Inductor component

Abstract

To enlarge a region where inductor wiring can be distributed.SOLUTION: An inductor component comprises: an element body having a first main surface; a first inter-layer insulation layer 31; a wiring inter-layer insulation layer 32; and inductor wiring 50. The first inter-layer insulation layer 31 is extended in parallel to the first main surface in the element body. The wiring inter-layer insulation layer 32 is extended to a first positive direction X1 orthogonal to the first main surface of the first inter-layer insulation layer 31. The inductor wiring 50 is extended into a region segmented by the wiring inter-layer insulation layer 32. In a specific cross section orthogonal to a center line of the inductor wiring 50, the plurality of wiring inter-layer insulation layers 32 is existed in a non-continuous state to a direction along the first main surface. For instance, a surface directed to a direction in parallel to the main surface from an outer surface of the first inter-layer insulation layer 31 is an end surface EF, and a place where a surface directed to the direction parallel to the first main surface from each portion of the wiring inter-layer insulation layer 32 is contacted to the element is an outer side insulation layer 32A. At the time, the outer side insulation layer 32A is contacted to the end surface EF of the first inter-layer insulation layer 31.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present invention relates to an inductor component. [Background technology]

[0002] The inductor component described in Patent Document 1 includes an element body, a substrate, a resin wall, and a coil. The element body is rectangular. The element body includes a magnetic material. The substrate is plate-shaped. The substrate is located inside the element body. The resin wall is located on a main surface of the substrate. The resin wall extends in a normal direction to the main surface. In a cross-sectional view of a cross section along the normal to the main surface of the substrate, a plurality of resin walls are arranged at intervals. Here, the dimension of the resin wall in the arrangement direction of the resin walls in the cross-sectional view is defined as the thickness dimension. In this case, the thickness dimension of the resin wall located on the outermost side in the arrangement direction of the resin walls in the cross-sectional view is larger than the thickness dimension of the resin wall located on the inner side. The coil is located on the main surface of the substrate. The coil is filled between adjacent resin walls. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2016-225463 A Summary of the Invention [Problem to be solved by the invention]

[0004] In the invention described in Patent Document 1, the volume ratio of the resin wall to the inside of the element body is large because the thickness dimension of the outermost resin wall is large, which makes it difficult to increase the volume ratio of the coil to the inside of the element body. [Means for solving the problem]

[0005] In order to solve the above problems, the present invention provides an inductor component comprising: an element body having a main surface; an interlayer insulating layer extending within the element body parallel to the main surface; an interwiring insulating layer extending from the interlayer insulating layer in a first positive direction perpendicular to the main surface; and an inductor wiring extending in contact with a surface of the interlayer insulating layer on the first positive side within a region partitioned by the interwiring insulating layer, wherein in a specific cross section perpendicular to a center line of the inductor wiring, the interwiring insulating layer is present in a plurality of discontinuous locations in a direction along the main surface, and when a surface of the outer surface of the interlayer insulating layer facing a direction parallel to the main surface is defined as an end surface, and a location of each of the locations of the interwiring insulating layer where a surface facing a direction parallel to the main surface is in contact with the element body is defined as an outer insulating layer, the outer insulating layer is in contact with the end surface of the interlayer insulating layer. Effect of the Invention

[0006] According to the above configuration, the area in which the inductor wiring can be arranged can be increased. [Brief description of the drawings]

[0007] [Figure 1] FIG. 1 is a perspective view of an inductor component. [Diagram 2] FIG. 2 is a transparent side view of the inductor component. [Diagram 3] FIG. 3 is a transparent top view of the inductor component. [Figure 4] FIG. 4 is a cross-sectional view of the inductor component taken along line 4-4 in FIG. [Diagram 5] FIG. 5 is an enlarged view of a part of FIG. [Figure 6] FIG. 6 is an explanatory diagram of a manufacturing method of an inductor component. [Figure 7] FIG. 7 is an explanatory diagram of a manufacturing method of an inductor component. [Figure 8] FIG. 8 is an explanatory diagram of a manufacturing method of an inductor component. [Figure 9] FIG. 9 is an explanatory diagram of a manufacturing method of an inductor component. [Figure 10] FIG. 10 is an explanatory diagram of a manufacturing method of an inductor component. [Figure 11] FIG. 11 is an explanatory diagram of a manufacturing method of an inductor component. [Figure 12] FIG. 12 is an explanatory diagram of a manufacturing method of an inductor component. [Figure 13] FIG. 13 is an explanatory diagram of a method for manufacturing an inductor component. [Figure 14] FIG. 14 is an explanatory diagram of a manufacturing method of an inductor component. [Figure 15] FIG. 15 is an explanatory diagram of a manufacturing method of an inductor component. [Figure 16] FIG. 16 is an explanatory diagram of a manufacturing method of an inductor component. [Figure 17] FIG. 17 is an explanatory diagram of a manufacturing method of an inductor component. [Figure 18] FIG. 18 is an explanatory diagram of a manufacturing method of an inductor component. [Figure 19] FIG. 19 is an explanatory diagram of a manufacturing method of an inductor component. [Figure 20] FIG. 20 is an explanatory diagram of a manufacturing method of an inductor component. [Figure 21] FIG. 21 is an explanatory diagram of a manufacturing method of an inductor component. [Figure 22] FIG. 22 is an explanatory diagram of a manufacturing method of an inductor component. [Figure 23] FIG. 23 is a cross-sectional view of an inductor component according to a modified example. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] Hereinafter, an embodiment of an inductor component will be described with reference to the drawings. Note that the drawings may show components enlarged for ease of understanding. The dimensional ratios of the components may differ from those in the actual drawings or from those in other drawings.

[0009] <Overall structure> 1, the inductor component 10 has a generally rectangular parallelepiped shape. As shown in FIG. 2, the inductor component 10 includes an element body 11 and an inductor wiring 50.

[0010] As shown in Fig. 1, the element body 11 has six planar outer surfaces. Of these six outer surfaces, one specific surface is designated as a first main surface 11A. A surface located opposite the first main surface 11A and parallel to the first main surface 11A is designated as a second main surface 11B. The outer shapes of the first main surface 11A and the second main surface 11B are both rectangular. In this embodiment, the first main surface 11A is a mounting surface that faces a substrate when the inductor component 10 is mounted on the substrate.

[0011] Here, an axis perpendicular to the first main surface 11A is defined as the first axis X. An axis perpendicular to the first axis X and parallel to a specific side of the first main surface 11A, in this embodiment, the long side of the first main surface 11A, is defined as the second axis Y. An axis perpendicular to the first axis X and the second axis Y is defined as the third axis Z. A direction along the first axis X in which the first main surface 11A faces is defined as the first positive direction X1, and a direction opposite to the first positive direction X1 is defined as the first negative direction X2. A specific direction along the second axis Y is defined as the second positive direction Y1, and a direction opposite to the second positive direction Y1 is defined as the second negative direction Y2. A specific direction along the third axis Z is defined as the third positive direction Z1, and a direction opposite to the third positive direction Z1 is defined as the third negative direction Z2.

[0012] As shown in FIG. 4, the element body 11 has, as the magnetic layers 20, a first magnetic layer 21, a first interlayer magnetic layer 22, a second magnetic layer 23, a second interlayer magnetic layer 24, and a third magnetic layer 25, in that order from the first negative direction X2 side. In FIG. 4, the boundaries of the magnetic layers 20 are virtually illustrated by two-dot chain lines, but it may not be possible to observe clear boundaries between the magnetic layers 20. The magnetic layers 20 are made of an organic resin containing a metal magnetic powder. That is, the element body 11 contains a magnetic material. In this embodiment, the metal magnetic powder is a metal magnetic powder made of an Fe-based alloy or an amorphous alloy. More specifically, the metal magnetic powder is an FeSiCr-based metal powder containing iron. The metal magnetic powder is not limited to an FeSiCr-based magnetic powder, but may be, for example, an FeCo-based, FeSiAr-based, iron oxide-based, or a combination thereof. The organic resin may be an epoxy-based, an imide-based, a liquid crystal polymer-based, an acrylic-based, a phenol-based, or a combination thereof. In addition to the above materials, the organic resin may contain an inorganic filler.

[0013] As shown in Fig. 2, the inductor wiring 50 is located inside the element body 11. As shown in Fig. 4, the inductor wiring 50 is located at the same location as the second magnetic layer 23 in the first positive direction X1. The material of the inductor wiring 50 is a conductive material. In this embodiment, the composition of the inductor wiring 50 is, for example, a copper ratio of 99 wt% or more and a sulfur ratio of 0.1 wt% or more and 1.0 wt% or less. Note that the inductor wiring 50 is not limited to a conductor mainly composed of copper, and may be a conductor mainly composed of Ag, Al, and Au.

[0014] As shown in Fig. 3, the inductor wiring 50 extends in a spiral shape parallel to the first main surface 11A. As shown in Fig. 4, the inductor wiring 50 includes a seed layer 51A. The seed layer 51A constitutes a part of the surface of the inductor wiring 50 on the first negative direction X2 side. The seed layer 51A is made of copper. Note that, by performing electrolytic copper plating on the seed layer 51A, copper grows on the seed layer 51A, and the entire inductor wiring 50 is formed.

[0015] As shown in FIG. 3, the inductor wiring 50 has a pair of pad portions 51P and a wiring body 51L. The pair of pad portions 51P are located at both ends of the inductor wiring 50. One of the pair of pad portions 51P is defined as an inner pad portion 51PA. The remaining one of the pair of pad portions 51P is defined as an outer pad portion 51PB. When viewed in the first negative direction X2, the inner pad portion 51PA is located on the second positive direction Y1 side with respect to the geometric center of the element body 11. When viewed in the first negative direction X2, the inner pad portion 51PA has a substantially circular shape. The outer pad portion 51PB is located on the second negative direction Y2 side with respect to the geometric center of the element body 11. When viewed in the first negative direction X2, the outer pad portion 51PB has a substantially rectangular shape.

[0016] The wire main body 51L connects a pair of pad portions 51P. Specifically, when the element body 11 is seen through in the first negative direction X2, the wire main body 51L extends counterclockwise from the inner pad portion 51PA to the outer pad portion 51PB such that the diameter increases as the number of turns increases. The number of turns of the inductor wire 50 is 2.5 turns.

[0017] The number of turns of the inductor wiring 50 is determined based on a virtual vector. The starting point of the virtual vector is disposed on the center line of the inductor wiring 50. When the virtual vector is moved from a state in which the starting point is disposed at a first end of the center line to a second end of the center line as viewed in the first negative direction X2, the number of turns is determined to be 1.0 turn when the angle by which the direction of the virtual vector rotates is 360 degrees. However, when the direction of the virtual vector is wound multiple times, the number of turns is increased when the windings are consecutive in the same direction.

[0018] The center line of the inductor wiring 50 is determined as follows. When viewed in the first negative direction X2, the shortest line segment is identified among the line segments that can be drawn from any point on an edge of the inductor wiring 50 to the opposite edge. A line connecting the points passing through the centers of the identified line segments is defined as the center line of the inductor wiring 50 when viewed in the first negative direction X2.

[0019] 4, the inductor component 10 includes, as insulating layers 30, a first interlayer insulating layer 31, an interwiring insulating layer 32, and a second interlayer insulating layer 33. The insulating layers 30 are made of an insulating resin. In this embodiment, the material is, for example, a polyimide resin.

[0020] 4, the first interlayer insulating layer 31 extends parallel to the first main surface 11A within the element body 11. The first interlayer insulating layer 31 is in contact with a surface of the first magnetic layer 21 on the first positive direction X1 side. The first interlayer insulating layer 31 is in contact with a surface of the inductor wiring 50 on the first negative direction X2 side. In other words, the inductor wiring 50 extends on the first interlayer insulating layer 31. Therefore, the first interlayer insulating layer 31 is located at the same position as the first interlayer magnetic layer 22 in the first positive direction X1.

[0021] The second interlayer insulating layer 33 extends parallel to the first main surface 11A within the element body 11. The second interlayer insulating layer 33 is in contact with a surface of the inductor wiring 50 on the first positive direction X1 side. The second interlayer insulating layer 33 is in contact with a surface of the third magnetic layer 25 on the first negative direction X2 side. Therefore, the second interlayer insulating layer 33 is located at the same position as the second interlayer magnetic layer 24 in the first positive direction X1.

[0022] When a surface of the inductor wiring 50 facing a direction parallel to the first main surface 11A is defined as a side surface, the inter-wiring insulating layer 32 covers the side surface of the inductor wiring 50. Therefore, the inter-wiring insulating layer 32 has a portion located at the same position as the inductor wiring 50 in the first positive direction X1. Furthermore, in a specific cross section perpendicular to the center line of the inductor wiring 50, the inter-wiring insulating layer 32 exists in a plurality of discontinuous locations in the direction along the first main surface 11A. For example, in the specific cross section shown in FIG. 4, the inter-wiring insulating layer 32 exists in seven discontinuous locations in the direction along the first main surface 11A.

[0023] Here, in the specific cross section, among the locations of the inter-wiring insulating layer 32, the locations where the surface parallel to the first main surface 11A is in contact with the element body 11 are defined as outer insulating layers 32A. In addition, among the locations of the inter-wiring insulating layer 32 in the specific cross section, the locations where the surface parallel to the first main surface 11A is not in contact with the element body 11 are defined as inner insulating layers 32B. For example, in the specific cross section shown in FIG. 4, there are four outer insulating layers 32A. In addition, in the specific cross section, there are three inner insulating layers 32B. Specifically, in the specific cross section, two outer insulating layers 32A are located on the third positive direction Z1 side with respect to the geometric center of the element body 11, and two inner insulating layers 32B are located between the outer insulating layers 32A. Between these inter-wiring insulating layers 32, the inductor wiring 50 is located. Furthermore, two outer insulating layers 32A are located on the third negative direction Z2 side with respect to the geometric center of the element body 11, and one inner insulating layer 32B is located between the outer insulating layers 32A. The inductor wiring 50 is located between these inter-wiring insulating layers 32. That is, the inductor wiring 50 extends in the first positive direction X1 side with respect to the first interlayer insulating layer 31 within a region defined by the inter-wiring insulating layers 32.

[0024] 5, among the outer surfaces of the first interlayer insulating layer 31, a surface facing a direction parallel to the first main surface 11A is defined as an end surface EF. Note that the "surface facing a direction parallel to the first main surface 11A" refers to a surface that can be seen when the first interlayer insulating layer 31 is viewed in a direction parallel to the first main surface 11A. In this case, the outer insulating layer 32A can be roughly divided into a contact end portion BP that is located at the same position as the first interlayer insulating layer 31 in the first positive direction X1, and a main body portion AP that is located on the first positive direction X1 side with respect to the contact end portion BP. The details of the contact end portion BP and the main body portion AP will be described later.

[0025] 2, the inductor component 10 includes two columnar wirings 40 and two external electrodes 60. Each columnar wiring 40 extends in a direction intersecting with the first main surface 11A. In this embodiment, each columnar wiring 40 extends in a direction perpendicular to the first main surface 11A. Each columnar wiring 40 is located on the first positive direction X1 side with respect to the inductor wiring 50. Each columnar wiring 40 is electrically connected to the inductor wiring 50.

[0026] Specifically, the first columnar wiring 41, which is one of the two columnar wirings 40, includes a first via 41A and a first lead wiring 41B. The material of the first columnar wiring 41 is the same as the material of the inductor wiring 50. The first via 41A is substantially cylindrical. As shown in FIG. 4, the first via 41A penetrates the second interlayer insulating layer 33. Therefore, the first via 41A is located at the same position as the second interlayer insulating layer 33 and the second interlayer magnetic layer 24 in the first positive direction X1. The surface of the first via 41A facing the first negative direction X2 is connected to the inner pad portion 51PA of the inductor wiring 50.

[0027] As shown in Fig. 3, the first escape wiring 41B is substantially cylindrical. As shown in Fig. 2, the diameter of the first escape wiring 41B is slightly larger than the diameter of the first via 41A. The surface of the first escape wiring 41B facing the first negative direction X2 is connected to the first via 41A. Therefore, the first escape wiring 41B is located at the same position as the third magnetic layer 25 in the first positive direction X1. The surface of the first escape wiring 41B facing the first positive direction X1 is exposed from the first main surface 11A.

[0028] As shown in FIG. 2, the second columnar wiring 42, which is the other of the two columnar wirings 40, includes a second via 42A and a second lead wiring 42B. The material of the second columnar wiring 42 is the same as that of the inductor wiring 50. The second columnar wiring 42 is located on the second negative direction Y2 side with respect to the first columnar wiring 41. The second via 42A has a substantially rectangular prism shape. The second via 42A penetrates the second interlayer insulating layer 33. Therefore, the second via 42A is located at the same position as the second interlayer insulating layer 33 and the second interlayer magnetic layer 24 in the first positive direction X1. The surface of the second via 42A facing the first negative direction X2 side is connected to the outer pad portion 51PB of the inductor wiring 50.

[0029] As shown in Fig. 3, the second escape wiring 42B has a substantially rectangular prism shape. As shown in Fig. 2, the dimension of each side of the second escape wiring 42B is slightly larger than the dimension of each side of the second via 42A. The surface of the second escape wiring 42B facing the first negative direction X2 is connected to the second via 42A. Therefore, the second escape wiring 42B is located at the same position as the third magnetic layer 25 in the first positive direction X1. The surface of the second escape wiring 42B facing the first positive direction X1 is exposed from the first main surface 11A.

[0030] 1, each external electrode 60 is exposed from element body 11. Specifically, each external electrode 60 is located on a first main surface 11A of element body 11. That is, each external electrode 60 covers a portion of the outer surface of element body 11.

[0031] 2, a first external electrode 61, which is one of the two external electrodes 60, is located on the first main surface 11A on the second positive direction Y1 side with respect to the geometric center of the first main surface 11A. The first external electrode 61 is in contact with a surface of the first escape wiring 41B facing the first positive direction X1. A second external electrode 62, which is the other of the two external electrodes 60, is located on the first main surface 11A on the second negative direction Y2 side with respect to the geometric center of the first main surface 11A. The second external electrode 62 is in contact with a surface of the second escape wiring 42B facing the first positive direction X1.

[0032] The inductor component 10 includes a solder resist 70. The solder resist 70 covers a surface of the element body 11 facing the first positive direction X1, excluding the two external electrodes 60. In other words, the first main surface 11A of the element body 11 is covered by the external electrodes 60 and the solder resist 70 and is not exposed. The solder resist 70 has higher insulating properties than the element body 11.

[0033] <About the insulating layer between wiring> As described above, the outer insulating layer 32A of the inter-wiring insulating layer 32 can be roughly divided into a contact end BP located at the same position as the first interlayer insulating layer 31 in the first positive direction X1, and a main body portion AP located on the first positive direction X1 side of the contact end portion BP. Note that the main body portion AP is located at the same location as the inductor wiring 50 in the first positive direction X1.

[0034] 5, the contact end BP is in contact with an end face EF of the first interlayer insulating layer 31. In the specific cross section, the outer surface of the contact end BP opposite to the first interlayer insulating layer 31 forms an inclined surface SF that approaches the first interlayer insulating layer 31 the further in the first negative direction X2. That is, the contact end BP has a substantially triangular shape in the specific cross section.

[0035] The main body portion AP is in contact with the surface of the first interlayer insulating layer 31 on the first positive direction X1 side. As a result, the dimension of the main body portion AP in the direction along the third axis Z at the end on the first negative direction X2 side is larger than the dimension of the contact end portion BP in the direction along the third axis Z on the first positive direction X1 side. That is, when the first interlayer insulating layer 31 is viewed in the first positive direction X1, a part of the main body portion AP protrudes from the contact end portion BP toward the inductor wiring 50 side. The part of the main body portion AP protruding from the contact end portion BP is in contact with the surface of the first interlayer insulating layer 31 facing the first positive direction X1. In this way, the outer insulating layer 32A is in contact with the surface of the first interlayer insulating layer 31 facing the first positive direction X1 in addition to the end face EF of the first interlayer insulating layer 31.

[0036] In addition, in a specific cross section, the dimension of the main body portion AP of the outer insulating layer 32A in the direction along the third axis Z is the same as the dimension of the inner insulating layer 32B in the direction along the third axis Z. In other words, except for the contact end portion BP of the first interlayer insulating layer 31, the outer insulating layer 32A and the inner insulating layer 32B have approximately the same shape.

[0037] Furthermore, the distance V1 between the outer insulating layer 32A and the inner insulating layer 32B facing the outer insulating layer 32A is larger than the distance V2 between the inner insulating layers 32B facing each other. That is, the distance V1 between the outer insulating layer 32A and the inner insulating layer 32B in a direction parallel to the first main surface 11A is larger than the distance V2 between the inner insulating layers 32B in a direction parallel to the first main surface 11A. As a result, the wiring width of the inductor wiring 50 located between the outer insulating layer 32A and the inner insulating layer 32B is larger than the wiring width of the inductor wiring 50 located between the inner insulating layers 32B.

[0038] <Production method> Next, a method for manufacturing the inductor element 10 will be described. As shown in FIG. 6, a base preparation step is performed first. Specifically, a plate-shaped base member 101 is prepared. The material of the base member 101 is ceramic. When viewed in the first negative direction X2, the base member 101 has a rectangular shape. The dimensions of each side of the base member 101 are such that a plurality of inductor components 10 can be accommodated therein. Next, a dummy insulating layer 102 is applied to the entire upper surface of the base member 101. Note that in FIG. 6, the dummy insulating layer 102 is illustrated by a thick line.

[0039] 7, a first insulating layer processing step is performed to form a first interlayer insulating layer 31. The first interlayer insulating layer 31 is formed on the surface of the base member 101 on the first positive direction X1 side. Specifically, the first interlayer insulating layer 31 is patterned. The patterning is performed in an area slightly larger than the area in which the inductor wiring 50 is arranged. Specifically, the first interlayer insulating layer 31 is formed by photolithography.

[0040] 8, a seed formation step is performed to form a seed layer 51A. Specifically, a copper seed portion 103 is formed by sputtering on the surfaces of the first interlayer insulating layer 31 and the dummy insulating layer 102 on the first positive direction X1 side.

[0041] 9, a photosensitive resist 104 is laminated on the upper surface of the seed portion 103. Then, only the area of ​​the upper surface of the seed portion 103 where the seed layer 51A of the inductor wiring 50 is to be formed is exposed to light. The exposed areas of the resist 104 are hardened. These hardened areas are formed as the covering portion 105. Thereafter, the unhardened areas of the resist 104, i.e., the areas other than the covering portion 105, are removed.

[0042] 10, the seed portion 103 is etched, whereby the seed portion 103 exposed from the covering portion 105 is removed. 11, the covering portion 105 is wet-etched using a chemical, whereby the covering portion 105 is peeled off, and as a result, the seed layer 51A is formed.

[0043] Thereafter, as shown in FIG. 12, a second insulating layer processing step is performed to form an inter-wiring insulating layer 32. Specifically, first, a photosensitive permanent resist 106 is laminated on the surface of the dummy insulating layer 102, the seed layer 51A, and the first inter-layer insulating layer 31 on the first positive direction X1 side. Next, the area in which the inter-wiring insulating layer 32 is to be formed, that is, the areas located on both sides of the seed layer 51A, are exposed to light. Specifically, a part of the surface of the first inter-layer insulating layer 31 on the first positive direction X1 side and an area including a position on the first positive direction X1 side with respect to the end face EF of the first inter-layer insulating layer 31 are exposed to light. At this time, the amount of exposure of the area including the position on the first positive direction X1 side with respect to the end face EF of the first inter-layer insulating layer 31 is made smaller than the amount of exposure of other areas. By controlling the exposure amount in this manner, as shown in FIG. 13, in the range including the first positive direction X1 side of the end face EF of the first interlayer insulating layer 31, a portion of the first negative direction X2 side of the permanent resist 106 does not harden, and an inclined surface SF of the contact end portion BP is formed.

[0044] 13, the uncured portion of the permanent resist 106 is peeled off and removed with a chemical solution, thereby forming the inter-wiring insulating layer 32. Next, as shown in FIG. 14, a first wiring formation step is performed to form the inductor wiring 50. Specifically, electrolytic copper plating is performed to grow copper from the portion where the seed layer 51A is exposed on the surface of the first interlayer insulating layer 31 on the first positive direction X1 side. This forms the inductor wiring 50. In the process of forming the inductor wiring 50, since the seed layer 51A is located between the inter-wiring insulating layers 32, the copper plating grows along the inter-wiring insulating layer 32. As a result, the cross section of the inductor wiring 50 becomes approximately rectangular. In addition, in the process of promoting the growth of the copper plating on the seed layer 51A, the surface of the inductor wiring 50 on the first positive direction X1 side may become a curved surface that is convex toward the first positive direction X1 side.

[0045] Next, as shown in FIG. 15, a third insulating layer processing step is performed to form a second interlayer insulating layer 33. The area in which the second interlayer insulating layer 33 is formed is an area on the first positive direction X1 side of the inductor wiring 50 and the interlayer insulating layer 32 excluding the areas where the first via 41A and the second via 42A are formed. The second interlayer insulating layer 33 is formed in this area by the same photolithography method as that used to form the first interlayer insulating layer 31. The dimension of the second interlayer insulating layer 33 in the direction along the first axis X is the same as the dimension of the first interlayer insulating layer 31 in the direction along the first axis X. When viewed in the first negative direction X2, the outer shape of the second interlayer insulating layer 33 coincides with the outer shape of the first interlayer insulating layer 31.

[0046] Next, as shown in FIG. 16, a second wiring formation process is performed to form the columnar wiring 40. The area in which the columnar wiring 40 is formed includes the area in which the inductor wiring 50 is exposed from the second interlayer insulating layer 33. First, a columnar seed layer 107 is formed in the above-mentioned area in the same manner as in the above-mentioned seed formation process. Note that the columnar seed layer 107 is not shown in FIGS. 2 to 5. Then, a resist is exposed to light in the area outside the above-mentioned area by photolithography using the same method as in the first insulating layer processing process. Then, a process similar to the first wiring formation process is performed to form the columnar wiring 40 by copper plating. After that, the resist is removed. As a result, a first columnar wiring 41 and a second columnar wiring 42 are formed.

[0047] 17, a first magnetic body forming process is performed to form the magnetic layer 20 other than the first magnetic layer 21. First, a resin containing magnetic powder, which is the material of the magnetic layer 20, is applied to the dummy insulating layer 102 on the first positive direction X1 side. At this time, the resin containing magnetic powder is applied so as to cover the surface of each columnar wiring 40 on the first positive direction X1 side. Next, the resin containing magnetic powder is hardened by pressing to form the first interlayer magnetic layer 22, the second magnetic layer 23, the second interlayer magnetic layer 24, and the third magnetic layer 25 on the surface side of the dummy insulating layer 102 in the first positive direction X1.

[0048] Then, the portion of the third magnetic layer 25 on the first positive direction X1 side is removed until the surface of each columnar wiring 40 on the first positive direction X1 side is exposed. In addition, in FIG. 17, the first interlayer magnetic layer 22, the second magnetic layer 23, the second interlayer magnetic layer 24, and the third magnetic layer 25 are illustrated as the magnetic layer 20 without distinction.

[0049] 18, a base member cutting step is performed. Specifically, the base member 101 and the dummy insulating layer 102 are all removed by cutting. Note that, as a result of all cutting the base member 101 and the dummy insulating layer 102, a part of the first interlayer insulating layer 31 on the first negative direction X2 side may be removed, but the inductor wiring 50 is not removed.

[0050] Next, as shown in FIG. 19, a second magnetic body forming process is performed to form the first magnetic layer 21. Specifically, first, a resin containing magnetic powder, which is the material of the first magnetic layer 21, is applied to the surfaces of the first interlayer insulating layer 31 and the first interlayer magnetic layer 22 on the first negative direction X2 side. Then, the resin containing magnetic powder is hardened by pressing. After that, the portion of the resin on the first negative direction X2 side is cut. For example, the portion of the resin on the first negative direction X2 side is cut so that the dimension of the inductor component 10 in the direction along the first axis X becomes a desired value. As a result, the first magnetic layer 21 is formed on the surfaces of the first interlayer insulating layer 31 and the first interlayer magnetic layer 22 on the first negative direction X2 side. In FIG. 19, the first magnetic layer 21, the first interlayer magnetic layer 22, the second magnetic layer 23, the second interlayer magnetic layer 24, and the third magnetic layer 25 are illustrated as the magnetic layer 20 without distinction.

[0051] 20, a main surface processing step is performed to form a solder resist 70. Specifically, an insulator is patterned by photolithography on the surface of the third magnetic layer 25 on the first positive direction X1 side and the surfaces of the columnar wirings 40 on the first positive direction X1 side, where the external electrodes 60 are not to be formed. As a result, the solder resist 70 is formed.

[0052] Next, as shown in FIG. 21, an electrode processing step is performed to form an external electrode 60. The external electrode 60 is formed in the area of ​​the surface of the third magnetic layer 25 on the first positive direction X1 side and the surface of each columnar wiring 40 on the first positive direction X1 side that is not covered with the solder resist 70. Copper, nickel, and gold are electrolessly plated in this area. As a result, a first external electrode 61 and a second external electrode 62 are formed. Note that in FIG. 21, the copper, nickel, and gold layers are illustrated without distinction. Also, as shown in FIG. 21, a part of the external electrode 60 may cover a part of the surface of the solder resist 70 on the first positive direction X1 side. Next, as shown in FIG. 22, a singulation processing step is performed. Specifically, the product is singulated by dicing at the break lines DL. In this manner, the inductor component 10 can be obtained.

[0053] <Effects of this embodiment> (1) According to the above embodiment, the inter-wiring insulating layer 32 is in contact with the end face EF of the first interlayer insulating layer 31. That is, when viewed in the first positive direction X1, at least a portion of the inter-wiring insulating layer 32 protrudes outward from the surface of the first interlayer insulating layer 31 on the first positive direction X1 side. Therefore, compared to a configuration in which the entire inter-wiring insulating layer 32 is located within the range of the surface of the first interlayer insulating layer 31 on the first positive direction X1 side, the area defined by the inter-wiring insulating layer 32, i.e., the area in which the inductor wiring 50 can be arranged, can be made larger.

[0054] (2) If the outer insulating layer 32A is in contact with the first interlayer insulating layer 31 on only one surface, when an external force acts on the outer insulating layer 32A in a direction parallel to the contact surface between the outer insulating layer 32A and the first interlayer insulating layer 31, the outer insulating layer 32A is likely to peel off from the inter-wiring insulating layer 32. On the other hand, in the above embodiment, the outer insulating layer 32A is in contact with the surface of the first interlayer insulating layer 31 facing the first positive direction X1 in addition to the end face EF of the first interlayer insulating layer 31. That is, in the above embodiment, the outer insulating layer 32A is in contact with the first interlayer insulating layer 31 on two surfaces. Therefore, when an external force acts on the outer insulating layer 32A, the external force can be dispersed on the two surfaces in contact with the first interlayer insulating layer 31. Therefore, according to the above configuration, peeling of the outer insulating layer 32A from the first interlayer insulating layer 31 can be suppressed.

[0055] (3) In the above embodiment, in a specific cross section, the distance V1 between the outer insulating layer 32A and the inner insulating layer 32B in a direction parallel to the first main surface 11A is larger than the distance V2 between the inner insulating layers 32B in a direction parallel to the first main surface 11A. As described above, the outer insulating layer 32A protrudes outward from the surface of the first interlayer insulating layer 31 on the first positive direction X1 side. This makes it possible to ensure a large distance V1 between the outer insulating layer 32A and the inner insulating layer 32B. As a result, the DC resistance in the inductor wiring 50 can be reduced.

[0056] (4) In the above embodiment, the columnar wiring 40 is located on the first positive direction X1 side with respect to the inductor wiring 50. That is, in the above embodiment, the outer insulating layer 32A of the inter-wiring insulating layer 32 is in contact with the end face EF of the first interlayer insulating layer 31 on the side farther from the external electrode 60. Therefore, even if the inductor wiring 50 protrudes from between the outer insulating layer 32A and the inter-wiring insulating layer 32, there is little risk that the protruding inductor wiring 50 will be short-circuited to the external electrode 60.

[0057] (5) In the above embodiment, the inductor wiring 50 has a seed layer 51A in contact with the first interlayer insulating layer 31 on the first positive direction X1 side. That is, in the above embodiment, the outer insulating layer 32A of the interlayer insulating layer 32 is in contact with the end face EF of the first interlayer insulating layer 31 at a position close to the seed layer 51A. Therefore, even if the position of the seed layer 51A is deviated from the designed position during the manufacturing process, there is little risk that the inductor wiring 50 will protrude from between the outer insulating layer 32A and the interlayer insulating layer 32.

[0058] (6) In the above embodiment, the outer surface of the contact end BP opposite the first interlayer insulating layer 31 forms an inclined surface SF that approaches the first interlayer insulating layer 31 the further toward the first negative direction X2. With this configuration, the volume of the first interlayer magnetic layer 22 can be increased compared to a configuration that does not have the inclined surface SF and in which the dimension of the outer insulating layer 32A in the direction along the third axis Z is constant.

[0059] <Example of change> The above embodiment and the following modified examples can be implemented in combination with each other to the extent that no technical contradiction occurs.

[0060] In the above embodiment, the inductor component 10 does not necessarily have to have the external electrode 60. In that case, the portion of the columnar wire 40 exposed from the first main surface 11A may be used as an electrode.

[0061] In the above embodiment, the columnar wirings 40 do not necessarily extend in a direction perpendicular to the first main surface 11A, but may extend in a direction intersecting the first main surface 11A. In the above embodiment, the shape of each of the columnar wirings 40 when viewed in a direction perpendicular to the first main surface 11A is not limited to the example of the above embodiment. For example, the shape of each of the columnar wirings 40 when viewed in a direction perpendicular to the first main surface 11A may be the same.

[0062] In the above embodiment, the material of the insulating layer 30 is not limited to the example in the above embodiment. For example, the material of the insulating layer 30 may be epoxy resin or the like. In the above embodiment, the number of turns and the shape of the inductor wiring 50 are not limited to those in the above embodiment. For example, the inductor wiring 50 may be linear with zero turns.

[0063] In the above embodiment, a portion of the inductor wiring 50 may not be covered by the insulating layer 30 and may be in contact with the magnetic layer 20. For example, in the above embodiment, the second interlayer insulating layer 33 may be omitted. Note that "among the portions of the inter-wiring insulating layer 32, the surface facing the direction parallel to the first main surface 11A is in contact with the element body 11" refers to a case where 90% or more of the surface of the inter-wiring insulating layer 32 facing the direction parallel to the first main surface 11A is in contact with the element body 11. In a configuration that does not have the second interlayer insulating layer 33, a portion of the surface of the inner insulating layer 32B facing the direction parallel to the first main surface 11A may be in contact with the element body 11 due to manufacturing errors or the like. Even in that case, if the proportion of the surface of the inter-wiring insulating layer 32 facing the direction parallel to the first main surface 11A that is in contact with the element body 11 is less than 90%, the portion does not correspond to the outer insulating layer 32A.

[0064] In the above embodiment, the inductor component 10 may include a plurality of inductor wirings 50. For example, assume that the inductor wiring 50 in the above embodiment is the first inductor wiring 50, the inter-wiring insulating layer 32 is the first inter-wiring insulating layer 32, and the outer insulating layer 32A is the first outer insulating layer 32A. In the example shown in FIG. 23, the outer insulating layer 32A of the first inter-wiring insulating layer 32 all extend from the surface of the first interlayer insulating layer 31 on the first positive direction X1 side. In the example shown in FIG. 23, the inductor component 10 further includes a second inductor wiring 52, a second inter-wiring insulating layer 34, and a third interlayer insulating layer 35. In the example shown in FIG. 23, the second inter-wiring insulating layer 34 extends from the second interlayer insulating layer 33 in the first positive direction X1. The second inductor wiring 52 extends on the first positive direction X1 side with respect to the second interlayer insulating layer 33 within the region defined by the second inter-wiring insulating layer 34. The third interlayer insulating layer 35 extends on the surfaces of the second inductor wiring 52 and the second interwiring insulating layer 34 on the first positive direction X1 side. In the example shown in FIG.

[0065] 23, in a specific cross section, the second inter-wiring insulating layer 34 is present in seven discontinuous locations in the direction along the first main surface 11A, similar to the first inter-wiring insulating layer 32. Note that Fig. 23 illustrates the second inter-wiring insulating layer 34 in four locations out of the seven locations.

[0066] Here, among the outer surfaces of the second interlayer insulating layer 33, the surface facing the direction parallel to the first main surface 11A is defined as the end surface EF, and among the locations of the second interwiring insulating layer 34 in the specific cross section, the location where the surface facing the direction parallel to the first main surface 11A is in contact with the element body 11 is defined as the second outer insulating layer 34A. In the specific cross section, the second outer insulating layer 34A located closest to the third positive direction Z1 is in contact with the end surface EF of the second interlayer insulating layer 33 and the surface of the first outer insulating layer 32A facing the element body 11. With this configuration, the contact surface of the second outer insulating layer 34A can be increased compared to a configuration in which the second outer insulating layer 34A is in contact only with the second interlayer insulating layer 33. That is, the adhesion of the second outer insulating layer 34A is improved.

[0067] 23, the first outer insulating layer 32A of the first interwiring insulating layer 32 may be in contact with the end face EF of the first interlayer insulating layer 31. In the example shown in Fig. 23, the first outer insulating layer 32A of the first interwiring insulating layer 32 may be in contact with the end face EF of the first interlayer insulating layer 31, while the second outer insulating layer 34A of the second interwiring insulating layer 34 may not be in contact with the end face EF of the second interlayer insulating layer 33.

[0068] In the above embodiment, it is sufficient that at least one of the outer insulating layers 32A is in contact with the end face EF of the first interlayer insulating layer 31 among the multiple outer insulating layers 32A. In the above embodiment, it is sufficient that the outer insulating layer 32A is in contact with the end face EF of the first interlayer insulating layer 31 or the second interlayer insulating layer 33. In other words, the outer insulating layer 32A does not have to be in contact with the face of the first interlayer insulating layer 31 facing the first positive direction X1.

[0069] In the above embodiment, the columnar wiring 40 may be located on the first negative direction X2 side with respect to the inductor wiring 50. Similarly, the external electrode 60 may be exposed from the second main surface 11B. In other words, the mounting surface of the inductor component 10 may be the second main surface 11B.

[0070] In the above embodiment, the distance V1 between the outer insulating layer 32A and the inner insulating layer 32B in a particular cross section may be the same as or smaller than the distance V2 between the inner insulating layers 32B.

[0071] In the above embodiment, the outer surface of the contact end BP opposite to the first interlayer insulating layer 31 does not have to be the inclined surface SF. For example, in a specific cross section, the dimension of the contact end BP in the direction along the third axis Z may be constant.

[0072] In the above embodiment, the material of the base member 101 is not limited to the example in the above embodiment. For example, the material of the base member 101 may be glass epoxy resin, glass, or the like. In the wiring formation process of the above embodiment, a dummy wiring may be formed to connect to the inductor wiring 50. For example, the dummy wiring can be used as a power supply wiring when forming copper plating.

[0073] <Additional Notes> The technical ideas that can be derived from the above-described embodiments and modifications will be described below. [1] An inductor component comprising: an element body having a main surface; an interlayer insulating layer extending within the element body parallel to the main surface; an interwiring insulating layer extending from the interlayer insulating layer in a first positive direction perpendicular to the main surface; and an inductor wiring extending in the first positive direction side with respect to the interlayer insulating layer within a region partitioned by the interwiring insulating layer, wherein in a specific cross section perpendicular to a center line of the inductor wiring, the interwiring insulating layer is present in a plurality of discontinuous locations in a direction along the main surface, and when an end face is an outer surface of the interlayer insulating layer that faces a direction parallel to the main surface, and an outer insulating layer is an outer surface where a surface of the interwiring insulating layer that faces a direction parallel to the main surface is in contact with the element body, the outer insulating layer is in contact with the end face of the interlayer insulating layer.

[0074] [2] The inductor component according to [1], wherein the outer insulating layer is in contact with a surface of the interlayer insulating layer facing the first positive direction in addition to the end faces of the interlayer insulating layer. [3] An inductor component as described in [1] or [2], wherein when the portions of the inter-wiring insulating layer whose surfaces facing a direction parallel to the main surface are not in contact with the element body are defined as inner insulating layers, in the specific cross section, the distance between the outer insulating layer and the inner insulating layer in a direction parallel to the main surface is larger than the distance between the inner insulating layers in a direction parallel to the main surface.

[0075] [4] An inductor component according to any one of [1] to [3], comprising a pillar wiring electrically connected to the inductor wiring and extending in a direction intersecting the main surface, the pillar wiring being located on the first positive direction side with respect to the inductor wiring.

[0076] [5] The inductor element according to any one of [1] to [4], wherein the inductor wiring has a seed layer in contact with the interlayer insulating layer on the first positive side. [6] An inductor component described in any one of [1] to [5], wherein when the direction opposite to the first positive direction is defined as a first negative direction and a portion of the outer insulating layer that is at the same position as the interlayer insulating layer in the first positive direction is defined as a contact end, the outer surface of the contact end opposite the interlayer insulating layer forms an inclined surface that approaches the interlayer insulating layer as it approaches the first negative direction.

[0077] [7] When the inductor wiring is a first inductor wiring, the interlayer insulating layer is a first interlayer insulating layer, the interwiring insulating layer is a first interwiring insulating layer, and the outer insulating layer is a first outer insulating layer, the inductor wiring includes: a second interlayer insulating layer extending on a surface of the first inductor wiring and the first interwiring insulating layer on the first positive direction side, a second interwiring insulating layer extending in the first positive direction from the second interlayer insulating layer, and a second inductor wiring extending on the first positive direction side with respect to the second interlayer insulating layer within a region defined by the second interwiring insulating layer. and in the specific cross-section, the second interlayer insulating layer is present in a plurality of discontinuous locations in a direction along the main surface, and when an outer surface of the second interlayer insulating layer that faces a direction parallel to the main surface is defined as an end surface, and when a surface of each of the locations of the second interlayer insulating layer that faces a direction parallel to the main surface is defined as a second outer insulating layer, the second outer insulating layer is in contact with the end surface of the second interlayer insulating layer and the surface of the first outer insulating layer that faces toward the element body. [Explanation of symbols]

[0078] BP…Contact end EF...End face SF…Slanted surface V1…interval V2…Interval X1…first positive direction X2…1st negative direction 10...Inductor components 11...Base body 11A…1st main surface 31...First interlayer insulating layer 32...Inter-wiring insulation layer 32A…Outer insulation layer 32B…Inner insulation layer 40…Column wiring 50…Inductor wiring 51A…Seed layer

Claims

1. An element body having a main surface; an interlayer insulating layer extending parallel to the main surface within the element body; an inter-wiring insulating layer extending from the interlayer insulating layer in a first positive direction perpendicular to the main surface; an inductor wiring extending on the first positive direction side with respect to the interlayer insulating layer within a region defined by the interlayer insulating layer; Equipped with In a specific cross section perpendicular to a center line of the inductor wiring, the inter-wiring insulating layer is present at a plurality of locations in a discontinuous manner in a direction along the main surface, Among the outer surfaces of the interlayer insulating layer, a surface facing a direction parallel to the main surface is defined as an end surface, When a portion of the inter-wiring insulating layer where a surface facing a direction parallel to the main surface is in contact with the element body is defined as an outer insulating layer, The outer insulating layer is in contact with the end surface of the interlayer insulating layer. Inductor components.

2. The outer insulating layer is in contact with the end face of the interlayer insulating layer as well as with a surface of the interlayer insulating layer facing the first positive direction. The inductor component according to claim 1 .

3. When a portion of the inter-wiring insulating layer where a surface facing a direction parallel to the main surface is not in contact with the element body is defined as an inner insulating layer, In the specific cross section, the distance between the outer insulating layer and the inner insulating layer in a direction parallel to the main surface is larger than the distance between the inner insulating layers in a direction parallel to the main surface. The inductor component according to claim 1 .

4. a pillar-shaped wiring electrically connected to the inductor wiring and extending in a direction intersecting the main surface, The pillar-shaped wiring is located on the first positive side with respect to the inductor wiring. The inductor component according to claim 1 .

5. The inductor wiring has a seed layer in contact with the interlayer insulating layer on the first positive side. The inductor component according to claim 1 .

6. A direction opposite to the first positive direction is a first negative direction, When a portion of the outer insulating layer that is located at the same position as the interlayer insulating layer in the first positive direction is defined as a contact end portion, The outer surface of the contact end portion opposite to the interlayer insulating layer is inclined toward the interlayer insulating layer in the first negative direction. The inductor component according to claim 1 .

7. When the inductor wiring is a first inductor wiring, the interlayer insulating layer is a first interlayer insulating layer, the inter-wiring insulating layer is a first inter-wiring insulating layer, and the outer insulating layer is a first outer insulating layer, a second interlayer insulating layer extending on the first positive side surface of the first inductor wiring and the first interwiring insulating layer; a second inter-wiring insulating layer extending from the second inter-layer insulating layer in the first positive direction; a second inductor wiring extending on a first positive direction side with respect to the second interlayer insulating layer within a region defined by the second interlayer insulating layer; Equipped with In the specific cross section, the second inter-wiring insulating layer is present at a plurality of locations in a discontinuous manner in a direction along the main surface, a surface of the second interlayer insulating layer that faces a direction parallel to the main surface is defined as an end surface; When a portion of the second inter-wiring insulating layer where a surface facing a direction parallel to the main surface is in contact with the element body is defined as a second outer insulating layer, The second outer insulating layer is in contact with the end face of the second interlayer insulating layer and a face of the first outer insulating layer facing the element body. The inductor component according to claim 1 .

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