Laser beam machine

Abstract

To further suppress a molten material from scattering.SOLUTION: A laser beam machine 10 according to the disclosure comprises a laser emitting part 200 that emits a laser beam to a processing point 500 and a chamber 100 having a hollow part through which the laser emitting part 200 is communicated with the processing point 500. The chamber 100 comprises an air inflow path 130 into which air is flown through an air inflow ports 110 formed in an inner wall 150 forming the hollow part and an air absorption path 140 that absorbs air through an air absorption port 120 formed on a surface opposing to a surface on which the air inflow port 110 is formed. The hollow part has a rectangular shape cross section. Two or more of air inflow ports 110 are formed at a long side portion 150a of the inner wall 150. In a long side portion 150b opposing to the long side portion 150a, portions corresponding to the air inflow ports 110 are walls. In the long side portion 150a, a portion corresponding to the air absorption port 120 is a wall. The air absorption path 140 rises from the air absorption port 120 toward an end at an outer side.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present disclosure relates to a laser processing machine. [Background technology]

[0002] In a laser processing machine that processes a workpiece by irradiating it with a laser, molten material generated by the laser irradiation may scatter and adhere to an optical system such as a lens. For example, Patent Document 1 discloses a technique for supplying gas into a nozzle and generating negative pressure to protect an optical system from scattering of a molten material. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2018-114542 A Summary of the Invention [Problem to be solved by the invention]

[0004] The inventors have found the following problems regarding laser processing machines. If the molten material is not completely collected and remains, it may cause contamination of the optical system and the workpiece, which may result in a deterioration in the efficiency of laser processing. In addition, it may cause contamination of the inside of the nozzle and surrounding equipment, which may result in a shortened equipment life. Therefore, there is a need to further suppress the scattering of the molten material.

[0005] The present disclosure has been made in consideration of such problems, and has an object to provide a laser processing machine that can further suppress scattering of molten material. [Means for solving the problem]

[0006] One aspect of the present invention for achieving the above object is to A laser processing machine, a laser irradiation unit that irradiates a laser onto a workpiece; A chamber having a hollow portion communicating from the laser irradiation portion to a processing point of the workpiece, The chamber comprises: an air inlet passage that communicates with an air inlet provided in the middle of an inner wall that forms a hollow portion of the chamber and allows air to flow into the chamber via the air inlet; an air intake passage that communicates with an air intake port provided on a surface of the inner wall opposite to the surface of the inner wall on which the air inflow port is provided, and that draws air from within the chamber through the air intake port; There is a system in place, the hollow portion of the chamber has a rectangular cross section when cut in a direction perpendicular to the laser propagation direction, At least two of the air inlets are provided on a long side of the inner wall of the chamber, a portion of an inner wall of the chamber facing the inner wall provided with the air inlet is a wall, an inner wall of the chamber facing the air inlet has a wall at a location corresponding to the air inlet; The air intake passage has an upward inclination from the air intake port toward the outer end. Effect of the Invention

[0007] According to the present disclosure, it is possible to provide a laser processing machine that can further suppress scattering of molten material. [Brief description of the drawings]

[0008] [Figure 1] FIG. 2 is a plan view of a chamber provided in the laser processing machine according to the embodiment. [Diagram 2] 1 is a diagram showing a configuration of a laser processing machine according to an embodiment; [Diagram 3] FIG. 2 is a diagram showing the shape of a chamber. [Figure 4] 1 is a graph showing the relationship between the shape of a chamber and the number of residual particles. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] Hereinafter, an embodiment of the present disclosure will be described in detail with reference to the drawings. In each drawing, the same or corresponding elements are given the same reference numerals, and duplicated explanations will be omitted as necessary for clarity of explanation. In addition, in this specification, "substantially the same" refers to a state in which a person sees something as having the same shape and the same dimensions.

[0010] First, the configuration of a laser processing machine 10 according to this embodiment will be described with reference to Figures 1 and 2. As shown in Figure 1, the laser processing machine 10 includes at least a chamber 100 and a laser irradiation unit 200. The laser processing machine 10 may further include peripheral members 600, 700, etc. In addition to the laser processing machine 10, workpieces 300, 400 are also shown in Figure 1.

[0011] The laser processing machine 10 is a device that processes a workpiece by irradiating a laser. In the example shown in FIG. 1, the laser processing machine 10 joins two workpieces 300, 400 by irradiating a laser. The processing point 500 shown in FIG. 1 is the position where the laser is irradiated. The laser irradiation unit 200 irradiates a laser toward the processing point 500. The workpieces 300, 400 are melted and joined by the laser near the processing point 500. When the workpieces 300, 400 receive the laser, they are suddenly heated and instantaneously exceed their melting point or boiling point, and the molten material or molten vapor may diffuse to the surroundings. Hereinafter, the molten material and molten vapor are referred to as "molten matter". Note that the laser processing machine 10 may perform processing other than joining workpieces. For example, the laser processing machine 10 may perform drilling processing.

[0012] The peripheral members 600, 700 are members that are disposed around the chamber 100 and the workpieces 300, 400, etc., and have various functions. In the example shown in FIG.

[0013] The chamber 100 communicates with the processing point 500 from the laser irradiation unit 200. As shown in FIG. 1, the chamber 100 is a hollow member, and the laser passes through a hollow portion provided in the chamber 100. FIG. 2 is a view of the chamber 100 from the laser irradiation unit 200 side. As shown in FIG. 2, the chamber 100 has a rectangular hollow. Specifically, the chamber 100 has a hollow whose cross section when cut in a direction perpendicular to the laser traveling direction is rectangular. That is, the inner wall 150 of the chamber 100 has two opposing long side portions 150a, 150b and two short side portions (not shown) connecting the ends of the long side portions.

[0014] At least two air inflow paths 130 are provided in the chamber 100. In the example shown in FIG. 2, two air inflow paths 130a, 130b are provided in the chamber 100. The air inflow path 130 communicates with the air inlet 110, and air is introduced into the chamber 100 through the air inlet 110. As shown in FIG. 1, the air inlet 110 is provided in the middle of the inner wall 150 of the chamber 100. Specifically, at least two air inlets 110 are provided in the long side portion of the inner wall 150. In the example shown in FIG. 2, two air inlets 110a, 110b are provided in the long side portion 150a of the inner wall 150.

[0015] At least one air intake passage 140 is provided in the chamber 100. In the example shown in FIG. 2, one air intake passage 140 is provided in the chamber 100. The air intake passage 140 is connected to the air intake port 120, and air in the chamber 100 is drawn in through the air intake port 120. The air intake port 120 is provided in the middle of the inner wall 150 of the chamber 100, as shown in FIG. 1. Specifically, the air intake port 120 is provided in a long side portion opposite to the long side portion of the inner wall 150 in which the air inlet 110 is provided. In the example shown in FIG. 2, one air intake port 120 is provided in the long side portion 150b of the inner wall 150. The air intake passage 140 has an upward inclination from the air intake port 120 toward the end of the chamber 100 on the outer side, as shown in FIG. 1. In other words, the air intake passage 140 is angled so that the air intake port 120 faces the processing point 500. Moreover, the air intake port 120 is preferably provided at approximately the same height as the air inlets 110a, 110b, as shown in Fig. 1. By providing the air intake port 120 at approximately the same height as the air inlets 110a, 110b, short-circuiting of the air flow in the chamber 100 is suppressed, and a vertical swirling flow can be generated in the chamber 100 with high accuracy.

[0016] In the long side portion 150b opposite to the long side portion 150a where the air inlets 110a and 110b are provided, the portions corresponding to the air inlets 110a and 110b are walls. In other words, the air intake port 120 is not provided in the portions corresponding to the air inlets 110a and 110b in the long side portion 150b. In addition, in the long side portion 150a opposite to the long side portion 150b where the air intake port 120 is provided, the portions corresponding to the air intake port 120 are walls. In other words, the air inlets 110a and 110b are not provided in the portions corresponding to the air intake port 120 in the long side portion 150a. In the example shown in FIG. 2, the air intake port 120 is provided in the long side portion 150b at a position between the two air inlets 110a and 110b.

[0017] The arrows shown in Figures 1 and 2 indicate the flow of air in the chamber 100. As shown in Figures 1 and 2, the air flowing in from the air inflow passages 130a, 130b through the air inlets 110a, 110b generates a swirling flow rotating in the vertical and horizontal directions in the chamber 100. The air swirling in the chamber 100 is sucked in from the air intake passage 140 through the air intake port 120. Since the swirling flow extends in the vertical direction, i.e., in the laser travel direction, the air flow reaches the processing point 500. Since the swirling flow extends in the horizontal direction, i.e., in the direction perpendicular to the laser travel direction, the molten material can be discharged from the chamber 100 even when the processing point 500 is linear.

[0018] The molten material generated when the laser is irradiated to the processing point 500 is discharged from the air intake passage 140 together with the air on the swirling flow generated in the chamber 100. Therefore, adhesion of the molten material to the workpieces 300, 400 and each member constituting the laser processing machine 10 can be suppressed. Since the laser processing machine 10 discharges the molten material by the air flow, the running cost is reduced compared to a device that discharges the molten material using an inert gas or the like. In addition, since the laser processing machine 10 does not require a mechanism for supplying an inert gas, the structure is simple and the control is easy. Since the mass of the molten material contained in the air is larger than that of the air, there is a risk that the molten material will deviate from the air flow due to inertial force in the air intake passage 140, etc. Therefore, from the viewpoint of suppressing adhesion of the molten material to the air intake passage 140, it is preferable to provide the air intake passage 140 in a straight line. EXAMPLES

[0019] Next, an embodiment of the present invention will be described. The chamber models according to Example 1 and Comparative Examples 1 to 3 are shown in Fig. 3. Fig. 3 is a schematic diagram showing the chamber models cut along the direction in which the air inflow paths 130a, 130b extend. The chamber models according to Example 1 and Comparative Examples 1 to 3 are all provided with two air inflow paths 130a, 130b and one air suction path 140.

[0020] Example 1 is a model in which air inflow paths 130a, 130b and air intake path 140 are provided on the long side of the chamber inner wall, and air intake path 140 has an inclination from air intake port 120 toward the end on the outer side. That is, it is a model corresponding to chamber 100 described in the above embodiment. Comparative Example 1 is a model in which air inflow paths 130a, 130b and air intake path 140 are provided on the long side of the chamber inner wall, and air intake path 140 extends approximately horizontally from air intake port 120 toward the end on the outer side. Comparative Example 2 is a model in which air inflow paths 130a, 130b and air intake path 140 are provided on the short side of the chamber inner wall, and air intake path 140 extends approximately horizontally from air intake port 120 toward the end on the outer side. Comparative example 3 is a model in which air inlet passages 130a, 130b and air suction passage 140 are provided on the short side portion of the inner wall of the chamber, and air suction passage 140 has an incline from air suction port 120 toward the end on the outer side.

[0021] The model shown in FIG. 3 was used to evaluate the dischargeability. When the evaluation was performed, virtual particles simulating molten material were placed near the laser processing point in the chamber, and then air was sucked in to measure the number of virtual particles remaining in the chamber. It was assumed that the virtual particles were floating in the initial placement and would adhere when they collided with the inner wall surface or the like. The evaluation results are shown in FIG. 4. Comparing Example 1 and Comparative Example 1 with Comparative Example 2 and Comparative Example 3, it was found that by providing the air inlet 110 and the air inlet 120 on the long side portion of the inner wall of the chamber, many virtual particles could be discharged by the air flow. In addition, comparing Example 1 and Comparative Example 1, it was found that the virtual particles could be further discharged by providing an inclination in the air inlet path 140. Thus, it was found that Example 1 was superior in dischargeability, being able to discharge many virtual particles in a short time compared to Comparative Examples 1 to 3.

[0022] The present disclosure is not limited to the above-described embodiment, and can be modified as appropriate without departing from the spirit and scope of the present disclosure. [Explanation of symbols]

[0023] 10 Laser processing machine 100 Chamber 110 (110a, 110b) Air inlet 120 Air intake 130 (130a, 130b) Air inlet passage 140 Air intake passage 150 Inner wall 150a, 150b Long side 200 Laser irradiation section 300,400 Work 500 processing points 600,700 Peripheral parts

Claims

1. a laser irradiation unit that irradiates a laser onto a workpiece; A chamber having a hollow portion communicating from the laser irradiation portion to a processing point of the workpiece, The chamber includes: an air inlet passage that communicates with an air inlet provided in the middle of an inner wall that forms a hollow portion of the chamber and allows air to flow into the chamber via the air inlet; an air intake passage that communicates with an air intake port provided on a surface of the inner wall opposite to the surface of the inner wall on which the air inflow port is provided, and that draws air from within the chamber through the air intake port; There is a system in place, the hollow portion of the chamber has a rectangular cross section when cut in a direction perpendicular to the laser propagation direction, At least two of the air inlets are provided on a long side of the inner wall of the chamber, a portion of an inner wall of the chamber facing the inner wall provided with the air inlet is a wall, an inner wall of the chamber facing the air inlet has a wall at a location corresponding to the air inlet; The air intake passage has an upward inclination from the air intake port toward the outer end. Laser processing machine.

2. The laser processing machine according to claim 1 , wherein the air inlet is provided at substantially the same height as the air suction port.

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