Laminated core manufacturing device

Abstract

To accurately apply an adhesive to a predetermined position on a lower surface of a metal plate.SOLUTION: A laminated core manufacturing device 10 comprises: a lower die 20 having a die 23 in which a die hole 26 is formed; an upper die 40 having a punch 45 corresponding to the die hole 26; an adhesive application device 70 for applying an adhesive to a lower surface WL of a metal plate W; and a control device 90 for controlling the upper die 40 and the adhesive application device 70. The control device 90 has: a movement control unit 92 for controlling the movement of the upper die 40 in a vertical direction Z; and an application control unit 94 configured to be capable of changing a start time which is a time to start the application of the adhesive from the adhesive application device 70 to the lower surface WL of the metal plate W.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present invention relates to an apparatus for manufacturing a laminated core. [Background technology]

[0002] A laminated core used in a motor or the like is formed by punching a strip-shaped metal plate (e.g., strip-shaped steel plate) into a predetermined shape to form an iron core member (core), and stacking and integrating the formed iron core members. For example, a laminated core is formed by stacking and integrating the iron core members by caulking, welding, or bonding. For example, Patent Document 1 discloses a manufacturing device that stacks a plurality of iron core members using an adhesive to manufacture a laminated core bonded to each other. In Patent Document 1, an adhesive application mechanism is provided in a lower mold having a die, and when the bottom dead center position of the pressing timing is reached, adhesive discharged from a discharge nozzle of the adhesive application mechanism is applied to a predetermined position on the lower surface of a thin steel plate. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2001-321850 A Summary of the Invention [Problem to be solved by the invention]

[0004] When applying the adhesive to the underside of the metal plate, the adhesive needs to be applied accurately to a predetermined position on the underside of the metal plate. If the adhesive is not applied accurately, the iron core members will not be bonded accurately to each other, which may reduce the strength of the laminated iron core.

[0005] The present invention has been made in consideration of the above-mentioned points, and its object is to provide a laminated core manufacturing apparatus that can accurately apply adhesive to a predetermined position on the underside of a metal plate. [Means for solving the problem]

[0006] The laminated iron core manufacturing apparatus of the present invention is a laminated iron core manufacturing apparatus in which a plurality of iron core components are stacked and bonded to each other, and comprises a lower mold having a die with a die hole formed therein, an upper mold having a punch corresponding to the die hole, an adhesive application device provided on the lower mold and applying adhesive to the underside of a strip-shaped metal plate, and a control device for controlling the upper mold and the adhesive application device, wherein the control device has a movement control unit that controls the vertical movement of the upper mold, and an application control unit configured to be able to change the start timing, which is the timing at which the adhesive application device starts applying the adhesive to the underside of the metal plate.

[0007] The laminated core manufacturing apparatus according to the present invention includes a control device that controls the upper die and the adhesive applicator. The application control unit of the control device is configured to be able to change the start timing, which is the timing at which the adhesive applicator starts applying adhesive to the underside of the metal plate. According to the above aspect, since the start timing of adhesive application can be changed as appropriate, the adhesive can be applied more accurately to a predetermined position on the underside of the metal plate at a predetermined timing.

[0008] Another laminated iron core manufacturing apparatus according to the present invention is a laminated iron core manufacturing apparatus in which a plurality of iron core components are stacked and bonded to each other, and comprises a lower mold having a die with a die hole formed therein, an upper mold having a punch corresponding to the die hole, an adhesive application device provided on the lower mold and applying adhesive to the underside of a strip-shaped metal plate, and a control device for controlling the upper mold and the adhesive application device, wherein the control device has a movement control unit that controls the vertical movement of the upper mold, and an application control unit configured to be able to change the completion timing, which is the timing at which the application of the adhesive from the adhesive application device to the underside of the metal plate is completed.

[0009] Another laminated core manufacturing apparatus according to the present invention includes a control device that controls the upper die and the adhesive applicator. The application control unit of the control device is configured to be able to change the completion timing, which is the timing at which the adhesive applicator completes application of the adhesive to the underside of the metal plate. According to the above aspect, since the timing at which the adhesive application is completed can be changed as appropriate, the adhesive can be applied more accurately to a predetermined position on the underside of the metal plate at a predetermined timing.

[0010] Another laminated iron core manufacturing apparatus according to the present invention is a laminated iron core manufacturing apparatus in which a plurality of iron core components are stacked and bonded to each other, and comprises a lower mold having a die with a die hole formed therein, an upper mold having a punch corresponding to the die hole, an adhesive application device provided on the lower mold and applying adhesive to the underside of a strip-shaped metal plate, and a control device for controlling the upper mold and the adhesive application device, wherein the control device has a movement control unit that controls the vertical movement of the upper mold, and an application control unit configured to be able to change the period from when the adhesive application device starts to apply the adhesive to the underside of the metal plate to when it is completed.

[0011] Another laminated core manufacturing apparatus according to the present invention includes a control device that controls the upper die and the adhesive applicator. The application control unit of the control device is configured to be able to change the period from when the adhesive applicator starts to apply adhesive to the underside of the metal plate until it finishes. According to the above aspect, the period for applying the adhesive can be changed as needed, so that the adhesive can be applied more accurately to a predetermined position on the underside of the metal plate at a predetermined timing. Effect of the Invention

[0012] According to the present invention, it is possible to provide a laminated core manufacturing device capable of accurately applying adhesive to a predetermined position on the lower surface of a metal plate. [Brief description of the drawings]

[0013] [Figure 1] FIG. 1 is a side view showing a manufacturing apparatus for a laminated core according to one embodiment. [Diagram 2] FIG. 2 is a perspective view showing a laminated core according to one embodiment. [Diagram 3] FIG. 3 is a plan view showing a lower mold according to one embodiment. [Figure 4A] FIG. 4A is a cross-sectional view showing a lift member and its surrounding structure according to one embodiment. [Figure 4B] FIG. 4B is a cross-sectional view illustrating a state in which the stripper plate according to the embodiment presses the metal plate downward. [Figure 4C] FIG. 4C is a cross-sectional view showing a state in which the metal plate is sandwiched between the stripper plate and the die plate according to the embodiment. [Diagram 5] FIG. 5 is a cross-sectional view showing a manufacturing apparatus for a laminated core according to one embodiment. [Figure 6A] FIG. 6A is a schematic diagram showing the positional relationship between a pilot pin and a pilot hole according to one embodiment. [Figure 6B] FIG. 6B is a schematic diagram showing a state in which a pilot pin according to one embodiment is inserted into a pilot hole. [Figure 6C] FIG. 6C is a schematic diagram showing a state in which half of the insertion portion of the pilot pin according to one embodiment is inserted into the pilot hole. [Figure 7A] FIG. 7A is a cross-sectional view showing an adhesive application device according to one embodiment in a normal state. [Figure 7B] FIG. 7B is a cross-sectional view showing a state in which adhesive is being supplied to an adhesive storage chamber of the adhesive application device according to one embodiment. [Figure 7C] FIG. 7C is a cross-sectional view showing a state in which adhesive is discharged from a nozzle of the adhesive dispensing device according to the embodiment. [Figure 7D] FIG. 7D is a cross-sectional view showing a state in which the adhesive discharged from a nozzle of the adhesive applicator according to the embodiment is attached to the lower surface of a band-shaped metal plate. [Figure 8] FIG. 8 is a cross-sectional view showing a state in which the stripper plate according to the embodiment is at the lowest position and pressing the band-shaped metal plate against the die plate. [Figure 9] FIG. 9 is an example of a graph showing the relationship between the vertical position of the upper die and the state of each member according to one embodiment. [Figure 10] FIG. 10 is a flowchart of a method for manufacturing a laminated core according to one embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] Hereinafter, an embodiment of a laminated core manufacturing apparatus according to the present invention will be described with reference to the drawings. Note that the embodiment described here is not intended to limit the present invention in any particular way. Also, the same reference numerals are used for members and parts that perform the same function, and duplicated descriptions are omitted or simplified as appropriate.

[0015] As shown in FIG. 1, a laminated core manufacturing apparatus 10 (hereinafter referred to as manufacturing apparatus 10) of this embodiment manufactures a laminated core 8 (see FIG. 2) in which a plurality of core members 5 (see FIG. 2) are stacked and bonded to each other. The manufacturing apparatus 10 is a progressive press die. In the manufacturing apparatus 10, a strip-shaped metal plate W is intermittently conveyed to a plurality of processing stages 25 (see FIG. 3) described below. The strip-shaped metal plate W is, for example, a coil material (strip-shaped thin steel plate). The manufacturing apparatus 10 includes a lower die 20, an upper die 40, a pilot pin 50 (see FIG. 5), a stripper plate 60, an adhesive application device 70 (see FIG. 5), and a control device 90.

[0016] The lower die 20 is fixed to the floor surface. As shown in FIG. 3, the lower die 20 is provided with a plurality of processing stages 25. The processing stages 25 include a pilot hole punching stage 25X, an inner shape punching stage 25A, an adhesive application stage 25B, and an outer shape punching stage 25C. The pilot hole punching stage 25X, the inner shape punching stage 25A, the adhesive application stage 25B, and the outer shape punching stage 25C are arranged in this order in the forward feed direction D. The pilot hole punching stage 25X includes a pilot hole forming die plate 22X, a pilot hole forming die 23X, a die hole 26X for punching a pilot hole, and a punch 45X for punching a pilot hole (see FIG. 5), which will be described later. The inner shape punching stage 25A includes a first die plate 22A, a first die 23A, an inner shape punching die hole 26A, and an inner shape punching punch 45A (see FIG. 5), which will be described later. The outer shape punching stage 25C includes a second die plate 22C, a second die 23C, an outer shape punching die hole 26C, and an outer shape punching punch 45C (see FIG. 5), which will be described later.

[0017] The lower mold 20 has a lower mold body 21, a die plate 22, and a die 23. The die plate 22 and the die 23 are placed on the lower mold body 21. The die plate 22 holds the die 23. The die plate 22 includes a pilot hole forming die plate 22X that holds a pilot hole forming die 23X described later, a first die plate 22A that holds a first die 23A described later, and a second die plate 22C that holds a second die 23C described later. The die 23 includes a pilot hole forming die 23X included in a pilot hole punching stage 25X, a first die 23A included in an inner shape punching stage 25A, and a second die 23C included in an outer shape punching stage 25C. The die 23 has a die hole 26 formed therein. The pilot hole forming die 23X has a pilot hole punching die hole 26X formed therein as the die hole 26. The first die 23A has an inner shape punching die hole 26A as the die hole 26. The second die 23C has an outer shape punching die hole 26C as the die hole 26. The upper surface 22T of the die plate 22 and the upper surface 23T of the die 23 are located at the same height. More specifically, the upper surface 22T of the pilot hole forming die plate 22X and the upper surface 23T of the pilot hole forming die 23X, the upper surface 22T of the first die plate 22A and the upper surface 23T of the first die 23A, and the upper surface 22T of the second die plate 22C and the upper surface 23T of the second die 23C are located at the same height. The lower die body 21 includes an adhesive application stage 25B. The lower die body 21 has an adhesive application through hole 27. Note that in FIG. 3, an adhesive application device 70 (see FIG. 5) is omitted from the illustration.

[0018] The belt-shaped metal sheet W is intermittently conveyed to the lower die 20 by a conveying device (not shown) provided near the manufacturing device 10. The belt-shaped metal sheet W is intermittently conveyed through the pilot hole punching stage 25X, the inner shape punching stage 25A, the adhesive application stage 25B, and the outer shape punching stage 25C in this order. The conveying device holds the belt-shaped metal sheet W in a wound state. The belt-shaped metal sheet W is conveyed to the lower die 20 by an unwinding device (not shown) of the conveying device, and the end material of the pressed belt-shaped metal sheet W is conveyed from the lower die 20 by a winding device (not shown) of the conveying device and wound up on the winding device. Note that instead of the unwinding device and winding device of the conveying device, the belt-shaped metal sheet W may be conveyed by being sandwiched between a pair of upper and lower rotating rolls arranged on the upstream and downstream sides of the manufacturing device 10, respectively.

[0019] As shown in FIG. 3, the die 23 of the lower die 20 has a plurality of lift members 30. The lift members 30 urge the strip-shaped metal plate W upward. The lift members 30 are configured to be able to push the strip-shaped metal plate W upward. When the strip-shaped metal plate W is intermittently conveyed on the die plate 22 and the die 23, the lift members 30 push the strip-shaped metal plate W upward and hold the strip-shaped metal plate W at a predetermined distance above the upper surface 22T of the die plate 22 and the upper surface 23T of the die 23. As shown in FIG. 4A, the lift members 30 are urged upward by a urging member 32 provided on the die 23. The urging member 32 is, for example, a coil spring. As shown in FIG. 4B, when the stripper plate 60 moves downward and the strip-shaped metal plate W is pressed downward by the stripper plate 60, the lift members 30 move downward against the urging force of the urging member 32. As a result, the strip-shaped metal sheet W is pressed against the upper surface 22T of the die plate 22 of the lower die 20 (more specifically, the upper surface 22T of the pilot hole forming die plate 22X, the upper surface 22T of the first die plate 22A, and the upper surface 22T of the second die plate 22C) and the upper surface 23T of the die 23 (more specifically, the upper surface 23T of the pilot hole forming die 23X, the upper surface 23T of the first die 23A, and the upper surface 23T of the second die 23C) by the stripper plate 60 (see FIG. 4C). At this time, the stripper plate 60 is located at the lowest position LP. As shown in FIGS. 4A to 4C, the biasing member 32 is configured to allow a portion WC of the metal sheet W located between the portion WA in contact with the lift member 30 and the portion WB in contact with the stripper plate 60 to move downward while maintaining a horizontal state during the period when the stripper plate 60 presses the metal sheet W downward against the biasing force of the biasing member 32. That is, the parts WA, WB, and WC move downward while maintaining a horizontal state. On the other hand, when the stripper plate 60 moves upward and the pressing force of the stripper plate 60 is no longer applied to the band-shaped metal plate W, the lift member 30 moves upward by the biasing force of the biasing member 32. That is, the lift member 30 is configured to be movable to the uppermost position PM (see FIG. 4A) when the stripper plate 60 is not pressing the band-shaped metal plate W.As a result, the lift member 30 holds the strip-shaped metal sheet W a predetermined distance above the lower die 20 (more specifically, the upper surface 22T of the die plate 22 and the upper surface 23T of the die 23). The strip-shaped metal sheet W moves above the upper surface 30A of the lift member 30 during the intermittent conveyance process. The die 23 of the lower die 20 has a regulating member 28 that regulates the upward movement of the strip-shaped metal sheet W when the lift member 30 pushes the strip-shaped metal sheet W upward. The regulating member 28 regulates the gap between the strip-shaped metal sheet W and the lower die 20 (more specifically, the upper surface 22T of the die plate 22 and the upper surface 23T of the die 23) from becoming larger than a predetermined distance.

[0020] As shown in FIG. 5, the upper die 40 is disposed above the lower die 20. The upper die 40 is configured to be able to approach and move away from the lower die 20. The upper die 40 has a plurality of punches 45 corresponding to the die holes 26. The punches 45 include a pilot hole punching punch 45X, an inner shape punching punch 45A, and an outer shape punching punch 45C. The pilot hole punching punch 45X is located above the pilot hole punching die hole 26X. The pilot hole punching punch 45X is configured to be able to be inserted into the pilot hole punching die hole 26X. The pilot hole punching punches 45X are arranged in pairs at a predetermined interval in the width direction E (see FIG. 3), which is a direction perpendicular to the forward feed direction D. The inner shape punching punch 45A is located above the inner shape punching die hole 26A. The inner shape punching punch 45A is configured to be able to be inserted into the inner shape punching die hole 26A. The punch 45C for punching the outer shape is located above the die hole 26C for punching the outer shape. The punch 45C for punching the outer shape is configured to be insertable into the die hole 26C for punching the outer shape. After the upper die 40 descends and approaches the lower die 20 in the pilot hole punching stage 25X, the pilot hole punching punch 45X and the die hole 26X for punching the pilot hole punch the strip-shaped metal sheet W are punched out. As a result, pilot holes PH (see FIG. 3) are formed in the strip-shaped metal sheet W. As shown in FIG. 3, two pilot holes PH are formed in the width direction E. A pilot pin 50 is inserted into the formed pilot hole PH. As shown in FIG. 5, in the inner shape punching stage 25A (see FIG. 3), after the upper die 40 descends and approaches the lower die 20, the inner shape punching punch 45A and the die hole 26A for punching the inner shape are punched out of the strip-shaped metal sheet W. As a result, the inner shape of the core member 5 is formed in the band-shaped metal plate W. In the outer shape punching stage 25C (see FIG. 3), after the upper die 40 descends and approaches the lower die 20, the band-shaped metal plate W is punched out by the outer shape punching punch 45C and the outer shape punching die hole 26C. As a result, the outer shape of the core member 5 is formed in the band-shaped metal plate W, and the core member 5 (see also FIG. 2) is completed, and the core members 5 are stacked one after another in the outer shape punching die hole 26C.As will be described later, an adhesive is applied to the underside of the completed core members 5, so that when the core members 5 are stacked, the core members 5 stacked in the vertical direction Z are adhered to each other.

[0021] As shown in FIG. 5, the pilot pin 50 is provided on the upper die 40. As shown in FIG. 6A, the pilot pin 50 is disposed at a position facing the pilot hole PH formed in the strip-shaped metal plate W. The pilot pin 50 is configured to be movable in the up-down direction Z together with the upper die 40. The pilot pin 50 is configured to be insertable into the pilot hole PH. As shown in FIG. 6B, the upper die 40 descends, so that the pilot pin 50 is inserted into the pilot hole PH. The pilot pin 50 is inserted into the pilot hole PH, so that the strip-shaped metal plate W is positioned relative to the manufacturing device 10 (e.g., the adhesive application device 70). FIG. 6B shows a state in which the pilot pin 50 is located at the lowest position, that is, a state in which the pilot pin 50 is located at the bottom dead center. When the upper die 40 is located at the bottom dead center, the pilot pin 50 is located at the bottom dead center. As shown in FIG. 6B, the pilot pin 50 has an insertion portion 50A that is inserted into the pilot hole PH. The insertion portion 50A is a portion of the pilot pin 50 that is located below the pilot hole PH when the pilot pin 50 is located at the bottom dead center. When the upper die 40 is raised while the pilot pin 50 is inserted into the pilot hole PH, the pilot pin 50 is removed from the pilot hole PH. FIG. 6C shows a state in which half of the length of the insertion portion 50A of the pilot pin 50 in the vertical direction Z is inserted into the pilot hole PH. For convenience of explanation, the upper die 40 and the like are not shown in FIGS. 6A to 6C.

[0022] As shown in FIG. 5, the stripper plate 60 is provided on the upper die 40. The stripper plate 60 is disposed at a position facing the die plate 22 of the lower die 20. The stripper plate 60 is configured to be movable in the vertical direction together with the upper die 40. The stripper plate 60 is configured to be movable downward to a lowest position LP (see FIG. 8), which is the lowest position. The stripper plate 60 restricts the vertical movement of the metal sheet W at the lowest position LP when the strip-shaped metal sheet W is punched by the punch 45. Note that the stripper plate 60 can restrict the movement of the metal sheet W in the vertical direction Z even when the stripper plate 60 is located slightly above the lowest position LP. When the stripper plate 60 moves to the lowest position LP, the stripper plate 60 is configured to be able to press the intermittently conveyed strip-shaped metal sheet W against the lower die 20 (here, the die plate 22 and the die 23) and to clamp the strip-shaped metal sheet W together with the lower die 20 (here, the die plate 22 and the die 23). The stripper plate 60 presses the band-shaped metal sheet W against the upper surface 22T of the die plate 22 and the upper surface 23T of the die 23. The stripper plate 60 is formed with a punch insertion hole 60X through which the pilot hole punching punch 45X is inserted, a punch insertion hole 60A through which the inner shape punching punch 45A is inserted, and a punch insertion hole 60C through which the outer shape punching punch 45C is inserted. When the upper die 40 is lowered and the stripper plate 60 presses the band-shaped metal sheet W against the die plate 22, the upper die 40 is further lowered, so that the pilot hole punching punch 45X protrudes from the punch insertion hole 60X and is inserted into the pilot hole punching die hole 26X, the inner shape punching punch 45A protrudes from the punch insertion hole 60A and is inserted into the inner shape punching die hole 26A, and the outer shape punching punch 45C protrudes from the punch insertion hole 60C and is inserted into the outer shape punching die hole 26C.

[0023] As shown in FIG. 3, the adhesive application device 70 is provided on the lower die body 21 of the lower die 20. The adhesive application device 70 is arranged between the inner shape punching stage 25A and the outer shape punching stage 25C. In this embodiment, "the adhesive application device 70 is arranged between the inner shape punching stage 25A and the outer shape punching stage 25C" includes a case where the adhesive application device 70 is provided adjacent to the inner shape punching stage 25A (for example, a case where it is provided on the first die plate 22A) and a case where the adhesive application device 70 is provided adjacent to the outer shape punching stage 25C (for example, a case where it is provided on the second die plate 22C). Note that the adhesive application device 70 does not necessarily have to be provided between the inner shape punching stage 25A and the outer shape punching stage 25C. For example, the adhesive application device 70 may be provided adjacent to the pilot hole punching stage 25X. In the example shown in FIG. 3, the nozzles 72 of the multiple adhesive application devices 70 are illustrated. The nozzles 72 are arranged at approximately equal intervals in a double ring shape. The adhesive application device 70 is provided in the adhesive application stage 25B (see also FIG. 5). More specifically, the adhesive application device 70 is disposed in the adhesive application through hole 27. The adhesive application device 70 is located below the strip-shaped metal plate W. The adhesive application device 70 applies adhesive to the lower surface WL of the strip-shaped metal plate W. The adhesive application device 70 applies adhesive to the lower surface WL of the strip-shaped metal plate W while the strip-shaped metal plate W is being transported from the inner shape punching stage 25A to the outer shape punching stage 25C. The adhesive application device 70 of this embodiment applies adhesive to the lower surface WL of the strip-shaped metal plate W by a non-contact application method (for example, a jet dispensing method or a spray method). Examples of liquid adhesives used in the adhesive application device 70 include epoxy adhesives, acrylic adhesives, silicon adhesives, and urethane adhesives, but are not particularly limited as long as sufficient adhesive strength is obtained to form the laminated iron core 8. The curing method of the adhesive is not particularly limited, and for example, a solvent volatilization type, a moisture curing type, a heat curing type, a curing agent mixed type, etc. can be used.

[0024] As shown in FIGS. 7A to 7D, the adhesive application device 70 has a housing 71, a nozzle 72, a plunger 73, and a supply tube 74. The housing 71 has an adhesive storage chamber 71A filled with adhesive. The housing 71 has an insertion hole 71B through which the supply tube 74 is inserted. The adhesive storage chamber 71A and the insertion hole 71B are connected to each other. The nozzle 72 is formed in the housing 71. The nozzle 72 is connected to the adhesive storage chamber 71A. The nozzle 72 is located below the belt-shaped metal plate W. The discharge port 72A of the nozzle 72 is located below the upper surface 22T of the die plate 22, which is the uppermost surface of the lower mold 20, and the upper surface 23T of the die 23 (see FIG. 5). The nozzle 72 sprays the adhesive onto the lower surface WL of the belt-shaped metal plate W. The adhesive sprayed from the discharge port 72A of the nozzle 72 is applied to the lower surface WL of the belt-shaped metal plate W in the form of droplets. A portion of the plunger 73 is accommodated in the adhesive storage chamber 71A of the housing. The plunger 73 slides within the adhesive storage chamber 71A. The plunger 73 is configured to be able to open and close the insertion hole 71B. The supply tube 74 is inserted through the insertion hole 71B. The supply tube 74 is connected to an adhesive storage tank (not shown) that stores the adhesive. For example, an application control unit 94 (see FIG. 1 ) of the control device 90, which will be described later, drives a supply pump (not shown) to supply adhesive to the adhesive storage chamber 71A via the supply tube 74.

[0025] As shown in FIG. 7A, when the adhesive application device 70 is not operating, most of the plunger 73 is accommodated in the adhesive storage chamber 71A. At this time, the insertion hole 71B is closed by the plunger 73, so that the adhesive storage chamber 71A and the insertion hole 71B are not communicated with each other, and no adhesive is supplied to the adhesive storage chamber 71A. As shown in FIG. 7B, when a signal is supplied to the adhesive application device 70, the plunger 73 moves downward, the insertion hole 71B is opened, and the adhesive storage chamber 71A and the insertion hole 71B are communicated with each other. As a result, the adhesive is supplied to the adhesive storage chamber 71A through the supply tube 74, as shown by the arrow F1. As shown in FIG. 7C, when the adhesive storage chamber 71A is completely filled with the adhesive, the plunger 73 moves upward. As a result, the adhesive G filled in the adhesive storage chamber 71A is discharged (sprayed) from the nozzle 72. At this time, the plunger 73 closes the insertion hole 71B. 7D, the adhesive G discharged (sprayed) from the nozzle 72 is applied to the lower surface WL of the band-shaped metal plate W, and the adhesive G adheres to the lower surface WL. Here, the adhesive G, which is sprayed from the discharge port 72A of the nozzle 72 and becomes droplets, spreads over a range larger than the opening area of ​​the discharge port 72A when it is applied (adheres) to the lower surface WL of the band-shaped metal plate W.

[0026] The adhesive applicator 70 applies the adhesive to the underside WL of the belt-shaped metal plate W by a non-contact application method, but is not limited to this. The adhesive applicator 70 may apply the adhesive to the underside WL of the belt-shaped metal plate W by a contact application method. The adhesive applicator 70 may, for example, bring a pile of adhesive from the discharge port 72A of the nozzle 72 into contact with the belt-shaped metal plate W to transfer the adhesive to the underside WL.

[0027] Fig. 9 is an example of a graph showing the relationship between the position in the vertical direction Z of upper die 40 and the state of each member during one cycle from when upper die 40, which is located at the top dead center, passes through the bottom dead center and returns to the top dead center again. The relationship between the position in the vertical direction Z of upper die 40 and the state of each member is not limited to that shown in Fig. 9. Note that the vertical axis of Fig. 9 indicates the position in the vertical direction Z of upper die 40, and the horizontal axis of Fig. 9 indicates the angle of upper die 40 (crank angle).

[0028] As shown in FIG. 9, at timing T0 when the upper die 40 is located at the top dead center, the strip-shaped metal sheet W is being transported in the forward feed direction D. Then, when the upper die 40 moves downward and reaches timing T1, the transport of the strip-shaped metal sheet W is completed. That is, the transport of the strip-shaped metal sheet W is stopped between timing T1 and timing T13 described later. When the upper die 40 moves further downward and reaches timing T2, the pilot pin 50 starts to be inserted into the pilot hole PH formed in the metal sheet W. That is, the pilot pin 50 is not inserted into the pilot hole PH before timing T2. When the upper die 40 moves further downward and reaches timing T3, the stripper plate 60 comes into contact with the metal sheet W. At this timing T3, the stripper plate 60 starts to press the lift member 30 downward via the metal sheet W, so that the lift member 30 starts to move downward. Also, when the timing T3 is reached, the adhesive application device 70 may start applying adhesive to the lower surface WL of the metal sheet W. When the upper die 40 moves further downward and reaches timing T4, the stripper plate 60 moves to the lowest position LP and presses the metal sheet W against the lower die 20. At this time, the descent of the lift member 30 is completed and the lift member 30 is also located at the lowest position. When the upper die 40 moves further downward and reaches timing T5, the adhesive application device 70 may start applying adhesive to the lower surface WL of the metal sheet W. When the upper die 40 moves further downward and reaches timing T6, the pilot hole punching punch 45X, the inner shape punching punch 45A, and the outer shape punching punch 45C start punching the metal sheet W. When the upper die 40 moves further downward and reaches timing T7, the pilot hole punching punch 45X, the inner shape punching punch 45A, and the outer shape punching punch 45C complete punching the metal sheet W. Then, the upper die 40 passes the bottom dead center at timing T8 and starts moving upward.

[0029] As shown in FIG. 9, when the upper die 40 moves upward from the bottom dead center and reaches timing T9, if the adhesive application device 70 has started applying the adhesive to the lower surface WL of the metal sheet W by the non-contact application method at timing T3 or timing T5, the application of the adhesive may be completed. When the upper die 40 moves further upward and reaches timing T10, the pressing of the metal sheet W by the stripper plate 60 is completed, and the lift member 30 begins to rise by the biasing member 32. When the upper die 40 moves further upward and reaches timing T11, the stripper plate 60 is completely separated from the metal sheet W, and the lift member 30 moves to the uppermost position PM (see FIG. 4A). Note that if the adhesive application device 70 has started applying the adhesive to the lower surface WL of the metal sheet W at timing T3 or timing T5, and the application of the adhesive has not been completed at timing T9, the application of the adhesive is completed. In this way, when the adhesive is applied by the non-contact application method, the application of the adhesive is completed at timing T9 or timing T11. On the other hand, when the adhesive is applied by the contact application method, application of the adhesive is completed at timing T11. When the upper die 40 moves further upward and reaches timing T12, the pilot pin 50 inserted in the pilot hole PH is completely removed from the pilot hole PH. Between timing T2 and timing T12, at least a part of the pilot pin 50 is inserted in the pilot hole PH. When the upper die 40 moves further upward and reaches timing T13, transportation of the strip-shaped metal sheet W begins. That is, between timing T13 and timing T1, the strip-shaped metal sheet W is transported in the forward feed direction D. Then, the upper die 40 passes the top dead center at timing T0 and begins to move downward.

[0030] As shown in FIG. 1, the control device 90 controls the upper mold 40 and the adhesive application device 70. The control device 90 includes, for example, a central processing unit (CPU) that executes instructions of a control program, a ROM that stores the program executed by the CPU, a RAM that is used as a working area for expanding the program, and a storage device such as a memory that stores the program and various data. The control device 90 includes a movement control unit 92 and an application control unit 94. The functions of each unit of the control device 90 are realized by a program. The program is downloaded, for example, via the Internet. The program may be read from a recording medium such as a CD or DVD. The functions of each unit of the control device 90 may be realized by a processor and / or a circuit.

[0031] The movement control unit 92 controls the movement of the stripper plate 60 in the vertical direction Z. In this embodiment, the movement control unit 92 controls the movement of the pilot pin 50 and the stripper plate 60 in the vertical direction Z by moving the upper die 40 in the vertical direction Z. The movement control unit 92 controls the approach of the upper die 40 to the lower die 20 and the separation of the upper die 40 from the lower die 20. The movement control unit 92 may be configured to be able to change the ascending speed and descending speed of the upper die 40. The movement control unit 92 may be configured to be able to change the lowest position LP according to the thickness of the metal sheet W. That is, the movement control unit 92 may be configured to be able to adjust the distance between the lower surface 60B of the stripper plate 60 located at the lowest position LP and the upper surface 22T of the die plate 22 according to the thickness of the metal sheet W.

[0032] The application control unit 94 controls the adhesive application device 70. The application control unit 94 controls the movement of the plunger 73. The application control unit 94 starts application of adhesive from the adhesive application device 70 to the lower surface WL of the metal plate W after the pilot pin 50 is inserted into the pilot hole PH (for example, after timing T2 in FIG. 9). The application control unit 94 may start application of adhesive from the adhesive application device 70 to the lower surface WL of the metal plate W only when at least a part of the pilot pin 50 is inserted into the pilot hole PH (for example, timing T2 to timing T5 in FIG. 9). The application control unit 94 completes application of adhesive from the adhesive application device 70 to the lower surface WL of the metal plate W before the pilot pin 50 comes out of the pilot hole PH (for example, before timing T12 in FIG. 9). The application control unit 94 may complete application of adhesive from the adhesive application device 70 to the lower surface WL of the metal sheet W during the period from when the pilot pin 50 is located at the bottom dead center (i.e., when the upper die 40 is located at the bottom dead center; see FIG. 6B) until the pilot pin 50 moves upward from the bottom dead center and comes out of the pilot hole PH (for example, between timing T8 and timing 12 in FIG. 9). The application control unit 94 may complete application of adhesive from the adhesive application device 70 to the lower surface WL of the metal sheet W during the period from when half of the length in the vertical direction Z of the insertion portion 50A of the pilot pin 50 comes out of the pilot hole PH (see FIG. 6C) until before the entire insertion portion 50A comes out of the pilot hole PH (for example, before timing T12 in FIG. 9). The application control unit 94 may complete application of adhesive from the adhesive application device 70 to the lower surface WL of the metal sheet W before the lift member 30 moves to the uppermost position PM (see FIG. 4A) (for example, before timing T11 in FIG. 9). The application control unit 94 may cause the adhesive application device 70 to apply adhesive to the underside WL of the metal plate W only when the transportation of the metal plate W is stopped (for example, from timing T1 to timing T13 in FIG. 9). The application control unit 94 may cause the adhesive application device 70 to apply adhesive to the underside WL of the metal plate W only when at least a portion of the pilot pin 50 is inserted into the pilot hole PH and the transportation of the metal plate W is stopped (for example, from timing T2 to timing T12 in FIG. 9).

[0033] The application control unit 94 may be configured to be able to change the start timing (timing T3 and timing T5 in the example shown in FIG. 9) which is the timing at which the adhesive application device 70 starts applying the adhesive to the lower surface WL of the metal plate W. The timing includes both timing based on the crank angle and timing based on the elapsed time. The application control unit 94 may be configured to be able to change the start timing according to the amount of adhesive applied per application portion on the lower surface WL of the metal plate W (the amount of adhesive to be applied necessary to bond the iron core members 5 to each other). The application control unit 94 may be configured to delay the start timing as the amount of adhesive applied per application portion is smaller. Note that a difference may occur between the amount of adhesive to be applied (i.e., the amount of adhesive applied) and the amount of adhesive actually applied due to clogging of the nozzle 72 or the like. That is, the amount of adhesive actually applied may be less than the amount of adhesive applied. By providing a sensor that measures the amount of adhesive actually applied, the application control unit 94 may be configured to be able to change the start timing according to the amount of adhesive actually applied per application portion on the lower surface WL of the metal plate W. The application control unit 94 may be configured to be able to change the start timing depending on the viscosity of the adhesive (including the temperature of the apparatus itself and the ambient temperature, which affect the viscosity of the adhesive). For example, the manufacturing apparatus 10 may be provided with a sensor that measures the viscosity of the adhesive, and the application control unit 94 may be configured to be able to change the start timing based on the viscosity of the adhesive measured by the sensor. The application control unit 94 may be configured to make the start timing earlier as the viscosity of the adhesive increases. The start timing may be the timing at which an adhesive jetting start signal is sent to the nozzle 72. The start timing may also be the timing at which the adhesive jetting from the nozzle 72 starts. The start timing may also be the timing at which the adhesive applicator 70 starts transferring the adhesive to the lower surface WL of the metal plate W. Furthermore, the start timing may be the timing at which the adhesive jetted upward from the outlet 72A of the nozzle 72 (for example, the adhesive puffed upward from the outlet 72A) starts contacting the lower surface WL of the metal plate W.

[0034] The application control unit 94 may be configured to be able to change the completion timing (timing T9 and timing T11 in the example shown in FIG. 9) which is the timing at which application of the adhesive from the adhesive application device 70 to the lower surface WL of the metal plate W is completed. The application control unit 94 may be configured to be able to change the completion timing according to the amount of adhesive applied per application portion of the lower surface WL of the metal plate W. The application control unit 94 may be configured to make the completion timing earlier as the amount of adhesive applied per application portion is smaller. The application control unit 94 may be configured to be able to change the completion timing according to the viscosity of the adhesive. The application control unit 94 may be configured to make the completion timing later as the viscosity of the adhesive is higher. The completion timing may be the timing at which an adhesive spray completion signal is sent to the nozzle 72. The completion timing may also be the timing at which spraying of the adhesive from the nozzle 72 is completed. The completion timing may also be the timing at which transfer of the adhesive from the adhesive application device 70 to the lower surface WL of the metal plate W is completed. Furthermore, the completion timing may be the timing when the adhesive discharged upward from the discharge port 72A of the nozzle 72 is transferred to the lower surface WL of the metal plate W and leaves the discharge port 72A. Note that at this timing, the adhesive may be swelling upward from the discharge port 72A.

[0035] The application control unit 94 may be configured to be able to change the period from when the adhesive application device 70 starts to apply the adhesive to the lower surface WL of the metal sheet W to when it is completed (timings T3 to T11 in the example shown in FIG. 9). The change of the period includes both changing the crank angle from when the adhesive application starts to when it is completed and changing the elapsed time from when the adhesive application starts to when it is completed. For example, even if the crank angle at the start and the end of the adhesive application is constant, the period from when the adhesive application starts to when it is completed may be changed by changing the lifting speed (i.e., the press speed) of the upper die 40. The application control unit 94 may be configured to be able to change the period from when the adhesive application device 70 finishes applying the adhesive to when the pilot pin 50 inserted in the pilot hole PH is removed. The change of the period includes both changing the crank angle from when the adhesive application is completed to when the pilot pin 50 is removed from the pilot hole PH and changing the elapsed time from when the adhesive application is completed to when the pilot pin 50 is removed from the pilot hole PH.

[0036] Next, an example of a method for manufacturing the laminated core 8 will be described. Here, a method for manufacturing the laminated core 8 will be described by focusing on one of the core members 5 that constitute the laminated core 8. FIG. 10 is a flowchart showing the method for manufacturing the laminated core 8. As shown in FIG. 10, the method for manufacturing the laminated core 8 includes a pilot hole punching step (step S10), an inner shape punching step (step S20), an adhesive application step (step S30), and an outer shape punching step (step S40). Note that for the band-shaped metal plate W, the pilot hole punching step (step S10), the inner shape punching step (step S20), and the outer shape punching step (step S40) are performed simultaneously.

[0037] In the pilot hole punching process (step S10), when the stripper plate 60 is located at the lowest position LP (see FIG. 8), the strip-shaped metal sheet W is punched by the pilot hole punching punch 45X to form a pilot hole PH in the metal sheet W. More specifically, as the upper die 40 moves further downward, the pilot hole punching punch 45X and the pilot hole punching die hole 26X punch out the strip-shaped metal sheet W pressed against the upper surface 22T of the die plate 22 and the upper surface 23T of the die 23, to form the pilot hole PH in the strip-shaped metal sheet W. In the pilot hole punching process (step S10), the strip-shaped metal sheet W is clamped by the stripper plate 60, the die plate 22, and the die 23.

[0038] In the inner shape punching process (step S20), when the stripper plate 60 is located at the lowest position LP, the band-shaped metal plate W is punched by the inner shape punching punch 45A to form the inner shape of the core member 5. More specifically, as the upper die 40 moves further downward, the inner shape punching punch 45A and the inner shape punching die hole 26A punch out the band-shaped metal plate W pressed against the upper surface 22T of the die plate 22 and the upper surface 23T of the die 23, and the inner shape of the core member 5 is formed in the band-shaped metal plate W. In the inner shape punching process (step S20), the band-shaped metal plate W is clamped by the stripper plate 60, the die plate 22, and the die 23.

[0039] In the adhesive application process (step S30), an adhesive is applied (e.g., sprayed) from an adhesive application device 70 to the lower surface WL of the strip-shaped metal plate W. The adhesive application device 70 is controlled by the application control unit 94, and starts applying the adhesive at the above-mentioned timing and completes the application of the adhesive.

[0040] In the outline punching process (step S40), when the stripper plate 60 is located at the lowest position LP, the strip-shaped metal plate W is punched by the outline punching punch 45C to form the outline of the core member 5. More specifically, the upper die 40 moves further downward, and the outline punching punch 45C and the outline punching die hole 26C punch out the strip-shaped metal plate W pressed against the upper surface 22T of the die plate 22 and the upper surface 23T of the die 23, thereby forming the outline of the core member 5 in the strip-shaped metal plate W. The formed core member 5 is pressed by the outline punching punch 45C and sequentially stacked in the outline punching die hole 26C. Since an adhesive is applied to the lower surface of the formed core member 5, the core members 5 are sequentially stacked on the core members 5 already stacked in the outline punching die hole 26C, thereby manufacturing a laminated core 8 including a plurality of core members 5 stacked vertically and bonded to each other. In step S40, the strip-shaped metal sheet W is clamped by the stripper plate 60, the die plate 22, and the die .

[0041] As described above, the laminated core manufacturing apparatus 10 of this embodiment includes the control device 90 that controls the upper die 40 and the adhesive applicator 70. The application control unit 94 of the control device 90 is configured to be able to change the start timing, which is the timing at which the adhesive applicator 70 starts applying the adhesive to the underside WL of the metal sheet W. According to the above embodiment, the timing at which the adhesive application starts can be changed as appropriate, so that the adhesive can be applied more accurately to a predetermined position on the underside WL of the metal sheet W at a predetermined timing.

[0042] In the laminated core manufacturing apparatus 10 of the present embodiment, the coating control unit 94 may be configured to be able to change the start timing in accordance with the amount of adhesive to be coated per coating portion on the lower surface WL of the metal plate W. According to the above aspect, the start timing can be set more accurately.

[0043] In the laminated core manufacturing apparatus 10 of this embodiment, the application control unit 94 may be configured to delay the start timing as the amount of adhesive application per application portion decreases. According to the above aspect, the adhesive can be applied more accurately to a predetermined position on the lower surface WL of the metal sheet W.

[0044] According to the above-mentioned aspect, in the laminated iron core manufacturing apparatus 10 of this embodiment, the start timing can be set more accurately.

[0045] In the laminated core manufacturing apparatus 10 of the present embodiment, the application control unit 94 may be configured to advance the start timing as the viscosity of the adhesive increases. According to the above-described aspect, the adhesive can be applied more accurately to a predetermined position on the lower surface WL of the metal plate W.

[0046] In the laminated core manufacturing apparatus 10 of the present embodiment, the start timing may be the timing at which an adhesive ejection start signal is sent to the nozzle 72. According to the above aspect, the start timing can be set more accurately.

[0047] In the laminated iron core manufacturing apparatus 10 of the present embodiment, the start timing may be the timing at which the adhesive starts to be sprayed from the nozzle 72. According to the above aspect, the start timing can be set more accurately.

[0048] In the laminated core manufacturing apparatus 10 of the present embodiment, the start timing may be the timing at which the adhesive applicator 70 starts transferring the adhesive to the lower surface WL of the metal plate W. According to the above-described embodiment, the start timing can be set more accurately.

[0049] In the laminated core manufacturing apparatus 10 of the present embodiment, the start timing may be the timing at which the adhesive discharged upward from the discharge port 72A starts to contact the lower surface WL of the metal plate W. According to the above aspect, the start timing can be set more accurately.

[0050] In the laminated core manufacturing apparatus 10 of the present embodiment, the application control unit 94 may be configured to be able to change the period from when the adhesive application device 70 starts to apply the adhesive to the underside WL of the metal plate W to when it is completed. According to the above aspect, the adhesive can be applied more accurately to a predetermined position on the underside WL of the metal plate W at a predetermined timing.

[0051] In the laminated core manufacturing apparatus 10 of this embodiment, the application control unit 94 may be configured to be able to change the completion timing, which is the timing at which the adhesive application device 70 completes application of the adhesive to the underside WL of the metal plate W. According to the above aspect, since the timing at which the adhesive application is completed can be changed as appropriate, the adhesive can be applied more accurately to a predetermined position on the underside WL of the metal plate W at a predetermined timing.

[0052] In the laminated core manufacturing apparatus 10 of the present embodiment, the coating control unit 94 may be configured to be able to change the completion timing in accordance with the amount of adhesive applied per coating portion on the lower surface WL of the metal plate W. According to the above aspect, the completion timing can be set more accurately.

[0053] In the laminated core manufacturing apparatus 10 of this embodiment, the coating control unit 94 may be configured to complete the process earlier as the amount of adhesive applied per coating portion decreases. According to the above-described embodiment, the adhesive can be applied more accurately to a predetermined position on the lower surface WL of the metal sheet W.

[0054] In the laminated core manufacturing apparatus 10 of the present embodiment, the application control unit 94 may be configured to be able to change the completion timing in accordance with the viscosity of the adhesive. According to the above aspect, the completion timing can be set more accurately.

[0055] In the laminated core manufacturing apparatus 10 of the present embodiment, the application control unit 94 may be configured to delay the completion timing as the viscosity of the adhesive increases. According to the above-described aspect, the adhesive can be applied more accurately to a predetermined position on the lower surface WL of the metal plate W.

[0056] In the laminated iron core manufacturing apparatus 10 of the present embodiment, the completion timing may be the timing at which an adhesive ejection completion signal is sent to the nozzle 72. According to the above aspect, the completion timing can be set more accurately.

[0057] In the laminated core manufacturing apparatus 10 of the present embodiment, the completion timing may be the timing at which the spraying of the adhesive from the nozzle 72 is completed. According to the above aspect, the completion timing can be set more accurately.

[0058] In the laminated core manufacturing apparatus 10 of the present embodiment, the completion timing may be the timing at which the transfer of the adhesive from the adhesive applicator 70 to the lower surface WL of the metal plate W is completed. According to the above-described embodiment, the completion timing can be set more accurately.

[0059] In the laminated core manufacturing apparatus 10 of the present embodiment, the completion timing may be the timing at which the adhesive discharged upward from the discharge port 72A is transferred to the lower surface WL of the metal plate W and leaves the discharge port 72A. According to the above aspect, the completion timing can be set more accurately.

[0060] In the laminated core manufacturing apparatus 10 of the present embodiment, the application control unit 94 may be configured to be able to change the period from when the adhesive application device 70 completes application of the adhesive to the underside WL of the metal plate W until the pilot pin 50 inserted into the pilot hole PH is removed. According to the above aspect, the adhesive can be applied more accurately to a predetermined position on the underside WL of the metal plate W.

[0061] In the laminated core manufacturing apparatus 10 of this embodiment, the biasing member 32 may be configured to allow a portion WC of the metal plate W located between the portion WA in contact with the lift member 30 and the portion WB in contact with the stripper plate 60 to move downward while maintaining a horizontal state during the period in which the stripper plate 60 presses the metal plate W downward against the biasing force of the biasing member 32. According to the above aspect, the metal plate W is prevented from bending, so that the iron core member 5 can be formed more accurately.

[0062] In the laminated core manufacturing apparatus 10 of the present embodiment, the movement control unit 92 may be configured to be able to change the ascending speed and descending speed of the upper die 40. According to the above aspect, bending of the metal sheet W is suppressed, so that the core member 5 can be formed more accurately.

[0063] In the laminated core manufacturing apparatus 10 of the present embodiment, the movement control section 92 may be configured to be able to change the lowest position LP in accordance with the thickness of the metal plate W. According to the above-described aspect, the metal plate W is prevented from being excessively pressed downward by the stripper plate 60.

[0064] The laminated core manufacturing apparatus 10 of this embodiment includes a pilot pin 50 that is provided on the upper die 40 and that is inserted into a pilot hole PH formed in the strip-shaped metal plate W to position the metal plate W relative to the adhesive applicator 70. The application control unit 94 of the control device 90 may start applying adhesive to the underside WL of the metal plate W from the adhesive applicator 70 after the pilot pin 50 is inserted into the pilot hole PH. According to the above embodiment, the adhesive applicator 70 starts applying adhesive to the underside WL of the metal plate W in a state in which the pilot pin 50 is inserted into the pilot hole PH to position the metal plate W relative to the adhesive applicator 70, so that the adhesive can be applied more accurately to a predetermined position on the underside WL of the metal plate W.

[0065] In the laminated core manufacturing apparatus 10 of this embodiment, the application control unit 94 may complete application of adhesive from the adhesive application device 70 to the underside WL of the metal plate W before the pilot pin 50 comes out of the pilot hole PH. According to the above aspect, application of adhesive to the underside WL of the metal plate W is completed in a state in which the metal plate W is positioned relative to the adhesive application device 70 by the pilot pin 50, so that the adhesive can be applied more accurately to a predetermined position on the underside WL of the metal plate W.

[0066] In the laminated core manufacturing apparatus 10 of this embodiment, the application control unit 94 may complete application of adhesive from the adhesive application device 70 to the underside WL of the metal sheet W during the period from when the pilot pin 50 is located at the bottom dead center to before the pilot pin 50 moves upward from the bottom dead center and comes out of the pilot hole PH. According to the above-mentioned aspect, application of adhesive to the underside WL of the metal sheet W is completed in a state in which the metal sheet W is positioned relative to the adhesive application device 70 by the pilot pin 50, so that the adhesive can be applied more accurately to a predetermined position on the underside WL of the metal sheet W.

[0067] In the laminated core manufacturing apparatus 10 of this embodiment, the application control unit 94 may complete application of adhesive from the adhesive application device 70 to the underside WL of the metal plate W after half of the length in the up-down direction Z of the insertion portion 50A has come out of the pilot hole PH and before the entire insertion portion 50A has come out of the pilot hole PH. According to the above aspect, application of adhesive to the underside WL of the metal plate W is completed with the metal plate W positioned relative to the adhesive application device 70 by the pilot pin 50, so that the adhesive can be applied more accurately to a predetermined position on the underside WL of the metal plate W.

[0068] In the laminated core manufacturing apparatus 10 of the present embodiment, the application control unit 94 may cause the adhesive application device 70 to apply adhesive to the lower surface WL of the metal plate W only when the transport of the metal plate W is stopped. According to the above-described embodiment, the adhesive can be applied more reliably to a predetermined position on the lower surface WL of the metal plate W.

[0069] In the laminated core manufacturing apparatus 10 of this embodiment, the application control unit 94 may complete application of adhesive from the adhesive application device 70 to the underside WL of the metal plate W before the lift member 30 moves to the uppermost position PM. According to the above-described embodiment, the adhesive can be accurately applied to a predetermined position on the underside WL of the metal plate W while appropriately maintaining the distance in the vertical direction Z between the underside WL of the metal plate W and the adhesive application device 70.

[0070] In the laminated core manufacturing apparatus 10 of this embodiment, the application control unit 94 may apply adhesive from the adhesive application device 70 to the underside WL of the metal sheet W only when at least a portion of the pilot pin 50 is inserted into the pilot hole PH. According to the above aspect, the adhesive application device 70 starts applying adhesive to the underside WL of the metal sheet W in a state in which the metal sheet W is positioned relative to the adhesive application device 70 by inserting at least a portion of the pilot pin 50 into the pilot hole PH, so that the adhesive can be applied more accurately to a predetermined position on the underside WL of the metal sheet W.

[0071] In the laminated core manufacturing apparatus 10 of this embodiment, the application control unit 94 may apply adhesive from the adhesive application device 70 to the underside WL of the metal plate W only when at least a part of the pilot pin 50 is inserted into the pilot hole PH and the transport of the metal plate W is stopped. According to the above-mentioned aspect, the adhesive application device 70 applies adhesive to the underside WL of the metal plate W in a state in which the metal plate W is positioned with respect to the adhesive application device 70 by inserting at least a part of the pilot pin 50 into the pilot hole PH and the transport of the metal plate W is stopped, so that the adhesive can be applied more accurately to a predetermined position on the underside WL of the metal plate W.

[0072] Although the preferred embodiments of the present invention have been described above, the above-described embodiments are merely examples, and the present invention can be embodied in various other forms.

[0073] In the above-described embodiment, the lower die body 21, the die plate 22, and the die 23 of the lower die 20 are configured as separate bodies, but they may be configured as an integral body as appropriate. For example, the die plate 22 and the die 23 may be configured as an integral body, or the die plate 22, the die 23, and the lower die body 21 may be configured as an integral body.

[0074] In the above-described embodiment, the upper surface 23T of the die 23 and the upper surface 22T of the die plate 22 are located at the same height, but are not limited to this. For example, the upper surface 23T of the die 23 may be located lower than the upper surface 22T of the die plate 22. In this case, the stripper plate 60 presses the belt-shaped metal sheet W against the upper surface 22T of the die plate 22.

[0075] In the above-described embodiment, the die plate 22 and the die 23 are placed on the lower die body 21, but the present invention is not limited to this. For example, the die plate 22 and the die 23 may be fitted into a recess formed to be recessed downward from the upper surface 21T of the lower die body 21 so that the upper surface 21T of the lower die body 21, the upper surface 22T of the die plate 22, and the upper surface 23T of the die 23 are positioned at the same height. In this case, the stripper plate 60 presses the belt-shaped metal sheet W against the upper surface 21T of the lower die body 21, the upper surface 22T of the die plate 22, and the upper surface 23T of the die 23.

[0076] In the above-described embodiment, the manufacturing apparatus 10 includes the control device 90 including the movement control unit 92 and the coating control unit 94, but is not limited to this. The manufacturing apparatus 10 may include a control device including the movement control unit 92 and another control device including the coating control unit 94. That is, the manufacturing apparatus 10 may include a plurality of control devices. [Explanation of symbols]

[0077] 5 Core material 8 Laminated core 10 Manufacturing equipment (laminated iron core manufacturing equipment) 20 Lower mold 21 Lower die body 22 Die Plate 22A No. 1 die plate 22C No. 2 die plate 22X Pilot hole forming die plate 22T top surface 23 Die 23A 1st die 23C 2nd Die 23X Pilot hole forming die 23T top surface 26 Die Hole 26A Die hole for punching inner shape 27 Through hole for applying adhesive 26C Outer shape punching die hole 26X Pilot hole punching die hole 40 Upper mold 45 Punch 45A Internal punching punch 45C Outline punching punch 45X Pilot hole punch 50 Pilot pin 50A Insertion Part 60 Stripper plate 70 Adhesive application device 72 Nozzle 90 Control device 92 Movement control section 94 Coating control unit G. Adhesive PH pilot hole W: Metal strip WL bottom surface

Claims

1. A manufacturing apparatus for a laminated core in which a plurality of core members are laminated and bonded to each other, comprising: A lower mold having a die with a die hole formed therein; an upper die having a punch corresponding to the die hole; an adhesive applicator provided in the lower die and configured to apply an adhesive to a lower surface of the band-shaped metal plate; a control device for controlling the upper mold and the adhesive application device, The control device includes: A movement control unit that controls the vertical movement of the upper mold; a coating control unit configured to be able to change a start timing, which is the timing at which the adhesive coating device starts coating the underside of the metal plate.

2. The manufacturing apparatus according to claim 1 , wherein the application control unit is configured to be able to change the start timing in accordance with an amount of adhesive applied per application portion on the lower surface of the metal plate.

3. The manufacturing apparatus according to claim 2 , wherein the application control unit is configured to delay the start timing as the amount of adhesive applied per application portion decreases.

4. The manufacturing apparatus according to claim 1 , wherein the application control unit is configured to be able to change the start timing depending on a viscosity of the adhesive.

5. The manufacturing apparatus according to claim 4 , wherein the application control unit is configured to make the start timing earlier as the viscosity of the adhesive increases.

6. the adhesive application device is located below the metal plate and has a nozzle that sprays the adhesive onto the lower surface of the metal plate; The manufacturing apparatus according to claim 1 , wherein the start timing is a timing at which a signal to start ejecting the adhesive is sent to the nozzle.

7. The manufacturing apparatus according to claim 6 , wherein the start timing is a timing at which spraying of the adhesive from the nozzle starts.

8. the adhesive application device is configured to apply the adhesive to the lower surface of the metal plate by transfer; The manufacturing apparatus according to claim 1 , wherein the start timing is a timing at which transfer of the adhesive from the adhesive applicator to the lower surface of the metal plate starts.

9. the adhesive applicator is located below the metal plate and has a discharge port for discharging the adhesive, The manufacturing apparatus according to claim 8 , wherein the start timing is a timing at which the adhesive discharged upward from the discharge port starts to contact the lower surface of the metal plate.

10. The manufacturing apparatus according to claim 1 , wherein the application control unit is configured to be able to change a period from when application of the adhesive from the adhesive application device to the lower surface of the metal plate begins to when application of the adhesive is completed.

11. A manufacturing apparatus for a laminated core in which a plurality of core members are laminated and bonded to each other, comprising: A lower mold having a die with a die hole formed therein; an upper die having a punch corresponding to the die hole; an adhesive applicator provided in the lower die and configured to apply an adhesive to a lower surface of the band-shaped metal plate; a control device for controlling the upper mold and the adhesive application device, The control device includes: A movement control unit that controls the vertical movement of the upper mold; and an application control unit configured to change a completion timing, which is the timing at which the application of the adhesive from the adhesive application device to the underside of the metal plate is completed.

12. The manufacturing apparatus according to claim 11 , wherein the application control unit is configured to be able to change the completion timing in accordance with an amount of adhesive applied per application portion on the lower surface of the metal plate.

13. The manufacturing apparatus according to claim 12 , wherein the application control unit is configured to make the completion timing earlier as the amount of adhesive applied per application portion decreases.

14. The manufacturing apparatus according to claim 11 , wherein the application control unit is configured to be able to change the completion timing depending on a viscosity of the adhesive.

15. The manufacturing apparatus according to claim 14 , wherein the application control unit is configured to delay the completion timing as the viscosity of the adhesive increases.

16. the adhesive application device is located below the metal plate and has a nozzle that sprays the adhesive onto the lower surface of the metal plate; The manufacturing apparatus according to claim 11 , wherein the completion timing is a timing at which a spray completion signal for the adhesive is sent to the nozzle.

17. The manufacturing apparatus according to claim 16 , wherein the completion timing is a timing at which spraying of the adhesive from the nozzle is completed.

18. the adhesive application device is configured to apply the adhesive to the lower surface of the metal plate by transfer; The manufacturing apparatus according to claim 11 , wherein the completion timing is a timing at which transfer of the adhesive from the adhesive applicator to the lower surface of the metal plate is completed.

19. the adhesive applicator is located below the metal plate and has a discharge port for discharging the adhesive, The manufacturing apparatus according to claim 18 , wherein the completion timing is a timing at which the adhesive discharged upward from the discharge port is transferred to the lower surface of the metal plate and leaves the discharge port.

20. The manufacturing apparatus according to claim 11 , wherein the application control unit is configured to be able to change a period from when application of the adhesive from the adhesive application device to the lower surface of the metal plate begins to when application of the adhesive is completed.

21. a pilot pin provided on the upper die and inserted into a pilot hole formed in the metal plate to position the metal plate relative to the adhesive applying device; The manufacturing apparatus according to claim 11, wherein the application control unit is configured to be able to change the period from when the adhesive application device completes application of the adhesive to the underside of the metal plate to when the pilot pin inserted into the pilot hole is removed.

22. A manufacturing apparatus for a laminated core in which a plurality of core members are laminated and bonded to each other, comprising: A lower mold having a die with a die hole formed therein; an upper die having a punch corresponding to the die hole; an adhesive applicator provided in the lower die and configured to apply an adhesive to a lower surface of the band-shaped metal plate; a control device for controlling the upper mold and the adhesive application device, The control device includes: A movement control unit that controls the vertical movement of the upper mold; and an application control unit configured to change a period from when application of the adhesive from the adhesive application device to the underside of the metal plate begins to when application is completed.

23. the adhesive application device is located below the metal plate and has a nozzle that sprays the adhesive onto the lower surface of the metal plate; The manufacturing apparatus according to claim 22 , wherein the application control unit is configured to be able to change a timing at which the adhesive starts to be sprayed from the nozzle.

24. the adhesive application device is configured to apply the adhesive to the lower surface of the metal plate by transfer; The manufacturing apparatus according to claim 22 , wherein the application control unit is configured to be able to change a timing at which the adhesive application device starts transferring the adhesive to the lower surface of the metal plate.

25. a stripper plate that is provided on the upper die and is movable downward to a lowest position that is the lowest position, the stripper plate restricting vertical movement of the metal plate at the lowest position when the metal plate is punched out by the punch; a lift member provided in the lower die, configured to be able to push the metal plate upward, and moving downward when the metal plate is pressed downward by the stripper plate; a biasing member that biases the lift member upward, 23. The manufacturing apparatus of claim 22, wherein the biasing member is configured to allow a portion of the metal plate located between a portion in contact with the lift member and a portion in contact with the stripper plate to move downward while remaining horizontal during a period in which the stripper plate presses the metal plate downward against the biasing force of the biasing member.

26. The manufacturing apparatus according to claim 22 , wherein the movement control section is configured to be able to change a lifting speed and a lowering speed of the upper mold.

27. a stripper plate that is provided on the upper die and is movable downward to a lowest position that is the lowest position, and that restricts vertical movement of the metal plate at the lowest position when the metal plate is punched out by the punch; The manufacturing apparatus according to claim 22 , wherein the movement control unit is configured to be able to change the lowest position depending on a thickness of the metal plate.

28. a pilot pin provided on the upper die and inserted into a pilot hole formed in the metal plate to position the metal plate relative to the adhesive applying device; The manufacturing apparatus according to claim 22 , wherein the application control unit starts application of the adhesive from the adhesive application device to the lower surface of the metal plate after the pilot pin is inserted into the pilot hole.

29. The manufacturing apparatus according to claim 28 , wherein the application control unit completes application of the adhesive from the adhesive application device to the lower surface of the metal plate before the pilot pin is removed from the pilot hole.

30. The manufacturing apparatus of claim 29, wherein the application control unit completes application of the adhesive from the adhesive application device to the underside of the metal plate between the time when the pilot pin is located at the bottom dead center and the time when the pilot pin moves upward from the bottom dead center and before the pilot pin comes out of the pilot hole.

31. The pilot pin has an insertion portion that is inserted into the pilot hole, The manufacturing apparatus of claim 30, wherein the application control unit completes application of the adhesive from the adhesive application device to the underside of the metal plate between the time when half of the vertical length of the insertion portion has come out of the pilot hole and before the entire insertion portion has come out of the pilot hole.

32. The manufacturing apparatus according to claim 29 , wherein the application control unit causes the adhesive application device to apply the adhesive to the lower surface of the metal plate only when transportation of the metal plate is stopped.

33. a stripper plate that is provided on the upper die and is movable downward to a lowest position that is the lowest position, the stripper plate restricting vertical movement of the metal plate at the lowest position when the metal plate is punched out by the punch; a lift member that is provided in the lower die, that is configured to be able to push the metal plate upward, and that moves downward when the metal plate is pressed downward by the stripper plate, the lift member is configured to be movable to an uppermost position when the stripper plate is not pressing against the metal plate, The manufacturing apparatus of claim 28 , wherein the application control unit completes application of the adhesive from the adhesive application device to the lower surface of the metal plate before the lift member moves to the uppermost position.

34. The manufacturing apparatus according to claim 33 , wherein the application control unit causes the adhesive application device to apply the adhesive to the lower surface of the metal plate only when transportation of the metal plate is stopped.

35. a pilot pin provided on the upper die and inserted into a pilot hole formed in the metal plate to position the metal plate relative to the adhesive applying device; The manufacturing apparatus of claim 22 , wherein the application control unit starts applying the adhesive from the adhesive application device to the underside of the metal plate only when at least a portion of the pilot pin is inserted into the pilot hole.

36. The manufacturing apparatus according to claim 35 , wherein the application control unit causes the adhesive application device to apply the adhesive to the lower surface of the metal plate only when transportation of the metal plate is stopped.

37. a pilot pin provided on the upper die and inserted into a pilot hole formed in the metal plate to position the metal plate relative to the adhesive applying device; The manufacturing apparatus of claim 22, wherein the application control unit causes the adhesive application device to apply the adhesive to the underside of the metal plate only when at least a portion of the pilot pin is inserted into the pilot hole and transportation of the metal plate is stopped.

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