Imaging device, heat dissipation sheet, storage structure for wiring substrate, and mobile body

Abstract

To provide high-precision control of vibrations to eliminate image shakes.SOLUTION: An imaging device in an embodiment comprises a vibration damping mechanism for reducing the impact of external vibrations on an image sensor. The vibration damping mechanism comprises: an anti-vibration structure disposed inside a housing; and a driving mechanism comprising two pairs of moving coil-type actuators such that the actuators of each pair are arranged to be spaced and opposed across an opening inside the anti-vibration structure, where the opening allows light from an object being photographed to pass through. The opposed actuators of each pair are electrically connected in series to drive the image sensor in a direction that can offset the vibrations of the image sensor.SELECTED DRAWING: Figure 9

Description

[Technical field]

[0001] The present invention generally relates to an imaging device, a heat dissipation sheet, a storage structure for a wiring board, and a moving body, and in particular to an imaging device that enables correction of video blur caused by vibration of the mounted device itself, a heat dissipation sheet provided thereon, a storage structure for a wiring board, and a moving body equipped with the imaging device. [Background technology]

[0002] Among cameras mounted on mobile objects such as unmanned aerial vehicles (UAVs), for example cameras mounted on drones, the adoption of multi-lens cameras, similar to smartphone cameras, is becoming a trend, and the magnification required for the telephoto camera is increasing year by year.

[0003] However, as the magnification increases, the vibrations transmitted from the drone body to the camera cannot be sufficiently removed by the three-axis control of the camera gimbal alone, resulting in a problem where vibrations remain as video blur of approximately 100 Hz to 150 Hz.

[0004] For example, Cited Document 1 discloses a structure in which a fixed part of an OIS (Optical Image Stabilization) movable part is held swingably by four suspension wires in a plane perpendicular to the optical axis.

[0005] However, since the structure disclosed in Reference 1 employs a moving magnet type, it is difficult to adequately deal with video blur of approximately 100 Hz to approximately 150 Hz due to limitations in increasing the ratio of the voice coil motor thrust (VCM) to the weight of the OIS moving part. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Patent No. 6842046 [Patent Document 2] JP 2011-087027 A Summary of the Invention [Problem to be solved by the invention]

[0007] The main object of the present invention is to provide an imaging device, a heat dissipation sheet, a wiring board storage structure, and a moving body that have a BIS (Body Image Stabilizer) function that controls vibrations with high precision to eliminate image blur. [Means for solving the problem]

[0008] According to a first aspect of the present invention, there is provided an imaging device, comprising: an optical system including at least one lens; an image sensor that receives light from an object via the optical system and generates a signal of an image of the object; a housing having a rectangular parallelepiped shape and provided with a substantially rectangular opening through which light from a subject enters, and the image sensor being provided on a rear side thereof; a vibration suppression mechanism for suppressing the influence of external vibrations on the image sensor; Equipped with The vibration damping mechanism includes: a vibration-resistant structure provided within the housing; a drive mechanism including two pairs of moving coil type actuators arranged in the vibration-resistant structure so as to face each other with the opening therebetween; Including, The actuators are electrically connected in series for each opposing pair and drive the image sensor in a direction that cancels the vibration to the image sensor.

[0009] According to a second aspect of the present invention, there is provided a heat dissipation sheet for use in the imaging device according to the first aspect, the heat dissipation sheet being fixed to a heat sink at one end and connected to the image sensor at the other end, and dissipating heat from the imaging device to the heat sink. The heat dissipation sheet is folded once and fixed to an opposing surface between the image sensor and the heat sink, and at least one slit is provided along the folding direction in a region of the deformation portion excluding the fixed surfaces between the image sensor and the heat sink.

[0010] According to a third aspect of the present invention, there is provided a storage structure for a wiring board provided in the imaging device according to the first aspect, the housing includes a top plate on the subject side, a bottom plate on the back side, and first to fourth side plates provided on an outer circumferential surface of the rectangular parallelepiped, a first space is provided between the first side plate and the drive mechanism, and a second space is provided between the third and fourth side plates and the drive mechanism; a non-shielding member is disposed so as to extend from the first space to a corner portion of the second space, In the storage structure, a shielded member extends from within the first space to within the second space between the non-shielded member and the image sensor, and both ends are bent so as to cover the corners between the first side plate and the third side plate and the corners between the first side plate and the fourth side plate.

[0011] Furthermore, according to a fourth aspect of the present invention, there is provided a moving object including the imaging device according to the first aspect. Effect of the Invention

[0012] According to the present disclosure, an imaging device capable of controlling vibrations with high precision and eliminating the problem of image blurring, and a mobile object equipped with the imaging device are provided. Furthermore, the present disclosure provides a heat dissipation sheet that can suppress rolling distortion that can occur in an imaging device. Furthermore, according to the present disclosure, a housing structure for a wiring board is provided that ensures sufficient magnetic field shielding for an image sensor. [Brief description of the drawings]

[0013] [Figure 1] FIG. 1 is a diagram illustrating an example of a schematic shape of a moving object on which an imaging device according to some embodiments of the present disclosure is mounted; [Diagram 2] 1 is an example of a schematic cross-sectional view showing a schematic configuration of an imaging device according to a first embodiment. [Diagram 3] FIG. 2 is a schematic perspective view showing an example of the appearance of a housing that accommodates a vibration damping mechanism. [Figure 4] 4 is an example of a cross-sectional view of a corner portion taken along a cutting line AA in FIG. 3. [Diagram 5] 1 is a perspective view showing an example of a schematic configuration of a vibration damping mechanism including upper and lower metal plates and suspension wires. FIG. [Figure 6] FIG. 6 is an example of a perspective view showing the configuration of FIG. 5 in a state in which the configuration is turned upside down. [Figure 7] 6 is an example of a perspective view of an embodiment in which a yoke is removed from the configuration of FIG. 5. [Figure 8] FIG. 7 is a perspective view of an example of the configuration shown in FIG. 6 including a coil slider. [Figure 9] FIG. 2 is a diagram illustrating an example of a current path in a drive mechanism of the imaging device according to the first embodiment. [Figure 10A] FIG. 11 is an example of a perspective view showing a main part of an imaging device according to a second embodiment. [Figure 10B] FIG. 10B is an example of a schematic cross-sectional view taken along the line BB in FIG. 10A. [Figure 11] 13 is an example of a diagram for explaining the placement location of a ball in the imaging device of the second embodiment. FIG. [Figure 12] 13A and 13B are diagrams illustrating an example of a method for connecting a vibration suppression mechanism and a driving mechanism with balls in an imaging device according to a second embodiment. [Figure 13] 13 is a diagram showing an example of wiring connection between a leaf spring and a coil in the second embodiment. FIG. [Figure 14]13 is an example of a perspective view of an imaging device according to a third embodiment as viewed from the rear surface side. [Figure 15] 15 is an example of a partial front view of the imaging device according to the third embodiment as viewed from the +Y direction in FIG. 14. [Figure 16A] 13 is an example of a perspective view of a heat dissipation member included in an imaging device according to a third embodiment, viewed obliquely from a rear surface side. [Figure 16B] 16B is an example of a perspective view showing an example of a heat sink included in the heat dissipation member shown in FIG. 16A. [Figure 16C] 16B is an example of a perspective view of a heat dissipation sheet included in the heat dissipation member shown in FIG. 16A when folded and viewed from an oblique top surface side. [Figure 17A] 16B is an example of a top view showing a detailed configuration of a heat dissipation sheet included in the heat dissipation member shown in FIG. 16A. [Figure 17B] FIG. 17B is an example of a top view of a heat dissipation sheet folded at fold line FD in FIG. 17A. [Figure 18] 13 is an example of a perspective view showing a schematic structure of a sensor FPC included in an imaging device according to a third embodiment. FIG. [Figure 19A] FIG. 11 is an example of a rear view of the imaging device according to the third embodiment. [Figure 19B] 19 is an explanatory diagram of an example of a structure for reducing a bending load in the sensor FPC shown in FIG. 18. [Figure 19C] 19 is an explanatory diagram of another example of the structure for reducing the bending load in the sensor FPC shown in FIG. 18. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] Hereinafter, some embodiments of the present invention will be described with reference to the drawings. The attached drawings are merely for the purpose of facilitating understanding of the present invention, and are in no way intended to limit the scope of the present invention. In the drawings, the same or corresponding elements and members are given the same reference numerals, and duplicate explanations thereof will be omitted as appropriate. In addition, the shapes and sizes of the members in the drawings are enlarged, reduced, or omitted as appropriate for ease of explanation, and may not match the actual scale and ratio. In addition, the term "substantially" is used with the intention of including measurement errors.

[0015] Furthermore, terms such as first, second, etc. used hereinafter are merely identifiers for distinguishing between identical or corresponding components, and the identical or corresponding components are not limited to the terms first, second, etc.

[0016] In addition, bonding does not only mean a case where the components are in direct physical contact with each other in a contact relationship between the components, but also includes a case where another component is interposed between the components and the components are in contact with each other via the other component.

[0017] In the following description, the direction along the optical axis of the optical system 22 of the imaging device is referred to as the Z direction, a direction perpendicular to the Z direction is referred to as the X direction, and a direction perpendicular to both the Z direction and the Y direction is referred to as the Y direction. The Z direction corresponds to the first direction defined in the claims, for example, and the X direction and the Y direction correspond to the second direction and the third direction defined in the claims, for example. In addition, the +Z side may be referred to as the "upper side" or "top surface" side, the -Z side as the "lower side" or "rear side", the +X side as the "right side", and the +Y side as the "front side". (1) First embodiment

[0018] Fig. 1 shows an example of a schematic shape of a moving body equipped with an imaging device according to some embodiments of the present disclosure. In Fig. 1, a UAV1 is shown as an example of a moving body. The UAV1 is an example of a moving body propelled by a propulsive force. The moving body is a concept including, in addition to the UAV, other aircraft moving in the air, vehicles moving on the ground, ships moving on water, and the like.

[0019] The UAV1 includes a plurality of rotors for generating thrust. The UAV1 flies by controlling the rotation of the plurality of rotors. The UAV1 flies using, for example, four rotors. However, the number of rotors is not limited to four. The UAV1 may also be a fixed-wing aircraft that does not have rotors.

[0020] UAV 1 is equipped with multiple imaging devices, and Fig. 1 shows imaging device 10 mounted via gimbal 8. Imaging device 10 is, for example, a high-magnification telephoto camera. Gimbal 8 suppresses the transmission of vibrations from the aircraft by three-axis control, but it is impossible to suppress them completely, and conventional imaging devices may cause video blur of about 100 Hz to about 150 Hz.

[0021] 2 is a schematic cross-sectional view showing an imaging device 10 according to a first embodiment. The imaging device 10 includes a lens unit 20 that includes an optical system 22 including at least one lens and receives light from a subject, and an imaging unit 100 that generates image data from an image of the subject formed by the lens unit 20. The lens unit 20 and the imaging unit 100 may be configured as an integrated unit, or the lens unit 20 may be configured as an exchangeable unit that is detachable from the imaging unit 100.

[0022] The imaging unit 100 includes a housing 80 , a vibration suppression mechanism 50 housed in the housing 80 , an image sensor 30 , and a drive mechanism 60 .

[0023] FIG. 3 is an example of a schematic perspective view showing the exterior of the housing 80. The housing 80 has a hollow rectangular parallelepiped shape with a substantially rectangular opening at the center for passing light of a subject incident from the Z direction, and has a top plate 42 provided on the top surface, a bottom plate 44 (not shown) provided on the bottom surface, side plates 46a to 46d provided on the outer periphery, and inner plates 48a to 48d provided on the inner periphery defining the opening. The image sensor 30 is installed under the bottom plate 44, and metal plates 52a to 52d, which will be described later, are provided on the side plate 46d of the periphery of the top plate 42, and their ends are exposed as electrodes in FIG. 3. Metal plates 54a to 54d are provided under the side plate 46d (see FIG. 6). At each corner of the top plate 42, solder joints 40a to 40d of suspension wires 56a to 56d, which are characteristic of this embodiment, to be described later, are formed with the top plate 42.

[0024] Fig. 4 shows a cross-sectional view of a corner portion taken along line AA in Fig. 3. As representatively shown in Fig. 4, suspension wire 56a is connected to metal plates 52a and 64d arranged facing each other above and below in a direction parallel to the optical axis. The upper metal plate 52a is fixed to top plate 42 by insert molding with resin. The lower metal plate 54d is fixed to a part of coil slider 72a by insert molding with resin.

[0025] By adopting a structure in which the upper and lower metal plates are connected by the suspension wires 56a-56d in this manner, it is possible to meet the requirement of high rigidity while configuring the upper and lower metal plates 52a-52d, 54a-54d in a limited, small area, and to prevent the suspension wires 56a-56d from buckling due to an impact caused by the movable body being dropped. In this embodiment, the suspension wires 56a-56d correspond to, for example, a "connecting member" as recited in the claims.

[0026] Fig. 5 is an example of a perspective view showing the entire structure of the upper and lower metal plates 52a-52d, 54a-54d and the suspension wires 56a-56d. Fig. 6 is an example of a perspective view showing the structure of Fig. 5 in an upside-down state. The metal plates 52a and 52d are composed of a base portion as an electrode and a head portion shaped to correspond to each corner portion of the top plate 42. The metal plates 52b and 52c are composed of a base portion as an electrode, a head portion shaped to correspond to each corner portion of the top plate 42, and a stripe portion extending from the base portion to the head portion.

[0027] Coils 62a-62d are placed in the spaces between the upper and lower metal plates 52a-52d, 54a-54d, and magnets MUa1-MUd1, MUa2-MUd2 and magnets MLa1-MLd1, MLa2-MLd2 are placed above and below each coil, sandwiching them (see FIG. 7). Yokes 68a-68d are arranged to cover the upper and lower opposing pairs of coils 62a-62d and magnets MUa1-MUd1, MUa2-MUd2, MLa1-MLd1, MLa2-MLd2, and a coil slider 72 (see FIG. 8), which will be described later, from the outside. The upper and lower surfaces of these yokes are fixed to the metal plates 52a-52d, 54a-54d, respectively.

[0028] FIG. 7 is an example of a perspective view of the configuration of FIG. 5 with the yokes 68a to 68d removed. In this embodiment, two magnets are arranged in the upper row and two in the lower row, corresponding to each coil, adjacent to each other in a plane parallel to a plane perpendicular to the optical axis. The two magnets in the upper row (e.g., MUa1, MUa2) are magnets of the same polarity, and the two magnets in the lower row (e.g., MLa1, MLa2) are magnets of the same polarity but opposite polarity to the magnets in the upper row. These magnets are fixed to the yoke, for example, the two magnets in the upper row (e.g., MUa1, MUa2) are fixed to the upper lower surface of the yoke (e.g., 68a), and the two magnets in the lower row (e.g., MLa1, MLa2) are fixed to the lower upper surface of the yoke (e.g., 68a), thereby providing a gap for the coil to move between the magnets in the upper row and the magnets in the lower row.

[0029] 8 is an example of a perspective view including a coil slider 72 in the configuration shown in FIG. 6, with the outer walls of each yoke omitted. The coil slider 72 fixes each coil, and when a current flows through the coils 62a to 62d as described in detail later, the coils move in two directions (X direction and Y direction) that are perpendicular to the optical axis direction (Z direction) and perpendicular to each other, and the image sensor 30 is driven via the coil slider 72. In this embodiment, the coils 62a to 62d and the magnets MUa1 to MUd1, MUa2 to MUd2, MLa1 to MLd1, and MLa2 to MLd2 correspond to, for example, a moving coil type actuator. This point is similar to the second and third embodiments described later.

[0030] Conventionally, a position detector is provided near the coil, and closed-loop control is performed using feedback from the position detector. Although such closed-loop control can control low-frequency vibrations of about 1 Hz to about 15 Hz, which are applied to conventional image stabilization devices used in handheld cameras, it cannot control high-frequency vibrations of 100 Hz to 150 Hz, which are caused by the vibration of a moving object such as a drone of the present invention. In particular, when a high-resolution image sensor is used, the effect of magnification by the lens is large. Therefore, in this embodiment, a position detector is not used, and a large-sized magnet that extends to the area where the position detector was provided in the conventional technology is arranged to strengthen the magnetic force, thereby realizing an open-loop controlled BIS (Body Image Stabilizer) function that can accurately drive a metal plate fixed by resin molding with an accuracy of μm.

[0031] 9 is an example of a diagram illustrating a current path for driving the moving coil type actuator of this embodiment. A coil FPC 70 for supplying power to each coil is provided on the metal plates 54a to 54d. The coil FPC 70 corresponds to, for example, a "first wiring board" defined in the claims in the embodiment of the present disclosure.

[0032] In this embodiment, there are two current paths, each of which is wired in series. In Fig. 9, this is indicated by a solid line and a number in parentheses (first wiring path) and a dotted line and a number in parentheses (second wiring path).

[0033] More specifically, the first wiring path starts from the base (1) of metal plate 52a and goes as follows: head (2) corresponding to the corner portion → suspension wire 56a (3) → first wiring (4) on metal plate 54a (4) → coil 62a → second wiring (5)-(6) on metal plate 54a (4) → wiring (7) (dotted line portions) on the back sides of metal plates 54b and 54c → wiring (8), (9) of coil FPC 70 on metal plate 54c → coil 62c → wiring (10) of coil FPC 70 → metal plate 54c (11) → suspension wire 56c → head (12) of metal plate 52c → base (13) of metal plate 52c.

[0034] The second wiring path starts at the base of metal plate 52b and goes from the head → suspension wire 56b → metal plate 54c → coil FPC 70 → coil 62b → coil FPC 70 → wiring that goes around the rectangular opening on coil FPC 70 → coil 62d → coil FPC 70 → metal plate 54d → suspension wire 56d → head of metal plate 52d → base of metal plate 52d.

[0035] By passing a current through these first and second wiring paths, the image sensor 30 moves in the ±Y direction. In this manner, open control is realized by employing serial wiring for each pair of actuators facing each other across an opening. The electrical wiring from the metal plate 54a to the metal plate 54c may be collectively expressed as the first wiring, and the electrical wiring from the metal plate 54b to the metal plate 54d may be collectively expressed as the second wiring. In this embodiment, the metal plates 54a to 54d correspond to, for example, a "wiring board" as defined in the claims.

[0036] According to this embodiment, a vibration control mechanism is provided in which upper and lower metal plates, each resin-molded into a housing, are connected and fixed at their corners by insert molding with suspension wires, and the space for the position detection device conventionally used in closed-loop control is replaced with the space for the magnet. Open control is achieved by connecting the opposing coils in series, so that the imaging element can be driven with high precision, for example to an precision of several μm, and an imaging device 10 can be provided that can ensure a resonance frequency of 1,000 Hz or more. (2) Second embodiment

[0037] In the above-described embodiment, the vibration-damping mechanism is formed by connecting and fixing the upper and lower metal plates with a suspension wire, and the current path is realized by these metal plates, suspension wires, and coil FPC. However, without being limited to the above-described form, it is also possible to realize the vibration-damping mechanism and the current path by, for example, a leaf spring and a ball.

[0038] FIG. 10A is an example of a perspective view showing a main part of an imaging device 110 configured using such a technical solution, and FIG. 10B is an example of a schematic cross-sectional view taken along the cutting line BB of FIG. 10A.

[0039] In the imaging device 110 of this embodiment, a plurality of balls 90 (at least three) are provided between the rear surface side of the housing 80 and the coil slider 72, and leaf springs 82a to 82d are disposed on the coil slider 72. The other configurations are substantially the same as those of the imaging device 10 described above.

[0040] The leaf springs 82a to 82d are each formed by folding a striped metal plate having ultra-high rigidity around each corner of the housing 80 so as to fit within the area of ​​the top plate 42. The contact portions of the leaf springs 82a to 82d and the coil slider 72 are fixed with an adhesive or the like.

[0041] 11 is an example of a diagram for explaining the arrangement of the ball 90. The ball 90 is fixed by being sandwiched between the coil slider 72 and the leaf springs 82a to 82d. An example of a method for connecting the fixed portion, which is the main portion of the vibration-resistant structure, and the drive mechanism with balls 90 will be described with reference to FIG.

[0042] A flat surface for the ball to roll is provided in advance on both the fixed part and the drive mechanism, and the ball 90 is placed on this flat surface, and then the coil slider 72 is aligned so as to abut on the ball 90. After that, the leaf springs 82a to 82d are pressed with a force at least twice the weight of the drive mechanism. This connects the ball 90 between the fixed part and the drive mechanism so as to sandwich it.

[0043] By constructing the vibration-resistant structure in this manner, a vibration-damping mechanism has been realized that prevents optical axis tilt in the drive mechanism due to deformation of the leaf springs 82a to 82d, while ensuring a resonant frequency of 1,000 Hz or more, as in the first embodiment described above. The wiring connection between the leaf spring and the coil will be described with reference to FIG.

[0044] First, the first wiring is connected from the outer electrode portion (+X) of leaf spring 82b to the inner tip portion (1) of leaf spring 82b to the -Y side end portion (2) of coil 62b to the +Y side end portion (3) of coil 62b to the -Y side end portion (4) of coil 62d to the +Y side end portion (5) of coil 62d to the inner tip portion (6) of leaf spring 82d to the outer electrode portion (X-) of leaf spring 82d.

[0045] Similarly, the second wiring can be connected in the order of the outer electrode portion (+Y) of leaf spring 82a → the inner tip portion (7) of leaf spring 82a → the -X side end portion (8) of coil 62a → the +X side end portion (9) of coil 62a → the -X side end portion (10) of coil 62c → the +X side end portion (11) of coil 62c → the inner tip portion (12) of leaf spring 82c → the outer electrode portion (Y-) of leaf spring 82c. Such wiring connects pairs of coils facing each other across an opening in series to form a VCM structure.

[0046] This embodiment also employs a VCM structure in which coils facing each other across an opening are connected in series by leaf spring 82, which replaces the insert-molded metal plate, so that the resonance frequency of the drive mechanism can be ensured to be 1,000 Hz or higher. In addition, by providing a leaf spring with ultra-high rigidity, deformation in a plane perpendicular to the optical axis is suppressed. Furthermore, since the vibration suppression mechanism and the drive mechanism are connected by sandwiching ball 90, the occurrence of tilting of the optical axis of the drive mechanism due to deformation of the leaf spring is prevented. (3) Third embodiment

[0047] As described in the first and second embodiments above, the imaging device of the present disclosure can ensure a resonance frequency of the drive mechanism of 1,000 Hz or more due to the open control VCM structure. However, rolling distortion may occur depending on the arrangement of connecting members such as wiring boards.

[0048] For example, when a sensor FPC extending in the +X direction is connected and a heat dissipation sheet similarly extending in the -X direction is provided on the back side, there is sufficient resistance to vibration in the X direction, but when the image sensor 30 is driven in the Y direction by a drive mechanism in response to vibration in the Y direction, rolling distortions in opposite directions may occur with the direction DR1 parallel to the Y direction as an axis, as shown in the perspective view of the back side in Fig. 14. The rolling distortions are mainly composed of rolling distortion R2 that occurs in the image sensor 30 due to deformation of the sensor FPC and rolling distortion R1 that occurs in the image sensor 30 due to deformation of the heat dissipation sheet.

[0049] Therefore, the imaging device 105 of this embodiment is provided with first and second connecting members having different functions, which offset and reduce rolling distortions that may occur from each of the connecting members due to the deformation reaction force received by the driving mechanism when the image sensor 30 is driven in the Y direction. The other configurations of the imaging device 105 of this embodiment are substantially the same as those of the first embodiment described above.

[0050] FIG. 14 is an example of a perspective view of an imaging device 105 according to the third embodiment as viewed from the rear side, and FIG. 15 is an example of a partial front view of the imaging device 105 as viewed from the +Y direction shown in FIG.

[0051] In this embodiment, the first and second connection members are a heat dissipation member and a sensor FPC 182. First, the heat dissipation member will be described with reference to Figs. 15 to 17B.

[0052] Fig. 16A is an example of a perspective view of a heat dissipation member as viewed obliquely from the rear side. In this embodiment, the heat dissipation part includes a heat sink 126 and a heat dissipation sheet 122. The heat dissipation sheet 122 performs a heat dissipation function by transferring heat generated in the image sensor 30 to, for example, the heat sink 126 shown in the perspective view of Fig. 16B.

[0053] As shown in Figures 15 and 16C, in this embodiment, the heat dissipation sheet 122 is once folded back in a direction parallel to the Y direction in the area between both ends, and the upper surface side including one end is fixed to the heat sink 126, and the lower surface side including the other end is fixed to the rear surface of the image sensor 30.

[0054] 17A and 17B are examples of top views showing the detailed configuration of the heat dissipation sheet 122. As shown in FIG. 17A, for example, the heat dissipation sheet 122 is set with a fold FD in a direction (Y direction) perpendicular to its extension direction (X direction), and is folded and installed based on the fold FD. At least one slit SL is provided in the heat dissipation sheet 122 along a direction intersecting the fold FD. In the example shown in FIG. 17A, three slits SL1 to SL3 are provided. The slit SL gives the heat dissipation sheet 122 elasticity in the Y direction of the driving direction of the driving mechanism, and this itself relieves the rolling distortion caused by the deformation reaction force R1 of the heat dissipation sheet 122. An example of a top view of the heat dissipation sheet 122 folded at the fold FD is shown in FIG. 17B. Of the entire area of ​​the heat dissipation sheet 122, the area where the slits FL1 to FL3 are provided constitutes a deformation portion, and both ends located on the left and right of the deformation portion constitute the attachment portion of the image sensor 30 and the heat sink 126.

[0055] FIG. 18 is an example of a perspective view showing a schematic structure of the sensor FPC 182, and FIG. 19A is an example of a rear view of the imaging device 105. As shown in FIG. The sensor FPC 182 includes an electrode portion 182a connected to an external power supply outside the housing 80, branch portions 182b, 182c branching off from the electrode portion 182a into two and extending into the space SP1 between the side plate 46d of the housing 80 and the drive mechanism 60, a bent portion 182d which stands upright from the ends of the branch portions 182b, 182c toward the top surface within the space SP1 and extends to both corner portions of the side plate 46d, bends in the space SP2 between the side plates 46b, 46c of the housing 80 and the drive mechanism 60, and further extends again toward the drive mechanism 60 on the top surface side, and a connection portion 182e which extends continuously from the bent portion 182d onto the image sensor 30 and is connected to the image sensor 30 to supply power from the external power supply to the image sensor 30.

[0056] In this way, sensor FPC 182 is disposed so as to extend into housing 80 from the outside of housing 80 and then extend to the image sensor via bent portion 182d, which in itself relieves rolling distortion caused by deformation reaction force R2 of sensor FPC 182. Furthermore, since deformation reaction force R1 of heat dissipation sheet 122 and deformation reaction force R2 of sensor FPC 182 are forces in opposite directions, they cancel each other out, thereby resolving the problem of rolling distortion caused by driving the drive mechanism for image sensor 30 in the Y direction.

[0057] Here, the sensor FPC 182 has a shield structure that can suppress the emission of electromagnetic waves while suppressing the deformation load of the sensor FPC 182. This will be described in detail with reference to Figs. 18 to 19C.

[0058] As shown in FIG. 18, bent portion 182d of sensor FPC 182 has outer shield members 134a and 134b that are erected starting from near the center of side plate 46d of housing 80 at branch portions 182b, 182c and extend in the ±Y direction to go around adjacent corner portions, and non-shield member 132 that is continuous with outer shield members 134a and 134b and extends within housing 80 along each of side plates 46a, 46c, 46d within spaces SP2 and SP1.

[0059] Furthermore, the imaging device 105 of this embodiment further includes an inner shield plate 130 that is disposed between the non-shielded member 132 and the driving mechanism 60 in the spaces SP1 and SP2 and is covered with a shielding material.

[0060] The non-shielding member 132 is thin and easily bendable because no shielding material is provided. Therefore, 132b, which is the X-direction component of the non-shielding member 132, bends only a small amount when the driving mechanism 60 is driven in the Y-direction as shown in FIG. 19B, and 132a, which is the Y-direction component, bends only a small amount when the driving mechanism 60 is driven in the X-direction as shown in FIG. 19C. This reduces the bending load of the FPC 182 body in the spaces SP1 and SP2. In this embodiment, the spaces SP1 and SP2 correspond to, for example, the first space and the second space defined in the claims, respectively.

[0061] Furthermore, outer shield members 134a, 134b and inner shield plate 130 are disposed at a distance sufficient to avoid interference with the bending movement of the FPC 182 body, thereby making it possible to suppress the emission of electromagnetic waves while suppressing the deformation load on the FPC.

[0062] Since the outer shield members 134a and 134b are covered with a shielding material until they enter the housing 80, the sensor FPC is thick and difficult to bend. On the other hand, the sensor FPC 182 needs to bend in response to the operation of the drive mechanism 60. Therefore, the shield is removed within the housing 80 to form a non-shielded member 132, thereby making the sensor FPC 182 thinner and easier to bend. However, simply removing the shield does not provide magnetic field shielding for the image sensor 30. Therefore, an inner shield plate 130 is provided between the image sensor 30 and the sensor FPC 182 within the housing 80.

[0063] According to this embodiment, the heat dissipation sheet 122 and the sensor FPC 182 are arranged so as to extend in the X direction perpendicular to the optical axis, and are configured so as to have bends along the Y direction, so that rolling distortion that may occur due to deformation of these members can be suppressed. In this embodiment, the sensor FPC 182 corresponds to, for example, the "second wiring board" defined in the claims.

[0064] In addition, a bendable non-shield member 132 is provided in the space between the housing 80 and the drive mechanism 60 to reduce the bending load on the entire sensor FPC 182, while outer shield members 134a, 134b which are less likely to bend are arranged on the outside of the housing 80, and an inner shield plate 130 is arranged on the inside of the housing 80, thereby realizing an FPC storage structure that ensures sufficient magnetic field shielding for the image sensor 30. (4) Mobile

[0065] The imaging device according to some of the above-mentioned embodiments can be mounted on the main body of a moving object via a support member such as a gimbal, as representatively shown in Fig. 1. This provides a moving object capable of acquiring images with reduced motion blur with high accuracy.

[0066] The vehicle may be, for example, an unmanned ground vehicle, or a ground remote controlled robot, without being limited to the UAV 1 shown in Figure 1. In some embodiments, vehicles consistent with embodiments of the present disclosure may be used to perform a variety of tasks in, for example, power line monitoring, communications, meteorology, agriculture, oceanography, exploration, photography, disaster prevention and mitigation, crop estimation, anti-smuggling, border patrol, security, and / or counter-terrorism.

[0067] The description of the foregoing embodiments has been presented for purposes of illustration and description, and is not intended to be exhaustive or to limit the embodiments of the invention to the precise form disclosed, but modifications and variations are possible in light of the above teachings or acquired from practice of various embodiments.

[0068] For example, in the above-described embodiment, metal plates 54a to 54d are used as the wiring board for supplying power to the coil, but the wiring board is not limited to this and may be any board that has a certain resistance to vibration and is conductive or has conductive wiring formed on its surface. In addition, although an example was given in which four suspension wires were used as the connecting members, the number is not limited to four and five or more may be used. Also, while the example was given in which two magnets are provided in two tiers, one above and one below each coil, the present invention is not limited to this, and depending on the magnetic force of the magnets used, two magnets may be provided above and below each coil, with one magnet provided in each tier, or a larger number of magnets may be provided. Furthermore, in the third embodiment, an example was given in which the first connecting member and the second connecting member for offsetting the rolling distortion that may occur due to the deformation reaction force are provided on the back side of the imaging device of the first embodiment, but this is not limited to this, and it is also possible to provide them on the back side of the imaging device of the second embodiment.

[0069] The embodiments discussed herein have been selected and described to explain the principles and properties of various embodiments and their practical applications so as to enable those skilled in the art to utilize the invention in various embodiments with various modifications suitable for particular applications. The features of the embodiments described herein may be combined in all possible combinations of methods, devices, modules, and systems. [Explanation of symbols]

[0070] 1: UAV (mobile vehicle) 8: Gimbal 10, 105, 110: Imaging device 20: Lens unit 22:Optical system 30: Image sensor 40a-40d: Solder joints 42: Top plate 44: Bottom plate 46a~46d: Side plate 48a~48d: Inner plate 50: Vibration control mechanism 52a~52d: Metal plate (wiring board) 102, 202, 302: Beam scanner 54a~54d: Metal plate 56a-56d: Suspension wire 60: Drive mechanism 62a to 62d: Coil 68a-68d: York 70: Coil FPC (first wiring board) 72: Coil slider 80: Housing 82a~82d: Leaf springs 90: Ball 100: Imaging unit 122: These heat dissipation sheets 126: Heat sink 130: Inner shield plate on the inside 132: Non-shielded member 134a, 134b: outer shield member 182: Sensor FPC (second wiring board) 182a: Electrode part 182b, 182c: Branching section FD: Fold FL1~FL3: Slit MUa1~MUd1, MUa2~MUd2: Magnets (top row) MLa1~MLd1, MLa2~MLd2: Magnets (lower row) R1, R2: Rolling distortion SP1: (1st) Space SP2: (2nd) space

Claims

1. an optical system including at least one lens; an image sensor that receives light from a subject via the optical system and generates a signal of an image of the subject; a housing having a rectangular parallelepiped shape and provided with a substantially rectangular opening through which light from a subject enters, and the image sensor being provided on a rear side thereof; a vibration suppression mechanism for suppressing the influence of external vibrations on the image sensor; Equipped with The vibration damping mechanism includes: a vibration-resistant structure provided within the housing; a drive mechanism including two pairs of moving coil type actuators arranged in the vibration-resistant structure so as to face each other with the opening therebetween; Including, The actuators are electrically connected in series to each other in opposing pairs, and drive the image sensor in a direction that cancels the vibration to the image sensor. Imaging device.

2. The vibration-resistant structure also serves as a current path to the image sensor and the actuator. The imaging device according to claim 1 .

3. The vibration-resistant structure includes a plurality of wiring boards stacked in a first direction along an optical axis of the optical system so as to sandwich the actuator therebetween; a connecting member that connects the wiring boards to each other in the first direction; a first wiring board provided on the wiring board on the rear surface side for forming a current path leading to the actuator; Includes 3. The imaging device according to claim 1.

4. The actuator comprises: coils disposed opposite each other across the opening in second and third directions each perpendicular to a first direction along an optical axis of the optical system; magnets stacked in the first direction with each coil sandwiched therebetween; a yoke disposed to cover the magnet and the coil; Includes The imaging device according to claim 1 .

5. The coil is formed of a hollow frame having an elongated elliptical planar shape, The magnet has a size sufficient to cover the area of ​​the hollow frame except for the arc portions at both ends. The imaging device according to claim 4.

6. The connecting member includes suspension wires disposed at the corners of the rectangular parallelepiped. The imaging device according to claim 3 .

7. The suspension wires are connected to the wiring board by soldering. The imaging device according to claim 3 .

8. a coil slider connected to the coil at each corner of the rectangular parallelepiped; the housing includes a top plate on the subject side, a bottom plate on the back side, and a side plate provided on an outer circumferential surface of the rectangular parallelepiped, Of the wiring boards, the wiring board on the top plate side is integrally molded with the top plate of the housing by insert molding, and the wiring board on the back surface side is integrally molded and disposed with the coil slider by insert molding. The imaging device according to claim 3 .

9. The actuator comprises: coils disposed opposite each other across the opening in second and third directions each perpendicular to a first direction along an optical axis of the optical system; magnets stacked in the first direction with each coil sandwiched therebetween; a coil slider for fixing each of the coils; Including, The vibration-resistant structure is a plurality of balls provided between each of the coil sliders and the housing; a leaf spring provided on the coil slider; Includes The imaging device according to claim 1 .

10. The image pickup device further includes a plurality of connection members having different functions, the connection members including a first connection member connected to the driving mechanism and a second connection member connected to the image sensor, The plurality of connection members are arranged to offset and mitigate rolling distortion that may occur due to a deformation reaction force that the imaging device receives as a result of driving of the driving mechanism. The imaging device according to claim 1 .

11. the first connection member includes a heat dissipation member; the heat dissipation member includes a heat dissipation sheet fixed to a heat sink at one end of both ends in a second direction perpendicular to a first direction along an optical axis of the optical system, The heat dissipation sheet is fixed to the drive mechanism at the other end of the two ends, and at least one slit is provided in a region between the two ends and extending in the second direction, and is folded halfway through the slit. The imaging device according to claim 10.

12. the housing includes a top plate on the subject side, a bottom plate on the back side, and first to fourth side plates provided on an outer circumferential surface of the rectangular parallelepiped, a first space is provided between the first side plate and the drive mechanism, and a second space is provided between the third and fourth side plates and the drive mechanism; the second connection member includes a second wiring board arranged to extend in a second direction perpendicular to a first direction along an optical axis of the optical system, The second wiring board is an electrode portion located on an outer side of the first side plate; a bent portion extending from the electrode portion toward the driving mechanism, bent once toward the top plate within the first and second spaces, and then bent again toward the bottom plate; a connection portion extending continuously from the bent portion to the driving mechanism and supplying power to the image sensor; Includes The imaging device according to claim 10.

13. The electrode portion is branched into a plurality of members in a region between both ends in a third direction perpendicular to the first direction and the second direction. The imaging device according to claim 12.

14. The vibration damping mechanism further includes an inner shield member provided in the first space and the second space so as to cover the vibration damping mechanism. The imaging device according to claim 12.

15. The electrode portion is covered with a shielding material. The imaging device according to claim 12.

16. The bent portion is an outer shield member provided upright from an end of the electrode portion, extending in a third direction perpendicular to the first direction and the second direction, and extending around an adjacent corner portion; a non-shielding member extending in the housing along the third side plate, the fourth side plate and the first side plate in the second space and the first space, the non-shielding member being continuous with the outer shield member; The imaging device according to claim 12.

17. The imaging device according to any one of claims 11 to 16, A heat dissipation sheet that is fixed to a heat sink at one end and connected to the image sensor at the other end, and dissipates heat from the imaging device to the heat sink, A heat dissipation sheet that is folded once and attached to the opposing surface between the image sensor and the heat sink, and has at least one slit provided along the direction of the fold in the area of ​​the deformed portion excluding the bonding surfaces with the image sensor and the heat sink.

18. A housing structure for a wiring board provided in the imaging device according to any one of claims 11 to 15, the housing includes a top plate on the subject side, a bottom plate on the back side, and first to fourth side plates provided on an outer circumferential surface of the rectangular parallelepiped, a first space is provided between the first side plate and the drive mechanism, and a second space is provided between the third and fourth side plates and the drive mechanism; a non-shielding member is disposed so as to extend from the first space to a corner portion of the second space, A shielded member extends from within the first space to within the second space between the non-shielded member and the image sensor, and both ends are bent to cover the corners between the first side plate and the third side plate and the corners between the first side plate and the fourth side plate. A structure for storing wiring boards.

19. A moving object comprising the imaging device according to any one of claims 11 to 16.

Images