Substrate processing apparatus and maintenance method for substrate processing apparatus

Abstract

To provide a substrate processing apparatus capable of efficiently cleaning an opening / closing mechanism and a maintenance method for the substrate processing apparatus.SOLUTION: A substrate processing apparatus 1 includes a processing chamber 23, three exhaust pipes 61, 62, 63, and an exhaust switching mechanism 25. The exhaust switching mechanism 25 includes a switching box 71, three opening / closing mechanisms 73, 74, 75 for individually opening and closing three communication ports 81, 82, 83 that individually connect the switching box 71 to the three exhaust pipes 61, 62, 63, and three cleaning nozzles 121, 122, 123 provided inside the switching box 71 corresponding to the three opening / closing mechanisms 73, 74, 75. The three cleaning nozzles 121, 122, 123 are each provided to face the link mechanism 97 of the corresponding opening / closing mechanism 73, 74, 75, and spray a cleaning liquid toward the link mechanism 97 of the corresponding opening / closing mechanism 73, 74, 75.SELECTED DRAWING: Figure 9

Description

[Technical field]

[0001] The present invention relates to a substrate processing apparatus for processing substrates and a maintenance method thereof. Examples of the substrate include semiconductor substrates, substrates for FPDs (Flat Panel Displays), glass substrates for photomasks, substrates for optical disks, substrates for magnetic disks, ceramic substrates, substrates for solar cells, etc. Examples of the FPD include liquid crystal display devices, organic EL (electroluminescence) display devices, etc. [Background technology]

[0002] The substrate processing apparatus includes a processing housing (processing chamber) for processing substrates, three exhaust pipes, and a switching mechanism for switching the exhaust path of the processing housing to one of the three exhaust pipes (see, for example, Patent Document 1). The three exhaust pipes have three openings. The switching mechanism includes three opening / closing members (cover members, opening / closing valves, or opening / closing valve bodies) for opening and closing the three openings individually.

[0003] The liquid processing apparatus (substrate processing apparatus) of Patent Document 2 comprises a liquid processing section, a main exhaust duct connected to the liquid processing section, a plurality of individual exhaust ducts each connected to the main exhaust duct, and a plurality of exhaust opening / closing valves provided between the main exhaust duct and each of the plurality of individual exhaust ducts.

[0004] The liquid treatment device also includes a branching section that branches off to the individual exhaust duct furthest upstream in the exhaust direction, and a cleaning fluid jetting section provided between the liquid treatment device and the branching section. The cleaning fluid jetting section is located upstream of the individual exhaust ducts. The cleaning fluid jetting section jets a mist-like (atomized) cleaning fluid. This makes it possible to clean the main exhaust duct, the individual exhaust ducts, and the exhaust on-off valves. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Patent Publication No. 2021-136435 [Patent Document 2] JP 2012-099582 A Summary of the Invention [Problem to be solved by the invention]

[0006] However, the substrate processing apparatus may have the following problem. An opening / closing member (a cover member, an opening / closing valve, or an opening / closing valve body) that opens and closes the opening is disposed inside a switching housing (switching box) of the switching mechanism, and is moved by a power source. When multiple types of chemical atmospheres mix together inside the switching housing and crystals are generated, the operation of the link mechanism that moves the opening / closing member may be impeded.

[0007] Here, the invention of Patent Document 2 cleans the exhaust on-off valve by sending a mist-like cleaning fluid from upstream. However, the invention of Patent Document 2 cleans not only the exhaust on-off valve, but also the main exhaust duct and multiple individual exhaust ducts. Therefore, there is a possibility that the exhaust on-off valve cannot be cleaned efficiently.

[0008] The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a substrate processing apparatus and a maintenance method for the substrate processing apparatus that are capable of efficiently cleaning an opening and closing mechanism. [Means for solving the problem]

[0009] In order to achieve the above object, the present invention has the following configuration: That is, the substrate processing apparatus according to the present invention is a substrate processing apparatus for processing a substrate, and includes a processing chamber having a holding part for holding the substrate in a horizontal position and a chemical liquid nozzle for discharging a chemical liquid onto the substrate held by the holding part, a plurality of exhaust pipes extending in a vertical direction provided on the side of the processing chamber, and an exhaust switching mechanism for switching an exhaust path from the processing chamber to any one of the plurality of exhaust pipes, the exhaust switching mechanism including a switching box connecting the processing chamber to the plurality of exhaust pipes, and a plurality of opening / closing mechanisms for individually opening and closing a plurality of communication ports that individually connect the switching box to the plurality of exhaust pipes. and a plurality of cleaning nozzles provided inside the switching box corresponding to the plurality of opening and closing mechanisms, each of the plurality of opening and closing mechanisms comprising an actuator provided outside the switching box, a cover member provided inside the switching box, and a link mechanism provided inside the switching box, the link mechanism converting linear movement of a rod extending from the actuator into opening and closing movement of the cover member, and each of the plurality of cleaning nozzles is provided facing the link mechanism of the corresponding opening and closing mechanism, and sprays cleaning liquid toward the link mechanism of the corresponding opening and closing mechanism.

[0010] In the substrate processing apparatus according to the present invention, the cleaning nozzle is provided so as to face the link mechanism of the opening / closing mechanism. The cleaning nozzle also sprays the cleaning liquid onto the link mechanism of the opening / closing mechanism. This allows a relatively large amount of cleaning liquid to be supplied to the link mechanism. As a result, at least one of the chemical solution and the crystals adhering to the link mechanism can be washed away. This allows the link mechanism (opening / closing mechanism) to be efficiently cleaned.

[0011] In addition, in the above-mentioned substrate processing apparatus, it is preferable that each of the multiple cleaning nozzles sprays cleaning liquid onto the link mechanism of the corresponding opening / closing mechanism so that the spray range of the cleaning liquid includes the upper end of the cover member of the corresponding opening / closing mechanism.

[0012] When the upper end of the lid member is included in the spray range (spray angle) of the cleaning liquid, a relatively large amount of cleaning liquid can be supplied to the upper end of the lid member. Therefore, for example, droplets of the cleaning liquid attached to the upper end of the lid member flow down from the upper end of the lid member along the lid member. This makes it possible to clean the lid member. Therefore, for example, the outer edge of the lid member can be cleaned. Therefore, it is possible to prevent the opening and closing operation of the lid member from being hindered.

[0013] In addition, in the above-mentioned substrate processing apparatus, it is preferable that each of the multiple opening and closing mechanisms is provided with a gasket for surrounding an outer periphery of one of the multiple communication ports, the gasket being provided on a surface of the cover member facing the one of the multiple communication ports.

[0014] When the opening / closing mechanism closes the communication port using the lid member, the gas in the switching box can be prevented from entering the specified exhaust pipe, which can prevent the mist (or vapor) of two different types of chemicals from mixing in the specified exhaust pipe and generating crystals.

[0015] In addition, in the above-mentioned substrate processing apparatus, it is preferable that the exhaust switching mechanism further includes a nozzle mounting member provided inside the switching box and to which the multiple cleaning nozzles are attached, the nozzle mounting member having a cleaning liquid flow path therein for supplying the cleaning liquid, and the cleaning liquid flow path branches out to supply the cleaning liquid supplied from a common inlet to the multiple cleaning nozzles.

[0016] The multiple cleaning nozzles are attached to a nozzle attachment member having a common inlet. Therefore, it is not necessary to provide individual piping for the multiple cleaning nozzles. This reduces the proportion of space occupied by the supply path for the cleaning liquid in the switching box. In addition, the supply path for the cleaning liquid can be configured simply.

[0017] Furthermore, in the above-mentioned substrate processing apparatus, it is preferable that the switching box is connected to the inside of the processing chamber via a connecting pipe, the connecting pipe having an exhaust control damper inside for controlling the amount of gas flow, and the exhaust switching mechanism further comprises: a control damper cleaning nozzle provided inside the switching box for spraying the cleaning liquid toward the exhaust control damper; a first cleaning liquid piping provided inside the switching box and connected to the control damper cleaning nozzle; and a second cleaning liquid piping provided inside the switching box, the second cleaning liquid piping branching off from the first cleaning liquid piping and connecting to the inlet of the nozzle mounting member.

[0018] The second cleaning liquid pipe that sends cleaning liquid to multiple cleaning nozzles branches off from the first cleaning liquid pipe that sends cleaning liquid to the control damper cleaning nozzle. This makes it possible to reduce the proportion of space that the cleaning liquid supply path occupies inside the switching box. In addition, the cleaning liquid supply path can be configured simply.

[0019] In addition, in the above-mentioned substrate processing apparatus, it is preferable that the apparatus further includes a control unit, which operates the multiple opening and closing mechanisms while the cleaning liquid is being sprayed from the multiple cleaning nozzles, thereby switching the open state of any one of the multiple communication ports in sequence among the multiple communication ports.

[0020] When the cleaning liquid is sprayed, any one of the plurality of communication ports is opened, so that the gas within the processing chamber is exhausted, thereby making it possible to maintain the cleanliness within the processing chamber.

[0021] In addition, in the above-mentioned substrate processing apparatus, it is preferable that the apparatus further comprises a plurality of exhaust pipe side cleaning nozzles respectively provided inside the plurality of exhaust pipes, the plurality of exhaust pipe side cleaning nozzles spraying the cleaning liquid onto the cover members of the plurality of opening and closing mechanisms through the plurality of communication ports.

[0022] Since the cleaning nozzle is provided inside the switching box, the cleaning nozzle may not be able to efficiently supply cleaning liquid to the surface (front surface) facing the communication port of the cover member of the opening / closing mechanism. However, according to the present invention, the exhaust pipe side cleaning nozzle is provided inside the exhaust pipe. Therefore, cleaning liquid can be efficiently supplied to the surface of the cover member of the opening / closing mechanism.

[0023] In the above-mentioned substrate processing apparatus, it is preferable that the switching box is connected to the inside of the processing chamber via a connecting pipe, and the inside bottom surface of the switching box is inclined so that the cleaning liquid is collected at the connecting pipe. Since the inside bottom surface of the switching box is inclined, the cleaning liquid present at the bottom surface inside the switching box can be efficiently discharged from the switching box.

[0024] In the above-mentioned substrate processing apparatus, it is preferable that the switching box is connected to the inside of the processing chamber via a connecting pipe, and the bottom surface of the switching box is higher than the bottom surface of the processing chamber and is at the same height as the bottom surface of the connecting pipe, thereby preventing the infiltration of liquid such as a cleaning liquid from the processing chamber into the switching box, and allowing the cleaning liquid present on the bottom surface of the switching box to be discharged through a discharge pipe in the processing chamber.

[0025] In the above-mentioned substrate processing apparatus, each of the cleaning nozzles is preferably a single-fluid nozzle that sprays only the cleaning liquid. For example, if the first cleaning nozzle is a two-fluid nozzle, it is necessary to send gas to the two-fluid nozzle in addition to the cleaning liquid. This requires the provision of piping for sending the gas. According to the present invention, no piping is required for sending the gas.

[0026] In the above-mentioned substrate processing apparatus, it is preferable that each of the plurality of cleaning nozzles sprays the cleaning liquid in the form of a mist.

[0027] Further, a maintenance method for a substrate processing apparatus according to the present invention is a substrate processing apparatus including: a processing chamber having a holding part for holding the substrate in a horizontal position and a chemical liquid nozzle for discharging a chemical liquid onto the substrate held by the holding part; a plurality of exhaust pipes provided on sides of the processing chamber and extending in a vertical direction; and an exhaust switching mechanism for switching an exhaust path from the processing chamber to any one of the plurality of exhaust pipes, the exhaust switching mechanism including a switching box connecting the processing chamber to the plurality of exhaust pipes, a plurality of opening / closing mechanisms for individually opening and closing a plurality of communication ports that individually connect the switching box to the plurality of exhaust pipes, and the plurality of opening / closing mechanisms In a maintenance method for a substrate processing apparatus each having an actuator provided outside the switching box, a cover member provided inside the switching box, and a link mechanism provided inside the switching box, the link mechanism converting linear movement of a rod extending from the actuator into opening and closing movement of the cover member, the method comprises a step of spraying cleaning liquid onto the link mechanisms of the corresponding plurality of opening and closing mechanisms using the plurality of cleaning nozzles, wherein the plurality of cleaning nozzles are provided inside the switching box so as to face the link mechanisms of the corresponding plurality of opening and closing mechanisms. Effect of the Invention

[0028] According to the substrate processing apparatus and the maintenance method for the substrate processing apparatus of the present invention, the opening and closing mechanism can be efficiently cleaned. [Brief description of the drawings]

[0029] [Figure 1] 1 is a plan view showing a schematic configuration of a substrate processing apparatus according to a first embodiment. [Diagram 2] 2 is a vertical sectional view of the substrate processing apparatus as seen in the direction of arrow AA in FIG. [Diagram 3] FIG. 2 is a cross-sectional view showing a processing chamber and an exhaust splitter mechanism. [Figure 4] FIG. 2 is a vertical cross-sectional view showing a processing chamber and an exhaust switching mechanism. [Diagram 5]FIG. 11 is a side view showing three opening and closing mechanisms attached to a switching box. [Figure 6] FIG. 2(a) is a vertical cross-sectional view showing the opening and closing mechanism when the cover member is in a closed state, and FIG. 2(b) is a vertical cross-sectional view showing the opening and closing mechanism when the cover member is in an open state. [Figure 7] FIG. 11 is a cross-sectional view showing three cleaning nozzles provided inside the switching box. [Figure 8] FIG. 1 is a diagram showing an outline of the piping routes to three cleaning nozzles. [Figure 9] 5A and 5B are longitudinal sectional views for explaining the cleaning operation of the opening and closing mechanism by the cleaning nozzle. [Figure 10] FIG. 4 is a vertical cross-sectional view for explaining a spray range of a cleaning nozzle. [Figure 11] 13 is a timing chart showing the cleaning operation of the three opening and closing mechanisms. [Figure 12] FIG. 11 is a cross-sectional view showing three exhaust pipe side cleaning nozzles according to a second embodiment provided inside three exhaust pipes. [Figure 13] 5A and 5B are vertical cross-sectional views for explaining the cleaning operation of the opening and closing mechanism by the exhaust pipe side cleaning nozzle. [Figure 14] FIG. 11 is a vertical cross-sectional view showing an exhaust gas switching mechanism according to a modified example. Example 1

[0030] Hereinafter, a first embodiment of the present invention will be described with reference to the drawings. Fig. 1 is a plan view (or a cross-sectional view) showing a schematic configuration of a substrate processing apparatus 1 according to the first embodiment. Fig. 2 is a vertical cross-sectional view of the substrate processing apparatus 1 as viewed in the direction of the arrow AA shown in Fig. 1.

[0031] <1. Substrate processing equipment> 1, the substrate processing apparatus 1 is a single-wafer processing apparatus that processes substrates W one by one. The substrate processing apparatus 1 includes an indexer block 2 and a processing block 3.

[0032] For convenience, in this specification, the direction in which the indexer block 2 and the processing block 3 are lined up is referred to as the "front-rear direction X." The front-rear direction X is horizontal. Within the front-rear direction X, for example, the direction from the processing block 3 toward the indexer block 2 is referred to as the "front." The direction opposite to the front is referred to as the "rear." The horizontal direction perpendicular to the front-rear direction X is referred to as the "width direction Y." One direction in the "width direction Y" is referred to as the "right" as appropriate. The direction opposite to the right is referred to as the "left." The direction perpendicular to the horizontal direction is referred to as the "vertical direction Z." In each figure, for reference, front, back, right, left, top, and bottom are indicated as appropriate.

[0033] <2. Indexer block> The indexer block 2 includes a plurality of (for example, four) load ports LP and an indexer robot IR. The load ports LP are used for loading and unloading the carriers C. The carriers C are placed on the load ports LP. The load ports LP are disposed outside the indexer block 2.

[0034] The carrier C accommodates a plurality of (for example, 25) substrates W. For example, a front opening unify pod (FOUP) is used as the carrier C, but is not limited to this. The substrate W is formed, for example, in a disk shape.

[0035] The indexer robot IR is disposed inside the indexer block 2. The indexer robot IR transports substrates W between, for example, four carriers C placed on four load ports LP and a substrate platform PS described below. The indexer robot IR includes a hand 5. The hand 5 is movable and holds one substrate W. The indexer robot IR moves the hand 5 holding one substrate W in the horizontal direction XY (front-rear direction X and width direction Y) and the vertical direction Z. The indexer robot IR also rotates the hand 5 around a vertical axis.

[0036] <3. Processing block> The processing block 3 includes a transport robot TR, a substrate platform PS, and four towers TW1 to TW4. The transport robot TR and the substrate platform PS are provided in a transport space 11 extending in the front-rear direction X. The transport space 11 extends linearly from the indexer block 2 toward the rear X. The substrate platform PS is disposed between the indexer robot IR and the transport robot TR.

[0037] The transport robot TR transports the substrate W between the substrate placement part PS and each of the processing units 21 (described later) of the four towers TW1 to TW4. The transport robot TR includes a hand 13. The hand 13 is movable and holds one substrate W in a horizontal position. The transport robot TR moves the hand 13 holding one substrate W in the horizontal directions XY and the vertical direction Z. The transport robot TR also rotates the hand 13 around a vertical axis.

[0038] The first tower TW1 and the second tower TW2 are arranged in the front-rear direction X along the transport space 11. Similarly, the third tower TW3 and the fourth tower TW4 are arranged in the front-rear direction X along the transport space 11.

[0039] In addition, in the width direction Y, the two towers TW1, TW2 are disposed so as to face the two towers TW3, TW4 across the transport space 11. That is, the two towers TW1, TW2 are disposed on the right side Y of the transport space 11. In addition, the two towers TW3, TW4 are disposed on the left side Y of the transport space 11.

[0040] Each of the four towers TW1 to TW4 includes six processing units 21 arranged in the vertical direction Z. That is, the processing block 3 includes 24 processing units 21. Note that, for example, Fig. 2 shows that each of the two towers TW2, TW4 includes six processing units 21 arranged in the vertical direction Z.

[0041] The processing block 3 includes four towers TW1 to TW4. In this regard, the processing block 3 may include one or two or more towers. Each of the towers TW1 to TW4 includes six processing units 21. In this regard, each of the towers TW1 to TW4 may include one processing unit 21 or two or more processing units 21 arranged in the vertical direction Z.

[0042] <3-1. Processing chamber> As shown in Fig. 1, each processing unit 21 includes a processing chamber 23 and an exhaust switching mechanism 25. Fig. 3 is a horizontal cross-sectional view showing the processing chamber 23 and the exhaust switching mechanism 25. Fig. 4 is a vertical cross-sectional view showing the processing chamber 23 and the exhaust switching mechanism 25.

[0043] The processing chamber 23 processes the substrates W one by one. The processing chamber 23 includes a holding and rotating part 27, three nozzles 29A, 29B, 29C, a substrate transfer port 30, and a fan filter unit 31 (see FIG. 4). The holding and rotating part 27 and the three nozzles 29A, 29B, 29C are each provided in the processing chamber 23. The fan filter unit 31 is provided on the ceiling of the processing chamber 23, as shown in FIG. 4. The fan filter unit 31 supplies clean air (gas) into the processing chamber 23.

[0044] The substrate transfer opening 30 is disposed facing the transfer space 11. The substrate W is transferred onto the holding and rotating unit 27 through the substrate transfer opening 30. The substrate transfer opening 30 is opened and closed by a shutter (not shown). The holding and rotating unit 27 rotates the substrate W around a vertical axis AX1 while holding the substrate W in a horizontal position. Specifically, the holding and rotating unit 27 includes a spin chuck 27A that holds the substrate W in a horizontal position, and an electric motor 27B that rotates the spin chuck 27A around the vertical axis AX1. The spin chuck 27A may be a chuck that holds the substrate W by clamping the side of the substrate W with three or more holding pins. The spin chuck 27A may also be a chuck that holds the lower surface of the substrate W by vacuum suction.

[0045] Each of the three nozzles 29A, 29B, 29C ejects a chemical liquid onto the substrate W held by the holding / rotating unit 27. The three nozzles 29A, 29B, 29C eject a first chemical liquid, a second chemical liquid, and a third chemical liquid. For example, the first nozzle 29A ejects the first chemical liquid, and the second nozzle 29B ejects the second chemical liquid. The third nozzle 29C ejects the third chemical liquid. The first chemical liquid, the second chemical liquid, and the third chemical liquid are different types from one another. Note that when the first chemical liquid, the second chemical liquid, and the third chemical liquid are not particularly distinguished from one another, they are referred to as "chemical liquids."

[0046] The first chemical liquid is classified as, for example, an acidic liquid (acid-based chemical liquid). The first chemical liquid includes, for example, at least one of hydrofluoric acid (hydrofluoric acid), hydrochloric acid-hydrogen peroxide solution, sulfuric acid, sulfuric acid-hydrogen peroxide solution, hydrofluoric nitric acid (a mixture of hydrofluoric acid and nitric acid), and hydrochloric acid.

[0047] The second chemical liquid is classified as, for example, an alkaline liquid (an alkaline-based chemical liquid). The second chemical liquid includes, for example, at least one of an ammonia hydrogen peroxide solution (SC1), an ammonia water solution, an ammonium fluoride solution, and a tetramethylammonium hydroxide (TMAH).

[0048] The third chemical liquid is, for example, classified as an organic liquid (organic chemical liquid). The organic liquid includes at least one of isopropyl alcohol (IPA), methanol, ethanol, hydrofluoroether (HFE), and acetone.

[0049] Each of the nozzles 29A, 29B, and 29C has a tubular shape that extends linearly. The nozzles 29A, 29B, and 29C include tip portions 33A, 33B, and 33C, respectively. The tip portions 33A, 33B, and 33C each have a discharge port (not shown) for discharging the chemical solution.

[0050] The processing chamber 23 further includes three rotational drive units 35A, 35B, and 35C. The three rotational drive units 35A, 35B, and 35C are connected to the three base ends of the three nozzles 29A, 29B, and 29C, respectively. Each of the rotational drive units 35A, 35B, and 35C includes, for example, an electric motor. The first rotational drive unit 35A rotates the first nozzle 29A around a vertical axis AX2. The second rotational drive unit 35B rotates the second nozzle 29B around a vertical axis AX3. The third rotational drive unit 35C rotates the third nozzle 29C around a vertical axis AX4.

[0051] 4, processing chamber 23 further includes three pipes 37, 39, and 41. One end of first pipe 37 is connected to first nozzle 29A. The other end of first pipe 37 is connected to first chemical liquid supply source 43. Also, first pipe 37 is provided with an on-off valve V1. When on-off valve V1 is opened, the first chemical liquid is sent from first chemical liquid supply source 43 to first pipe 37, and the first chemical liquid is discharged from first nozzle 29A.

[0052] Similarly, one end of the second pipe 39 is connected to the second nozzle 29B. The other end of the second pipe 39 is connected to the second chemical liquid supply source 45. Also, an on-off valve V2 is provided in the second pipe 39. When the on-off valve V2 is opened, the second chemical liquid is discharged from the second nozzle 29B. Similarly, one end of the third pipe 41 is connected to the third nozzle 29C. The other end of the third pipe 41 is connected to the third chemical liquid supply source 47. Also, an on-off valve V3 is provided in the third pipe 41. When the on-off valve V3 is opened, the third chemical liquid is discharged from the third nozzle 29C.

[0053] The processing chamber 23 further includes an upper cup 49 and a lower cup 51. The upper cup 49 and the lower cup 51 are each formed in a hollow cylindrical shape. As shown in Fig. 3 and Fig. 4, the upper cup 49 and the lower cup 51 are arranged so as to surround the side surfaces of the substrate W and the spin chuck 27A. The upper cup 49 is arranged above the lower cup 51. The upper cup 49 is raised and lowered relative to the lower cup 51, the substrate W, and the spin chuck 27A by a drive unit (not shown).

[0054] Furthermore, the upper cup 49 receives the chemical liquid scattered from the substrate W due to the rotation of the substrate W or the like, and guides the chemical liquid to the lower cup 51. A liquid discharge pipe 53 is provided at the bottom of the lower cup 51. The lower cup 51 stores the chemical liquid sent from the upper cup 49 or the like, and discharges the chemical liquid through the liquid discharge pipe 53. A liquid discharge pipe 53 is also connected to the bottom of the processing chamber 23.

[0055] The processing chamber 23 includes a partition plate 55 that separates the upper space SP1 and the lower space SP2 inside. The air supplied from the fan filter unit 31 is sent from the upper space SP1 to the lower space SP2 while flowing inside and outside the upper cup 49 as shown by flows FL1, FL2, FL3, FL4, FL5, and FL6 indicated by dashed lines in Fig. 4. Then, the air is sent from the lower space SP2 of the processing chamber 23 to one of three exhaust pipes 61, 62, and 63 (described later) via the exhaust switching mechanism 25 described later. Note that the partition plate 55 is not shown in Fig. 3.

[0056] <3-2.3 exhaust pipes> Three exhaust pipes 61, 62, 63 extending in the vertical direction Z are provided on the sides of each processing chamber 23. Specifically, the three exhaust pipes 61, 62, 63 are provided in each of the four towers TW1 to TW4.

[0057] 2, three exhaust pipes 61, 62, 63 are provided on the sides of the six processing chambers 23 of the second tower TW2. Each of the three exhaust pipes 61, 62, 63 extends in the vertical direction Z. In the four towers TW1 to TW4, the three exhaust pipes 61, 62, 63 are arranged side by side in the width direction Y.

[0058] As shown in FIG. 2, six horizontal exhaust pipes 65A, 66A, 67A, 65B, 66B, 67B are provided on the roof of the substrate processing apparatus 1. The six exhaust pipes 61, 62, 63 of the two towers TW1, TW2 are connected to three horizontal exhaust pipes 65A, 66A, 67A. The six exhaust pipes 61, 62, 63 of the two towers TW3, TW4 are connected to three horizontal exhaust pipes 65B, 66B, 67B. For example, the upper end of the first exhaust pipe 61 of the first tower TW1 and the upper end of the first exhaust pipe 61 of the second tower TW2 are connected to the horizontal exhaust pipe 65A. Similarly, the second exhaust pipe 62 of the first tower TW1 and the second exhaust pipe 62 of the second tower TW2 are connected to the horizontal exhaust pipe 66A. Furthermore, the third exhaust pipe 63 of the first tower TW1 and the third exhaust pipe 63 of the second tower TW2 are connected to the horizontal exhaust pipe 67A.

[0059] <3-3. Exhaust switching mechanism> As described above, each processing unit 21 includes an exhaust switching mechanism 25. The exhaust switching mechanism 25 switches the exhaust path from the processing chamber 23 to any one of the three exhaust pipes 61, 62, and 63. The exhaust switching mechanism 25 is disposed between the processing chamber 23 and the three exhaust pipes 61, 62, and 63, as shown in FIGS.

[0060] The exhaust switching mechanism 25 includes a switching box 71 and three opening and closing mechanisms 73, 74, and 75. The switching box 71 connects the processing chamber 23 to three exhaust pipes 61, 62, and 63. The switching box 71 is connected to the inside of the processing chamber 23 via a connecting pipe 76 (exhaust inlet 78).

[0061] The connecting pipe 76 connects between the processing chamber 23 and the switching box 71. The connecting pipe 76 has an exhaust control damper 77 inside. The exhaust control damper 77 controls the air volume (=volume / time) of the gas (exhaust). As shown in FIG. 3, the exhaust control damper 77 includes a plate-shaped member 77B that is rotatable around a vertical axis 77A. The plate-shaped member 77B is driven by an electric motor (not shown). One end of the connecting pipe 76 forms an exhaust inlet 78. The gas in the processing chamber 23 is sent from the exhaust inlet 78 into the switching box 71.

[0062] The three exhaust pipes 61, 62, 63 are provided with three communication ports 81, 82, 83 corresponding to the area of ​​the switching box 71. The first exhaust pipe 61 is provided with a first communication port 81. Similarly, the second exhaust pipe 62 is provided with a second communication port 82. The third exhaust pipe 63 is provided with a third communication port 83. The three communication ports 81, 82, 83 are aligned in the width direction Y. Each of the three communication ports 81, 82, 83 is formed in a circular shape.

[0063] The three communication ports 81, 82, 83 communicate between the switching box 71 and the three exhaust pipes 61, 62, 63. The first communication port 81 communicates between the switching box 71 and the first exhaust pipe 61. Similarly, the second communication port 82 communicates between the switching box 71 and the second exhaust pipe 62. The third communication port 83 communicates between the switching box 71 and the third exhaust pipe 63.

[0064] The three opening / closing mechanisms 73, 74, and 75 individually open and close the three communication ports 81, 82, and 83. Specifically, as shown in Fig. 3, the first opening / closing mechanism 73 opens and closes the first communication port 81. Similarly, the second opening / closing mechanism 74 opens and closes the second communication port 82. The third opening / closing mechanism 75 opens and closes the third communication port 83.

[0065] 5, the three opening / closing mechanisms 73, 74, and 75 are each configured as an integrally assembled part based on a base member 87 (described later). This makes it easy to attach and detach each of the three opening / closing mechanisms 73, 74, and 75 to and from the switching box 71.

[0066] The ceiling wall 71A of the switching box 71 has three mounting openings 85A, 85B, and 85C. The three mounting openings 85A, 85B, and 85C are arranged in the width direction Y. The three opening / closing mechanisms 73, 74, and 75 are attached to the three mounting openings 85A, 85B, and 85C, respectively. Specifically, the first opening / closing mechanism 73 is attached to the mounting opening 85A. Similarly, the second opening / closing mechanism 74 is attached to the mounting opening 85B, and the third opening / closing mechanism 75 is attached to the mounting opening 85C. The attachment is performed, for example, with a plurality of screws.

[0067] The three opening / closing mechanisms 73, 74, 75 have substantially the same configuration. Each of the three opening / closing mechanisms 73, 74, 75 includes a base member 87, an upper support member 89, an actuator 91, a rod 93, a cover member (opening / closing valve or opening / closing valve body) 95, and a link mechanism 97. The rod 93 includes an upper rod 93U and a lower rod 93L. When there is no need to distinguish between the upper rod 93U and the lower rod 93L, they are referred to as "rod 93."

[0068] The upper support member 89, the actuator 91, and the upper rod 93U are provided on the outside of the switching box 71. The cover member 95 and the link mechanism 97 are provided on the inside of the switching box 71. The lower rod 93L is housed in a bellows 107 and is disposed on the inside and outside of the switching box 71.

[0069] The base member 87 is detachably attached to each of the three mounting openings 85A, 85B, and 85C. The base member 87 is a plate-shaped member. For example, when the base member 87 is attached to the mounting opening 85A, the mounting opening 85A is blocked by the base member 87.

[0070] The upper support member 89 is provided on the upper surface of the base member 87. The upper support member 89 is formed in a gate shape, but it does not have to be formed in a gate shape. The actuator 91 is attached to the upper support member 89. The actuator 91 includes, for example, an air cylinder, but may also include an electric motor.

[0071] The rod 93 extends downward from the actuator 91 while penetrating the base member 87. The rod 93 (upper rod 93U) is moved in the vertical direction Z by the actuator 91. The cover member 95 is disposed below the base member 87.

[0072] The cover member 95 is a member that allows gas from the processing chamber 23 to flow or blocks gas from the processing chamber 23 between the inside of the switching box 71 and, for example, the first exhaust pipe 61. The state in which gas from the processing chamber 23 is allowed to flow is called an open state. The state in which gas from the processing chamber 23 is blocked is called a closed state. The cover member 95 is formed in a disk shape.

[0073] Also, as shown in the circle frame of the dashed line in FIG. 5, a packing 95A for surrounding the outer periphery of the third communication port 83 is provided on the surface (front surface) of the cover member 95 of the third opening / closing mechanism 75 corresponding to the third communication port 83. Similarly, a packing 95A for surrounding the outer periphery of the first communication port 81 is provided on the surface facing the first communication port 81 of the cover member 95 of the first opening / closing mechanism 73. Also, a packing 95A for surrounding the outer periphery of the second communication port 82 is provided on the surface facing the second communication port 82 of the cover member 95 of the second opening / closing mechanism 74. For example, when the first opening / closing mechanism 73 closes the first communication port 81 using the cover member 95, it is possible to prevent the gas in the switching box 71 from entering the first exhaust pipe 61. Therefore, for example, it is possible to prevent the mist (or vapor) of two different types of chemicals from mixing and generating crystals in the first exhaust pipe 61.

[0074] See Figures 5, 6(a) and 6(b). Link mechanism 97 is provided on the underside of base member 87. Link mechanism 97 converts linear movement in the vertical direction Z of rod 93 extending from actuator 91 into opening and closing movement (swinging) of cover member 95 about horizontal axis AX5. Link mechanism 97 includes a lower support member 101, a first link 103 and a second link 105. Lower support member 101 is provided on the underside of base member 87. That is, lower support member 101 is fixed to the underside of base member 87.

[0075] The horizontal axis AX5 is located at a height between the base member 87 and the cover member 95. The horizontal axis AX5 passes through a lower end portion of the lower support member 101. The horizontal axis AX6 passes through a lower end portion of the rod 93 (93L). The horizontal axis AX7 passes through a lower end side of the first link 103. The horizontal axis AX6 and the horizontal axis AX7 are each parallel to the horizontal axis AX5. That is, the three horizontal axes AX5, AX6, and AX7 each extend in the width direction Y. In addition, in the closed state shown in FIG. 6(a), the horizontal axis AX6 is located at a height between the two horizontal axes AX5 and AX7. In addition, in the closed state, the horizontal axis AX5 is located between the two horizontal axes AX6 and AX7 in a plan view.

[0076] An upper end portion of the first link 103 is connected to the lower support member 101 so as to be rotatable about a horizontal axis AX5. A lower end portion of the first link 103 is connected to the rear surface of the disk-shaped cover member 95. An upper end portion of the second link 105 is connected to the rod 93 (lower rod 93L) so as to be rotatable about a horizontal axis AX6. A lower end portion of the second link 105 is connected to the first link 103 so as to be rotatable about a horizontal axis AX7.

[0077] In addition, it is difficult to ensure airtightness at the portion where the lower rod 93L slides against the base member 87. For this reason, a bellows structure is used at the sliding portion, thereby preventing gas leakage at the sliding portion.

[0078] Please refer to Figures 6(a) and 6(b). Each of the three opening / closing mechanisms 73, 74, and 75 includes a bellows 107, a lower member 108L, and an upper member 108U. The bellows 107 extends in the vertical direction Z. A cavity TN of the bellows 107 can accommodate a part or the whole of the lower rod 93L. The lower member 108L is provided at the lower end of the bellows 107. The lower member 108L is attached to the upper surface of the base member 87, for example, by a plurality of screws. The lower rod 93L passes through the lower member 108L and the base member 87 while passing through the cavity TN of the bellows 107.

[0079] An upper member 108U is provided at the upper end of the bellows 107. The upper member 108U closes the upper end of the cavity TN. The upper end of the lower rod 93L is connected to the lower part of the upper member 108U.

[0080] 5, the lower end of the upper rod 93U is connected to the upper part of the upper member 108U via a floating joint 115. That is, the floating joint 115 is connected to the lower end of the upper rod 93U and further connected to the upper part of the upper member 108U. The floating joint 115 is a joint that absorbs eccentricity and angular misalignment between the upper rod 93U and the lower rod 93L.

[0081] Here, the operation of the three opening and closing mechanisms 73, 74, 75 will be briefly described. As shown in FIG. 6(b), the actuator 91 moves the rods 93 (upper rod 93U and lower rod 93L) upward. This causes the cover member 95 to be in an open state that allows gas to flow from the processing chamber 23. When the cover member 95 of the first opening and closing mechanism 73 is in an open state, the first communication port 81 is opened. Similarly, when the cover member 95 of the second opening and closing mechanism 74 is in an open state, the second communication port 82 is opened. Moreover, when the cover member 95 of the third opening and closing mechanism 75 is in an open state, the third communication port 83 is opened.

[0082] 6(a), the actuator 91 moves the rod 93 downward. This places the cover member 95 in a closed state that blocks gas from the processing chamber 23. When the cover member 95 of the first opening and closing mechanism 73 is in the closed state, the first communication port 81 is closed. Similarly, when the cover member 95 of the second opening and closing mechanism 74 is in the closed state, the second communication port 82 is closed. When the cover member 95 of the third opening and closing mechanism 75 is in the closed state, the third communication port 83 is closed. Note that the opening and closing mechanisms 73, 74, and 75 shown in FIG. 5 are in the closed state.

[0083] <3-3-1.3 cleaning nozzles> Next, the three cleaning nozzles 121, 122, and 123, which are characteristic of this embodiment, will be described. For example, if an acidic chemical atmosphere and an alkaline chemical atmosphere are mixed and crystals (salt) are generated, the operation of the link mechanism 97 that moves the lid member 95 may be hindered. In addition, crystals attached to the packing 95A and its contact portion may hinder the opening and closing operation of the lid member 95. Therefore, a cleaning liquid is sprayed (ejected) onto the link mechanism 97 (particularly the joint portion), the packing 95A, and the contact portion of the packing 95A. Thereby, at least one of the chemical liquid and the crystals attached to the link mechanism 97, for example, is washed away.

[0084] Fig. 7 is a cross-sectional view showing the three cleaning nozzles 121, 122, 123 provided inside the switching box 71. Fig. 8 is a diagram showing an outline of the piping routes to the three cleaning nozzles 121, 122, 123. The exhaust switching mechanism 25 further includes the three cleaning nozzles 121, 122, 123, a nozzle mounting member 125, and a control damper cleaning nozzle 127. The three cleaning nozzles 121, 122, 123, the nozzle mounting member 125, and the control damper cleaning nozzle 127 are provided inside the switching box 71. Each of the three cleaning nozzles 121, 122, 123 sprays cleaning liquid.

[0085] Three cleaning nozzles 121, 122, and 123 are attached to the nozzle attachment member 125. The nozzle attachment member 125 is a rod-shaped member extending in the width direction Y. As shown in Fig. 7, the switching box 71 includes an introduction section 129 adjacent to the connection pipe 76, and a distribution section 131 extending from the introduction section 129 in the width direction Y along the three exhaust pipes 61, 62, and 63.

[0086] The nozzle mounting member 125 is disposed in the distribution section 131. The nozzle mounting member 125 is disposed on or near the side wall 71B facing the three communication ports 81, 82, and 83. The side wall 71B is adjacent to the processing chamber 23. As shown in FIG. 8, the nozzle mounting member 125 has a cleaning liquid flow path 125A for sending the cleaning liquid on the inside and also has a common inlet 125B. The cleaning liquid flow path 125A also extends in the width direction Y. The cleaning liquid flow path 125A branches to send the cleaning liquid supplied from the common inlet 125B to the three cleaning nozzles 121, 122, and 123. The three cleaning nozzles 121, 122, and 123 communicate with the cleaning liquid flow path 125A.

[0087] The control damper cleaning nozzle 127 sprays the cleaning liquid toward the exhaust control damper 77. This makes it possible to wash away at least one of the chemical solution and the crystals adhering to the exhaust control damper 77. As shown in FIG. 8, the exhaust switching mechanism 25 further includes three cleaning liquid pipes 133, 135, and 137, a branch pipe 139, and a pipe joint 141. The three cleaning liquid pipes 133, 135, and 137 and the branch pipe 139 are provided inside the switching box 71. The branch pipe 139 is, for example, a T-shaped pipe.

[0088] One end of the cleaning liquid pipe 133 is connected to the control damper cleaning nozzle 127, and the other end of the cleaning liquid pipe 133 is connected to a branch pipe 139. One end of the cleaning liquid pipe 135 is connected to the branch pipe 139, and the other end of the cleaning liquid pipe 135 is connected to an inner connection part 141A of a pipe fitting 141. The pipe fitting 141 is attached to a wall part (e.g., a ceiling wall 71A) of the switching box 71. The inner connection part 141A is disposed inside the switching box 71. Also, the outer connection part 141B of the pipe fitting 141 is disposed outside the switching box 71.

[0089] The cleaning liquid pipe 137 branches off from the cleaning liquid pipes 133 and 135. One end of the cleaning liquid pipe 137 is connected to a branch pipe 139, and the other end of the cleaning liquid pipe 137 is connected to an inlet 125B of the nozzle attachment member 125. One end of the cleaning liquid pipe 143 is connected to the outer connection part 141B of the pipe joint 141. The other end of the cleaning liquid pipe 143 is connected to a cleaning liquid supply source 145. The cleaning liquid supply source 145 supplies the cleaning liquid. For example, carbon dioxide water (CO2 water) is used as the cleaning liquid, but is not limited to this. For example, the cleaning liquid may be pure water such as deionized water (DIW).

[0090] An on-off valve V5 is provided in the cleaning liquid piping 143. The on-off valve V5 controls supply and stop of the cleaning liquid. When the on-off valve V5 is opened, the cleaning liquid is sent from the cleaning liquid supply source 145 to the three cleaning nozzles 121, 122, and 123 and the control damper cleaning nozzle 127. As a result, the cleaning liquid is sprayed from the three cleaning nozzles 121, 122, and 123 and the control damper cleaning nozzle 127.

[0091] Each of the three cleaning nozzles 121, 122, 123 and the control damper cleaning nozzle 127 sprays cleaning liquid in the form of a mist. Each of the three cleaning nozzles 121, 122, 123 and the control damper cleaning nozzle 127 is configured as a single-fluid nozzle that sprays only cleaning liquid. The single-fluid nozzle turns the cleaning liquid into a mist by the pressure of the cleaning liquid without using gas. Each of the three cleaning nozzles 121, 122, 123 and the control damper cleaning nozzle 127 may be configured as a dual-fluid nozzle. The dual-fluid nozzle turns the cleaning liquid into a mist by atomizing it using a flow of gas (e.g., nitrogen gas).

[0092] For example, each of the three cleaning nozzles 121, 122, and 123 is provided so as to face obliquely upward from a height position lower than the link mechanism 97. Specifically, as shown in Figures 9(a), 9(b), and 10, the first cleaning nozzle 121 is provided so as to face the link mechanism 97 of the first opening and closing mechanism 73. The first cleaning nozzle 121 sprays the cleaning liquid directly onto the link mechanism 97 of the first opening and closing mechanism 73 so that the spraying range RG of the cleaning liquid includes the upper end of the lid member 95 of the first opening and closing mechanism 73.

[0093] Similarly, the second cleaning nozzle 122 is provided so as to face the link mechanism 97 of the second opening and closing mechanism 74. The second cleaning nozzle 122 sprays the cleaning liquid directly onto the link mechanism 97 of the second opening and closing mechanism 74 so that the upper end of the cover member 95 of the second opening and closing mechanism 74 is included in the spraying range RG of the cleaning liquid. The third cleaning nozzle 123 is provided so as to face the link mechanism 97 of the third opening and closing mechanism 75. The third cleaning nozzle 123 sprays the cleaning liquid directly onto the link mechanism 97 of the third opening and closing mechanism 75 so that the upper end of the cover member 95 of the third opening and closing mechanism 75 is included in the spraying range RG of the cleaning liquid.

[0094] The direction and spray range (spray angle) RG of each of the cleaning nozzles 121, 122, 123 are set in advance based on the closed state shown in Fig. 9(a). For example, as shown in Fig. 10, the horizontal width of the spray range RG may be set to be larger than the diameter of the cover member 95.

[0095] The cleaning liquid pipes 133 and 135 correspond to the first cleaning liquid pipe of the present invention. The cleaning liquid pipe 137 corresponds to the second cleaning liquid pipe of the present invention. The first cleaning nozzle 121 corresponds to the first opening and closing mechanism 73. Similarly, the second cleaning liquid nozzle 122 corresponds to the second opening and closing mechanism 74, and the third cleaning liquid nozzle 123 corresponds to the third opening and closing mechanism 75.

[0096] <4. Control unit> The substrate processing apparatus 1 includes a control unit 150 (see FIG. 1) and a storage unit (not shown). The control unit 150 controls each component of the substrate processing apparatus 1. The control unit 150 includes one or more processors, such as a central processing unit (CPU). The storage unit includes, for example, at least one of a read-only memory (ROM) and a random-access memory (RAM). The storage unit stores computer programs required to control each component of the substrate processing apparatus 1.

[0097] <5. Normal Operation of the Substrate Processing Apparatus 1> Next, a normal operation of the substrate processing apparatus 1 will be described. See Fig. 1. A carrier C is placed on the load port LP. The indexer robot IR takes out the substrate W from the carrier C placed on the load port LP, and transports the substrate W to the substrate platform PS. The transport robot TR in the processing block 3 takes out the substrate W from the substrate platform PS, and transports the substrate W to a predetermined processing chamber 23 among the 24 processing chambers 23 (processing units 21).

[0098] The fan filter unit 31 shown in FIG. 4 supplies clean air into the processing chamber 23. The exhaust equipment of the factory sucks in gas from one end of each of the six horizontal exhaust pipes 65A, 66A, 67A, 65B, 66B, and 67B. For example, in the exhaust switching mechanism 25 shown in FIG. 3 and FIG. 5, the two opening / closing mechanisms 73 and 74 close the two communication ports 81 and 82, and the third opening / closing mechanism 75 opens the third communication port 83. Therefore, the gas in the processing chamber 23 is sent to the exhaust equipment of the factory via the third communication port 83, the third exhaust pipe 63, and the horizontal exhaust pipe 67A.

[0099] For example, the first exhaust pipe 61 is used to exhaust acid gas. The second exhaust pipe 62 is used to exhaust alkaline gas. The third exhaust pipe 63 is used to exhaust organic gas. For example, the second exhaust pipe 62 may be used to exhaust organic gas, and the third exhaust pipe 63 may be used to exhaust alkaline gas. The roles of the three exhaust pipes 61, 62, 63 are not limited.

[0100] For example, a case will be described in which an acid-based chemical liquid (first chemical liquid) is supplied from the first nozzle 29A to the substrate W to perform chemical liquid processing. In this case, in the exhaust switching mechanism 25 shown in Figs. 3 and 5, the first opening and closing mechanism 73 opens the first communication port 81, and the two opening and closing mechanisms 74, 75 close the two communication ports 82, 83. As a result, the gas in the processing chamber 23 is sent in the order of the connection pipe 76 (exhaust inlet 78), the switching box 71, and the first exhaust pipe 61. Therefore, the gas containing the mist (or vapor) of the acid-based chemical liquid generated by the chemical liquid processing is sent to the first exhaust pipe 61 through the switching box 71.

[0101] Next, a case will be described in which an alkaline chemical solution (second chemical solution) is supplied from the second nozzle 29B to the substrate W to perform chemical solution processing. In this case, in the exhaust switching mechanism 25 shown in Figs. 3 and 5, the second opening and closing mechanism 74 opens the second communication port 82, and the two opening and closing mechanisms 73, 75 close the two communication ports 81, 83. As a result, the gas in the processing chamber 23 is sent in the order of the connecting pipe 76 (exhaust inlet 78), the switching box 71, and the second exhaust pipe 62. Therefore, the gas containing the mist (or vapor) of the alkaline chemical solution generated by the chemical solution processing is sent to the second exhaust pipe 62 through the switching box 71.

[0102] Next, a case will be described in which an organic chemical liquid (third chemical liquid) is supplied from the third nozzle 29C to the substrate W to perform chemical liquid processing. In this case, in the exhaust switching mechanism 25 shown in Figs. 3 and 5, the third opening and closing mechanism 75 opens the third communication port 83, and the two opening and closing mechanisms 73, 74 close the two communication ports 81, 82. As a result, the gas in the processing chamber 23 is sent in the order of the connection pipe 76 (exhaust inlet 78), the switching box 71, and the third exhaust pipe 63. Therefore, the gas containing the mist (or vapor) of the organic chemical liquid generated by the chemical liquid processing is sent to the third exhaust pipe 63 through the switching box 71.

[0103] After the substrate W has been subjected to a predetermined chemical treatment, the transport robot TR transports the substrate W from the treatment chamber 23 to the substrate platform PS. The indexer robot IR transports the substrate W after the chemical treatment from the substrate platform PS to the carrier C placed on the load port LP.

[0104] <6. Maintenance Operation of Substrate Processing Apparatus 1> Next, a cleaning operation of the three opening / closing mechanisms 73, 74, and 75 will be described as a maintenance operation of the substrate processing apparatus 1. This cleaning operation is performed when the processing chamber 23 is not performing substrate processing, i.e., when no substrates W are loaded into the processing chamber 23. The cleaning operation is also performed every time a preset number (or lot) of substrates W are processed by the substrate processing apparatus 1, or every time a preset number of days or time has elapsed.

[0105] 11 is a timing chart showing the cleaning operation of the three opening and closing mechanisms 73, 74, and 75. In order to maintain the cleanliness inside the processing chamber 23, any one of the three lid members 95 of the three opening and closing mechanisms 73, 74, and 75 is always opened during the cleaning operation. In addition, the fan filter unit 31 shown in FIG. 4 supplies clean air, and the exhaust equipment of the factory sucks in the gas inside the three exhaust pipes 61, 62, and 63.

[0106] At time t1, when the on-off valve V5 shown in Fig. 8 is opened, the three cleaning nozzles 121, 122, and 123 and the control damper cleaning nozzle 127 spray mist-like cleaning liquid. The on-off valve V5 is opened from time t1 to time t9. At time t1, for example, the on-off mechanisms 73 and 74 close the communication ports 81 and 82, and the third on-off mechanism 75 opens the third communication port 83. For example, the first cleaning nozzle 121 sprays mist-like cleaning liquid as shown in Fig. 9(a).

[0107] The sprayed mist-like cleaning liquid hits three joints while going around the obstruction. The three joints are the joint between the lower rod 93L and the second link 105 through which the horizontal axis AX6 passes, the joint between the first link 103 and the second link 105 through which the horizontal axis AX7 passes, and the joint between the lower support member 101 and the first link 103 through which the horizontal axis AX5 passes. Since the first cleaning nozzle 121 is directed toward the link mechanism 97 of the first opening / closing mechanism 73, a large amount of cleaning liquid is concentrated and supplied to the three joints. When the mist-like cleaning liquid adheres to the lower rod 93L, for example, it becomes large droplets of cleaning liquid, and the droplets flow down along the lower rod 93L. In this way, the link mechanism 97 can be efficiently cleaned by the cleaning liquid that adheres directly and the cleaning liquid that flows from above.

[0108] Furthermore, when the mist of cleaning liquid adheres to the side wall 71C on the first communication port 81 side of the switching box 71, the cleaning liquid becomes large droplets, which flow down the side wall 71C. At this time, the droplets of the cleaning liquid flow down the outer periphery of the ring-shaped packing 95A interposed between the cover member 95 and the side wall 71C. Therefore, the peripheral portion of the packing 95A indicated by the symbol CP in FIG. 9(a) can be cleaned. The second opening / closing mechanism 74 is cleaned by the second cleaning nozzle 122 in the same manner as the first cleaning nozzle 121.

[0109] Also, at time t1, the third cleaning nozzle 123 sprays mist-like cleaning liquid as shown in Fig. 9(b). Similarly, the sprayed mist-like cleaning liquid hits the three joints while going around the obstacles. Also, for example, the mist-like cleaning liquid adhering to the lower rod 93L turns into large droplets, and the droplets flow down along the lower rod 93L. As a result, the link mechanism 97 can be efficiently cleaned.

[0110] Also, the third opening / closing mechanism 75 opens the third communication port 83. Therefore, the sprayed mist-like cleaning liquid goes around the cover member 95 and hits the surface (front surface) of the cover member 95 facing the third communication port 83 and the packing 95A. Also, when the mist-like cleaning liquid adheres to the surface of the cover member 95 and the packing 95A, it becomes large droplets of the cleaning liquid. Also, as shown by the arrow AR1, the droplets of the cleaning liquid flow down the surface of the cover member 95 and the packing 95A. Also, when the mist-like cleaning liquid adheres to the side wall 71C inside the switching box 71, it becomes large droplets of the cleaning liquid, and the droplets flow down the side wall 71C. As a result, the contact surface between the packing 95A and the side wall 71C can also be cleaned. The cleaning liquid is supplied in a concentrated manner to the link mechanism 97, the surface of the cover member 95, the packing 95A, and the like. Therefore, the contact surface between the packing 95A and the side wall 71C and the like can be efficiently cleaned.

[0111] Also, as shown in FIG. 11, when mist-like cleaning liquid is being sprayed from the three cleaning nozzles 121, 122, 123, the three opening / closing mechanisms 73, 74, 75 are operated to switch between the open states of any one of the three communication ports 81, 82, 83 in turn among the three communication ports 81, 82, 83.

[0112] At time t2, the third opening / closing mechanism 75 closes the third communication port 83, and the first opening / closing mechanism 73 opens the first communication port 81. As a result, the first opening / closing mechanism 73 is cleaned in the open state, and the opening / closing mechanisms 74 and 75 are cleaned in the closed state. The length LT between times t2 and t3 is, for example, 5 seconds. The length LT between times t3 and t4 and between times t5 and t6, etc. is also 5 seconds.

[0113] At time t3, the first opening and closing mechanism 73 closes the first communication port 81, and the second opening and closing mechanism 74 opens the second communication port 82. As a result, the second opening and closing mechanism 74 is cleaned in the open state, and the opening and closing mechanisms 73, 75 are cleaned in the closed state. Similarly, at time t4, the second opening and closing mechanism 74 closes the second communication port 82, and the third opening and closing mechanism 75 opens the third communication port 83. As a result, the third opening and closing mechanism 75 is cleaned in the open state, and the opening and closing mechanisms 73, 74 are cleaned in the closed state.

[0114] Furthermore, the operation between time t5 and t8 is the same as the operation between time t2 and t5. Furthermore, the operation between time t5 and t8 is repeated one or more times until the on-off valve V5 is closed. The repetition period (between time t5 and t8) may be omitted. Thereafter, at time t9, the on-off valve V5 is closed. This completes the cleaning operation of the three on-off mechanisms 73, 74, and 75.

[0115] Next, the discharge of the cleaning liquid will be described. A large amount of cleaning liquid is supplied into the switching box 71 by the three cleaning nozzles 121, 122, 123 and the control damper cleaning nozzle 127. As shown in FIG. 4, the inner bottom surface 71D of the switching box 71 is configured to be higher than the inner bottom surface 23D of the processing chamber 23. The bottom surface 71D is also configured to be at approximately the same height as the inner bottom surface 76D of the connection pipe 76. Therefore, the cleaning liquid collected on the bottom surface 71D in the switching box 71 flows to the bottom surface 23D in the processing chamber 23, which is lower than the bottom surface 71D in the switching box 71. In addition, it is possible to prevent the infiltration of liquids such as the cleaning liquid from the processing chamber 23 into the switching box 71. The cleaning liquid that flows to the bottom surface 23D in the processing chamber 23 is discharged from the liquid discharge pipe 53 (see FIG. 4) provided at the bottom of the processing chamber 23.

[0116] Furthermore, for example, when the third opening / closing mechanism 75 opens the third communication port 83, the cleaning liquid may be discharged from the third communication port 83. As shown in Fig. 2, a liquid discharge pipe 147 is connected to the bottoms of the three exhaust pipes 61, 62, 63 so as to be able to discharge liquid such as the processing liquid.

[0117] According to this embodiment, the first cleaning nozzle 121 is provided so as to face the link mechanism 97 of the first opening and closing mechanism 73. The first cleaning nozzle 121 also directly injects the cleaning liquid into the link mechanism 97 of the first opening and closing mechanism 73. Similarly, the second cleaning nozzle 122 is provided so as to face the link mechanism 97 of the second opening and closing mechanism 74. The second cleaning nozzle 122 also directly injects the cleaning liquid into the link mechanism 97 of the second opening and closing mechanism 74. This allows a relatively large amount of cleaning liquid to be supplied to the link mechanism 97. Therefore, at least one of the chemical solution and the crystals adhering to the link mechanism 97 can be washed away. Therefore, the link mechanism 97 (opening and closing mechanisms 73, 74) can be efficiently cleaned.

[0118] Furthermore, when the upper end of the lid member 95 is included in the spray range (spray angle) RG of the cleaning liquid, a relatively large amount of cleaning liquid can be supplied to the upper end of the lid member 95. Therefore, for example, droplets of the cleaning liquid adhering to the upper end of the lid member 95 flow down from the upper end of the lid member 95 along the lid member 95. This makes it possible to clean the lid member 95. Therefore, for example, the outer edge portion of the lid member 95 (see symbol CP in FIG. 9(a)) can be cleaned. Therefore, it is possible to prevent the opening and closing operation of the lid member 95 from being hindered.

[0119] In addition, the three cleaning nozzles 121, 122, and 123 are all attached to a nozzle attachment member 125 having a common inlet 125B. Therefore, it is not necessary to provide individual piping for the three cleaning nozzles 121, 122, and 123. This makes it possible to reduce the proportion of the space occupied by the cleaning liquid supply path in the switching box 71. In addition, the cleaning liquid supply path can be configured simply.

[0120] In addition, the cleaning liquid pipe 137 that supplies cleaning liquid to the three cleaning nozzles 121, 122, and 123 branches off from the cleaning liquid pipes 133 and 135 that supply cleaning liquid to the control damper cleaning nozzle 127. This makes it possible to reduce the proportion of the space that the cleaning liquid supply path occupies inside the switching box 71. In addition, the cleaning liquid supply path can be configured simply.

[0121] Moreover, each of the cleaning nozzles 121, 122, and 123 is composed of a single-fluid nozzle. If each of the cleaning nozzles 121, 122, and 123 is a dual-fluid nozzle, it is necessary to send gas to the dual-fluid nozzle in addition to the cleaning liquid. This requires the provision of piping for sending the gas. According to this embodiment, no piping is required for sending the gas. Example 2

[0122] Next, a second embodiment of the present invention will be described with reference to the drawings. Note that descriptions overlapping with those of the first embodiment will be omitted. Fig. 12 is a cross-sectional view showing three exhaust pipe side cleaning nozzles 161, 162, 163 according to the second embodiment provided inside three exhaust pipes 61, 62, 63. Figs. 13(a) and 13(b) are vertical cross-sectional views for explaining the cleaning operation of the first opening and closing mechanism 73 by the exhaust pipe side cleaning nozzle 161.

[0123] In the first embodiment, the three cleaning nozzles 121, 122, and 123 are provided to clean the three opening / closing mechanisms 73, 74, and 75. In this regard, in the second embodiment, three exhaust pipe side cleaning nozzles 161, 162, and 163 are further provided.

[0124] 12, the three exhaust pipe cleaning nozzles 161, 162, 163 are provided in the three exhaust pipes 61, 62, 63, respectively. That is, the first exhaust pipe cleaning nozzle 161 is provided inside the first exhaust pipe 61. The first exhaust pipe cleaning nozzle 161 is provided on the inner wall NA facing the first communication port 81. The second exhaust pipe cleaning nozzle 162 is provided inside the second exhaust pipe 62. The second exhaust pipe cleaning nozzle 162 is provided on the inner wall NA facing the second communication port 82. The third exhaust pipe cleaning nozzle 163 is provided inside the third exhaust pipe 63. The third exhaust pipe cleaning nozzle 163 is provided on the inner wall NA facing the third communication port 83.

[0125] The first exhaust pipe cleaning nozzle 161 sprays cleaning liquid in mist form onto the cover member 95 of the first opening and closing mechanism 73 through the first communication port 81. Similarly, the second exhaust pipe cleaning nozzle 162 sprays cleaning liquid onto the cover member 95 of the second opening and closing mechanism 74 through the second communication port 82. The third exhaust pipe cleaning nozzle 163 sprays cleaning liquid onto the cover member 95 of the third opening and closing mechanism 75 through the third communication port 83.

[0126] Each of the three exhaust pipe side cleaning nozzles 161, 162, 163 is configured as a one-fluid nozzle, but may be configured as a two-fluid nozzle. For example, each of the three exhaust pipe side cleaning nozzles 161, 162, 163 may be arranged facing slightly upward. This makes it easier to directly spray the mist-like cleaning liquid onto the upper end of the surface (front surface) of the lid member 95. Each of the three exhaust pipe side cleaning nozzles 161, 162, 163 may be supplied with cleaning liquid from, for example, the cleaning liquid supply source 145 through a pipe not shown. The three exhaust pipe side cleaning nozzles 161, 162, 163 spray cleaning liquid when the three cleaning nozzles 121, 122, 123 spray cleaning liquid.

[0127] The effect of this embodiment will be described. For example, the first cleaning nozzle 121 is provided inside the switching box 71. Therefore, even if the first communication port 81 is open, the first cleaning nozzle 121 may not be able to efficiently supply cleaning liquid to the surface (front surface) of the cover member 95 of the first opening / closing mechanism 73 that faces the first communication port 81. The same applies to the packing 95A. However, according to this embodiment, for example, the first exhaust pipe side cleaning nozzle 161 is provided inside the first exhaust pipe 61. Therefore, cleaning liquid can be efficiently supplied to the surface of the cover member 95 of the first opening / closing mechanism 73. The two exhaust pipe side cleaning nozzles 162, 163 have the same effect as the first exhaust pipe side cleaning nozzle 161.

[0128] The present invention is not limited to the above-described embodiment, but can be modified as follows.

[0129] (1) In each of the above-described embodiments, the bottom surface inside the switching box 71 was horizontal and not inclined. In this regard, the inner bottom surface of the switching box 71 may be inclined so that the cleaning liquid collects in the connecting pipe 76. That is, as shown in FIG. 14 , the inner bottom surface 71D of the switching box 71 has an inclined surface 71E. The inclined surface 71E is inclined so that the connecting pipe 76 side is lower. As a result, since the inner bottom surface of the switching box 71 is inclined, the cleaning liquid present on the bottom surface inside the switching box 71 can be efficiently discharged from the switching box 71 through the connecting pipe 76.

[0130] (2) In each of the above-described embodiments and modified example (1), three exhaust pipes 61, 62, and 63 are provided on the side of processing chamber 23. In this regard, two or four or more exhaust pipes may be provided on the side of processing chamber 23. That is, a plurality of exhaust pipes may be provided on the side of processing chamber 23. In this case, the same number of communication ports, opening / closing mechanisms, cleaning nozzles, exhaust pipe-side cleaning nozzles, etc. as the number of the plurality of exhaust pipes are provided.

[0131] (3) In each of the above-described embodiments and modifications, when the cleaning liquid is sprayed from the three cleaning nozzles 121, 122, 123, the three opening / closing mechanisms 73, 74, 75 are operated to switch between the open states of any one of the three communication ports 81, 82, 83 in turn among the three communication ports 81, 82, 83. In this regard, if there is no problem with the cleanliness of the processing chamber 23, all of the three communication ports 81, 82, 83 may be closed when the cleaning liquid is sprayed from the three cleaning nozzles 121, 122, 123.

[0132] (4) In the above-described embodiment and each modified example, for example as shown in Fig. 7, the distribution section 131 (i.e., the three opening and closing mechanisms 73, 74, 75) of the exhaust switching mechanism 25 is disposed between the processing chamber 23 and the three exhaust pipes 61, 62, 63. In this regard, the three exhaust pipes 61, 62, 63 may be disposed between the processing chamber 23 and the distribution section 131 (i.e., the three opening and closing mechanisms 73, 74, 75).

[0133] (5) In each of the above-described embodiments and modified examples, the side wall 71C is provided between the switching box 71 and the three exhaust pipes 61, 62, and 63. In this regard, the side wall 71C does not necessarily have to be provided.

[0134] (6) In each of the above-described embodiments and modifications, the processing chamber 23 may include a nozzle (not shown) that ejects a cleaning liquid onto the substrate W held by the holding / rotating part. The cleaning liquid (e.g., carbon dioxide water) is supplied to this nozzle from the processing liquid supply source 145. [Explanation of symbols]

[0135] 1 ... Substrate processing equipment 23 … Processing chamber 23D,71D,76D … Bottom 25 ... Exhaust switching mechanism 27 … Rotating holding part 29A, 29B, 29C … Nozzle 53…Liquid discharge pipe 61,62,63 … Exhaust pipe 71 … Switching box 71A … Ceiling wall 71E … Inclined surface 73,74,75 … Opening and closing mechanism 76 ... Connecting pipe 81, 82, 83 … Connecting port 91 ... Actuator 93 ... Rod 95 ... Lid member 95A ... Packing 97 … Link mechanism 121, 122, 123 … Cleaning nozzle 125 ... Nozzle mounting member 127 … Control damper cleaning nozzle 133,135,137 … Cleaning fluid piping 150 ... Control section 161, 162, 163 … Exhaust pipe cleaning nozzle AX5,AX6,AX7…Horizontal axis

Claims

1. A substrate processing apparatus for processing a substrate, a processing chamber having a holder for holding the substrate in a horizontal position and a chemical nozzle for discharging a chemical onto the substrate held by the holder; a plurality of exhaust pipes extending in a vertical direction and provided on the sides of the processing chamber; an exhaust switching mechanism for switching an exhaust path from the processing chamber to any one of the plurality of exhaust pipes; The exhaust switching mechanism is a switching box for connecting the processing chamber to the plurality of exhaust pipes; a plurality of opening / closing mechanisms for individually opening and closing a plurality of communication ports that individually communicate between the switching box and the plurality of exhaust pipes; a plurality of cleaning nozzles provided inside the switching box in correspondence with the plurality of opening and closing mechanisms; Each of the plurality of opening and closing mechanisms includes: An actuator provided outside the switching box; A cover member provided inside the switching box; a link mechanism provided inside the switching box, the link mechanism converting linear movement of a rod extending from the actuator into an opening and closing operation of the cover member; a cleaning nozzle for spraying a cleaning liquid onto the link mechanism of the corresponding opening / closing mechanism, the cleaning nozzle being arranged to face the link mechanism of the corresponding opening / closing mechanism, the cleaning nozzle being arranged to face the link mechanism of the corresponding opening / closing mechanism, the cleaning nozzle being arranged to spray a cleaning liquid onto the link mechanism of the corresponding opening / closing mechanism, the cleaning nozzle being arranged to face ...

2. 2. The substrate processing apparatus according to claim 1, A substrate processing apparatus characterized in that each of the plurality of cleaning nozzles sprays a cleaning liquid onto the link mechanism of the corresponding opening / closing mechanism so that the spray range of the cleaning liquid includes an upper end of the lid member of the corresponding opening / closing mechanism.

3. 3. The substrate processing apparatus according to claim 1, A substrate processing apparatus characterized in that each of the multiple opening and closing mechanisms is provided with a gasket for surrounding an outer periphery of one of the multiple communication ports, the gasket being provided on the surface of the cover member facing the one of the multiple communication ports.

4. 3. The substrate processing apparatus according to claim 1, The exhaust switching mechanism further includes a nozzle mounting member provided inside the switching box and to which the plurality of cleaning nozzles are attached, the nozzle attachment member has a cleaning liquid flow path therein for supplying the cleaning liquid; 4. The substrate processing apparatus according to claim 3, wherein the cleaning liquid flow path is branched so as to send the cleaning liquid supplied from a common inlet to the plurality of cleaning nozzles.

5. 5. The substrate processing apparatus according to claim 4, The switching box is connected to the inside of the processing chamber via a connecting pipe, The connecting pipe has an exhaust control damper therein for controlling the amount of gas flow, The exhaust switching mechanism includes: a control damper cleaning nozzle provided inside the switching box and configured to spray the cleaning liquid toward the exhaust control damper; a first cleaning liquid pipe provided inside the switching box and connected to the control damper cleaning nozzle; a second cleaning liquid pipe provided inside the switching box, the second cleaning liquid pipe branching off from the first cleaning liquid pipe and connected to the inlet of the nozzle attachment member; The substrate processing apparatus further comprises:

6. 3. The substrate processing apparatus according to claim 1, A control unit is further provided, The control unit of the substrate processing apparatus is characterized in that, when the cleaning liquid is sprayed from the multiple cleaning nozzles, the control unit operates the multiple opening and closing mechanisms to switch between an open state of any one of the multiple communication ports in sequence among the multiple communication ports.

7. 3. The substrate processing apparatus according to claim 1, a plurality of exhaust pipe side cleaning nozzles respectively provided on the inside of the plurality of exhaust pipes, the plurality of exhaust pipe side cleaning nozzles spraying the cleaning liquid onto the cover members of the plurality of opening and closing mechanisms through the plurality of communication ports.

8. 3. The substrate processing apparatus according to claim 1, The switching box is connected to the inside of the processing chamber via a connecting pipe, The substrate processing apparatus according to claim 1, wherein the inner bottom surface of the switching box is inclined so that the cleaning liquid is collected in the connecting pipe.

9. 3. The substrate processing apparatus according to claim 1, The switching box is connected to the inside of the processing chamber via a connecting pipe, 2. The substrate processing apparatus according to claim 1, wherein an inner bottom surface of the switching box is higher than an inner bottom surface of the processing chamber and is at the same height as an inner bottom surface of the connecting pipe.

10. 3. The substrate processing apparatus according to claim 1, 4. The substrate processing apparatus according to claim 1, wherein each of the plurality of cleaning nozzles is a single-fluid nozzle that sprays only the cleaning liquid.

11. 3. The substrate processing apparatus according to claim 1, 4. The substrate processing apparatus according to claim 1, wherein each of the plurality of cleaning nozzles sprays a cleaning liquid in the form of a mist.

12. a processing chamber having a holder for holding the substrate in a horizontal position and a chemical nozzle for discharging a chemical onto the substrate held by the holder; a plurality of exhaust pipes provided on sides of the processing chamber and extending in a vertical direction; an exhaust switching mechanism for switching an exhaust path from the processing chamber to one of the plurality of exhaust pipes, The exhaust switching mechanism includes: a switching box for connecting the processing chamber to the plurality of exhaust pipes; a plurality of opening / closing mechanisms for individually opening and closing a plurality of communication ports that individually communicate between the switching box and the plurality of exhaust pipes, Each of the plurality of opening and closing mechanisms includes: An actuator provided outside the switching box; A cover member provided inside the switching box; a link mechanism provided inside the switching box, the link mechanism converting a linear movement of a rod extending from the actuator into an opening and closing operation of the cover member, spraying a cleaning liquid onto the link mechanisms of the plurality of opening / closing mechanisms by a plurality of cleaning nozzles; Equipped with The maintenance method for the substrate processing apparatus, wherein the plurality of cleaning nozzles are provided inside the switching box so as to face the link mechanisms of the corresponding plurality of opening / closing mechanisms, respectively.

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