Electronic device manufacturing method and electronic device
By using specific rail connection and folding techniques in electronic devices, changing the attitude of parts and reducing volume, the room for improvement in existing electronic devices in miniaturization is solved, enabling a more compact device design.
Patent Information
- Application Number
- JP2023155197
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2023-09-21
- Publication Date
- 2025-04-03
AI Technical Summary
There is room for improvement in existing electronic devices in miniaturization.
By connecting the guide rails with specific frames and guide terminals, the attitude of the parts is changed and the guide terminals of the second guide rails are connected to the subframe, thereby achieving compactness of the electronic device.
Effectively reduce the volume of electronic equipment, improve its compactness, and avoid interference and overlap between parts.
Smart Images
Figure 2025046926000001_ABST
Abstract
Description
[Technical field]
[0001] The present invention relates to a manufacturing method of an electronic device, and to an electronic device. [Background technology]
[0002] Patent Document 1 discloses an electronic device in which three electronic components are connected to one lead frame. According to Patent Document 1, after three angular velocity sensors are connected to one lead frame, the leads connected to two electronic components are bent to orient the three electronic components in different directions. [Prior art documents] [Patent documents]
[0003] [Patent Document 1] JP 2020-136324 A Summary of the Invention [Problem to be solved by the invention]
[0004] The electronic device described in Patent Document 1 has room for improvement in terms of miniaturization. [Means for solving the problem]
[0005] A method for manufacturing an electronic device includes connecting a first component to a first lead portion of a first lead frame having a first frame portion and a first lead portion extending from the first frame portion toward an inside of the first frame portion, and changing a posture of the first component with respect to the first frame portion by bending the first lead portion in a direction intersecting a plane along which the first frame portion extends; connecting a second component to the second lead portion of a second lead frame having a second frame portion and a second lead portion extending from the second frame portion toward the inside of the second frame portion, and changing a posture of the first component with respect to the first frame portion by bending the first lead portion in a direction intersecting a plane along which the second frame portion extends; changing the attitude of the second component relative to the second frame portion by bending the second lead portion in a direction intersecting the first frame portion; electrically connecting the first lead portion to the substrate via a bonding member while the first frame portion is stacked on the substrate; stacking the second frame portion on the first frame portion while the first component is inserted inside the second frame portion, and then electrically connecting the second lead portion to the substrate via a bonding member; cutting the first lead portion from the first frame portion; and cutting the second lead portion from the second frame portion.
[0006] The electronic device includes a substrate having a substrate surface, a first lead portion connected to the substrate surface of the substrate and bent in a direction intersecting the substrate surface, a support portion connected to the substrate surface of the substrate and positioned outside an area overlapping with the first lead portion in a planar view, a second lead portion connected to the substrate via the support portion and bent in a direction intersecting the substrate surface, a first component connected to a portion of the first lead portion extending in a direction intersecting the substrate surface, and a second component connected to a portion of the second lead portion extending in a direction intersecting the substrate surface. [Brief description of the drawings]
[0007] [Figure 1] FIG. 1 is a perspective view showing an electronic device. [Diagram 2] FIG. [Diagram 3] FIG. [Figure 4] FIG. 1 is a perspective view showing an electronic device. [Diagram 5] FIG. 2 is a plan view showing a first lead frame. [Figure 6] FIG. 4 is a plan view showing a second lead frame. [Figure 7] FIG. 4 is a bottom view showing the first lead frame and the electronic component. [Figure 8] FIG. 4 is a bottom view showing the second lead frame and the electronic component. [Figure 9] FIG. [Figure 10] FIG. 4 is a perspective view illustrating bending of the first lead frame. [Figure 11] FIG. 4 is a perspective view illustrating bending of a second lead frame. [Figure 12] 1A to 1C are perspective views illustrating a method for manufacturing an electronic device. [Figure 13] 1A to 1C are perspective views illustrating a method for manufacturing an electronic device. [Figure 14] FIG. 2 is a plan view showing a state in which a substrate, a first lead frame, and a second lead frame are stacked. [Figure 15] 1A to 1C are perspective views illustrating a method for manufacturing an electronic device. [Figure 16] 15 is a cross-sectional view taken along line AA in FIG. 14 . [Figure 17] FIG. 11 is a plan view showing another example of the first lead frame. [Figure 18] 15 is a cross-sectional view of the substrate, another example of the first lead frame, and the second lead frame taken along line AA in FIG. 14. [Figure 19] FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0008] As shown in FIG. 1, the electronic device 1 has a substrate 2 and a cap 3. The cap 3 is overlaid on the substrate 2. The substrate 2 may be made of a paper phenol substrate or a glass epoxy substrate. In this embodiment, the substrate 2 is made of a glass epoxy substrate. The cap 3 is a molded part made of a resin material. The cap 3 may be made of an epoxy resin or the like.
[0009] In Fig. 1, an X-axis, a Y-axis, and a Z-axis are indicated. The X-axis, the Y-axis, and the Z-axis are mutually orthogonal coordinate axes. The X-axis, the Y-axis, and the Z-axis are also indicated as necessary in the figures shown in Fig. 1 and subsequent figures. In this case, the X-axis, the Y-axis, and the Z-axis in each figure correspond to the X-axis, the Y-axis, and the Z-axis in Fig. 1. Fig. 1 shows a state in which an electronic device 1 is placed on an XY plane defined by the X-axis and the Y-axis.
[0010] In the following, when the X-axis, Y-axis, and Z-axis are indicated in the diagrams or explanations showing components or units of the electronic device 1, they refer to the X-axis, Y-axis, and Z-axis in a state where the components or units are incorporated into the electronic device 1. The X-axis, Y-axis, and Z-axis are each indicated with an arrow. For each of the X-axis, Y-axis, and Z-axis, the direction of the arrow indicates the + (positive) direction, and the direction opposite to the arrow indicates the - (negative) direction. The Z-axis is an axis perpendicular to the XY plane. A plan view is a view of the electronic device 1 as viewed in the -Z direction.
[0011] 2, the electronic device 1 includes a plurality of electronic components 4. In this embodiment, the electronic device 1 includes three electronic components 4. Hereinafter, when the three electronic components 4 are individually identified, the three electronic components 4 are referred to as electronic component 4A, electronic component 4B, and electronic component 4C, respectively. The three electronic components 4 are each mounted on a first surface 5A of the substrate 2. The first surface 5A is an example of a substrate surface.
[0012] In this embodiment, the electronic component 4A and the electronic component 4B each have one built-in angular velocity sensor. The electronic component 4C has one built-in angular velocity sensor and three acceleration sensors. The angular velocity sensor detects angular velocity. A gyro sensor can be used as the angular velocity sensor. The angular velocity sensor built into the electronic component 4A detects angular velocity around the X-axis. The angular velocity sensor built into the electronic component 4B detects angular velocity around the Y-axis. The electronic component 4A is an example of a first component. The electronic component 4B is an example of a second component. The electronic component 4C is an example of a third component.
[0013] The angular velocity sensor built into the electronic component 4C detects the angular velocity around the Z-axis. One of the three acceleration sensors built into the electronic component 4C detects the acceleration in the direction along the X-axis. Another of the three acceleration sensors built into the electronic component 4C detects the acceleration in the direction along the Y-axis. Yet another of the three acceleration sensors built into the electronic component 4C detects the acceleration in the direction along the Z-axis. In other words, the electronic device 1 is a composite sensor that integrates a three-axis angular velocity sensor and a three-axis acceleration sensor into one package. Such a composite sensor is also called a 6DoF (Degrees of Freedom) sensor.
[0014] Of the three electronic components 4, electronic component 4A and electronic component 4B are each mounted on the first surface 5A of the substrate 2 via a plurality of leads 8. Electronic component 4A is electrically connected to lead 8A of the plurality of leads 8. Electronic component 4B is electrically connected to lead 8B of the plurality of leads 8. In other words, the lead 8 that is electrically connected to electronic component 4A among the plurality of leads 8 is called lead 8A. The lead 8 that is electrically connected to electronic component 4B among the plurality of leads 8 is called lead 8B. When the lead 8 that is electrically connected to electronic component 4A and the lead 8 that is electrically connected to electronic component 4B are to be distinguished from each other, they are distinguished as lead 8A and lead 8B. Lead 8A is an example of a first lead portion. Lead 8B is an example of a second lead portion.
[0015] As shown in FIG. 3, each of the leads 8 includes a board-side terminal 11 and a component-side terminal 12. The board-side terminal 11 extends along the first surface 5A of the substrate 2. The board-side terminal 11 is a portion that is joined to the first surface 5A of the substrate 2. The board-side terminal 11 is thicker than other portions of the lead 8. That is, in a plan view in a direction perpendicular to the surface on which the frame 18 extends, at least a part of a portion of the lead 8 that overlaps with the substrate 2 is thicker than other portions. The component-side terminal 12 extends along a plane that intersects with the first surface 5A of the substrate 2. The component-side terminal 12 of the lead 8A extends along the YZ plane. That is, the component-side terminal 12 of the lead 8A intersects with the X-axis. The component-side terminal 12 of the lead 8B extends along the XZ plane. That is, the component-side terminal 12 of the lead 8B intersects with the Y-axis. Lead 8 is bent from substrate-side terminal 11 in a direction intersecting first surface 5A of substrate 2.
[0016] The electronic component 4C has a terminal electrode (not shown) formed on its bottom surface facing the -Z direction. A plurality of pad electrodes (not shown) are formed on the first surface 5A of the substrate 2. The terminal electrodes of the electronic component 4C are electrically connected to the plurality of pad electrodes formed on the first surface 5A of the substrate 2. The substrate side terminals 11 of the plurality of leads 8 are also electrically connected to the plurality of pad electrodes formed on the first surface 5A of the substrate 2. The plurality of pad electrodes formed on the first surface 5A of the substrate 2 are electrically connected to a plurality of via wirings (not shown) formed on the substrate 2. The plurality of via wirings formed on the substrate 2 penetrate from the first surface 5A to the second surface 5B. The second surface 5B corresponds to the back surface of the first surface 5A.
[0017] 4, a plurality of terminal electrodes 13 are formed on the second surface 5B of the substrate 2. The plurality of terminal electrodes 13 are each electrically connected to via wiring (not shown) of the substrate 2. That is, the three electronic components 4 are each electrically connected to the plurality of terminal electrodes 13 of the substrate 2. By transmitting and receiving various signals to and from the electronic components via the plurality of terminal electrodes 13, it is possible to obtain data on angular velocity and acceleration.
[0018] The manufacturing method of the electronic device 1 includes preparing a lead frame. The lead frame is a component for mounting the electronic component 4. The lead frame is a sheet metal member made of a material including metals such as copper, aluminum, and iron. The lead frame can be formed by stamping, etching, or the like. The electronic component 4 is joined to the lead frame by a conductive joining member such as solder. The pad electrode of the electronic component 4 is electrically connected to the lead frame. The manufacturing method of the electronic device 1 includes preparing two types of lead frames. The two types of lead frames are called a first lead frame 15 and a second lead frame 16, respectively. The first lead frame 15 is a lead frame for mounting the electronic component 4A. The second lead frame 16 is a lead frame for mounting the electronic component 4B.
[0019] As shown in FIG. 5, the first lead frame 15 has a frame 18 and a plurality of leads 8A. The first lead frame 15 has a first surface 21A facing the Z direction. A plurality of openings 22 are formed in the frame 18. The openings 22 penetrate the frame 18 along the Z axis. In the example shown in FIG. 5, five openings 22 are formed in the frame 18. The five openings 22 are aligned along the X axis. The frame 18 is an example of a first frame portion.
[0020] A plurality of leads 8A are connected to the frame 18 on the inside of each opening 22. The plurality of leads 8A extend in the +X direction from a portion of the frame 18 extending along the Y axis toward the inside of each opening 22. One electronic component 4A is mounted on the plurality of leads 8A connected to one opening 22. The number of openings 22 formed in the frame 18 is not limited to five. The number of openings 22 formed in the frame 18 can be any number equal to or greater than one.
[0021] As shown in FIG. 6, the second lead frame 16 has a frame 19 and a plurality of leads 8B. The second lead frame 16 has a first surface 25A facing the Z direction. A plurality of openings 26 are formed in the frame 19. The openings 26 penetrate the frame 19 along the Z axis. In the example shown in FIG. 6, five openings 26 are formed in the frame 19. The five openings 26 are aligned along the X axis. The frame 19 is an example of a second frame portion.
[0022] A plurality of leads 8B are connected to the frame 19 inside each of the openings 26. The plurality of leads 8B extend in the -Y direction from a portion of the frame 19 extending along the X-axis toward the inside of each of the openings 26. One electronic component 4B is mounted on the plurality of leads 8B connected to one opening 26. The number of openings 26 formed in the frame 19 is not limited to five. The number of openings 26 formed in the frame 19 can be any number equal to or greater than one.
[0023] The manufacturing method of the electronic device 1 includes mounting the electronic component 4 on a lead frame. Mounting the electronic component 4 on the lead frame includes mounting the electronic component 4A on the first lead frame 15 as shown in FIG. 7. The electronic component 4A is mounted on the second surface 21B of the first lead frame 15. The second surface 21B faces the -Z direction. The second surface 21B is the back surface of the first surface 21A shown in FIG. 5. As shown in FIG. 7, the electronic components 4A are mounted on each of the openings 22 of the first lead frame 15. In the example shown in FIG. 7, five electronic components 4A are mounted on one first lead frame 15. The electronic components 4A are electrically connected to the component-side terminals 12 of the multiple leads 8A shown in FIG. 3 by a conductive joining member such as solder.
[0024] Mounting the electronic component 4 on the lead frame includes mounting the electronic component 4B on the second lead frame 16, as shown in FIG. 8. The electronic component 4B is mounted on the second surface 25B of the second lead frame 16. The second surface 25B faces the -Z direction. The second surface 25B is the back surface of the first surface 25A shown in FIG. 6. As shown in FIG. 8, the electronic components 4B are mounted in each opening 26 of the second lead frame 16. In the example shown in FIG. 8, five electronic components 4B are mounted on one second lead frame 16. The electronic components 4B are electrically connected to the component-side terminals 12 of the multiple leads 8B shown in FIG. 3 by a conductive joining member such as solder.
[0025] As shown in Fig. 9, the manufacturing method of the electronic device 1 includes mounting electronic components 4C on a substrate 2M. The substrate 2M has a configuration in which a plurality of substrates 2 are connected together. The substrate 2M is divided into a plurality of substrates 2. In the example shown in Fig. 9, five electronic components 4C are mounted on the substrate 2M. The five electronic components 4C are mounted on a first surface 5A of the substrate 2M.
[0026] The manufacturing method of the electronic device 1 includes bending the lead frame on which the electronic component 4 is mounted. Bending the lead frame includes bending a first lead frame 15 on which the electronic component 4A is mounted, as shown in Fig. 10. The first lead frame 15 can be bent by a press machine using a bending die or the like. In the first lead frame 15 on which the electronic component 4A is mounted, the multiple leads 8A are bent for each opening 22.
[0027] The multiple leads 8A are bent in a direction intersecting the XY plane on which the frame 18 extends. The multiple leads 8A are bent in the +Z direction with respect to the XY plane on which the frame 18 extends, leaving the board-side terminals 11. The posture of the electronic component 4A with respect to the frame 18 can be changed by performing a bending process on the first lead frame 15. By changing the posture of the electronic component 4A with respect to the frame 18, the area of the electronic component 4A that occupies the region inside the opening 22 in a plan view can be reduced. As a result, the region of the opening 22 can be expanded in a plan view. The first surface 21A and the second surface 21B of the first lead frame 15 are the surfaces on which the frame 18 extends.
[0028] Bending the lead frame includes bending the second lead frame 16 on which the electronic component 4B is mounted, as shown in Fig. 11. The second lead frame 16 can be bent by a press using a bending die or the like. In the second lead frame 16 on which the electronic component 4B is mounted, the multiple leads 8B are bent for each opening 26.
[0029] The multiple leads 8B are bent in a direction intersecting the XY plane on which the frame 19 extends. The multiple leads 8B are bent in the +Z direction with respect to the XY plane on which the frame 19 extends, leaving the board-side terminals 11. The posture of the electronic component 4B with respect to the frame 19 can be changed by performing a bending process on the second lead frame 16. By changing the posture of the electronic component 4B with respect to the frame 19, the area of the electronic component 4B that occupies the region inside the opening 26 in a plan view can be reduced. As a result, the region of the opening 26 can be expanded in a plan view. The first surface 25A and the second surface 25B of the second lead frame 16 are the surfaces on which the frame 19 extends.
[0030] The manufacturing method of the electronic device 1 includes stacking a substrate 2M on which electronic components 4 are mounted and a bent lead frame. Stacking the substrate 2M and the bent lead frame includes stacking a first lead frame 15 in the +Z direction of the substrate 2M, as shown in Fig. 12. When the first lead frames 15 are stacked in the +Z direction of the substrate 2M, an electronic component 4C is positioned inside an opening 22 of the first lead frame 15. In other words, the first lead frames 15 are stacked in the +Z direction of the substrate 2M with one electronic component 4C inserted in one opening 22 of the first lead frame 15.
[0031] When the first lead frame 15 is stacked in the +Z direction of the substrate 2M, the electronic components 4A and 4C do not come into contact with each other. When the first lead frame 15 and the substrate 2M are stacked before bending the first lead frame 15, the electronic components 4A and 4C overlap each other. When the first lead frame 15 and the substrate 2M are stacked before bending the first lead frame 15, the electronic components 4A and 4C interfere with each other. By bending the first lead frame 15, interference between the electronic components 4A and 4C can be avoided.
[0032] Stacking the substrate 2M and the bent lead frame includes stacking the second lead frame 16 in the +Z direction of the first lead frame 15, as shown in Fig. 13. As shown in Fig. 12, the first lead frame 15 and the second lead frame 16 are each formed with a positioning hole 28. When the first lead frame 15 and the second lead frame 16 are stacked, they are stacked based on both positioning holes 28. The positioning holes 28 can improve the positional accuracy of the second lead frame 16 relative to the first lead frame 15.
[0033] 13, when the second lead frames 16 are stacked in the +Z direction of the first lead frames 15, the electronic component 4C is located inside the opening 26 of the second lead frames 16. That is, the second lead frames 16 are stacked in the +Z direction of the first lead frames 15 with one electronic component 4C inserted into one opening 26 of the second lead frames 16. When the second lead frames 16 are stacked in the +Z direction of the first lead frames 15, the electronic component 4A is located inside the opening 26 of the second lead frames 16. That is, the second lead frames 16 are stacked in the +Z direction of the first lead frames 15 with one electronic component 4A inserted into one opening 26 of the second lead frames 16.
[0034] FIG. 14 is a plan view showing a state where the substrate 2M, the first lead frame 15, and the second lead frame 16 are stacked. As shown in FIG. 14, when the second lead frame 16 is stacked in the +Z direction of the first lead frame 15, the electronic components 4B and 4C do not contact each other. When the first lead frame 15 and the second lead frame 16 are stacked before the second lead frame 16 is bent, the electronic components 4B and 4C are stacked. When the first lead frame 15 and the second lead frame 16 are stacked before the second lead frame 16 is bent, the electronic components 4B and 4C interfere with each other. By bending the second lead frame 16, the interference between the electronic components 4B and 4C is avoided.
[0035] Furthermore, when the second lead frame 16 is stacked in the +Z direction of the first lead frame 15, the electronic components 4A and 4B do not come into contact with each other. When the first lead frame 15 and the second lead frame 16 are stacked before bending the second lead frame 16, the electronic components 4A and 4B overlap each other. When the first lead frame 15 and the second lead frame 16 are stacked before bending the second lead frame 16, the electronic components 4A and 4B interfere with each other. By bending the second lead frame 16, interference between the electronic components 4A and 4B can be avoided.
[0036] Furthermore, when the first lead frame 15 and the second lead frame 16 are overlapped before both the first lead frame 15 and the second lead frame 16 are bent, the electronic components 4A and 4B overlap each other. When the first lead frame 15 and the second lead frame 16 are overlapped before both the first lead frame 15 and the second lead frame 16 are bent, the electronic components 4A and 4B interfere with each other. By bending both the first lead frame 15 and the second lead frame 16, interference between the electronic components 4A and 4B can be avoided.
[0037] The manufacturing method of the electronic device 1 includes joining the first lead frame 15 and the second lead frame 16 to the substrate 2M. Joining the first lead frame 15 and the second lead frame 16 to the substrate 2M corresponds to electrically connecting the first lead frame 15 and the second lead frame 16 to pad electrodes (not shown) of the substrate 2M. The substrate side terminals 11 of the first lead frame 15 and the second lead frame 16 are joined to the pad electrodes of the substrate 2M by solder reflow.
[0038] The manufacturing method of the electronic device 1 includes covering the electronic component 4 with resin. Covering the electronic component 4 with resin corresponds to molding a cap 3M with resin in the +Z direction of the second lead frame 16, as shown in FIG. 15. The cap 3M has a configuration in which a plurality of caps 3 are connected together. The cap 3M is divided into a plurality of caps 3. Molding the cap 3M with resin in the +Z direction of the second lead frame 16 can be performed by an injection molding machine using a mold die or the like.
[0039] The method of manufacturing the electronic device 1 includes cutting a plurality of leads 8 from a lead frame. Cutting the plurality of leads 8 from the lead frame includes cutting a plurality of first leads 8A from a frame 18 of a first lead frame 15 shown in Fig. 10. Cutting the plurality of leads 8 from the lead frame includes cutting a plurality of second leads 8B from a frame 19 of a second lead frame 16 shown in Fig. 11.
[0040] Cutting the leads 8 from the lead frame is performed by dividing the electronic device 1M shown in FIG. 15 into a plurality of electronic devices 1. The electronic device 1M has a plurality of first leads 8A connected to the frame 18 of the first lead frame 15 and a plurality of second leads 8B connected to the frame 19 of the second lead frame 16. In the example shown in FIG. 15, five electronic devices 1 are connected to the electronic device 1M. In the example shown in FIG. 15, the leads 8 are cut from the lead frame by dividing the five electronic devices 1 from the electronic device 1M. That is, in the example shown in FIG. 15, the leads 8 are cut from the lead frame by dividing the five electronic devices 1 from the electronic device 1M. The electronic device 1 shown in FIG. 1 is manufactured by dividing the five electronic devices 1 from the electronic device 1M.
[0041] The electronic device 1M can be divided into five electronic devices 1 by a press using a cutting die or the like. When one opening 22 is formed in the first lead frame 15 and one opening 26 is formed in the second lead frame 16, one electronic device 1 is cut from one electronic device 1M. Cutting one electronic device 1 from one electronic device 1M also corresponds to dividing the electronic device 1 into individual electronic devices 1 from the electronic device 1M.
[0042] FIG. 16 is a cross-sectional view taken along line AA in FIG. 14. As shown in FIG. 16, the first lead frame 15 is interposed between the substrate 2M and the second lead frame 16. In FIG. 16, the electronic component 4C is omitted from illustration. In this embodiment, the edge of the opening 22 of the first lead frame 15 and the edge of the opening 26 of the second lead frame 16 overlap each other. Therefore, a gap of the thickness of the first lead frame 15 is generated between the lead 8B of the second lead frame 16 and the substrate 2M. When the second lead frame 16 is joined to the substrate 2M, the gap between the lead 8B and the substrate 2M can be filled with a joining material such as solder to join the lead 8B to the pad electrode of the substrate 2M.
[0043] In the above structure, the leads 8B and the electronic component 4B are supported by a joint member such as solder. A structure can be adopted in which a support member other than a joint member such as solder is interposed between the substrate 2M and the leads 8B. This structure can more stably support the leads 8B and the electronic component 4B. This structure can be realized, for example, by adopting a first lead frame 31 shown in FIG. 17. The first lead frame 31 has a plurality of support parts 32 for each opening 22. The first lead frame 31 has the same configuration as the first lead frame 15 shown in FIG. 5, except for the presence of the plurality of support parts 32. For this reason, the same components of the first lead frame 31 as those of the first lead frame 15 are denoted by the same reference numerals as those of the first lead frame 15, and detailed description thereof will be omitted.
[0044] As shown in FIG. 17, in each opening 22, the multiple support parts 32 extend in the −Y direction from a portion of the frame 18 that extends along the X-axis toward the inside of the opening 22. In each opening 22, the multiple support parts 32 are arranged along the X-axis. When the second lead frame 16 is stacked on the first lead frame 31, the multiple support parts 32 overlap the multiple leads 8B. The multiple support parts 32 are provided at positions that overlap the multiple leads 8B. The electronic component 4A is mounted on the first lead frame 31. The first lead frame 31 on which the electronic component 4A is mounted is bent. When the second lead frame 16 on which the electronic component 4B is mounted is stacked on the first lead frame 31 that has been bent, the support parts 32 are interposed between the lead 8B and the substrate 2M as shown in FIG. In FIG. 18, the electronic component 4C is not shown.
[0045] When the first lead frame 31 and the second lead frame 16 are electrically connected to pad electrodes (not shown) of the substrate 2M, the multiple support portions 32 are connected to the pad electrodes of the substrate 2M by a joining member such as solder. When the second lead frame 16 is joined to the substrate 2M, the multiple leads 8B are connected to the multiple support portions 32 by a joining member such as solder. This allows the second lead frame 16 to be electrically connected to the substrate 2M. When the second lead frame 16 is joined to the substrate 2M, the multiple leads 8B are electrically connected to the pad electrodes of the substrate 2M with the multiple support portions 32 interposed between the multiple leads 8B and the substrate 2M.
[0046] Next, the electronic component 4 is covered with resin, and then the leads 8 are cut from the lead frame. Cutting the leads 8 from the lead frame includes cutting the first leads 8A and the supporting parts 32 from the frame 18 of the first lead frame 31 shown in FIG. 17. Cutting the leads 8 from the lead frame includes cutting the second leads 8B from the frame 19 of the second lead frame 16 shown in FIG. 11. This allows the manufacture of an electronic device 1 having a plurality of supporting parts 32, as shown in FIG. 19. At least a part of the part of each lead 8B overlapping the supporting part 32 is a board-side terminal 11 that is thicker than the other parts. That is, in a plan view perpendicular to the plane on which the frame 18 extends, at least a part of the part of the lead 8B overlapping the supporting part 32 is thicker than the other parts. This configuration makes it easier to bring each lead 8B into contact with the supporting part 32, thereby reducing the contact resistance.
[0047] It is also possible to adopt a configuration in which the electronic component 4C is omitted from the electronic device 1 described above. That is, the first lead frame 15, the first lead frame 31, and the second lead frame 16 described above can also be applied to an electronic device 1 that does not include the electronic component 4C. In the case of an electronic device 1 that does not include the electronic component 4C, covering the electronic component 4 with resin is equivalent to covering the electronic components 4A and 4B with resin. In an electronic device 1 that does not include the electronic component 4C, the openings 22 and 26 can be narrower than in an electronic device 1 that includes the electronic component 4C.
[0048] In the above-described electronic device 1, a configuration in which the substrate 2M, the first lead frame 15, and the second lead frame 16 are stacked in this order is exemplified. However, the stacking order of the substrate 2M, the first lead frame 15, and the second lead frame 16 is not limited to this. In the electronic device 1, a configuration in which the substrate 2M, the second lead frame 16, and the first lead frame 15 are stacked in this order can also be applied.
[0049] In the above-described electronic device 1, a configuration in which the first lead frame 31 has a plurality of supporting portions 32 is exemplified. In the electronic device 1, a configuration in which the second lead frame 16 has a plurality of supporting portions 32 can also be applied. In the configuration in which the second lead frame 16 has a plurality of supporting portions 32, a configuration in which the substrate 2M, the second lead frame 16, and the first lead frame 15 are laminated in this order is adopted. [Explanation of symbols]
[0050] 1...electronic device, 1M...electronic device, 2...substrate, 2M...substrate, 3...cap, 3...cap, 4...electronic component, 4A...electronic component, 4B...electronic component, 4C...electronic component, 5A...first surface, 5B...second surface, 8...lead, 8A...first lead, 8B...second lead, 11...substrate side terminal, 12...component side terminal, 13...terminal electrode, 15...first lead frame, 16...second lead frame, 18...frame, 19...frame, 21A...first surface, 21B...second surface, 22...opening, 25A...first surface, 25B...second surface, 26...opening, 28...positioning hole, 31...first lead frame, 32...support portion.
Claims
1. a first lead frame having a first frame portion and a first lead portion extending from the first frame portion toward an inside of the first frame portion, a first component being connected to the first lead portion, and a posture of the first component relative to the first frame portion being changed by bending the first lead portion in a direction intersecting a plane along which the first frame portion extends; a second lead frame having a second frame portion and a second lead portion extending from the second frame portion toward an inside of the second frame portion, a second component is connected to the second lead portion, and a posture of the second component with respect to the second frame portion is changed by bending the second lead portion in a direction intersecting a plane in which the second frame portion extends; electrically connecting the first lead portion to the substrate via a bonding member in a state in which the first frame portion is laminated on the substrate; laminating the second frame portion on the first frame portion in a state in which the first component is inserted inside the second frame portion, and then electrically connecting the second lead portion to the substrate via a bonding member; cutting the first lead portion from the first frame portion; and cutting the second lead portion from the second frame portion. A method for manufacturing an electronic device.
2. the first lead frame has a support portion extending from the first frame portion toward an inside of the first frame portion at a position overlapping the second lead portion, When the second lead portion is electrically connected to the substrate via a bonding member, the support portion is interposed between the substrate and the second lead portion. The method for manufacturing an electronic device according to claim 1 .
3. In a plan view in a direction perpendicular to a plane along which the first frame portion extends, at least a portion of the second lead portion overlapping the support portion is thicker than other portions of the second lead portion. The method for producing an electronic device according to claim 2 .
4. In a plan view in a direction perpendicular to a plane along which the first frame portion extends, at least a portion of the first lead portion that overlaps the substrate is thicker than other portions of the first lead portion. The method for manufacturing an electronic device according to claim 1 .
5. mounting a third component on the substrate; When stacking the first frame portion on the substrate, the first frame portion is stacked on the substrate in a state in which the third component is inserted inside the first frame portion; When stacking the second frame portion on the first frame portion, the second frame portion is stacked on the first frame portion in a state in which the third component is inserted inside the second frame portion. The method for manufacturing an electronic device according to claim 1 .
6. The method further includes covering the first component and the second component with resin before cutting the first lead portion from the first frame portion and before cutting the second lead portion from the second frame portion. The method for manufacturing an electronic device according to claim 1 .
7. a substrate having a substrate surface; a first lead portion connected to the board surface of the board and bent in a direction intersecting the board surface; a support portion connected to the board surface of the board and positioned outside a region overlapping with the first lead portion in a plan view; a second lead portion connected to the substrate via the support portion and bent in a direction intersecting with a surface of the substrate; a first component connected to a portion of the first lead portion that extends in a direction intersecting with the substrate surface; a second component connected to a portion of the second lead portion that extends in a direction intersecting the substrate surface; Electronic devices.
Citation Information
Patent Citations
Method for manufacturing electronic device
JP2020136324A