Manufacturing method of heat dissipation member, metal mold, and product of the same
The method of using a specially designed mold and pressurized rotating shaft to bond copper and aluminum particles addresses the inefficiencies in manufacturing copper-based heat dissipation fins, resulting in a more efficient, energy-saving, and environmentally friendly process.
Patent Information
- Application Number
- JP2024006444
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2023-09-22
- Filing Date
- 2024-01-19
- Publication Date
- 2025-04-04
- Estimated Expiration
- 2044-01-19
AI Technical Summary
Existing methods for manufacturing heat dissipation fins from copper metals or copper alloys are inefficient, energy-intensive, and prone to uneven plastic flow, making it difficult to achieve precise dimensions and effective heat dissipation.
A method involving a mold with a specific cavity design and a pressurized rotating shaft is used to mix and bond copper and aluminum material particles, allowing for plastic deformation and crystal lattice defects to form, which facilitates bonding and molding of the heat dissipation member.
This method simplifies the manufacturing process, reduces energy consumption, and enables the use of recycled materials, resulting in a heat dissipation member with improved material strength and environmental sustainability.
Smart Images

Figure 2025051567000001_ABST
Abstract
Description
[Technical field]
[0001] The present invention relates to a method for producing a heat dissipation member for an electric device. [Background technology]
[0002] With the progress of science and technology and the widespread use of electronic devices, the working efficiency of electronic devices has become one of the main requirements pursued by related manufacturers and users. The heat dissipation effect during the operation of the electronic devices is also emphasized, and heat dissipation fins made of heat dissipation metal with good thermal conductivity are often seen in the electronic devices.
[0003] The heat sink fins are generally made by extrusion molding, which involves extruding heat sink metal at high temperature and shaping the heat sink metal to fit the cavity of a mold. However, this method is limited to heat sink metals (such as aluminum metal) that are easy to mold, and copper metal and copper alloys, which are often used to manufacture electronic components and precision micro molded components, are not suitable for manufacturing using this method due to their difficult-to-process material properties.
[0004] When making heat sink fins from copper metal material, the die casting method is required, in which the heat sink metal is heated and melted, poured into a mold, and cooled to form the shape. However, this method is not only time-consuming but also consumes a lot of energy. Alternatively, the forging method is used, but when the heat sink component of the fin is formed by the forging method, unevenness in the height of the fin is likely to occur due to uneven plastic flow, and subsequent finishing of the external dimensions of the product is required by more machining. Therefore, the development of heat sink fins made of copper metal or copper alloy is a development goal for related industries. Summary of the Invention [Problem to be solved by the invention]
[0005] In order to develop a heat dissipation fin made of copper metal or copper alloy, the present invention provides a manufacturing method of a heat dissipation member, a mold and a product thereof. [Means for solving the problem]
[0006] The present invention provides a method for manufacturing a heat dissipation member, comprising the steps of: preparing a mold, forming a mold cavity therein, the mold cavity having a mold opening formed on one side of the mold, the mold cavity including a substrate portion, a central portion communicating between the substrate portion and the mold opening, and a plurality of fin portions formed by being radially recessed and surrounding a groove wall in a groove in the central portion, and the radial extension range of the substrate portion covering the radial extension range of the central portion; placing a substrate within the substrate portion; uniformly mixing the particles of the same material and the particles of an aluminum material to form mixed particles, which are then disposed in the mold cavity; A step of inserting a pressurizing rotary shaft into the mold cavity from the mold opening and rotating the axis of the pressurizing rotary shaft while moving the pressurizing rotary shaft in the axial direction of the central portion; removing the mold to form a heat dissipation member; Includes.
[0007] In the method for manufacturing a heat dissipation member of the present invention, a maximum distance by which the pressurizing rotation shaft is inserted into the central portion is smaller than a length of the central portion.
[0008] In the method for manufacturing a heat dissipation member of the present invention, a thickness distance of each of the fin portions in a direction toward the die opening becomes thinner from the central portion toward the end of the fin portion.
[0009] The present invention further provides a mold for manufacturing a heat dissipation member, the mold cavity being formed therein, the mold cavity having a mold opening formed on one side of the mold, the cavity including a substrate portion, a central portion communicating between the substrate portion and the mold opening, and a plurality of fin portions formed radially recessed around a groove wall in a groove in the central portion, the radial extension range of the substrate portion covering the radial extension range of the central portion.
[0010] In the mold of the present invention, the thickness distance of each of the fin portions in the direction toward the mold opening becomes thinner from the central portion toward the end of the fin portion.
[0011] The present invention further provides a heat dissipation member manufactured by the above method, the heat dissipation member including a substrate, a center pillar extending and protruding from one side of the substrate, and a plurality of fins arranged at intervals from a free end of the center pillar toward the substrate and extending radially in a sheet-like manner to surround the surface of the center pillar.
[0012] In the heat dissipation member of the present invention, the material of at least a portion of the substrate is copper metal or aluminum metal.
[0013] In the heat dissipation member of the present invention, the material of at least a portion of the substrate is the copper material particles, the aluminum material particles, or a mixture of the above materials.
[0014] In the heat dissipation member of the present invention, a bonding surface is formed between the center pillar and the substrate. Effect of the Invention
[0015] The manufacturing method of the heat dissipation element provided by the present invention only requires the axial movement of the pressurized rotary shaft in the mold cavity and the generation of high friction and extrusion force by pre-pressure, which allows the aluminum material particles and the copper material particles to form plastic deformation and crystal lattice defects, reduce the interface bonding energy, and fill and diffuse with each other, achieving the effect of bonding and forming different materials of the heat dissipation component, overcoming the problem of the difficulty of processing and synthesizing copper and aluminum materials in the conventional process. In addition, the manufacturing method provided by the present invention has simple steps, reduces energy consumption, and the copper material particles and aluminum material particles can also be selected as recycled materials, which can be reused and has an environmentally friendly effect. [Brief description of the drawings]
[0016] [Figure 1]FIG. 1 is an illustration of a product according to a preferred embodiment of the present invention. [Diagram 2] FIG. 1 is a diagram illustrating a simulation of a manufacturing process according to a preferred embodiment of the present invention. [Diagram 3] 1 is a cross-sectional view of a product according to a preferred embodiment of the present invention; [Figure 4] FIG. 2 is a cross-sectional view of a mold according to a preferred embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0017] 1 and 3, a preferred embodiment of a heat dissipation member 10 provided by the present invention includes a substrate 11, a center pillar 12, and a plurality of heat dissipation fins 13. The substrate 11 is a plate material, the center pillar 12 is hollow and protrudes from one side of the substrate 11, and the heat dissipation fins 13 are spaced apart from each other from a free end of the center pillar 12 toward the substrate 11, and extend radially in a sheet shape to surround the surface of the center pillar 12.
[0018] Next, referring to Figure 2, the substrate 11, the center pillar 12 and the multiple heat dissipation fins 13 are formed by mixing copper material particles 21 and aluminum material particles 22 and then molding them in a mold 30, and a mold cavity 31 is configured within the mold 30, and the mold cavity 31 forms a mold opening 32 on one side of the mold 30, and the mold cavity 31 is molded to correspond to the heat dissipation member 10, and the inside of the mold cavity 31 includes, in order toward the mold opening 32, a substrate portion 311, a central portion 312 and multiple fin portions 313.
[0019] Here, the so-called "copper material" in the present invention refers to the copper material in which the metallic element contained most abundantly is copper. Preferably, the copper material particles are pure copper with a copper content of 90% or more. The so-called "aluminum material" in the present invention refers to the aluminum material in which the metallic element contained most abundantly is aluminum. The so-called "particle" in the present invention refers to a particle having a maximum equivalent spherical diameter of less than 10 mm, and the particle may be sheet-shaped, needle-shaped, strip-shaped, spherical, or any irregular shape.
[0020] The aluminum material particles 22 may comprise recycled aluminum material, and the copper material particles 21 may also comprise recycled copper material.
[0021] Here, the so-called "particles" in the present invention refer to particles having a maximum equivalent spherical diameter of 10 mm or less, and said particles may be in the form of sheet pieces, needles, strips, spheres or any irregular shape.
[0022] Here, in the central portion 312, a long groove communicates between the base portion 311 and the mold opening 32, the maximum hole diameter formed in the base portion 311 is larger than the maximum hole diameter formed in the central portion 312, and the extension range of the base portion 311 covers the extension range of the central portion 312. A plurality of fin portions 313 are formed by being recessed in the radial direction so as to surround the groove wall in the groove of the central portion 312.
[0023] Referring to FIG. 4 , the thickness distance H of each fin portion 313 in the direction toward the mold opening 32 becomes thinner toward the end of the fin portion 313 of the central portion 312, and the cross section of the fin portion 313 has a triangular structure, which contributes to the quality of joining and molding during the subsequent production of the heat dissipation member 10.
[0024] The manufacturing steps of the heat dissipation member 10 include the following. Step 1: Prepare the mold 30, and place the substrate 11 in the substrate portion 311 of the mold cavity 31. At this time, the substrate 11 is the plate material that has been manufactured, and the substrate 11 fills the substrate portion 311 after being placed.
[0025] Here, the material of at least a part of the substrate 11 is the same as the material of at least a part of the center pillar 12, and may be copper metal or aluminum metal. Alternatively, the material of at least a part of the substrate 11 is the copper material particles 21, and is formed by the aluminum material particles 22 or a mixture of the materials. In this embodiment, the substrate 11 is formed of the copper metal.
[0026] Step 2: After the copper material particles 21 and the aluminum material particles 22 are uniformly mixed, mixed particles A are formed and placed in the mold cavity 31. Here, the ratio of the copper material particles 21 and the aluminum material particles 22 is not limited and can be adjusted according to the needs of the use environment, structural form, etc. of the heat dissipation member 10. When the ratio of the copper material particles 21 is large, the heat dissipation member 10 can have good heat absorption properties and heat resistance properties, exhibit anti-oxidation and corrosion resistance characteristics, and extend the service life. When the ratio of the aluminum material particles 22 is large, the heat dissipation member 10 can have the effects of rapid heat dissipation, weight reduction, and cost reduction.
[0027] Preferably, the mixed particles A may be placed in the mold cavity 31 through the mold opening 32. The mold 30 may be provided with a supply port communicating with the mold cavity 31.
[0028] Step 3: The mixed particles A are solid-phase bonded. The pressurizing rotary shaft 40 is inserted into the mold cavity 31 through the mold opening 32, and the pressurizing rotary shaft 40 is rotated about its axis while moving in the axial direction at the central portion 312. When the pressurizing rotary shaft 40 rotates while moving in the axial direction at the central portion 312, the mixed particles A are pushed and moved to the gaps between the central portions 312 of the pressurizing rotary shaft 40 and to each of the fin portions 313 due to the high friction and extrusion force of the pressurizing rotary shaft 40.
[0029] In addition, the mixed particles A are displaced due to high friction and extrusion force, completely filling each fin portion 313, and when the crystal lattice structure of the aluminum material particles 22 and the copper material particles 21 is also damaged by the friction or extrusion force, causing crystal lattice spacing or crystal lattice defects, the aluminum material particles 22 and the copper material particles 21 have their crystal lattice gaps or crystal lattice defects filled and diffused into each other, and some of the aluminum material particles 22 and the copper material particles 21 are compressed and bonded into a solid material due to a change in the crystal lattice structure, thereby obtaining a solid-state bonding effect.
[0030] Step 4: Demold to form the heat dissipation member 10. After the mold 30 is removed, the mixed particles A are filled into the area of the fin portion 313 and solid-state bonded to form the heat dissipation fin 13, and the mixed particles A remaining in the gap between the pressurizing rotation shaft 40 and the central portion 312 are solid-state bonded to form the center pillar 12.
[0031] In addition, the pressurized rotating shaft 40 is displaced axially within the mold cavity 31, thereby providing the above-mentioned solid-state bonding effect between the mixed particles A and the substrate 11, and forming a bonding surface B between the center pillar 12 and the substrate 11.
[0032] Furthermore, the maximum distance between the pressurizing rotation shaft 40 and the central portion 312 is smaller than the length of the central portion 312, so that more of the mixed particles A can be left to perform the solid-state bonding step with the substrate 11, and a bonding surface B with a larger area can be formed between the mixed particles A and the substrate 11.
[0033] In addition, when the thickness distance H of each fin portion 313 becomes thinner toward the end of the fin portion 313, in addition to making it easier to fill the mixed particles A (from larger spaces to smaller spaces), when the mixed particles A are filled at the end of the fin portion 313, the gradually shrinking space at the end of the fin portion 313 can also provide resistance to the mixed particles A, which is advantageous for the material strength after molding of the heat dissipation fins 13 of the heat dissipation member 10.
[0034] The manufacturing method of the heat dissipation member provided by the present invention only requires the axial movement of the pressurized rotary shaft 40 in the mold cavity 31 and the generation of high friction and extrusion force by pre-pressing, so that the aluminum material particles 22 and the copper material particles 21 form plastic deformation or crystal lattice defects, reduce the interface bonding energy, and fill and diffuse with each other to achieve the effect of bonding and forming different materials of the heat dissipation member 10, and overcome the problem of the difficulty of processing and synthesizing copper and aluminum materials in the conventional process. In addition, the manufacturing method provided by the present invention has simple steps, reduces energy consumption, and the copper material particles 21 and the aluminum material particles 22 can also be selected from recycled materials, which can be reused and has an environmentally friendly effect. [Explanation of symbols]
[0035] 10 Heat dissipation material 11 Substrate 12 Center pillar 13 Heat dissipation fin 21 Copper material particles 22 Aluminum material particles 30 Mold 31 Mold Cavity 311 Circuit Board 312 Central part 313 Fin section 32 Mold opening 40 Pressurized rotating shaft A Mixed particles B Joint surface H Thickness Distance
Claims
1. preparing a mold, forming a mold cavity therein, the mold cavity having a mold opening formed on one side of the mold, the mold cavity including a base portion, a central portion communicating between the base portion and the mold opening, and a plurality of fin portions formed by being radially recessed and surrounding a groove wall in a groove of the central portion, the radial extension range of the base portion covering the radial extension range of the central portion; placing a substrate within the substrate portion; uniformly mixing the particles of the same material and the particles of an aluminum material to form mixed particles, which are then disposed in the mold cavity; A step of inserting a pressurizing rotary shaft into the mold cavity from the mold opening and rotating the axis of the pressurizing rotary shaft while moving the pressurizing rotary shaft in the axial direction of the central portion; removing the mold to form a heat dissipation member; A method for manufacturing a heat dissipation member comprising the steps of:
2. The method according to claim 1 , wherein a maximum distance that the pressurizing rotary shaft is inserted into the central portion is smaller than a length of the central portion.
3. The manufacturing method according to claim 1 or 2, wherein a thickness distance of each of the fin portions configured in a direction toward an opening of the mold becomes thinner from the central portion toward an end of the fin portion.
4. A mold for manufacturing a heat dissipation member, the mold cavity being formed therein, the mold cavity having a mold opening formed on one side of the mold, the cavity including a substrate portion, a central portion communicating between the substrate portion and the mold opening, and a plurality of fin portions formed radially recessed around a groove wall in a groove in the central portion, the radial extension range of the substrate portion covering the radial extension range of the central portion.
5. The mold according to claim 4 , wherein a thickness distance of each of the fin portions in a direction toward the mold opening becomes thinner in the central portion toward an end of the fin portion.
6. a substrate; a center pillar extending and protruding from one side surface of the substrate; and a plurality of fins disposed at intervals from a free end of the center pillar toward the substrate and extending in a radial direction in a sheet shape so as to surround a surface of the center pillar, The center pillar and the fins are formed by uniformly mixing copper material particles and aluminum material particles and then rubbing and extruding them, A heat dissipation member, wherein a bonding surface is formed between the center pillar and the substrate.
7. The heat dissipation member according to claim 6 , wherein the material of at least a part of the substrate is a copper metal or an aluminum metal.
8. The heat dissipation member according to claim 6 , wherein at least a portion of the material of the substrate is the copper material particles, the aluminum material particles, or a mixture of the materials.
Citation Information
Patent Citations
Semiconductor device
JP1990246141A
Radiator
JP2002026201A