Unit for manufacturing electric part

Abstract

To reduce chips that are not peeled off from an adhesive sheet.SOLUTION: A support mechanism 2 supports an adhesive sheet 10 having a front face that adhesively holds a plurality of chips 20 to be material of a plurality of electric parts. A facing member 3 is arranged facing a rear face of the adhesive sheet 10. A nozzle 4 blows air between the adhesive sheet 10 supported by the support mechanism 2 and the facing member 3. The nozzle 4 blows air between the adhesive sheet 10 and the facing member 3, resulting in vibration of the adhesive sheet 10, and the plurality of chips 20 are detached from the adhesive sheet 10.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present invention relates to an apparatus for manufacturing electronic components. [Background technology]

[0002] Japanese Patent Laid-Open Publication No. 2007-266208 (Patent Document 1) is a prior art document that discloses the configuration of an external electrode forming device for chip-type electronic components. In the external electrode forming device described in Patent Document 1, the adhesive material is heated to non-contact peel the chip-type element from the adhesive material without applying an external force to the chip-type element attached to the adhesive material containing a plastically deformable thermally foamable adhesive. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2007-266208 A Summary of the Invention [Problem to be solved by the invention]

[0004] When the adhesive material undergoes plastic deformation to hold the chip, even if the adhesive material is heated and foamed, some chips will not peel off from the adhesive material.

[0005] The present invention has been made in consideration of the above problems, and has an object to provide an electronic component manufacturing apparatus that can reduce the number of chips that do not peel off from the adhesive sheet. [Means for solving the problem]

[0006] An electronic component manufacturing apparatus according to the present invention includes a support mechanism, an opposing member, and a nozzle. The support mechanism supports an adhesive sheet having a plurality of chips, which are materials for a plurality of electronic components, adhesively held on its surface. The opposing member is disposed to face the rear surface of the adhesive sheet. The nozzle blows air between the adhesive sheet and the opposing member, which are supported by the support mechanism. The nozzle blows air between the adhesive sheet and the opposing member, thereby vibrating the adhesive sheet and detaching the plurality of chips from the adhesive sheet. Effect of the Invention

[0007] According to the present invention, it is possible to reduce the number of chips that do not peel off from the adhesive sheet. [Brief description of the drawings]

[0008] [Figure 1] FIG. 1 is a flow diagram showing a method for manufacturing an electronic component. [Diagram 2] 1 is a perspective view showing a configuration of an electronic component manufacturing apparatus according to an embodiment of the present invention; [Diagram 3] 3 is a plan view of the electronic component manufacturing apparatus of FIG. 2 as viewed from the direction of arrow III. [Figure 4] 4 is a side view of the electronic component manufacturing apparatus of FIG. 3 as viewed in the direction of arrow IV. [Diagram 5] FIG. 2 is a perspective view showing a state when a functional sheet is attached to a chip. [Figure 6] FIG. 2 is a perspective view showing a state in which a functional sheet is attached to a chip. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] Hereinafter, an electronic component manufacturing apparatus according to an embodiment of the present invention will be described with reference to the drawings. In the following description of the embodiment, the same or corresponding parts in the drawings are given the same reference numerals, and the description thereof will not be repeated.

[0010] An electronic component manufacturing apparatus according to an embodiment of the present invention will be described below with reference to the drawings. Fig. 1 is a flow diagram showing a manufacturing method for an electronic component. In the following description of the manufacturing method for an electronic component, a manufacturing method for a multilayer ceramic capacitor will be described, but the electronic component is not limited to a multilayer ceramic capacitor and may be a multilayer ceramic coil or the like, as long as it is an electronic component made from a chip.

[0011] As shown in FIG. 1, when manufacturing a multilayer ceramic capacitor, first, a ceramic dielectric slurry is prepared (step S1). Specifically, a ceramic dielectric powder, an additive powder, a binder resin, a dissolving liquid, and the like are dispersed and mixed, and thus a ceramic dielectric slurry is prepared. The ceramic dielectric powder is, for example, a dielectric particle having a perovskite structure such as BaTiO3, CaTiO3, SrTiO3, CaZrO3, or CaHfO3. The additive powder is, for example, at least one of a Si compound, an Mg compound, an Mn compound, an Fe compound, a Cr compound, an Ni compound, and a Co compound. As the binder resin, a polyurethane resin, a urea resin, a melamine resin, an epoxy resin, a vinyl acetate resin, an acrylic resin, or an aqueous polymer such as polyvinyl alcohol (PVA) or polyvinyl butyral (PVB) can be used. These may be used alone or in a mixture of two or more kinds. The ceramic dielectric slurry may be either a solvent-based or water-based. When the ceramic dielectric slurry is a water-based paint, the ceramic dielectric slurry is prepared by mixing a water-soluble binder, a dispersant, etc. with a dielectric raw material dissolved in water.

[0012] Next, a ceramic dielectric sheet is formed (step S2). Specifically, the ceramic dielectric slurry is formed into a sheet shape on a carrier film using a die coater, gravure coater, or microgravure coater, and then dried to form a ceramic dielectric sheet. From the viewpoint of miniaturization and high capacity of the multilayer ceramic capacitor, the thickness of the ceramic dielectric sheet is preferably 0.2 μm or more and 10 μm or less.

[0013] Next, a mother sheet is formed (step S3). Specifically, a ceramic dielectric sheet is coated with a conductive paste so as to have a predetermined pattern, thereby forming a mother sheet on which a predetermined internal electrode pattern is provided. The conductive paste contains Ni powder, a solvent, a dispersant, a binder, and the like, and is prepared so as to have a constant viscosity. As the binder, polyvinyl butyral (PVB) or polyvinyl alcohol (PVA) or the like is used. As a method for coating the conductive paste, a screen printing method, an inkjet method, a gravure printing method, or the like can be used. From the viewpoint of miniaturization and high capacity of the multilayer ceramic capacitor, the thickness of the internal electrode pattern is preferably 0.2 μm or more and 10 μm or less. In addition to the mother sheet having the internal electrode pattern, a ceramic dielectric sheet that has not been subjected to the above step S3 is also prepared as the mother sheet.

[0014] Next, a plurality of mother sheets are stacked (step S4). Specifically, a predetermined number of mother sheets, each of which does not have an internal electrode pattern and is made of only ceramic dielectric sheets, are stacked to a thickness of, for example, 0.5 μm or more and 5 μm or less. A predetermined number of mother sheets, each of which has an internal electrode pattern, are stacked thereon. The number of mother sheets, each of which has an internal electrode pattern, is, for example, 5 sheets or more and 1500 sheets or less. A predetermined number of mother sheets, each of which does not have an internal electrode pattern and is made of only ceramic dielectric sheets, are stacked thereon to a thickness of, for example, 0.5 μm or more and 10 μm or less. This forms a mother sheet group.

[0015] Next, the group of mother sheets is pressed together to form a dielectric block (step S5). Specifically, the group of mother sheets is pressed in the stacking direction by a hydrostatic press or a rigid press to form a dielectric block. At this time, the ceramic dielectric sheets are pressed at a predetermined temperature to adhere to each other. In addition, by arranging and pressing a ceramic dielectric sheet of a certain thickness on the outermost layer in the stacking direction, it is possible to protect the dielectric sheet on which the internal electrode pattern is formed.

[0016] Next, the dielectric block is attached to the adhesive sheet (step S6). The adhesive sheet has an adhesive layer on its front surface and a base layer on its back surface. The adhesive sheet may be one in which the surface area of ​​the adhesive layer increases so that the adhesive layer loses its adhesive holding power. The adhesive sheet may be a long sheet. The maximum dimension of the thickness of the adhesive sheet in a state in which it has lost its adhesive holding power is preferably 0.2 mm or more and 0.5 mm or less.

[0017] Next, the dielectric block adhesively held on the adhesive sheet is divided to form chips (step S7). Specifically, the dielectric block is divided into a matrix shape by press-cutting, dicing or laser cutting, and is separated into a plurality of chips. In step S7, an adhesive sheet is prepared on which a plurality of chips are adhesively held on the surface in a state of being arranged closely together. Internal electrodes are exposed on the side surfaces of each of the plurality of chips.

[0018] Next, the chip is detached from the adhesive sheet (step S8). Here, the configuration of an electronic component manufacturing apparatus according to one embodiment of the present invention, which is used when detaching the chip from the adhesive sheet, will be described. FIG. 2 is a perspective view showing the configuration of an electronic component manufacturing apparatus according to one embodiment of the present invention. FIG. 3 is a plan view of the electronic component manufacturing apparatus of FIG. 2, as viewed from the direction of arrow III. FIG. 4 is a side view of the electronic component manufacturing apparatus of FIG. 3, as viewed from the direction of arrow IV.

[0019] As shown in FIGS. 2 to 4, an electronic component manufacturing apparatus 1 according to an embodiment of the present invention includes a support mechanism 2, an opposing member 3, and a nozzle 4. The support mechanism 2 supports an adhesive sheet 10 on whose surface a plurality of chips, which are materials for a plurality of electronic components, are adhesively held. The adhesive sheet 10 loses its adhesive holding force while being supported by the support mechanism 2. The support mechanism 2 supports the adhesive sheet 10 by any of a vacuum suction method, an electrostatic adsorption method, an adhesive method, and a mechanical method. In this embodiment, the support mechanism 2 supports the adhesive sheet 10 so that a certain tension is applied to the adhesive sheet 10. A box 5 for collecting a plurality of chips 20 detached from the adhesive sheet 10 is disposed below the adhesive sheet 10. The box 5 is preferably made of resin so as to prevent the chips 20 from being scratched.

[0020] The facing member 3 is disposed so as to face the back surface of the adhesive sheet 10. In this embodiment, the facing member 3 is a flat plate having a rectangular surface facing the back surface of the adhesive sheet 10. The area of ​​the surface of the facing member 3 facing the back surface of the adhesive sheet 10 is, for example, 0.01 m 2 More than 0.5m 2 However, the shape of the opposing member 3 is not limited to a rectangular flat plate, and the surface opposing the back surface of the adhesive sheet 10 may be a circular flat plate. In this case, the diameter of the surface opposing the back surface of the adhesive sheet 10 is, for example, 3 cm or more and 100 cm or less.

[0021] When viewed from a direction perpendicular to the back surface of the adhesive sheet 10, it is preferable that at least a portion of the opposing member 3 is arranged so as to overlap with the area of ​​the adhesive sheet 10 in which the multiple chips 20 are adhesively held, and it is more preferable that the entire opposing member 3 is arranged so as to overlap with the area of ​​the adhesive sheet 10 in which the multiple chips 20 are adhesively held.

[0022] The area of ​​the region where the opposing member 3 is projected onto the adhesive sheet 10 in a direction perpendicular to the back surface of the adhesive sheet 10 may be smaller than, the same as, or larger than the area of ​​the region on the adhesive sheet 10 where the multiple chips 20 are adhesively held.

[0023] 4 is preferably 0 mm or more and 3 mm or less. The corners and ridges of the surface of the opposing member 3 facing the back surface of the adhesive sheet 10 are preferably rounded. The opposing member 3 is fixed to a support (not shown).

[0024] The nozzle 4 blows air between the adhesive sheet 10 supported by the support mechanism 2 and the opposing member 3. In this embodiment, three pairs of nozzles 4 are arranged symmetrically with respect to the center of the longitudinal direction of the opposing member 3 when viewed from a direction perpendicular to the back surface of the adhesive sheet 10. The number of nozzles 4 arranged is not limited to six, and may be one or more. As shown in FIG. 4, the inclination angle θ of the nozzle 4 with respect to the back surface of the adhesive sheet 10 is preferably 1° or more and 45° or less, and more preferably 16° or more and 45° or less from the viewpoint of suppressing interference between the nozzle 4 and the adhesive sheet 10. The shortest distance from the tip of the nozzle 4 to the back surface of the adhesive sheet 10 is preferably 3 mm or more and 20 mm or less. The nozzle 4 is connected to a supply source that supplies air. The pressure of the air supplied from the supply source to the nozzle 4 is preferably 0.3 MPa or more and 1 MPa or less.

[0025] Here, the operation of electronic component manufacturing apparatus 1 will be described. First, adhesive sheet 10 supported by support mechanism 2 is heated or cooled to a temperature exceeding a threshold temperature, causing it to lose its adhesive holding power. Even in a state in which adhesive sheet 10 has lost its adhesive holding power, some chips 20 remain held by adhesive sheet 10 among the multiple chips 20.

[0026] Next, as shown in Fig. 4, while the adhesive sheet 10 that has lost its adhesive holding power is supported by the support mechanism 2, the nozzle 4 blows air between the adhesive sheet 10 and the opposing member 3, thereby vibrating the adhesive sheet 10 and detaching the multiple chips 20 from the adhesive sheet 10. Specifically, the adhesive sheet 10 vibrates in the vertical direction due to convection of the air blown between the adhesive sheet 10 and the opposing member 3. This vibration causes the chips 20 held by the adhesive sheet 10 to be detached from the adhesive sheet 10. The multiple chips 20 detached from the adhesive sheet 10 are collected in the box 10.

[0027] Next, a functional sheet is attached to the collected chip 20. FIG. 5 is a perspective view showing the state when the functional sheet is attached to the chip. FIG. 6 is a perspective view showing the state in which the functional sheet is attached to the chip. As shown in FIG. 5 and FIG. 6, the chip 20 has one surface 21 and the other surface 22. A paste 31 is applied to the one surface 21 side. The paste 31 has electrical conductivity or adhesiveness.

[0028] With one surface 21 of the chip 20 and the main surface 30S of the functional sheet 30 facing each other, the chip 20 is pressed against the functional sheet 30 from the other surface 22 side, so that the functional sheet 30 is attached to one surface 21 of the chip 20. The functional sheet 30 is, for example, a conductive sheet. Thereafter, the paste 31 and the functional sheet 30 are dried. Similarly, the paste 31 is applied to the other surface 22, the functional sheet 30 is attached, and then dried.

[0029] 1, the chip is then fired (step S11). Specifically, the chip is heated, and the dielectric material and conductive material contained in the chip are fired to form a laminate. The firing temperature is appropriately set according to the dielectric material and conductive material.

[0030] Next, external electrodes are formed (step S12). For example, the laminate is plated with Ni and then with Sn in this order to form plating layers, thereby forming external electrodes on the outer surfaces of the laminate.

[0031] Through the above-mentioned series of steps, a multilayer ceramic capacitor can be manufactured.

[0032] (Experimental Example) Below, we will explain the results of experiments in which various parameters were changed to perform a chip detachment test from an adhesive sheet.

[0033] [Table 1]

[0034] [Table 2]

[0035] Table 1 summarizes the basic parameters. Table 2 summarizes the parameters that were changed from the basic parameters in Experimental Examples 1 to 4. In each of Experimental Examples 1 to 4, the parameters shown in Table 1 were used except for the changed parameters shown in Table 2.

[0036] As shown in Table 2, in Experimental Example 1, the maximum dimension of the thickness of the adhesive sheet 10 in a state in which the adhesive holding power has been lost was changed, and a detachment test was performed to visually confirm whether all the chips 20 had detached from the adhesive sheet 10. As a result, it was confirmed that all the chips 20 had detached from the adhesive sheet 10 when the maximum dimension of the thickness of the adhesive sheet 10 in a state in which the adhesive holding power has been lost was 0.2 mm or more and 0.5 mm or less. When the maximum dimension of the thickness of the adhesive sheet 10 in a state in which the adhesive holding power has been lost was 0.1 mm, the adhesive sheet 10 was torn or vibrated excessively, and chips 20 were found to be damaged. When the maximum dimension of the thickness of the adhesive sheet 10 in a state in which the adhesive holding power has been lost was 0.6 mm, the vibration of the adhesive sheet 10 was weakened, and chips 20 that did not detach from the adhesive sheet 10 were found.

[0037] In Experimental Example 2, a detachment test was performed by changing the inclination angle θ of the nozzle 4 with respect to the back surface of the adhesive sheet 10, and it was visually confirmed whether all the chips 20 had detached from the adhesive sheet 10. As a result, it was confirmed that all the chips 20 had detached from the adhesive sheet 10 when the inclination angle θ of the nozzle 4 with respect to the back surface of the adhesive sheet 10 was 1° or more and 45° or less. When the inclination angle θ of the nozzle 4 with respect to the back surface of the adhesive sheet 10 was 0°, the nozzle 4 and the adhesive sheet 10 interfered with each other, making it impossible to conduct the experiment. When the inclination angle θ of the nozzle 4 with respect to the back surface of the adhesive sheet 10 was 50°, the vibration of the adhesive sheet 10 was weakened, and some chips 20 were not detached from the adhesive sheet 10.

[0038] In Experimental Example 3, a detachment test was performed by changing the pressure of the air supplied to nozzle 4, and it was visually confirmed whether all of the chips 20 had detached from the adhesive sheet 10. As a result, it was confirmed that all of the chips 20 had detached from the adhesive sheet 10 when the pressure of the air supplied to nozzle 4 was 0.3 MPa or more and 1 MPa or less. When the pressure of the air supplied to nozzle 4 was 0.2 MPa, the vibration of the adhesive sheet 10 was weakened, and chips 20 that did not detach from the adhesive sheet 10 were observed. When the pressure of the air supplied to nozzle 4 was 1.1 MPa, the adhesive sheet 10 was torn or vibrated excessively, and chips 20 were found to be damaged.

[0039] In Experimental Example 4, a detachment test was performed by changing the shortest distance L between the back surface of the adhesive sheet 10 and the opposing member 3, and it was visually confirmed whether all the chips 20 had detached from the adhesive sheet 10. As a result, it was confirmed that all the chips 20 had detached from the adhesive sheet 10 when the shortest distance L between the back surface of the adhesive sheet 10 and the opposing member 3 was 0 mm or more and 3 mm or less. Even when the shortest distance L between the back surface of the adhesive sheet 10 and the opposing member 3 was 0 mm, it was confirmed that air blown from the nozzle 4 could be inserted between the back surface of the adhesive sheet 10 and the opposing member 3, and all the chips 20 had detached from the adhesive sheet 10. When the shortest distance L between the back surface of the adhesive sheet 10 and the opposing member 3 was 4 mm, the vibration of the adhesive sheet 10 was weakened, and some chips 20 were not detached from the adhesive sheet 10.

[0040] From the above experimental results, it was confirmed that by having the nozzle 4 blow air between the adhesive sheet 10 that has lost its adhesive holding power and the opposing member 3, the adhesive sheet 10 is vibrated and multiple chips 20 are detached from the adhesive sheet 10, thereby reducing the number of chips 20 that do not peel off from the adhesive sheet 10.

[0041] (Additional Note) It will be appreciated by those skilled in the art that the exemplary embodiments described above are examples of the following aspects.

[0042] <1> a support mechanism for supporting an adhesive sheet on whose surface a plurality of chips, which are materials for a plurality of electronic components, are adhesively held; An opposing member arranged to face the back surface of the pressure-sensitive adhesive sheet; a nozzle for blowing air into a gap between the adhesive sheet supported by the support mechanism and the opposing member, The apparatus for manufacturing electronic components wherein the nozzle blows air between the adhesive sheet and the opposing member to vibrate the adhesive sheet and detach the plurality of chips from the adhesive sheet.

[0043] <2> the shortest distance between the pressure-sensitive adhesive sheet supported by the support mechanism and the opposing member is 0 mm or more and 3 mm or less; <1> An apparatus for manufacturing electronic components according to claim 1.

[0044] <3> The pressure of the air supplied to the nozzle is 0.3 MPa or more and 1 MPa or less. <1> or <2> An apparatus for manufacturing electronic components according to claim 1.

[0045] <4> The inclination angle of the nozzle with respect to the back surface of the adhesive sheet is 1° or more and 45° or less. <1> from <3> 13. An apparatus for manufacturing electronic components according to any one of claims 1 to 12.

[0046] <5> The maximum dimension of the thickness of the pressure-sensitive adhesive sheet in a state in which the adhesive holding force has been lost is 0.2 mm or more and 0.5 mm or less. <1> from <4> 13. An apparatus for manufacturing electronic components according to any one of claims 1 to 12.

[0047] In the above description of the embodiments, configurations that can be combined may be combined with each other.

[0048] The embodiments disclosed herein should be considered to be illustrative and not restrictive in all respects. The scope of the present invention is defined by the claims, not the above description, and is intended to include all modifications within the meaning and scope of the claims. [Explanation of symbols]

[0049] 1 manufacturing apparatus, 2 support mechanism, 3 opposing member, 4 nozzle, 5 box, 10 adhesive sheet, 20 chip, 21 one side, 22 other side, 30 functional sheet, 30S main surface, 31 paste.

Claims

1. a support mechanism for supporting an adhesive sheet on whose surface a plurality of chips, which are materials for a plurality of electronic components, are adhesively held; an opposing member disposed so as to face the back surface of the pressure-sensitive adhesive sheet; a nozzle for blowing air into a gap between the adhesive sheet supported by the support mechanism and the opposing member, The apparatus for manufacturing electronic components wherein the nozzle blows air between the adhesive sheet and the opposing member to vibrate the adhesive sheet and detach the plurality of chips from the adhesive sheet.

2. 2 . The electronic component manufacturing apparatus according to claim 1 , wherein a minimum distance between the adhesive sheet supported by the support mechanism and the opposing member is 0 mm or more and 3 mm or less.

3. 2. The electronic component manufacturing apparatus according to claim 1, wherein a pressure of the air supplied to the nozzle is equal to or higher than 0.3 MPa and equal to or lower than 1 MPa.

4. 2. The electronic component manufacturing apparatus according to claim 1, wherein an inclination angle of the nozzle with respect to the rear surface of the adhesive sheet is greater than or equal to 1° and less than or equal to 45°.

5. 2. The electronic component manufacturing apparatus according to claim 1, wherein the maximum dimension of the thickness of the adhesive sheet in a state in which it has lost its adhesive holding power is 0.2 mm or more and 0.5 mm or less.

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