Semiconductor manufacturing apparatus and semiconductor device manufacturing method

Abstract

To provide a semiconductor manufacturing apparatus and a semiconductor device manufacturing method that can efficiently execute removal of foreign matter from a collet.SOLUTION: A semiconductor manufacturing apparatus includes: a transfer source stage; a transfer destination stage; a first collet for transferring a semiconductor chip from the transfer source stage to the transfer destination stage; a foreign matter removal unit provided between the transfer destination stage and the transfer source stage on a straight line or a circular line; and a control unit configured to control an operation of the first collet and bring the first collet into contact with the foreign matter removal unit when the first collet returns from the transfer destination stage to the transfer source stage.SELECTED DRAWING: Figure 1A

Description

[Technical field]

[0001] The present disclosure relates to a semiconductor manufacturing apparatus and a method for manufacturing a semiconductor device. [Background technology]

[0002] Patent Document 1 discloses a pickup device for preventing malfunctions even when foreign matter adheres to the chip holding surface. This pickup device includes a pickup mechanism having a chip holding surface and a foreign matter removal unit. The pickup mechanism is controlled so that the chip holding surface of the pickup mechanism is brought into contact with the foreign matter removal unit at a predetermined timing. This causes the foreign matter adhering to the chip holding surface to adhere to the foreign matter removal unit, thereby removing the foreign matter from the chip holding surface. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent Publication No. 2021-77687 Summary of the Invention [Problem to be solved by the invention]

[0004] When a collet vacuum-adsorbs a chip and transports the chip, foreign matter may adhere to the collet surface. In this case, the foreign matter may get caught between the collet and the chip during chip adsorption and transport, causing damage to the chip. In Patent Document 1, a step of removing foreign matter from the collet is performed separately from the chip transport operation. This may increase the takt time.

[0005] The present disclosure has been made to solve the above-mentioned problems, and has an object to provide a semiconductor manufacturing apparatus and a method for manufacturing a semiconductor device that can efficiently remove foreign matter from a collet. [Means for solving the problem]

[0006] The semiconductor manufacturing apparatus according to the present disclosure comprises a source stage, a destination stage, a first collet for transporting semiconductor chips from the source stage to the destination stage, a foreign matter removal unit provided between the destination stage and the source stage on a straight line or a circular line, and a control unit configured to control the operation of the first collet and bring the first collet into contact with the foreign matter removal unit when the first collet returns from the destination stage to the source stage.

[0007] The manufacturing method of a semiconductor device according to the present disclosure involves transporting a semiconductor chip from a source stage to a destination stage by a collet, and as the collet returns from the destination stage to the source stage, bringing the collet into contact with a foreign matter removal unit provided between the destination stage and the source stage in a straight line or along a circumference. Effect of the Invention

[0008] In the semiconductor manufacturing apparatus and the semiconductor device manufacturing method according to the present disclosure, the foreign matter removal unit is provided between the destination stage and the source stage, which makes it possible to efficiently remove foreign matter from the collet. [Brief description of the drawings]

[0009] [Figure 1A] 1 is a diagram illustrating the configuration and operation of a semiconductor manufacturing apparatus according to a first embodiment. [Figure 1B] 1 is a diagram illustrating the configuration and operation of a semiconductor manufacturing apparatus according to a first embodiment. [Figure 2A] 5A to 5C are diagrams illustrating the stamping operation of the collet according to the first embodiment. [Figure 2B] 5A to 5C are diagrams illustrating the stamping operation of the collet according to the first embodiment. [Figure 2C] 5A to 5C are diagrams illustrating the stamping operation of the collet according to the first embodiment. [Diagram 3] 4 is a flowchart illustrating a method for manufacturing the semiconductor device according to the first embodiment. [Figure 4]1 is a plan view of a semiconductor manufacturing apparatus according to a first embodiment. [Figure 5A] FIG. 11 is a front view of a semiconductor manufacturing apparatus according to a second embodiment. [Figure 5B] FIG. 11 is a plan view of a semiconductor manufacturing apparatus according to a second embodiment. [Figure 5C] FIG. 11 is a front view of a semiconductor manufacturing apparatus according to a second embodiment. [Figure 5D] FIG. 11 is a front view of a semiconductor manufacturing apparatus according to a second embodiment. [Figure 5E] FIG. 11 is a plan view of a semiconductor manufacturing apparatus according to a second embodiment. [Figure 6] FIG. 11 is a front view of a semiconductor manufacturing apparatus according to a modified example of the second embodiment. [Figure 7A] 11A and 11B are diagrams showing examples of the shape of the surface of a push-up rod according to the second embodiment. [Figure 7B] 13A and 13B are diagrams showing examples of the shape of the surface of a push-up rod according to the second embodiment. [Figure 8A] FIG. 11 is a front view of a semiconductor manufacturing apparatus according to a third embodiment. [Figure 8B] FIG. 11 is a front view of a semiconductor manufacturing apparatus according to a third embodiment. [Figure 9A] FIG. 13 is a plan view of a semiconductor manufacturing apparatus according to a first modified example of the third embodiment. [Figure 9B] FIG. 13 is a plan view of a semiconductor manufacturing apparatus according to a first modified example of the third embodiment. [Figure 9C] FIG. 13 is a plan view of a semiconductor manufacturing apparatus according to a first modified example of the third embodiment. [Figure 9D] FIG. 13 is a plan view of a semiconductor manufacturing apparatus according to a first modified example of the third embodiment. [Figure 10A] FIG. 13 is a plan view of a semiconductor manufacturing apparatus according to a second modification of the third embodiment. [Figure 10B] FIG. 13 is a plan view of a semiconductor manufacturing apparatus according to a second modification of the third embodiment. [Figure 10C] FIG. 13 is a plan view of a semiconductor manufacturing apparatus according to a second modification of the third embodiment. [Figure 10D] FIG. 13 is a plan view of a semiconductor manufacturing apparatus according to a second modification of the third embodiment. [Figure 11A] FIG. 11 is a plan view of a semiconductor manufacturing apparatus according to a fourth embodiment. [Figure 11B] FIG. 11 is a plan view of a semiconductor manufacturing apparatus according to a fourth embodiment. [Figure 12] FIG. 13 is a diagram showing a foreign matter removal unit according to the fifth embodiment. [Figure 13] FIG. 2 is a diagram illustrating a configuration of a control unit. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] A semiconductor manufacturing apparatus and a method for manufacturing a semiconductor device according to each embodiment will be described with reference to the drawings. The same or corresponding components are designated by the same reference numerals, and repeated description may be omitted.

[0011] Embodiment 1 1A and 1B are diagrams for explaining the configuration and operation of a semiconductor manufacturing apparatus 100 according to the first embodiment. The semiconductor manufacturing apparatus 100 includes a source stage 7a, a destination stage 7b, and a collet 2 for transporting a semiconductor chip 6 from the source stage 7a to the destination stage 7b. The semiconductor manufacturing apparatus 100 is, for example, a semiconductor chip transport mechanism. The collet 2 is provided at the tip of a transport arm 1 having a movement mechanism for up, down, left, and right directions. Here, the up and down direction is a direction perpendicular to the source stage 7a or the destination stage 7b. The left and right direction is a direction parallel to the arrow 81.

[0012] The semiconductor manufacturing apparatus 100 further includes a foreign matter removal unit 3. The foreign matter removal unit 3 is provided on a straight line between the destination stage 7b and the source stage 7a. The source stage 7a, the foreign matter removal unit 3, and the destination stage 7b are aligned on a straight line along a first direction. The first direction is the direction along the arrow 81. The foreign matter removal unit 3 is, for example, an adhesive sheet.

[0013] The adhesive sheet that is the foreign matter removal unit 3 is preferably sized such that one side is sufficiently larger than the diameter of the collet 2 and that multiple stamps can be performed even if the stamp position is changed for each stamp. It is also desirable to make the foreign matter removal unit 3 as large as possible to reduce the frequency of replacement. The foreign matter removal unit 3 may be arranged so as to be spread out between the source stage 7a and the destination stage 7b. Examples of the adhesive sheet include sheets that use an acrylic adhesive, a urethane adhesive, or the like.

[0014] The control unit 4 controls the operation of the collet 2. The control unit 4 is configured to move the transport arm 1 in the up, down, left and right directions and cause the collet 2 to perform a stamping operation. The stamping operation is an operation in which the foreign matter removal unit 3 and the surface of the collet 2, i.e., the suction surface, are brought into contact with each other.

[0015] Hereinafter, the transport arm 1 and collet 2 may be collectively referred to as the chip transport unit. The chip transport unit is provided with an intake and exhaust unit 5 that supplies and exhausts gas. The intake and exhaust unit 5 is connected to holes in the suction surface of the collet 2. The collet 2 holds the semiconductor chip 6 by vacuum suction of the intake and exhaust unit 5, and transports the semiconductor chip 6.

[0016] Next, the operation of the collet 2 will be described. First, as shown in Fig. 1A, the surface of the collet 2 is brought into contact with the semiconductor chip 6 at the source stage 7a, and the semiconductor chip 6 is held by vacuum suction. Next, the collet 2 transports the semiconductor chip 6 to the destination stage 7b. At this time, the collet 2 moves in the first direction as shown by the arrow 81, passes above the foreign matter removal unit 3, and reaches the destination stage 7b.

[0017] Next, the collet 2 with the semiconductor chip 6 mounted on the destination stage 7b passes above the foreign matter removal unit 3 and returns to the destination stage 7b, as indicated by an arrow 83 in Fig. 1B. At this time, the collet 2 performs a stamping operation on the foreign matter removal unit 3 on the way back from the destination stage 7b to the source stage 7a. In other words, the control unit 4 is configured to bring the collet 2 into contact with the foreign matter removal unit 3 when the collet 2 returns from the destination stage 7b to the source stage 7a.

[0018] 2A to 2C are diagrams illustrating the stamping operation of collet 2 according to embodiment 1. As shown in Fig. 2B, collet 2 moves in the vertical direction and the surface of collet 2 comes into contact with foreign matter removal part 3. As a result, as shown in Fig. 2C, foreign matter 8 adhering to collet 2 is moved to the adhesive sheet, and the surface of collet 2 is cleaned.

[0019] The stamping operation is performed, for example, every time a semiconductor chip 6 is mounted. That is, the operation shown in FIG. 1A and the operations shown in FIG. 1B and FIG. 2A are performed alternately. Without being limited to this, the timing of the stamping operation may be set by the semiconductor manufacturing apparatus 100. For example, the stamping operation may be performed every time a semiconductor chip 6 is mounted a predetermined number of times. The predetermined number of times may be multiple times or may be one time. Furthermore, the stamping operation may be performed multiple times every time a semiconductor chip 6 is mounted.

[0020] FIG. 3 is a flow chart for explaining the method for manufacturing a semiconductor device according to the first embodiment. First, a suction process is performed (step 1). In the suction process, the collet 2 suctions the semiconductor chip 6 on the source stage 7a. Next, a transport process is performed (step 2). In the transport process, the collet 2 transports the adsorbed semiconductor chip 6 from the source stage 7a to the destination stage 7b. Next, a placement process is performed (step 3). In the placement process, the transported semiconductor chip 6 is placed on the destination stage 7b. Next, a stamp process is performed (step 4). In the stamp process, when the collet 2 returns from the destination stage 7b to the source stage 7a, the collet 2 is brought into contact with the foreign matter removal unit 3 provided between the destination stage 7b and the source stage 7a on a straight line.

[0021] FIG. 4 is a plan view of the semiconductor manufacturing apparatus 100 according to the first embodiment. The foreign matter removal unit 3 is, for example, an adhesive sheet larger than the suction surface of the collet 2. The control unit 4 may be configured to move the contact portion of the foreign matter removal unit 3 with the collet 2 in the positive direction of the first direction as shown by the arrow 84 each time the foreign matter removal unit 3 and the collet 2 are brought into contact with each other. In FIG. 4, one square separated by a dashed line is the contact portion that comes into contact with the collet 2 in one stamping operation. The control unit 4 moves the contact portion one square at a time in the order of the numbers shown in FIG. 4 each time the foreign matter removal unit 3 and the collet 2 are brought into contact with each other. The control unit 4 may be configured to move the contact portion in a second direction perpendicular to the first direction when the contact portion reaches a turning point, that is, an end of the foreign matter removal unit 3, and then move the contact portion in the negative direction of the first direction.

[0022] In addition, in Fig. 4, the first direction is shown as the X direction, and the second direction is shown as the Y direction. The method of moving the contact portion is not limited to the method shown in Fig. 4. In addition, in Fig. 4, the direction from the source stage 7a toward the destination stage 7b is defined as the positive first direction, but the direction from the destination stage 7b toward the source stage 7a may be the positive first direction.

[0023] Next, the effects of this embodiment will be described. According to this embodiment, the surface of the collet 2 can be cleaned periodically while the semiconductor manufacturing apparatus 100 is in operation. This reduces the incidence of scratches on the surface of the semiconductor chip 6 that comes into contact with the collet 2. Furthermore, since the foreign matter removal unit 3 is located between the source stage 7a and the destination stage 7b, foreign matter can be efficiently removed from the collet 2. In other words, foreign matter can be removed on the path of the collet 2 for transporting the semiconductor chip 6, and the travel tact time to the foreign matter removal unit 3 can be minimized.

[0024] 4, the stamping operation can be performed more efficiently by making the foreign matter removal section 3 large and switching the contact area, and the frequency of replacing the adhesive sheet can be reduced.

[0025] In this embodiment, an example has been described using one collet 2, but any number of collets 2 may be installed in the semiconductor manufacturing apparatus 100. For example, one foreign matter removal unit 3 is installed for one collet 2. This can be changed as appropriate in accordance with the specifications of the apparatus, and for example, one foreign matter removal unit 3 may be installed for multiple collets 2.

[0026] The above-mentioned modifications can be appropriately applied to the semiconductor manufacturing apparatus and the semiconductor device manufacturing method according to the following embodiments. Note that the semiconductor manufacturing apparatus and the semiconductor device manufacturing method according to the following embodiments have many points in common with the first embodiment, so the following description will focus on the differences from the first embodiment.

[0027] Embodiment 2 5A, 5C, and 5D are front views of semiconductor manufacturing apparatus 200 according to embodiment 2. FIGS. 5B and 5E are plan views of semiconductor manufacturing apparatus 200 according to embodiment 2. Note that source stage 7a and destination stage 7b are omitted in FIGS. 5A to 5E. In this embodiment, the configuration of foreign matter removal section 3 is different from that of embodiment 1. Other configurations are similar to those of embodiment 1.

[0028] The foreign matter removal unit 3 in this embodiment is an adhesive sheet, as in the first embodiment. The semiconductor manufacturing apparatus 200 further includes rollers 9, 10 for winding up the adhesive sheet. The rollers 9, 10 are provided on both ends of the adhesive sheet, and the adhesive sheet is wound up by rotating the rollers 9, 10. The roller 9 is a sheet feeding roller for feeding out the adhesive sheet. The roller 10 is a sheet winding roller for winding up the adhesive sheet fed from the roller 9.

[0029] Next, the operation of the semiconductor manufacturing apparatus 200 will be described. The basic operation is the same as that of the first embodiment, so the sheet winding operation will be mainly described here. As shown in Figs. 5A and 5B, after the semiconductor chip 6 is transported, when the collet 2 returns from the destination stage 7b to the source stage 7a, the control unit 4 brings the collet 2 into contact with the foreign matter removal unit 3. The contact portion at this time is set as position P1. After the stamping operation, as shown in Fig. 5C, the rollers 9 and 10 rotate in the direction indicated by the arrow 85, and the adhesive sheet is wound in the first direction as indicated by the arrow 86.

[0030] As a result, the next time the stamping operation is performed, the collet 2 and the foreign body removal unit 3 come into contact with each other at position P2, which is different from position P1, as shown in Figures 5D and 5E. By repeating this operation, the contact portions are switched. The control of the rollers 9 and 10 may be performed by the control unit 4.

[0031] According to this embodiment, the adhesive sheet is wound up after each stamping operation, so that it is always possible to stamp a new portion. Also, by making the adhesive sheet into a roller type, the installation area of ​​the foreign matter removal unit 3 can be reduced, and the frequency of replacing the adhesive sheet can be reduced.

[0032] 6 is a front view of semiconductor manufacturing apparatus 200 according to a modified example of the second embodiment. Semiconductor manufacturing apparatus 200 may include a push-up rod 11 configured to push up the adhesive sheet toward the suction surface of collet 2 when the adhesive sheet comes into contact with collet 2. Push-up rod 11 is installed below the adhesive sheet. Control of push-up rod 11 may be performed by control unit 4. This can improve the adhesion between collet 2 and the adhesive sheet, and improve the foreign matter removal capability.

[0033] 7A and 7B are diagrams showing examples of the shape of the surface of the push-up rod 11 according to the second embodiment. As shown in FIG. 7A, the shape of the contact surface of the push-up rod 11a with the adhesive sheet may be circular or annular. As shown in FIG. 7B, the shape of the contact surface of the push-up rod 11b with the adhesive sheet may be rectangular. Also, the contact surface of the push-up rod 11 with the adhesive sheet may be uneven. FIG. 7B shows an example in which checkered unevenness is formed on the contact surface of the push-up rod 11b. The shape of the contact surface of the push-up rod 11 and the shape of the unevenness can be appropriately changed according to the shape of the collet 2, the purpose, etc. For example, striped unevenness may be formed on the contact surface of the push-up rod 11.

[0034] Embodiment 3 8A and 8B are front views of semiconductor manufacturing apparatus 300 according to embodiment 3. This embodiment differs from embodiment 2 in that a plurality of collets 2 are provided. In this embodiment, collets 2a and 2b are provided as collets 2 that transport semiconductor chips 6 from source stage 7a to destination stage 7b. Note that destination stage 7b is omitted in FIGS. 8A and 8B.

[0035] The semiconductor manufacturing equipment 300 includes a chip transport section 220 having a collet 2a and a collet 2b. In the chip transport section 220, a transport arm 1 is formed in a bifurcated shape. A first transport arm 1a is provided on one of the two branches of the transport arm 1, and a second transport arm 1b is provided on the other. A collet 2a is provided at the tip of the first transport arm 1a, and a collet 2b is provided at the tip of the second transport arm 1b. The first transport arm 1a and the second transport arm 1b each have a mechanism for moving the collets 2a and 2b up and down.

[0036] An intake and exhaust unit 5a is connected to a hole in the suction surface of collet 2a, and an intake and exhaust unit 5b is connected to a hole in the suction surface of collet 2b. Chip transport unit 220 has vacuum valves 13a and 13b that open and close the intake and exhaust lines of intake and exhaust units 5a and 5b, respectively. Under normal conditions, vacuum valves 13a and 13b are closed. In addition, a rotation mechanism 12 that rotates transport arm 1 as shown by arrow 88 is provided at the base of transport arm 1.

[0037] Next, the operation of semiconductor manufacturing equipment 300 will be described. As shown in Fig. 8A, first transfer arm 1a descends and collet 2a comes into contact with semiconductor chip 6. At this time, second transfer arm 1b descends and the suction surface of collet 2b comes into contact with foreign matter removal unit 3. Next, as shown in Fig. 8B, vacuum valve 13a opens and semiconductor chip 6 is vacuum-sucked by collet 2a as shown by arrow 89. At this time, vacuum valve 13b is in a closed state.

[0038] Next, the first transfer arm 1a and the second transfer arm 1b are raised to transfer the adsorbed semiconductor chip 6 to the destination stage 7b. At this time, the entire transfer arm 1 or the entire chip transfer section 220 may be raised.

[0039] When the next semiconductor chip 6 is to be transported, the positions of collet 2a and collet 2b are reversed by rotation mechanism 12. This allows collet 2b to come into contact with semiconductor chip 6, and collet 2a to come into contact with foreign matter removal unit 3. At this time, vacuum valve 13b is opened, and semiconductor chip 6 is attracted by vacuum suction. Note that vacuum valve 13a is closed. Control unit 4 performs control so that the above operations are repeated.

[0040] In this manner, the chip transport unit 220 of the present embodiment is configured so that when the collet 2a holds the semiconductor chip 6 on the source stage 7a, the collet 2b comes into contact with the foreign matter removal unit 3. Also, the chip transport unit 220 is configured so that when the collet 2b holds the semiconductor chip 6 on the source stage 7a, the collet 2a comes into contact with the foreign matter removal unit 3.

[0041] In this embodiment, the vertical movement of the arm when suctioning the semiconductor chip 6 and the stamping operation are performed simultaneously, so that the tact time required for cleaning the collet 2 can be reduced.

[0042] 9A to 9D are plan views of a semiconductor manufacturing apparatus 400 according to a first modified example of the third embodiment. Foreign matter removal units 3a and 3b, which are adhesive sheets, may be provided on the source stage 7a side and the destination stage 7b side, respectively. In the first modified example, the chip transport unit 220 is configured as follows. First, as shown in FIG. 9A, when the collet 2a holds the semiconductor chip 6 on the source stage 7a, the collet 2b and the foreign matter removal unit 3a come into contact with each other. Next, while the collet 2a holds the semiconductor chip 6, the positions of the collet 2a and the collet 2b are reversed by the rotating mechanism 12. Next, as shown in FIG. 9B, when the collet 2a mounts the semiconductor chip 6 on the destination stage 7b, the collet 2b and the foreign matter removal unit 3b come into contact with each other.

[0043] 9C, when collet 2b holds semiconductor chip 6 on source stage 7a, collet 2a comes into contact with foreign matter removal unit 3a. Next, with collet 2b holding semiconductor chip 6, the positions of collet 2a and collet 2b are reversed by rotation mechanism 12. Next, when collet 2b mounts semiconductor chip 6 on destination stage 7b, collet 2a comes into contact with foreign matter removal unit 3b.

[0044] In this modification, by also providing an adhesive sheet on the destination stage 7b side, the number of stamps on the adhesive sheet can be increased, and the foreign matter removal capability can be further improved. Although the foreign matter removal units 3a and 3b are provided separately in Figs. 9 to 9D, a common foreign matter removal unit 3 may be provided on both the source stage 7a side and the destination stage 7b side.

[0045] 10A to 10D are plan views of semiconductor manufacturing apparatus 500 according to a second modified example of embodiment 3. The second modified example differs from the first modified example in that an adhesive removal unit 14 is provided instead of foreign matter removal unit 3b. The other configurations are similar to those of the first modified example. The adhesive removal unit 14 is, for example, a cleaning sheet for removing adhesive.

[0046] In the second modified example, the chip transport unit 220 is configured as follows. First, as shown in Fig. 10A, when the collet 2a holds the semiconductor chip 6 on the source stage 7a, the collet 2b comes into contact with the foreign matter removal unit 3. Next, while the collet 2a holds the semiconductor chip 6, the positions of the collet 2a and the collet 2b are reversed by the rotation mechanism 12. Next, as shown in Fig. 10B, when the collet 2a mounts the semiconductor chip 6 on the destination stage 7b, the collet 2b comes into contact with the adhesive removal unit 14.

[0047] 10C, when collet 2b holds semiconductor chip 6 on source stage 7a, collet 2a comes into contact with foreign matter removal unit 3. Next, with collet 2b holding semiconductor chip 6, the positions of collet 2a and collet 2b are reversed by rotation mechanism 12. Next, when collet 2b mounts semiconductor chip 6 on destination stage 7b, collet 2a comes into contact with adhesive removal unit 14.

[0048] There is a concern that the stamping operation on the adhesive sheet may cause glue components to adhere and remain on the surface of the collet 2. According to the second modified example, the adhesive on the surface of the collet 2 can be removed by the adhesive remover 14.

[0049] Embodiment 4 11A and 11B are plan views of a semiconductor manufacturing apparatus 600 according to the fourth embodiment. In the first to third embodiments, the source stage 7a, the foreign matter removal unit 3, and the destination stage 7b are arranged on a straight line. However, the source stage 7a, the foreign matter removal unit 3, and the destination stage 7b may be arranged on a circle. In other words, the foreign matter removal unit 3 is provided on the circle between the destination stage 7b and the source stage 7a.

[0050] In this embodiment, collets 2a, 2b, and 2c are provided as the collet 2 that transports the semiconductor chip 6 from the source stage 7a to the destination stage 7b. The semiconductor manufacturing apparatus 600 includes a chip transport section 620 having the collets 2a, 2b, and 2c. In the chip transport section 620, the transport arm 1 is formed in a three-pronged shape. The transport arm 1 includes a first transport arm 1a, a second transport arm 1b, and a third transport arm 1c. The collet 2a is provided at the tip of the first transport arm 1a, the collet 2b is provided at the tip of the second transport arm 1b, and the collet 2c is provided at the tip of the third transport arm 1c. The first transport arm 1a, the second transport arm 1b, and the third transport arm 1c each have a mechanism for moving the collets 2a, 2b, and 2c up and down.

[0051] The holes on the suction surface of the collet 2a are connected to the suction and exhaust unit 5a, the holes on the suction surface of the collet 2b are connected to the suction and exhaust unit 5b, and the holes on the suction surface of the collet 2c are connected to the suction and exhaust unit 5c. The chip transport unit 620 has vacuum valves 13a, 13b, and 13c that open and close the suction and exhaust lines of the suction and exhaust units 5a, 5b, and 5c, respectively. Under normal circumstances, the vacuum valves 13a, 13b, and 13c are closed. In addition, a rotation mechanism 12 that rotates the transport arm 1 as shown by the arrow 90 is provided at the base of the transport arm 1. In other words, the control unit 4 is configured to rotate the chip transport unit 620.

[0052] The collets 2a, 2b, and 2c are arranged on a circle centered on the rotation mechanism 12. In other words, the tips of the first transfer arm 1a, the second transfer arm 1b, and the third transfer arm 1c are located at the vertices of an equilateral triangle centered on the rotation mechanism 12.

[0053] Next, the operation of semiconductor manufacturing apparatus 600 will be described. In the state shown in Fig. 11A, collet 2a is located directly above source stage 7a, collet 2b is located directly above destination stage 7b, and collet 2c is located directly above foreign matter removal section 3. Collets 2a and 2c do not hold a semiconductor chip 6, and collet 2b holds a semiconductor chip 6b. Vacuum valves 13a and 13c are in a closed state, and vacuum valve 13b is in an open state. A semiconductor chip 6a is placed on source stage 7a, and no semiconductor chip 6 is placed on destination stage 7b.

[0054] Next, the first transfer arm 1a descends, and the collet 2a comes into contact with the semiconductor chip 6a. At this time, the second transfer arm 1b descends, and the semiconductor chip 6b held by the collet 2b comes into contact with the destination stage 7b. Furthermore, the third transfer arm 1c descends, and the collet 2c comes into contact with the adhesive sheet. At this time, the vacuum valve 13a is closed, the vacuum valve 13b is open, and the vacuum valve 13c is closed.

[0055] Next, while vacuum valves 13a and 13c are kept closed, vacuum valve 13b is closed and the semiconductor chip 6b held by collet 2b is released from vacuum suction. This causes semiconductor chip 6b to be mounted on destination stage 7b. Next, while vacuum valves 13b and 13c are kept closed, vacuum valve 13a is opened and collet 2a vacuum suctions semiconductor chip 6a.

[0056] In this manner, collet 2a holds semiconductor chip 6 on source stage 7a, collet 2b mounts semiconductor chip 6 on destination stage 7b, and collet 2c comes into contact with foreign matter removal unit 3. This state is referred to as a first state.

[0057] Next, the first transfer arm 1a, the second transfer arm 1b, and the third transfer arm 1c are raised, and the rotation mechanism 12 is rotated clockwise by 120° as indicated by the arrow 90. Fig. 11B shows the state after the rotation. In the state shown in Fig. 11B, the collet 2a is located directly above the destination stage 7b, the collet 2b is located directly above the foreign matter removal unit 3, and the collet 2c is located directly above the destination stage 7b.

[0058] In this state, collet 2c holds semiconductor chip 6c on source stage 7a, collet 2a mounts semiconductor chip 6a on destination stage 7b, and collet 2b comes into contact with foreign matter removal unit 3. This state is called the second state. In this way, chip transport unit 620 is configured to change from the first state to the second state by rotating. Such control is repeated by control unit 4.

[0059] In this embodiment, the arm can simultaneously move up and down when suctioning the semiconductor chip 6, move up and down when releasing the suction of the semiconductor chip 6, and stamp the foreign matter removal unit 3. Therefore, the tact time can be further reduced compared to the third embodiment.

[0060] Embodiment 5. Fig. 12 is a diagram showing a foreign matter removal unit 15 according to embodiment 5. The adhesive sheets described in embodiments 1 to 4 are an example of the foreign matter removal unit 3. As the foreign matter removal unit 15, other foreign matter removal mechanisms such as a brush as shown in Fig. 12 may be provided.

[0061] FIG. 13 is a diagram for explaining the configuration of the control unit 4. Each function of the control unit 4 is realized by at least one processing circuit 93. That is, the processing circuit 93 transports the semiconductor chip 6 from the source stage 7a to the destination stage 7b by the collet 2, and brings the foreign matter removal unit 3 and the collet 2 into contact when the collet 2 returns from the destination stage 7b to the source stage 7a. The processing circuit 93 may be dedicated hardware. The processing circuit 93 may be composed of at least one processor 91 that executes a program stored in at least one memory 92. The processor 91 is also called a CPU (Central Processing Unit), a central processing unit, a processing unit, an arithmetic unit, a microprocessor, a microcomputer, or a DSP (Digital Signal Processor).

[0062] When the processing circuit 93 is a dedicated hardware, the processing circuit 93 may be, for example, a single circuit, a composite circuit, a programmed processor, or a parallel programmed processor. The processing circuit 93 may also be an ASIC (Application Specific Integrated Circuit) or an FPGA (Field-Programmable Gate Array). The processing circuit 93 may also be a combination of these. Each function of the control unit 4 may be realized by a separate processing circuit 93. The functions of each unit may also be realized by a single processing circuit 93.

[0063] When the processing circuitry 93 is a processor 91, the functions of the control unit 4 are realized by software, firmware, or a combination of software and firmware. The software and firmware are written as programs and stored in the memory 92. The processing circuitry 93 realizes the functions of each unit by reading and executing the programs stored in the memory 92.

[0064] That is, the memory 92 stores a program for transporting the semiconductor chip 6 from the source stage 7a to the destination stage 7b by the collet 2, and for bringing the foreign matter removal unit 3 into contact with the collet 2 when the collet 2 returns from the destination stage 7b to the source stage 7a. It can also be said that these programs cause the computer to execute the procedures or methods in the control unit 4.

[0065] Here, the memory 92 may be a non-volatile or volatile semiconductor memory such as RAM, ROM, flash memory, EPROM, EEPROM, etc., a magnetic disk, a flexible disk, an optical disk, a compact disk, a mini disk, a DVD, etc. RAM is an abbreviation for Random Access Memory. ROM is an abbreviation for Read Only Memory. EPROM is an abbreviation for Erasable Programmable Read Only Memory. EEPROM is an abbreviation for Electrically Erasable Programmable Read-Only Memory. DVD is an abbreviation for Digital Versatile Disc.

[0066] It should be noted that some of the functions of the control unit 4 may be realized by dedicated hardware and some by software or firmware. In this way, the processing circuit 93 can realize each of the above-mentioned functions by hardware, software, firmware, or a combination of these.

[0067] The technical features described in each embodiment may be used in appropriate combination. [Explanation of symbols]

[0068] 1 Transport arm, 1a First transport arm, 1b Second transport arm, 1c Third transport arm, 2, 2a, 2b, 2c Collet, 3, 3a, 3b Foreign object removal section, 4 Control section, 5, 5a, 5b, 5c Suction and exhaust section, 6, 6a, 6b, 6c Semiconductor chip, 7a Source stage, 7b Destination stage, 8 Foreign object, 9, 10 Roller, 11, 11a, 11b Push-up rod, 12 Rotation mechanism, 13a, 13b, 13c Vacuum valve, 14 Adhesive removal section, 15 Foreign object removal section, 91 Processor, 92 Memory, 93 Processing circuit, 100 Semiconductor manufacturing equipment, 200 Semiconductor manufacturing equipment, 220 Chip transport section, 300 Semiconductor manufacturing equipment, 400 Semiconductor manufacturing equipment, 500 Semiconductor manufacturing equipment, 600 Semiconductor manufacturing equipment, 620 Chip transport section

Claims

1. A source stage; A destination stage; a first collet that transports a semiconductor chip from the source stage to the destination stage; a foreign object removal unit provided between the destination stage and the source stage on a straight line or a circular line; a control unit configured to control an operation of the first collet and bring the first collet into contact with the foreign matter removal unit when the first collet returns from the destination stage to the source stage; A semiconductor manufacturing apparatus comprising:

2. 2. The semiconductor manufacturing apparatus according to claim 1, wherein the source stage, the foreign matter removal section, and the destination stage are aligned on a straight line.

3. the foreign matter removal portion is an adhesive sheet that is larger than the suction surface of the first collet, the source stage, the foreign matter removal unit, and the destination stage are aligned in a first direction, The semiconductor manufacturing apparatus of claim 2, wherein the control unit is configured to move a contact portion of the adhesive sheet with the first collet in a positive direction of the first direction each time the adhesive sheet is brought into contact with the first collet, and when the contact portion reaches a turning point, to move the contact portion in a second direction perpendicular to the first direction, and then to move the contact portion in a negative direction of the first direction.

4. a chip transport unit having the first collet and a second collet that transports a semiconductor chip from the source stage to the destination stage, 3. The semiconductor manufacturing apparatus according to claim 2, wherein the chip transport unit is configured such that when the first collet holds a semiconductor chip at the source stage, the second collet comes into contact with the foreign matter removal unit, and when the second collet holds a semiconductor chip at the source stage, the first collet comes into contact with the foreign matter removal unit.

5. 5. The semiconductor manufacturing apparatus according to claim 4, wherein the chip transport unit is configured such that when the first collet mounts a semiconductor chip on the destination stage, the second collet comes into contact with the foreign matter removal unit, and when the second collet mounts a semiconductor chip on the destination stage, the first collet comes into contact with the foreign matter removal unit.

6. the foreign matter removal unit is an adhesive sheet, Further comprising an adhesive removal unit, 5. The semiconductor manufacturing apparatus according to claim 4, wherein the chip transport unit is configured such that when the first collet mounts a semiconductor chip on the destination stage, the second collet comes into contact with the adhesive removal unit, and when the second collet mounts a semiconductor chip on the destination stage, the first collet comes into contact with the adhesive removal unit.

7. 2. The semiconductor manufacturing apparatus according to claim 1, wherein the source stage, the foreign matter removal section, and the destination stage are arranged on a circumference of a circle.

8. a chip transport unit including the first collet, a second collet that transports the semiconductor chip from the source stage to the destination stage, and a third collet that transports the semiconductor chip from the source stage to the destination stage, The control unit is configured to rotate the chip transport unit; 8. The semiconductor manufacturing apparatus according to claim 7, wherein the chip transport unit is configured to rotate to change from a first state in which the first collet holds a semiconductor chip on the source stage, the second collet loads a semiconductor chip on the destination stage, and the third collet is in contact with the foreign matter removal unit, to a second state in which the third collet holds a semiconductor chip on the source stage, the first collet loads a semiconductor chip on the destination stage, and the second collet is in contact with the foreign matter removal unit.

9. 9. The semiconductor manufacturing apparatus according to claim 1, wherein the foreign matter removal unit is an adhesive sheet.

10. The semiconductor manufacturing apparatus according to claim 9, further comprising a roller for winding up the adhesive sheet.

11. 10. The semiconductor manufacturing apparatus according to claim 9, further comprising a push-up rod configured to push up the adhesive sheet toward the suction surface of the first collet when the adhesive sheet comes into contact with the first collet.

12. A collet is used to transport the semiconductor chip from the source stage to the destination stage. A method for manufacturing a semiconductor device, characterized in that when the collet returns from the destination stage to the source stage, the collet is brought into contact with a foreign matter removal unit provided between the destination stage and the source stage in a straight line or along a circumference.

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