Substrate mounting device, substrate processing apparatus, and position adjusting method

Abstract

To maintain a positional relation between a mounting surface of a mounting table and each of lifting pins in the most lowered state regardless of a temperature change.SOLUTION: A substrate mounting device includes: a mounting table that has a mounting surface on which a substrate is mounted and a plurality of through-holes penetrating in a vertical direction and opening through the mounting surface; lifting pins each of which is provided in each of the through-holes, and that is movable in the vertical direction relatively to the mounting table and supports the substrate from below; and an adjustment mechanism that is provided in each of the through-holes and can adjust a position of the lifting pin in the vertical direction in the corresponding through-hole. The lifting pin has a positioning portion supported from below by the adjustment mechanism.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present disclosure relates to a substrate mounting device, a substrate processing apparatus, and a position adjusting method. [Background technology]

[0002] For example, in the manufacturing process of flat panel displays (FPDs) and semiconductors, various processes such as dry etching, sputtering, CVD (chemical vapor deposition), etc. are performed on a substrate to be processed, such as a glass substrate or a semiconductor wafer. Such processes are performed, for example, with the substrate to be processed placed on a substrate placement table provided in a chamber. When the substrate to be processed is carried into or out of the chamber, the substrate to be processed is lifted from the substrate placement table by a plurality of lift pins provided so as to protrude from the placement surface of the substrate placement table, i.e., so as to be able to rise and fall relative to the placement surface.

[0003] When various processes are performed on the substrate to be processed, each lift pin descends and the substrate to be processed is placed on the placement surface. The placement surface has an electrostatic chuck structure and a bump shape formed by embossing or the like to support the substrate to be processed, and an inert gas such as He gas is supplied through a plurality of gas holes penetrating the electrostatic chuck structure, and heat is exchanged with the substrate to be processed. At this time, a minute gap is generated between the substrate to be processed and the placement surface, and a heat transfer gas is supplied to the minute gap. However, in order to uniformly remove a film from the substrate to be processed by etching, for example, it is necessary to uniformize the temperature distribution of the substrate to be processed. Therefore, in order to uniformize the distribution of the heat transfer gas in the minute gap, it is preferable to make the distance between the substrate to be processed and the lowered lift pin the same as the distance between the substrate to be processed and the placement surface.

[0004] In response to this, a technique is known in which the height position of the lift pin is adjusted to match the position of the tip of the lift pin with the placement surface (see, for example, Patent Document 1). The lift pin described in Patent Document 1 has a cylindrical portion and a lid portion that covers the cylindrical portion, and is configured so that the height of the lid portion relative to the cylindrical portion is adjustable. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2020-17590 A Summary of the Invention [Problem to be solved by the invention]

[0006] The technique according to the present disclosure can maintain the positional relationship between the mounting surface of the mounting table and each of the lift pins in the most lowered state, regardless of temperature changes. [Means for solving the problem]

[0007] One aspect of the technology disclosed herein comprises a mounting table having a mounting surface on which a substrate is placed and a plurality of through holes penetrating in the vertical direction and opening onto the mounting surface, lifting pins provided in each of the through holes, movable in the vertical direction relative to the mounting table and supporting the substrate from below, and adjustment mechanisms provided in each of the through holes, capable of adjusting the vertical position of the lifting pins in the corresponding through holes, and the lifting pins have positioning portions supported from below by the adjustment mechanisms. Effect of the Invention

[0008] According to the present disclosure, the positional relationship between the mounting surface of the mounting table and each lift pin in the most lowered state can be maintained regardless of temperature changes. [Brief description of the drawings]

[0009] [Figure 1] 1 is a schematic diagram illustrating an example of a substrate processing apparatus. [Diagram 2] 2 is a vertical enlarged cross-sectional view showing an example of a substrate mounting device included in the substrate processing apparatus; FIG. [Diagram 3] FIG. 3 is a schematic enlarged view showing an example of the region [B] surrounded by the two-dot chain line in FIG. [Figure 4] 2 is a vertical enlarged cross-sectional view showing an example of a substrate mounting device included in the substrate processing apparatus; FIG. [Diagram 5] 11 is an enlarged view showing an example of a cylindrical member of an adjustment mechanism included in the substrate mounting device. FIG. [Figure 6] 4 is an enlarged view showing an example of a minute gap provided in the mounting surface of the substrate mounting table. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] However, in the technology of the above-mentioned Patent Document 1, the lift pins have a lid portion that contacts the substrate and a tubular portion that is in separable contact with the lift mechanism below the lid portion, and when the substrate to be processed is processed, the lift pins are separated from the lift mechanism provided below the substrate mounting table, and contact with the substrate mounting table only by the weight of the lift pins or the surface pressure of the weight of the lift pins and an inert gas such as He. Therefore, the position of the tip of the lid of the lift pin may be shifted from the mounting surface due to the difference in the amount of thermal expansion caused by the temperature difference and the difference in the thermal expansion coefficient between the substrate mounting table and the lift mechanism during processing. In addition, the lift pins may fall off during the up and down movement. Furthermore, the product of the processing of the substrate to be processed adheres to the lid portion, increasing the actual diameter, and the lift pins may get caught in the lift pin hole of the substrate mounting table during the downward movement. As a result, when the lift mechanism is in the downward position, the position of the tip of the lid may not match the mounting surface due to the fall of the lift pin.

[0011] Hereinafter, an embodiment of the technology according to the present disclosure will be described with reference to the drawings. However, the configurations described in the following embodiments are merely examples, and the present invention is not limited to these configurations. For example, each part included in this configuration can be replaced with any other part that can perform the same function. In addition, any other components may be added.

[0012] FIG. 1 is a schematic diagram showing an example of a substrate processing apparatus. FIG. 1(a) is a schematic cross-sectional view of the substrate processing apparatus. FIG. 1(b) is a view seen from the direction of the arrow A in FIG. 1(a) (plan view of the substrate placement table). The substrate processing apparatus 10 shown in FIG. 1(a) is an apparatus used in the manufacturing process of, for example, a flat panel display (FPD) or a semiconductor. The substrate processing apparatus 10 of this embodiment can perform plasma processing on a glass substrate (hereinafter referred to as "substrate G") as a substrate to be processed. The substrate to be processed is not limited to a glass substrate, but may be a semiconductor wafer. The substrate processing apparatus 10 includes a substrate placement device 1, a processing chamber 20 in which the substrate placement device 1 is housed, an exhaust section (not shown) and a gas supply section (not shown) for adjusting the pressure in the processing chamber 20, an antenna chamber 80 in which a high-frequency antenna for converting the supplied gas into plasma is housed, and a high-frequency power supply section (not shown). In the processing chamber 20, the substrate G is subjected to plasma processing while being placed on the substrate placement device 1. The processing chamber 20 is composed of a container body 100 having a bottomed rectangular cylindrical shape, a rectangular metal window 120, and a rectangular frame-shaped metal frame 110. The container body 100 is made of a conductive material such as aluminum, and is electrically grounded. An opening is formed on the upper surface of the container body 100. This opening has a metal window 120 and a metal frame 110, which are insulated from the container body 100, and is airtightly closed by a seal member 111 provided between the container body 100 and the metal frame 110. A gate valve is provided on the side wall of the container body 100 to open and close a transfer inlet and a transfer outlet (not shown) for transferring the substrate G into and out of the processing space 20. The metal frame 110 is made of a metal material such as aluminum, and is provided on the upper surface side of the side wall of the container body 100. The space surrounded by the container body 100, the metal frame 110 and the metal window 120 houses the mounting table 2 and constitutes the processing space 20 in which the substrate G is located during plasma processing. The processing container is configured as a processing vessel that can be depressurized by a gas supply section and an exhaust section (not shown) connected to the processing space 20, and constitutes the aforementioned substrate processing apparatus 10 that performs plasma processing using high-frequency power supplied from a high-frequency power supply section (not shown) outside the antenna chamber 80 to a high-frequency antenna (not shown) installed in the antenna chamber 80 in the space above the metal window 120.

[0013] The substrate mounting device 1 has a mounting table 2 that is fixedly installed in a processing chamber 20. The mounting table 2 is provided so as to face the metal window 120. The mounting table 2 is installed on the bottom surface of the container body 100 via legs 132, and the mounting table 2 is prevented from bending even when the inside of the container body 100 is maintained in a vacuum by an insulated bolt (not shown) that connects the lower surface of the mounting table 2 to the container body 100. The upper surface of the mounting table 2 is flat and serves as a mounting portion 21 on which the substrate G is mounted. FIG. 6 is an enlarged view showing an example of a minute gap provided on the mounting surface of the substrate mounting table. As shown in FIG. 6, the mounting table 2 is provided with a base 2a made of a metal material such as stainless steel or aluminum, i.e., a material having electrical conductivity, and an electrostatic chuck 2b that holds the substrate G by electrostatic adsorption. The mounting portion 21 functions as a lower electrode during plasma processing. A high-frequency power supply unit (not shown) is connected to the base 2a. The high frequency power supply unit supplies high frequency bias power to the base portion 2a, so that ions in the plasma generated in the processing space 20 can be attracted to the substrate G.

[0014] As shown in FIG. 1(b), the mounting table 2 has a plurality of through holes 22 that penetrate the mounting table 2 in the vertical direction, i.e., in the height direction, and open to the mounting portion 21. These through holes 22 are distributed and arranged at positions that overlap with the substrate G in a plan view. As will be described later, each through hole 22 is provided with a lift pin 3 that supports the substrate G from the lower surface side. Note that the number and arrangement of the through holes 22 (how they are arranged) are not limited to those shown in FIG. 1(b). Also, the shape of the through holes 22 in a plan view is circular in FIG. 1(b), but is not limited thereto, and may be, for example, a quadrangle such as a square or a rectangle, an oval, or the like.

[0015] FIG. 2 is a vertical enlarged cross-sectional view showing an example of a substrate mounting device provided in a substrate processing apparatus. FIG. 2(a) is a view showing a state in which lift pins of the substrate mounting device are located at an initial position (home position). FIG. 2(b) is a view showing a state in which the lift pins are in the middle of moving upward or downward. FIG. 2(c) is a view showing a state in which the lift pins are stopped at the uppermost position. FIG. 3 is a schematic enlarged view showing an example of an area [B] surrounded by a two-dot chain line in FIG. 2. FIG. 3(a) is a view showing a state in which the lift pins are located at a first position. FIG. 3(b) is a view showing a state in which the lift pins are located at a second position.

[0016] As shown in FIG. 2(a) to FIG. 2(c), the lift pins 3 are supported in the through holes 22 so as to be movable up and down relative to the mounting table 2. This allows the lift pins 3 to move in and out of the through holes 22. The lift pins 3 are used when carrying the substrate G into the processing chamber 20 or carrying it out from the processing chamber 20. When carrying the substrate G into the processing chamber 20, each lift pin 3 is protruded to the uppermost position from the mounting portion 21 of the mounting table 2, and the substrate G from a transport arm (not shown) can be supported on each lift pin 3 in this state (see FIG. 2(c)). Then, each lift pin 3 lowers to the initial position (lowest position) while supporting the substrate G, enabling plasma processing of the substrate G on the mounting table 2 (see FIG. 2(a)). When the substrate G after the plasma processing is to be removed from the processing chamber 20, the lift pins 3 are again extended from the mounting portion 21 of the mounting table 2 to the uppermost position, so that the substrate G is supported on the lift pins 3 (see FIG. 2(c)). Then, in this state, the substrate G can be removed by the transport arm.

[0017] The lift pin 3 is made of a cylindrical member. The lift pin 3 has an enlarged diameter portion (large diameter portion) 31, an intermediate portion (medium diameter portion) 32, and a reduced diameter portion (small diameter portion) 33, which are arranged in this order from the top. The enlarged diameter portion 31 is a portion where the outer diameter is the largest enlarged diameter. The reduced diameter portion 33 is a portion where the outer diameter is the smallest reduced diameter. The intermediate portion 32 is a portion where the outer diameter is intermediate between the enlarged diameter portion and the reduced diameter portion. At least the upper surface 311 of the enlarged diameter portion 31 of the lift pin 3 is made of a metal material such as stainless steel or aluminum. The upper surface 311 functions as a lower electrode during plasma processing, similar to the placement portion 21. In this embodiment, the lift pin 3 is made of a solid body, but is not limited thereto, and may be made of a hollow body, for example.

[0018] As shown in FIG. 2(a) to FIG. 2(c), a driving unit 4 for moving the lift pins 3 in the up and down direction is provided below each lift pin 3. The configuration of the driving unit 4 is not particularly limited, and may be, for example, a configuration having a motor or a configuration having an air cylinder. For example, as shown in FIG. 1, a third connecting member 63 supporting the lift pins 3 passes through an insertion hole 100b provided in a bottom wall 100a of the container body 100, extends downward from the container body 100, and is connected to a support member 40. The support member 40 is located outside the container body 100, and has a conductive member 41 constituting an upper portion and an insulating member 42 provided below the conductive member 41. A conductive bellows 44 for isolating a vacuum atmosphere from an atmospheric atmosphere is provided between the conductive member 41 of the support member 40 and the lower surface 2c of the mounting table. A sliding member 46 is provided below the support member 40, and is guided in the vertical direction relative to the lower surface 100c of the container body 100 by a guide member 45 connected to the lower surface 100c of the container body 100. In addition, the lower surface of the sliding member 46 is connected to a linear motion unit (not shown) that combines a ball screw and a motor, and can be raised and lowered in the vertical direction relative to the lower surface of the container body 100 by a drive control device (not shown).

[0019] When processing the substrate G, each lift pin 3 is lowered, and the substrate G is placed on the placement part 21. As shown in FIG. 3(a), a minute gap SG is generated between the substrate G and the upper surface of the dielectric layer 2f of the placement part 21 described later, and the heat transfer gas Q is supplied to the minute gap SG. In order to uniformly remove the film on the substrate G by, for example, etching, it is necessary to uniformize the temperature distribution of the substrate G. Therefore, in order to uniformize the distribution of the heat transfer gas Q in the minute gap SG, it is preferable to set the distance D1 between the substrate G and the lift pin 3 at the initial position to the same size as the distance D2 between the substrate G and the upper surface of the dielectric layer 2f. The minute gap SG can be generated by placing the substrate G on a plurality of protruding portions formed on the placement part 21 in a protruding shape. For example, as shown in FIG. 6, a plurality of protruding portions 2d made of a dielectric material are formed in a protruding shape on the surface of the base part 2a of the placement table, and the protruding portions 2d are surrounded by an insulating member 2e. The upper surface of the protrusion 2d is equal to or lower than the upper surface of the insulating member 2e. More preferably, the upper surface of the protrusion 2d is at the same height as the upper surface of the insulating member 2e, and when the substrate G is placed on the mounting table 2, it is in contact with the upper surface of the insulating member 2e and the upper surface of the protrusion 2d. In addition, a thin dielectric layer 2f made of the same dielectric material as the protrusion 2d is formed below the protrusion 2d, and the minute space SG refers to the space between the upper surface of the protrusion 2d and the upper surface of the dielectric layer 2f.

[0020] Therefore, the substrate mounting device 1 is configured to be able to adjust the distance D1 between the substrate G and the lift pins 3 at the initial position to be equal to the distance D2 between the substrate G and the upper surface of the dielectric layer 2f. Hereinafter, this configuration (position adjustment method) and operation will be described. As shown in FIG. 2(a) to FIG. 2(c), an adjustment mechanism 5 is provided in each through hole 22. The adjustment mechanism 5 is configured to be able to adjust the vertical position of the lift pins 3 in the through hole 22 in which the adjustment mechanism 5 is provided. In this embodiment, the adjustment mechanism 5 is configured to be able to adjust the vertical position of the lift pins 3 between a first position (see FIG. 3(a)) and a second position (see FIG. 3(b)). In the first position, the upper surface 311 of the lift pins 3 is located at the same height as the upper surface of the dielectric layer 2f. In the second position, the upper surface 311 of the lift pins 3 is located below the upper surface of the dielectric layer 2f (first position). As shown in FIG. 3(a) and FIG. 3(b), the adjustment mechanism 5 has a cylindrical member 51 supported in the through hole 22 so as to be movable in the vertical direction, and a fixed member 52 fixed to the mounting table 2. The cylindrical member 51 is a cylindrical member through which the lift pin 3 is inserted. A male screw 511 is formed on the outer periphery of the cylindrical member 51. A cylindrical fixed member 52 is arranged concentrically with the cylindrical member 51 on the outer periphery side of the cylindrical member 51. The lift pin 3 is inserted into the fixed member 52 in the same manner as the cylindrical member 51. A female screw 521 that screws into the male screw 511 of the cylindrical member 51 is formed on the inner periphery of the fixed member 52. The vertical position of the cylindrical member 51 can be adjusted by changing the amount of screwing between the male screw 511 of the cylindrical member 51 and the female screw 521 of the fixed member 52.

[0021] In the state shown in FIG. 3(a), the lower surface 312 of the enlarged diameter portion 31 of the lift pin 3 abuts against the upper surface (upper end) 512 of the cylindrical member 51. This positions the lift pin 3 at a first position where the upper surface 311 of the lift pin 3 is at the same height as the upper surface of the dielectric layer 2f. In this state, it is preferable to process the substrate G. Also, in the state shown in FIG. 3(b), the lower surface 312 of the enlarged diameter portion 31 of the lift pin 3 abuts against the upper surface 512 of the cylindrical member 51 as in the state shown in FIG. 3(a), but the lift pin 3 is positioned at a second position where the upper surface 311 is located below the upper surface of the dielectric layer 2f. Thus, in this embodiment, the enlarged diameter portion 31 functions as a positioning portion that is supported and positioned by the adjustment mechanism 5 from below. Note that a method for changing the amount of screwing between the cylindrical member 51 and the fixing member 52 will be described later with reference to FIG. 4(b).

[0022] The cylindrical member 51 is made of a metal material. At least the portion of the fixing member 52 that is screwed with the cylindrical member 51 has a metal material component 53 made of a metal material and a resin material component 54 made of a resin material. The material of the cylindrical member 51 and the metal material component 53 is not particularly limited, and examples of the material include metal materials such as stainless steel and aluminum. In the substrate mounting device 1, the mounting table 2, the cylindrical member 51, the metal material component 53, and the lift pins 3 are made of metal materials, and the lift pins 3 are thermally connected to the mounting table 2 via the cylindrical member 51 and the metal material component 53. Here, "thermally connected" refers to a state in which the members are in contact with each other and heat is transferred quickly, that is, a state in which heat transfer is relatively high. The combination of being made of a metal material and being thermally connected allows the temperature distribution of the system including the mounting table 2, the cylindrical member 51, the metal material component 53, and the lift pins 3 to be uniform. This prevents a difference in thermal expansion between the mounting table 2 and the lift pins 3, which would cause a misalignment between the height of the upper surface 311 of the lift pins 3 and the height of the upper surface of the dielectric layer 2f, and therefore maintains the state shown in Fig. 3(a). In this manner, the substrate mounting device 1 can maintain the positional relationship between the mounting table 2 and the lift pins 3 at the initial position regardless of temperature changes. This allows the distance D1 between the substrate G and the lift pins 3 at the initial position to be the same as the distance D2 between the substrate G and the upper surface of the dielectric layer 2f, in order to uniformize the temperature distribution of the substrate G.

[0023] In this embodiment, the lift pin 3 is made of one member. This prevents a part of the lift pin 3 from falling off or getting caught in the through hole 22 during the up and down movement, which causes a misalignment between the height of the upper surface 311 of the lift pin 3 at the initial position and the height of the upper surface of the dielectric layer 2f. In this embodiment, the lift pin 3 is made of one member, but is not limited to this and may be made of multiple members. When the lift pin 3 is made of multiple members, it is preferable that the members are fixed to each other. When the lift pin 3 is made of multiple members, for example, the enlarged diameter portion 31 and the reduced diameter portion 33 may be made of a metal material such as stainless steel, and the middle portion 32 may be made of a resin material such as polyimide.

[0024] Here, for example, consider a case where the lift pin 3 is replaced with a new lift pin 3. In this case, depending on the individual difference of the lift pin 3, the height of the upper surface 311 of the lift pin 3 and the height of the upper surface of the dielectric layer 2f may become misaligned, that is, the distance D1 and the distance D2 may become different (for example, the state shown in FIG. 3(b)). In addition to the individual difference of the lift pin 3, the height of the upper surface 311 of the lift pin 3 and the height of the upper surface of the dielectric layer 2f may become misaligned over time (for example, the state shown in FIG. 3(b)). Even if such a misalignment occurs, it is possible to achieve the state shown in FIG. 3(a) by changing the amount of screwing between the cylindrical member 51 and the fixing member 52. The constituent material of the resin material constituent portion 54 is not particularly limited, and examples thereof include resin materials such as polyimide and fluororesin having heat resistance. This loosens the screwing between the cylindrical member 51 and the fixing member 52, and it is possible to prevent the cylindrical member 51 from being misaligned. Prevention of the positional deviation of the cylindrical member 51 contributes to prevention of the positional deviation of the upper surface 311 of the lift pin 3. When the fixing member 52 has the metal material constituent part 53 and the resin material constituent part 54, the fixing member 52 can be manufactured by, for example, two-color molding. In the present embodiment, the cylindrical member 51 (one side) of the cylindrical member 51 and the fixing member 52 is configured to have the metal material constituent part 53 and the resin material constituent part 54, but is not limited thereto. For example, the fixing member 52 may be configured to be made of a metal material, and the cylindrical member 51 may have the metal material constituent part 53 and the resin material constituent part 54.

[0025] As shown in FIG. 3(a) and FIG. 3(b), the adjustment mechanism 5 (substrate mounting device 1) is provided with a first seal member 55 and a second seal member 56. The first seal member 55 is disposed between the lift pins 3 and a portion of the fixed member 52 through which the lift pins 3 are inserted, and is concentric with the lift pins 3. The first seal member 55 is ring-shaped along the outer periphery of the lift pins 3, and seals the gap between the lift pins 3 and the fixed member 52. The second seal member 56 is disposed between the mounting table 2 and the fixed member 52, and is concentric with the fixed member 52. The second seal member 56 is ring-shaped along the outer periphery of the fixed member 52, and seals the gap between the mounting table 2 and the fixed member 52. The constituent materials of the first seal member 55 and the second seal member 56 are not particularly limited, and examples thereof include various heat-resistant rubber materials such as silicone rubber and fluororubber. As a result, the first seal member 55 is compressed between the lift pins 3 and the fixed member 52, and can adequately seal the gap between them. It is also preferable that the first seal member 55 is not compressed to an extent that it prevents the up and down movement of the lift pins 3. Like the first seal member 55, the second seal member 56 is also compressed between the mounting table 2 and the fixed member 52, and can adequately seal the gap between them.

[0026] As described above, the heat transfer gas Q is supplied to the minute gap SG between the substrate G and the upper surface of the dielectric layer 2f. The heat transfer gas Q is a temperature control gas for adjusting the temperature of the substrate G, and is discharged from the flow path 23 opening to the mounting portion 21 into the minute gap SG. The heat transfer gas Q is not particularly limited, and for example, an inert gas such as helium gas, nitrogen gas, or argon gas can be used. The heat transfer gas Q is likely to enter the inside of the mounting table 2 through the through hole 22, that is, from the mounting portion 21 side into the inside of the mounting table 2, but the first seal member 55 and the second seal member 56 can block this entry (the flow of the heat transfer gas Q), respectively. This makes it possible to prevent, for example, the heat transfer gas Q supplied to the minute gap SG from entering the inside of the mounting table 2 and being wasted. The supply of the heat transfer gas Q to the minute gap SG can be stopped depending on, for example, the processing of the substrate G. As described above, in the substrate mounting device 1, the mounting table 2, the cylindrical member 51, the metal material constituent part 53, and the lift pins 3 are made of metal materials, and the lift pins 3 are thermally connected to the mounting table 2 via the cylindrical member 51 and the metal material constituent part 53. Therefore, in the substrate mounting device 1, the first seal member 55 and the second seal member 56 are configured to prevent the lift pins 3 and the mounting table 2 from impeding heat transfer.

[0027] FIG. 4 is a vertically enlarged cross-sectional view showing an example of a substrate mounting device provided in a substrate processing apparatus. FIG. 4(a) is a view showing a state in which the driving unit is about to move the lift pins further downward from the state shown in FIG. 2(a). FIG. 4(b) is a view showing a state in which the vertical position of the cylindrical member, that is, the height of the cylindrical member, is adjusted. As shown in FIG. 4(a) (as well as in FIGS. 2(a) to 2(c)), the substrate mounting device 1 includes a connecting mechanism (connecting unit) 6 that connects the lift pins 3 and the driving unit 4, and a supporting member (supporting unit) 7 that supports the connecting mechanism 6 with respect to the mounting table 2. The connecting mechanism 6 includes a first connecting member 61, a second connecting member 62, a third connecting member 63, an elastic member (biasing member) 64, and a linear bush 65. The supporting member 7 is cylindrical and can house and support the connecting mechanism 6 inside.

[0028] The first connecting member 61 has a cylindrical portion 611 and a flange portion 612 provided at the lower end of the cylindrical portion 611. The lower end of the reduced diameter portion 33 of the lift pin 3 is inserted into the inside of the cylindrical portion 611. A female thread 613 is formed on the inner periphery of the cylindrical portion 611. Meanwhile, a male thread 331 that screws with the female thread 613 is formed on the lower end of the reduced diameter portion 33 of the lift pin 3. The female thread 613 screws with the male thread 331, thereby connecting the lift pin 3 and the first connecting member 61 (connecting mechanism 6). The flange portion 612 is a portion that is larger in diameter than the outer diameter of the cylindrical portion 611.

[0029] The third connecting member 63 is disposed below the first connecting member 61. The third connecting member 63 is formed of a cylindrical member, and its lower end is connected to the driving unit 4. The driving unit 4 allows the third connecting member 63 to move up and down together with the lifting pins 3. A linear bush 65 is disposed between the third connecting member 63 and the support member 7. The linear bush 65 is fixed to the inner periphery of the support member 7, and guides the third connecting member 63, which moves up and down together with the lifting pins 3. This allows the third connecting member 63 to move up and down smoothly. The smooth up and down movement of the third connecting member 63 contributes to the smooth up and down movement of the lifting pins 3.

[0030] The first connecting member 61 and the third connecting member 63 are connected via the second connecting member 62. The second connecting member 62 has a cylindrical portion 621, a lid portion 622 provided at the upper end of the cylindrical portion 621, and a protruding portion 623 provided at the lower end of the cylindrical portion 621. The cylindrical portion 621 has a bottomed tubular shape, and the first connecting member 61 is inserted into the cylindrical portion 621. The lid portion 622 has a ring shape along the circumferential direction of the cylindrical portion 621, and the cylindrical portion 611 of the first connecting member 61 is slidably fitted inside the lid portion 622. The protruding portion 623 is a portion that protrudes downward from the bottom of the cylindrical portion 621. The second connecting member 62 is connected to the third connecting member 63 by the protruding portion 623.

[0031] The elastic material 64 is composed of a coil spring. In the cylindrical portion 621 of the second connecting member 62, the elastic material 64 is concentrically arranged on the outer periphery of the cylindrical portion 611 of the first connecting member 61. The elastic material 64 is compressed between the flange portion 612 of the first connecting member 61 and the lid portion 622 of the second connecting member 62. As shown in FIG. 2(a), the lift pin 3 can be stored in the through hole 22 by the driving unit 4 and returned to the initial position. In this initial position, the enlarged diameter portion 31 of the lift pin 3 abuts against the cylindrical member 51 of the adjustment mechanism 5. As a result, the distance D1 between the substrate G and the lift pin 3 at the initial position is the same as the distance D2 between the substrate G and the upper surface of the dielectric layer 2f. In the state shown in FIG. 2(a), the lift pin 3 receives a biasing force from the elastic material 64 via the first connecting member 61. As a result, the lift pins 3 are pulled downward, and the enlarged diameter portion 31 is reliably brought into contact with the cylindrical member 51 of the adjustment mechanism 5. As a result, even if the lift pins 3 do not return to their initial position due to, for example, aging deterioration of the drive unit 4, the lift pins 3 can be returned to their initial position by the biasing force of the elastic material 64, and the reproducibility of making the distance D1 the same as the distance D2 can be ensured. In the state shown in FIG. 2(a), the elastic material 64 is not fully contracted, and a sufficient contraction allowance is ensured. As shown in FIG. 4(a), when the drive unit 4 further lowers the lift pins 3 from the state shown in FIG. 2(a), the elastic material 64 can be further compressed because a sufficient contraction allowance is ensured. This makes it possible to prevent the drive unit 4 from pulling the lift pins 3 excessively, and therefore to prevent deformation such as elongation or breakage of the lift pins 3. In this way, the elastic material 64 also functions as a buffer for mitigating the tensile force of the drive unit 4 acting on the lift pins 3. Here, the container body 100 and the mounting table 2 each have their own water passages (not shown) inside, and are individually connected to an external temperature control unit (not shown) by pipes such as heat-resistant hoses (not shown), through which a temperature control refrigerant circulates, and the temperature obtained from temperature measuring devices such as thermocouples (not shown) installed individually on the container body 100 and the mounting table 2 is monitored, and the temperature of the temperature control refrigerant circulating individually is adjusted by the external temperature control unit, thereby controlling the temperature.For example, when the temperature of the container body 100 is controlled at 110° C. and the temperature of the mounting table 2 is controlled at 30° C., the temperature of the third connecting member 63 becomes higher than the temperature of the mounting table 2 due to the temperature influence of the container body 100 via the guide member 45. In addition, when the temperature of the container body 100 is controlled at 80° C. and the temperature of the mounting table 2 is controlled at 110° C., the temperature of the third connecting member 63 becomes lower than the temperature of the mounting table 2 due to the temperature influence of the container body 100 via the guide member 45.

[0032] The elastic member 64 may be made of, for example, a rubber material such as polyurethane rubber having high thermal insulation properties, which reduces heat transfer from the third connecting member 63. If durability is a priority, it is preferable to use austenitic stainless steel or the like. If a rubber material is used as the elastic member 64, it is possible to suppress the flow of heat between the lift pins 3 and the drive unit 4, thereby suppressing the temperature change of the lift pins 3. In addition, the first connecting member 61, the second connecting member 62, and the third connecting member 63 may be made of, for example, a resin material such as polyimide having high heat resistance, which reduces heat transfer. If durability is a priority, it is preferable to use various metal materials such as stainless steel or aluminum.

[0033] Next, a method for adjusting the vertical position of the cylindrical member 51 of the adjustment mechanism 5, i.e., the height of the cylindrical member 51, will be described with reference to FIG. 4(b) and FIG. 5. FIG. 5 is an enlarged view showing an example of a cylindrical member of the adjustment mechanism provided in the substrate mounting device. FIG. 5(a) is an enlarged vertical cross-sectional view showing an example of the cylindrical member. FIG. 5(b) is an enlarged top view showing an example of the cylindrical member. As shown in FIG. 5(a) and FIG. 5(b), a pair of grooves 513 is provided on the upper surface 512 of the cylindrical member 51. The pair of grooves 513 are arranged on opposite sides of the central axis O51 of the cylindrical member 51. The pair of grooves 513 are engaged with the jig 30 collectively. In this embodiment, the jig 30 is a flat-head screwdriver.

[0034] [1] When adjusting the height of the cylindrical member 51, the antenna chamber 80 above the metal window 110 is lifted up, the antenna chamber 80 is separated from the processing chamber 20, and the processing chamber 20 is opened.

[0035] [2] Next, as shown in Fig. 4(b), the lift pins 3 are removed from the through holes 22 (cylindrical member 51). As described above, the lift pins 3 are connected to the first connecting member 61 of the connecting mechanism 6 by screwing. The lift pins 3 can be removed by releasing the screwing between the lift pins 3 and the first connecting member 61.

[0036] [3] Next, the jig 30 is engaged from above with the groove 513 of the cylindrical member 51 to bring it into an engaged state. Then, while maintaining this engaged state, the jig 30 rotates the cylindrical member 51 around its central axis O51. This rotation changes the amount of engagement between the cylindrical member 51 and the fixed member 52, thereby adjusting the height position of the cylindrical member 51. For example, by rotating the cylindrical member 51 in one direction around the central axis O51, the amount of engagement between the cylindrical member 51 and the fixed member 52 increases, and the height position of the cylindrical member 51 can be adjusted to be lower. In addition, by rotating the cylindrical member 51 in the opposite direction around the central axis O51, the amount of engagement between the cylindrical member 51 and the fixed member 52 decreases, and the height position of the cylindrical member 51 can be adjusted to be higher. It is preferable to previously grasp the rotation angle (unit: deg / μm) of the cylindrical member 51 per unit height.

[0037] [4] Next, the jig 30 is removed, the lift pin 3 is inserted into the through hole 22, and the lift pin 3 and the first connecting member 61 are connected to the connection limit.

[0038] [5] Next, it is confirmed whether or not the upper surfaces 311 of the lift pins 3 and the upper surface of the dielectric layer 2f are at the same height. The height is confirmed using a dial gauge. If the result of this confirmation is that the upper surfaces 311 and the upper surface of the dielectric layer 2f are at the same height, the door of the processing chamber 20 is closed, and the height adjustment of the cylindrical member 51 is completed. On the other hand, if the upper surfaces 311 and the upper surface of the dielectric layer 2f are not at the same height, steps [2] to [5] are repeated until the upper surfaces 311 and the upper surface of the dielectric layer 2f are at the same height.

[0039] In this embodiment, a flat-head screwdriver is used as the jig 30, but the present invention is not limited to this. For example, depending on the arrangement and shape of the grooves 513, a Phillips screwdriver, for example, can be used.

[0040] In this embodiment, the height of the cylindrical member 51 is adjusted so that the position of the upper surface 311 of the lifting pin 3 is at the same height as the upper surface of the dielectric layer 2f. However, it is of course also possible to adjust the height of the cylindrical member 51 so as to lower the position of the upper surface 311 toward the lower surface 2c of the mounting table 2 in order to adjust the temperature of the substrate G.

[0041] In this embodiment, the inductively coupled plasma apparatus having a metal window has been described as the substrate processing apparatus, but the present invention is not limited to this, and an inductively coupled plasma apparatus having a dielectric window instead of a metal window may be used. The plasma generation method applied to the substrate processing apparatus is also not limited to inductively coupled plasma, and may be a substrate processing apparatus using other plasma generation methods such as capacitively coupled plasma or microwave plasma.

[0042] Although the preferred embodiment of the present disclosure has been described above, the present disclosure is not limited to the above-mentioned embodiment, and various modifications and changes are possible within the scope of the gist of the disclosure. In the above embodiment, the lift pins 3 are movable in the vertical direction relative to the mounting table 2, but this is not limited to this. For example, the lift pins 3 may be installed in a fixed state, and the mounting table 2 may be movable in the vertical direction relative to the lift pins 3. In this case, the lift pins 3 can also appear and disappear in the through holes 22. In this way, it is sufficient that the lift pins 3 are movable in the vertical direction relative to the mounting table 2. [Explanation of symbols]

[0043] 1. Substrate placement device 2. Placement table 21 Placement surface 22 Through hole 3 Lifting pin 31 Expanded diameter part 5 Adjustment mechanism 10 Substrate processing equipment 20 Processing Room G board

Claims

1. a mounting table having a mounting surface on which a substrate is placed and a plurality of through holes extending vertically and opening into the mounting surface; a lift pin provided in each of the through holes, movable in a vertical direction relative to the mounting table, and supporting the substrate from a lower surface side; an adjustment mechanism provided in each of the through holes and capable of adjusting a vertical position of the lift pin in the corresponding through hole; The lift pins have a positioning portion supported from below by the adjustment mechanism.

2. The lift pin is formed of a cylindrical member and has an expanded diameter portion where the outer diameter of the cylindrical member is expanded, The substrate mounting device according to claim 1 , wherein the enlarged diameter portion functions as the positioning portion.

3. the adjustment mechanism has a cylindrical member through which the lift pin is inserted, 3. The substrate mounting device according to claim 2, wherein the lift pins are positioned by the enlarged diameter portion coming into contact with an upper end of the cylindrical member.

4. The cylindrical members are supported in the corresponding through holes so as to be movable in the up and down direction, 4. The substrate mounting device according to claim 3, wherein the vertical position of the cylindrical member can be adjusted by rotating the cylindrical member about its central axis using a jig engaged with the upper side of the cylindrical member.

5. The adjustment of the cylindrical member is performed in a state where the lift pin is removed from the cylindrical member, 5. The substrate mounting device according to claim 4, wherein a groove for engaging with the jig is provided at an upper end of the cylindrical member.

6. the adjustment mechanism includes a cylindrical member through which the lift pin is inserted, and a fixing member that is fixed to the mounting table at an outer circumferential side of the cylindrical member and that is screwed into the cylindrical member; 2. The substrate mounting device according to claim 1, wherein the cylindrical member is capable of adjusting its vertical position by changing an amount of screwing with the fixing member.

7. 7. The substrate mounting device according to claim 6, wherein at least a portion of one of said cylindrical member and said fixed member that is screwed into the other member is made of a metal material and a resin material.

8. 8. The substrate mounting device according to claim 7, wherein the other member is made of a metallic material.

9. the fixing member has a portion through which the lift pin is inserted, a first seal member that seals a gap between the lift pin and a portion of the fixed member through which the lift pin is inserted; The substrate mounting device according to claim 6 , further comprising: a second seal member that seals a gap between the mounting table and the fixed member.

10. a temperature control gas is supplied between the mounting surface and the substrate to adjust the temperature of the substrate; 10. The substrate mounting device according to claim 9, wherein the first seal member and the second seal member are each capable of blocking a flow of the temperature adjusting gas from the mounting surface side.

11. a drive unit provided below the lift pins and configured to move the lift pins in a vertical direction; a connecting portion that connects the lift pin and the drive portion, 2 . The substrate mounting device according to claim 1 , wherein the connecting portion has an elastic material that urges the lift pins downward to abut against the adjustment mechanism when the lift pins are housed in the corresponding through holes.

12. 12. The substrate mounting device according to claim 11, wherein the elastic member also functions as a buffer portion that buffers a tensile force of the drive portion acting on the lift pins when the drive portion lowers the lift pins.

13. The substrate mounting device according to claim 11 , wherein the lift pins and the connecting portion are connected by screwing.

14. The mounting table is installed in a fixed state, 2. The substrate mounting device according to claim 1, wherein the lift pins are configured to be movable in a vertical direction relative to the mounting table.

15. 2. The substrate mounting device according to claim 1, wherein the mounting table and the lift pins are each made of a metal material containing at least stainless steel or aluminum.

16. a substrate mounting device on which a substrate is mounted; a processing chamber in which the substrate mounting device is housed and processing is performed on the substrate, The substrate mounting device includes: a mounting table having a mounting surface on which a substrate is placed and a plurality of through holes extending vertically and opening into the mounting surface; a lift pin provided in each of the through holes, movable in a vertical direction relative to the mounting table, and supporting the substrate from a lower surface side; an adjustment mechanism provided in each of the through holes, capable of adjusting a vertical position of the corresponding through hole; The lift pins have a positioning portion supported from below by the adjustment mechanism.

17. a mounting table having a mounting surface on which a substrate is placed and a plurality of through holes penetrating in the vertical direction and opening into the mounting surface; a lift pin provided in each of the through holes, movable in a vertical direction relative to the mounting table, and supporting the substrate from a lower surface side; an adjustment mechanism provided in each of the through holes and capable of adjusting a vertical position of the lift pins in the corresponding through hole, the method comprising: A position adjustment method for positioning the lift pins by supporting the lift pins from below with the adjustment mechanism.

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