Transport device, molding device, and manufacturing method for article

Abstract

To provide a technique advantageous in accurately controlling the transport of a member by each hand in a transport device configured to drive a support member supporting a plurality of hands in a height direction.SOLUTION: A transport device includes a first hand that holds a first member, a second hand that holds a second member, a support member that supports the first hand and the second hand, a driving unit that drives the support member in a height direction to drive the first hand and the second hand in the height direction, and a control unit that controls a first process of transporting the first member to a first holding part by the first hand and a second process of transporting the second member to a second holding part by the second hand. On the basis of a driving error of the driving unit determined based on the movement of the first holding part in the first process, the control unit controls the driving of the second hand by the driving unit in the second process.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a conveying apparatus, a molding apparatus, and a method for manufacturing an article. [Background technology]

[0002] In a lithography apparatus that uses an original to form a pattern on a substrate, a transport device that holds and transports a member such as an original or a substrate may be provided. In such a transport device, an abnormality may occur such that the actual position of a hand that holds and moves a member is shifted from a designed position (target position) due to aging or the surrounding environment. If such an abnormality occurs, the hand or the member may unintentionally come into contact with other components in the lithography apparatus while the hand is transporting the member, and these may be damaged. Patent Document 1 describes that information on the transfer height position at which the substrate is transferred during the elevation and lowering of the substrate holder is obtained based on time-series data of the pressure of the suction path, which changes depending on whether the substrate is held by the substrate holder. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2017-139261 A Summary of the Invention [Problem to be solved by the invention]

[0004] In some transport devices, a support member that supports a plurality of hands is driven in a height direction to drive each of the plurality of hands in the height direction. In such a transport device, it is desirable to obtain a drive error when driving the support member by a simple method and to precisely control the transport of a member by each of the plurality of hands.

[0005] Therefore, an object of the present invention is to provide an advantageous technology for precisely controlling the transport of materials by each hand in a transport device configured to drive a support member that supports multiple hands in the vertical direction. [Means for solving the problem]

[0006] In order to achieve the above-mentioned object, a conveying device as one aspect of the present invention includes a first hand that holds a first member, a second hand that holds a second member, a support member that supports the first hand and the second hand, a drive unit that drives the first hand and the second hand in the height direction by driving the support member in the height direction, and a control unit that controls a first process of conveying the first member to a first holding unit by the first hand and a second process of conveying the second member to a second holding unit by the second hand, wherein the first holding unit is configured to be movable in the height direction, and in the first process, after driving the first hand in the height direction by the drive unit, the first holding unit is moved in the height direction so that the first member held by the first hand comes into contact with the first holding unit, and the control unit controls the drive of the second hand by the drive unit in the second process based on a drive error of the drive unit determined from the movement of the first holding unit in the first process.

[0007] Further objects and other aspects of the present invention will become apparent from the following description of preferred embodiments with reference to the accompanying drawings. Effect of the Invention

[0008] According to the present invention, for example, in a conveying device configured to drive a support member supporting multiple hands in the vertical direction, it is possible to provide an advantageous technique for precisely controlling the conveying of members by each hand. [Brief description of the drawings]

[0009] [Figure 1] Schematic diagram showing a configuration example of a flattening device [Diagram 2] Schematic diagram showing a configuration example of a flattening module [Diagram 3] Schematic diagram showing a configuration example of a conveying device [Figure 4] Flowchart showing mold transport processing in the first embodiment [Diagram 5] FIG. 1 is a schematic diagram for explaining the operation of a transfer device and a flattening module in a mold transfer process according to a first embodiment; [Figure 6] 1 is a flowchart showing a substrate transfer process according to a first embodiment; [Figure 7] FIG. 1 is a schematic diagram for explaining the operation of a transfer device and a flattening module in a substrate transfer process according to a first embodiment; [Figure 8A] Flowchart showing mold transport processing in the second embodiment [Figure 8B] Flowchart showing mold transport processing in the second embodiment [Figure 9] FIG. 13 is a schematic diagram for explaining the operation of a transfer device and a flattening module in a mold transfer process according to the second embodiment; [Figure 10] 11 is a flowchart showing a gap detection process according to the third embodiment. [Figure 11] FIG. 13 is a schematic diagram for explaining the operation of a transport device and a flattening module in a gap correction process according to the third embodiment; [Figure 12] FIG. 13 is a schematic diagram showing a modified example of the conveying device; [Figure 13] FIG. 1 is a diagram for explaining a method for manufacturing an article (imprint processing); [Figure 14] FIG. 1 is a diagram for explaining a method for manufacturing an article (flattening process); DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, the embodiments will be described in detail with reference to the attached drawings. Note that the following embodiments do not limit the invention according to the claims. Although the embodiments describe a number of features, not all of these features are essential to the invention, and the features may be combined in any manner. Furthermore, in the attached drawings, the same reference numbers are used for the same or similar configurations, and duplicated descriptions are omitted.

[0011] In this specification and the attached drawings, unless otherwise specified, directions are shown in an XYZ coordinate system in which the direction parallel to the surface of the substrate is the XY plane. The directions parallel to the X-axis, Y-axis, and Z-axis in the XYZ coordinate system are the X direction, Y direction, and Z direction, respectively, and the rotation around the X-axis, the Y axis, and the Z axis are θX, θY, and θZ, respectively. Control or drive regarding the X-axis, Y-axis, and Z-axis means control or drive regarding the direction parallel to the X-axis, the direction parallel to the Y axis, and the direction parallel to the Z axis, respectively. In addition, control or drive regarding the θX-axis, θY-axis, and θZ-axis means control or drive regarding the rotation around the axis parallel to the X-axis, the rotation around the axis parallel to the Y axis, and the rotation around the axis parallel to the Z axis, respectively. In addition, the position is information that can be specified based on the coordinates of the X-axis, Y-axis, and Z-axis, and the attitude is information that can be specified by the values ​​of the θX-axis, θY-axis, and θZ-axis.

[0012] Moreover, a molding apparatus to which the conveying apparatus according to the present invention can be applied is an apparatus that performs a molding process of pressing a mold against a composition on a substrate to mold the composition. Examples of molding apparatus include an imprinting apparatus and a planarizing apparatus. An imprinting apparatus is an apparatus that forms (transfers) a pattern in a composition (imprinting material) on a substrate by contacting a mold having a concave-convex pattern with the composition. The molding process performed by an imprinting apparatus is sometimes called an imprinting process. A planarizing apparatus is an apparatus that flattens the surface of the composition by contacting a mold having a flat surface with the composition on a substrate. The molding process performed by a planarizing apparatus is sometimes called a planarizing process. In the following, a planarizing apparatus will be described as an example of a molding apparatus, but the configuration and process of the planarizing apparatus can also be applied to an imprinting apparatus.

[0013] First Embodiment A first embodiment of the present invention will be described. Fig. 1 is a schematic diagram showing an example of the configuration of a planarization apparatus 100 of this embodiment. As described above, the planarization apparatus 100 is an example of a molding apparatus that molds a composition 3 on a substrate 2 using a mold 1. Specifically, the planarization apparatus 100 can mold a planarization film on the substrate 2 by bringing the mold 1 having a flat surface into contact with the uncured composition 3 supplied (applied) onto the substrate 2, curing the composition 3, and separating the mold 1 from the cured composition 3.

[0014] The mold 1 may be made of a material that is UV-transmissive. Examples of the material of the mold 1 include glass made of a material selected from silicon oxide, boron oxide, sodium carbonate, magnesium oxide, calcium oxide, aluminum oxide, etc., polymethyl methacrylate resin, polycarbonate resin, photocured film, metal film, etc. In the following, the mold 1 will be described using a flat plate made of quartz glass as an example, but is not limited to this. In addition, the shape of the mold 1 is preferably a disk shape with a diameter of more than 300 mm and less than 500 mm, and a thickness of 0.25 mm or more and less than 2 mm, but is not limited to this.

[0015] Examples of the material of the substrate 2 include glass, ceramics, metals, semiconductors, and resins. If necessary, a member made of a material different from that of the substrate 2 may be provided on the surface of the substrate 2. The substrate 2 is, for example, a silicon wafer, a compound semiconductor wafer, or quartz glass. In this embodiment, the substrate 2 is made of a material selected from silicon, silicon carbide, silicon oxide, aluminum oxide, aluminum nitride, gallium oxide, gallium nitride, gallium phosphide, gallium arsenide, germanium, and the like. The substrate 2 may be improved in adhesion to the composition by surface treatment such as silane coupling treatment, silazane treatment, and formation of an organic thin film. In the following, a silicon wafer made of silicon is used as the substrate 2, but is not limited thereto. The shape of the silicon wafer as the substrate 2 is typically a disk shape with a diameter of 300 mm, but is not limited thereto.

[0016] The composition 3 may be a photocurable composition that is cured by irradiation with light, or a thermosetting composition that is cured by application of heat. The photocurable composition and the thermosetting composition may also be called moldable materials. In the following, the composition 3 will be described by taking as an example a photocurable composition that is cured by irradiation with light having a wavelength of 200 to 380 nm, but is not limited thereto. The photocurable composition contains at least a polymerizable compound and a photopolymerization initiator, and may further contain a non-polymerizable compound or a solvent as necessary. The non-polymerizable compound is at least one selected from the group consisting of a sensitizer, a hydrogen donor, an internal mold release agent, a surfactant, an antioxidant, and a polymer component. The viscosity of the viscous body (viscosity at 25° C.) is, for example, 1 mPa·s or more and 100 mPa·s or less.

[0017] 1, the planarization apparatus 100 of the present embodiment may include a planarization module 200, a supply module 300, a carry-in station 400, an unloading station 500, a transport device 600, a control unit 700, and an alarm unit 800. The transport device 600 is an apparatus that holds and transports the mold 1 and / or the substrate 2. The term "transport" used below refers to the transport device 600 holding and moving the mold 1 and / or the substrate 2 from a predetermined starting point to a predetermined arrival point.

[0018] The planarizing module 200 is a unit that performs planarizing processing, as a molding process, by using a mold 1 to planarize the composition 3 on the substrate 2. The planarizing module 200 hardens the composition 3 in a state in which the mold 1 and the composition 3 on the substrate 2 are in contact with each other, and separates the mold 1 from the hardened composition 3 to form a planarizing film (planarizing layer) on the substrate 2. A detailed configuration example of the planarizing module 200 will be described later.

[0019] The supply module 300 (coating module) is a unit that supplies (coats) the composition 3 onto the substrate 2 as a pretreatment of the planarization treatment by the planarization module 200. The substrate 2 to which the composition 3 has been supplied in the supply module 300 is transported to the planarization module 200 by the transport device 600. The supply module 300 may be provided as a component of the planarization module 200.

[0020] The carry-in station 400 is an interface section for carrying the mold 1 and / or the substrate 2 from outside the apparatus into the flattening apparatus 100. The carry-in station 400 may be understood as an interface section for transferring the mold 1 and / or the substrate 2 between the outside of the apparatus and the flattening apparatus 100. The mold 1 carried into the carry-in station 400 from outside the apparatus is transported to the flattening module 200 by the transport device 600. In addition, the substrate 2 carried into the carry-in station 400 from outside the apparatus is transported to the supply module 300 by the transport device 600, where the composition 3 is supplied, and then the substrate 2 is transported to the flattening module 200 by the transport device 600.

[0021] The carry-out station 500 is an interface section for carrying out the mold 1 and / or the substrate 2 from the flattening apparatus 100 to the outside of the apparatus. The carry-out station 500 may be understood as an interface section for transferring the mold 1 and / or the substrate 2 between the outside of the apparatus and the flattening apparatus 100. The mold 1 used in the flattening process in the flattening module 200 is carried to the carry-out station 500 by the conveying device 600. In addition, the substrate 2 that has been subjected to the flattening process in the flattening module 200 is carried to the carry-out station 500 by the conveying device 600. The substrate 2 may be carried to the carry-out station 500 immediately after the flattening process is completed, or may be carried to the carry-out station 500 at a timing when a predetermined time has elapsed since the flattening process is completed.

[0022] The transport device 600 is a device that transports the mold 1 and / or the substrate 2. The transport device 600 of this embodiment includes a plurality of hands that each hold a member. Specifically, the transport device 600 includes a first hand that holds the mold 1 as a first member, and a second hand that holds the substrate 2 as a second member. A detailed configuration example of the transport device 600 will be described later.

[0023] The control unit 700 controls each unit (such as the planarizing module 200, the supply module 300, and the transport device 600) in the planarizing apparatus 100. The control unit 700 may be configured by an information processing device (computer) having a processor such as a CPU (Central Processing Unit) and a storage unit (memory) such as a ROM or a RAM. The control unit 700 may also be configured by, for example, a PLD (abbreviation for Programmable Logic Device) such as an FPGA (abbreviation for Field Programmable Gate Array), an ASIC (abbreviation for Application Specific Integrated Circuit), a general-purpose computer with a built-in program, or a combination of all or part of these.

[0024] The notification unit 800 notifies various pieces of information to the operator of the planarization apparatus 100. For example, the notification unit 800 may have a display unit (display) and notify by displaying various pieces of information on the display unit. Alternatively, the notification unit 800 may have an audio output unit and notify by outputting various pieces of information by audio from the audio output unit.

[0025] Here, in the planarization apparatus 100 of the present embodiment, the supply module 300 is provided as a pretreatment module for performing pretreatment for the planarization process, but is not limited thereto. For example, as a pretreatment module, a heat treatment module for adjusting the temperature of the substrate 2, a film formation module for forming a thin film on the substrate 2, an alignment module for aligning the substrate 2, etc. may be additionally or alternatively provided to the supply module 300. In this case, the substrate 2 may be transported by the transport device 600 from the carry-in station 400 via the pretreatment module to the planarization module 200. In addition, the composition 3 may be supplied (applied) onto the substrate 2 outside the planarization apparatus 100, and in that case, the substrate 2 may be transported from the carry-in station 400 to the planarization module 200 without passing through the supply module 300.

[0026] 1, a post-treatment module for performing post-treatment after the planarization process is not provided, but the present invention is not limited thereto. For example, the heat treatment module and alignment module mentioned above as the pre-treatment module may be provided as the post-treatment module. In this case, the substrate 2 can be transported by the transport device 600 from the planarization module 200 to the unloading station 500 via the post-treatment module.

[0027] Like the substrate 2, the mold 1 may also pass through a pre-treatment module before being transported from the carry-in station 400 to the planarizing module 200, and may also pass through a post-treatment module before being transported from the planarizing module 200 to the unloading station 500. The planarizing apparatus 100 may be provided with a carrier (storage unit) for the purpose of temporarily storing or evacuating the mold 1 and / or the substrate 2.

[0028] 1, the planarizing apparatus 100 of the present embodiment is provided with one each of the planarizing module 200, the supply module 300, the loading station 400, the unloading station 500, and the transport device 600, but is not limited thereto. For example, a plurality of any of the modules, stations, and / or carriers may be disposed inside or outside the apparatus.

[0029] [Example of flattening module configuration] Next, a configuration example of the flattening module 200 will be described with reference to FIG. 2. FIG. 2 is a schematic diagram showing a configuration example of the flattening module 200. As shown in FIG. 2, the flattening module 200 may include a substrate chuck 201, a substrate stage 202, a base 203, and a driving mechanism 204. The flattening module 200 may also include a support 205, a plate 206, a guide 207, a base 208, a driving mechanism 209, a head 210, a support 211, and a mold chuck 212. The flattening module 200 further includes an irradiation unit 213, an upward sensor 214, and a downward sensor 215. The flattening module 200 of this embodiment may be controlled by the control unit 700 of the flattening apparatus 100, but a control unit for controlling the flattening module 200 may be provided separately.

[0030] The substrate chuck 201 is supported by the substrate stage 202 and functions as a holder (second holder) for holding the substrate 2. Examples of the method by which the substrate chuck 201 holds the substrate 2 by suction include a vacuum suction method and an electrostatic suction method. When the vacuum suction method is used, a recessed portion communicated with a negative pressure generator is formed on the surface (holding surface) of the substrate chuck 201. The substrate chuck 201 can hold the substrate 2 by placing the substrate 2 on the holding surface and applying a negative pressure to the inside of the recessed portion by the negative pressure generator. The substrate chuck 201 also has holding pins (not shown in FIG. 2) that protrude from the holding surface and hold the substrate 2 when the substrate 2 is transported by the transport device 600. The holding pins can be raised and lowered so as to protrude from the holding surface of the substrate chuck 201 or be stored in the holding surface.

[0031] The substrate stage 202 is disposed on a base 203, and is driven in the XY directions on the base 203 by a driving mechanism 204. The driving mechanism 204 can be configured with an actuator such as a stepping motor, a linear motor, or an air cylinder. In the present embodiment, the driving mechanism 204 is configured to drive the substrate stage 202 (substrate 2) with the X-axis or Y-axis as the driving axis, but is not limited thereto. For example, the driving mechanism 204 may be configured to drive the substrate stage 202 with an axis (e.g., Z-axis) different from the X-axis and Y-axis as the driving axis. The substrate stage 202 may have a rotation mechanism and drive the substrate stage 202 in a rotation direction around the X-axis, Y-axis, and / or Z-axis. The substrate stage 202 may be configured to drive a holding pin that holds the substrate 2.

[0032] The support column 205 is disposed on the base 203 and is supported by the base 203. The plate 206 is disposed on the support column 205 and is supported by the support column 205. The guide 207 is suspended by the plate 206 and passes through a platform 208 to hold a head 210. The platform 208 is disposed below the support column 211 and is suspended by the plate 206 via the support column 211.

[0033] The driving mechanism 209 drives the head 210 in the Z direction along the guide 207. The driving mechanism 209 can be configured with an actuator such as a stepping motor, a linear motor, or a voice coil motor. The flattening module 200 can also include a position detection unit 221 that detects the position (height) of the mold chuck 212 (holding surface) using, for example, an encoder or an interferometer.

[0034] The mold chuck 212 is disposed under the head 210 and is supported by the head 210. The mold chuck 212 functions as a holder (first holder) that holds the mold 1, and is configured to be movable in the height direction (Z direction) by the driving mechanism 209. Examples of a method for the mold chuck 212 to suction and hold the mold 1 include a vacuum suction method and an electrostatic suction method. The flattening module 200 also includes a mold detection unit 222 (mold detection sensor) that detects whether or not the mold 1 is being held by the mold chuck 212. For example, when the mold chuck 212 holds the mold 1 using a vacuum suction method, the mold detection unit 222 can detect whether or not the mold 1 is being held by the mold chuck 212 by detecting the suction pressure of the mold 1 by the mold chuck 212.

[0035] The irradiation unit 213 is a unit (curing unit) that irradiates the composition 3 on the substrate 2 with light to cure the composition 3. The irradiation unit 213 may have a light source that emits light (e.g., ultraviolet light) that cures the composition 3, and an optical system for irradiating the composition 3 on the substrate 2 with the light emitted from the light source. In the planarization module 200 of this embodiment, the mold chuck 212 is driven in the -Z direction by the driving mechanism 209 to bring the mold 1 into contact with the composition 3 on the substrate 2, and the irradiation unit 213 irradiates the composition 3 with light in this state. The light from the irradiation unit 213 is irradiated to the composition 3 on the substrate 2 via the platform 208 and the mold 1. This allows the composition 3 filled between the mold 1 and the substrate 2 to be cured. Then, the mold chuck 212 is driven in the +Z direction by the driving mechanism 209 to separate the mold 1 from the cured composition 3. This allows a planarization film made of the cured composition 3 to be formed on the substrate 2.

[0036] The upward sensor 214 is disposed on the upper surface of the substrate stage 202, and detects the height of a component disposed above the upward sensor 214 by measuring the distance in the Z direction to the component. For example, when the lowest component within the measurement range in the Z direction is the substrate 2, the upward sensor 214 detects the height of the substrate 2 by measuring the distance in the Z direction to the substrate 2. The upward sensor 214 may be, for example, a displacement sensor using a spectroscopic interference method. Note that, in the example of FIG. 2, two upward sensors 214 are provided, but this is not limiting, and one or three or more upward sensors 214 may be provided. Furthermore, the upward sensor 214 may have a function of measuring the tilt in the X direction, the tilt in the Y direction, and / or the center position of the substrate 2 or the mold 1, either alone or in multiple units.

[0037] The downward sensor 215 (detection unit) is disposed on the lower surface of the platform 208, and detects the height of a member disposed below the downward sensor 215 by measuring the distance in the Z direction to the member. For example, when the uppermost member within the measurement range in the Z direction is the mold 1, the downward sensor 215 detects the height of the mold 1 by measuring the distance in the Z direction to the mold 1. The downward sensor 215 may be, for example, a displacement sensor using a spectroscopic interference method. Note that, in the example of FIG. 2, one downward sensor 215 is provided, but this is not limiting, and multiple downward sensors 215 may be provided. Furthermore, the downward sensor 215, either alone or in multiple units, may have a function of measuring the inclination in the X direction, the inclination in the Y direction, and / or the center position of the mold 1 or the substrate 2.

[0038] In the flattening module 200, the mold 1 is transported by the transport device 600 to below the mold chuck 212 and held by the mold chuck 212. The substrate 2 is transported by the transport device 600 to above the substrate chuck 201 and held by the substrate chuck 201. A method for transporting the mold 1 and the substrate 2 by the transport device 600 will be described later.

[0039] [Example of transport device configuration] Next, a configuration example of the transport device 600 will be described with reference to Fig. 3. Fig. 3(a) shows the transport device 600 as viewed from the rear (-Y direction). Fig. 3(b) shows the transport device 600 as viewed from the side (-X direction).

[0040] The transport device 600 of this embodiment has a plurality of hands each holding a member and a support member supporting the plurality of hands, and drives the plurality of hands in the height direction (Z direction) by driving the support member in the height direction (Z direction). Specifically, the transport device 600 includes a first hand 602 holding the mold 1, a second hand 603 holding the substrate 2, a support member 612 supporting the first hand 602 and the second hand 603, and a drive unit 611 driving the support member 612 in the height direction (Z direction). The transport device 600 of this embodiment can be controlled by the control unit 700 of the flattening device 100, but a control unit for controlling the transport device 600 may be provided separately.

[0041] The first hand 601 is a holding member (end effector) that holds the mold 1 as the first member, and is supported by a support member 612 via a first arm 604. The first hand 601 has a holding portion 607 that holds the mold 1 by suction using a vacuum suction method or the like. The holding portion 607 may be configured as a suction hole formed in the first hand 601 and connected to a negative pressure generating device (not shown). The first arm 604 is a mechanism for driving the first hand 601 in the XY direction. The first hand 601 is attached to one end of the first arm 604, and the other end is attached to a support member 612. The first arm 604 may be provided with one or more joints between the one end and the other end. In addition, the first arm 604 may be provided with a fine movement mechanism 609 that drives the first hand 601 in the height direction to finely adjust the position of the first hand 601 in the height direction (Z direction).

[0042] The second hand 602 is a holding member (end effector) that holds the substrate 2 as the second member, and is supported by a support member 612 via a second arm 605. The second hand 602 has a holding portion 608 that holds the substrate 2 by vacuum suction or the like. The holding portion 608 may be configured as a suction hole formed in the second hand 603 and connected to a negative pressure generating device (not shown). The second arm 605 is a mechanism for driving the second hand 602 in the XY direction. The second hand 602 is attached to one end of the second arm 605, and the other end is attached to a support member 612. The second arm 605 may have one or more joints between the one end and the other end. The second arm 605 may also be provided with a fine movement mechanism 610 that drives the second hand 602 in the height direction to finely adjust the position of the second hand 602 in the height direction (Z direction).

[0043] The support member 612 supports the first hand 601 via the first arm 604, and supports the second hand 602 via the second arm 605. In other words, the support member 612 is a member that supports the first hand 601 and the second hand 602. The support member 612 may be understood as a movable member that is driven by the drive unit 611.

[0044] The driving unit 611 is disposed below the support member 612, and drives the support member 612 in the height direction (Z direction). The driving unit 611 can drive the first hand 601 and the second hand 602 in the height direction by driving the support member 612 in the height direction. In other words, the driving unit 611 is a mechanism commonly used to drive the first hand 601 and the second hand 602 in the height direction.

[0045] However, in the transport device 600, the actual height of the first hand 601 and the second hand 602 driven by the drive unit 611 via the support member 612 may deviate from the designed height (target height) due to aging or the surrounding environment. That is, a drive error may occur in the drive unit 611 that drives the first hand 601 and the second hand 602 via the support member 612. If such a drive error occurs in the drive unit 611, the hands 601-602, the mold 1, or the substrate 2 may unintentionally come into contact with other components in the flattening device 100 during transport of the components such as the mold 1 or the substrate 2, and these components may be damaged. Therefore, in the transport device 600, it is desired to obtain the drive error of the drive unit 611 (i.e., the drive error of the support member 612 by the drive unit 611) by a simple method and accurately control the transport of the components by each hand 601-602.

[0046] Therefore, in the transport device 600 of this embodiment, in a mold transport process (first process) in which the first hand 601 transports the mold 1 (first member) to the mold chuck 212 (first holding part), a drive error of the drive unit 611 is determined. Then, based on the drive error of the drive unit 611 determined in the mold transport process, a substrate transport process (second process) in which the second hand 602 transports the substrate 2 (second member) to the substrate chuck 201 (second holding part) is controlled. Hereinafter, the mold transport process and the substrate transport process in the transport device 600 of this embodiment will be described.

[0047] [Mold transport processing] First, the mold transport process in the transport device 600 of this embodiment will be described with reference to FIGS. 4 and 5. FIG. 4 is a flowchart showing the mold transport process in the transport device 600 of this embodiment. The flowchart in FIG. 4 can be executed by the control unit 700 of the flattening device 100, but if the transport device 600 is provided with a separate control unit, it may be executed by the control unit. FIG. 5 is a schematic diagram for explaining the operation of the transport device 600 and the flattening module 200 in the mold transport process. In FIG. 5, only components necessary for the explanation are shown, and other components are omitted. In the following explanation, the "height direction" refers to the Z direction.

[0048] In step S101, the control unit 700 causes the first hand 601 to hold the mold 1 carried into the carry-in station 400 from outside the apparatus. Next, in step S102, the control unit 700 drives the first hand 601 in the XY directions with the first arm 604 to place the mold 1 below the mold chuck 212 of the flattening module 200, as shown in FIG. 5(a).

[0049] In step S103, the control unit 700 drives the support member 612 (first hand 601) in the height direction by the drive unit 611 so that the height of the first hand 601 becomes the target height H1. For example, as shown in FIG. 5B, the control unit 700 generates a drive command value A1 for driving the drive unit 611 so that the height of the first hand 601 becomes the target height H1, and supplies the drive command value A1 to the drive unit 611. The drive unit 611 supplied with the drive command value A1 from the control unit 700 drives the support member 612 (first hand 601) in the height direction according to the drive command value A1. However, in this embodiment, the first hand 601 is not positioned at the target height H1 due to a drive error ΔD of the drive unit 611.

[0050] In step S104, the control unit 700 causes the drive mechanism 209 of the flattening module 200 to lower (move) the mold chuck 212 in the height direction so that the mold 1 held by the first hand 601 comes into contact with the mold chuck 212 of the flattening module 200. For example, as shown in FIG. 5(c), the control unit 700 causes the drive mechanism 209 to lower the mold chuck 212 while causing the mold detection unit 222 to detect the suction pressure of the mold chuck 212. This allows the control unit 700 to determine that the mold 1 on the first hand 601 and the mold chuck 212 have come into contact with each other based on the detection result of the mold detection unit 222. When the control unit 700 determines that the mold 1 on the first hand 601 and the mold chuck 212 have come into contact with each other, it stops the lowering of the mold chuck 212 by the drive mechanism 209.

[0051] In step S105, the control unit 700 estimates the height Ea (i.e., the position in the height direction) of the first hand 601 based on the descent (movement) of the mold chuck 212 in step S104. For example, as shown in FIG. 5(c), the control unit 700 can estimate the height Ea of the first hand 601 based on the thickness of the mold 1 and the height of the mold chuck 212 (holding surface). The thickness of the mold 1 is measured in advance using an external measuring device or the like and stored in the control unit 700. The height of the mold chuck 212 is detected by the position detection unit 221. Note that, hereinafter, the height Ea of the first hand 601 estimated based on the descent of the mold chuck 212 may be referred to as the "estimated height Ea".

[0052] Here, the control unit 700 may obtain the height of the mold chuck 212 based on the amount of descent (amount of movement) of the mold chuck 212 by the driving mechanism 209. For example, the control unit 700 acquires the position of the mold chuck 212 before the driving mechanism 209 lowers the mold chuck 212 as a reference position (reference height). This allows the control unit 700 to obtain the height of the mold chuck 212 when the mold 1 on the first hand 601 and the mold chuck 212 come into contact with each other based on the reference position and the amount of descent of the mold chuck 212 detected by the position detection unit 221.

[0053] In step S106, the control unit 700 determines a drive error ΔD of the drive unit 611 of the transport device 600 based on the estimated height Ea obtained in step S105. For example, as shown in Fig. 5(c), the control unit 700 can determine the difference between the target height H1 of the first hand 601 and the estimated height Ea as the drive error ΔD (for example, ΔD = H1 - Ea).

[0054] In step S107, the control unit 700 judges whether or not the drive error ΔD of the drive unit 611 determined in step S106 is greater than a threshold value. If the drive error ΔD is greater than the threshold value, the process proceeds to step S108, where the control unit 700 performs a notification process. The notification process is a process of notifying an operator using the notification unit 800 that the drive error ΔD of the drive unit 611 is greater than the threshold value. In addition to or instead of the notification process, the control unit 700 may interrupt the mold transport process or may stop the execution of the subsequent substrate transport process. On the other hand, if the drive error ΔD is equal to or less than the threshold value, the process proceeds to step S109.

[0055] In step S109, with the mold chuck 212 holding the mold 1, the control unit 700 causes the drive mechanism 209 of the flattening module 200 to raise the mold chuck 212 in the height direction. Next, in step S110, the control unit 700 causes the first hand 601 to retreat from below the mold chuck 212 of the flattening module 200 by driving the first hand 601 in the XY directions with the first arm 604. Through the above steps, the mold transport process is completed.

[0056] [Substrate transport processing] Next, the substrate transport process in the transport device 600 of this embodiment will be described with reference to Figs. 6 and 7. Fig. 6 is a flowchart showing the substrate transport process in the transport device 600 of this embodiment. The flowchart in Fig. 6 can be executed by the control unit 700 of the planarization apparatus 100, but when a control unit is provided separately in the transport device 600, it may be executed by the control unit. Fig. 7 is a schematic diagram for explaining the operation of the transport device 600 and the flattening module 200 in the substrate transport process. Fig. 7 shows only components necessary for the explanation, and other components are omitted.

[0057] In step S121, the control unit 700 causes the second hand 602 to hold the substrate 2 that has been carried into the carry-in station 400 from outside the apparatus, or the substrate 2 to which the composition 3 has been supplied in the supply module 300.

[0058] In step S122, the control unit 700 drives the support member 612 (second hand 602) in the height direction by the drive unit 611 so that the height of the second hand 602 becomes the target height H2. At this time, the control unit 700 controls the drive of the support member 612 (second hand 602) by the drive unit 611 based on the drive error ΔD of the drive unit 611 determined in the above mold transport process. For example, as shown in FIG. 7(a), the control unit 700 determines a correction value C for correcting the drive error ΔD of the drive unit 611 based on the drive error ΔD of the drive unit 611 determined in the mold transport process. Then, the control unit 700 generates a drive command value A2 for driving the drive unit 611 so that the height of the second hand 602 becomes the target height H2, corrects the drive command value A2 by the correction value C, and supplies the corrected command value A2′ obtained thereby to the drive unit 611. The drive unit 611, to which the correction command value A2' is supplied from the control unit 700, drives the support member 612 (second hand 602) in the height direction in accordance with the correction command value A2'. As described above, in this embodiment, the drive of the second hand 602 in the height direction by the drive unit 611 in the substrate transport process is controlled based on the drive error ΔD of the drive unit 611 determined from the movement of the mold chuck 212 in the mold transport process. This allows the second hand 602 to be accurately positioned at the target height H2.

[0059] 7(b), the control unit 700 drives the second hand 602 in the XY directions by the second arm 605 to place the substrate 2 above the substrate chuck 201 of the flattening module 200. At this time, the control unit 700 causes the holding pins 216 to protrude from the holding surface (upper surface) of the substrate chuck 201.

[0060] 7(c), the control unit 700 causes the driving unit 611 to lower the supporting member 612 (second hand 602) in the height direction, thereby placing the substrate 2 on the holding pins 216 protruding from the holding surface (upper surface) of the substrate chuck 201. Here, also in step S124, the control unit 700 may control the lowering of the supporting member 612 (second hand 602) by the driving unit 611 based on the driving error ΔD of the driving unit 611 determined from the movement of the mold chuck 212 in the mold transport process.

[0061] In step S125, the control unit 700 drives the second hand 602 in the XY directions by the second arm 605, thereby retracting the second hand 602 from above the substrate chuck 201 of the flattening module 200. Next, in step S126, the control unit 700 stores the holding pins 216 in the holding surface (upper surface) of the substrate chuck 201. This causes the substrate 2 to be held by the substrate chuck 201, and the substrate transport process is completed.

[0062] As described above, the transport device 600 of this embodiment controls the driving of the second hand 602 in the height direction by the drive unit 611 in the substrate transport process based on the drive error ΔD of the drive unit 611 determined from the movement of the mold chuck 212 in the mold transport process. According to this embodiment, the drive error ΔD of the drive unit 611 can be obtained by a simple method, and the transport of members by each of the multiple hands (first hand 601, second hand 602) can be accurately controlled.

[0063] <Second embodiment> A second embodiment of the present invention will be described. In this embodiment, an example will be described in which the driving of the second hand 602 in the height direction by the driving unit 611 in the substrate transport process is controlled based on the driving error ΔD of the driving unit 611 determined using the downward sensor 215 in the mold transport process. Note that this embodiment basically inherits the first embodiment, and can follow the first embodiment except for the matters mentioned below. For example, the configuration of the flattening apparatus 100 is as described in the first embodiment.

[0064] This embodiment is different from the first embodiment in the mold transport process. Hereinafter, the mold transport process in the transport device 600 of this embodiment will be described with reference to Figs. 8A, 8B, and 9. Figs. 8A-8B are flowcharts showing the mold transport process in the transport device 600 of this embodiment. The flowcharts in Figs. 8A-8B can be executed by the control unit 700 of the flattening device 100, but when a control unit is provided separately in the transport device 600, they may be executed by the control unit. Also, Fig. 9 is a schematic diagram for explaining the operation of the transport device 600 and the flattening module 200 in the mold transport process. In Fig. 9, only components necessary for the explanation are illustrated, and other components are omitted.

[0065] In step S201, the control unit 700 causes the first hand 601 to hold the mold 1 carried into the carry-in station 400 from outside the apparatus. Next, in step S202, the control unit 700 drives the first hand 601 in the XY directions with the first arm 604 to position the mold 1 below the downward sensor 215 of the flattening module 200, as shown in FIG. 9(a).

[0066] In step S203, the control unit 700 drives the support member 612 (first hand 601) in the height direction by the drive unit 611 so that the height of the first hand 601 becomes the target height H1, as shown in Fig. 9(b). This step S203 is the same process as step S103 in the flowchart of Fig. 4, so a detailed description will be omitted here. Next, in step S204, the control unit 700 causes the downward sensor 215 to detect the height of the mold 1 held by the first hand 601 below the downward sensor 215.

[0067] In step S205, the control unit 700 estimates the height Eb (i.e., the position in the height direction) of the first hand 601 based on the height of the mold 1 detected by the downward sensor 215 in step S204. For example, as shown in FIG. 9(c), the control unit 700 can estimate the height Eb of the first hand 601 based on the thickness of the mold 1 and the height of the mold 1 detected by the downward sensor 215. The thickness of the mold 1 is measured in advance using an external measuring device or the like and stored in the control unit 700. Note that, hereinafter, the height Eb of the first hand 601 estimated based on the detection result of the downward sensor 215 may be referred to as the "estimated height Eb".

[0068] In step S206, the control unit 700 determines a drive error ΔD of the drive unit 611 of the transport device 600 based on the estimated height Eb obtained in step S205. For example, as shown in Fig. 9(c), the control unit 700 can determine the difference between the target height H1 of the first hand 601 and the estimated height Eb as the drive error ΔD (for example, ΔD=H1-Ea).

[0069] In step S207, the control unit 700 judges whether the drive error ΔD of the drive unit 611 determined in step S206 is greater than a threshold value. If the drive error ΔD is greater than the threshold value, the process proceeds to step S208, where the control unit 700 performs a notification process. The notification process is a process of notifying an operator using the notification unit 800 that the drive error ΔD of the drive unit 611 is greater than the threshold value. In addition to or instead of the notification process, the control unit 700 may interrupt the mold transport process or may stop the execution of the subsequent substrate transport process. On the other hand, if the drive error ΔD is equal to or less than the threshold value, the process proceeds to step S209.

[0070] In step S209, the control unit 700 drives the first hand 601 in the XY directions with the first arm 604 to place the mold 1 below the mold chuck 212 of the flattening module 200. Note that if the downward sensor 215 is arranged so as to be able to detect the height of the mold 1 in a state in which the mold 1 is arranged below the mold chuck 212, this step S209 can be omitted.

[0071] In step S210, the control unit 700 causes the drive mechanism 209 of the flattening module 200 to lower (move) the mold chuck 212 in the height direction so that the mold 1 held by the first hand 601 comes into contact with the mold chuck 212 of the flattening module 200. This step S210 is the same process as step S104 in the flowchart of FIG. 4, and therefore a detailed description thereof will be omitted here.

[0072] In step S211, with the mold chuck 212 holding the mold 1, the control unit 700 causes the drive mechanism 209 of the flattening module 200 to raise the mold chuck 212 in the height direction. Next, in step S212, the control unit 700 causes the first hand 601 to retreat from below the mold chuck 212 of the flattening module 200 by driving the first hand 601 in the XY directions with the first arm 604. Through the above steps, the mold transport process is completed.

[0073] As described above, the transport device 600 of this embodiment determines the drive error ΔD of the drive unit 611 using the downward sensor 215. This embodiment also makes it possible to obtain the drive error ΔD of the drive unit 611 by a simple method and accurately control the transport of members by each of the multiple hands (the first hand 601 and the second hand 602).

[0074] Here, in the mold transport process of this embodiment, the downward sensor 215 is used to estimate the height of the first hand 601, but the present invention is not limited to this, and the upward sensor 214 may be used. In this case, the mold 1 is placed above the upward sensor 214 in step S202, and the height of the mold 1 can be detected by the upward sensor 214 in step S204. Moreover, the substrate transport process of this embodiment can be performed in the same manner as the substrate transport process described in the first embodiment.

[0075] <Third embodiment> A third embodiment of the present invention will be described. In the transport device 600, the interval between the first hand 601 and the second hand 602 in the height direction (Z direction) may change over time. In this embodiment, a process for detecting the change over time in the interval between the first hand 601 and the second hand 602 in the height direction (hereinafter, this process may be referred to as an interval detection process) will be described. Note that this embodiment basically inherits the first embodiment, and may follow the first embodiment except for the matters mentioned below. In this embodiment, the second embodiment may be applied in addition to or instead of the first embodiment.

[0076] Fig. 10 is a flowchart showing the gap detection process. The flowchart in Fig. 10 can be executed by the control unit 700 of the flattening apparatus 100, but when a control unit is provided separately in the transport device 600, it may be executed by the control unit. Fig. 11 is a schematic diagram for explaining the operation of the transport device 600 and the flattening module 200 in the gap correction process. Fig. 11 shows only components necessary for the explanation, and the other components are omitted.

[0077] 11(a), the control unit 700 drives the first hand 601 in the XY directions by the first arm 604 to place the first hand 601 below the downward sensor 215 of the flattening module 200. Next, in step S302, the control unit 700 causes the downward sensor 215 to detect the height of the first hand 601 placed below the downward sensor 215. Here, in the present embodiment, an example in which the height of the first hand 601 is detected using the downward sensor 215 has been shown, but the present invention is not limited thereto, and the height of the first hand 601 may be detected using the upward sensor 214.

[0078] In step S303, the control unit 700 drives the second hand 602 in the XY directions by the second arm 605, as shown in Fig. 11(b), to place the second hand 602 above the upward sensor 214 of the flattening module 200. Next, in step S304, the control unit 700 causes the upward sensor 214 to detect the height of the second hand 602 placed above the upward sensor 214. Here, in the present embodiment, an example in which the height of the second hand 602 is detected using the upward sensor 214 has been shown, but this is not limiting, and the height of the second hand 602 may be detected using the downward sensor 215.

[0079] In step S305, the control unit 700 determines the amount of change over time G in the distance between the first hand 601 and the second hand 602 in the height direction. For example, the control unit 700 can obtain the difference between the height of the first hand 601 detected in step S302 and the height of the second hand 602 detected in step S304, and determine the amount by which the difference has changed from a specified value (design value) as the amount of change over time G. Here, the upward sensor 214 and the downward sensor 215 may be understood as detection units that detect the change over time in the distance between the first hand 601 and the second hand 602 in the height direction.

[0080] The amount of change over time G determined in this manner is used when the driving unit 611 drives the supporting member 612 (second hand 602) in the substrate transport process. That is, the control unit 700 controls the driving of the supporting member 612 (second hand 602) by the driving unit 611 in the substrate transport process based on the driving error ΔD of the driving unit 611 determined in the mold transport process and the amount of change over time G determined as described above. Specifically, the control unit 700 corrects a drive command value for driving the driving unit 611 so that the height of the second hand 602 becomes a target height in the substrate transport process, so that the driving error ΔD and the amount of change over time G of the driving unit 611 are each reduced. This makes it possible to precisely control the transport of members by each of the multiple hands (first hand 601, second hand 602).

[0081] In this embodiment, the amount of change over time G is corrected by controlling the driving of the support member 612 (second hand 602) by the driving unit 611, but the present invention is not limited to this. For example, the amount of change over time G may be corrected by the fine movement mechanism 609 of the first arm 604 or the fine movement mechanism 610 of the second arm 605.

[0082] <Fourth embodiment> A fourth embodiment according to the present invention will be described. In this embodiment, a modified example of the conveying device 600 will be described. This embodiment basically follows the first embodiment, and may follow the first embodiment except for the matters mentioned below. In this embodiment, the second embodiment may be applied in addition to or instead of the first embodiment. In this embodiment, the third embodiment may also be applied.

[0083] FIG. 12(a) shows a transport device 600a of a first modified example. The transport device 600a shown in FIG. 12(a) is provided with a third hand 603 above the first hand 601, as compared with the transport device 600 shown in FIG. 4. The third hand 603 holds an arbitrary plate member via a holding portion 606 (suction hole) that employs a vacuum suction method or the like. This plate member can protect the member held by the first hand 601 and / or the second hand 602 from the surrounding environment. Examples of the surrounding environment include dust, gas, and heat. The third hand 603 is supported by a first arm 604 and can move together with the first hand 601. The third hand 603 is configured to be able to retreat from above the first hand 601 when the mold 1 held by the first hand 601 is transported to the mold chuck 212 of the flattening module 200.

[0084] FIG. 12(b) shows a transport device 600b of a second modified example. The transport device 600b shown in FIG. 12(b) is different from the transport device 600 shown in FIG. 4 in that it includes a fourth hand 613 between the first hand 601 and the second hand 602. The fourth hand 613 holds an arbitrary plate member via a holding portion 614 (suction hole) that employs a vacuum suction method or the like. The plate member can protect the member held by the second hand 602 from the surrounding environment. The fourth hand 613 is supported by the second arm 605 and can move together with the second hand 602.

[0085] <Embodiments of the method for manufacturing an article> The method for manufacturing an article according to an embodiment of the present invention is suitable for manufacturing an article such as a microdevice such as a semiconductor device or an element having a fine structure. The method for manufacturing an article according to this embodiment includes a molding step of molding a composition on a substrate using the above-mentioned molding apparatus (imprinting apparatus, flattening apparatus), a processing step of processing the substrate on which the composition has been molded in the molding step, and a manufacturing step of manufacturing an article from the substrate processed in the processing step. Furthermore, this manufacturing method includes other well-known steps (oxidation, film formation, deposition, doping, flattening, etching, resist stripping, dicing, bonding, packaging, etc.). The method for manufacturing an article according to this embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article compared to conventional methods.

[0086] The pattern of the cured product molded using the above molding device is used permanently for at least a part of various articles, or temporarily when manufacturing various articles. The articles are electric circuit elements, optical elements, MEMS, recording elements, sensors, or molds. Examples of electric circuit elements include volatile or non-volatile semiconductor memories such as DRAM, SRAM, flash memory, and MRAM, and semiconductor elements such as LSI, CCD, image sensors, and FPGA. Examples of molds include molds for imprinting and molds having a flat surface (flat template, superstrate), etc.

[0087] The pattern of the cured product is used as it is as at least a part of a component of the article, or is used temporarily as a resist mask, which is removed after etching or ion implantation in a substrate processing step.

[0088] Next, a specific method for manufacturing an article using an imprinting apparatus as a molding apparatus will be described. As shown in Fig. 13(a), a substrate 1z such as a silicon wafer having a workpiece 2z such as an insulator formed on its surface is prepared, and then an imprinting material 3z is applied to the surface of the workpiece 2z by an inkjet method or the like. Here, a state in which multiple droplets of the imprinting material 3z are applied onto the substrate is shown.

[0089] As shown in Fig. 13(b), the imprinting mold 4z is placed so that the side on which the concave-convex pattern is formed faces the imprinting material 3z on the substrate. As shown in Fig. 13(c), the substrate 1z to which the imprinting material 3z has been applied is brought into contact with the mold 4z, and pressure is applied. The imprinting material 3z fills the gap between the mold 4z and the workpiece 2z. When light is irradiated through the mold 4z in this state as energy for hardening, the imprinting material 3z hardens.

[0090] 13(d), after the imprint material 3z is cured, the mold 4z and the substrate 1z are separated, and a pattern of the cured product of the imprint material 3z is formed on the substrate 1z. In this cured product pattern, the recesses of the mold correspond to the protrusions of the cured product, and the protrusions of the mold correspond to the recesses of the cured product, i.e., the recessed and protruding patterns of the mold 4z are transferred to the imprint material 3z.

[0091] As shown in Fig. 13(e), when etching is performed using the pattern of the cured material as an etching-resistant mask, the portion of the surface of the workpiece 2z where there is no cured material or where only a thin layer remains is removed, forming a groove 5z. As shown in Fig. 13(f), when the pattern of the cured material is removed, an article having grooves 5z formed on the surface of the workpiece 2z can be obtained. Here, the pattern of the cured material is removed, but it may be used as an interlayer insulating film included in a semiconductor element or the like, that is, a component of an article, without being removed after processing.

[0092] Next, a specific method for manufacturing an article when a flattening apparatus is used as a molding apparatus will be described. In the imprinting apparatus, as described above, a mold for transferring a circuit pattern on which a concave-convex pattern is formed is used as a mold. On the other hand, in the flattening apparatus, a mold (flat template, superstrate) having a flat surface on which a concave-convex pattern is not formed is used as a mold. The flattening apparatus performs a flattening process using a mold such as a flat template or superstrate to mold a composition on a substrate so as to be flattened by the flat surface. The flattening process includes a step of curing the curable composition by irradiation with light or by heating in a state in which the flat surface of the flat template is brought into contact with the curable composition supplied onto the substrate. In this way, the present embodiment can be applied to a molding apparatus that molds a composition on a substrate using a flat template.

[0093] The base pattern on the substrate has an unevenness profile caused by the pattern formed in the previous process, and in particular, with the recent trend toward multi-layered structures of memory elements, the substrate (process wafer) may have a step of about 100 nm. The step caused by the gentle undulation of the entire substrate can be corrected by the focus tracking function of the exposure device (scanner) used in the photolithography process. However, the fine unevenness with a pitch that fits within the exposure slit area of ​​the exposure device consumes the depth of focus (DOF) of the exposure device as it is. As a conventional technology for flattening the base pattern of the substrate, a technology for forming a flattening layer such as SOC (Spin On Carbon) or CMP (Chemical Mechanical Polishing) is used. However, in the conventional technology, as shown in FIG. 14(a), only a 40% to 70% unevenness suppression rate is obtained at the boundary between the isolated pattern region A and the repeated dense (dense line & space pattern) pattern region B, and sufficient flattening performance is not obtained. Moreover, in the future, the unevenness of the underlying pattern will tend to further increase due to the increasing number of layers.

[0094] As a solution to this problem, U.S. Patent No. 9,415,418 proposes a technology to form a continuous film by applying the resist that will become the planarization layer with an inkjet dispenser and imprinting it with a flat template. Also, U.S. Patent No. 8,394,282 proposes a technology to reflect the topography measurement results on the substrate side in the shading information for each position instructed to be applied by an inkjet dispenser. The imprint apparatus IMP can be used particularly as a flat processing (planarization) apparatus that presses a flat template as a mold against previously applied uncured resist to locally planarize the substrate surface.

[0095] Figure 14(a) shows the substrate before flattening. In isolated pattern region A, the area of ​​the pattern convex parts is small. In repeated dense pattern region B, the area occupied by the pattern convex parts and the area occupied by the pattern concave parts are 1:1. The average height of isolated pattern region A and repeated dense pattern region B differs depending on the proportion of the pattern convex parts.

[0096] Fig. 14(b) shows a state in which a resist that forms a planarization layer is applied to a substrate. Fig. 14(b) shows a state in which the resist is applied by an inkjet dispenser based on the technology proposed in U.S. Pat. No. 9,415,418, but a spin coater may also be used to apply the resist. In other words, the imprint apparatus IMP can be applied as long as it includes a step of pressing a planar template against uncured resist that has been applied in advance to planarize it.

[0097] As shown in Fig. 14(c), the flat template is made of glass or quartz that transmits ultraviolet light, and the resist is hardened by irradiation of ultraviolet light from a light source. The flat template follows the profile of the substrate surface for gentle unevenness of the entire substrate. After the resist is hardened, the flat template is separated from the resist as shown in Fig. 14(d).

[0098] <Summary of the embodiment> The disclosure of the present specification includes at least the following conveying apparatus, molding apparatus, and method for manufacturing an article. (Item 1) A first hand that holds a first member; A second hand that holds a second member; a support member for supporting the first hand and the second hand; a drive unit that drives the support member in a height direction to drive the first hand and the second hand in the height direction; a control unit that controls a first process of transporting the first member to a first holding unit by the first hand and a second process of transporting the second member to a second holding unit by the second hand; Equipped with The first holding portion is configured to be movable in the height direction, In the first process, after driving the first hand in the height direction by the driving unit, the first holding unit is moved in the height direction so that the first member held by the first hand comes into contact with the first holding unit; The control unit controls the driving of the second hand by the driving unit in the second process based on a driving error of the driving unit determined from the movement of the first holding unit in the first process. (Item 2) In the first process, the first hand is driven by the driving unit to a target height, The control unit determines a height of the first hand as an estimated height based on a movement of the first holding unit in the first process, and determines a difference between the estimated height and the target height as the drive error. (Item 3) 3. The conveying device according to item 2, wherein the control unit calculates the estimated height based on a height of the first holding part when the first member and the first holding part come into contact with each other in the first process. (Item 4) The control unit calculates the estimated height based on an amount of movement of the first holding part in the height direction so that the first member and the first holding part come into contact with each other in the first process. (Item 5) 5. The conveying device according to any one of items 1 to 4, wherein the control unit corrects a command value supplied to the drive unit for driving the second hand in the second process based on the drive error. (Item 6) 6. The conveying device according to any one of items 1 to 5, wherein the control unit stops execution of the second process when the drive error is greater than a threshold value. (Item 7) 7. The conveying device according to any one of items 1 to 6, wherein the control unit issues a notification when the drive error is greater than a threshold value. (Item 8) a detection unit that detects a change over time in a distance between the first hand and the second hand in the height direction, The conveying device according to any one of items 1 to 7, characterized in that the control unit controls the driving of the second hand by the driving unit in the second process further based on the detection result of the detection unit. (Item 9) A first hand that holds a first member; A second hand that holds a second member; a support member for supporting the first hand and the second hand; a drive unit that drives the support member in a height direction to drive the first hand and the second hand in the height direction; a control unit that controls a first process of transporting the first member to a first holding unit by the first hand and a second process of transporting the second member to a second holding unit by the second hand; a detection unit that detects a height of the first member held by the first hand; Equipped with In the first process, after the first hand is driven in the height direction by the driving unit, a height of the first member held by the first hand is detected by the detection unit; The control unit controls the driving of the second hand by the driving unit in the second process based on a driving error of the driving unit determined from the detection result of the detection unit in the first process. (Item 10) A molding apparatus for molding a composition on a substrate using a mold, comprising: A first holding part that holds the mold; A second holding part that holds the substrate; A conveying device according to any one of items 1 to 9, Equipped with A molding apparatus, characterized in that the transport device transports the mold as the first member to the first holding section, and transports the substrate as the second member to the second holding section. (Item 11) A molding step of molding the composition on a substrate using the molding apparatus according to item 10; a processing step of processing the substrate having the composition molded in the molding step; a manufacturing process for manufacturing an article from the substrate processed in the processing process; A method for producing an article, comprising:

[0099] The invention is not limited to the above-described embodiments, and various modifications and variations are possible without departing from the spirit and scope of the invention. Accordingly, the following claims are appended to apprise the public of the scope of the invention. [Explanation of symbols]

[0100] 1: mold (first member), 2: substrate (second member), 3: composition, 100: flattening device (molding device), 200: flattening module, 201: substrate chuck (second holding part), 212: mold chuck (first holding part), 600: conveying device, 601: first hand, 602: second hand, 611: driving part, 612: supporting member, 700: control part

Claims

1. A first hand that holds a first member; A second hand that holds a second member; a support member for supporting the first hand and the second hand; a drive unit that drives the support member in a height direction to drive the first hand and the second hand in the height direction; a control unit that controls a first process of transporting the first member to a first holding unit by the first hand and a second process of transporting the second member to a second holding unit by the second hand; Equipped with The first holding portion is configured to be movable in the height direction, In the first process, the first hand is driven in the height direction by the driving unit, and then the first holding unit is moved in the height direction so that the first member held by the first hand comes into contact with the first holding unit; The control unit controls the driving of the second hand by the driving unit in the second process based on a driving error of the driving unit determined from the movement of the first holding unit in the first process.

2. In the first process, the first hand is driven by the driving unit so as to reach a target height, The conveying device according to claim 1, characterized in that the control unit determines the height of the first hand as an estimated height based on the movement of the first holding part in the first process, and determines the difference between the estimated height and the target height as the drive error.

3. The conveying device according to claim 2 , wherein the control unit calculates the estimated height based on a height of the first holding portion when the first member and the first holding portion come into contact with each other in the first process.

4. The conveying device according to claim 2, characterized in that the control unit calculates the estimated height based on an amount of movement of the first holding part in the height direction so that the first member and the first holding part come into contact with each other in the first process.

5. The transport device according to claim 1 , wherein the control unit corrects a command value supplied to the drive unit for driving the second hand in the second process based on the drive error.

6. The transport device according to claim 1 , wherein the control unit stops the execution of the second process when the drive error is greater than a threshold value.

7. The transport device according to claim 1 , wherein the control unit issues a notification when the drive error is greater than a threshold value.

8. a detection unit that detects a change over time in a distance between the first hand and the second hand in the height direction, The transport device according to claim 1 , wherein the control unit controls driving of the second hand by the drive unit in the second process further based on a detection result of the detection unit.

9. A first hand that holds a first member; A second hand that holds a second member; a support member for supporting the first hand and the second hand; a drive unit that drives the support member in a height direction to drive the first hand and the second hand in the height direction; a control unit that controls a first process of transporting the first member to a first holding unit by the first hand and a second process of transporting the second member to a second holding unit by the second hand; a detection unit that detects a height of the first member held by the first hand; Equipped with In the first process, after the first hand is driven in the height direction by the driving unit, a height of the first member held by the first hand is detected by the detection unit; A conveying device characterized in that the control unit controls the driving of the second hand by the driving unit in the second process based on a driving error of the driving unit determined from the detection result of the detection unit in the first process.

10. A molding apparatus for molding a composition on a substrate using a mold, comprising: A first holding part that holds the mold; A second holding part that holds the substrate; A conveying device according to any one of claims 1 to 9, Equipped with A molding apparatus, characterized in that the transport device transports the mold as the first member to the first holding section, and transports the substrate as the second member to the second holding section.

11. A molding step of molding a composition on a substrate using the molding apparatus according to claim 10; a processing step of processing the substrate having the composition molded in the molding step; a manufacturing process for manufacturing an article from the substrate processed in the processing process; A method for producing an article, comprising:

Images