Processing method
The powder bed laser processing device addresses inefficiencies in processing large areas by using multiple scanning units to overlap irradiation regions, ensuring accurate and efficient processing of variously shaped areas while minimizing waste.
Patent Information
- Application Number
- JP2025007611
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2025-01-20
- Publication Date
- 2025-04-10
AI Technical Summary
Existing powder additive manufacturing techniques face inefficiencies when processing large areas, as they require inefficient laser beam irradiation over the powder bed, and using multiple laser light sources can reduce accuracy due to power variations and result in waste when processing smaller areas.
A powder bed laser processing device equipped with multiple scanning units and driving units, allowing for efficient irradiation of laser beams over variously shaped areas by overlapping the irradiation regions of multiple scanning units, thereby maintaining accuracy and reducing waste.
The solution enables efficient processing of variously shaped areas with improved accuracy and reduced waste, as the overlapping irradiation regions ensure consistent laser power and efficient use of resources.
Smart Images

Figure 2025061481000001_ABST
Abstract
Description
[Technical field]
[0001] The present invention relates to a powder bed laser processing apparatus, a powder additive manufacturing apparatus, a processing method, and a program. [Background technology]
[0002] In the field of powder additive manufacturing apparatuses, laser processing apparatuses capable of handling large modeling areas have been developed.
[0003] For example, as a device for expanding the processing range of a single laser, a technique for moving the main body of a galvano scanner within a laser device has been disclosed (Patent Document 1). [Prior art documents] [Patent documents]
[0004] [Patent Document 1] JP 2011-240403 A Summary of the Invention [Problem to be solved by the invention]
[0005] However, in the case of the above-mentioned technology, in order to handle a large molding area, it is necessary to move the laser light irradiation unit relative to the powder bed while processing, which is not efficient. In addition, to address this issue, a technology is generally known in which multiple laser light sources are prepared and different laser lights are irradiated to different processing areas. However, when such a technology is adopted, there is a risk that the accuracy of the product will decrease because the laser power of each laser light source varies. In addition, when multiple laser light sources are prepared, multiple laser lights cannot be used in processing a relatively small molding area, and waste may occur.
[0006] The present disclosure has been made to solve such problems, and provides a powder bed laser processing device and the like that can efficiently process a variety of building areas. [Means for solving the problem]
[0007] The powder bed laser processing apparatus according to the present disclosure has a first scanning unit, a second scanning unit, a first driving unit, and a second driving unit. The first scanning unit scans and irradiates the powder bed with a first laser light. The second scanning unit scans and irradiates the powder bed with a second laser light. The first driving unit moves the first scanning unit so that the first laser light can be irradiated onto a first irradiation region. The second driving unit moves the second scanning unit so that the second laser light can be irradiated onto a second irradiation region including a part of the first irradiation region, and so that the position of the second scanning unit relative to the first scanning unit can be changed.
[0008] In the processing method according to the present disclosure, a computer executes a first driving step, a second driving step, a first scanning step, and a second scanning step. In the first driving step, the computer moves a first scanning unit so that a first irradiation region can be irradiated with a first laser light. In the second driving step, the computer moves a second scanning unit so that a second irradiation region including a part of the first irradiation region can be irradiated with a second laser light and so that a relative position with the first scanning unit can be changed. In the first scanning step, the computer scans and irradiates the first irradiation region with the first laser light. In the second scanning step, the computer scans and irradiates the second irradiation region with the second laser light.
[0009] A program according to the present disclosure causes a computer to execute the following processing method. In a first driving step, the computer moves a first scanning unit so that a first irradiation region can be irradiated with a first laser light. In a second driving step, the computer moves a second scanning unit so that a second irradiation region including a part of the first irradiation region can be irradiated with a second laser light and so that a relative position with the first scanning unit can be changed. In the first scanning step, the computer scans and irradiates the first irradiation region with the first laser light. In a second scanning step, the computer scans and irradiates the second irradiation region with the second laser light. Effect of the Invention
[0010] According to the present disclosure, it is possible to provide a powder bed laser processing apparatus, a powder additive manufacturing apparatus, a processing method, and a program capable of efficiently processing a variety of molding areas. [Brief description of the drawings]
[0011] [Figure 1] 1 is an overall view of a powder rapid prototyping apparatus according to an embodiment; [Diagram 2] 1 is a schematic perspective view of a laser processing apparatus according to an embodiment; [Diagram 3] FIG. [Figure 4] FIG. 2 is a diagram illustrating a configuration of a scanning unit. [Diagram 5] FIG. 2 is a top view showing the configuration of a laser beam. [Figure 6] 4 is a top view showing the irradiation area of the processing unit. FIG. [Figure 7] 1 is a top view showing a first example of a situation in which the laser processing device is manufacturing a product. FIG. [Figure 8] FIG. 11 is a top view showing a second example of a situation in which the laser processing apparatus is manufacturing a product. [Figure 9] FIG. 11 is a top view showing a third example of a situation in which the laser processing apparatus is manufacturing a product. [Figure 10] FIG. 1 is a block diagram of a powder additive manufacturing apparatus. [Figure 11] FIG. 2 is a block diagram of the laser processing device. [Figure 12] 4 is a flowchart showing the operation of the powder rapid prototyping apparatus. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0012] The present invention will be described below through the embodiments of the invention, but the invention according to the claims is not limited to the following embodiments. In addition, not all of the configurations described in the embodiments are necessarily essential as means for solving the problems. For clarity of explanation, the following description and drawings are omitted and simplified as appropriate. In each drawing, the same elements are given the same reference numerals, and duplicate explanations are omitted as necessary.
[0013] <Embodiment Mode> Hereinafter, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is an overall view of a powder additive manufacturing apparatus according to an embodiment. The powder additive manufacturing apparatus 1 shown in FIG. 1 is a type of so-called 3D printer, which produces a desired three-dimensional shape by forming and stacking thinly sliced two-dimensional layers one by one based on three-dimensional design data. FIG. 1 is a side view of the powder additive manufacturing apparatus 1, and for convenience of explanation, a part of it is shown as a cross section. The powder additive manufacturing apparatus 1 mainly comprises a powder bed laser processing apparatus 10 and a main body block 20.
[0014] For convenience of explaining the positional relationship of the components, a right-handed Cartesian coordinate system is used in Fig. 1. Also, in Fig. 2 and subsequent figures, when a Cartesian coordinate system is used, the X-axis, Y-axis, and Z-axis directions in Fig. 1 coincide with the X-axis, Y-axis, and Z-axis directions in these Cartesian coordinate systems, respectively.
[0015] The following describes the main body block 20. The main body block 20 includes a housing that supports the powder rapid prototyping apparatus 1 on a stationary surface. The main body block 20 includes a recoater 30, a powder supply unit 40, and a powder bed support unit 50 as its main components.
[0016] The recoater 30 sweeps the powder 80 supplied from the powder supply unit 40 onto the powder bed 90, and then spreads the powder 80 evenly across the powder bed 90. The recoater 30 includes a plate-like member that is installed so as to be able to reciprocate on the upper surface of the main body block 20. In the powder rapid prototyping apparatus 1, the recoater 30 moves from one end, which is the right side (negative side of the Y axis), to the other end, which is the left side (positive side of the Y axis), thereby spreading the powder 80 onto the powder bed 90. That is, in the powder rapid prototyping apparatus 1, the right side of FIG. 1 is the initial position of the recoater 30, and the powder 80, which is the material of the manufactured product, is spread onto the powder bed 90 by moving from the initial position to the left side. The plate-like member of the recoater 30 may be a roller.
[0017] The powder supplying unit 40 supplies a predetermined amount of powder 80 to the recoater 30 to generate a powder bed 90. The powder supplying unit 40 includes a powder storage unit, which is a rectangular recess provided on the upper surface of the main body block 20, and a plate-like member that moves the bottom surface of the powder storage unit up and down. The powder supplying unit 40 pushes up the plate-like member a preset distance. In this way, the powder supplying unit 40 supplies the predetermined amount of powder 80 to the recoater 30.
[0018] The powder bed support portion 50 is engaged so as to be movable up and down in a rectangular hole provided in the upper surface of the main body block 20. The powder bed support portion 50 has a flat upper surface, and supports a powder bed 90 on this upper surface.
[0019] The powder bed laser processing apparatus 10 is installed above the powder bed support 50, and irradiates a desired position with laser light onto a powder bed 90 formed on the upper surface of the powder bed support 50. As the powder bed laser processing apparatus 10 irradiates the powder bed 90 with laser light, the powder bed 90 melts and bonds, and an article 92 is formed.
[0020] Next, the powder bed laser processing apparatus 10 will be described in detail with reference to Fig. 2. Fig. 2 is a schematic perspective view of the laser processing apparatus according to the embodiment. The powder bed laser processing apparatus 10 has a plurality of processing units 11 as a main component. The powder bed laser processing apparatus 10 shown in the figure has four processing units 11 above a powder bed 90, which correspond to four divided regions 91 obtained by dividing the powder bed 90 into two in the X-axis direction and into two in the Y-axis direction.
[0021] More specifically, a first processing unit 11A is installed above a first divided region 91A, which is one of the four divided regions 91. Similarly, a second processing unit 11B, a third processing unit 11C, and a fourth processing unit 11D are installed above the second divided region 91B, the third divided region 91C, and the fourth divided region 91D, respectively. The above-mentioned multiple processing units 11 are each arranged on a plane parallel to the surface of the powder bed 90.
[0022] In the following description, for example, when simply referring to the machining unit 11, this refers collectively to the first machining unit 11A, the second machining unit 11B, the third machining unit 11C, and the fourth machining unit 11D. In each configuration of the machining unit 11, when a reference symbol corresponding to any of the first machining unit 11A, the second machining unit 11B, the third machining unit 11C, and the fourth machining unit 11D is not indicated, this refers to the configuration corresponding to all of the machining units 11.
[0023] The powder bed laser processing apparatus 10 shown in Fig. 2 is in a state in which a laser beam is irradiated onto a powder bed 90 to produce a product 92. In the figure, the thick dotted line indicates the laser beam irradiated from the processing unit 11 onto the powder bed 90. Each of the multiple processing units 11 has the function of irradiating a laser beam.
[0024] For example, the first machining unit 11A has a first driving unit 12A and a first scanning unit 13A. Similarly, the second machining unit 11B has a second driving unit 12B and a second scanning unit 13B. The third machining unit 11C has a third driving unit 12C and a third scanning unit 13C. The fourth machining unit 11D has a fourth driving unit 12D and a fourth scanning unit 13D. The driving unit 12 moves the scanning units 13 so that the laser light emitted by each scanning unit 13 can be irradiated onto the powder bed 90. The driving unit 12 also moves each scanning unit 13 on a common moving plane.
[0025] Next, the configuration of the machining unit 11 will be described with reference to Fig. 3. Fig. 3 is a schematic perspective view of the machining unit 11. The machining unit 11 mainly includes a drive unit 12 and a scanning unit 13. Fig. 3 also shows a divided area 91, a scanning area 101, and an irradiatable range 102 below the machining unit 11.
[0026] The driving unit 12 is installed above the divided region 91 by any support member (not shown). The driving unit 12 has a gantry mechanism including a first transport unit 12X and a second transport unit 12Y. The gantry mechanism is one embodiment of the driving unit 12.
[0027] The first transport unit 12X is fixed to an arbitrary support member, includes a guide rail extending in the X-axis direction, and supports the second transport unit 12Y so as to be linearly movable in the X-axis direction. That is, the first transport unit 12X transports the scanning unit 13 in a first direction (X direction) parallel to the surface of the powder bed 90. The second transport unit 12Y is supported by the first transport unit 12X, includes a guide rail extending in the Y-axis direction, and supports the scanning unit 13 so as to be linearly movable in the Y-axis direction. That is, the second transport unit 12Y transports the scanning unit 13 in a second direction (Y direction) parallel to the surface of the powder bed 90 and different from the first direction.
[0028] Next, the irradiation area of the laser light of the processing unit 11 will be described with reference to Fig. 3. The scanning unit 13 scans and irradiates the powder bed with the laser light L13. The scanning unit 13 scans the laser light L13 within the range of a scanning area 101. That is, the scanning area 101 indicates an area where the laser light L13 can be irradiated when the position of the scanning unit 13 does not change.
[0029] Further, the driving unit 12 moves the scanning unit 13 so that the laser light L13 can be irradiated to the irradiable range 102. The irradiable range 102 is set to include the divided region 91. In other words, the irradiable range 102 is set so that the laser light L13 can be irradiated to a range exceeding the divided region 91. In this way, the powder bed laser processing apparatus 10 is able to irradiate a wide area with the laser light by moving the scanning unit 13.
[0030] Next, the scanning unit 13 will be further described with reference to Fig. 4. Fig. 4 is a diagram showing the configuration of the scanning unit. The scanning unit 13 mainly includes a first galvano unit 131, a second galvano unit 132, and a lens 133. The scanning unit 13 includes the first galvano unit 131 and the second galvano unit 132 as one embodiment of a scanning unit that receives laser light and scans the laser light.
[0031] The first galvano unit 131 has a mirror 131A that reflects a laser beam and a mirror driver 131B that rotates the mirror back and forth around a predetermined axis within a predetermined angle range. The first galvano unit 131 receives a laser beam L13 from the outside, reflects it on the mirror 131A, and supplies the reflected laser beam L13 to the second galvano unit 132.
[0032] Similarly to the first galvano unit 131, the second galvano unit 132 also has a mirror 132A that reflects laser light, and a mirror driver 132B that rotates the mirror back and forth around a predetermined axis within a predetermined angle range. The axis around which the mirror of the first galvano unit 131 rotates and the axis around which the mirror of the second galvano unit 132 rotates are set to be perpendicular to each other. The second galvano unit 132 reflects the laser light L13 supplied from the first galvano unit 131 to the mirror 132A, and supplies the reflected laser light L13 to the lens 133.
[0033] Lens 133 receives the laser light scanned by first galvano unit 131 and second galvano unit 132 and irradiates the laser light onto powder bed 90. Lens 133 is a predetermined optical lens, and irradiates laser light L13 supplied from second galvano unit 132 onto powder bed 90. With this configuration, scanning unit 13 scans and irradiates scanning area 101 with laser light L13 supplied from the outside. Lens 133 may be configured by combining a plurality of lenses.
[0034] The galvano unit of the scanning unit 13 may have a galvano motor as a mechanism for reciprocating the mirror, or may be a MEMS mirror driver if the mirror is constructed using MEMS (Micro Electro Mechanical Systems) technology. The scanning unit 13 may include a configuration in which the relative positional relationship between the galvano unit and the lens 133 changes. By changing the positions of the galvano unit and the lens 133, the powder bed laser processing apparatus 10 can enlarge the scanning area 101 of the scanning unit 13.
[0035] Next, the configuration for supplying laser light in powder bed laser processing apparatus 10 and the irradiation area of scanning unit 13 will be described with reference to Fig. 5. Fig. 5 is a top view showing the configuration of the laser light. Powder bed laser processing apparatus 10 has a laser light source 140, a partial reflection mirror 141, a total reflection mirror 142, a partial reflection mirror 143, a total reflection mirror 144, a partial reflection mirror 145 and a total reflection mirror 146 as a configuration for supplying laser light to scanning unit 13.
[0036] The laser light source 140 includes, for example, a carbon dioxide laser oscillator that oscillates and emits a carbon dioxide laser. The laser light source 140 supplies a laser beam to a partial reflection mirror 141. The partial reflection mirror 141 reflects a portion of the laser beam received from the laser light source 140 and supplies the reflected beam to a total reflection mirror 142. The partial reflection mirror 141 also transmits a portion of the laser beam received from the laser light source 140 and supplies the transmitted beam to a partial reflection mirror 145.
[0037] Total reflection mirror 142 reflects the laser light received from partial reflection mirror 141 and supplies it to partial reflection mirror 143. Partial reflection mirror 143 reflects a portion of the laser light received from total reflection mirror 142 and supplies it to first scanning unit 13A corresponding to first divided region 91A. Partial reflection mirror 143 also transmits a portion of the laser light received from total reflection mirror 142 and supplies it to total reflection mirror 144. Total reflection mirror 144 reflects the laser light received from partial reflection mirror 143 and supplies it to third scanning unit 13C corresponding to third divided region 91C.
[0038] The partial reflection mirror 145 reflects a portion of the laser light received from the partial reflection mirror 141 and supplies it to the second scanning unit 13B corresponding to the second divided region 91B. The partial reflection mirror 145 also transmits a portion of the laser light received from the partial reflection mirror 141 and supplies it to the total reflection mirror 146. The total reflection mirror 146 reflects the laser light received from the partial reflection mirror 145 and supplies it to the fourth scanning unit 13D corresponding to the fourth divided region 91D.
[0039] With the above configuration, the powder bed laser processing apparatus 10 splits the laser light generated by the laser source 140 and supplies it to each of the four scanning units 13. Note that the reflectance or transmittance of the partial reflection mirror in the above configuration is adjusted so that the laser power supplied to the four scanning units 13 is uniform.
[0040] In the above example, if the laser power of the laser light output from laser light source 140 is 100%, the laser power of the laser light transmitted through or reflected by partial reflection mirror 141 is 50%. Moreover, the laser power of the laser light transmitted through or reflected by partial reflection mirror 143 is 25%. Similarly, the laser power of the laser light transmitted through or reflected by partial reflection mirror 145 is 25%. As a result, the laser power of the laser light received by scanning unit 13 is 25%.
[0041] In this way, by branching the laser light generated by one laser source and supplying it to multiple scanning units 13, the powder bed laser processing apparatus 10 can suppress variations in the laser power of the multiple scanning units 13. Therefore, the powder additive manufacturing apparatus 1 can efficiently manufacture products with suppressed dimensional variations.
[0042] The above-mentioned mirror configuration is one example in powder bed laser processing apparatus 10, and the mirror configuration in powder bed laser processing apparatus 10 is not limited to the above. In the above-mentioned mirror configuration, partial reflection mirror 143, total reflection mirror 144, partial reflection mirror 145, and total reflection mirror 146 can each be designed to be able to follow the movement of scanning unit 13 that supplies laser light.
[0043] Next, the irradiation area of the scanning unit 13 will be described. In FIG. 5, the area indicated by the thick dotted line is the first irradiation area 103A. The first irradiation area 103A is an area corresponding to the range of the powder bed 90 within the irradiation possible range 102 of the first scanning unit 13A. In other words, the first irradiation area 103A is an area where the first scanning unit 13A can irradiate the powder bed 90 with laser light. The first irradiation area 103A includes the first divided area 91A, and also includes parts of the second divided area 91B, the third divided area 91C, and the fourth divided area 91D adjacent to the first divided area 91A.
[0044] The irradiation area will be further described with reference to FIG. 6. FIG. 6 is a top view showing the irradiation area of the processing unit. In FIG. 6, in addition to the first irradiation area 103A, the second irradiation area 103B, the third irradiation area 103C, and the fourth irradiation area 103D are shown. The second irradiation area 103B is an area where the second scanning unit 13B can irradiate the powder bed 90 with laser light. The third irradiation area 103C is an area where the third scanning unit 13C can irradiate the powder bed 90 with laser light. The fourth irradiation area 103D is an area where the fourth scanning unit 13D can irradiate the powder bed 90 with laser light. As shown in the figure, the first irradiation area 103A to the fourth irradiation area 103D have overlapping areas.
[0045] For example, the first irradiation area 103A has a first processing area A1, a second processing area A2, a third processing area A3, and a fourth processing area A4 as shown in the figure. The first processing area A1 is included in the first irradiation area 103A and does not overlap with other irradiation areas. In other words, the first processing area A1 is an area that can be irradiated with laser light by the first scanning unit 13A.
[0046] The second processing area A2 is an area where the first irradiation area 103A and the second irradiation area 103B overlap each other. That is, the second processing area A2 is an area that can be irradiated with laser light by the first scanning unit 13A and the second scanning unit 13B.
[0047] The third processing area A3 is an area where the first irradiation area 103A and the third irradiation area 103C overlap each other. That is, the third processing area A3 is an area that can be irradiated with laser light by the first scanning unit 13A and the third scanning unit 13C.
[0048] The fourth processing area A4 is an area where the first irradiation area 103A, the second irradiation area 103B, the third irradiation area 103C, and the fourth irradiation area 103D overlap each other. That is, the fourth processing area A4 is an area that can be irradiated with laser light by the first scanning unit 13A, the second scanning unit 13B, the third scanning unit 13C, and the fourth scanning unit 13D.
[0049] As described above, in the powder bed laser processing apparatus 10, the irradiation areas of the laser light of each of the multiple scanning units 13 overlap each other. For example, the first driving unit 12A moves the first scanning unit so that the laser light irradiated by the first scanning unit 13A can be irradiated to the first irradiation area. The second driving unit 12B moves the second scanning unit 13B so that the laser light irradiated by the second scanning unit 13B can be irradiated to the second irradiation area including a part of the first irradiation area. The first driving unit 12A and the second driving unit 12B move the first scanning unit 13A and the second scanning unit 13B so that the relative positions of the first scanning unit 13A and the second scanning unit 13B can be changed. With this configuration, the powder bed laser processing apparatus 10 can efficiently manufacture products of various sizes and shapes.
[0050] Next, an example of a product manufactured by the powder bed laser processing apparatus 10 will be described. Fig. 7 is a top view showing a first example of a situation in which a product is being manufactured. For ease of understanding, Fig. 7 shows the positions of the lenses 133 of each of the multiple scanning units 13 and the laser light irradiated from each lens superimposed on the powder bed 90.
[0051] FIG. 7 shows a state in which a product 92 is being manufactured in a powder bed 90. The product 92 is relatively large and spans a first divided region 91A, a second divided region 91B, a third divided region 91C, and a fourth divided region 91D. In order to manufacture the product 92, the powder bed laser processing apparatus 10 assigns the first scanning unit 13A to process (i.e., irradiate laser light) the first divided region 91A. Similarly, the powder bed laser processing apparatus 10 assigns the second scanning unit 13B to process the second divided region 91B, the third scanning unit 13C to process the third divided region 91C, and the fourth scanning unit 13D to process the fourth divided region 91D. In this manner, the powder bed laser processing apparatus 10 efficiently manufactures the product 92 by having the four scanning units 13 equally share the processing area.
[0052] Next, a further example of the case where the powder bed laser processing apparatus 10 manufactures a product will be described with reference to Fig. 8. Fig. 8 is a top view showing a second example of the situation where the laser processing apparatus manufactures a product. Fig. 8 shows the situation where a product 93 is manufactured in the powder bed 90. The product 93 is a relatively small item that exists in the first division region 91A.
[0053] In the above-mentioned situation, the powder bed laser processing apparatus 10 assigns, for example, the first scanning unit 13A to process the first processing area A1 of the first divided area 91A to manufacture the product 93. The powder bed laser processing apparatus 10 also assigns the second scanning unit 13B to process the second processing area A2, the third scanning unit 13C to process the third processing area A3, and the fourth scanning unit 13D to process the fourth processing area A4. In this manner, the powder bed laser processing apparatus 10 efficiently manufactures the product 93 by dividing the work among the four scanning units 13.
[0054] Next, Fig. 9 will be described. Fig. 9 is a top view showing a third example of a situation in which the laser processing device is manufacturing a product. Fig. 9 shows a situation in which a product 93 and a product 94 are manufactured in a powder bed 90. The product 93 is manufactured in a first division area 91A. The product 94 has the same size as the product 93 and is manufactured in a fourth division area 91D.
[0055] In the above-mentioned situation, the powder bed laser processing apparatus 10, for example, has the first scanning unit 13A and the third scanning unit 13C perform the processing of the product 93 in the first divided region 91A. Also, the powder bed laser processing apparatus 10 has the second scanning unit 13B and the fourth scanning unit 13D perform the processing of the product 94 in the fourth divided region 91D. In this way, the powder bed laser processing apparatus 10 efficiently manufactures the product 93 and the product 94.
[0056] An example of the processing method performed by the powder bed laser processing apparatus 10 has been described above with reference to Figures 7, 8, and 9. As described above, the powder bed laser processing apparatus 10 can efficiently use multiple scanning units 13 for manufactured products of various sizes.
[0057] Next, the functional configuration of the powder additive manufacturing apparatus 1 will be described with reference to Fig. 10. Fig. 10 is a block diagram of the powder additive manufacturing apparatus. The powder additive manufacturing apparatus 1 mainly comprises an overall control unit 21, an operation reception unit 22, a display unit 23, a powder bed laser processing apparatus 10, a recoater 30, a powder supply unit 40, and a powder bed support unit 50. Each component shown in Fig. 10 is connected by a predetermined communication means so as to be able to communicate appropriately.
[0058] The overall control unit 21 includes an arithmetic unit such as a CPU (Central Processing Unit) or an MPU (Micro Processing Unit), is communicatively connected to each component of the powder additive manufacturing apparatus 1, and controls the entire powder additive manufacturing apparatus 1. For example, when the overall control unit 21 receives an instruction from a user to manufacture a product, it controls the powder bed laser processing apparatus 10, the recoater 30, the powder supply unit 40, and the powder bed support unit 50 according to the size and shape of the product to manufacture the product.
[0059] The operation reception unit 22 is a user interface including, for example, a keyboard, buttons, a touch panel, etc. The operation reception unit 22 receives operations from a user who uses the powder additive manufacturing apparatus 1, and supplies a signal related to the received operation to the overall control unit 21. The display unit 23 includes a display device such as a liquid crystal panel, an organic electroluminescence panel, or an LED (light-emitting diode), and notifies the user of information such as the operating status of the powder additive manufacturing apparatus 1.
[0060] The storage unit 24 is a storage device including a non-volatile memory, and stores, for example, a program executed by the powder rapid prototyping apparatus 1. The storage unit 24 may supply the stored program to the overall control unit 21 when the powder rapid prototyping apparatus 1 is started up.
[0061] The powder bed laser processing apparatus 10 shown in the figure will be described later. The recoater 30, the powder supply unit 40, and the powder bed support unit 50 are each set to be operable by receiving support from the overall control unit 21. For example, the recoater 30, the powder supply unit 40, and the powder bed support unit 50 each have a sensor for monitoring the operating state, a motor for executing the operation, and a motor driver for driving the motor.
[0062] Next, the functional configuration of the powder bed laser processing apparatus 10 will be further described with reference to Fig. 11. Fig. 11 is a block diagram of the powder bed laser processing apparatus 10. The powder bed laser processing apparatus 10 mainly includes a control unit 15, a first processing unit 11A, a second processing unit 11B, a third processing unit 11C, and a fourth processing unit 11D.
[0063] The control unit 15 controls the multiple scanning units 13 of the powder bed laser processing apparatus 10. The control unit 15 has a position monitoring unit 110, a drive control unit 111, and a laser light control unit 112 as its main components.
[0064] The position monitoring unit 110 monitors the positions of the first scanning unit 13A, the second scanning unit 13B, the third scanning unit 13C, and the fourth scanning unit 13D. More specifically, the position monitoring unit 110 acquires data on the position of the first scanning unit 13A from the first position sensor 14A of the first machining unit 11A. Similarly, the position monitoring unit 110 acquires data on the positions of the respective scanning units 13 from the second position sensor 14B of the second machining unit 11B, the third position sensor 14C of the third machining unit 11C, and the fourth position sensor 14D of the fourth machining unit 11D. When the position monitoring unit 110 acquires data on the positions of the respective scanning units 13, it supplies the acquired data to the drive control unit 111.
[0065] The drive control unit 111 includes a calculation device such as a CPU or an MPU. The drive control unit 111 also includes a volatile or non-volatile storage device and executes a predetermined program. Thereby, the drive control unit 111 controls the operation of the first drive unit 12A, the second drive unit 12B, the third drive unit 12C, and the fourth drive unit 12D in cooperation with the position monitoring unit 110. That is, the drive control unit 111 receives data on the position of each scanning unit 13 from the position monitoring unit 110, and supplies a signal to each drive unit 12 to support driving according to the received data. Furthermore, when the scanning unit 13 moves to a set position, the drive control unit 111 also cooperates with the laser light control unit 112 to scan and irradiate each irradiation area with a laser light. The laser light control unit 112 receives an instruction from the drive control unit 111 and controls the oscillation of the laser light included in the laser light source 140.
[0066] The first processing unit 11A has, as its main components, a first driving unit 12A, a first scanning unit 13A, and a first position sensor 14A. The first driving unit 12A includes a motor for moving the first scanning unit 13A. The first driving unit 12A may include a motor driver for driving this motor. The first scanning unit 13A includes a driving unit for driving a scanner for scanning and irradiating the powder bed 90 with the laser light, and a driver for driving this driving unit. The driving unit for driving the scanner is, for example, a galvanometer motor. In addition, when the scanner is composed of a MEMS mirror, the driving unit is a MEMS mirror driver. The first position sensor 14A is a sensor for detecting the position of the first scanning unit 13A, and is, for example, a linear position sensor or an encoder for detecting the operating state of the motor.
[0067] The second machining unit 11B has, as its main components, a second driving unit 12B, a second scanning unit 13B, and a second position sensor 14B. The third machining unit 11C has, as its main components, a third driving unit 12C, a third scanning unit 13C, and a third position sensor 14C. The fourth machining unit 11D has, as its main components, a fourth driving unit 12D, a fourth scanning unit 13D, and a fourth position sensor 14D. The configurations of the second machining unit 11B, the third machining unit 11C, and the fourth machining unit 11D are equivalent to the configuration of the first machining unit 11A described above.
[0068] Next, a process executed by the powder rapid prototyping apparatus 1 will be described with reference to Fig. 12. Fig. 12 is a flowchart showing the operation of the powder rapid prototyping apparatus 1. The flowchart shown in Fig. 12 starts, for example, when the powder rapid prototyping apparatus 1 is started.
[0069] First, the overall control unit 21 of the powder rapid prototyping apparatus 1 sets each component of the powder rapid prototyping apparatus 1 to an initial position (step S10). The initial position is the initial position of the operation when starting the production of a product. For example, the initial position of the recoater 30 is the right end position of the main body block 20 shown in FIG. 1. The initial position of the powder supply unit 40 is a position where the top surface of the powder 80 and the top surface of the main body block 20 coincide. The initial position of the powder bed support unit 50 is a position where the surface for generating the powder bed 90 coincides with the top surface of the main body block 20. After setting each component to its initial position, the overall control unit 21 executes the processes from step S11 to step S13 and the process of step S14 in parallel.
[0070] The processing of steps S11 to S13 will be described below. The overall control unit 21 lowers the powder bed support unit 50 by a thickness equivalent to one layer of the powder bed 90 (step S11). Next, the overall control unit 21 causes the powder supply unit 40 to supply powder 80 equivalent to one layer of the powder bed 90 (step S12). Next, the overall control unit 21 moves the recoater 30 to spread the powder 80 supplied from the powder supply unit 40 onto the powder bed 90, thereby generating the powder bed 90 (step S13). Steps S11 to S13 have been described above.
[0071] In step S14, the overall control unit 21 moves the scanning units 13 of the powder bed laser processing apparatus 10 to predetermined positions (step S14). More specifically, the overall control unit 21 instructs the drive control units 111 of the powder bed laser processing apparatus 10 as to the positions of the respective scanning units 13. The drive control units 111 move the first scanning unit 13A to the fourth scanning unit 13D in response to the instructions received from the overall control unit 21.
[0072] Next, the overall control unit 21 judges whether or not laser irradiation is possible (step S15). More specifically, when the overall control unit 21 detects that the processes of steps S11 to S13 and the process of step S14 described above have been completed, it judges that laser irradiation is possible, and when any process has not been completed, it does not judge that laser irradiation is possible. When it does not judge that laser irradiation is possible (step S15: NO), the overall control unit 21 repeats step S15. When it judges that laser irradiation is possible (step S15: YES), the overall control unit 21 proceeds to step S16.
[0073] In step S16, the overall control unit 21 instructs the powder bed laser processing apparatus 10 to irradiate the laser light (step S16). When the powder bed laser processing apparatus 10 receives such an instruction, the laser light control unit 112 causes the laser light to be scanned and irradiated onto the irradiation area.
[0074] Next, the overall control unit 21 judges whether the processing has been completed (step S17). If it is not judged that the processing has been completed (step S17: NO), the overall control unit 21 returns to the processing of steps S11 and S14. If it is judged that the processing has been completed (step S17: YES), the overall control unit 21 ends the series of processing.
[0075] The above describes the processing executed by the powder rapid prototyping apparatus 1. The flowchart shown in Fig. 11 includes a processing method executed by the powder bed laser processing apparatus 10. That is, the powder bed laser processing apparatus 10 moves the scanning unit 13 so that the laser light can be irradiated onto each irradiation area (step S14), and further scans and irradiates the laser light onto each irradiation area (step S16).
[0076] In the above process, first driver 12A to fourth driver 12D move scanner 13 (step S14) during the period when the powder bed support unit lowers the powder bed or the recoater is driven (the period from step S11 to step S13). By such a process, powder bed laser processing apparatus 10 can efficiently move scanner 13 to manufacture products.
[0077] As described above, according to the embodiment, it is possible to provide a powder bed laser processing apparatus, a powder additive manufacturing apparatus, a processing method, and a program that can efficiently process various modeling areas.
[0078] The above-mentioned program can be stored and supplied to a computer using various types of non-transitory computer-readable media. The non-transitory computer-readable media includes various types of tangible recording media. Examples of the non-transitory computer-readable media include magnetic recording media (e.g., flexible disks, magnetic tapes, hard disk drives), magneto-optical recording media (e.g., magneto-optical disks), CD-ROM (Read Only Memory), CD-R, CD-R / W, and semiconductor memory (e.g., mask ROM, PROM (Programmable ROM), EPROM (Erasable PROM), flash ROM, RAM (Random Access Memory)). The program may also be supplied to a computer by various types of temporary computer-readable media. Examples of the temporary computer-readable media include electric signals, optical signals, and electromagnetic waves. The temporary computer-readable media can supply the program to a computer via a wired communication path such as an electric wire and an optical fiber, or via a wireless communication path.
[0079] Although the embodiment has been described above, the powder bed laser processing apparatus 10 and the powder additive manufacturing apparatus 1 according to the embodiment are not limited to the above-mentioned configuration. For example, the number of scanning units 13 may be two or more, not four. The powder bed laser processing apparatus 10 may have a plurality of laser light sources, and may supply laser light from the plurality of laser light sources to the scanning unit 13.
[0080] The present invention is not limited to the above-described embodiment, and can be modified as appropriate without departing from the spirit and scope of the present invention. [Explanation of symbols]
[0081] 1 Powder additive manufacturing equipment 10 Powder bed laser processing equipment 11 Processing unit 12 Drive unit 12X First conveyor section 12Y 2nd conveyor section 13 Scanning section 14 Position Sensor 15 Control Unit 20 Body block 21 Overall control unit 22 Operation reception section 23 Display section 24 Memory section 30 Recoater 40 Powder supply section 50 Powder bed support 80 powder 90 powder bed 91 Split area 92 Manufactured products 93 Manufactured products 94 Manufactured products 101 Scanning Area 102 Irradiation range 103 Irradiation area 110 Position monitoring section 111 Drive control unit 112 Laser light control unit 131 First Galvano Unit 132 Second Galvano Unit 133 Lens 140 Laser Light Source 141 Partially Reflecting Mirror 142 Total Reflection Mirror 143 Partially Reflecting Mirror 144 Total Reflection Mirror 145 Partially Reflecting Mirror 146 Total Reflection Mirror
Claims
1. A processing method for manufacturing an additive manufacturing product by irradiating a powder bed with a laser, comprising: The computer a dividing step of dividing an area of the powder bed to be irradiated with the laser light into first to Nth divided areas each having an equal area; A scanning step of irradiating the first divided region to the Nth divided region of the powder bed with a first laser light to an Nth laser light, respectively. Processing method.
2. The computer, a step of moving the laser beam scanning unit while a powder bed support unit supporting the powder bed lowers the powder bed or while a recoater that spreads powder on the powder bed is driven; The processing method according to claim 1.
Citation Information
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