Electronic equipment

Abstract

To provide electronic equipment which has a large display region, and electronic equipment in which the size of a display region can be selected in accordance with the purpose of use.SOLUTION: Electronic equipment has such a constitution that two sections sandwiching the bending portion of a display panel are each fixed to housings, and the electronic equipment assumes a form in which the display panel is opened and a form in which the display panel is folded in three pieces. The electronic equipment has such a mechanism that two housings slide in parallel to each other, and when the display panel is folded, the display panel is deformed in such a manner that a portion of the display panel where the display face is bent in shape of a convex and a portion where the display face is bent in shape of a concave move in parallel to and in a direction opposite to each other. When the display panel is deformed, the two sections of the display panel supported by the housings slide while the display faces of these sections keep parallel to each other.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] One aspect of the present invention relates to an electronic device including a display device.

[0002] Note that one embodiment of the present invention is not limited to the above technical fields. The technical field of one embodiment of the present invention is a semiconductor device, a display device, a light-emitting device, a power storage device, a storage device, and a , electronic device, lighting device, input device, input / output device, driving method thereof, or manufacturing method thereof The law can be cited as one example. [Background technology]

[0003] In recent years, electronic devices equipped with display devices have become increasingly diverse. Electronic devices include smartphones, tablet devices, and wearable devices.

[0004] The representative display device is an organic EL (Electro Luminescence ) elements and light emitting diodes (LEDs) Light-emitting devices equipped with optical elements, liquid crystal display devices, electronic paper that displays using electrophoresis, etc. - etc.

[0005] Patent Document 1 discloses a flexible light-emitting device using an organic EL element. . [Prior art documents] [Patent documents]

[0006] [Patent Document 1] JP 2014-197522 A Summary of the Invention [Problem to be solved by the invention]

[0007] In recent years, there has been a demand for electronic devices with large display areas. This has the advantage of improving the visibility and increasing the amount of information that can be displayed. In electronic devices of this type, portability decreases when the display area is enlarged. For this reason, it has been difficult to improve both the viewability of the display and the portability.

[0008] An object of one embodiment of the present invention is to provide an electronic device having a large display area. Another object of the present invention is to improve the portability of electronic devices. One of the objectives is to provide an electronic device that can change the size of the display depending on the purpose. It is an object of the present invention to provide an electronic device capable of selecting the size of a region. One of the objects of the present invention is to provide a novel electronic device. [Means for solving the problem]

[0009] One embodiment of the present invention is an electronic device that has a flexible display panel. The third portion has a first portion, a second portion, and a third portion. The third portion has flexibility. and is located between the first portion and the second portion. The display panel is a first display surface, a second display surface located in the second portion, and a third display surface located in the third portion; The display panel is capable of being transformed between a first form and a second form. In one embodiment, the third portion is flat, and the first display surface, the second display surface, and the third display surface are In the second embodiment, the third portion is disposed parallel to the third display surface. a first curved portion in which a part of the third display surface is curved convexly, and a second curved portion in which another part of the third display surface is curved concavely. and a curved portion, and a portion of the first display surface and a portion of the second display surface are each flat. When the display panel is in the second form, the first curved portion and the second curved portion The third portion is deformed so that the width between the first display surface and the second display surface changes. The relative positions of the first and second parts change while maintaining the parallel state.

[0010] When the display panel is transformed between the first and second configurations, the first display surface and the second display surface are While the display surfaces are kept parallel, the first portion and the second portion are aligned in a direction perpendicular to the first display surface. Preferably, the third portion deforms such that the relative positions of the two portions change.

[0011] When the display panel is in the second form, the third display surface in the third portion is curved concavely. The part where the third display surface is bent convexly in the third part faces the first part side, and the part where the third display surface is bent convexly in the third part faces the second part side. In this case, the area of ​​the second display surface is preferably located on the side of the first display surface. It is more preferable that the display surface of the display device be larger than the display surface of the display device.

[0012] The area of ​​the display area in the first embodiment is equal to or larger than the area of ​​the display area in the second embodiment. It is preferable that the ratio is 1.1 times or more and 3 times or less.

[0013] The electronic device includes a first housing supporting a first portion and a second housing supporting a second portion. It is preferable that the housing further include a mechanism for slidably connecting the first housing and the second housing.

[0014] The electronic device preferably has a hinge having parallel first and second axes. At this time, the first housing and the hinge are connected to be rotatable about a first axis, and the second housing and the hinge are connected to be rotatable about a first axis. The first housing and the second housing are connected to each other so as to be rotatable about a second axis. It is preferable that the slide rail extends in a direction intersecting the first axis, and The hinge is preferably slidably mounted along a slide rail.

[0015] It is preferable that the electronic device can be modified as follows: When the display panel is in the first position, the hinge is located at one end of the slide rail. When the display state is changed to the display state, the hinge rotates to rotate the first housing and the second housing in a direction perpendicular to the first display surface. When the display panel is in the second form, the hinge is connected to the slide rail. By sliding along the slide rail, the first housing or the second housing moves along the slide rail. Sliding.

[0016] The second housing preferably has a notch in a part opposite to the side supporting the second portion. Furthermore, when the display panel is in the second form, the first housing and the second housing are separated by the notch. It is more preferable that the third portion is housed in a space formed between the body.

[0017] The second housing may have a convex portion having a convex curved surface in a portion overlapping with the third portion. Furthermore, when the display panel is in the second form, the third portion is attached to the protruding portion of the second housing. It is more preferable that the curve be along the line.

[0018] When the display panel is in the first form, the electronic device detects the relative position of the first housing and the second housing by a sensor. It is preferable that the electronic device has a first lock mechanism that locks the display panel. and the first display surface is at least one of the second portion, the third portion, and the second housing. a second lock for locking the relative positions of the first and second housings in a state where the first and second housings are covered at least uniformly; It is preferable that the actuator has a lock mechanism.

[0019] It is preferable that the electronic device has a first vibration element and a second vibration element. The first vibration element and the second vibration element vibrate the first housing and the second housing, respectively. In this case, it is more preferable that the first vibration element and the second vibration element have the following function: It is even more preferable if the vibration frequencies are different. Effect of the Invention

[0020] According to one embodiment of the present invention, an electronic device having a large display area can be provided. This can improve the portability of child devices. Or, it can be used for electronic devices that can change the size of the display area. Or, electronic devices that allow the size of the display area to be selected according to the purpose can be provided. We can provide new electronic equipment. [Brief description of the drawings]

[0021] [Figure 1] 1 shows a configuration example of an electronic device according to an embodiment. [Diagram 2] 1 shows a configuration example of an electronic device according to an embodiment. [Diagram 3] 1 shows a configuration example of an electronic device according to an embodiment. [Figure 4] 1 shows a configuration example of an electronic device according to an embodiment. [Diagram 5] 1 shows a configuration example of an electronic device according to an embodiment. [Figure 6] 1 shows a configuration example of an electronic device according to an embodiment. [Figure 7] 1 shows a configuration example of an electronic device according to an embodiment. [Figure 8] 1 shows a configuration example of an electronic device according to an embodiment. [Figure 9] 1 shows a configuration example of an electronic device according to an embodiment. [Figure 10] 1 shows a configuration example of an electronic device according to an embodiment. [Figure 11] FIG. 1 is a block diagram of an electronic device according to an embodiment. [Figure 12] 1 shows a configuration example of an electronic device according to an embodiment. [Figure 13] FIG. 1 is a block diagram of an electronic device according to an embodiment. [Figure 14] 1 shows a configuration example of an electronic device according to an embodiment. [Figure 15] 1 shows a configuration example of an electronic device according to an embodiment. [Figure 16] 1 shows a configuration example of an electronic device according to an embodiment. [Figure 17] 3 shows a configuration example of an input device according to an embodiment. [Figure 18] 3 shows a configuration example of an input device according to an embodiment. [Figure 19] 1 shows a configuration example of a display device according to an embodiment. [Figure 20] 5A to 5C are diagrams illustrating an example of a method for driving an input device according to an embodiment. [Figure 21] 1 shows a configuration example of an input / output device according to an embodiment. [Figure 22] 1 shows a configuration example of an input / output device according to an embodiment. [Diagram 23] 1 shows a configuration example of an input / output device according to an embodiment. [Figure 24] 1 shows a configuration example of an input / output device according to an embodiment. [Diagram 25] 1 shows a configuration example of an input / output device according to an embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0022] The embodiment will be described in detail with reference to the drawings. However, the present invention is not limited to the following description. The present invention is not limited to the above embodiment, and various changes and modifications may be made in the form and details without departing from the spirit and scope of the present invention. It will be easily understood by those skilled in the art that the present invention can be realized by the following embodiments. The present disclosure should not be construed as being limited to the contents of the preceding paragraph.

[0023] In the configuration of the invention described below, the same parts or parts having similar functions are The same reference numerals are used in common between different drawings, and the repeated explanations are omitted. When referring to a function, the hatching pattern is the same and no particular symbol is attached. .

[0024] In each figure described in this specification, the size, layer thickness, or area of ​​each component is indicated by The figures may be exaggerated for clarity and are not necessarily limited to scale. stomach.

[0025] In this specification, ordinal numbers such as "first" and "second" are used to avoid confusion of components. The numbers are added for the purpose of convenience and are not intended to be limiting.

[0026] (Embodiment 1) In this embodiment, a configuration example of an electronic device according to one embodiment of the present invention will be described.

[0027] An electronic device according to one embodiment of the present invention includes a display panel that is partly flexible and can be bent. The electronic device has two configurations: one with the display panel open and one folded in three. It can be taken.

[0028] In electronic devices, the two parts that sandwich the curved part of the display panel are each fixed to the housing. In addition, when the display panel is folded into three, the display panel has a display The display surface has a portion where the display surface is curved convexly and a portion where the display surface is curved concavely. The display panel has a mechanism that allows the body to slide in parallel, so that the two curved parts They can be deformed so that they move in parallel and opposite directions. The two parts supported by the panel housing slide while maintaining their display surfaces parallel to each other. It is possible.

[0029] The electronic device according to one embodiment of the present invention has a seamless, wide display area when the display panel is open. The display panel can be folded into three parts for easy viewing. In this case, electronic devices can be made smaller and more portable. When the device is attached, the two housings can slide and deform, allowing the height of the electronic device to be adjusted. The range of motion in the direction (perpendicular to the display surface) can be kept to a minimum. There is no need to lift the case, and the two can be separated by simply sliding one case over the other. Since the electronic device can be switched between the above modes, it is possible to realize an electronic device with improved convenience. In addition, because electronic devices can be transformed with such simple movements, they can be operated with one hand. It is also possible.

[0030] More specifically, for example, the following configuration can be adopted.

[0031] [Configuration example] 1(A1), (B1), and (C1) are schematic perspective views of an electronic device 10. The child device 10 has a flexible display panel 11. FIG. FIG. 1(C1) shows a state where the display panel 11 is open, and FIG. 1(B1) shows a state where the display panel 11 is folded. Each of the states between these two states is shown.

[0032] FIG. 1(A2) is a schematic cross-sectional view corresponding to the cutting line A1-A2 in FIG. 1(A1). FIG. 1(B2) is a schematic cross-sectional view corresponding to the section line A3-A4 in FIG. 1(B1). (C2) is a schematic cross-sectional view corresponding to the cutting line A5-A6 in FIG. 1(C1).

[0033] The electronic device 10 includes a display panel 11, a hinge 12, a housing 21, and a housing 22. The panel 11 has a flexible and bendable portion (also called the third portion). The part that is supported by the housing 21 and fixed to the housing 21 (the first part) is sandwiched between the octopus part. A portion supported by the housing 22 and fixed to the housing 22 (also referred to as a first portion) and a portion supported by the housing 22 and fixed to the housing 22 (also referred to as a second portion) are The display panel 11 has two display panels supported by a housing 21 or a housing 22. The portion may not be flexible.

[0034] The housing 21 and the housing 22 are connected by a hinge 12. , the display panel 11 is moved in a direction parallel to the display surface thereof by the slide rail 13 of the housing 21. is slidably coupled to the

[0035] In each of the drawings in FIG. 1, a printed circuit board 42, a battery 43, etc. are included in the housing 21. Various ICs are mounted on the printed circuit board 42. FPC (Flexible Printed Circuit) connected to 11 ends 41 is partially inserted into the housing 21 and connected to a terminal of the printed circuit board 42. In the configuration shown in Fig. 1, the housing 21 can also be called a main body.

[0036] In addition, the housing 22 has a cutout portion on the side opposite to the side supporting the display panel 11. In other words, the housing 22 has a portion on the side opposite to the side supporting the display panel 11 that is thicker than the other portions. The recess has a small thickness.

[0037] 1(A1) and (A2) show two housings stacked together such that housing 22 is positioned above housing 21. The display panel 11 is in a movable state (also referred to as a closed state of the electronic device 10). The flexible portion is bent so that the display surface is convex, and the flexible portion is bent so that the display surface is concave. The display panel is folded by two bent parts. The flexible portion of the cable 11 is formed in a gap between the notch of the housing 22 and the housing 21. The storage unit is positioned so that it can be stored in the storage unit.

[0038] The edge of the housing 22 is processed so that the surface is curved. 1 is curved so that the display surface is convex so as to fit the curved surface of the housing 22.

[0039] In addition, the housing 21 has a portion near the end that is thicker and protrudes toward the display surface. Furthermore, that portion is processed to have a concave shape so that the convexly curved portion of the display panel 11 fits into it. That is, the protruding portion of the housing 21 is a portion where the display panel 11 is folded. When the display panel 11 is unfolded, the display panel 11 has a function of protecting the surface of the curved portion. The user holds the protruding portion of the housing 21, and the housing 22 slides, so that the center of gravity The electronic device 10 can be easily held even if the position is changed. The protruding portion is a mechanism that is stored inside the housing 21 when the display panel 11 is in a flat state. In that case, when the display panel 11 is in a flat state, Since there are no protruding parts, a neat design can be achieved.

[0040] In the state shown in FIG. 1(A1) and FIG. 1(A2), the electronic device 10 has the housing 22 of the display panel 11. It can be displayed by the part supported by.

[0041] From the state shown in FIG. 1(A1) and (A2), the housing 21 and the housing 22 are slid relative to each other. By doing so, the electronic device 10 can be transformed into the state shown in FIG. 1 (B1) and (B2). At this time, the hinge 12 slides along the slide rail 13 of the housing 21. This allows the housing 21 and the housing 22 to slide relative to each other. 1(B1) and (B2) show a state where the hinge 12 is positioned at one end of the slide rail 13. 2) shows the state where the hinge 12 is positioned at the other end of the slide rail 13. .

[0042] Furthermore, when the hinge 12 rotates from the state shown in FIG. 1(B1) or (B2), The electronic device 10 can be transformed into the states shown in FIGS.

[0043] In the state shown in FIG. 1(C1) and (C2), the flexible portion of the display panel 11 is flat. The display panel 11 has a portion supported by the housing 21, a portion supported by the housing 22, and a flexible The display surfaces of the parts having the same property are located on a single plane. In this state, the electronic device 10 can display images using the entire display area of ​​the display panel 11. Cut.

[0044] The electronic device 10 illustrated in FIG. 1 is configured such that the housing 22 slides in the direction of the short side of the housing 21. This allows the display area to be expanded. It is possible to expand the display area by about twice the size of the original display area. The display area of ​​the folded screen is longer than that of a screen with an aspect ratio of 4:3 or 16:9. In the case of a square shape, the aspect ratio of the display area is reduced by expanding the display panel 11. For example, vertically oriented windows, such as those associated with applications, You can display multiple images side by side, or display multiple horizontally long images side by side. This allows you to use multiple applications without switching screens. This allows users to simultaneously carry out tasks that were previously performed on the same computer, which improves convenience. When you display an application such as a book, the aspect ratio is adjusted to match that of an actual book when it is open. Since it can be brought closer, visibility can be improved.

[0045] The electronic device 10 configured as above has excellent portability when the display panel 11 is folded. When the display panel 11 is open, the seamless, wide display area allows for easy viewing of the display. Therefore, the electronic device 10 is an electronic device that has both high display visibility and high portability. It is equipment.

[0046] [Relationship between the display panel and the case] 2(A) and (B) are cross-sectional views of the display panel 11 in a folded state and an unfolded state, respectively. The positional relationship between the housing 21 and the housing 22 and the display panel 11 is shown in FIG. For the sake of clarity, the housings 21 and 22 are shown by dashed lines.

[0047] The display panel 11 has three portions: a portion 11a, a portion 11b, and a portion 11c. The portion 11a is fixed to the housing 21, and the portion 11b is fixed to the housing 22. and the portion 11c is located between the portions 11a and 11b and is flexible. These are the parts that are not fixed to any of the housings. All three parts have multiple pixels. In order to distinguish between these, the following symbols are used: Different hatching patterns are used.

[0048] Here, the portion 11a fixed to the housing 21 in the direction parallel to the sliding direction of the housing The width of the portion 11b fixed to the housing 22 in the same direction is defined as width W1. W2. Also, the width between the portion 11a and the portion 11b in the same direction, i.e., the width between the portion 11a and the portion 11b, The width of the portion 11c is defined as width W3. Here, the width W3 of the portion 11c is the width from the end of the portion 11a to the end of the portion 11b. 1b (i.e., the width of the display area of ​​the display panel 11) to the opposite end of the display panel 11. The length is the length minus W1 and width W2.

[0049] In addition, the height of the gap formed between the housings 21 and 22 by the notch of the housing 22 is The height is D. The radius of curvature of the convex portion having the convex curved surface of the housing 22 is R.

[0050] The portion 11c of the display panel 11 is curved along the convex curved surface of the housing 22. Therefore, the radius of curvature of the convex portion is the minimum radius of curvature that can be bent without damaging the display panel 11. For example, the radius of curvature R is preferably 0.5 mm or more and 50 mm or less. Preferably, the thickness is 1 mm or more and 30 mm or less, more preferably, 1 mm or more and 20 mm or less, and even more preferably, The smaller the radius of curvature R, the smaller the electronic device 10 The thickness can be reduced.

[0051] The height D of the gap formed between the housing 21 and the housing 22 is the same as the height D of the portion 1 of the display panel 11. This is the part that determines the radius of curvature of the part of 1c that bends so that the display surface faces inward. Specifically, the radius of curvature of the portion 11c on the display surface side is determined by the length of half the height D of the display panel 1. Therefore, the height D is the length that does not damage the display panel 11. For example, the gap height D is 1 mm or more and 100 mm or less. m or less, preferably 2 mm or more and 60 mm or less, more preferably 2 mm or more and 40 mm or less, More preferably, it can be set to 2 mm or more and 20 mm or less.

[0052] It is preferable that the width W3 of the portion 11c is greater than the width W1 of the portion 11a. In the folded state of the display panel 11, at least, the portion 11 It is preferable to set the width W3 of the portion 11c so that a is located inside the portion 11c. .

[0053] It is also preferable that the width W2 is close to the sum of the widths W1 and W3. Since the width of the body 21 and the housing 22 can be made approximately the same, when the display panel 11 is folded In addition, the width W2 can be reduced by dividing the width W1 and the width W3. In this way, when the display panel 11 is folded, the electronic device The size of the display area of ​​the display device 10 can be increased. Specifically, the width W2 is the sum of the width W1 and the width W3. 75% or more and 200% or less, preferably 80% or more and 180% or less, more preferably 85% It is preferable to set the length to 150% or less.

[0054] Here, by making the width W2 larger than the width W1, the display panel 11 can be folded. This is preferable because it allows the size of the display area to be increased when the display panel 11 is folded. In this state, the portion 11a is positioned inside the portion 11b when viewed from the display surface side. It is preferable to set the width of each of the display panels 11 when the display panel 11 is folded. In this state, the portion 11b covers the portion 11a, so that the portion 11a is not visible to the user. This is preferable because it is possible to protect the portion 11a while maintaining the width W2. More than 1 and 10 times, preferably 1.2 to 7 times, more preferably It is preferably 1.5 times or more and 5 times or less, and more preferably 2 times or more and 3.5 times or less.

[0055] In addition, the display panel 11 and the housing 21 are not fixed to each other at a portion 11a that constitutes a part of the display area. Alternatively, the connector 22 may be fixed to the housing 21 via an FPC or the like. When the display panel 11 is unfolded, a part of the display area may be raised above the housing 21. As mentioned above, please use the table as a precaution to avoid applying excessive force to the PC, etc., which may result in damage. The portion 11a constituting a part of the display area and the housing 21 are fixed at their contact surfaces. is preferred.

[0056] [About the slide mechanism] An example of a mechanism for changing the relative positions of the housing 21 and the housing 22 will be described below. do.

[0057] FIG. 3A shows the electronic device 10 cut along the cutting line B1-B2 in FIG. 1A and 1B are perspective views showing a portion of each of the housing 21, the housing 22, and the hinge 12. The hinge 12 has two shaft portions (shaft portion 12a and shaft portion 12b).

[0058] As shown in FIG. 1B1 and other figures, the housing 21 has a movable area for the pair of hinges 12 and In the portion of the mold, two recesses are provided. In FIG. 3(A), one of the two recesses is shown. The cross section is shown. In addition, a band-shaped recess that forms a slide rail 13 is formed on the side of the recess. The shaft portion 12a is fitted into a recess of the slide rail 13, and the slide rail On the other hand, the housing 22 and the hinge 12 are connected to each other via the shaft portion 12b. The core is rotatably mounted on the core.

[0059] Next, the sliding operation will be described with reference to Figs. 3(B)-(F). Fig. 3(B) shows FIG. 3(F) shows the display panel 11 in an open state. Figure 3(C)-(E) shows the stages between these states. The electronic device 10 can be switched between the state shown in FIG. 3(B) and the state shown in FIG. 3(F). The shape can be reversibly changed. Here, Fig. 3(B)-(F) shows the appearance of each state. In order to show the shape of the display panel 11, the projection of the side surface of the display panel 11 is shown by a dashed line.

[0060] In the state shown in FIG. 3(B), the hinge 12 is located at one end of the slide rail 13. From this state, by pulling the housing 22 in the direction of the arrow, the hinge 12 moves to the slide rail. The slide occurs along the guide rail 13, passing through the state shown in FIG. 3(C) and then changing to the state shown in FIG. 3(D). ) shows a state in which the hinge 12 is positioned at the other end of the slide rail 13.

[0061] When the housing 22 is slid, the portion 11a (symbol: The portion 11b (the reference number is not shown) fixed to the housing 22 is The display surfaces of the display panel 11 slide while remaining parallel to each other. The portion 11c (the reference numeral is not shown) having the groove is located at the position where the display surface is bent so as to have a concave shape. The device moves in a direction away from the portion 11a. That is, in the flexible portion 11c, The display panel 11 is deformed so that the bending portion changes. At this time, the display surface of the portion 11c If the part that bends to become convex does not displace, the display surface will bend to become concave. The amount of displacement of this portion is approximately half the amount of sliding of the housing 22.

[0062] When the housing 22 is pulled further in the direction of the arrow from the state shown in FIG. 3(D), the housing 22 is in the state shown in FIG. As shown in FIG. 1, the hinge 12 rotates around the shaft portion 12a and the shaft portion 12b. By rotating the plunger 12 at the same angle around the two shafts, the housings 21 and 22 are The parts of the display panel 11 fixed to each other maintain a state in which the display surfaces are parallel. After that, it moves relatively through the state shown in FIG. 3(E) and then moves to the state shown in FIG. 3(F). The housings 21 and 22 are then moved until the flexible portion 11c of the display panel 11 becomes flat. Move around with.

[0063] FIG. 3(F) shows the display panel 11 in an unfolded, flat state. At this time, the display surfaces of the portions 11a, 11b, and 11c of the display panel 11 are are preferably located on one plane.

[0064] When the electronic device 10 is transformed from the state shown in FIG. 3(F) to the state shown in FIG. 3(B), For example, the housing 22 is tilted from the state shown in FIG. Applying a force in the upward direction rotates the hinge 12, passing through the state shown in FIG. 3(E) to the state shown in FIG. ), and then the housing 22 is pushed in and slid to the state shown in FIG. It can be made to reach the state shown in FIG. 3(B) via the state shown in (C).

[0065] In the state shown in FIG. 3(D), a part of the flexible portion 11c of the display panel 11 is 3(D), the housing 22 is bent along the surface of the protruding portion of the housing 22. When the part is pushed in and slid, the part that comes into contact with the protrusion maintains its shape. The display panel 11 is deformed such that the portion that bends so that the display surface becomes concave is displaced.

[0066] Here, a cross section of an end portion of the housing 21 located on the housing 22 side when the display panel 11 is opened is shown. In this example, the shape is an arc shape. As a result, as shown in FIG. The hinge 12 can be rotated so that the housing 22 does not physically interfere with (contact with) the housing 22. The cross-sectional shapes of the housing 21 and the housing 22 are merely examples and are not limited to these.

[0067] 4(A) to (C) show an example in which the end portion of the housing 22 has an arc shape. 4(D) and (E) show an example in which the bottom surface side of the end portion of the housing 21 is also arc-shaped. do.

[0068] 5(A) to (E) show an example in which the slide rail 13 is provided on the housing 22. It shows.

[0069] The side surface of the housing 22 is provided with a recess that forms the slide rail 13. The shaft portion 12b fits into a recess of the slide rail 13 and slides along the slide rail 13. On the other hand, the housing 21 and the hinge 12 are rotatable about the shaft portion 12a. It is installed.

[0070] In the state shown in FIG. 5(A), the hinge 12 is located at one end of the slide rail 13. When the housing 22 is pulled from the state shown in FIG. 5(B), and then to the state shown in FIG. 5(C). By further pulling the housing 22, the hinge The sprocket 12 rotates and goes through the state shown in FIG. 5(D) to the state shown in FIG. 5(E). When the electronic device 10 is to be transformed from the state shown in FIG. 5(A), the above-mentioned procedure is reversed. That's good.

[0071] The above describes an electronic device in which the display panel 11 can be folded into three parts. However, by folding more than that, it is possible to realize electronic devices with excellent portability. Cut.

[0072] Figures 6(A) and (B) show examples of electronic devices that can be folded into five parts. The child device has a housing 23 between the housing 21 and the housing 22. The hinge 14 connects the housing 23 and the housing 22, and the hinge 15 connects the housing 21 and the housing 22. A slide rail 13a is provided on the housing 21, and a slide rail 13b is provided on the housing 22. The shaft portion 14a of the hinge 14 is fitted into a recess of the slide rail 13a of the housing 21. The shaft portion 15b of the hinge 15 is connected to the slide rail 13b of the housing 22. The hinges 14 and 15 are fitted into the recesses and can slide. The movable member 15 is attached to the housing 23 so as to be rotatable around the shaft portion 15a.

[0073] As shown in FIGS. 6(A) and 6(B), the housing 23 and the housing 22 are slid in the direction of the arrows. As a result, the display panel 11 can be folded into five and opened. The electronic device can be transformed between the above states.

[0074] In addition, a configuration in which the display panel 11 can be folded into five parts is shown here. By increasing the number of housings, the number of times the display panel 11 can be folded can be increased. The aspect ratio (ratio of the long side to the short side of a rectangle) of the display panel 11 when it is opened is If the aspect ratio is large (e.g., 16:9 or more, preferably 2:1 or more), fold it into 5 or more. By adopting a configuration that can be folded, portability is improved, especially when the display panel 11 is folded. In this case, it is preferable that the thickness of the display panel 1 is smaller than the thickness of the electronic device when the housings are stacked. It is preferable that the length of the opening of the opening 1 is sufficiently large (for example, at least twice as long, preferably at least three times as long). I wish.

[0075] In this embodiment, the mechanism by which the housing 21 and the housing 22 slide is a slide rail 1. In the above, an example in which the hinge 12 is provided and the hinge 3 is provided is described. However, the present invention is not limited to this example and may have other configurations. For example, the housing 22 may be provided so as to slide in an L-shape relative to the housing 21. Alternatively, a configuration without hinges may be used by using slide rails.

[0076] The above is a description of the slide mechanism.

[0077] [About the locking mechanism] The electronic device 10 has a display panel 11 folded (e.g., FIG. 1(A1)) and a display panel 12 folded (e.g., FIG. 1(A2)). In each state where the panel 11 is unfolded (for example, FIG. 1(C1)), the housing 2 It is preferable that the sensor 1 has a lock mechanism capable of fixing the relative positions of the sensor 1 and the housing 22. For example, the sliding mechanism may have two or more stability mechanisms for the relative positions of the housings 21 and 22. It is preferable to have a mechanism that can lock it in place and release it relatively easily. stomach.

[0078] In Figs. 7(A1) and (A2), a mechanism for locking the position of the shaft portion 12a of the hinge 12 is provided. The sliding mechanism is a leaf spring attached to the housing 21. The plate spring 51 has a protrusion, and the protrusion is connected to the slide rail 13. The shaft portion 12a is provided so as to protrude into the passage of the shaft portion 12a.

[0079] As shown in FIG. 7(A1), when the protrusion of the leaf spring 51 comes into contact with the shaft portion 12a, the leaf spring 51 When the shaft portion 12a reaches the end of the slide rail 13, the protrusion of the leaf spring 51 As a result, as shown in FIG. a is fixed at the end of the slide rail 13 as a stable position. When a force is applied in a direction away from the end of the ride rail 13, the leaf spring 51 is lifted and the shaft 12a can slide away from the stable position.

[0080] As shown in Figs. 7(B1) and (B2), a part of the housing 21 is designed to be deformable like a spring. The spring portion 53 is processed as shown in FIG. 1, and the plate spring 51 and the screw 52 are not used. It is also possible.

[0081] 8(A1) and (A2), a hinge 12 is provided on the other end side of the slide rail 13 of the housing 21. 1 shows an example in which a mechanism is provided for locking both the position and the angle.

[0082] The shaft portion 12a is provided with a notch 54. When a rotates, as shown in FIG. 8(A2), the protrusion of the leaf spring 51 fits into the notch 54. As a result, the end of the slide rail 13 is in a stable position, and the position and rotation of the shaft portion 12a are controlled. The rotation angle is fixed. Conversely, when the shaft portion 12a rotates from the state shown in FIG. 8(A2), the plate Since the spring 51 is lifted, the shaft portion 12a cannot slide in a direction away from the stable position. can.

[0083] FIG. 8B shows a case where a spring portion 53 is provided instead of the leaf spring 51 and the screw 52. An example is shown.

[0084] Here, an example in which a lock mechanism is provided in the housing 21 has been shown, but as shown in FIG. In the case where the slide rail 13 is provided on the housing 22, a similar configuration is provided on the housing 22. can be done.

[0085] In addition, the side of the housing where the slide rail 13 is not provided has a locking mechanism for locking the rotation of the hinge 12. It is preferable that the lock mechanism is provided to lock the shaft portion 12b. The lock mechanism that can lock the key in a stable position is provided on the housing 22. The shaft portion 12b has two notches 54 spaced apart at an angle of 90 degrees. This allows the hinge 12 to be locked in two stable positions. However, the number of the housings is not limited to 1, and may be one, or three or more. When slide rails 13 are provided on the housing 22, a similar structure should be provided on the housing 21. can be done.

[0086] In the above, the lock mechanism for fixing the position, angle, or both the position and angle of the shaft of the hinge 12 is described. However, as long as the relative positions of the housings 21 and 22 can be locked, various functions can be used. For example, the hinge 12 may be provided with a structure other than the shaft portion and the housing 21 or the housing 22. A lock mechanism may be provided between the housings 21 and 22. Alternatively, for example, a hook-shaped member may be provided on one of the housings 21 and 22, and the front When the display panel 11 is folded (for example, FIG. 1(A1)), the relative position of the housing 21 and the housing 22 The housing 21 or the housing 22 may be configured to have a locking mechanism. A button or switch for doing so may be provided.

[0087] The above is a description of the lock mechanism.

[0088] [Variations] An example of the configuration of the electronic device 10 that is partially different from the above will be described below.

[0089] FIG. 9A is a schematic cross-sectional view of the electronic device 10 with the display panel 11 folded. In FIG. 9A, the flexible portion 11c of the display panel 11 is shown with two curved portions. The portion between the portions 11a and 11b extends obliquely and not parallel to the portions 11a and 11b. More specifically, the display surface of the portion 11c is curved to be convex, and the display surface of the portion 11c is curved to be convex. The curved parts are bent at an angle of less than 180 degrees. With this configuration, when the housing 21 and the housing 22 are slid to close, In this case, the direction of the force pulling the portion 11c of the display panel 11 can be set to an obliquely upward direction. This makes it possible to make the portion 11c more easily deformable than in the case shown in FIG. This can be done.

[0090] In FIG. 9B, the display surface of the portion 11c of the display panel 11 is curved to be convex. The part where the display surface is bent to form a concave shape and the part where the display surface is bent to form a concave shape are both greater than 180 degrees. This shows an example of a curved surface at an angle. The radius of curvature of the two curved portions in the portion 11c is made larger than that shown in FIG. As a result, the stress applied to the curved portion 11c of the display panel 11 is In the case shown in FIG. When the portion 11c is bent with the same radius of curvature as in the above case, the thickness of the housing 22 can be reduced. do.

[0091] FIG. 9(C1) shows an example in which the housing 21 and the housing 22 are curved. 9(C2) shows a schematic cross-sectional view of the display panel 11 in an unfolded state.

[0092] The display panel 11 is curved to fit the surface shapes of the housings 21 and 22. By curving the display surface in a concave shape, the center and edges of the display area are This allows the distance from the user's viewpoint to the display surface (also called the viewing distance) to be reduced. This increases the sense of immersion and allows the user to experience a more realistic display. .

[0093] In this way, by having a curved housing, it is possible to easily store the electronic device 10 in, for example, a trouser pocket. When the device is put away, it conforms to the surface of the user's body, making it difficult for the user to move. This can be prevented.

[0094] In addition, in Figs. 9(C1) and (C2), the housing 21 and the housing 22 are arranged so that the display surface is concave. Although the display surface is bent, the housing 21 and the housing 22 are bent so that the display surface is convex. For example, in the case of a wearable information terminal such as a wristwatch type, the housing 21 In addition, the housing 22 can be worn so as to conform to the curved surface of the body, such as the arm, so that the user can feel comfortable. You can get a good fit.

[0095] 10(A) to 10(C) show an electronic device 1 in which a housing 22 slides in the long side direction of a housing 21. 10C, the display panel 11 is in the open state. For example, the application can display a large aspect ratio. You can display multiple vertically long images, such as a single window, side by side, or you can display multiple horizontally long images, such as a single window. The created images can be displayed side by side in multiples. This allows you to work with multiple applications simultaneously without having to use a single mouse. In addition, for example, by using the display panel 11 with the long side facing horizontally, When watching movies, panoramic photos, or other wide-screen images, you can display them without shrinking them. In addition, by using the display panel 11 with the long side oriented vertically, horizontal writing can be displayed. When displaying text, it is now possible to display more lines than before without shrinking the screen. do.

[0096] The above is a description of the modified example.

[0097] [Examples of electronic device configurations] An example of the hardware configuration provided in each housing of the electronic device 10 will be described below. .

[0098] FIG. 11 is a block diagram showing an example of the configuration of the electronic device 10. As shown in FIG.

[0099] In the drawings attached to this specification, the components are classified by function and are divided into independent blocks. Although the block diagram shows a block diagram, the actual components are completely separated by function. This can be difficult, and one component may be involved in multiple functions.

[0100] In addition, the configuration of the electronic device 10 illustrated in FIG. 11 is an example, and it is not necessary to include all of the components. The electronic device 10 may include the necessary components among those shown in FIG. In addition, the device may have components other than those shown in FIG.

[0101] The electronic device 10 includes a housing 21, a housing 22, and a touch panel 63. 63 is disposed transversely between the housings 21 and 22.

[0102] The housing 21 includes a processor (CPU) 61, a storage device 64, a display controller 71, Touch sensor controller 72, battery controller 73, power receiving unit 74, battery Module 75, sound controller 76, communication module 81, attitude detection unit 83, shape The device includes a state detection unit 84, an external interface 85, a vibration module 87, a sensor 88, etc. The housing 22 includes an audio input unit 77, an audio output unit 78, an antenna 82, and a camera module 86. etc.

[0103] A storage device 64, a display controller 71, a touch sensor controller 72, Telly controller 73, sound controller 76, communication module 81, attitude detection unit 83, shape detection unit 84, external interface 85, camera module 86, vibration module The controller 87, the sensor 88, etc. are connected to the calculation unit 61 via the bus line 62. do.

[0104] The touch panel 63 corresponds to the display panel 11. That is, the touch panel 63 is , a portion fixed to the housing 21, a portion fixed to the housing 22, and a flexible portion It also has a portion that is not fixed to the housing.

[0105] The calculation unit 61 is, for example, a central processing unit (CPU). The calculation unit 61 can function as a data storage unit (DSU). Spray controller 71, touch sensor controller 72, battery controller 7 3, sound controller 76, communication module 81, attitude detection unit 83, shape detection unit 84 , external interface 85, camera module 86, vibration module 87, sensor 88 It has the function of controlling components such as:

[0106] Signals are transmitted between the calculation unit 61 and each component via a bus line 62 . The calculation unit 61 receives signals input from each component connected via a bus line 62. It has a function to process the signals and generate signals to be output to each component. Each component connected to the input 62 can be controlled holistically.

[0107] In addition, the ICs of the computing unit 61 and other components have an oxidized channel formation region. It is also possible to use transistors that use solid semiconductors and have extremely low off-state currents. Since the off-state current of the transistor is extremely low, the transistor can be used as a memory element. Used as a switch to hold the charge (data) that has flowed into a functioning capacitive element This characteristic is realized by the calculation unit 61. By using it as a register or cache memory, the calculation unit 61 can be operated only when necessary, and other In this case, the information of the immediately preceding process is saved in the memory element, so that the normally off-chip This enables low power consumption of the electronic device 10.

[0108] The calculation unit 61 interprets and executes commands from various programs using a processor. It performs various data processing and program control. Programs that can be executed by the processor are The program may be stored in a memory area of ​​the processor or in the storage device 64. It's fine.

[0109] The calculation unit 61 includes a CPU and a DSP (Digital Signal Processor). cessor), GPU (Graphics Processing Unit), etc. These microprocessors may be used alone or in combination. The microprocessor is an FPGA (Field Programmable Gate Array ray) and FPAA (Field Programmable Analog Arra) y) by PLD (Programmable Logic Device) This may be realized as a configuration.

[0110] The calculation unit 61 may have a main memory. The main memory may be a RAM (Random Access Memory). volatile memory such as ROM (Read Only Memory) and The configuration may include a non-volatile memory such as a .times. ...

[0111] The RAM provided in the main memory is, for example, a dynamic random access memory (DRAM). A virtual dom access memory (DMA) is used as the working space of the calculation unit 61. The memory space is allocated to the operating system stored in the storage device 64. Systems, application programs, program modules, program data, etc. These data and programs are loaded into RAM for execution. The program module is directly accessed and operated by the calculation unit 61. The position of the electronic device 10 is determined based on the data input from the output unit 83, the shape detection unit 84, the sensor 88, etc. The characteristic data for calculating the placement and orientation of each housing, as well as the relative positional relationship of each housing, is The data may be read from the storage device 64 as a look-up table and stored in the main memory. stomach.

[0112] On the other hand, ROM has a BIOS (Basic Input / Output) that does not require rewriting. It can store the ROM, such as the ROM (read-only memory) and firmware. Mask ROM and OTPROM (One Time Programmable Read Only) d Only Memory), EPROM (Erasable Programmable EPROM can be used. UV-EPROM (Ultra-Voltage Erasable Read-Only) is a type of EEPROM that allows data to be erased by exposure to ultraviolet light. iolet Erasable Programmable Read Only Me mory), EEPROM (Electrically Erasable Program ammunition read only memory, and flash memory. can be.

[0113] The storage device 64 may be, for example, a flash memory or an MRAM (Magnetores istive Random Access Memory), PRAM (Phase change RAM), ReRAM (Resistance RAM), FeRAM ( A storage device that uses non-volatile memory elements such as Ferroelectric RAM. , or DRAM (Dynamic RAM) or SRAM (Static RAM), etc. A storage device using a volatile storage element such as a hard disk may also be used. Hard Disk Drive (HDD) and Solid State Drive (S You can also use a recording media drive such as SSD (solid state drive). stomach.

[0114] In addition, a removable HDD or SS can be connected via the external interface 85. D and other storage devices, flash memory, Blu-ray discs, DVDs and other recording media A media drive can also be used as the storage device 64. A storage device that is not built into the device 10 but is placed outside the electronic device 10 is used as the storage device 64. In that case, the external interface 85 may be connected to the communication module 84. The communication device 80 may be configured to exchange data wirelessly via the controller 81.

[0115] The touch panel 63 includes a display controller 71 and a touch sensor controller 7 2. A display controller 71 and a touch sensor controller 72 are each connected to the calculation unit 61 via a bus line 62.

[0116] The display controller 71 receives an input from the arithmetic unit 61 via the bus line 62. In response to the drawing instruction, the touch panel 63 is controlled to display a predetermined image on the display surface of the touch panel 63. Display it.

[0117] The touch sensor controller 72 responds to a request from the calculation unit 61 via the bus line 62. The touch sensor of the touch panel 63 is controlled by the touch sensor. The signal received by the touch sensor is output to the calculation unit 61 via the bus line 62. The touch sensor controller 72 may have a function of calculating touch position information from the Alternatively, the calculation may be performed by the calculation unit 61.

[0118] The touch panel 63 performs the following operations based on a signal supplied from the display controller 71: The touch panel 63 can display an image. Based on the signal provided by the sensor, the sensor detects the approach or contact of a detected object such as a finger or stylus. and outputting the position information to the touch sensor controller 72. do.

[0119] The touch panel 63 and the touch sensor controller 72 detect the object to be detected from the detection surface. It is preferable that the sensor has a function of acquiring the distance in the height direction from the object to the sensor. It is preferable that the sensor has a function of acquiring the magnitude of pressure applied to the surface of the sensor. It is preferable that the device has a function of acquiring the size of the surface in contact with the projection surface.

[0120] The touch panel 63 is a module having a touch sensor that is superimposed on the display surface of the display panel. In this case, the touch sensor may be provided in a module. It is preferable that at least a part of the display panel is flexible and can be curved along the display panel. The module equipped with the touch sensor and the display panel can be bonded with adhesive or the like. A polarizing plate or a buffer material (separator) may be provided between them. It is preferable that the thickness of the module is equal to or smaller than the thickness of the display panel.

[0121] The touch panel 63 may be a touch panel in which a display panel and a touch sensor are integrated. For example, it can be an on-cell type touch panel or an in-cell type touch panel. It is preferable that the on-cell or in-cell touch panel is thin and lightweight. Furthermore, on-cell or in-cell touch panels can reduce the number of parts. This allows costs to be reduced.

[0122] The touch panel 63 has a touch sensor that detects whether a detection object such as a finger approaches or touches the touch sensor. Various sensors that detect touch can be applied. For example, capacitive sensors, resistive sensors, Sensors that use surface acoustic wave, infrared, optical, etc. can be used. In addition, there are optical sensors using photoelectric conversion elements, pressure sensors using pressure-sensitive elements, etc. Also, two or more types of sensors of different types may be used, or the same type may be used. There may be two or more sensors.

[0123] For example, a capacitive touch sensor includes a pair of conductive layers. Capacitive coupling occurs. When the object to be detected touches or approaches a pair of conductive layers, The change in capacitance between the pair of conductive layers can be used for detection.

[0124] The capacitive touch panel includes a surface capacitive touch panel and a projected capacitive touch panel. Capacitive methods include self-capacitance and mutual capacitance, mainly depending on the driving method. The mutual capacitance method is preferable because it allows easy simultaneous multi-point detection.

[0125] In addition, instead of the touch panel 63, a display panel that does not have a function as a touch sensor may be used. Even in that case, the display panel can be widened to improve the visibility of the display. It is possible to do so.

[0126] The flexible touch panel 63, display panel, touch sensor, etc. may be, for example, a display The substrate that supports the element, the circuit that drives it, or the circuit that constitutes the touch sensor is This can be achieved by using a flexible substrate.

[0127] A typical example of a material for the flexible substrate is an organic resin. In addition, glass, metal, alloy, semiconductor, etc. that is thin enough to have flexibility can be used. Or a composite material containing two or more of organic resin, glass, metal, alloy, semiconductor, etc. Laminated materials may be used.

[0128] The display element of the touch panel 63 is, for example, an OLED (Organic Light Emitting Diode). t Emitting Diode), LED(Light Emitting Diode) de), QLED(Quantum-dot Light Emitting Diod) e) or other self-luminous light-emitting elements can be used. Alternatively, a transmissive type, a reflective type, or A semi-transmissive liquid crystal element may be used. display elements such as ctro Mechanical Systems elements and electron emission elements A display device using MEMS can be used. Examples include MEMS display elements using a laser diode and MEMS display elements using an optical interference method. Carbon nanotubes may be used as the output element. Electronic paper may also be used. Electronic paper is available in a variety of types, including microcapsule type, electrophoretic type, and electrowet type. It is possible to use elements that employ a printing method, an electronic liquid powder method, or the like.

[0129] The battery controller 73 manages the charging state of the battery module 75. The battery controller 73 can also receive power from the battery module 75. The power receiving unit 74 receives power supplied from an external source and stores it in a battery. The battery controller 73 has a function of charging the battery module 75. The operation of the power receiving unit 74 can be controlled depending on the charging state of the power module 75.

[0130] The battery module 75 includes, for example, one or more primary and / or secondary batteries. As a secondary battery that can be used in the battery module 75, for example, a lithium ion secondary battery is used. Examples of battery modules include lithium-ion polymer secondary batteries. In addition to these batteries, the 75 is equipped with a protection circuit to prevent overcharging and over-discharging of the battery. It may be possible to do so.

[0131] When used indoors, an alternating current (AC) power source may be used as the external power source. In addition, when the electronic device 10 is used separately from an external power source, the charge and discharge capacity is large and the charge and discharge capacity is long. A battery module 75 that allows the use of the electronic device 10 over a long period of time is desirable. When charging the battery module 75, a charger capable of supplying power to the electronic device 10 is used. In this case, charging should be done using a wired method such as a USB connector or AC adapter. Alternatively, wireless power supply such as electric field coupling, electromagnetic induction, and electromagnetic resonance (electromagnetic resonance coupling) may be used. The charging may be performed by a method.

[0132] The battery controller 73 includes, for example, a battery management unit (BMU). The BMU collects data on the cell voltage and temperature of the battery, and detects overcharging and overdischarging. Monitoring, cell balancer control, battery deterioration management, battery remaining capacity (State of Charge rge:SOC calculation and fault detection control.

[0133] The battery controller 73 connects the battery module 75 to the bus line 62 and the It controls the transmission of power to each component via other power supply lines. The data controller 73 controls, for example, a multi-channel power converter, an inverter, a protection circuit, and The configuration may include a path, etc.

[0134] The battery module 75 is preferably arranged so as to overlap the touch panel 63. At this time, the housing (here, the housing 21) in which the battery module 75 is incorporated is In the case where the battery module is flexible and can be bent for use, At least a portion of the battery module 75 is also preferably flexible. Examples of secondary batteries that can be used with Rule 75 include lithium-ion secondary batteries and lithium-ion Polymer secondary batteries are also included. In order to make these batteries flexible, It is advisable to use a laminated bag for the outer packaging.

[0135] The film used for the laminated bag is a metal film (aluminum, stainless steel, nickel steel, plastic film made of organic materials, organic materials (organic resins, fibers, etc.) Hybrid material films containing inorganic materials (such as ceramics), carbon-containing inorganic films (carbon film, graphite film, etc.) or A laminated film made of multiple materials is used. Metal films are easy to emboss and have good adhesion. By forming concave or convex portions through embossing, the surface area of ​​the film exposed to the outside air increases. Therefore, it has excellent heat dissipation effect.

[0136] In particular, for laminated bags, metal film with concave and convex parts formed by embossing is used. When a laminated bag having the above structure is used, the strain caused by the stress applied to the laminated bag is reduced. As a result, the laminated bag does not break when the secondary battery is bent. This is preferable because it can effectively reduce problems such as the deterioration of the image.

[0137] In addition, it is preferable that the battery controller 73 has a power consumption reduction function. For example, as a power saving function, the electronic device 10 may detect that there is no input for a certain period of time and perform a power saving function. The clock frequency of the calculation unit 61 is lowered or the input of the clock is stopped, and the calculation unit 61 itself Stopping the operation of the body, stopping the operation of auxiliary memory, and supplying These functions include reducing the power supplied to the device and reducing power consumption. , may be executed by the battery controller 73 alone or in conjunction with the computing unit 61. can be done.

[0138] The audio input unit 77 includes, for example, a microphone and an audio input connector. The audio input unit 77 and the audio output unit 78 include, for example, a speaker and an audio output connector. 78 are connected to the sound controller 76 and are connected to the calculation unit 6 via the bus line 62. 1. The audio data input to the audio input unit 77 is sent to the sound controller 76. The digital signal is converted to a digital signal in the sound controller 76 and the calculation unit 61. On the other hand, the sound controller 76 controls the sound source 74 in response to a command from the calculation unit 61. The audio output unit 78 generates an audible analog audio signal and outputs it to the audio output unit 78. The audio output connector can be used to connect audio output devices such as earphones, headphones, and headsets. It is possible, and sound generated by the sound controller 76 is output to the device.

[0139] The communication module 81 can perform communication via an antenna 82. For example, 61 to control the electronic device 10 to connect to a computer network. The Worm controls the signal and transmits the signal to the computer network. ld Wide Web (WWW) is based on the Internet, intranets, and external networks. Stranet, PAN (Personal Area Network), LAN (Lo cal Area Network), CAN(Campus Area Network) k), MAN (Metropolitan Area Network), WAN (Wi Global Area Network), GAN (Global Area Network) The electronic device 10 can be connected to a computer network such as a personal computer (PC) or a personal digital assistant (DMSA) for communication. In addition, when a plurality of communication methods are used, the antenna 82 is adapted to correspond to the communication method. In some cases, a plurality of such elements may be provided.

[0140] The communication module 81 is provided with, for example, a high-frequency circuit (RF circuit) for transmitting and receiving RF signals. High-frequency circuits transmit electromagnetic and electrical signals in the frequency bands specified by the laws of each country. and vice versa, and use the electromagnetic signals to wirelessly communicate with other communication devices. The practical frequency band generally used is several tens of kHz to several tens of GHz. The high-frequency circuit connected to the antenna 82 is a high-frequency circuit that supports a plurality of frequency bands. The high-frequency circuit section includes an amplifier, mixer, filter, DSP, RF transistor, When wireless communication is performed, a communication protocol or The communication technologies are LTE (Long Term Evolution), GSM (Global System for Mobile Communications), and bal System for Mobile Communication: Registered trademark ), EDGE(Enhanced Data Rates for GSM Evolu tion), CDMA2000 (Code Division Multiple Ac cess 2000), W-CDMA (Wideband Code Division Multiple Access (registered trademark) or Wi-Fi ( ireless Fidelity (registered trademark), Bluetooth (registered trademark), Z It is possible to use IEEE standardized communication specifications such as igBee (registered trademark). .

[0141] The communication module 81 may have a function of connecting the electronic device 10 to a telephone line. When making a call through a telephone line, the communication module 81 receives a In response to the command, the electronic device 10 controls a connection signal for connecting to a telephone line, and transmits the signal Call a telephone line.

[0142] The communication module 81 receives broadcast radio waves via an antenna 82 and transmits the information to the touch panel 63. For example, the tuner may include a tuner for generating a video signal to be output to the It has a tuning circuit, an AD conversion circuit (analog-to-digital conversion circuit), a decoder circuit, etc. The demodulation circuit has a function of demodulating a signal input from the antenna 82. The AD conversion circuit also converts the demodulated analog signal into a digital signal. The decoder circuit decodes the video data contained in the digital signal and outputs it to the display. It has a function of generating a signal to be transmitted to the play controller 71.

[0143] The decoder may also have a splitting circuit and a plurality of processors. It has the function of dividing the input video data spatially and temporally and outputting it to each processor. The processors decode the input video data and output it to the display controller. In this way, the decoder 71 can be used as a decoder for multiple processors. By applying a configuration that processes data in parallel, it is possible to decode video data with a large amount of information. In particular, when displaying images with a resolution exceeding full HD, In this case, the decoder circuit that decodes the compressed data has an extremely high speed processing capability. It is preferable that the decoder circuit has four or more processors. A configuration including multiple processors capable of parallel processing of at least 8, and more preferably at least 16. It is preferable that the decoder separates the video signal included in the input signal from the video signal included in the input signal. It may also have a circuit for separating other signals (text information, program information, authentication information, etc.).

[0144] The broadcasting waves that can be received by the antenna 82 include terrestrial waves and satellite broadcasts. The broadcasting radio waves that can be received by the antenna 82 include analog broadcasting. There are various types of broadcasting, such as digital broadcasting, video and audio broadcasting, and audio-only broadcasting. For example, UHF band (approximately 300MHz to 3GHz) or VHF band (30MHz to 300MHz ) can receive broadcast radio waves transmitted in a specific frequency band. By using multiple data received in multiple frequency bands, the transfer rate can be increased. This allows for a higher resolution than full HD, and allows for more information to be obtained. For example, an image having a resolution of 4K-2K can be displayed on the touch panel 63. It is capable of displaying images with resolutions of 8K-4K, 16K-8K, or higher. Cut.

[0145] The tuner is also transmitted via data transmission technology over a computer network. A configuration in which a signal to be transmitted to a display controller 71 is generated using the broadcast data. In this case, if the received signal is a digital signal, the tuner demodulates the signal. The input / output circuit may not include an analog-to-digital converter circuit.

[0146] The attitude detection unit 83 has a function of detecting the inclination, attitude, etc. of the electronic device 10. For example, The detection unit 83 may include an acceleration sensor, an angular velocity sensor, a vibration sensor, a pressure sensor, a gyro sensor, A sensor or the like can be used. A combination of a plurality of these sensors may also be used. .

[0147] The shape detection unit 84 detects the relative positional relationship between the housing 21 and the housing 22, and calculates the information. The signal processing unit 61 has a function of outputting the signal via a bus line 62.

[0148] As the shape detection unit 84, for example, a sensor similar to the attitude detection unit 83 is disposed on the housing 22. The information on the inclination and the attitude of the housing 22 acquired by the shape detection unit 84 can be configured as follows: When the input is input to the calculation unit 61 via the bus line 62, the calculation unit 61 detects the position of the Based on the detected information on the inclination and attitude of the housing 21 and the information on the inclination and attitude of the housing 22, the housing 21 and the housing 22 are The relative positional relationship of the housing 22 can be calculated.

[0149] Alternatively, the shape detection unit 84 may be a device for detecting the rotation angle of the hinge 12 as exemplified in the above configuration example. By doing so, the relative position of the two housings connected by the hinge 12 can be detected. In this case, the rotation angle of each hinge axis is controlled mechanically, optically, magnetically, or electrically. The detection may be performed automatically.

[0150] Alternatively, a flexible member is provided to connect two adjacent housings, and a sensor is provided to detect the curved shape. In this case, the flexible member may be a touch panel 63 or a touch A protective member for protecting the switch panel 63 may be used. For example, a plurality of acceleration sensors are arranged on the flexible member, and the position of each sensor is detected. The shape may be calculated by the calculation unit 61 based on the change in acceleration at the position. The present invention uses a sensor including a piezoelectric element disposed on a flexible member to detect bending. Or, the physical properties (resistivity, thermal conductivity, transmittance, etc.) may change due to bending. By incorporating a sensor that changes its physical properties into the flexible material, its shape can be determined from the change in its physical properties. The state may be calculated.

[0151] The shape detection unit 84 detects two states: a state in which the two housings are closed, and a state in which the two housings are open. For example, an example of a method for optical detection is to detect the state of adjacent The light receiving element is placed in one of the two housings, and when these are closed, external light is blocked. Alternatively, the detection may be performed by utilizing the fact that the front surface of one of the two adjacent housings is By placing a light receiving element on one surface and a light source on the other surface, When the light source is in either open state, the light receiving element is exposed to light from the light source or is not exposed to light from the light receiving element. In this case, the infrared light from the light source is detected by utilizing the disappearance of the infrared light. is preferable because it is not visible to the user.

[0152] The configuration of the shape detection unit 84 is not limited to this, and the relative position relationship between two adjacent housings may be detected. Any mechanical, electromagnetic, thermal, acoustic, or chemical means that can detect the relationship between the Various sensors that utilize the above can be used.

[0153] The external interface 85 may be, for example, one provided in the housing 21 or the housing 22. The above buttons, switches (also called chassis switches), and other input components are connected The external interface 85 is connected to the bus line 62 via a The switch is connected to the computing unit 61. The switch is connected to the power supply ON / OFF. There are buttons for adjusting the volume, a button for taking pictures with the camera, etc.

[0154] The external interface 85 has an external port, for example, a computer or a processor. The printer can be connected to an external device via a cable. There are also USB (Universal Serial Bus) terminals. Ports include a LAN (Local Area Network) connection terminal, digital It may have a terminal for receiving broadcasts, a terminal for connecting an AC adapter, etc. Alternatively, a transmitter / receiver for optical communication using infrared light, visible light, ultraviolet light, etc. may be provided. good.

[0155] The camera module 86 is connected to the computing unit 61 via a bus line 62. When a switch installed on the body is pressed or when a touch operation is performed on the touch panel 63, The camera module 86 can take still or moving images. For example, a lamp such as a xenon lamp, a light emitting diode (LED) or an organic electroluminescence (EL) lamp may be used. Alternatively, the light emitted by the touch panel 63 can be used as a light source for photography. In this case, light of various colors, not just white, may be used as the light source for photography. It may also be used.

[0156] The vibration module 87 includes a vibration element that vibrates the electronic device 10 and a vibration control circuit that controls the vibration element. The vibration element includes a vibration motor (eccentric motor), a resonant actuator, and a vibration controller. actuators, magnetostrictive elements, piezoelectric elements, etc., which can convert electric or magnetic signals into vibrations. An element having such a function can be used.

[0157] The vibration module 87 controls the frequency and amplitude of the vibration of the vibration element in response to a command from the calculation unit 61. By controlling the amplitude, duration, etc. of the vibration, the electronic device 10 can be vibrated in various vibration patterns. For example, vibrations linked to the operation of a switch on the housing of an electronic device can be generated. Vibration linked to the startup of 0, and video and audio played in video playback applications vibrations linked to incoming e-mails, vibrations linked to input operations on the touch panel 63, Various vibration patterns based on the actions performed in various applications, such as The vibration can be emitted by a vibration module 87.

[0158] In addition, it is preferable that the vibration module 87 has a configuration including multiple vibration elements. By combining the vibrations of the above vibration elements, various vibration patterns can be generated. This makes it possible to transmit various information to the user. By controlling the vibration frequency, amplitude, vibration pattern, timing, etc., When multiple vibration elements are arranged, more diverse vibrations can be expressed. The same elements may be arranged at intervals, or multiple types of vibration elements with different natural frequencies may be used. This is also fine.

[0159] In addition, the vibration (elastic wave) from two or more vibration elements arranged at a distance from each other is By interfering with the surface, the strength of the vibration varies depending on the position on the surface of the electronic device. It is preferable that the vibration module 87 has a function of driving the device 10 to vibrate. At this time, the electronic device 10 is provided with a surface that can transmit elastic waves. It is preferable to use an elastic body. This allows a new tactile feedback to be provided to the user. The strength of the vibration can be varied depending on the position, so for example When the user touches the surface, the surface is made to feel the unevenness of the surface and the difference in friction resistance. This makes it possible to, for example, display an image on the touch panel 63 and By linking these two together, it is possible to express the texture of the displayed object. By expressing letters and Braille in relief on the surface of the touch screen, users can read text information by touching it. It is also possible to obtain the following:

[0160] For example, in FIG. 12A, two vibration elements (vibration elements 91a, 91b) are provided on the surface of the housing 21 opposite to the display surface. In this example, the elastic body 92 has a function of a touch sensor. In addition, in FIG. 12B, two vibration elements (vibration element 9) are provided inside the housing 21. 1a, vibration element 91b), and two vibration elements (vibration elements 91c, 91d) inside the housing 22. In the case where the entire display panel 11 is flexible, The filter 11 can also function as the elastic body described above.

[0161] In addition, the electronic device 10 is vibrated by the vibration module 87. By touching various objects that transmit vibrations, such as cables and walls, the objects emit sounds. For example, the device may have a function as a vibration generator that generates a music playback application. By vibrating the electronic device 10 in accordance with the music being played in conjunction with the above. In this case, an object that touches the electronic device 10 can be used as a speaker. For example, FIG. In the example shown in FIG. 1, a sound 96 is generated from a table 95 due to vibration of an electronic device 10 placed on the table 95. This shows an example where the following command is issued:

[0162] The sensor 88 includes a sensor and a sensor controller. The sensor unit is supplied with power from the battery module 75. The controller receives input from the sensor unit, converts it into a control signal, and transmits it via a bus line 62. The sensor controller performs error management for the sensor unit. The sensor controller may also perform a calibration process for the sensor unit. A configuration may be provided in which a plurality of controllers control the sensor units.

[0163] The sensor 88 detects, for example, force, displacement, position, velocity, acceleration, angular velocity, rotation speed, distance, light, liquid , magnetic, temperature, chemical, sound, time, hardness, electric field, current, voltage, power, radiation, flow rate, Equipped with various sensors that can measure humidity, gradient, vibration, odor, or infrared rays It is also possible to use the following.

[0164] Here, it is preferable that both the housing 21 and the housing 22 have a battery module. This reduces the frequency of charging the electronic device 10. By disposing the battery module separately in the housing 21 and the housing 22, the thickness of the housing 21 can be reduced. This allows the thickness of the two cases to be the same, resulting in a cleaner design. It can be said that

[0165] In FIG. 13, a battery module 75a is provided in the housing 21, and a battery In the example shown, the battery module 75b is provided in a different housing. The battery module 75a and the battery module 75b are connected to the battery controller 73. The power received by the power receiving unit 74 can be supplied via a power supply circuit (not shown). Power is directly supplied from the power receiving unit 74 to the battery module 75b via a power supply line. In addition, the power receiving unit 74 and the battery controller 73 may be mounted in both the housing 21 and the housing 22. It may be provided in.

[0166] To transmit power and signals between two housings, an FPC is used that crosses between the housings. Alternatively, the two cases can be electrically connected regardless of their relative positions. Alternatively, wiring for transmitting signals or power may be provided through the inside of the hinge. Alternatively, the display of the touch panel 63 may extend into two adjacent housings. An FPC may be attached to the opposite side of the housing to cross between the two housings. Power and signals may be transmitted wirelessly between the housings.

[0167] 11 and 13, the audio input unit 77, the audio output unit 78, the antenna 82, and the camera 10 are shown. Although the example in which the camera module 86 is provided in the housing 22 has been shown, these may be provided in the housing 21. Alternatively, the housing 21 and the housing 22 may be provided with the same. Similarly, each component provided in the housing 1 may be provided in the housing 22, or the components provided in the housing 2 may be provided in the housing 2. 1 and the housing 22.

[0168] The above is a description of the configuration example of the electronic device.

[0169] [Application example] One embodiment of the present invention can be used as a wearable electronic device. Cut.

[0170] FIG. 14 shows an example of a wristwatch-type wearable device equipped with the electronic device 10. The wearable device shown in FIG. 4 includes an electronic device 10, a band 45, and a band 46. The band 45 has a fastener, and the band 46 has a number of holes that engage with the fastener. The wearable device can be attached to the arm or other parts of the body using two bands. The form of the bond is not limited to this, and various forms can be used.

[0171] In addition, the display panel 11 has a function as a touch panel, so that the display area can be touched. This allows the electronic device 10 to be operated.

[0172] FIG. 14 shows an example in which the electronic device 10 has a housing button 47 on the side of the housing 21. The input actions using the housing button 47 include touching, pressing, turning, and pulling. , twisting, or shifting vertically, forward, or backward. It is possible.

[0173] In FIG. 14, a battery 48 is provided inside each of the bands 45 and 46. The battery 48 is attached to the band 45 or the band 46. The battery 48 can provide power to the electronic device 10. A battery controller that manages the charging and discharging of the battery 48 is incorporated in the electronic device 10. The electronic device 10 has a main battery in the housing 21 or the housing 22. By using the -48 as a sub-battery, the period of use on a single charge can be significantly extended. Alternatively, neither the housing 21 nor the housing 22 is provided with a battery. Alternatively, the battery 48 may be used as the main battery. Furthermore, the housing 22 can be made thinner and lighter.

[0174] 15(A) to (C) show examples of how the wearable device is worn. The compatible device is in a state where the housing 22 is stacked on the housing 21 as shown in FIG. 15(B), the housing 22 is slid to the position shown in FIG. 15(C). As shown in the figure, the display panel 11 can be reversibly deformed to an unfolded state. For example, The display panel 11 is usually used in a folded state, and when a wider display area is required, the display panel 11 is folded up. 22 can be slid to open and use the display panel 11.

[0175] As shown in FIG. 15A, when the housing 21 and the housing 22 are overlapped with each other, The housing 22 has a locking mechanism to prevent it from sliding unintentionally. At this time, the locked state can be released by, for example, pressing the housing button 47. It is preferable to use a spring or other such restoring force to release the locked state. When the image is removed, the state shown in FIG. 15(A) is automatically transformed into the state shown in FIG. 15(C). Conversely, the state of FIG. 15(C) may be automatically changed to the state of FIG. 15(A). Alternatively, a magnet may be used instead of the locking mechanism, and the magnetic force may be applied to the locking mechanism. The relative positions of the housings 21 and 22 may be fixed by using a magnetic force. The housing 21 and the housing 22 can be easily attached and detached.

[0176] In FIG. 15(A) to (C), the bending direction of the band 45 and the band 46 is approximately perpendicular to the bending direction. The structure in which the housing 22 can be slid in the vertical direction is shown, but as shown in Figs. 16(A) and (B), In addition, the housing 22 can be slid in a direction approximately parallel to the bending direction of the bands 45 and 46. It may be configured as follows.

[0177] As shown in FIGS. 16C and 16D, the display surfaces of the housings 21 and 22 are convex. In this case, when the housing 22 is slid, It is preferable that the sliding direction is along the band 45 or the band 46. In this case, when the display panel 11 is opened, the display surface is curved to fit the arm. The housing 21 and the casing 22 are configured to be wrapped around the arm along the bands 45 and 46. Therefore, the gap between the housing 22 and the arm is small, and the housing 22 is prevented from being damaged by being hit. In addition, even when the display panel 11 is open, the user can wear the device more comfortably. can be given to those who

[0178] The above is a description of the application example.

[0179] This embodiment may be combined, at least in part, with other embodiments described in this specification. It can be implemented in combination.

[0180] (Embodiment 2) In the following, we will discuss input devices (touch sensors) that can be applied to the display panels of electronic devices, and input / output An example of the configuration of a device (touch panel) etc. will be described.

[0181] In this specification, the display panel has a function of displaying (outputting) an image on a display surface. Therefore, the display panel is one aspect of the output device.

[0182] In the present specification, the substrate of the display panel is provided with, for example, an FPC or TCP (Tape Carrier Package) or other connectors attached, or circuit boards A device in which an IC (integrated circuit) is mounted using the COG (Chip On Glass) method, etc. This is sometimes called a display panel module, a display module, or simply a display panel. be.

[0183] In addition, in this specification, a touch sensor is a sensor that is touched by a detection object such as a finger or a stylus. It has the function of detecting pressure or approach. It also has the location information Therefore, the touch sensor is one aspect of the input device. .

[0184] In addition, in this specification and the like, a substrate having a touch sensor is referred to as a touch sensor panel or a single In this specification, the base of the touch sensor panel is For example, a board with a connector such as FPC or TCP attached, or a board The IC is mounted using the COG method, etc., and is called a touch sensor panel module or touch sensor The touch sensor may be called a sensor module, a sensor module, or simply a touch sensor.

[0185] In this specification, the touch panel has a function of displaying (outputting) images on a display surface. Detects when a finger, stylus, or other object touches, presses, or approaches the display surface. The touch panel has a function as a touch sensor that detects the movement of the object. This is one aspect.

[0186] The touch panel is, for example, a display panel (or display device) with a touch sensor, It can also be called a display panel (or display device) with a display function.

[0187] The touch panel may also have a display panel and a touch sensor panel. Alternatively, the display panel may have a touch sensor function inside. do.

[0188] In the present specification, the substrate of the touch panel is provided with a connector such as an FPC or TCP. or a board with an IC mounted on it using the COG method, etc. It may be called a touch panel module, a display module, or simply a touch panel. be.

[0189] [Touch sensor configuration example] An example of the configuration of the input device (touch sensor) will be described below with reference to the drawings.

[0190] 17A shows a schematic top view of the input device 150. The input device 150 includes a substrate 160. A plurality of conductive layers 151, a plurality of conductive layers 152, a plurality of wirings 155, and a plurality of wirings 156 are provided on the The substrate 160 also has a plurality of conductive layers 151 and a plurality of conductive layers 152. In FIG. 17(A), the FPC 157 is provided with An example in which an IC 158 is provided is shown.

[0191] FIG. 17B is an enlarged view of the area surrounded by the dashed line in FIG. 17A. 1 has a shape in which multiple diamond-shaped electrode patterns are connected in the horizontal direction. The diamond-shaped electrode patterns are electrically connected to each other. Similarly, the conductive layer 152 is A plurality of diamond-shaped electrode patterns are arranged in a vertical direction, and the diamond-shaped electrode patterns are arranged in a row. The turns are electrically connected to each other. A part of these overlaps and crosses each other. At this crossing part, the conductive layer 151 and the conductive layer 15 An insulator is sandwiched between the two to prevent an electrical short circuit.

[0192] As shown in FIG. 17C, a plurality of diamond-shaped conductive layers 152 are formed on the conductive layer 1. The island-shaped conductive layers 152 may be arranged vertically. The conductive layer 153 electrically connects two adjacent conductive layers 152. With such a structure, the conductive layer 151 and the conductive layer 152 can be formed by processing the same conductive film. Therefore, the variation in the film thickness can be suppressed. This makes it possible to suppress variations in the resistance value and light transmittance of each electrode depending on the location. Here, the conductive layer 152 has a conductive layer 153. However, the conductive layer 151 may have such a structure. It may be a configuration.

[0193] As shown in FIG. 17D, the conductive layer 151 and the conductive layer 15 shown in FIG. The inside of the diamond-shaped electrode pattern in 2 may be hollowed out, leaving only the outline. At this time, the width of the conductive layer 151 and the conductive layer 152 is set to be thin enough not to be visually recognized by the user. In this case, the conductive layers 151 and 152 may be made of a light-shielding material such as a metal or an alloy. In addition, the conductive layer 151 or the conductive layer 152 shown in FIG. The configuration may include the following.

[0194] Each conductive layer 151 is electrically connected to one wiring 155. The conductive layer 152 is electrically connected to one wiring 156. One of the wirings 52 corresponds to a row wiring, and the other corresponds to a column wiring.

[0195] The IC158 has a function of driving the touch sensor. is connected to either the conductive layer 151 or the conductive layer 152 via the wiring 155 or the wiring 156. In addition, a current (or a potential) flowing through either the conductive layer 151 or the conductive layer 152 is supplied. ) is input to IC 158 via wiring 155 or wiring 156.

[0196] Here, when the input device 150 is placed on the display surface of the display panel to form a touch panel, In this case, a light-transmitting conductive material is preferably used for the conductive layer 151 and the conductive layer 152. In addition, a light-transmitting conductive material is used for the conductive layer 151 and the conductive layer 152, and the conductive layer 152 is When the light is extracted through the conductive layer 151 or the conductive layer 152, the conductive layer 151 and the conductive layer A conductive film containing the same conductive material is disposed between the layer 152 as a dummy pattern. In this way, it is preferable to fill a part of the gap between the conductive layer 151 and the conductive layer 152 with a dummy pattern. By filling the gap with the lines, the variation in light transmittance can be reduced. The unevenness in brightness of the light passing through 50 can be reduced.

[0197] Examples of the conductive material having a light-transmitting property include indium oxide, indium tin oxide, and indium tin oxide. Conductive oxides such as zinc oxide, zinc oxide, and zinc oxide doped with gallium are used. A film containing graphene can also be used. The film containing graphene is, for example, For example, the graphene oxide film can be reduced. As a method for this, a method of applying heat can be mentioned.

[0198] Alternatively, a metal or alloy that is thin enough to have light transmission properties can be used. For example, gold , silver, platinum, magnesium, nickel, tungsten, chromium, molybdenum, iron, cobalt Metals such as titanium, copper, palladium, or titanium, or alloys containing such metals, can be used. Alternatively, a nitride of the metal or alloy (for example, titanium nitride) may be used. Further, a laminated film in which two or more conductive films containing the above-mentioned materials are laminated may be used.

[0199] In addition, the conductive layers 151 and 152 are thin enough to be invisible to the user. For example, such a conductive film may be processed into a lattice (mesh) shape. By doing so, it is possible to obtain high conductivity and high visibility of the display device. 30 nm or more and 100 μm or less, preferably 50 nm or more and 50 μm or less, more preferably 5 It is preferable that the width of the portion is 0 nm or more and 20 μm or less. A conductive film having a pattern width is preferable because it is extremely difficult for a user to visually recognize the conductive film.

[0200] As an example, FIG. 18A to FIG. 18D show an enlarged view of a part of the conductive layer 151 or the conductive layer 152. FIG. 18(A) shows an example in which a lattice-shaped conductive film 146 is used. At this time, the conductive film 146 is arranged so as not to overlap with a display element of the display device. This is preferable because it does not block light from the display device. The direction of the lattice is the same as the direction of the display element array, and the period of the lattice is an integer number of periods of the display element array. It is preferable to double the amount.

[0201] FIG. 18B shows a lattice-shaped conductive film processed to form triangular openings. 147. By adopting such a configuration, compared to the case shown in FIG. Therefore, it is possible to achieve a lower resistance overall.

[0202] Also, as shown in FIG. 18C, a conductive film 14 having a pattern shape without periodicity With this configuration, moire is prevented when the display unit of the display device is overlapped. It is possible to suppress the occurrence of the above problems.

[0203] Alternatively, conductive nanowires may be used for the conductive layers 151 and 152. (D) shows an example in which a nanowire 149 is used. By dispersing the 9 at an appropriate density so that they come into contact with each other, a two-dimensional network is formed. The film can function as a highly light-transmitting conductive film. The value is 1 nm or more and 100 nm or less, preferably 5 nm or more and 50 nm or less, and more preferably 5 Nanowires having a diameter of 25 nm or more can be used. Metal nanowires such as Ag nanowires, Cu nanowires, and Al nanowires, or For example, Ag nanowires have a light transmittance of 89% or more, and a sheet resistance value of 40 Ω / □ or more and 100 Ω / □ or less can be achieved.

[0204] The above is a description of the configuration example of the touch sensor.

[0205] [Touch panel configuration example] FIG. 19A is a schematic perspective view of the touch panel 100. FIG. 19B is a schematic perspective view of the touch panel 100. 9(A) is an exploded perspective schematic view of the device 9. For clarity, only representative components are shown. 19B, only the outline of the substrate 160 is shown by a dashed line.

[0206] The touch panel 100 includes a substrate 101 and a substrate 160 disposed opposite each other.

[0207] A display unit 102, a circuit 103, wiring 104, etc. are provided on the substrate 101. An FPC 167 is mounted on the board 101 .

[0208] The circuit 103 can be, for example, a circuit that functions as a scan line driver circuit.

[0209] The wiring 104 has a function of supplying signals and power to the display portion 102 and the circuit 103. Signals and power are input to the wiring 104 from the outside via the FPC 167 or from the IC 168. do.

[0210] The board 160 is provided with an input device 150 .

[0211] The configuration of the input device 150 can be based on the above-mentioned example of the touch sensor. ) an input device 150 includes a plurality of conductive layers 151, a plurality of conductive layers 152, a plurality of wirings 155 1, a case in which a plurality of wirings 156 are included is shown.

[0212] As the input device 150, for example, a capacitive touch sensor can be used. There are various types of capacitive touch sensors, such as surface capacitive touch sensors and projected capacitive touch sensors. There are two types of methods: self-capacitance and mutual capacitance. This is preferable because it enables point detection. In the following, a projected capacitive touch sensor is applied. The following describes the case where this is done.

[0213] However, this is not limited to this, and may also include the approach or contact of a detected object such as a finger or stylus. Alternatively, various sensors capable of detecting and outputting a pressing force may be provided to the input device 150. It can also be applied.

[0214] The touch panel 100 shown in FIGS. 19(A) and 19(B) includes an input device 150 provided on a substrate 160. The wiring 155 and the wiring 156 of the input device 150 are connected to the connector 169. The connection portion 169 is electrically connected to the FPC 167 connected to the substrate 101 side. A connector exhibiting anisotropic conductivity may be provided.

[0215] With this configuration, the FPC connected to the touch panel 100 is located on one of the substrates ( In this case, the touch panel 100 can be provided only on the substrate 101 side. The FPC on the top may be attached, but as shown in Figure 19(A)(B), The panel 100 is provided with one FPC 167, which is connected to the substrate 101 side and the substrate Supplying signals to both sides of the 160 can reduce the number of parts and simplify the configuration. This is preferable because it allows

[0216] In addition, in Figure 19(A)(B), IC168 is mounted in a COF (Chip On Film) manner. The figure shows an example of IC168 mounted on FPC167 by the following formula. An IC having a function as a driving circuit or the like can be applied. In particular, IC168 may have a function as a signal line driver circuit. It is preferable that the input device 150 has both the function of driving the input device 150 and the function of driving the input device 150, since the number of parts can be reduced. I wish.

[0217] [Example of how to drive a touch sensor] An example of a method for driving an input device (touch sensor) that can be applied to one embodiment of the present invention will be described below. I will explain this in more detail.

[0218] FIG. 20A is a block diagram showing the configuration of a mutual capacitance type touch sensor. The sensor includes a pulse voltage output circuit 601 and a current detection circuit 602. Six wirings X (wirings X1-X6) are connected to the circuit 601. Six wires Y (wires Y1-Y6) are connected to the 1 / 16-bit ... One wire X and one wire Y form a capacitance 603.

[0219] For example, the conductive layer 151 corresponds to one of the wiring X and the wiring Y, and the conductive layer 152 corresponds to the other. Corresponds to.

[0220] The pulse voltage output circuit 601 inputs pulse voltages to the wirings X1-X6 in sequence, for example. The current detection circuit 602 detects the current flowing through each of the wirings Y1-Y6, for example. This is a circuit for measuring.

[0221] Each of the wirings X1 to X6 is connected to each of the wirings Y1 to Y6 via a capacitor 603. Therefore, when a pulse voltage is applied to one of the wires X1-X6, A current flows through each of Y1-Y6. A part of the electric field generated between the pair of wires is The object to be detected touches, approaches, or presses the detection surface (hereafter referred to as "touch"). This causes the strength of the electric field between the wirings to change. The magnitude of the current flowing through the wirings Y1-Y6 changes.

[0222] When there is no touch operation, the magnitude of the current flowing through the wires Y1-Y6 is equal to the magnitude of the capacitance 603. On the other hand, when a part of the electric field is blocked by a touch operation, the value of the wiring Y1- The magnitude of the current flowing through Y6 decreases. This current difference allows the touch action to be detected. This can be done.

[0223] The current detection circuit 602 obtains the (temporal) integral value of the current flowing through one wiring. In that case, for example, an integrating circuit or the like can be used. The value can also be obtained as a current value. In that case, for example, the current can be converted to a voltage and It is also possible to obtain the peak value of the voltage.

[0224] FIG. 20B shows input and output waves in the mutual capacitance type touch sensor shown in FIG. In FIG. 20(B), the detection of each matrix in one sensing period is shown. In FIG. 20B, when there is no touch operation (non-touch), The two cases where there is a touch operation (when touched) are shown side by side. Here, the wiring Y1 For -Y6, the voltage waveform corresponding to the direction and magnitude of the current flowing through each wire is It shows.

[0225] As shown in FIG. 20(B), a pulse voltage is sequentially applied to the wirings X1-X6. In response, current flows through the wires Y1-Y6. When not touched, the voltage of the wires X1-X6 In response to the change in On the other hand, when a touch is applied to the wiring Y1-Y6, the output waveforms of the wiring Y1-Y6 are the same. Since the current flowing through the wire Y located at the point where the operation was performed decreases, the current flowing through the wire Y shown in FIG. The output waveform changes as shown below.

[0226] In FIG. 20B, a touch sensor is provided at or near the intersection of the wiring X3 and the wiring Y3. This shows an example of a case where a

[0227] In this way, in the mutual capacitance method, the electric field generated between a pair of wires is shielded by the object to be detected, By utilizing the change in the current flowing through the wiring, the position information of the detected object can be obtained. In addition, when the sensitivity is high, the detection object moves away from the detection surface (for example, the surface of a touch panel). Even if the object is touching something, the coordinates can be detected. The sensor may have a function of detecting a change in pressure by pressing the sensing surface. This reduces the thickness of the touch panel and increases the parasitic capacitance of the wiring, which is used to detect the pressure. It may have a function of detecting a change in pressure.

[0228] In addition, in the case of a touch panel, the display period of the display unit and the sensing period of the touch sensor By using a driving method in which the driving time is shifted from the driving time, the detection sensitivity of the touch sensor can be increased. For example, if a display period and a sensing period are separated during one frame period, In this case, it is preferable to provide two or more sensing periods in one frame period. By increasing the frequency of sensing, the detection sensitivity can be further improved.

[0229] The pulse voltage output circuit 601 and the current detection circuit 602 are, for example, a single IC chip. It is preferable that the IC chip is formed in the touch panel. It is preferable that the device is flexible and mounted on a substrate inside the housing of an electronic device. When using a touch panel with a curved surface, parasitic capacitance increases at the curved area, and the effect of noise increases. Therefore, ICs that use driving methods that are less susceptible to noise are used. It is preferable to use a chip. For example, a driving method that increases the signal-to-noise ratio (S / N ratio) is used. It is preferable to use an IC chip to which the method has been applied.

[0230] The above is a description of an example of the method for driving the touch sensor.

[0231] [Cross-section example] An example of a cross-sectional configuration of a touch panel will be described below with reference to the drawings.

[0232] [Cross-sectional configuration example 1] FIG. 21 is a schematic cross-sectional view of a touch panel. The touch panel shown in FIG. This is a so-called external touch panel, in which a substrate with a touch sensor is attached to the touch panel. In FIG. 21, the area including the FPC 373, the area including the drive circuit 382, ​​and the area including the display unit 381 are shown. 13 shows cross sections of a region including FPC 350 and a region including FPC 350.

[0233] The touch panel includes a substrate 291, a substrate 191, and a substrate 330. The substrate 191 is bonded to the substrate 330 by an adhesive layer 220. Here, the substrate 291, the substrate 191, and the substrate 292 are bonded together by the adhesive layer 230. The sandwiched laminated structure corresponds to a display panel. The configuration including the laminated structure corresponds to a touch sensor.

[0234] <Display panel> Between the substrate 291 and the substrate 191, a transistor 201, a transistor 202, a transistor A resistor 203, a display element 204, a capacitor element 205, and the like are provided.

[0235] The substrate 291 is bonded to an insulating layer 294 by an adhesive layer 292. 1 is attached to an insulating layer 194 by an adhesive layer 192.

[0236] The substrate 291 and the substrate 191 may be made of a flexible material such as resin. It is preferable to use a flexible film or the like for the substrate 291 and the substrate 191. By using flexible materials for these substrates, a bendable display panel can be realized. The substrate 291 and the substrate 191 serve to protect the transistors and the light-emitting elements. It has the function of protecting the film from the sun and can also be called a protective film.

[0237] In addition, the insulating layer 294 and the insulating layer 194 are made of a material that is difficult for impurities such as water and hydrogen to diffuse. By using such a configuration, the substrate 291 and the substrate 191 can be made moisture-permeable. Even if a material having such properties is used, it is possible to prevent the display element 204 and each transistor from being damaged by external interference. It is possible to effectively prevent the diffusion of impurities, realizing a highly reliable touch panel. can.

[0238] On the insulating layer 294, an insulating layer 211, an insulating layer 212, an insulating layer 213, an insulating layer 214, and an insulating layer 215 are formed. The insulating layer 211 is provided with an edge layer 215, a spacer 216, etc. The other part functions as a dielectric for the capacitance element 205. The insulating layers 212, 213, and 214 are insulating layers for forming transistors and capacitor elements. The insulating layer 214 is provided to cover the insulating layers 205 and 206. The insulating layer 214 functions as a planarization layer. Here, the insulating layer 212, the insulating layer 213, and the insulating layer 214 are used as insulating layers for covering the transistors and the like. Although the present invention shows a case having three layers, i.e., layers 214, the present invention is not limited to this, and may have four or more layers. The insulating layer 214, which functions as a planarizing layer, is not necessary. If available, it is not necessary to provide this.

[0239] A display element 204 is provided on the insulating layer 214. This shows an example of a top emission type organic EL element. The display element 204 emits light toward the second electrode 223. A transistor 202, a transistor 203, a capacitor element 205, wiring, etc. are arranged in layers. This makes it possible to increase the aperture ratio of the display portion 381.

[0240] The display element 204 has an EL layer 222 between a first electrode 221 and a second electrode 223. In addition, an optical adjustment layer 224 is provided between the first electrode 221 and the EL layer 222. The insulating layer 215 is provided to cover the ends of the first electrode 221 and the optical adjustment layer 224. is.

[0241] FIG. 21 shows a cross section of one pixel as an example of the display unit 381. A transistor 202 for current control, a transistor 203 for switching control, and a capacitor The source or drain of the transistor 202 is One electrode of the capacitor 205 is connected to the insulating layer 212, the insulating layer 213, and the insulating layer 214. 4 is electrically connected to the first electrode 221 through an opening provided in the first electrode 221 .

[0242] In addition, in FIG. 21, as an example of the driving circuit 382, ​​a transistor 201 is provided. This shows the composition of the

[0243] The transistor 201, the transistor 202, and the transistor 203 each have a gate a conductive layer 241 functioning as a gate electrode; a semiconductor layer 242 functioning as a source and a drain; It has a pair of conductive layers 243 .

[0244] In FIG. 21, a transistor 201 and a transistor 202 are provided with a semiconductor device in which a channel is formed. A configuration in which the conductive layer 242 is sandwiched between two gates (conductive layer 241 and conductive layer 244) is applied. This example shows a transistor with a field effect mobility of 1.2 m / s compared to other transistors. This allows the on-state current to be increased, resulting in high-speed operation. Furthermore, it is possible to reduce the area occupied by the circuit. By using transistors with a large on-state current, it is possible to increase the size of display panels or Even if the number of wirings increases when finer wiring is implemented, it is possible to reduce the signal delay in each wiring. This makes it possible to reduce variations in display luminance.

[0245] The transistors provided in the driver circuit 382 and the display portion 381 have the same structure. Alternatively, transistors having different structures may be used in combination. .

[0246] At least one of the insulating layers 212 and 213 covering each transistor is water or It is preferable to use a material that is difficult for impurities such as hydrogen to diffuse into the insulating layer 21. Alternatively, the insulating layer 213 can function as a barrier film. This effectively prevents impurities from diffusing into the transistor from the outside. This makes it possible to realize a highly reliable touch panel.

[0247] The spacer 216 is provided on the insulating layer 215 and adjusts the distance between the substrate 291 and the substrate 191. In FIG. 21, when there is a gap between the spacer 216 and the light shielding layer 232, In this example, the spacer 216 is disposed on the substrate 2. 91 side is shown, but it may be provided on the substrate 191 side (for example, closer to the substrate 191 than the light-shielding layer 232). Alternatively, granular spacers may be used in place of the spacers 216. Although materials such as silica can be used for the spacer, organic resins, rubber, etc. It is preferable to use a material having elasticity. In this case, the granular spacer is crushed in the vertical direction. The shape may be different.

[0248] A colored layer 231, a light-shielding layer 232, and the like are provided on the substrate 291 side of the insulating layer 194. The light-shielding layer 232 has an opening, and is disposed so that the opening overlaps with the display area of ​​the display element 204. In addition, an insulating layer that functions as an overcoat and covers the colored layer 231 and the light-shielding layer 232 is formed. A layer may be provided.

[0249] A connection portion 206 is provided in an area near the end of the substrate 291. The FPC 373 is electrically connected via the interconnect layer 209. A part of the wiring 207 electrically connected to the driving circuit 382 and the same conductive film as the first electrode 221 The connecting portion 206 is formed by laminating a conductive layer formed by processing the conductive layer. In this way, by forming the connection portion 206 by stacking two or more conductive layers, the electrical resistance can be reduced. Not only can the weight be reduced, but the mechanical strength of the connection portion 206 can be increased.

[0250] In FIG. 21, as an example, the same conductive film as the gate electrode of the transistor is processed to form The wiring is processed with the same conductive film as the source and drain electrodes of the transistor. 3 shows a cross-sectional structure of an intersection 387 where the formed wiring intersects with the wiring.

[0251] Input Device An electrode 333 and an electrode 332 are provided on the surface of the substrate 330 facing the substrate 291. In this example, a bridge electrode 334 is provided to connect to the electrode 333. As shown in FIG. 1 at an intersection 387, the electrodes 332 and 333 are formed on the same plane. An insulating layer 161 is provided to cover the electrodes 332 and 333. A bridge electrode 334 is provided on the surface of the insulating layer 1. Two electrodes 333 are provided so as to sandwich the electrode 332 through an opening provided in 61, and Electrically connected.

[0252] The connection portion 106 is provided in an area near the edge of the substrate 330. The connection portion 106 is The FPC 350 is electrically connected via the connection layer 109. In the configuration shown in FIG. A part of the wiring 342 and a conductive layer obtained by processing the same conductive film as the bridge electrode 334 are An example in which the connection portion 106 is formed by laminating is shown.

[0253] Here, the substrate 330 can also be used as a substrate that is directly touched by a detection object such as a finger or a stylus. In this case, a protective layer (ceramic coat, etc.) is provided on the substrate 330. The protective layer is preferably made of, for example, silicon oxide, aluminum oxide, or yttrium oxide. Alternatively, inorganic insulating materials such as yttria-stabilized zirconia (YSZ) can be used. Alternatively, the substrate 330 may be made of tempered glass. The tempered glass is made of glass that has been subjected to physical or chemical treatment. The surface of the material can be subjected to compressive stress. The touch sensor can be attached to a piece of tempered glass by ion exchange or air cooling. The opposite surface is placed on the top surface of an electronic device, for example, and used as a touch surface. This allows the overall thickness of the device to be reduced.

[0254] The substrate 330 has a flexible portion so as to bend at least together with the display panel. For example, the same material as the substrate 291, the substrate 191, etc. can be used. Cut.

[0255] [About each component] Each of the above components will be described below.

[0256] The substrate of the touch panel can be made of a material having a flat surface. The substrate on the side from which the light is extracted is made of a material that transmits the light. For example, glass or quartz is used. Materials such as ceramic, sapphire, and organic resin can be used.

[0257] By using a thin substrate, the touch panel can be made lighter and thinner. Furthermore, by using a substrate having a thickness sufficient to provide flexibility, a flexible touch panel can be obtained. This can be achieved.

[0258] Examples of glass include non-alkali glass, barium borosilicate glass, and aluminophore glass. Usable materials include silicate glass.

[0259] Examples of materials having flexibility and transparency to visible light include materials having flexibility. Thickness of glass, polyethylene terephthalate (PET), polyethylene naphthalate Polyester resins such as (PEN), polyacrylonitrile resins, polyimide resins, methacrylate resin, polycarbonate (PC) resin, polyethersulfone (PE S) Resin, polyamide resin, cycloolefin resin, polystyrene resin, polyamide imide resin, polyvinyl chloride resin, polytetrafluoroethylene (PTFE) resin, etc. In particular, it is preferable to use a material with a low thermal expansion coefficient. ×10-6 / K or less, polyamide-imide resin, polyimide resin, PET, etc. are preferably used. In addition, it is possible to use a substrate in which glass fibers are impregnated with organic resin, or an organic substrate in which inorganic fillers are It is also possible to use a substrate with a lower thermal expansion coefficient by mixing it with resin. Since the substrate is light in weight, the touch panel using the substrate can also be made light in weight.

[0260] In addition, the substrate on the side from which light is not extracted does not need to have light-transmitting properties. In addition to the above-mentioned substrate, a metal substrate or the like can also be used. Metal substrates have high thermal conductivity and the entire substrate Since heat can be easily transferred to the body, localized temperature increases on the touch panel can be suppressed. In order to obtain flexibility and bendability, the thickness of the metal substrate is preferably 10 μm or more and 200 μm or less. It is preferable that the thickness is 20 μm or less, and more preferable that the thickness is 20 μm or more and 50 μm or less.

[0261] The material constituting the metal substrate is not particularly limited, but examples thereof include aluminum, copper, and nickel. Metals such as nickel, or alloys such as aluminum alloys and stainless steel are preferably used. It is possible.

[0262] In addition, the surface of the metal substrate is oxidized or an insulating film is formed on the surface to perform insulation treatment. For example, a coating method such as spin coating or dipping, an electrodeposition method, or the like may be used. The insulating film may be formed by deposition, evaporation, sputtering, or the like. In addition to leaving it in air or heating it, an oxide film is formed on the surface of the substrate by anodizing, etc. This is also fine.

[0263] As a flexible substrate, the layer made of the above material protects the surface of the touch panel from scratches. A hard coat layer (e.g., a silicon nitride layer) that can disperse pressure, or a layer of a material that can disperse pressure (e.g., For example, an aramid resin layer may be laminated on the surface of the sheet. In order to prevent the deterioration of the life of light-emitting elements, a silicon nitride film, a silicon oxynitride film, etc. The water permeability of membranes containing silicon and silicon, and membranes containing nitrogen and aluminum, such as aluminum nitride membranes, It may have a low insulating film.

[0264] The substrate may be formed by laminating a plurality of layers. In particular, the substrate may have a glass layer. This improves the barrier properties against water and oxygen, making it possible to create a highly reliable touch panel. For example, a substrate having a glass layer, an adhesive layer, and an organic resin layer laminated thereon from the side closest to the light emitting element is used. By providing such an organic resin layer, the glass layer is prevented from cracking or cracking. The glass material and the organic resin can suppress the cracking and improve the mechanical strength. By applying this composite material to the substrate, a highly reliable and flexible touch panel can be produced. It can be said that

[0265] The transistor includes a conductive layer functioning as a gate electrode, a semiconductor layer, and a A conductive layer that functions as a drain electrode and a conductive layer that functions as a gate insulating layer. FIG. 21 shows a case where a bottom-gate transistor is applied. is doing.

[0266] Note that there is no particular limitation on the structure of a transistor included in a touch panel of one embodiment of the present invention. For example, the transistor may be a staggered type transistor or an inverted staggered type transistor. In addition, the transistor structure may be either a top gate type or a bottom gate type. The semiconductor material used for the transistor is not particularly limited, and may be, for example, an oxide semiconductor, a silicon Examples of such elements include silicon and germanium.

[0267] The crystallinity of the semiconductor material used in the transistor is not particularly limited. A semiconductor having crystallinity (a microcrystalline semiconductor, a polycrystalline semiconductor, a single crystal semiconductor, or a semiconductor having a partially crystalline region) If a semiconductor having crystallinity is used, the This is preferable because it is possible to suppress deterioration of the resistor characteristics.

[0268] In addition, the semiconductor material used for the transistor is, for example, a group 14 element (silicon, A semiconductor layer may be made of a material selected from the group consisting of germanium, a compound semiconductor, and an oxide semiconductor. Typically, a semiconductor containing silicon, a semiconductor containing gallium arsenide, or an oxide containing indium Semiconductors and the like can be used.

[0269] In particular, it is preferable to use an oxide semiconductor having a band gap larger than that of silicon. If a semiconductor material with a wider band gap and lower carrier density than silicon is used, This is preferable because it is possible to reduce the current in the off state of the transistor.

[0270] For example, the oxide semiconductor may contain at least indium (In) or zinc (Zn It is preferable that the oxide contains In-M-Zn (wherein M is Al, Ti, Metals such as Ga, Ge, Y, Zr, Sn, La, Ce or Hf) are included. nothing.

[0271] In particular, the semiconductor layer has a plurality of crystal parts, and the crystal parts have a c-axis aligned with a surface on which the semiconductor layer is formed. Or, the crystals are oriented approximately perpendicular to the upper surface of the semiconductor layer, and grain boundaries are observed between adjacent crystal portions. It is preferable to use an oxide semiconductor film that is not subject to the above-mentioned conditions.

[0272] Such an oxide semiconductor does not have crystal grain boundaries, so that when the display panel is curved, The occurrence of cracks in the oxide semiconductor film due to stress is suppressed. Such oxide semiconductors are suitable for use in touch panels that are flexible and can be curved. It can be used.

[0273] In addition, by using such a crystalline oxide semiconductor for the semiconductor layer, This suppresses fluctuations in the capacitance, thereby achieving a highly reliable transistor.

[0274] In addition, a transistor using an oxide semiconductor having a larger band gap than silicon is The low off-state current allows the charge stored in the capacitor connected in series with the transistor to be maintained for a long time. By applying such a transistor to a pixel, This makes it possible to stop the driving circuit while maintaining the gradation of each pixel. This makes it possible to realize a display device with reduced power consumption.

[0275] Alternatively, silicon is preferably used as a semiconductor in which a channel of a transistor is formed. Although amorphous silicon may be used as silicon, silicon having crystallinity is particularly preferred. It is preferable to use silicon. For example, microcrystalline silicon, polycrystalline silicon, single crystal silicon, etc. In particular, polycrystalline silicon has a lower temperature than single crystal silicon. It has high field effect mobility and high reliability compared to amorphous silicon. By applying such a polycrystalline semiconductor to the pixels, the aperture ratio of the pixels can be improved. Even if the display device has extremely high resolution, the scanning line driver circuit and the signal line driver circuit This makes it possible to form the display and pixels on the same substrate, reducing the number of components that make up electronic devices. It is possible.

[0276] Alternatively, transistors using different semiconductors may be mixed. For example, polycrystalline Silicon-based transistors and oxide semiconductor-based transistors are mixed. In this case, for example, a transistor in a driver circuit or Polycrystalline silicon is used for transistors that need to pass large currents, such as current control transistors. It is also preferable to use a transistor such as a switching transistor in a pixel. A capacitor is connected in series with the charger, and a transistor holds the charge stored in the capacitor. In particular, it is preferable to use an oxide semiconductor.

[0277] In addition to the gate, source, and drain of the transistor, the various wiring that makes up the touch panel Materials that can be used for conductive layers such as wires and electrodes include aluminum, titanium, Chromium, nickel, copper, yttrium, zirconium, molybdenum, silver, tantalum, Examples of the material include metals such as tungsten, or alloys that contain tungsten as the main component. Films containing these materials can be used as single layers or as laminate structures. A single-layer structure of an aluminum film containing titanium, a two-layer structure of an aluminum film laminated on a titanium film, Two-layer structure with aluminum film laminated on tungsten film, copper-magnesium-aluminum Two-layer structure with copper film laminated on aluminum alloy film, two-layer structure with copper film laminated on titanium film, tungsten A two-layer structure in which a copper film is laminated on a titanium film, a titanium nitride film, and an aluminum film are laminated on top of that. An aluminum film or a copper film is laminated, and then a titanium film or a titanium nitride film is formed on the aluminum film or a copper film. A three-layer structure consisting of a molybdenum film or molybdenum nitride film and an aluminum film or A three-layer structure is formed by laminating a copper film on a silicon substrate and then forming a molybdenum film or a molybdenum nitride film on the copper film. In addition, oxides such as indium oxide, tin oxide, and zinc oxide may be used. In addition, copper containing manganese is preferred because it improves the controllability of the shape by etching. It is nice.

[0278] In addition, it can be used for conductive layers such as various wiring and electrodes that constitute a touch panel. Examples of the light-transmitting material include indium oxide, indium tin oxide, and indium zinc oxide. Conductive oxides such as zinc oxide, zinc oxide, and zinc oxide doped with gallium, or graphene are used. Or, gold, silver, platinum, magnesium, nickel, tungsten, chromium, Metallic materials such as chromium, molybdenum, iron, cobalt, copper, palladium, or titanium, or the like An alloy material containing a metal material can be used. Alternatively, a nitride of the metal material (e.g., Titanium nitride) and the like may also be used. Metal materials, alloy materials (or their nitrides) In the case of using a conductive film, it is sufficient to make the film thin enough to have light transmission properties. For example, an alloy of silver and magnesium and indium tin oxide can be used as a conductive layer. It is preferable to use a laminated film of such a material because the electrical conductivity can be increased.

[0279] Examples of insulating materials that can be used for each insulating layer, overcoat, spacer, etc. include For example, resins such as acrylic and epoxy resins, and resins having siloxane bonds such as silicone resins. Others: silicon oxide, silicon oxynitride, silicon nitride oxide, silicon nitride, aluminum oxide Alternatively, inorganic insulating materials such as ammonium nitrate may be used.

[0280] In addition, it is preferable that the light emitting element is provided between a pair of insulating films having low water permeability. This makes it possible to prevent impurities such as water from entering the light emitting element, and thus prevents a decrease in the reliability of the device. Can be controlled.

[0281] Insulating films with low water permeability include silicon nitride films and silicon oxynitride films, which are made of nitrogen and silicon. and films containing nitrogen and aluminum, such as an aluminum nitride film. A silicon oxide film, a silicon oxynitride film, an aluminum oxide film, or the like may also be used.

[0282] For example, the water vapor permeability of a low-permeability insulating film is 1×10 -5 [g / (m 2 ·day) ] or less, preferably 1 × 10 -6 [g / (m 2 ·day)] or less, preferably 1×1 0 -7 [g / (m 2 ·day)] or less, and more preferably 1×10 -8 [g / (m 2 d ay)] below.

[0283] The adhesive layers may be of a light-curing adhesive, such as an ultraviolet-curing adhesive, a reaction-curing adhesive, or a heat-curing adhesive. Various curing adhesives such as adhesives, anaerobic adhesives, etc. can be used. Epoxy resin, acrylic resin, silicone resin, phenolic resin, polyimide resin, Mido resin, PVC (polyvinyl chloride) resin, PVB (polyvinyl butyral) resin, EVA (ethylene vinyl acetate) resin, etc. In particular, the moisture permeability of epoxy resin, etc. A material with low adhesion is preferable. A two-part mixed resin may also be used. may also be used.

[0284] The resin may contain a desiccant. For example, an oxide of an alkaline earth metal (an acid The material used is one that adsorbs moisture by chemical adsorption, such as calcium chloride or barium oxide. Alternatively, materials such as zeolite and silica gel can absorb water by physical adsorption. If a desiccant is included, impurities such as moisture can be prevented from adsorbing to the functional element. This is preferable because it is possible to suppress the intrusion of foreign matter and improve the reliability of the display panel.

[0285] In addition, by mixing a filler having a high refractive index or a light scattering material into the resin, a light emitting element can be formed. For example, titanium oxide, barium oxide, Zeolite, zirconium, etc. can be used.

[0286] The light-emitting element may be a self-emitting element that is illuminated by a current or a voltage. The category includes devices whose light intensity can be controlled. For example, light-emitting diodes (LEDs), organic An EL element, an inorganic EL element, etc. can be used.

[0287] The light-emitting elements are top emission type, bottom emission type, and dual emission type. The electrode on the light extraction side is made of a conductive film that transmits visible light. In addition, it is preferable to use a conductive film that reflects visible light for the electrode on the side from which light is not extracted. stomach.

[0288] The EL layer has at least a light-emitting layer. The EL layer has a hole-injecting layer as a layer other than the light-emitting layer. high hole transporting material, hole blocking material, high electron transporting material, electron injection The material contains a highly conductive material or a bipolar material (a material with high electron transport and hole transport properties). The insulating layer may further include a layer containing the insulating layer.

[0289] The EL layer can be made of either low molecular weight compounds or high molecular weight compounds. Each of the layers constituting the EL layer may be formed by deposition (including vacuum deposition). The insulating layer can be formed by a method such as a transfer method, a printing method, an ink-jet method, or a coating method.

[0290] When a voltage higher than the threshold voltage of the light-emitting element is applied between the cathode and anode, the EL layer is charged from the anode side. Holes are injected from the cathode side, and electrons are injected from the cathode side. The injected electrons and holes are These molecules recombine and the luminescent material contained in the EL layer emits light.

[0291] When a white-emitting light-emitting element is used as the light-emitting element, two or more types of light-emitting elements are used in the EL layer. For example, the light emitted by two or more luminescent materials may be of complementary colors. By selecting a light-emitting material so as to satisfy the above relationship, white light can be obtained. For example, Luminescent substances that emit light of R (red), G (green), B (blue), Y (yellow), O (orange), etc. Or, among luminescent materials that emit light containing two or more of the spectral components of R, G, and B, It is preferable that the spectrum of the light emitted from the light emitting element is in the visible light region. A light emitting element having two or more peaks within a wavelength range (e.g., 350 nm to 750 nm) is used. It is preferable to use a material having a peak in the yellow wavelength region. Preferably, the material has spectral components in the green and red wavelength regions as well.

[0292] The EL layer is made up of a light-emitting layer containing a light-emitting material that emits one color and a light-emitting layer containing a light-emitting material that emits another color. For example, a plurality of light-emitting layers in the EL layer are preferably laminated. The layers may be stacked in contact with each other or separated by an area that does not contain any luminescent material. For example, a fluorescent-emitting layer or a phosphorescent-emitting layer may be laminated between the fluorescent-emitting layer and the phosphorescent-emitting layer. The phosphorescent layer contains the same materials (e.g., host material, assist material) as the phosphorescent layer, and both of the emitting layers A region that does not contain any optical material may be provided. This makes it easier to manufacture the light-emitting element. In addition, the driving voltage is reduced.

[0293] The light-emitting element may be a single element having one EL layer, or a light-emitting element having multiple EL layers. and a charge generating layer interposed therebetween to form a tandem element.

[0294] The conductive film that transmits visible light is, for example, indium oxide, indium tin oxide, indium Zinc oxide, zinc oxide, zinc oxide doped with gallium, etc. can be used. , gold, silver, platinum, magnesium, nickel, tungsten, chromium, molybdenum, iron, Metallic materials such as ballast, copper, palladium, or titanium, alloys containing these metallic materials, or The nitrides of these metal materials (for example, titanium nitride) are also formed thin enough to have light transmission properties. Also, a laminated film of the above materials can be used as a conductive layer. For example, if a laminated film of an alloy of silver and magnesium and indium tin oxide is used, This is preferable because it is possible to increase the electrical conductivity. Graphene or the like may also be used.

[0295] The conductive film that reflects visible light is made of, for example, aluminum, gold, platinum, silver, nickel, tungsten, etc. Metallic materials such as stainless steel, chromium, molybdenum, iron, cobalt, copper, or palladium, or In addition, the above-mentioned metal materials and alloys may be used. Tungsten, neodymium, germanium, etc. may be added. Titanium, nickel Alternatively, an alloy containing neodymium and aluminum (aluminum alloy) may be used. An alloy containing silver and copper, palladium, or magnesium may also be used. The alloy is preferable because of its high heat resistance. Furthermore, an aluminum film or an aluminum alloy film By laminating a metal film or a metal oxide film in contact with the aluminum alloy film, oxidation of the aluminum alloy film is suppressed. Examples of materials for such metal films and metal oxide films include titanium and titanium oxide. In addition, the conductive film that transmits visible light and a film made of a metal material are laminated. For example, a laminated film of silver and indium tin oxide, an alloy of silver and magnesium and indium For example, a laminated film of aluminum tin oxide can be used.

[0296] The conductive layers may be formed by evaporation or sputtering. Using a discharge method such as the inkjet method, a printing method such as the screen printing method, or a plating method It can be formed.

[0297] In addition, the above-mentioned light-emitting layer, the substance having a high hole-injecting property, the substance having a high hole-transporting property, the The layer including a substance having a high electron transporting property, a substance having a high electron injecting property, a bipolar substance, or the like is These include inorganic compounds such as quantum dots and polymer compounds (oligomers, dendrimers, and polymers). For example, by using quantum dots in the light-emitting layer, It can also function as such.

[0298] The quantum dot materials include colloidal quantum dot materials, alloy quantum dot materials, Core-shell type quantum dot materials, core type quantum dot materials, etc. can be used. , materials containing elements from groups 12 and 16, 13 and 15, or 14 and 16 Alternatively, cadmium, selenium, zinc, sulfur, phosphorus, indium, tellurium, Quantum dot materials containing elements such as lead, gallium, arsenic, and aluminum may also be used.

[0299] Materials that can be used for the coloring layer include metal materials, resin materials, pigments, and dyes. Examples of such materials include resin materials.

[0300] Materials that can be used for the light-shielding layer include carbon black, metal oxides, and multiple gold layers. In addition, the light-shielding layer may contain the material of the coloring layer. For example, a material used for a colored layer that transmits light of a certain color can be used. The present invention uses a laminated structure of a film containing the material and a film containing a material used for a colored layer that transmits light of another color. By using the same material for the colored layer and the light-shielding layer, it is possible to standardize the equipment and simplify the process. This is preferable because it allows simplification.

[0301] The connection layer between the FPC and the terminals is made of anisotropic conductive film (ACF). pic Conductive Film) and Anisotropic Conductive Paste (ACP) For example, a fluorotropic conductive paste can be used.

[0302] The above is a description of each component.

[0303] [Example of manufacturing method] An example of a method for manufacturing a display device using a flexible substrate will be described below.

[0304] Here, the display element, the circuit, the wiring, the electrodes, the insulating layer, and the optical components such as the colored layer and the light-shielding layer are The layers that contain the optical components are collectively called the element layer. For example, the element layer may contain a display element. In addition to the display element, wiring electrically connected to the display element, transistors used in pixels and circuits The semiconductor device may include an element such as a capacitor.

[0305] In addition, in this case, when the display element is completed (the manufacturing process is completed), the element layer is supported. A member that supports the substrate and has flexibility is called a substrate. This also includes extremely thin films, etc., with a thickness of 10 nm or more and 300 μm or less.

[0306] Representative methods for forming an element layer on a substrate having a flexible insulating surface include There are two methods as follows. One is to form an element layer directly on a flexible substrate. The other method is to form an element layer on a support substrate that is different from the flexible substrate. After that, the element layer is peeled off from the supporting substrate, and the element layer is transferred to the substrate. Although not described in detail, in addition to the above two methods, a device layer is formed on a non-flexible substrate. Alternatively, the substrate may be made flexible by thinning it by polishing or the like.

[0307] If the material constituting the substrate is heat resistant to the heat applied in the process of forming the element layer, It is preferable to form the element layer directly on the substrate, since the process is simplified. If the element layer is formed while the plate is fixed to the support substrate, the plate can be easily transported within and between devices. This is preferable because it is easier.

[0308] In addition, when a method of forming an element layer on a supporting substrate and then transferring the element layer to the substrate is used, the element layer is first A release layer and an insulating layer are laminated on a supporting substrate, and an element layer is formed on the insulating layer. The element layer is then transferred to the substrate by peeling the element layer from the support substrate. It is only necessary to select a material that causes peeling at the interface between the peeling layer and the insulating layer or within the peeling layer. In this method, a material having high heat resistance is used for a support substrate and a peeling layer, and thus an element layer is formed. This allows the upper limit of the temperature during the formation of the semiconductor device to be increased, forming a device layer having more reliable devices. This is preferable because it is possible.

[0309] For example, a layer containing a high melting point metal material such as tungsten as a peeling layer and a layer containing the metal material A layer containing an oxide is laminated and used. In addition, silicon oxide, silicon nitride, etc. are used as an insulating layer on the peeling layer. It is preferable to use a multi-layer structure including silicon, silicon oxynitride, silicon nitride oxide, etc. In this specification, an oxynitride is a material containing more oxygen than nitrogen as a component. Nitrogen oxide refers to a material that has a high nitrogen content compared to oxygen in its composition. Refers to the material.

[0310] The element layer and the support substrate can be separated by applying a mechanical force or by etching the separation layer. Examples include etching the surface or allowing a liquid to penetrate the peeled interface. Alternatively, the difference in thermal expansion between the two layers that form the peel interface can be utilized to heat or cool the material. The peeling may be performed by

[0311] When peeling begins, a starting point for peeling is first formed, and the peeling progresses from that starting point. The starting point of peeling is preferably a point where a part of the insulating layer or the peeling layer is locally heated by laser light or the like. and by physically cutting or penetrating a part of the insulating layer or peeling layer with a sharp object. It can be formed.

[0312] Furthermore, if peeling is possible at the interface between the support substrate and the insulating layer, there is no need to provide a peeling layer.

[0313] For example, glass is used as the support substrate, and an organic resin such as polyimide is used as the insulating layer. By doing so, it is possible to peel off the glass and the organic resin at the interface. The above organic resins can also be used as the substrate.

[0314] Alternatively, a heat generating layer is provided between a support substrate and an insulating layer made of an organic resin, and the heat generating layer is heated. The heat generating layer may be formed by applying a current to the heat generating layer and the insulating layer. Materials that generate heat when current flows through them, materials that generate heat when light is absorbed, and materials that generate heat when a magnetic field is applied. For example, the heat generating layer can be made of various materials such as The material to be used can be selected from the group consisting of semiconductors, metals, and insulators.

[0315] The above is a description of the example of the manufacturing method.

[0316] [Cross-sectional configuration example 2] FIG. 22 shows a schematic cross-sectional view of a touch panel having a partly different configuration from that shown in FIG. Note that explanations of parts that overlap with those described above will be omitted, and only differences will be explained.

[0317] The transistor 201 and the transistor 202 have a conductive layer functioning as their second gates. The layer 244 is provided between the insulating layer 213 and the insulating layer 214. As a result, the electric field strength applied to the semiconductor layer 242 can be increased compared to the configuration shown in FIG. This is preferable because it allows the voltage applied to the second gate to be reduced.

[0318] Moreover, the display element 204 shown in FIG. 22 is an example formed by a color-coded method. Specifically, the EL layer 222 that emits light of a different color is formed for each pixel of a different color. Further, outside the light-emitting region of the display element 204, an end portion of the EL layer 222 is connected to the second electrode 223. The EL layer 222 is formed by, for example, deposition using a metal mask, printing, or ink. It can be formed by a jet method or the like.

[0319] Although the entire EL layer 222 is illustrated in different colors here, the EL layer 222 is It is also possible to paint one or more of the multiple films separately and leave the rest unpainted. For example, it is possible to paint only the light-emitting layer and make the rest the same. Of the three types of light-emitting layers, red (R), green (G), and blue (B), the red light-emitting layer and the green light-emitting layer The light-emitting layer can be formed by painting separately, and the blue light-emitting layer and the other layers can be formed without painting separately. can.

[0320] In addition, in FIG. 22, the optical adjustment layer 224 and the colored layer 231 shown in FIG. 21 are not provided. An example is shown.

[0321] Note that the configuration of the transistor and the configuration of the display element 204 shown here are the same as those shown in FIG. The following cross-sectional configurations of transistors, display elements, etc. can be substituted. can.

[0322] [Cross-sectional configuration example 3] The touch panel shown in FIG. 23 has a touch sensor between a substrate 191 and a substrate 291. The touch panel shown in FIG. 23 is an in-cell type touch panel. With this configuration, the input device and the display panel are connected to the substrate 191. This allows for the creation of a thin touch panel.

[0323] The touch panel shown in FIG. 23 has a light-shielding layer 235 and an insulating layer 236 on the surface of the insulating layer 194 on the substrate 291 side. An edge layer 234, an insulating layer 161, etc. are provided in this order. The insulating layer 161 and the bridge electrode An insulating layer 233 is provided to cover the insulating layers 334 and 335. An optical layer 232 and a color layer 231 are provided.

[0324] The insulating layer 233 and the insulating layer 234 function as a planarization film. 3 and the insulating layer 234 may not be provided if they are not required.

[0325] The light blocking layer 235 is disposed on the visible side of the electrodes that constitute the touch sensor. This prevents external light from being reflected by the electrodes, etc., and the reflected light from being visible to the user. This makes it possible to realize a touch panel with improved visibility.

[0326] [Cross-sectional configuration example 4] FIG. 24 shows the cross-sectional configuration example of the transistor 201 and the transistor 20 2 and the transistor 203 are top-gate transistors. An example is shown.

[0327] Each transistor has a semiconductor layer 261 and is formed on the semiconductor layer 261 via an insulating layer 211. A conductive layer 241 that functions as a gate is provided. The slit 262 may have a recessed area 262 .

[0328] The conductive layer 243 functioning as a source or a drain of the transistor is formed on the insulating layer 213. through openings provided in the insulating layer 213, the insulating layer 212, and the insulating layer 211. It is electrically connected to region 262 .

[0329] In addition, in FIG. 24, the capacitor element 205 is formed by processing the same semiconductor film as the semiconductor layer 261. A laminated structure of a layer formed by processing the same conductive film as the conductive layer 241, an insulating layer 211, and a layer formed by processing the same conductive film as the conductive layer 241. Here, a part of the semiconductor film of the capacitor 205 includes a transistor It is preferable that a region 263 having a higher conductivity than the region in which the channel is formed is formed. It is nice.

[0330] The regions 262 and 263 are smaller than the regions in which the channels of transistors are formed, for example. It can be a region containing a lot of impurities, a region with a high carrier concentration, or a region with low crystallinity. This can be done.

[0331] The impurities that have the effect of increasing the electrical conductivity depend on the type of semiconductor used in the semiconductor layer 261. The typical gases are helium, neon, argon, phosphorus, boron, etc. hydrogen, lithium, sodium, magnesium, aluminum, nitrogen, fluorine, potassium Other examples include titanium, iron, nickel, copper, zinc, silver, indium, etc. Sodium, tin, etc. also act as impurities that affect the conductivity of semiconductors. In the case of silicon, phosphorus is an element that can give n-type conductivity, while boron is an element that can give n-type conductivity. These are elements that can impart p-type conductivity.

[0332] [Cross-sectional configuration example 5] Figure 25 shows a cross section of the FPC mounted on only one side of the board, as shown in Figure 19. 1 shows an example configuration.

[0333] The connection portion 385 includes a wiring 342 provided on the substrate 191 side and a The wiring 207 is electrically connected via a connector 386 .

[0334] The connector 386 may be, for example, a conductive particle. For this purpose, it is possible to use particles of organic resin or silica coated with a metal material. It is preferable to use nickel or gold as the metal material because it is possible to reduce the contact resistance. Particles coated with layers of two or more metal materials, such as nickel coated with gold, are It is preferable to use a material that is elastically deformable or plastically deformable as the connector 386. At this time, the conductive particles are preferably in a shape that is crushed in the vertical direction as shown in FIG. This may result in a connection between the connection body 386 and the conductive layer electrically connected thereto. The contact area is increased, contact resistance is reduced, and problems such as poor contact are prevented. .

[0335] The connector 386 is preferably disposed so as to be covered with the adhesive layer 220. For example, The connecting members 386 may be dispersed in the previous adhesive layer 220. 25, the adhesive layer 220 is placed on the display element 204. For example, light emitting elements with hollow sealing structure, The present invention can be similarly applied to any device having an adhesive layer 220 disposed around the periphery, such as a liquid crystal display device. can.

[0336] The above is a description of the cross-sectional configuration example.

[0337] This embodiment may be combined, at least in part, with other embodiments described in this specification. It can be implemented in combination. [Explanation of symbols]

[0338] 10 Electronic equipment 11 Display Panel 11a part 11b part 11c part 12 Hinge 12a Shaft 12b Shaft 13 Slide rail 13a Slide rail 13b Slide rail 14 Hinge 14a Shaft 14b Shaft 15 Hinge 15a Shaft 15b Shaft 21 Case 22 Case 23 Case 41 FPC 42 Printed Circuit Board 43 Battery 45 Bands 46 Bands 47 Case Button 48 Battery 51 Leaf spring 52 Screw 53 Spring part 54 Notch 61 Arithmetic section 62 Bus Line 63 Touch Panel 64 Storage device 71 Display Controller 72 Touch Sensor Controller 73 Battery Controller 74 Power receiving section 75 Battery Module 75a Battery Module 75b Battery module 76 Sound Controller 77 Audio input section 78 Audio output section 81 Communication Module 82 Antenna 83 Attitude detection unit 84 Shape detection section 85 External Interface 86 Camera Module 87 Vibration Module 88 Sensors 91a Vibration element 91b Vibration element 91c Vibration element 91d Vibration element 92 Elastic Body 95 Table 96 Audio 100 Touch Panel 101 Substrate 102 Display section 103 Circuit 104 Wiring 106 Connection 109 Connection Layer 146 Conductive Film 147 Conductive Film 148 Conductive Film 149 Nanowires 150 Input Device 151 Conductive layer 152 Conductive layer 153 Conductive Layer 155 Wiring 156 Wiring 157 FPC 158 IC 160 Substrate 161 Insulating Layer 167 FPC 168 IC 169 Connection 191 Substrate 192 Adhesive layer 194 Insulating Layer 201 Transistor 202 Transistor 203 Transistor 204 Display element 205 Capacitive element 206 Connection 207 Wiring 209 Connection Layer 211 Insulating layer 212 Insulating layer 213 Insulating Layer 214 Insulating layer 215 Insulating Layer 216 Spacer 220 Adhesive layer 221 Electrode 222 EL layer 223 Electrode 224 Optical adjustment layer 230 Adhesive layer 231 Colored layer 232 Light blocking layer 233 Insulating Layer 234 Insulating layer 235 Light blocking layer 241 Conductive Layer 242 Semiconductor layer 243 Conductive Layer 244 Conductive Layer 261 Semiconductor Layer 262 areas 263 areas 291 Substrate 292 Adhesive layer 294 Insulating Layer 330 Substrate 332 Electrode 333 Electrode 334 Bridge Electrode 342 Wiring 350 FPC 373 FPC 381 Display section 382 Drive circuit 385 Connection 386 Connectors 387 Intersection 601 Pulse voltage output circuit 602 Current Detection Circuit 603 capacity

Claims

[Claim 1] An electronic device having a flexible display panel, the display panel has a first portion, a second portion, and a third portion; the third portion is flexible and is located between the first portion and the second portion; the display panel has a first display surface located in the first portion, a second display surface located in the second portion, and a third display surface located in the third portion, the display panel is transformable between a first configuration and a second configuration; The first form is a form in which the third portion is flat, and the first display surface, the second display surface, and the third display surface are positioned parallel to each other, The second form is a form in which the third portion has a first curved portion in which a part of the third display surface is curved in a convex shape, and a second curved portion in which another part of the third display surface is curved in a concave shape, and a part of the first display surface and a part of the second display surface overlap each other in parallel, When the display panel is in the second form, the third portion is deformed such that a width between the first curved portion and the second curved portion changes, thereby changing a relative position between the first portion and the second portion. electronic equipment.

Images