Thermal management circuit

Abstract

To provide a thermal management circuit capable of easily adjusting heat exchange efficiency of a heat transfer medium.SOLUTION: A thermal management circuit 10 comprises: a battery circuit 100 (a low temperature circuit 200) (a devices layout circuit) through which a heat transfer medium heat-exchanged with a battery 110 (eAxel 210)(a temperature control target device) flows; a refrigeration cycle 400 connected to a chiller 410 and a water-cooled condenser 440; a heat exchanging device 300 in which heat is exchanged between outside air and the heat transfer medium; and a switching device 500. The heat exchanging device 300 includes an LT radiator 310 (a first heat exchanger), an HT radiator 320 (a second heat exchanger) and an overcooling condenser 330 (a third heat exchanger) installed separately from each other. A connection state between each of the LT radiator 310, the HT radiator 320, and the overcooling condenser 330 and each of the battery circuit 100 (the low temperature circuit 200) and the refrigeration cycle 400 is switched by the switching device 500.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present disclosure relates to thermal management circuits. [Background technology]

[0002] JP 2020-185880 A (Patent Document 1) discloses a coolant circuit including a first heat exchanger and a second heat exchanger in which heat exchange between outside air and coolant is performed. The coolant circuit is configured to be switchable between a circuit state in which the first heat exchanger and the second heat exchanger are connected in series and a circuit state in which the first heat exchanger and the second heat exchanger are connected in parallel. The heat exchange efficiency of the heat medium (coolant) is adjusted by switching the connection state between the first heat exchanger and the second heat exchanger. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2020-185880 A Summary of the Invention [Problem to be solved by the invention]

[0004] In the coolant circuit of Patent Document 1, as described above, the heat exchange efficiency of the heat medium is adjusted by switching the connection state between the first heat exchanger and the second heat exchanger. In contrast, it is desired to make it possible to adjust the heat exchange efficiency of the heat medium more easily.

[0005] The present disclosure has been made to solve the above-mentioned problems, and has an object to provide a thermal management circuit that can easily adjust the heat exchange efficiency of a heat medium. [Means for solving the problem]

[0006] A thermal management circuit according to one aspect of the present disclosure is a thermal management circuit mounted on an electric device, and includes an equipment layout circuit through which a heat medium flows to be heat-exchanged with a temperature-adjusted equipment, which is an equipment to be temperature-adjusted, a refrigeration cycle connected to a chiller and a water-cooled condenser, a heat exchanger in which heat exchange between outside air and the heat medium occurs, and a switching device capable of switching a flow path of the heat medium. The heat exchanger includes a first heat exchanger, a second heat exchanger, and a third heat exchanger that are provided separately from each other. The connection states of each of the first heat exchanger, the second heat exchanger, and the third heat exchanger with the equipment layout circuit and each of the refrigeration cycles are switched by the switching device.

[0007] In the thermal management circuit according to one aspect of the present disclosure, as described above, the connection states of each of the first heat exchanger, the second heat exchanger, and the third heat exchanger with the equipment layout circuit and the refrigeration cycle are switched by the switching device. As a result, since the heat exchange device is provided with three heat exchangers, the combination of heat exchangers used for heat exchange can be made more diverse than when there are two heat exchangers. As a result, it is possible to easily adjust the heat exchange efficiency by the heat exchange device. This makes it possible to easily adjust the temperature of the temperature-adjusted equipment in the equipment layout circuit, and to easily meet air conditioning demands through the refrigeration cycle.

[0008] In the thermal management circuit according to the above aspect, the third heat exchanger is preferably connected to the refrigeration cycle. The water-cooled condenser includes a condenser that changes the heat medium from a gas phase to a liquid phase. In the third heat exchanger, heat is exchanged between the heat medium that has been changed to the liquid phase in the condenser and outside air. With this configuration, the third heat exchanger can easily exchange heat between the outside air and the refrigerant of the refrigeration cycle.

[0009] In the thermal management circuit according to the above aspect, the water-cooled condenser preferably includes a condenser that changes the heat medium from a gas phase to a liquid phase, and a supercooler that cools the heat medium that has been changed to the liquid phase in the condenser. The condenser and the supercooler are connected to the switching device by a first flow path and a second flow path, respectively. Each of the first flow path and the second flow path has a first direction flow path in which the heat medium flows toward the switching device, and a second direction flow path in which the heat medium flows in a direction opposite to the first direction flow path. With this configuration, the heat medium can be exchanged independently in the closed circuit that passes through the condenser and the first flow path, and in the closed circuit that passes through the supercooler and the second flow path. As a result, the heat exchange efficiency of the heat medium can be adjusted more easily.

[0010] In the thermal management circuit according to the above aspect, the water-cooled condenser preferably includes a condenser that changes the heat medium from a gas phase to a liquid phase, and a supercooler that cools the heat medium that has been changed to the liquid phase in the condenser. The condenser and the supercooler are connected to the switching device by a third flow path and a fourth flow path, respectively. The third flow path is configured by a third direction flow path through which the heat medium flows from the condenser to the switching device. The fourth flow path is configured by a fourth direction flow path through which the heat medium flows from the switching device to the supercooler. With this configuration, the configuration of the thermal management circuit can be simplified compared to a case in which each of the third flow path and the fourth flow path is configured by a plurality of flow paths.

[0011] In the heat management circuit according to the above aspect, the first heat exchanger and the third heat exchanger are preferably disposed upstream of the second heat exchanger in the flow direction of the outside air flowing into the heat exchange device. With this configuration, the outside air passes through the first heat exchanger and the third heat exchanger before passing through the second heat exchanger, so that the temperature of the outside air passing through the first heat exchanger and the third heat exchanger can be made relatively low. As a result, the amount of heat released by the heat medium in the first heat exchanger and the third heat exchanger can be increased. Effect of the Invention

[0012] According to the present disclosure, the heat exchange efficiency of the heat medium can be easily adjusted by using the first to third heat exchangers. [Brief description of the drawings]

[0013] [Figure 1] 1 is a diagram showing a configuration of a thermal management system according to a first embodiment. [Diagram 2] FIG. 2 is a diagram showing a circuit pattern 1A of the thermal management circuit according to the first embodiment. [Diagram 3] FIG. 1B is a diagram showing a circuit pattern 1B of the thermal management circuit according to the first embodiment. [Figure 4] FIG. 1C is a diagram showing a circuit pattern 1C of the thermal management circuit according to the first embodiment. [Diagram 5] FIG. 2 is a diagram showing a circuit pattern 1D of the thermal management circuit according to the first embodiment. [Figure 6] FIG. 2 is a diagram showing a circuit pattern 1E of the thermal management circuit according to the first embodiment. [Figure 7] 4 is a diagram showing the correspondence between various temperature conditions and circuit patterns in the thermal management circuit according to the first embodiment. FIG. [Figure 8] FIG. 11 is a diagram showing a configuration of a thermal management system according to a second embodiment. [Figure 9] FIG. 2 shows a circuit pattern 2A of a thermal management circuit according to a second embodiment. [Figure 10] FIG. 11 is a diagram showing a circuit pattern 2B of a thermal management circuit according to a second embodiment. [Figure 11] FIG. 13 shows a circuit pattern 2C of a thermal management circuit according to a second embodiment. [Figure 12] FIG. 11 shows a circuit pattern 2D of a thermal management circuit according to a second embodiment. [Figure 13] FIG. 11 is a diagram showing a circuit pattern 2E of a thermal management circuit according to a second embodiment. [Figure 14] FIG. 11 is a diagram showing the correspondence between various temperature conditions and circuit patterns in a thermal management circuit according to a second embodiment. [Figure 15] FIG. 11 is a diagram showing a configuration of a thermal management system according to a third embodiment. [Figure 16] FIG. 13 shows a circuit pattern 3A of a thermal management circuit according to a third embodiment. [Figure 17] FIG. 13 shows a circuit pattern 3B of the thermal management circuit according to the third embodiment. [Figure 18] FIG. 13 shows a circuit pattern 3C of a thermal management circuit according to a third embodiment. [Figure 19] FIG. 13 shows a circuit pattern 3D of a thermal management circuit according to a third embodiment. [Figure 20] FIG. 13 shows a circuit pattern 3E of a thermal management circuit according to a third embodiment. [Figure 21] FIG. 11 is a diagram showing the correspondence between various temperature conditions and circuit patterns in a thermal management circuit according to a third embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. In the drawings, the same or corresponding parts are denoted by the same reference characters, and the description thereof will not be repeated.

[0015] [First embodiment] Fig. 1 is a diagram showing an overall configuration of a thermal management system 1 including a thermal management circuit 10 according to a first embodiment. The thermal management system 1 includes the thermal management circuit 10, an electronic control unit (ECU) 80, and an HMI (Human Machine Interface) 90. The thermal management system 1 is mounted on, for example, an electric vehicle 1a (see Fig. 2). The electric vehicle 1a is an example of an "electrical device" in the present disclosure.

[0016] The thermal management circuit 10 includes a battery circuit 100, a low-temperature circuit 200, a heat exchange device 300, a refrigeration cycle 400, a switching device 500, a heater core 600, and a water pump 700. In this specification, the heat medium flowing in the refrigeration cycle 400 is referred to as a "refrigerant," and the heat medium flowing in the other circuits is referred to as a "coolant." Each of the refrigerant and the coolant is an example of the "heat medium" in the present disclosure.

[0017] The battery circuit 100 connects the chiller 410 and the switching device 500, which will be described later. The battery circuit 100 includes a battery 110 and a water pump 120. The battery 110 is a device that is subject to temperature adjustment (for example, cooling). A coolant that exchanges heat with the battery 110 flows through the battery circuit 100. The battery 110 stores electric power used for driving the electric vehicle 1a, etc. The water pump 120 is disposed downstream of the battery 110 and upstream of the chiller 410 in the flow direction of the coolant flowing through the battery circuit 100. The battery 110 and the battery circuit 100 are examples of a "temperature-adjusted device" and a "device arrangement circuit," respectively, of the present disclosure.

[0018] The low-temperature circuit 200 includes an eAxle 210 and a water pump 220. In the low-temperature circuit 200, a coolant flows that is heat exchanged with the eAxle 210. The eAxle 210 includes a PCU (Power Control Unit) and an oil cooler, not shown. The eAxle 210 is a device that is subject to temperature adjustment (for example, cooling). The water pump 220 is disposed upstream of the eAxle 210 in the flow direction of the coolant that flows through the low-temperature circuit 200. The eAxle 210 and the low-temperature circuit 200 are examples of a "temperature-adjusted device" and a "device arrangement circuit" of the present disclosure, respectively.

[0019] The heat exchange device 300 includes a LT (Low Temperature) radiator 310, a HT (High Temperature) radiator 320, and a supercooling condenser 330. The LT radiator 310, the HT radiator 320, and the supercooling condenser 330 are provided separately (independently) from each other. In each of the LT radiator 310 and the HT radiator 320, heat exchange is performed between the outside air and the coolant. In the supercooling condenser 330, heat exchange is performed between the outside air and the refrigerant of the refrigeration cycle 400. The refrigerant of the refrigeration cycle 400 is more effectively cooled because it is directly heat exchanged with the outside air. The supercooling condenser 330 is connected to the refrigeration cycle 400. The LT radiator 310 and the HT radiator 320 are examples of the "first heat exchanger" and the "second heat exchanger" of the present disclosure, respectively. The supercooling condenser 330 is an example of the "third heat exchanger" of the present disclosure.

[0020] The refrigeration cycle 400 includes a chiller 410 , an evaporator 420 , a compressor 430 , a water-cooled condenser 440 , an expansion valve 450 , an expansion valve 460 , a three-way valve 470 , and a three-way valve 480 .

[0021] The three-way valve 470 and the three-way valve 480 are connected by a flow path 475. The three-way valve 470 and the three-way valve 480 are configured to be switchable between flowing the refrigerant from the water-cooled condenser 440 to the supercooling condenser 330, or flowing the refrigerant through the flow path 475 so as not to flow the refrigerant to the supercooling condenser 330.

[0022] The chiller 410 is connected to each of the refrigeration cycle 400 and the battery circuit 100. Thus, in the chiller 410, heat exchange occurs between the refrigerant flowing through the refrigeration cycle 400 and the cooling liquid flowing through the battery circuit 100.

[0023] The refrigerant (gas phase refrigerant or liquid phase refrigerant) circulating through the refrigeration cycle 400 flows through one or both of a first path of the compressor 430-water-cooled condenser 440-subcooling condenser 330 (or flow path 475)-expansion valve 460-evaporator 420-compressor 430 and a second path of the compressor 430-water-cooled condenser 440-subcooling condenser 330 (or flow path 475)-expansion valve 450-chiller 410-compressor 430.

[0024] The water-cooled condenser 440 includes a condenser section 441 and a liquid storage section 442. The condenser section 441 condenses the high-temperature, high-pressure gas refrigerant pumped from the compressor 430 to change it into a liquid refrigerant. The condenser section 441 also exchanges heat between the cooling liquid from the switching device 500 and the liquid refrigerant. The liquid storage section 442 separates the liquid-phase refrigerant that has passed through the condenser section 441 into gas and liquid. The supercooling condenser 330 exchanges heat between the liquid-phase refrigerant that has passed through the liquid storage section 442 and outside air.

[0025] The switching device 500 is configured to be able to switch the flow path of the heat medium (coolant). The switching device 500 has ports P1 to P16. The port P1 is an outlet port through which the coolant flows out toward the LT radiator 310. The port P2 is an inlet port through which the coolant flows in from the LT radiator 310. No flow path is connected to either of the ports P3 or P4. The port P5 is an outlet port through which the coolant flows out toward the HT radiator 320. The port P6 is an inlet port through which the coolant flows in from the HT radiator 320. The port P7 is an outlet port through which the coolant flows out toward the heater core 600. The port P8 is an inlet port through which the coolant flows in from the heater core 600.

[0026] The port P9 is an outlet port that causes the coolant to flow out toward the water pump 220 (eAxle 210). The port P10 is an inlet port into which the coolant flows in from the eAxle 210. The port P11 is an outlet port that causes the coolant to flow out toward the battery 110. The port P12 is an inlet port into which the coolant flows from the chiller 410 that has circulated through the battery circuit 100. The port P13 is an inlet port into which the coolant flows in from the water pump 700 that is provided between the condenser 441 and the switching device 500. The port P14 is an outlet port that causes the coolant to flow out toward the condenser 441. The ports P13 and P14 are connected to the condenser 441 by the flow paths 710 and 720, respectively. The coolant that flows out of the condenser 441 flows into the switching device 500 from the port P13 through the flow path 710. The cooling liquid flowing out from port P14 flows into condenser section 441 through flow path 720. The cooling liquid flowing into condenser section 441 is heat exchanged with the refrigerant of refrigeration cycle 400 in condenser section 441, and then flows out toward water pump 700. No flow path is connected to ports P15 and P16. Note that flow paths 710 and 720 are each an example of a "first flow path" in the present disclosure. Also, flow paths 710 and 720 are each an example of a "first direction flow path" and a "second direction flow path" in the present disclosure.

[0027] The ECU 80 controls the thermal management circuit 10. The ECU 80 includes a processor 81, a memory 82, a storage 83, and an interface 84. The ECU 80 controls the states of the switching device 500, the three-way valve 470, and the three-way valve 480, and adjusts the flow rate of each water pump, etc.

[0028] Here, it is desired to make it possible to more easily adjust the heat exchange efficiency of the heat medium (coolant, refrigerant) in a conventional heat management circuit.

[0029] Therefore, in the thermal management circuit 10 of the first embodiment, the connection states of the LT radiator 310, the HT radiator 320, and the subcooling condenser 330 to the battery circuit 100, the low temperature circuit 200, and the refrigeration cycle 400 are switched by a switching device 500. Specifically, the thermal management circuit 10 can have the circuit patterns shown in the following Figs. 2 to 6.

[0030] FIG. 2 is a diagram showing a circuit pattern 1A of the thermal management circuit 10. In the example shown in FIG. 2, the eAxle 210 is connected to the LT radiator 310 via the switching device 500. Also, the condenser unit 441 is connected to the HT radiator 320 via the switching device 500. Also, the ports P11 and P12 (see FIG. 1) of the switching device 500 are closed, so that the coolant does not flow through the chiller 410. Also, the ports P7 and P8 (see FIG. 1) of the switching device 500 are closed, so that the coolant does not flow through the heater core 600. Also, the three-way valve 470 and the three-way valve 480 are each controlled so that the refrigerant of the refrigeration cycle 400 flows through the supercooling condenser 330. In addition, in the circuit pattern 1A, the HT radiator 320 and the LT radiator 310 are separated.

[0031] 2, the LT radiator 310 and the subcooling condenser 330 are each disposed upstream of the HT radiator 320 in the flow direction of outside air flowing into the heat exchange device 300. Specifically, the outside air flows into the inside of the vehicle from a grill 1b provided at the front end of the electric vehicle 1a. Therefore, the LT radiator 310 and the subcooling condenser 330 are each disposed forward of the HT radiator 320 in the front-rear direction of the electric vehicle 1a. Also, when viewed from the front of the electric vehicle 1a, the LT radiator 310 and the subcooling condenser 330 may each be disposed at a position where at least a portion of them does not overlap with the HT radiator 320. This makes it possible to prevent the outside air warmed by passing through the LT radiator 310 and the subcooling condenser 330 from passing through the HT radiator 320.

[0032] Fig. 3 is a diagram showing a circuit pattern 1B of the thermal management circuit 10. In the example shown in Fig. 3, the eAxle 210 and the condenser 441 are each connected to the LT radiator 310 and the HT radiator 320 via a switching device 500. The chiller 410 and the heater core 600 are the same as those in Fig. 2. The three-way valve 470 and the three-way valve 480 are each controlled so that the refrigerant of the refrigeration cycle 400 flows through the subcooling condenser 330. In the circuit pattern 1B, the HT radiator 320 and the LT radiator 310 are integrated.

[0033] 4 is a diagram showing a circuit pattern 1C of the thermal management circuit 10. In the example shown in FIG. 4, the eAxle 210 and the chiller 410 are each connected to the LT radiator 310 and the HT radiator 320 via the switching device 500. The condenser section 441 is connected to the heater core 600 via the switching device 500. The three-way valve 470 and the three-way valve 480 are each controlled so that the refrigerant of the refrigeration cycle 400 flows through the flow path 475 without flowing through the subcooling condenser 330. In the circuit pattern 1C, the HT radiator 320 and the LT radiator 310 are integrated.

[0034] FIG. 5 is a diagram showing a circuit pattern 1D of the thermal management circuit 10. In the example shown in FIG. 5, the chiller 410 is connected to the LT radiator 310 and the HT radiator 320 via the switching device 500. The condenser unit 441 is connected to the heater core 600 via the switching device 500. The switching device 500 is controlled so that the eAxle 210 (low-temperature circuit 200) is separated from the other circuits and becomes independent. The three-way valve 470 and the three-way valve 480 are each controlled so that the refrigerant of the refrigeration cycle 400 flows through the flow path 475 without flowing through the supercooling condenser 330. In the circuit pattern 1D, the HT radiator 320 and the LT radiator 310 are integrated.

[0035] FIG. 6 is a diagram showing a circuit pattern 1E of the thermal management circuit 10. In the example shown in FIG. 6, the chiller 410 is connected to the HT radiator 320 via the switching device 500. The eAxle 210 is connected to the LT radiator 310 via the switching device 500. The condenser 441 is connected to the heater core 600 via the switching device 500. The three-way valve 470 and the three-way valve 480 are each controlled so that the refrigerant of the refrigeration cycle 400 flows through the flow path 475 without flowing through the supercooling condenser 330. In the circuit pattern 1E, the HT radiator 320 and the LT radiator 310 are separated.

[0036] FIG. 7 is a diagram showing the circuit patterns of the thermal management circuit 10 corresponding to each of a plurality of temperature conditions. For example, in summer, the circuit pattern is switched based on the cooling demand of the eAxle 210 and the heat dissipation demand of the refrigerant (cooling demand of the battery 110). When the cooling demand of the eAxle 210 is high and the heat dissipation demand of the refrigerant is high, the thermal management circuit 10 is switched to the circuit pattern 1A (see FIG. 2). When the cooling demand of the eAxle 210 is low and the heat dissipation demand of the refrigerant is high, the thermal management circuit 10 is switched to the circuit pattern 1B (see FIG. 3). When the cooling demand of the eAxle 210 is high and the heat dissipation demand of the refrigerant is low, the thermal management circuit 10 is switched to the circuit pattern 1A. When the cooling demand of the eAxle 210 is low and the heat dissipation demand of the refrigerant is low, the thermal management circuit 10 is switched to the circuit pattern 1A. Note that a case where the cooling requirement for eAxle 210 is high may be, for example, a case where the temperature of the coolant flowing through low-temperature circuit 200 is equal to or higher than a predetermined value, or a case where the temperature of eAxle 210 is equal to or higher than a predetermined value. Also, a case where the heat dissipation requirement for the refrigerant is high may be, for example, a case where the temperature of the coolant flowing through battery circuit 100 is equal to or higher than a predetermined value, or a case where the temperature of battery 110 is equal to or higher than a predetermined value.

[0037] In addition, in winter, the circuit pattern is switched based on the cooling request of the eAxle 210 and the heat absorption request of the refrigerant. For example, when cooling of the eAxle 210 is required (for example, warming up of the eAxle 210 is completed) and the heat absorption request of the refrigerant is high, the heat management circuit 10 is switched to circuit pattern 1C (see FIG. 4). When the eAxle 210 is cold (i.e., there is no cooling request) and the heat absorption request of the refrigerant is high, the heat management circuit 10 is switched to circuit pattern 1D (see FIG. 5). When cooling of the eAxle 210 is required and the heat absorption request of the refrigerant is low, the heat management circuit 10 is switched to circuit pattern 1E (see FIG. 6). When the eAxle 210 is cold and the heat absorption request of the refrigerant is low, the heat management circuit 10 is switched to circuit pattern 1D. Note that the case where there is a demand for cooling the eAxle 210 may be, for example, a case where the warm-up of the eAxle 210 has been completed as described above, or a case where the temperature of the eAxle 210 (coolant in the low-temperature circuit 200) is equal to or higher than a predetermined value. Also, the case where there is a high demand for refrigerant to absorb heat may be a case where a heat pump heating output of equal to or higher than a predetermined value is demanded.

[0038] As described above, in the first embodiment, the connection state between each of the LT radiator 310, the HT radiator 320, and the supercooling condenser 330 and each of the battery circuit 100, the low-temperature circuit 200, and the refrigeration cycle 400 is switched by the switching device 500. This allows heat exchange of the heat medium (coolant, refrigerant) using the LT radiator 310, the HT radiator 320, and the supercooling condenser 330 according to the temperature conditions required by each of the battery circuit 100, the low-temperature circuit 200, and the refrigeration cycle 400. As a result, the heat exchange amount (efficiency) of the heat medium can be easily adjusted. As a result, the cooling performance of the battery 110, the eAxel 210, etc. can be improved, and the running performance of the electric vehicle 1a and the charging performance of the battery 110 can be improved. In addition, the heat absorption performance (heat pump heating performance) can be improved, and the cruising distance of the electric vehicle 1a can be increased.

[0039] Moreover, each of the LT radiator 310 and the subcooling condenser 330 is disposed upstream of the HT radiator 320 in the flow direction of the outside air flowing into the heat exchanger 300. Here, a relatively low upper limit temperature value (for example, 65°C) is set for the coolant of the low-temperature circuit 200 that exchanges heat with the eAxle 210. Therefore, by disposing the LT radiator 310, which mainly cools the eAxle 210, upstream in the flow direction of the outside air, it is possible to prevent outside air with a temperature equal to or higher than the above-mentioned lower limit temperature value from flowing through the LT radiator 310. As a result, the temperature of the outside air flowing through the LT radiator 310 becomes relatively low, so that the air-water temperature difference in the LT radiator 310 can be made larger, and the same cooling performance can be achieved with a smaller heat exchange area, so that the LT radiator 310 can be made smaller. As a result, the subcooling condenser 330 can be disposed in the space formed by making the LT radiator 310 smaller.

[0040] [Second embodiment] Next, a second embodiment of the present disclosure will be described with reference to Fig. 8 to Fig. 14. In the second embodiment, a water-cooled condenser 440A is provided with a supercooling unit 443. The same components as those in the first embodiment are denoted by the same reference numerals as those in the first embodiment, and the description will not be repeated.

[0041] 8 is a diagram showing an overall configuration of a thermal management system 2 including a thermal management circuit 20 according to a second embodiment. The thermal management circuit 20 differs from the thermal management circuit 10 of the first embodiment in that the thermal management circuit 20 includes a refrigeration cycle 400A instead of the refrigeration cycle 400 and a heat exchanger 300A instead of the heat exchanger 300.

[0042] The refrigeration cycle 400A differs from the refrigeration cycle 400 of the first embodiment in that it includes a water-cooled condenser 440A instead of the water-cooled condenser 440. The water-cooled condenser 440A includes a condenser section 441, a liquid storage section 442, and a supercooling section 443. The condenser section 441, the liquid storage section 442, and the supercooling section 443 are connected in series to each other in the refrigeration cycle 400A (in the flow path of the refrigerant flowing through the refrigeration cycle 400A). The refrigerant in the refrigeration cycle 400A flows through the condenser section 441, the liquid storage section 442, and the supercooling section 443 in this order. The supercooling section 443 cools the refrigerant that has been changed to a liquid phase in the condenser section 441 by heat exchange with the cooling liquid flowing through the supercooling section 443. The refrigerant that has flowed to the supercooling section 443 flows toward the expansion valves 450 and 460.

[0043] The heat exchange device 300A differs from the heat exchange device 300 of the first embodiment in that it includes an HT sub-radiator 340 instead of the subcooling condenser 330. The HT sub-radiator 340 is disposed in the same position as the subcooling condenser 330. The heat management circuit 30 has excellent heat absorption performance due to the provision of three radiators. The HT sub-radiator 340 is an example of the "third heat exchanger" of the present disclosure.

[0044] The port P15 of the switching device 500 is an inlet port into which the cooling liquid flows in from the supercooling unit 443. The port P15 and the supercooling unit 443 are connected by a flow path 730. The port P16 of the switching device 500 is an outlet port from which the cooling liquid flows out toward the supercooling unit 443. The port P16 and the supercooling unit 443 are connected by a flow path 740. Each of the flow paths 730 and 740 is an example of a "second flow path" in the present disclosure. The flow paths 730 and 740 are examples of a "first direction flow path" and a "second direction flow path" in the present disclosure, respectively.

[0045] The port P3 of the switching device 500 is an outlet port through which the coolant flows out toward the HT sub-radiator 340. The port P4 of the switching device 500 is an inlet port through which the coolant from the HT sub-radiator 340 flows in.

[0046] FIG. 9 is a diagram showing a circuit pattern 2A of the thermal management circuit 20. In the example shown in FIG. 9, the eAxle 210 is connected to the LT radiator 310 via the switching device 500. The condensation unit 441 is connected to the HT radiator 320 via the switching device 500. The supercooling unit 443 is connected to the HT sub-radiator 340 via the switching device 500. The ports P11 and P12 (see FIG. 8) of the switching device 500 are closed, so that the coolant does not flow through the chiller 410. The ports P7 and P8 (see FIG. 8) of the switching device 500 are closed, so that the coolant does not flow through the heater core 600. In the circuit pattern 2A, the HT radiator 320, the LT radiator 310, and the HT sub-radiator 340 are separated.

[0047] Fig. 10 is a diagram showing a circuit pattern 2B of the thermal management circuit 20. In the example shown in Fig. 10, the eAxle 210 and the condenser unit 441 are each connected to the LT radiator 310 and the HT radiator 320 via a switching device 500. The subcooling unit 443 is connected to the HT sub-radiator 340 via a switching device 500. The chiller 410 and the heater core 600 are the same as those in Fig. 9. In the circuit pattern 2B, the HT radiator 320 and the LT radiator 310 are integrated.

[0048] Fig. 11 is a diagram showing a circuit pattern 2C of the thermal management circuit 20. In the example shown in Fig. 11, the eAxle 210 and the chiller 410 are each connected to the LT radiator 310, the HT radiator 320, and the HT sub-radiator 340 via a switching device 500. The condenser section 441 and the subcooling section 443 are each connected to the heater core 600 via the switching device 500. In the circuit pattern 2C, the HT radiator 320, the LT radiator 310, and the HT sub-radiator 340 are integrated.

[0049] Fig. 12 is a diagram showing a circuit pattern 2D of the thermal management circuit 20. In the example shown in Fig. 12, the chiller 410 is connected to the LT radiator 310, the HT radiator 320, and the HT sub-radiator 340 via the switching device 500. The condenser section 441 and the subcooling section 443 are each connected to the heater core 600 via the switching device 500. The switching device 500 is controlled so that the eAxle 210 (low-temperature circuit 200) is separated from the other circuits and becomes independent. In the circuit pattern 2D, the HT radiator 320, the LT radiator 310, and the HT sub-radiator 340 are integrated.

[0050] Fig. 13 is a diagram showing a circuit pattern 2E of the thermal management circuit 20. In the example shown in Fig. 13, the chiller 410 is connected to the HT radiator 320 and the HT sub-radiator 340 via the switching device 500. The eAxle 210 is connected to the LT radiator 310 via the switching device 500. Each of the condenser unit 441 and the subcooler unit 443 is connected to the heater core 600 via the switching device 500. In the circuit pattern 2E, the HT radiator 320 and the HT sub-radiator 340 are integrated.

[0051] 14 is a diagram showing circuit patterns of the heat management circuit 20 corresponding to each of a plurality of temperature conditions. For example, in summer, when the cooling demand of the eAxle 210 is high and the heat dissipation demand of the refrigerant is high, the heat management circuit 20 is switched to the circuit pattern 2A (see FIG. 9). When the cooling demand of the eAxle 210 is low and the heat dissipation demand of the refrigerant is high, the heat management circuit 20 is switched to the circuit pattern 2B (see FIG. 10). When the cooling demand of the eAxle 210 is high and the heat dissipation demand of the refrigerant is low, the heat management circuit 20 is switched to the circuit pattern 2A. When the cooling demand of the eAxle 210 is low and the heat dissipation demand of the refrigerant is low, the heat management circuit 20 is switched to the circuit pattern 2A.

[0052] Also, in winter, when cooling of the eAxle 210 is required and the heat absorption demand of the refrigerant is high, the heat management circuit 20 is switched to circuit pattern 2C (see FIG. 11). When the eAxle 210 is cold and the heat absorption demand of the refrigerant is high, the heat management circuit 20 is switched to circuit pattern 2D (see FIG. 12). When cooling of the eAxle 210 is required and the heat absorption demand of the refrigerant is low, the heat management circuit 20 is switched to circuit pattern 2E (see FIG. 13). When the eAxle 210 is cold and the heat absorption demand of the refrigerant is low, the heat management circuit 20 is switched to circuit pattern 2D.

[0053] Other configurations and effects are similar to those of the first embodiment, and therefore will not be described repeatedly.

[0054] [Third embodiment] Next, a third embodiment of the present disclosure will be described with reference to Fig. 15 to Fig. 21. In the third embodiment, the configuration of the flow path between the water-cooled condenser 440A and the switching device 500 is different from that of the second embodiment. The same components as those in the second embodiment are denoted by the same reference numerals as those in the second embodiment, and the repeated description will not be given.

[0055] FIG. 15 is a diagram showing the overall configuration of a thermal management system 3 including a thermal management circuit 30 according to the third embodiment. The thermal management circuit 30 is different from the thermal management circuit 20 of the second embodiment in that the flow path 720 and the flow path 730 (see FIG. 8 for both) are not provided. That is, in the third embodiment, the condensation section 441 and the switching device 500 are connected only by the flow path 710. In other words, the flow path connecting the condensation section 441 and the switching device 500 is composed only of the flow path 710. The supercooling section 443 and the switching device 500 are connected only by the flow path 740. In other words, the flow path connecting the supercooling section 443 and the switching device 500 is composed only of the flow path 740. In this case, the flow path 710 is an example of the "third flow path" and the "third direction flow path" of the present disclosure. Also, the flow path 740 is an example of the "fourth flow path" and the "fourth direction flow path" of the present disclosure.

[0056] FIG. 16 is a diagram showing a circuit pattern 3A of the thermal management circuit 30. In the example shown in FIG. 16, the eAxle 210 is connected to the LT radiator 310 via the switching device 500. The water-cooled condenser 440A is connected to the HT radiator 320 and the HT sub-radiator 340 via the switching device 500. In addition, the ports P11 and P12 (see FIG. 15) of the switching device 500 are closed, so that the coolant does not flow through the chiller 410. In addition, the ports P7 and P8 (see FIG. 15) of the switching device 500 are closed, so that the coolant does not flow through the heater core 600. In addition, in the circuit pattern 3A, the HT radiator 320 and the HT sub-radiator 340 are integrated.

[0057] Fig. 17 is a diagram showing a circuit pattern 3B of the thermal management circuit 30. In the example shown in Fig. 17, the eAxle 210 and the water-cooled condenser 440A are each connected to the LT radiator 310, the HT radiator 320, and the HT sub-radiator 340 via a switching device 500. The chiller 410 and the heater core 600 are the same as those in Fig. 16. Note that in the circuit pattern 3B, the HT radiator 320, the LT radiator 310, and the HT sub-radiator 340 are integrated.

[0058] Fig. 18 is a diagram showing a circuit pattern 3C of the thermal management circuit 30. In the example shown in Fig. 18, the eAxle 210 and the chiller 410 are each connected to the LT radiator 310, the HT radiator 320, and the HT sub-radiator 340 via a switching device 500. The water-cooled condenser 440A is connected to the heater core 600 via the switching device 500. In the circuit pattern 3C, the HT radiator 320, the LT radiator 310, and the HT sub-radiator 340 are integrated.

[0059] Fig. 19 is a diagram showing a circuit pattern 3D of the thermal management circuit 30. In the example shown in Fig. 19, the chiller 410 is connected to the LT radiator 310, the HT radiator 320, and the HT sub-radiator 340 via the switching device 500. The water-cooled condenser 440A is connected to the heater core 600 via the switching device 500. The switching device 500 is controlled so that the eAxle 210 (low-temperature circuit 200) is separated from the other circuits and becomes independent. In the circuit pattern 3D, the HT radiator 320, the LT radiator 310, and the HT sub-radiator 340 are integrated.

[0060] Fig. 20 is a diagram showing a circuit pattern 3E of the thermal management circuit 30. In the example shown in Fig. 20, the chiller 410 is connected to the HT radiator 320 and the HT sub-radiator 340 via a switching device 500. The eAxle 210 is connected to the LT radiator 310 via the switching device 500. The water-cooled condenser 440A is connected to the heater core 600 via the switching device 500. In the circuit pattern 2E, the HT radiator 320 and the HT sub-radiator 340 are integrated.

[0061] 21 is a diagram showing circuit patterns of the heat management circuit 30 corresponding to each of a plurality of temperature conditions. For example, in summer, when the cooling demand of the eAxle 210 is high and the heat dissipation demand of the refrigerant is high, the heat management circuit 30 is switched to the circuit pattern 3A (see FIG. 16). When the cooling demand of the eAxle 210 is low and the heat dissipation demand of the refrigerant is high, the heat management circuit 30 is switched to the circuit pattern 3B (see FIG. 17). When the cooling demand of the eAxle 210 is high and the heat dissipation demand of the refrigerant is low, the heat management circuit 30 is switched to the circuit pattern 3A. When the cooling demand of the eAxle 210 is low and the heat dissipation demand of the refrigerant is low, the heat management circuit 30 is switched to the circuit pattern 3A.

[0062] Also, in winter, when cooling of the eAxle 210 is required and the heat absorption demand of the refrigerant is high, the heat management circuit 30 is switched to circuit pattern 3C (see FIG. 18). When the eAxle 210 is cold and the heat absorption demand of the refrigerant is high, the heat management circuit 30 is switched to circuit pattern 3D (see FIG. 19). When cooling of the eAxle 210 is required and the heat absorption demand of the refrigerant is low, the heat management circuit 30 is switched to circuit pattern 3E (see FIG. 20). When the eAxle 210 is cold and the heat absorption demand of the refrigerant is low, the heat management circuit 30 is switched to circuit pattern 3D.

[0063] Other configurations and effects are similar to those of the first and second embodiments, and therefore will not be described repeatedly.

[0064] In the above first to third embodiments, an example in which the thermal management circuit is mounted on an electric vehicle has been described, but the present disclosure is not limited to this. The thermal management circuit may be mounted on an electric device other than an electric vehicle (for example, a stationary power storage device).

[0065] In the above embodiment, an example has been shown in which the HT radiator 320 and the subcooling condenser 330 (HT sub radiator 340) are provided forward (upstream of the wind) of the LT radiator 310 in the front-rear direction of the electric vehicle 1a, but the present disclosure is not limited to this. The positional relationship between the HT radiator 320 and the subcooling condenser 330 (HT sub radiator 340) and the LT radiator 310 is not limited to the example of the above embodiment. For example, the HT radiator 320 and the subcooling condenser 330 (HT sub radiator 340) and the LT radiator 310 may be arranged side by side in the left-right direction (a direction intersecting the flow direction of the wind).

[0066] The embodiments disclosed herein should be considered to be illustrative and not restrictive in all respects. The scope of the present disclosure is defined by the claims, not by the description of the embodiments described above, and is intended to include all modifications within the meaning and scope of the claims. [Explanation of symbols]

[0067] 1a Electric vehicle (electrical equipment), 10, 20, 30 Thermal management circuit, 100 Battery circuit (equipment layout circuit), 110 Battery (temperature control target equipment), 200 Low temperature circuit (equipment layout circuit), 210 eAxel (temperature control target equipment), 300, 300A Heat exchanger, 310 LT radiator (first heat exchanger), 320 HT radiator (second heat exchanger), 330 Supercooling condenser (third heat exchanger), 340 HT sub-radiator (third heat exchanger), 400, 400A Refrigeration cycle, 410 Chiller, 440, 440A Water-cooled condenser, 441 Condenser, 443 Supercooling section, 500 Switching device, 710 Flow path (first flow path) (first direction flow path) (third direction flow path), 720 Flow path (first flow path) (second direction flow path), 730 Flow path (second flow path) (first direction flow path), 740 flow path (second flow path) (second direction flow path) (fourth direction flow path).

Claims

1. A thermal management circuit for use in an electrical device, comprising: a device layout circuit through which a heat medium circulates to be heat exchanged with a temperature control target device that is a device to be temperature controlled; a refrigeration cycle connected to the chiller and the water-cooled condenser; a heat exchange device for performing heat exchange between outside air and a heat medium; A switching device capable of switching a flow path of the heat medium, The heat exchange device includes a first heat exchanger, a second heat exchanger, and a third heat exchanger that are provided separately from each other, a thermal management circuit, in which a connection state of each of the first heat exchanger, the second heat exchanger, and the third heat exchanger, and a connection state of each of the equipment arrangement circuit and the refrigeration cycle are switched by the switching device.

2. The third heat exchanger is connected to the refrigeration cycle, The water-cooled condenser includes a condenser that changes a heat medium from a gas phase to a liquid phase, The thermal management circuit according to claim 1 , wherein in the third heat exchanger, heat is exchanged between the heat medium changed into a liquid phase in the condenser section and outside air.

3. The water-cooled condenser includes a condenser section that changes a heat medium from a gas phase to a liquid phase, and a supercooling section that cools the heat medium that has been changed to the liquid phase in the condenser section, the condensation section and the subcooling section are connected to the switching device by a first flow path and a second flow path, respectively; 2. The thermal management circuit according to claim 1, wherein each of the first flow path and the second flow path has a first directional flow path in which the heat medium flows toward the switching device, and a second directional flow path in which the heat medium flows in a direction opposite to the first directional flow path.

4. The water-cooled condenser includes a condenser section that changes a heat medium from a gas phase to a liquid phase, and a supercooling section that cools the heat medium that has been changed to the liquid phase in the condenser section, the condensation section and the subcooling section are connected to the switching device by a third flow path and a fourth flow path, respectively; The third flow path is configured by a third direction flow path through which a heat medium flows from the condenser portion toward the switching device, The thermal management circuit according to claim 1 , wherein the fourth flow path is configured as a fourth directional flow path through which the heat medium flows from the switching device toward the subcooling portion.

5. A thermal management circuit as described in any one of claims 1 to 4, wherein each of the first heat exchanger and the third heat exchanger is arranged upstream of the second heat exchanger in the flow direction of outside air flowing into the heat exchange device.

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