Substrate processing device

Abstract

To provide a technique that can restrict a substrate immersed in processing liquid stored in a processing tank from floating up, so as to prevent the floating from disturbing ascent and descent of the substrate with respect to the processing tank.SOLUTION: A substrate processing device is provided with: a processing tank 1 in which an opening 10 is formed on the upper surface thereof and in which processing liquid L is stored; a lifter 2 that supports a substrate W in a standing posture and lifts the substrate up and down through the opening 10, between a lower position P1 where the supported substrate W is arranged in the processing tank 1 and an upper position P2 where the supported substrate W is arranged above the processing tank 1; a lid 5 which is changed in posture between a closed posture Q1 in which the opening is covered and an opened posture Q2 in which the lid stands up with respect to the opening; and a floating restricting member 6, provided on the lid 5, which is arranged above the substrate W arranged in the processing tank 1 to restrict the substrate W from floating up, when the lid 5 is in the closed posture Q1. The floating restricting member 6 is hinge-connected to the lid 5 and is maintained in a hang-down posture in which the member hangs down by own weight regardless of the posture of the lid 5.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present disclosure relates to a substrate processing apparatus. [Background technology]

[0002] 2. Description of the Related Art Among substrate processing apparatuses used in manufacturing processes for semiconductor devices and the like, there are those that process substrates with a processing liquid by immersing the substrate in the processing liquid stored in a processing tank (for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Utility Model Application Publication No. 6-52144 [Patent Document 2] Japanese Patent Application Publication No. 8-45894 [Patent Document 3] Japanese Patent Application Publication No. 11-54469 [Patent Document 4] JP 2004-338924 A Summary of the Invention [Problem to be solved by the invention]

[0004] When a substrate is immersed in a processing liquid, if bubbles are generated in the processing liquid, for example, due to gas being supplied into the processing liquid or the processing liquid being heated and evaporated, the immersed substrate may float up.

[0005] For example, Patent Document 1 describes a lid that opens and closes the opening of a processing tank that is provided with a floating prevention member for preventing the substrate from floating up. Here, the lid is configured to open both ways upward, and a floating prevention member is fixed to the underside of the lid in a position that protrudes in the normal direction. Therefore, when the lid is closed (i.e., when the lid is in a horizontal position and covers the opening of the processing tank), the floating prevention member protrudes vertically downward from the underside of the lid, and the end of the protruding side abuts or is close to the upper edge of the substrate immersed in the processing liquid. Therefore, even if the substrate tries to float up, it hits the floating prevention member and cannot float up.

[0006] However, with this configuration, when the lid is open (for example, when the lid is changed from a horizontal position to a vertical position), the anti-floating member protrudes horizontally into the space above the opening, interfering with the raising and lowering of the substrate relative to the processing tank. Therefore, measures must be taken, such as opening the lid widely (increasing the opening angle) so that the anti-floating member does not interfere with the substrate being raised and lowered.

[0007] An object of the present disclosure is to provide a technique that can prevent a substrate immersed in a processing liquid stored in a processing tank from floating up, and that does not interfere with raising and lowering the substrate relative to the processing tank. [Means for solving the problem]

[0008] A first aspect is a substrate processing apparatus comprising: a processing tank having an opening on an upper surface and storing a processing liquid therein; a lifter supporting a substrate in an upright position and raising and lowering through the opening between a lower position where the supported substrate is disposed within the processing tank and an upper position where the supported substrate is disposed above the processing tank; a lid whose position can be changed between a closed position covering the opening and an open position in which the lid is raised relative to the opening; and a float regulating member provided on the lid that is positioned above the substrate disposed in the processing tank when the lid is in the closed position to regulate the substrate from floating up, the float regulating member being hingedly connected to the lid and maintained in a hanging position hanging vertically by its own weight regardless of the position of the lid.

[0009] A second aspect is a substrate processing apparatus according to the first aspect, wherein when the lid is in the closed position, the float prevention member is positioned toward the center of the substrate placed in the processing tank when viewed from above.

[0010] A third aspect is a substrate processing apparatus according to the first or second aspect, wherein when the lid is in the closed position, the float prevention member is in close contact with the substrate placed in the processing tank.

[0011] A fourth aspect is the substrate processing apparatus according to the first or second aspect, wherein when the lid is in the closed position, the float prevention member abuts against the substrate placed in the processing tank.

[0012] A fifth aspect is the substrate processing apparatus according to any one of the first to fourth aspects, wherein the floatation restricting member includes a groove provided on a lower surface in the hanging posture.

[0013] A sixth aspect is a substrate processing apparatus according to any one of the first to fifth aspects, wherein a hinge structure hinge-connecting the float control member to the lid includes a first connecting piece provided on a main surface of the lid that is positioned opposite the liquid surface of the processing liquid when the lid is in the closed position, a second connecting piece provided on the float control member, and a pin inserted into a first through hole provided in the first connecting piece and a second through hole provided in the second connecting piece. Effect of the Invention

[0014] According to the first aspect, when the lid is in a closed position covering the opening, the float regulating member provided on the lid is in a hanging position and is positioned above the substrate placed in the processing tank to regulate the floating of the substrate. On the other hand, even when the lid is in an open position standing up from the opening, the float regulating member provided on the lid is maintained in a hanging position. Therefore, when the lid is in an open position, the float regulating member is unlikely to interfere with the raising and lowering of the substrate relative to the processing tank. In other words, the float regulating member can regulate the floating of the substrate immersed in the processing liquid stored in the processing tank, and is unlikely to interfere with the raising and lowering of the substrate relative to the processing tank.

[0015] According to the second aspect, the floatation regulating member is unlikely to hinder the flow of the processing liquid formed in the processing tank.

[0016] According to the third aspect, the floatation regulating member is less likely to damage the substrate.

[0017] According to the fourth aspect, it is possible to prevent the substrate from floating up, and also, for example, to prevent the substrate from rotating.

[0018] According to the fifth aspect, the substrate in contact with the floatation regulating member is less likely to become misaligned with respect to the floatation regulating member.

[0019] According to the sixth aspect, the positional relationship between the lid and the lifting restriction member can be adjusted by utilizing the hinge structure. [Brief description of the drawings]

[0020] [Figure 1] 1 is a perspective view diagrammatically illustrating a substrate processing apparatus according to an embodiment of the present invention. [Diagram 2] FIG. 1 is a block diagram illustrating a substrate processing apparatus. [Diagram 3] 1 is a cross-sectional view that typically illustrates a substrate processing apparatus. [Figure 4] 1 is a cross-sectional view that typically illustrates a substrate processing apparatus. [Diagram 5] 1 is a cross-sectional view that typically illustrates a substrate processing apparatus. [Figure 6] 1 is a cross-sectional view that typically illustrates a substrate processing apparatus. [Figure 7] FIG. 11 is a cross-sectional view that typically shows a substrate processing apparatus according to a first modified example. [Figure 8] FIG. 11 is a cross-sectional view that typically shows a substrate processing apparatus according to a second modified example. [Figure 9] FIG. 11 is a cross-sectional view that typically shows a substrate processing apparatus according to a second modified example. [Figure 10] FIG. 11 is a cross-sectional view that illustrates a substrate processing apparatus according to a third modified example. [Figure 11] FIG. 13 is a cross-sectional view that typically shows a substrate processing apparatus according to a fourth modified example. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0021] Hereinafter, an embodiment will be described with reference to the accompanying drawings. Note that the components described in this embodiment are merely examples, and are not intended to limit the scope of the present disclosure to only those components. In addition, the drawings are shown in a schematic manner, and for the convenience of explanation, configurations may be omitted, dimensions may be exaggerated or simplified, the number of components may be exaggerated or simplified, and configurations may be simplified as appropriate. In addition, the positional relationship of the configurations shown in the drawings is not necessarily described accurately.

[0022] Expressions showing relative or absolute positional relationships (e.g., "in one direction," "along one direction," "parallel," "orthogonal," "center," "middle," "concentric," "coaxial," etc.) not only strictly express the positional relationship, but also include a state in which the relative positions are displaced with respect to angles or distances within a range in which a tolerance or similar function is obtained, unless otherwise specified. Expressions showing an equal state (e.g., "same," "equal," "homogeneous," etc.) not only strictly express a quantitatively equal state, but also include a state in which a difference exists within a range in which a tolerance or similar function is obtained, unless otherwise specified. Expressions showing a shape (e.g., "circular," "elliptical," "square," "cylindrical," etc.) not only strictly express the shape geometrically, but also include a shape within a range in which a similar effect is obtained, and may have, for example, unevenness or chamfering. Each expression such as "comprises," "includes," "has," "includes," and "has" of a component is not an exclusive expression that excludes the presence of other components. The expression "at least one of A, B, and C" includes "A only," "B only," "C only," "any two of A, B, and C," and "all of A, B, and C." When ordinal numbers such as "first" or "second" are used, these terms are used for convenience to facilitate understanding of the contents of the embodiments, and are not limited to the order that may result from these ordinal numbers.

[0023] <1. Substrate processing equipment> A substrate processing apparatus 100 according to an embodiment will be described with reference to Figs. 1 and 2. Fig. 1 is a perspective view that typically shows the substrate processing apparatus 100 according to an embodiment. Fig. 2 is a block diagram that typically shows the substrate processing apparatus 100. In the following, for ease of explanation, the arrangement direction of multiple substrates W supported by the lifter 2 is referred to as the "Y direction", the horizontal direction perpendicular to the Y direction is referred to as the "X direction", and the vertical direction is referred to as the "Z direction".

[0024] The substrate processing apparatus 100 is an apparatus that processes a substrate W with a processing liquid L. The substrate processing apparatus 100 is also an apparatus (a so-called batch type apparatus) that collectively processes a plurality of substrates W. The substrate W to be processed in the substrate processing apparatus 100 is, for example, a circular thin plate-like (disc-like) semiconductor wafer.

[0025] The substrate processing apparatus 100 includes a processing tank 1, a lifter 2, a processing liquid supply unit 3, a gas supply unit 4, a lid 5, a floatation restricting member 6, and a control unit .

[0026] (Treatment tank 1) The treatment tank 1 is a tank that stores the treatment liquid L therein. The treatment tank 1 includes a bottom wall 11 and a side wall 12 rising from the periphery of the bottom wall 11. The bottom wall 11 is, for example, rectangular when viewed from above (each side extends in the X direction or the Y direction). The bottom wall 11 is, for example, shaped so as to slope downward toward its center line C1 (a center line that divides the bottom wall 11 in half in the X direction), and a drain pipe (not shown) is connected to the center line C1, which is the lowest part. The surface of the treatment tank 1 facing the bottom wall 11 is open. That is, the treatment tank 1 includes an opening 10 on its upper surface. An outer tank 13 is provided around the opening 10. Specifically, the outer tank 13 is provided, for example, so as to surround the upper edge of the side wall 12, and receives the treatment liquid L that has overflowed from the opening 10 beyond the upper edge.

[0027] (Lifter 2) The lifter 2 supports a plurality of substrates W in an upright position (a position in which the main surface is aligned with a vertical plane). The lifter 2 includes, for example, a back plate 21 and a plurality of (here, three) support parts 22 provided on the back plate 21. The back plate 21 is a plate-shaped member and is provided in an upright position (a position in which the main surface is aligned with a vertical plane (XZ plane)). One end of each support part 22 is fixed to the main surface of the back plate 21 and provided so as to protrude in the normal direction (Y direction) of the main surface. However, each of the three support parts 22 is provided on the lower end side of the main surface of the back plate 21, at both ends and the center of the back plate 21 in the X direction. Each support part 22 may be connected via a support frame at the end on the protruding side. A plurality of grooves (lifter grooves) 221 are provided on the upper surface of each support part 22 at a predetermined pitch along the extension direction (Y direction). In each of the three support parts 22, a set of three lifter grooves 221 provided at the same positions in the extension direction (Y direction) of the support parts 22 supports one substrate W. That is, three locations on the lower peripheral portion of the substrate W are accommodated in each of the sets of lifter grooves 221, so that the substrate W is supported in an upright position parallel to the back plate 21 (that is, a position in which the main surface is aligned with the vertical plane (XZ plane)). Furthermore, the substrate W is supported in each of the sets of lifter grooves 221 provided at a predetermined pitch along the extension direction (Y direction) of the support parts 22, so that the substrates W are supported in a state in which they are arranged at a predetermined pitch along the normal direction (Y direction) of the main surface.

[0028] A drive mechanism (lifting mechanism) 20 for raising and lowering the lifter 2 is connected to the lifter 2. Specifically, the lifting mechanism 20 includes, for example, a drive source (e.g., a motor or a cylinder), a linear motion mechanism (e.g., a rack and pinion mechanism, a ball screw mechanism, or a cam mechanism) for converting the power applied from the drive source into lifting and lowering motion of the lifter 2, and the like.

[0029] The lifter 2 is driven by the lifting mechanism 20 to move up and down through the opening 10 between a lower position P1 and an upper position P2.

[0030] The lower position P1 is a position where the substrate W supported by the lifter 2 is disposed in the processing tank 1. Specifically, the lower position P1 is a position where the entire substrate W supported by the lifter 2 is disposed below the opening 10. Therefore, the processing liquid L is stored in the processing tank 1, and the lifter 2 supporting the substrate W is disposed at the lower position P1, so that the substrate W is immersed in the processing liquid L. Here, when the lifter 2 is disposed at the lower position P1, the substrate W supported by the lifter 2 is disposed at a position where its center C coincides with the center line C2 of the opening 10 (the center line that bisects the opening 10 in the X direction) when viewed from above.

[0031] The upper position P2 is a position where the substrate W supported by the lifter 2 is disposed above the processing bath 1. Specifically, the upper position P2 is a position where the entire substrate W supported by the lifter 2 is disposed above the opening 10. Therefore, when the lifter 2 that is disposed at the lower position P1 is moved to the upper position P2, the substrate W that has been immersed in the processing liquid L is pulled up from the processing liquid L.

[0032] (Processing liquid supply unit 3) The processing liquid supply unit 3 includes a supply pipe 31. One end of the supply pipe 31 is connected to a processing liquid supply source 311, and the other end is disposed in the processing tank 1. As an example, the other end of the supply pipe 31 extends along the inner surface of the side wall 12, and is disposed in such a position that an opening provided at the end faces the bottom wall 11. An opening / closing valve 312 is interposed in the supply pipe 31. When the opening / closing valve 312 is opened, the processing liquid L is supplied from the processing liquid supply source 311 to the processing tank 1 through the supply pipe 31. When the opening / closing valve 312 is closed, the supply of the processing liquid L through the supply pipe 31 is stopped. As an example, the processing liquid L supplied by the processing liquid supply source 311 is a liquid containing phosphoric acid (H3PO4). Such a processing liquid L is used, for example, in a process (etching process) for etching a silicon nitride film (SiN) deposited on a substrate W.

[0033] The processing liquid supply unit 3 also includes a circulation pipe 32. One end of the circulation pipe 32 is connected to the outer bath 13, and the other end is connected to the jet nozzle 33. A pump 321, an in-line heater 322, a filter 323, and the like are interposed in the circulation pipe 32. The pump 321 pumps the processing liquid L stored in the outer bath 13 through the circulation pipe 32 to the jet nozzle 33. The in-line heater 322 heats the processing liquid L flowing through the circulation pipe 32 to a predetermined processing temperature. For example, when etching a silicon nitride film deposited on the substrate W with the processing liquid L containing phosphoric acid, the processing liquid L may be heated to, for example, about 160° C. by the in-line heater 322. The filter 323 removes particles and the like contained in the processing liquid L flowing through the circulation pipe 32.

[0034] The ejection nozzle 33 is provided, for example, near the bottom wall 11. The ejection nozzle 33 is, for example, a long cylindrical member, and is disposed in such a manner that the long dimension is aligned with the arrangement direction (Y direction) of the multiple substrates W supported by the lifter 2. The ejection nozzle 33 is provided with multiple ejection ports along the long dimension. Here, a pair of ejection nozzles 33, 33 is disposed. The pair of ejection nozzles 33, 33 are disposed symmetrically on one side (+X side) and the other side (-X side) of the center line C1 of the bottom wall 11 when viewed from above. Each ejection nozzle 33 is disposed, for example, in such a manner that the ejection port faces near the center of the processing tank 1 (diagonally upward).

[0035] (Gas supply section 4) The gas supply unit 4 includes a supply pipe 41. One end of the supply pipe 41 is connected to a gas supply source 411, and the other end is connected to a gas ejection nozzle 42. An on-off valve 412 is inserted in the supply pipe 41. When the on-off valve 412 is opened, gas is supplied from the gas supply source 411 to the gas ejection nozzle 42 through the supply pipe 41. When the on-off valve 412 is closed, the supply of gas through the supply pipe 41 is stopped. The gas supplied by the gas supply source 411 is, for example, an inert gas (nitrogen, as one example).

[0036] The gas ejection nozzle 42 is provided, for example, near the bottom wall 11. The gas ejection nozzle 42 is, for example, a long cylindrical member, and is arranged in such a manner that the long dimension is aligned with the arrangement direction (Y direction) of the multiple substrates W supported by the lifter 2. The gas ejection nozzle 42 is provided with multiple ejection ports along the long dimension. Here, multiple gas ejection nozzles 42 (two in the illustrated example) are arranged. It is also preferable that the multiple gas ejection nozzles 42 are arranged symmetrically on one side (+X side) and the other side (-X side) of the center line C1 of the bottom wall 11 when viewed from above. Each gas ejection nozzle 42 is arranged, for example, with the ejection port facing upward or the ejection port facing near the center of the processing tank 1 (diagonally upward).

[0037] (Lid 5) The lid 5 opens and closes the opening 10. The lid 5 is, for example, a double-hinged type and includes a pair of lid parts (first lid part 5a and second lid part 5b). The first lid part 5a and the second lid part 5b are, for example, flat plate-shaped members. Each of the lid parts 5a, 5b is supported by the device base so that its attitude with respect to the opening 10 can be freely changed. Specifically, for example, the device base is provided with an axis part (first axis part) 51a extending in the Y direction on the +X side of the opening 10, and the first lid part 5a is connected to the first axis part 51a at the edge on the +X side so as to be freely rotatable around the first axis part 51a. The device base is provided with a shaft portion (second shaft portion 51) b extending in the Y direction on the -X side of the opening 10, and the second cover portion 5b is connected to the second shaft portion 51b at the edge on the -X side so as to be rotatable around the second shaft portion 51b. The cover portions 5a, 5b may be directly connected to the shaft portions 51a, 51b, or may be indirectly connected to the shaft portions 51a, 51b via an arm or the like.

[0038] A drive mechanism (first rotation mechanism) 50a is connected to the first cover portion 5a to rotate it around the first shaft portion 51a. Similarly, a drive mechanism (second rotation mechanism) 50b is connected to the second cover portion 5b to rotate it around the second shaft portion 51b. Specifically, each of the first rotation mechanism 50a and the second rotation mechanism 50b includes, for example, a drive source (e.g., a cylinder or a motor) and a transmission mechanism that transmits power provided from the drive source to each cover portion 5a, 5b to rotate them. A part of the drive source and the transmission mechanism may be shared between the first rotation mechanism 50a and the second rotation mechanism 50b.

[0039] The first cover portion 5a is driven by the first rotation mechanism 50a to rotate about the first shaft portion 51a, thereby changing its position between the closed position Q1 and the open position Q2. Similarly, the second cover portion 5b is driven by the second rotation mechanism 50b to rotate about the second shaft portion 51b, thereby changing its position between the closed position Q1 and the open position Q2.

[0040] The closed position Q1 is a position that covers the opening 10. Specifically, for example, the closed position Q1 is a position in which the lid portions 5a and 5b extend above the opening 10 and substantially parallel to the opening 10. Here, the first lid portion 5a and the second lid portion 5b have the same dimensions along the X direction. Therefore, when the first lid portion 5a and the second lid portion 5b are both in the closed position Q1, the leading edges of the lid portions 5a and 5b are close to each other, abut, or slightly overlap each other on the center line C2 of the opening 10, and one side (+X side) of the center line C2 is covered by the first lid portion 5a, and the other side (-X side) of the center line C2 is covered by the second lid portion 5b. That is, the opening 10 is entirely covered.

[0041] The open position Q2 is a position in which the lifter 2 stands up with respect to the opening 10. Specifically, for example, the open position Q2 is a position in which the lid parts 5a, 5b form predetermined angles (open angles) θa, θb greater than zero with respect to the opening 10. However, the open angle θa of the first lid part 5a is set to an angle such that the leading edge of the first lid part 5a and the lifting control member 6 (described later) provided thereon do not interfere with the movement area T. The open angle θb of the second lid part 5b is set to an angle such that the leading edge of the second lid part 5b does not interfere with the movement area T. Here, the "movement area T" is an area through which the lifter 2 and the substrate W supported by it pass when the lifter 2 supporting the substrate W is raised and lowered between the lower position P1 and the upper position P2 through the opening 10. Therefore, when both the first lid part 5a and the second lid part 5b are in the open position Q2, the opening 10 is opened (exposed), and the lifter 2 and the substrate W supported by it can be raised and lowered between the lower position P1 and the upper position P2 through the opening 10 without interfering with the lid parts 5a, 5b and the float control member 6.

[0042] (Float control member 6) The float restricting member 6 is a member that restricts the floating of the substrate W placed in the processing tank 1 (i.e., the substrate W supported by the lifter 2 placed at the lower position P1), and is provided on the lid 5. The float restricting member 6 will be described later.

[0043] (Control Unit 7) The control unit 7 controls each part of the substrate processing apparatus 100. The control unit 7 is, for example, configured by a general computer having an electric circuit. As an example, the control unit 7 is configured to include a CPU (Central Processor Unit) as a central processing unit responsible for data processing, a ROM (Read Only Memory) in which a basic program and the like are stored, a RAM (Random Access Memory) used as a working area when the CPU performs a predetermined process (data processing), a storage device (for example, a storage device configured by a non-volatile storage device such as a flash memory or a hard disk device), and a bus line connecting these to each other. For example, a program that defines the process to be executed by the control unit 7 is stored in the storage device, and the CPU executes this program, thereby allowing the control unit 7 to execute the process defined by the program. However, a part or all of the process executed by the control unit 7 may be executed by hardware such as a dedicated logic circuit.

[0044] <2. Floating control material> The float restricting member 6 will be described with reference to Figs. 3 to 6. Figs. 3 and 4 are both cross-sectional views of the substrate processing apparatus 100 as viewed from the direction of arrow A in Fig. 1, with Fig. 3 showing a schematic view of the substrate processing apparatus 100 with the lid 5 closed, and Fig. 4 showing a schematic view of the substrate processing apparatus 100 with the lid 5 open. Fig. 5 is a cross-sectional view of the substrate processing apparatus 100 as viewed from the direction of arrow B in Fig. 1. Fig. 6 is a cross-sectional view of the substrate processing apparatus 100 as viewed from the direction of arrow C in Fig. 3.

[0045] (a) Arrangement of the lift-prevention member relative to the lid The float regulating member 6 is a member that regulates the floating of the substrate W placed in the processing tank 1 (i.e., the substrate W supported by the lifter 2 placed at the lower position P1), and is provided on the lid 5. Here, the number of float regulating members 6 provided is one. That is, the float regulating member 6 is provided on only one of the pair of lid portions 5a, 5b (in the illustrated example, the first lid portion 5a).

[0046] The float restricting member 6 is hinged to the first lid portion 5a. Specifically, the float restricting member 6 is hinged to the first lid portion 5a so as to be rotatable about an axis parallel to the first shaft portion 51a (i.e., an axis extending in the Y direction). When the first lid portion 5a is driven by the first rotation mechanism 50a to rotate about the first shaft portion 51a and change its position, the float restricting member 6 rotates in the opposite direction about the hinge due to its own weight and maintains a drooping position (a position hanging down in the vertical direction). In other words, the float restricting member 6 has a weight that allows it to be maintained in a drooping position regardless of the position of the first lid portion 5a.

[0047] For example, while the first lid part 5a is being changed from the open position Q2 to the closed position Q1 (i.e., while the first lid part 5a is being rotated about the first shaft part 51a in a direction that reduces the angle between the first lid part 5a and the opening 10), the float regulating member 6 rotates about the hinge by its own weight so that the angle between the first lid part 5a and the opening 10 increases, thereby maintaining the hanging position. Then, when the first lid part 5a is in the closed position Q1, the float regulating member 6 is disposed in the hanging position above the substrate W disposed in the processing tank 1 (i.e., the substrate W supported by the lifter 2 disposed at the lower position P1) (FIG. 3).

[0048] Furthermore, for example, while the first lid part 5a is being changed from the closed position Q1 to the open position Q2 (i.e. while the first lid part 5a is being rotated about the first shaft part 51a in a direction that increases the angle it forms with the opening 10), the float restriction member 6 rotates about the hinge by its own weight so that the angle it forms with the first lid part 5a decreases, thereby maintaining the hanging position. Then, when the first lid part 5a is in the open position Q2, the float restriction member 6 is disposed in the hanging position to the side of the movement region T (FIG. 4).

[0049] (b) Hinge structure The float restricting member 6 has an elongated shape, and is hinged near the leading edge of the first lid portion 5a with its elongated direction extending parallel to the leading edge. Here, a configuration example of a structure (hinge structure 8) for hinge-connecting the float restricting member 6 to the first lid portion 5a will be described.

[0050] Specifically, the hinge structure 8 includes, for example, a connecting piece (first connecting piece) 81 provided on the first lid portion 5a, a connecting piece (second connecting piece) 82 provided on the float control member 6, and a pin 83 connecting the first connecting piece 81 and the second connecting piece 82.

[0051] Specifically, the first connecting pieces 81 are provided, for example, near the leading edge of the first lid portion 5a, on one end side and the other end side in the extending direction (Y direction) of the leading edge. Each first connecting piece 81 is provided on the underside 52a of the first lid portion 5a (i.e., the main surface of the first lid portion 5a, which faces the liquid surface of the processing liquid L when the first lid portion 5a is in the closed position Q1) so as to protrude in the normal direction. Each first connecting piece 81 is provided with a first through hole 811 penetrating in the extending direction (Y direction) of the leading edge. However, the inner diameter of the first through hole 811 is set to a dimension sufficiently larger than the outer diameter of the pin 83.

[0052] Specifically, the second connecting pieces 82 are provided, for example, on one end side and the other end side in the extension direction of the float regulating member 6. The float regulating member 6 may have a flat cross section cut in a direction intersecting the longitudinal direction, in which case it is preferable that each second connecting piece 82 is provided on one end face in the longitudinal direction of the flat cross section. Each second connecting piece 82 is provided with a second through hole 821 that penetrates the float regulating member 6 in the longitudinal direction. However, the inner diameter of the second through hole 821 is set to a dimension sufficiently larger than the outer diameter of the pin 83.

[0053] When the float restricting member 6 is disposed at a predetermined position near the leading edge of the first lid portion 5a with its longitudinal direction extending parallel to the leading edge, the first connecting pieces 81 and the second connecting pieces 82 are adjacent to each other while being close to each other in the Y direction, and the through holes 811, 821 provided in the adjacent connecting pieces 81, 82 overlap when viewed along the Y direction. The pin 83 is inserted so as to penetrate the overlapping first through hole 811 and second through hole 821 in order. As a result, the float restricting member 6 is hingedly connected to the first lid portion 5a so as to be rotatable around the pin 83 (that is, around an axis along the extension direction (Y direction) of the pin 83).

[0054] (c) Positional relationship between the float-prevention member and the substrate Next, the positional relationship between the float restricting member 6 and the substrate W placed in the processing bath 1 when the first lid part 5a is in the closed position Q1 will be described.

[0055] (Z-direction positional relationship) When the first lid portion 5a is in the closed position Q1, the floatation prevention member 6 approaches the substrate W placed in the processing tank 1 in a non-contact manner while providing a gap G between the substrate W and the substrate W (FIGS. 3 and 5). Needless to say, the "substrate W placed in the processing tank 1" here refers to the substrate W that is placed in the correct position in the depth direction in the processing tank 1 without floating up (i.e., the substrate W with each of the three points on the lower peripheral portion properly accommodated in the lifter grooves 221).

[0056] Therefore, when the substrate W placed in the processing bath 1 tries to float up, the substrate W hits the float restricting member 6 when it floats up a distance equivalent to the gap G (specifically, the dimension d of the gap G in the Z direction) and cannot float up any further. In other words, the float restricting member 6 restricts the amount of float of the substrate W to a range that does not exceed the gap G.

[0057] The dimension d of the gap G in the Z direction is preferably set to a value smaller than the depth H of the lifter groove 221. For example, when the depth H of the lifter groove 221 is 4 mm, the dimension d of the gap G is preferably set to a value smaller than 4 mm (for example, a value within a range of 1 mm to 3 mm). By setting the dimension d of the gap G to a value smaller than the depth H of the lifter groove 221, the amount of lifting of the substrate W is restricted to a range smaller than the depth H of the lifter groove 221. In other words, the substrate W is restricted so as not to rise beyond the lifter groove 221. This makes it possible to prevent the substrate W from floating up and coming out of the lifter groove 221, the substrate W coming out of the lifter groove 221 from entering another lifter groove 221, and other such situations.

[0058] (Y-direction positional relationship) When the first lid portion 5a is in the closed position Q1, the floatation prevention member 6 extends parallel to the arrangement direction (Y direction) of the multiple substrates W arranged in the processing tank 1 (FIG. 6). Furthermore, in this state, the floatation prevention member 6 overlaps with the entire row of the multiple substrates W (from the substrate W at one end side to the substrate W at the other end side in the arrangement direction) when viewed from above (FIG. 6).

[0059] Therefore, when the first lid portion 5a is in the closed position Q1, the float prevention member 6 is present above all of the substrates W placed in the processing tank 1, and even if any of the substrates W placed in the processing tank 1 floats up, the substrate W abuts against the lower surface of the float prevention member 6. In other words, all of the substrates W placed in the processing tank 1 are prevented from floating up without exception.

[0060] (Positional relationship in X direction) When the first lid portion 5a is in the closed position Q1, the floatation prevention member 6 is located on the center side Cn of the substrate W placed in the processing tank 1 when viewed from above (FIG. 6). However, if the substrate W is disk-shaped and supported in an upright position in the processing tank 1, the substrate W has a line segment shape corresponding to its diameter when viewed from above, and the "center side Cn of the substrate W when viewed from above" is a position where the distance to the center C of the substrate W (center of the line segment) when viewed from above is smaller than the distance to the end of the substrate W (end of the line segment).

[0061] When the substrate W is disk-shaped and supported in an upright position in the processing tank 1, the edge (upper edge) of the substrate W located on the liquid surface side of the processing liquid L is arc-shaped, and the closer to the center C of the substrate W as viewed from above, the smaller the distance between the periphery of the substrate W and the liquid surface of the processing liquid L (FIG. 3). In other words, when the first lid portion 5a is in the closed position Q1, the float regulating member 6 is located on the center side Cn of the substrate W placed in the processing tank 1 as viewed from above, so that the length of the portion of the float regulating member 6 immersed in the processing liquid L can be kept small. Therefore, the flow (liquid flow) of the processing liquid L formed in the processing tank 1 is less likely to be obstructed by the float regulating member 6.

[0062] (d) Position adjustment Here, the relative positional relationship and dimensions of each part (float prevention member 6, first lid part 5a, processing tank 1, etc.) are specified so that the above-mentioned positional relationship is formed between the float prevention member 6 and the substrate W placed in the processing tank 1 when the first lid part 5a is in the closed position Q1.

[0063] For example, the positional relationship in the X direction between the float restricting member 6 and the substrate W placed in the processing tank 1 is determined by the position of the float restricting member 6 in the X direction relative to the first lid portion 5a (specifically, for example, the position of the first connecting piece 81 in the X direction). As described above, when the first lid portion 5a is in the closed position Q1 as viewed from above, the center C of the substrate W placed in the processing tank 1 coincides with the center line C2 of the opening 10, and the leading edge of the first lid portion 5a also roughly coincides with the center line C2. Therefore, by arranging the float restricting member 6 at a position sufficiently close to the leading edge of the first lid portion 5a, the float restricting member 6 can be positioned on the center side Cn of the substrate W placed in the processing tank 1 as viewed from above.

[0064] For example, the positional relationship in the Y direction between the float regulating member 6 and the substrate W placed in the processing tank 1 is determined from the arrangement position of the float regulating member 6 in the Y direction with respect to the first lid portion 5a (specifically, for example, the arrangement positions of the first connecting piece 81 and the second connecting piece 82 in the Y direction). That is, by appropriately determining this arrangement position, the float regulating member 6 can be arranged at a position overlapping with the entire row of the substrates W placed in the processing tank 1 when viewed from above. Furthermore, for example, by interposing a member such as a spacer between the first connecting piece 81 and the second connecting piece 82, the arrangement position of the float regulating member 6 in the Y direction with respect to the first lid portion 5a (and thus the positional relationship in the Y direction between the float regulating member 6 and the substrate W placed in the processing tank 1) can be adjusted.

[0065] For example, the positional relationship in the Z direction between the float restricting member 6 and the substrate W placed in the processing tank 1 is determined by the Z direction arrangement position of the float restricting member 6 with respect to the first lid portion 5a (specifically, for example, the Z direction arrangement positions of the first through hole 811 and the second through hole 821) and the Z direction arrangement position of the first lid portion 5a with respect to the processing tank 1. That is, by appropriately determining these arrangement positions, the float restricting member 6 can be arranged in a position close to the substrate W placed in the processing tank 1 in a non-contact state. Furthermore, for example, if a pressing bolt for adjusting the mounting height of the first lid portion 5a is provided between the first lid portion 5a and the device base, the Z direction arrangement position of the first lid portion 5a with respect to the processing tank 1 (and thus the Z direction positional relationship between the float restricting member 6 and the substrate W placed in the processing tank 1) can be adjusted by the pressing amount of the pressing bolt. However, if the target adjustment position at which the float preventing member 6 should be placed is not a position in contact with the substrate W but a position close to the substrate W in a non-contact state, even if the float preventing member 6 is placed at a position slightly deviated from the target adjustment position, the float preventing member 6 will not immediately interfere with the substrate W. For this reason, a certain degree of adjustment error is permissible. This reduces the workload associated with the adjustment.

[0066] It is preferable to adjust the position of each part (for example, adjusting the position of the float regulating member 6 in the Y direction relative to the first lid part 5a, adjusting the position of the first lid part 5a in the Z direction relative to the treatment tank 1, etc.) with the second lid part 5b removed from the device base. That is, if the second lid part 5b is removed from the device base, it becomes possible to visually check the float regulating member 6 from diagonally above through the opening 10 when the first lid part 5a is in the closed position Q1. By adjusting the position of each part while visually checking the position of the float regulating member 6, it is possible to easily place the float regulating member 6 at the target adjustment position.

[0067] <3. Processing flow> The flow of processes performed in the substrate processing apparatus 100 will be described with continued reference to Fig. 3 to Fig. 6. A series of processes performed in the substrate processing apparatus 100 is performed under the control of the control unit 7. That is, the series of processes performed in the substrate processing apparatus 100 progresses as the control unit 7 controls each part of the substrate processing apparatus 100 (specifically, the lifting mechanism 20 of the lifter 2, the on-off valve 312 of the processing liquid supply unit 3, the pump 321, the in-line heater 322, the on-off valve 412 of the gas supply unit 4, the rotating mechanisms 50a and 50b of the lid 5, etc.).

[0068] (Downward process) First, a plurality of substrates W are supported by the lifter 2 disposed at the upper position P2. Once the plurality of substrates W are supported by the lifter 2, the lifter 2 is lowered from the upper position P2 to the lower position P1 (AR21).

[0069] However, while the lifter 2 is lowered, the lid 5 is open. That is, the first lid part 5a and the second lid part 5b are in the open position Q2. When the first lid part 5a is in the open position Q2, the floatation restricting member 6 is disposed in a hanging position on the side of the moving area T. If the floatation restricting member is not hinged to the first lid part 5a and is fixedly provided (unrotatable with respect to the first lid part 5a) in a position protruding in the normal direction of the lower surface 52a of the first lid part 5a, when the first lid part 5a is in the open position Q2, the floatation restricting member protrudes into the space above the opening 10 (the moving area T side). For this reason, measures must be taken, such as increasing the opening angle θa of the first lid part 5a, so that the floatation restricting member does not interfere with the lifter 2 being raised and lowered and the substrate W supported thereon. In contrast, if the floatation prevention member 6 is hinged to the first cover part 5a and is maintained in a hanging position regardless of the position of the first cover part 5a, the floatation prevention member 6 does not protrude toward the movement area T when the first cover part 5a is in the open position Q2. Therefore, the floatation prevention member 6 is unlikely to interfere with the lifting and lowering of the lifter 2 and the substrate W supported thereon, and an increase in the opening angle θa of the first cover part 5a can be suppressed.

[0070] (Closing process) When the lifter 2 is placed in the lower position P1, the lid 5 is opened. That is, the first lid part 5a and the second lid part 5b are changed in position from the open position Q2 to the closed position Q1 (AR51). As described above, the position of the first lid part 5a in the Z direction relative to the processing tank 1 is adjusted so that the float regulating member 6 is close to the substrate W placed in the processing tank 1 in a non-contact state when the first lid part 5a is in the closed position Q1. Therefore, for example, even if the float regulating member 6 temporarily sinks deeply due to the momentum of the rotation of the first lid part 5a when the first lid part 5a reaches the closed position Q1, the float regulating member 6 is not immediately placed in a position where it interferes with the substrate W placed in the processing tank 1. Therefore, even if the float regulating member 6 temporarily sinks deeply, the float regulating member 6 is unlikely to damage the substrate W.

[0071] (Processing) For example, if the processing liquid L is supplied to the processing tank 1 through the supply piping 31 and stored in the processing tank 1 before the lifter 2 is lowered from the upper position P2 to the lower position P1, the lifter 2 supporting the multiple substrates W is placed at the lower position P1, so that the multiple substrates W are immersed in the processing liquid L. By immersing the multiple substrates W in the processing liquid L, processing of the multiple substrates W with the processing liquid L is started.

[0072] During the processing of the substrate W, the processing liquid L is pumped through the circulation pipe 32 and sprayed from each of the spray nozzles 33. That is, the processing liquid L overflowing from the opening 10 is received by the outer tank 13, flows into the circulation pipe 32, is heated by the in-line heater 322, has particles removed by the filter 323, and is sprayed from each of the spray nozzles 33. Here, the pair of spray nozzles 33, 33 are disposed symmetrically on one side and the other side of the center line C1 of the bottom wall 11 when viewed from above. Therefore, by spraying the processing liquid L from each of the spray nozzles 33, approximately symmetrical liquid flows (e.g., circulating liquid flows) are formed on one side and the other side of the center plane (the center plane that divides the processing tank 1 into two equal parts in the X direction) in the processing tank 1 (i.e., on one side and the other side of the center C of the substrate W placed in the processing tank 1 when viewed from above). As an example, the processing liquid L ejected from each ejection nozzle 33 flows upward near the central surface of the processing tank 1 (upflow), branches into opposite directions in the X direction near the liquid surface of the processing liquid L, flows downward near the side wall 12 (the side wall 12 on the +X side or the -X side), and flows upward near the central surface of the processing tank 1 again. The formation of a liquid flow in the processing tank 1 promotes the processing of the substrate W with the processing liquid L. During the processing of the substrate W, gas is supplied to each gas ejection nozzle 42 through the supply pipe 41, and the gas is ejected from each gas ejection nozzle 42. As a result, air bubbles are supplied into the processing liquid L stored in the processing tank 1 (bubbling). The supply of air bubbles, for example, agitates the processing liquid L to increase the uniformity of the concentration of the processing liquid L, and the uniformity of the processing of the substrate W is increased.

[0073] During the processing of the substrate W, the first lid portion 5a is in the closed position Q1, and in this state, the float regulating member 6 is disposed in a hanging position above the substrate W disposed in the processing tank 1. In addition, in this state, the float regulating member 6 approaches the substrate W disposed in the processing tank 1 in a non-contact state while providing a gap G between the substrate W and the float regulating member 6. Therefore, even if there is a substrate W that is about to float due to the adhesion of air bubbles, the substrate W hits the float regulating member 6 when it floats up a distance corresponding to the gap G, and cannot float any further. In other words, the float regulating member 6 regulates the amount of float of the substrate W to a range that does not exceed the gap G (a range that is smaller than the depth H of the lifter groove 221 when the dimension d of the gap G is set to a value smaller than the depth H of the lifter groove 221). In addition, the float regulating member 6 only comes into contact with the substrate W that is about to float up beyond the distance corresponding to the gap G, so that the substrate W that is not floating is not unnecessarily damaged by the float regulating member 6.

[0074] Moreover, when the first lid portion 5a is in the closed position Q1, the float prevention member 6 is disposed on the center side Cn of the substrate W placed in the processing tank 1 as viewed from above. Therefore, the length of the portion of the float prevention member 6 immersed in the processing liquid L is kept short, and the liquid flow formed in the processing tank 1 is less likely to be obstructed by the float prevention member 6. Furthermore, when a substantially symmetrical liquid flow is formed on one side and the other side of the center C of the substrate W placed in the processing tank 1 as viewed from above, the float prevention member 6 is disposed on the center side Cn of the substrate W as viewed from above, so that the effect of the float prevention member 6 on the liquid flow can be kept small.

[0075] (opening process) When a predetermined processing time has elapsed since processing of the plurality of substrates W with the processing liquid L has begun (i.e., since the plurality of substrates W have been immersed in the processing liquid L), the lid 5 is opened. That is, the first lid part 5a and the second lid part 5b are changed in position from the closed position Q1 to the open position Q2 (AR52). As described above, when the first lid part 5a is in the open position Q2, the floatation control member 6 is disposed in a hanging position to the side of the movement area T.

[0076] (Ascending process) When the lid 5 is opened, the lifter 2 is raised from the lower position P1 to the upper position P2 (AR22). By raising the lifter 2, the multiple substrates W supported by the lifter 2 are lifted out of the processing liquid L, and the processing of the multiple substrates W with the processing liquid L is stopped (ended).

[0077] <4. Effects> The substrate processing apparatus 100 according to the embodiment includes a processing tank 1, a lifter 2, a lid 5, and a floatation prevention member 6. The processing tank 1 includes an opening 10 on the upper surface thereof, and stores a processing liquid L therein. The lifter 2 supports the substrate W in an upright position, and moves up and down through the opening 10 between a lower position P1 where the supported substrate W is disposed in the processing tank 1 and an upper position P2 where the supported substrate W is disposed above the processing tank 1. The lid 5 changes its position between a closed position Q1 where the lid 5 covers the opening 10 and an open position Q2 where the lid 5 stands up relative to the opening 10. The floatation prevention member 6 is provided on the lid 5, and when the lid 5 is in the closed position Q1, the floatation prevention member 6 is disposed above the substrate W disposed in the processing tank 1 to prevent the substrate W from floating up. The floatation prevention member 6 is hinged to the lid 5, and is maintained in a vertically hanging position by its own weight, regardless of the position of the lid 5. According to this configuration, when the lid 5 is in the closed position Q1 covering the opening 10, the float preventing member 6 provided on the lid 5 is in a hanging position and is disposed above the substrate W placed in the processing tank 1 to prevent the substrate W from floating up. On the other hand, even when the lid 5 is in the open position Q2 standing up from the opening 10, the float preventing member 6 provided on the lid 5 is maintained in the hanging position. Therefore, when the lid 5 is in the open position Q2, the float preventing member 6 is unlikely to interfere with the raising and lowering of the substrate W relative to the processing tank 1. In other words, the float preventing member 6 can prevent the substrate W immersed in the processing liquid L stored in the processing tank 1 from floating up, and is unlikely to interfere with the raising and lowering of the substrate W relative to the processing tank 1.

[0078] In the above embodiment, when the lid 5 is in the closed position Q1, the floatation prevention member 6 is disposed on the center side Cn of the substrate W placed in the processing tank 1 when viewed from above. Therefore, the floatation prevention member 6 is unlikely to obstruct the flow of the processing liquid L formed in the processing tank 1.

[0079] In the above embodiment, the number of the float regulating members 6 is one. Therefore, the influence of the float regulating members 6 on the flow of the processing liquid L formed in the processing tank 1 can be kept small.

[0080] In the above embodiment, when the lid 5 is in the closed position Q1, the floatation prevention member 6 approaches the substrate W placed in the processing bath 1 without contacting the substrate W. With this configuration, the floatation prevention member 6 is less likely to damage the substrate W.

[0081] In the above embodiment, the hinge structure 8 that hinge-connects the float regulating member 6 to the lid 5 includes a first connecting piece 81 provided on the underside 52a of the lid 5 (first lid portion 5a) (i.e., the main surface of the lid 5 that faces the liquid surface of the treatment liquid L when the lid 5 is in the closed position Q1), a second connecting piece 82 provided on the float regulating member 6, and a pin 83 inserted through a first through hole 811 provided in the first connecting piece 81 and a second through hole 821 provided in the second connecting piece 82. With this configuration, the positional relationship between the lid 5 and the float regulating member 6 can be adjusted by utilizing the hinge structure 8.

[0082] <5. Modifications> The configuration of the substrate processing apparatus 100 according to the above embodiment can be modified as appropriate. In the following description, the same components as those described in the above embodiment are denoted by the same reference numerals, and the description thereof will be omitted.

[0083] (First Modification) 7 shows a float preventing member 6a according to a first modified example. When the first lid portion 5a is in the closed position Q1, the float preventing member 6a comes into contact with the substrate W placed in the processing tank 1 (i.e., the substrate W placed at a normal position in the depth direction in the processing tank 1). In other words, the position of the float preventing member 6a in the Z direction relative to the first lid portion 5a and the position of the first lid portion 5a in the Z direction relative to the processing tank 1 are specified so that the float preventing member 6a comes into contact with the substrate W placed in the processing tank 1 when the first lid portion 5a is in the closed position Q1.

[0084] Therefore, the substrate W placed in the processing tank 1 cannot float up from its normal position. That is, the float prevention member 6a prevents the substrate W from being positioned at the normal position. Furthermore, the float prevention member 6a comes into contact with the substrate W placed in the processing tank 1, thereby preventing the substrate W from rotating. For example, the substrate W is prevented from rotating in the circumferential direction. Furthermore, for example, the substrate W is prevented from rotating so as to tilt its main surface relative to the vertical plane. That is, the float prevention member 6a not only prevents the substrate W from floating up, but also prevents the substrate W from rotating.

[0085] (Second Modification) 8 and 9 show a float restricting member 6b according to a second modified example. This float restricting member 6b has a groove (restricting groove) 611 provided on a lower surface 61 in a hanging posture. Specifically, for example, a plurality of restricting grooves 611 are provided at a predetermined pitch along the extension direction (Y direction) of the lower surface 61.

[0086] The shape of the restriction groove 611 can be appropriately determined. For example, as illustrated in FIG. 8, the restriction groove 611 may be V-shaped in side view. That is, the restriction groove 611 may be a groove (V-shaped restriction groove 611v) whose side wall is inclined with respect to a vertical plane and is provided at a predetermined pitch (so-called sawtooth shape). Alternatively, as illustrated in FIG. 9, the restriction groove 611 may be rectangular in side view. That is, the restriction groove 611 may be a groove (rectangular restriction groove 611t) whose side wall is along a vertical plane (XZ plane) and whose bottom wall is along a horizontal plane (XY plane) and is provided at a predetermined pitch (so-called comb-tooth shape).

[0087] When the regulating grooves 611 are provided, the pitch (the distance between adjacent regulating grooves 611) is preferably smaller than the pitch E (the distance between adjacent lifter grooves 221) of the lifter grooves 221. In other words, the pitch of the regulating grooves 611 is preferably smaller than the pitch (the distance between adjacent substrates W) of the multiple substrates W supported by the lifter 2. For example, when the pitch E of the lifter grooves 221 is 5 mm, the pitch Ev of the V-shaped regulating grooves 611v or the pitch Et of the rectangular regulating grooves 611t is preferably, for example, 0.5 mm to 3 mm, and particularly preferably 1 mm to 2.5 mm.

[0088] When the regulating groove 611 is provided, it is preferable that the depth thereof is smaller (shallower) than the depth H of the lifter groove 221. For example, when the depth H of the lifter groove 221 is 4 mm, it is preferable that the depth Hv of the V-shaped regulating groove 611v or the depth Ht of the rectangular regulating groove 611t is, for example, 0.5 mm to 3.5 mm.

[0089] In the configuration in which the regulating groove 611 is provided on the lower surface 61 of the float regulating member 6b according to this modification, the substrate W in contact with the float regulating member 6b (specifically, the lower surface 61) is unlikely to become misaligned with respect to the float regulating member 6b. For example, the substrate W is unlikely to slip in the extending direction of the lower surface 61 and become inclined. In addition, for example, the substrate W is unlikely to receive force from the liquid flow or air bubbles of the processing liquid L and swing relative to the lower surface 61.

[0090] (Third Modification) 10 shows a floatation prevention member 6c according to a third modified example. This floatation prevention member 6c is disposed at a position that coincides with the center C of the substrate W placed in the processing tank 1 when viewed from above when the first lid part 5a is in the closed position Q1.

[0091] In order to dispose the float restricting member 6c at such a position, for example, the dimension in the X direction of the first lid part 5a may be made larger than that of the second lid part 5b. In this case, when the first lid part 5a is viewed from above in the closed position Q1, the center C of the substrate W placed in the processing tank 1 coincides with the center line C2 of the opening 10, and the leading edge of the first lid part 5a is shifted by a predetermined dimension (offset width) ΔX to the -X side beyond the center line C2. Therefore, by disposing the float restricting member 6c near the leading edge of the first lid part 5a (at a position shifted by the offset width ΔX from the leading edge), the float restricting member 6c can be disposed at a position that coincides with the center C of the substrate W placed in the processing tank 1 when viewed from above.

[0092] Furthermore, for example, the first connecting piece 81 may be disposed in a position that is slightly inclined toward the -X side as it goes downward so that the first through-hole 811 coincides with the center line C2 of the opening 10 when viewed from above when the first lid portion 5a is in the closed position Q1. Alternatively, the first connecting piece 81 may be shaped to protrude slightly toward the -X side. With such a configuration, the float regulating member 6c can be disposed at a position that coincides with the center C of each substrate W placed in the processing tank 1 when viewed from above.

[0093] When the substrate W is disk-shaped and supported in an upright position in the processing tank 1, the edge of the substrate W disposed on the liquid surface side of the processing liquid L is arc-shaped, and the distance between the periphery of the substrate W and the liquid surface of the processing liquid L is smallest at a position that coincides with the center C of the substrate W when viewed from above. In other words, when the first cover portion 5a is in the closed position Q1, the float regulating member 6c is disposed at a position that coincides with the center C of the substrate W disposed in the processing tank 1 when viewed from above, so that the length of the portion of the float regulating member 6c immersed in the processing liquid L can be minimized. Therefore, the liquid flow formed in the processing tank 1 is not particularly likely to be hindered by the float regulating member 6c. As an example, when the distance between the periphery of the substrate W and the liquid surface of the processing liquid L at a position that coincides with the center C of the substrate W disposed in the processing tank 1 when viewed from above is about 7 mm, and the dimension d of the gap G is about 2 mm, the length of the portion of the float regulating member 6c immersed in the processing liquid L can be reduced to about 5 mm.

[0094] (Fourth Modification) 11 shows a float prevention member 6d according to a fourth modified example. This float prevention member 6d is disposed on the end side Cf of the substrate W placed in the processing tank 1 when viewed from above with the first lid portion 5a in the closed position Q1. However, when the substrate W is disk-shaped and supported in an upright position in the processing tank 1, the substrate W is in the form of a line segment corresponding to its diameter when viewed from above, and the "end side Cf of the substrate W when viewed from above" is a position where the distance to the center C of the substrate W (center of the line segment) when viewed from above is equal to or greater than the distance to the end of the substrate W (end of the line segment).

[0095] In order to dispose the floatation restricting member 6d in such a position, the floatation restricting member 6d may be disposed at a position sufficiently far from the tip edge of the first lid portion 5a (at a position sufficiently close to the edge opposite to the tip edge).

[0096] In this modification, when the first lid portion 5a is in the closed position Q1, the floatation prevention member 6d is disposed in a hanging position above the substrate W disposed in the processing tank 1. In this state, the floatation prevention member 6d approaches the substrate W disposed in the processing tank 1 in a non-contact state while providing a gap G between the substrate W and the substrate W (solid line in FIG. 11). Therefore, when the substrate W disposed in the processing tank 1 tries to float up, the substrate W abuts against the floatation prevention member 6d (dotted chain line in FIG. 11) when it floats up a distance equivalent to the gap G, and cannot float up any further. In other words, the floatation prevention member 6d restricts the amount of floatation of the substrate W to a range that does not exceed the gap G.

[0097] However, in this modified example, when the magnitude of the force that the floatation restricting member 6d receives from the substrate W exceeds a predetermined range, the floatation restricting member 6d is lifted up by the substrate W and rotates slightly around the hinge (rotates in a direction away from the center C of the substrate W) to assume an inclined posture that is slightly inclined with respect to the vertical direction (two-dot chain line in FIG. 11). In other words, when the force that causes the substrate W to float exceeds a predetermined range, the floatation restricting member 6d rotates so as to escape from the substrate W. For this reason, it is difficult for the floatation restricting member 6d to apply a force that exceeds the predetermined range to the substrate W. Therefore, it is difficult for a situation to occur in which the substrate W that is trying to float is pressed down too hard by the floatation restricting member 6d and damaged.

[0098] (Other variations) In the above embodiment, the number of float regulating members 6 provided is one, but two or more float regulating members 6 may be provided. For example, the number of float regulating members 6 provided may be two, with one float regulating member 6 provided in the first lid portion 5a and the other float regulating member 6 provided in the second lid portion 5b. Also, for example, two or more float regulating members 6 may be provided in one or both of the first lid portion 5a and the second lid portion 5b. Needless to say, when the number of float regulating members 6 provided is one, the float regulating member 6 may be provided in either the first lid portion 5a or the second lid portion 5b.

[0099] The weight of the float regulating member 6 according to the above embodiment can be appropriately specified as long as it is a weight that allows the float regulating member 6 to be maintained in the hanging position regardless of the position of the first lid portion 5a. For example, the weight of the float regulating member 6 can be adjusted by appropriately adjusting the dimensions of the float regulating member 6 (the vertical dimensions in the hanging position). Note that when the first lid portion 5a is in the closed position Q1, a part of the float regulating member 6 may be immersed in the treatment liquid L. In this case, the float regulating member 6 is subjected to buoyancy from the treatment liquid L and may also be subjected to force from air bubbles in the treatment liquid L. It is preferable that the weight of the float regulating member 6 is specified so that the float regulating member 6 is maintained in the hanging position without swinging around the hinge even in a state where it is subjected to these forces.

[0100] The shape of the float regulating member 6 according to the above embodiment can be appropriately specified. For example, the cross section of the float regulating member 6 cut in a direction intersecting with the longitudinal direction may be, for example, flat. As one example, the cross section of the float regulating member 6 may be an ellipse (a shape consisting of a pair of linear long sides and a pair of arc-shaped short sides) (e.g., FIG. 3). Alternatively, the cross section of the float regulating member 6 cut in a direction intersecting with the longitudinal direction may be, for example, a circle, an ellipse, a rectangle, a square, a polygon, or the like.

[0101] In addition, when the cross section of the float preventing member 6 taken in a direction intersecting the longitudinal direction has a flat shape, it is also preferable that the float preventing member 6 is hinged to the lid 5 at one end face in the longitudinal direction of the cross section. With this configuration, in the hanging position, the float preventing member 6 is in a position such that the longitudinal direction of the cross section is oriented vertically and the lateral direction of the cross section is oriented horizontally. Therefore, when the lid 5 is in the open position Q2, the float preventing member 6 is effectively prevented from interfering with the raising and lowering of the substrate W relative to the processing tank 1. Furthermore, when the lid 5 is in the closed position Q1, the effect of the float preventing member 6 on the flow of the processing liquid L formed in the processing tank 1 can be reduced.

[0102] The material for forming the float-preventing member 6 according to the above embodiment can be appropriately selected. For example, the material for forming the float-preventing member 6 can be a resin (e.g., a fluororesin, for example, PTFE (polytetrafluoroethylene)), a metal, or the like.

[0103] In the above embodiment, the cover 5 (shutter) is of a double-opening type, but it may be of a single-opening type.

[0104] The flow of processing performed in the substrate processing apparatus 100 is not limited to that exemplified in the above embodiment. For example, after the lifter 2 supporting the multiple substrates W is lowered from the upper position P2 to the lower position P1, the processing liquid L may be supplied to the processing tank 1 through the supply pipe 31, and the processing liquid L may be stored in the processing tank 1. In this case, the processing of the multiple substrates W with the processing liquid L is started when the liquid level of the processing liquid L reaches a level higher than the multiple substrates W arranged in the processing tank 1. Also, for example, the processing liquid L stored in the processing tank 1 may be drained through the drain pipe before the lifter 2 supporting the multiple substrates W is raised from the lower position P1 to the upper position P2. In this case, the processing of the multiple substrates W with the processing liquid L is stopped (ended) when the liquid level of the processing liquid L drops and the multiple substrates W are exposed from the processing liquid L.

[0105] The substrate W to be processed in the substrate processing apparatus 100 may be, for example, a semiconductor wafer having a three-dimensional structure (for example, a three-dimensional structure in the middle of manufacturing a three-dimensional NAND (Not-AND) flash memory) formed on its main surface. In addition, in the substrate processing apparatus 100, such a substrate W may be subjected to a process of etching a silicon nitride film deposited on the substrate W using a processing liquid L containing phosphoric acid.

[0106] In the substrate processing apparatus 100, the processing liquid L used for processing may be any type. For example, the processing liquid L may be phosphoric acid to which an additive (e.g., silicon) and / or a diluting liquid has been added. In this case, the diluting liquid may be, for example, DIW (deionized water), carbonated water, electrolytic ionized water, hydrogen water, ozone water, or hydrochloric acid water with a dilution concentration of about 10 ppm to 100 ppm. Alternatively, the processing liquid L may be any of various cleaning liquids (for example, a mixture of sulfuric acid and hydrogen peroxide, DIW, carbonated water, electrolytic ionized water, hydrogen water, or ozone water).

[0107] Any type of processing may be performed on the substrate W in the substrate processing apparatus 100. For example, the processing performed on the substrate W in the substrate processing apparatus 100 may be an etching processing or a cleaning processing. In addition, in the substrate processing apparatus 100, the processing liquid L stored in the processing tank 1 may be successively replaced with a different one, so that a plurality of types of processing may be successively performed on the substrate W.

[0108] The substrate W to be processed in the substrate processing apparatus 100 is not limited to a semiconductor wafer (semiconductor substrate). The substrate W to be processed in the substrate processing apparatus 100 may be, for example, a glass substrate for a liquid crystal display device, a glass substrate for a plasma display device, a substrate for an optical display, a substrate for an organic EL display, a substrate for an FED (Field Emission Display), a substrate for an optical disk, a substrate for a magnetic disk, a substrate for a magneto-optical disk, a glass substrate for a photomask, a substrate for a solar cell, or the like.

[0109] Although the substrate processing apparatus has been described in detail as above, the above description is merely illustrative in all respects and does not limit the substrate processing apparatus. It is understood that countless variations not illustrated can be envisioned without departing from the scope of this disclosure. The configurations described in the above embodiments and the above variations can be appropriately combined or omitted as long as they are not mutually contradictory. [Explanation of symbols]

[0110] 100 Substrate processing apparatus 1 Treatment tank 10 aperture 2 Lifter 3 Processing liquid supply section 4 Gas supply section 5 Lid 5a 1st lid part 5b 2nd lid part 6, 6a, 6b, 6c, 6d Floating control member 7 Control section 8 Hinge structure 81 1st connection piece 82 Second connection piece 83 pin

Claims

1. a processing tank having an opening on an upper surface and storing a processing liquid therein; a lifter that supports a substrate in an upright position and moves up and down through the opening between a lower position where the supported substrate is disposed in the processing tank and an upper position where the supported substrate is disposed above the processing tank; a lid whose position is changed between a closed position covering the opening and an open position in which the lid stands up against the opening; a floatation prevention member provided on the lid, the floatation prevention member being disposed above the substrate disposed in the processing tank when the lid is in the closed position, and preventing the substrate from floating up; Equipped with The float regulating member is The container is hinged to the lid and is maintained in a vertically dangling position by its own weight, regardless of the position of the lid. Substrate processing equipment.

2. The substrate processing apparatus according to claim 1 , When the lid is in the closed position, the float regulating member is disposed on the center side of the substrate disposed in the processing tank as viewed from above. Substrate processing equipment.

3. 3. The substrate processing apparatus according to claim 1, When the lid is in the closed position, the float regulating member is in close contact with the substrate disposed in the processing tank. Substrate processing equipment.

4. 3. The substrate processing apparatus according to claim 1, When the lid is in the closed position, the float-restricting member abuts against the substrate disposed in the processing tank. Substrate processing equipment.

5. 3. The substrate processing apparatus according to claim 1, The float regulating member has a groove provided on a lower surface in the hanging position, The substrate processing apparatus includes:

6. 3. The substrate processing apparatus according to claim 1, A hinge structure for hinge-connecting the lift-restricting member to the lid, a first connecting piece provided on a main surface of the lid that faces a liquid surface of the treatment liquid when the lid is in the closed position; A second connecting piece provided on the float regulating member; a pin inserted through a first through hole provided in the first connecting piece and a second through hole provided in the second connecting piece; Equipped with Substrate processing equipment.

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