Component mounting system, component mounting device and component mounting method

Abstract

To provide a component mounting system, a component mounting device and a component mounting method capable of reducing the number of special components to be discarded in the production of a mounting substrate which repeats a turn for mounting a component onto the substrate by a plurality of nozzles.SOLUTION: A component mounting method which repeats a turn for sucking and mounting a component onto a substrate by each of a plurality of nozzles includes: a mounting step (ST10) of mounting the component onto the substrate; a discard step (ST4) of not mounting the component, which is sucked by the nozzle in the mounting step (ST10) onto the substrate but discarding the component; and a re-mounting step (ST11) in which, in a case where there is a component discarded in the discard step (ST4), a component of the same kind of the discarded component is re-mounted onto the substrate. In the re-mounting step (ST11), in a case where components of which the number to be sucked in one turn are included in components to be re-mounted, the relevant components are re-mounted in such a manner that the number to be sucked in one turn becomes equal to or less than a predetermined number.SELECTED DRAWING: Figure 6

Description

[Technical field]

[0001] The present invention relates to a component mounting system, a component mounting apparatus, and a component mounting method that picks up components with a plurality of nozzles and mounts them on a board. [Background technology]

[0002] The component mounting device efficiently mounts components on a board by repeatedly picking up components with each of a number of nozzles held by a mounting head, moving the mounting head above the board, and mounting the components picked up by each nozzle on the board. The component mounting device also inspects the attitude of the component held by the nozzle and the position held by the nozzle between picking up the component on the nozzle and mounting it on the board, and stops mounting on the board if an abnormality is detected, thereby ensuring the mounting quality of the mounting board. Patent Document 1 discloses a component mounting device that picks up components from the same tape material to each of a number of nozzles and inspects the attitude of the held components. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2014-123636 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, in conventional technologies including Patent Document 1, if an abnormality is detected in a component held by the nozzle, the mounting head discards the component held by the nozzle and picks up and reattaches a new component. Therefore, if the mounting head is holding multiple special components, such as expensive components, and an abnormality is detected, multiple special components will be discarded, leaving room for further improvement in order to reduce the number of special components that are discarded.

[0005] Therefore, an object of the present invention is to provide a component mounting system, a component mounting device, and a component mounting method that can reduce the number of special components that are discarded in the production of mounted boards, which involves repeated turns of mounting components to a board using multiple nozzles. [Means for solving the problem]

[0006] The component mounting system of the present invention comprises a component mounting device that performs production by repeating turns of picking up components with each of a plurality of nozzles and mounting them on a board, a component information acquisition means that acquires information on whether or not to limit the number of components that can be picked up in one turn for each of a plurality of components when the component mounting device performs production in accordance with mounting data, and a mounting data creation device that creates mounting data for components for which the number of components that can be picked up in one turn is limited so that the number of components that can be picked up in one turn is equal to or less than a predetermined number.

[0007] The component mounting device of the present invention is a component mounting device that performs production by repeating turns of picking up components with each of a plurality of nozzles and mounting them on a board, and when performing production in accordance with mounting data, when re-mounting onto the board a component of the same type as a component that was discarded without being mounted on the board, if the discarded components include a component for which the number that can be picked up in one turn is limited in the mounting data, the component is re-mounted so that the number of components that can be picked up in one turn is less than a predetermined number.

[0008] The component mounting method of the present invention, in which production is carried out by repeating turns of picking up components with each of a plurality of nozzles and mounting them on a board, includes a mounting step of mounting components on the board in accordance with mounting data, a discarding step of discarding the components picked up by the nozzles in the mounting step without mounting them on the board, and a remounting step, if any components have been discarded in the discarding step, of remounting components of the same type as the discarded components on the board in accordance with the mounting data, and in the remounting step, if any components to be remounted include components for which the mounting data specifies a limit on the number of components that can be picked up in one turn, the components are remounted so that the number of components picked up in one turn is equal to or less than a predetermined number. Effect of the Invention

[0009] According to the present invention, in the production of mounted boards in which a plurality of nozzles are used to repeatedly place components on a board, the number of special components that are discarded can be reduced. [Brief description of the drawings]

[0010] [Figure 1] FIG. 1 is a plan view of a component mounting system according to an embodiment of the present invention; [Diagram 2] FIG. 1 is an explanatory diagram of the functions of the main parts of a component mounting device according to an embodiment of the present invention; [Diagram 3] FIG. 1 is a block diagram showing a configuration of a component mounting system according to an embodiment of the present invention. [Figure 4] FIG. 1 is an explanatory diagram of an example of component data used in a component mounting system according to an embodiment of the present invention; [Diagram 5] FIG. 1 is an explanatory diagram of an example of mounting data used in a component mounting system according to an embodiment of the present invention; [Figure 6] 1 is a flow diagram of a component mounting method according to an embodiment of the present invention; DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] An embodiment of the present invention will be described in detail below with reference to the drawings. The configurations, shapes, etc. described below are examples for explanation and can be appropriately changed according to the specifications of the component mounting system, the component mounting device, and the mounting data creation device. In the following, the same reference numerals are used for corresponding elements in all the drawings, and duplicated explanations are omitted. In FIG. 1 and in some parts described later, the X-axis (left-right direction in FIG. 1) in the board transport direction and the Y-axis (up-down direction in FIG. 1) perpendicular to the board transport direction are shown as two axes perpendicular to each other in the horizontal plane. In FIG. 1 and in some parts described later, the Z-axis (perpendicular to the paper surface in FIG. 1) is shown as the height direction perpendicular to the horizontal plane.

[0012] First, the configuration of the component mounting system 1 will be described with reference to Fig. 1. The component mounting system 1 is configured to include a component mounting device M and a mounting data creation device CP that are connected via a communication network NT. The component mounting device M has a function of performing a component mounting operation of mounting components supplied from a component supply unit onto a board. The component mounting system 1 is not limited to having one component mounting device M, and may have two or more components. The mounting data creation device CP has a function of creating mounting data that is referenced when the component mounting device M mounts components on a board, and transferring the data to the component mounting device M.

[0013] Next, the configuration of component mounting apparatus M will be described with reference to Figures 1 and 2. In component mounting apparatus M, a board transport mechanism 3 is arranged along the X-axis at the center of base 2. Board transport mechanism 3 transports board KB carried in from upstream along the X-axis, and positions and holds it at a mounting work position by a mounting head, which will be described below. In addition, board transport mechanism 3 carries board KB downstream after component mounting work has been completed. Component supply units 4 are installed on both sides of board transport mechanism 3 (front and rear directions of the Y-axis).

[0014] A plurality of tape feeders 5 are attached in parallel along the X-axis to the component supply unit 4. The tape feeders 5 feed a carrier tape, on which pockets for storing components are formed, by pitch-feeding in a direction (tape feed direction) from the outside of the component supply unit 4 toward the board transport mechanism 3, to supply components to a component removal position where the mounting head picks up the components.

[0015] 1 and 2, a Y-axis table 6 equipped with a linear drive mechanism is disposed along the Y-axis at both ends in the X-axis direction on the upper surface of the base 2. A beam 7 similarly equipped with a linear mechanism is coupled to the Y-axis table 6 so as to be freely movable along the Y-axis (arrow a in FIG. 2). A mounting head 8 is attached to the beam 7 so as to be freely movable along the X-axis (arrow b in FIG. 2). A lower end of the mounting head 8 is fitted with multiple nozzles 8a that can hold components and move up and down in the Z-axis direction (arrow c in FIG. 2) and rotate around a vertical axis (Z-axis).

[0016] The Y-axis table 6 and the beam 7 constitute a mounting head moving mechanism that moves the mounting head 8 in horizontal directions (X-axis direction, Y-axis direction). The mounting head moving mechanism and the mounting head 8 constitute a component mounting means 9 that performs the component mounting work of picking up components from the component supply unit 4 and mounting them at the mounting position on the board KB.

[0017] 2, in component mounting work, the mounting head 8 moves above the component supply unit 4 and picks up a predetermined component supplied from a predetermined tape feeder 5 with each nozzle 8a. The mounting head 8 then moves above the board KB and rotates the components held by each nozzle 8a in a predetermined direction, repeating a series of turns (mounting turns) to mount the components at their respective mounting positions (arrow d). In this way, the component mounting device M produces mounted boards by repeating turns in which each of the multiple nozzles 8a picks up components and mounts them on the board KB.

[0018] 1, a head camera 10 is attached to the beam 7, which is located on the underside of the beam 7 and moves integrally with the mounting head 8. As the mounting head 8 moves, the head camera 10 moves above the board KB positioned at the mounting work position of the board transport mechanism 3, and captures images of board marks (not shown) provided on the board KB, component mounting positions, and the like.

[0019] In Fig. 1, a component recognition camera 11 and a component disposal unit 12 are disposed between the component supply unit 4 and the board transport mechanism 3. When the mounting head 8, which has taken out a component from the component supply unit 4, is positioned above the component recognition camera 11, the component recognition camera 11 captures an image of the component held by the nozzle 8a from below. From the captured image, the holding posture of the component is recognized and the presence or absence of a suction failure is determined. During the component mounting operation of the mounting head 8 on the board KB, the mounting position is corrected taking into account the captured image of the board KB by the head camera 10 and the captured image of the component by the component recognition camera 11.

[0020] In the component disposal section 12, components that are determined to have poor suction based on the imaging results by the component recognition camera 11 are disposed without being mounted on the board KB. A touch panel 13 operated by the worker is provided in front of the component mounting device M at a position where the worker works. The touch panel 13 displays various information such as warnings on its display section, and the worker inputs data and operates the component mounting device M using operation buttons and the like displayed on the display section.

[0021] Next, the configuration of the control system of the component mounting system 1 will be described with reference to Fig. 3. Here, the description will focus on the function of creating mounting data that allows multiple special components to be appropriately mounted on the board KB in the production of mounted boards in which the turns of mounting components on the board KB using multiple nozzles 8a are repeated. The board transport mechanism 3, the component supply unit 4, the component mounting means 9, the head camera 10, the component recognition camera 11, and the touch panel 13 are connected to the control device 20 provided in the component mounting device M. The control device 20 also includes a mounting memory unit 21, a mounting control unit 22, and a mounting communication unit 23. The mounting memory unit 21 is a storage device, and stores mounting data 21a and the like.

[0022] The mounting data creation device CP includes a management storage unit 31, a management communication unit 32, a component information acquisition means 33, and a mounting data creation unit 34. The management storage unit 31 is a storage device, and stores production data 31a, component data 31b, mounting data 31c, device data 31d, etc. The mounting communication unit 23 and the management communication unit 32 are communication devices, and are connected to each other via a communication network NT, and transmit and receive various types of data to and from each other.

[0023] 3, production data 31a includes board data for mounting boards. The board data includes information such as the board size, the type of components to be mounted (component number) and mounting position (XY coordinates, θ direction), and reference mark position (XY coordinates) for each type of mounting board. Component data 31b includes information such as component specification information (shape, dimensions, etc.) for each component number, operation parameters (speed, acceleration, etc.), and constraints on component mounting work.

[0024] An example of component data 31b will now be described with reference to Fig. 4. The component data 31b includes, for each component number 40, size information such as component length 41, width 42, height 43, and other information on limitations during component mounting work such as simultaneous pickup limitation information 44. The simultaneous pickup limitation information 44 includes the maximum number (limitations) of components of the same type that the mounting head 8 can simultaneously pick up (hereinafter simply referred to as "simultaneous pickup") in one turn (the same turn) of the component mounting work.

[0025] In the example of FIG. 4, the simultaneous pick-up limit information 44 is the maximum number of parts that can be picked up simultaneously. A part with simultaneous pick-up limit information 44 of "0" indicates that there is no limit to simultaneous pick-up. A simultaneous pick-up limit information 44 of "1" or more indicates that there is a limit to simultaneous pick-up. For example, simultaneous pick-up is limited for special parts such as expensive parts with a high price per unit or parts with low production numbers or inventory. A part with part number 40 of "bb" has a limit on simultaneous pick-up, and the maximum number of parts that can be picked up simultaneously is "1". Additionally, there is no limit on simultaneous pick-up for parts with part numbers 40 of "aa", "cc", and "dd".

[0026] 3, mounting data 31c includes the production model name of the mounted board, the component number (type of component) specifying the type of component to be mounted on board KB, the component supply position in component supply unit 4 (position of tape feeder 5), the mounting position (XY coordinates), the mounting direction, the mounting order, etc. Device data 31d includes information related to the configuration of component mounting device M, such as the number of mounting heads 8 equipped in component mounting device M, the number of nozzles 8a that mounting head 8 has.

[0027] 3, the mounting data creation unit 34 creates mounting data 31c based on the production data 31a, the component data 31b, and the device data 31d. When the mounting data creation unit 34 creates the mounting data 31c, the component information acquisition means 33 acquires information on whether there is a limit on simultaneous pickup of components to be mounted on the mounting board (whether there is a limit on the number of components to be picked up in one turn) from the management storage unit 31 of the mounting data creation device CP or an external database. In this embodiment, the component information acquisition means 33 extracts components with a limit on simultaneous pickup (components whose simultaneous pickup limit information 44 is "1" or more) from the component data 31b stored in the management storage unit 31 of the mounting data creation device CP. Note that the component information acquisition means 33 may be a device independent of the mounting data creation device CP.

[0028] For components with a limited number of components to be picked up in one turn (the same turn) (components with a limit on simultaneous pick-up), the mounting data creation unit 34 creates mounting data 31c so that the number of components to be picked up in one turn is equal to or less than a predetermined number (the maximum number included in the simultaneous pick-up limit information 44). The created mounting data 31c is transmitted to the component mounting device M and stored in the mounting storage unit 21 as mounting data 21a.

[0029] Here, an example of mounting data 31c created by mounting data creation unit 34 will be described with reference to Fig. 5. Mounting data 31c includes nozzle number 46, component number 40, component supply position 47, mounting position (X coordinate 48, Y coordinate 49, θ direction 50), and simultaneous pickup restriction information 44 for each turn number 45. In this example, component mounting device M is equipped with one mounting head 8, and mounting head 8 has four nozzles 8a. That is, in one turn, each of four nozzles 8a with nozzle numbers 46 "1" to "4" holds a component with component number 40, and the component is mounted in the mounting position in order. Component supply position 47 indicates the supply position (slot number, etc.) of tape feeder 5 that supplies the component with component number 40.

[0030] For the sake of convenience, parts other than those with part numbers 40 "aa", "bb", and "cc" are not displayed in Fig. 5. According to part data 31b shown in Fig. 4, there is no limit to the number of parts with part numbers 40 "aa" and "cc" that can be picked up simultaneously, but the maximum number of parts with part number 40 "bb" (hereinafter referred to as "part bb") that can be picked up simultaneously is limited to one. Therefore, mounting data creation unit 34 creates part data 31b so that part bb is held by only one of the four nozzles 8a in one turn.

[0031] 5, component data 31b is created so that component bb, which has a limit on simultaneous pickup, is held only by nozzle 8a with nozzle number 46 of "1" in the turn with turn number 45 of "2" (hereinafter referred to as "turn T2" etc.), and only by nozzle 8a with nozzle number 46 of "2" in turn T5. Also, since there is no limit on simultaneous pickup of component aa, component data 31b is created so that component data 31b is held by two nozzles 8a with nozzle numbers 46 of "2" and "3" in turn T3, taking into account the efficiency of component mounting work.

[0032] In this way, the mounting data creation device CP includes a component information acquisition means 33 that acquires information (simultaneous pick-up limit information 44) as to whether or not to limit the number of components that can be picked up in one turn for each of a plurality of components when the component mounting device M performs production in accordance with the mounting data 21a, and a mounting data creation unit 34 that creates mounting data 31c for components for which the number of components that can be picked up in one turn is limited so that the number of components that can be picked up in one turn is equal to or less than a predetermined number (the maximum number included in the simultaneous pick-up limit information 44).

[0033] 3, the mounting control unit 22 controls the component supply unit 4 (tape feeder 5) and the component mounting means 9 based on the mounting data 21a to mount the components supplied from the component supply unit 4 at the mounting positions on the board KB. The mounting control unit 22 also causes the component discard unit 12 to discard the components determined to be poorly picked up based on the image of the components held by the nozzle 8a captured by the component recognition camera 11. Furthermore, the mounting control unit 22 causes the mounting head 8 to pick up (re-pick up) the same type of component as the discarded component (the component with the same component number 40) and mount (re-mount) it at the mounting position on the board KB.

[0034] When the component to be remounted is a component with a limit on simultaneous pickup (a component with simultaneous pickup limit information 44 of "1" or more), the mounting control unit 22 controls the number of components to be re-pickup by the mounting head 8 to be equal to or less than the maximum number included in the simultaneous pickup limit information 44. That is, when performing production in accordance with the mounting data 21a, when re-mounting onto the board KB a component of the same type as a component that was discarded without being mounted on the board KB, if the discarded components include a component with a limit on the number that can be picked up in one turn in the mounting data 21a, the mounting control unit 22 (component mounting device M) re-mounts the component so that the number that can be picked up in one turn is equal to or less than a predetermined number (the maximum number included in the simultaneous pickup limit information 44).

[0035] Next, following the flow of Fig. 6 and referring to the mounting data 21a shown in Fig. 5, a component mounting method for performing production by repeating a turn of picking up components with each of the multiple nozzles 8a and mounting them on the board KB will be described. First, the mounting control unit 22 causes each of the multiple nozzles 8a of the mounting head 8 to pick up components supplied by the tape feeder 5 at the supply position 47 of the component supply unit 4 in accordance with the mounting data 21a (ST1: component pick-up step). Next, the mounting control unit 22 causes the component recognition camera 11 to capture an image of the components held by the nozzles 8a, and judges whether or not there is a component that has not been properly picked up based on the imaged result (ST2: poor pick-up judgement step).

[0036] If there are no components with poor suction (No in ST2), the mounting control unit 22 mounts each of the multiple components held by the mounting head 8 at the mounting positions (X coordinate 48, Y coordinate 49, mounting direction 50) in accordance with the mounting data 21a (ST3: component mounting step). Then, the process returns to the component pickup step (ST1) and the next turn is executed. In this way, the process from the component pickup step (ST1) to the component mounting step (ST3) is a mounting step (ST10) in which components are mounted on the board KB in accordance with the mounting data 21a.

[0037] 6, if there is a component that has failed to be picked up (Yes in ST2), the mounting control unit 22 has the component discard unit 12 discard the failed component (ST4: discarding step). In the discarding step (ST4), if the mounting head 8 holds a component (same type of component) with the same component number 40 as the failed component in addition to the failed component, the component discarding unit 12 also discards the other components of the same type. Thus, in the discarding step (ST4), the component picked up by the nozzle 8a in the mounting step (ST10) is discarded without being mounted on the board KB.

[0038] 5, if a component bb with component number 40 "bb" held by nozzle 8a with nozzle number 46 "1" is determined to have a pickup failure in turn T2 with turn number 45 "2" (Yes in ST2), the component bb held by nozzle 8a with nozzle number 46 "1" is discarded by component discard unit 12 (ST4). In this embodiment, the mounting data 21a is created so that only one component bb with a limit on simultaneous pickup is picked up in one turn, and therefore two or more components bb are not discarded in the discard step (ST4) of the same turn.

[0039] On the other hand, in turn T3, if the component aa held by the nozzle 8a with the nozzle number 46 of "2" is determined to be poorly picked up (Yes in ST2), in addition to the component aa held by the nozzle 8a with the nozzle number 46 of "2", the component aa held by the nozzle 8a with the nozzle number 46 of "3" is also discarded by the component discard unit 12 (ST4). In other words, for parts aa with no limit on simultaneous pickup, two or more may be discarded in the discard step (ST4) of the same turn.

[0040] Even if the components supplied from the same tape feeder 5 are not judged to have poor suction from the imaging results of the component recognition camera 11, there is a risk of quality problems such as misalignment after being mounted on the board KB. In the component mounting method of this embodiment, components of the same type as the components judged to have poor suction from the imaging results held by the mounting head 8, i.e., components supplied from the same tape feeder 5, are discarded without being mounted on the board KB, thereby preventing quality problems that may occur during mounting. Furthermore, in the component mounting method of this embodiment, the number of special components that can be picked up in one turn is limited for those that have a limit on simultaneous pickup, so that even if a special component is judged to have poor suction, it is possible to prevent the special component from being wasted.

[0041] 6, next, the mounting control unit 22 mounts the components held by the mounting head 8 at the mounting positions without discarding them, in accordance with the mounting data 21a (ST5: remaining component mounting step). Next, the mounting control unit 22 causes the nozzle 8a of the mounting head 8 to pick up (hereinafter referred to as "re-pickup") the same type of component as the component discarded in the discarding step (ST4), in accordance with the mounting data 21a (ST6: component re-pickup step).

[0042] For example, if one part bb is discarded in the discard step (ST4) of turn T2, then in the part re-pickup step (ST6) of turn T2, the part bb is re-pickup to the nozzle 8a whose nozzle number 46 is "1." If two parts aa are discarded in the discard step (ST4) of turn T3, then in the part re-pickup step (ST6) of turn T3, the parts aa are re-pickup to the nozzles 8a whose nozzle numbers 46 are "2" and "3," respectively.

[0043] In FIG. 6, next, the mounting control unit 22 causes the component recognition camera 11 to capture an image of the component re-sucked to the nozzle 8a, and determines whether or not there is a component that has failed to be picked up based on the captured image (ST7: re-sucking failure determination step).

[0044] If there are no components that have not been properly picked up (No in ST7), the mounting control unit 22 causes the mounting head 8 to mount (hereinafter referred to as "remount") the components that have been re-pickup at the mounting positions in accordance with the mounting data 21a (ST8: component remounting process). Then, the process returns to the component pickup process (ST1) and the next turn is executed. In this way, the component re-pickup process (ST6) to the component remounting process (ST8) are a remounting process (ST11) in which, if there are components discarded in the discarding process (ST4), a component of the same type as the discarded component is remounted on the board KB in accordance with the mounting data 21a.

[0045] In FIG. 6, if there is a component that has not been properly picked up (Yes in ST7), mounting control unit 22 interrupts the component mounting operation and causes touch panel 13 to display a warning to the effect that there is a component that has not been properly picked up (ST9: warning step).

[0046] The mounting data 21a is created by the mounting data creation device CP so that, for components with a limit on simultaneous pickup (components for which simultaneous pickup limit information 44 is "1" or more), the number of components picked up in one turn is less than or equal to a predetermined number (the maximum number included in simultaneous pickup limit information 44). Therefore, by performing the remounting process (ST11) in the same turn, the number of components picked up in one turn by the mounting head 8 in the component re-pickup process (ST6) with a limit on simultaneous pickup is less than or equal to the maximum number.

[0047] For example, if a component bb that has a limit on simultaneous pickup (simultaneous pickup limit information 44 is "1") is discarded in the discard step (ST4) of turn T2, then in the remounting step (ST11), only one component bb is re-picked up by the mounting head 8 (ST6). That is, a number of components bb greater than the maximum number will not be re-picked up by the mounting head 8. On the other hand, if two components aa are discarded in the discard step (ST4) of turn T3, then there is no limit on simultaneous pickup of the component aa (simultaneous pickup limit information 44 is "0"), so in the remounting step (ST11), two components aa are re-picked up by the mounting head 8 (ST6).

[0048] The remounting step (ST11) may be executed for each turn, or may be executed for all discarded components collectively after all turns specified in the mounting data 21a have been executed. In this case, if the components to be re-pickup include components for which simultaneous pick-up is restricted (components for which simultaneous pick-up restriction information 44 is "1" or more) based on the simultaneous pick-up restriction information 44 of the mounting data 21a, the mounting control unit 22 re-pickups the components so that the number of components picked up in one turn is equal to or less than the maximum number.

[0049] In this way, in the remounting step (ST11), if there is a component among the remounted components for which the number of components that can be picked up in one turn is limited in the mounting data 21a (components with limitations on simultaneous pickup), the mounting control unit 22 remounts the components so that the number of components that can be picked up in one turn is equal to or less than a predetermined number. This makes it possible to reduce the number of special components (components with limitations on simultaneous pickup) that are discarded in the production of mounted boards in which the turns of mounting components on the board KB with multiple nozzles 8a are repeated.

[0050] As described above, the component mounting system 1 of this embodiment includes a component mounting device M that performs production by repeating a turn of picking up components with each of a plurality of nozzles 8a and mounting them on a board KB, a component information acquisition means 33 that acquires information (simultaneous pickup limit information 44) on whether or not to limit the number of components to be picked up in one turn for each of a plurality of components when the component mounting device M performs production according to the mounting data 21a, and a mounting data creation device CP that creates mounting data 21a for components that limit the number to be picked up in one turn (components with a limit on simultaneous pickup) so that the number of components to be picked up in one turn is equal to or less than a predetermined number (maximum number). This makes it possible to reduce the number of special components (components with a limit on simultaneous pickup) that are discarded. [Industrial Applicability]

[0051] The component mounting system, component mounting device, and component mounting method of the present invention have the effect of reducing the number of special components that are discarded in the production of mounted boards, which involves repeated turns of mounting components to the board with multiple nozzles, and are useful in the field of mounting components to boards. [Explanation of symbols]

[0052] 1 Component mounting system 8a Nozzle KB board M Component Mounting Equipment

Claims

1. a component mounting device that performs production by repeatedly picking up components with each of a plurality of nozzles and mounting them on a board; a component information acquisition means for acquiring information on whether or not to limit the number of components that can be picked up in one turn for each of a plurality of components when the component mounting device performs production in accordance with the mounting data; and a mounting data creation device that creates the mounting data for components that have a limited number of components that can be picked up in one turn so that the number of components that can be picked up in one turn is a predetermined number or less.

2. A component mounting apparatus that performs production by repeatedly rotating a plurality of nozzles to pick up components and place them on a board, A component mounting device that, when performing production according to mounting data, re-mounts on the board a component of the same type as a component that was discarded without being mounted on the board, and if the discarded components include a component for which the number that can be picked up in one turn is limited in the mounting data, re-mounts the component so that the number of components that can be picked up in one turn is a predetermined number or less.

3. A component mounting method for manufacturing a component by repeatedly picking up components with each of a plurality of nozzles and mounting them on a board, comprising: a mounting step of mounting components on the board in accordance with mounting data; a discarding step of discarding the component picked up by the nozzle in the mounting step without mounting it on the board; a remounting step of, when there is a component discarded in the discarding step, remounting a component of the same type as the discarded component on the board in accordance with the mounting data, In the remounting step, if there is a component among the components to be remounted, the number of components that can be picked up in one turn is limited in the mounting data, the component is remounted so that the number of components that can be picked up in one turn is equal to or less than a predetermined number.

Images