Power converter

Abstract

To provide a power converter that suppresses temperature increases in electronic components placed around heat-generating members.SOLUTION: A power converter 1A includes a heat-generating member 3 having a heat-generating element 31 that generates heat when activated, electronic components 4 arranged around the heat-generating member with a gap between them, a housing 2 having a base portion 23 on which the heat-generating member is arranged and which has a cooling flow path 25 through which a cooling medium can flow, and a heat dissipation member 7A having a base end portion 71a fixed to the base portion and extending away from the heat-generating member.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present disclosure relates to power converters. [Background technology]

[0002] Patent Document 1 discloses a power converter having a semiconductor module with a built-in switching element, a cooler for cooling the semiconductor module, and a pressing member for clamping the semiconductor module together with the cooling tube of the cooler. This power converter cools the semiconductor module, which is a heat-generating component that generates heat during operation, by pressing the semiconductor module against the cooling tube of the cooler with the pressing member. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2014-143303 A Summary of the Invention [Problem to be solved by the invention]

[0004] When a heat-generating component generates high heat, even if the heat-generating component is cooled by a cooler, the heat that cannot be completely cooled may affect other electronic components arranged around the heat-generating component. However, in the configuration described in Patent Document 1, the cooler can cool the heat-generating component itself, but cannot cool other electronic components arranged around the heat-generating component. As a result, the temperature of the other electronic components may rise, causing them to stop operating normally.

[0005] The present disclosure has been made to solve the above-mentioned problems, and has an object to provide a power converter that can suppress a rise in temperature of electronic components arranged in the vicinity of a heat-generating component. [Means for solving the problem]

[0006] In order to solve the above problems, the power converter of the present disclosure comprises a heat-generating component having a heat-generating element that generates heat when activated, electronic components arranged around the heat-generating component with a gap between them, a housing having a base on which the heat-generating component is arranged and which has a cooling flow path through which a cooling medium can flow, and a heat dissipation member having a base end fixed to the base and extending away from the heat-generating component. Effect of the Invention

[0007] According to the power converter of the present disclosure, it is possible to suppress a rise in temperature of electronic components arranged around a heat-generating component. [Brief description of the drawings]

[0008] [Figure 1] 1 is a cross-sectional view of a power converter according to a first embodiment of the present disclosure. [Diagram 2] 1 is a plan view of a power converter according to a first embodiment of the present disclosure with a cover removed; [Diagram 3] 2 is a plan view showing a heat dissipation member provided apart from a heat generating member in a power converter according to a first embodiment of the present disclosure. FIG. [Figure 4] 13A to 13C are diagrams illustrating a fixing structure of a base end portion of a heat dissipation member to a base portion according to a modified example of the first embodiment of the present disclosure. [Diagram 5] 13A to 13C are diagrams illustrating a fixing structure of a base end portion of a heat dissipation member to a base portion according to another modified example of the first embodiment of the present disclosure. [Figure 6] FIG. 4 is a cross-sectional view of a power converter according to a second embodiment of the present disclosure. [Figure 7] FIG. 11 is a plan view showing a heat dissipation member provided apart from a heat generating member in a power converter according to a second embodiment of the present disclosure. [Figure 8] 13A and 13B are diagrams illustrating a heat dissipation member according to a modified example of the second embodiment of the present disclosure. [Figure 9] FIG. 11 is a cross-sectional view of a power converter according to a third embodiment of the present disclosure. [Figure 10] 13A and 13B are diagrams illustrating a heat dissipation member according to a modified example of the third embodiment of the present disclosure. [Figure 11] FIG. 11 is a cross-sectional view of a power converter according to a fourth embodiment of the present disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] First Embodiment (Power converter configuration) Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. As shown in FIGS. 1 and 2, a power converter 1A includes a housing 2, a heat generating member 3, an electronic component 4, and a heat dissipation member 7A. The power converter 1A converts, for example, a direct current input from the outside into an alternating current and outputs the alternating current to the outside.

[0010] The housing 2 accommodates a heat generating member 3, an electronic component 4, and a heat dissipation member 7A. The housing 2 is, for example, in the shape of a hollow box, and includes a lower housing 21 and a lid 22 (see FIG. 1). The lower housing 21 and the lid 22 constituting the housing 2 are each formed from a metal material such as an aluminum alloy, a stainless steel alloy, or an iron-based alloy.

[0011] The lower housing 21 is integrally provided with a base portion 23 and a peripheral wall portion 24, for example. The base portion 23 is in the form of a flat plate, and has, on one side thereof, a fixing surface 23f to which the heat generating member 3 and the electronic component 4 are fixed. The base portion 23 is formed, for example, in a rectangular shape when viewed in the plate thickness direction Dt of the base portion 23. The shape of the base portion 23 when viewed in the plate thickness direction Dt is not limited to a rectangular shape, and may be a circular shape, an elliptical shape, a polygonal shape, or the like.

[0012] The base portion 23 has a cooling passage 25 for cooling the heat generating member 3 and the electronic component 4 fixed to the fixing surface 23f. For example, the cooling passage 25 may be provided in the base portion 23 across an area overlapping a part of the heat-generating member 3 and an area overlapping a part of the electronic component 4 when viewed in the plate thickness direction Dt of the base portion 23. A cooling medium such as water or antifreeze liquid supplied from outside the housing 2 flows through the cooling flow passage 25. The base portion 23 is cooled by a cooling medium flowing through a cooling passage 25 .

[0013] The peripheral wall portion 24 rises from the outer circumferential edge of the base portion 23 to one side in the plate thickness direction Dt of the base portion 23. The peripheral wall portion 24 is formed so as to surround the periphery of the heat generating member 3 and the electronic component 4 which are fixed to the base portion 23 . The peripheral wall portion 24 may be formed with, for example, holes, slits, etc. for dissipating heat. The peripheral wall portion 24 may be configured, for example, without any holes or slits. The peripheral wall portion 24 may be formed integrally with the base portion 23, for example. The peripheral wall portion 24 may be, for example, a separate body from the base portion 23 and joined to the base portion 23 . The lower housing 21 has an accommodation space S surrounded by a base portion 23 and a peripheral wall portion 24 . The housing space S is a space for housing the heat generating member 3 and the electronic component 4. The lower housing 21 has an opening 21a that opens to one side in the plate thickness direction Dt.

[0014] As shown in FIG. 1, the lid 22 is provided on the side of the peripheral wall portion 24 opposite the base portion 23 . The lid 22 closes the opening 21 a of the lower housing 21 . The lid 22 may be provided to the lower housing 21 so as to be openable and closable, for example, by means of a bolt, an appropriate locking hook, or the like. The lid 22 may be attached to the lower housing 21 by riveting, welding, brazing, adhesion, or the like so as to be unable to be opened or closed. In order to improve the sealing performance, a packing, a gasket, a sealant (none of which are shown) or the like may be interposed between the lid 22 and the peripheral wall portion 24. As a modified example, the housing 2 may not include the lid 22.

[0015] As shown in FIGS. 1 and 2, the heat generating member 3 has a heat generating element 31 that generates heat when activated. In this embodiment, the heating element 31 is a semiconductor element. In this embodiment, the heat generating member 3 includes a semiconductor element as the heat generating element 31. The heating element 31 may be a semiconductor element generally applied to power converters, such as an inverter circuit, a converter circuit, etc. The semiconductor elements serving as the heating elements 31 may be provided for three phases, for example, U phase, V phase, and W phase. In this case, the heating elements 31 for the three phases may be arranged at intervals along the fixing surface 23f of the base portion 23. Each heating element 31 is fixed to the base portion 23 . Each heating element 31 has one surface in contact with the fixing surface 23 f of the base portion 23 . Each heat generating element 31 is cooled by a base portion 23 having a cooling passage 25 through which a cooling medium flows. The heat generating member 3 may be, for example, a power module. In this case, the heat generating member 3 may be electrically connected to, for example, an external motor (not shown) or the like via a bus bar (not shown) penetrating the housing 2.

[0016] The electronic components 4 are disposed in the housing 2 around the heat generating member 3 . In this embodiment, the electronic component 4 includes, for example, a capacitor 41 and a substrate . The electronic components 4 are not limited to the capacitor 41 and the substrate 42, and may include other components as appropriate.

[0017] The capacitor 41 is electrically connected to an external DC power supply (not shown) or the like via a bus bar (not shown) that penetrates the housing 2. The capacitor 41 temporarily stores electrical energy supplied from the outside via the bus bar. The capacitor 41 is connected to the semiconductor element of each phase, which is the heating element 31 . An openable and closable gate (not shown) is provided between the capacitor 41 and the semiconductor element of each phase, which is the heating element 31, and the operation of the gate is controlled by a controller (not shown) provided on the substrate 42 described below.

[0018] The board 42 includes a controller (not shown) that controls the operation of the power converter 1A. The substrate 42 is fixed to the lower housing 21 via a bracket or the like (not shown). On the board 42, a plurality of electronic components (not shown) that constitute the controller are mounted. The substrate 42 controls, for example, a power module which is the heat generating member 3 . The substrate 42 detects, for example, a direct current input to the capacitor 41 via a bus bar (not shown). The substrate 42 controls the operation of the gates in response to the detected direct current, thereby controlling the semiconductor elements of each phase as the heating elements 31 .

[0019] The electronic components 4 (capacitor 41, substrate 42) are provided in the housing 2 around the heat generating member 3. As shown in FIG. 1, the electronic component 4 is provided between the heat generating member 3 and the electronic component 4 with a gap therebetween. The capacitor 41 is disposed relative to the heat generating member 3, intersecting the plate thickness direction Dt of the base portion 23 and separated from the heat generating member 3 by a gap S1 in a direction along the fixing surface 23f. The substrate 42 is provided at a position where at least a portion of the substrate 42 overlaps with the heat generating member 3 when viewed in the plate thickness direction Dt. The substrate 42 is provided at a predetermined distance from the heat generating member 3 in the plate thickness direction Dt. Between the substrate 42 and the heat generating member 3, a gap S2 is provided.

[0020] As shown in FIGS. 1 to 3, the heat dissipation member 7A extends away from the heat generating member 3. As shown in FIG. The heat dissipation member 7A is configured to remove heat generated from the heat generating member 3 to the surroundings during operation at a position away from the heat generating member 3, and dissipate the heat to the base portion .

[0021] On the other hand, the heat dissipation member 7 A is not in contact with the heat generating member 3 . In other words, the heat dissipation member 7A is configured so as not to directly remove from the heat generating member 3 the heat that is generated by the heat generating member 3 during operation.

[0022] In this embodiment, the heat dissipation member 7A is, for example, a wire 71. The wires 71 are preferably made of a material with high thermal conductivity, such as, for example, silver, copper, gold, an aluminum alloy, a nickel alloy, or platinum. In this embodiment, the wire 71 can be easily deformed by an external force, such as by the hand of an operator. In this embodiment, the wire 71 is provided so as to straddle the heat generating member 3, for example. In this embodiment, the wire 71 is provided so as to straddle each of the heat generating elements 31 (semiconductor elements) of the heat generating member 3 . In this embodiment, two wires 71 are provided crossing each other so as to diagonally straddle each heating element 31 when viewed in the plate thickness direction Dt.

[0023] As shown in FIGS. 1 and 3, each wire 71 has base ends 71a at both ends fixed to the base portion . The wire 71 has a pair of extending portions 71b provided at both ends thereof, and a gap extending portion 71c provided between the pair of extending portions 71b. Each of the pair of extending portions 71b extends from a base end portion 71a fixed to the base portion 23 in a direction (plate thickness direction Dt) in which the heat generating member 3 and the substrate 42 (electronic component 4) face each other with a gap S2 therebetween. The base end 71a and the extending portion 71b at both ends of the wire 71 are provided on both sides sandwiching the heat generating member 3 when viewed in the plate thickness direction Dt.

[0024] The gap extension portion 71c extends in the gap S2 between the heat generating member 3 and the electronic component 4 in a direction intersecting the direction in which the heat generating member 3 and the electronic component 4 face each other (the plate thickness direction Dt). The gap extension 71c is provided with a gap between the heat generating member 3 and the electronic component 4. The gap extending portion 71c is provided so as to connect the pair of extending portions 71b to each other.

[0025] The capacitor 41 becomes hotter than the substrate 42 during operation, and therefore also functions as a heat generating member. For this reason, in this embodiment, a gap S1 is also provided between the substrate 42 which is the electronic component 4 and the capacitor 41 which functions as a heat generating member. Furthermore, the wire 71 is provided so as to straddle not only the heat generating member 3 but also the capacitor 41 which also functions as a heat generating member. The wire 71 spanning the capacitor 41 absorbs heat emitted from the capacitor 41 to the surroundings and dissipates the heat to the base portion 23.

[0026] As shown in FIG. 3, the base portion 23 is provided with an attachment portion 28 for fixing the heat dissipation member 7A. To the mounting portion 28, a base end portion 71a of a wire 71 which is the heat dissipation member 7A can be attached. The base end portion 71 a is fixed to the base portion 23 by being attached to the attachment portion 28 . In this embodiment, the attachment portion 28 is a recess 281 recessed from a fixing surface 23f, which is the surface of the base portion 23. The base end 71a of the wire 71 is inserted into the recess 281 and fixed to the recess 281 by a joining means such as an adhesive, soldering, or brazing.

[0027] Such an attachment portion 28 (recess 281) is formed at least at a position corresponding to the base end portion 71a of the wire 71 which is the heat dissipation member 7A. A plurality of mounting portions 28 may be provided in advance on base portion 23 at predetermined intervals. When multiple mounting portions 28 are provided on the base portion 23 in advance at a predetermined interval, the base end 71a of the wire 71, which is the heat dissipation member 7A, is fixed to an appropriately selected mounting portion 28 from among the multiple mounting portions 28.

[0028] The heat dissipation member 7A may further include a plate-shaped portion 78. The plate-like portion 78 is disposed in the gap S2 between the heat generating member 3 and the electronic component 4. The plate-like portion 78 extends along a plane intersecting the direction in which the heat generating member 3 and the electronic component 4 face each other (plate thickness direction Dt). The plate-like portion 78 is joined to the wire 71, which is the heat dissipation member 7A, by adhesion, soldering, brazing, or the like. The plate-shaped portion 78 is provided such that at least a portion of the plate-shaped portion 78 overlaps at least a portion of the heat generating member 3 when viewed in the plate thickness direction Dt. Like the wire 71, the plate-like portion 78 is made of a material having high thermal conductivity, such as silver, copper, gold, an aluminum alloy, a nickel alloy, or platinum.

[0029] For example, the plate-like portion 78 may be disposed for each heating element 31 . In this case, the plate-shaped portion 78 may be provided at a position such that the plate-shaped portion 78 is included in the area occupied by each heating element 31 when viewed in the plate thickness direction Dt.

[0030] In such a power converter 1A, the heat-generating member 3 is provided on a base portion 23 having a cooling flow passage 25 through which a cooling medium can flow. As a result, the heat-generating member 3 in contact with the base portion 23 is cooled by the cooling medium flowing through the cooling flow passage 25. Further, a base end 71a of the heat dissipation member 7A is fixed to the base portion 23 having the cooling flow path 25. Therefore, the heat dissipation member 7A is cooled by the cooling medium flowing through the cooling flow path 25. Since the heat dissipation member 7A extends away from the heat generating member 3, the heat that is propagated from the heat generating member 3 through the atmosphere (air) in the housing 2 to the periphery of the heat generating member 3 is taken away by the heat dissipation member 7A.

[0031] (Action and Effects) According to the present embodiment, in the power converter 1A, heat that reaches the periphery of the heat generating member 3 from the heat generating member 3 is removed by the heat dissipation member 7A. This prevents the heat from the heat generating member 3 from reaching the electronic components 4 provided in the periphery of the heat generating member 3. As a result, the temperature rise of the electronic components 4 arranged in the periphery of the heat generating member 3 can be suppressed.

[0032] According to one example of this embodiment, the gap extension portion 71c is provided in the gap S2 between the heat generating member 3 and the electronic component 4, so that the gap extension portion 71c of the heat dissipation member 7A can efficiently remove the heat emitted from the heat generating member 3. Therefore, the influence of the heat of the heat generating member 3 on the electronic component 4 can be more effectively suppressed.

[0033] Furthermore, according to one example of this embodiment, the heat dissipation member 7A has an extension portion 71b extending from the base portion 23 in the direction in which the heat-generating member 3 and the electronic component 4 face each other, so that the heat emitted from the heat-generating member 3 and propagating to the surrounding area through the gap S2 between the heat-generating member 3 and the electronic component 4 can be removed by the extension portion 71b.

[0034] According to one example of this embodiment, the heat dissipation member 7A is a wire 71. The wire 71 can be easily deformed by the hand of an operator or the like. Therefore, the wire 71 can be easily laid out in the gap S2 between the heat generating member 3 and the electronic component 4 while avoiding interference between the heat generating member 3 and the electronic component 4 inside the housing 2.

[0035] According to one example of the present embodiment, the heat dissipation member 7A further includes a plate-shaped portion 78 joined to the heat dissipation member 7A in the gap S2 between the heat generating member 3 and the electronic component 4. This allows the plate-shaped portion 78 to more effectively remove heat from the heat generating member 3 to the periphery of the heat generating member 3.

[0036] Furthermore, according to one example of this embodiment, multiple mounting portions 28 are formed on the base portion 23, so that the heat dissipation member 7A can be easily positioned in an appropriate position depending on the positions of the heat-generating member 3 and the electronic components 4, etc., arranged around it.

[0037] Furthermore, according to one example of the present embodiment, since the mounting portion 28 is the recess 281, by inserting the base end portion 71a of the heat dissipation member 7A into the recess 281, the heat dissipation member 7A can be easily attached to the base portion 23.

[0038] (Modification of the first embodiment) In the first embodiment, the base end 71a of the wire 71 is inserted into the recess 281 and joined by adhesive, soldering, brazing, or the like, but the present invention is not limited to this. For example, as shown in FIG. 4, a metallic male plug 76 may be attached to the base end 71 a of the wire 71 by crimping or the like, and the male plug 76 may be fitted into the recess 281 .

[0039] 5, instead of the recess 281, the base end 71a of the wire 71 may be joined to a protrusion 282 formed to protrude from the surface (fixing surface 23f) of the base part 23. In this case, a female plug 77 engageable with the protrusion 282 may be attached to the base end 71a of the wire 71 by crimping or the like, and the female plug 77 may be engaged (joined) with the protrusion 282.

[0040] Second Embodiment (Power converter configuration) Hereinafter, a second embodiment of the present disclosure will be described with reference to the drawings. In the following description, the same components as those in the first embodiment are denoted by the same reference numerals in the drawings, and the description thereof will be omitted. As shown in FIG. 6, the power converter 1B includes a housing 2, a heat generating member 3, an electronic component 4, and a heat dissipation member 7B. The heat dissipation member 7B extends away from the heat generating member 3. The heat dissipation member 7B is configured to remove heat generated from the heat generating member 3 to the surroundings during operation at a position away from the heat generating member 3, and dissipate the heat to the base portion .

[0041] On the other hand, the heat dissipation member 7 B is not in contact with the heat generating member 3 . In other words, the heat dissipation member 7B is configured not to directly remove the heat generated by the heat generating member 3 during operation.

[0042] In this embodiment, the heat dissipation member 7B is, for example, a rod 72. The bar 72 is preferably made of a material having high thermal conductivity, such as, for example, silver, copper, gold, an aluminum alloy, a nickel alloy, or platinum. In this embodiment, the rod 72 has a higher strength than the wire 71 in the first embodiment, and is difficult to deform by the hand of an operator or the like. In this embodiment, the rods 72 are provided on both sides of each heat generating element 31 (semiconductor element) of the heat generating member 3 . As shown in FIG. 7, in this embodiment, the rods 72 are provided at the four corners of each heating element 31 when viewed in the plate thickness direction Dt.

[0043] As shown in FIGS. 6 and 7, each bar 72 has base ends 72a fixed to the base portion 23 at both ends. The bar 72 has an extending portion 72b and a gap extending portion 72c. The extending portion 72b extends from the base end portion 72a fixed to the base portion 23 in a direction (plate thickness direction Dt) in which the heat generating member 3 and the substrate 42 (electronic component 4) face each other with a gap S2 therebetween. The gap extension portion 72c is provided continuously from the extension portion 72b. The gap extension portion 72c extends in the gap S2 between the heat generating member 3 and the electronic component 4 in a direction intersecting the direction in which the heat generating member 3 and the electronic component 4 face each other (the plate thickness direction Dt). The gap extension 72c is provided with a gap between the heat generating member 3 and the electronic component 4. The gap extension portion 72c extends toward the center of the heating element 31 when viewed in the plate thickness direction Dt. In this embodiment, the rod 72 is provided not only around the heat generating member 3 but also around the capacitor 41 .

[0044] The base end 72a of the rod 72 is inserted into a recess 281 serving as the attachment portion 28, and is fixed to the recess 281 by a joining means such as an adhesive, soldering, or brazing. The base end 72 a of the rod 72 may have a male screw groove formed on its outer circumferential surface, which may be screwed into a female screw groove formed in the recess 281 .

[0045] The heat dissipation member 7B may further include a plate-shaped portion 78. The plate-like portion 78 is joined to the rod 72, which is the heat dissipation member 7B, by adhesion, soldering, brazing or the like.

[0046] (Action and Effects) According to the present embodiment, in the power converter 1B, heat reaching the periphery of the heat generating member 3 is removed by the heat dissipation member 7B. This prevents the heat from the heat generating member 3 from reaching the electronic components 4 provided in the periphery of the heat generating member 3. As a result, the temperature rise of the electronic components 4 arranged in the periphery of the heat generating member 3 can be suppressed.

[0047] According to one example of this embodiment, the gap extension portion 72c is provided in the gap S2 between the heat generating member 3 and the electronic component 4, so that the gap extension portion 72c of the heat dissipation member 7B can efficiently remove the heat emitted from the heat generating member 3. Therefore, the influence of the heat from the heat generating member 3 on the electronic component 4 can be more effectively suppressed.

[0048] Furthermore, according to one example of this embodiment, the heat dissipation member 7B has an extension portion 72b extending from the base portion 23 in the direction in which the heat-generating member 3 and the electronic component 4 face each other, so that the heat emitted from the heat-generating member 3 and propagating to the surrounding area through the gap S2 between the heat-generating member 3 and the electronic component 4 can be removed by the extension portion 72b.

[0049] Furthermore, according to one example of this embodiment, by forming the heat dissipation member 7B from the bar material 72, the heat dissipation member 7B can have a simple configuration, and costs can be reduced.

[0050] (Modification of the second embodiment) In the second embodiment, the bar 72 has the extending portion 72b and the gap extending portion 72c, but the present invention is not limited to this. For example, as shown in FIG. 8, in a power converter 1C in this modification, a bar 73 serving as a heat dissipation member 7C has an extending portion 73b. The rod 73 has a base end 73 a fixed to the base portion 23 . The extending portion 73b extends from a base end portion 73a fixed to the base portion 23 in a direction (plate thickness direction Dt) in which the heat generating member 3 and the substrate 42 (electronic component 4) face each other with a gap S2 therebetween. The extending portion 73b is provided so that at least a portion of it faces the gap S2 between the heat generating member 3 and the electronic component 4. The extending portion 73b is provided such that at least a tip portion 73s thereof faces the gap S2 between the heat generating member 3 and the electronic component 4 in a direction intersecting with the plate thickness direction Dt.

[0051] In this modified example, at least a portion of the extension portion 73b is arranged to face the gap S2 between the heat-generating member 3 and the electronic component 4, so that the heat emitted from the heat-generating member 3 and propagated to the surrounding area through the gap S2 between the heat-generating member 3 and the electronic component 4 can be more efficiently removed.

[0052] <Third embodiment> (Power converter configuration) Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. In the following description, the same components as those in the first embodiment are denoted by the same reference numerals in the drawings, and the description thereof will be omitted. As shown in FIG. 9, a power converter 1D includes a housing 2, a heat generating member 3, an electronic component 4, and a heat dissipation member 7D. The heat dissipation member 7D extends away from the heat generating member 3. The heat dissipation member 7D is configured to remove heat generated from the heat generating member 3 to the surroundings during operation at a position away from the heat generating member 3, and dissipate the heat to the base portion .

[0053] On the other hand, the heat dissipation member 7D is not in contact with the heat generating member 3. In other words, the heat dissipation member 7D is configured not to directly remove from the heat generating member 3 the heat that is generated by the heat generating member 3 during operation.

[0054] In this embodiment, the heat dissipation member 7D is a pipe material 74, for example. The tubing 74 is preferably formed from a material having high thermal conductivity, such as, for example, silver, copper, gold, aluminum alloys, nickel alloys, platinum, or the like. In this embodiment, the pipe material 74 is provided so as to straddle the heat generating member 3, for example. In this embodiment, the pipe material 74 is provided so as to straddle each of the heat generating elements 31 (semiconductor elements) of the heat generating member 3 . In this embodiment, two pipe members 74 are provided crossing each other so as to diagonally straddle each heating element 31 when viewed from the plate thickness direction Dt.

[0055] Each pipe 74 has its base end 74 a fixed to the base portion 23 . A base end 74 a of the pipe 74 is connected to the cooling passage 25 of the base portion 23 . The pipe 74 includes a flow passage portion 74r that is provided so as to communicate with the cooling flow passage 25 of the base portion 23.

[0056] The pipe 74 has a pair of extending portions 74b provided at both ends thereof, and a gap extending portion 74c provided between the pair of extending portions 74b. Each of the pair of extending portions 74b extends from a base end portion 74a fixed to the base portion 23 in a direction (plate thickness direction Dt) in which the heat generating member 3 and the substrate 42 (electronic component 4) face each other with a gap S2 therebetween. Base end portions 74a at both ends of the pipe material 74 and extension portions 74b at both ends of the pipe material 74 are provided on both sides sandwiching the heat generating member 3 when viewed in the plate thickness direction Dt.

[0057] The gap extension portion 74c extends in the gap S2 between the heat generating member 3 and the electronic component 4 in a direction intersecting the direction in which the heat generating member 3 and the electronic component 4 face each other (the plate thickness direction Dt). The gap extension 74c is provided with a gap between the heat generating member 3 and the electronic component 4. The gap extension portion 74c is provided so as to connect the pair of extension portions 74b to each other.

[0058] The base end portion 74a is fixed to the base portion 23 by being attached to the attachment portion 28. In this embodiment, the attachment portion 28 is a recess 281 recessed from a fixing surface 23f, which is the surface of the base portion 23. The base end 74a of the pipe 74 may be inserted into the recess 281 and fixed to the recess 281 by a joining means such as an adhesive, soldering, or brazing. The proximal end 74 a of the tube 74 may be threaded into the recess 281 .

[0059] (Action and Effects) According to the present embodiment, in the power converter 1D, similarly to the above-described first embodiment, heat reaching the periphery of the heat generating member 3 is removed by the heat dissipation member 7D. This prevents the heat from the heat generating member 3 from reaching the electronic components 4 provided in the periphery of the heat generating member 3. As a result, the temperature rise of the electronic components 4 arranged in the periphery of the heat generating member 3 can be suppressed.

[0060] According to one example of this embodiment, the gap extension portion 74c is provided in the gap S2 between the heat generating member 3 and the electronic component 4, so that the gap extension portion 74c of the heat dissipation member 7D can efficiently remove the heat emitted from the heat generating member 3. Therefore, the influence of the heat of the heat generating member 3 on the electronic component 4 can be more effectively suppressed.

[0061] According to one example of the present embodiment, the flow path portion 74r of the pipe material 74, which is the heat dissipation member 7D, communicates with the cooling flow path 25 of the base portion 23, so that the cooling medium flowing through the cooling flow path 25 flows through the flow path portion 74r of the pipe material 74. This allows the heat dissipation member 7D to more efficiently remove heat from the heat-generating member 3 to the periphery of the heat-generating member 3.

[0062] (Modification of the third embodiment) The pipe material 74 shown in the above embodiment may be a so-called flexible pipe that can be easily deformed by the operator's hands, etc. Also, as shown in FIG. 10, a joint member 79 may be connected to the base end portion 74a of the pipe 74, and the joint member 79 may be fitted into the recess 281. As shown in FIG.

[0063] <Fourth embodiment> (Power converter configuration) Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. In the following description, the same components as those in the first embodiment are denoted by the same reference numerals in the drawings, and the description thereof will be omitted. As shown in FIG. 11, a power converter 1E includes a housing 2, a heat generating member 3, an electronic component 4, and a heat dissipation member 7A.

[0064] In this embodiment, the base portion 23 of the housing 2 is provided with high thermal conductivity portions 91 and 92. In this embodiment, the highly thermally conductive portion 91 is provided along the fixing surface 23f of the base portion 23. The highly thermally conductive portion 91 is connected to a wire 71 which is the heat dissipation member 7A. Moreover, the high thermal conductivity portion 92 is embedded in the base portion 23 and is connected to the cooling flow path 25 . Here, in this embodiment, the base portion 23 is formed, for example, from an iron-based metal, whereas the high thermal conductivity portions 91, 92 are formed from a material having a higher thermal conductivity than the base portion 23, such as silver, copper, gold, an aluminum alloy, a nickel alloy, or platinum.

[0065] (Action and Effects) According to the present embodiment, in the power converter 1E, similarly to the above-described first embodiment, heat reaching the periphery of the heat generating member 3 is removed by the heat dissipation member 7A. This prevents the heat from the heat generating member 3 from reaching the electronic components 4 provided in the periphery of the heat generating member 3. As a result, the temperature rise of the electronic components 4 arranged in the periphery of the heat generating member 3 can be suppressed.

[0066] According to one example of this embodiment, by providing the highly thermally conductive parts 91, 92 connected to at least one of the cooling flow path 25 and the heat dissipation member 7A on the base part 23, the heat released from the heat generating member 3 is more efficiently absorbed by the highly thermally conductive parts 91, 92 via the heat dissipation member 7A. Therefore, the influence of the heat from the heat generating member 3 on the electronic component 4 can be more effectively suppressed.

[0067] In the above-described embodiments, the plate-shaped portion 78 is provided, but the present invention is not limited to this.

[0068] Although some embodiments of the present disclosure have been described above, these embodiments are presented as examples and are not intended to limit the scope of the disclosure. These embodiments can be implemented in various other forms, and various omissions, substitutions, and modifications can be made without departing from the gist of the disclosure. These embodiments and their modifications are considered to be within the scope and gist of the disclosure, as well as within the scope of the disclosure and its equivalents.

[0069] <Additional Notes> The power converters 1A to 1E described in each embodiment can be understood, for example, as follows.

[0070] (1) The power converters 1A to 1E according to the first aspect comprise a heat generating member 3 having a heat generating element 31 that generates heat upon operation, an electronic component 4 arranged around the heat generating member 3 and separated from the heat generating member 3 by a gap S2, a housing 2 having a base portion 23 on which the heat generating member 3 is arranged and which has a cooling flow path 25 through which a cooling medium can flow, and heat dissipation members 7A to 7D whose base ends 71a, 72a, 73a, 74a are fixed to the base portion 23 and extend away from the heat generating member 3. Examples of the heat generating member 3 include a heat generating element 31 including a semiconductor element and a capacitor 41. Examples of the electronic component 4 include a capacitor 41 and a substrate 42 on which a plurality of electronic components are mounted.

[0071] In the power converters 1A to 1E, the heat generating member 3 is provided on a base portion 23 having a cooling passage 25 through which a cooling medium can flow. As a result, the heat generating member 3 is cooled by the cooling medium flowing through the cooling passage 25. In addition, the heat dissipation members 7A to 7D are fixed to the base portion 23 having the cooling passage 25. As a result, the heat dissipation members 7A to 7D are cooled by the cooling medium flowing through the cooling passage 25. Since the heat dissipation members 7A to 7D extend away from the heat generating member 3, the heat that reaches the periphery of the heat generating member 3 is taken away by the heat dissipation members 7A to 7D. As a result, the heat from the heat generating member 3 is prevented from reaching the electronic components 4 provided around the heat generating member 3. As a result, the temperature rise of the electronic components 4 arranged around the heat generating member 3 can be prevented.

[0072] (2) The power converters 1A, 1B, 1D according to the second aspect are the power converters 1A, 1B, 1D of (1), wherein the heat dissipation members 7A, 7B, 7D are provided with gap extension portions 71c, 72c, 74c extending in a direction intersecting the direction in which the heat generating member 3 and the electronic component 4 oppose each other in the gap S2 between the heat generating member 3 and the electronic component 4.

[0073] As a result, by providing the gap extensions 71c, 72c, and 74c in the gap S2 between the heat generating member 3 and the electronic component 4, the heat dissipated from the heat generating member 3 can be efficiently removed by the gap extensions 71c, 72c, and 74c of the heat dissipation members 7A, 7B, and 7D. Therefore, the influence of the heat from the heat generating member 3 on the electronic component 4 can be more effectively prevented.

[0074] (3) The power converters 1A to 1D according to a third aspect are the power converters 1A to 1D of (1) or (2), and the heat dissipation members 7A to 7D have extensions 71b, 72b, 73b, 74b extending from the base portion 23 in a direction in which the heat generating member 3 and the electronic component 4 face each other across a gap S2.

[0075] As a result, heat dissipation members 7A to 7D have extension portions 71b, 72b, 73b, and 74b extending from base portion 23 in the direction in which heat-generating member 3 and electronic component 4 face each other, so that heat emitted from heat-generating member 3 and propagating to the surrounding area through gap S2 between heat-generating member 3 and electronic component 4 can be removed by extension portions 71b, 72b, and 73b.

[0076] (4) A power converter 1C according to a fourth aspect is the power converter 1C of (3), wherein at least a portion of the extension portion 73b is provided to face the gap S2 between the heat generating member 3 and the electronic component 4.

[0077] As a result, at least a portion of the extension portion 73b is arranged to face the gap S2 between the heat-generating member 3 and the electronic component 4, so that the heat emitted from the heat-generating member 3 and propagated to the surrounding area from the gap S2 between the heat-generating member 3 and the electronic component 4 can be more efficiently removed.

[0078] (5) A fifth aspect of the power converter 1A is the power converter 1A according to any one of (1) to (4), in which the heat dissipation member 7A is formed of a wire 71.

[0079] As a result, when the heat dissipation member 7A is the wire 71, the wire 71 can be easily deformed by the hand of an operator, etc. Therefore, the heat dissipation member 7A can be easily laid out in the gap S2 between the heat-generating member 3 and the electronic component 4 while avoiding interference between the heat-generating member 3 and the electronic component 4 inside the housing 2.

[0080] (6) A sixth aspect of the power converter 1B, 1C is the power converter 1B, 1C according to any one of (1) to (4), in which the heat dissipation members 7B, 7C are made of rods 72, 73.

[0081] Thus, by forming the heat dissipation members 7B, 7C from the rods 72, 73, the heat dissipation members 7B, 7C can have a simple configuration, and the cost can be reduced.

[0082] (7) A power converter 1D according to a seventh aspect is any one of the power converters 1D of (1) to (4), wherein the heat dissipation member 7D is made of a pipe material 74 having a flow path portion 74r arranged to communicate with the cooling flow path 25 of the base portion 23.

[0083] As a result, the flow path portion 74r of the pipe material 74, which is the heat dissipation member 7D, communicates with the cooling flow path 25 of the base portion 23, and the cooling medium flowing through the cooling flow path 25 flows through the flow path portion 74r of the pipe material 74. This allows the heat dissipation member 7D to more efficiently remove heat from the heat-generating member 3 to the periphery of the heat-generating member 3.

[0084] (8) A power converter 1A-1D according to an eighth aspect is any one of the power converters 1A-1D of (1) to (7), and further includes a plate-shaped portion 78 joined to the heat dissipation member 7A-7D, disposed in the gap S2 between the heat-generating member 3 and the electronic component 4, and extending along a plane intersecting the direction in which the heat-generating member 3 and the electronic component 4 face each other.

[0085] As a result, by further providing a plate-shaped portion 78 joined to the heat dissipation members 7A-7D in the gap S2 between the heat-generating member 3 and the electronic component 4, the heat that reaches the surrounding area of ​​the heat-generating member 3 can be more effectively removed by the plate-shaped portion 78.

[0086] (9) The power converters 1A to 1D according to a ninth aspect are any one of the power converters 1A to 1D according to (1) to (8), and further include mounting portions 28 formed in multiple numbers on the base portion 23, to which the base ends 71a, 72a, 73a, 74a of the heat dissipation members 7A to 7D can be attached, respectively.

[0087] As a result, since multiple mounting portions 28 are formed on the base portion 23, the heat dissipation members 7A to 7D can be easily provided in appropriate positions depending on the positions of the heat-generating member 3 and the electronic components 4 and the like provided around it.

[0088] (10) A power converter 1A according to a tenth aspect is the power converter 1A of (9), wherein the mounting portion 28 is a recess 281 formed so as to be recessed from the surface of the base portion 23, and the base ends 71a, 72a, 73a, 74a of the heat dissipation members 7A-7D are mounted to the base portion 23 in a state where they are inserted into the recess 281.

[0089] Thus, since the mounting portion 28 is the recess 281, by inserting the base ends 71a, 72a, 73a, 74a of the heat dissipation members 7A to 7D into the recess 281, the heat dissipation members 7A to 7D can be easily mounted to the base portion 23.

[0090] (11) The power converter 1A according to an eleventh aspect is the power converter 1A of (9), wherein the mounting portion 28 is a convex portion 282 formed to protrude from the surface of the base portion 23, and the base end portion 71a of the heat dissipation member 7A is attached to the base portion 23 by being joined to the convex portion 282.

[0091] With this, since the mounting portion 28 is the protrusion 282, by joining the base end portion 71a of the heat dissipation member 7A to the protrusion 282, the heat dissipation member 7A can be easily attached to the base portion 23.

[0092] (12) A power converter 1E according to a twelfth aspect is any one of the power converters 1E according to (1) to (11), wherein the base portion 23 is provided with high thermal conductivity portions 91, 92 connected to at least one of the cooling flow path 25 and the heat dissipation member 7A and made of a material having a higher thermal conductivity than a material forming the base portion 23.

[0093] Thus, by providing the highly thermally conductive portions 91, 92 connected to at least one of the cooling flow path 25 and the heat dissipation member 7A on the base portion 23, the heat released from the heat generating member 3 is more efficiently absorbed by the highly thermally conductive portions 91, 92 via the heat dissipation member 7A. Therefore, the influence of the heat from the heat generating member 3 on the electronic components 4 can be more effectively suppressed. [Explanation of symbols]

[0094] 1A~1E...Power converter 2. Housing 3...Heat generating component 4. Electronic components 7A to 7D: Heat dissipation members 21…Lower housing 21a...Opening 22…Lid 23…Base 23f…Fixed surface 24...Peripheral wall part 25…Cooling channel 28…Mounting part 31...Heater element 41...Capacitor (heat generating component) 42...Substrate 71…Wire 71a, 72a, 73a, 74a...base end 71b, 72b, 73b, 74b...extension part 71c, 72c, 74c...Gap extension part 72, 73...Bar material 73s...Tip 74…Pipe material 74r…Flow passage section 76...Male plug 77…Female plug 78…Plate-shaped part 79...Joint member 91, 92...High thermal conductivity section 281…Recess 282…Convex part Dt…Thickness direction S: Storage space S1…Gap S2…Gap

Claims

1. A heat generating member having a heat generating element that generates heat when activated; an electronic component provided around the heat generating component with a gap therebetween; a housing having a base portion in which the heat generating member is provided and which has a cooling flow path through which a cooling medium can flow; a heat dissipation member having a base end fixed to the base portion and extending away from the heat generating member; A power converter comprising:

2. the heat dissipation member includes a gap extension portion extending in a gap between the heat generating member and the electronic component in a direction intersecting a direction in which the heat generating member and the electronic component face each other, 2. The power converter of claim 1.

3. the heat dissipation member includes an extension portion extending from the base portion in a direction in which the heat generating member and the electronic component face each other with a gap therebetween; 3. The power converter according to claim 1 or 2.

4. The extension portion is provided so that at least a portion of the extension portion faces a gap between the heat generating member and the electronic component.

4. The power converter of claim 3.

5. The heat dissipation member is made of a wire.

3. The power converter according to claim 1 or 2.

6. The heat dissipation member is made of a rod material.

3. The power converter according to claim 1 or 2.

7. The heat dissipation member is made of a pipe material having a flow path portion provided so as to communicate with the cooling flow path of the base portion.

3. The power converter according to claim 1 or 2.

8. a plate-shaped portion joined to the heat dissipation member, disposed in a gap between the heat generating member and the electronic component, and extending along a plane intersecting a direction in which the heat generating member and the electronic component face each other, 3. The power converter according to claim 1 or 2.

9. a plurality of mounting portions formed on the base portion, each of which can be attached to the base end portion of the heat dissipation member; The power converter according to claim 1 or 2, further comprising:

10. The mounting portion is a recess formed to be recessed from a surface of the base portion, The base end of the heat dissipation member is attached to the base portion in a state where the base end is inserted into the recess.

10. The power converter of claim 9.

11. The mounting portion is a protrusion formed so as to protrude from a surface of the base portion, The base end of the heat dissipation member is attached to the base portion by being joined to the protruding portion.

10. The power converter of claim 9.

12. The base portion is provided with a high thermal conductivity portion connected to at least one of the cooling flow path and the heat dissipation member, and made of a material having a higher thermal conductivity than a material forming the base portion.

3. The power converter according to claim 1 or 2.

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