Macroscopic texturing for anodized and coated surfaces

Abstract

To provide improved coatings applied to a consumable part of a processing device.SOLUTION: A consumable part 210 for a plasma processing chamber includes a plasma facing side. An engineered surface 300 is formed into the plasma facing side of the consumable part. A plurality of raised features 440 defines the engineered surface, wherein features are arranged in a predefined pattern, wherein each of the plurality of raised features includes a top region having an outer edge and a sidewall. A base surface of the engineered surface is configured to surround each of the plurality of raised features, such that a corresponding sidewall of a corresponding raised feature extends up at an angle from the base surface to a corresponding top region. The consumable part is configured to be installed in the plasma processing chamber and to be exposed to a plasma and by-products of the plasma.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present embodiments relate to semiconductor substrate processing equipment tools, and more particularly to improved coatings applied to consumable parts of the processing equipment. [Background technology]

[0002] In semiconductor processing systems such as plasma chambers, components coated in the plasma chamber typically feature an aluminum surface that is grit blasted to create random microscopic features and improve adhesion. The surface is then anodized and coated with a plasma-resistant thermal spray coating by plasma spraying. The surface finish is critical to the adhesion and durability of the thermal spray coating. However, the microscopic roughness of the surface created by grit blasting does not provide sufficient adhesion for subsequently deposited layers. For example, the primary failure mode of thermal spray coatings is due to delamination from the underlying anodized coating. Delamination may occur more frequently near surface transition areas (e.g., corners, edges, etc.) where the break in surface continuity encourages crack propagation in the thermal spray coating. Once the coating begins to delaminate, the broken thermal spray coating and exposed anodized aluminum will cause metal contamination and particle defects on the wafer, rendering the part unusable. Typically, failed / used parts must be refurbished to restore performance in the chamber. Alternatively, replacement parts may have to be ordered, increasing operational costs in the semiconductor processing system.

[0003] Also, by-products of wafer processing may adhere to surfaces of a semiconductor processing system. For example, by-products may be generated during an etching process of a wafer or any other material in an etching chamber and then adhere to components of the semiconductor processing system. Because the by-products do not adhere well to surfaces of the semiconductor processing system, they may later be removed and / or dislodged from those surfaces and deposited on the wafer surface during subsequent wafer processing steps. In one case, the by-products adhere to the wafer surface, leading to contamination of at least a portion of the wafer surface. Depending on the degree of contamination, some or all of the wafer may become defective, and damage to the wafer surface may lead to defects in chips formed by wafer processing. In another case, the by-products may adhere to an electrostatic chuck, which may be unable to chuck and / or hold the wafer when the by-products are non-conductive materials.

[0004] The background description provided herein is intended to provide a general overview of the contents of the present disclosure. Work by the currently named inventors within the scope of what is described in this Background section, as well as aspects of the description that may not otherwise be considered prior art at the time of filing, are not admitted, expressly or impliedly, as prior art against the present disclosure.

[0005] It is within this context that embodiments of the present disclosure have been made. Summary of the Invention

[0006] The present embodiments are directed to solving one or more problems found in the related art, and specifically include a macroscopic texture on the plasma-facing surface of the consumable part to increase the surface area of ​​the plasma-facing surface, thereby enhancing adhesion of additional layers by creating additional bonding sites. Several inventive embodiments of the present disclosure are described below.

[0007] An embodiment of the disclosure includes a consumable part for a plasma processing chamber. The consumable part includes a plasma-facing surface. An engineered surface is formed on the plasma-facing surface of the consumable part. A plurality of raised features define the engineered surface. The plurality of raised features are arranged in a predetermined pattern. Each of the plurality of raised features includes a top region having an outer edge and a sidewall. A base surface of the engineered surface surrounds each of the plurality of raised features such that a corresponding sidewall of a corresponding raised feature extends upwardly at an angle from the base surface toward the corresponding top region. The consumable part is configured to be installed in a plasma processing chamber. The consumable part is configured to be exposed to a plasma and by-products of the plasma.

[0008] Another embodiment of the present disclosure includes a method for constructing an engineered surface of a consumable part configured to be installed in a plasma processing chamber. The method includes masking a plasma-facing surface of the consumable part with a stencil, the stencil including a pattern of openings providing access to the plasma-facing surface. The method includes identifying and blasting the plasma-facing surface with a blasting media through the stencil to generate a plurality of raised features defining the engineered surface, the engineered surface being formed on the plasma-facing surface. The plurality of raised features are arranged in a predetermined pattern across the engineered surface. Each of the plurality of raised features includes a top region having an outer edge and a sidewall. A base surface of the engineered surface surrounds each of the plurality of raised features such that a corresponding sidewall of a corresponding raised feature extends upwardly at an angle from the base surface toward a corresponding top region. The consumable part is configured to be exposed to a plasma and by-products of the plasma.

[0009] Another embodiment of the present disclosure includes a plasma processing chamber for processing a wafer, the plasma processing chamber including a lower electrode configured to support a wafer, an upper electrode positioned above the lower electrode, and a consumable part. The consumable part includes a plasma-facing surface. An engineered surface is formed on the plasma-facing surface of the consumable part. A plurality of raised features define the engineered surface, the plurality of raised features being arranged in a predetermined pattern, each of the plurality of raised features including a top region having an outer edge and a sidewall. A base surface of the engineered surface surrounds each of the plurality of raised features, such that a corresponding sidewall of a corresponding raised feature extends upwardly at an angle from the base surface toward the corresponding top region. The consumable part is configured to be installed in the plasma processing chamber. The consumable part is configured to be exposed to a plasma and by-products of the plasma.

[0010] These and other advantages will become apparent to those of ordinary skill in the art upon reading the entire specification and claims. [Brief description of the drawings]

[0011] The present embodiments may be best understood by referring to the following description taken in conjunction with the accompanying drawings.

[0012] [Figure 1A] FIG. 1A illustrates an exemplary plasma volume confinement etch chamber including at least one consumable part that includes an engineered surface having a macroscopic texture designed to increase the surface area of ​​the plasma-facing surface for better adhesion of additional layers and / or by-products through additional bonding sites, in accordance with one embodiment of the present disclosure.

[0013] [Figure 1B] FIG. 1B illustrates another example of an etch chamber including at least one consumable part that includes an engineered surface having a macroscopic texture designed to increase the surface area of ​​the plasma-facing surface for better adhesion of additional layers and / or by-products through additional bonding sites, in accordance with one embodiment of the present disclosure.

[0014] [Diagram 2] FIG. 2 illustrates a cross-section of a consumable part of a plasma processing system showing that the engineered surface has a macroscopic texture designed to create additional bonding sites for better adhesion of additional layers and / or by-products, according to one embodiment of the present disclosure.

[0015] [Diagram 3] FIG. 3 is a diagram of a plasma confinement ring including an engineered surface with a macroscopic texture designed to create additional bonding sites for better adhesion of additional layers and / or by-products, in accordance with one embodiment of the present disclosure.

[0016] [Figure 4A] FIG. 4A is a cross-sectional view of an engineered surface of a consumable part having macroscopic texture in the form of raised features designed to create additional bonding sites for better adhesion of additional layers and / or by-products, in accordance with one embodiment of the present disclosure.

[0017] [Figure 4B] FIG. 4B is a cross-section of a raised feature of an engineered surface having a macroscopic texture designed to create additional bonding sites for better adhesion of additional layers and / or by-products, according to one embodiment of the present disclosure.

[0018] [Diagram 5] FIG. 5 is a flow diagram illustrating a method for constructing an engineered surface of a consumable part with macroscopic texture in the form of raised features designed to create additional bonding sites for better adhesion of additional layers and / or by-products, according to one embodiment of the disclosure.

[0019] [Figure 6A]FIG. 6A illustrates grit or bead blasting through a stencil to build an engineered surface of a consumable part with macroscopic texture in the form of raised features designed to create additional bonding sites for better adhesion of additional layers and / or by-products, according to one embodiment of the present disclosure.

[0020] [Figure 6B-1] FIG. 6B-1 illustrates, in accordance with one embodiment of the present disclosure, grit or bead blasting the plasma-facing surface of a consumable part at an angle to create an engineered surface with macroscopic texture in the form of raised features designed to create additional bonding sites for better adhesion of additional layers and / or by-products.

[0021] [Figure 6B-2] FIG. 6B-2 illustrates, in accordance with one embodiment of the present disclosure, grit or bead blasting the plasma-facing surface of a consumable part at multiple angles to create an engineered surface with macroscopic texture in the form of raised features designed to create additional bonding sites for better adhesion of additional layers and / or by-products.

[0022] [Figure 6C] FIG. 6C shows the engineered surface of a consumable part after grit or bead blasting in accordance with one embodiment of the present disclosure, where the engineered surface includes macroscopic texture in the form of raised features designed to create additional bonding sites for better adhesion of additional layers and / or by-products.

[0023] [Figure 7A]FIG. 7A illustrates a consumable part including an engineered surface coated with a plasma-resistant thermal spray coating having a relatively flat surface that has been anodized and exposed to plasma in a plasma processing system in accordance with one embodiment of the present disclosure, where the thermal spray coating does not match the engineered surface having macroscopic texture in the form of raised features designed to create additional bonding sites for better adhesion of additional layers and / or by-products.

[0024] [Figure 7B] FIG. 7B illustrates a consumable part including an engineered surface that has been anodized and coated with a plasma-resistant thermal spray coating having a relatively flat surface that has been exposed to plasma in a plasma processing system in accordance with one embodiment of the present disclosure, where the thermal spray coating conforms to the engineered surface with macroscopic texture in the form of raised features designed to create additional bonding sites for better adhesion of additional layers and / or by-products.

[0025] [Figure 8A] FIG. 8A illustrates a stencil and multiple exemplary openings configured to direct grit or bead blasting media onto the plasma-facing surface of a consumable part to build an engineered surface having a macroscopic texture in the form of raised features designed to create additional bonding sites for better adhesion of additional layers and / or by-products, according to one embodiment of the present disclosure.

[0026] [Figure 8B] FIG. 8B illustrates a stencil having multiple openings arranged in a pattern to direct grit or bead blasting media onto the plasma-facing surface of a consumable part to create an engineered surface with a patterned macroscopic texture designed to create additional bonding sites for better adhesion of additional layers and / or by-products, according to one embodiment of the present disclosure.

[0027] [Figure 8C] FIG. 8C illustrates a stencil with multiple openings arranged in a two-zone pattern to direct grit or bead blasting media onto the plasma-facing surface of a consumable part to construct an engineered surface with a patterned macroscopic texture designed to create additional bonding sites for better adhesion of additional layers and / or by-products, according to one embodiment of the present disclosure.

[0028] [Figure 8D] FIG. 8D illustrates a stencil with multiple openings arranged in a three-zone pattern to direct grit or bead blasting media onto the plasma-facing surface of a consumable part to construct an engineered surface with a patterned macroscopic texture designed to create additional bonding sites for better adhesion of additional layers and / or by-products, according to one embodiment of the present disclosure.

[0029] [Figure 8E] FIG. 8E illustrates a stencil with multiple openings arranged in a linear scale pattern to direct grit or bead blasting media onto the plasma-facing surface of a consumable part to construct an engineered surface with a patterned macroscopic texture designed to create additional bonding sites for better adhesion of additional layers and / or by-products, according to one embodiment of the present disclosure.

[0030] [Figure 9A-1] FIG. 9A-1 shows a plurality of uniformly arranged raised features, where the feature structure and height are configured to be uniform to build a conformal plasma resistant thermal spray coating, in accordance with one embodiment of the present disclosure, where the raised features define an engineered surface having a patterned macroscopic texture designed to create additional bonding sites for better adhesion of additional layers and / or by-products.

[0031] [Figure 9A-2] FIG. 9A-2 shows a plurality of raised features uniformly spaced at a lower density than the features in FIG. 9A-1, according to one embodiment of the present disclosure.

[0032] [Figure 9B-1] FIG. 9B-1 shows a plurality of uniformly arranged raised features, with uniform feature structure and smaller height than FIG. 9A-1, configured to construct a relatively flat, non-conformal, plasma-resistant thermal spray coating in accordance with one embodiment of the present disclosure, where the raised features define an engineered surface with a patterned macroscopic texture designed to create additional bonding sites for better adhesion of additional layers and / or by-products.

[0033] [Figure 9B-2] FIG. 9B-2 shows a plurality of raised features uniformly spaced at a lower density than the features of FIG. 9A-1, according to one embodiment of the present disclosure.

[0034] [Figure 9C-1] FIG. 9C-1 shows a plurality of raised features arranged in two sub-patterns, where the structure and height of the features across the sub-patterns are uniform, and the raised features define an engineered surface with a patterned macroscopic texture designed to create additional bonding sites for better adhesion of additional layers and / or by-products, in accordance with one embodiment of the present disclosure.

[0035] [Figure 9C-2] FIG. 9C-2 shows a plurality of raised features arranged in two sub-patterns, where the structure and height of the features in each sub-pattern are uniform but may vary between the two sub-patterns, in accordance with one embodiment of the present disclosure, and the raised features define an engineered surface with a patterned macroscopic texture designed to create additional bonding sites for better adhesion of additional layers and / or by-products.

[0036] [Figure 9D] FIG. 9 shows a plurality of raised features arranged in three sub-patterns, where the structure and height of the features across the sub-patterns are uniform, and the raised features define an engineered surface with a patterned macroscopic texture designed to create additional bonding sites for better adhesion of additional layers and / or by-products, in accordance with one embodiment of the present disclosure.

[0037] [Figure 9E] FIG. 9E shows a plurality of raised features arranged in a linear-scale pattern such that the density of the features increases linearly, in accordance with one embodiment of the present disclosure, where the raised features define an engineered surface having a patterned macroscopic texture designed to create additional bonding sites for better adhesion of additional layers and / or by-products.

[0038] [Figure 10] FIG. 10 illustrates a process of applying different stencils to the plasma-facing surface of a consumable part to create rounded edges on a plurality of raised features arranged in a pattern, according to one embodiment of the present disclosure.

[0039] [Figure 11] FIG. 11 is an electron microscope image of a cross-section of a consumable part including an engineered surface that has been anodized and coated with a plasma-resistant thermal spray coating in accordance with one embodiment of the present disclosure, where the engineered surface has macroscopic texture in the form of raised features designed to create additional bonding sites for better adhesion of additional layers. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0040] Although the following detailed description includes many specific details for purposes of illustration, those skilled in the art will appreciate that many variations and modifications to the following details are within the scope of the disclosure. Accordingly, the aspects of the disclosure described below are set forth without prejudice to, and without imposing limitations on, the claims that follow this description.

[0041] Generally, various embodiments of the present disclosure describe systems and methods that provide novel methods for forming a surface macroscopic texture on a consumable part. In embodiments of the present disclosure, the macroscopic texture adds patterned large-scale features on or within the surface of the consumable part. In various embodiments, the consumable part may be a plain bulk material (e.g., bare ceramic, bare aluminum, etc.), may be anodized (e.g., anodized), and may or may not have a plasma-resistant thermal spray coating. In embodiments, the intended effect of the plasma-facing surface macroscopic texture on the consumable part includes enhancing the adhesion of the thermal spray coating (or adhesion of additional layers) and / or adhesion of by-products. The macroscopic texture increases the surface area of ​​the consumable part surface, enhancing the adhesion of a subsequently applied layer (e.g., a plasma-resistant thermal spray coating) by creating additional bonding sites (e.g., for improved adhesion of the yttria thermal spray coating). Since one of the major causes of consumable part failure is when the thermal spray coating peels off the underlying anodized surface of the consumable part, improving adhesion strength can increase the life of the coating (as well as the life of the consumable part). Since the plasma-resistant thermal spray coating is a significant portion of the cost of the consumable part, increasing the life of the consumable part can significantly reduce the cost of ownership of the plasma-resistant thermal spray components (e.g., consumable parts) used in the chamber body of the conductor etch chamber. This can significantly increase the life and service life of the consumable part. Also, the service life of the consumable part can be extended between maintenance inspections, thereby reducing tool downtime of the plasma processing system. The embodiments of the present disclosure achieve the above advantages and further achieve the additional advantage that the macroscopic texture can cause by-products formed during the process steps to be trapped and / or immobilized, thereby leading to improved processing performance since the consumable part is less likely to shed particles (e.g., by-products) over its service life. Embodiments of the present disclosure achieve the above advantages, with the added advantage that the macroscopic texture (eg, roughening) improves the fracture resistance of the coating on the altered surface of the consumable part.Yet another embodiment of the present disclosure achieves the above advantages and further realizes that the macroscopic texture reduces the development of large in-plane stresses that lead to cracking in the subsequent thermal spray coating by introducing continuous, intentional breaks in the surface contour. That is, the macroscopic texture enhances stress reduction in the film (e.g., thermal spray coating). Yet another embodiment of the present disclosure achieves the above advantages and further realizes that the macroscopic texture increases the surface continuity of the consumable part (e.g., removes breaks in the surface continuity), especially near surface transitions (e.g., corners, edges, etc.). By increasing the surface continuity, cracks in the created surface (e.g., thermal spray coating) are prevented from initiating / propagating to the surface due to breaks in the surface continuity.

[0042] Embodiments of the present disclosure form a surface macroscopic texture on a consumable part (e.g., a plasma-facing surface), which may be any component found in a semiconductor processing assembly (e.g., a plasma processing chamber). In some cases, the consumable part may be removably disposed in the plasma processing chamber. In this manner, the consumable may be removed for repair and / or replacement. In such an approach, the life and / or service life of the plasma processing chamber may be increased. For illustrative purposes, the following list provides examples of consumable parts found in a plasma processing chamber, but is not intended to be exhaustive. Examples of consumable parts include a liner configured to protect an inner wall of the plasma processing chamber, one or more C-shroud parts, one or more plasma confinement ring parts, a focus ring, an edge ring, an electrostatic semiconductor wafer clamping / chucking system, an upper electrode, a lower electrode, a pedestal configured to support a wafer, and the like. In other cases, embodiments of the present disclosure may be provided on any plasma-facing surface found in a semiconductor processing assembly, and the surface may be located on a consumable part or a fixed part.

[0043] The embodiments of the present disclosure relate to plasma process modules. For example, such plasma process modules may be used in plasma etch chambers or modules, deposition chambers or modules, spin rinse chambers or modules, metal plating chambers or modules, clean chambers or modules, bevel edge etch chambers or modules, physical vapor deposition (PVD) chambers or modules, chemical vapor deposition (CVD) chambers or modules, atomic layer deposition (ALD) chambers or modules, plasma enhanced chemical vapor deposition (PECVD) chambers or modules, atomic layer etching (ALE) chambers or modules, ion implantation chambers or modules, track chambers or modules, etc. The embodiments of the present disclosure also relate to any other semiconductor processing system that may be associated with or used in the fabrication and / or manufacture of semiconductor wafers. The other any other semiconductor processing system may include, for example, electroplating, electroetching, electropolishing, electrochemical mechanical polishing, deposition, wet deposition, and through silicon via (TSV) processes. Embodiments of the present disclosure are not limited to the examples provided herein and may be implemented in different plasma processing systems employing different configurations, geometries, and plasma generation technologies (e.g., inductively coupled systems, capacitively coupled systems, electron-cyclotron resonance systems, microwave systems, etc.) Examples of plasma processing systems and plasma process modules are disclosed in commonly owned U.S. Patent Nos. 8,862,855, 8,847,495, and 8,485,128, and U.S. Patent Application Serial No. 15 / 369,110.

[0044] With the above general understanding of the various embodiments, exemplary details of the embodiments will now be described with reference to the various drawings. In one or more drawings, similarly numbered elements and / or components are generally intended to have the same configuration and / or function. Furthermore, the drawings may not be drawn to scale, but are intended to explain and emphasize the concept of novelty. It will be apparent that the present embodiment can be practiced without some or all of these specific details. In other instances, well-known process operations have not been described in detail so as not to unnecessarily obscure the present embodiment.

[0045] FIG. 1A illustrates an exemplary plasma processing chamber 100A (e.g., a plasma volume confinement etch chamber) including at least one consumable part including an engineered surface with a macroscopic texture designed to increase the surface area of ​​the plasma-facing surface for better adhesion of additional layers and / or by-products through additional bonding sites, according to one embodiment of the present disclosure. The plasma processing chamber 100A includes an upper electrode 142 and a lower electrode 144 with a semiconductor wafer 146 disposed thereon. The etch chamber 100A is shown configured for small plasma volume confinement with a plasma confinement ring 160 disposed to define the lateral boundaries of the small plasma volume confinement region 145. The upper electrode 142 and the lower electrode 144 with the semiconductor wafer 146 disposed thereon define the upper and lower boundaries of the small plasma volume confinement region 145, respectively.

[0046] The configurable plasma processing chamber 100A includes an outer plasma confinement structure 162 that functions as the plasma confinement structure 162 when the plasma processing chamber 100A is configured for a large plasma volume. When the plasma processing chamber 100A is configured for a small volume, the outer plasma confinement structure 162 is in place to provide a redundant baffle through which neutral species of the plasma must pass when exhausting the etch chamber via the turbo pump 202.

[0047] In one embodiment, the plasma confinement rings 160 are configured to extend between the periphery of the upper electrode 142 and the periphery of the lower electrode 146 such that the plasma generated by ionization of the reactive gas by the applied RF energy is confined within a small plasma volume confinement region 145 defined between the confinement rings 160 and the electrodes 142, 144 just above the surface of the wafer 146. The plasma confinement rings 160 may define a slotted confinement shield made up of a plurality of circular rings 160. The circular rings 160 are made of a dielectric material such as silica or quartz, with adjacent rings separated by spacers 170 to create circumferential slots or passages between the circular rings 160 through which neutral species of the plasma are exhausted. The circumferential slots thereby form parallel passages spaced apart in a direction perpendicular to the flow of plasma or gas through the parallel passages.

[0048] The spacer 170 is similarly constructed of a dielectric material such as silica or quartz, or a conductive material such as silicon carbide or doped silicon, and the slots or passages are configured to dissipate any ion particles remaining in the exhaust gas flowing through the confinement ring 160 and exhausting it through the chamber 100A via the turbo pump 202. In one embodiment, the plasma confinement ring 160 is connected by a shaft 179. The shaft 179 may be constructed of a lightweight, low particle generating material such as nylon, and is configured to support the confinement ring 160 and the spacer 170. The spacer is configured to extend around the shaft 179 and between the confinement ring 160, so that when the plasma confinement ring 160 extends to define the small plasma volume confinement region 145, a desired space is created between the ring to neutralize ion particles or electrons from the plasma that may cross the slots or passages.

[0049] The plasma confinement rings 160, the spacers 170, and the shaft 179 together form a confinement assembly 173. When the confinement assembly 173 retracts to form the large plasma volume confinement region 145, the shaft 179 is removed from the confinement region 145 and the spacers 170 in the adjacent rings 160 are retracted, thereby collapsing the stack of plasma confinement rings 160. Specifically, the large plasma volume is generated at the interface between the chamber liner 164 and the outer plasma confinement structure 162 configured in the plasma processing chamber 100A.

[0050] Plasma-protective chamber liners 164, 166 may be incorporated to provide thermal stability, proper RF ground return path, and serviceability with minimal downtime. The chamber liners 164, 166 may also be configured to provide additional protection to the walls of the plasma processing chamber 100A, where the liners are exposed to the plasma process instead of the walls being exposed to the plasma process. The upper chamber liner 164 is configured to the outer plasma confinement structure 162, and the lower chamber liner 166 is configured to line the lower region of the walls of the plasma processing chamber from the outer plasma confinement structure 162 to the base of the etch chamber 200 and turbo pump 202 exhaust.

[0051] Embodiments of the present disclosure may be implemented on any of the plasma-facing surfaces shown in Figure 1A. Examples of plasma-facing surfaces shown in Figure 1A include, but are not limited to, chamber liner 164, chamber liner 166, upper electrode 142, lower electrode 144, and components of confinement assembly 173.

[0052] FIG. 1B illustrates another example of a plasma processing chamber 100B (e.g., an etch chamber) including at least one consumable part including an engineered surface with a macroscopic texture designed to increase the surface area of ​​the plasma-facing surface for better adhesion of additional layers and / or by-products through additional bonding sites, according to an embodiment of the present disclosure. Specifically, the plasma processing chamber 100B may include an upper central electrode 106, an upper outer electrode 104, a lower central electrode 108, and a lower outer electrode 110 within a plasma processing chamber 149 surrounded by chamber walls 150. A lower insulator ring 112 insulates the lower central electrode 108 from the lower outer electrode 110. The ring 112 may be or incorporate an edge ring and / or a focus ring. Also within the plasma processing chamber 149, a substrate 146 is disposed on the lower central electrode 108. The lower central electrode 108 provides an electrostatic chuck (ESC) for holding the substrate 146. In this embodiment, the lower outer electrode 110 and the upper outer electrode 104 have openings with a larger diameter than the substrate 146 such that the substrate 146 is disposed within the openings.

[0053] The gas source 124 is connected to the plasma processing chamber 149 and supplies an etching gas to the plasma region 140 of the plasma processing chamber 149 during a wafer process (e.g., an etching process). The RF bias source 148, the first excitation RF source 152, and the second excitation RF source 156 are electrically connected to the plasma processing chamber 149 via the controller 135 and supply power to the electrodes 104, 106, 108, 110. The RF bias source 148 generates an RF bias power and supplies the RF bias power to the plasma processing chamber 149. The first excitation RF source 152 generates an RF power source and supplies the RF bias power to the plasma processing chamber 149. The second excitation RF source 156 generates another RF power source in addition to the RF power generated by the first excitation RF source 152 and supplies the RF power source to the plasma processing chamber 149. Different RF signals may be supplied to various combinations of the upper and lower electrodes. In this example, the top electrode is grounded and power is supplied only to the bottom central electrode 108 .

[0054] The C-shroud 114 spans from the upper outer electrode 104 to the lower outer electrode 110 and provides additional plasma containment. The C-shroud 114 has a number of openings 102 to allow gas and plasma to flow out of the C-shroud 114. In this embodiment, the C-shroud 114 is grounded.

[0055] An upper temperature controller 171 provides independent temperature control for the upper central electrode 106 and the upper outer electrode 104. A lower temperature controller 172 provides independent temperature control for the lower central electrode 108 and the lower outer electrode 110. In one embodiment, the upper outer electrode 104 and the C-shroud 114 may be maintained at the same temperature by the same setting of the upper temperature controller 171.

[0056] The controller 135 is connected to the gas source 124, the RF bias source 148, the upper temperature controller 171, the lower temperature controller 172, the exhaust pump 120, the first excitation RF source 152, and the second excitation RF source 156. The controller 135 controls the flow of etching gases into the plasma processing chamber 149, the chamber pressure, and controls the generation of RF power from the three RF sources 148, 152, 156, the electrodes 104, 106, 108, and 110, and the exhaust pump 120.

[0057] The top central electrode 106 also serves as a gas distribution plate and is connected to a gas source 124 and serves as a gas inlet for gas from the gas source 124. The exhaust pump 120 serves as a gas outlet and removes gas passing through the aperture 102 from the top central electrode 106 through the plasma region 140 to the exhaust pump 120. The exhaust pump 120 may help control pressure.

[0058] Embodiments of the present disclosure may be implemented on any of the plasma-facing surfaces shown in Figure 1B. Examples of plasma-facing surfaces shown in Figure 1B include, but are not limited to, the upper central electrode 106, the upper outer electrode 104, the lower central electrode 108, and the lower outer electrode 110, the insulator ring 112, the edge ring, the focus ring, and the electrostatic semiconductor wafer clamping / chucking system (e.g., electrostatic chuck - ESC), C-shroud 114.

[0059] FIG. 2 illustrates a cross-sectional view of a consumable part 210 for a plasma processing chamber showing an engineered surface 300 having a macroscopic texture designed to create additional bonding sites for better adhesion of additional layers and / or by-products according to one embodiment of the present disclosure. FIG. 2 is an illustration of an engineered surface 300 formed on a plasma-facing surface of the consumable part 210, the engineered surface 300 including a macroscopic texture that adds patterned large-scale features extending from a base surface 350. The consumable part 210 is configured to be placed in a plasma processing chamber. In one embodiment, the consumable part 210 is removably placed in a plasma processing chamber. More specifically, the consumable part 210 is configured to be exposed to plasma and by-products of the plasma during wafer processing (e.g., etching, deposition, etc.). In one embodiment, the consumable part 210 is made of a conductive material (e.g., aluminum alloy). In another embodiment, the consumable part is made of a dielectric material (e.g., ceramic).

[0060] As shown, the consumable part 210 includes a base surface 350 that includes a macroscopic texture. The base surface 350, which is textured and forms the engineered surface 300 along with any other finishing layers, may be exposed to plasma during wafer processing. Specifically, the macroscopic texture includes a plurality of raised features 440 that define the engineered surface that are arranged in a predetermined pattern. That is, the features of the plurality of raised features 440 are arranged in a predetermined pattern, such as on the base surface 350. In an embodiment, patterning the base surface 350 of the consumable part for coating adhesion and / or by-product adhesion is a low-cost, easily implemented, and repeatable method. Instead of indiscriminately forming a microscopic texture (e.g., a microscopic surface roughness, optionally applied by grit blasting) on ​​the base surface 350 of the consumable part 210 to promote adhesion, as is done in the current art, embodiments of the present disclosure form a macroscopic texture on the base surface 350 of the consumable part to form the engineered surface 300, with macroscopic features patterned on the base surface 350 to promote adhesion of a coating (e.g., to the base surface and / or an anodized layer on the base surface) and / or promote enhanced anchoring of by-products to the consumable part during wafer processing (e.g., to the base surface, to the anodized base surface, and / or to a thermal spray coating on the base surface or on the anodized base surface). In embodiments, the macroscopic features may be formed by masking and media blasting, machining, wet chemical etching through a stencil or mask, selective deposition methods, additive manufacturing, etc., as described further below. The consumable part, in various embodiments, may be a plain bulk material (e.g., bare ceramic, bare aluminum, etc.), may be anodized (e.g., anodized), and may or may not have a plasma spray coating applied. The intended effect of the plasma-facing surface macroscopic texture on the consumable part, in embodiments, includes enhancing the adhesion of the sprayed coating (or adhesion of additional layers) and / or the adhesion of by-products.For example, by-products may be formed during the etching process, and the by-products may adhere to one or more components (e.g., plasma confinement liners) of the corresponding plasma processing chamber. Illustratively, the macroscopic texture forms features that are about 5-100 times the size of the features formed in the previously generated microscopic texture. In embodiments, the size of the macroscopic features ranges between 0.1 mm and up to 3.0 mm. In other embodiments, the size of the macroscopic features ranges between 0.2 mm and 2.5 mm. In yet other embodiments, the size of the macroscopic features ranges between 0.2 mm and 1.3 mm. In other embodiments, the size of the macroscopic features ranges between 0.3 mm and 1.0 mm.

[0061] Additionally, the plurality of microscopic features may be optionally formed into the plurality of raised features. For example, the plurality of raised features may be roughened by bead and / or grit blasting to build the microscopic features into the plurality of raised features. The additional microscopic texture (e.g., roughening of the macroscopic features) may provide improved fracture resistance (e.g., better adhesion) for a coating disposed over an engineered surface.

[0062] In an embodiment, the base surface 350 patterned with macroscopic features is then optionally anodized to provide the anodized layer 220. That is, the engineered surface 300 is anodized. For example, in one embodiment, the consumable part is an aluminum alloy and the engineered surface 300 is formed from the aluminum alloy. During the anodization process, the aluminum alloy is anodized, such as by an electrolytic passivation process. For example, anodizing the metal increases the thickness of a native oxide layer on the surface. In one embodiment, the contours of the macroscopic features are exposed through the anodized layer 220 such that the form factor of the macroscopic features is present through the anodized layer. That is, the anodized layer 220 conforms to the contours of the plurality of raised features 440.

[0063] Specifically, the surface of the anodized layer 220 is altered by the presence and exposure of the macroscopic features. As such, the surface area of ​​the base surface 350 of the consumable part and the surface area of ​​the anodized layer 220 are also increased. That is, the surface morphology of the anodized layer 220 is distorted. The combined effect of the increased surface area and the irregular surface morphology serves to resolve the internal stress of the plasma-resistant thermal spray coating 230. Thus, improving the adhesion between the thermal spray coating 230 and the anodized layer 220. In this way, the benefits of the macroscopic features exposed through the anodized layer 220 (e.g., exposing contours) can be utilized to provide better and enhanced adhesion to additional layers, such as through additional bonding sites.

[0064] Additionally, in another embodiment, a plasma-resistant thermal spray coating 230 is optionally applied to the anodized layer 220. For example, the thermal spray coating may be a yttrium-based thermal spray coating (e.g., yttrium oxide) on the anodized consumable part 210 (e.g., an anodized aluminum alloy of the consumable part). The coating 230 may be applied through a thermal spray process in which a heated material is sprayed onto the surface. In one application, the thermal spray coating is heated through an electrical (e.g., plasma or arc) or chemical (e.g., combustion) process. In an embodiment of the present disclosure, the macroscopic features that define the engineered surface 300 (e.g., formed on the base surface 350) enhance the adhesion of the plasma-resistant thermal spray coating 230 to the consumable part 210, and more particularly, to the anodized layer 220. That is, the macroscopic features provide better adhesion of the plasma resistant thermal spray coating 230 to the anodized layer 220, which in turn reduces delamination of the plasma resistant thermal spray coating 230 from the anodized layer 220. The better adhesion of the thermal spray coating 230 prevents metal contamination on the wafer due to exposure of the anodized aluminum caused by some damaged thermal spray coatings (e.g., delamination).

[0065] 3 is an illustration of a consumable part 210' including an engineered surface 300' having a macroscopic texture designed to create additional bonding sites for better adhesion of additional layers and / or by-products, according to one embodiment of the present disclosure. For purposes of illustration only, the consumable part 210' may be the plasma confinement ring 160 first introduced in FIG. 1A. For purposes of clarity and illustration, the plasma confinement ring 160 may be used as a proxy for the consumable part 210' disposed in a plasma processing chamber. For example, the consumable part 210' may be removably disposed in a plasma processing chamber.

[0066] As shown, the plasma-facing surface 310 of the consumable part 210' includes an engineered surface 300' that includes a plurality of raised features 440', as previously introduced. Each of the plurality of raised features 440' extends diagonally upward from a base surface 350'. For example, the consumable part 210' may be configured in the shape of a disk (e.g., as shown in FIG. 1A ) and may be a plasma confinement ring 160 that includes an inner diameter of the disk or an annular ring, the inner diameter defining the plasma-facing surface. Specifically, when the consumable part 210' is placed in a plasma processing chamber, the consumable part 210' is exposed to plasma during wafer processing (e.g., during etching, deposition, etc.). More specifically, the plasma-facing surface 310 may be directly exposed to plasma in the plasma processing chamber during wafer processing. Embodiments of the present disclosure form a macroscopic texture on the plasma-facing surface 310 of the consumable part 210' to form an engineered surface 300', where macroscopic features are patterned on the surface of the plasma-facing surface 310 to promote adhesion of a coating and / or promote enhanced adhesion of by-products to the surface of the consumable part during wafer processing.

[0067] Also, the consumable part 210' may include an upper portion 169 and a lower portion 163, such as a surrogate plasma confinement ring. Because the upper portion 169 and / or the lower portion 163 may not be directly exposed to the plasma, in some embodiments, macroscopic texturing of their surfaces may not be required. In other embodiments, macroscopic texturing of the upper portion 169 and / or the lower portion 163 may be implemented because the upper portion 169 and / or the lower portion 163 may be indirectly exposed to the plasma, thereby shortening the life of the consumable part 210' and / or increasing the possibility of by-product entrapment and spalling. In those cases, the macroscopic texturing of the upper portion 169 and / or the lower portion 163 may increase the life of any additional plasma-resistant thermal spray coating (not shown) applied to the consumable part 210' (e.g., the plasma confinement ring 160) and / or may provide better adhesion of by-products to their surfaces during one or more wafer processing operations, helping to prevent spalling of by-products.

[0068] In one embodiment, a plurality of raised features may be formed surrounding the void. By way of example, a hole (e.g., a circular hole) may be formed in the plasma-facing surface of the consumable part, and a surrounding structure around the hole may be defined as a plurality of raised features. For example, a reverse stencil (e.g., a negative of the stencil used to form the engineered surface of FIG. 3) may be used in conjunction with media blasting (e.g., grit blasting, bead blasting, etc.) to form the hole and the raised features surrounding the hole.

[0069] In another embodiment, the plurality of recessed features defines an engineered surface. For example, a reverse stencil (e.g., a negative of the stencil used to form the engineered surface of FIG. 3) may be used in conjunction with media blasting (e.g., grit blasting, bead blasting, etc.) to form the plurality of recessed features, which may be voids (i.e., as opposed to solid, raised features). By way of example, as opposed to FIG. 3, the recessed features may extend diagonally downward from the base surface.

[0070] 4A-4B illustrate the macroscopic texture of the surface of consumable part 210′, including example dimensions and configurations of each of the features that define the macroscopic texture, in accordance with an embodiment of the present disclosure. For example, FIGS. 4A-4B may be close-ups of one or more of the raised features shown in FIG. 3. Specifically, FIG. 4A is a cross-sectional view of an engineered surface 300′ of consumable part 210′ ​​having a macroscopic texture in the form of a raised feature 440′ designed to create additional bonding sites for better adhesion of additional layers and / or by-products, in accordance with an embodiment of the present disclosure. FIG. 4B is a cross-sectional view of a raised feature 440′ of engineered surface 300′ having a macroscopic texture designed to create additional bonding sites for better adhesion of additional layers and / or by-products, in accordance with an embodiment of the present disclosure. 4A-4B illustrate various parameters that can be controlled in forming a plurality of raised features 440′, including center-to-center spacing, aspect ratio, feature separation (e.g., distance between features in a pattern), edge finish (e.g., roundness), etc.

[0071] The plasma-facing surface 310 of the consumable part 210' includes an engineered surface 300'. As previously described, the consumable part 210' may be removably disposed in a plasma processing chamber. For example, the consumable part 210' may be a liner configured to protect an inner wall of a plasma processing chamber, or an inner wall of a plasma processing chamber, or one or more C-shroud portions, or one or more plasma confinement ring portions, or a focus ring, or an edge ring, or an electrostatic semiconductor wafer clamping / chucking system, or an upper electrode, or a lower electrode, or a dielectric window for inductively coupled plasma, etc. In an embodiment, the plasma-facing surface 310 of the consumable part 210' may be a conductive material or a dielectric material.

[0072] More specifically, the plurality of raised features 440' define the engineered surface 300'. The plurality of raised features 440' define a macroscopic texture formed on the plasma-facing surface 310 of the consumable part 210'. The plurality of raised features 440' are designed to form additional bonding sites for better adhesion of additional layers and / or capture of by-products formed during wafer processing. The plurality of raised features 440' are formed in a predetermined pattern on the plasma-facing surface 310. As shown, the base surface 350' surrounds each of the plurality of raised features 440' such that a corresponding sidewall 450 of a corresponding raised feature 440 extends from the base surface 350' to a corresponding upper region 470. For example, in the cross-section of FIG. 4A, the plurality of raised features 440' includes a raised feature 440A, a raised feature 440B to the left of the feature 440A, and other raised features. Additional raised features that extend into and out of the page in FIG. 4A are not shown.

[0073] The raised feature 440A is defined by a central axis 480A, and the raised feature 440B is defined by a central axis 480B. A distance "B" is defined between the two central axes 480A and 480B, and the distance B defines a separation between the raised features. Depending on the pattern selected for the plurality of raised features formed on the plasma-facing surface 310 of the consumable part 210', additional separation may be defined between the raised features. For illustrative purposes only, the distance B may be about 47 mm. In some embodiments, the distance B ranges between about 15 mm and about 75 mm, or more. In some embodiments, the distance B ranges between about 10 mm and about 60 mm. In some embodiments, the distance B ranges between about 20 mm and about 50 mm.

[0074] Each of the raised features includes a top region and a sidewall. In some embodiments, the raised features may be depicted as a nodule or a truncated cone. As a representation of the raised features, the raised feature 440A includes a top region 470 (e.g., a plateau). The top region 470 may have an outer edge 460. In one embodiment, the outer edge 460 is a rounded corner. In another embodiment, the outer edge 460 is not rounded, i.e., a left acute angle. For illustrative purposes, the outer edge 460 is described throughout this specification as a rounded corner. However, other features may define it as an acute angle, etc. Each of the raised features may have a predetermined edge finish for the corresponding outer edge. In one embodiment, the edge finish may include a rounded corner on the outer edge, like the raised feature 440A. In another embodiment, the edge finish may be sharp and / or distinct. Other types of edge finishes can be maintained and their configurations controlled by using bead blasting and / or grit blasting via a stencil on the plasma-facing surface 310. For example, the edge finish to the outer edge may include a chamfered edge, a generally angled shape toward the top region, a sharp edge, etc. Distance "A" defines the distance between the rounded corners on opposite sides of the top region 470. For illustrative purposes only, distance A may be about 2 mm, where distance A is the diameter of the top region 470. In some embodiments, distance A ranges between about 0.5 mm and about 5 mm. In other embodiments, distance A ranges between about 1 mm and about 4 mm. In yet other embodiments, distance A ranges between about 1.5 mm and about 3 mm.

[0075] For a typical raised feature 440A, distance "C" defines the height of the feature. For purposes of illustration only, distance C may be about 0.5 mm. In some embodiments, distance C ranges between about 0.1 mm and about 3.0 mm. In some embodiments, distance C ranges between about 0.2 mm and about 3 mm. In other embodiments, the size of distance C is between about 0.2 mm and about 2.5 mm. In yet other embodiments, the size of the macroscopic feature ranges between about 0.2 mm and about 1.3 mm. In other embodiments, the size of the macroscopic feature ranges between about 0.3 mm and 1.0 mm.

[0076] Also, an exemplary raised feature 440A may include a sidewall 450. The raised feature 440A extends at an angle upward from the base surface 350′. Specifically, the sidewall 450 extends upward from the base surface 350′ at an angle 490A, which is defined between a line 485A (extending from the sidewall 450) and a central axis 480A. The configuration of the sidewall 450 and the upper region 470 defines an aspect ratio (ratio between the approximate height and the approximate diameter of the raised feature 440A at the base surface 350′) that can be controlled by machining with grit and / or bead blasting via a stencil on the plasma-facing surface of the consumable part. For illustrative purposes only, the angle 490A is about 30 degrees. In an embodiment, the angle 490A ranges between about 15 degrees and about 60 degrees. In some embodiments, angle 490A ranges between about 0 degrees and about 45 degrees. In other embodiments, angle 490A ranges between about 15 degrees and about 40 degrees. In other embodiments, angle 490A ranges between about 20 degrees and about 40 degrees. In still other embodiments, angle 490A ranges between about 25 degrees and about 35 degrees. An angle 490B is also defined between opposing sides indicated by lines 485A and 485B extending downward from sidewall 450. For example, angle 490B is about 60 degrees. In some embodiments, angle 490B ranges between 0 degrees and 90 degrees. In other embodiments, angle 490A ranges between about 30 degrees and about 80 degrees. In other embodiments, angle 490A ranges between about 40 degrees and about 80 degrees. In still other embodiments, angle 490A ranges between about 50 degrees and about 70 degrees. For purposes of example only, angles 490A and 490B defining sidewall 450 and top region 470 may form a nub, or a truncated cone.

[0077] FIG. 5 is a flow diagram 500 illustrating a method for constructing an engineered surface of a consumable part with a macroscopic texture in the form of raised features designed to create additional bonding sites for better adhesion of additional layers, according to one embodiment of the present disclosure. Flow diagram 500 may be implemented to create and / or create any of the macroscopic features that define the engineered surface of the plasma-facing surface of the consumable part in FIGS. 1-4 and 6-11 described in this application. Flow diagram 500 illustrates that one method for patterning the macroscopic texture (e.g., features) that defines the engineered surface of the consumable part is accomplished through masking and media blasting. In other embodiments, the macroscopic texture (e.g., features) that defines the engineered surface may be formed through machining (e.g., via physical or laser ablation, etc.). In still other embodiments, the macroscopic texture (e.g., features) that defines the engineered surface may be formed through chemical etching through a stencil or mask, or selective deposition, or additive manufacturing (e.g., via powder bed fusion, material extrusion, direct deposition, etc.) to deposit features that create the desired engineered surface.

[0078] At 510, the method includes masking the plasma-facing surface of the consumable part with a stencil, the stencil including a pattern of openings that provide access to the plasma-facing surface. The plasma-facing surface of the consumable part may include a conductive material (e.g., aluminum alloy, aluminum, metal, etc.) or a dielectric material (e.g., ceramic). The plasma-facing surface of the consumable part is configured to be exposed to the plasma and plasma by-products. As previously described, macroscopic features are patterned on the plasma-facing surface of the consumable part to promote coating adhesion, such as enhanced adhesion of a plasma-resistant thermal spray coating. In one embodiment, the macroscopic features may be formed in a conductive material (e.g., aluminum alloy) that is removed immediately after machining.

[0079] The stencil is used to control the formation of the macroscopic features (e.g., the plurality of raised features). Specifically, the form, shape, and / or contour of each of the macroscopic features is controlled by the stencil that is placed over the plasma-facing surface during blasting. Also, the pattern (including sub-pattern) of the plurality of raised features formed on the plasma-facing surface and defining the engineered surface of the plasma-facing surface is controlled via the stencil during blasting. Control parameters that define the formation of the raised features include, but are not limited to, the overall shape, center-to-center spacing, aspect ratio, feature separation (e.g., distance between features in a pattern), edge finish (e.g., roundness), and the like.

[0080] In an embodiment, the stencil may be any suitable material. In particular, the stencil may be made of any material that may not deform during media blasting. In one embodiment, the stencil is made of a material that may not deform during media blasting. In another embodiment, the stencil may be made of a material that allows the stencil to be reusable. In another embodiment, the stencil is disposable.

[0081] In yet other embodiments, the stencil is made of a material capable of conforming to complex part geometries, including transitions between edges (e.g., corners, etc.) of the surface of a corresponding consumable part (e.g., chamber liner, etc.), conductance gaps, transitions between surfaces of the consumable part, etc. That is, the plasma-facing surface of the consumable part includes surface transitions (e.g., edges, corners, valleys, etc.) that may contribute to delamination of a subsequently applied coating. For example, delamination may occur more frequently at corners of a consumable part that is not modified with embodiments of the present disclosure. In embodiments, the addition of macroscopic features to the plasma-facing surface enhances the adhesion and adheres more firmly to the plasma-facing surface having the surface transitions.

[0082] At 520, the method includes identifying and blasting the plasma-facing surface with a blasting media through a stencil to generate a plurality of raised features defining an engineered surface, the engineered surface being formed on the plasma-facing surface. In one embodiment, the macroscopic features are blasted by grit media blasting through a fabricated stencil. In another embodiment, the macroscopic features are formed by photomasking and etching. The features of the plurality of raised features are arranged in a predetermined pattern on the engineered surface. Also, in one embodiment, each of the plurality of raised features includes a top region having an outer edge and a sidewall. In one embodiment, the outer edge is rounded. In other embodiments, the outer edge may be defined as not rounded and having a sharp edge or corner. A base surface of the engineered surface surrounds each of the plurality of raised features such that a corresponding sidewall of a corresponding raised feature extends upward at an angle from the base surface to a corresponding top region.

[0083] The macroscopic patterns can be generated by the following methods, including but not limited to: bead blasting with media, grit blasting with media, and photomasking with etching. In one embodiment, the macroscopic patterns are formed by bead blasting processing with beads as the blasting media. In another embodiment, the macroscopic patterns are formed by grit blasting application with grit material as the blasting media. Control parameters during bead blasting and / or grit blasting include type of media, size of media, duration of blasting, direction of blasting, number of passes, and the like. In one embodiment, the media used for bead blasting or grit blasting is formed of the same composition and / or material as that used to form the plasma-facing surface of the consumable part to reduce and / or prevent contamination of the plasma-facing surface due to impregnation of the blasting media on the plasma-facing surface. In yet other embodiments, the macroscopic patterns are formed by photomasking and etching. For example, etching processes include wet chemical etching, plasma etching, and the like. In other embodiments, the patterned macroscopic features are formed by machining, selective deposition methods, additive manufacturing, and the like.

[0084] An additional finishing step is performed on the macroscopically textured plasma-facing surface of the consumable part. In one embodiment, for example, the method may include removing the stencil and optionally blasting the plasma-facing surface with a second blasting media to roughen the plurality of raised features with microscopic features. The microscopic texturing is performed on the plurality of raised features to provide increased fracture resistance of a coating disposed over the engineered surface. In other embodiments, the additional finishing step may include anodizing the engineered surface, such as building and / or creating an anodized layer. The additional finishing step may also include applying a thermal spray coating (e.g., a plasma-resistant thermal spray coating) to the anodized engineered surface. In particular, at least a portion of the plurality of raised features protrudes through the anodized layer to enhance adhesion of the thermal spray coating to the anodized layer.

[0085] In one embodiment, the formation of macroscopic features (e.g., raised features, recessed features, etc.) may be formed by wet chemical etching through a stencil or mask. For example, covering the consumable part with adhesive tape allows selective chemical etching of the exposed surfaces to form the planned features.

[0086] In another embodiment, the formation of macroscopic features (e.g., raised features, recessed features, etc.) may be formed by selective deposition techniques. Raised features may be produced by selectively activating areas of interest using wet or dry chemistry such as plasma, and then depositing the desired material in the activated areas. Raised features may also be produced in the reverse manner, i.e., by passivating areas for recessed features to favor subsequent deposition in the remaining areas.

[0087] In yet another embodiment, the formation of the macroscopic features (e.g., raised features, recessed features, etc.) may be achieved by additive manufacturing. The additive material may be composed of the same material as the underlying plasma-facing surface of the consumable part, or may be composed of a different composition. The additive material may also have the same microstructure as the microstructure of the underlying plasma-facing surface of the consumable part, or may have a different microstructure. For example, by way of example only, additive manufacturing methods may include, but are not limited to, photopolymerization, powder bed fusion, material extrusion, direct deposition, and the like.

[0088] In yet another embodiment, the plurality of recessed features define an engineered surface. For example, an inverse stencil or mask may be used in conjunction with media blasting (e.g., grit blasting, bead blasting, etc.) to form the plurality of recessed features. When an inverse stencil is used, recessed features may be produced that are voids in the engineered surface (i.e., as opposed to raised features that are solid). In another embodiment, an inverse stencil or mask may be used in conjunction with chemical etching to form the plurality of recessed features.

[0089] 6A, 6B-1, 6B-2, and 6C show grit blasting or bead blasting via a stencil to construct an engineered surface 300' of a consumable part 210' with a macroscopic texture. Specifically, macroscopic features (e.g., raised features) are patterned on the plasma-facing surface 310 (e.g., surface) of the consumable part 210' to promote adhesion of a coating and / or by-products.

[0090] Specifically, FIG. 6A illustrates grit blasting or bead blasting through a stencil to construct an engineered surface 300′ of a consumable part 210′ ​​with a macroscopic texture in the form of raised features designed to create additional bonding sites for better adhesion of additional layers and / or by-products, according to one embodiment of the present disclosure. As shown in FIG. 6A, in one embodiment, a plurality of raised features are machined by grit media blasting through a fabricated stencil 610. For example, the stencil 610 includes an opening 610A through which the blast media can pass and reach the plasma-facing surface 310 of the consumable part 210′. The stencil 610 also includes an obstruction 610B, which blocks the blast media from reaching the plasma-facing surface 310 of the consumable part 210′. As such, the stencil 610 controls the formation of a plurality of raised features on the plasma-facing surface 310 of the consumable part, the plurality of raised features defining corresponding engineered surfaces of the consumable part 210'.

[0091] 6A, distance 615 indicates the distance between stencil 610 and plasma-facing surface 310 (e.g., the surface of the plasma-facing surface). In some applications, distance 615 is minimized until stencil 615 comes to rest on plasma-facing surface 310 during bead and / or grit blasting. In other embodiments, stencil 615 is displaced from plasma-facing surface 310 (e.g., distance 615 has a value) during bead and / or grit blasting.

[0092] The blaster nozzle 620 is configured to deliver blast media (e.g., grit and / or beads) through the stencil at one or more angles to the plasma-facing surface 310 of the consumable part 210′. In some implementations, the blaster nozzle 620 moves toward the stencil in a pattern. For example, the blaster nozzle 610 may move in one or more directions in a first cycle or pass. For illustrative purposes, the blaster nozzle 610 may move in one direction (e.g., vertically or laterally, or diagonally) toward the stencil in one cycle or pass. One or more cycles or passes may be performed during the bead and / or grit blasting process. Different patterns of blaster nozzle 620 movement may also be performed when building multiple raised features on the plasma-facing surface 310 of the consumable part 210′.

[0093] 6B-1 illustrates grit or bead blasting the plasma-facing surface 310 of the consumable part 210′ ​​shown in FIG. 6A at an angle to create an engineered surface with macroscopic texture in the form of raised features designed to create additional bonding sites for better adhesion of additional layers and / or by-products. Specifically, macroscopic features (e.g., raised features) are patterned on the plasma-facing surface 310 (e.g., surface) of the consumable part 210′ ​​to promote adhesion of coatings and / or by-products.

[0094] As shown in FIG. 6B-1 , a stencil 610 is positioned against the plasma-facing surface 310 of the consumable part 210′ ​​during bead and / or grit media blasting. The stencil 610 includes openings 610B through which the blast media 629 can reach the plasma-facing surface 310 when blasted from the blaster nozzle 620. The stencil 610 includes occlusions 610A that restrict the blast media 629 from passing through and reaching the plasma-facing surface 310 of the consumable part 210′. As previously described, the blaster nozzle 620 may move toward the stencil in a predetermined pattern, such as a predetermined movement 625, or in a random pattern.

[0095] During the bead blasting and / or grit blasting process, particulates 635 are removed from the consumable part 210′. Specifically, the blasting media impinges and / or impacts the plasma-facing surface 310, removing portions (e.g., material) of the consumable part 210′ ​​as particulates 635. For example, regions 630A and 630B are removed from the consumable part 210′ ​​on the facing side of the raised feature 440A. In one embodiment, regions 630A and 630B bond together to surround the raised feature 440A. The particulates 635 may include the blasting media 629.

[0096] Highlights 690 on the outer edges of raised features 440A indicate undercutting of material from the consumable part 210′ ​​below the occlusion 610A of the stencil 610. Specifically, in one embodiment, highlights 690 indicate the formation of rounded corners on the outer edges of the upper regions of raised features 440A as the blast media removes material from the plasma-facing surface 310 of the consumable part 210′ ​​below the occlusion 610A.

[0097] 6B-2 illustrates that, according to one embodiment of the present disclosure, the plasma-facing surface 310 of the consumable part 210' is grit- or bead-blasted at multiple angles to construct an engineered surface 300' having a macroscopic texture in the form of raised features designed to create additional bonding sites for better adhesion of additional layers and / or by-products. Specifically, macroscopic features (e.g., raised features) are patterned on the plasma-facing surface 310 (e.g., surface) of the consumable part 210' to promote adhesion of coatings and / or by-products.

[0098] As shown in FIG. 6B-2, the stencil 610′ is positioned against the plasma-facing side 310 of the consumable part 210′ ​​during bead and / or grit media blasting. The stencil 610′ includes openings 610B′ through which the blast media 629 can reach the plasma-facing surface 310 when blasted from the buster nozzle 620. The stencil 610′ includes occlusions 610A′ that restrict the blast media 629 from passing through and reaching the plasma-facing surface 310 of the consumable part 210′. Each of the occlusions 610A includes at least one angled side 605. For example, the corresponding occlusion 610A may include angled sides 605A and 605B.

[0099] As previously described, the blaster nozzle 620 may move toward the stencil in a predetermined or random pattern, such as in a predetermined motion 625A and / or 625B. During the bead blasting and / or grit blasting process, particulates 635 are removed from the consumable part 210′. Specifically, the blasting media impinges and / or impacts the plasma-facing surface 310 and removes portions (e.g., material) of the consumable part 210′ ​​as particulates 635. For example, regions 630A′ and 630B′ are removed from the consumable part 210′ ​​on the facing side of the raised feature 440A′. In one embodiment, the regions 630A′ and 630B′ combine together to surround the raised feature 440A′. The particulates 635 may include the blasting media 629.

[0100] For example, in one pass, the blaster nozzle 620 may move in one direction, and in another pass, the blaster nozzle 620 may move in the opposite direction. In another embodiment, the blaster nozzle 620 follows a predetermined movement 625A in a pattern with the nozzle at a first angle relative to the plasma-facing surface 310. Specifically, in one embodiment, the delivery of the blast media 629 at the first angle aligns with the angled side 605A of the corresponding occlusion 610A. The blast media 629 undercuts the corresponding occlusion 610A to allow for the formation of a rounded corner at the outer edge of the top region of the corresponding raised feature 440A. In another embodiment, the blaster nozzle 620 follows a predetermined movement 625B in a pattern with the nozzle at a second angle relative to the plasma-facing surface 310. Specifically, in one embodiment, the delivery of the blast media 629 at the second angle aligns with the angled side 605B of the corresponding occlusion 610A. The blast media 629 undercuts the corresponding occlusion 610A to allow for the formation of rounded corners on the outer edge of the upper region of the corresponding raised feature 440A.

[0101] FIG. 6C illustrates an engineered surface 300′ of a consumable part after grit blasting or bead blasting as shown in FIGS. 6A, 6B-1 and / or 6B-2 in accordance with one embodiment of the present disclosure, where the engineered surface 300′ includes a macroscopic texture in the form of a plurality of raised features 440A′ (including raised features 440A) designed to create additional bonding sites for better adhesion of additional layers and / or by-products.

[0102] Specifically, after the macroscopic features are generated on the plasma-facing surface 310 of the consumable part 210′, the stencil 610 is removed from the plasma-facing surface 310 to expose the plurality of raised features that define the engineered surface 300′. Specifically, the macroscopic features may be represented by the raised features 440A described above in connection with FIGS. 4A-4B. For example, the raised features 440A include a top region 470 that may have an outer edge and a sidewall that extends at an angle upward from the base surface 350′ of the engineered surface 300′. The void regions 630A and 630B may combine to surround the raised region 440A. As shown in FIG. 6C, in one embodiment, the outer edge 460 of the raised feature 440A is rounded. Each of the raised features may have a predetermined edge finish relative to the corresponding outer edge, as described above. In one embodiment, the edge finish may include rounded corners on the outer edges, such as for raised feature 440A. In other embodiments, the edge finish may include sharp angles on the outer edges.

[0103] In one embodiment, after the macroscopic features are created, the stencil is removed and the entire engineered surface 300' is grit blasted and / or bead blasted to optionally create a microscopic roughness. The engineered surface 300' of the consumable part 210' is then anodized and finished with an overcoat (e.g., a plasma-resistant thermal spray coating). The plasma-resistant thermal spray coating may be applied via plasma spray, thermal spray, CVD, or other available techniques.

[0104] FIG. 7A illustrates a consumable part 210-1 including an engineered surface 300-1 that has been anodized (e.g., anodized layer 220-1) and covered with a plasma-resistant thermal spray coating 230-1 in accordance with one embodiment of the present disclosure, where the consumable part 210-1 does not conform to engineered surface 300-1 having macroscopic texture in the form of raised features designed to create additional bonding sites for better adhesion of additional layers and / or by-products.

[0105] Specifically, a plurality of raised features 440-1 are formed on the plasma-facing surface 310-1 of the consumable part 210-1. The plurality of raised features 440-1 define an engineered surface 300-1. The plurality of raised features 440-1 may be further blasted with grit and / or bead media to optionally form a microscopic texture. The engineered surface 300-1 is anodized to form an anodized layer 220-1. A plasma-resistant thermal spray coating 230-1 is formed on the anodized layer 220-1.

[0106] Each of the plurality of raised features 440-1 has an approximate height "h1". The height "h1" may define the contours of the plurality of raised features 440-1. As shown, the surface 705-1 of the anodized layer 220-1 may closely follow and / or conform to the contours of the plurality of raised features 240-1. Because the contours of the plurality of raised features 440-1 are exposed through the anodized layer 220-1, adhesion of the plasma resistant thermal spray coating 230-1 to the anodized layer 220-1 is enhanced.

[0107] Additionally, height "h1" is a particular dimension such that surface 710 of plasma resistant thermal spray coating 230-1 does not follow and / or conform to the contours of raised features 440-1, i.e., height "h1" is a smaller dimension such that thermal spray coating 230-1 (typically 2-3 times the thickness of anodized layer 220-1) fills in the peaks and valleys of the contours of raised features 440-1 and also extends over raised features 440-1 such that surface 710 is relatively flat.

[0108] FIG. 7B illustrates a consumable part 210-2 including an engineered surface 300-2 that has been anodized (e.g., anodized layer 220-2) and covered with a plasma-resistant thermal spray coating 230-2 that conforms to the engineered surface with macroscopic texture in the form of raised features designed to create additional bonding sites for better adhesion of additional layers and / or by-products, in accordance with one embodiment of the present disclosure.

[0109] Specifically, a plurality of raised features 440-2 are formed on the plasma-facing surface 310-2 of the consumable part 210-2. The plurality of raised features 440-2 define an engineered surface 300-2. The plurality of raised features 440-2 may be further blasted with grit and / or bead media to optionally form a microscopic texture. The engineered surface 300-2 is anodized to form an anodized layer 420-2. A plasma-resistant thermal spray coating 230-2 is formed on the anodized layer 220-2. A surface 720 of the plasma-resistant thermal spray coating 230-2 is exposed to a plasma in a plasma processing system.

[0110] Each of the plurality of raised features 440-2 has an approximate height "h2". The height "h2" may define the contours of the plurality of raised features 440-2. As shown, the surface 705-2 of the anodized layer 220-2 can closely follow and / or conform to the contours of the plurality of raised features 440-2. Because the contours of the plurality of raised features 440-2 are exposed through the anodized layer 220-2, adhesion of the plasma resistant thermal spray coating 230-2 to the anodized layer 220-2 is enhanced.

[0111] Additionally, height "h2" is a particular dimension such that surface 720 of plasma resistant thermal spray coating 230-2 follows and / or matches the contours of the plurality of raised features 440-2. That is, height "h2" is a larger dimension (e.g., height "h2" is greater than height "h1") such that thermal spray coating 230-2 follows the peaks and valleys of the contours of the plurality of raised features 440-2. As shown, surface 720 is relatively non-flat and matches the contours of the plurality of raised features 440-2.

[0112] FIG. 8A illustrates a stencil 800A and multiple exemplary apertures configured to direct grit or bead blasting media to build an engineered surface with macroscopic texture in the form of raised features designed to create additional bonding sites for better adhesion of additional layers, according to one embodiment of the present disclosure. Different types of apertures may have different effects when forming corresponding raised features on the plasma-facing surface of the corresponding consumable part. For example, the shapes of the apertures may include, but are not limited to, elliptical apertures 801 (e.g., circle, etc.), multi-sided polygonal apertures 802 (e.g., eight-sided, etc.), square or rectangular apertures 803, triangular apertures, symmetrical shapes, asymmetrical shapes, etc. Although the stencil apertures are shown as circular throughout this application, the apertures can be of any type and shape.

[0113] FIG. 8B illustrates a stencil 800B having a plurality of openings arranged in a pattern 810, according to one embodiment of the present disclosure. The patterned stencil 800B is configured to differentiate and direct a grit or bead blasting media onto the plasma-facing surface of the consumable part to build an engineered surface. Specifically, the engineered surface has a patterned macroscopic texture designed to create additional bonding sites for better adhesion of additional layers. In one embodiment, the openings of the pattern 810 are repeated uniformly throughout the stencil, as shown in FIG. 8B. Additionally, the shape and size of the openings can be selected as previously described. The density of the openings can also be selected.

[0114] In yet another embodiment, the 800B stencil, used for illustrative purposes only, may be inverted to form a plurality of recessed features that define an engineered surface. For example, a reverse stencil or mask may be used in conjunction with media blasting (e.g., grit blasting, bead blasting, etc.) to form a plurality of recessed features, which may be voids in the engineered surface (i.e., opposite the raised features, which are solid). In another embodiment, a reverse stencil or mask may be used in conjunction with chemical etching to form a plurality of recessed features.

[0115] 8C illustrates a stencil 800C for directing grit or bead blasting media onto the plasma-facing surface of a consumable part to create an engineered surface having a plurality of openings arranged in a two-zone pattern and a patterned macroscopic texture designed to create additional bonding sites for better adhesion of additional layers, according to one embodiment of the present disclosure. Specifically, stencil 800C includes a defined pattern 820 that includes a first zone 820A and a second zone 820B, with a line 825 separating the two zones.

[0116] The openings in the two zones are shown to be circular or elliptical, but can be any shape. Also, the openings in the first zone 820A can be of a first type (e.g., circular) and the openings in the second zone 820B can be of a second type (e.g., square). Also, the size of the openings in the first zone 820A and the second zone 820B are uniform, but the size of the openings in the first zone 820A can be a first size and the size of the openings in the second zone 820B can be a second size. The size and shape of the openings can control the size and shape of the formed macroscopic features, respectively.

[0117] The first zone 820A includes a first set of raised features arranged in a first subpattern. The second zone 820B includes a second set of raised features arranged in a second subpattern. The subpatterns of the first zone 820A and the second zone 820B may closely follow each other or may be different from each other. As shown in FIG. 8C, the first subpattern of the first zone 820A is similar to the subpattern of the second zone 820B, both of which follow a uniform displacement (e.g., horizontal, vertical, and / or diagonal displacement) between the openings. However, the density of the openings in the two zones is different. Specifically, the density of the openings in the first zone 820A is less than the density of the openings in the second zone 820B.

[0118] 8D illustrates a stencil 800D having a plurality of openings arranged in a three-zone pattern for directing a grit or bead blasting media onto a plasma-facing surface of a consumable part to construct an engineered surface having a patterned macroscopic texture designed to generate additional bonding sites for better adhesion of additional layers, according to one embodiment of the present disclosure. Specifically, stencil 800D includes a defined pattern 830 including a first zone 830A, a second zone 830B, and a third zone 830C. A line 831 separates first zone 830A from second zone 830B, and a line 832 separates second zone 830B from third zone 830C.

[0119] Although the openings of the three zones are shown to be circular or elliptical, they can be any shape. Also, the openings of the first zone 830A can be a first type (e.g., circular), the openings of the second zone 830B can be a second type (e.g., square), and the openings of the third zone 830C can be the first or second type, or a third type (e.g., triangular). Also, although the size of the openings of the three zones is shown to be uniform, the size of the openings of the first zone 830A can be a first size, the size of the openings of the second zone 830B can be a second size, and the size of the openings of the third zone 830C can be a third size. That is, the size of the openings of each of the three zones can be similar or different. The size and shape of the openings can control the size and shape of the formed macroscopic features, respectively.

[0120] The first zone 830A includes a first set of raised features arranged in a first subpattern. The second zone 830B includes a second set of raised features arranged in a second subpattern. The third zone 830C includes a third set of raised features arranged in a third subpattern. The subpatterns of the three zones may closely follow each other or may be different from each other. As shown, the subpatterns of each of the three zones are similar to each other and follow uniform displacements (e.g., horizontal, vertical, and / or diagonal displacements) between the openings. However, the density of the openings in the three zones is different. Specifically, the density of the openings in the first zone 830A is the highest of the three zones. The density of the openings in the third zone 830C is the lowest of the three zones. Additionally, the density of openings in the second zone is less than the density of openings in the first zone 830A, but greater than the density of openings in the third zone 830C.

[0121] FIG. 8E illustrates a stencil 800E having a plurality of openings arranged in a linear scale pattern, directing a grit or bead blasting media onto the plasma-facing surface of a consumable part to build an engineered surface having a patterned macroscopic texture designed to create additional bonding sites for better adhesion of additional layers, according to one embodiment of the disclosure. Specifically, plot 850 illustrates the density of openings in stencil 800E while moving in a particular direction across the stencil. For example, plot 850 includes a vertical axis 851 that illustrates the density of openings in stencil 800E and a horizontal axis 852 that illustrates the distance across stencil 800E in a particular direction. Following plot 850, the left side of stencil 800E has the highest density of openings. Moving from left to right across stencil 800E, the density decreases linearly until it reaches the right end of stencil 800E where the density of openings is minimal (e.g., zero).

[0122] The openings in stencil 800E are shown to be circles or ellipses, but can be any shape. Also, the openings may vary in shape throughout stencil 800E, as well as in any subpattern of the stencil. Also, while the size of the openings is shown to be uniform throughout stencil 800E, the size of the openings may vary throughout. The size and shape of the openings may control the size and shape, respectively, of the macroscopic features formed.

[0123] 9A-1, 9A-2, 9B-1, 9B-2, 9C-1, 9C-2, 9D, and 9E depict different configurations and patterns of raised features disposed across corresponding engineered surfaces and are provided for illustrative and clarification purposes only. Features may be formed across the engineered surfaces in customized patterns, with the features being formed according to selectable parameters such as size, shape, density of the raised features, and the like.

[0124] FIG. 9A-1 illustrates a plurality of raised features uniformly arranged across a corresponding engineered surface in a pattern 910 according to one embodiment of the present disclosure. The raised features defining the engineered surface include a patterned macroscopic texture designed to generate additional bonding sites for better adhesion of additional layers and / or by-products. As previously described, the structure and height of the features are configured to be uniform to build a conformal plasma-resistant thermal spray coating (not shown). That is, the thermal spray coating has a contour that similarly matches the contour of the engineered surface. For example, the height of the macroscopic raised features in the pattern 910 and the separation between the raised features allow the top surface of the thermal spray coating to approximately match the contour of the engineered surface in the pattern 910.

[0125] FIG. 9A-2 illustrates a plurality of raised features uniformly arranged at a lower density than the features of FIG. 9A-1, according to one embodiment of the present disclosure. The features of FIG. 9A-2 are uniformly arranged across the corresponding engineered surface in a pattern 920. The structure and height of the features of FIG. 9A-2 are configured similarly to the features of FIG. 9A-1 and are configured to be uniform to build a conformal plasma-resistant thermal spray coating, as described above. However, the density of the features in the pattern 920 of FIG. 9A-2 is less than the density of the features in the pattern 910 of FIG. 9A-1 to illustrate that the density can be selected. Also, the size and shape of the features in each of the patterns 910 and 920 can be selected.

[0126] FIG. 9B-1 shows a plurality of uniformly arranged raised features in a pattern 930 according to one embodiment of the present disclosure. The structure and height of the features in the pattern 930 are uniform. Specifically, the height of the features in the pattern 930 is smaller than the height of the features in the pattern 910 of FIG. 9A-1. The structure and height of the features in the pattern 930 are configured to be uniform to build a relatively flat non-conformal plasma-resistant thermal spray coating, as described above. That is, the thermal spray coating has a contour that does not match the contour of the engineered surface. The raised features define an engineered surface with a patterned macroscopic texture designed to create additional bonding sites for better adhesion of additional layers. For example, the height of the macroscopic raised features in the pattern 930 and the separation between the raised features may prevent the upper surface of the thermal spray coating from substantially conforming to the contour of the engineered surface of the pattern 930.

[0127] FIG. 9B-2 shows a plurality of raised features uniformly arranged at a lower density than the features of FIG. 9B-1 according to one embodiment of the present disclosure. The features of FIG. 9B-2 are uniformly arranged across the corresponding engineered surface in pattern 940. The structure and height of the features of FIG. 9B-2 are configured similarly to the features of FIG. 9B-1 and are configured to be uniform to build a non-conformal plasma-resistant thermal spray coating as described above. The density of the features in pattern 940 of FIG. 9B-2 is less than the density of the features in pattern 930 of FIG. 9B-1 to illustrate that the density can be selected. Also, the size and shape of the features in each of patterns 930 and 940 can be selected.

[0128] FIG. 9C-1 shows a plurality of raised features arranged in a pattern 950 further including two sub-patterns 950A and 950B according to one embodiment of the present disclosure. The raised features in the two sub-patterns 950A and 950B define an engineered surface with a patterned macroscopic texture designed to generate additional bonding sites for better adhesion of additional layers and / or by-products. The structure and height of the features throughout each of the two sub-patterns 950A and 950B are uniform to build a conformal plasma spray-resistant coating (not shown) as described above. That is, the spray coating has a contour that matches similarly to the contour of the engineered surface. For example, the height of the macroscopic raised features in pattern 910 and the separation between the raised features allow the top surface of the spray coating to approximately match the contour of the engineered surface of pattern 910. Although the features are shown to be uniform throughout each of the two subpatterns 950A and 950B, the density of features in subpattern 950B (to the right) is less than the density of features in subpattern 950A (to the left), indicating that the density of raised features in each of subpatterns 950A and 950B can be selected. Additionally, although the features are shown to be uniform throughout each of the two subpatterns 950A and 950B, the features may have different configurations, as further shown in FIG.

[0129] FIG. 9C-2 shows a plurality of raised features arranged in two sub-patterns 960A and 960B, where the structure and height of the features in each sub-pattern are uniform but may differ between the two sub-patterns, according to one embodiment of the present disclosure. The raised features in the two sub-patterns 960A and 960B define an engineered surface with a patterned macroscopic texture designed to generate additional bonding sites for better adhesion of additional layers and / or by-products. The features across each of the two sub-patterns 960A and 960B have different configurations. Specifically, the structure and height of the features in sub-pattern 960A are uniform to build a conformal plasma-resistant thermal spray coating (not shown) as described above. For example, the height of the macroscopic raised features and the separation of the raised features in sub-pattern 960A allow the top surface of the thermal spray coating to similarly and / or approximately conform to the contour of the engineered surface in sub-pattern 960A. On the other hand, the structure and height of the features in subpattern 960B are uniform to construct a non-conformal plasma-resistant thermal spray coating, as described above. For example, the height of the macroscopic raised features in subpattern 960B and the separation between the raised features may cause the top surface of the thermal spray coating to not be able to conform similarly and / or nearly to the contour of the engineered surface in subpattern 960B. That is, the top surface of the thermal spray coating has a contour that does not match the raised features in subpattern 960B. In this manner, the thermal spray coating may have different contours depending on the underlying raised feature subpattern. Although the features are shown to have the same density throughout both subpatterns 960A and 960B, the density of the features may vary between the two subpatterns 960A and 960B, and the density of the raised features in each of subpatterns 960A and 960B may be selectable. For example, the density of features in subpattern 960B (to the right) may be less than the density of features in subpattern 960A (to the left), or vice versa.

[0130] FIG. 9D shows a plurality of raised features arranged in three sub-patterns (970A, 970B, and 970C) according to one embodiment of the present disclosure, where the structure and height of the features across the sub-patterns are uniform. The raised features in the three sub-patterns 970A, 970B, and 970C define an engineered surface with a patterned macroscopic texture designed to generate additional bonding sites for better adhesion of additional layers and / or by-products. The features across each of the three sub-patterns may have the same configuration. For example, the structure and height of the features in the three sub-patterns may be uniform to build a conformal or non-conformal plasma-resistant thermal spray coating (not shown) as described above. For example, the height of the macroscopic raised features and the separation between the raised features in the three sub-patterns allow the top surface of the thermal spray coating to conform similarly and / or approximately to the contours of the engineered surface depending on the underlying sub-pattern. Alternatively, the height of the macroscopic raised features and the separation between the raised features in the three subpatterns may prevent the top surface of the thermal spray coating from conforming similarly and / or nearly to the contours of the engineered surface. Although the features are shown to be uniform throughout each of the three subpatterns, in other embodiments, the configuration (e.g., size and shape) of features in one subpattern may differ relative to the configuration of features in another subpattern depending on the underlying subpattern. More specifically, the density of features in each of subpatterns 970A, 970B, and 970C has a different density. Specifically, the density of features in subpattern 970A is the highest and the density of features in subpattern 970C is the lowest. Also, the density of features in subpattern 970B is greater than the density of features in subpattern 970C and less than the density of features in subpattern 970A.

[0131] FIG. 9E illustrates a plurality of raised features arranged in a linearly scaled pattern 980 such that the density of the features increases linearly, according to one embodiment of the present disclosure. The raised features define an engineered surface with a patterned macroscopic texture designed to generate additional bonding sites for better adhesion of additional layers and / or by-products. For illustrative purposes only, the features in the pattern 980 may be formed using the stencil 800E of FIG. 8E. Specifically, the features across the engineered surface may have the same configuration. For example, the structure and height of the features in the pattern 980 may be uniform to build a conformal or non-conformal plasma-resistant thermal spray coating (not shown), as previously described. Although the features are shown as being uniform across the engineered surface, in other embodiments, the configuration (e.g., size and shape) of the features may vary across the engineered surface. Plot 990 illustrates the density of the raised features in the pattern 980. For example, plot 990 includes a vertical axis 991 that indicates the density of raised features (e.g., nodules) and a horizontal axis 992 that indicates the distance across the engineered surface in a particular direction. According to plot 990, the density of raised features is highest in a particular direction to the left of pattern 980. Moving along a particular direction toward pattern 980 showing the engineered surface, the density of raised features decreases linearly until the density of raised openings reaches a minimum (e.g., zero) to the right of pattern 980.

[0132] FIG. 10 illustrates a process of applying different stencils to the plasma-facing surface 310 of the consumable part 210′ ​​to generate the described configurations (e.g., rounded edges) in a plurality of raised features arranged in a pattern, according to one embodiment of the disclosure. For example, bead and / or grit blasting with corresponding blasting media is performed in two passes. In the first pass, bead and / or grit blasting with a first blasting media is performed using stencil 1. The bead and / or grit blasting may move towards stencil 1 (1010) at one or more predetermined angles (e.g., the angle of the blaster nozzle) according to a predetermined pattern. In the second pass, bead and / or grit blasting with a second blasting media is performed using stencil 2 (1020). The first and second blasting media may be the same or different. The bead and / or grit blast may move toward stencil 2 according to a predetermined pattern and at one or more predetermined angles (e.g., the angle of the blaster nozzle). Using different stencils 1 and 2 may promote desired edges in the raised features that define the engineered surface. For example, the openings in stencil 2 may be larger than the openings in stencil 1, but both patterns of openings generally follow the same pattern. In that way, during the second pass, the blast media may reach additional areas of the plasma-facing surface 310 of the consumable part 210' to generate rounded corners on the outer edges of the upper regions of the plurality of raised features that are formed in the engineered surface and that define the engineered surface, as shown in FIGS. 4A-4B.

[0133] 11 is an electron microscope image of a cross section of a consumable part 210-3 that includes an engineered surface that has been anodized (anodized layer 220-3) and covered with a plasma-resistant thermal spray coating 230-3, according to one embodiment of the present disclosure. The engineered surface includes a patterned macroscopic texture designed to create additional bonding sites for better adhesion of additional layers and / or by-products, according to one embodiment of the present disclosure.

[0134] The above description of the embodiments has been provided for purposes of illustration and description. It is not intended to be comprehensive or to limit the present disclosure. Individual elements or features of a specific embodiment are generally not limited to that specific embodiment, but, where applicable, may be interchangeable and may be used in selected embodiments even if not specifically shown or described. The same may also be modified in various ways. Such variations should not be considered as departures from the present disclosure, and all such variations are intended to be included within the scope of the present disclosure.

[0135] Although the foregoing embodiments have been described in some detail for purposes of clarity of understanding, it will be apparent that certain changes and modifications may be practiced within the scope of the appended claims. Thus, the present embodiments are to be considered as illustrative and not restrictive, and the present embodiments are not to be limited to the details given herein, but may be modified within the scope and equivalents of the claims.

Claims

1. 1. A consumable part for a plasma processing chamber, comprising: a plasma-facing surface of the consumable part; and an engineered surface formed on the plasma-facing surface of the consumable part; a plurality of raised features defining the engineered surface, the features of the plurality of raised features being arranged in a predetermined pattern, each of the plurality of raised features including an upper region having an outer edge and a sidewall; a base surface of the engineered surface surrounding each of the plurality of raised features such that a corresponding sidewall of a corresponding raised feature extends upwardly from the base surface toward a corresponding upper region at an angle; Equipped with the consumable part is configured to be installed in the plasma processing chamber; the consumable part is configured to be exposed to a plasma and by-products of the plasma; Consumable parts.

2. 2. The consumable part according to claim 1, The angle ranges between about 15 degrees and about 60 degrees.

3. 2. The consumable part according to claim 1, The consumable part, wherein features of the plurality of raised features are macroscopic with corresponding raised feature heights relative to the base surface ranging from about 0.2 mm to about 3 mm.

4. 2. The consumable part according to claim 1, an anodized layer formed on said engineered surface; a thermal spray coating formed on the anodized layer; Further equipped with The plurality of raised features are configured to enhance adhesion of the thermal spray coating to the anodized layer.

5. 2. The consumable part according to claim 1, The consumable parts are: a liner configured to protect an interior wall of the plasma processing chamber; or one or more C shroud sections; or one or more plasma confinement ring segments; or Focus ring, or Edge ring, or Electrostatic semiconductor wafer clamping / chucking system; or Top electrode, or Dielectric windows for inductively coupled plasmas, or Bottom Electrode A consumable part comprising one of the following:

6. 2. The consumable part according to claim 1, a plurality of microscopic features optionally formed on said plurality of raised features; The consumable parts further include:

7. 2. The consumable part according to claim 1, the defined pattern includes a first zone and a second zone; the first zone includes a first set of raised features arranged in a first subpattern; The second zone includes a second set of raised features arranged in a second subpattern.

8. 2. The method of claim 1 , The method, wherein the plasma-facing surface of the consumable part is a conductive or dielectric material.

9. 1. A method for constructing an engineered surface of a consumable part configured to be installed in a plasma processing chamber, comprising: masking the plasma-facing surface of the consumable part with a stencil, the stencil including a pattern of openings providing access to the plasma-facing surface; identifying and blasting the plasma-facing surface with a blasting media through the stencil to generate a plurality of raised features defining the engineered surface, the engineered surface being formed on the plasma-facing surface; Including, features of the plurality of raised features are arranged in a predetermined pattern on the engineered surface; each of the plurality of raised features includes an upper region having an outer edge and a sidewall; a base surface of the engineered surface surrounds the plurality of raised features such that corresponding sidewalls of corresponding raised features extend upward at an angle from the base surface to corresponding upper regions; The method, wherein the consumable part is exposed to a plasma or a by-product of the plasma.

10. 10. The method of claim 9, The angle ranges between about 15 degrees and about 60 degrees.

11. 10. The method of claim 9, the features of the plurality of raised features are macroscopic, with corresponding raised feature heights relative to the base surface ranging from about 0.2 mm to about 3 mm; method.

12. 10. The method of claim 9, The consumable parts are: a liner configured to protect an interior wall of the plasma processing chamber; or one or more C shroud sections; or one or more plasma confinement ring segments; or Focus ring, or Edge ring, or Electrostatic semiconductor wafer clamping / chucking system; or Top electrode, or Dielectric windows for inductively coupled plasmas, or Bottom Electrode The method comprises one of:

13. 10. The method of claim 9, identifying and blasting the plasma-facing surface through the stencil, bead blasting the plasma-facing surface; or grit blasting said plasma-facing surface. Including, The method, wherein the blast media is made of the same type of material as the plasma-facing surface of the consumable part.

14. 10. The method of claim 9, the stencil includes a first zone and a second zone; the first zone includes a first sub-pattern of openings; The method, wherein the second zone comprises a second subpattern of openings.

15. 10. The method of claim 9, identifying and blasting the plasma-facing surface through the stencil, blasting the plasma-facing surface at a first angle with the blasting media through the stencil; blasting the plasma-facing surface at a second angle through the stencil with the blasting media; A method comprising:

16. 10. The method of claim 9, removing the stencil; and Optionally blasting the plasma-facing surface with a second blasting medium to roughen the plurality of raised features with microscopic features. The method further comprising:

17. 10. The method of claim 9, anodizing the engineered surface to produce an anodized layer; applying a thermal spray coating to the anodized layer, At least a portion of the plurality of raised features protrude through the anodized layer to enhance adhesion of the thermal sprayed coating to the anodized layer. The method further comprising:

18. 1. A plasma processing chamber for processing a wafer, comprising: a lower electrode configured to support the wafer; an upper electrode located above the lower electrode; A consumable part, a plasma-facing surface of the consumable part; and a consumable part including an engineered surface formed on a plasma-facing surface of the consumable part; a plurality of raised features defining the engineered surface, The features of the plurality of raised features are arranged in a predetermined pattern, each of the plurality of raised features including a top region having an outer edge and a sidewall; a base surface of the engineered surface surrounding each of the plurality of raised features such that a corresponding sidewall of a corresponding raised feature extends upwardly from the base surface toward a corresponding upper region at an angle; Including, the consumable part is configured to be installed in the plasma processing chamber; the consumable part is configured to be exposed to a plasma and by-products of the plasma; Plasma processing chamber.

19. 20. The plasma processing chamber of claim 17, further comprising: The consumable parts are: a liner configured to protect an interior wall of the plasma processing chamber; or one or more C shroud sections; or one or more plasma confinement ring segments; or Focus ring, or Edge ring, or Electrostatic semiconductor wafer clamping / chucking system; or Top electrode, or Dielectric windows for inductively coupled plasmas, or Bottom Electrode 1. A plasma processing chamber comprising one of:

20. 18. The consumable part according to claim 17, the angle ranges between about 15 degrees and about 60 degrees; the features of the plurality of raised features are macroscopic with corresponding raised feature heights relative to the base surface ranging from about 0.2 mm to about 3 mm; a plurality of microscopic features are optionally formed in said plurality of raised features; the plasma-facing surface of the consumable part is a conductive or dielectric material; Further comprising, consumable parts.

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