Semi-solid alloy interface heat dissipation composition and use thereof

Abstract

To provide a semi-solid alloy interface heat dissipation composition and a method of using the same, which automatically fills in the unevenness at the interface of electronic components, possesses both advantages of solid metals and liquid metals, and thus achieves technical effects of easy installation, high conductivity, and low thermal contact resistance.SOLUTION: A semi-solid alloy interface heat dissipation composition 1 comprises, based on total atoms of 100 at.%, 0.1-10 at.% of Bi, 20-30 at.% of In, and 65-75 at.% of Sn. In use thereof, the semi-solid alloy interface heat dissipation composition 1 is disposed between a heat sink heat dissipation device 2 and an electronic component 3, is completely solid at a room temperature, and has a liquid content ranging from 0.1 to 70% at a temperature of 40 to 130°C.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a heat dissipation composition, and more particularly to a semi-solid alloy interface heat dissipation composition. [Background technology]

[0002] When electronic components operate, heat is generated, and if the temperature exceeds the heat resistance range of the electronic components, it may cause damage to the electronic components. Heat sinks are a widely used heat dissipation method that can remove heat generated from electronic components. To further improve heat dissipation efficiency, a thermal interface material (TIM) is additionally used between the electronic component and the heat sink to fill holes that occur when the two materials of the electronic component and the heat sink are joined or contacted, thereby reducing the surface contact thermal resistance between the heat sink and the electronic component.

[0003] Thermal interface materials come in solid, liquid and composite forms, solid thermal interface materials are, for example, tapes and silicone sheets, and liquid thermal interface materials are, for example, gels and thermal pastes. However, liquid thermal interface materials are difficult to control and prone to flow during the operation of electronic components, which limits their installation and use. Solid thermal interface materials require a reflow process and are prone to the formation of brittle compounds at the interface, which reduces their thermal performance and mechanical properties. Composite thermal interface materials have the disadvantages of being complicated to manufacture and involving unstable materials, which are prone to chemical reactions during use, and which make it difficult to evaluate their material properties and reliability.

[0004] In view of the above, there is a need to improve upon conventional thermal interface materials. Summary of the Invention [Problem to be solved by the invention]

[0005] The main objective of the present invention is to provide a semi-solid alloy interface heat dissipation composition to solve the above technical problems, including that liquid thermal interface materials are not stable when applied to an entity, solid thermal interface materials are difficult to apply, have poor thermal conductivity and mechanical properties, and composite thermal interface materials are difficult to manufacture and lack stable properties. [Means for solving the problem]

[0006] In order to achieve the above object, according to one embodiment of the present invention, there is provided a semi-solid alloy interface heat dissipation composition, the composition comprising, relative to a total atomic percentage of 100, 0.1 at% to 10 at% bismuth, 20 at% to 30 at% indium, and 65 at% to 75 at% tin.

[0007] In order to achieve the above object, according to another embodiment of the present invention, there is provided a semi-solid alloy interface heat dissipation composition containing, relative to a total atomic percentage of 100, 0.1 at% to 15 at% bismuth, 5 at% to 30 at% indium, 20 at% to 40 at% nickel, and 40 at% to 60 at% tin.

[0008] In order to achieve the above object, according to yet another embodiment of the present invention, there is provided a semi-solid alloy interface heat dissipation composition containing, relative to a total atomic percentage of 100, 0.1 at% to 20 at% silver, 0.1 at% to 15 at% bismuth, 10 at% to 75 at% indium, 0.1 at% to 30 at% nickel, and 0.1 at% to 50 at% tin.

[0009] In order to achieve the above object, according to yet another embodiment of the present invention, there is provided a semi-solid alloy interface heat dissipation composition containing, relative to a total atomic percentage of 100, 5 at% to 15 at% silver, 0.1 at% to 10 at% bismuth, 0.1 at% to 10 at% copper, 65 at% to 75 at% indium, 0.1 at% to 10 at% nickel, and 0.1 at% to 10 at% tin.

[0010] In order to achieve the above object, according to yet another embodiment of the present invention, there is provided a use of the above-mentioned semi-solid alloy interface heat dissipation composition for dissipating heat from an electronic component, wherein the semi-solid alloy interface heat dissipation composition is provided between a heat dissipation device and the electronic component, is all-solid at room temperature, and has a liquid content of 0.1% to 70% of the total mole number of the semi-solid alloy interface heat dissipation composition at a temperature of 40°C to 130°C.

[0011] In one embodiment of the present invention, the heat dissipation device is a heat sink. Effect of the Invention

[0012] The beneficial effects of the present invention are as follows: When the temperature of the semi-solid alloy interface heat dissipation composition of the present invention rises with the use of electronic components and exceeds 40°C, it begins to melt and partly becomes liquid, automatically filling the unevenness of the interface of the electronic components. And within the operating limit temperature of the electronic components (about 130°C), the liquid phase ratio of the semi-solid alloy interface heat dissipation composition is less than 70%, and it does not flow arbitrarily large inside the electronic components, and it combines the advantages of both solid metal and liquid metal, and realizes technical effects such as easy installation, high conductivity, and low interface thermal resistance. [Brief description of the drawings]

[0013] [Figure 1] FIG. 2 is a schematic diagram of a semi-solid alloy interface heat dissipation composition according to an embodiment of the present invention disposed between a heat sink and a chip; [Diagram 2] FIG. 2 is a schematic diagram illustrating a semi-solid alloy interface heat dissipation composition according to an embodiment of the present invention first disposed between a heat sink and a chip. [Diagram 3] FIG. 2 is a schematic diagram illustrating a case where a semi-solid alloy interface heat dissipation composition according to an embodiment of the present invention is provided between a heat sink and a chip, and the semi-solid alloy interface heat dissipation composition melts locally under the operation of the chip. [Figure 4]FIG. 2 is a schematic diagram illustrating a case where the semi-solid alloy interface heat dissipation composition according to an embodiment of the present invention is provided between a heat sink and a chip, and the temperature of the chip continues to rise, so that the semi-solid alloy interface heat dissipation composition further melts. [Diagram 5] 1 shows a Differential Scanning Calorimetry (DSC) analysis of a semi-solid alloy interface heat dissipation composition according to an embodiment of the present invention. [Figure 6] 1 shows a DSC analysis of the composition of Comparative Example 1. [Figure 7] 4 shows a DSC analysis of a semi-solid alloy interface heat dissipation composition according to another embodiment of the present invention. [Figure 8] 4 shows a DSC analysis of a semi-solid alloy interface heat dissipation composition according to yet another embodiment of the present invention. [Figure 9] 4 shows a DSC analysis of a semi-solid alloy interface heat dissipation composition according to yet another embodiment of the present invention. [Figure 10] 4 shows a DSC analysis of the composition of Comparative Example 2. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] In order to better explain the present invention, in the following specific embodiments, many specific details are provided, but it should be understood by those skilled in the art that the present invention can be similarly practiced in embodiments in which certain specific details are not provided.

[0015] Ternary semi-solid alloy interface heat dissipation composition

[0016] The semi-solid alloy interface heat dissipation composition according to the first embodiment of the present invention contains, when the total atomic percentage (at%) of the semi-solid alloy interface heat dissipation composition is taken as 100, 0.1 at% to 10 at% (e.g., 0.1 at%, 1 at%, 2 at%, 3 at%, 4 at%, 5 at%, 6 at%, 7 at%, 8 at%, 9 at%, or 10 at%) of bismuth, 20 at% to 30 at% (e.g., 20 at%, 21 at%, 22 at%, 23 at%, 24 at%, 25 at%, 26 at%, 27 at%, 28 at%, 29 at%, or 30 at%) of indium, and 65 at% to 75 at% (e.g., 65 at%, 66 at%, 67 at%, 68 at%, 69 at%, 70 at%, 71 at%, 72 at%, 73 at%, 74 at%, or 75 at%) of tin.

[0017] In addition to providing the above-mentioned semi-solid alloy interface heat dissipation composition containing three elements (ternary composition) in the present invention, according to different actual application situations, the present invention also provides a semi-solid alloy interface heat dissipation composition containing four elements (quaternary), a semi-solid alloy interface heat dissipation composition containing five elements (quinary) and a semi-solid alloy interface heat dissipation composition containing six elements (hexanary), as follows:

[0018] Quaternary semi-solid alloy interface heat dissipation composition

[0019] In addition to bismuth, indium and tin, the semi-solid alloy interface heat dissipation composition according to the second embodiment of the present invention can further include nickel, and when the total atomic percentage of the semi-solid alloy interface heat dissipation composition is taken as 100, the semi-solid alloy interface heat dissipation composition can include 0.1 at% to 15 at% (e.g., 0.1 at%, 1 at%, 2 at%, 3 at%, 4 at%, 5 at%, 6 at%, 7 at%, 8 at%, 9 at%, 10 at%, 11 at%, 12 at%, 13 at%, 14 at%, or 15 at%) of bismuth, 5 at% to 30 at% (e.g., 5 at%, 6 at%, 7 at%, 8 at%, 9 at%, 10 at%, 11 at%, 12 at%, 13 at%, 14 at%, or 15 at%) of nickel. t%, 10 at%, 12 at%, 14 at%, 16 at%, 18 at%, 20 at%, 22 at%, 24 at%, 26 at%, 28 at%, or 30 at%) indium, 20 at% to 40 at% (e.g., 20 at%, 22 at%, 24 at%, 26 at%, 28 at%, 30 at%, 32 at%, 34 at%, 36 at%, 38 at%, or 40 at%) nickel, and 40 at% to 60 at% (e.g., 40 at%, 42 at%, 44 at%, 46 at%, 48 at%, 50 at%, 52 at%, 54 at%, 56 at%, 58 at%, or 60 at%) tin.

[0020] Quinella semi-solid alloy interface heat dissipation composition:

[0021] In addition to bismuth, indium, tin and nickel, the semi-solid alloy interface heat dissipation composition according to the third embodiment of the present invention can further include silver, and when the total atomic percentage of the semi-solid alloy interface heat dissipation composition is 100, the semi-solid alloy interface heat dissipation composition can include 0.1 at% to 20 at% (for example, 0.1 at%, 1 at%, 2 at%, 3 at%, 4 at%, 5 at%, 6 at%, 7 at%, 8 at%, 9 at%, 10 at%, 11 at%, 12 at%, 13 at%, 14 at%, 15 at%, 16 at%, 17 at%, 18 at%, 19 at%, or 20 at%) silver, 0.1 at% to 15 at% (for example, 0.1 at%, 1 at%, 2 at%, 3 at%, 4 at%, 5 at%, 6 at%, 7 at%, 8 at%, 9 at%, 10 at%, 11 at%, 12 at%, 13 at%, 14 at%, or 15 at%) bismuth, 10 at% to 75 at% (for example, 10 at%, 12 at%, 14 at%, 16 at%, 18 at%, 20 at%, 22 at%, 24 at%, 26 at%, 28 at%, 30 at%, 32 at%, 34 at%, 36 at%, 38 at%, 40 at%, 42 at%, 44 at%, t%, 46at%, 48at%, 50at%, 52at%, 54at%, 56at%, 58at%, 60at%, 62at%, 64at%, 66at%, 68at%, 70at%, 72at%, or 74at%) indium, 0.1at% to 30at% (for example, 0.1at%, 1at%, 2at%, 3at%, 4at%, 5at%, 6at%, 7at%, 8at%, 9at%, 10at%, 11at%, 12at%, 13at%, 14at%, 15at%, 16at%, 17at%, 18at%, 19at%, 20at%, 21at%) , 22 at%, 23 at%, 24 at%, 25 at%, 26 at%, 27 at%, 28 at%, 29 at%, or 30 at%) nickel, and 0.1 at% to 50 at% (for example, 0.1 at%, 2 at%, 4 at%, 6 at%, 8 at%, 10 at%, 12 at%, 14 at%, 16 at%, 18 at%, 20 at%, 22 at%, 24 at%, 26 at%, 28 at%, 30 at%, 32 at%, 34 at%, 36 at%, 38 at%, 40 at%, 42 at%, 44 at%, 46 at%, 48 at%, or 50 at%) tin.

[0022] Hexagonal semi-solid alloy interface heat dissipation composition

[0023] In addition to bismuth, indium, tin, nickel, and silver, the semi-solid alloy interface heat dissipation composition according to the fourth embodiment of the present invention can further include copper, and when the total atomic percentage of the semi-solid alloy interface heat dissipation composition is taken as 100, the semi-solid alloy interface heat dissipation composition can include 5 at% to 15 at% (e.g., 5 at%, 6 at%, 7 at%, 8 at%, 9 at%, 10 at%, 11 at%, 12 at%, 13 at%, 14 at%, or 15 at%) of silver, 0.1 to 10 at% (e.g., 0.1 at%, 1 at%, 2 at%, 3 at%, 4 at%, 5 at%, 6 at%, 7 at%, 8 at%, 9 at%, or 10 at%) of bismuth, 0.1 at% to 10 at% (e.g., 0.1 at%, 1 at%, 2 at%, 3 at%, 4 at%, 5 at%, , 6 at%, 7 at%, 8 at%, 9 at%, or 10 at%) copper, 65 at% to 75 at% (for example, 60 at%, 61 at%, 62 at%, 63 at%, 64 at%, 65 at%, 66 at%, 67 at%, 68 at%, 69 at%, 70 at%, 71 at%, 72 at%, 73 at%, 74 at%, or 75 at%) indium, 0.1 at% to 1 Contains 0 at% (e.g., 0.1 at%, 1 at%, 2 at%, 3 at%, 4 at%, 5 at%, 6 at%, 7 at%, 8 at%, 9 at%, or 10 at%) nickel and 0.1 at% to 10 at% (e.g., 0.1 at%, 1 at%, 2 at%, 3 at%, 4 at%, 5 at%, 6 at%, 7 at%, 8 at%, 9 at%, or 10 at%) tin.

[0024] As shown in Figs. 1 to 4, in the use of the above-mentioned semi-solid alloy interface heat dissipation composition for dissipating heat from an electronic component according to the fifth embodiment of the present invention, a semi-solid alloy interface heat dissipation composition 1 is provided between a heat dissipation device 2 and an electronic component 3, and is entirely solid at room temperature, and the liquid content at a temperature of 40°C to 130°C accounts for 0.1% to 70% of the total mole number of the semi-solid alloy interface heat dissipation composition.

[0025] Specifically, in this embodiment, the heat dissipation device 2 is a heat sink, and the electronic component 3 is a chip. As shown in Figures 1 and 2, the semi-solid alloy interface heat dissipation composition 1 of the present invention is easily formed into a sheet-like body based on its characteristic of being all solid at room temperature, and thus can be easily attached between the heat dissipation device 2 and the electronic component 3.

[0026] As shown in Fig. 3, when the temperature of the electronic component 3 increases with use and exceeds 40°C, the semi-solid alloy interface heat dissipation composition 1 of the present invention begins to melt and becomes a mixed form in which most of it becomes solid 11 and a small part becomes liquid 12. As can be seen from Fig. 3, the semi-solid alloy interface heat dissipation composition 1 close to the electronic component 3 becomes liquid 12 due to the relatively high temperature in that area, so that the unevenness of the interface of the electronic component 3 can be filled in and a better heat dissipation effect can be achieved for the electronic component 3.

[0027] As shown in FIG. 4, as the temperature of the electronic component 3 continues to rise, the semi-solid alloy interface heat dissipation composition 1 melts and turns into more liquid 12, completely filling in the unevenness of the interface of the electronic component 3. Within the operating temperature limit of the electronic component 3 (about 130° C.), the liquid phase ratio of the semi-solid alloy interface heat dissipation composition 1 is controlled to less than 70%, so that the semi-solid alloy interface heat dissipation composition 1 does not flow arbitrarily large within the electronic component 3, and thus combines the advantages of the stability of a solid metal and the excellent thermal conductivity of a liquid metal.

[0028] It is expected that during the life of the patent of this application, many related technologies relating to semi-solid alloy interface heat dissipation compositions and their uses will be developed, and the scope of this application is intended to include all such new technologies a priori.

[0029] Throughout this application, various embodiments of the invention may be presented in a range format. It should be understood that the description in range format is merely for convenience and brevity and should not be construed as an inflexible limitation on the scope of the invention. Thus, any description of a range should be considered to have specifically disclosed all possible subranges and individual numerical values ​​within that range. For example, a description of a range such as 1-6 should be considered to have specifically disclosed subranges such as 1-3, 1-4, 1-5, 2-4, 2-6, 3-6, etc., and individual numerical values ​​within said range such as 1, 2, 3, 4, 5, 6, etc. Any broad range is applicable.

[0030] As used herein, the terms "process" and "method" refer to methods, means, techniques, and procedures for accomplishing a particular task, including, but not limited to, methods, means, techniques, and procedures that are known to a practitioner in the chemical, materials, mechanical, computational, and digital arts or that are readily evolved from known methods, means, techniques, and procedures.

[0031] Reference is now made to the following examples, which together with the above descriptions illustrate some embodiments of the invention in a non-limiting manner.

[0032] Hereinafter, the melting points of the semi-solid alloy interface heat dissipation composition of the present invention will be analyzed by differential scanning calorimetry (DSC), and compositions having the same elemental composition but different contents will also be analyzed.

[0033] Experimental method

[0034] The target alloy to be detected was cut into sheets of approximately 45mg to 50mg and placed in an alumina crucible, after which a differential scanning calorimeter was placed to measure the melting temperature. The parameters were set to heat from 30°C to 150°C (heating rate of 5°C / min), hold for 10 minutes, then cool to 30°C (cooling rate of 5°C / min), and finally hold for 10 minutes, repeating the above heating and cooling cycle a total of three times. The following result data is obtained using the average results of 2 to 3 times.

[0035] Example 1 (semi-solid alloy interface heat dissipation composition of the present invention, ternary alloy)

[0036] Referring to Table 1 (Example 1) and Table 2 (Comparative Example 1) below, Example 1 contains 5 at% bismuth, 25 at% indium, and 70 at% tin. Comparative Example 1 also contains three elements, bismuth, indium, and tin, but the contents are different, with the indium content being low at 5 at% and the tin content being high at 90 at%.

[0037] [Table 1]

[0038] [Table 2]

[0039] Table 3 (Example 1) and Table 4 (Comparative Example 1) below show the contents of the liquid phase obtained by melting, analyzed by PANDAT software simulation. Referring to Tables 3 and 4 and the DSC analysis results of FIG. 5 (Example 1) and FIG. 6 (Comparative Example 1), Table 3 shows that the liquid phase content at 70°C accounts for 11.8% of the total moles of the ternary alloy, and the liquid phase content at 120°C accounts for 27.6% of the total moles of the ternary alloy. The arrows in FIG. 5 indicate the direction of heat dissipation, and since an endothermic reaction occurs when the solid phase becomes liquid, the melting start temperature is determined by observing the heat absorption direction opposite to the arrow indicating the heat dissipation direction. Referring to the lower wave in FIG. 5, the peak value is about 80.4°C, and the melting start temperature is about 72.3°C, indicating that the ternary alloy of Example 1 begins to melt at 72.3°C. FIG. 6 does not show any peaks, indicating that the alloy of Comparative Example 1 does not experience a melting phenomenon.

[0040] [Table 3]

[0041] [Table 4]

[0042] Example 2 (semi-solid alloy interface heat dissipation composition of the present invention, quaternary alloy)

[0043] Referring to Table 5 below, Example 2 contains 5 at% bismuth, 25 at% indium, 25 at% nickel, and 45 at% tin.

[0044] [Table 5]

[0045] Table 6 below shows the content of the liquid phase obtained by melting, which is analyzed by PANDAT software simulation. Referring to Table 6 and the DSC analysis results in FIG. 7, Table 6 shows that the liquid phase content at 60°C accounts for 20.1% of the total moles of the quaternary alloy, and the liquid phase content at 100°C accounts for 41.8% of the total moles of the quaternary alloy. The arrow in FIG. 7 indicates the direction of heat dissipation. When the solid phase becomes liquid, an endothermic reaction occurs, so the melting start temperature is determined by observing the endothermic direction opposite to the arrow indicating the heat dissipation direction. Referring to the lower wave in FIG. 7, there are two peak values, which are about 63.6°C and 118.4°C, and the melting start temperatures are about 61.5°C and 100.4°C, respectively, which indicates that the two metal compounds of the quaternary alloy of Example 2 begin to melt at 61.5°C and 100.4°C, respectively.

[0046] [Table 6]

[0047] Example 3 (semi-solid alloy interface heat dissipation composition of the present invention, quinary alloy)

[0048] Referring to Table 7 below, Example 3 contains 10 at% silver, 5 at% bismuth, 50 at% indium, 10 at% nickel, and 25 at% tin.

[0049] [Table 7]

[0050] Table 8 below shows the content of the liquid phase obtained by melting, which is analyzed by PANDAT software simulation. Referring to Table 8 and the DSC analysis results in FIG. 8 (arrows indicate the heat dissipation direction), Table 8 shows that the liquid phase content at 60°C accounts for 18.9% of the total moles of the quinary alloy, and the liquid phase content at 100°C accounts for 47.2% of the total moles of the quinary alloy. The arrows in FIG. 8 indicate the heat dissipation direction, and since an endothermic reaction occurs when the solid phase becomes liquid, the melting start temperature is determined by observing the endothermic direction opposite to the arrow indicating the heat dissipation direction. Referring to the lower wave in FIG. 8, there are two peak values, which are about 61.5°C and 100.6°C, and the melting start temperatures are about 61.6°C and 90.9°C, respectively, indicating that the two metal compounds of the quinary alloy of Example 3 began to melt at 61.6°C and 90.9°C, respectively.

[0051] [Table 8]

[0052] Example 4 (semi-solid alloy interface heat dissipation composition of the present invention, hexa-component alloy)

[0053] Referring to the following Table 9 (Example 4) and Table 10 (Comparative Example 2), Example 4 contains 10 at% silver, 5 at% bismuth, 5 at% copper, 70 at% indium, 5 at% nickel, and 5 at% tin, and Comparative Example 2 contains the same elements as Example 4, but the contents of these elements are all outside the element content range of the semi-solid alloy interface heat dissipation composition (hexary alloy) of the present invention, and are 20 at% silver, 15 at% bismuth, 15 at% copper, 20 at% indium, 15 at% nickel, and 15 at% tin, respectively.

[0054] [Table 9]

[0055] [Table 10]

[0056] Table 11 (Example 4) and Table 12 (Comparative Example 2) below show the contents of the liquid phase obtained by melting, which were analyzed by PANDAT software simulation. Referring to Table 11 and Table 12 and the DSC analysis results in Figure 9 (Example 4) and Figure 10 (Comparative Example 2) (arrows indicate the heat dissipation direction), Table 11 shows that the liquid phase content at 70°C accounts for 16% of the total moles of the hex alloy, and the liquid phase content at 120°C accounts for 38.7% of the total moles of the hex alloy. The arrow in Figure 9 indicates the heat dissipation direction, and since an endothermic reaction occurs when the solid phase becomes liquid, the melting start temperature is determined by observing the endothermic direction opposite to the arrow indicating the heat dissipation direction. Referring to the lower wave in Fig. 9, there are three peak values, which are about 73.3°C, 99.4°C and 107.8°C, and the melting start temperatures are about 72.1°C and 98.3°C, respectively, indicating that the metal compounds in the hexagonal alloy of Example 4 start to melt at 72.1°C and 98.3°C, respectively. Fig. 10 does not show any peaks, indicating that the alloy of Comparative Example 2 does not experience the melting phenomenon.

[0057] [Table 11]

[0058] [Table 12]

[0059] As described above, when the temperature of the semi-solid alloy interface heat dissipation composition of the present invention rises with the use of electronic components and exceeds 40°C, it starts to melt and partly becomes liquid, automatically filling the unevenness of the interface of the electronic components. And within the operating temperature limit of the electronic components (about 130°C), the liquid phase ratio of the semi-solid alloy interface heat dissipation composition is less than 70%, and it does not flow arbitrarily large inside the electronic components, and it combines the advantages of both solid metal and liquid metal, and achieves technical effects such as easy installation, high conductivity, and low interface thermal resistance.

[0060] The present invention has been disclosed by preferred embodiments, but they are not intended to limit the present invention. Those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, so the protection scope of the present invention should be defined by the appended claims. [Explanation of symbols]

[0061] 1 Semi-solid alloy interfacial heat dissipation composition 11 Solid 12 liquid 2. Heat dissipation device 3. Electronic Components

Claims

1. The atomic percentage of the alloy is 0.1 at% to 10 at% bismuth, 20 at% to 30 at% indium, and 65 at% to 75 at% tin, where the total atomic percentage is 100. Semi-solid alloy interfacial heat dissipation composition.

2. The atomic percentage of the alloy is 0.1 at% to 15 at% bismuth, 5 at% to 30 at% indium, 20 at% to 40 at% nickel, and 40 at% to 60 at% tin, where the total atomic percentage is 100. Semi-solid alloy interfacial heat dissipation composition.

3. The atomic percentages of the silver, bismuth, and tin are 0.1 at% to 20 at%. The atomic percentages of the bismuth, bismuth, and indium are 0.1 at% to 3 ... Semi-solid alloy interfacial heat dissipation composition.

4. The atomic percentages of the silver, bismuth, copper, nickel, and tin are 5 at% to 15 at% relative to a total atomic percentage of 100, 0.1 at% to 10 at% relative to bismuth, 0.1 at% to 10 at% relative to copper, 65 at% to 75 at% relative to indium, 0.1 at% to 10 at% relative to nickel, and 0.1 at% to 10 at% relative to tin. Semi-solid alloy interfacial heat dissipation composition.

5. The use of the semi-solid alloy interface heat dissipation composition according to any one of claims 1 to 4 for dissipating heat of electronic components, wherein the semi-solid alloy interface heat dissipation composition is provided between a heat dissipation device and the electronic components, and is a solid at room temperature, and the liquid content at a temperature of 40°C to 130°C accounts for 0.1% to 70% of the total mole number of the semi-solid alloy interface heat dissipation composition. Use of a semi-solid alloy interface heat dissipation composition for dissipating heat from an electronic component.

6. The heat dissipation device is a heat sink. Use of the semi-solid alloy interface heat dissipation composition according to claim 5 for dissipating heat from electronic components.

Images