Processing method

Abstract

To provide a processing method capable of suppressing a processing defect caused by influences of an end of a substrate.SOLUTION: A processing method is a method for performing byte cutting on a substrate using a byte cutting device comprising a holding table, a byte cutting unit including a byte wheel, a processing feeding unit, and a processing position change unit. The method includes: a holding step 1001 of holding the substrate on the holding table; a first positioning step 1002 of positioning an outer edge of a byte tool inside of one end side of the substrate in an X direction by a predetermined amount; a first processing step 1003 of performing the byte cutting on the substrate; a second positioning step 1004 of positioning the outer edge of the byte tool inside of the other end side of the substrate in the X direction by a predetermined amount; and a second processing step 1005 of performing the byte cutting on the substrate.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present invention relates to a processing method. [Background technology]

[0002] In recent years, substrates on which devices are manufactured are becoming larger in size in order to improve production efficiency. For example, there is a large substrate on which multiple semiconductor chips having bumps on the surface are mounted and sealed with resin. In order to turn and cut the surface of such a large substrate, a byte cutting device has been proposed that can move the byte wheel in the X direction perpendicular to the Y direction, which is the processing feed direction (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2016-40063 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, some prototype-stage substrates have steps or protrusions on their edges, and some are so large that the holding table cannot suction-hold them all the way to the edges, causing the edges to flap easily during cutting. When cutting such substrates, the cutting tool may be damaged when it cuts into the edge of the substrate, or the resin may be dragged from the edge, causing processing defects. Since it is necessary to confirm the machinability of the substrate in the device area at the prototype stage, a cutting method that is not affected by the edges of the substrate was required.

[0005] An object of the present invention is to provide a processing method capable of suppressing processing defects caused by the influence of the edge of a substrate. [Means for solving the problem]

[0006] In order to solve the above-mentioned problems and achieve the object, the processing method of the present invention is a processing method for cutting a substrate using a processing apparatus including at least a holding table for holding a substrate, processing means having a processing tool for processing the substrate held on the holding table, Y-direction movement means for relatively moving the holding table and the processing means in a Y direction which is a processing feed direction, and X-direction movement means for relatively moving the holding table and the processing means in an X direction perpendicular to the Y direction, and is characterized by comprising: a holding step for holding the substrate with the holding table; a first positioning step for positioning an outer edge of the processing tool a predetermined amount inward from one end side of the substrate in the X direction after the holding step; a first processing step for processing the substrate after the first positioning step; a second positioning step for positioning the outer edge of the processing tool a predetermined amount inward from the other end side of the substrate in the X direction after the first processing step; and a second processing step for processing the substrate after the second positioning step. Effect of the Invention

[0007] The present invention has an effect of suppressing processing defects caused by the influence of the edge of the substrate. [Brief description of the drawings]

[0008] [Figure 1] FIG. 1 is a cross-sectional view of a main part of a substrate to be processed by the processing method according to the first embodiment. [Diagram 2] FIG. 2 is a perspective view that illustrates a configuration example of a tool cutting device that performs the processing method according to the first embodiment. [Diagram 3] FIG. 3 is a flowchart showing the flow of the processing method according to the first embodiment. [Figure 4] FIG. 4 is a plan view that illustrates a first positioning step of the processing method illustrated in FIG. [Diagram 5] FIG. 5 is a plan view that illustrates a second positioning step of the processing method illustrated in FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] The form (embodiment) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiment. Furthermore, the components described below include those that a person skilled in the art can easily imagine and those that are substantially the same. Furthermore, the configurations described below can be appropriately combined. Furthermore, various omissions, substitutions, or modifications of the configurations can be made without departing from the gist of the present invention.

[0010] [Embodiment 1] A processing method according to a first embodiment of the present invention will be described with reference to the drawings. Fig. 1 is a cross-sectional view of a main part of a substrate to be processed by the processing method according to the first embodiment. Fig. 2 is a perspective view showing a schematic configuration example of a tool cutting device for carrying out the processing method according to the first embodiment.

[0011] (substrate) The processing method according to the first embodiment is a method of cutting (corresponding to processing) the sealing resin 4 of the substrate 1 shown in Fig. 1 with a cutting tool. As shown in Fig. 1, the substrate 1 to be processed by the processing method according to the first embodiment includes a rectangular base substrate 2, a plurality of chips 3 mounted on the base substrate 2, and sealing resin 4 sealing the chips 3, and has a rectangular planar shape. In the first embodiment, the width 11 (shown in Fig. 2) of the substrate 1 is, for example, 515 mm, and the length 12 of the substrate 1 is, for example, 510 mm.

[0012] Moreover, the substrate 1 is formed to have a uniform thickness. In the first embodiment, the chips 3 are arranged on the surface of the substrate 1 at equal intervals in two directions perpendicular to each other. In the first embodiment, each chip 3 has a plurality of bumps 5 (protruding electrodes). The sealing resin 4 is layered on the surface of the base substrate 2 to seal the chips 3. In the embodiment, the sealing resin 4 is layered on the entire surface of the base substrate 2.

[0013] The substrate 1 is divided into individual chips 3 by, for example, cutting the spaces between the chips 3 after at least a part of the surface of the sealing resin 4 has been cut with a cutting tool and planarized by a processing method.

[0014] (Cutting tool) The processing method according to the first embodiment is performed by a byte cutting device 100 (corresponding to a processing device) shown in Fig. 2. The byte cutting device 100 shown in Fig. 2 is a processing device that performs byte cutting (also referred to as turning cutting) on ​​at least a part of the surface of the sealing resin 4 of the substrate 1 to flatten at least a part of the surface of the sealing resin 4 of the substrate 1. As shown in Fig. 2, the byte cutting device 100 at least includes an apparatus base 101, a holding table 110, a byte cutting unit 120, a processing feed unit 130, a processing position changing unit 140, a cutting feed unit 150, and a control unit 160.

[0015] The holding table 110 holds the base substrate 2 of the substrate 1 on a holding surface 111. In the first embodiment, the holding table 110 has an upper surface, that is, the holding surface 111, which is formed flat along the horizontal direction, and the holding surface 111 is formed in a rectangular shape, and the base substrate 2 of the substrate 1 is placed on the holding surface 111. In the first embodiment, the size of the holding surface 111 of the holding table 110 is equal to the size of the substrate 1.

[0016] The holding table 110 has a holding surface 111 connected to a vacuum suction source (not shown). The holding surface 111 of the holding table 110 is sucked by the suction source, thereby suction-holding the substrate 1 placed on the holding surface 111. The holding table 110 is provided so as to be movable in the Y direction parallel to the horizontal direction by the processing feed unit 130. In the first embodiment, the Y direction is parallel to the longitudinal direction of the apparatus base 101.

[0017] The bit cutting unit 120 is a processing means for cutting the substrate 1 held on the holding table 110 with a bit wheel 121 attached to the lower end of a spindle (not shown). The bit cutting unit 120 is supported by a gate-shaped support frame 102 standing upright on the device base 101 via a cutting feed unit 150 and a processing position changing unit 140.

[0018] The bite cutting unit 120 has a spindle (not shown), a motor 124 that rotates the spindle about its axis, and a bite wheel 121 attached to the lower end of the spindle. The axis of the spindle is parallel to the Z direction that is parallel to the vertical direction. The bite wheel 121 is attached to the lower end of the spindle. When the spindle is rotated about its axis by the motor 124, the bite wheel 121 rotates about the axis that is parallel to the Z direction.

[0019] The bite wheel 121 cuts at least a part of the surface of the sealing resin 4 of the substrate 1 held by the holding table 110. The bite wheel 121 includes a wheel base 122 formed in an annular shape and attached to the lower end of a spindle, and a bite tool 123 (corresponding to a processing tool) provided on the lower surface of the wheel base 122 facing the holding surface 111. The bite tool 123 is formed in a columnar shape and provided on the outer edge of the lower surface of the wheel base 122, and by rotating the bite wheel 121 around its axis, it cuts into the surface of the sealing resin 4 of the substrate 1 and cuts at least a part of the surface of the sealing resin 4.

[0020] In the first embodiment, the diameter of the wheel base 122 of the bite wheel 121 is smaller than the width 11 of the substrate 1 .

[0021] The processing feed unit 130 is a Y-direction moving means that is installed on the device base 101 and relatively moves the holding table 110 and the byte cutting unit 120 in the Y direction, which is a processing feed direction parallel to the holding surface 111. The processing feed unit 130 moves the holding table 110 in the Y direction, thereby moving the holding table 110 between a carry-in / out position where the substrate 1 is carried in and out of the holding table 110 away from the byte cutting unit 120 and a processing position located below the byte cutting unit 120 where the byte cutting is performed by the byte cutting unit 120. The processing feed unit 130 is a moving unit that moves the holding table 110 between the carry-in / out position and the processing position.

[0022] The machining position changing unit 140 is an X-direction moving means that is installed on the support frame 102 and relatively moves the holding table 110 and the bit cutting unit 120 in the X direction that is parallel to the horizontal direction and perpendicular to the Y direction. The machining position changing unit 140 moves the moving frame 103 in the X direction, thereby moving the bit cutting unit 120 in the X direction.

[0023] The notch feed unit 150 is installed on the moving frame 103, and moves the bit cutting unit 120 in the Z direction, which is the notch feed direction perpendicular to the holding surface 111. The notch feed unit 150 moves the second moving frame 104, which supports the bit cutting unit 120, in the Z direction, thereby moving the bit cutting unit 120 in the Z direction.

[0024] The cutting feed unit 150 lowers the bite cutting unit 120 to bring the bite tool 123 of the bite wheel 121 closer to the substrate 1 held on the holding table 110 at the processing position, and raises the bite cutting unit 120 to move the bite tool 123 of the bite wheel 121 away from the substrate 1 held on the holding table 110 at the processing position.

[0025] The processing feed unit 130, the processing position change unit 140 and the cutting feed unit 150 are each equipped with a well-known ball screw that is rotatable about its axis, a well-known pulse motor and holding table 110 that rotate the ball screw about its axis, and well-known guide rails that support the moving frames 103, 104 so that they can move freely in the Y direction, X direction or Z direction.

[0026] The control unit 160 controls each of the above-mentioned components constituting the bit cutting device 100. In other words, the control unit 160 causes the bit cutting device 100 to execute a processing operation on the substrate 1. The control unit 160 is a computer that has an arithmetic processing device having a microprocessor such as a CPU (central processing unit), a storage device having a memory such as a ROM (read only memory) or a RAM (random access memory), and an input / output interface device, and is capable of executing a computer program.

[0027] The arithmetic processing device of the control unit 160 executes a computer program stored in the ROM on the RAM to generate control signals for controlling the bit cutting device 100. The arithmetic processing device of the control unit 160 outputs the generated control signals to each component of the bit cutting device 100 via the input / output interface device.

[0028] The control unit 160 is also connected to a display unit (not shown) configured with a liquid crystal display device or the like for displaying the status and images of the machining operation, and an input unit (not shown) used by the operator to register machining conditions. In the first embodiment, the input unit includes a touch panel provided on the display unit.

[0029] (Processing method) The processing method according to the first embodiment is a method of cutting at least a part of the sealing resin 4 of the substrate 1 with the above-mentioned cutting device 100. The processing method according to the first embodiment is also the processing operation of the above-mentioned cutting device 100. Fig. 3 is a flowchart showing the flow of the processing method according to the first embodiment.

[0030] The processing method according to the first embodiment includes a holding step 1001, a first positioning step 1002, a first processing step 1003, a second positioning step 1004, and a second processing step 1005, as shown in FIG.

[0031] (holding step) The holding step 1001 is a step of holding the substrate 1 on the holding table 110. In the byte cutting device 100 having the above-described configuration, the base substrate 2 of the substrate 1 before the byte cutting is placed on the holding surface 111 of the holding table 110 positioned at the carry-in / out position by an operator or the like, and the control unit 160 receives the processing conditions input by the operator or the like, and then receives an instruction to start the processing operation input by the operator, and then the control unit 160 starts the processing operation, i.e., the holding step 1001 of the processing method according to the first embodiment.

[0032] In the first embodiment, in the holding step 1001, the tool cutting device 100 drives the motor 124 to start rotating the spindle and tool wheel 121 around their axes. Also, in the first embodiment, in the holding step 1001, the tool cutting device 100 sucks and holds the base substrate 2 side of the substrate 1 on the holding surface 111 of the holding table 110 by a vacuum suction source. Note that, in the first embodiment, in the holding step 1001, the substrate 1 is sucked and held on the holding table 110 with the width 11 of the substrate 1 parallel to the X direction and the length 12 of the substrate 1 parallel to the Y direction.

[0033] (First positioning step) Fig. 4 is a plan view showing a schematic diagram of a first positioning step of the processing method shown in Fig. 3. The first positioning step 1002 is a step of positioning an outer edge 123-1 of a bite tool 123 of a bite wheel 121 on a predetermined amount 201 inside one end side of the substrate 1 in the X direction after the holding step 1001.

[0034] In the first embodiment, in the first positioning step 1002, the control unit 160 of the bit cutting device 100 controls the processing position changing unit 140 to position the bit cutting unit 120 at a position where the distance between the outer edge 41 of the sealing resin 4 of the substrate 1 held on the holding table 110 and the outer edge 123-1 of the bit tool 123 at the closest position to the one end side of the substrate 1 in the X direction is a predetermined amount 201, as shown in Fig. 4. Note that the predetermined amount 201 is a distance that exceeds zero and is less than the distance at which the outer edge 123-1 of the bit tool 123 at the closest position to the one end side of the substrate 1 in the X direction overlaps with the outer edge 31 of the chip 3 at the closest end side of the substrate 1 held on the holding table 110 in the Z direction.

[0035] (First processing step) The first processing step 1003 is a step of cutting the substrate 1 with a bite after the first positioning step 1002. In the first embodiment, in the first processing step 1003, the control unit 160 of the bite cutting device 100 controls the incision feed unit 150 to position the lower end of the bite tool 123 of the bite wheel 121 at a desired height from the holding surface 111. Note that the desired height is preferably a height at which the bite tool 123 cuts the sealing resin 4 of the substrate 1 with a bite.

[0036] In the first embodiment, in the first processing step 1003, the control unit 160 of the bit cutting device 100 controls the processing feed unit 130 to move the holding table 110, which holds the substrate 1 by suction, in the Y direction toward the processing position. In the first processing step 1003, the control unit 160 of the bit cutting device 100 cuts the bit tool 123 into the sealing resin 4 of the substrate 1 held on the holding table 110 at the processing position while supplying processing fluid to the bit wheel 121, etc., to perform bit cutting.

[0037] In embodiment 1, in the first processing step 1003, when the substrate 1 held by the holding table 110 passes below the bite wheel 121, the control unit 160 of the bite cutting device 100 controls the cutting feed unit 150 to raise the bite cutting unit 120, and controls the processing feed unit 130 to move the holding table 110 to the loading / unloading position.

[0038] (Second positioning step) Fig. 5 is a plan view showing a schematic diagram of a second positioning step of the processing method shown in Fig. 3. The second positioning step 1004 is a step of positioning the outer edge 123-1 of the bite tool 123 of the bite wheel 121 on the inside by a predetermined amount 202 from the other end side of the substrate 1 in the X direction after the first processing step 1003.

[0039] In the first embodiment, in the second positioning step 1004, the control unit 160 of the cutting tool 100 controls the machining position change unit 140 to position the cutting tool 120 at a position where the distance between the outer edge 42 of the sealing resin 4 of the substrate 1 held on the holding table 110 in the X direction and the outer edge 123-1 of the cutting tool 123 when positioned closest to the other end of the substrate 1 in the X direction is a predetermined amount 202, as shown in FIG. 5. The predetermined amount 202 is a distance that exceeds zero and is less than the distance where the outer edge 123-1 of the cutting tool 123 when positioned closest to the other end of the substrate 1 in the X direction overlaps with the outer edge 32 of the chip 3 closest to the other end of the substrate 1 held on the holding table 110 in the Z direction. In the first embodiment, the predetermined amount 202 may be equal to or different from the predetermined amount 201 in the first positioning step 1002.

[0040] (Second processing step) The second processing step 1005 is a step of cutting the substrate 1 with a bite after the second positioning step 1004. In the first embodiment, in the first processing step 1003, the control unit 160 of the bite cutting device 100 controls the cutting feed unit 150 to position the lower end of the bite tool 123 of the bite wheel 121 at a desired height from the holding surface 111.

[0041] In the first embodiment, in the second processing step 1005, the control unit 160 of the bit cutting device 100 controls the processing feed unit 130 to move the holding table 110, which holds the substrate 1 by suction, in the Y direction toward the processing position. In the first embodiment, in the second processing step 1005, the control unit 160 causes the bit cutting device 100 to cut the bit tool 123 into the sealing resin 4 of the substrate 1 held on the holding table 110 at the processing position while supplying processing fluid to the bit wheel 121, etc., to perform bit cutting.

[0042] In the first embodiment, in the second processing step 1005, when the substrate 1 held by the holding table 110 passes below the bite wheel 121, the control unit 160 controls the cutting feed unit 150 to raise the bite cutting unit 120, and controls the processing feed unit 130 to move the holding table 110 to the carry-in / out position. In the first embodiment, in the second processing step 1005, the bite cutting device 100 stops the suction holding of the substrate 1 on the holding table 110, and ends the processing method.

[0043] As described above, in the processing method according to the first embodiment, in the positioning steps 1002 and 1004, the bite cutting unit 120 is positioned at a position where the outer edge 123-1 of the bite tool 123 is separated from the outer edges 41 and 42 of both ends in the X direction of the sealing resin 4 of the substrate 1 held on the holding table 110 by predetermined distances 201 and 202. Therefore, in the processing steps 1003 and 1005, the sealing resin 4 is bit-cut while leaving uncut areas at both ends in the X direction of the sealing resin 4 where the bite cutting has not been performed.

[0044] For this reason, the processing method of embodiment 1 can prevent the need to cut with a bit even if there are steps or protrusions on the outer edge of the sealing resin 4 of the substrate 1, and can prevent the substrate 1 from flapping on the holding surface 111 because the outer edge of the sealing resin 4 of the substrate 1 is not cut with a bit in processing steps 1003 and 1005 even if the outer edge of the substrate 1 is not held by suction to the holding surface 111.

[0045] As a result, the processing method according to the first embodiment has the effect of suppressing processing defects caused by the influence of the edge of the substrate 1.

[0046] The present invention is not limited to the above embodiment. In other words, various modifications can be made without departing from the gist of the present invention. In the present invention, a central processing step for cutting the central portion in the X direction of the substrate 1 held by suction on the holding table 110 may be performed at least once between the first processing step 1003 and the second processing step 1005.

[0047] Also, in the present invention, if the difference between the diameter of the wheel base 122 of the bite wheel 121 and the width 11 of the substrate 1 is small and the bite tool 123 can be simultaneously positioned at a position that achieves the above-mentioned predetermined amounts 201, 202, the first positioning step 1002 and the second positioning step 1004 may be performed simultaneously, and the first processing step 1003 and the second processing step 1005 may be performed simultaneously. That is, in the present invention, the first processing step 1003 and the second processing step 1005 may be performed simultaneously in one bite cutting.

[0048] Furthermore, in the present invention, the substrate 1 to be processed does not need to be laminated over the entire surface of the base substrate 2 as long as the sealing resin 4 seals the chip 3 .

[0049] In the present invention, the processing method may be such that a grinding device (corresponding to a processing device) equipped with a grinding unit as processing means performs so-called creep feed grinding (corresponding to processing) on ​​the substrate 1. In this case, the grinding stone of the grinding wheel of the grinding unit corresponds to the processing tool. [Explanation of symbols]

[0050] 1 Board 100 Bit cutting device (processing device) 110 Holding table 120 Bit cutting unit (processing means) 123 Bit tools (machining tools) 123-1 Outer edge 130 Processing feed unit (Y direction movement means) 140 Processing position change unit (X-direction movement means) 201,202 Predetermined amount 1001 Retention Step 1002 First positioning step 1003 First processing step 1004 Second positioning step 1005 Second processing step Y Machining feed direction

Claims

[Claim 1] A processing method for cutting a substrate using a processing device including at least a holding table for holding a substrate, processing means having a processing tool for processing the substrate held on the holding table, Y-direction movement means for relatively moving the holding table and the processing means in a Y direction which is a processing feed direction, and X-direction movement means for relatively moving the holding table and the processing means in an X direction perpendicular to the Y direction, comprising: a holding step of holding the substrate on the holding table; a first positioning step of positioning an outer edge of the processing tool a predetermined amount inward from one end side of the substrate in the X direction after the holding step; a first processing step of processing the substrate after the first positioning step; a second positioning step of positioning an outer edge of the processing tool a predetermined amount inward from another end side of the substrate in the X direction after the first processing step; a second processing step of processing the substrate after the second positioning step; A processing method comprising:

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