Substrate processing apparatus and substrate processing method

Abstract

To appropriately adjust the horizontality of a rotary holder configured to be rotatable and hold a plurality of substrates in a substrate processing apparatus.SOLUTION: A substrate processing apparatus includes a rotating holding unit that holds multiple substrates and is configured to be freely rotatable, a plurality of measuring units that measure the height of an object to be measured, and a control unit, the plurality of measuring units include a measuring unit that measures the height of the rotating holding unit, and the control unit adjusts the horizontality of the rotating holding unit on the basis of the height of the rotating holding unit measured by the measuring unit.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present disclosure relates to a substrate processing apparatus and a substrate processing method. [Background technology]

[0002] Patent Document 1 discloses a substrate processing apparatus including a mounting unit on which a substrate is mounted, a processing unit for processing the substrate, and a transfer robot for transferring the substrate from the mounting unit to the processing unit. In the substrate processing apparatus, the position of the hand of the transfer robot in the mounting unit is adjusted. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2020-68257 A Summary of the Invention [Problem to be solved by the invention]

[0004] The technique disclosed herein appropriately adjusts the horizontality of a rotary holder configured to rotatably hold a plurality of substrates in a substrate processing apparatus. [Means for solving the problem]

[0005] A substrate processing apparatus according to one embodiment of the present disclosure has a rotating holding unit configured to hold a plurality of substrates and be freely rotatable, a plurality of measuring units that measure the height of an object to be measured, and a control unit, wherein the plurality of measuring units includes a measuring unit that measures the height of the rotating holding unit, and the control unit adjusts the horizontality of the rotating holding unit based on the height of the rotating holding unit measured by the measuring unit. Effect of the Invention

[0006] According to the present disclosure, it is possible to appropriately adjust the horizontality of a rotational holder configured to rotatably hold a plurality of substrates in a substrate processing apparatus. [Brief description of the drawings]

[0007] [Figure 1] 1 is a plan view showing an outline of a configuration of a wafer processing apparatus according to an embodiment of the present invention. [Diagram 2] FIG. 2 is a plan view showing a configuration of a placement module. [Diagram 3] FIG. 2 is a side view showing a configuration of a placement module. [Figure 4] FIG. 13 is an explanatory view showing how a wafer is transferred between a rotary table and a first pick. [Diagram 5] FIG. 13 is an explanatory view showing how a wafer is transferred between a rotary table and a first pick. [Figure 6] FIG. 13 is an explanatory view showing how a wafer is transferred between the rotary table and a second pick. [Figure 7] FIG. 13 is an explanatory view showing how a wafer is transferred between the rotary table and a second pick. [Figure 8] FIG. 1 is a flow chart showing main steps of a method for adjusting the levelness of a rotary table and the height of a pick. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] In a manufacturing process of a semiconductor device, various processes are performed on a semiconductor wafer (hereinafter, sometimes referred to as a "wafer") using, for example, a wafer processing apparatus.

[0009] The wafer processing apparatus has, for example, a rotating holder configured to hold a plurality of wafers and to be freely rotatable. The rotating holder is provided in various modules. Furthermore, the wafer is transferred between the rotating holder and the transport robot. In such a wafer processing apparatus, in order to properly transfer the wafer between the rotating holder and the transport robot, adjustments have been conventionally made on the transport robot side. However, for example, when the transport robot is configured to be able to transport a plurality of wafers simultaneously, it is difficult for the transport robot to adjust a transport error due to, for example, a horizontal misalignment of the rotating holder.

[0010] Furthermore, when assembling the wafer processing equipment at the operation site and making adjustments for operation, or when the wafer processing equipment stops due to unexpected trouble or a power outage, teaching and adjustment of the horizontality of the rotating holder have traditionally been performed manually by an operator. This work involves opening and closing the module by the operator, which is time-consuming and raises the risk of contamination inside the module in which the rotating holder is installed.

[0011] Here, in the substrate processing apparatus (wafer processing apparatus) disclosed in Patent Document 1, the position of the hand of the transport robot in the placement unit is adjusted as described above. Specifically, the substrate processing apparatus includes a placement unit, a processing unit, a transport robot, and a control unit. The placement unit includes a substrate support unit that supports the substrate in a horizontal state, and a measurement unit that measures an edge position, which is the horizontal position of the periphery of the substrate supported by the substrate support unit. The transport robot includes a hand that receives the substrate supported by the substrate support unit of the placement unit and carries it into the processing unit. The control unit determines the center position of the substrate based on the edge position measured by the measurement unit, and adjusts the position of the hand in the placement unit based on the center position of the substrate. This aims to improve the positional accuracy of the substrate carried into the processing unit.

[0012] However, the wafer processing apparatus disclosed in Patent Document 1 does not include the above-mentioned spin holder, and naturally does not take into consideration adjustment of the horizontality of the spin holder.

[0013] The technology disclosed herein has been made in consideration of the above circumstances, and appropriately adjusts the horizontality of a rotating holder configured to hold multiple substrates and be freely rotatable in a substrate processing apparatus. Hereinafter, a wafer processing apparatus as a substrate processing apparatus and a wafer processing method as a substrate processing method according to the present embodiment will be described with reference to the drawings. In this specification and the drawings, elements having substantially the same functional configurations are denoted by the same reference numerals, and duplicated descriptions will be omitted.

[0014] <Wafer processing equipment> First, a description will be given of the configuration of a wafer processing apparatus according to this embodiment. Fig. 1 is a plan view showing an outline of the configuration of a wafer processing apparatus 1. In the wafer processing apparatus 1, a desired process is performed on a wafer W as a substrate under a reduced pressure atmosphere.

[0015] 1, the wafer processing apparatus 1 has a configuration in which a loading / unloading station 10 and a processing station 11 are integrally connected via two mounting modules 20a and 20b. The loading / unloading station 10 transports and processes the wafer W under a normal pressure atmosphere (e.g., air atmosphere). The processing station 11 transports and processes the wafer W under a reduced pressure atmosphere (e.g., vacuum atmosphere).

[0016] The placement modules 20a and 20b function as load lock modules. The placement module 20a temporarily places and holds the wafer W transferred from a loader module 30 (described later) in the carry-in / out station 10, in order to deliver the wafer W to a transfer module 50 (described later) in the processing station 11. The placement module 20b temporarily places and holds the wafer W transferred from the transfer module 50, in order to deliver the wafer W to the loader module 30.

[0017] The placement modules 20a and 20b are connected to the loader module 30 and the transfer module 50 via a gate (not shown) provided with a gate valve (not shown). The gate valve ensures airtightness between the placement modules 20a and 20b and the loader module 30 and the transfer module 50, and also ensures communication between them. The placement modules 20a and 20b are configured so that their interiors can be switched between a normal pressure atmosphere and a reduced pressure atmosphere. The specific configuration of the placement modules 20a and 20b will be described later.

[0018] The loading / unloading station 10 has a loader module 30 equipped with a first transfer robot 40 described below, and a load port 31 on which a carrier C capable of accommodating a plurality of wafers W under normal pressure is placed.

[0019] The loader module 30 has, for example, a rectangular housing, and the inside of the housing is maintained at normal pressure. A plurality of, for example, four load ports 31 are arranged side by side on one side constituting the long side of the housing of the loader module 30. Two placement modules 20a and 20b are arranged side by side on the other side constituting the long side of the housing of the loader module 30, via a gate (not shown) provided with a gate valve (not shown).

[0020] A first transfer robot 40 for transferring a wafer W is provided inside the loader module 30. The first transfer robot 40 has a multi-joint first transfer arm 41. The first transfer arm 41 has a first pick 42 at its tip as a first transfer unit for holding one wafer W. The first transfer arm 41 is configured to be able to move the first pick 42 in the vertical and horizontal directions. The first transfer robot 40 transfers the wafer W between the carrier C of the load port 31 and the placement modules 20a and 20b.

[0021] The processing station 11 includes a transfer module 50 for carrying a plurality of, for example, four, wafers W, and a plurality of, for example, four processing modules 51.

[0022] The transfer module 50 has, for example, a rectangular housing, and the inside of the housing is maintained at a reduced pressure atmosphere. Four processing modules 51 are connected to the transfer module 50 via gates (not shown) provided with gate valves (not shown). In addition, two placement modules 20a and 20b are connected to the transfer module 50 via gates (not shown) provided with gate valves (not shown).

[0023] A second transfer robot 60 for transferring the wafer W is provided inside the transfer module 50. The second transfer robot 60 has a multi-joint second transfer arm 61. The second transfer arm 61 has a pair of second picks 62a, 62b as a second transfer unit at its tip. The second picks 62a, 62b each have the same configuration and each hold two wafers W. That is, the second transfer arm 61 holds a total of four wafers W. The second transfer arm 61 is also configured to be able to move the second picks 62a, 62b in the vertical and horizontal directions. The second transfer robot 60 transfers the wafer W between the placement modules 20a, 20b and the four processing modules 51.

[0024] The processing module 51 mounts, for example, four wafers W arranged horizontally and performs a desired process on the four wafers W under a reduced pressure atmosphere. The number of wafers W processed in the processing module 51 is not limited, and may be one to three, or five or more. Examples of the process under a reduced pressure atmosphere include an etching process, a plasma process such as a film formation process or a diffusion process, a chemical oxide removal process, and a heat treatment.

[0025] The above-described wafer processing apparatus 1 is provided with a control unit 70. The control unit 70 is, for example, a computer equipped with a CPU, a memory, and the like, and has a program storage unit (not shown). The program storage unit stores a program for controlling the processing of the wafer W in the wafer processing apparatus 1. The program storage unit also stores a program for controlling the operation of the drive systems such as the above-described various modules and the transport robot to realize the wafer processing in the wafer processing apparatus 1, which will be described later. The above-described program may be recorded in a computer-readable storage medium H and installed from the storage medium H to the control unit 70. The above-described storage medium H may be temporary or non-temporary.

[0026] In the wafer processing apparatus 1 configured as above, first, the wafer W is transferred from the carrier C to the placement module 20a by the first transfer robot 40 under normal pressure. At this time, four wafers W are transferred in sequence to the placement module 20a.

[0027] Next, the four wafers W are transferred by the second transfer robot 60 from the placement module 20a to the processing module 51 under a reduced pressure atmosphere, and a desired process is performed. Next, the four wafers W are transferred by the second transfer robot 60 to the placement module 20b.

[0028] Next, the wafers W are transferred from the placement module 20b to the carrier C by the first transfer robot 40 under normal pressure. At this time, four wafers W are sequentially transferred to the carrier C. In this manner, a series of wafer processing steps in the wafer processing apparatus 1 is completed.

[0029] <Placement module> Next, the placement modules 20a and 20b will be described. The placement modules 20a and 20b have the same configuration, and will be collectively referred to as placement module 20 in the following description. Fig. 2 is a plan view showing the configuration of the placement module 20. Fig. 3 is a side view showing the configuration of the placement module 20.

[0030] 2 and 3, the mounting module 20 has a chamber 100 that accommodates four wafers W. The chamber 100 has a chamber body 101 and a lid 102. The upper part of the chamber body 101 is open, and this opening is closed by the lid 102. The lid 102 is configured to be freely attached and detached to the chamber body 101. The upper surface of the side wall of the chamber body 101 and the lower surface of the lid 102 are sealed by a sealant (not shown), ensuring airtightness inside the chamber 100.

[0031] An air supply section (not shown) for supplying gas and an exhaust section (not shown) for discharging gas are connected to the chamber 100, and the interior is configured to be switchable between atmospheric pressure and reduced pressure atmosphere by the air supply section and the exhaust section. That is, the placement module 20 is configured to appropriately transfer the wafer W between the loader module 30 of the normal pressure atmosphere and the transfer module 50 of the reduced pressure atmosphere.

[0032] A turntable 110 is provided inside the chamber 100 as a rotating holder that holds four wafers W simultaneously. The turntable 110 has four storage sections 111 that are integrally formed. The four storage sections 111 are disposed at equal intervals around the circumference of the turntable 110, that is, disposed at 90 degree intervals from the center 110c of the turntable 110. Each storage section 111 is configured in a substantially 3 / 4 annular shape with a diameter larger than the wafer W, and stores the wafer W so as to surround it inside. Each storage section 111 is disposed so that the opening of the annular shape faces radially outward.

[0033] Each accommodation section 111 is provided with, for example, three holding sections 112 that protrude inward and hold the outer periphery of the wafer W. The accommodation section 111 can horizontally hold the wafer W on the holding sections 112. With this configuration, the turntable 110 can hold four wafers W horizontally and at equal intervals in the circumferential direction.

[0034] A rotation mechanism 120 that rotates the turntable 110 about a center 110c as a central axis is provided below the turntable 110. The rotation mechanism 120 rotates the turntable 110 and the wafer W held on the turntable 110 together.

[0035] Further, below the turntable 110, a horizontal adjustment mechanism 130 for adjusting the horizontality (inclination) of the turntable 110 is provided. The horizontal adjustment mechanism 130 has a plurality of, for example, four, drive units 131. The four drive units 131 are arranged at equal intervals in the circumferential direction of the turntable 110. Each drive unit 131 is configured to be freely expandable and contractible, and raises and lowers the turntable 110. For the drive unit 131, for example, a stepping motor or a piezoelectric actuator is used. In this case, the horizontal direction of the turntable 110 can be adjusted by raising and lowering the turntable 110 with the four drive units 131. Note that the configuration of the horizontal adjustment mechanism 130 is not limited to this, and it is sufficient if the horizontality of the turntable 110 can be adjusted.

[0036] In addition, a plurality of lift pins (not shown) are provided below the turntable 110. The lift pins transfer the wafer W between the first pick 42 of the first transfer robot 40 or the second picks 62a, 62b of the second transfer robot 60 when the four accommodation units 111 are disposed at predetermined positions.

[0037] 4 and 5 are explanatory diagrams showing how the wafer W is transferred between the turntable 110 and the first pick 42 of the first transfer robot 40. The wafer W is transferred in a state where the turntable 110 is positioned so that the four accommodation sections 111 are arranged in the X-axis direction and the Y-axis direction.

[0038] The first pick 42 of the first transfer robot 40 moves in the positive Y-axis direction as a first direction relative to the chamber 100, and delivers one wafer W between it and one of the accommodation units 111 (the accommodation unit 111 on the X-axis positive direction and Y-axis negative direction side in the illustrated example) of the turntable 110. Hereinafter, the positional relationship between the first pick 42 and the turntable 110 shown in FIG. 4 is referred to as a first delivery position.

[0039] When a wafer W is loaded into the loading module 20a, the wafer W held by the first pick 42 is transferred to the lift pins, which are then lowered to hold the wafer W in the accommodation unit 111. When a wafer W is loaded out of the loading module 20b, the wafer W held in the accommodation unit 111 is transferred to the lift pins, which are then raised to be held by the first pick 42.

[0040] When four wafers W are transferred from the first transfer robot 40 to the turntable 110, one wafer W is transferred from the first pick 42 to one of the accommodation units 111, and then the turntable 110 is rotated by 90 degrees. This transfer of one wafer W and the 90 degree rotation of the turntable 110 are repeated until four wafers W are transferred from the first transfer robot 40 to the turntable 110.

[0041] 6 and 7 are explanatory views showing how the wafer W is transferred between the turntable 110 and the second picks 62a, 62b of the second transfer robot 60. The wafer W is transferred in a state where the turntable 110 is positioned so that the four accommodation sections 111 are arranged in the X-axis direction and the Y-axis direction.

[0042] The second picks 62a, 62b of the second transfer robot 60 move in the negative Y-axis direction as a second direction relative to the chamber 100, and transfer four wafers W between the chamber 100 and the four accommodation units 111 of the turntable 110. Two wafers W are held on the second pick 62a, and the two wafers W on the second pick 62a are disposed at positions corresponding to the two accommodation units 111. Similarly, two wafers W are held on the second pick 62b, and the two wafers W on the second pick 62b are disposed at positions corresponding to the two accommodation units 111. Hereinafter, the positional relationship between the second picks 62a, 62b and the turntable 110 shown in FIG. 6 is referred to as a second transfer position.

[0043] When wafers W are loaded into loading module 20a, the four wafers W held by second picks 62a and 62b are transferred to the lift pins, which are then lowered to hold the wafers W in each of the four accommodation units 111. When wafers W are loaded out of loading module 20b, the four wafers W held in the four accommodation units 111 are transferred to the lift pins, which are then raised to hold the wafers W on second picks 62a and 62b.

[0044] As shown in FIGS. 2 to 7, a plurality of, for example, seven, sensors 140a to 140g are provided inside the chamber 100. Each of the sensors 140a to 140g is a sensor capable of measuring the height of a measurement object, for example, a laser displacement sensor (laser displacement meter) which is an optical displacement sensor. In this embodiment, the measurement objects are the turntable 110, the first pick 42 of the first transfer robot 40, the second picks 62a and 62b of the second transfer robot 60, the wafer W held by the first pick 42, and the wafer W held by the second picks 62a and 62b, as described below. Note that each of the sensors 140a to 140g is not limited to a laser displacement sensor, and may be any sensor capable of measuring the height of the measurement object.

[0045] The first sensor 140a and the second sensor 140b are each provided on the bottom surface of the chamber body 101 below the turntable 110. The first sensor 140a and the second sensor 140b each irradiate laser light upward and receive the light reflected by the object to be measured, thereby measuring the height of the object to be measured.

[0046] 2 and 3, the first sensor 140a and the second sensor 140b are arranged in a radial direction along the X-axis in point symmetry with respect to the center 110c. The first sensor 140a is arranged on the positive side of the X-axis, and the second sensor 140b is arranged on the negative side of the X-axis. The first sensor 140a and the second sensor 140b each measure the height of the bottom surface of the rotary table 110.

[0047] 6 and 7, the first sensor 140a is disposed below the second pick 62b when the second pick 62a enters the chamber 100. The second sensor 140b is disposed below the second pick 62b when the second pick 62b enters the chamber 100. Then, in a state in which the turntable 110 is rotated so that the turntable 110 is not positioned above the first sensor 140a and the second sensor 140b, the first sensor 140a measures the height of the bottom surface of the second pick 62a, and the second sensor 140b measures the height of the bottom surface of the second pick 62b.

[0048] The third sensor 140c, the fourth sensor 140d, the fifth sensor 140e, the sixth sensor 140f and the seventh sensor 140g are provided on the lower surface of the lid body 102 above the turntable 110, respectively.

[0049] 2 and 3, the third sensor 140c and the fourth sensor 140d are arranged point-symmetrically about the center 110c in the radial direction oblique to the X-axis and Y-axis. The third sensor 140c is arranged on the X-axis positive side and the Y-axis positive side, and the fourth sensor 140d is arranged on the X-axis negative side and the Y-axis negative side. Then, in a state where the turntable 110 is rotated so that the turntable 110 is located below the third sensor 140c and the fourth sensor 140d, the third sensor 140c and the fourth sensor 140d each measure the height of the upper surface of the turntable 110.

[0050] 6 and 7, the third sensor 140c is disposed above the wafer W held by the second pick 62a when the second pick 62a enters the chamber 100. The fourth sensor 140d is disposed above the wafer W held by the second pick 62b when the second pick 62b enters the chamber 100. The third sensor 140c measures the height of the top surface of the wafer W held by the second pick 62a, and the fourth sensor 140d measures the height of the top surface of the wafer W held by the second pick 62b.

[0051] In addition, the third sensor 140c measures the height of the top surface of the wafer W held in the accommodation portion 111 of the turntable 110, and the fourth sensor 140d measures the height of the top surface of the wafer W held in the accommodation portion 111 of the turntable 110.

[0052] 2 and 3, the fifth sensor 140e and the sixth sensor 140f are arranged line-symmetrically with the third sensor 140c and the fourth sensor 140d, and are arranged point-symmetrically with respect to the center 110c in the radial direction oblique to the X-axis and the Y-axis. The fifth sensor 140e is arranged on the negative X-axis and positive Y-axis side, and the sixth sensor 140f is arranged on the positive X-axis and negative Y-axis side. Then, in a state where the turntable 110 is rotated so that the turntable 110 is located below the fifth sensor 140e and the sixth sensor 140f, the fifth sensor 140e and the sixth sensor 140f each measure the height of the upper surface of the turntable 110.

[0053] 6 and 7, the fifth sensor 140e is disposed above the wafer W held by the second pick 62b when the second pick 62b enters the chamber 100. The sixth sensor 140f is disposed above the wafer W held by the second pick 62a when the second pick 62a enters the chamber 100. The fifth sensor 140e measures the height of the top surface of the wafer W held by the second pick 62b, and the sixth sensor 140f measures the height of the top surface of the wafer W held by the second pick 62a.

[0054] In addition, the fifth sensor 140e measures the height of the top surface of the wafer W held in the accommodation portion 111 of the turntable 110, and the sixth sensor 140f measures the height of the top surface of the wafer W held in the accommodation portion 111 of the turntable 110.

[0055] 4 and 5, the seventh sensor 140g is disposed above the first pick 42 when the first pick 42 enters the chamber 100. The seventh sensor 140g measures the height of the top surface of the first pick 42. The seventh sensor 140g also measures the height of the top surface of the wafer W held by the first pick 42.

[0056] <Adjustment of the rotating table and pick> When the wafer processing apparatus 1 is assembled at the operation site and adjustment work for operation is performed, the horizontal adjustment mechanism 130 is taught so that the turntable 110 is at a desired horizontality, and the transfer arms 41 and 61 are taught so that the picks 42, 62a, and 62b are at a desired height. When the wafer processing apparatus 1 is stopped due to an unexpected trouble or a power outage, the horizontality of the turntable 110 is adjusted, and the heights of the picks 42, 62a, and 62b are adjusted. Furthermore, the heights of the wafers W held on the turntable 110 and the heights of the wafers W held on the picks 42, 62a, and 62b are also adjusted. In the following description, the horizontality adjustment of the turntable 110 and the height adjustment of the picks 42, 62a, and 62b include both the initial setting teaching and the adjustment during use. FIG. 8 is a flow diagram showing the main steps of a method for adjusting the horizontality of the turntable 110 and the heights of the picks 42, 62a, and 62b.

[0057] (Level adjustment of the rotary table 110) First, the first sensor 140a and the second sensor 140b measure the lower surface height at two points on the turntable 110 (step S1 in FIG. 8). The measurement results by the first sensor 140a and the second sensor 140b are output to the control unit 70. In step S1, the upper surface height at two points on the turntable 110 may be measured by the third sensor 140c and the fourth sensor 140d, or the upper surface height at two points on the turntable 110 may be measured by the fifth sensor 140e and the sixth sensor 140f. Alternatively, the height of the turntable 110 may be measured by all the sensors 140a to 140f.

[0058] The control unit 70 calculates the horizontality of the turntable 110 based on the measured lower surface height of the turntable 110 (step S2 in FIG. 8). Furthermore, the control unit 70 adjusts the horizontality based on the calculated horizontality of the turntable 110 so that the turntable 110 is positioned horizontally (step S3 in FIG. 8). Specifically, the control unit 70 controls the horizontal adjustment mechanism 130 so that the turntable 110 is positioned horizontally.

[0059] The adjustment of the horizontality in step S3 may be performed based on the measured lower surface height of the turntable 110. For example, the horizontal adjustment mechanism 130 may be controlled so that the lower surface height falls within a predetermined range at two points on the turntable 110 to be measured. In such a case, step S2 is omitted.

[0060] Furthermore, if it is difficult to adjust the level of the turntable 110 using only the level adjustment mechanism 130, for example, the cover 102 may be removed to open the inside of the chamber 100, and an operator may manually adjust the level of the turntable 110. In this case, it is preferable to adjust the level of the turntable 110 while measuring the height of the turntable 110 using the first sensor 140a and the second sensor 140b. For this reason, it is preferable to use the first sensor 140a and the second sensor 140b provided below the turntable 110 as the sensors for measuring the height of the turntable 110.

[0061] (First pick 42 height adjustment) Next, the first pick 42 of the first transfer robot 40 is advanced into the chamber 100 in the positive direction of the X-axis, and the first pick 42 is placed at the first delivery position shown in FIG 4 (step S4 in FIG 8). Then, the seventh sensor 140g measures the height of the top surface of the first pick 42 (step S5 in FIG 8). The measurement result by the seventh sensor 140g is output to the control unit 70.

[0062] The control unit 70 adjusts the height of the first pick 42 based on the measured height of the upper surface of the first pick 42 (step S6 in FIG. 8). Specifically, the control unit 70 controls the first transfer arm 41 of the first transfer robot 40 so that the first pick 42 is placed at a desired height.

[0063] (Height adjustment of second picks 62a and 62b) Next, the second picks 62a, 62b of the second transfer robot 60 are advanced into the chamber 100 in the negative direction of the X-axis, and the second picks 62a, 62b are disposed at the second delivery position shown in FIG. 6 (step S7 in FIG. 8). In addition, the turntable 110 is rotated so that the turntable 110 is not positioned above the first sensor 140a and the second sensor 140b. Next, the first sensor 140a measures the lower surface height of the second pick 62a, and the second sensor 140b measures the lower surface height of the second pick 62b (step S8 in FIG. 8). The measurement results by the first sensor 140a and the second sensor 140b are output to the control unit 70.

[0064] The control unit 70 adjusts the heights of the second picks 62a, 62b based on the measured lower surface heights of the second picks 62a, 62b (step S9 in FIG. 8). Specifically, the control unit 70 controls the second transfer arm 61 of the second transfer robot 60 so that the second picks 62a, 62b are positioned at a desired height.

[0065] The order of the height adjustment of the first pick 42 in steps S4 to S6 and the height adjustment of the second picks 62a, 62b in steps S7 to S9 is not limited. The height adjustment of the first pick 42 may be performed after the height adjustment of the second picks 62a, 62b.

[0066] Furthermore, when the target height of the first pick 42 and the target height of the second picks 62a, 62b are different, the height adjustment of the first pick 42 in steps S4 to S6 and the height adjustment of the second picks 62a, 62b in steps S7 to S9 may be performed in parallel, which can shorten the time required for the adjustment work.

[0067] (Height adjustment of the wafer W on the first pick 42) Next, the first pick 42, which has received and held the wafer W from the carrier C, is advanced into the chamber 100 in the positive direction of the X-axis, and the first pick 42 and the wafer W are disposed at the first delivery position shown in Fig. 4 (step S10 in Fig. 8). Then, the seventh sensor 140g measures the height of the top surface of the wafer W on the first pick 42 (step S11 in Fig. 8). The measurement result by the seventh sensor 140g is output to the control unit 70.

[0068] The control unit 70 adjusts the height of the wafer W based on the measured height of the top surface of the wafer W on the first pick 42 (step S12 in FIG. 8). Specifically, the control unit 70 controls the first transfer arm 41 of the first transfer robot 40 so that the wafer W on the first pick 42 is placed at a desired height. In this case, even if the wafer W is deformed, for example, the height of the wafer W can be appropriately adjusted.

[0069] (Height adjustment of wafer W on rotating table 110) Next, one wafer W is transferred from the first pick 42 to the accommodation portion 111 of the turntable 110, and then the turntable 110 is rotated by 90 degrees. This transfer of the one wafer W and the 90 degree rotation of the turntable 110 are repeated until the turntable 110 holds four wafers W (step S13 in FIG. 8). Next, the sensors 140c to 140f measure the heights of the top surfaces of the four wafers W on the turntable 110 (step S14 in FIG. 8). The measurement results by the sensors 140c to 140f are output to the control unit 70.

[0070] The control unit 70 adjusts the heights of the four wafers W on the turntable 110 based on the measured heights of the upper surfaces of the four wafers W on the turntable 110 (step S15 in FIG. 8). Specifically, the control unit 70 controls the horizontal adjustment mechanism 130 so that the four wafers W on the turntable 110 are horizontal and positioned at a desired height.

[0071] (Height adjustment of the wafer W on the second picks 62a and 62b) Next, the second picks 62a, 62b of the second transfer robot 60 are advanced into the chamber 100 in the negative direction of the X-axis, and the second picks 62a, 62b are disposed at the second transfer position shown in FIG. 6. After that, the four wafers W are transferred from the rotary table 110 to the second picks 62a, 62b, and the second picks 62a, 62b and the four wafers W are disposed at the second transfer position (step S16 in FIG. 8). Next, the sensors 140c to 140f measure the upper surface heights of the four wafers W on the second picks 62a, 62b (step S17 in FIG. 8). The measurement results by the sensors 140c to 140f are output to the control unit 70.

[0072] The control unit 70 adjusts the heights of the four wafers W on the second picks 62a and 62b based on the measured heights of the upper surfaces of the four wafers W (step S18 in FIG. 8). Specifically, the control unit 70 controls the second transfer arm 61 of the second transfer robot 60 so that the four wafers W on the second picks 62a and 62b are positioned horizontally at a desired height.

[0073] As described above, steps S1 to S9 are performed to automatically adjust the horizontality of turntable 110 and automatically adjust the heights of picks 42, 62a, and 62b. Furthermore, steps S10 to S18 are performed to automatically adjust the heights of wafers W held on turntable 110 and the heights of wafers W held by picks 42, 62a, and 62b.

[0074] <Monitoring during normal operation> During normal operation of the wafer processing apparatus 1, the state of the turntable 110 is monitored, and the states of the picks 42, 62a, and 62b are monitored. Furthermore, the states of the wafers W held on the turntable 110 and the wafers W held by the picks 42, 62a, and 62b are monitored.

[0075] (Monitoring the rotary table 110) The control unit 70 constantly monitors the horizontality of the turntable 110 using the first sensor 140a and the second sensor 140b during normal operation of the wafer processing apparatus 1. The control unit 70 calculates the horizontality of the turntable 110 and monitors the state of the turntable 110.

[0076] When the control unit 70 detects an abnormal transition in the horizontality of the turntable 110, the control unit 70 may control the horizontal adjustment mechanism 130 to adjust the horizontality of the turntable 110. Alternatively, the turntable 110 may be replaced.

[0077] (First pick 42 watch) During normal operation of the wafer processing apparatus 1, the control unit 70 monitors the height of the top surface of the first pick 42 using the seventh sensor 140g when the first pick 42 is not holding a wafer W. The control unit 70 measures the height of the top surface of the first pick 42 to monitor the state of the first pick 42.

[0078] When the control unit 70 detects an abnormal transition in the height of the upper surface of the first pick 42, the control unit 70 may adjust the first transport arm 41 so as to adjust the height of the upper surface of the first pick 42. Alternatively, the first pick 42 may be replaced.

[0079] (Monitoring second picks 62a and 62b) During normal operation of the wafer processing apparatus 1, the control unit 70 monitors the lower surface height of the second picks 62a, 62b using the first sensor 140a and the second sensor 140b when the second picks 62a, 62b are not holding a wafer W. The control unit 70 measures the lower surface height of the second picks 62a, 62b to monitor the state of the second picks 62a, 62b.

[0080] When the control unit 70 detects an abnormal transition in the lower surface height of the second picks 62a, 62b, the second transfer arm 61 may be adjusted to adjust the lower surface height of the second picks 62a, 62b. Alternatively, the second picks 62a, 62b may be replaced.

[0081] During normal operation of the wafer processing apparatus 1, the wafer W is successively held by the first pick 42 of the first transport robot 40, the turntable 110 of the loading module 20a, the second picks 62a, 62b of the second transport robot 60, the processing module 51, and the turntable 110 of the loading module 20b.

[0082] (Monitoring the wafer W on the first pick 42) During normal operation of the wafer processing apparatus 1, the control unit 70 measures the height of the upper surface of the wafer W held by the first pick 42 using the seventh sensor 140g, and monitors the state of the wafer W.

[0083] When the control unit 70 detects an abnormal change in the height of the upper surface of the wafer W held by the first pick 42, the control unit 70 may control the first transfer arm 41 to adjust the height of the upper surface of the wafer W. Alternatively, the first pick 42 may be replaced.

[0084] The control unit 70 also detects the presence or absence of a wafer W on the first pick 42. For example, after the first pick 42 transfers the wafer W to the rotary table 110, the wafer W should not be held by the first pick 42, but the wafer W may remain on the first pick 42 due to a malfunction. The control unit 70 detects the presence or absence of such a wafer W. When an abnormality in the presence or absence of the wafer W is detected, the transport conditions for the wafer W are corrected.

[0085] (Monitoring the wafer W on the rotating table 110) During normal operation of the wafer processing apparatus 1, the control unit 70 measures the height of the upper surface of each of the four wafers W held on the turntable 110 using the sensors 140c to 140f, and monitors the state of the wafers W.

[0086] When the control unit 70 detects an abnormal change in the height of the upper surfaces of the four wafers W held on the turntable 110, the control unit 70 may control the horizontal adjustment mechanism 130 to adjust the height of the upper surfaces of the wafers W. Alternatively, the turntable 110 may be replaced.

[0087] (Monitoring the wafer W on the second picks 62a, 62b) During normal operation of the wafer processing apparatus 1, the control unit 70 measures the height of the upper surfaces of the four wafers W held by the second picks 62a and 62b using the sensors 140c to 140f, and monitors the states of the wafers W.

[0088] When the control unit 70 detects an abnormal change in the height of the upper surfaces of the four wafers W held by the second picks 62a and 62b, the control unit 70 may control the second transfer arm 61 to adjust the height of the upper surfaces of the wafers W. Alternatively, the second picks 62a and 62b may be replaced.

[0089] The control unit 70 also detects the presence or absence of a wafer W on the second picks 62a, 62b. For example, after the wafer W is transferred from the second picks 62a, 62b to the rotary table 110, the first pick 42 should not be holding the wafer W, but the wafer W may remain on the second picks 62a, 62b due to a malfunction. The control unit 70 detects the presence or absence of such a wafer W. When an abnormality in the presence or absence of the wafer W is detected, the transport conditions for the wafer W are corrected.

[0090] <Effects of this embodiment> Conventionally, the adjustment of the level of the turntable 110 has been performed manually by an operator as described above. This work requires the operator to open and close the chamber 100 (attach and detach the lid 102), and also requires the installation of a spirit level or a displacement sensor on the turntable 110 to measure the level of the turntable 110. Therefore, such manual work is time-consuming. In addition, since the opening and closing of the chamber 100 is required, there is a risk of contamination of the inside of the chamber 100.

[0091] In this regard, according to the present embodiment, the horizontality of the turntable 110 is automatically adjusted using the first sensor 140a and the second sensor 140b. This eliminates the need for the manual labor involved in the conventional method described above, shortens the work time, and improves work efficiency. It also makes it possible to avoid the risk of contamination inside the chamber 100. As a result, it becomes possible to adjust the horizontality of the turntable 110 efficiently and accurately.

[0092] Furthermore, when the interior of chamber 100 is configured to be switched between a normal pressure atmosphere and a reduced pressure atmosphere, it is necessary to reduce the volume of chamber 100, but since turntable 110 has a large planar area for holding four wafers W, it is preferable to reduce the height of chamber 100. Thus, by arranging sensors 140a-140g at optimal positions as in this embodiment, it is possible to realize a chamber 100 with such a small volume.

[0093] Furthermore, when applying the configuration of the turntable 110 and the sensors 140a to 140g of this embodiment, the temperature inside the chamber 100 is not particularly limited.

[0094] Furthermore, according to this embodiment, the height of the first pick 42 is automatically adjusted using the seventh sensor 140g, and the heights of the second picks 62a, 62b are automatically adjusted using the first sensor 140a and the second sensor 140b. Therefore, the heights of the picks 42, 62a, 62b can be adjusted efficiently and accurately.

[0095] Furthermore, according to this embodiment, the sensors 140a to 140g are used to adjust the height of the wafer W on the turntable 110 and the height of the wafer W on the picks 42, 62a, and 62b. Since the height of the wafer W is thus directly adjusted with high accuracy, the wafer can be appropriately processed.

[0096] Conventionally, abnormality detection and transition state understanding of the wafer processing apparatus 1 have not been performed automatically, and it has taken time to resolve sudden problems, resulting in long downtimes of the wafer processing apparatus 1.

[0097] In this regard, according to the present embodiment, during normal operation of the wafer processing apparatus 1, the states of the turntable 110, the picks 42, 62a, and 62b, the state of the wafer W held on the turntable 110, and the state of the wafer W held on the picks 42, 62a, and 62b are monitored. In this case, abnormalities can be accurately detected, and downtime of the wafer processing apparatus 1 can be reduced.

[0098] <Other embodiments> In the above embodiment, the placement module 20 is provided with seven sensors 140a to 140g, but the number and arrangement of these sensors are not limited. As described above, the sensors may be arranged at optimal positions according to the measurement target, such as adjusting and monitoring the level of the turntable 110, adjusting and monitoring the height of the picks 42, 62a, and 62b, adjusting and monitoring the height of the wafer W on the turntable 110, and adjusting and monitoring the height of the wafer W on the picks 42, 62a, and 62b. In addition, the sensors 140a to 140g are provided inside the chamber 100, but they may be provided outside the chamber 100. In this case, a transmission window (not shown) is provided in the chamber 100 in which the sensors 140a to 140g are provided, and the laser light from each of the sensors 140a to 140g is irradiated to the measurement target through the transmission window. The transmission window is made of a material that transmits laser light, such as polycarbonate or acrylic.

[0099] In the above embodiment, the wafer W is transferred and processed in the processing station 11 of the wafer processing apparatus 1 under a reduced pressure atmosphere, but the wafer W may be transferred and processed in the processing station 11 under a normal pressure atmosphere. In such a case, the interior of the loading modules 20a, 20b is maintained at an atmospheric atmosphere, and the wafer W is transferred between the loader module 30 and the transfer module 50. The configuration of the turntable 110 and the sensors 140a to 140g of the present disclosure can be applied to the loading modules 20a, 20b under such an atmospheric atmosphere, and the above-mentioned effects can be obtained.

[0100] In the above embodiment, the configuration of the turntable 110 and the sensors 140a-140g is applied to the mounting modules 20a and 20b, but may be applied to other modules. For example, when the processing module 51 has a turntable configured to be rotatable and hold a plurality of wafers W, the above-mentioned effects can be obtained by installing a sensor in the processing module 51.

[0101] In the above embodiment, the picks 42, 62a, 62b of the transport robots 40, 60 enter the placement modules 20a, 20b from two directions, but the number and the direction of entry of the transport robots are not limited to this. The configuration of the turntable 110 and the sensors 140a to 140g can be applied to the case where the pick of the transport robot enters from one direction or the case where the pick of the transport robot enters from three or more directions, and the above-mentioned effects can be obtained.

[0102] In the above embodiment, the turntable 110 holds four wafers W, but there is no limitation on the number of wafers W. The technology disclosed herein can be applied to the turntable 110 that holds two or more wafers W.

[0103] The embodiments disclosed herein should be considered to be illustrative and not restrictive in all respects. The above-described embodiments may be omitted, substituted, or modified in various forms without departing from the scope and spirit of the appended claims. For example, the components of the above-described embodiments may be arbitrarily combined. From such an arbitrary combination, the actions and effects of each of the components in the combination can be obtained as a matter of course, and other actions and effects that are obvious to a person skilled in the art from the description of this specification can be obtained.

[0104] In addition, the effects described in this specification are merely explanatory or exemplary and are not limiting. In other words, the technology according to the present disclosure may achieve other effects that are apparent to a person skilled in the art from the description of this specification in addition to or in place of the above effects.

[0105] Note that the following configuration examples also fall within the technical scope of the present disclosure. (1) a rotating holder configured to hold a plurality of substrates and to be rotatable; A plurality of measuring units for measuring the height of a measurement object; A control unit, the plurality of measuring units includes a measuring unit that measures a height of the rotation holder, The control unit adjusts the horizontality of the spin holder based on the height of the spin holder measured by the measurement unit. (2) The plurality of measurement units include A measuring unit disposed above the rotating holder; The substrate processing apparatus according to (1), further comprising: a measuring unit disposed below the spin holder. (3) A horizontal adjustment mechanism for adjusting the horizontality of the rotation holding unit is provided, The substrate processing apparatus according to (1) or (2), wherein the control unit controls the horizontal adjustment mechanism so that the spin holder is positioned horizontally based on the height of the spin holder measured by the measurement unit. (4) the plurality of measuring units includes a measuring unit that measures a height of the substrate held by the spin holder, The substrate processing apparatus according to any one of (1) to (3), wherein the control unit adjusts a height of the substrate held by the rotating holding unit based on a height of the substrate measured by the measurement unit. (5) the measuring unit measures a height of the spin holder during normal operation of the substrate processing apparatus; The substrate processing apparatus according to any one of (1) to (4), wherein the control unit monitors a state of the spin holder based on a height of the spin holder during normal operation measured by the measurement unit. (6) the plurality of measuring units includes a measuring unit that measures a height of the substrate held by the spin holder during normal operation of the substrate processing apparatus, The substrate processing apparatus according to any one of (1) to (5), wherein the control unit monitors a state of the substrate based on a height of the substrate held by the rotating holding unit during the normal operation measured by the measurement unit. (7) A transport unit for transporting the substrate between the rotating holder and the substrate transport unit, The plurality of measuring units includes a measuring unit that measures a height of the transport unit, The substrate processing apparatus according to any one of (1) to (6), wherein the control unit adjusts a height of the transport unit based on the height of the transport unit measured by the measurement unit. (8) Having a plurality of the conveying units, the first conveying unit is configured to be movable relative to the rotating holding unit from a first direction; the second conveying unit is configured to be movable relative to the rotating holding unit in a second direction different from the first direction; The plurality of measurement units include A measuring unit that measures the height of the first transport unit; A measuring unit that measures the height of the second transport unit, The control unit is adjusting a height of the first transport unit based on the height of the first transport unit measured by the measurement unit; The substrate processing apparatus according to (7), further comprising: adjusting a height of the second transport part based on the height of the second transport part measured by the measuring part. (9) The plurality of measurement units includes a measurement unit that measures a height of the substrate held by the transport unit, The substrate processing apparatus according to (7) or (8), wherein the control unit adjusts a height of the substrate held in the transport unit based on a height of the substrate measured by the measurement unit. (10) The measuring unit measures a height of the transport unit during normal operation of the substrate processing apparatus, The substrate processing apparatus according to any one of (7) to (9), wherein the control unit monitors a state of the transport unit based on a height of the transport unit during the normal operation measured by the measurement unit. (11) The plurality of measuring units includes a measuring unit that measures a height of the substrate held by the transport unit during normal operation of the substrate processing apparatus, The substrate processing apparatus according to any one of (7) to (10), wherein the control unit monitors a state of the substrate based on a height of the substrate held in the transport unit during normal operation measured by the measurement unit. (12) A rotary holder configured to hold a plurality of substrates and to be rotatable; A plurality of measuring units for measuring the height of a measurement object; A control unit, In the substrate processing apparatus, the plurality of measurement units include a measurement unit that measures a height of the spin holder, A substrate processing method comprising: adjusting a horizontality of the spin holder based on the height of the spin holder measured by the measuring unit. (13) The substrate processing apparatus includes a transport unit that transports the substrate between the spin holder and the substrate processing apparatus, The plurality of measuring units includes a measuring unit that measures a height of the transport unit, The substrate processing method according to (12), further comprising adjusting a height of the transport part based on the height of the transport part measured by the measuring part. [Explanation of symbols]

[0106] 1. Wafer Processing Equipment 70 Control section 110 Rotating Table 140a~140g sensor W wafer

Claims

1. A rotary holder configured to hold a plurality of substrates and to be rotatable; A plurality of measuring units for measuring the height of a measurement object; A control unit, the plurality of measuring units includes a measuring unit that measures a height of the rotation holder, The control unit adjusts the horizontality of the spin holder based on the height of the spin holder measured by the measurement unit.

2. The plurality of measurement units include A measuring unit disposed above the rotating holder; The substrate processing apparatus according to claim 1 , further comprising: a measuring unit disposed below the spin holder.

3. a horizontal adjustment mechanism for adjusting the horizontality of the rotation holding unit; The substrate processing apparatus according to claim 1 , wherein the control unit controls the horizontal adjustment mechanism based on the height of the spin holder measured by the measurement unit so that the spin holder is positioned horizontally.

4. the plurality of measuring units includes a measuring unit that measures a height of the substrate held by the spin holder, The substrate processing apparatus according to claim 1 , wherein the control unit adjusts a height of the substrate held by the spin holder based on a height of the substrate measured by the measurement unit.

5. The measuring unit measures a height of the spin holder during normal operation of the substrate processing apparatus, The substrate processing apparatus according to claim 1 , wherein the control unit monitors a state of the spin holder based on a height of the spin holder during the normal operation measured by the measurement unit.

6. the plurality of measuring units includes a measuring unit that measures a height of the substrate held by the spin holder during normal operation of the substrate processing apparatus, The substrate processing apparatus according to claim 1 , wherein the control unit monitors a state of the substrate based on a height of the substrate held by the spin holder during the normal operation measured by the measurement unit.

7. a transport unit that transports the substrate between the rotating holder and the substrate holder; The plurality of measuring units includes a measuring unit that measures a height of the transport unit, The substrate processing apparatus according to claim 1 , wherein the control unit adjusts a height of the transport unit based on a height of the transport unit measured by the measurement unit.

8. A plurality of the transport units are provided, the first conveying unit is configured to be movable relative to the rotating holding unit from a first direction; the second conveying unit is configured to be movable relative to the rotating holding unit in a second direction different from the first direction; The plurality of measurement units include A measuring unit that measures a height of the first transport unit; A measuring unit that measures a height of the second transport unit, The control unit is adjusting a height of the first transport unit based on the height of the first transport unit measured by the measurement unit; The substrate processing apparatus according to claim 7 , further comprising: a step of adjusting a height of the second transport part based on the height of the second transport part measured by the measuring part.

9. the plurality of measuring units includes a measuring unit that measures a height of the substrate held by the transport unit, The substrate processing apparatus according to claim 7 , wherein the control unit adjusts a height of the substrate held by the transport unit based on a height of the substrate measured by the measurement unit.

10. The measuring unit measures a height of the transport unit during normal operation of the substrate processing apparatus, The substrate processing apparatus according to claim 7 , wherein the control unit monitors a state of the transport unit based on a height of the transport unit during the normal operation measured by the measurement unit.

11. the plurality of measuring units includes a measuring unit that measures a height of the substrate held by the transport unit during normal operation of the substrate processing apparatus, The substrate processing apparatus according to claim 7 , wherein the control unit monitors a state of the substrate based on a height of the substrate held by the transport unit during the normal operation measured by the measurement unit.

12. A rotary holder configured to hold a plurality of substrates and to be rotatable; A plurality of measuring units for measuring the height of a measurement object; A control unit, In the substrate processing apparatus, the plurality of measurement units include a measurement unit that measures a height of the spin holder, A substrate processing method comprising: adjusting a horizontality of the spin holder based on the height of the spin holder measured by the measuring unit.

13. the substrate processing apparatus includes a transport unit configured to transport the substrate between the spin holder and the substrate processing apparatus; The plurality of measuring units includes a measuring unit that measures a height of the transport unit, The substrate processing method according to claim 12 , further comprising adjusting a height of the transport part based on the height of the transport part measured by the measuring part.

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