Reflection device and manufacturing method for reflection device

Abstract

To provide a reflection device for improving the responsiveness of a liquid crystal layer, and a manufacturing method for the reflection device.SOLUTION: A reflection device 100 includes a first electrode substrate 10 having a first surface 101, a second electrode substrate 20 having a second surface 201 opposite to the first surface 101, a wall part 42 projecting from the second surface 201 along a normal direction of the second surface 201, and a liquid crystal layer existing between the first surface 101 of the first electrode substrate 10 and the second surface 201 of the second electrode substrate 20. The first electrode substrate 10 includes a first electrode existing on the first surface 101. The second electrode substrate 20 includes a second electrode existing on the second surface 201. The wall part 42 includes a plurality of first x wall parts 45 extending in an x direction Dx, and a plurality of second y wall parts 46 extending in a y direction Dy that intersects with the x direction Dx. The first x wall part 45 includes a first x penetration hole 451 penetrating the first x wall part 45 in the y direction Dy. The second y wall part 46 includes a second y penetration hole 461 penetrating the second y wall part 46 in the x direction Dx.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] SUMMARY OF THE DISCLOSURE Embodiments of the present disclosure relate to a reflector device and a method for manufacturing a reflector device. [Background technology]

[0002] In wireless communication, a reflector that reflects radio waves is used. In recent years, development of a reflector that can change the reflection direction of radio waves to any direction has been progressing. In this application, such a reflector is also referred to as a reflection device. The reflection device includes a liquid crystal layer containing a liquid crystal material. When a bias voltage is applied to the liquid crystal layer, the molecular orientation in the liquid crystal layer changes. The reflection direction of the radio waves changes depending on the molecular orientation in the liquid crystal layer. The reflection direction of the radio waves is controlled by controlling the bias voltage applied to the liquid crystal layer.

[0003] In wireless communication, a phase shifter that modulates the phase of a signal by using a liquid crystal material is also known. Such a phase shifter is used, for example, in a phased array antenna. Patent Document 1 discloses a phase shifter that includes a microstrip line, a ground conductor layer, and a liquid crystal layer. Patent Document 1 also discloses a phased array antenna that includes the above phase shifter. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent Publication No. 2021-101511 Summary of the Invention [Problem to be solved by the invention]

[0005] The thickness of the liquid crystal layer for controlling radio waves is greater than the thickness of the liquid crystal layer used in displays, etc. The greater the thickness, the lower the responsiveness of the liquid crystal layer.

[0006] An object of the embodiments of the present disclosure is to provide a reflecting device and a method for manufacturing a reflecting device that can effectively solve such problems. [Means for solving the problem]

[0007] The embodiments of the present disclosure relate to the following [1] to

[17] . [1] A reflecting device comprising: a first electrode substrate including a first surface and a first back surface opposite the first surface; a second electrode substrate including a second surface facing the first surface and a second back surface opposite the second surface; a wall portion protruding from the second surface along a normal direction of the second surface; a liquid crystal layer located between the first surface of the first electrode substrate and the second surface of the second electrode substrate; the first electrode substrate includes a first electrode located on the first surface and a first substrate supporting the first electrode; the second electrode substrate includes a second electrode located on the second surface and a second substrate supporting the second electrode; The wall portion includes a plurality of first x-wall portions extending in an x-direction in a plan view and a plurality of second y-wall portions extending in a y-direction intersecting the x-direction in a plan view, In a plan view, a plurality of the 1x wall portions intersect with a plurality of the 2y wall portions, and one cell is defined by two of the 1x wall portions adjacent to each other in the y direction and two of the 2y wall portions adjacent to each other in the x direction, and the liquid crystal layer is located in a space in which a plurality of cells defined by the plurality of the 1x wall portions and the plurality of the 2y wall portions are configured, the 1x wall portion includes a 1x through hole penetrating the 1x wall portion in the y direction, The 2y-wall portion includes a 2y-through hole passing through the 2y-wall portion in the x-direction.

[0008] [2] In the reflection device according to [1], the 1x through hole may be provided at a position in the 1x wall portion that contacts the second surface of the second electrode substrate, The 2y through-hole may be provided in the 2y wall portion at a position in contact with the second surface of the second electrode substrate.

[0009] [3] In the reflection device according to [1], the first through hole may be provided in the first wall portion at a position in contact with the first surface of the first electrode substrate, The 2y through-hole may be provided in the 2y wall portion at a position in contact with the first surface of the first electrode substrate.

[0010] [4] In the reflection device according to [1], the 1x through hole may be provided at a position in the 1x wall portion away from the first surface of the first electrode substrate and the second surface of the second electrode substrate, The 2y through-hole may be provided in the 2y wall portion at a position away from the first surface of the first electrode substrate and the second surface of the second electrode substrate.

[0011] [5] In the reflection device according to [1], a plurality of the 1x through holes may be located in a region of the 1x wall portion that defines one of the cells, A plurality of the 2y through-holes may be located in a region of the 2y wall portion that defines one of the cells.

[0012] [6] In the reflection device described in [1], the plurality of cells of the cell structure may be connected via a plurality of the 1x through holes and a plurality of the 2y through holes.

[0013] [7] The reflector according to [2], The first x through holes arranged in the y direction may be positioned so as to be aligned in a straight line in the y direction, and / or The second y through holes aligned in the x direction may be positioned to line up on a straight line in the x direction.

[0014] [8] In the reflection device according to [2], the plurality of first x-through holes arranged in the y direction may be positioned so as not to be aligned in a straight line in the y direction, and / or The plurality of 2y through holes aligned in the x direction may be positioned so as not to line up on a straight line in the x direction.

[0015] [9] In the reflection device described in [1], the first x through hole may have a width in the x direction and the second y through hole may have a width in the y direction of 1.0 μm or more.

[0016]

[10] The reflector according to [1] may further include an alignment film located on a surface of the wall portion.

[0017]

[11] A method for manufacturing a reflection device comprising: a first electrode substrate, a second electrode substrate, and a liquid crystal layer disposed between the first electrode substrate and the second electrode substrate, the method comprising the steps of: forming a cell structure; and filling the cell structure with a liquid crystal material. The cell structure comprises: the second electrode substrate including a second surface and a second back surface opposite the second surface; a wall portion protruding from the second surface along a normal direction of the second surface, the second electrode substrate includes a second electrode located on the second surface and a second substrate supporting the second electrode; The wall portion includes a plurality of first x-wall portions extending in an x-direction in a plan view and a plurality of second y-wall portions extending in a y-direction intersecting the x-direction in a plan view, In a plan view, a plurality of the 1x wall portions intersect with a plurality of the 2y wall portions, and one cell is defined by two of the 1x wall portions adjacent to each other in the y direction and two of the 2y wall portions adjacent to each other in the x direction, the 1x wall portion includes a 1x through hole penetrating the 1x wall portion in the y direction, the 2y wall portion includes a 2y through hole penetrating the 2y wall portion in the x direction, A method for manufacturing a reflection device, wherein in the filling step, the liquid crystal material is filled into spaces constituting a plurality of cells of the cell structure partitioned by a plurality of the 1x wall portions and a plurality of the 2y wall portions.

[0018]

[12] In the method for manufacturing a reflection device according to

[11] , in the filling step, a lid portion may be disposed so as to cover the cell and face the second surface of the second electrode substrate of the cell structure via the wall portion; In the filling process, the liquid crystal material may be filled into spaces constituting multiple cells of the cell structure partitioned by the multiple 1x wall portions and the multiple 2y wall portions from the x direction or the y direction through the multiple 1x through holes and the multiple 2y through holes.

[0019]

[13] In the method for manufacturing a reflection device described in

[12] , the plurality of cells of the cell structure may be in communication with each other via the plurality of 1x through holes and the plurality of 2y through holes.

[0020]

[14] In the method for manufacturing a reflection device described in

[13] , the lid portion may be the first electrode substrate including the first front surface and a first back surface located opposite the first front surface.

[0021]

[15] In the manufacturing method of the reflection device described in

[11] , in the filling process, the liquid crystal material may be filled into spaces constituting multiple cells of the cell structure partitioned by multiple 1x wall portions and multiple 2y wall portions from a normal direction of the second surface of the second electrode substrate.

[0022]

[16] The method for manufacturing a reflector according to

[11] may further include a degassing step for removing any voids between the liquid crystal material filled in the cell structure and the wall portion.

[0023]

[17] The method for manufacturing a reflector according to

[11] may further include a step of forming an alignment film on a surface of the wall portion of the cell structure. Effect of the Invention

[0024] According to an embodiment of the present disclosure, the response of the liquid crystal layer can be improved. [Brief description of the drawings]

[0025] [Figure 1] FIG. 2 is a vertical cross-sectional view showing an example of a reflecting device. [Diagram 2] FIG. 2 is a perspective view showing an example of a wall structure. [Figure 3A] 1 is a longitudinal cross-sectional view showing an example of a cross section of a first x-wall portion of a wall structure along the x-direction. FIG. [Figure 3B] FIG. 11 is a longitudinal cross-sectional view showing an example of a cross section of a second y wall portion of the wall structure along the y direction. [Figure 4] FIG. 2 is a perspective view showing an example of a cell structure. [Diagram 5] 11A to 11C are diagrams showing an assembly step of assembling a first electrode substrate to a cell structure. [Figure 6] FIG. 11 is a top view showing an example of a configuration focusing on cells in a wall portion of a wall structure. [Figure 7A] FIG. 4 is a vertical cross-sectional view showing an example of a wall portion. [Figure 7B] FIG. 4 is a vertical cross-sectional view showing an example of a wall portion. [Figure 7C] FIG. 4 is a vertical cross-sectional view showing an example of a wall portion. [Figure 8] FIG. 4 is a diagram illustrating a method for measuring the dimensions of a wall portion. [Figure 9] FIG. 4 is a vertical cross-sectional view showing a step of forming a first resin layer. [Figure 10] FIG. 4 is a vertical cross-sectional view showing a step of exposing the first resin layer to light. [Figure 11] FIG. 4 is a vertical cross-sectional view showing the first resin layer after exposure. [Figure 12] FIG. 4 is a perspective view illustrating an example of a first resin layer after exposure. [Figure 13] FIG. 4 is a vertical cross-sectional view showing a step of laminating a second resin layer onto a first resin layer. [Figure 14] FIG. 4 is a vertical cross-sectional view showing a step of forming a second resin layer. [Figure 15]FIG. 2 is a vertical cross-sectional view showing an example of a manufactured cell structure. [Figure 16] 11A and 11B are cross-sectional views showing other examples of manufactured cell structures. [Figure 17] 5A to 5C are vertical cross-sectional views showing a step of forming an alignment film. [Figure 18] 5A to 5C are vertical cross-sectional views showing a step of filling a cell structure with a liquid crystal material. [Figure 19] 5A to 5C are vertical cross-sectional views showing a step of filling a cell structure with a liquid crystal material. [Figure 20] FIG. 11 is a perspective view showing an example of a wall structure according to a first modified example. [Figure 21A] 1 is a longitudinal cross-sectional view showing an example of a cross section of a first x-wall portion of a wall structure along the x-direction. FIG. [Figure 21B] FIG. 11 is a longitudinal cross-sectional view showing an example of a cross section of a second y wall portion of the wall structure along the y direction. [Figure 22] FIG. 11 is a perspective view showing an example of a wall structure according to a second modified example. [Figure 23A] 1 is a longitudinal cross-sectional view showing an example of a cross section of a first x-wall portion of a wall structure along the x-direction. FIG. [Figure 23B] FIG. 11 is a longitudinal cross-sectional view showing an example of a cross section of a second y wall portion of the wall structure along the y direction. [Figure 24] FIG. 4 is a perspective view that illustrates a process of bonding each resin layer. [Diagram 25] FIG. 13 is a perspective view showing an example of a wall structure according to a third modified example. [Figure 26A] 1 is a longitudinal cross-sectional view showing an example of a cross section of a first x-wall portion of a wall structure along the x-direction. FIG. [Figure 26B] FIG. 11 is a longitudinal cross-sectional view showing an example of a cross section of a second y wall portion of the wall structure along the y direction. [Figure 27] 13A to 13C are vertical cross-sectional views showing an example of a manufacturing process for a cell structure according to a fourth modified example. [Figure 28] 13A to 13C are vertical cross-sectional views showing an example of a manufacturing process for a cell structure according to a fourth modified example. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0026] In this specification and drawings, unless otherwise specified, terms that refer to a material that serves as the basis of a certain configuration, such as "substrate," "base material," "plate," "sheet," and "film," are not to be distinguished from one another solely on the basis of differences in name.

[0027] In this specification and drawings, unless otherwise specified, terms that specify shapes, geometric conditions, and the extent thereof, such as "parallel" and "orthogonal," and values ​​of lengths and angles, are not bound by strict meanings, but are interpreted to include a range within which similar functions may be expected.

[0028] In this specification and drawings, unless otherwise specified, when a certain configuration such as a certain member or a certain region is described as being "on" or "under", "upper" or "lower" or "above" or "below" another configuration such as another member or another region, this includes the case where the certain configuration is in direct contact with the other configuration. It also includes the case where another configuration is included between a certain configuration and the other configuration, that is, where the configuration is indirectly in contact. Furthermore, unless otherwise specified, the words "on", "upper side", "upper", or "lower", "lower side", and "lower" may be used in the up-down direction.

[0029] In this specification and drawings, unless otherwise specified, the same or similar parts or parts having similar functions are denoted by the same or similar symbols, and repeated explanations may be omitted. In addition, the dimensional ratios of the drawings may differ from the actual ratios for the convenience of explanation, and some components may be omitted from the drawings.

[0030] In this specification and drawings, unless otherwise specified, the present invention may be combined with other embodiments or modified versions as long as no contradictions arise. In addition, other embodiments may be combined with each other, or other embodiments and modified versions may be combined as long as no contradictions arise. In addition, modified versions may be combined as long as no contradictions arise.

[0031] In this specification and drawings, unless otherwise specified, when a plurality of steps are disclosed in a method such as a manufacturing method, other steps that are not disclosed may be performed between the disclosed steps. In addition, the order of the disclosed steps is arbitrary within the range that does not cause contradiction.

[0032] In this specification, when multiple upper limit candidates and multiple lower limit candidates are given for a certain parameter, the numerical range of the parameter may be formed by combining any one of the upper limit candidates and any one of the lower limit candidates. For example, consider a case where "parameter B is, for example, A1 or more, may be A2 or more, or may be A3 or more. Parameter B is, for example, A4 or less, may be A5 or less, or may be A6 or less." In this case, the numerical range of parameter B may be A1 or more and A4 or less, A1 or more and A5 or less, A1 or more and A6 or less, A2 or more and A4 or less, A2 or more and A5 or less, A2 or more and A6 or less, A3 or more and A4 or less, A3 or more and A5 or less, or A3 or more and A6 or less.

[0033] An embodiment of the present disclosure will be described in detail with reference to the drawings. Note that the embodiment described below is an example of the present disclosure, and the present disclosure is not to be interpreted as being limited to only these embodiments.

[0034] In recent years, high-frequency radio waves such as microwaves, millimeter waves, and submillimeter waves have begun to be used in various fields. Microwaves are radio waves with a frequency band of approximately 0.3 GHz to 30 GHz. Millimeter waves are radio waves with a frequency band of approximately 30 GHz to 300 GHz. Submillimeter waves are radio waves with a frequency band of approximately 300 GHz to 3 THz. Examples of fields in which they are used include 5th generation mobile communication systems, mobile and automotive communication systems, radar for collision prevention systems, and medical biosensing.

[0035] The higher the frequency of radio waves, the more directional the radio waves tend to travel. Therefore, the higher the frequency of radio waves, the more areas the radio waves from base stations cannot reach directly. One way to solve this problem would be to increase the number of base stations or relay stations. However, this would cause problems with installation costs and securing installation locations.

[0036] By using a reflector, it is possible to make the radio waves reflected by the reflector reach areas where radio waves from a base station cannot reach directly. In particular, a reflecting device equipped with a liquid crystal layer can control the direction in which the radio waves are reflected. By using a reflecting device, it is possible to flexibly change the area that the radio waves reach. Such a reflecting device is also called an IRS (Intelligent Reflecting Surface).

[0037] 1 is a vertical cross-sectional view showing an example of a reflection device 100. The reflection device 100 includes a first electrode substrate 10, a second electrode substrate 20, and a liquid crystal layer 30. Reference character E1 represents a radio wave that has reached the first electrode substrate 10. Reference character E2 represents a radio wave that has been reflected by the first electrode substrate 10.

[0038] The first electrode substrate 10 includes a first front surface 101 and a first back surface 102, a plurality of first electrodes 12 located on the first front surface 101, and a first substrate 11 supporting the plurality of first electrodes 12. The first back surface 102 is located on the opposite side to the first front surface 101. The first back surface 102 may be formed by the first substrate 11.

[0039] The second electrode substrate 20 includes a second front surface 201 and a second rear surface 202, a second electrode 22 located on the second front surface 201, and a second substrate 21 supporting the second electrode 22. The second front surface 201 faces the first front surface 101 of the first electrode substrate 10 in the z direction Dz. The z direction Dz is the thickness direction of the reflection device 100. The second rear surface 202 is located on the opposite side to the second front surface 201. The second rear surface 202 may be formed by the second substrate 21.

[0040] The liquid crystal layer 30 is located between the first surface 101 of the first electrode substrate 10 and the second surface 201 of the second electrode substrate 20. The first electrode 12 of the first electrode substrate 10 and the second electrode 22 of the second electrode substrate 20 face each other in the z direction Dz so as to sandwich the liquid crystal layer 30 therebetween. One second electrode 22 may face a plurality of first electrodes 12. The second electrode 22 may be a common electrode. A common voltage is applied to the common electrode, and the potential of the common electrode is fixed. The common voltage is, for example, 0V.

[0041] When the voltage applied to the first electrode 12 changes, the orientation of the liquid crystal material contained in the liquid crystal layer 30 changes. When the orientation of the liquid crystal material changes, the dielectric constant of the liquid crystal layer changes. As a result, the effective dielectric constant of the portion near the first electrode 12 changes.

[0042] The voltages of the multiple first electrodes 12 can be controlled independently. By controlling the voltages of the multiple first electrodes 12, the phase of the reflected radio waves E2 can be controlled according to the position in the surface direction of the first electrode substrate 10. By changing the phase of the radio waves E2 according to the position in the surface direction of the first electrode substrate 10, the radiation pattern of the radio waves E2 reflected by the reflecting device 100 can be controlled. This makes it possible to control the direction of the radio waves E2.

[0043] The first substrate 11 and the second substrate 21 are made of an insulating material. The first substrate 11 and the second substrate 21 may be transparent or opaque to visible light. The first substrate 11 and the second substrate 21 include, for example, glass or non-alkali glass. The first substrate 11 and the second substrate 21 may be flexible. For example, the first substrate 11 and the second substrate 21 may include a resin film. Examples of materials for the resin film include polyethylene terephthalate (PET), polycarbonate, fluororesin, liquid crystal polymer (LCP), polyimide (PI), and cycloolefin polymer (COP).

[0044] The first electrode 12 and the second electrode 22 are made of a material having electrical conductivity. The first electrode 12 and the second electrode 22 may contain a metal. The metal is, for example, copper, gold, silver, aluminum, titanium, nickel, chromium, or an alloy thereof. The first electrode 12 and the second electrode 22 may contain a conductive oxide. The conductive oxide is, for example, ITO (indium tin oxide), IZO (indium zinc oxide), or the like.

[0045] The liquid crystal layer 30 is disposed in a space partitioned by a wall portion 42 between the first electrode substrate 10 and the second electrode substrate 20. The liquid crystal layer 30 contains a liquid crystal material. The liquid crystal material is, for example, a nematic liquid crystal. The nematic liquid crystal is, for example, a cyano-based liquid crystal, a fluorine-based liquid crystal, a biphenyl-based liquid crystal, a terphenyl-based liquid crystal, a tolan-based liquid crystal, or the like. The liquid crystal material may be a liquid crystal having a positive dielectric anisotropy, so-called Np liquid crystal.

[0046] The thickness T1 of the liquid crystal layer 30 is, for example, 20 μm or more, and may be 50 μm or more, 80 μm or more, or 100 μm or more. By increasing the thickness T1 of the liquid crystal layer 30, the phase modulation function of the liquid crystal layer 30 can be improved. The thickness T1 of the liquid crystal layer 30 is, for example, 1000 μm or less, and may be 500 μm or less, or 300 μm or less.

[0047] The reflection device 100 may include an alignment film 90. The alignment film 90 has a regulating force for aligning the liquid crystal material of the liquid crystal layer 30 in a certain direction. The alignment film 90 may be located on the surface of the wall 42, for example, as shown in FIG. 1 . For example, the alignment film 90 may be located on the wall surface 41. For example, the alignment film 90 may be located on the surface of the wall 42 facing the first surface 101. The alignment film 90 may be in contact with the liquid crystal layer 30.

[0048] The alignment film 90 may be a polymer film that has been subjected to a rubbing treatment. The polymer film is, for example, a polyimide film. The alignment film 90 may be a photo-alignment film. The photo-alignment film is obtained by aligning the molecules of a polymer surface by irradiating ultraviolet light. The alignment film 90 may be an obliquely evaporated film. The obliquely evaporated film is, for example, SiO x The thickness T2 of the alignment film 90 is, for example, 0.02 μm or more, may be 0.05 μm or more, or may be 0.08 μm or more. The thickness T2 of the alignment film 90 is, for example, 1.00 μm or less, may be 0.50 μm or less, or may be 0.20 μm or less.

[0049] The larger the thickness T1 of the liquid crystal layer 30, the smaller the influence of the regulating force from the alignment film 90 on the liquid crystal layer 30. Therefore, the larger the thickness T1 of the liquid crystal layer 30, the slower the responsiveness of the alignment of the liquid crystal material. The decrease in responsiveness is particularly noticeable when the bias voltage to the liquid crystal layer 30 is stopped. This is because the speed at which the alignment of the liquid crystal material changes when the bias voltage is stopped depends on elastic relaxation. For example, a conventional reflecting device requires 1 to 30 seconds for the alignment to change when the bias voltage is stopped.

[0050] In consideration of this problem, in this embodiment, it is proposed that the reflection device 100 includes a wall structure 40 as shown in Fig. 1. The wall structure 40 is located between the first surface 101 of the first electrode substrate 10 and the second surface 201 of the second electrode substrate 20. The wall structure 40 divides the liquid crystal layer 30 in a planar view. The planar view means that an object is viewed along the normal direction of the first surface 101 of the first electrode substrate 10.

[0051] 1, the wall structure 40 includes a plurality of wall portions 42 aligned along the planar direction of the first surface 101. The wall portions 42 include wall surfaces 41 facing the liquid crystal material of the liquid crystal layer 30. The wall surfaces 41 generate an alignment control force, which makes it easier to determine the alignment direction of the liquid crystal material. Therefore, even if the thickness T1 of the liquid crystal layer 30 is large, the responsiveness of the liquid crystal layer 30 can be ensured.

[0052] FIG. 2 is a perspective view showing an example of the wall structure 40. FIG. 3A is a longitudinal sectional view showing an example of a cross section of the first x-wall portion 45 of the wall structure 40 along the x-direction Dx. FIG. 3B is a longitudinal sectional view showing an example of a cross section of the second y-wall portion 46 of the wall structure 40 along the y-direction Dy. As shown in FIG. 2, FIG. 3A, and FIG. 3B, the multiple wall portions 42 may include multiple x-wall portions 45 extending in the x-direction Dx and multiple y-wall portions 46 extending in the y-direction Dy so as to intersect with the multiple x-wall portions 45. The first x-wall portion 45 may include a first x-through hole 451 penetrating the first x-wall portion 45 in the y-direction Dy. The first x-through hole 451 may be provided in the first x-wall portion 45 at a position in contact with the first surface 101 of the first electrode substrate 10 shown in FIG. The second y-wall portion 46 may include a second y-through hole 461 penetrating the second y-wall portion 46 in the x-direction Dx. The 2y through-hole 461 may be provided in the 2y wall portion 46 at a position in contact with the first surface 101 of the first electrode substrate 10 shown in FIG.

[0053] Both the x-direction Dx and the y-direction Dy are parallel to the plane direction of the first surface 101. The y-direction Dy is a direction intersecting the x-direction Dx. The angle between the x-direction Dx and the y-direction Dy is, for example, 60° or more, may be 70° or more, or may be 80° or more. The angle between the x-direction Dx and the y-direction Dy is, for example, 120° or less, may be 110° or less, or may be 100° or less. The angle between the x-direction Dx and the y-direction Dy may be 90°. That is, the y-direction Dy may be a direction perpendicular to the x-direction Dx. The multiple x-wall portions 45 may be aligned in the y-direction Dy. The multiple y-wall portions 46 may be aligned in the x-direction Dx.

[0054] A plurality of spaces are partitioned by the wall portion 42 including a plurality of 1x walls 45 and a plurality of 2y walls 46. The spaces partitioned by the wall portion 42 are also referred to as cells 43. In a plan view, the plurality of 1x walls 45 and the plurality of 2y walls intersect, and one cell 43 is partitioned by two adjacent 1x walls 45 in the y direction Dy and two adjacent 2y walls 46 in the x direction Dx. The plurality of cells 43 are aligned in the x direction Dx and the y direction Dy. The liquid crystal material of the liquid crystal layer 30 is located in each of the plurality of cells 43. The liquid crystal layer 30 located in the cell 43 is also referred to as an individual liquid crystal layer. By partitioning the liquid crystal layer 30 into a plurality of individual liquid crystal layers by the wall structure 40, the response of the liquid crystal material is improved.

[0055] In the wall structure 40 shown in FIG. 2, the cells 43 communicate with each other through the 1x through holes 451 and the 2y through holes 461, as described below. This allows the liquid crystal material to move between two adjacent cells 43 through the 1x through holes 451 and the 2y through holes 41, making it possible to employ a method of filling the liquid crystal material using capillary action. In the wall structure 40 shown in FIG. 2, the liquid crystal material may be dripped from above onto the wall structure 40 to fill each cell 43 with the liquid crystal material. After each cell 43 is filled with the liquid crystal material in this manner, a degassing process is performed.

[0056] As described above, in the present embodiment, it is proposed to configure a wall structure 40 that is filled with liquid crystal material, is movable between two adjacent cells 43, and is located on the second electrode substrate 20. Note that the structure that includes the second electrode substrate 20 and the wall portion 42 located on the second electrode substrate 20 is also referred to as a cell structure.

[0057] The cell structure will now be described.

[0058] 4 is a perspective view showing an example of a cell structure K. The cell structure K includes a second electrode substrate 20 and a wall portion 42 protruding from the second surface 201 of the second electrode substrate 20 along the normal direction of the second surface 201. The wall portion 42 may overlap the second electrode 22 of the second electrode substrate 20, or may not overlap the second electrode 22. The wall portion 42 may include a portion that overlaps the second electrode 22 and a portion that does not overlap the second electrode 22. In this case, the surface of the wall portion 42 facing the second surface 201 may include a step due to the thickness of the second electrode 22. As described above, the wall portion 42 includes a plurality of 1x wall portions 45 extending in the x-direction Dx in plan view. The plurality of 1x wall portions 45 may be aligned in the y-direction Dy. The 1x wall portion 45 may include a 1x through-hole 451 penetrating the 1x wall portion 45 in the y-direction Dy. The wall portion 42 also includes a plurality of 2y wall portions 46 extending in the y-direction Dy in plan view. The 2y wall portion 46 may include a 2y through-hole 461 penetrating the 2y wall portion 46 in the x-direction Dx. The plurality of 2y wall portions 46 may be aligned in the x-direction Dx.

[0059] Furthermore, the first x-through holes 451 aligned in the y-direction Dy may be positioned so as to be aligned on a straight line in the y-direction Dy. The second y-through holes 461 aligned in the x-direction may be positioned so as to be aligned on a straight line in the x-direction Dx. However, the first x-through holes 451 aligned in the y-direction Dy may be positioned so as not to be aligned on a straight line in the y-direction Dy. The second y-through holes 461 aligned in the x-direction Dx may be positioned so as not to be aligned on a straight line in the x-direction Dx.

[0060] The 1x wall portion 45 has a height H1x and a width W1x. The height H1x is the distance in the z direction Dz from the second surface 201 to the tip of the 1x wall portion 45. The width W1x is the dimension of the 1x wall portion 45 in the y direction Dy. Additionally, the 2y wall portion 46 has a height H2y and a width W2y. The height H2y is the distance in the z-direction Dz from the second surface 201 to the tip of the 2y wall portion 46. The width W2y is the dimension of the 2y wall portion 46 in the x-direction Dx.

[0061] For example, the height from the second surface 201 of the second electrode substrate 20 to the tips of the multiple 1x wall portions 45 may be the same as the height from the second surface 201 of the second electrode substrate 20 to the tips of the multiple 2y wall portions 46.

[0062] 5 is a diagram showing a process of combining the first electrode substrate 10 with the cell structure K. In the combining process, before filling the liquid crystal material in the filling process, the first electrode substrate 10 is disposed so as to face the second surface 201 of the second electrode substrate 20 of the cell structure K via the wall portion 42 and cover the cell 43.

[0063] 6 is a top view showing an example of a configuration focusing on a cell 43 of a wall portion 42 of the wall structure 40. In FIG. 6, the liquid crystal layer 30 is omitted. In a plan view, the first x wall portions 45 may be arranged in the y direction Dy with a first interval S1 therebetween. In a plan view, the second y wall portions 46 may be arranged in the x direction Dx with a second interval S2 therebetween. In a plan view, the cell 43 is surrounded by two first x wall portions 45 adjacent to each other in the y direction Dy and two second y wall portions 46 adjacent to each other in the x direction Dx.

[0064] The liquid crystal layer 30 shown in FIG. 1 is located in a space in which a plurality of cells 43 are formed, the cells being partitioned by the plurality of 1x walls 45 and the plurality of 2y walls .

[0065] The first interval S1 and the second interval S2 are, for example, 20 μm or more, may be 50 μm or more, or may be 100 μm or more. The first interval S1 and the second interval S2 are, for example, 1000 μm or less, may be 500 μm or less, or may be 250 μm or less.

[0066] The functions of the 1x through hole 451 and the 2x through hole 461 will be described. The cells 43 of the cell structure K are connected to each other through the 1x through holes 451 and the 2y through holes 461. The liquid crystal material of the liquid crystal layer 30 has fluidity. The liquid crystal material can move between two cells 43 adjacent to each other in the y direction Dy through the 1x through hole 451 and the 2x through hole 461. For example, assume that the volume or pressure of the liquid crystal material located in a first cell 43 is larger than the volume or pressure of the liquid crystal material located in another second cell 43 adjacent to the first cell 43. In this case, the liquid crystal material can move from the first cell 43 to the second cell 43 through the 1x through hole 451 or the 2x through hole 461. Therefore, it is possible to suppress the difference in the volume or pressure of the liquid crystal material in each cell 43.

[0067] The width Sx of the first x through hole 451 in the x direction Dx and the width Sy of the second y through hole 461 in the y direction Dy are, for example, 1.0 μm or more, may be 1.5 μm or more, or may be 2.0 μm or more. The gap Gx is, for example, 20.0 μm or less, may be 15.0 μm or less, or may be 10.0 μm or less. The width Sx of the first x through hole 451 in the x direction may be smaller than the width W1x of the first x wall portion 45 in the y direction Dy. The width Sy of the second y through hole 461 in the y direction Dy may be smaller than the width W2y of the second y wall portion 46 in the x direction Dx.

[0068] Here, the width W2y of the 2y wall portion 46 described above is measured at the position where the width of the 2y wall portion 46 is maximum. An example of the shape of the 2y wall portion 46 in Fig. 5 will be described with reference to Figs. 7A to 7C. The measurement of the width W1x of the 1x wall portion 46 is similarly described.

[0069] Fig. 7A is a vertical cross-sectional view showing an example of the shape of the 2y wall portion 46 when viewed along the line AA in the x-direction Dx in Fig. 5. As shown in Fig. 7A, the 2y wall portion 46 may include a portion whose width decreases from the second surface 201 toward the tip 2. The 2y wall portion 46 may have a maximum width at the second surface 201. In this case, the width of the 2y wall portion 46 at the second surface 201 is measured as the width W2y.

[0070] Fig. 7B is a longitudinal sectional view showing an example of the shape of the 2y wall portion 46 when viewed along the line AA in the x-direction Dx in Fig. 5. As shown in Fig. 7B, the 2y wall portion 46 may include a portion whose width increases from the second surface 201 toward the tip 2. The 2y wall portion 46 may have a maximum width at the tip 2. In this case, the width of the 2y wall portion 46 at the tip 2 is measured as the width W2y.

[0071] 7C is a longitudinal cross-sectional view showing an example of the shape of the 2y wall portion 46 when viewed along the line AA in the x-direction Dx in FIG. 5. As shown in FIG. 7C, the 2y wall portion 46 may include a portion whose width increases from the second surface 201 toward the tip 2, and a portion whose width decreases from the second surface 201 toward the second tip 62. In this case, the 2y wall portion 46 has a maximum width at a position different from the second surface 201 and different from the tip 2. For example, the 2y wall portion 46 has a maximum width at a position where the distance Hw from the second surface 201 in the z-direction Dz is 0.4×H2y or more and 0.6×H2y or less. In this case, the maximum width is measured as the width W2y.

[0072] Although not shown, the width W1x of the 1x wall portion 45 is also measured at a position where the width of the 1x wall portion 45 is maximum in a vertical cross-sectional view of the 1x wall portion 45.

[0073] The measurement positions of the heights H1x and H1y are determined based on the measurement positions of the widths W1x and W2y. Specifically, H1x and H2y are measured at the center in the width direction at the measurement positions of the widths W1x and W2y.

[0074] The width W1x and the width W2y are, for example, 1.0 μm or more, may be 3.0 μm or more, or may be 5.0 μm or more. The width W1x and the width W2y are, for example, 100 μm or less, may be 50 μm or less, or may be 25 μm or less.

[0075] As described later, the liquid crystal material is filled into the cell structure K. In the filling process, the 1x wall portion 45 and the 2y wall portion 46 are subjected to pressure from the flowing liquid crystal material. The 1x wall portion 45 and the 2y wall portion 46 are also subjected to force from the alignment film 90. The larger the width W1x and the width W2y are, the more the 1x wall portion 45 and the 2y wall portion 46 can be prevented from being deformed by these forces. On the other hand, the smaller the width W1x and the width W2y are, the more the amount of liquid crystal material filled into the cell structure K increases. By adjusting the width W1x and the width W2y, the amount of liquid crystal material in the liquid crystal layer 30 provided in the reflection device 100 can be appropriately maintained.

[0076] The 1x wall portion 45 has a first aspect ratio. The first aspect ratio is a ratio of a height H1x of the 1x wall portion 45 to a width W1x of the 1x wall portion 45. The first aspect ratio is, for example, 1.0 or more, and may be 2.0 or more, or may be 3.0 or more. The first aspect ratio is, for example, 10.0 or less, and may be 8.0 or less, or may be 5.0 or less.

[0077] The 2y wall portion 46 has a second aspect ratio. The second aspect ratio is the ratio of the height H2y of the 2y wall portion 46 to the width W2y of the 2y wall portion 46. The second aspect ratio is, for example, 1.0 or more, and may be 2.0 or more, or 3.0 or more. The second aspect ratio is, for example, 10.0 or less, and may be 8.0 or less, or 5.0 or less.

[0078] A method for calculating values ​​such as width W1x, width W2y, height H1x, and height H2y will be described. These values ​​are calculated by averaging the measured values ​​in nine areas as shown in FIG. 8. For example, width W1x is calculated by averaging the measured values ​​of width W1x in the first area A1 to the ninth area A9. The first area A1 to the ninth area A9 are obtained by virtually dividing the wall structure 40 into thirds in the x-direction Dx and the y-direction Dy, respectively. Measurements in each area are performed in the portion closest to the center point C of each area. For example, in the first area A1, width W1x is measured in the portion of the 1x-th wall portion 45 closest to the center point C.

[0079] Measurements of width W1x, width W2y, height H1x, height H2y, etc. are performed based on cross-sectional images obtained by an electron microscope.

[0080] As shown in FIGS. 7A to 7C, the reflecting device 100 may include an alignment film 90 located on a surface of the 2y-wall portion 46 of the cell structure K. The alignment film 90 may be located on a side surface of the 2y-wall portion 46. The alignment film 90 may be located at the tip 2 of the 2y-wall portion 46. The alignment film 90 may be a vertical alignment film. Similarly, the alignment film 90 may be provided on a surface of the 1x-wall portion 45 of the cell structure K.

[0081] Next, a description will be given of an example of a manufacturing method for the reflection device 100. The manufacturing method for the reflection device 100 includes at least a step of preparing a cell structure K including the second electrode substrate 20, and a filling step of filling the cell structure K with a liquid crystal material.

[0082] Here, an example of a manufacturing method for the cell structure K will be described. The cell structure K is obtained by forming a wall portion 42 on the second surface 201 of the second electrode substrate 20 including the second substrate 21 and the second electrode 22. Figs. 9 to 17 are diagrams for explaining an example of a wall portion forming step for forming the wall portion 42.

[0083] In the wall forming step, as shown in FIG. 9, a first resin layer 71 may be formed on the second surface 201. The first resin layer 71 may be transferred from a first dry film 70 to the second surface 201, for example. The first dry film 70 includes the first resin layer 71, and a first cover 72 and a first support 73 positioned to sandwich the first resin layer 71. The step of transferring the first resin layer 71 to the second surface 201 includes, for example, a step of peeling the first cover 72 from the first resin layer 71, a step of attaching the first resin layer 71 to the first surface 101, and a step of peeling the first support 73 from the first resin layer 71. In the attaching step, as shown in FIG. 9, the first resin layer 71 and the first support 73 may be pressed toward the first surface 101 with a first pressure P1. This suppresses the generation of a gap between the first resin layer 71 and the first surface 101.

[0084] The first resin layer 71 may contain a photosensitive resin such as a photocurable resin, etc. For example, the first resin layer 71 may contain an acrylic resin.

[0085] When the first resin layer 71 contains a photosensitive resin, an exposure step is performed in which the first resin layer 71 is exposed to light using an exposure mask 80, as shown in FIG. 10 . The exposure mask 80 includes a base material 81 and a light-shielding layer 82. The light-shielding layer 82 is made of a material that does not transmit light. For example, the light-shielding layer 82 includes a metal. Gaps in the light-shielding layer 82 form the transmission regions 83. The first resin layer 71 is irradiated with light that has passed through the transmission regions 83.

[0086] After the exposure step, a development step is performed to develop the first resin layer 71. After the development step, a baking step may be performed to heat the first resin layer 71. As a result, as shown in FIG. 11, the first resin layer 71 having a pattern corresponding to the wall portion 42 is formed on the second surface 201. Here, FIG. 12 is a perspective view that shows a schematic configuration of the first resin layer 71 that is formed and patterned on the second surface 201 of the second electrode substrate 20. As shown in FIG. 12, the portion of the wall portion 42 where the 1x through hole 451 and the 2y through hole 461 are not positioned is formed as the first resin layer 71.

[0087] 13, a second resin layer 76 is formed on the exposed and developed first resin layer 71. For example, the second resin layer 76 having a pattern corresponding to the wall portion 42 may be attached to the first resin layer 71. Here, FIG. 14 is a perspective view showing a schematic configuration of the second resin layer 76 formed and patterned on the support 78 of the second dry film 75. As shown in FIG. 14, the second resin layer 76 is etched and opened in regions 751 and 761 that correspond to the 1x through-hole 451 and the 2y through-hole 461 of the wall portion 42.

[0088] The second resin layer 76 may contain a photosensitive resin such as a photocurable resin. For example, the second resin layer 76 may contain an acrylic resin. Even when the second resin layer 76 contains a photosensitive resin, an exposure step is performed in which the second resin layer 76 is exposed to light using an exposure mask on the second dry film. After the exposure step, a development step is performed in which the second resin layer 76 is developed, and a desired pattern is formed. After the development step, a baking step may be performed in which the second resin layer 76 is heated.

[0089] 13, the second resin layer 76 may be transferred from the second dry film 75 onto the first resin layer 71. The step of transferring the second resin layer 76 to the first resin layer 71 includes, for example, a step of attaching the second resin layer 76 to the first resin layer 71 and a step of peeling the second support 78 from the second resin layer 76. In the attaching step, the second resin layer 76 and the second support 78 may be pressed toward the first resin layer 71. This prevents a gap from being generated between the second resin layer 76 and the first resin layer 71. The method of forming the second resin layer 76 is not limited.

[0090] FIG. 15 is a cross-sectional view showing an example of the 1x wall portion 45 of the manufactured cell structure K. The 1x wall portion 45 of the wall portion 42 includes a first resin layer 71 located on the second surface 201 and a second resin layer 76 located on the first resin layer 71. The 2y wall portion 46 of the wall portion 42 also includes a first resin layer 71 located on the second surface 201 and a second resin layer 76 located on the first resin layer 71, similar to the 1x wall portion 45. The aspect ratio of the 1x wall portion 45 and the 2y wall portion 46 is increased by including two resin layers in the 1x wall portion 45 and the 2y wall portion 46. Although not shown, the 1x wall portion 45 and the 2y wall portion 46 may include three or more resin layers.

[0091] FIG. 16 is a vertical cross-sectional view showing another example of the manufactured cell structure K. In the example of FIG. 16, a cross section of the 1x-th wall portion 45 of the wall portion 42 is shown, but the 2y-th wall portion 46 of the wall portion 42 is also shown. As shown in FIG. 16, the cell structure K may include a water-repellent layer 92 located on the second surface 201. The water-repellent layer 92 is a layer configured to repel a solution containing a material and a solvent constituting the alignment film 90. The water-repellent layer 92 may be formed on the second surface 201 before the wall portion 42 is formed on the second surface 201. The water-repellent layer 92 is formed, for example, by performing a water-repellent treatment on the second surface 201.

[0092] After the wall portion 42 is formed, a step of forming the alignment film 90 may be performed. For example, a solution containing a material and a solvent constituting the alignment film 90 is applied to the surfaces of the 1x-wall portion 45 and the 2y-wall portion 46 of the wall portion 42. Then, the liquid crystal layer 30 to which the solution has been applied is heated. As a result, the alignment film 90 is formed on the liquid crystal layer 30. As a result, the alignment film 90 is formed on the surfaces of the 1x-wall portion 45 and the 2y-wall portion 46 of the wall portion 42.

[0093] Fig. 17 is a cross-sectional view showing another example of the manufactured cell structure K. Note that, in the example of Fig. 17, a cross section of the 1x-th wall portion 45 of the wall portion 42 is shown, but the same is true for the 2y-th wall portion 46 of the wall portion 42. Although not shown in Fig. 17, the above-mentioned water-repellent layer 92 may be formed on the second surface 201. The water-repellent layer 92 can suppress the formation of the alignment film 90 on the second surface 201.

[0094] 18 and 19 are longitudinal cross-sectional views showing a filling step of filling the cell structure K with the liquid crystal material 31. In the filling step, as shown in FIG. 18, a lid portion F is disposed so as to cover the cell 43, facing the second surface 201 of the second electrode substrate 20 of the cell structure K via a wall portion 42. In the example of FIG. 18, the lid portion F is the first electrode substrate 10 including the first surface 101 and the first back surface 102 located on the opposite side of the first surface 101. However, the lid portion F may be a film different from the first electrode substrate 10. In this case, the first electrode substrate 10 is assembled after the film is disposed, so that a film (not shown) may be disposed between the cell structure K and the first electrode substrate 10.

[0095] After each cell 43 of the cell structure K is covered with the cover F, the air surrounding the cell structure K arranged in the sealed space is discharged to the outside. Then, as shown in FIG. 19, a liquid crystal material 31 is supplied onto the second surface 201 of the cell structure K.

[0096] As shown in FIG. 4, the cells 43 of the cell structure K communicate with each other through the 1x through holes 451 and the 2y through holes 461. Therefore, in the filling step, the liquid crystal material may be filled from the x direction Dx or the y direction Dy into the space constituting the cells 43 of the cell structure K partitioned by the 1x wall portions 45 and the 2y wall portions 46 shown in FIG. 4 through the 1x through holes 451 and the 2y through holes 461. In this case, the liquid crystal material 31 moves along the second surface 201 so as to fill each cell 43 through the 1x through holes 451 between the 1x wall portions 45 and the 2y through holes 461 between the 2y wall portions 46. In this manner, in the filling step, the liquid crystal material 31 is filled into the spaces constituting the plurality of cells 43 of the cell structure K, which are partitioned by the plurality of 1x walls 45 and the plurality of 2y walls 46.

[0097] In the filling step, the liquid crystal material 31 is filled into the cell structure K using the capillary phenomenon described above, but the present invention is not limited to this. For example, in the filling step, the liquid crystal material 31 may be filled from the normal direction of the second surface 201 of the second electrode substrate 20 into the spaces constituting the multiple cells 43 of the cell structure K partitioned by the multiple 1x walls 45 and the multiple 2y walls 45. In this case, after the filling step, a combination step may be provided in which the first electrode substrate 10 is combined with the cell structure K filled with the liquid crystal material 31 so as to cover the multiple cells 43 while facing the second surface 201 of the second electrode substrate 20 via the wall portions 42.

[0098] After the filling step, a degassing step may be performed. In the degassing step, the gap between the liquid crystal material 31 filled in the cell structure K and the wall portion 42 is removed. The gas forming the gap is discharged through the first through-hole 451 and the second through-hole 461. Therefore, the time required for the degassing step is reduced compared to the case where the degassing step is performed on a liquid crystal material in a conventional cell surrounded on all sides.

[0099] By carrying out the above steps, a reflecting device 100 having a wall structure 40 shown in FIG. 1 is obtained.

[0100] According to this embodiment, since the 1x wall portion 45 and the 2y wall portion 46 of the wall structure 40 communicate with each other through the first through hole 451 and the second through hole 461, the time required for the filling step and the deaeration step can be reduced. Therefore, the productivity of the reflecting device 100 can be improved.

[0101] The above-described embodiment can be modified in various ways. Hereinafter, other embodiments will be described with reference to the drawings as necessary. In the following description and the drawings used in the following description, the same reference numerals as those used for the corresponding parts in the above-described embodiment are used for parts that can be configured similarly to the above-described embodiment. Duplicate descriptions will be omitted. In addition, if it is clear that the effects obtained in the above-described embodiment can also be obtained in other embodiments, the description may be omitted.

[0102] (First Modification) In the above-described embodiment, an example has been shown in which the 1x through hole 451 is provided in the 1x wall portion 45 at a position in contact with the first surface 101 of the first electrode substrate 10 shown in Fig. 1, and the 2y through hole 461 is provided in the 2y wall portion 46 at a position in contact with the first surface 101 of the first electrode substrate 10 shown in Fig. 1. However, the positional relationship between the 1x through hole 451 and the 2y through hole 461 in the 1x wall portion 45 and the 2y wall portion 46 is not limited.

[0103] FIG. 20 is a perspective view showing an example of the wall structure 40 according to the first modification. FIG. 21A is a longitudinal sectional view showing an example of a cross section of the first x-wall portion 45 of the wall structure 40 along the x-direction Dx. FIG. 21B is a longitudinal sectional view showing an example of a cross section of the second y-wall portion 46 of the wall structure 40 along the y-direction Dy. In FIGS. 20, 21A, and 21B, the liquid crystal layer 30 is omitted. As shown in FIGS. 20, 21A, and 21B, the multiple wall portions 42 may include multiple x-wall portions 45 extending in the x-direction Dx and multiple y-wall portions 46 extending in the y-direction Dy so as to intersect with the multiple x-wall portions 45. The first x-wall portion 45 may include a first x-through hole 451 penetrating the first x-wall portion 45 in the y-direction Dy. The first x-through hole 451 may be provided in the first x-wall portion 45 at a position in contact with the first surface 201 of the second electrode substrate 20 shown in FIG. 1. The 2y wall portion 46 may include a 2y through-hole 461 that penetrates the 2y wall portion 46 in the x-direction Dx. The 2y through-hole 461 may be provided in the 2y wall portion 46 at a position in contact with the second surface 201 of the second electrode substrate 20 shown in FIG.

[0104] In the first modified example, the multiple cells 43 of the existing cell structure K are also in communication with each other via the multiple 1x through holes 451 and the multiple 2y through holes 461. Therefore, the liquid crystal material can move between two cells 43 adjacent to each other in the y direction Dy through the 1x through hole 451 and the 2x through hole 461. That is, the liquid crystal material can move between the adjacent cells 43 through the 1x through hole 451 and the 2x through hole 461. Therefore, it is possible to suppress the occurrence of a difference in the volume or pressure of the liquid crystal material in each cell 43.

[0105] Other configurations, functions, and manufacturing methods of the reflecting device according to the first modified example are similar to those of the above-described embodiment, and can be manufactured by similar manufacturing processes, so that descriptions thereof will be omitted.

[0106] (Second Modification) FIG. 22 is a perspective view showing an example of the wall structure 40 according to the second modified example. FIG. 23A is a longitudinal sectional view showing an example of a cross section of the 1x wall portion 45 of the wall structure 40 along the x direction Dx. FIG. 23B is a longitudinal sectional view showing an example of a cross section of the 2y wall portion 46 of the wall structure 40 along the y direction Dy. In FIGS. 22, 23A, and 23B, the liquid crystal layer 30 is omitted. As shown in FIGS. 22, 23A, and 23B, the 1x through hole 451 may be provided in the 1x wall portion 45 at a position away from the first surface 101 of the first electrode substrate 10 and the second surface 201 of the second electrode substrate 20 shown in FIG. 1. The 2y through hole 461 may be provided in the 2y wall portion 46 at a position away from the first surface 101 of the first electrode substrate 10 and the second surface 201 of the second electrode substrate 20 shown in FIG. 1.

[0107] In the second modified example, the multiple cells 43 of the existing cell structure K are also in communication with each other via the multiple 1x through holes 451 and the multiple 2y through holes 461. Therefore, the liquid crystal material can move between two cells 43 adjacent to each other in the y direction Dy through the 1x through hole 451 and the 2x through hole 461. That is, the liquid crystal material can move between the adjacent cells 43 through the 1x through hole 451 and the 2x through hole 461. Therefore, it is possible to suppress the occurrence of a difference in the volume or pressure of the liquid crystal material in each cell 43.

[0108] The other configurations, functions, and manufacturing method of the reflecting device according to the second modification are the same as those of the above-mentioned embodiment, and can be manufactured by the same manufacturing process. Here, in the method of the reflecting device according to the second modification, as in the above-mentioned embodiment, for example, as shown in FIG. 24, the first resin layer 71 formed to correspond to the pattern of the wall portion 42 may be transferred from a dry film (not shown) to the second surface 201 of the second electrode substrate 20. The second resin layer 76 formed to correspond to the pattern of the wall portion 42 may be opened by etching the regions 751 and 761 that correspond to the 1x through hole 451 and the 2y through hole 461 of the wall portion 42 on the dry film (not shown). This second resin layer 76 may be transferred from the dry film onto the first resin layer 71. The third resin layer 79 formed to correspond to the pattern of the wall portion 42 may be transferred from a dry film (not shown) onto the second resin layer 76. In this case, the 1x wall portion 45 and the 2y wall portion 46 of the wall portion 42 include three or more resin layers.

[0109] (Third Modification) FIG. 25 is a perspective view showing an example of the wall structure 40 according to the third modified example. FIG. 26A is a longitudinal sectional view showing an example of a cross section of the 1x wall portion 45 of the wall structure 40 along the x direction Dx. FIG. 26B is a longitudinal sectional view showing an example of a cross section of the 2y wall portion 46 of the wall structure 40 along the y direction Dy. In FIGS. 25, 26A, and 26B, the liquid crystal layer 30 is omitted. As shown in FIGS. 25, 26A, and 26B, a plurality of 1x through holes 451 may be located in a region of the 1x wall portion 45 that defines one cell 43. As shown in FIGS. 25 and 26B, a plurality of 2y through holes 461 may be located in a region of the 2y wall portion 46 that defines one cell 46.

[0110] In the third modified example as well, the multiple cells 43 of the existing cell structure K communicate with each other via the multiple 1x through holes 451 and the multiple 2y through holes 461. Therefore, the liquid crystal material can move between two cells 43 adjacent to each other in the y direction Dy through the 1x through hole 451 and the 2x through hole 461. That is, the liquid crystal material can move between the adjacent cells 43 through the 1x through hole 451 and the 2x through hole 461. Therefore, it is possible to suppress the occurrence of a difference in the volume or pressure of the liquid crystal material in each cell 43.

[0111] Other configurations, functions, and manufacturing methods of the reflecting device according to the third modified example are similar to those of the above-described embodiment, and the reflecting device can be manufactured by similar manufacturing processes.

[0112] (Fourth Modification) Fig. 27 is a vertical cross-sectional view showing an example of a manufacturing process of the cell structure K according to the fourth modified example. As shown in Fig. 27, the cell structure K may include an alignment film 95 located on the second surface 201. The alignment film 95 may be formed on the second surface 201 before the wall portion 42 is formed on the second surface 201. A rubbing treatment may be performed on the alignment film 95.

[0113] After the wall portion 42 is formed on the second surface 201, a step of forming an alignment film 90 may be performed as shown in Fig. 28. For example, a solution containing a material constituting the alignment film 90 and a solvent is applied to the surface of the wall portion 42 such as the 1x wall portion 45. The alignment film 90 may be formed on the alignment film 95. Then, a step of forming a liquid crystal layer 30 is performed.

[0114] The alignment film 95 may have a regulating force different from that of the alignment film 90. For example, when the alignment film 90 is a vertical alignment film, the alignment film 95 may be a horizontal alignment film. In the example shown in FIG. 28, the regulating force of the alignment film 95, which is a horizontal alignment film, is higher than the regulating force of the alignment film 90, which is a vertical alignment film. Therefore, the regulating force of the alignment film 95 can extend to the liquid crystal layer 30 overlapping the alignment film 95 and the alignment film 90 in the z direction Dz.

[0115] Although not shown, the alignment film 90 is formed on the surface of the wall portion 42 but does not necessarily have to be formed on the alignment film 95 .

[0116] Although not shown, the cell structure K may include only one of a horizontal alignment film and a vertical alignment film. For example, the cell structure K may include a horizontal alignment film located on the second surface 201, but may not include a vertical alignment film located on the surface of the wall portion 42. For example, the cell structure K may include a vertical alignment film located on the surface of the wall portion 42, but may not include a horizontal alignment film located on the second surface 201.

[0117] Although not shown, the arrangement of the vertical alignment film and the horizontal alignment film may be changed depending on the type of liquid crystal material. For example, the cell structure K may include a vertical alignment film located on the second surface 201 and a horizontal alignment film located on the surface of the wall portion 42.

[0118] (Fifth Modification) In the above embodiment, an example has been described in which the wall portion 42 is formed by exposing and developing a resin layer containing a photosensitive resin, but the method of forming the wall portion 42 is not limited. For example, the wall portion 42 may be formed by a 3D printer. For example, the wall portion 42 may be formed by an imprint method.

[0119] Although several modified examples of the embodiment described above have been explained, it is of course possible to combine a plurality of modified examples appropriately and apply them to the embodiment described above. [Explanation of symbols]

[0120] 10...First electrode substrate 101...1st surface 102…First back 11...First board 12...1st electrode 20…Second electrode substrate 201…Second surface 202…Second back 21...Second board 22…Second electrode 30...Liquid crystal layer 31...Liquid crystal materials 40…Wall structure 43…Cell 45…1st wall section 451…1st through hole 46…2nd y wall part 461...2nd y through hole 90...Alignment film 92...Water-repellent layer 95...Alignment film

Claims

1. 1. A reflecting device, comprising: a first electrode substrate including a first surface and a first back surface opposite the first surface; a second electrode substrate including a second surface opposite to the first surface and a second back surface opposite to the second surface; a wall portion protruding from the second surface along a normal direction of the second surface; a liquid crystal layer located between the first surface of the first electrode substrate and the second surface of the second electrode substrate; the first electrode substrate includes a first electrode located on the first surface and a first substrate supporting the first electrode; the second electrode substrate includes a second electrode located on the second surface and a second substrate supporting the second electrode; The wall portion includes a plurality of first x-wall portions extending in an x-direction in a plan view and a plurality of second y-wall portions extending in a y-direction intersecting the x-direction in a plan view, In a plan view, a plurality of the first x-wall portions intersect with a plurality of the second y-wall portions, and one cell is defined by two of the first x-wall portions adjacent to each other in the y direction and two of the second y-wall portions adjacent to each other in the x direction, and the liquid crystal layer is located in a space in which a plurality of cells defined by the first x-wall portions and the second y-wall portions are configured, the first x-wall portion includes a first x-through hole penetrating the first x-wall portion in the y-direction, The second y-wall portion includes a second y-through hole that penetrates the second y-wall portion in the x-direction.

2. the first x-through hole is provided at a position in the first x-wall portion that contacts the second surface of the second electrode substrate, The reflection device according to claim 1 , wherein the second y through-hole is provided in the second y wall portion at a position in contact with the second surface of the second electrode substrate.

3. the first x-through hole is provided at a position in the first x-wall portion in contact with the first surface of the first electrode substrate, The reflection device according to claim 1 , wherein the second y through-hole is provided in the second y wall portion at a position in contact with the first surface of the first electrode substrate.

4. the first x-through hole is provided in the first x-wall portion at a position away from the first surface of the first electrode substrate and the second surface of the second electrode substrate, The reflection device according to claim 1 , wherein the second y-through hole is provided in the second y-wall portion at a position away from the first surface of the first electrode substrate and the second surface of the second electrode substrate.

5. A plurality of the first x through holes are located in a region of the first x wall portion that defines one of the cells, The reflecting device according to claim 1 , wherein a plurality of the second y through holes are positioned in a region of the second y wall portion that defines one of the cells.

6. The method for manufacturing a reflection device according to claim 1 , wherein the cells of the cell structure are in communication with each other via the first x-through holes and the second y-through holes.

7. (The through holes are aligned in a straight line.) The first x-through holes arranged in the y direction are positioned so as to be aligned in a straight line in the y direction, and / or The reflection device according to claim 2 , wherein the second y through holes arranged in the x direction are positioned so as to be aligned on a straight line in the x direction.

8. The first x-through holes arranged in the y direction are not aligned in a straight line in the y direction, and / or The reflection device according to claim 2 , wherein the second y through holes arranged in the x direction are positioned so as not to be aligned on a straight line in the x direction.

9. The reflection device according to claim 1 , wherein a width of the first x-through hole in the x-direction and a width of the second y-through hole in the y-direction are 1.0 μm or more.

10. The reflector device of claim 1 , further comprising an alignment film located on a surface of the wall portion.

11. 1. A method for manufacturing a reflection device comprising: a first electrode substrate; a second electrode substrate; and a liquid crystal layer disposed between the first electrode substrate and the second electrode substrate, the method comprising the steps of: forming a cell structure; and filling the cell structure with a liquid crystal material. The cell structure comprises: the second electrode substrate including a second surface and a second back surface opposite the second surface; a wall portion protruding from the second surface along a normal direction of the second surface, the second electrode substrate includes a second electrode located on the second surface and a second substrate supporting the second electrode; The wall portion includes a plurality of first x-wall portions extending in an x-direction in a plan view and a plurality of second y-wall portions extending in a y-direction intersecting the x-direction in a plan view, In a plan view, a plurality of the first x-wall portions and a plurality of the second y-wall portions intersect with each other, and one cell is defined by two of the first x-wall portions adjacent to each other in the y direction and two of the second y-wall portions adjacent to each other in the x direction, the first x-wall portion includes a first x-through hole penetrating the first x-wall portion in the y-direction, the second y-wall portion includes a second y-through hole penetrating the second y-wall portion in the x-direction, In the filling step, the liquid crystal material is filled into spaces constituting a plurality of cells of the cell structure partitioned by the first x-wall portions and the second y-wall portions.

12. In the filling step, a lid portion is disposed so as to cover the cell and face the second surface of the second electrode substrate of the cell structure via the wall portion; 12. The method for manufacturing a reflection device as described in claim 11, wherein in the filling process, the liquid crystal material is filled into spaces constituting multiple cells of the cell structure partitioned by the multiple first x wall portions and the multiple second y wall portions from the x direction or the y direction through the multiple first x through holes and the multiple second y through holes.

13. The method for manufacturing a reflection device according to claim 12 , wherein the cells of the cell structure are in communication with each other via the first x-through holes and the second y-through holes.

14. The method for manufacturing a reflection device according to claim 12 , wherein the lid portion is the first electrode substrate including the first front surface and a first back surface located opposite to the first front surface.

15. 12. The method for manufacturing a reflection device as described in claim 11, wherein in the filling process, the liquid crystal material is filled into spaces constituting a plurality of cells of the cell structure partitioned by a plurality of the first x wall portions and a plurality of the second y wall portions from a normal direction of the second surface of the second electrode substrate.

16. The method for manufacturing a reflector device according to claim 11, further comprising a degassing step for removing any voids between the liquid crystal material filled in the cell structure and the wall portion.

17. The method for manufacturing a reflector according to claim 11 , further comprising the step of forming an alignment film on a surface of the wall portion of the cell structure.

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