Stacked electronic component

Abstract

To minimize equivalent series inductance (ESL) due to the structure of a stacked electronic component.SOLUTION: A stacked electronic component according to an embodiment of the present invention includes a body including a dielectric layer, and a first internal electrode and a second internal electrodes that alternately arranged through the dielectric layers in a first direction, and a first external electrode and a second external electrode that are arranged on surfaces of the body facing each other in a second direction perpendicular to the first direction. The body includes a main part in which the first internal electrode and the second internal electrode are alternately arranged in the first direction, a first cover part arranged over one surface of the main part in the first direction, and a second cover part arranged over the other surface of the main part in the first direction. One of the first cover and the second cover includes a cover electrode having an average measurement in the second direction larger than those of the first internal electrode and the second internal electrode. The cover electrode is arranged adjacent to the one surface or the other surface of the main part in the first direction rather than a surface of the body facing the first direction.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to a multilayer electronic component. [Background technology]

[0002] Multilayer ceramic capacitors (MLCCs), a type of multilayer electronic component, are chip-type capacitors that are mounted on printed circuit boards of various electronic products or automotive products, such as visual devices such as liquid crystal displays (LCDs) and plasma display panels (PDPs), computers, smartphones and mobile phones, on-board chargers (OBCs) for electric vehicles, circuits such as DC-DC converters, and infotainment systems, to charge or discharge electricity.

[0003] For multilayer ceramic capacitors to operate smoothly in the high frequency range above the resonant frequency, it is important that they have low equivalent series inductance (ESL). Attempts have been made to connect multilayer ceramic capacitors in parallel to reduce the equivalent series inductance of the multilayer ceramic capacitor, but this has the drawback of increasing the mounting area and production time.

[0004] Therefore, there is a need for structural improvements that can reduce the equivalent series inductance of multilayer electronic components such as multilayer ceramic capacitors. Summary of the Invention [Problem to be solved by the invention]

[0005] Among other objects of the present invention is to minimize the equivalent series inductance (ESL) due to the construction of multilayer electronic components.

[0006] However, the object of the present invention is not limited to the above-mentioned contents, and can be more easily understood in the course of describing specific embodiments of the present invention. [Means for solving the problem]

[0007] A multilayer electronic component according to an embodiment of the present invention includes a body including a dielectric layer, and first and second internal electrodes alternately arranged with the dielectric layer in a first direction, and first and second external electrodes arranged on a surface of the body facing a second direction perpendicular to the first direction, wherein the body includes a main part in which the first and second internal electrodes are alternately arranged in the first direction, a first cover part arranged on one side of the main part in the first direction, and a second cover part arranged on the other side of the main part in the first direction, one of the first cover part and the second cover part includes a cover electrode having an average size in the second direction larger than that of the first and second internal electrodes, and the cover electrode is arranged adjacent to one or the other side of the main part in the first direction rather than the surface of the body facing the first direction.

[0008] According to yet another embodiment of the present invention, there is provided a multilayer electronic component comprising: a body including a dielectric layer, and first and second internal electrodes alternately arranged with the dielectric layer in a first direction; a first external electrode arranged on one surface of the body facing a second direction perpendicular to the first direction and connected to the first internal electrode; and a second external electrode arranged on the other surface of the body facing the second direction and connected to the second internal electrode, wherein the body includes a main part in which the first and second internal electrodes are alternately arranged in the first direction, a first cover part arranged on one surface of the main part in the first direction, and a second cover part arranged on the other surface of the main part in the first direction, wherein the first cover part includes a first cover electrode having an average size larger in the second direction than the first and second internal electrodes, and the second cover part includes a second cover electrode having an average size larger in the second direction than the first and second internal electrodes. Effect of the Invention

[0009] One of the various effects of the present invention is that the length of the internal electrodes adjacent to the mounting surface is extended longer than the length of the other internal electrodes, thereby shortening the current path, thereby reducing the ESL and impedance of the multilayer electronic component.

[0010] However, the various yet significant advantages and effects of the present invention are not limited to the above, and can be more easily understood in the course of describing specific embodiments of the present invention. [Brief description of the drawings]

[0011] [Figure 1] 1 is a perspective view showing a schematic configuration of a multilayer electronic component according to an embodiment of the present invention and still another embodiment of the present invention; [Diagram 2] 2 is a cross-sectional view of the multilayer electronic component according to one embodiment of the present invention taken along line II' in FIG. [Diagram 3] 1. FIG. 4 is a cross-sectional view of a multilayer electronic component according to still another embodiment of the present invention taken along line II' in FIG. [Figure 4] FIG. 4 is an enlarged view of region P in FIG. [Diagram 5] 2 is a cross-sectional view taken along line II-II' in FIG. [Figure 6] FIG. 2 is an exploded perspective view showing the structure of a main body according to one embodiment. [Figure 7] FIG. 1 is a perspective view showing a state in which a multilayer electronic component according to an embodiment of the present invention and yet another embodiment of the present invention is mounted on a substrate. [Figure 8a] 8 is a cross-sectional view of a multilayer electronic component according to an embodiment of the present invention mounted on a substrate, taken along line III-III' in FIG. 7. [Figure 8b] 8 is a cross-sectional view of a multilayer electronic component mounted on a substrate according to still another embodiment of the present invention taken along line III-III' in FIG. 7. [Figure 9a] FIG. 13 is a schematic diagram showing a current path of a multilayer electronic component according to a comparative example. [Figure 9b] FIG. 2 is a schematic diagram showing a current path of a multilayer electronic component according to one embodiment of the present invention. [Figure 10] 1 is a perspective view showing a schematic diagram of a multilayer electronic component according to an embodiment of the present invention; [Figure 11] 1A and 1B are cross-sectional views of a multilayer electronic component according to one embodiment taken along a first direction and a second direction. [Figure 12] 1A and 1B are cross-sectional views of a multilayer electronic component according to one embodiment taken along a first direction and a second direction. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] Hereinafter, the embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention can be modified into several other forms, and the scope of the present invention is not limited to the embodiments described below. Furthermore, the embodiments of the present invention are provided to more completely explain the present invention to those skilled in the art. Therefore, the shapes and sizes of elements in the drawings may be enlarged or reduced (or highlighted or simplified) for clearer explanation, and elements indicated by the same reference numerals in the drawings are the same elements.

[0013] In addition, in the drawings, parts that are not relevant to the description are omitted in order to clearly explain the present invention, and the size and thickness of each component shown in the drawings are arbitrarily shown for the convenience of explanation, so the present invention is not necessarily limited by the drawings. Furthermore, components having the same function within the same concept are described using the same reference numerals. Furthermore, throughout the specification, when a part "includes" a certain component, it does not mean that the part excludes other components, but that the part may further include other components, unless otherwise specified to the contrary.

[0014] In the drawings, the first direction is the direction in which the internal electrodes 121, 122 are alternately arranged with the dielectric layer therebetween or the thickness T direction, and of the second and third directions which are perpendicular to the first direction, the second direction can be defined as the length L direction and the third direction can be defined as the width W direction.

[0015] 1 is a perspective view roughly showing a multilayer electronic component according to one embodiment of the present invention and another embodiment of the present invention; FIG. 2 is a cross-sectional view of the multilayer electronic component according to one embodiment of the present invention taken along line I-I' in FIG. 1; FIG. 3 is a cross-sectional view of the multilayer electronic component according to yet another embodiment of the present invention taken along line I-I' in FIG. 1; FIG. 4 is an enlarged view of region P in FIG. 3; FIG. 5 is a cross-sectional view taken along line II-II' in FIG. 1; FIG. 6 is an exploded perspective view showing the structure of a main body according to one embodiment of the present invention; FIG. 7 is a perspective view showing a form in which the multilayer electronic component according to one embodiment of the present invention and another embodiment of the present invention are mounted on a substrate; 8b is a cross-sectional view of a multilayer electronic component according to one embodiment taken along line III-III' in FIG. 7, FIG. 8b is a cross-sectional view of a multilayer electronic component according to yet another embodiment of the present invention mounted on a substrate taken along line III-III' in FIG. 7, FIG. 9a is a schematic diagram showing current paths in a multilayer electronic component according to a comparative example, FIG. 9b is a schematic diagram showing current paths in a multilayer electronic component according to one embodiment of the present invention, FIG. 10 is a perspective view showing a schematic view of a multilayer electronic component according to one embodiment, FIG. 11 is a cross-sectional view of the multilayer electronic component according to one embodiment in the first and second directions, and FIG. 12 is a cross-sectional view of the multilayer electronic component according to one embodiment in the first and second directions.

[0016] A multilayer electronic component 100 according to one embodiment of the present invention, a multilayer electronic component 100' according to still another embodiment, and various embodiments thereof will be described in detail below with reference to FIGS.

[0017] A multilayer electronic component 100 according to an embodiment of the present invention includes a body including a dielectric layer, and first and second internal electrodes alternately arranged with the dielectric layer in a first direction, and first and second external electrodes arranged on a surface of the body facing a second direction perpendicular to the first direction, the body including a main part in which the first and second internal electrodes are alternately arranged in the first direction, a first cover part arranged on one side of the main part in the first direction, and a second cover part arranged on the other side of the main part in the first direction, one of the first cover part and the second cover part including a cover electrode having an average size in the second direction larger than that of the first and second internal electrodes, and the cover electrode is arranged adjacent to one or the other side of the main part in the first direction rather than the surface of the body facing the first direction.

[0018] A multilayer electronic component 100′ according to yet another embodiment of the present invention includes a main body including a dielectric layer, and first and second internal electrodes alternately arranged with the dielectric layer in a first direction, a first external electrode arranged on one surface of the main body facing a second direction perpendicular to the first direction and connected to the first internal electrode, and a second external electrode arranged on the other surface of the main body facing the second direction and connected to the second internal electrode, wherein the main body includes a main part in which the first and second internal electrodes are alternately arranged in the first direction, a first cover part arranged on one surface of the main part in the first direction, and a second cover part arranged on the other surface of the main part in the first direction, the first cover part including first cover electrodes having an average size larger in the second direction than the first and second internal electrodes, and the second cover part including second cover electrodes having an average size larger in the second direction than the first and second internal electrodes.

[0019] Hereinafter, with reference to FIGS. 1 to 6, an embodiment commonly applicable to a multilayer electronic component 100 according to one embodiment of the present invention and a multilayer electronic component 100' according to still another embodiment will be described in detail.

[0020] The body 110 includes a dielectric layer 111 and internal electrodes 121 and 122 alternately arranged with the dielectric layer 111 in a first direction. There is no particular limitation on the specific shape of the body 110, but as shown in the figure, the body 110 may have a hexahedral shape or a similar shape. Due to shrinkage of the ceramic powder contained in the body 110 during the firing process, the body 110 may have a substantially hexahedral shape, although it is not a hexahedral shape having perfectly straight lines.

[0021] The main body 110 may include a first surface 1 and a second surface 2 facing each other in a first direction, a third surface 3 and a fourth surface 4 facing each other in a second direction perpendicular to the first direction, and a fifth surface 5 and a sixth surface 6 facing each other in a third direction perpendicular to the first direction and the second direction.

[0022] The multiple dielectric layers 111 forming the main body 110 are in a fired state, and the boundaries between adjacent dielectric layers 111 can be integrated to such an extent that they are difficult to see without using a scanning electron microscope (SEM). There is no particular limit to the number of laminated dielectric layers, and this can be determined in consideration of the size of the ceramic electronic component. For example, the main body can be formed by laminating 300 or more dielectric layers.

[0023] The raw material for forming the dielectric layer 111 can be varied depending on the purpose. Specifically, ferroelectric BaTiO3 can be used as the material for the main purpose of achieving a high capacitance per unit volume, and paraelectric CaZrO3 can be used as the material for the main purpose of improving reliability in high temperature environments. Examples of BaTiO3-based materials include BaTiO3, BaTiO3 partially solid-dissolved with Ca (calcium), Zr (zirconium), etc. (Ba 1-x Ca x )TiO3(0 <x<1)、Ba(Ti 1-y Ca y )O3(0 <y<1)、(Ba 1-x Ca x )(Ti 1-y Zr y )O3(0 <x<1、0<y<1)またはBa(Ti 1-y Zry ) Examples include O3 (0 < y < 1), and examples of the material of the CaZrO3 substrate include (Ca 1-x Sr x )(Zr 1-y Ti y )O3 (0 < x < 1, 0 < y < 1).

[0024] The average thickness td of the dielectric layer 111 is not particularly limited.

[0025] When aiming for miniaturization and high capacitance of the multilayer electronic component 100, the average thickness td of the dielectric layer 111 can be 0.35 μm or less, and in order to improve the reliability of the multilayer electronic component 100 under high temperature and high pressure, the average thickness td of the dielectric layer 111 can be 2 μm or more. However, the preferred average thickness td of the dielectric layer 111 in the present invention will be described later.

[0026] The average thickness td of the dielectric layer 111 can mean the average thickness of the dielectric layer 111 disposed between the first internal electrode 121 and the second internal electrode 122.

[0027] The average thickness td of the dielectric layer 111 can be measured by scanning an image of a cross-section (L-T cross-section) in the third direction and the first direction of the main body 110 with a scanning electron microscope (SEM).

[0028] For example, the average thickness td of the dielectric layer 111 is extracted from an image scanned with a scanning electron microscope (SEM) of a cross-section in the length and thickness directions (L-T) cut at the central portion in the width direction of the main body 110. Among the dielectric layers, for a total of 5 dielectric layers, 2 layers on the upper side and 2 layers on the lower side with respect to one layer of the dielectric layer at the point where the central line in the length direction of the main body and the central line in the thickness direction are in contact, with the point where the central line in the length direction of the main body and the central line in the thickness direction are in contact as a reference, after determining 5 points at equal intervals, 2 points on the left side and 2 points on the right side centered on one reference point, the thickness at each point is measured and the average value can be measured.

[0029] As shown in FIG. 2, the internal electrodes 121, 122 and the dielectric layers 111 are alternately disposed in a first direction.

[0030] The internal electrodes 121, 122 may be divided into a first internal electrode 121 and a second internal electrode 122. The first internal electrodes 121 and the second internal electrodes 122 are alternately arranged to face each other with a dielectric layer 111 constituting the body 110 interposed therebetween, and may be in contact with a third surface 3 and a fourth surface 4 of the body 110, respectively, and connected to external electrodes 131, 132, which will be described later.

[0031] Referring to FIG. 2, the first internal electrode 121 may be spaced apart from the fourth surface 4 and exposed through the third surface 3, and the second internal electrode 122 may be spaced apart from the third surface 3 and exposed through the fourth surface 4.

[0032] At this time, the first internal electrode 121 and the second internal electrode 122 can be electrically isolated from each other by the dielectric layer 111 disposed therebetween.

[0033] Referring to FIG. 5, the body 110 may be formed by alternately stacking ceramic green sheets on which the first internal electrodes 121 are printed and ceramic green sheets on which the second internal electrodes 122 are printed, and then firing the stacked ceramic green sheets.

[0034] There is no particular limitation on the material for forming the internal electrodes 121 and 122, and any material having excellent electrical conductivity can be used. For example, the internal electrodes can be formed by printing a conductive paste for the internal electrodes, which contains one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof, on a ceramic green sheet.

[0035] The method for printing the conductive paste for the internal electrodes may be a screen printing method or a gravure printing method, but the present invention is not limited thereto.

[0036] The average thickness te of the internal electrodes 121, 122 is not particularly limited and may vary depending on the purpose. In order to reduce the size of the multilayer electronic component 100, the average thickness te of the internal electrodes 121, 122 may be 0.35 μm or less, and in order to improve the reliability of the multilayer electronic component 100 under high temperature and high pressure, the average thickness te of the internal electrodes 121, 122 may be 3 μm or more.

[0037] The average thickness te of the internal electrodes 121 and 122 may be calculated by measuring the thickness of each of the internal electrodes at a reference point, which is a total of five internal electrode layers, two layers at the top and two layers at the bottom, based on a point where the center line of the length direction of the body and the center line of the thickness direction of the body meet, among the internal electrode layers extracted from an image obtained by scanning a cross section in the length and thickness direction (LT) cut at the center of the width direction of the body 110 using a scanning electron microscope (SEM). The average thickness te of the internal electrodes 121 and 122 may be calculated by measuring the thickness of each of the internal electrodes at a reference point, which is a point where the center line of the length direction of the body and the center line of the thickness direction of the body meet. The average thickness te of the internal electrodes 121 and 122 may be calculated by measuring the thickness of each of the internal electrodes at a reference point, which is a total of five internal electrode layers, two layers at the top and two layers at the bottom, based on a point where the center line of the length direction of the body and the center line of the thickness direction of the body meet.

[0038] The body 110 may include a main portion M which is a region in which the dielectric layers 111 and the internal electrodes 121, 122 are alternately arranged in a first direction. The main portion M may be formed by repeatedly stacking a plurality of first internal electrodes 121 and second internal electrodes 122 with the dielectric layers 111 interposed therebetween.

[0039] Meanwhile, the main portion M can be divided into a capacitance forming portion, which is an area where the first internal electrode 121 and the second internal electrode 122 overlap in the first direction, and a longitudinal margin portion, which is an area where the first internal electrode 121 does not overlap the second internal electrode 122 in the first direction.

[0040] 5, covers C1 and C2 may be disposed on one side and the other side in the first direction of the main part M. The covers may include a first cover part C1 disposed on one side in the first direction of the main part M and a second cover part C2 disposed on the other side in the first direction of the main part M.

[0041] The covers C1 and C2 can prevent damage to the internal electrodes due to physical or chemical stress, and can also improve the strength of the multilayer electronic component 100.

[0042] The cover parts C1 and C2 do not include the first internal electrode 121 and the second internal electrode 122, and may include the same material as the dielectric layer 111, and may be formed by laminating a single dielectric layer or two or more dielectric layers in the thickness direction on the upper and lower surfaces of the main part M, respectively. However, the components of the cover parts are not limited to the same components as the dielectric layer 111 of the main part M, and may include components different from the dielectric layer 111 of the main part M.

[0043] The cover parts C1 and C2 do not include the first internal electrode 121 and the second internal electrode 122, but may include cover electrodes 121' and 122' having a larger average size in the second direction than the first internal electrode and the second internal electrode. The cover electrodes 121' and 122' will be described in detail later.

[0044] The average thickness tc of the covers C1 and C2 is not particularly limited. In order to achieve a smaller size and higher capacity of the multilayer electronic component, the average thickness of the covers C1 and C2 may be 15 μm or less.

[0045] The average thickness of the cover parts C1 and C2 may mean the size in the first direction, and may be the average value of the sizes in the first direction of the cover parts C1 and C2 measured at five equally spaced points on the upper or lower part of the main part M.

[0046] Referring to FIG. 5, margin portions 114 and 115 may be disposed on one and other surfaces of the main portion M in the third direction.

[0047] The margin portions 114, 115 include a margin portion 114 disposed on one surface in the third direction of the main portion M, and a margin portion 115 disposed on the other surface. That is, the margin portions 114, 115 may be disposed on both sides in the width direction of the main portion.

[0048] The margins 114 and 115 may refer to regions between both ends of the internal electrodes 121 and 122 and the boundary surface of the body 110 in a cross section of the body 110 cut in the width-thickness (WT) direction, as shown in FIG.

[0049] The margins 114 and 115 essentially serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0050] The margin portions 114 and 115 may be formed by applying a conductive paste to the ceramic green sheet except for the areas where the margin portions are to be formed, to form internal electrodes.

[0051] In addition, in order to suppress steps caused by the internal electrodes 121, 122, after lamination, the internal electrodes can be cut so as to be exposed on the fifth surface 5 and the sixth surface 6 of the main body, and then a single dielectric layer or two or more dielectric layers can be laminated in the width direction on both side surfaces of the main portion M to form margin portions 114, 115.

[0052] On the other hand, there is no need to particularly limit the width of the marginal portions 114, 115. However, in order to more easily achieve a smaller size and higher capacity of the multilayer electronic component, the average width of the marginal portions 114, 115 can be 15 μm or less.

[0053] The average width of the margin portions 114, 115 may mean the average size of the margin portions 114, 115 in the third direction, and may be the average value of the sizes of the margin portions 114, 115 in the third direction measured at five equally spaced points on the side of the main portion M.

[0054] 1 to 3, external electrodes 130 and 140 are disposed on a body 110. As shown in FIG.

[0055] Specifically, when a direction perpendicular to the first direction is defined as a second direction, the external electrodes 130 and 140 may be disposed on one and other surfaces 3 and 4 of the body 110 facing each other in the second direction.

[0056] In this case, the external electrode 130 may include a first external electrode 130 arranged on one surface 3 facing the second direction of the body 110 and connected to the first internal electrode 121, and a second external electrode 140 arranged on the other surface 3 facing the second direction of the body 110 and connected to the second internal electrode 121.

[0057] As shown in Figures 1 to 3, the external electrodes 130, 140 are respectively arranged on a third surface 3 and a fourth surface 4, which are one surface and the other surface facing each other in the second direction of the body 110, and may include a first external electrode 130 connected to the first internal electrode 121 and a second external electrode 140 connected to the second internal electrode 122.

[0058] In this embodiment, the ceramic electronic component 100 has a structure including two external electrodes 130, 140, but the number and shape of the external electrodes may be changed according to the shape of the internal electrodes 121, 122 and other purposes.

[0059] Meanwhile, the external electrodes 130 and 140 may be formed using any material having electrical conductivity, such as a metal, and the specific material may be determined taking into consideration electrical characteristics, structural stability, etc., and may further have a multi-layer structure.

[0060] For example, the external electrodes 130, 140 may include an electrode layer disposed on the body 110 and a plating layer formed on the electrode layer.

[0061] More specifically, the electrode layer may be a fired electrode including a conductive metal and glass, or a resin-based electrode including a conductive metal and resin.

[0062] Also, the electrode layer may be in a form in which a fired electrode and a resin-based electrode are sequentially formed on the body 110. Also, the electrode layer may be formed by transferring a sheet including a conductive metal onto the body 110, or by transferring a sheet including a conductive metal onto the fired electrode.

[0063] The conductive metal contained in the electrode layer may be any material having excellent electrical conductivity, and is not particularly limited. For example, the conductive metal may be one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0064] The plating layer may be a plating layer containing at least one of nickel (Ni), tin (Sn), palladium (Pd) and an alloy thereof, and may be formed of a plurality of layers.

[0065] More specifically, the plating layer may be a Ni plating layer or a Sn plating layer, and may be a form in which a Ni plating layer and a Sn plating layer are sequentially formed on an electrode layer, or a form in which a Sn plating layer, a Ni plating layer and a Sn plating layer are sequentially formed. Also, the plating layer may include a plurality of Ni plating layers and / or a plurality of Sn plating layers.

[0066] There is no need to particularly limit the size of the multilayer electronic components 100, 100'.

[0067] In order to simultaneously achieve miniaturization and high capacity, the multilayer electronic components 100, 100' may have a size of 0201 (length x width = 0.2 mm x 0.1 mm) or less, and in the case of products in which reliability in high temperature and high pressure environments is important, may have a size of 3225 (length x width = 3.2 mm x 2.5 mm) or more, but are not limited thereto.

[0068] Here, the length of the multilayer electronic component 100 may refer to the maximum size of the multilayer electronic component 100 in a second direction, and the width of the multilayer electronic component 100 may refer to the maximum size of the multilayer electronic component in a third direction.

[0069] Referring to FIG. 7 which shows a mounting substrate 1100 on which the multilayer electronic components 100, 100' are mounted, and FIG. 8a and FIG. 8b which show a cross section along line III-III' in FIG. 7 according to an embodiment, the multilayer electronic components 100, 100' can be bonded to electrode pads 181, 182 arranged on a substrate 180 by solders 191, 192.

[0070] Referring to Fig. 8a, the electrode layer 122' may be disposed closest to the substrate 180, and referring to Fig. 8b, the second electrode layer 122' may be disposed closest to the substrate 180. In the case of a multilayer electronic component 100' according to still another embodiment shown in Fig. 8b, the effects of the present invention described below can be achieved regardless of the mounting direction.

[0071] In the following, a multilayer electronic component 100 according to one embodiment of the present invention and a multilayer electronic component 100' according to yet another embodiment will be described in detail separately.

[0072] Referring to FIG. 2, a body 110 of a multilayer electronic component 100 according to an embodiment of the present invention includes a main part M in which first internal electrodes 121 and second internal electrodes 122 are alternately arranged in a first direction, a first cover part C1 arranged on one side of the main part in the first direction, and a second cover part C2 arranged on the other side of the main part in the first direction, and one of the first cover part and the second cover part may include a cover electrode 122' having an average size in the second direction larger than that of the first internal electrodes and the second internal electrodes.

[0073] In this case, the cover electrode may be disposed adjacent to one or the other surface in the first direction of the main part rather than a third surface 3 or a fourth surface 4 which faces the body in the first direction.

[0074] Referring to FIG. 4, which is an enlarged view of region P in FIG. 2, the cover electrode 122' may extend a certain distance S from a straight line connecting the ends of the internal electrodes 121 and 122.

[0075] The inductance L of a conductor having a rectangular parallelepiped shape with length l (mm), width w (mm), and thickness t (mm) can be written as follows:

number

[0076] That is, it can be seen that the inductance L of a conductor having a rectangular parallelepiped shape changes more rapidly with changes in length than with changes in width or thickness.

[0077] Therefore, when a voltage having a high frequency equal to or higher than the resonant frequency is applied to the multilayer electronic component, a current flows along the bottom layer in the stacking direction, which has the shortest current path, and the inductance on that path can act as the impedance of the multilayer electronic component.

[0078] Therefore, in one embodiment of the present invention, the body 110 includes a cover electrode 122' in which one of the first cover portion and the second cover portion has an average size in the second direction larger than that of the first internal electrode and the second internal electrode, and the cover electrode is disposed adjacent to one side or the other side of the main part in the first direction rather than the side facing the first direction of the body, thereby forming a shortened current path and reducing the equivalent series inductance (ESL) of the multilayer electronic component.

[0079] Specifically, in the comparative example in which the size of the cover electrode 122' in the second direction is not larger than the average size in the second direction of the internal electrodes 121, 122, current flows along the current path C' shown in FIG. 9a, whereas in the embodiment in which the size of the cover electrode 122' in the second direction is adjusted to be larger than the average size in the second direction of the internal electrodes 121, 122, current can flow along the current path C shown in FIG. 9b.

[0080] When a high-frequency voltage equal to or higher than the resonant frequency is applied to the multilayer electronic component of the comparative example, the current path C' includes the bottom layer of the internal electrodes, but does not pass through the entire bottom layer; rather, some sections pass through the bottom layer of the internal electrodes, and some sections form a path that passes through the internal electrodes of the adjacent upper layers.

[0081] On the other hand, when a high-frequency voltage equal to or higher than the resonant frequency is applied to the multilayer electronic component according to the embodiment, the current path C' corresponds to a path that passes through the entire cover electrode. Therefore, in the case of the multilayer electronic component according to the embodiment, the current path is made shorter than in the case of the multilayer electronic component according to the comparative example, and thus the equivalent series inductance of the multilayer electronic component can be reduced.

[0082] Meanwhile, the material for forming the cover electrode 122 ′ is not particularly limited, and may include the same conductive metal as the internal electrodes 121 and 122 , and may be formed by the same method as the method for forming the internal electrodes 121 and 122 .

[0083] Meanwhile, in an embodiment, the cover electrode 122′ may be connected to only one of the first external electrode 130 and the second external electrode 140. This can effectively reduce the number of current paths in the multilayer electronic component 100.

[0084] Meanwhile, there may be a plurality of internal electrodes 121, 122, and it is preferable that the sizes of the internal electrodes 121, 122 in the second direction are substantially the same. Specifically, the deviation in size between the plurality of internal electrodes 121, 122 in the second direction may be 10% or less, and it is more preferable that the deviation in size between the plurality of internal electrodes 121, 122 in the second direction is 5% or less.

[0085] On the other hand, in order to effectively form the above-described shortened current path, the size of the cover electrode 122' in the second direction can be appropriately adjusted. Referring to FIG. 4, the size in the second direction in which the cover electrode 122' and the external electrode 130 are separated can be denoted as D, and the average thickness of the dielectric layer can be denoted as td. When D < td, dielectric breakdown may occur at a voltage lower than the breakdown voltage of the dielectric layer 111 between the internal electrodes 121 and 122. When D ≥ 2×td is satisfied, the effect of shortening the current path for the multilayer electronic component according to the comparative example may be slight. Therefore, in one embodiment, by adjusting to satisfy td ≤ D < 2×td, the equivalent series inductance (ESL) of the multilayer electronic component 100 can be decreased, and a decrease in breakdown voltage can be prevented.

[0086] On the other hand, when the average thickness of the cover electrode 122' is smaller than the average thickness te of the internal electrode, the effect of decreasing the equivalent series inductance (ESL) may be insufficient. Therefore, in one embodiment, the average thickness of the cover electrode 122' can be equal to or greater than the average thickness of the internal electrodes 121 and 122. On the other hand, the upper limit value of the average thickness of the cover electrode 122' is not particularly limited and can vary according to the required characteristics of the multilayer electronic component 100.

[0087] On the other hand, the effect of decreasing the equivalent series inductance (ESL) obtained by including the cover electrode 122' as in one embodiment of the present invention in the main body 110 can be improved as the dielectric layer 111 is thicker. Specifically, the average thickness td of the dielectric layer 111 can be 2 μm or more, and thereby the effect of decreasing the equivalent series inductance (ESL) of the present invention can be further improved. The upper limit value of the average thickness td of the dielectric layer 111 is not particularly limited and can vary depending on the size of the multilayer electronic component 100.

[0088] Meanwhile, the effect of reducing the equivalent series inductance (ESL) obtained by including the cover electrode 122' in the body as in one embodiment of the present invention can be more significant when the multilayer electronic component 100 has a reverse geometry capacitor (RGC) structure. Specifically, as shown in Fig. 10, when the maximum size W in the third direction of the multilayer electronic component 100'' is greater than the maximum size L in the second direction, the current path can be significantly reduced.

[0089] Meanwhile, the effect of reducing the equivalent series inductance (ESL) obtained by including the cover electrode 122' in the main body as in one embodiment of the present invention may be more significant when the size of the multilayer electronic component 100 is small. Specifically, when the multilayer electronic component 100 is 1005 size or less, the effect of shortening the current path may be further improved. Here, the 1005 size may refer to a case where length×width=1.0 mm×0.5 mm, or a case where the maximum size L in the second direction×the maximum size W in the third direction=1.0 mm×0.5 mm.

[0090] Referring to FIG. 3, the body 110 of a multilayer electronic component 100′ according to another embodiment of the present invention may include a first internal electrode 121 and a second internal electrode 122, and the external electrodes 130, 140 arranged on the body may include a first external electrode 130 connected to the first internal electrode 121 and a second external electrode connected to the second internal electrode 122.

[0091] At this time, the body 110 includes a main part M in which the first internal electrodes and the second internal electrodes are alternately arranged in the first direction, a first cover part C1 arranged on one side of the main part in the first direction, and a second cover part C2 arranged on the other side of the main part in the first direction, the first cover part includes a first cover electrode 121' having an average size in the second direction larger than the first internal electrodes and the second internal electrodes, and the second cover part includes a second cover electrode 122' having an average size in the second direction larger than the first internal electrodes and the second internal electrodes. As a result, a shortened current path is formed, thereby reducing the equivalent series inductance (ESL) of the multilayer electronic component, and reducing the equivalent series inductance (ESL) regardless of the mounting direction.

[0092] Meanwhile, in one embodiment, the first cover electrode 121' may be connected to the first external electrode 130 and spaced apart from the second external electrode 140, and the second cover electrode 122' may be connected to the second external electrode 140 and spaced apart from the first external electrode 130. This makes it possible to effectively shorten the current path of the multilayer electronic component 100'.

[0093] 4, which is an enlarged view of region P in FIG. 3, the second cover electrode 122' may have a shape extending a certain distance S from a straight line connecting ends of the second internal electrodes 122'. Although the shape of the second cover electrode 122' is shown in FIG. 3, the first cover electrode 121' may also have a shape extending a certain distance S from a straight line connecting ends of the first internal electrodes 121.

[0094] Meanwhile, the first internal electrodes 121 and the second internal electrodes 122 may each be a plurality of electrodes, and it is preferable that the sizes in the second direction of the plurality of first internal electrodes 121 and the plurality of second internal electrodes 122 are substantially the same. Specifically, the deviation in the sizes in the second direction of the plurality of first internal electrodes 121 and the plurality of second internal electrodes 122 may be 10% or less, and it is more preferable that the deviation in the sizes in the second direction of the plurality of first internal electrodes 121 and the plurality of second internal electrodes 122 is 5% or less.

[0095] On the other hand, in order to effectively form the above-described shortened current path, the size of the second cover electrode 122' in the second direction can be appropriately adjusted. Referring to FIG. 4, the size in the second direction in which the second cover electrode 122' and the first external electrode 130 are separated can be defined as D, and the average thickness of the dielectric layer can be defined as td. When D < td, dielectric breakdown may occur at a voltage lower than the breakdown voltage of the dielectric layer 111 between the internal electrodes 121 and 122. When D ≥ 2×td is satisfied, the effect of shortening the current path for the multilayer electronic component according to the comparative example may be slight. Therefore, in one embodiment, by adjusting so as to satisfy td ≤ D < 2×td, the equivalent series inductance (ESL) of the multilayer electronic component 100' can be reduced, and a decrease in breakdown voltage can be prevented.

[0096] On the other hand, when the average thickness of the first cover electrode 121' or the second cover electrode 122' is smaller than the average thickness te of the internal electrode, the effect of reducing the equivalent series inductance (ESL) may be insufficient. Therefore, in one embodiment, the average thickness of the first cover electrode 121' or the second cover electrode 122' can be equal to or greater than the average thickness of the first internal electrode 121 and the second internal electrodes 121 and 122. On the other hand, the upper limit value of the average thickness of the first cover electrode 121' and the second cover electrode 122' is not particularly limited and can vary according to the required characteristics of the multilayer electronic component 100'.

[0097] On the other hand, the effect of reducing the equivalent series inductance (ESL) obtained by including the first cover electrode 121' and the second cover electrode 122' in the main body 110 as in still another embodiment of the present invention can be improved as the dielectric layer 111 is thicker. Specifically, the average thickness td of the dielectric layer 111 can be 2 μm or more, whereby the reduction in the equivalent series inductance (ESL) of the present invention can be further improved. The upper limit value of the average thickness td of the dielectric layer 111 is not particularly limited and can vary depending on the size of the multilayer electronic component 100'.

[0098] Meanwhile, the effect of reducing the equivalent series inductance (ESL) obtained by including the first cover electrode 121' and the second cover electrode 122' in the body as in one embodiment of the present invention can be more significant when the multilayer electronic component 100' has a reverse geometry capacitor (RGC) structure. Specifically, as shown in Fig. 10, when the maximum size W in the third direction of the multilayer electronic component 100'' is larger than the maximum size L in the second direction, the current path can be significantly reduced.

[0099] Meanwhile, the effect of reducing the equivalent series inductance (ESL) obtained by including the first cover electrode 121' and the second cover electrode 122' in the body 110 as in an embodiment of the present invention may be more significant when the size of the multilayer electronic component 100' is small. Specifically, when the multilayer electronic component 100' is 1005 size or less, the effect of shortening the current path may be further improved. Here, the 1005 size may refer to a case where the length x width = 1.0 mm x 0.5 mm, or a case where the maximum size L in the second direction x the maximum size W in the third direction = 1.0 mm x 0.5 mm.

[0100] Meanwhile, an example of a method for measuring the size in the second direction of the first cover electrode 121' and the second cover electrode 122' and the average size in the second direction of the internal electrodes 121, 122 is to measure an image obtained by scanning a cross section in the length and thickness direction (LT) cut at the center of the width direction of the body 110 using a scanning electron microscope (SEM).

[0101] Specifically, in the case of the first cover electrode 121' and the second cover electrode 122', the size in the second direction of the area where the cover electrodes 121', 122' are formed in the cross section can be measured, and in the case of the internal electrodes 121, 122, five points, two on the upper side and two on the lower side, are determined at equal intervals based on the point where the center line of the length direction of the body and the center line of the thickness direction of the body meet, and the size in the second direction at each point is measured to calculate an average value.

[0102] Meanwhile, the average thickness of the first cover electrode 121 ′ and the second cover electrode 122 ′ can be measured in the same manner as the average thickness of the internal electrodes 121 and 122 .

[0103] FIG. 11 is a cross-sectional view of a multilayer electronic component 100-1 according to one embodiment taken along a first direction and a second direction.

[0104] 11, one of the first cover part C1 and the second cover part C2 including the cover electrode 122' of the multilayer electronic component 100-1 according to the embodiment may further include one or more additional cover electrodes 122'' disposed outwardly in the first direction from the cover electrode 122'. The additional cover electrode 122'' is disposed outwardly in the first direction from the cover electrode 122' in the cover part C2 including the cover electrode 122' and may serve to improve the strength of the multilayer electronic component 100-1 and improve the moisture resistance reliability.

[0105] In this case, in one embodiment, the cover electrode may be connected to only one of the first external electrode and the second external electrode, and the additional cover electrode may be connected to only the same external electrode as the external electrode to which the cover electrode is connected.

[0106] FIG. 11 shows a second additional cover electrode 122'' arranged outward in the first direction from the second cover electrode 122' when the second cover part C2 includes the second cover electrode 122'. However, when the first cover part C1 includes the first cover electrode 121', the first cover part C1 may further include a first additional cover electrode 121'' arranged outward in the first direction from the first cover electrode 121'.

[0107] The number of the additional cover electrodes 122'' may be one or more. As the number of the additional cover electrodes 122'' increases, the effect of improving the strength and moisture resistance reliability of the multilayer electronic component 100-1 can be further improved.

[0108] There is no need to particularly limit the upper limit of the number of the additional cover electrodes 122'', and the upper limit of the number of the additional cover electrodes 122'' can be determined according to the thickness or design specifications of the cover part C2.

[0109] FIG. 12 is a cross-sectional view of a multilayer electronic component 100'-1 according to one embodiment taken along a first direction and a second direction.

[0110] 12, the first cover part C1 of the multilayer electronic component 100'-1 according to the embodiment may further include a first additional cover electrode 121'' disposed outward in the first direction than the first cover electrode 121', and the second cover part C2 may further include a second additional cover electrode 122' disposed outward in the first direction than the second cover electrode 122'. The first additional cover electrode 121'' and the second additional cover electrode 122'' are disposed outward in the first direction than the first cover electrode 121' and the second cover electrode 122', and may serve to improve the strength and moisture resistance reliability of the multilayer electronic component 100'-1.

[0111] In this case, in one embodiment, the cover electrode may be connected to only one of the first external electrode and the second external electrode, and the additional cover electrode may be connected to only the same external electrode as the external electrode to which the cover electrode is connected.

[0112] The number of the first additional cover electrodes 121'' and the second additional cover electrodes 122'' may be one or more. As the number of the first additional cover electrodes 121'' and the second additional cover electrodes 122'' increases, the effect of improving the strength and moisture resistance reliability of the multilayer electronic component 100'-1 can be further improved.

[0113] There is no need to specifically limit the upper limit of the number of the first additional cover electrodes 121'' and the second additional cover electrodes 122'', and the upper limit of the number of the first additional cover electrodes 121'' and the second additional cover electrodes 122'' can be determined according to the thickness or design specifications of the first cover part C1 and the second cover part C2.

[0114] (Experimental Example) Table 1 shows the results of calculations of the effect of shortening the current path depending on the size of the multilayer electronic component 100, assuming that the average thickness of the dielectric layers is 5 μm.

[0115] The shortening of the current path was calculated by comparing the comparative example path shown in FIG. 9a with the path shown in FIG. 9b.

[0116] [Table 1]

[0117] Referring to Table 1, it can be seen that the smaller the size of the multilayer electronic component is and the smaller the maximum dimension L in the second direction is, the greater the path shortening efficiency is.

[0118] As a result, when the maximum dimension W in the third direction of the multilayer electronic components 100, 100' is adjusted to be greater than the maximum dimension L in the second direction, the effect of shortening the current path obtained by introducing the cover electrodes 121', 122' can be further improved.

[0119] Although the embodiments of the present invention have been described in detail above, the present invention is not limited to the above-described embodiments and the accompanying drawings, but is limited by the scope of the accompanying claims. Therefore, various substitutions, modifications, and changes can be made by a person having ordinary knowledge in the art within the scope of the technical idea of ​​the present invention described in the claims, and these also belong to the scope of the present invention.

[0120] In addition, the expression "one embodiment" used in the present disclosure does not mean the same embodiment, but is provided to emphasize and describe each unique feature that is different from the others. However, the above-mentioned one embodiment does not exclude being realized in combination with the features of another embodiment. For example, even if a matter described in a specific embodiment is not described in another embodiment, it can be understood as a description related to the other embodiment, unless there is a description that is opposite or contradictory to the matter in the other embodiment.

[0121] The terms used in the present disclosure are merely used to describe one embodiment and are not intended to limit the present disclosure. In this case, a singular expression includes a plural expression unless the context clearly indicates otherwise. [Explanation of symbols]

[0122] 100, 100', 100'' Multilayer Electronic Components 110 Main unit 111 Dielectric layer M Main section C1, C2 cover 114, 115 Margin 121, 122 Internal electrode 121', 122' Cover electrodes 130, 140 external electrode 1100 Mounting Board

Claims

1. a body including a dielectric layer, and a first internal electrode and a second internal electrode alternately arranged with the dielectric layer in a first direction; a first external electrode and a second external electrode disposed on a surface of the body facing each other in a second direction perpendicular to the first direction, the body includes a main part in which the first internal electrodes and the second internal electrodes are alternately arranged in the first direction, a first cover part arranged on one side of the main part in the first direction, and a second cover part arranged on the other side of the main part in the first direction, one of the first cover portion and the second cover portion includes a cover electrode having an average size in the second direction larger than the first internal electrode and the second internal electrode; The cover electrode is disposed adjacent to one or the other surface of the main portion in the first direction rather than a surface of the body facing in the first direction.

2. 2 . The multilayer electronic component of claim 1 , wherein one of the first cover part and the second cover part including the cover electrode further includes one or more additional cover electrodes disposed outwardly of the cover electrode in the first direction.

3. the cover electrode is connected to only one of the first external electrode and the second external electrode, The multilayer electronic component according to claim 2 , wherein the additional cover electrode is connected only to the same external electrode as the external electrode to which the cover electrode is connected.

4. 2. The multilayer electronic component according to claim 1, wherein the first internal electrodes and the second internal electrodes are each a plurality of electrodes, and the deviation in size between the first internal electrodes and the second internal electrodes in the second direction is 10% or less.

5. When the distance between the cover electrode and the external electrode in the second direction is D and the average thickness of the dielectric layer is td, 2. The multilayer electronic component according to claim 1, wherein td≦D<2×td is satisfied.

6. 2. The multilayer electronic component according to claim 1, wherein an average thickness of said cover electrodes is equal to or greater than an average thickness of said internal electrodes.

7. When a direction perpendicular to the first direction and the second direction is defined as a third direction, The multilayer electronic component according to claim 1 , wherein a maximum size of the multilayer electronic component in the third direction is greater than a maximum size of the multilayer electronic component in the second direction.

8. The multilayer electronic component according to claim 1 , wherein the multilayer electronic component is equal to or smaller than 1005 size.

9. a body including a dielectric layer, and a first internal electrode and a second internal electrode alternately arranged with the dielectric layer in a first direction; a first external electrode disposed on a surface of the body facing a second direction perpendicular to the first direction and connected to the first internal electrode; a second external electrode disposed on another surface of the body facing the second direction and connected to the second internal electrode, the body includes a main part in which the first internal electrodes and the second internal electrodes are alternately arranged in the first direction, a first cover part arranged on one side of the main part in the first direction, and a second cover part arranged on the other side of the main part in the first direction, the first cover portion includes a first cover electrode having an average size in the second direction larger than the first internal electrode and the second internal electrode, and the second cover portion includes a second cover electrode having an average size in the second direction larger than the first internal electrode and the second internal electrode.

10. 10. The multilayer electronic component according to claim 9, wherein the first cover portion further includes one or more first additional cover electrodes arranged outward in the first direction from the first cover electrode, and the second cover portion further includes one or more second additional cover electrodes arranged outward in the first direction from the second cover electrode.

11. 11. The multilayer electronic component according to claim 10, wherein the first cover electrode and the first additional cover electrode are connected to the first external electrode and spaced apart from the second external electrode, and the second cover electrode and the second additional cover electrode are connected to the second external electrode and spaced apart from the first external electrode.

12. 10. The multilayer electronic component according to claim 9, wherein the first internal electrodes and the second internal electrodes are each a plurality of electrodes, and a deviation in size of the plurality of first internal electrodes and the plurality of second internal electrodes in the second direction is 10% or less.

13. When the distance between the second cover electrode and the first external electrode in the second direction is D and the average thickness of the dielectric layer is td, The multilayer electronic component according to claim 9 , wherein td≦D<2×td is satisfied.

14. 10. The multilayer electronic component according to claim 9, wherein an average thickness of the first cover electrode or the second cover electrode is equal to or greater than an average thickness of the internal electrodes.

15. When a direction perpendicular to the first direction and the second direction is defined as a third direction, 15. The multilayer electronic component according to claim 9, wherein a maximum size of the multilayer electronic component in the third direction is greater than a maximum size of the multilayer electronic component in the second direction.

16. The multilayer electronic component according to claim 9 , wherein the multilayer electronic component is equal to or smaller than 1005 size.

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