Processing device

Abstract

To provide a processing device capable of preventing cutting chips from being fixed to a cover.SOLUTION: A processing device 1 includes a first cutting unit 20-1 for cutting workpiece held on a holding unit 10, a second cutting unit 20-2 for cutting the workpiece held on the holding unit 10, a processing chamber 30 for storing the holding unit 10, the first cutting unit 20-1 and the second cutting unit 20-2, and a bellows cover 62 which is extensible and contractable in a Y-axis direction between the first cutting unit 20-1 and the second cutting unit 20-2 arranged in the ceiling part of the processing chamber 30, wherein the processing chamber 30 has an opening for permitting access into the processing chamber 30 formed on one end in an X-axis direction perpendicular to the Y-axis direction, and the bellows cover 62 is inclined downward toward the inner side of the processing chamber 30 from the opening side in the X-axis direction.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present invention relates to a processing device. [Background technology]

[0002] A cutting device having two cutting units each having a cutting blade and arranged facing each other is widely used, and a bellows cover (see, for example, Patent Document 1) or a cover made of a curled sheet material (see, for example, Patent Document 2) is arranged between the two cutting units. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2014-143294 A [Patent Document 2] JP 2002-28073 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, the covers shown in Patent Documents 1 and 2 have a risk that when the waste liquid dries, cutting chips contained in the waste liquid will adhere to the cover and damage it, and therefore improvements are desired.

[0005] An object of the present invention is to provide a processing device that can suppress cutting chips from adhering to a cover. [Means for solving the problem]

[0006] In order to solve the above-mentioned problems and achieve the object, the processing apparatus of the present invention is a processing apparatus comprising a holding unit for holding a workpiece, a first processing unit for processing the workpiece held by the holding unit, a second processing unit for processing the workpiece held by the holding unit, the first processing unit and the second processing unit arranged facing each other in the Y-axis direction, a processing chamber accommodating the holding unit, the first processing unit and the second processing unit, and a cover arranged on the ceiling of the processing chamber and capable of expanding and contracting in the Y-axis direction between the first processing unit and the second processing unit, wherein an opening is formed in the processing chamber on one end side in the X-axis direction perpendicular to the Y-axis direction to allow access to the processing chamber, and the cover is inclined in a downward direction from the opening side toward the inside of the processing chamber in the X-axis direction.

[0007] In the processing device, the first processing unit may have a first spindle to the tip of which a first cutting blade for cutting the workpiece is removably fixed, and the second processing unit may have a second spindle to the tip of which a second cutting blade for cutting the workpiece is removably fixed. Effect of the Invention

[0008] The present invention has an effect of suppressing cutting chips from adhering to the cover. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a perspective view showing a configuration example of a processing device according to the first embodiment. [Diagram 2] FIG. 2 is a perspective view showing a schematic cutaway view of a wall member of the processing apparatus shown in FIG. [Diagram 3] FIG. 3 is a front view, partially in section, illustrating a main portion of the processing apparatus shown in FIG. [Figure 4] FIG. 4 is a side view, partially in section, typically showing a main part of the processing apparatus shown in FIG. [Diagram 5] FIG. 5 is a perspective view showing an example of the configuration of the cover unit shown in FIG. [Figure 6] FIG. 6 is a side view that typically illustrates a state in which the bellows cover of the cover unit illustrated in FIG. 5 is extended. [Figure 7] FIG. 7 is a side view that typically illustrates a state in which the bellows cover of the cover unit illustrated in FIG. 5 is contracted. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] The form (embodiment) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiment. Furthermore, the components described below include those that a person skilled in the art can easily imagine and those that are substantially the same. Furthermore, the configurations described below can be appropriately combined. Furthermore, various omissions, substitutions, or modifications of the configurations can be made without departing from the gist of the present invention.

[0011] [Embodiment 1] A processing device according to a first embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing an example of the configuration of the processing device according to the first embodiment. FIG. 2 is a perspective view showing a schematic cutaway view of a wall member of the processing device shown in FIG. 1. FIG. 3 is a front view showing a schematic partial cross-section of the main part of the processing device shown in FIG. 1. FIG. 4 is a side view showing a schematic partial cross-section of the main part of the processing device shown in FIG. 3.

[0012] (Workpiece) 1 and 2 according to the first embodiment is a cutting device that cuts a workpiece 200. In the first embodiment, the workpiece 200 to be processed by the processing device 1 is a wafer such as a disk-shaped semiconductor wafer or an optical device wafer, the substrate of which is silicon, sapphire, gallium arsenide, SiC (silicon carbide), or the like. The workpiece 200 has devices 203 formed in areas partitioned in a lattice pattern by a plurality of planned dividing lines 202 formed in a lattice pattern on a surface 201.

[0013] The device 203 is, for example, an integrated circuit such as an IC (Integrated Circuit) or an LSI (Large Scale Integration), an image sensor such as a CCD (Charge Coupled Device) or a CMOS (Complementary Metal Oxide Semiconductor), a MEMS (Micro Electro Mechanical Systems), various types of memories (semiconductor memory devices), an LED (Light Emitting Diode), or a power device.

[0014] The workpiece 200 has a disk-shaped adhesive tape 205, which is larger in diameter than the workpiece 200, attached to a back surface 204 behind the front surface 201, and an annular frame 206, which is annular, attached to the outer edge of the adhesive tape 205, and is supported within an opening of the annular frame 206. The workpiece 200 of the present invention may be a so-called TAIKO (registered trademark) wafer, which is thinned in the center and has a thick portion formed on the outer periphery, or may be a rectangular resin package substrate having a plurality of devices sealed with resin, a ceramic substrate, a ferrite substrate, a substrate containing at least one of nickel and iron, a glass substrate, or the like, in addition to the wafer.

[0015] (Processing equipment) 1 and 2 is a cutting device that holds a workpiece 200 in a holding unit 10, which is a holding means, and cuts (corresponding to processing) the workpiece 200 along a planned division line 202 with a cutting blade 21 to divide the workpiece 200 into individual devices 203. As shown in FIGS. 1 and 2, the processing device 1 includes the holding unit 10 that suction-holds the workpiece 200 on a holding surface 11, the cutting unit 20 that is a processing unit that cuts the workpiece 200 held by the holding unit 10 with the cutting blade 21, an imaging unit (not shown) that images the workpiece 200 held by the holding unit 10, and a control unit 100.

[0016] 2, the processing device 1 includes a moving unit 40 that moves the holding unit 10 and the cutting unit 20 relatively. The moving unit 40 includes at least an X-axis moving unit 41, which is a processing feed unit that processes and feeds the holding unit 10 in the X-axis direction parallel to the horizontal direction, a Y-axis moving unit 42, which is an indexing feed unit that indexes and feeds the cutting unit 20 in the Y-axis direction parallel to the horizontal direction and perpendicular to the X-axis direction, a Z-axis moving unit 43, which is a cutting feed unit that cuts and feeds the cutting unit 20 in the Z-axis direction parallel to the vertical direction perpendicular to both the X-axis and Y-axis directions, and a rotational moving unit 44 that rotates the holding unit 10 around an axis parallel to the Z-axis direction.

[0017] 2, the processing device 1 is equipped with two cutting units 20, i.e., a two-spindle dicer, a so-called facing dual type cutting device. The movement units 40 of the processing device 1 are equipped with two Y-axis movement units 42 and two Z-axis movement units 43, and the two Y-axis movement units 42 and the two Z-axis movement units 43 correspond to the cutting units 20, respectively.

[0018] The X-axis moving unit 41 is installed on the device body 2, and moves the holding unit 10 together with the rotation moving unit 44 in the X-axis direction, which is the processing feed direction, to relatively feed the holding unit 10 and the cutting unit 20 along the X-axis direction. The Y-axis moving unit 42 is installed on a gate-shaped support frame (not shown) standing upright from the device body 2, and moves the corresponding cutting unit 20 in the Y-axis direction, which is the indexing feed direction, to relatively index-feed the holding unit 10 and the cutting unit 20 along the Y-axis direction. The Z-axis moving unit 43 is installed on the moving frame 3 that is moved in the Y-axis direction by the Y-axis moving unit 42, and moves the corresponding cutting unit 20 in the Z-axis direction, which is the cutting feed direction, to relatively feed the holding unit 10 and the cutting unit 20 along the Z-axis direction.

[0019] The X-axis moving unit 41, the Y-axis moving unit 42 and the Z-axis moving unit 43 each include a well-known ball screw rotatably provided around its axis, a well-known motor for rotating the ball screw around its axis, and a well-known guide rail for supporting the holding unit 10 or the cutting unit 20 movably in the X-axis, Y-axis or Z-axis direction. The rotational movement unit 44 includes a well-known motor for rotating the holding unit 10 around its axis.

[0020] The holding unit 10 is disk-shaped, and a holding surface 11 for holding the workpiece 200 is formed from porous ceramics or the like. The holding unit 10 is provided so as to be movable in the X-axis direction by an X-axis moving unit 41 across a processing area 5 (shown in FIG. 3) below the cutting unit 20 and a carry-in / out area 6 spaced from below the cutting unit 20 for carrying in and out the workpiece 200, and is provided so as to be rotatable about an axis parallel to the Z-axis direction by a rotation moving unit 44.

[0021] The holding unit 10 has a holding surface 11 connected to a vacuum suction source (not shown), and is sucked by the vacuum suction source to suction and hold the workpiece 200 placed on the holding surface 11. In the first embodiment, the holding unit 10 suction-holds the back surface 204 of the workpiece 200 via an adhesive tape 205. In addition, a plurality of clamping parts 12 that clamp an annular frame 206 are provided around the periphery of the holding unit 10.

[0022] In the first embodiment, the machining area 5 is surrounded by a plurality of wall members 31 standing from the apparatus body 2 and a ceiling member 32 connected to the upper ends of the plurality of wall members 31. The plurality of wall members 31 and the ceiling member 32 configure a machining chamber 30 that houses the holding unit 10 and the cutting unit 20 positioned in the machining area 5. That is, the machining apparatus 1 is provided with the machining chamber 30.

[0023] As shown in FIG. 1, the processing chamber 30 has an opening 33 formed at one end side on the loading / unloading area 6 side in the X-axis direction. In the first embodiment, the opening 33 is provided in one wall member 31 and penetrates this one wall member 31. The opening 33 is provided above the movement path of the holding unit 10 that moves between the loading / unloading area 6 and the holding unit 10, and allows access to the inside of the processing chamber 30, i.e., the processing area 5, from the outside. An opening / closing door 34 is attached to the opening 33. The opening / closing door 34 closes and opens the opening 33. That is, the opening / closing door 34 opens and closes the opening 33.

[0024] The cutting units 20 are processing units to which a cutting blade 21 for cutting the workpiece 200 held by the holding unit 10 is detachably attached. The cutting units 20 are attached to a second moving frame 4 movable in the Z-axis direction by a corresponding Z-axis moving unit 43, and are provided movable in the Y-axis direction by a Y-axis moving unit 42 with respect to the workpiece 200 held by the holding unit 10, and are also provided movable in the Z-axis direction by the Z-axis moving unit 43. The cutting units 20 can position the cutting blade 21 at any position on the holding surface 11 of the holding unit 10 by the Y-axis moving unit 42 and the Z-axis moving unit 43.

[0025] As shown in FIG. 3, the cutting unit 20 includes a cutting blade 21, a spindle housing 22 attached to the lower end of the second moving frame 4 and movable in the Y-axis and Z-axis directions by a Y-axis moving unit 42 and a Z-axis moving unit 43, a spindle 23 serving as a rotating shaft mounted on the spindle housing 22 and rotatable about its axis, a spindle motor (not shown) that rotates the spindle 23 about its axis, and a supply nozzle 24 that supplies cutting water to the cutting blade 21 during cutting.

[0026] The cutting blade 21 is an extremely thin cutting grindstone having a substantially ring shape for cutting the workpiece 200. In the first embodiment, as shown in Figs. 3 and 4, the cutting blade 21 includes an annular cutting edge 211 for cutting the workpiece 200, and an annular base 212 for supporting the cutting edge 211 at its outer edge and detachably attached to the spindle 23. The cutting edge 211 is made of abrasive grains such as diamond or CBN (Cubic Boron Nitride) and a bond material such as metal or resin, and is formed to a predetermined thickness. In the present invention, the cutting blade 21 may be a so-called washer blade consisting of only the cutting edge 211.

[0027] The spindle housing 22 is attached to the lower end of the second moving frame 4, supported by the Z-axis moving unit 43 for movement in the Z-axis direction, and supported by the Y-axis moving unit 42 via the Z-axis moving unit 43 and the moving frame 3 for movement in the Y-axis direction. The spindle housing 22 accommodates a portion of the spindle 23 excluding the tip portion, as well as a spindle motor (not shown), and supports the spindle 23 for rotation around its axis.

[0028] The cutting blade 21 is removably fixed to the tip of the spindle 23. The spindle 23 is rotated by a spindle motor (not shown), and the tip protrudes from the tip surface of the spindle housing 22. The tip of the spindle 23 is gradually tapered toward the tip, and the cutting blade 21 is attached to it. The axes of the spindle 23 and the cutting blade 21 of the cutting unit 20 are parallel to the Y-axis direction.

[0029] The cutting unit 20 rotates the cutting blade 21 about its axis by the spindle 23 while supplying cutting water to the cutting blade 21 from a supply nozzle 24. The cutting unit 20 cuts the intended division lines 202 with the cutting blade 21 by causing the cutting edge 26 of the cutting blade 21 rotating about its axis to cut into the adhesive tape 205 until it reaches the adhesive tape 205, thereby dividing the workpiece 200 into individual devices 203. At this time, the cutting water collides with the cutting blade 21 rotating about its axis and the workpiece 200 during cutting, and is sprayed inside the processing chamber 30.

[0030] In the following, one of the two cutting units 20 will be referred to as a first cutting unit 20-1 (corresponding to a first processing unit), and the other will be referred to as a second cutting unit 20-2 (corresponding to a second processing unit). For this reason, the first cutting unit 20-1 and the second cutting unit 20-2 are disposed facing each other in the Y-axis direction. The cutting blade 21 of the first cutting unit 20-1 corresponds to a first cutting blade, and the spindle 23 corresponds to a first spindle. The cutting blade 21 of the second cutting unit 20-2 corresponds to a second cutting blade, and the spindle 23 corresponds to a second spindle.

[0031] The imaging unit images the workpiece 200 held by the holding unit 10 and acquires the captured image. The imaging unit is fixed to one of the cutting units 20-1 and 20-2 so as to move integrally with one of the cutting units 20-1 and 20-2. The imaging unit includes an imaging element that images an area to be cut of the workpiece 200 held by the holding unit 10 before cutting. The imaging element is, for example, a CCD (Charge-Coupled Device) imaging element or a CMOS (Complementary MOS) imaging element. The imaging unit images the workpiece 200 held by the holding unit 10 and acquires an image for performing alignment to align the workpiece 200 with the cutting blade 21, and outputs the acquired image to the control unit 100.

[0032] The processing device 1 also includes an X-axis position detection unit (not shown) for detecting the position of the holding unit 10 in the X-axis direction, a Y-axis position detection unit (not shown) for detecting the positions of the cutting units 20-1 and 20-2 in the Y-axis direction, and a Z-axis position detection unit for detecting the positions of the cutting units 20-1 and 20-2 in the Z-axis direction. The X-axis position detection unit and the Y-axis position detection unit can be configured with a linear scale parallel to the X-axis direction or the Y-axis direction, and a read head. The Z-axis position detection unit detects the positions of the cutting units 20-1 and 20-2 in the Z-axis direction using motor pulses.

[0033] The X-axis position detection unit, the Y-axis position detection unit, and the Z-axis position detection unit output the positions of the holding unit 10 in the X-axis direction and the Y-axis or Z-axis directions of the cutting units 20-1, 20-2 to the control unit 100. The angle detection unit outputs the angle from a reference position around the axis of the holding unit 10 to the control unit 100. In the first embodiment, the positions of each component of the processing device 1 in the X-axis direction, the Y-axis direction, and the Z-axis direction are determined based on a predetermined reference position (not shown).

[0034] The processing device 1 also includes a cassette elevator 50 for placing a cassette (not shown) containing the workpiece 200 before and after cutting and moving the cassette in the Z-axis direction, a cleaning unit 51 for cleaning the workpiece 200 after cutting, and a transport mechanism 52 (shown in FIG. 1). The cassette is a container capable of containing a plurality of workpieces 200 spaced apart in the Z-axis direction, and includes an inlet / outlet through which the workpieces 200 can be inserted and removed.

[0035] The cassette elevator 50 is positioned next to one side in the Y-axis direction of the holding unit 10 positioned in the loading / unloading area 6, and the cassette is placed on it with its loading / unloading opening positioned on the side of the holding unit 10 positioned in the loading / unloading area 6.

[0036] The cleaning unit 51 is positioned next to the other side of the holding unit 10 positioned in the loading / unloading area 6 in the Y-axis direction, and is positioned in line with the cassette and the holding unit 10 positioned in the loading / unloading area 6 in the Y-axis direction.

[0037] The transport mechanism 52 transports the workpiece 200 within the cassette, on the holding surface 11 of the holding unit 10, and through the cleaning unit 51. That is, the transport mechanism 52 transports the workpiece 200 between the cutting unit 20 and the cassette placed on the cassette elevator 50. The transport mechanism 52 includes a first transport unit 53 and a second transport unit 54.

[0038] The first transport unit 53 transports the workpiece 200 between inside the cassette and the holding surface 11 of the holding unit 10, and also transports it from the cleaning unit 51 to inside the cassette. The first transport unit 53 includes a clamping section 55 that clamps an annular frame 206 supporting the workpiece 200 and moves the workpiece 200 in and out of the cassette, and a suction section 56 that suctions the annular frame 206.

[0039] The second transport unit 54 transports the workpiece 200 from the holding surface 11 of the holding unit 10 to the cleaning unit 51. The second transport unit 54 includes a suction portion 57 that suctions the annular frame 206.

[0040] The control unit 100 also controls each component of the processing device 1 to cause the processing device 1 to perform a processing operation on the workpiece 200. The control unit 100 is a computer having an arithmetic processing device having a microprocessor such as a CPU (central processing unit), a storage device having a memory such as a ROM (read only memory) or a RAM (random access memory), and an input / output interface device. The arithmetic processing device of the control unit 100 performs arithmetic processing according to a computer program stored in the storage device, and outputs control signals for controlling the processing device 1 to each component of the processing device 1 via the input / output interface device.

[0041] The control unit 100 is connected to a display unit 110 configured with a liquid crystal display device or the like that displays the state of the machining operation and captured images, an input unit (not shown) that an operator uses to register machining conditions, and an alarm unit (not shown). The input unit is configured with at least one of a touch panel provided on the display unit 110 and an external input device such as a keyboard. The alarm unit emits at least one of sound and light to alarm the operator.

[0042] (Cover unit) The processing device 1 also includes a cover unit 60, as shown in Figs. 2, 3, and 4. Next, the cover unit 60 will be described. Fig. 5 is a perspective view showing a configuration example of the cover unit shown in Fig. 2. Fig. 6 is a side view typically showing a state in which the bellows cover of the cover unit shown in Fig. 5 is extended. Fig. 7 is a side view typically showing a state in which the bellows cover of the cover unit shown in Fig. 5 is contracted.

[0043] The cover unit 60 is disposed on the ceiling of the processing chamber 30 and between the first cutting unit 20-1 and the second cutting unit 20-2. The ceiling of the processing chamber 30 refers to the upper part of the holding unit 10 in the processing chamber 30, i.e., the holding unit 10 positioned in the processing area 5. The cover unit 60 covers the upper part of the holding unit 10 during cutting of the workpiece 200. As shown in FIG. 5, the cover unit 60 is formed in a rectangular planar shape. In the following description, the width direction of the cover unit 60 is indicated by the symbol XA, the longitudinal direction is indicated by the symbol YA, and the thickness direction is indicated by the symbol ZA.

[0044] As shown in FIG. 5, the cover unit 60 includes a pair of support rails 61 and a bellows cover 62 (corresponding to a cover). The support rails 61 extend along the longitudinal direction YA of the cover unit 60. The pair of support rails 61 support both ends of the bellows cover 62 in the width direction XA. Each of the support rails 61 includes a side portion 63 that abuts against the end of the bellows cover 62 in the width direction XA and stands in the thickness direction ZA, and a protruding portion 64 that stands from the lower end of the side portion 63 in a direction in which the pair of support rails 61 approach each other and supports both ends of the bellows cover 62 in the width direction XA from below. The protruding portion 64 on the back side of the processing chamber 30 has through holes (not shown) formed at both ends. The through holes promote dripping of waste liquid accumulated between the protruding portion 64 and the lower surface of the bellows cover 62, and by dripping from both ends, dripping of waste liquid is prevented from dripping onto the workpiece 200.

[0045] The bellows cover 62 is made of a resin such as polycarbonate, and is formed by alternately folding back peaks 65 and valleys 66 as shown in Figs. 6 and 7, forming an inclined surface 69 therebetween. The peaks 65 and valleys 66 are parallel to the width direction XA. The bellows cover 62 is stretchable in the longitudinal direction YA so that adjacent peaks 65 and adjacent valleys 66 approach and move away from each other. When the bellows cover 62 is expanded, the adjacent peaks 65 and adjacent valleys 66 move away from each other as shown in Fig. 6. When the bellows cover 62 is contracted, the adjacent peaks 65 and adjacent valleys 66 move toward each other as shown in Fig. 7.

[0046] The bellows cover 62 is provided with plate-shaped mounting portions 67, 68 at both ends in the longitudinal direction YA. The bellows cover 62 is attached, via the mounting portions 67, 68, to one of the second moving frames 4 to which the spindle housing 22 of the first cutting unit 20-1 is attached, and to the other of the second moving frames 4 to which the spindle housing 22 of the second cutting unit 20-2 is attached. The mounting positions of the mounting portions 67, 68 relative to the second moving frames 4 are located near the upper sides of the first cutting unit 20-1 and the second cutting unit 20-2.

[0047] One of the mounting portions 67 is fixed to a pair of support rails 61. The other mounting portion 68 is supported from below by the protruding portion 64 and is provided movable in the longitudinal direction YA of the bellows cover 62, i.e., in the direction in which the bellows cover 62 expands and contracts. Therefore, when the distance between the first cutting unit 20-1 and the second cutting unit 20-2 changes, the mounting portion 68 moves between the support rails 61 accordingly, and the bellows cover 62 expands and contracts.

[0048] As a result, even if the distance between the first cutting unit 20-1 and the second cutting unit 20-2 changes, the bellows cover 62 is kept covering the upper part of the holding unit 10, and the sprayed cutting water adheres to the lower surface of the bellows cover 62. Therefore, the bellows cover 62 of the cover unit 60 prevents the cutting water from adhering to the components disposed above the cutting units 20-1 and 20-2. In the present invention, the bellows cover 62 may have unevenness formed on both surfaces by embossing or the like.

[0049] The cover unit 60 configured in this manner is disposed between the second moving frame 4 having the cutting units 20-1 and 20-2 attached to its lower end with the longitudinal direction YA parallel to the Y-axis direction. For this reason, the bellows cover 62 of the cover unit 60 is disposed on the ceiling of the machining chamber 30 and is extendable and contractible in the Y-axis direction between the first cutting unit 20-1 and the second cutting unit 20-2.

[0050] In the first embodiment, the cover unit 60, i.e., the bellows cover 62, is disposed between the second moving frames 4 having the cutting units 20-1, 20-2 attached to the lower ends thereof in a state inclined downward from the opening 33 side toward the inside of the machining chamber 30 in the X-axis direction, as shown in Figs. 3 and 4. That is, the width direction XA of the cover unit 60 is disposed between the second moving frames 4 having the cutting units 20-1, 20-2 attached to the lower ends thereof in a state inclined with respect to the X-axis direction so as to gradually decline from the loading / unloading area 6 toward the machining area 5, i.e., toward the back of the machining area 5 away from the opening 33. That is, the peaks 65 and valleys 66 of the bellows cover 62 are inclined with respect to the X-axis direction so as to gradually decline from the loading / unloading area 6 toward the machining area 5, i.e., toward the back of the machining area 5 away from the opening 33.

[0051] Next, a description will be given of the processing operation of the processing device 1. In the processing device 1 having the above-mentioned configuration, a cassette containing a plurality of workpieces 200 is placed on the cassette elevator 50, and the control unit 100 receives and registers processing conditions input by an operator from an input unit or the like. When the control unit 100 receives a processing start instruction input by an operator from an input unit or the like, the processing device 1 starts the processing operation.

[0052] When the machining operation is started, the control unit 100 of the machining device 1 starts rotating the spindles 23 of the cutting units 20-1 and 20-2, i.e., the cutting blades 21, and starts supplying cutting water to the cutting blades 21. During the machining operation, the control unit 100 of the machining device 1 controls the cassette elevator 50 and the first transport unit 53, etc., to take out one workpiece 200 before cutting from the cassette and place it on the holding surface 11 of the holding unit 10 positioned in the carry-in / out area 6.

[0053] In the processing operation of the first embodiment, the control unit 100 of the processing device 1 sucks and holds the workpiece 200 on the holding surface 11 of the holding unit 10 positioned in the carry-in / out area 6 via the adhesive tape 205, and clamps the annular frame 206 with the clamp section 12. In the processing operation of the first embodiment, the control unit 100 of the processing device 1 controls the moving unit 40 to position the holding unit 10 holding the workpiece 200 in the processing area 5, and causes the imaging unit to image the workpiece 200 to perform alignment.

[0054] In the processing operation, the control unit 100 of the processing device 1 controls the moving unit 40 and the cutting unit 20 to relatively move the cutting unit 20 and the workpiece 200 along the division lines 202 while causing the cutting blade 21 to cut into the division lines 202 until it reaches the adhesive tape 205, and cuts the workpiece 200 along the division lines 202 to divide the workpiece 200 into individual devices 203. In the processing operation, when the control unit 100 cuts all the division lines 202 of the workpiece 200 held by the holding unit 10, the processing device 1 controls the moving unit 40 to position the holding unit 10 in the carry-in / out area 6, and causes the second conveying unit 54 to convey the workpiece 200 after cutting from the holding unit 10 to the cleaning unit 51, and after cleaning, causes the conveying mechanism 52 to store the workpiece 200 in a cassette.

[0055] During cutting, cutting water collides with the cutting blade 21 and the workpiece 200 and is sprayed inside the machining chamber 30, and the sprayed cutting water adheres to the underside of the bellows cover 62 of the cover unit 60. Since the width direction XA of the cover unit 60, i.e., the bellows cover 62, is inclined with respect to the X-axis direction as described above, the adhering cutting water drips down from the end of the bellows cover 62 on the far side of the machining chamber 30 along the lower end of the valley portion 66 of the bellows cover 62, and thus it is possible to prevent the cutting water from continuing to adhere to the bellows cover 62.

[0056] As described above, in the processing device 1 according to the first embodiment, the width direction XA of the bellows cover 62 of the cover unit 60 is inclined with respect to the X-axis direction, so that cutting water adhering to the bellows cover 62 is likely to drip from the bellows cover 62. Therefore, the processing device 1 according to the first embodiment can prevent cutting water from continuing to adhere to the bellows cover 62, and the adhering cutting water is likely to drip before it dries.

[0057] As a result, the processing device 1 according to the first embodiment can suppress cutting chips in the cutting water from adhering to the bellows cover, and an effect is achieved in that damage to the bellows cover 62 can be suppressed.

[0058] Furthermore, in the processing device 1 according to the first embodiment, the bellows cover 62 is inclined downward in the X-axis direction from the opening 33 side toward the inside of the processing chamber 30, so that cutting water can easily drip from the end of the bellows cover 62 on the far side of the processing chamber 30, and the opening 33 can be made large. Therefore, the processing device 1 can have a large opening 33, making it easier for an operator to work.

[0059] Furthermore, the processing device 1 according to the first embodiment can have a large opening 33, and the degree of freedom in design is improved when the cutting blade 21 is replaced by an exchange device that automatically replaces the cutting blade 21.

[0060] It should be noted that the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the gist of the present invention. [Explanation of symbols]

[0061] 1 Processing equipment 10 Holding Unit 20-1 First cutting unit (first processing unit) 20-2 Second cutting unit (second processing unit) 21 Cutting blade (first cutting blade, second cutting blade) 23 Spindle (First spindle, Second spindle) 30 Processing room 33 Aperture 62 Bellows cover (cover) 200 Workpiece

Claims

1. A processing device comprising: A holding unit for holding the workpiece; a first processing unit that processes the workpiece held by the holding unit; A second processing unit that processes the workpiece held by the holding unit; The first processing unit and the second processing unit are disposed facing each other in the Y-axis direction, a processing chamber that accommodates the holding unit, the first processing unit, and the second processing unit; a cover that is disposed on a ceiling portion of the processing chamber and is extendable and contractible in the Y-axis direction between the first processing unit and the second processing unit; An opening is formed in the processing chamber on one end side in an X-axis direction perpendicular to the Y-axis direction, allowing access to the inside of the processing chamber; The cover is inclined downward in the X-axis direction from the opening side toward the inside of the processing chamber.

2. The first processing unit has a first spindle to which a first cutting blade for cutting a workpiece is removably fixed at a tip thereof, 2. The processing device according to claim 1, wherein the second processing unit has a second spindle having a second cutting blade for cutting the workpiece removably fixed to a tip thereof.

Images