Module including elastic wave device

Abstract

To enable suitable generation of a plurality of modules from an aggregate substrate without aimlessly increasing the steps.SOLUTION: A module including an elastic wave device includes: a module substrate 2 in which a part of two or more electronic devices 3 is used as a device chip 4 functioning as an elastic wave device; a first sealing part 12 that seals the electronic device 3 other than the device chip 4; and a second sealing part 13 that seals the device chip 4. The second sealing part 13 is formed of a resin 13a with a thermosetting property, an insulating property, and a high conductivity. The first sealing part 12 is formed of a resin 12b with a thermosetting property and an insulating property, and making the fluidity before the curing higher than that of the resin 13a included in the second sealing part 13.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to an improvement to a module in which two or more electronic devices mounted on a module substrate are partly device chips that function as acoustic wave devices. [Background technology]

[0002] In a module in which two or more electronic devices mounted on a module substrate have one or more device chips that function as acoustic wave devices, an internal space must be secured by creating a cavity in the sealing resin beneath the device chip (bare chip) that constitutes the acoustic wave device, while the other electronic devices require sealing resin to be inserted beneath them as an underfill.

[0003] In Patent Document 1, an acoustic wave device and other electronic devices are covered with a single resin, and then the portion of the resin covering the acoustic wave device is hardened. Next, the portion of the resin covering the electronic devices other than the acoustic wave device is temporarily softened to form an underfill, and then the portion covering the electronic devices other than the acoustic wave device is thermally hardened. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent Publication No. 2023-28625 Summary of the Invention [Problem to be solved by the invention]

[0005] The main problem that this invention aims to solve is to make it possible to appropriately generate a plurality of modules having the above-mentioned structure from an aggregate substrate on which electronic devices are mounted, without unnecessarily increasing the number of processes required to obtain a module having the above-mentioned structure. [Means for solving the problem]

[0006] In order to achieve the above object, the present invention provides a module having an acoustic wave device, comprising: a module substrate having two or more electronic devices mounted thereon, some of the two or more electronic devices being device chips that function as acoustic wave devices; a first sealing portion that seals the electronic device other than the device chip that functions as the acoustic wave device between the module substrate; a second sealing portion that seals the device chip that functions as the acoustic wave device between the module substrate and the device chip, the first sealing portion and the second sealing portion are formed so that a forming region of the first sealing portion and a forming region of the second sealing portion do not overlap with each other when the module substrate is viewed in a direction perpendicular to a mounting surface of the electronic device; The second sealing portion is made of a thermosetting resin having insulating properties and high thermal conductivity, The first sealing portion is made of a thermosetting resin that has insulating properties and has a higher fluidity before hardening than the resin that constitutes the second sealing portion.

[0007] The device chip functioning as the acoustic wave device includes: a functional element including an IDT electrode on one surface and a bump connected to the functional element, the device being mounted on the module substrate using the bump to create a gap between the one surface of the device and the mounting surface of the module substrate, In one aspect of the present invention, the second sealing portion serves to make the gap into an internal space that is isolated from the outside.

[0008] The first sealing portion is composed of a first resin portion and a second resin portion made of a resin different from the resin constituting the first resin portion, the electronic device other than the device chip that functions as the acoustic wave device, the electronic device being other than the electronic device sealed between the module substrate and the module substrate by the first resin part, is sealed by the second resin part; Furthermore, one aspect of the present invention is that the second resin part is formed so as not to overlap with the formation area of ​​the first resin part when the module substrate is viewed in a direction perpendicular to the mounting surface of the electronic device. Effect of the Invention

[0009] According to this invention, by mounting electronic devices on an aggregate substrate that becomes a module substrate, and by performing a heat treatment on a processing object in which a resin constituting a first sealing portion and a resin constituting a second sealing portion are positioned on the module substrate, a device chip that functions as an acoustic wave device is sealed with the second sealing portion and other electronic devices are sealed with the first sealing portion, thereby generating a module having the above-mentioned structure. This makes it possible to appropriately generate a plurality of modules having the above-mentioned structure from the aggregate substrate, without unnecessarily increasing the number of steps for obtaining a module in which some of the two or more mounted electronic devices are device chips that function as acoustic wave devices. [Brief description of the drawings]

[0010] [Figure 1] FIG. 1 is a cross-sectional configuration diagram of a module (first example) according to an embodiment of the present invention. [Diagram 2] FIG. 2 is a cross-sectional view taken along line AA in FIG. [Diagram 3] FIG. 3 is a configuration diagram showing an example of a resonator formed on a functional surface of a device chip constituting an acoustic wave device in the first example. [Figure 4] FIG. 4 is a configuration diagram showing an example of a circuit formed on a functional surface of a device chip constituting an acoustic wave device in the first example. [Diagram 5]FIG. 5 is a cross-sectional configuration diagram of a module (second example) according to an embodiment of the present invention. [Figure 6] FIG. 6 is a configuration diagram showing a state in which an electronic device is mounted on the module board of the first example, and shows the module board as viewed from the position of line BB in FIG. [Figure 7] FIG. 7 is a configuration diagram showing a base film having sealing members arranged and held on one surface thereof constituting the first example, and shows the module substrate as viewed from the position of line CC in FIG. [Figure 8] FIG. 8 is a diagram showing the sealing process of the first example. [Figure 9] FIG. 9 is a configuration diagram showing a process of forming the sealing member. [Figure 10] FIG. 10 is a diagram showing the process of forming the sealing member. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] Hereinafter, a typical embodiment of the present invention will be described with reference to FIGS.

[0012] First, a module 1 according to an embodiment of the present invention will be described mainly with reference to FIGS. A module 1 according to this embodiment includes two or more electronic devices 3 mounted on a module substrate 2, some of which are device chips 4 that function as acoustic wave devices. Such an acoustic wave device is suitable for use as a frequency filter in mobile communication devices and the like. The module 1 is typically used as a power amplifier module integrated duplexer (PAMiD) module or the like. Examples of electronic devices 3 other than the device chip 4 functioning as an acoustic wave device include semiconductor devices functioning as power amplifiers, low-noise amplifiers, and switches, and passive components functioning as resistors, capacitors, coils, etc.

[0013] One surface of the device chip 4 is a functional surface 4a on which a functional element including an IDT electrode, typically a resonator 5, is formed. Moreover, the device chip 4 is provided, on the functional surface 4a, with wiring 6 that connects the resonators 5 to each other, and a circuit 7 that includes the wiring 6 that enables the resonators 5 to be connected to the outside. Note that the wiring 6 is omitted in Figs. 1 and 2. The resonator 5 and the wiring 6 are typically made of a conductive metal film formed by photolithography and etching.

[0014] The device chip 4 has a function of propagating elastic waves. A piezoelectric material such as lithium tantalate or lithium niobate is typically used for the device chip 4. The device chip 4 may also be configured by laminating the piezoelectric material on a support such as sapphire, silicon, alumina, spinel, quartz, or glass. Typically, the device chip 4 is configured in the shape of a rectangular plate with a side measuring 0.5 to 1 mm and a thickness of 0.15 to 0.2 mm.

[0015] 3 shows an example of a resonator 5 formed on the functional surface 4a of the device chip 4. The resonator 5 has an IDT electrode 5c and a reflector 5d formed to sandwich the IDT electrode 5c. The IDT electrode 5c is composed of an electrode pair, and each electrode pair is formed by connecting a bus bar 5f at one end side of a plurality of electrode fingers 5e arranged in parallel so that their length direction crosses the propagation direction x of the elastic wave. The reflector 5d is formed by connecting ends of a plurality of electrode fingers 5g arranged in parallel so that their length direction crosses the propagation direction x of the elastic wave with a bus bar 5h.

[0016] Fig. 4 shows the concept of an example of a circuit 7 provided on one device chip 4. Reference numeral 5a denotes a resonator 5 connected in series between signal input / output terminals 8, reference numeral 5b denotes a resonator 5 connected in parallel between signal input / output terminals 8, and reference numeral 9 denotes a ground. The number and arrangement of the resonators 5 can be changed as necessary. In other words, a ladder-type filter is configured by the circuit 7 in Fig. 4.

[0017] The device chip 4 thus configured has bumps 10 on the functional surface 4a so as to protrude from the functional surface 4a. The bumps 10 are made of a conductive metal and are typically formed on the corners or edges of the functional surface 4a of the device chip 4, with their bases fixed to the wiring 6. The device chip 4 is mounted on the mounting surface 2a of the electronic device 3 on the module substrate 2 by using the bumps 10. Typically, the mounting is performed by fixing the protruding ends of the bumps 10 to wiring (not shown) on the mounting surface 2a by ultrasonic welding or the like. The functional surface 4a of the device chip 4 faces the mounting surface 2a of the module substrate 2, and a gap of the protruding dimension of the bumps 10 is formed between the functional surface 4a and the mounting surface 2a. The device chip 4 thus mounted is sealed between the module substrate 2 by a second sealing portion 13, which will be described later. The gap is made into an internal space 11 that is isolated from the outside by this second sealing portion 13. The functional element is positioned within this internal space 11. As a result, the module 1 according to this embodiment includes, in a part thereof, an acoustic wave device constituted by the device chip 4 as a bare chip.

[0018] The module 1 includes a first sealing portion 12 and a second sealing portion 13 on the mounting surface 2a. The first sealing portion 12 seals the electronic device 3 other than the device chip 4 that functions as the acoustic wave device between the module substrate 2 and the electronic device 3 . The second sealing portion 13 seals the device chip 4 that functions as the acoustic wave device between the module substrate 2 and the second sealing portion 13 .

[0019] The first sealing portion 12 and the second sealing portion 13 are formed so that the formation area of ​​the first sealing portion 12 and the formation area of ​​the second sealing portion 13 do not overlap when the module substrate 2 is viewed from a direction y (see Figure 1) perpendicular to the mounting surface 2a of the electronic device 3. In the illustrated example, the first sealing portion 12 and the second sealing portion 13 have substantially the same thickness in a direction perpendicular to the mounting surface 2a. The first sealing portion 12 covers the entire mounting area of ​​the electronic device 3 other than the device chip 4 functioning as an acoustic wave device and its periphery within a certain range, and the second sealing portion 13 covers the entire mounting area of ​​the device chip 4 functioning as an acoustic wave device and its periphery within a certain range. Moreover, first sealing portion 12 and second sealing portion 13 cover mounting surface 2a of module substrate 2 in an integrated state without leaving any gap between them.

[0020] The second sealing portion 13 is made of a thermosetting resin 13a that has insulating properties and high thermal conductivity. On the other hand, the first sealing portion 12 is made of a thermosetting resin 12b that has insulating properties and has a higher fluidity before hardening than the resin that constitutes the second sealing portion 13.

[0021] Specifically, the first sealing portion 12 covers the entire semiconductor device indicated by the symbol 3a and the passive components indicated by the symbol 3b in FIG. 1, and also penetrates between these and the mounting surface 2a of the module substrate 2, with part of it serving as underfill 12a. On the other hand, the second sealing portion 13 covers the back surface 4b opposite to the functional surface 4a of the device chip 4 and the side surface 4c extending between the back surface 4b and the functional surface 4a, and also enters between the functional surface 4a and the mounting surface 2a at the edge of the functional surface 4a to seal the gap between them all around the center of the device chip 4 (FIGS. 1 and 2). The internal space 11 is formed inside the edge of the functional surface 4a.

[0022] Since the module 1 according to this embodiment has the structure described above, first, the electronic device 3 is mounted on the aggregate substrate 14 (see FIG. 6) that becomes the module substrate 2, and then, by heat treating a processing object W (workpiece / see FIG. 8) in which the resin 12b that constitutes the first sealing portion 12 and the resin 13a that constitutes the second sealing portion 13 are positioned on the module substrate 2, the device chip 4 that functions as an acoustic wave device is sealed with the second sealing portion 13 and the other electronic devices 3 are sealed with the first sealing portion 12, thereby generating a module 1 having the structure. Therefore, a plurality of modules 1 can be generated from the processing object W without unnecessarily increasing the number of steps for obtaining the module 1 having the structure. Secondly, in the heat treatment, the fluidity of the resin 12b constituting the first sealing portion 12 is increased, and in the softened state before hardening, the resin 12b can easily enter as an underfill 12a between the electronic device 3 other than the device chip 4 functioning as an acoustic wave device and the mounting surface 2a of the module substrate 2. Furthermore, when there is an electronic device 3 connected to the module substrate 2 via a bonding wire 3c, the external force applied by the resin 12b to the bonding wire 3c during the formation of the first sealing portion 12 can be reduced, and positional displacement of the bonding wire 3c can be suppressed. Thirdly, in the heat treatment, even if the resin 12b constituting the first sealing portion 12 has the fluidity described above, the resin 13a constituting the second sealing portion 13 can be made not to have such fluidity. As a result, it is possible to cause the resin 13a constituting the second sealing portion 13 to penetrate between the device chip 4 functioning as an acoustic wave device and the mounting surface 2a of the module substrate 2 in a controlled manner so as not to lose the internal space 11. Fourthly, since the second sealing portion 13 is made of resin 13a having high thermal conductivity, the heat generated during operation of the device chip 4 functioning as an acoustic wave device can be efficiently dissipated to the outside by using the second sealing portion 13.

[0023] The resin 12b constituting the first sealing portion 12 is typically one that temporarily softens at a first temperature that is higher than room temperature, and hardens by maintaining this first temperature or by raising the temperature to a second temperature that is higher than the first temperature.

[0024] On the other hand, the resin 13a constituting the second sealing portion 13 is typically one that temporarily softens at the first temperature, which is higher than room temperature, and hardens by maintaining this first temperature or by raising the temperature to a second temperature that is higher than the first temperature. The first temperature and the second temperature are set so that the resin 12b constituting the first sealing portion 12 and the resin 13a constituting the second sealing portion 13 are the same. The resin 13a constituting the second sealing portion 13 contains a filler made of a substance with high thermal conductivity in a range of 70 wt% to 90 wt% relative to the base resin. The filler is typically formed as granules with a diameter of about 10 μm. Specifically, an epoxy resin containing a filler or a phenolic resin containing a filler can be used as the resin 13a constituting the second sealing portion 13. Typically, silica, alumina, or aluminum nitride can be used as the filler. The fluidity of the resin 12b constituting the first sealing portion 12 and the resin 13a constituting the second sealing portion 13 varies depending on the type of resin, the type of filler, and the filler content, but the filler content is the main factor affecting the fluidity. By making the resin 13a constituting the second sealing portion 13 a resin containing a larger amount of the filler than the resin 12b constituting the first sealing portion 12, the fluidity of the resin 13a constituting the second sealing portion 13 can be made lower than the fluidity of the resin 12b constituting the first sealing portion 12 at the first temperature.

[0025] More specifically, it has been found that the following resin 12b constituting the first sealing portion 12 is preferably used. High fluidity resin manufactured by Sumitomo Bakelite Co., Ltd.: A730 series In addition, it was found that the following resin 13a constituting the second sealing portion 13 is preferably used. Kyocera Corporation's low-fluidity, high-heat-dissipation resin: KE-G1250 series However, the resin 12b constituting the first sealing portion 12 and the resin 13a constituting the second sealing portion 13 need only have the characteristics described above, and are not limited to these two specific resins.

[0026] FIG. 5 shows a partial modification of the configuration of the module 1 described above. In this example, the first sealing portion 12 is made up of a first resin portion 120 and a second resin portion 121 made of a resin 12c different from the resin 12b constituting the first resin portion 120. The resin 12c is also thermosetting like the resin 12b, has insulating properties, and has a higher fluidity before curing than the resin 13a constituting the second sealing portion 13. The electronic devices 3 other than the device chip 4 that functions as the elastic wave device, and the electronic devices 3 other than the electronic devices 3 sealed between the module substrate 2 by the first resin part 120, are sealed by the second resin part 121. At the same time, the second resin portion 121 is formed so as not to overlap with the formation area of ​​the first resin portion 120 when the module substrate 2 is viewed from a direction y perpendicular to the mounting surface 2a of the electronic device 3. In this case, packaging is possible in which the resin 12b constituting the first resin part 120 is a resin optimized for preventing misalignment of the bonding wire 3c, and the resin 12c constituting the second resin part 121 is a resin optimized for forming the underfill 12a.

[0027] Next, a method for manufacturing the module 1 having the above structure will be described mainly with reference to FIGS. That is, this manufacturing method is a method for manufacturing a module 1 in which two or more electronic devices 3 are mounted, and some of the two or more electronic devices 3 are device chips 4 that function as acoustic wave devices. The manufacturing method includes at least the following steps.

[0028] (Mounting process) The mounting step is a step of mounting the electronic device 3 in each component region 14a of each module 1 on an aggregate substrate 14 which becomes the module substrate 2 constituting the module 1 (see FIG. 6). 6, the inside of the rectangle shown by the dashed line is the component area 14a, and margins 14b are set between each of the component areas 14a, forming a lattice pattern. In a later process, the aggregate substrate 14 is diced at the margins 14b to generate a plurality of modules 1. In each component region 14a, one device chip 4 serving as an acoustic wave device and three other electronic devices 3 are mounted.

[0029] (Sealing process) The sealing process is a process of forming, for each component area 14a of each module 1, a first sealing portion 12 that seals the electronic device 3 other than the device chip 4 that functions as the acoustic wave device between the aggregate substrate 14, and a second sealing portion 13 that seals the device chip 4 that functions as the acoustic wave device between the aggregate substrate 14.

[0030] In this sealing process, for each component region 14a of each module 1, a second portion 16b is formed from the thermosetting resin 13a that is the second sealing portion 13 and has insulating properties and high thermal conductivity. A sealing member 16 is prepared having a first portion 16a made of thermosetting resin 12b that becomes the first sealing portion 12, the resin 12b having insulating properties and a higher fluidity before hardening than that of resin 13a that constitutes the second sealing portion 13 (see Figure 7).

[0031] Then, for each component area 14a of each module 1, the sealing member 16 is laminated on the assembly substrate 14 that has undergone the mounting process so that the first portion 16a of the sealing member 16 covers the electronic device 3 other than the device chip 4 that functions as the acoustic wave device, and the second portion 16b of the sealing member 16 covers the device chip 4 that functions as the acoustic wave device (see Figure 8).

[0032] After the lamination, the assembly substrate 14 and the sealing member 16 are pressure-bonded together at a predetermined temperature (see FIG. 8).

[0033] According to this manufacturing method, a plurality of modules 1 can be produced from the assembly substrate 14 that has been subjected to the mounting process, without unnecessarily increasing the number of processes for obtaining the module 1 having the structure.

[0034] In the illustrated example, the sealing member 16 has a rectangular plate shape and is substantially the same size as the component region 14a. The first portion 16a and the second portion 16b each have a plate shape, and one side of the first portion 16a and one side of the second portion 16b are fixed to each other, so that the sealing member 16 as a whole has a rectangular plate shape. In the illustrated example, a number of sealing members 16 corresponding to the number of component regions 14a and a base film 17 having a function of temporarily holding the sealing members 16 are prepared, and a plurality of sealing members 16 are arranged on the base film 17 with gaps 18 between adjacent sealing members 16. The gaps 18 are in a lattice shape and are arranged to substantially match the margins 14b (see FIG. 7). In the illustrated example, a positioning pin 19b (see FIG. 8) formed on one side 19a constituting the molding die 19, an insertion portion 14c (see FIG. 6) for the pin formed on the collective substrate 14, and an insertion portion 17a (see FIG. 7) for the pin formed on the base film 17 are used to position the collective substrate 14 on which the electronic device 3 is mounted on the base film 17 holding the sealing member 16 in the one side 19a, and the molding die 19 is then closed from this state to achieve the compression bonding.

[0035] Specifically, the sealing member 16 is held by the base film 17 with one surface of the sealing member 16 being adhesively or weakly attached to one surface of the base film 17. The base film 17 is positioned in the one mold 19a with the holding side of the sealing member 16 facing the other mold 19c. Meanwhile, the assembly board 14 is positioned in the one mold 19a with the mounting surface 2a of the electronic device 3 facing one surface of the base film 17. At the same time, by alignment using the pins 19b, the second portion 16b of the sealing member 16 is positioned in front of (directly below in the illustrated example) the device chip 4 that becomes the acoustic wave device for each component region 14a in the movable direction z (see FIG. 8) of the molding die 19, and the first portion 16a of the sealing member 16 is positioned in front of (directly below in the illustrated example) the remaining electronic device 3. By clamping the molding die 19, the first sealing portion 12 and the second sealing portion 13 are appropriately formed for each of the component regions 14a on the collective substrate 14. Thereafter, the molding die 19 is opened, and the base film 17 is peeled off from the collective substrate 14 side to separate the two, thereby obtaining a processing target W in which each of the component regions 14a is a module 1.

[0036] (Formation process) Moreover, the manufacturing method according to this embodiment further includes a step of forming the sealing member 16. In the forming step, a first mold 21 is provided with a plurality of forming regions 21a of the sealing member 16, and each forming region 21a is provided with a first filling portion 21b filled with a resin constituting the first portion 16a (i.e., the resin 12b constituting the first sealing portion 12) and a second filling portion 21c filled with a resin constituting the second portion 16b (i.e., the resin 13a constituting the second sealing portion 13). A mold 20 consisting of a pair of mold 22 is prepared (see FIG. 9).

[0037] Next, for each of the forming regions 21a, the first filling portion 21b is filled with the resin constituting the first portion 16a, and then the second filling portion 21c is filled with the resin constituting the second portion 16b. Alternatively, for each of the forming regions 21a, the second filling portion 21c is filled with the resin constituting the second portion 16b, and then the first filling portion 21b is filled with the resin constituting the first portion 16a.

[0038] Next, the mold is clamped at a predetermined temperature to simultaneously mold the sealing members 16 in the number corresponding to the forming regions 21a. After such molding, the mold is opened, and typically the support portion 21d of the sealing member 16 remaining on one side of the mold 21 is pushed up by a needle (not shown) or the like, and the floating sealing member 16 is captured by a known vacuum chuck (not shown) or the like and arranged on a known conveying frame (not shown) with a chuck. Thereafter, the conveying frame is positioned above the base film 17, the chucking of the sealing member 16 is released, and the multiple sealing members 16 are arranged on the base film 17 as described above (see FIG. 7).

[0039] In addition, in this embodiment, the one mold 21 is configured such that the inside of a recess 21e formed in the one mold 21 is the formation region 21a, and the first filling portion 21b and the second filling portion 21c are separated by a partition wall 21f rising from the bottom 21g of the recess 21e toward the entrance 21h, and the height of the partition wall 21f is made smaller than the distance between the bottom 21g of the recess 21e and the entrance 21h. By using such a one-side mold 21, the resin constituting the first portion 16a and the resin constituting the second portion 16b can be caused to flow onto the partition wall 21f by clamping the mold 20, and both resins thus flowing can be integrated onto the partition wall 21f (FIG. 10). This allows the sealing member 16, which has the first portion 16a and the second portion 16b each having a plate shape, and is formed by fixing one side of the first portion 16a to one side of the second portion 16b, to be appropriately formed as a rectangular plate shape as a whole.

[0040] Of course, the present invention is not limited to the above-described embodiments, but includes all embodiments that can achieve the object of the present invention. [Explanation of symbols]

[0041] x Propagation direction y Orthogonal to the mounting surface W Processing target z Direction of movement 1 Module 2 Module Board 2a Mounting surface 3. Electronic Devices 3a Semiconductor Devices 3b Passive Components 3c Bonding Wire 4. Device Chip 4a Functionality 4b Back 4c side 4d Edge 5, 5a, 5b resonator 5c IDT electrode 5d reflector 5e electrode finger 5f Busbar 5g electrode finger 5h busbar 6 Wiring 7 Circuit 8 Signal input / output terminals 9 Grand 10. Bump 11. Interior Space 12 First sealing portion 120 First resin part 121 Second resin part 12a Underfill 12b Resin 13 Second sealing part 13a Resin 14 Collective board 14a Configuration area 14b Margin 14c Insertion part 16 Sealing member 16a Part 1 16b Part 2 17 Base film 17a Insertion part 18 Gap 19 Molding mold 19a One-sided type 19b Locating pin 19c Other type 20 Mold 21 One-way mold 21a Formation area 21b 1st filling section 21c 2nd filling section 21d Support part 21e Recess 21F Partition wall 21g bottom 21h Entrance 22 Other mold

Claims

1. a module substrate having two or more electronic devices mounted thereon, some of the two or more electronic devices being device chips that function as acoustic wave devices; a first sealing portion that seals the electronic device other than the device chip that functions as the acoustic wave device between the module substrate; a second sealing portion that seals the device chip that functions as the acoustic wave device between the module substrate and the device chip, the first sealing portion and the second sealing portion are formed such that a forming region of the first sealing portion and a forming region of the second sealing portion do not overlap with each other when the module substrate is viewed in a direction perpendicular to a mounting surface of the electronic device; The second sealing portion is made of a thermosetting resin having insulating properties and high thermal conductivity, A module including an acoustic wave device, wherein the first sealing portion is made of a thermosetting resin that is insulating and has a higher fluidity before hardening than the resin that constitutes the second sealing portion.

2. The device chip functioning as the acoustic wave device includes: a functional element including an IDT electrode on one surface and a bump connected to the functional element, the device being mounted on the module substrate using the bump to create a gap between the one surface of the device and the mounting surface of the module substrate, The module including the acoustic wave device according to claim 1 , wherein the gap is made into an internal space isolated from the outside by the second sealing portion.

3. The first sealing portion is composed of a first resin portion and a second resin portion made of a resin different from that of the first resin portion, the electronic device other than the device chip that functions as the acoustic wave device, the electronic device being other than the electronic device sealed between the module substrate and the device chip by the first resin part, is sealed by the second resin part; and wherein the second resin portion is formed so as not to overlap with a formation area of ​​the first resin portion when the module substrate is viewed in a direction perpendicular to the mounting surface of the electronic device.

Images