Vertical probe, probe head, and method of making vertical probe

Abstract

To provide a vertical probe that can contact small conductive contacts with good current resistance, structural strength, lifespan, and processing accuracy and when applied to a probe head, breaking or shifting position of the tip portion due to vertical movement can be avoided.SOLUTION: A vertical probe includes opposite first and third sides, and opposite second and fourth sides. The third and fourth sides extend in a planar manner from a body to a tip portion. The first and second sides include first and second upper plane segments at the body, first and second transition segments at the tip portion, and first and second lower plane segments closer to the third and fourth sides than the first and second upper plane segments are, respectively. The first and second transition segments gradually approach the third and fourth sides as they extend from the first and second upper plane segments to the first and second lower plane segments. The first transition and lower plane segments are realized by laser processing.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to probes and probe heads of a probe card, and more particularly to a vertical probe, a probe head having the vertical probe, and a method for manufacturing the vertical probe. [Background technology]

[0002] Conventional vertical probes have a long and thin columnar shape with a square or rectangular cross section. Such vertical probes are manufactured by micromachining processes or cutting plate materials, and can be formed with the required probe width and thickness according to the requirements of use. As electronic components become smaller, the width and thickness of such vertical probes must also be reduced accordingly in order to contact the minute conductive contacts on the object to be measured (including, but not limited to, objects having micro bumps).

[0003] However, reducing the width and thickness of the entire probe will significantly increase the resistance value and significantly reduce the structural strength. The higher the probe resistance value, the lower the current resistance performance. If the current resistance performance of the probe is too low, the probe will be easily burned when current is applied. In addition, if the structural strength of the probe is too low, it will be easily worn, broken, and even broken due to the force during measurement, shortening the life of the probe and requiring frequent replacement. Therefore, under the premise that the probe has sufficient current resistance performance, it is a very important task in the technical field to enable the probe to contact the micro-conductive contacts and improve the life of the probe. Summary of the Invention [Problem to be solved by the invention]

[0004] The present invention provides a vertical probe, in which the width and thickness are reduced only at the probe tip, so that the probe tip meets the requirement of point contact with a micro conductive contact, and the other sections have a relatively large width and thickness, so that the probe has good current resistance and structural strength. Such a vertical probe includes a body and a probe tip, and the probe tip includes a probe tip contact part having a width and thickness both smaller than the body, and a probe tip tapered part located between the body and the probe tip contact part. The width of the probe tip can be reduced by a micromachining process or by laser cutting a plate material, and the thickness of the probe tip can be reduced by machining or etching in a micromachining process.

[0005] In the process of attaching the vertical probe to the probe holder, the vertical probe is first installed through the upper and lower guide holes of the upper and lower guide plate units of the probe holder, and then the upper and lower guide plate units move relatively in the horizontal direction and are fixed to each other to form the probe holder. At this time, the upper and lower guide plate units are displaced in the horizontal direction, so that the main body of the vertical probe is elastically curved and deformed. For example, when the lower guide plate unit moves relatively to the left with respect to the upper guide plate unit, the main body of the vertical probe is curved to the left from top to bottom. In this case, the right side surface of the vertical probe abuts on the inner surface of the lower guide hole. The abutment position is located at a position close to the probe tip gradually narrowing part on the main body. When the probe tip contact part contacts the measured object and receives an upward reaction force, the probe tip retracts slightly elastically into the lower guide hole. Therefore, if there is a step between the part of the right side of the vertical probe located at the gradually tapering part of the probe tip and the part located at the main body, and they are not flush with each other, the structural strength of this part will be weakened. Also, when the probe tip moves up and down, the right side cannot completely contact the inner surface of the lower guide hole. That is, there is a step at the part where the right side can move up and down and contact the inner surface of the lower guide hole. This easily leads to the breakage of the probe. Also, the position of the contact part of the probe tip easily shifts, and it becomes impossible to match the conductive contact of the object to be measured. Furthermore, if the thickness of the probe tip is reduced by machining or etching in a micromachine process, a tolerance that does not meet the demand easily occurs, and the manufacturing yield rate of the probe card decreases.

[0006] The present invention has been made in view of the above, and aims to provide a vertical probe, a probe head, and a method for manufacturing the vertical probe. This allows the vertical probe to meet the demand for point contact with a minute conductive contact, and has good current resistance performance, structural strength, and service life. Also, good processing accuracy can be achieved. Furthermore, when the vertical probe is applied to a probe head, the probe tip is unlikely to break due to vertical movement when making point contact with the object to be measured. Furthermore, the probe tip is unlikely to shift, and can be aligned with the conductive contact of the object to be measured. [Means for solving the problem]

[0007] In order to achieve the above-mentioned object, according to the present invention, a vertical probe comprises an elongated body extending in a longitudinal direction, and a probe tip connected to the body and extending in the longitudinal direction from the body. The vertical probe includes a first side, a second side, a third side facing in a direction opposite to the direction in which the first side faces, and a fourth side facing in a direction opposite to the direction in which the second side faces, the third side and the fourth side extending in a plane from the body to the probe tip. The first side includes a first upper planar region located on the body, a first transition region located at the probe tip, and a first lower planar region located at the probe tip, the first transition region is located between the first upper planar region and the first lower planar region, a first upper connecting line is formed between the first transition region and the first upper planar region, a first lower connecting line is formed between the first transition region and the first lower planar region, the first lower planar region is closer to the third side than the first upper planar region, and the first transition region extends from the first upper connecting line to the first lower connecting line while approaching the third side. The second side includes a second upper planar region located on the body, a second transition region located at the probe tip, and a second lower planar region located at the probe tip, the second transition region is located between the second upper planar region and the second lower planar region, a second upper connecting line is formed between the second transition region and the second upper planar region, a second lower connecting line is formed between the second transition region and the second lower planar region, the second lower planar region is closer to the fourth side than the second upper planar region, and the second transition region extends from the second upper connecting line to the second lower connecting line while approaching the fourth side. The first transition region of the first side and the first lower planar region are realized by a laser processing method.

[0008] As a result, the probe tip of the vertical probe of the present invention is designed not to be flush with the main body only at the first side and the second side. That is, by forming a first transition region and a first lower flat region at the first side, the thickness of the probe tip is reduced. At the third side opposite to the first side, the main body and the probe tip are flush. Similarly, by forming a second transition region and a second lower flat region at the second side, the width of the probe tip is reduced. At the fourth side opposite to the second side, the main body and the probe tip are flush. As a result, at the probe tip, the portion including the first and second transition regions becomes the probe tip gradually tapered portion, and the portion including the first and second lower flat regions becomes the probe tip contact portion. The probe tip gradually tapered portion is reduced to the required width and thickness, so that the width and thickness of the probe tip contact portion meet the demand for point contact with the micro-conductive contact. The main body has a relatively large width and thickness, so that the vertical probe has good current resistance performance, structural strength, and service life. When the vertical probe is attached to the upper and lower guide holes of the upper and lower guide plate units of the probe holder, and the main body of the vertical probe is elastically curved and deformed due to the horizontal relative movement of the upper and lower guide plate units, the planar third side and / or fourth side of the vertical probe abuts against the inner surface of the lower guide hole. Since there is no step between the main body and the probe tip on the third and fourth sides, the structural strength of this portion is relatively good. When the probe tip makes point contact with the object to be measured, it does not easily break even if it moves up and down and retracts into the lower guide hole. In addition, it is possible to avoid the position of the probe tip being shifted and being unable to align it with the conductive contact of the object to be measured. In addition, the first side of the vertical probe is formed with a first transition region and a first lower flat region by a laser processing method. Thus, the dimensional accuracy of the probe tip can be improved. Furthermore, in the second side, the second transition region and the second lower flat region are also formed by a laser processing method. Thus, the dimensional accuracy of the probe tip can be further improved.This allows the tolerance of the vertical probes to be tailored to meet demand, and increases the manufacturing yield rate of the probe cards.

[0009] Preferably, the probe tip has a contact end that is farthest from the body, and when a distance between the first lower connection line and the contact end in the longitudinal direction is defined as a first height, and a distance between the second lower connection line and the contact end in the longitudinal direction is defined as a second height, the first height and the second height are not substantially equal.

[0010] When the probe tip is in point contact with the object to be measured, stress is concentrated in the first and second transition regions and the first and second lower planar regions, and these regions are relatively prone to breakage. In the present invention, the first lower connection line and the second lower connection line are designed to have different heights. That is, the heights of the first and second lower planar regions are different. This improves the problem of stress concentration and further prevents the vertical probe from easily breaking.

[0011] Preferably, the probe tip has a contact end that is farthest from the body, and when a distance between the first upper connection line and the contact end in the longitudinal direction is defined as a third height, and a distance between the second upper connection line and the contact end in the longitudinal direction is defined as a fourth height, the third height and the fourth height are not substantially equal.

[0012] As a result, the heights of the first upper connecting line and the second upper connecting line are designed to be different. That is, the overall height of the first lower planar region and the first transition region is different from the overall height of the second lower planar region and the second transition region. This can improve the problem of stress concentration and further prevent the vertical probe from easily breaking. In the present invention, the heights of the first and second lower connecting lines may be designed to be different, and at the same time, the heights of the first and second upper connecting lines may be designed to be different. This can further improve the problem of stress concentration and further prevent the vertical probe from easily breaking.

[0013] Preferably, the distance between the second upper connecting line and the second lower connecting line is greater than the distance between the first upper connecting line and the first lower connecting line.

[0014] Thus, the length of the second transition region is greater than that of the first transition region. Therefore, compared with the first transition region and the second transition region, the stress can be dispersed. In the probe holder, when the upper and lower guide plate units move relatively along one horizontal axis direction, or when the upper and lower guide plate units move relatively along two horizontal axes directions and the relative displacement amounts in the two horizontal axes are different, the vertical probe receives a relatively large stress in the horizontal axis direction with the large relative displacement amount. Therefore, the second transition region with a relatively long length faces the horizontal axis direction with the large relative displacement amount, thereby achieving a good stress dispersion effect. In addition, the lengths of the first and second transition regions of the vertical probe are designed based on the predetermined relative displacement amounts of the upper and lower guide plate units in the two horizontal axes directions, which further improves the problem of stress concentration and further suppresses the easy breakage of the vertical probe.

[0015] Preferably, the first side, the second side, the third side, and the fourth side all have a width in the main body between 30 micrometers and 100 micrometers.

[0016] Thus, the vertical probe has a single side width of 30 μm to 100 μm when the thickness and width reduction of the probe tip has not yet been performed (i.e., when the first and second transition regions and the first and second lower planar regions have not yet been formed). Such dimensions are suitable for performing the thickness and width reduction of the probe tip by creating the first and second transition regions and the first and second lower planar regions.

[0017] Preferably, the probe tip comprises a probe tip convergence portion and a probe tip contact portion, the probe tip convergence portion comprises the first transition region and the second transition region, the probe tip contact portion comprises the first lower planar region and the second lower planar region, the probe tip contact portion has a square cross section, and the body has a square cross section.

[0018] As a result, the vertical probe has the same amount of reduction in thickness and width at the probe tip, which makes it possible to suppress the concentration of a relatively large stress in one of the horizontal directions.

[0019] Preferably, the probe tip comprises a probe tip convergence portion and a probe tip contact portion, the probe tip convergence portion comprises the first transition region and the second transition region, the probe tip contact portion comprises the first lower planar region and the second lower planar region, the second upper planar region and the second lower planar region of the second side are perpendicular to a first horizontal axis direction, the first upper planar region and the first lower planar region of the first side are perpendicular to a second horizontal axis direction, and the distance between the first upper planar region and the first lower planar region of the first side in the second horizontal axis direction is greater than the distance between the second upper planar region and the second lower planar region of the second side in the first horizontal axis direction.

[0020] As a result, the cross section of the main body is rectangular, with the short side located on the first side and the long side located on the second side. The probe tip shrinks more at the first side than at the second side. Thus, the probe tip experiences a smaller degree of stress concentration at the second side. The second side faces the horizontal axis direction in which the relative displacement of the upper and lower guide plate units is relatively large, making it possible to prevent the vertical probe from easily breaking. The short side of the cross section of the main body is parallel to the horizontal axis direction in which the relative displacement is relatively large, providing an excellent elastic deformation effect.

[0021] In order to achieve the above object, a probe head according to the present invention comprises an upper guide plate unit, a lower guide plate unit, and the above-mentioned vertical probe. The upper guide plate unit includes an upper guide hole. The lower guide plate unit includes an upper side, a lower side, and a lower guide hole penetrating the upper side and the lower side. The main body of the vertical probe includes an upper mounting part and a lower mounting part, which are provided to penetrate the upper guide hole and the lower guide hole, respectively. The probe tip of the vertical probe is located below the lower side of the lower guide plate unit.

[0022] As a result, the vertical probe of the probe head according to the present invention has the above-mentioned characteristic configuration, and, on the premise of meeting the demand for point contact with a minute conductive contact, has good current resistance performance, structural strength, and service life, and can achieve good processing accuracy. In addition, the lower mounting part of the vertical probe can abut against the inner surface of the lower guide hole by the third side surface and / or the fourth side surface having a planar shape. This makes the probe tip less likely to break due to vertical movement. In addition, it is possible to avoid the probe tip being misaligned and being unable to be aligned with the conductive contact of the object to be measured.

[0023] Preferably, the probe head defines a first horizontal axis direction and a second horizontal axis direction that are perpendicular to each other, and the upper guide hole and the lower guide hole are offset from each other along the first horizontal axis direction so that the fourth side surface of the vertical probe abuts against one inner surface of the lower guide hole.

[0024] As a result, when the upper and lower guide plate units move relative to each other along the first horizontal axis direction, causing the upper and lower guide holes to shift from each other along the first horizontal axis direction, the vertical probe abuts against the inner surface of the lower guide hole with the planar fourth side surface. As a result, even if the probe tip moves up and down and retracts into the lower guide hole when it makes point contact with the object to be measured, it is not easily broken. In addition, it is possible to avoid a situation where the probe tip is not aligned with the conductive contact of the object to be measured due to a shift in position.

[0025] More preferably, the upper guide hole and the lower guide hole are offset from one another along the second horizontal axis such that the third side surface of the vertical probe abuts against another inner surface of the lower guide hole.

[0026] As a result, when the upper and lower guide plate units are displaced relative to each other in the first and second horizontal axis directions, causing the upper and lower guide holes to deviate from each other in the first and second horizontal axis directions, the planar third and fourth side faces of the vertical probe abut on the inner surface of the lower guide hole. As a result, even if the probe tip moves up and down and retracts into the lower guide hole when it makes point contact with the object to be measured, it is not easily broken. Also, it is possible to avoid a situation where the probe tip is misaligned and cannot be aligned with the conductive contact of the object to be measured.

[0027] More preferably, the upper guide hole and the lower guide hole are offset from each other along the first lateral axis by a distance greater than the distance they are offset from each other along the second lateral axis.

[0028] Therefore, the relative displacement of the upper and lower guide plate units in the first horizontal direction is large, the upper and lower guide holes are offset from each other by a relatively large distance in the first horizontal direction, and the body of the vertical probe is elastically curved and deformed mainly in the first horizontal direction. Based on this, the first and second transition regions of the vertical probe can be designed, for example, the length of the second transition region can be designed to be longer than the length of the first transition region, thereby further improving the problem of stress concentration and making the vertical probe less likely to break.

[0029] Preferably, the probe head further comprises another vertical probe. The other vertical probe includes an elongated body extending in a longitudinal direction and a probe tip connected to the body and extending from the body in a longitudinal direction. The other vertical probe includes a first side, a second side, a third side facing in a direction opposite to the direction in which the first side faces, and a fourth side facing in a direction opposite to the direction in which the second side faces, and the first side, the second side, the third side, and the fourth side of the other vertical probe extend in a plane from the body of the other vertical probe to the probe tip of the other vertical probe. The body of the other vertical probe includes an upper mounting portion and a lower mounting portion, and the upper mounting portion and the lower mounting portion of the other vertical probe are provided to penetrate through another upper guide hole of the upper guide plate unit and another lower guide hole of the lower guide plate unit, respectively. The probe tip of the another vertical probe is located below the lower surface of the lower guide plate unit.

[0030] In other words, the thickness and width of the probe tip of this other vertical probe (hereinafter also referred to as the second vertical probe) are not reduced and are the same as those of the main body. Compared with the vertical probe with the reduced thickness and width of the probe tip described above (hereinafter also referred to as the first vertical probe), the second vertical probe has a larger contact end area of ​​the probe tip. Such a probe head is suitable for measuring an object having micro bumps. The contact end of the probe tip of the second vertical probe can simultaneously contact multiple micro bumps used to transmit a power signal or a ground signal. Meanwhile, the contact end of the probe tip of the first vertical probe can contact a single micro bump used to transmit a test signal. Thus, even if the dimensions of the probe tips of the first and second vertical probes are different, the dimensions of the main body are the same. Therefore, it is easy to control the deformation amount of the main body of the first and second vertical probes to be the same, which generates uniform probe test results. In addition, the wear amount of the first and second vertical probes can be made the same. The micro bumps of the object to be measured are usually arranged in a matrix. Due to the reduction method of the thickness and width of the probe tip of the first vertical probe, the bodies of the first and second vertical probes are aligned with each other, on the premise that the probe tip of the first vertical probe exactly corresponds to a single microbump. Therefore, the lower guide holes for the first and second vertical probes are aligned with each other. That is, it is not necessary to design different arrangement methods of the lower guide holes for the first and second vertical probes. This simplifies the design of the lower guide holes, avoids the design of the arrangement of the lower guide holes becoming complicated, and prevents the plate body of the lower guide plate unit from being damaged due to the variation in the interval.

[0031] Preferably, the probe head defines a first horizontal axis direction and a second horizontal axis direction that are perpendicular to each other. The upper guide hole and the lower guide hole are offset from each other along the first horizontal axis direction so that the fourth side surface of the vertical probe and the other vertical probe abuts one inner surface of the lower guide hole. The upper guide hole and the lower guide hole are offset from each other along the second horizontal axis direction so that the third side surface of the vertical probe and the other vertical probe abuts another inner surface of the lower guide hole. The upper guide hole and the lower guide hole are offset from each other along the first horizontal axis direction by a distance greater than the distance they are offset from each other along the second horizontal axis direction.

[0032] As a result, when the upper and lower guide holes are offset from each other in the first and second horizontal axis directions, the planar third and fourth side faces of the vertical probe abut against the inner surface of the lower guide hole. As a result, even if the probe tip moves up and down and retracts into the lower guide hole when it makes point contact with the object to be measured, it is not easily broken. Also, it is possible to avoid the probe tip being misaligned with the conductive contact of the object to be measured. Also, the distance by which the upper and lower guide holes are offset from each other in the first horizontal axis direction is relatively large, and the body of the vertical probe is elastically curved and deformed mainly in the first horizontal axis direction. Based on this, the first and second transition regions of the vertical probe can be designed, for example, by designing the length of the second transition region to be longer than the length of the first transition region, the problem of stress concentration can be further improved and the vertical probe can be made more difficult to break.

[0033] In order to achieve the above object, the manufacturing method of the vertical probe according to the present invention is used for manufacturing the above vertical probe. The first transition region is formed by performing laser processing between a first position and a second position on a top surface of a substrate made of a conductive material by a laser processing method (e.g., laser ablation). The first lower planar region is formed by performing laser processing between the second position and a third position on the substrate by the laser processing method.

[0034] Thus, the first side of the vertical probe is formed with a first transition region and a first lower planar region by a laser processing method, so that the dimensional accuracy of the probe tip can be improved, the tolerance of the vertical probe can be made to meet demand, and the manufacturing yield rate of the probe card can be increased.

[0035] Preferably, in the above-mentioned vertical probe manufacturing method, the second transition region of the second side is formed by performing a laser processing on the base material by a laser processing method (e.g., laser cutting), which can further improve the dimensional accuracy of the probe tip and increase the manufacturing yield rate of the probe card.

[0036] In one embodiment of the present invention, a method for manufacturing a vertical probe includes the following steps. A substrate is provided. The substrate is a plate (plate-like body) having a top surface and a bottom surface facing in the opposite direction to the direction in which the top surface faces. The laser treatment method performs laser treatment between a first location and a second location on a top surface of the substrate to form a transition surface that gradually extends from the first location to the second location as the transition surface approaches the bottom surface. By performing laser processing between the second position and the third position on the top surface of the base material using a laser processing method, one processed plane is formed. A cutting process is performed to cut the substrate into at least one vertical probe, such that a first upper planar region of a first side of the vertical probe originates from a non-laser treated portion of the top surface of the substrate, a first transition region originates from a transition surface in the substrate, a first lower planar region originates from a processing plane in the substrate, and a second side and a fourth side are generated by the cutting process.

[0037] As a result, the vertical probe according to the present invention described above can be manufactured by subjecting a plate to laser processing (e.g., laser ablation) and a cutting process. The top surface of the plate is laser processed to form a transition surface and a processing plane, thereby realizing a reduction in the thickness of the probe tip of the cut vertical probe, and maintaining the flatness of the bottom surface of the plate, which can be used as the third side of the vertical probe. This manufacturing method can manufacture a vertical probe having the above-mentioned effects, and the same plate can be laser processed and then cut into multiple probes, making the manufacturing process convenient and quick.

[0038] Preferably, the cutting process is performed by a laser processing method (e.g., laser cutting), which can further improve the dimensional accuracy of the vertical probe and further improve the manufacturing yield rate of the probe card.

[0039] Preferably, in the longitudinal direction, the distance between the position of the second upper connection line on the second side surface generated by the cutting process and the third position is not substantially equal to the distance between the first position and the third position. Or, in the longitudinal direction, the distance between the position of the second upper connection line on the second side surface generated by the cutting process and the third position is not substantially equal to the distance between the second position and the third position. This makes it possible to prevent the second upper connection line on the second side surface from being aligned with the first upper connection line on the first side surface. Or, it makes it possible to prevent the second lower connection line on the second side surface from being aligned with the first lower connection line on the first side surface. This improves the problem of stress concentration in the first and second transition regions and the first and second lower flat regions, making the vertical probe more difficult to break.

[0040] In another embodiment of the present invention, a method for manufacturing a vertical probe includes the following steps. A substrate is provided, the substrate being an elongated needle body and including a second side of the vertical probe. A first transition region is formed by performing laser processing between a first position and a second position on the top surface of the substrate using a laser processing method, and a first lower planar region is formed by performing laser processing between the second position and a third position on the top surface of the substrate using a laser processing method, such that the top surface of the substrate becomes a first side of the vertical probe.

[0041] Thus, the vertical probe according to the present invention described above can be manufactured by performing laser processing on the long needle body. The needle body is formed by a microcomputer process or other method. At this time, the side profile required for the vertical probe is formed, so that the needle body can include a second upper planar region, a second transition region, and a second lower planar region on the second side of the vertical probe. The top and bottom surfaces of the needle body are planar. The above-mentioned manufacturing method realizes a reduction in the thickness of the probe tip by forming a first transition region and a first lower planar region on the top surface of the needle body. The bottom surface located opposite to the top surface maintains a flat surface and becomes the third side of the vertical probe. By such a manufacturing method, a vertical probe having the above-mentioned effects can be manufactured.

[0042] Preferably, the distance between the first position and the third position in the longitudinal direction is not substantially equal to the distance between the second upper connecting line of the second side surface and the third position, or the distance between the second position and the third position in the longitudinal direction is not substantially equal to the distance between the second lower connecting line of the second side surface and the third position.

[0043] As a result, the start position of the first transition region formed by performing laser processing on the top surface of the needle body is different from the start position of the second transition region on the second side surface. Therefore, the connecting line between the first transition region and the first upper plane region and the connecting line between the second transition region and the second upper plane region can be made to be unable to align with each other. Or, the end position of the first transition region is different from the end position of the second transition region on the second side surface. Therefore, the connecting line between the first transition region and the first lower plane region and the connecting line between the second transition region and the second lower plane region can be made to be unable to align with each other. The stress concentration problem of the first and second transition regions and the first and second lower plane regions can be improved, and the vertical probe can be made less likely to break. In the present invention, the connecting line between the first transition region and the first upper plane region and the connecting line between the second transition region and the second upper plane region can be made to be misaligned with each other, and the connecting line between the first transition region and the first lower plane region and the connecting line between the second transition region and the second lower plane region can be made to be misaligned with each other, which can further improve the stress concentration problem and make the vertical probe more unlikely to break.

[0044] The detailed structure, features, assembly, or use of the vertical probe, the probe head, and the manufacturing method of the vertical probe according to the present invention will be described in the detailed description of the embodiments below. However, those having ordinary knowledge in the technical field of the present invention should understand that such detailed description and the implementation of the specific embodiments enumerated in the present invention are merely for the purpose of explaining the present invention, and are not intended to limit the scope of the claims of the present invention. [Brief description of the drawings]

[0045] [Figure 1] 1 is a schematic cross-sectional view showing a probe head according to a first embodiment of the present invention. [Diagram 2] FIG. 2 is a schematic plan view showing a vertical probe according to the first embodiment of the present invention. [Diagram 3]3 is a schematic diagram showing a cross section of the probe head according to the first embodiment of the present invention taken along line 3-3 in FIG. 1. [Figure 4] FIG. 2 is a schematic three-dimensional view showing a vertical probe according to a first embodiment of the present invention. [Diagram 5] 4 is a flowchart showing a method for manufacturing a vertical probe according to the first embodiment of the present invention. [Figure 6] 1A to 1C are schematic three-dimensional views illustrating a manufacturing process of a vertical probe according to a first embodiment of the present invention. [Figure 7] 1A to 1C are schematic three-dimensional views illustrating a manufacturing process of a vertical probe according to a first embodiment of the present invention. [Figure 8] 1A to 1C are schematic three-dimensional views illustrating a manufacturing process of a vertical probe according to a first embodiment of the present invention. [Figure 9] FIG. 4 is a schematic diagram similar to FIG. 3, showing an embodiment in which the cross section of the main body of the vertical probe is rectangular. [Figure 10] FIG. 6 is a schematic plan view showing a vertical probe according to a second embodiment of the present invention. [Figure 11] FIG. 9 is a schematic diagram similar to FIG. 8, illustrating a cutting process of a vertical probe according to a second embodiment of the present invention. [Figure 12] 11A to 11C are schematic plan views showing another manufacturing method of a vertical probe according to the present invention. [Figure 13] 13 is a schematic three-dimensional view showing the manufacturing method shown in FIG. 12. [Figure 14] FIG. 11 is a schematic cross-sectional view showing a probe head according to a third embodiment of the present invention. [Figure 15] 11 is a schematic diagram showing two vertical probes of a probe head according to a third embodiment of the present invention contacting microbumps. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0046] The applicant hereby explains that in the embodiments and drawings introduced below, the same reference numerals represent the same or similar components or structural features thereof. It should be noted that the components and structures in the drawings are not illustrated based on actual proportions and quantities for convenience of illustration, and that the features of different embodiments may be applied to each other if possible. In addition, when referring to a component being installed on another component, it means that the aforementioned component is directly installed on the other component, or that the aforementioned component is indirectly installed on the other component, that is, one or more other components are further installed between the two components. When a component is "directly" installed on another component, it means that no other components are installed between the two components.

[0047] As shown in FIG. 1, a probe head 10 according to a first embodiment of the present invention includes an upper guide plate unit 20, a lower guide plate unit 30, and vertical probes 40 (the number of which is not limited).

[0048] In this embodiment, the upper and lower guide plate units 20 and 30 are each composed of only one plate body, but the upper guide plate unit 20 and / or the lower guide plate unit 30 may be composed of a plurality of overlapping plates. The edges of the upper and lower guide plate units 20 and 30 may be directly connected to each other by having a convex structure, or a hollow guide plate (not shown) may be connected between the upper and lower guide plate units 20 and 30. The upper guide plate unit 20 includes an upper side surface 21, a lower side surface 22, and upper guide holes 23 (the number of which is not limited) penetrating the upper side surface 21 and the lower side surface 22. The lower guide plate unit 30 includes an upper side surface 31, a lower side surface 32, and a lower guide hole 33 penetrating the upper side surface 31 and the lower side surface 32.

[0049] In the process of assembling the probe head 10, the upper and lower guide plate units 20, 30 are initially opposed to each other but are not fixed to each other, the upper side surface 31 of the lower guide plate unit 30 faces the lower side surface 22 of the upper guide plate unit 20, and the upper guide hole 23 is coaxially aligned with the lower guide hole 33. As shown in FIG. 2, the vertical probe 40 is initially linear and passes through the upper guide hole 23 and the lower guide hole 33 which are coaxially aligned, and then the upper and lower guide plate units 20, 30 move relatively in the first horizontal axis direction (Y axis direction), the upper guide hole 23 and the lower guide hole 33 are shifted in the Y axis direction, and the vertical probe 40 is curved as shown in FIG. 1. The upper and lower guide plate units 20, 30 may further move relatively in the second horizontal axis direction (X axis direction), and the upper guide hole 23 and the lower guide hole 33 are shifted in the X axis direction. In this embodiment, the distance by which the upper and lower guide holes 23, 33 are shifted in the Y-axis direction is greater than the distance by which the upper and lower guide holes 23, 33 are shifted in the X-axis direction, so that the vertical probe 40 is curved mainly in the Y-axis direction. After that, the upper and lower guide plate units 20, 30 are fixed to each other, and the vertical probe 40 in the probe head 10 maintains the curved shape as shown in FIG.

[0050] As shown in FIG. 2, the vertical probe 40 includes an elongated main body 41 extending along the vertical axis (Z axis), a probe rear end 42 integrally connected to the main body 41 and extending upward from the main body 41 along the Z axis, and a probe tip 43 integrally connected to the main body 41 and extending downward from the main body 41 along the Z axis. As shown in FIG. 1, the portion where the main body 41 and the probe rear end 42 are connected is an upper mounting portion 411, which is provided so as to penetrate the upper guide hole 23. The portion where the main body 41 and the probe tip 43 are connected is a lower mounting portion 412, which is provided so as to penetrate the lower guide hole 33. The lower mounting portion 412 partially protrudes from the lower side surface 32 of the lower guide plate unit 30, so that the probe tip 43 is located lower than the lower side surface 32 of the lower guide plate unit 30.

[0051] As shown in Figures 2 to 4, the vertical probe 40 includes a first side 44, a second side 45, a third side 46 facing in a direction opposite to the direction in which the first side 44 faces, and a fourth side 47 facing in a direction opposite to the direction in which the second side 45 faces. The third side 46 and the fourth side 47 all extend in a plane from the main body 41 to the probe tip 43. More specifically, the portion where the third side 46 is located on the main body 41 and the portion where the third side 46 is located on the probe tip 43 are on the same plane and are parallel to the Y-axis and the Z-axis, which is defined as the YZ plane. The portion where the fourth side 47 is located on the main body 41 and the portion where the fourth side 47 is located on the probe tip 43 are on the same plane and are parallel to the X-axis and the Z-axis, which is defined as the XZ plane. To explain in detail, in the third side surface 46 and the fourth side surface 47, not all parts of the main body 41 are on the same plane as the probe tip 43, but only the parts where the main body 41 and the probe tip 43 are connected are on the same plane. Therefore, in both the third side surface 46 and the fourth side surface 47, only the parts where the main body 41 and the probe tip 43 are connected are extended in a plane from the main body 41 to the probe tip 43. As shown in FIG. 1, the part where the main body 41 and the probe tip 43 are connected is usually the lower mounting part 412 of the main body 41, or a part of the lower mounting part 412 of the main body 41 protruding from the lower side surface 32 of the lower guide plate unit 30. In contrast, the first side surface 44 and the second side surface 45 extend from the main body 41 to the probe tip 43 in a non-complete plane. This will be explained in detail as follows.

[0052] The first side 44 includes a first upper planar region 441 located on the body 41, a first transition region 442 located on the probe tip 43, and a first lower planar region 443. The first transition region 442 is located between the first upper planar region 441 and the first lower planar region 443. The first upper planar region 441 and the first lower planar region 443 are perpendicular to the X-axis. The first transition region 442 is inclined with respect to the first upper planar region 441 and the first lower planar region 443. A first upper connecting line 444 is formed between the first transition region 442 and the first upper planar region 441. A first lower connecting line 445 is formed between the first transition region 442 and the first lower planar region 443. The first lower planar region 443 is closer to the third side 46 than the first upper planar region 441. The first transition region 442 extends from the first upper connecting line 444 to the first lower connecting line 445 while approaching the third side surface 46. In other words, if the distance on the X-axis between the first side surface 44 and the third side surface 46 is defined as the thickness, the thickness of the body 41 is greater than the thickness of the probe tip 43. The thickness of the probe tip 43 gradually decreases within the first transition region 442, and is uniform within the first lower flat region 443.

[0053] The second side 45 includes a second upper planar region 451 located on the body 41, a second transition region 452 located on the probe tip 43, and a second lower planar region 453 located on the probe tip 43. The second transition region 452 is located between the second upper planar region 451 and the second lower planar region 453. The second upper planar region 451 and the second lower planar region 453 are perpendicular to the Y-axis. The second transition region 452 is inclined relative to the second upper planar region 451 and the second lower planar region 453. A second upper connecting line 454 is formed between the second transition region 452 and the second upper planar region 451. A second lower connecting line 455 is formed between the second transition region 452 and the second lower planar region 453. The second lower planar region 453 is closer to the fourth side 47 than the second upper planar region 451. The second transition region 452 extends from the second upper connecting line 454 to the second lower connecting line 455 while approaching the fourth side surface 47. In other words, if the distance on the Y axis between the second side surface 45 and the fourth side surface 47 is defined as the width, the width of the body 41 is greater than the width of the probe tip 43. The width of the probe tip 43 gradually decreases within the range of the second transition region 452, and is uniform within the range of the second lower flat region 453.

[0054] In this way, the portion of the probe tip 43 including the first and second transition regions 442, 452 is the probe tip tapered portion 431, and the portion including the first and second lower flat regions 443, 453 is the probe tip contact portion 432. The probe tip tapered portion 431 is located between the body 41 and the probe tip contact portion 432, and the cross-sectional area of ​​the probe tip tapered portion 431 gradually decreases from the body 41 toward the probe tip contact portion 432. The end of the probe tip contact portion 432 is a contact end 433, which is the farthest part of the probe tip 43 from the body 41. The contact end 433 is used to contact the conductive contact of the object to be measured. The probe tip tapered portion 431 can be gradually tapered to a required thickness and width, and the thickness and width of the probe tip contact portion 432 are required to be able to make point contact with the micro conductive contact. The body 41 has a relatively large thickness and width, so that the vertical probe 40 has good current resistance, structural strength, and service life. In this embodiment, the first and second transition regions 442 and 452 are inclined planes, respectively. The first and second transition regions 442 and 452 are not limited to inclined planes, and may be gradually reduced in thickness and width, for example, in a step shape.

[0055] As shown in FIGS. 5 to 8, the method for manufacturing the vertical probe 40 includes the following steps S11 to S14.

[0056] In step S11, a substrate 50A is provided (see FIG. 6). The substrate 50A is a plate made of a conductive material. The substrate 50A has a top surface 51 and a bottom surface 52 facing the opposite side to the direction in which the top surface 51 faces. In detail, the substrate 50A can utilize an alloy plate material or a plated plate material, and can use a long material. For example, the plate material can be a microelectronics mold or a metal hot-rolled mold.

[0057] In step S12, a laser processing method (laser ablation) is performed between a first position P1 and a second position P2 on the top surface 51 of the base material 50A to form one transition surface 511, which gradually extends from the first position P1 to the second position P2 as the transition surface 511 approaches the bottom surface 52. The transition surface 511 is not limited to an inclined plane, and may be, for example, stepped as long as it can gradually reduce the thickness of the base material 50A.

[0058] In step S13, a laser processing method is used to perform laser processing between the second position P2 and the third position P3 on the top surface 51 of the base material 50A to form one processing plane 512. In other words, after step S12 is completed, step S13 is subsequently performed by the same laser processing method to form the processing plane 512. As a result, the start position for forming the processing plane 512 becomes the end position (second position P2) for forming the transition surface 511, and the end position (third position P3) for forming the processing plane 512 becomes one end surface 53 of the base material 50A. The laser processing method (e.g., laser ablation) described in steps S12 and S13 is to directly apply laser light to the base material 50A, ablate the base material 50A by the energy of the laser light, and reduce the thickness of the base material 50A.

[0059] In step S14, a cutting process is performed to cut out the substrate 50A into at least one vertical probe 40. For example, the vertical probe 40 as shown in FIG. 2 is cut out along two cutting paths 54, 55 as shown in FIG. 8, such that the first upper planar region 441 of the first side 44 of the vertical probe 40 originates from the non-laser-processed portion (plane 513 shown in FIGS. 7 and 8) on the top surface 51 of the substrate 50A, the first transition region 442 originates from the transition surface 511 on the substrate 50A, the first lower planar region 443 originates from the processing plane 512 on the substrate 50A, and the second side 45 and the fourth side 47 are generated by the cutting process. More specifically, the cutting paths 54, 55 shown in FIG. 8 respectively form the fourth side 47 and the second side 45 of the vertical probe 40. The cutting path 55 cuts out the second upper planar region 451 , the second transition region 452 and the second upper planar region 453 of the second side 45 by two transition locations 551 , 552 .

[0060] In the present invention, the probe tip 43 of the vertical probe 40 is designed such that only the first side surface 44 and the second side surface 45 are not flush with the main body 41. The probe tip 43 is flush with the main body 41 at the third side surface 46 and the fourth side surface 47. Therefore, as shown in Figures 1 and 3, the vertical probe 40 is attached to the lower guide plate unit 30 so that the second side surface 45 faces in a direction in which the lower guide hole 33 is shifted along the first horizontal axis direction relative to the upper guide hole 23 (i.e., in the negative direction of the Y axis). The fourth side surface 47 abuts against the inner surface 331 of the lower guide hole 33 facing in the negative direction of the Y axis. In addition, when the upper guide hole 23 and the lower guide hole 33 are also offset in the second horizontal axis direction, the first side surface 44 faces in the direction in which the lower guide hole 33 is offset in the second horizontal axis direction (i.e., the positive direction of the X-axis) relative to the upper guide hole 23, and the third side surface 46 abuts against another inner surface 332 of the lower guide hole 33 facing in the positive direction of the X-axis.

[0061] As a result, the third side surface 46 and / or the fourth side surface 47 of the vertical probe 40, which are planar, come into contact with the inner surface 332 and / or the inner surface 331 of the lower guide 33. The third side surface 46 and the fourth side surface 47 have no step between the main body 41 and the probe tip 43. The structural strength of this portion is relatively good. As a result, when the contact end 433 of the probe tip 43 makes point contact with the object to be measured, even if the probe tip 43 moves up and down and retracts into the lower guide hole 33, the probe tip 43 is not easily broken by this. In addition, it is possible to prevent the contact end 433 from being unable to align with the conductive contact of the object to be measured due to the position of the probe tip 43 being shifted. In addition, the first side surface 44 of the vertical probe 40 is formed with a first transition region 442 and a first lower flat region 443 by a laser processing method. Therefore, the dimensional accuracy of the probe tip 43 can be improved. In addition, the second transition region 452 and the second lower flat region 453 on the second side 45 are also formed by the laser processing method. Therefore, the dimensional accuracy of the probe tip 43 can be further improved. This allows the tolerance of the vertical probe 40 to meet demand, and the manufacturing yield rate of the probe card can be increased.

[0062] Although the probe head 10 in this embodiment includes the upper and lower guide plate units 20, 30 through which the vertical probe 40 penetrates, the probe head 10 does not necessarily have to include the upper guide plate unit 20. The vertical probe 40 is provided penetrating the lower guide hole 33 of the lower guide plate unit 30, and if the third side surface 46 and / or the fourth side surface 47 abuts against the inner surface 332 and / or the inner surface 331 of the lower guide hole 33, the effect of the vertical probe 40 of the present invention described above can be achieved.

[0063] Preferably, as shown in FIG. 3, the first side 44 and the third side 46 of the vertical probe 40 have a width W1 of 30 micrometers to 100 micrometers at the main body 41. The second side 45 and the fourth side 47 also have a width W2 of 30 micrometers to 100 micrometers at the main body 41. In other words, in the above-mentioned manufacturing process, the thickness (corresponding to the width W2) of the base material 50A is 30 micrometers to 100 micrometers as shown in FIG. 6. The maximum distance (corresponding to the width W1) in the Y-axis of the two cutting paths 54, 55 shown in FIG. 8 is also 30 micrometers and 100 micrometers. Such dimensions are suitable for reducing the thickness and width of the probe tip by processing the first and second transition regions 442, 452 and the first and second lower flat regions 443, 453.

[0064] In this embodiment, the cross section of the main body 41 is square. That is, the widths W1 and W2 shown in FIG. 3 are equal. The cross section of the probe tip contact portion 432 is square, and the widths W3 and W4 are equal. In this way, the reduction amount of the probe tip width of the vertical probe 40 (i.e., the difference between W1 and W3) is equal to the reduction amount of the probe tip thickness (i.e., the difference between W2 and W4), and it is possible to avoid the occurrence of a large stress concentration in one horizontal axis direction. However, as shown in FIG. 9, the cross section of the main body 41 may be rectangular, and the cross section of the probe tip contact portion 432 may still be square. In addition, in the cross section of the main body 41, the short sides are located on the first side surface 44 and the third side surface 46, and the long sides are located on the second side surface 45 and the fourth side surface 47. Therefore, in the probe tip 43, the reduction amount at the first side surface 44 is greater than the reduction amount at the second side surface 45. That is, the distance D1 on the X-axis between the first upper flat area 441 and the first lower flat area 443 of the first side surface 44 is larger than the distance D2 on the Y-axis between the second upper flat area 451 and the second lower flat area 453 of the second side surface 45. In other words, the reduction in the cross-sectional area of ​​the probe tip 43 is relatively large on the first side surface 44 and relatively small on the second side surface 45. Such a probe tip 43 has a small degree of stress concentration on the second side surface 45. Therefore, by making the second side surface 45 face the horizontal axis direction (i.e., the Y axis) in which the relative displacement amount of the upper and lower guide plate units 20 and 30 is large, the vertical probe 40 is less likely to break. In addition, since the short side of the cross section of the main body 41 and the horizontal axis direction (i.e., the Y axis) in which the relative displacement amount is large are parallel, a good elastic deformation effect is obtained. Furthermore, the main body 41 may further include a slit (not shown) penetrating at least the first side surface 44 and the third side surface 46. This makes it possible to obtain a higher elastic deformation effect. Note that the cross-sectional shape of the probe tip contact portion 432 in the present invention is a square, and the cross-sectional shape of the main body 41 is a square or a rectangle, but the square or rectangle is not limited to a perfect square or rectangle, and also includes cases where the four corners of the square or rectangle are not perfect right angles due to processing errors or lead angles.

[0065] As shown in FIG. 2 and FIG. 4, in the present invention, the distance on the Z axis between the first lower connection line 445 and the contact end 433 is defined as the first height H1, and the distance on the Z axis between the second lower connection line 455 and the contact end 433 is defined as the second height H2, and in the first embodiment, the first height H1 is greater than the second height H2. When the probe tip 43 is in point contact with the object to be measured, stress is concentrated on the first and second transition regions 442, 452 and the first and second lower flat regions 443, 453, which causes a problem that these parts are relatively easy to break. By designing the first and second lower connection lines 445, 455 to have different heights, i.e., making the heights of the first and second lower flat regions 443, 453 different, the problem of stress concentration can be improved and the vertical probe 40 is less likely to break. In other words, the second height H2 may be greater than the first height H1, and the above-mentioned effect can be achieved if the first height H1 and the second height H2 are not equal. In order to realize such structural features, in the manufacturing method of the vertical probe 40, by the cutting process as shown in FIG. 8, the distance D3 on the Z axis between the position of the second lower connection line 455 (i.e., the turning position 552 of the cutting path 55) and the third position P3 is not equal to the distance D4 on the Z axis between the second position P2 and the third position P3.

[0066] The above-mentioned effect can be realized by designing the first and second upper connecting lines 444, 454 to have different heights. For example, as shown in FIG. 10, in the vertical probe according to the second embodiment of the present invention, the distance on the Z axis between the first upper connecting line 444 and the contact end 433 is defined as a third height H3, and the distance on the Z axis between the second upper connecting line 454 (i.e., the transition point between the second upper plane region 451 and the second transition region 452 on the second side surface 45) and the contact end 433 is defined as a fourth height H4, and the fourth height H4 is greater than the third height H3, or the third height H3 is greater than the fourth height H4. That is, the overall height of the first lower plane region 443 and the first transition region 442 is different from the overall height of the second lower plane region 453 and the second transition region 452. This can further improve the problem of stress concentration, making the vertical probe more difficult to break. In order to realize such a structural feature, the cutting process in the manufacturing method of the vertical probe is such that the distance D5 on the Z axis between the position of the second upper connecting line 454 (i.e., the turning position 551 of the cutting diameter 55) and the third position P3 is not equal to the distance D6 on the Z axis between the first position P1 and the third position P3, as shown in Fig. 11. In addition, in the present invention, the first and second lower connecting lines 445, 455 can be located at different heights, and at the same time, the first and second upper connecting lines 444, 454 can also be located at different heights. In this way, the problem of stress concentration can be further improved, and the vertical probe can be made more difficult to break.

[0067] In the first and second embodiments described above, the distance D7 between the second upper connecting line 454 and the second lower connecting line 455 is greater than the distance D8 between the first upper connecting line 444 and the first lower connecting line 445. As shown in FIG. 4, that is, the length of the second transition region 452 is greater than the length of the first transition region 442, and the second transition region 452 has a better stress dispersion effect than the first transition region 442. When the upper and lower guide plate units 20 and 30 are only displaced relative to each other in the Y-axis direction, or when the relative displacement amount of the upper and lower guide plate units 20 and 30 in the Y-axis direction is greater than the relative displacement amount of the upper and lower guide plate units 20 and 30 in the X-axis direction, the vertical probe 40 will be subjected to a large stress in the Y-axis where the relative displacement amount is large. The second transition region 452 faces the Y-axis and has a relatively long length, which can effectively disperse the relatively large stress that the vertical probe 40 will be subjected to in the Y-axis. Furthermore, the distances D7 and D8 can be designed according to a predetermined relative displacement amount on the X-axis and Y-axis of the upper and lower guide plate units 20 and 30. This can further improve the problem of stress concentration and make the vertical probe less likely to break.

[0068] As shown in FIGS. 12 to 13, a vertical probe 40 of the present invention is manufactured by another manufacturing method, which includes the following steps S21 to S23.

[0069] Step S21 provides a base material 50B (as shown in FIG. 13). The base material 50B is an elongated needle body made of a conductive material. The base material 50B has a top surface 51, a bottom surface 52 facing the opposite side to the top surface 51, and two side surfaces 56 and 57 facing the opposite sides to each other. For example, the needle body is formed by a micromachining process. Usually, a plurality of needle bodies are simultaneously formed on one substrate (not shown), and a post-process is simultaneously performed on these plurality of needle bodies to manufacture a plurality of vertical probes. FIG. 13 shows only one needle body in schematic form. At this time, a side profile required by the vertical probe 40 is formed. Thus, the side surfaces 56 and 57 of the needle body 50B become the fourth side surface 47 and the second side surface 45 (shown in FIG. 4) of the vertical probe 40, respectively. In other words, the needle body 50B provided by this step S21 already includes the second upper planar region 451, the second transition region 452, the second lower planar region 453, the second upper connecting line 454, and the second lower connecting line 455 of the second side 45 of the vertical probe 40. The maximum width and thickness of the base material 50B provided in this step S21 are finally equal to the width and thickness of the main body 41 of the vertical probe 40 after the manufacturing is completed, that is, W1 and W2 shown in FIG.

[0070] In other embodiments, the needle body may be formed by a laser processing method (e.g., laser cutting). Typically, multiple needle bodies are formed simultaneously on one substrate (not shown) to form the side profile required by the vertical probe 40. Thus, the sides 56 and 57 of the needle body 50B become the fourth side 47 and the second side 45 of the vertical probe 40, respectively (as shown in FIG. 4).

[0071] In step S22, a laser processing method (e.g., laser ablation) is used to form a first transition region 442 of the vertical probe 40 on the top surface 51 of the substrate 50B between the first position P1 and the second position P2 (as shown in FIG. 4).

[0072] In step S23, a laser processing method is used to form a first lower planar area 443 of the vertical probe 40 between the second position P2 and the third position P3 on the top surface 51 of the substrate 50B (as shown in FIG. 4).

[0073] In other words, following step S22, step S23 is performed by the same laser processing method so that the top surface 51 of the substrate 50B becomes the first side surface 44 of the vertical probe 40. The start position for forming the first lower planar region 443 is the end position (second position P2) for forming the first transition region 442, and the start position for forming the first lower planar region 443 (third position P3) is located at one end 58 of the substrate 50B.

[0074] In this manufacturing method, the distance D9 on the Z axis between the first position P1 and the third position P3 and the distance D10 on the Z axis between the second upper connection line 454 and the third position P3 may be made unequal, so that the first and second upper connection lines 444, 454 of the finally manufactured vertical probe 40 are not aligned with each other. That is, as shown in FIG. 10, the third height H3 and the fourth height H4 are different. This can improve the problem of stress concentration and make the vertical probe less likely to break. Also, the distance D11 on the Z axis between the second position P2 and the third position P3 and the distance D12 on the Z axis between the second lower connection line 455 and the third position P3 may be made unequal, so that the first and second lower connection lines 445, 455 of the finally manufactured vertical probe 40 are not aligned with each other. That is, as shown in FIG. 2, the first height H1 and the second height H2 are different. This can improve the problem of stress concentration and make the vertical probe less likely to break.

[0075] As shown in FIG. 14, the probe head according to the third embodiment of the present invention is similar to that according to the first embodiment. However, in this embodiment, two types of vertical probes 40, 40' are provided. The vertical probe 40 can adopt any of the above-mentioned aspects. The probe tip 43 is reduced at the first side 44 and the second side 45. Compared with the vertical probe 40, the vertical probe 40' is different in that the probe tip 43 does not have the first and second transition regions 442, 452 and the first and second lower flat regions 443, 453. That is, the first to fourth side surfaces 44-47 of the vertical probe 40' all extend in a plane from the main body 41 to the probe tip 43, so that the thickness and width of the probe tip 43 of the vertical probe 40' are not reduced and are equal to those of the main body 41. Therefore, the area of ​​the contact end 433 of the probe tip 43 of the vertical probe 40' is larger than the area of ​​the contact end 433 of the probe tip 43 of the vertical probe 40.

[0076] Thus, the probe head according to the embodiment shown in FIG. 14 is suitable for detecting a test object having microbumps. For example, FIG. 15 shows nine microbumps 61, 62 in a schematic manner. The microbumps may be arranged in a matrix. Also, three or four microbumps for transmitting a power signal or a ground signal may be arranged in a concentrated manner. In the embodiment shown in FIG. 15, all of the microbumps 61 are used to transmit a power signal, or all of the microbumps are used to transmit a ground signal. The microbumps 62 used to transmit a test signal are arranged in a non-concentrated manner. FIG. 15 shows the contact end 433 and the body 41 of two types of vertical probes 40, 40', and the lower guide hole 33 through which the vertical probes 40, 40' are provided. The contact end 433 of the vertical probe 40' is used to contact four microbumps 61 at the same time, and the contact end 433 of the vertical probe 40 is used to contact one microbump 62.

[0077] As a result, even if the dimensions of the probe tips 43 of the vertical probes 40, 40' are not the same, the dimensions of the main body 41 are approximately the same. This makes it easy to control the deformation amounts of the main body 41 of the vertical probes 40, 40' to be the same, generating uniform probe test results. In addition, the amounts of wear of the vertical probes 40, 40' can be made the same.

[0078] In particular, in the embodiment of Fig. 15, the contact end 433 of the vertical probe 40 is configured to contact four microbumps 61 simultaneously. However, this is not limited thereto, and the contact end 433 of the vertical probe 40 may be configured to contact a plurality of microbumps 61 simultaneously. For example, three, nine, or other quantities may be used. However, the contact end 433 of the probe tip 43 of the vertical probe 40 corresponds to a single microbump.

[0079] A person skilled in the art will understand that the thickness and width of the probe tip 43 of the vertical probe 40 can be appropriately reduced and proportional so that the contact end 433 of the probe tip 43 of the vertical probe 40 exactly corresponds to a single microbump 62. After the thickness and width of the probe tip 43 of the vertical probe 40 are reduced, the bodies 41 of the vertical probes 40, 40' are still aligned with each other. Therefore, the lower guide holes 33 for passing the vertical probes 40, 40' are also aligned with each other. That is, it is not necessary to design different arrangement methods of the lower guide holes 33 for the vertical probes 40, 40'. This simplifies the design of the lower guide holes 33, avoids the complicated design of the arrangement of the lower guide holes 33, and avoids the plate body of the lower guide plate unit 30 being damaged due to the variation in the interval.

[0080] A method for mounting the vertical probes 40, 40' in the upper guide hole 23 and the lower guide hole 33 will be described with an example. As shown in Figures 14, 15, and 1 and 4, the method for mounting the vertical probes 40, 40' in the lower guide plate unit 30 is as follows. The second side surface 45 faces the direction in which the lower guide hole 33 is shifted in the first horizontal axis direction relative to the upper guide hole 23 (i.e., the negative direction of the Y axis). The fourth side surface 47 abuts against the inner surface 331 of the lower guide hole 33 facing the negative direction of the Y axis. In a situation in which the upper guide hole 23 and the lower guide hole 33 are shifted from each other, the first side surface 44 faces the direction in which the lower guide hole 33 is shifted in the second horizontal axis direction relative to the upper guide hole 23 (i.e., the positive direction of the X axis). The third side surface 46 is made to abut against another inner surface 332 of the lower guide hole 33 facing in the positive direction of the X-axis.

[0081] Finally, it is reiterated that the components disclosed in the embodiments according to the present invention are for illustrative purposes only and do not limit the scope of the present invention, and that the replacement or modification of other equivalent components should be included in the scope of the claims of the present invention. [Explanation of symbols]

[0082] 10: Probe head 20: Upper guide plate unit 21:Top side 22: Lower side 23: Upper guide hole 30: Lower guide plate unit 31:Top side 32: Lower side 33: Lower guide hole 331, 332: Inner surface 40, 40´: Vertical probe 41: Main body 411: Upper mounting part 412: Lower mounting part 42: Probe rear end 43: Probe tip 431: Probe tip gradually narrowing section 432: Probe tip contact part 433: Contact end 44: The First Aspect 441: First upper plane region 442: First transition region 443: First lower plane area 444: First upper connecting line 445: First lower connecting line 45: The Second Side 451: Second upper plane area 452: Second transition region 453: Second lower plane area 454: Second upper connecting line 455: Second lower connecting wire 46: The Third Side 47: The Fourth Aspect 50A, 50B: Base material 51: Top 511: Transition surface 512: Machining plane 513: Plane 52: Bottom 53: End surface 54, 55: Cleavage pathway 551, 552: Switching position 56, 57: Side 58:Terminal 61, 62: Fine protrusion D1, D2, D3, D4, D5, D6, D7, D8, D9, D10, D11, D12: Distance H1: First height H2: Second height H3: The third height H4: The fourth height P1: First position P2: Second position P3: Third position P4: Fourth position S11, S12, S13, S14, S21, S22, S23 steps W1, W2, W3, W4 width

Claims

1. an elongated body extending in a longitudinal direction; a probe tip connected to the body and extending longitudinally from the body, the vertical probe includes a first side, a second side, a third side facing in a direction opposite to the direction in which the first side faces, and a fourth side facing in a direction opposite to the direction in which the second side faces, the third side and the fourth side extending in a plane from the body to the probe tip, the first side includes a first upper planar region located on the body, a first transition region located on the probe tip, and a first lower planar region located on the probe tip, the first transition region is located between the first upper planar region and the first lower planar region, a first upper connecting line is formed between the first transition region and the first upper planar region, a first lower connecting line is formed between the first transition region and the first lower planar region, the first lower planar region is closer to the third side than the first upper planar region, and the first transition region extends from the first upper connecting line to the first lower connecting line while approaching the third side; the second side includes a second upper planar region located on the body, a second transition region located on the probe tip, and a second lower planar region located on the probe tip, the second transition region is located between the second upper planar region and the second lower planar region, a second upper connecting line is formed between the second transition region and the second upper planar region, a second lower connecting line is formed between the second transition region and the second lower planar region, the second lower planar region is closer to the fourth side than the second upper planar region, and the second transition region extends from the second upper connecting line to the second lower connecting line while approaching the fourth side; the first transition region of the first side and the first lower planar region are realized by a laser processing method; A vertical probe.

2. 2. The vertical probe of claim 1, the probe tip has a contact tip that is furthest from the body, and when a distance between the first lower connection line and the contact tip in the longitudinal direction is defined as a first height, and a distance between the second lower connection line and the contact tip in the longitudinal direction is defined as a second height, the first height and the second height are not substantially equal; or the probe tip has a contact tip that is farthest from the body, and when a distance between the first upper connection line and the contact tip in the longitudinal direction is defined as a third height, and a distance between the second upper connection line and the contact tip in the longitudinal direction is defined as a fourth height, the third height and the fourth height are not substantially equal; or a distance between the second upper connecting line and the second lower connecting line is greater than a distance between the first upper connecting line and the first lower connecting line; A vertical probe.

3. 2. The vertical probe of claim 1, the first side, the second side, the third side, and the fourth side all have a width at the body between 30 micrometers and 100 micrometers; A vertical probe.

4. 2. The vertical probe of claim 1, the probe tip comprises a probe tip convergence section and a probe tip contact section, the probe tip convergence section comprises the first transition region and the second transition region, the probe tip contact section comprises the first lower planar region and the second lower planar region, the probe tip contact section has a square cross section, and the body has a square cross section; or the probe tip includes a probe tip convergence portion and a probe tip contact portion, the probe tip convergence portion includes the first transition region and the second transition region, the probe tip contact portion includes the first lower planar region and the second lower planar region, the second upper planar region and the second lower planar region of the second side are perpendicular to a first horizontal axis direction, the first upper planar region and the first lower planar region of the first side are perpendicular to a second horizontal axis direction, and a distance between the first upper planar region and the first lower planar region of the first side in the second horizontal axis direction is greater than a distance between the second upper planar region and the second lower planar region of the second side in the first horizontal axis direction; A vertical probe.

5. an upper guide plate unit including an upper guide hole; a lower guide plate unit including an upper surface, a lower surface, and a lower guide hole penetrating the upper surface and the lower surface; The vertical probe according to any one of claims 1 to 4, The body of the vertical probe includes an upper mounting portion and a lower mounting portion; the upper mounting portion and the lower mounting portion are provided to penetrate through the upper guide hole and the lower guide hole, respectively; The probe tip of the vertical probe is located below the lower surface of the lower guide plate unit. A probe head comprising:

6. 6. The probe head of claim 5, the probe head defines a first transverse axis direction and a second transverse axis direction that are perpendicular to each other; the upper guide hole and the lower guide hole are offset from each other along the first horizontal axis so that the fourth side surface of the vertical probe abuts against one inner surface of the lower guide hole; the upper guide hole and the lower guide hole are offset from each other along the second horizontal axis so that the third side surface of the vertical probe abuts against another inner surface of the lower guide hole; the upper guide hole and the lower guide hole are offset from each other along the first horizontal axis by a distance greater than the distance they are offset from each other along the second horizontal axis; A probe head comprising:

7. 6. The probe head of claim 5, the probe head further comprises another vertical probe; The other vertical probe is an elongated body extending in a longitudinal direction; a probe tip connected to the body and extending longitudinally from the body; the other vertical probe includes a first side, a second side, a third side facing in a direction opposite to the direction in which the first side faces, and a fourth side facing in a direction opposite to the direction in which the second side faces, the first side, the second side, the third side, and the fourth side of the other vertical probe extending in a plane from the body of the other vertical probe to the probe tip of the other vertical probe, the main body of the other vertical probe includes an upper mounting portion and a lower mounting portion, the upper mounting portion and the lower mounting portion of the other vertical probe being provided to penetrate through another upper guide hole of the upper guide plate unit and another lower guide hole of the lower guide plate unit, respectively; the probe tip of the other vertical probe is located below the lower surface of the lower guide plate unit; A probe head comprising:

8. A method for manufacturing a vertical probe used to manufacture the vertical probe according to claim 1, comprising the steps of: forming the first transition region by performing laser processing between a first position and a second position on a top surface of a substrate made of a conductive material using the laser processing method; and performing a laser treatment between the second position and a third position of the substrate by the laser treatment method to form the first lower planar region. A method for manufacturing a vertical probe comprising the steps of:

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