Manufacturing method of device

Abstract

To stably bond a mounted member.SOLUTION: A manufacturing method of a device contains: a step of exhausting a bonding material for fixing a mounted member to a predetermined position of a base body by bonding a mounting surface of the base body and a bonding surface of the mounted member from a nozzle of a bonding device where an outer edge-formed area of a tip end surface of the nozzle is 75% or larger of an area of the bonding surface, and coating, with the bonding material, a mounting surface in such a size and shape that at least one part of an outer edge of the bonding material is deviated from the bonding surface; and a step of distributing the mounted member to the predetermined position of the base body, further deviating at least one part of the bonding material nipped between the mounting surface and the bonding surface from the bonding surface by pressing force, and thereby bonding the mounted member to the base body.SELECTED DRAWING: Figure 3C

Description

[Technical field]

[0001] The present invention relates to a method for manufacturing a device such as a light emitting device, or to a light emitting device. [Background technology]

[0002] For example, a bonding material is used to fix a semiconductor chip in a predetermined position on a substrate. Patent Document 1 discloses a method of transferring a bonding material using a paste-like bonding material so that the applied thickness is thinner than the thickness of the semiconductor chip, taking into consideration the phenomenon that the bonding material creeps up onto the upper surface of the semiconductor chip. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] WO2011 / 121756 Summary of the Invention [Problem to be solved by the invention]

[0004] There is still room for improvement in the method of stably joining the mounted components, such as semiconductor chips, that are the objects to be mounted. [Means for solving the problem]

[0005] A method for manufacturing a device disclosed in an embodiment includes the steps of: ejecting a bonding material for bonding a mounting surface of a base and a bonding surface of a mounted component to fix the mounted component at a predetermined position on the base from a nozzle of a bonding device, the nozzle having an area of ​​the outer edge shape of the tip face of the nozzle that is 75% or more of the area of ​​the bonding surface, and applying the bonding material onto the mounting surface in a size and shape such that at least a portion of the outer edge of the bonding material extends beyond the bonding surface; and placing the mounted component at a predetermined position on the base, and pressing at least a portion of the bonding material sandwiched between the mounting surface and the bonding surface to further extend beyond the bonding surface, thereby bonding the mounted component to the base.

[0006] Moreover, the light emitting device disclosed in the embodiment comprises a light emitting element, a submount having a thickness of 150 μm or more and 500 μm or less and having the light emitting element arranged on its upper surface, a base on which the submount is mounted, an intervening portion provided between the submount and the base, and a protruding portion protruding from the submount, and a joint having a two-stage shape formed in at least a portion of the protruding portion, wherein, in a cross-sectional view, the outermost point of the upper stage of the two-stage shape is located outside and above the connection point between the upper and lower stages, and the apex of the upper stage is located away from the side of the submount. Effect of the Invention

[0007] In the manufacture of devices such as light emitting devices, mounted members can be stably joined, and devices such as light emitting devices can be provided with stable quality. [Brief description of the drawings]

[0008] [Figure 1] FIG. 1 is a flow diagram of a bonding method according to an embodiment. [Figure 2A] FIG. 2A is a schematic diagram of a bonding apparatus according to an embodiment. [Figure 2B] FIG. 2B is a plan view of a nozzle of the bonding apparatus according to the embodiment. [Figure 2C] FIG. 2C is a cross-sectional view of a nozzle of a bonding apparatus according to an embodiment. [Figure 3A] FIG. 3A is a top view for explaining an example of the positional relationship between a position where a bonding material is applied and a position where a mounted member is disposed in the bonding method according to the embodiment. [Figure 3B] FIG. 3B is a cross-sectional view for explaining an example of a state in which a bonding material is applied by a bonding apparatus in the bonding method according to the embodiment. [Figure 3C] FIG. 3C is a cross-sectional view for explaining an example of a state of the bonding material applied to the base body by the bonding apparatus in the bonding method according to the embodiment. [Figure 3D]FIG. 3D is a top view for explaining an example of a state of the bonding material applied to the base body by the bonding apparatus in the bonding method according to the embodiment. [Figure 3E] FIG. 3E is a top view for explaining another example of the positional relationship between the position where the bonding material is applied and the position where the mounted member is disposed in the bonding method according to the embodiment. [Figure 3F] FIG. 3F is a top view for explaining another example of the state of the bonding material applied to the base body by the bonding apparatus in the bonding method according to the embodiment. [Figure 3G] FIG. 3G is a top view for explaining another example of the state of the bonding material applied to the base body by the bonding apparatus in the bonding method according to the embodiment. [Figure 3H] FIG. 3H is a top view for explaining another example of the positional relationship between the position where the bonding material is applied and the position where the mounted member is disposed in the bonding method according to the embodiment. [Figure 3I] FIG. 3I is a top view for explaining another example of the positional relationship between the position where the bonding material is applied and the position where the mounted member is disposed in the bonding method according to the embodiment. [Figure 4A] FIG. 4A is a side view for explaining an example of a state in which a mounted member is joined to a base body by the joining method according to the embodiment. [Figure 4B] FIG. 4B is a side view for explaining another example of a state in which a mounted member is joined to a base body by the joining method according to the embodiment. [Figure 5A] FIG. 5A is a top view for explaining an example of a state of a bonding material applied to a base body by a bonding device in a conventional bonding method. [Figure 5B] FIG. 5B is a cross-sectional view for explaining an example of a state of a bonding material applied to a base body by a bonding device in a conventional bonding method. [Figure 5C] FIG. 5C is a side view for explaining an example of a state in which a mounted member is joined to a base body by a conventional joining method. [Figure 6]FIG. 6 is a graph comparing the application amount of bonding material between a conventional bonding method and the bonding method according to the embodiment. [Figure 7A] FIG. 7A is an image showing an example of a state in which a mounted member is peeled off from a base body when the mounted member is stably joined. [Figure 7B] FIG. 7B is an image showing an example of a state in which a mounted member is peeled off from a base body when the mounted member is not stably joined. [Figure 8A] FIG. 8A is an image showing an example of a state where the bonding is performed by the bonding method according to the embodiment. [Figure 8B] FIG. 8C is an image showing another example of a state bonded by the bonding method according to the embodiment. [Figure 8C] FIG. 8C is an image showing an example of a state where the bonding is performed by a conventional bonding method. [Figure 9] FIG. 9 is a perspective view of the light emitting device according to the embodiment. [Figure 10] FIG. 10 is a top view of the light emitting device according to the embodiment. [Figure 11] FIG. 11 is a top view for explaining the internal structure of the light emitting device according to the embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] In this specification and claims, polygons such as triangles and quadrangles are referred to as polygons, including shapes in which the corners of the polygons have been processed by rounding, chamfering, removing corners, rounding, etc. Furthermore, shapes in which processing has been applied not only to the corners (edges of the sides) but also to the middle parts of the sides are also referred to as polygons. In other words, shapes in which partial processing has been applied while leaving the polygon as the base are included in the interpretation of "polygon" described in this specification and claims.

[0010] This is not limited to polygons, but also applies to words expressing specific shapes such as trapezoids, circles, and irregular shapes. The same is true when dealing with each side that forms the shape. In other words, even if the corners or middle part of a side have been processed, the interpretation of "side" includes the processed part. Note that when distinguishing a "polygon" or "side" that has no processing from a processed shape, the word "strict" is added, for example, "strict quadrangle."

[0011] In addition, in this specification or the claims, expressions such as up and down, left and right, front and back, front and back, front and back, and the like merely describe relationships such as relative positions, orientations, and directions, and do not necessarily correspond to the relationships in use.

[0012] Hereinafter, the embodiments for carrying out the present invention will be described with reference to the drawings. However, although the embodiments shown embody the technical ideas of the present invention, they do not limit the present invention. In the following description, the same names and symbols indicate the same or similar components, and duplicated descriptions may be omitted as appropriate. Note that the sizes and positional relationships of the components shown in each drawing may be exaggerated to clarify the description.

[0013] <Joining method according to embodiment> A bonding method for mounting a mounted member on a base body in the manufacture of a device such as a light emitting device according to an embodiment will be described. FIG. 1 is a flow diagram of the bonding method. FIG. 2A is a schematic diagram of a bonding apparatus. FIG. 2B is a plan view of a nozzle portion of the bonding apparatus. FIG. 2C is a cross-sectional view of the nozzle portion of the bonding apparatus. FIGS. 3A to 3I are supplementary views for explaining each step of the bonding method according to an embodiment. FIGS. 4A and 4B are side views of a state in which a mounted member is bonded to a base body by the bonding method according to an embodiment.

[0014] The method for bonding a mounted member 1 according to the embodiment includes a step of applying a bonding material (step S1) and a step of bonding the mounted member (step S2). In the step S1 of applying the bonding material, the bonding material 2 is applied onto the base 10, and in the step S2 of bonding the mounted member, the mounted member 1 is bonded to the base 10 by the applied bonding material 2.

[0015] The mounted member 1 is a member to be mounted, such as a light emitting element in the manufacture of a light emitting device. The base 10 has a mounting surface on which the mounted member 1 is mounted, such as a flat board. The bonding material 2 is a material that bonds the mounted member 1 to the base 10. A bonding device 3 is used to apply the bonding material 2.

[0016] (Bonding device 3) 2A to 2C, the bonding device 3 has a syringe 31 and a nozzle 32. The syringe 31 is filled with the bonding material 2. The bonding material 2 filled in the syringe 31 is discharged from the nozzle 32 with the amount of the bonding material 2 being controlled by a drive circuit of the bonding device 3. The syringe 31 can be filled with 1 ml or more of the bonding material 2.

[0017] (Nozzle 32) The tip of the nozzle 32 has a discharge portion 33, an inner portion 34, a tip surface 35, and one or more outer surfaces 36. The bonding material 2 filled in the syringe 31 is discharged from the tip of the nozzle 32. The bonding material 2 can be a paste material in which metal particles are dispersed in a resin or an organic solvent.

[0018] Examples of the paste material include metal paste materials such as Au paste and Ag paste. Other examples include epoxy-based and silicone-based resin paste materials. The bonding material 2 may have a viscosity of 10 Pa·s or more and 150 Pa·s or less. In the bonding apparatus 3 shown in the figure, an Au paste material with a viscosity of 40 Pa·s or more and 70 Pa·s or less is used as the bonding material 2.

[0019] In the discharge part 33, a discharge port is formed through which the bonding material 2 filled in the syringe 31 is discharged. One or more discharge ports are formed in the discharge part 33. In the illustrated bonding apparatus 3, there is one discharge port, but there may be multiple discharge ports.

[0020] The ejection port is formed to be circular in plan view. The shape is not limited to a circle, and may be an ellipse or a rectangle. The maximum length of the ejection port is 0.05 mm or more and 0.5 mm or less in plan view. The area of ​​the ejection port is 0.002 mm 2 More than 0.2mm 2 This allows the bonding material 2 to be applied in an appropriate shape (form and size). The maximum length and area of ​​the discharge port are not necessarily limited to these ranges.

[0021] Although details will be described later, among the areas where the bonding material 2 is applied, the area located directly below the discharge port has a thicker bonding material 2 than the outer peripheral area 21. The central area 22, which is the area where the bonding material 2 applied to the application surface is relatively thick, can be considered to be the area directly below the discharge port. Note that due to the properties of the bonding material 2, such as its viscosity, there may be some deviation between the central area 22 and the area directly below the discharge port. In any case, the central area 22 can be formed in an appropriate shape depending on the shape of the discharge port.

[0022] The inner encapsulant part 34 has one or more containing surfaces for applying the bonding material 2 discharged from the discharge port in a predetermined shape. In a plan view, the discharge port is surrounded by the inner encapsulant part 34. When applying the bonding material 2, the bonding material 2 discharged from the discharge port is surrounded by one or more containing surfaces of the inner encapsulant part 34 and the application surface onto which the bonding material 2 is applied, and is in a state of being contained within the inner encapsulant part 34.

[0023] The outer edge of the inner packet part 34, which is formed by one or more inner packet surfaces, has a circular shape. The outer edge of the inner packet part 34 is not limited to a circular shape, and may be an ellipse, a rectangle, or the like. The maximum length of the outer edge of the inner packet part 34 is between 0.5 mm and 2 mm. The area of ​​the outer edge of the inner packet part 34 is less than 0.2 mm. 2 More than 3.14mm 2This allows the outer edge of the applied bonding material 2 to be shaped in an appropriate manner. Note that the maximum length and area of ​​the outer edge shape of the inner packet part 34 do not have to be limited to these ranges.

[0024] When the bonding material 2 is applied, the bonding material 2 discharged from the discharge port extends beyond the outer edge of the inner packet part 34. The outer edge shape of the bonding material 2 applied to the application surface may correspond to the outer edge shape of the inner packet part 34. That is, the outer edge shape of the applied bonding material 2 may be the same as or approximately the same as the outer edge shape of the inner packet part 34. The shape of the applied bonding material 2 may also be smaller than the outer edge shape of the inner packet part 34.

[0025] For example, nozzles 32 may be used in which the outer edge shape of the inner packet part 34 and the shape of the discharge port are respectively a circle with a diameter of 0.5 mm and a circle with a diameter of 0.1 mm, a circle with a diameter of 0.9 mm and a circle with a diameter of 0.2 mm, or a circle with a diameter of 1.1 mm and a circle with a diameter of 0.3 mm. It should be noted that nozzles 32 are not limited to these examples.

[0026] The one or more inner surfaces include an opposing surface that defines the discharge port and faces the application surface. The one or more inner surfaces include an inner surface that intersects with the tip surface 35. In the inner container part 34, the area between the opposing surface and the inner surface is R-shaped, and the opposing surface and the inner surface can also be considered as one continuous surface that is connected. Note that the inner container part 34 may have a shape in which the opposing surface and the inner surface intersect and can each be considered as a surface separately. In a plan view, the center position of the outer edge shape of the inner container part 34 overlaps with the discharge port.

[0027] The tip surface 35 is the surface that is closest to the application surface when the bonding material 2 is applied. The tip surface 35 surrounds the inner packet part 34. The tip surface 35 is annular. The inner and outer edges of the tip surface 35 are circular. The shape of the inner edge of the tip surface 35 is the same as or similar to the shape of the outer edge of the inner packet part. The tip surface 35 intersects with the outer edge of the inner packet part 34.

[0028] The tip surface 35 is a flat surface, and the discharge portion 33 and the inner encapsulation portion 34 are recessed inward from an imaginary plane including the tip surface 35. If the tip surface 35 is the lower surface of the nozzle 32, it can be said that the discharge portion 33 and the inner encapsulation portion 34 are formed above an imaginary plane including the tip surface 35. The discharge portion 33 and the inner encapsulation portion 34 are formed above an imaginary plane including the inner edge of the tip surface 35. The discharge portion 33 and the inner encapsulation portion 34 are formed above an imaginary plane including the outer edge of the tip surface 35.

[0029] Tip surface 35 is parallel to the facing surface of inner packet part 34. An imaginary plane including the inner edge of tip surface 35 is parallel to the facing surface of inner packet part 34. An imaginary plane including the outer edge of tip surface 35 is parallel to the facing surface of inner packet part 34. In plan view, the centre of the inner edge shape of tip surface 35 overlaps with the discharge outlet. In plan view, the centre of the outer edge shape of tip surface 35 overlaps with the discharge outlet.

[0030] The maximum height from the tip surface 35, a virtual plane including the inner edge of the tip surface 35, or a virtual plane including the outer edge of the tip surface 35 to the opposing surface of the inner container part 34 is 20 μm or more and 80 μm or less. By setting the maximum height within this range, the bonding material 2 can be applied thinly. As will be described in detail later, in the region where the bonding material 2 is applied, the thickness of the outer peripheral region 21, which is the region where the bonding material 2 is applied thinly, can be 50 μm or less. Note that this maximum height does not have to be limited to this range, and can be greater than 80 μm or less than 20 μm.

[0031] When the bonding material 2 is applied, the bonding material 2 discharged from the discharge port remains near the outer edge of the tip surface 35 or extends beyond the outer edge. Therefore, the outer edge shape of the bonding material 2 applied to the application surface can be a shape corresponding to the outer edge shape of the tip surface 35. In other words, the outer edge shape of the applied bonding material 2 can be the same as the outer edge shape of the tip surface 35 or can be approximately the same as the outer edge shape of the tip surface 35. Note that the shape of the applied bonding material 2 can also be smaller than the outer edge shape of the tip surface 35.

[0032] It should be noted that the bonding device 3 does not necessarily have to have an enclosed part 34. In this case, the tip surface 35 defines the discharge outlet in place of the opposing surface of the enclosed part 34. The tip surface 35 in such a bonding device 3 is provided in a region that combines the tip surface 35 of the bonding device 3 shown in plan view and the opposing surface of the enclosed part 34. It can also be said that the tip surface 35 is both the tip surface 35 and the opposing surface.

[0033] Therefore, including such forms, it can be said that in the bonding device 3, the maximum height from the tip surface 35, an imaginary plane including the inner edge of the tip surface 35, or an imaginary plane including the outer edge of the tip surface 35 to the opposing surface of the encapsulation portion 34 is preferably greater than 0 μm and less than 80 μm, or 0 μm (i.e., no encapsulation portion 34 is present).

[0034] The one or more outer surfaces 36 have the same shape as the outer edge of the inner packet part 34, and are larger than the outer edge of the inner packet part 34. The one or more outer surfaces 36 intersect with the tip surface 35. In plan view, the outer edge shape of the one or more outer surfaces 36 matches the combined outer edge shape of the inner packet part 34 and the tip surface 35.

[0035] In plan view, the width of the tip surface 35 can be half the maximum length of the outer edge shape of one or more outer surfaces 36 minus the maximum length of the outer edge shape of the inner container part 34. The width of this tip surface 35 is preferably 0.05 mm or more and 0.5 mm or less. By making it 0.5 mm or less, it is possible to suppress variation in the shape of the applied bonding material 2. In addition, by making it 0.05 mm or more, it is possible to maintain the strength of the tip of the nozzle 32 and to make it less likely that the nozzle 32 will be damaged due to contact with the base 10, etc.

[0036] (Joining method: process of applying adhesive) In step S1 of applying the bonding material, the nozzle 32 of the bonding device 3 is placed at a predetermined application position on the base 10, and the bonding material 2 is discharged from the discharge unit 33. The application position of the bonding material 2 is determined based on the position on the base 10 where the mounted member 1 is to be placed and mounted. In other words, in order to apply the bonding material 2 to fix the mounted member 1 to a predetermined position on the base 10, the predetermined position on the mounting surface of the base 10 where the mounted member 1 is to be placed, and the size and shape of the bonding surface of the mounted member 1 facing the mounting surface of the base 10 are parameters for determining the application position.

[0037] 3A, in this process, the application position of the bonding material 2 is determined based on the position where the bonding surface of the mounted member 1 is mounted, so that the outer edge of the tip surface 35 fits within the bonding surface of the mounted member 1 when viewed from above. In other words, the outer edge shape of the tip surface 35 is a size and shape that fits within the inside of the bonding surface of the mounted member 1.

[0038] The bonding apparatus 3 preferably satisfies the condition that the area of ​​the outer edge shape of the tip surface 35 is 75% or more and 100% or less of the area of ​​the bonding surface of the mounted member 1. By satisfying this condition, even if the outer edge shape of the tip surface 35 is contained inside the bonding surface of the mounted member 1, a sufficient bonding area for the bonding material 2 can be secured, and the mounted member 1 can be stably bonded.

[0039] Furthermore, the application position of the bonding material 2 is determined so that there is an imaginary straight line that intersects with the outer edge of the tip surface 35 at two points and passes through the bonding surface of the mounted member 1 when viewed from above. This imaginary straight line preferably satisfies the condition that the length (distance) between the two points where this line intersects with the outer edge of the tip surface 35 is 80% or more and 100% or less of the length of this line passing through the bonding surface of the mounted member 1. By satisfying this condition, after the bonding process is completed, a part of the bonding material 2 can be made to protrude from the bonding surface of the mounted member 1, and the bonding state can be confirmed. In addition, the amount of bonding material 2 used for bonding can be reduced.

[0040] These conditions based on the area ratio and length ratio may also be affected by differences in the outer edge shape of tip end face 35 and the shape of the bonding surface of mounted member 1. As an example, when the outer edge shape of tip end face 35 is circular and the shape of the bonding surface of mounted member 1 is rectangular with an aspect ratio of 0.4 to 1, the bonding method according to the embodiment satisfies the above-mentioned area ratio condition, length ratio condition, or both.

[0041] The mounted member 1 is not particularly limited as long as it is an object to be mounted on the base 10. Examples of the mounted member 1 include a light-emitting element and a submount. It may also be a reflective member such as a mirror, an optical member such as a lens, or a light-emitting device. In the illustrated example of the bonding method, a submount on which a light-emitting element is disposed and whose bonding surface that bonds with the mounting surface of the base 10 is rectangular is used as the mounted member 1.

[0042] The area of ​​the joint surface of the mounted component 1 is 0.5 mm 2 More than 3mm 2 or less. Also, the height of the mounted member 1 from the joining surface is 150 μm or more and 500 μm or less. In the joining method according to the embodiment, a mounted member 1 that satisfies this condition is adopted, and stable joining can be realized. Note that even if it is outside the range of this condition, it is possible to realize stable joining by applying the joining method according to the embodiment.

[0043] 3E, in this step, the application position of the bonding material 2 may be determined so that at least a part of the outer edge of the tip surface 35 protrudes from the mounted member 1. Furthermore, the application position of the bonding material 2 may be determined so that at least a part of the bonding material 2 protrudes from two opposing points sandwiching the mounted member 1.

[0044] Hereinafter, in step S1 of applying the bonding material, the case where the outer edge of the tip face 35 does not protrude from the bonding surface of the mounted member 1 and the case where it does protrude are referred to simply as the "bonding method that does not allow protrusion" and the "bonding method that allows protrusion", respectively. Note that, although details will be described later, in either bonding method, at least a part of the applied bonding material 2 may protrude from the bonding surface of the mounted member 1.

[0045] In the protruding joining method, as shown in Fig. 3E, the outer edge shape of the tip surface 35 may be sized and shaped to protrude from only a part of the outer edge of the joining surface of the mounted member 1, or as shown in Figs. 3H and 3I, the outer edge shape of the tip surface 35 may be sized and shaped to protrude from the entire outer edge of the joining surface of the mounted member 1. In either case, the mounted member 1 can be stably joined.

[0046] In the former case, the condition for the above-mentioned area ratio preferably satisfies the condition that the area of ​​the outer edge shape of the tip face 35 is 80% or more and 200% or less of the area of ​​the bonding surface of the mounted member 1. By satisfying this condition, a sufficient bonding area for the bonding material 2 can be secured. If it exceeds 200%, the application area of ​​the bonding material 2 applied to the mounting surface of the base 10 may become too large.

[0047] Moreover, the condition for the above-mentioned length ratio is preferably that the length (distance) between two points where the imaginary line intersects with the outer edge of the inner portion 34 is more than 100% and not more than 120% of the length of this line passing through the joining surface of the mounted component 1. By satisfying this condition, the amount of bonding material 2 used for joining can be reduced. If it exceeds 120%, the application area of ​​the bonding material 2 applied to the mounting surface of the base 10 may become too large.

[0048] In the latter case, the condition for the above-mentioned area ratio preferably satisfies the condition that the area of ​​the outer edge shape of the tip surface 35 exceeds 100% and is not more than 230% of the area of ​​the bonding surface of the mounted member 1. By satisfying this condition, a sufficient bonding area for the bonding material 2 can be secured. On the other hand, if it exceeds 230%, the application area of ​​the bonding material 2 applied to the mounting surface of the base 10 may become too large.

[0049] Moreover, the condition for the above-mentioned length ratio is preferably that the length (distance) between two points where the imaginary line intersects with the outer edge of inner portion 34 is more than 100% and not more than 120% of the length of this line passing through the bonding surface of mounted component 1. If it exceeds 120%, the application area of ​​bonding material 2 applied to the mounting surface of base 10 may become too large.

[0050] In the following, unless otherwise specified, the protruding joining method will be described based on the former case as shown in Fig. 3E. Note that, among the explanations based on the former case, the contents that apply based on Fig. 3H or Fig. 3I also apply to the latter case.

[0051] In the case of the protruding bonding method, the nozzle 32 of the bonding device 3 has a size such that at least a part of the outer edge of the nozzle 32 tip protrudes from the bonding surface of the mounted member 1. The outer edge of the nozzle 32 tip is partially or entirely larger than the bonding surface of the mounted member 1. Here, the outer edge of the nozzle 32 partially larger than the bonding surface means that the maximum length of the outer edge shape of the nozzle 32 tip is larger than the length in at least one direction of the bonding surface of the mounted member 1. Alternatively, the minimum length of the bonding surface of the mounted member 1 is smaller than the length in at least one direction of the outer edge shape of the nozzle 32 tip. Note that even if the "outer edge of the nozzle 32 tip" is replaced with the "outer edge shape of the tip surface 35", it can be said that the nozzle 32 has a size such that at least a part of the nozzle 32 protrudes from the bonding surface of the mounted member 1. In the bonding device 3 shown in the figure, the outer edge of the tip surface 35 is also the outer edge of the nozzle 32 tip.

[0052] For example, if the joining surface of the mounted member 1 is rectangular and the outer edge shape of the tip surface 35 is circular, the diameter of the outer edge of the tip surface 35 is larger than the short sides of the rectangle. Also, this diameter is smaller than the long sides of the rectangle. At least a part of the outer edge of the tip of the nozzle 32 protrudes from the two opposing long sides of the joining surface of the mounted member 1. Note that this diameter may be larger than the long sides of the rectangle. In this case, at least a part of the outer edge of the tip of the nozzle 32 protrudes from the four sides of the joining surface of the mounted member 1.

[0053] The bonding material 2 discharged from the discharge portion 33 is filled between the mounting surface of the base 10 and the inner portion 34. Thereafter, the bonding device 3 is lifted up, whereby the bonding material 2 is applied to the mounting surface of the base 10.

[0054] At the stage when the bonding device 3 is lifted up, the bonding material 2 applied to the mounting surface of the base 10 becomes larger than the outer edge of the tip surface 35. Figures 3D and 3F respectively show the size of the bonding material 2 applied to the mounting surface of the base 10 in the non-overflow bonding method and the overflow bonding method.

[0055] 3D and 3F, the outer edge of the bonding material 2 is outside the outer edge of the tip surface 35. At least a part of the bonding material 2 protrudes from the bonding surface of the mounted member 1 to be mounted on the base 10. In other words, the bonding material 2 is applied onto the mounting surface of the base 10 with a size and shape such that at least a part of the outer edge of the bonding material 2 protrudes from the bonding surface of the mounted member 1.

[0056] 3E, the application position of the bonding material 2 by the bonding device 3 may be determined so that at least a part of the outer edge of the tip surface 35 protrudes from the mounted member 1, and then, as shown in FIG. 3G, the bonding material 2 may be provided so that it remains inside the outer edge of the tip surface 35. In this case, too, the bonding material 2 is applied with a size and shape such that at least a part of the bonding material 2 protrudes from the bonding surface of the mounted member 1 to be mounted on the base 10.

[0057] In the non-overflow bonding method, the outer edge of the bonding material 2 applied so that the outer edge of the tip surface 35 fits within the bonding surface of the mounted component 1, at least a portion of which overflows from the bonding surface of the mounted component 1 when the bonding device 3 is lifted up. In other words, in the non-overflow bonding method, the bonding material 2 is applied so that at least a portion of the bonding material 2 applied to the mounting surface of the base 10 overflows from the bonding surface of the mounted component 1 when the bonding material 2 applied to the mounting surface of the base 10 is separated from the bonding device 3.

[0058] The bonding material 2 applied to the mounting surface of the base 10 has a raised central region 22 located directly below the discharge port. This raised portion is formed by lifting up the bonding device 3. The bonding material 2 applied to the base 10 has an outer circumferential region 21 that is flat and has a substantially constant thickness, and a central region 22 that is surrounded by the outer circumferential region 21 and raised from the outer circumferential region 21.

[0059] The outer peripheral region 21 of the bonding material 2 can be formed so that its thickness (height) from the mounting surface of the base 10 is less than 50 μm. It does not have to be less than 50 μm, and the thickness of the outer peripheral region 21 is preferably formed to be 5 μm or more and less than 80 μm. This makes it possible to suppress the maximum height of the bonding material 2 when the mounted member 1 is bonded.

[0060] The central region 22 of the bonding material 2 is a region that is more central than the outer periphery region 21. The central region 22 is surrounded by the outer periphery region 21. The central region 22 is a region of a size and shape that fits within the bonding surface of the mounted member 1 in a top view.

[0061] The central region 22 has a thickness (height) from the mounting surface of the base 10 that is greater than that of the outer circumferential region 21. The maximum thickness of the central region 22 is 100 μm or more. This allows the bonding material 2 in the central region 22 to protrude sufficiently. The maximum thickness of the central region 22 may be less than 100 μm.

[0062] The maximum thickness of the central region 22 is preferably 50 μm or more larger than the maximum thickness of the outer peripheral region 21. If the difference in thickness between the central region 22 and the outer peripheral region 21 is small, the bonding material 2 in the central region 22 may not sufficiently protrude from the bonding surface, making it difficult to confirm that the bonding state is stable.

[0063] (Joining method: process of joining mounted components) In step S2 of bonding the mounted member, the mounted member 1 is placed at a predetermined position on the mounting surface of the base 10 from above the mounting surface of the base 10. In relation to the mounted member 1 located above the mounting surface of the base 10, the bonding material 2 has a central region 22 covered by the mounted member 1 in top view, and at least a part of its outer edge protrudes from the mounted member 1.

[0064] The bonding material 2 applied to the base 10 is sandwiched and pressed between the mounting surface of the base 10 and the bonding surface of the mounted member 1. This pressing causes at least a portion of the bonding material 2 to protrude from the bonding surface of the mounted member 1. In other words, a portion of the bonding material 2 protrudes from the bonding surface of the mounted member 1 due to the step S1 of applying the bonding material, and a further portion of the bonding material 2 protrudes from the bonding surface of the mounted member 1 due to the step S2 of bonding the mounted member 1.

[0065] The bonding material 2 in the central region 22 is pushed outward. A part of the bonding material 2 in the central region 22 protrudes from the mounted member 1 in a top view. The outer edge of the bonding material 2 after pressing is defined further outward than the outer peripheral region 21 of the bonding material 2 applied in the step S1 of applying the bonding material. The bonding material 2 is cured in the protruding state, and the mounted member 1 is bonded to the base 10.

[0066] Furthermore, even before the bonding material 2 protrudes due to pressure, at least a portion of the bonding material 2 in the outer peripheral region 21 is of a size and shape that causes it to protrude from the bonding surface of the mounted member 1, so after pressure is applied, both the bonding material 2 applied to the outer peripheral region 21 and the bonding material 2 applied to the central region 22 will protrude from the mounted member 1.

[0067] When pressed, the bonding material 2 protrudes from at least 50% of the outer edge of the bonding surface of the mounted component 1. Note that the portion that protrudes due to pressing is at least 50%, and the portion that would have protruded from the bonding surface even without pressing is not taken into consideration. It is preferable that the bonding material 2 protrudes from at least two-thirds of the outer edge of the bonding surface of the mounted component 1 when pressed. The degree of bonding of the bonding material 2 can be determined by the degree of protrusion, and when using this method to confirm that bonding is sufficient, it can be determined that the bonding is stable when the proportion of the portion of the bonding material 2 that protrudes compared to the total length of the outer edge is large.

[0068] In the bonding method without protruding, when comparing the state before pressing the bonding material 2 with the state in which the mounted member 1 is bonded to the base 10, the proportion of the bonding material 2 protruding from the outer edge of the bonding surface of the mounted member 1 is greater in the bonded state. In the state in which the bonding material 2 protrudes due to pressing, or in the state in which the mounted member 1 is bonded to the base 10, the bonding material 2 is caused to protrude from at least two sides of the rectangular bonding surface of the mounted member 1 by pressing. Note that these two sides are preferably opposite sides. Also, it may be made to protrude from three sides or four sides.

[0069] In the bonding method in which the bonding material 2 protrudes, when the state before pressing the bonding material 2 is compared with the state in which the mounted member 1 is bonded to the base 10, the proportion of the bonding material 2 protruding from the outer edge of the bonding surface of the mounted member 1 is equal or greater in the bonded state. In the state in which the bonding material 2 protrudes due to pressing or in the state in which the mounted member 1 is bonded to the base 10, the bonding material 2 is caused to protrude from at least two sides of the rectangular bonding surface of the mounted member 1 by pressing. Note that these two sides are preferably opposite sides. Also, the bonding material 2 may protrude from three or four sides.

[0070] In addition, for a mounted member 1 having a rectangular bonding surface, it is preferable that the number of sides on which the bonding material 2 protrudes when the mounted member 1 is bonded to the base 10 is greater than the number of sides on which the bonding material 2 protrudes before the bonding material 2 is pressed.

[0071] Here, the portion of the bonding material 2 that protrudes from the bonding surface of the mounted member 1 in top view is referred to as a protruding portion 24. On the other hand, the portion that does not protrude from the bonding surface of the mounted member 1 and is provided between the base 10 and the mounted member 1 is referred to as an interposed portion 23.

[0072] When a bonding material 2 having a viscosity of 40 Pa·s to 120 Pa·s is used, the protruding portion of the bonding material 2 will have a shape that bulges outward. Note that a shape that bulges outward can occur not only when the bonding material 2 has a viscosity of 40 Pa·s to 120 Pa·s.

[0073] When the mounted member 1 is joined to the base 10, the protruding portion 24 of the bonding material 2 contacts the side surface of the mounted member 1 that intersects with the joining surface of the mounted member 1. The highest point of the bonding material 2 from the mounting surface of the base 10 is located outside the side surface of the mounted member 1. In other words, this highest point is located away from the side surface of the mounted member 1. The highest point of the bonding material 2 from the mounting surface of the base 10 in the area where the bonding material 2 contacts the side surface of the mounted member 1 is lower than the highest point of the protruding portion 24 of the bonding material 2.

[0074] When the mounted member 1 is bonded to the base 10, or when the bonding material 2 is cured, the bonding material 2 has a shape as shown in Fig. 4A or Fig. 4B. Here, each of these shapes will be described.

[0075] Fig. 4A is a side view showing an example of a state in which a mounted member 1 is joined to a base 10. Fig. 4A shows a case in which a mounted member 1 is joined to a base 10 such that an outer edge of a protruding portion 24 of the bonding material 2 produced by step S2 of joining the mounted member is positioned outside an outer edge of the bonding material 2 applied in step S1 of applying the bonding material. In this case, the protruding portion 24 of the bonding material 2 appears to have a single step shape.

[0076] Such a shape of the bonding material 2 is formed when bonding is performed using a bonding method that does not allow the bonding material to protrude. Note that the shape can also be formed when bonding is performed using a bonding method that allows the bonding material to protrude.

[0077] The protruding portion 24 of the bonding material 2 includes the bonding material 2 applied to the outer peripheral region 21 in step S1 of applying the bonding material and the bonding material 2 applied to the central region 22. The maximum distance from the bonding surface of the mounted member 1 to the outer edge of the protruding portion 24 of the bonding material 2 is more than 1 time and not more than 5 times the maximum distance from the bonding surface of the mounted member 1 to the outer edge of the bonding material 2 at the stage when it is applied in step S1 of applying the bonding material. Preferably, it is not more than 3 times. This makes it possible to reduce the amount of bonding material 2 to be applied.

[0078] Fig. 4B is a side view showing another example of a state in which the mounted member 1 is joined to the base 10. Fig. 4B shows a case in which the mounted member 1 is joined to the base 10 such that the outer edge of the protruding portion 24 of the bonding material 2 produced by step S2 of joining the mounted member is positioned inside the outer edge of the bonding material 2 applied in step S1 of applying the bonding material. In this case, the protruding portion 24 of the bonding material 2 appears to have a two-step shape.

[0079] Such a shape of the bonding material 2 is formed when bonding is performed using a bonding method that causes the bonding material to protrude. Note that the shape can also be formed when bonding is performed using a bonding method that does not cause the bonding material to protrude.

[0080] In the protruding portion 24 of the bonding material 2, the lower step 26 of the two-step shape includes the bonding material 2 applied to the outer circumferential region 21 in the step S1 of applying the bonding material, but does not include the bonding material 2 applied to the central region 22. Therefore, the thickness of the lower step 26 of the two-step shape is equal to the thickness of the outer circumferential region 21. Note that the word "equal" here allows for a difference in thickness that varies as the bonding material 2 hardens.

[0081] The two-step upper step 25 includes the bonding material 2 applied to the outer peripheral region 21 in step S1 of applying the bonding material and the bonding material 2 applied to the central region 22. The maximum height of the two-step upper step 25 from the mounting surface of the base 10 is at least 2 times and at most 20 times the maximum height of the two-step lower step 26 from the mounting surface of the base 10.

[0082] The outermost point of upper stage 25 in the two-stage shape is located outside and above the connecting point between upper stage 25 and lower stage 26, and the apex of upper stage 25 is located away from the side of mounted member 1. The connecting point between upper stage 25 and lower stage 26 can be said to be the intersection point between outer circumferential region 21 of bonding material 2 applied in step S1 of applying the bonding material and bonding material 2 protruding in step S2 of bonding the mounted member.

[0083] The distance from an imaginary plane including the side surface of the mounted member 1 with which the two-stage upper stage 25 contacts to the outermost point of the two-stage lower stage 26 in a direction perpendicular to the plane is more than 1 time and not more than 3 times the distance to the outermost point of the two-stage upper stage 25 in a direction perpendicular to the plane. Preferably, it is not more than 1.5 times. This makes it possible to suppress the degree of protrusion of the upper stage 25 relative to the degree of protrusion of the two-stage lower stage 26.

[0084] Next, the bonding method according to the embodiment will be described in comparison with a conventional bonding method. First, the conventional bonding method will be described. Figs. 5A to 5C are diagrams for explaining the shape of the bonding material 2 applied by the conventional bonding method. Fig. 5A is a top view showing an application area of ​​the bonding material 2 on the mounted member 1 placed on the base 10. Fig. 5B is a cross-sectional view showing the shape of the bonding material 2 applied to the base 10. Fig. 5C is a side view showing the state in which the mounted member 1 is bonded to the base 10 by this conventional bonding method.

[0085] As shown in Fig. 5A, in the conventional bonding method, the bonding material 2 is applied only to the central region 22. The bonding material 2 is applied from the outer edge of the bonding surface of the mounted member 1 to a position sufficiently inward. Also, as shown in Fig. 5B, in the conventional bonding method, the bonding material 2 is applied in a drop-like shape to the central region 22. Then, as shown in Fig. 5C, the bonding material 2 is pressed by the mounted member 1, and hardened in a state in which part of the bonding material 2 protrudes from the mounted member 1.

[0086] As described above, the conventional bonding method does not involve a processing step of applying bonding material 2 so as to take into account the shape of the bonding surface of the mounted component 1 and to cover a sufficient area of ​​the bonding surface, and therefore tends to require a greater amount of bonding material 2 to be applied than in the bonding method of the embodiment.

[0087] For example, one method of judging whether the bonding material 2 has stably bonded the mounted member 1 to the base 10 is to check whether the bonding material 2 protrudes from the mounted member 1. When using this judging method, it is necessary to adjust the amount of bonding material 2 applied so that the bonding material 2 protrudes from the mounted member 1 in order to prevent an increase in bonding defects.

[0088] This adjustment must take into consideration variations in the amount of bonding material 2 applied by the bonding device. It must also be considered that the bonding material 2 does not always spread in the same direction or overflow by the same amount due to differences in how the force applied to the bonding material 2 by pressing is different. If the distance until the bonding material 2 overflows onto the mounted member 1 is long, as in the conventional method, these effects become greater, so the bonding method according to the embodiment can reduce the amount of bonding material 2 applied compared to the conventional bonding method.

[0089] FIG. 6 shows the results of comparing the amount of adhesive material applied to maintain a stable adhesive strength. It was determined whether or not the adhesive strength was stable when the following two conditions were met. The first condition is that a force is applied from the side to the mounted member 1 after bonding, and the force at which the mounted member 1 is peeled off from the base 10 is equal to or greater than a predetermined threshold. The threshold can be set as appropriate, but in this determination, it was set to 2 kgf. The second condition is that the adhesive material 2 is evenly applied to both the bonding surface and the mounting surface within the area that fits within the outer edge of the adhesive material 2 when the mounted member 1 is peeled off from the base 10. FIG. 7A shows an example of a state where this condition is met, and FIG. 7B shows an example of a state where this condition is not met.

[0090] 6, it can be seen that in the bonding method according to the embodiment, the application amount of the single-stage bonding material 2 is reduced by approximately 40%, and the application amount of the two-stage bonding material 2 is reduced by more than 20%, compared to the conventional bonding method. In this way, the bonding method according to the embodiment can stably bond the mounted members with a smaller application amount of bonding material than the conventional bonding method.

[0091] Furthermore, differences may occur not only in terms of the amount of bonding material 2 applied, but also in the shape of the bonding material 2 in a state in which the mounted member 1 is bonded, as compared to conventional bonding methods. Fig. 8A is an image showing an example of a state in which the mounted member 1 is bonded to the base 10 by a bonding method that does not cause overflow. Fig. 8B is an image showing an example of a state in which the mounted member 1 is bonded to the base 10 by a bonding method that causes overflow. Fig. 8C is an image showing an example of a state in which the mounted member 1 is bonded to the base 10 by a conventional bonding method.

[0092] 8A and 8C, there is a difference in the shape of the protruding portion 24 of the bonding material 2. In the bonding method according to the embodiment, the amount of bonding material 2 applied can be reduced, and therefore the height of the bonding material 2 protruding from the bonding surface of the mounted member 1 can be reduced accordingly.

[0093] In the conventional bonding method, the maximum height of the bonding material 2 protruding from the side surface of the mounted member 1 is greater than the height of the bonding material 2 in the portion in contact with the side surface of the mounted member 1 by 150 μm or more and 200 μm or less. On the other hand, in the bonding method according to the embodiment that does not allow protrusion, the maximum height of the bonding material 2 protruding from the side surface of the mounted member 1 can be limited to a maximum height greater than the height of the bonding material 2 in the portion in contact with the side surface of the mounted member 1 by 80 μm or more and 120 μm or less.

[0094] 8B, it can be seen that the swelling of the protruding portion 24 of the bonding material 2 is formed further outward from the side surface of the mounted component 1 than in FIG. 8C. This is thought to be because a lower stage of the two-stage shape is provided at the stage where the bonding material 2 is applied, and the central region 22 of the bonding material 2 spreads outward on the bonding material 2 provided on this lower stage. In other words, it is thought that the bonding material 2 spreads more easily on the same bonding material 2 than on the mounting surface of the base 10.

[0095] The bonding material 2 bulges outward, thereby suppressing the maximum height of the bonding material 2 at the protruding portion. In other words, when the maximum height of the bonding material 2 at the protruding portion is the same in the conventional bonding method and the protruding bonding method according to the embodiment, the distance from the mounted member 1 to the maximum height of the bonding material 2 is longer in the protruding bonding method according to the embodiment than in the conventional bonding method.

[0096] <Light-emitting device manufactured by the manufacturing method according to the embodiment> Next, a light emitting device according to an embodiment will be described. The light emitting device according to the embodiment is manufactured by a manufacturing method including the above-mentioned bonding method. The light emitting device can be said to be an example of a device in the above-mentioned device manufacturing method. FIG. 9 is a perspective view of a light emitting device 100, which is an example of a light emitting device according to an embodiment. FIG. 10 is a top view of the light emitting device 100. FIG. 11 is a top view of the light emitting device 100 with some components removed to explain the internal structure.

[0097] The light emitting device 100 includes a plurality of components including a base 10A, a plurality of light emitting elements 101, a plurality of submounts 1A, one or a plurality of light reflecting members 1B, a plurality of protective elements 102, a sealing member 103, and a lens member 104. The light emitting device 100 may further include other components.

[0098] Next, each component will be described. (Base 10A) The base 10A has a base and a sidewall protruding upward from the base. The base and the sidewall form a concave shape with the inside of the sidewall recessed. The base has a mounting surface, and the sidewall surrounds the mounting surface. The base 10A is an example of the base 10 described in the bonding method according to the embodiment.

[0099] The substrate 10A can be made of a ceramic material such as silicon nitride, aluminum nitride, or silicon carbide. It can also be made of a metal material such as iron, an iron alloy, or copper. The substrate 10A can also be formed by bonding the base and the sidewalls made of different materials.

[0100] (Light emitting element 101) The light emitting element 101 has a light emission surface from which light is emitted. For example, a semiconductor laser element can be used as the light emitting element 101. The light emitting element 101 has an upper surface, a lower surface, and one or more side surfaces. One of the side surfaces of the light emitting element 101 is a light emission surface. Note that the light emitting surface of the light emitting element 101 may be on another surface.

[0101] The light emitting element 101 has an emission peak wavelength in the range of 320 nm to 530 nm, typically in the range of 430 nm to 480 nm. For example, a semiconductor element including a nitride semiconductor can be used as the light emitting element 101. For example, GaN, InGaN, and AlGaN can be used as the nitride semiconductor. Note that the emission peak wavelength of the light emitting element 101 is not limited to this wavelength range.

[0102] (Submount 1A) The submount 1A is an example of the mounted member 1 described in the bonding method according to the embodiment. The submount 1A has a bottom surface, a top surface, and one or more side surfaces. The bottom surface of the submount 1A serves as the bonding surface. The submount 1A has the smallest width in the vertical direction. The submount 1A is also configured in a rectangular parallelepiped shape. However, the shape is not limited to a rectangular parallelepiped.

[0103] The submount 1A has a thickness of 150 μm or more and 500 μm or less. The submount 1A is formed using, for example, silicon nitride, aluminum nitride, or silicon carbide. Other materials may also be used. The conductive region of the submount 1A may be formed by providing, for example, Ti / Pt / Au. The bonding region of the submount 1A may be formed by providing, for example, Pt / AuSn in a part of the region provided with Ti / Pt / Au.

[0104] (Light reflecting member 1B) The light reflecting member 1B has a joint surface and a light reflecting surface inclined with respect to the joint surface. The light reflecting surface has a reflectance of, for example, 90% or more for the peak wavelength of the irradiated light. The light reflectance here can be 100% or less or less than 100%.

[0105] The light reflecting member 1B may use glass or metal as the main material forming its outer shape. The main material is preferably a heat-resistant material, for example, glass such as quartz or BK7 (borosilicate glass), metal such as aluminum, or Si. The light reflecting surface may be formed using metal such as Ag or Al, or a dielectric multilayer film such as Ta2O5 / SiO2, TiO2 / SiO2, or Nb2O5 / SiO2. Note that the main material refers to the material with the largest proportion when multiple materials are used, but refers to the material when only one material is used.

[0106] (Protection element 102) The protective element 102 is a circuit element for preventing an excessive current from flowing through a specific element (e.g., the light emitting element 101) and causing the element to be destroyed. A typical example of the protective element 102 is a constant voltage diode such as a Zener diode. For example, a Si diode can be used as the Zener diode.

[0107] (Sealing member 103) The sealing member 103 has an upper surface and a lower surface. The sealing member 103 is translucent from the upper surface to the lower surface. Here, being translucent means that the transmittance of the main light incident thereon is 80% or more.

[0108] The sealing member 103 may be partially light-transmitting. For example, the sealing member 103 may have a non-light-transmitting frame body having one or more openings, and one or more light-transmitting members that cover the one or more openings of the frame body.

[0109] The main material of the sealing member 103 may be a light-transmitting material such as glass, sapphire, or quartz. The main material of the frame may be a metal, and the light-transmitting member may be any of the light-transmitting materials described above.

[0110] (Lens member 104) Lens member 104 has an upper surface and a lower surface. Lens member 104 has a plurality of lens surfaces. The plurality of lens surfaces are formed on the upper surface side of lens member 104. It can be said that the upper surface of lens member 104 is configured to include a plurality of lens surfaces. In lens member 104, the portions forming each lens surface are referred to as lens portions.

[0111] The lens member 104 may have a plurality of lens surfaces arranged in an array. The lens member 104 may have a plurality of lens surfaces arranged in a matrix. The plurality of lens surfaces includes at least two or more lens surfaces arranged side by side. The lens member 104 may be formed using a light-transmitting material such as glass or synthetic quartz.

[0112] (Light emitting device 100) Next, the light emitting device 100 will be described. In the light emitting device 100, the multiple light emitting elements 101 are each mounted on a submount 1A. One or more light emitting elements 101 are mounted on one submount 1A. In the example of the light emitting device 100 shown in the figure, one light emitting element 101 is mounted on each of the multiple submounts 1A.

[0113] In the light emitting device 100, the submount 1A on which the light emitting element 101 is mounted is disposed on the mounting surface of the base 10A. The bonding surface of the submount 1A is bonded to the mounting surface of the base 10A via the bonding material 2 by the bonding method described above. In the light emitting device 100, the portion on which the bonding material 2 is provided is referred to as the bonding portion 2A.

[0114] In the light emitting device 100, for example, a two-stage joint 2A is formed by the above-mentioned protruding joining method. In a cross-sectional view passing through an imaginary line connecting the centers of two opposing sides of the submount 1A having a rectangular joining surface, the joint 2A of the light emitting device 100 has a two-stage shape in which the outermost point of the upper stage is located outside and above the connecting point between the upper and lower stages, and the apex of the upper stage is located away from the side surface of the submount.

[0115] In the light emitting device 100, the light reflecting member 1B is disposed on the mounting surface of the base 10A. The bonding surfaces of one or more light reflecting members 1B are bonded to the mounting surface of the base 10A via the bonding material 2 by the bonding method described above. The light reflecting member 1B is disposed so that the light reflecting surface faces the light emitting surface of the light emitting element 101. The light reflecting member 1B can be disposed individually for each of the multiple light emitting elements 101.

[0116] Since the light emitting elements 101 arranged side by side and the light reflecting members 1B corresponding to each light emitting element 101 are arranged close to each other, the amount of bonding material 2 applied is reduced by the bonding method described above, so that the bonding materials 2 bonding adjacent mounted members 1 are less likely to interfere with each other. This makes it less likely that the bonding material 2 will swell due to interference, causing current leakage, or obstructing light traveling toward the light reflecting surface. As a result, the quality of the light emitting device 100 is stabilized. Therefore, devices such as light emitting devices can be provided with stable quality.

[0117] In the light emitting device 100, a protective element 102 is mounted on a submount 1A. The multiple protective elements 102 are arranged corresponding to the multiple light emitting elements 101, respectively. Each protective element 102 is arranged in the vicinity of the corresponding light emitting element 101.

[0118] In the light emitting device 100, the sealing member 103 is bonded to the base 10A. The lower surface of the sealing member 103 is bonded to the upper surface of the base 10A. A sealed space is formed by bonding the base 10A and the sealing member 103. The sealing member 103 is bonded by a method different from the bonding method described above. For example, the sealing member 103 is bonded to the base 10A by using AuSn solder.

[0119] The light emitting element 101 is enclosed in this sealed space. By joining the base body 10A and the sealing member 103 under a predetermined gas atmosphere, an airtight sealed space can also be formed. By enclosing the light emitting element 101 in the sealed space in this manner, dust collection on the light emitting surface of the light emitting element 101 can be suppressed, and a decrease in light emitting efficiency can be suppressed. The light reflected by the light reflecting member 1B passes through the sealing member 103.

[0120] In the light emitting device 100, the lens member 104 is located above the plurality of light emitting elements 101. The lens member 104 is disposed above the sealing member 103. The lens member 104 is bonded to the sealing member 103. The lens member 104 is bonded by a method different from the bonding method described above. For example, the lens member 104 is bonded to the sealing member 103 using a UV curable adhesive. The lens member 104 is disposed such that the light emitted from each light emitting element 101 passes through each lens surface and is emitted.

[0121] As explained above, the present invention having the technical features disclosed in the specification is not limited to the structures described in each embodiment of the specification. For example, the present invention can be applied to a light-emitting device having components not disclosed in the embodiments, and differences from the disclosed structure are not grounds for the inability to apply the present invention. In addition, from the perspective of the minimum components required to complete the invention, the components of the light-emitting device disclosed in the embodiments may include non-essential components.

[0122] This means that the light emitting device disclosed in the embodiments of this specification includes the viewpoint of disclosing a rational configuration assuming one usage form, in addition to the viewpoint of completing the invention. While the application of the invention is not limited to the exemplary usage form, there are aspects that work effectively by applying the invention to that usage form.

[0123] From this point of view, it may not be essential for the present invention (claims) to have all the components disclosed in one embodiment. For example, if some components of a light-emitting device disclosed in an embodiment are not described in the claims, the components are not limited to those disclosed in the present embodiment, and the freedom of design by those skilled in the art, such as substitution, omission, modification of shape, and change of material, is acknowledged, and the invention described in the claims is applied. [Industrial Applicability]

[0124] The bonding method described in the embodiment can be incorporated into a manufacturing method for manufacturing a device such as a light-emitting device. The light-emitting device described in the embodiment can be used in a projector. In other words, a projector can be said to be one application form to which the present invention is applied. The present invention is not limited to this, and can be used as a light source for lighting, in-vehicle headlights, head-mounted displays, backlights for other displays, etc. The device described in the embodiment does not have to be limited to a light-emitting device, and can be used for things other than light sources. [Explanation of symbols]

[0125] 1 Mounting material 2 Bonding material 21 Outer area 22 Central area 23 Intervening part 24 Protruding part 25 Upper 26 Lower 3. Bonding Equipment 31 Syringe 32 Nozzles 33 Discharge part 34 Inner container 35 Tip surface 36 External surface 10 Base 100 Light emitting device 10A base 1A Submount 1B Light reflecting material 2A joint 101 Light emitting element 102 Protection element 103 Sealing member 104 Lens parts

Claims

1. a step of discharging a bonding material for bonding a mounting surface of a base and a bonding surface of a mounted component to fix the mounted component at a predetermined position of the base from a nozzle of a bonding device having an outer edge shape of a tip surface of the nozzle that is of a size and shape such that the outer edge shape does not extend beyond the bonding surface, and applying the bonding material onto the mounting surface in a size and shape such that only a portion of the outer edge of the bonding material extends beyond the bonding surface; a step of placing the mounted member at a predetermined position of the base, and pressing at least a portion of the bonding material sandwiched between the mounting surface and the bonding surface so as to protrude beyond an outer edge other than a portion of an outer edge of the bonding surface, thereby bonding the mounted member to the base; A method for manufacturing a device comprising:

2. The manufacturing method according to claim 1 , wherein in the step of applying the bonding material, the bonding material is applied so that the maximum length of an outer edge of the bonding material is 0.5 mm or more and 2 mm or less.

3. The manufacturing method according to claim 1 , wherein an area of ​​an outer edge shape of the tip surface of the nozzle is 75% or more and 100% or less of an area of ​​the joining surface.

4. The joint surface is a rectangle having long sides and short sides, In the step of applying the bonding material, an outer edge of the bonding material has a size and shape that protrudes from two long sides that are opposite sides of the bonding surface, 4. The manufacturing method according to claim 1, wherein in the step of joining the mounted component to the base, at least a portion of the bonding material is pressed to extend beyond at least one of the two short sides that are opposite sides of the bonding surface.

5. In the step of applying the bonding material, the bonding material is applied onto the base so as to form an outer peripheral region having a thickness from the mounting surface of less than 50 μm, and a central region which is located more centrally than the outer peripheral region and has a thickness from the mounting surface greater than the outer peripheral region and has a maximum thickness of 100 μm or more; In the step of bonding the mounted member to the base, the mounted member is placed at a predetermined position on the mounting surface from a position above the mounting surface where the central region is covered by the mounted member in a top view and where a part of the outer edge of the bonding material protrudes from the mounted member, and the mounted member is bonded to the base such that a part of the bonding material in the central region protrudes from the bonding surface by pressing. The method according to any one of claims 1 to 4.

6. 6. The manufacturing method according to claim 5, wherein in the step of joining the mounted component to the base, the mounted component is joined to the base in such a manner that at least a portion of the bonding material in the central region is pressed to extend beyond at least two opposing short sides of the rectangular bonding surface.

7. The joint surface is a rectangle having long sides and short sides, In the step of applying the bonding material, an outer edge of the bonding material has a size and shape that protrudes from two long sides that are opposite sides of the bonding surface, 7. The manufacturing method according to claim 1, wherein an outer edge of a portion of the mounting surface that protrudes from a long side of the mounting surface by pressing in the step of joining the mounted component to the base is located inside an outer edge of the bonding material applied in the step of applying the bonding material.

8. 8. The manufacturing method according to claim 7, wherein in the process of joining the mounted component to the base, a maximum height of the bonding material from the base at a portion that protrudes from the long side of the joining surface by pressing is between 2 and 20 times a maximum height of the bonding material from the base outside the portion that protrudes from the long side of the joining surface by pressing.

9. The joint surface is a rectangle having long sides and short sides, In the step of applying the bonding material, an outer edge of the bonding material has a size and shape that protrudes from two long sides that are opposite sides of the bonding surface, 7. The manufacturing method according to claim 1, wherein an outer edge of a portion of the mounting surface that protrudes from a long side of the mounting surface by pressing in the step of joining the mounted component to the base is located outside an outer edge of the bonding material applied in the step of applying the bonding material.

10. 10. The manufacturing method according to claim 9, wherein a maximum distance from the long side of the joining surface of an outer edge of the joining material applied in the step of applying the joining material exceeds 1 time and is 3 times or less than a maximum distance from the long side of the joining surface of an outer edge of a portion of the joining material that protrudes from the long side of the joining surface by pressing in the step of joining the mounted member to the base.

Images