Electronic component

Abstract

To provide a technique of preventing reduction of the reliability of an electronic component.SOLUTION: An electronic component (1) includes: a housing (4) including a first main surface (41) and a second main surface (42) facing each other and four side surfaces (43 to 46) connecting the first main surface and the second main surface to each other; and drawing lines (2b, 2d, 3b, 3d) drawn from specific sides (43, 44) of the four side surfaces to the outside of the housing and extending from the first main surface to the second main surface. The housing has a gap between the drawing lines and the specific side surfaces.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present disclosure relates to electronic components.

Background Art

[0002] Conventionally, an electronic component with a lead wire drawn out from the inside of a housing to the outside is known. For example, Japanese Unexamined Patent Application Publication No. 2016-178139 (Patent Document 1) discloses an electronic component including a plate-shaped terminal connected to a circuit element inside a housing, fixing one end of the terminal to the side surface of the housing, fixing the terminal in close contact with the side surface of the housing without a gap, and then bending the terminal from the side surface toward the bottom surface to arrange the other end of the terminal on the bottom surface of the housing.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] According to the electronic component disclosed in Patent Document 1, the electronic component can be surface-mounted on the substrate by soldering the terminal drawn out to the outside of the housing and extending along the side surface to the substrate. However, in the electronic component disclosed in Patent Document 1, since the terminal drawn out from the outside of the housing is in close contact with the side surface of the housing without a gap, for example, due to a temperature change or the like, if the substrate expands and the terminal is deformed so as to be separated from the housing, or the substrate shrinks and the terminal is deformed so as to be drawn into the housing side, stress concentrates on one end portion of the terminal connected to the side surface of the housing or the other end portion of the terminal soldered to the substrate, and there is a risk that the reliability of the electronic component may be reduced due to metal fatigue of the terminal.

[0005] The present disclosure has been made to solve such problems, and an object thereof is to provide a technique capable of preventing a decrease in the reliability of electronic components.

Means for Solving the Problems

[0006] An electronic component according to one embodiment of the present disclosure includes a housing including a pair of first main surfaces and second main surfaces facing each other, and four side surfaces connecting the first main surface and the second main surface, and a lead wire drawn out from a specific side surface among the four side surfaces to the outside of the housing and extending in the direction from the first main surface to the second main surface. The housing has a gap between the lead wire and the specific side surface.

Effects of the Invention

[0007] According to one embodiment of the present disclosure, even when the substrate on which the electronic component is mounted expands and the lead wire deforms away from the housing, or the substrate contracts and the lead wire is drawn into the housing side, the lead wire bends by using the gap generated between the lead wire and the side surface of the housing, so that stress is concentrated on one end of the lead wire connected to the side surface or the other end of the lead wire soldered to the substrate. This can be prevented, and a decrease in the reliability of the electronic component can be prevented.

Brief Description of the Drawings

[0008]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Embodiments for Carrying Out the Invention

[0009] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. In the drawings, the same or corresponding parts are denoted by the same reference numerals and their description will not be repeated.

[0010] <Embodiment 1> FIG. 1 is a perspective view of a coil component 1 according to Embodiment 1. FIG. 2 is a side view of the coil component 1 according to Embodiment 1. FIG. 3 is a perspective view of the coil component 1 viewed from the bottom side according to Embodiment 1. FIG. 4 is a perspective view of coil conductors 2 and 3 according to Embodiment 1. In the following description, as shown in FIG. 1, after defining the X-axis, Y-axis, and Z-axis, for example, the X-axis direction corresponds to the left-right direction (lateral direction) of the coil component 1, the Y-axis direction corresponds to the front-back direction (longitudinal direction) of the coil component 1, and the Z-axis direction corresponds to the up-down direction (height direction) of the coil component 1.

[0011] The coil component 1 is an example of an "electronic component". The coil component 1 is, for example, a transformer coil mounted in a filter circuit used for noise countermeasures in a power line. The coil component 1 is configured to magnetically couple two coils, whereby it is possible to cancel the parasitic inductance of a capacitor mounted in the filter circuit.

[0012] As shown in FIGS. 1 to 3, the coil component 1 includes a housing 4, a coil conductor 2, and a coil conductor 3.

[0013] The housing 4 includes a pair of opposing flat surfaces 41 and a bottom surface 42, and four side surfaces 43 to 46 connecting between the flat surface 41 and the bottom surface 42. The flat surface 41 is an example of the "first main surface". The bottom surface 42 is an example of the "second main surface". The side surfaces 43 and 44 are examples of the "specific side surfaces". Each of the above-described surfaces is one surface when the housing 4 is a substantially rectangular parallelepiped, and does not necessarily have to be a flat surface. For example, at least one of the flat surface 41, the bottom surface 42, the side surface 43, the side surface 44, the side surface 45, and the side surface 46 may have unevenness in part. Also, the side surfaces 43 to 46 may be formed in a trapezoidal shape such that the areas of the flat surface 41 and the bottom surface 42 are different.

[0014] The housing 4 is made of a mold resin in order to fix the coil conductors 2 and 3 at predetermined positions. Specifically, the mold resin includes at least one of an epoxy resin added with a silica filler, a silicone resin, a liquid crystal polymer, and various resins mixed with a metal magnetic material. Note that the inside of the housing 4 may be composed of a plurality of resins.

[0015] As shown in FIGS. 1 to 4, the coil conductors 2 and 3 are formed by bending a metal plate having a predetermined shape extracted from a single metal plate by punching. For example, when a punch is pressed against the upper surface of a single metal plate placed on a die, the metal plate is sheared to obtain a metal plate having a predetermined shape. By bending the obtained metal plate along the housing 4, the coil conductors 2 and 3 can be formed. Note that the above-described punching is merely an example. For example, the coil conductors 2 and 3 may be formed by other methods such as etching, wire processing, or laser processing.

[0016] The coil conductor 2 includes a coil portion 2a having a rectangular opening, a lead wire 2b connected to one end of the coil portion 2a, and a lead wire 2d connected to the other end of the coil portion 2a.

[0017] The lead wire 2b is drawn out from the inside of the housing 4 to the outside of the housing 4 and extends along the side surface 44 in the Z-axis direction from the plane 41 to the bottom surface 42, and is arranged to bend in the X-axis direction along the bottom surface 42 from the end of the side surface 44 (the lower end in the Z-axis direction). An electrode 2c is provided at the end of the lead wire 2b along the bottom surface 42. Since the bent portions between the lead wire 2b and the coil portion 2a, and the bent portion between the electrode 2c and the other portion of the lead wire 2b (the connection portion between the side surface 44 and the bottom surface 42) are formed by bending, they have a substantially right-angled structure with a radius of curvature.

[0018] The lead wire 2d is arranged to run parallel to the lead wire 2b. Specifically, the lead wire 2d is drawn out from the inside of the housing 4 to the outside of the housing 4 and extends along the side surface 44 in the Z-axis direction from the plane 41 to the bottom surface 42, and is arranged to bend in the X-axis direction along the bottom surface 42 from the end of the side surface 44 (the lower end in the Z-axis direction). An electrode 2e is provided at the end of the lead wire 2d along the bottom surface 42. Since the bent portions between the lead wire 2d and the coil portion 2a, and the bent portion between the electrode 2e and the other portion of the lead wire 2d (the connection portion between the side surface 44 and the bottom surface 42) are formed by bending, they have a substantially right-angled structure with a radius of curvature.

[0019] The lead wires 2b and 2d are soldered to the substrate 5 on which the housing 4 is installed at the portions bent along the bottom surface 42 from the end of the side surface 44. For example, as shown in FIG. 2, the electrode 2e provided at the end of the lead wire 2d is soldered to the substrate 5 at the soldering portion 62. Similarly, the electrode 2c provided at the end of the lead wire 2b is soldered to the substrate 5 at a soldering portion (not shown).

[0020] The coil conductor 3 includes a coil portion 3a having a rectangular opening, a lead wire 3b connected to one end of the coil portion 3a, and a lead wire 3d connected to the other end of the coil portion 3a.

[0021] The lead wire 3b is drawn out from the inside of the housing 4 to the outside of the housing 4, extends along the side surface 43 in the Z-axis direction from the plane 41 to the bottom surface 42, and is arranged to bend in the X-axis direction along the bottom surface 42 from the end of the side surface 43 (the lower end portion in the Z-axis direction). An electrode 3c is provided at the end of the lead wire 3b along the bottom surface 42. The bent portion between the lead wire 3b and the coil portion 3a, and the bent portion between the electrode 3c and the other portion of the lead wire 3b (the connection portion between the side surface 43 and the bottom surface 42) are formed by bending, so they have a substantially right-angled structure with a radius of curvature. Each of the electrodes 2c, 2e, 3c, 3e is used as a mounting electrode when mounting on a substrate.

[0022] The lead wire 3d is arranged to run parallel to the lead wire 3b. Specifically, the lead wire 3d is drawn out from the inside of the housing 4 to the outside of the housing 4, extends along the side surface 43 in the Z-axis direction from the plane 41 to the bottom surface 42, and is arranged to bend in the X-axis direction along the bottom surface 42 from the end of the side surface 43 (the lower end portion in the Z-axis direction). An electrode 3e is provided at the end of the lead wire 3d along the bottom surface 42. The bent portion between the lead wire 3d and the coil portion 3a, and the bent portion between the electrode 3e and the other portion of the lead wire 3d (the connection portion between the side surface 43 and the bottom surface 42) are formed by bending, so they have a substantially right-angled structure with a radius of curvature.

[0023] The lead wires 3b, 3d are soldered to the substrate 5 on which the housing 4 is installed at the portion bent along the bottom surface 42 from the end of the side surface 43. For example, as shown in FIG. 2, the electrode 3e provided at the end of the lead wire 3d is soldered to the substrate 5 at the soldering portion 63. Similarly, the electrode 2c provided at the end of the lead wire 3b is soldered to the substrate 5 at a soldering portion (not shown).

[0024] As shown in FIG. 3, the width H1 of the end portion of the lead wire 3b at the position drawn out from the side surface 43 is smaller than the width H2 of the end portion (electrode 3c) of the lead wire 3b soldered to the substrate 5. Similarly, the width H3 of the end portion of the lead wire 3d at the position drawn out from the side surface 43 is smaller than the width H4 of the end portion (electrode 3e) of the lead wire 3d soldered to the substrate 5.

[0025] Although not shown, the width of the end portion of the lead wire 2b at the position drawn out from the side surface 44 is smaller than the width of the end portion (electrode 2c) of the lead wire 2b soldered to the substrate 5. Similarly, the width of the end portion of the lead wire 2d at the position drawn out from the side surface 44 is smaller than the width of the end portion (electrode 2e) of the lead wire 2d soldered to the substrate 5.

[0026] Each of the end portion of the lead wire 3b at the position drawn out from the side surface 43, the end portion of the lead wire 3d at the position drawn out from the side surface 43, the end portion of the lead wire 2b at the position drawn out from the side surface 44, and the end portion of the lead wire 2d at the position drawn out from the side surface 44 is an example of a "first end portion", and hereinafter these end portions are also referred to as "first end portions". Further, each of the end portion (electrode 3c) of the lead wire 3b soldered to the substrate 5, the end portion (electrode 3e) of the lead wire 3d soldered to the substrate 5, the end portion (electrode 2c) of the lead wire 2b soldered to the substrate 5, and the end portion (electrode 2e) of the lead wire 2d soldered to the substrate 5 is an example of a "second end portion", and hereinafter these end portions are also referred to as "second end portions".

[0027] As described above, each bent portion in the coil conductor 2 and the coil conductor 3 is formed by an arc having a constant radius. Also, the coil conductor 2 and the coil conductor 3 may be formed of one or a plurality of wires, and similarly, by bending the wires, the bent portion may be formed by an arc having a constant radius.

[0028] The coil part 2a is an example of the "first coil part" and functions as the coil L1 in the coil component 1. The coil part 3a is an example of the "second coil part" and functions as the coil L2 in the coil component 1. The coil part 3a is arranged on the side of the plane 41 rather than the coil part 2a. Note that the coil part 2a may be arranged on the side of the plane 41 rather than the coil part 3a. The coil part 2a and the coil part 3a are conductors and are formed, for example, by a metal plate of copper or an alloy of copper mixed with other metals. The main component of the coil part 2a and the coil part 3a is copper, and the proportion of copper may be at least 50% or more, preferably 80% or more. Note that the coil L1 is not limited to being composed of a single-turn coil part 2a and may be composed of a multi-turn coil part 2a. The coil L2 is not limited to being composed of a single-turn coil part 3a and may be composed of a multi-turn coil part 3a.

[0029] When viewed from the direction in which the plane 41 and the bottom surface 42 of the housing 4 face each other (the Z-axis direction in the figure), the coil L1 (coil part 2a) and the coil L2 (coil part 3a) have a substantially rectangular shape. Here, the substantially rectangular shape means a shape having four sides and includes those with large rounded corners at the corners. Also, in the embodiment, although the coil L1 (coil part 2a) and the coil L2 (coil part 3a) are shown as substantially rectangular coils, the coil L1 (coil part 2a) and the coil L2 (coil part 3a) may be formed in an elliptical or circular shape, or other polygonal shapes.

[0030] When the coil component 1 is viewed in the Z-axis direction from the side of the plane 41, the coil part 3a and the coil part 2a are arranged inside the housing 4 such that at least a part of the opening of the coil part 3a overlaps with the opening of the coil part 2a. In FIGS. 1 to 4, an example in which the opening of the coil part 3a and the opening of the coil part 2a substantially overlap is shown, but as long as the coil part 3a and the coil part 2a are within the range of magnetic field coupling, the opening of the coil part 3a and the opening of the coil part 2a may be displaced. Preferably, at least 50% of one of the openings of the coil part 3a and the coil part 2a may overlap with the other opening.

[0031] At the position where the coil part 2a is connected to the lead wires 2b and 2d, the distance between the lead wire 2b and the lead wire 2d should be as small as possible so that the coil opening can be closed more, the magnetic flux density can be increased, and thus the inductance can be increased. On the other hand, in order to avoid short - circuiting when mounting the coil component 1 on the mounting substrate, the distance between the electrode 2c and the electrode 2e is designed to be as large as possible.

[0032] At the position where the coil part 3a is connected to the lead wires 3b and 3d, the distance between the lead wire 3b and the lead wire 3d should be as small as possible so that the coil opening can be closed more, the magnetic flux density can be increased, and thus the inductance can be increased. On the other hand, in order to avoid short - circuiting when mounting the coil component 1 on the mounting substrate, the distance between the electrode 3c and the electrode 3e is designed to be as large as possible.

[0033] In the coil conductor 2 and the coil conductor 3 configured as described above, when the current input from the electrode 2c of the coil conductor 2 is supplied to the coil part 2a through the lead wire 2b, a magnetic field is generated in the coil part 2a. Further, when the current output from the electrode 2e through the coil part 2a and the lead wire 2d is supplied to the coil part 3a through the electrode 3e and the lead wire 3d, a magnetic field is generated in the coil part 3a. The direction of the magnetic field generated in the coil part 3a is the same as the direction of the magnetic field generated in the coil part 2a.

[0034] As shown in FIG. 4, the coil component 1 is disposed between the coil part 2a and the coil part 3a, and further includes an insulator 7 for preventing contact between the coil part 2a and the coil part 3a. Specifically, the insulator 7 engages with the openings of the coil part 2a and the coil part 3a, and is disposed between the coil part 2a and the coil part 3a so as to provide a gap between the coil part 2a and the coil part 3a. The insulator 7 is made of a resin such as polyimide or epoxy. An opening 7a for opening the openings of the coil part 2a and the coil part 3a is formed in the central portion of the insulator 7. In the present disclosure, the opening 7a is not an essential configuration.

[0035] As described above, in the coil component 1, the second ends of the lead wires 2b and 2d drawn out to the outside of the housing 4 and extending along the side surface 44 in the direction from the plane 41 to the bottom surface 42 are soldered to the substrate 5, and the second ends of the lead wires 3b and 3d drawn out to the outside of the housing 4 and extending along the side surface 43 in the direction from the plane 41 to the bottom surface 42 are soldered to the substrate 5, whereby the coil component 1 can be surface-mounted on the substrate 5.

[0036] Here, for example, due to temperature changes or the like, if the substrate 5 expands and the lead wires 2b, 2d, 3b, 3d are deformed so as to move away from the housing 4, or if the substrate 5 contracts and the lead wires 2b, 2d, 3b, 3d are deformed so as to be drawn into the housing 4 side, stress concentrates on the first ends of the lead wires 2b, 2d, 3b, 3d connected to the side surface of the housing 4 or the second ends of the lead wires 2b, 2d, 3b, 3d soldered to the substrate 5, and there is a risk that the reliability of the coil component 1 may decrease due to metal fatigue of the lead wires 2b, 2d, 3b, 3d.

[0037] Therefore, the coil component 1 according to Embodiment 1 is configured such that the housing 4 has a shape for creating a gap between the lead wires 2b and 2d and the side surface 44, thereby preventing stress from concentrating on the first end portions of the lead wires 2b and 2d connected to the side surface 44 of the housing 4 or the second end portions of the lead wires 2b and 2d soldered to the substrate 5. Further, the coil component 1 is configured such that the housing 4 has a shape for creating a gap between the lead wires 3b and 3d and the side surface 43, thereby preventing stress from concentrating on the first end portions of the lead wires 3b and 3d connected to the side surface 43 of the housing 4 or the second end portions of the lead wires 3b and 3d soldered to the substrate 5.

[0038] FIG. 5 is a diagram for explaining the angles formed by the lead wires 2b, 2d, 3b, and 3d and the side surfaces in the coil component 1 according to Embodiment 1.

[0039] As shown in FIG. 5, the side surface 44 is inclined toward the inside of the housing 4 such that the angle D1 formed between the portion of the lead wire 2d along the side surface 44 and the side surface 44 becomes a predetermined angle. In other words, the side (the side in the Z-axis direction) of the side surface 45 connected to the side surface 44 is inclined such that the angle D1 formed between the portion of the lead wire 2d along the side surface 44 and the side surface 44 becomes a predetermined angle. Although not shown, the side surface 44 is inclined toward the inside of the housing 4 such that the angle formed between the portion of the lead wire 2b along the side surface 44 and the side surface 44 becomes a predetermined angle. In other words, the side (the side in the Z-axis direction) of the side surface 46 connected to the side surface 44 is inclined such that the angle formed between the portion of the lead wire 2b along the side surface 44 and the side surface 44 becomes a predetermined angle.

[0040] Similarly, the side surface 43 is inclined toward the inside of the housing 4 such that the angle D2 formed between the portion of the lead line 3d along the side surface 43 and the side surface 43 is a predetermined angle. In other words, the side (the side in the Z-axis direction) of the side surface 45 connected to the side surface 43 is inclined such that the angle D2 formed between the portion of the lead line 3d along the side surface 43 and the side surface 43 is a predetermined angle. Although not shown, the side surface 43 is inclined toward the inside of the housing 4 such that the angle formed between the portion of the lead line 3b along the side surface 43 and the side surface 43 is a predetermined angle. In other words, the side (the side in the Z-axis direction) of the side surface 46 connected to the side surface 44 is inclined such that the angle formed between the portion of the lead line 3b along the side surface 44 and the side surface 44 is a predetermined angle.

[0041] Each of the angle D1 formed between the lead line 2d and the side surface 44, the angle formed between the lead line 2b and the side surface 44, the angle D2 formed between the lead line 3d and the side surface 43, and the angle formed between the lead line 3b and the side surface 43 is 2 degrees or more, preferably within the range of 2 degrees to 5 degrees. Note that the angle D1 formed between the lead line 2d and the side surface 44, the angle formed between the lead line 2b and the side surface 44, the angle D2 formed between the lead line 3d and the side surface 43, and the angle formed between the lead line 3b and the side surface 43 may be the same or different from each other.

[0042] FIG. 6 is a diagram for explaining an example in which the substrate 5 is enlarged when the coil component 1 according to Embodiment 1 is mounted on the substrate 5. In FIG. 6, an example is shown in which the length of the substrate 5 extends in the X-axis direction after the coil component 1 is mounted on the substrate 5. In FIG. 6, the stress applied to the lead lines 2d and 3d will be described, but the same applies to the stress applied to the lead lines 2b and 3b.

[0043] As shown in FIG. 6, when the substrate 5 expands and stress is generated in the X-axis direction, a linear expansion difference occurs between the substrate 5 and the housing 4. Therefore, stress is applied to the lead wire 2d in a direction away from the housing 4, and the lead wire 2d deforms so as to move away from the housing 4. If the lead wire 2d is in close contact with the side surface 44 without a gap, or if the angle D1 formed by the lead wire 2d and the side surface 44 is less than 2 degrees, the first end portion of the lead wire 2d at the position drawn out from the side surface 44 and the second end portion of the lead wire 2d soldered to the substrate 5 are pulled in a direction away from the housing 4, causing metal fatigue in the lead wire 2d. As a result, the reliability of the coil component 1 may decrease. In particular, when the substrate 5 expands, the stress on the first end portion of the lead wire 2d increases.

[0044] In this regard, in the coil component 1 according to the first embodiment, by using the gap provided between the lead wire 2d and the side surface 44, the lead wire 2d can be bent to absorb the linear expansion difference between the substrate 5 and the housing 4. Therefore, the coil component 1 can prevent stress from concentrating on the first end portion and the second end portion of the lead wire 2d, and can prevent the reliability of the coil component 1 from decreasing. When the angle D1 formed by the lead wire 2d and the side surface 44 is 2 degrees or more, preferably in the range of 2 degrees to 5 degrees, the coil component 1 can more effectively prevent stress from concentrating on the first end portion and the second end portion of the lead wire 2d.

[0045] Furthermore, in the coil component 1, since the width of the first end portion of the lead wire 2d is smaller and the rigidity is smaller than that of the second end portion, the first end portion is more easily bent than when the widths of the first end portion and the second end portion are the same, and the stress applied to the first end portion can be effectively relaxed, preventing the lead wire 2d from cracking. On the other hand, since the width of the second end portion of the lead wire 2d is ensured to be large, the soldering strength of the lead wire 2d to the substrate 5 can be increased.

[0046] Similarly, when the substrate 5 expands and stress is generated in the X-axis direction, a linear expansion difference occurs between the substrate 5 and the housing 4. Therefore, stress is applied to the lead wire 3d in a direction away from the housing 4, and the lead wire 3d deforms so as to move away from the housing 4. If the lead wire 3d is in close contact with the side surface 43 without a gap, or if the angle D2 formed between the lead wire 3d and the side surface 43 is less than 2 degrees, the first end of the lead wire 3d located at the position drawn out from the side surface 43 and the second end of the lead wire 3d soldered to the substrate 5 are pulled in a direction away from the housing 4, causing metal fatigue in the lead wire 3d. As a result, the reliability of the coil component 1 may decrease. In particular, when the substrate 5 expands, the stress on the first end of the lead wire 3d increases.

[0047] In this regard, in the coil component 1 according to the first embodiment, by utilizing the gap provided between the lead wire 3d and the side surface 43, the lead wire 3d can be bent to absorb the linear expansion difference between the substrate 5 and the housing 4. Therefore, the coil component 1 can prevent stress from concentrating on the first end and the second end of the lead wire 3d, and can prevent the reliability of the coil component 1 from decreasing. When the angle D2 formed between the lead wire 3d and the side surface 43 is 2 degrees or more, preferably in the range of 2 degrees to 5 degrees, the coil component 1 can more effectively prevent stress from concentrating on the first end and the second end of the lead wire 3d.

[0048] Furthermore, in the coil component 1, since the width of the first end of the lead wire 3d is smaller and the rigidity is lower than that of the second end, the first end is more likely to bend than when the widths of the first end and the second end are the same, and the stress applied to the first end can be effectively relieved, preventing the lead wire 3d from cracking. On the other hand, since the width of the second end of the lead wire 3d is ensured to be large, the soldering strength of the lead wire 3d to the substrate 5 can be increased.

[0049] In the above configuration, it is preferable that the coil component 1 has a gap between the electrode 2e or the electrode 3e and the substrate 5. By adopting such a configuration, the coil component 1 can relieve the stress related to the electrode 2e or the electrode 3e as compared with the case where the electrode 2e or the electrode 3e is in close contact with the substrate 5.

[0050] More preferably, the angle formed by the coil portion 3a and the substrate 5 is different from the angle formed by the electrode 2e or the electrode 3e and the substrate 5. By adopting such a configuration, the coil component 1 can relieve the stress related to the electrode 2e or the electrode 3e as compared with the case where the electrode 2e or the electrode 3e is in close contact with the substrate 5 while ensuring the reliability on the coil portion 3a side.

[0051] Note that the angle formed by the coil portion 3a and the substrate 5 means the angle formed by the extending direction of the plane 41 on which the coil portion 3a is mounted and the extending direction of the coil portion 3a when viewed from the side surface 45 of the housing 4 where the electrode 2e or the electrode 3e is not mounted. The same applies to the angle formed by the electrode 2e or the electrode 3e and the substrate 5.

[0052] FIG. 7 is a diagram for explaining an example in which the substrate 5 is reduced when the coil component 1 according to the first embodiment is mounted on the substrate 5. In FIG. 7, an example in which the length of the substrate 5 is shrunk in the X-axis direction after the coil component 1 is mounted on the substrate 5 is shown. In FIG. 7, the stress applied to the lead wire 2d and the lead wire 3d is described, but the same can be said about the stress applied to the lead wire 2b and the lead wire 3b.

[0053] As shown in Fig. 7, when the substrate 5 shrinks and stress is generated in the X-axis direction, a linear expansion difference occurs between the substrate 5 and the housing 4. Therefore, stress is applied to the lead wire 2d in the direction in which the lead wire 2d approaches the housing 4, and the lead wire 2d deforms so as to be drawn into the housing 4. If the lead wire 2d is in close contact with the side surface 44 without a gap, or if the angle D1 formed by the lead wire 2d and the side surface 44 is less than 2 degrees, the first end of the lead wire 2d at the position drawn out from the side surface 44 and the second end of the lead wire 2d soldered to the substrate 5 are drawn in the direction approaching the housing 4, which may cause metal fatigue in the lead wire 2d. As a result, the reliability of the coil component 1 may decrease. In particular, when the substrate 5 shrinks, the stress on the second end of the lead wire 2d increases.

[0054] In this regard, in the coil component 1 according to the first embodiment, by using the gap provided between the lead wire 2d and the side surface 44, the lead wire 2d can be bent to absorb the linear expansion difference between the substrate 5 and the housing 4. In particular, since a gap is formed near the portion where the lead wire 2d bends in the X-axis direction along the bottom surface 42 from the end (the lower end in the Z-axis direction) of the side surface 44, it is possible to prevent stress from concentrating on the second end of the lead wire 2d. In this way, the coil component 1 can prevent stress from concentrating on the first end and the second end of the lead wire 2d, and can prevent the reliability of the coil component 1 from decreasing. When the angle D1 formed by the lead wire 2d and the side surface 44 is 2 degrees or more, preferably in the range of 2 degrees to 5 degrees, the coil component 1 can more effectively prevent stress from concentrating on the first end and the second end of the lead wire 2d.

[0055] Furthermore, in the coil component 1, since the width of the first end portion of the lead wire 2d is smaller than that of the second end portion and the rigidity is lower, the first end portion is more likely to bend than when the widths of the first end portion and the second end portion are the same, and the stress applied to the first end portion can be effectively relaxed, preventing the lead wire 2d from cracking. On the other hand, since the width of the second end portion of the lead wire 2d is ensured to be large, the soldering strength of the lead wire 2d to the substrate 5 can be increased.

[0056] Similarly, when the substrate 5 shrinks and stress is generated in the X-axis direction, a linear expansion difference occurs between the substrate 5 and the housing 4. Therefore, a stress is applied to the lead wire 3d in the direction in which the lead wire 3d approaches the housing 4, and the lead wire 3d deforms so as to be drawn into the housing 4. If the lead wire 3d is in close contact with the side surface 43 without a gap, or if the angle D2 formed between the lead wire 3d and the side surface 43 is less than 2 degrees, the first end portion of the lead wire 3d at the position drawn from the side surface 43 and the second end portion of the lead wire 3d soldered to the substrate 5 are drawn in the direction approaching the side surface 43, resulting in metal fatigue in the lead wire 3d. As a result, the reliability of the coil component 1 may decrease. In particular, when the substrate 5 shrinks, the stress on the second end portion of the lead wire 3d increases.

[0057] In this regard, in the coil component 1 according to the first embodiment, by utilizing the gap provided between the lead wire 3d and the side surface 43, the lead wire 3d can be bent to absorb the difference in linear expansion between the substrate 5 and the housing 4. In particular, since a gap is generated near the portion where the lead wire 3d bends in the X-axis direction along the bottom surface 42 from the end of the side surface 43 (the lower end portion in the Z-axis direction), it is possible to prevent stress from concentrating on the second end portion of the lead wire 3d. In this way, the coil component 1 can prevent stress from concentrating on the first end portion and the second end portion of the lead wire 3d, and can prevent the reliability of the coil component 1 from decreasing. When the angle D2 formed by the lead wire 3d and the side surface 43 is 2 degrees or more, preferably within the range of 2 degrees to 5 degrees, the coil component 1 can more effectively prevent stress from concentrating on the first end portion and the second end portion of the lead wire 3d.

[0058] Furthermore, in the coil component 1, since the width of the first end portion of the lead wire 3d is smaller and the rigidity is lower than that of the second end portion, the first end portion is more likely to bend than when the widths of the first end portion and the second end portion are the same, and the stress applied to the first end portion can be effectively relaxed, preventing the lead wire 3d from cracking. On the other hand, since the width of the second end portion of the lead wire 3d is ensured to be large, the soldering strength of the lead wire 3d to the substrate 5 can be increased.

[0059] As described above, in the coil component 1 according to the first embodiment, even when the substrate 5 expands and the lead wires 2b, 2d, 3b, 3d are deformed so as to move away from the housing 4, or when the substrate 5 contracts and the lead wires 2b, 2d, 3b, 3d are deformed so as to be drawn toward the housing 4 side, by utilizing the gap generated between the lead wires 2b, 2d, 3b, 3d and the housing 4, the lead wires 2b, 2d, 3b, 3d can be bent to prevent stress from concentrating on the first end portion or the second end portion of the lead wires 2b, 2d, 3b, 3d, and can prevent the reliability of the coil component 1 from decreasing.

[0060] <Second Embodiment> With reference to Fig. 8, the coil component 1 according to Embodiment 2 will be described. Hereinafter, only the parts of the coil component 1 according to Embodiment 2 that are different from the coil component 1 according to Embodiment 1 will be described.

[0061] Fig. 8 is a side view of the coil component 1 according to Embodiment 2. As shown in Fig. 8, in the coil component 1 according to Embodiment 2, the side surface 45 connecting the side surfaces 43 and 44 of the housing 4 is formed in a stepped shape in the direction from the bottom surface 42 to the plane 41 such that the width H12 on the side of the bottom surface 42 is smaller than the width H11 on the side of the plane 41. More specifically, the width H12 of the side surface 45 corresponding to the portion where the lead wires 2d, 3d bend along the bottom surface 42 is smaller than the width H11 of the side surface 45 corresponding to the portion where the lead wire 2d is drawn out from the side surface 44 or the portion where the lead wire 3d is drawn out from the side surface 43.

[0062] Similarly, although not shown, the side surface 46 connecting the side surfaces 43 and 44 of the housing 4 is formed in a stepped shape in the direction from the bottom surface 42 to the plane 41 such that the width H12 on the side of the bottom surface 42 is smaller than the width H11 on the side of the plane 41. More specifically, the width H12 of the side surface 46 corresponding to the portion where the lead wires 2b, 3b bend along the bottom surface 42 is smaller than the width H11 of the side surface 46 corresponding to the portion where the lead wire 2b is drawn out from the side surface 44 or the portion where the lead wire 3b is drawn out from the side surface 43.

[0063] In other words, each of the side surfaces 43 and 44 has irregularities such that the portion on the side of the plane 41 protrudes more than the portion on the side of the bottom surface 42.

[0064] By providing the housing 4 having the above-described shape, the coil component 1 according to Embodiment 2 can create a gap between the lead wires 2b, 2d, 3b, 3d and the housing 4.

[0065] In the coil component 1 according to the above-described Embodiments 1 and 2, the lead wires 2b, 2d, 3b, and 3d are bent along the substrate 5 toward the housing 4 side and soldered to the substrate 5. However, the lead wires 2b, 2d, 3b, and 3d may be bent along the substrate 5 toward the side opposite to the housing 4 and soldered to the substrate 5.

[0066] <Aspect> (Item 1) The electronic component (1) of the present disclosure includes a housing (4) including a pair of first main surfaces (41) and second main surfaces (42) facing each other, and four side surfaces (43 to 46) connecting the first main surface and the second main surface, and lead wires (2b, 2d, 3b, 3d) drawn out from a specific side surface (43, 44) among the four side surfaces to the outside of the housing and extending in the direction from the first main surface to the second main surface. The housing has a gap between the lead wire and the specific side surface.

[0067] According to the electronic component described in Item 1, even when the substrate on which the electronic component is mounted is deformed so that the substrate expands and the lead wire moves away from the housing, or the substrate contracts and the lead wire is drawn into the housing side, the lead wire bends using the gap generated between the lead wire and the side surface of the housing, so that stress is concentrated on one end of the lead wire connected to the side surface or the other end of the lead wire soldered to the substrate. This can be prevented, and a decrease in the reliability of the electronic component can be prevented.

[0068] (Item 2) In the electronic component according to Item 1, the housing has a shape for generating a gap between the lead wire and the specific side surface.

[0069] According to the electronic component described in Item 2, the lead wire bends using the gap generated between the lead wire and the side surface of the housing, so that stress is concentrated on one end of the lead wire connected to the side surface or the other end of the lead wire soldered to the substrate. This can be prevented.

[0070] (Item 3) In the electronic component according to Item 1 or 2, the lead wire is soldered to the substrate (5) on which the housing is installed at the portion bent along the second main surface from the end of a specific side surface.

[0071] According to the electronic component described in Item 3, it is possible to prevent stress from concentrating on one end or the other end of the lead wire by utilizing the gap generated near the portion bent along the second main surface from the end of a specific side surface.

[0072] (Item 4) In the electronic component according to any one of Items 1 to 3, the width of the first end portion of the lead wire at the position drawn out from a specific side surface is smaller than the width of the second end portion of the lead wire soldered to the substrate.

[0073] According to the electronic component described in Item 4, the stress applied to the first end portion of the lead wire can be effectively relaxed, and it is possible to prevent the lead wire from cracking.

[0074] (Item 5) In the electronic component according to any one of Items 1 to 4, in the portion where the lead wire is drawn out from a specific side surface to the outside of the housing, the angle formed by the lead wire and the specific side surface is 2 degrees or more.

[0075] According to the electronic component described in Item 5, it is possible to effectively prevent stress from concentrating on one end or the other end of the lead wire by utilizing the gap where the angle formed by the lead wire and the specific side surface is 2 degrees or more.

[0076] (Item 6) In the electronic component according to Item 5, the angle is in the range of 2 degrees to 5 degrees.

[0077] According to the electronic component described in Item 6, it is possible to more effectively prevent stress from concentrating on one end or the other end of the lead wire by utilizing the gap where the angle formed by the lead wire and the specific side surface is in the range of 2 degrees to 5 degrees.

[0078] (Item 7) In the electronic component according to any one of Items 1 to 6, among the four side surfaces, the side surfaces (45, 46) connected to a specific side surface are formed in a stepped shape in the direction from the second main surface to the first main surface such that the width on the side of the second main surface is smaller than the width on the side of the first main surface.

[0079] According to the electronic component described in Item 7, it is possible to prevent stress from concentrating on one end or the other end of the lead wire by utilizing the gap generated by the shape of the side surface connected to the specific side surface.

[0080] (Item 8) The electronic component according to any one of Items 1 to 7 includes a first coil part (2a) disposed inside the housing and a second coil part (3a) disposed inside the housing. The first coil part and the second coil part are disposed inside the housing such that at least a part of the opening of the first coil part overlaps with the opening of the second coil part when viewed from the side of the first main surface. The lead wire is connected to at least one of the first coil part and the second coil part.

[0081] According to the electronic component described in Item 8, in the coil component, it is possible to prevent stress from concentrating on one end or the other end of the lead wire, and it is possible to prevent the reliability of the coil component from deteriorating.

[0082] In this specification, an example in which the angle formed by the lead wires 2d, 3d and the substrate 5 is 90 degrees has been described. However, it is sufficient that there is a gap between the lead wires 2d, 3d and the side surfaces 43, 44 of the housing 4, and the angle formed by the lead wires 2d, 3d and the substrate 5 is not limited to 90 degrees. More specifically, the coil component 1 may have a structure such that the side surfaces 43, 44 of the housing 4 are orthogonal to the main surface of the substrate 5.

[0083] As described above, a plurality of embodiments and modification examples have been explained. However, the features in each of these plurality of embodiments and modification examples can be appropriately combined as long as no contradiction occurs.

[0084] The embodiments disclosed this time should be considered as illustrative in all respects and not restrictive. The scope of the present disclosure is shown not by the description of the above embodiments but by the claims, and it is intended that all modifications within the meaning and scope equivalent to the claims are included.

Description of Reference Numerals

[0085] 1 Coil component, 2, 3 Coil conductors, 2a, 3a Coil parts, 2b, 2d, 3b, 3d Lead wires, 2c, 2e, 3c, 3e Electrodes, 4 Housing, 5 Substrate, 7 Insulator, 7a Opening, 41 Plane, 42 Bottom surface, 43, 44, 45, 46 Side surfaces, 62, 63 Soldering parts.

Claims

1. a housing including a pair of first and second main surfaces facing each other and four side surfaces connecting the first and second main surfaces; a lead wire that is led out from a specific side surface among the four side surfaces to the outside of the housing and extends in a direction from the first main surface to the second main surface, The electronic component, wherein the housing has a gap between the lead wire and the specific side surface.

2. The electronic component according to claim 1 , wherein the housing has a shape for generating the gap between the lead wire and the specific side surface.

3. 3 . The electronic component according to claim 1 , wherein the lead wire is soldered to a substrate on which the housing is mounted at a portion where the lead wire is bent from an end of the particular side surface along the second main surface.

4. The electronic component according to claim 3 , wherein a width of a first end of the lead wire at a position where the lead wire is led out from the particular side surface is smaller than a width of a second end of the lead wire soldered to the board.

5. 3 . The electronic component according to claim 1 , wherein an angle formed between the lead wire and the specific side surface at a portion where the lead wire is led out from the specific side surface to the outside of the housing is equal to or greater than 2 degrees.

6. The electronic component according to claim 5, wherein the angle is in the range of 2 degrees to 5 degrees.

7. 3. The electronic component according to claim 1, wherein a side surface connected to the specific side surface among the four side surfaces is formed in a stepped shape in a direction from the second main surface to the first main surface such that a width on the second main surface side is smaller than a width on the first main surface side.

8. A first coil portion disposed inside the housing; a second coil portion disposed inside the housing, the first coil section and the second coil section are disposed inside the housing such that, when viewed from the first main surface side, at least a portion of an opening of the first coil section overlaps with an opening of the second coil section; The electronic component according to claim 1 , wherein the lead wire is connected to at least one of the first coil portion and the second coil portion.

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