Coil electronic component and manufacturing method thereof

Abstract

To provide: a coil electronic component of which a thickness is thin; and a manufacturing method thereof.SOLUTION: A coil electronic component according to the present invention, includes: a magnetic body that includes a first surface and a second surface opposing each other in a first direction, a third surface and a fourth surface opposing each other in a second direction, and connecting the first and second surfaces, and a fifth surface and a sixth surface opposing each other in a third direction, and connecting the first and second surfaces, and includes a magnetic material; a support member that is arranged inside the magnetic body, and includes a first support surface and a second support surface facing each other; a coil that includes a first coil pattern arranged on the first support surface of the support member, a second coil pattern arranged on the second support surface of the support member, and a via connecting the first coil pattern and the second coil pattern.; an external electrode that is arranged on the sixth surface of the magnetic body; and at least one connection electrode connecting the coil with the external electrode in the magnetic body. A diameter of a part where the connection electrode is connected to the coil is larger than a diameter of a remaining part in the connection electrode.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a coil electronic component, and particularly to a coil electronic component with a small thickness and a method for manufacturing the same.

Background Art

[0002] In recent years, as the functions of mobile devices have become diversified, the power consumption has increased. In order to extend the battery usage time in mobile devices, coil electronic components with less loss and excellent efficiency are adopted around a power management integrated circuit (PMIC).

[0003] In order to slim down products and increase the degree of freedom in component arrangement, the demand for a power inductor with a small thickness has been increasing. In particular, the demand for a thin-film power inductor in which external electrodes are arranged only on the surface mounted on a substrate has also been increasing, which has become a problem.

Summary of the Invention

Problems to be Solved by the Invention

[0004] The present invention has been made in view of the above problems in the conventional coil electronic components, and an object of the present invention is to provide a coil electronic component with a small thickness. Another object of the present invention is to provide a method for manufacturing a coil electronic component with a small thickness.

Means for Solving the Problems

[0005] In order to achieve the above object, a coil electronic component according to the present invention has a first surface and a second surface facing each other in a first direction, a third surface and a fourth surface facing each other in a second direction and connecting the first surface and the second surface, and a fifth surface and a sixth surface facing each other in a third direction and connecting the first surface and the second surface. The coil electronic component includes a magnetic body containing a magnetic substance, a support member disposed inside the magnetic body and including a first support surface and a second support surface facing each other, a first coil pattern disposed on the first support surface of the support member, a second coil pattern disposed on the second support surface of the support member, and a via connecting the first coil pattern and the second coil pattern. The coil electronic component further has an external electrode disposed on the sixth surface of the magnetic body and at least one connection electrode connecting the coil and the external electrode inside the magnetic body. The diameter of a portion of the connection electrode connected to the coil is larger than the diameter of the remaining portion of the connection electrode.

[0006] Preferably, an extension portion having a diameter larger than that of the remaining portion of the connection electrode is disposed at an end of the connection electrode connected to the coil. Preferably, the connection electrode extends in the third direction and includes a first portion connected to the coil and a second portion extended in the first direction and connected to the external electrode. Preferably, the connection electrode extends in the third direction and includes a first portion connected to the coil and a second portion extended in the second direction and connected to the external electrode. Preferably, the connection electrode is made of a material different from that of the coil, and an intermetallic compound is disposed at an interface between the connection electrode and the coil. Preferably, the coil contains copper (Cu), and the connection electrode contains gold (Au), aluminum (Al), silver (Ag), or an alloy thereof. Preferably, a portion of the connection electrode connected to the external electrode and a portion of the connection electrode connected to the coil are on a center line in the first direction when viewed from the third direction. It is preferable that the portion where the connection electrode is connected to the external electrode and the portion where the connection electrode is connected to the coil are biased in the second direction with respect to the first direction center line when viewed from the third direction. The external electrode includes a first external electrode and a second external electrode, the connection electrode includes a first connection electrode connecting the first coil pattern and the first external electrode, and a second connection electrode connecting the second coil pattern and the second external electrode, and it is preferable that the first connection electrode and the second connection electrode are disposed so as to be biased toward the third surface or the fourth surface side of the magnetic body. The external electrode includes a first external electrode and a second external electrode, the connection electrode includes a first connection electrode connecting the first coil pattern and the first external electrode, and a second connection electrode connecting the second coil pattern and the second external electrode, and it is preferable that one of the first connection electrode and the second connection electrode is disposed so as to be biased toward the third surface side of the magnetic body, and the other connection electrode is disposed so as to be biased toward the fourth surface side.

[0007] A method for manufacturing a coil electronic component according to the present invention, which is made to achieve the above object, includes a step of providing a support member having a plurality of coils and a plurality of through holes, where each coil includes a first coil pattern disposed on a first surface of the support member around the through hole, and a second coil pattern disposed on a second surface of the support member and connected to the first coil pattern via a via, a step of connecting two adjacent first coil patterns to each other with a plurality of connection conductors, a step of disposing the support member on a first magnetic body, a step of filling a magnetic material so as to cover the support member, a step of crimping and curing the magnetic material to form a second magnetic body, a step of cutting the support member so that each of the connection conductors is divided into a first connection electrode and a second connection electrode to form an individual laminate, and a step of forming a first external electrode connected to the first connection electrode of the individual laminate and a second external electrode connected to the second connection electrode.

[0008] In the step of filling the magnetic material, it is preferable that a part of the connection conductor is exposed. Before the step of forming the individual laminate, it is preferable to further include a step of forming a first insulating film on the outer surface of the first magnetic body and a step of forming a second insulating film on the outer surface of the second magnetic body. In the step of forming the second insulating film on the outer surface of the second magnetic body, it is preferable that the second insulating film is formed so as to be separated from the exposed portion of the connection conductor. Before the step of forming the first external electrode and the second external electrode, it is preferable to further include a step of forming a third insulating film on an end surface in a direction intersecting the lamination direction of the individual laminate. Before the step of forming the individual laminate, it is preferable to further include a step of forming a second insulating film on the outer surface of the second magnetic body and a step of forming an adhesive layer so as to cover the outer surface of the second magnetic body and the second insulating film. Before the step of forming the first external electrode and the second external electrode, it is preferable to further include a step of forming a fourth insulating film so as to cover the outer surface of the individual laminate and the adhesive layer, and a step of removing the adhesive layer.

[0009] A method for manufacturing a coil electronic component according to another embodiment of the present invention includes a step of providing a support member having a plurality of coils and a plurality of through holes, where each coil includes a first coil pattern disposed on a first surface of the support member centered on the through hole, and a second coil pattern disposed on a second surface of the support member and connected to the first coil pattern via a via. The method further includes a step of connecting two connection electrodes to each first coil pattern, a step of disposing the support member on a first magnetic body, a step of filling a magnetic material so as to cover the support member, a step of crimping and curing the magnetic material to form a second magnetic body, a step of cutting the support member to form individual laminates, and a step of forming external electrodes connected to the connection electrodes of the individual laminates.

Advantages of the Invention

[0010] According to the coil electronic component and its manufacturing method according to the present invention, there are provided a magnetic body, a support member disposed inside the magnetic body and including a first support surface and a second support surface facing each other, a first coil pattern disposed on the first support surface of the support member, a second coil pattern disposed on the second support surface of the support member, a via connecting the first coil pattern and the second coil pattern, a coil including the via, an external electrode disposed on the magnetic body, and at least one connection electrode connecting the coil and the external electrode inside the magnetic body. The diameter of the portion where the connection electrode is connected to the coil is larger than the diameter of the remaining portion of the connection electrode, so that a coil electronic component with a small thickness can be provided.

Brief Description of the Drawings

[0011]

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Best Mode for Carrying Out the Invention

[0012] Next, a specific example of an embodiment for carrying out the coil electronic component and its manufacturing method according to the present invention will be described with reference to the drawings.

[0013] To clearly describe the present invention in the drawings, parts not related to the description are omitted, and the same reference numerals are given to the same or similar components throughout the specification. In addition, in the accompanying drawings, some components are exaggerated, omitted, or shown schematically, and the sizes of the components do not fully reflect the actual sizes. The attached drawings are for facilitating the understanding of the embodiments disclosed in this specification, and the technical ideas disclosed in this specification are not limited by the attached drawings, and should be understood to include all modifications, equivalents, or alternatives included in the spirit and technical scope of the present invention.

[0014] Terms including ordinal numbers such as first, second, etc. can be used to describe various components, but the components are not limited by the terms. These terms are used only for the purpose of distinguishing one component from another. Also, when a part such as a layer, film, region, plate, etc. is “on” or “above” another part, it includes not only the case where it is directly above the other part, but also the case where there is another part in between. Conversely, when a part is said to be “directly above” another part, it means that there is no other part in the middle. Also, being “on” or “above” a reference part means being located above or below the reference part, and does not necessarily mean being located “on” or “above” in the direction opposite to gravity. Throughout the specification, terms such as "comprising" or "having" are intended to specify the presence of the features, numbers, steps, operations, components, parts, or combinations thereof described in the specification, and are not to be construed as precluding the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof. Thus, when a part is said to "comprise" a certain component, this means that, unless otherwise stated to the contrary, it does not exclude other components, but can further comprise other components.

[0015] Also, throughout the specification, "on a plane" means when the target part is viewed from above, and "in a cross-section" means when the cross-section obtained by cutting the target part vertically is viewed from the side. Also, throughout this specification, "connected" does not only mean that two or more components are directly connected, but also means that two or more components are indirectly connected via other components, are not only physically connected but also electrically connected, or can mean that they are integrated although called by different names depending on their positions and functions.

[0016] FIG. 1 is a perspective view showing a schematic configuration of a coil electronic component according to an embodiment of the present invention, FIG. 2 is a schematic cross-sectional view taken along line II-II' of FIG. 1, FIG. 3 is a schematic cross-sectional view taken along line III-III' of FIG. 1, and FIG. 4 is a bottom view schematically showing the coil electronic component of FIG. 1. Referring to FIGS. 1, 2, 3, and 4, a coil electronic component 1000 according to an embodiment of the present invention includes a magnetic body 100, a coil 200, a support member 300, a first connection electrode 400, a second connection electrode 500, a first external electrode 700, a second external electrode 800, and a surface insulating layer 900.

[0017] The magnetic body 100 can be configured in a substantially rectangular parallelepiped shape, but the present embodiment is not limited thereto. Due to the shrinkage of magnetic powder and the like during sintering, the magnetic body 100 may have a substantially hexahedral shape, although it is not a perfect hexahedral shape. For example, the magnetic body 100 is substantially hexahedral, but the portions corresponding to the corners and vertices may have a rounded shape. In the present embodiment, for the sake of convenience of explanation, two opposing surfaces in the length direction (L-axis direction) are defined as the first surface (S1) and the second surface (S2), respectively, two opposing surfaces in the width direction (W-axis direction) are defined as the third surface (S3) and the fourth surface (S4), respectively, and two opposing surfaces in the thickness direction (T-axis direction) are defined as the fifth surface (S5) and the sixth surface (S6), respectively.

[0018] The length of the coil electronic component 1000 is based on an optical microscope or an SEM (Scanning Electron Microscope) photograph of the cross section in the length direction (L-axis direction)-thickness direction (T-axis direction) at the center in the width direction (W-axis direction) of the coil electronic component 1000, and means the maximum value among the lengths of a plurality of line segments parallel to the length direction (L-axis direction) by connecting the two outermost boundary lines facing each other in the length direction (L-axis direction) of the coil electronic component 1000 appearing in the cross section photograph described above. Alternatively, the length of the coil electronic component 1000 means the minimum value among the lengths of a plurality of line segments parallel to the length direction (L-axis direction) by connecting the two outermost boundary lines facing each other in the length direction (L-axis direction) of the coil electronic component 1000 appearing in the cross section photograph described above. Alternatively, the length of the coil electronic component 1000 means the arithmetic average value of the lengths of at least two line segments among a plurality of line segments parallel to the length direction (L-axis direction) by connecting the two outermost boundary lines facing each other in the length direction (L-axis direction) of the coil electronic component 1000 appearing in the cross section photograph described above.

[0019] The thickness of the coil electronic component 1000 means the maximum value among the lengths of a plurality of line segments parallel to the thickness direction (T-axis direction) by connecting two outermost boundary lines facing the thickness direction (T-axis direction) of the coil electronic component 1000 that appear in the cross-section photo described above, based on an optical microscope or SEM (Scanning Electron Microscope) photo of the length direction (L-axis direction)-thickness direction (T-axis direction) cross-section at the center in the width direction (W-axis direction) of the coil electronic component 1000. Alternatively, the thickness of the coil electronic component 1000 means the minimum value among the lengths of a plurality of line segments parallel to the thickness direction (T-axis direction) by connecting two outermost boundary lines facing the thickness direction (T-axis direction) of the coil electronic component 1000 that appear in the cross-section photo described above. Alternatively, the thickness of the coil electronic component 1000 means the arithmetic mean value of the lengths of at least two line segments among a plurality of line segments parallel to the thickness direction (T-axis direction) by connecting two outermost boundary lines facing the thickness direction (T-axis direction) of the coil electronic component 1000 that appear in the cross-section photo described above.

[0020] The width of the coil electronic component 1000 means the maximum value among the lengths of a plurality of line segments parallel to the width direction (W-axis direction) by connecting two outermost boundary lines facing the width direction (W-axis direction) of the coil electronic component 1000 that appear in the cross-section photo described above, based on an optical microscope or SEM (Scanning Electron Microscope) photo of the length direction (L-axis direction)-width direction (W-axis direction) cross-section at the center in the thickness direction (T-axis direction) of the coil electronic component 1000. Alternatively, the width of the coil electronic component 1000 means the minimum value among the lengths of a plurality of line segments parallel to the width direction (W-axis direction) by connecting two outermost boundary lines facing the width direction (W-axis direction) of the coil electronic component 1000 that appear in the cross-section photo described above. Alternatively, the width of the coil electronic component 1000 means the arithmetic mean value of the lengths of at least two line segments among a plurality of line segments parallel to the width direction (W-axis direction) by connecting two outermost boundary lines facing each other in the width direction (W-axis direction) of the coil electronic component 1000 appearing in the cross-sectional photograph described above.

[0021] On the other hand, each of the length, width, and thickness of the coil electronic component 1000 can also be measured by the micrometer measurement method. The micrometer measurement method sets the zero point on a Gage R&R (Repeatability and Reproducibility) micrometer, inserts the coil electronic component 1000 according to this embodiment between the chips of the micrometer, and turns the measurement lever of the micrometer to measure. On the other hand, when measuring the length of the coil electronic component 1000 by the micrometer measurement method, the length of the coil electronic component 1000 can mean the value measured once, or can also mean the arithmetic mean of the values measured multiple times. This can also be similarly applied to the measurement of the width and thickness of the coil electronic component 1000.

[0022] The magnetic body 100 constitutes the outer shape of the coil electronic component 1000, and is a space in which a magnetic path through which magnetic flux induced from the coil 200 passes is formed when current is applied to the coil 200 through the first external electrode 700 and the second external electrode 800. The magnetic body 100 surrounds and encapsulates the coil 200 and the support member 300 and contains a magnetic substance. The magnetic body 100 contains magnetic particles, and an insulating material is interposed between the magnetic particles. The magnetic substance includes a first metal magnetic powder, a second metal magnetic powder having a smaller particle size than the first metal magnetic powder, and a third metal magnetic powder having a smaller particle size than the second metal magnetic powder. The average particle size (D 50 ) of the first metal magnetic powder is 5 μm or more and 30 μm or less, and the average particle size (D 50) is 1 μm or more and 5 μm or less, and the average particle diameter (D 50 ) can be 0.05 μm or more and 0.5 μm or less. The magnetic particles can be ferrite particles or metal magnetic particles that exhibit magnetic properties.

[0023] The ferrite particles can be, for example, at least one or more of spinel ferrites such as Mg-Zn-based, Mn-Zn-based, Mn-Mg-based, Cu-Zn-based, Mg-Mn-Sr-based, Ni-Zn-based, hexagonal ferrites such as Ba-Zn-based, Ba-Mg-based, Ba-Ni-based, Ba-Co-based, Ba-Ni-Co-based, garnet ferrites such as Y-based, and Li-based ferrites.

[0024] The metal magnetic particles can be composed of two or more types of powders having different compositions, and can contain one or more selected from the group consisting of iron (Fe), silicon (Si), chromium (Cr), cobalt (Co), molybdenum (Mo), aluminum (Al), niobium (Nb), copper (Cu), and nickel (Ni). For example, the metal magnetic particles can be at least one or more of pure iron, Fe-Si-based alloys, Fe-Si-Al-based alloys, Fe-Ni-based alloys, Fe-Ni-Mo-based alloys, Fe-Ni-Mo-Cu-based alloys, Fe-Co-based alloys, Fe-Ni-Co-based alloys, Fe-Cr-based alloys, Fe-Cr-Si-based alloys, Fe-Si-Cu-Nb-based alloys, Fe-Ni-Cr-based alloys, and Fe-Cr-Al-based alloys. Here, the different compositions of the metal magnetic particles mean different contents.

[0025] The metal magnetic particles can be amorphous or crystalline. For example, the metal magnetic particles can be Fe-Si-B-Cr-based amorphous alloys, but the present embodiment is not limited thereto. The metal magnetic particles have an average particle diameter of about 0.1 μm to 30 μm, but are not limited thereto. In this specification, the average particle diameter means a particle size distribution expressed by D 90 or D 50 and the like. The particle size distribution is well known to those skilled in the art as an indicator showing what ratio of particles of what size (particle diameter) are contained in the particle group to be measured. D 50 (The particle diameter corresponding to 50% volume accumulation of the particle size distribution) indicates the average particle diameter. The metal magnetic particles can be two or more different types of metal magnetic particles. Here, the fact that the types of metal magnetic particles are different means that the metal magnetic particles are distinguished from each other by at least one of the average particle diameter, composition, component ratio, crystallinity, and shape.

[0026] The insulating material can include, but is not limited to, epoxy, polyimide, liquid crystal polymer, etc. alone or in combination. The method for forming the magnetic body 100 is not particularly limited. For example, after arranging sheets made of magnetic materials above and below the coil 200, they can be pressure-bonded and cured to form the magnetic body 100.

[0027] The support member 300 is disposed inside the magnetic body 100 and supports the coil 200. The support member 300 can be formed of an insulating material including a thermosetting insulating resin such as an epoxy resin, a thermoplastic insulating resin such as polyimide, or a photosensitive insulating resin, or can be composed of an insulating material in which such an insulating resin is impregnated with a reinforcing agent such as glass fiber or an inorganic filler. For example, the support member 300 can be formed of an insulating material such as prepreg, ABF (Ajinomoto Build-up Film), FR-4, BT (Bismaleimide Triazine) film, PID (Photo Imageable Dielectric) film, etc., but the present embodiment is not limited thereto.

[0028] As the inorganic filler, silica (SiO 2) Alumina (Al 2 O 3 ) Silicon carbide (SiC), barium sulfate (BaSO 4 ), talc, mud, mica powder, aluminum hydroxide (Al(OH) 3 ), magnesium hydroxide (Mg(OH) 2 ), calcium carbonate (CaCO 3 ), magnesium carbonate (MgCO 3 ), magnesium oxide (MgO), boron nitride (BN), aluminum borate (AlBO 3 ), barium titanate (BaTiO 3 ), and calcium zirconate (CaZrO 3 ) at least one or more selected from the group consisting of may be used. There is a through hole 310 at the center of the support member 300. By filling the through hole 310 with the magnetic material constituting the magnetic body 100 to form the core 110, the performance of the coil electronic component can be improved.

[0029] The coil 200 is disposed inside the magnetic body 100 and exhibits the characteristics of the coil electronic component 1000. For example, when the coil electronic component 1000 of the present embodiment is utilized as a power inductor, when a current is applied to the coil 200, it stores energy in the form of a magnetic field and plays a role in stabilizing the power supply of the electronic device by maintaining the output voltage. The coil 200 is disposed on the first support surface 320 and the second support surface 330 of the support member 300 that face each other. The coil 200 includes a first coil pattern 210 and a second coil pattern 220, and the first coil pattern 210 and the second coil pattern 220 are electrically connected via the first via 230.

[0030] The first coil pattern 210 is disposed on the first support surface 320 of the support member 300 and includes a first lead-out portion 213. The first lead-out portion 213 is electrically connected to the first external electrode 700 by the first connection electrode 400. The first coil pattern 210 is not directly connected to the connection part 250. For example, the first coil pattern 210 and the connection part 250 may be made of the same conductive metal, or may be separated from each other. The second coil pattern 220 is disposed on the second support surface 330 of the support member 300 and includes a second lead-out portion 223. The second lead-out portion 223 is electrically connected to the second external electrode 800 by the second via 240, the connection part 250, and the second connection electrode 500.

[0031] On the other hand, when the first coil pattern 210, the first lead-out portion 213, the first via 230, the second via 240, and the connection part 250 are formed by plating on the side of the first support surface 320 of the support member 300, the first coil pattern 210, the first lead-out portion 213, the first via 230, the second via 240, and the connection part 250 each include a seed layer such as an electroless plating layer and an electrolytic plating layer. Here, the electrolytic plating layer may have a single-layer structure or a multilayer structure. The electrolytic plating layer having a multilayer structure is formed in a conformal structure in which one electrolytic plating layer covers another electrolytic plating layer, and may also be formed in a shape in which one electrolytic plating layer is laminated only on one surface of another electrolytic plating layer.

[0032] The seed layer of the first coil pattern 210, the seed layer of the first lead-out portion 213, the seed layer of the first via 230, the seed layer of the second via 240, and the seed layer of the connection part 250 may be integrally formed and no boundary may be formed therebetween, but the present embodiment is not limited thereto. The electrolytic plating layer of the first coil pattern 210, the electrolytic plating layer of the first lead-out portion 213, the electrolytic plating layer of the first via 230, the electrolytic plating layer of the second via 240, and the electrolytic plating layer of the connection part 250 may be integrally formed and no boundary may be formed therebetween, but the present embodiment is not limited thereto. The above description can be similarly applied to the second coil pattern 220, the second lead-out portion 223, the first via 230, and the second via 240.

[0033] Each of the coil 200 and the vias (230, 240) is formed of a conductive material such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or an alloy thereof, but the present embodiment is not limited thereto. An insulating film (IF) is provided between the coil 200 and the magnetic body 100.

[0034] The insulating film (IF) is formed along the surfaces of the support member 300 and the coil 200. There is no insulating film (IF) at the portion where the support member 300 and the coil 200 are connected to the connection electrodes (400, 500). The insulating film (IF) is for insulating the coil 200 from the magnetic body 100 and includes a known insulating material such as Parylene. Any insulating material can be included in the insulating film (IF), and there is no special limitation. For example, the insulating film (IF) can be a polyurethane resin, a polyester resin, an epoxy resin, or a polyamide-imide resin. The insulating film (IF) is formed by a method such as vapor deposition, but is not limited thereto. For example, the insulating film (IF) can also be formed by laminating an insulating film on both sides of the support member 300.

[0035] The first connection electrode 400 electrically connects the coil 200 to the first external electrode 700 within the magnetic body 100, and the second connection electrode 500 electrically connects the coil 200 to the second external electrode 800 within the magnetic body 100. The first connection electrode 400 is disposed within the magnetic body 100. For example, the first connection electrode 400 is separated from the first surface (S1), the third surface (S3), and the fourth surface (S4) of the magnetic body 100. The first connection electrode 400 may be a conductive wire. The conductive wire may be, for example, a bonding wire. That is, the first connection electrode 400 is connected to the first lead portion 213 of the first coil pattern 210 by ball bonding. The connection method by ball bonding is as generally known. For example, ball bonding is performed by melting the tip of the bonding wire to form a free air ball and crimping this ball to the first lead portion 213.

[0036] The first connection electrode 400 can also be formed by plating a conductive metal. However, when the distance between the first coil pattern 210 and the first external electrode 700 is relatively large, it is not easy to form the first connection electrode 400 by plating. In this case, it may be advantageous to form the first connection electrode 400 by ball bonding the conductive wire as described above. The first connection electrode 400 includes a first main body 410 and a first extension portion 420. The first main body 410 occupies most of the first connection electrode 400. The first main body 410 includes a first end portion 411 and a second end portion 413. The first end portion 411 is the portion connected to the first external electrode 700, and the second end portion 413 is the portion connected to the first extension portion 420.

[0037] The first extension portion 420 is connected to the first lead portion 213 of the first coil pattern 210 and the second end portion 413 of the first main body 410. Therefore, the first extension portion 420 is disposed between the first lead portion 213 of the first coil pattern 210 and the first main body 410 of the first connection electrode 400. The first extension portion 420 is thicker than the first main body 410. For example, the diameter of the first extension portion 420 is larger than the diameter of the first main body 410. The first connection electrode 400 can be made of the same material as the coil 200. For example, both the first connection electrode 400 and the coil 200 contain copper (Cu). The first connection electrode 400 can also be made of a material different from that of the coil 200. For example, the coil 200 contains copper (Cu), and the first connection electrode 400 may contain gold (Au), aluminum (Al), silver (Ag), or an alloy thereof. When the first connection electrode 400 is made of a material different from that of the coil 200, an intermetallic compound may be formed at the interface between the first connection electrode 400 and the coil 200. For example, an intermetallic compound is disposed at the interface between the first extension portion 420 and the first lead portion 213.

[0038] The second connection electrode 500 is disposed within the magnetic body 100. For example, the second connection electrode 500 is spaced apart from the second surface (S2), the third surface (S3), and the fourth surface (S4) of the magnetic body 100. Similar to the first connection electrode 400, the second connection electrode 500 may be a conductive wire. The conductive wire may be, for example, a bonding wire. The second connection electrode 500 includes a second main body 510 and a second extension portion 520. The second main body 510 occupies most of the second connection electrode 500. The second main body 510 includes a first end portion 511 and a second end portion 513. The first end portion 511 is a portion connected to the first external electrode 800, and the second end portion 513 is a portion connected to the second extension portion 520.

[0039] The second extension portion 520 is connected to the second lead portion 223 of the second coil pattern 220 and the second end portion 513 of the second main body 510. That is, the second extension portion 520 is connected to the second lead portion 223 of the second coil pattern 220 via the second via 240 and the connection portion 250. The connection part 250 is connected to the second via 240 and the second connection electrode 500, but is electrically insulated from the first coil pattern 210. Therefore, the second extension part 520 is disposed between the connection part 250 and the second main body 510 of the second connection electrode 500. The second extension part 520 is thicker than the second main body 510. For example, the diameter of the second extension part 520 is larger than the diameter of the second main body 510. The second connection electrode 500 can be made of the same material as the coil 200. For example, both the second connection electrode 500 and the coil 200 contain copper (Cu).

[0040] The second connection electrode 500 can also be made of a material different from that of the coil 200. For example, the coil 200 contains copper (Cu), and the second connection electrode 500 may contain gold (Au), aluminum (Al), silver (Ag), or an alloy thereof. When the second connection electrode 500 is made of a material different from that of the coil 200, an intermetallic compound may be formed at the interface between the second connection electrode 500 and the coil 200. For example, an intermetallic compound is disposed at the interface between the second extension part 520 and the connection part 250.

[0041] Referring to FIG. 4, the first connection electrode 400 and the second connection electrode 500 are disposed on a center line (C-C') passing through the center in the width direction (W-axis direction) of the magnetic body 100 and parallel to the length direction (L-axis direction). The first external electrode 700 and the second external electrode 800 are disposed outside the magnetic body 100 and connected to the coil 200. The first external electrode 700 is disposed on the sixth surface (S6) of the magnetic body 100 and connected to the first lead-out part 213 of the coil 200 via the first connection electrode 400. The second external electrode 800 is disposed on the sixth surface (S6) of the magnetic body 100 and connected to the second lead-out part 223 of the coil 200 via the second connection electrode 500. The first external electrode 700 includes a first metal layer 701, a second metal layer 702, and a third metal layer 703.

[0042] The first metal layer 701 includes copper (Cu) as a plating layer that contacts the outer surfaces of the first connection electrode 400 and the magnetic body 100, that is, the sixth surface (S6). The second metal layer 702 includes nickel (Ni) as a plating layer that covers the first metal layer 701. The third metal layer 703 includes tin (Sn) as a plating layer that covers the second metal layer 702. However, the present embodiment is not limited to such a three-layer structure, and a two-layer structure in which only one metal layer is added on the first metal layer 701 is also possible.

[0043] The second external electrode 800 includes a first metal layer 801, a second metal layer 802, and a third metal layer 803. The first metal layer 801 includes copper (Cu) as a plating layer that contacts the outer surfaces of the second connection electrode 500 and the magnetic body 100, that is, the sixth surface (S6). The second metal layer 802 includes nickel (Ni) as a plating layer that covers the first metal layer 801. The third metal layer 803 includes tin (Sn) as a plating layer that covers the second metal layer 802. However, the present embodiment is not limited to such a three-layer structure, and a two-layer structure in which only one metal layer is added on the first metal layer 801 is also possible.

[0044] As another example, the first external electrode 700 and the second external electrode 800 include a conductive metal and glass. The conductive metal can be, for example, a conductive metal including copper (Cu), nickel (Ni), tin (Sn), palladium (Pd), platinum (Pt), gold (Au), silver (Ag), tungsten (W), titanium (Ti), lead (Pb), or an alloy thereof. The glass component included in the external electrodes (700, 800) has a composition in which an oxide is mixed. The glass component may include, for example, silicon oxide, boron oxide, aluminum oxide, transition metal oxide, alkali metal oxide, alkaline earth metal oxide, or a combination thereof. Here, the transition metal is selected from zinc (Zn), titanium (Ti), copper (Cu), vanadium (V), manganese (Mn), iron (Fe), or nickel (Ni), the alkali metal is selected from lithium (Li), sodium (Na), or potassium (K), and the alkaline earth metal may be selected from magnesium (Mg), calcium (Ca), strontium (Sr), or barium (Ba).

[0045] The method for forming such external electrodes (700, 800) is not particularly limited. For example, it can be formed by dipping the laminate into a conductive paste containing a conductive metal and glass, or by printing the conductive paste on the surface of the laminate by a screen printing method, a gravure printing method, or the like. In addition, various methods can be used, such as applying the conductive paste to the surface of the laminate, or transferring a dry film obtained by drying the conductive paste to the laminate.

[0046] The surface insulating layer 900 is disposed on the first surface (S1), the second surface (S2), the fifth surface (S5), and the sixth surface (S6) of the magnetic body 100. However, the surface insulating layer 900 partially covers the sixth surface (S6) of the magnetic body 100. That is, the first external electrode 700 and the second external electrode 800 are disposed on the sixth surface (S6) of the magnetic body 100, and the surface insulating layer 900 does not cover the first external electrode 700 and the second external electrode 800. On the other hand, the surface insulating layer 900 is also disposed on the third surface (S3) and the fourth surface (S4) of the magnetic body 100. In this way, the surface insulating layer 900 is disposed on at least a part of the first surface (S1), the second surface (S2), the third surface (S3), the fourth surface (S4), the fifth surface (S5), and the sixth surface (S6) of the magnetic body 100 to prevent an electrical short circuit between other electronic components and the external electrodes (700, 800).

[0047] The surface insulating layer 900 can be used as a resist when forming the external electrodes (700, 800) by electrolytic plating, but is not limited thereto. The surface insulating layer 900 may contain a polymer resin, a pigment, a filler, etc. The polymer resin may include a thermosetting polymer resin such as epoxy or a thermoplastic polymer resin such as acrylic. As a pigment that can produce a color, for example, in the case of black, carbon black, black manganese (Mn)-based spinel powder, etc. can be used. The surface insulating layer is SiO 2 and may further contain additives such as talc.

[0048] For example, the surface insulating layer 900 is a thermoplastic resin such as polystyrene-based, vinyl acetate-based, polyester-based, polyethylene-based, polypropylene-based, polyamide-based, rubber-based, acrylic-based, etc., a thermosetting resin such as phenol-based, epoxy-based, urethane-based, melamine-based, alkyd-based, etc., a photosensitive resin, parylene, SiO x or SiN x and may contain. The surface insulating layer 900 can be formed through processes such as screen printing, pad printing, dipping, spray printing, etc. For example, the surface insulating layer 900 can be formed by applying a liquid insulating resin to the surface of the magnetic body 100, laminating an insulating film such as a dry film on the surface of the magnetic body 100, or through a thin film process such as vapor deposition. In the case of an insulating film, an ABF (Ajinomoto Build-up Film) or a polyimide film that does not contain a photosensitive insulating resin may be used.

[0049] The thickness of the surface insulating layer 900 can be 3 μm or more and 25 μm or less. If the thickness of the surface insulating layer 900 is less than 3 μm, the magnetic material is exposed at the thin part, and there is a possibility that problems such as oxidation may occur in the outer shape in the actual use environment. When the thickness of the surface insulating layer 900 exceeds 25 μm, although the insulating properties are excellent, the volume of the magnetic material relatively decreases compared to the volume of the coil electronic component 1000, so there is a possibility that electrical characteristics such as inductance, DC resistance, or rated current may deteriorate.

[0050] FIG. 5 is a diagram schematically showing a first coil pattern and a second coil pattern of a coil electronic component according to a modified example of an embodiment of the present invention. Referring to FIG. 5, the first coil pattern 210a includes a first extension portion 215a, and the second coil pattern 220a includes a second extension portion 225a. The first extension portion 215a is a structure extended from the first lead portion 213 to the third surface (S3) side of the magnetic body 100 and is connected to the first connection electrode 400. The second extension portion 225a is a structure extended from the second lead portion 223 to the third surface (S3) side of the magnetic body 100 and is connected to the second connection electrode 500.

[0051] In this way, the first connection electrode 400 and the second connection electrode 500 are arranged so as to be biased to the third surface (S3) side of the magnetic body 100 with respect to the center line (C-C'). Compared with the embodiment shown in FIG. 4, in this modified example, the first connection electrode 400 is not directly connected to the first lead portion 213, and the second connection electrode 500 is not directly connected to the second lead portion 223. Therefore, the sizes of the first lead portion 213 and the second lead portion 223 can be reduced, and the area of the coil can be increased accordingly. Ultimately, the capacitance of the coil electronic component can be increased. Since the remaining components except for the above are the same as the components of the coil electronic component shown in FIG. 1, the repeated description thereof is omitted.

[0052] FIG. 6 is a diagram schematically showing a first coil pattern and a second coil pattern of a coil electronic component according to another modification of the embodiment of the present invention. Referring to FIG. 6, the first coil pattern 210b includes a first protruding portion 215b, and the second coil pattern 220b includes a second extending portion 225b. The first protruding portion 215b is a structure protruding from the first coil pattern 210b near the first lead portion 213 to the side of the point where the first surface (S1) and the fourth surface (S4) of the magnetic body 100 are in contact, and is connected to the first connection electrode 400. The second extending portion 225b is a structure extending from the second lead portion 223 of the second coil pattern 220b to the side of the third surface (S3) of the magnetic body 100, and is connected to the second connection electrode 500. Thus, the first connection electrode 400 and the second connection electrode 500 are arranged so as to be displaced from each other with respect to the center line (C-C'). That is, the first connection electrode 400 is biased toward the fourth surface (S4) side of the magnetic body 100, and the second connection electrode 500 is arranged so as to be biased toward the third surface (S3) side. The effect of such an arrangement is the same as or similar to the effect of the modification shown in FIG. 5.

[0053] FIG. 7 is a diagram schematically showing a first coil pattern and a second coil pattern of a coil electronic component according to another modification of the embodiment of the present invention. Referring to FIG. 7, the first coil pattern 210c includes a first protruding portion 215c, and the second coil pattern 220c includes a second protruding portion 225c. The first protruding portion 215c is a structure protruding from the first coil pattern 210c near the first lead portion 213 to the side of the point where the first surface (S1) and the fourth surface (S4) of the magnetic body 100 are in contact, and is connected to the first connection electrode 400. The second protruding portion 225c is a structure extending from the second coil pattern 220c near the second lead portion 223 to the side of the point where the second surface (S2) and the fourth surface (S4) of the magnetic body 100 are in contact, and is connected to the second connection electrode 500. In this way, the first connection electrode 400 and the second connection electrode 500 are arranged so as to be biased toward the fourth surface (S4) side of the magnetic body 100 with respect to the center line (C-C'). The effects of such an arrangement are the same as or similar to the effects of the modification shown in FIG. 5.

[0054] FIG. 8 is a diagram schematically showing a first coil pattern and a second coil pattern of a coil electronic component according to another modification of the embodiment of the present invention. Referring to FIG. 8, the first coil pattern 210d includes a first extension portion 215d, and the second coil pattern 220d includes a second protruding portion 225d. The first extension portion 215d is a structure extended from the first lead-out portion 213 toward the third surface (S3) side of the magnetic body 100 and is connected to the first connection electrode 400. The second protruding portion 225d is a structure extended from the second coil pattern 220d near the second lead-out portion 223 toward the side of the point where the second surface (S3) and the fourth surface (S4) of the magnetic body 100 are in contact and is connected to the second connection electrode 500. In this way, the first connection electrode 400 and the second connection electrode 500 are arranged so as to cross each other with respect to the center line (C-C'). That is, the first connection electrode 400 is biased toward the third surface (S3) side of the magnetic body 100, and the second connection electrode 500 is arranged so as to be biased toward the fourth surface (S4) side. The effects of such an arrangement are the same as or similar to the effects of the modification shown in FIG. 5.

[0055] FIG. 9 is a diagram schematically showing a first coil pattern and a second coil pattern of a coil electronic component according to another modification of the embodiment of the present invention. Referring to FIG. 9, the first coil pattern 210e is connected to the first external electrode 700 via two first connection electrodes 400, and the second coil pattern 220e is connected to the second external electrode 800 via two second connection electrodes 500. That is, the first coil pattern 210e includes a first lead-out portion 213e, and two first connection electrodes 400 are connected to the first lead-out portion 213e. The two first connection electrodes 400 are also connected to the first external electrode 700. Also, the second coil pattern 220e includes a second lead-out portion 223e, and two second connection electrodes 500 are connected to the second lead-out portion 223e. The two second connection electrodes 500 are also connected to the second external electrode 800.

[0056] The diameter of the bonding wire used as the connection electrode is 8 μm or more and 500 μm or less. The larger the diameter of the bonding wire used, the lower the resistance, which is advantageous. However, when it is difficult to use a bonding wire with a larger diameter due to space constraints, two connection electrodes with a smaller diameter can be used together to further reduce the DC resistance (Rdc). On the other hand, the number of connection electrodes is not limited to two, and more connection electrodes can be used as needed. Since the remaining components other than the above are the same as the components of the coil electronic component shown in FIG. 1, duplicate descriptions thereof are omitted.

[0057] FIG. 10 is a diagram schematically showing a first coil pattern and a second coil pattern of a coil electronic component according to another modification of the embodiment of the present invention. Referring to FIG. 10, the first coil pattern 210f includes a first extension portion 215f, and the second coil pattern 220f includes a second extension portion 225f. The first extension portion 215f is a structure extended from the first lead-out portion 213f to the third surface (S3) side of the magnetic body 100, and is connected to the two first connection electrodes 400. The second extension portion 225f is a structure extended from the second lead-out portion 223f to the third surface (S3) side of the magnetic body 100, and is connected to the two second connection electrodes 500. Since the remaining components other than the above are the same as the components of the coil electronic component shown in FIG. 5, repeated descriptions thereof are omitted.

[0058] FIG. 11 is a diagram schematically showing a first coil pattern and a second coil pattern of a coil electronic component according to another modification of the embodiment of the present invention. Referring to FIG. 11, the first coil pattern 210g includes a first protrusion 215g, and the second coil pattern 220g includes a second extension 225g. The first protrusion 215g is a structure extended from the first coil pattern 210g near the first lead-out portion 213g to the side of the point where the first surface (S1) and the fourth surface (S4) of the magnetic body 100 are in contact, and is connected to the two first connection electrodes 400. The second extension 225g is a structure extended from the second lead-out portion 223g to the side of the third surface (S3) of the magnetic body 100, and is connected to the two second connection electrodes 500. Since the remaining components except the above are the same as the components of the coil electronic component shown in FIG. 6, the repeated description thereof is omitted.

[0059] FIG. 12 is a diagram schematically showing a first coil pattern and a second coil pattern of a coil electronic component according to another modification of the embodiment of the present invention. Referring to FIG. 12, the first coil pattern 210h includes a first protrusion 215h, and the second coil pattern 220h includes a second protrusion 225h. The first protrusion 215h is a structure protruding from the first coil pattern 210h near the first lead-out portion 213h to the side of the point where the first surface (S1) and the fourth surface (S4) of the magnetic body 100 are in contact, and is connected to the two first connection electrodes 400. The second protrusion 225h is a structure extended from the second coil pattern 220h near the second lead-out portion 223h to the side of the point where the second surface (S2) and the fourth surface (S4) of the magnetic body 100 are in contact, and is connected to the two second connection electrodes 500. Since the remaining components except the above are the same as the components of the coil electronic component shown in FIG. 7, the repeated description thereof is omitted.

[0060] FIG. 13 is a diagram schematically showing a first coil pattern and a second coil pattern of a coil electronic component according to another modification of the embodiment of the present invention. Referring to FIG. 13, the first coil pattern 210i includes a first extension portion 215i, and the second coil pattern 220a includes a second protrusion portion 225i. The first extension portion 215i is a structure that extends from the first lead-out portion 213i to the side of the third surface (S3) of the magnetic body 100 and is connected to the two first connection electrodes 400. The second protrusion portion 225i is a structure that extends from the second coil pattern 220a near the second lead-out portion 223i to the side of the point where the second surface (S3) and the fourth surface (S3) of the magnetic body 100 are in contact and is connected to the two second connection electrodes 500. Since the remaining components except for the above are the same as the components of the coil electronic component shown in FIG. 8, repeated description thereof will be omitted.

[0061] FIG. 14 is a perspective view showing a schematic configuration of a coil electronic component according to another embodiment of the present invention, FIG. 15 is a schematic cross-sectional view taken along line XV-XV' of FIG. 14, FIG. 16 is a schematic cross-sectional view taken along line XVI-XVI' of FIG. 14, and FIG. 17 is a bottom view schematically showing the coil electronic component of FIG. 14. Since the components of the coil electronic component 2000 except for the first connection electrode 1400 and the second connection electrode 1500 are the same as the components of the coil electronic component shown in FIG. 1, repeated description thereof will be omitted.

[0062] The first connection electrode 1400 includes a first main body 1410, a first bent portion 1411, and a first extension portion 1420. The first main body 1410 occupies most of the first connection electrode 1400 and is spaced apart from the first surface (S1) of the magnetic body 100. A first bent portion 1411 is connected to one end of the first main body 1410, and a first extension portion 1420 is connected to the other end. The first bent portion 1411 is a portion connected to the first external electrode 700. The first bent portion 1411 contacts the first external electrode 700 and extends to the first surface (S1) of the magnetic body 100 along the length direction (L-axis direction). The first main body 1410 is separated from the first surface (S1) of the magnetic body 100, while the first bent portion 1411 is in contact with the first surface (S1) of the magnetic body 100. Therefore, compared with the case where the first bent portion 1411 is not present, the area where the first connection electrode 1400 contacts the first external electrode 700 is larger. The first extension portion 1420 is connected to the first lead portion 213 of the first coil pattern 210. Therefore, the first extension portion 1420 is disposed between the first lead portion 213 of the first coil pattern 210 and the first main body 1410 of the first connection electrode 1400. The first extension portion 1420 is thicker than the first main body 1410. For example, the diameter of the first extension portion 1420 is larger than the diameter of the first main body 1410.

[0063] The second connection electrode 1500 includes a second main body 1510, a second bent portion 1511, and a second extension portion 1520. The second main body 1510 occupies most of the second connection electrode 1500 and is separated from the second surface (S2) of the magnetic body 100. One end portion of the second main body 1510 is connected to the second bent portion 1511, and the other end portion is connected to the second extension portion 1520. The second bent portion 1511 is a portion connected to the second external electrode 800. The second bent portion 1511 contacts the second external electrode 800 and extends to the second surface (S2) of the magnetic body 100 along the length direction (L-axis direction). The second main body 1510 is separated from the second surface (S2) of the magnetic body 100, while the second bent portion 1511 is in contact with the second surface (S2) of the magnetic body 100. Therefore, compared with the case where the second bent portion 1511 is not present, the area where the second connection electrode 1500 contacts the second external electrode 800 is larger. The second extension portion 1520 is connected to the second lead portion 223 of the second coil pattern 220 via the second via 240. Therefore, the second extension portion 1520 is disposed between the second via 240 and the second main body 1510 of the second connection electrode 1500. The second extension portion 1520 is thicker than the second main body 1510. For example, the diameter of the second extension portion 1520 is larger than the diameter of the second main body 1510.

[0064] The first connection electrode 1400 and the second connection electrode 1500 may be conductive wires. The conductive wire may be, for example, a bonding wire.

[0065] FIG. 18 is a perspective view showing a schematic configuration of a coil electronic component according to another embodiment of the present invention, FIG. 19 is a schematic cross-sectional view taken along line XIX-XIX' of FIG. 18, and FIG. 20 is a bottom view schematically showing the coil electronic component of FIG. 18. Since the components of the coil electronic component 3000 excluding the first connection electrode 2400 and the second connection electrode 2500 are the same as the components of the coil electronic component shown in FIG. 1, duplicate descriptions thereof are omitted.

[0066] The first connection electrode 2400 includes a first main body 2410, a first bent portion 2411, and a first extension portion 2420. The first main body 2410 occupies most of the first connection electrode 2400 and is separated from the first surface (S1) of the magnetic body 100. A first bent portion 2411 is connected to one end portion of the first main body 2410, and a first extension portion 2420 is connected to the other end portion. The first bent portion 2411 is a portion connected to the first external electrode 700. The first bent portion 2411 contacts the first external electrode 700 and extends to the third surface (S3) of the magnetic body 100 along the width direction (W-axis direction). While the first main body 2410 is separated from the third surface (S3) of the magnetic body 100, the first bent portion 2411 contacts the third surface (S3) of the magnetic body 100. Therefore, the area where the first connection electrode 2400 contacts the first external electrode 700 is wider than the case where the first bent portion 2411 is absent. The first extension portion 2420 is connected to the first lead-out portion 213 of the first coil pattern 210. Therefore, the first extension portion 2420 is disposed between the first lead portion 213 of the first coil pattern 210 and the first main body 2410 of the first connection electrode 2400. The first extension portion 2420 is thicker than the first main body 2410. For example, the diameter of the first extension portion 2420 is larger than the diameter of the first main body 2410.

[0067] The second connection electrode 2500 includes a second main body 2510, a second bent portion 2511, and a second extension portion 2520. The second main body 2510 occupies most of the second connection electrode 2500 and is spaced apart from the second surface (S2) of the magnetic body 100. A second bent portion 2511 is connected to one end of the second main body 2510, and a second extension portion 2520 is connected to the other end. The second bent portion 2511 is a portion connected to the second external electrode 800. The second bent portion 2511 contacts the second external electrode 800 and extends to the third surface (S3) of the magnetic body 100. While the second main body 2510 is spaced apart from the third surface (S3) of the magnetic body 100, the second bent portion 2511 contacts the third surface (S3) of the magnetic body 100. Therefore, compared with the case where the second bent portion 2511 is not present, the area where the second connection electrode 2500 contacts the second external electrode 800 is wider. The second extension portion 2520 is connected to the second lead portion 223 of the second coil pattern 220 via the second via 240. Therefore, the second extension portion 2520 is disposed between the second via 240 and the second main body 2510 of the second connection electrode 2500. The second extension portion 2520 is thicker than the second main body 2510. For example, the diameter of the second extension portion 2520 is larger than the diameter of the second main body 2510.

[0068] The first connection electrode 1400 and the second connection electrode 1500 may be conductive wires. The conductive wire may be, for example, a bonding wire.

[0069] FIG. 21 is a flowchart for explaining a method of manufacturing a coil electronic component according to an embodiment of the present invention, and FIGS. 22a to 22g are diagrams sequentially showing the method of manufacturing a coil electronic component according to an embodiment of the present invention.

[0070] Referring to FIG. 21, the method of manufacturing a coil electronic component according to an embodiment of the present invention includes a step (21-ST1) of providing a support member having a plurality of coils and a plurality of through holes, a step (21-ST2) of connecting two adjacent first coil patterns to each other with a connection conductor, a step (21-ST3) of disposing the support member on a first magnetic body, a step (21-ST4) of filling a magnetic material so as to cover the support member, a step (21-ST5) of crimping and curing the magnetic material to form a second magnetic body, a step (21-ST6) of forming a first insulating film on an outer surface of the first magnetic body, a step (21-ST7) of forming a second insulating film on an outer surface of the second magnetic body, a step (21-ST8) of cutting the support member so that each connection conductor is divided into a first connection electrode and a second connection electrode to form an individual laminate, a step (21-ST9) of forming a third insulating film on an end surface in a direction intersecting the stacking direction of the individual laminate, a step (21-ST10) of forming a first external electrode connected to the first connection electrode of the individual laminate and a second external electrode connected to the second connection electrode.

[0071] In step (21-ST1), each coil includes a first coil pattern disposed on a first surface of the support member around the through hole, and a second coil pattern disposed on a second surface of the support member and connected to the first coil pattern via a via. In step (21-ST4), a part of the connection conductor is exposed. In step (21-ST7), the second insulating film is formed so as to be separated from the exposed portion of the connection conductor.

[0072] Referring to FIG. 22a, the support member 300 includes a plurality of coils 200 and a plurality of through holes 310. Each coil 200 includes a first coil pattern 210 disposed on the first support surface 320 of the support member 300 around the through hole 310, and a second coil pattern 220 disposed on the second support surface 330 of the support member 300 and connected to the first coil pattern 210 via the first via 230. Two adjacent first coil patterns 210 in the length direction (L-axis direction) are connected to each other via a connection conductor 600.

[0073] The connection conductor 600 may be a bonding wire. For example, one end of the bonding wire is melted to form a free air ball, this ball is crimped to the first point (P1) which becomes the first lead-out portion 213 of the first coil pattern 210, and the other end of the bonding wire is crimped to the second point (P2) separated from the first point (P1) to perform ball bonding. Also, the ball of the bonding wire is crimped to the connection portion 250, and the other end of the bonding wire is crimped to another connection portion 250 to perform ball bonding. Before performing ball bonding, a step of irradiating a laser to the first point (P1) and the second point (P2) of the first coil pattern 210 to remove the insulating film (IF, see FIG. 2) is performed.

[0074] Referring to FIG. 22b, the support member 300 is disposed on the first magnetic body 120. In this case, the second coil pattern 220 contacts the surface of the first magnetic body 120. Next, the magnetic material 130 is filled so as to cover the support member 300. The magnetic material 130 fills the through hole 310 of the support member 300 and covers all of the first coil pattern 210 and the second coil pattern 220. On one hand, when filling the magnetic material 130, a part of the connection conductor 600 is exposed. The first magnetic body 120 can include the same material as the magnetic material 130 or can include different materials.

[0075] Referring to FIG. 22c, the magnetic material 130 is crimped and cured to form the second magnetic body 140. In this process, the exposed part of the connection conductor 600 is crimped to form the same plane as the surface of the second magnetic body 140. Referring to FIG. 22d, a first insulating film 910 is formed on the outer surface of the first magnetic body 120, and a second insulating film 920 is formed on the outer surface of the second magnetic body 140. The second insulating film 920 is formed so as to be separated from the exposed part of the connection conductor 600. Referring to FIG. 22e, the support member 300 is cut so that each connection conductor 600 is divided into the first connection electrode 400 and the second connection electrode 500 to form the individual laminate 100a.

[0076] Referring to FIG. 22f, a third insulating film 930 is formed on the end surface in the direction intersecting the stacking direction of the individual laminate 100a. Referring to FIG. 22g, a first external electrode 700 connected to the first connection electrode 400 of the individual laminate 100a is formed, and a second external electrode 800 connected to the second connection electrode 500 is formed. The finally manufactured coil electronic component corresponds to the coil electronic component shown in FIG. 15. Except for the above, repeated descriptions regarding the same parts as the features of the coil electronic component according to the foregoing embodiment are omitted.

[0077] FIG. 23 is a flowchart for explaining a manufacturing method of a coil electronic component according to another embodiment of the present invention, FIGS. 24a to 24d are diagrams sequentially showing a manufacturing method of a coil electronic component using a ball bonding wire, and FIGS. 25a to 25c are diagrams sequentially showing a manufacturing method of a coil electronic component using a wedge wire bonding.

[0078] Referring to FIG. 23, the method for manufacturing a coil electronic component according to this embodiment includes a step (23-ST1) of providing a support member having a plurality of coils and a plurality of through holes, a step (23-ST2) of connecting two adjacent first coil patterns to each other with a connection conductor, a step (23-ST3) of disposing the support member on a first magnetic body, a step (23-ST4) of filling a magnetic material so as to cover the support member, a step (23-ST5) of crimping and curing the magnetic material to form a second magnetic body, a step (23-ST6) of forming a first insulating film on the outer surface of the first magnetic body, a step (23-ST7) of forming a second insulating film on the outer surface of the second magnetic body, a step (23-ST8) of cutting the support member so that each connection conductor is divided into two first connection electrodes to form an individual laminate, a step (23-ST9) of forming a third insulating film on the end surface in a direction intersecting the stacking direction of the individual laminate, and a step (23-ST10) of forming a first external electrode connected to the first connection electrode of the individual laminate and a second external electrode connected to the second connection electrode.

[0079] Referring to FIGS. 24a and 24b, two first coil patterns (210L, 210R) adjacent to each other in the width direction (W-axis direction) are connected via a connection conductor 600. The connection conductor 600 is a ball-bonding wire. For example, one end of the bonding wire is melted to form a ball, this ball is crimped to a first point (P1) that becomes the first lead-out portion 213L of the first coil pattern 210L, and the other end of the bonding wire is also crimped to a second point (P2) that becomes the first lead-out portion 213R of the other first coil pattern 210R to perform ball bonding. Before performing ball bonding, a step of irradiating a laser to a first point (P1) of the first coil pattern 210L and a second point (P2) of the second coil pattern 210R to remove an insulating film (IF, see FIG. 2) is performed. The ball bonding is also performed in the same manner at the points that become the connection parts connected to the respective second lead-out parts of the first coil pattern 210L and the first coil pattern 210R.

[0080] Referring to FIG. 24c, the support member 300 is disposed on the first magnetic body 120, and the magnetic material 130 is filled so as to cover the support member 300. When the magnetic material 130 is filled, a part of the connection conductor 600 is exposed. Thereafter, the magnetic material 130 is crimped and cured to form the second magnetic body 140. Referring to FIG. 24d, the support member 300 is cut so that each connection conductor is divided into two first connection electrodes (400L, 400R) to form individual laminates (100L, 100R).

[0081] On the other hand, referring to FIG. 25a, two first coil patterns (210L, 210R) adjacent to each other in the width direction (W-axis direction) are connected via a connection conductor 600. The connection conductor 600 is a wedge bonding wire. For example, one end of the bonding wire is crimped to a first point (P1) that becomes the first lead-out part 213L of the first coil pattern 210L to perform stitch bonding, and the other end of the bonding wire is crimped to a second point (P2) that becomes the first lead-out part 213R of the other first coil pattern 210R to perform stitch bonding, and then wedge bonding is performed. Before performing wedge bonding, a step of irradiating a laser to a first point (P1) of the first coil pattern 210L and a second point (P2) of the second coil pattern 210R to remove an insulating film (IF, see FIG. 2) is performed. At the point that becomes the connection part connected to the second lead-out part of the first coil pattern 210L and the first coil pattern 210R, wedge bonding is similarly performed.

[0082] Referring to FIG. 25b, the support member 300 is disposed on the first magnetic body 120, and the magnetic material 130 is filled so as to cover the support member 300. When the magnetic material 130 is filled, a part of the connection conductor 600 is exposed. Thereafter, the magnetic material 130 is crimped and cured to form the second magnetic body 140. Referring to FIG. 25c, the support member 300 is cut so that each connection conductor is divided into two first connection electrodes (400L, 400R) to form individual laminates (100L, 100R). The steps except the above are the same as those of the embodiment of FIG. 21, and the repeated description thereof is omitted.

[0083] FIG. 26 is a flowchart for explaining a method of manufacturing a coil electronic component according to another embodiment of the present invention, and FIGS. 27a to 27i are diagrams sequentially showing a method of manufacturing a coil electronic component according to another embodiment of the present invention.

[0084] Referring to FIG. 26, the method of manufacturing a coil electronic component of the present embodiment includes a step (26-ST1) of providing a support member having a plurality of coils and a plurality of through holes, a step (26-ST2) of connecting two adjacent first coil patterns to each other with a connection conductor, a step (26-ST3) of disposing the support member on the first magnetic body, a step (26-ST4) of filling a magnetic material so as to cover the support member, a step (26-ST5) of crimping and curing the magnetic material to form a second magnetic body, a step (26-ST6) of forming a first insulating film on the outer surface of the second magnetic body, a step (26-ST7) of forming an adhesive layer so as to cover the outer surface of the second magnetic body and the first insulating film, Step (26-ST8) of forming individual laminates by cutting the support member so that each connection conductor is divided into a first connection electrode and a second connection electrode Step (26-ST9) of forming a second insulating film so as to cover the outer surface of the individual laminate and the adhesive layer Step (26-ST10) of removing the adhesive layer Step (26-ST11) of forming a first external electrode connected to the first connection electrode of the individual laminate and a second external electrode connected to the second connection electrode

[0085] FIGS. 27a, 27b, and 27c show steps (26-ST1), (26-ST2), (26-ST3), (26-ST4), and (26-ST5), which are the same as the steps of the embodiment of FIG. 21, and thus repeated description thereof will be omitted.

[0086] Referring to FIG. 27d, a first insulating film 910 is formed on the outer surface of the second magnetic body 140. The first insulating film 910 is formed so as to be separated from the exposed portion of the connection conductor 600. Referring to FIG. 27e, an adhesive layer 1100 is formed so as to cover the outer surface of the second magnetic body 140 and the first insulating film 910. For example, the adhesive layer is formed using a drum coating or a fluidized bed spraying method. The adhesive layer contains a thermoplastic resin containing spherical foaming agents therein. Referring to FIG. 27f, the support member 300 is cut so that each connection conductor is divided into a first connection electrode 400 and a second connection electrode 500 to form an individual laminate 100a. Here, the adhesive layer 1100 covers the outer surface of the second magnetic body 140 and the first insulating film 910. Referring to FIG. 27g, a second insulating film 920 is formed so as to cover the outer surface of the individual laminate 100a and the adhesive layer 1100.

[0087] Referring to FIG. 27h, the adhesive layer is removed. For example, polymer balls are included in the adhesive layer, and an organic solvent is contained inside the balls. When the adhesive layer is heated, the organic solvent boils at a specific temperature or higher, and the internal pressure of the balls increases. Due to the increase in the internal pressure, the film of the polymer balls expands. When the expanded balls break through the insulating film at the same time, the adhesive layer is removed together with the insulating film at this part. By removing the adhesive layer, the first connection electrode 400 and the second connection electrode 500 are exposed, and the first insulating film 910 is also exposed. Referring to FIG. 27i, a first external electrode 700 connected to the first connection electrode 400 of the individual laminate 100a is formed, and a second external electrode 800 connected to the second connection electrode 500 is formed. Except for the above, repeated descriptions regarding the same parts as the features of the coil electronic component according to the above-described embodiment are omitted.

[0088] FIG. 28 is a flowchart for explaining a method of manufacturing a coil electronic component according to another embodiment of the present invention, and FIGS. 29a and 29b are diagrams for explaining the method of manufacturing a coil electronic component according to the present embodiment.

[0089] Referring to FIG. 28, the method of manufacturing a coil electronic component according to the present embodiment includes a step of providing a support member having a plurality of coils and a plurality of through holes (28-ST1), a step of connecting two connection electrodes to each first coil pattern (28-ST2), a step of disposing the support member on the first magnetic body (28-ST3), a step of filling a magnetic material so as to cover the support member (28-ST4), a step of crimping and curing the magnetic material to form a second magnetic body (28-ST5), a step of forming a first insulating film on the outer surface of the first magnetic body (28-ST6), a step of forming a second insulating film on the outer surface of the second magnetic body (28-ST7), Step (28-ST8) of cutting the support member so that the two connection electrodes are divided into a first connection electrode and a second connection electrode to form individual laminate bodies; Step (28-ST9) of forming a third insulating film on an end surface in a direction intersecting the lamination direction of the individual laminate body; Including step (28-ST10) of forming a first external electrode connected to the first connection electrode of the individual laminate body and a second external electrode connected to the second connection electrode. In step (28-ST4), a magnetic material is filled so that the free end of the connection electrode is exposed.

[0090] Referring to FIG. 29a, connection electrodes (400, 500) are connected to the first coil pattern 210. The connection electrodes (400, 500) may be vertical bonding wires. In this case, after forming a plurality of pads (430, 530) on the surface of the first coil pattern 210, connection electrodes (400, 500) are connected to the respective pads (430, 530). That is, the first connection electrode 400 is connected to the first lead-out portion 213 of the first coil pattern 210 by ball bonding.

[0091] The connection method by ball bonding is as generally known. For example, ball bonding is performed by melting the tip of the bonding wire to form a ball (free air ball) and crimping this ball to the first lead-out portion 213. However, the tip on the opposite side of the bonding wire remains free without being connected to the first coil pattern. Before performing ball bonding, a step of irradiating a laser to the first lead-out portion 213 of the first coil pattern 210 to remove the insulating film (IF, see FIG. 2) is performed. The second connection electrode 500 is also ball bonded in the same manner.

[0092] Referring to FIG. 29b, after the support member 300 is disposed on the first magnetic body 120, the magnetic material 130 is filled so as to cover the support member 300. Here, the magnetic material 130 is filled so that the free ends of the connection electrodes (400, 500) are exposed. For example, the exposed surface of the free end of the connection electrodes (400, 500) can form the same plane as the surface of the second magnetic body 140. The remaining steps except the above can be performed in the same manner as in the embodiment of FIG. 21 or in the same manner as in the embodiment of FIG. 26. Therefore, repeated descriptions regarding the same parts as the features of the method for manufacturing a coil electronic component according to the above-described embodiment are omitted.

[0093] FIG. 30 is a diagram schematically showing a state in which two coil electronic components according to an embodiment of the present invention are connected in parallel. Referring to FIG. 30, the first coil electronic component 4000a and the second coil electronic component 4000b are connected in parallel through the first connection conductor 4400 and the second connection conductor 4500. Since the first coil electronic component 4000a and the second coil electronic component 4000b are the same as the coil electronic component shown in FIG. 9, repeated descriptions thereof are omitted. However, in order to clearly show the relationship between the components, the second coil patterns of the first coil electronic component 4000a and the second coil electronic component 4000b are not shown in FIG. 30.

[0094] The first lead-out portion 4213a of the first coil pattern 4210a of the first coil electronic component 4000a and the first lead-out portion 4213b of the first coil pattern 4210b of the second coil electronic component 4000b are connected via the first connection conductor 4400. Also, the second lead-out portion 4223a of the second coil pattern (not shown) of the first coil electronic component 4000a and the second lead-out portion 4223b of the second coil pattern (not shown) of the second coil electronic component 4000b are connected via the second connection conductor 4500. The first connection conductor 4400 and the second connection conductor 4500 may be ball bonding wires or wedge bonding wires.

[0095] FIG. 31 is a diagram schematically showing a state in which two coil electronic components according to another embodiment of the present invention are connected in parallel. Referring to FIG. 31, the first coil electronic component 5000a and the second coil electronic component 5000b are connected in parallel via the first connection conductor 5400 and the second connection conductor 5500. Since the first coil electronic component 5000a and the second coil electronic component 5000b are the same as the coil electronic component shown in FIG. 10, repeated description thereof is omitted. However, in order to clearly show the relationship between the components, the second coil patterns of the first coil electronic component 5000a and the second coil electronic component 5000b are not shown in FIG. 31.

[0096] The first extension portion 5215a of the first coil pattern 5210a of the first coil electronic component 5000a and the first extension portion 5215b of the first coil pattern 5210b of the second coil electronic component 5000b are connected via a plurality of first connection conductors (5400, 5400). Also, the second extension portion 5225a of the second coil pattern (not shown) of the first coil electronic component 5000a and the second extension portion 5225b of the second coil pattern (not shown) of the second coil electronic component 5000b are connected via two second connection conductors (5500, 5500). The first connection conductor 5400 and the second connection conductor 5500 may be ball bonding wires or wedge bonding wires.

[0097] FIG. 32 is a diagram schematically showing a state in which two coil electronic components according to another embodiment of the present invention are connected in parallel. Referring to FIG. 32, the first coil electronic component 6000a and the second coil electronic component 6000b are connected in parallel via the first connection conductor 6400 and the second connection conductor 6500. Since the first coil electronic component 6000a and the second coil electronic component 6000b are the same as the coil electronic components shown in FIG. 12, repeated description thereof will be omitted. However, in order to clearly show the relationship between the components, the second coil patterns of the first coil electronic component 6000a and the second coil electronic component 6000b are not shown in FIG. 32.

[0098] The first extension 6215a of the first coil pattern 6210a of the first coil electronic component 6000a and the first extension 6215b of the first coil pattern 6210b of the second coil electronic component 6000b are connected via a plurality of first connection conductors (6400, 6400). Also, the second extension 6225a of the second coil pattern (not shown) of the first coil electronic component 6000a and the second extension 6225b of the second coil pattern (not shown) of the second coil electronic component 6000b are connected via two second connection conductors 6500, 6500. The first connection conductor 6400 and the second connection conductor 6500 may be ball bonding wires or wedge bonding wires.

[0099] Note that the present invention is not limited to the above-described embodiments. Various modifications can be made without departing from the technical scope of the present invention.

Description of Reference Numerals

[0100] 100 Magnetic body 110 Core 200 Coil 210 First coil pattern 220 Second coil pattern 223 Second lead-out portion 230 First via 240 Second via 213 First lead-out portion 223 Second lead-out part 250 Connection part 300 Support member 310 Through hole 320 First support surface 330 Second support surface 400, 1400, 2400 First connection electrode 410, 1410, 2410 First body 411 First end 413 Second end 420 First extension part 500, 1500, 2500 Second connection electrode 510, 1510, 2510 Second body 511 First end 513 Second end 520 Second extension part 700 First external electrode 701 First metal layer 702 Second metal layer 703 Third metal layer 800 Second external electrode 801 First metal layer 802 Second metal layer 803 Third metal layer 900 Insulating layer 1000, 2000, 3000 Coil electronic component 1100 Adhesive layer 1411, 2411 First bending part 1420, 2420 First extension part 1511, 2511 Second bending part 1520, 2520 Second extension part IF insulating film

Claims

1. a magnetic body including a magnetic substance, the magnetic body having a first surface and a second surface facing a first direction, a third surface and a fourth surface facing a second direction and connecting the first surface and the second surface, and a fifth surface and a sixth surface facing the third direction and connecting the first surface and the second surface; a support member disposed inside the magnetic body and including a first support surface and a second support surface facing each other; a coil including a first coil pattern disposed on the first support surface of the support member, a second coil pattern disposed on the second support surface of the support member, and a via connecting the first coil pattern and the second coil pattern; an external electrode disposed on the sixth surface of the magnetic body; At least one connection electrode is provided in the magnetic body to connect the coil and the external electrode, A coil electronic component, characterized in that a diameter of a portion where the connection electrode is connected to the coil is larger than a diameter of a remaining portion of the connection electrode.

2. 2. The coil electronic component according to claim 1, wherein an extension part having a diameter larger than the remaining part of the connection electrode is disposed at the end of the connection electrode which is connected to the coil.

3. 2. The coil electronic component according to claim 1, wherein the connection electrode includes a first portion extending in the third direction and connected to the coil, and a second portion extending in the first direction and connected to the external electrode.

4. 2. The coil electronic component according to claim 1, wherein the connection electrode includes a first portion extending in the third direction and connected to the coil, and a second portion extending in the second direction and connected to the external electrode.

5. the connection electrode is made of a material different from that of the coil; 5. The coil electronic component according to claim 4, wherein an intermetallic compound is disposed at an interface between the connection electrode and the coil.

6. The coil comprises copper (Cu), 6. The coil electronic component according to claim 5, wherein the connection electrodes contain gold (Au), aluminum (Al), silver (Ag), or an alloy thereof.

7. 2 . The coil electronic component according to claim 1 , wherein a portion of the connection electrode connected to the external electrode and a portion connected to the coil are on a center line in the first direction when viewed from the third direction.

8. 2. The coil electronic component according to claim 1, wherein a portion of the connection electrode connected to the external electrode and a portion connected to the coil are biased in the second direction based on a center line in the first direction when viewed from the third direction.

9. The external electrodes include a first external electrode and a second external electrode, the connection electrodes include a first connection electrode that connects the first coil pattern and the first external electrode, and a second connection electrode that connects the second coil pattern and the second external electrode, The coil electronic component according to claim 8 , wherein the first connection electrode and the second connection electrode are arranged biased toward the third surface or the fourth surface of the magnetic body.

10. The external electrodes include a first external electrode and a second external electrode, the connection electrodes include a first connection electrode that connects the first coil pattern and the first external electrode, and a second connection electrode that connects the second coil pattern and the second external electrode, The coil electronic component according to claim 8, characterized in that one of the first connection electrode and the second connection electrode is biased toward the third surface side of the magnetic body, and the other connection electrode is biased toward the fourth surface side.

11. providing a support member having a plurality of coils and a plurality of through holes; Here, each coil includes a first coil pattern arranged on a first surface of the support member with the through hole as a center, and a second coil pattern arranged on a second surface of the support member and connected to the first coil pattern through a via, connecting two adjacent first coil patterns to each other with a plurality of connection conductors; placing the support member on a first magnetic body; filling the support member with a magnetic material; compressing and curing the magnetic material to form a second magnetic body; cutting the support member to form individual laminates such that each of the connection conductors is divided into a first connection electrode and a second connection electrode; and forming a first external electrode connected to the first connection electrode of the individual laminate, and a second external electrode connected to the second connection electrode of the individual laminate.

12. The method for manufacturing a coil electronic component according to claim 11, wherein a part of the connecting conductor is exposed in the step of filling the magnetic material.

13. Prior to the step of forming the individual laminates, forming a first insulating film on an outer surface of the first magnetic body; The method for manufacturing a coil electronic component according to claim 11, further comprising the step of forming a second insulating film on an outer surface of the second magnetic body.

14. In the step of forming a second insulating film on an outer surface of the second magnetic body, The method of claim 13, wherein the second insulating film is formed to be spaced apart from the exposed portion of the connection conductor.

15. Before the step of forming the first external electrode and the second external electrode, The method for manufacturing a coil electronic component according to claim 14, further comprising the step of forming a third insulating film on an end surface of the individual laminate in a direction intersecting the lamination direction.

16. Prior to the step of forming the individual laminates, forming a second insulating film on an outer surface of the second magnetic body; The method for manufacturing a coil electronic component according to claim 12, further comprising the step of forming an adhesive layer so as to cover an outer surface of the second magnetic body and the second insulating film.

17. Before the step of forming the first external electrode and the second external electrode, forming a fourth insulating film so as to cover an outer surface of the individual laminate and the adhesive layer; The method for manufacturing a coil electronic component according to claim 16, further comprising the step of removing the adhesive layer.

18. providing a support member having a plurality of coils and a plurality of through holes; Here, each coil includes a first coil pattern disposed on a first surface of the support member centered on the through hole, and a second coil pattern disposed on a second surface of the support member and connected to the first coil pattern through a via; connecting two connection electrodes to each of the first coil patterns; placing the support member on a first magnetic body; filling the support member with a magnetic material; compressing and curing the magnetic material to form a second magnetic body; cutting the support member to form individual laminates; and forming external electrodes connected to the connection electrodes of the individual laminates.

Images