Easily dismantlable thermosetting resin composition and dismantling method

Abstract

To provide a thermosetting resin composition which allows improved recyclability of resource through easy dismantling of cured products.SOLUTION: The present invention provides an easily dismantlable thermosetting resin composition that comprises a thermosetting component and an inorganic filler, wherein the content of the inorganic filler is 40 mass% or more relative to the total amount of the easily dismantlable thermosetting resin composition, and wherein a cured product derived from thermal curing of the thermosetting resin composition has a structure represented by formula (1).SELECTED DRAWING: None

Description

[Technical field]

[0001] The present invention relates to an easily dismantled thermosetting resin composition and a dismantling method, more particularly to an easily dismantled thermosetting resin composition, a structure comprising a cured product of the easily dismantled thermosetting resin composition, a semiconductor device comprising a cured product of the easily dismantled thermosetting resin composition, a method for dismantling the cured product of the easily dismantled thermosetting resin composition, and a method for recycling materials constituting the structure. [Background technology]

[0002] In recent years, there has been a trend in automobile and other structures to use lightweight metals such as aluminum and resins instead of iron in order to reduce weight, and these metals have been increasingly combined with hardened thermosetting resins. On the other hand, in order to promote the effective use of resources such as metals, active research and development has been conducted on the separation and recovery of metals from waste composite materials used in automobiles and other components, and their reuse. Therefore, it is important to remove hardened thermosetting resins from composite materials while minimizing damage to the metals, and recover the metals.

[0003] For example, Patent Document 1 discloses a treatment liquid capable of efficiently decomposing and dissolving a cured product of a thermosetting resin composition at a low temperature in order to recover carbon fibers from carbon fiber reinforced plastics that use carbon fibers as a reinforcing material, or to recover semiconductor elements and the like from a semiconductor package obtained by sealing a semiconductor element with a cured epoxy resin (encapsulating resin). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2020-50689 A Summary of the Invention [Problem to be solved by the invention]

[0005] However, the method for decomposing a cured product of a thermosetting resin composition as disclosed in Patent Document 1 focuses on a treatment liquid for decomposition, and does not disclose a technical idea regarding the decomposability and dismantling property of the thermosetting resin composition itself. The present inventors have newly focused on the dismantling property of the thermosetting resin composition itself and, as a result of intensive research, have found that it is effective for the cured product of the thermosetting resin composition to have a predetermined structure. That is, it was considered that the predetermined structural portion becomes easily detached when the cured product of the thermosetting resin composition is subjected to a solution treatment, thereby disrupting the network in the cured product and making the cured product easily dismantled. [Means for solving the problem]

[0006] The present invention provides the following easily dismantlable thermosetting resin composition, a structure comprising a cured product of the easily dismantlable thermosetting resin composition, a semiconductor device comprising a cured product of the easily dismantlable thermosetting resin composition, a method for dismantling the cured product of the easily dismantlable thermosetting resin composition, and a method for recycling materials constituting the structure.

[0007] [1] An easily dismantlable thermosetting resin composition comprising a thermosetting component and an inorganic filler, The content of the inorganic filler is 40% by mass or more based on the total amount of the easily dismantlable thermosetting resin composition, The easily dismantlable thermosetting resin composition has a structure represented by the following formula (1), wherein the cured product obtained by thermally curing the easily dismantlable thermosetting resin composition has a structure represented by the following formula (1). [ka] (In formula (1), R 1 , R 2 each independently represents a hydrogen atom, a hydrocarbon group or aromatic group having 1 to 30 carbon atoms, a hydroxyl group, or an alkoxyl group having 1 to 30 carbon atoms. [2] The easily dismantlable thermosetting resin composition according to [1], The easily dismantlable thermosetting resin composition, wherein the thermosetting component has a -Si-O- structure. [3] The easily dismantlable thermosetting resin composition according to [1] or [2], The easily dismantlable thermosetting resin composition, wherein the thermosetting component comprises a thermosetting resin and a curing agent, and both the thermosetting component and the curing agent have a -Si-O- structure. [4] The easily dismantlable thermosetting resin composition according to [1] or [2], The easily dismantlable thermosetting resin composition, wherein the thermosetting component comprises a thermosetting resin and a curing agent, and the curing agent has a -Si-O- structure. [5] The easily dismantlable thermosetting resin composition according to [3] or [4], The easily dismantlable thermosetting resin composition, wherein the curing agent comprises a phenol-based curing agent. [6] The easily dismantlable thermosetting resin composition according to [1] or [2], The easily dismantlable thermosetting resin composition, wherein the thermosetting component comprises a thermosetting resin and a curing agent, and the thermosetting resin has a -Si-O- structure. [7] The easily dismantlable thermosetting resin composition according to any one of [3] to [6], The easily dismantlable thermosetting resin composition includes one or more thermosetting resins selected from the group consisting of epoxy resins, phenoxy resins, polyimide resins, benzoxazine resins, unsaturated polyester resins, phenolic resins, melamine resins, silicone resins, cyanate resins, bismaleimide resins, and acrylic resins. [8] The easily dismantlable thermosetting resin composition according to any one of [3] to [7], The easily dismantlable thermosetting resin composition, wherein the thermosetting resin comprises an epoxy resin. [9] The easily dismantlable thermosetting resin composition according to any one of [3] to [8], The easily dismantlable thermosetting resin composition, wherein the thermosetting resin comprises an organopolysiloxane having two or more alkenyl groups bonded to silicon atoms in each molecule.

[10] The easily dismantlable thermosetting resin composition according to [9], The easily dismantlable thermosetting resin composition, wherein the organopolysiloxane is a mixture of different types of organopolysiloxane.

[11] The easily dismantlable thermosetting resin composition according to [9] or

[10] , The easily dismantlable thermosetting resin composition, wherein the organopolysiloxane is in a granular form.

[12] The easily dismantlable thermosetting resin composition according to any one of [1] to

[11] , An easily dismantlable thermosetting resin composition in the form of a powder, granule, tablet or sheet.

[13] The easily dismantlable thermosetting resin composition according to any one of [1] to

[12] , The easily dismantlable thermosetting resin composition comprises: A stator having a stator core having a plurality of teeth and a plurality of slots formed alternately in a circumferential direction, a coil wound around and housed in the slot, the coil having a pair of coil ends protruding from the stator core on both sides in an axial direction, and a sealing member provided within the slot to cover the coil, An easily dismantlable thermosetting resin composition used for forming the sealing member.

[14] The easily dismantlable thermosetting resin composition according to any one of [1] to

[12] , The easily dismantlable thermosetting resin composition comprises: A rotor comprising: a rotor core fixed to a rotating shaft and having a plurality of holes arranged along a circumferential edge of the rotating shaft; magnets inserted into the holes; and a fixing member provided at a space between the holes and the magnets, An easily dismantlable thermosetting resin composition used for forming the fixing member.

[15] The easily dismantlable thermosetting resin composition according to any one of [1] to

[12] , The easily dismantlable thermosetting resin composition comprises: An in-vehicle electronic control unit including a wiring board, a plurality of electronic components mounted on the wiring board, and a sealing member that seals the electronic components, An easily dismantlable thermosetting resin composition used for forming the sealing member.

[16] A structure comprising a cured product of the easily dismantlable thermosetting resin composition described in any one of [1] to

[12] .

[17] A semiconductor element; an encapsulant for encapsulating the semiconductor element; Equipped with A semiconductor device, wherein the encapsulant is made of a cured product of the easily dismantlable thermosetting resin composition according to any one of [1] to

[12] .

[18] A stator core having a plurality of teeth and a plurality of slots alternately arranged in a circumferential direction; a coil wound in the slot and housed in the slot, the coil having a pair of coil ends protruding from the stator core in both axial directions; a sealing member provided in the slot to cover the coil, A stator, wherein the sealing member is made of a cured product of the dismantlable thermosetting resin composition described in any one of [1] to

[12] .

[19] An in-vehicle electronic control unit comprising: a wiring board; a plurality of electronic components mounted on the wiring board; and a sealing member that seals the electronic components, The sealing member is made of a cured product of the easily dismantlable thermosetting resin composition according to any one of [1] to

[12] .

[20] A rotor comprising: a rotor core fixed to a rotating shaft and provided with a plurality of holes arranged along a circumferential edge of the rotating shaft; magnets inserted into the holes; and a fixing member provided at a space between the holes and the magnets, A rotor, wherein the fixing member is made of a cured product of the dismantlable thermosetting resin composition described in any one of [1] to

[12] .

[21] A method for dismantling a cured product of the easily dismantlable thermosetting resin composition according to any one of [1] to

[15] , comprising: A dismantling method comprising the step of immersing the cured product of the easily dismantlable thermosetting resin composition in a solvent to dismantle the cured product.

[22] The disassembly method according to

[21] , The disassembly method, wherein the solvent is a solvent containing fluorine ions.

[23] The disassembly method according to

[21] or

[22] , The dismantling method, wherein the immersion is performed at -20 to 200°C.

[24] The disassembly method according to

[21] or

[22] , The disassembly method, wherein the immersion is performed at 5 to 30°C.

[25] A disassembly method according to any one of

[21] to

[24] , comprising: The dismantling method, wherein the hardened material is powdered in the dismantling step.

[26] A method for recycling materials constituting the structure according to

[16] , comprising the steps of: A step of immersing the structure in a solvent and dismantling the cured product of the easily dismantlable thermosetting resin composition; and recovering said material from said structure.

[27] A method for recycling a material constituting a stator according to

[18] , comprising the steps of: Immersing the stator in a solvent and dismantling the cured product of the easily dismantlable thermosetting resin composition; and recovering said material from said stator.

[28] A method for recycling materials constituting an in-vehicle electronic control unit according to

[19] , comprising the steps of: immersing the in-vehicle electronic control unit in a solvent and dismantling the cured product of the easily dismantlable thermosetting resin composition; and recovering said material from said vehicle electronic control unit.

[29] A method for recycling a material constituting a rotor according to

[20] , comprising the steps of: Immersing the rotor in a solvent and dismantling the cured product of the easily dismantlable thermosetting resin composition; and recovering said material from said rotor. Effect of the Invention

[0008] According to the present invention, the cured product of the thermosetting resin composition can be easily dismantled, thereby improving the recyclability of resources. [Brief description of the drawings]

[0009] [Figure 1] 1 is a cross-sectional view of a motor according to an embodiment of the present invention taken in a direction perpendicular to the rotation axis direction. [Diagram 2] 1 is a vertical cross-sectional view taken along a rotation axis of a motor according to an embodiment of the present invention; [Diagram 3] FIG. 2 is an enlarged view of the periphery of a slot according to the embodiment. [Figure 4] FIG. 2 is a plan view showing the rotor according to the embodiment. [Diagram 5] FIG. 5 is a cross-sectional view showing the rotor shown in FIG. [Figure 6] FIG. 5 is an enlarged cross-sectional view showing the rotor shown in FIG. [Figure 7] 1 is a schematic cross-sectional view showing an example of an in-vehicle electronic control unit according to an embodiment of the present invention; DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] In this specification, the expression "a to b" in the description of a numerical range means a or more and b or less, unless otherwise specified. For example, "1 to 5 mass%" means "1 mass% or more and 5 mass% or less." In addition, the lower limit and upper limit of a numerical range can be arbitrarily combined with the lower limit and upper limit of another numerical range.

[0011] Unless otherwise specified, each of the components and materials exemplified in this specification may be used alone or in combination of two or more kinds.

[0012] In the description of groups (atomic groups) in this specification, when a description is made without specifying whether the group is substituted or unsubstituted, the description includes both groups having no substituents and groups having a substituent. For example, an "alkyl group" includes not only an alkyl group having no substituents (unsubstituted alkyl group) but also an alkyl group having a substituent (substituted alkyl group). In addition, in the description of groups (atomic groups) in this specification, when there is no indication as to whether they are straight-chain, branched, or cyclic, they may be any of straight-chain, branched, or cyclic.

[0013] In this specification, the term "organic group" means an atomic group obtained by removing one or more hydrogen atoms from an organic compound, unless otherwise specified. For example, a "monovalent organic group" refers to an atomic group obtained by removing one hydrogen atom from any organic compound.

[0014] Hereinafter, an embodiment of the present invention will be described in detail.

[0015] 1.Easily dismantled thermosetting resin composition The easily dismantlable thermosetting resin composition of this embodiment (hereinafter also simply referred to as "resin composition") contains a thermosetting component and an inorganic filler, the content of the inorganic filler being 40 mass% or more based on the total amount of the easily dismantlable thermosetting resin composition, and the cured product obtained after thermal curing of the resin composition has a structure represented by the following formula (1). In addition, the conditions for the thermal curing are preferably 175°C for 2 minutes.

[0016] [ka] (In formula (1), R 1 , R 2 each independently represents a hydrogen atom, a hydrocarbon group or aromatic group having 1 to 30 carbon atoms, a hydroxyl group, or an alkoxyl group having 1 to 30 carbon atoms.

[0017] As a result, when the cured product of the resin composition of the present embodiment is subjected to a solution treatment, the structure of formula (1) is released, and the crosslinked structure in the cured product collapses, resulting in easy dismantling. The structure of formula (1) may result from a thermosetting reaction of a thermosetting component.

[0018] In the present embodiment, the term "easily dismantlable" refers to the property that the cured product undergoes gel decomposition and becomes solubilized when the cured product is treated with a solution. The presence or absence of the structure represented by formula (1) in the cured product can be confirmed by ordinary analytical means such as gas chromatography, high performance liquid chromatography, thin layer chromatography, NMR, and IR. The subject of analysis may be the state of the cured product, or a decomposition liquid obtained after decomposing the cured product. Gas chromatography mass spectrometry (GC-MS) is preferred because it can be confirmed from the state of the cured product. The subject of analysis may be a decomposition treatment liquid of the cured product, so that it can be easily distinguished from structures due to coupling agents, etc., which will be described later.

[0019] The cured product of this embodiment preferably has the structure of formula (1) as a repeating unit. The number of repeats is not particularly limited, but may be 5 to 1,500 on average.

[0020] In formula (1), R 1 , R 2 each independently represents a hydrogen atom, a hydrocarbon group or aromatic group having 1 to 30 carbon atoms, a hydroxyl group, or an alkoxyl group having 1 to 30 carbon atoms. The hydrocarbon group having 1 to 30 carbon atoms may be linear, branched, or cyclic, and may or may not have a substituent. The hydrocarbon group having 1 to 30 carbon atoms is preferably a linear alkyl, alkenyl or alkynyl group having 1 to 20 carbon atoms, and more preferably a linear alkyl, alkenyl or alkynyl group having 1 to 10 carbon atoms. The branched hydrocarbon group having 3 to 20 carbon atoms is preferably a branched alkyl, alkenyl, or alkynyl group having 3 to 20 carbon atoms, more preferably a branched alkyl, alkenyl, or alkynyl group having 3 to 10 carbon atoms, and even more preferably a branched alkyl, alkenyl, or alkynyl group having 3 to 6 carbon atoms. The cyclic hydrocarbon group having 3 to 20 carbon atoms is preferably a cycloalkyl, cycloalkenyl, or cycloalkynyl group having 3 to 20 carbon atoms, and more preferably a cycloalkenyl or cycloalkynyl group having 5 to 10 carbon atoms. Specific examples include a cyclopropyl group, a cyclobutyl group, a cyclopentyl group, and a cyclohexyl group. The aromatic group may have a substituent, and examples of the substituent include a hydrocarbon group, a hydroxyl group, a halogen atom, and an amino group. The alkoxyl group having 1 to 30 carbon atoms is preferably an alkoxyl group having 1 to 10 carbon atoms, and more preferably an alkoxyl group having 1 to 6 carbon atoms. Specific examples include a methoxy group, an ethoxy group, and an isopropyloxy group.

[0021] The resin composition of the present embodiment includes a thermosetting component. The thermosetting component may be any component that includes a group that is polymerized / crosslinked by the action of an active chemical species such as a radical, and specifically may be either a thermosetting resin or a curing agent. The resin composition of the present embodiment may include only one type of thermosetting component, or may include two or more types of thermosetting components.

[0022] The resin composition of the present embodiment preferably contains a thermosetting resin and a curing agent. In this case, it is preferable that at least one of the thermosetting resin and the curing agent has a -Si-O- structure. This allows the cured product of the resin composition of the present embodiment to have a structure represented by formula (1), and the cured product is soluble in a solvent, thereby obtaining easy dismantling.

[0023] In the resin composition of the present embodiment, various components can be combined so that the cured product has a structure represented by formula (1). Specific examples include resin compositions having the following forms.

[0024] <1> A resin composition comprising a phenolic resin (P) having an -Si-O- structure. <2> A resin composition comprising a thermosetting resin and a phenolic resin (P) having a -Si-O- structure as a curing agent. <3> A resin composition comprising an epoxy resin (A) having an -Si-O- structure. <4> A resin composition comprising: a silicone resin (organopolysiloxane) (C1) having two or more alkenyl groups bonded to silicon atoms in one molecule as a thermosetting resin; and an organohydrogenpolysiloxane (C2) having two or more hydrogen atoms bonded to silicon atoms in one molecule as a curing agent. <5> A resin composition comprising an acrylic / vinyl resin obtained by reacting an unsaturated bond having an -Si-O- structure in the main chain.

[0025] [Inorganic filler] The resin composition of the present embodiment further contains an inorganic filler, which is used to increase the mechanical strength and impart heat resistance, flame retardancy, etc., depending on the application of the cured product or structure.

[0026] Specific examples of inorganic fillers include silicates such as talc, calcined clay, uncalcined clay, mica, and glass; oxides such as titanium oxide, alumina, boehmite, and silica; carbonates such as calcium carbonate, magnesium carbonate, and hydrotalcite; hydroxides such as aluminum hydroxide, magnesium hydroxide, and calcium hydroxide; sulfates or sulfites such as barium sulfate, calcium sulfate, and calcium sulfite; borates such as zinc borate, barium metaborate, aluminum borate, calcium borate, and sodium borate; nitrides such as aluminum nitride, boron nitride, silicon nitride, and carbon nitride; titanates such as strontium titanate and barium titanate, etc. These may be used alone or in combination of two or more.

[0027] The average particle diameter D50 of the inorganic filler is preferably 0.01 μm or more and 75 μm or less, more preferably 0.05 μm or more and 50 μm or less. By setting the average particle diameter of the inorganic filler within the above range, the filling property is improved. The average particle diameter D50 can be the average particle diameter converted into volume (cumulative 50%) by a commercially available laser type particle size distribution meter.

[0028] The content of the inorganic filler is 40% by mass or more, preferably 50% by mass or more, and more preferably 60% by mass or more, based on the total amount of the resin composition. It may be appropriately set depending on the application, and may be 80% by mass or more, or 90% by mass or more. On the other hand, in order to maintain fluidity, the content of the inorganic filler is preferably 99.8% by mass or less, more preferably 98% by mass or less, and even more preferably 95% by mass or less, based on the total amount of the resin composition. By making the content of the inorganic filler equal to or more than the lower limit, the storage stability and curability of the cured product can be improved. Also, by making the content of the inorganic filler equal to or less than the upper limit, good flowability of the resin composition can be obtained, and moldability can be effectively improved.

[0029] The inorganic filler may be surface-treated. Examples of the surface treatment agent include methylhydrogenpolysiloxane, silicone resin, metal soap, silane coupling agent, perfluoroalkylsilane, and fluorine compounds such as perfluoroalkyl phosphate ester salt. Among them, when the thermosetting resin described later contains an organopolysiloxane having two or more alkenyl groups bonded to silicon atoms in one molecule, for example, a silicone-based surface treatment agent having at least one polysiloxane structure and a hydrolyzable silyl group in the molecule is preferably used.

[0030] Each embodiment will be described in detail below.

[0031] First Embodiment In the first embodiment, a resin composition containing a phenol resin (P) having a -Si-O- structure is described. In this case, the curing agent may not have a -Si-O- structure, and may be a known curing agent. Known curing agents will be described later.

[0032] As the phenolic resin (P) having a -Si-O- structure, a phenolic resin modified with a silyl ether having a phenolic hydroxyl group can be used. Specifically, for example, a silyl ether modified novolak resin represented by the following formula (P1) can be used.

[0033] [ka]

[0034] In formula (P1), x and y are both integers, and x+y is 2-200. In addition, in formula (P1), in order to obtain good dismantling properties and moldability, x:y=1:99 to 99:1 is preferable, x:y=2:98 to 75:25 is more preferable, and x:y=5:95 to 50:50 is even more preferable. In addition, in formula (P1), D has a structure represented by the following formula (P1-1).

[0035] [ka]

[0036] In formula (P1-1), R 9 R represents a divalent hydrocarbon group having 2 to 10 carbon atoms. 10 each independently represents a hydrogen atom, a monovalent hydrocarbon group or aromatic group having 1 to 30 carbon atoms, a hydroxyl group, or an alkoxyl group having 1 to 30 carbon atoms. z is an integer of 0 to 10. Among them, R 9 R is preferably a divalent hydrocarbon group having 2 to 5 carbon atoms, more preferably a divalent hydrocarbon group having 2 to 4 carbon atoms, and even more preferably a propenyl group. 10 are each independently preferably a monovalent hydrocarbon group having 1 to 20 carbon atoms, more preferably a monovalent hydrocarbon group having 1 to 10 carbon atoms, or an alkyl group, further preferably an alkyl group having 1 to 5 carbon atoms, and particularly preferably a methyl group.

[0037] The weight average molecular weight (Mw) of the phenol resin (P1) is not particularly limited, but is preferably 500 to 10,000, more preferably 1,000 to 8,000, and even more preferably 1,500 to 5,000. The number average molecular weight (Mn) of the phenol resin (P1) is not particularly limited, but is preferably 100 to 5,000, more preferably 300 to 3,000, and even more preferably 600 to 1,000. In this embodiment, Mw and Mn can be calculated by gel permeation chromatography (GPC).

[0038] The phenol resin (P) can be synthesized by reacting a silyl ether, a phenol, and an aldehyde in the presence of an acid catalyst.

[0039] As the silyl ethers, those having a phenolic hydroxyl group are preferable, and examples thereof include those shown in the following formula (P1-2).

[0040] [ka]

[0041] In formula (P1-2), R 9 R represents a divalent hydrocarbon group having 2 to 10 carbon atoms. 10 each independently represents a hydrogen atom, a monovalent hydrocarbon group or aromatic group having 1 to 30 carbon atoms, a hydroxyl group, or an alkoxyl group having 1 to 30 carbon atoms. z is an integer of 0 to 10. Among them, R 9 R is preferably a divalent hydrocarbon group having 2 to 5 carbon atoms, more preferably a divalent hydrocarbon group having 2 to 4 carbon atoms, and even more preferably a propenyl group. 10 are each independently preferably a monovalent hydrocarbon group having 1 to 20 carbon atoms, more preferably a monovalent hydrocarbon group having 1 to 10 carbon atoms, and are also preferably an alkyl group, more preferably an alkyl group having 1 to 5 carbon atoms, and even more preferably a methyl group.

[0042] Examples of phenols include, but are not limited to, phenol; cresols such as orthocresol, metacresol, and paracresol; xylenols such as 2,3-xylenol, 2,4-xylenol, 2,5-xylenol, 2,6-xylenol, and 3,5-xylenol; 2,3,5-trimethylphenol, 2-ethylphenol, 4-ethylphenol, 2-isopropylphenol, 4-isopropylphenol, n-butylphenol, isobutylphenol, tert-butylphenol, hexylphenol, octylphenol, nonylphenol, phenylphenol, benzylphenol, cumylphenol, allylphenol, and kaolin. Examples of the phenols include alkylphenols such as rudanol, urushiol, thitsiol, and laccol; naphthols such as 1-naphthol and 2-naphthol; halogenated phenols such as fluorophenol, chlorophenol, bromophenol, and iodophenol; monohydric phenol substitutes such as p-phenylphenol, aminophenol, nitrophenol, dinitrophenol, and trinitrophenol; and polyhydric phenols such as resorcin, alkylresorcin, pyrogallol, catechol, alkylcatechol, hydroquinone, alkylhydroquinone, phloroglucin, bisphenol A, bisphenol F, bisphenol S, dihydroxynaphthalene, and naphthalene. These may be used alone or in combination of two or more. Among these, the phenols may include one or more selected from the group consisting of phenol, cresol, xylenol, and alkylphenol, and phenol is preferably used from the viewpoint of cost. can.

[0043] The aldehydes are not particularly limited, and examples thereof include formaldehydes such as formalin and paraformaldehyde; trioxane, acetaldehyde, propionaldehyde, polyoxymethylene, chloral, hexamethylenetetramine, furfural, glyoxal, n-butylaldehyde, caproaldehyde, allylaldehyde, benzaldehyde, crotonaldehyde, acrolein, tetraoxymethylene, phenylacetaldehyde, o-tolualdehyde, salicylaldehyde, etc. These aldehydes may be used alone or in combination of two or more. Among these, the aldehydes may include formaldehyde or acetaldehyde, and from the viewpoints of productivity and low cost, formalin or paraformaldehyde can be used.

[0044] The catalyst used in synthesizing the phenolic resin (P) may be catalyst-free, or an acidic catalyst may be used from the viewpoint of producing a novolac-type phenolic resin. The acidic catalyst is not particularly limited, but examples thereof include acids such as oxalic acid, hydrochloric acid, sulfuric acid, diethyl sulfate, and paratoluenesulfonic acid, and metal salts such as zinc acetate, which may be used alone or in combination of two or more kinds.

[0045] The reaction solvent used in synthesizing the phenolic resin (P) may be water, or an organic solvent. As the organic solvent, a non-aqueous system may be used using a non-polar solvent. Examples of the organic solvent include alcohols, ketones, and aromatics, and examples of the alcohols include methanol, ethanol, propyl alcohol, ethylene glycol, diethylene glycol, triethylene glycol, and glycerin, examples of the ketones include acetone and methyl ethyl ketone, and examples of the aromatics include toluene and xylene. These may be used alone or in combination of two or more.

[0046] The molar ratio (F / P molar ratio) of phenols (P) to aldehydes (F) may be, for example, 0.2 to 1.0 mol, preferably 0.3 to 0.9 mol, of aldehydes per 1 mol of phenols. By setting the aldehydes within the above range, the amount of unreacted phenols can be reduced, and the yield can be increased.

[0047] The reaction temperature may be, for example, 40° C. to 120° C., and preferably 60° C. to 110° C. The reaction time is not particularly limited and may be appropriately determined depending on the types of starting materials, the molar ratio of the starting materials, the amount and type of catalyst used, and the reaction conditions.

[0048] In this manner, the phenol resin (P) can be obtained.

[0049] <Second embodiment> In the second embodiment, a case where a phenol resin (P) having a -Si-O- structure is used as a curing agent will be described. In this case, the thermosetting resin may or may not have a -Si-O- structure, but in the second embodiment, a case where the -Si-O- structure is not present will be described. The thermosetting resin is not particularly limited, but a known epoxy resin can be used. Known epoxy resins will be described later.

[0050] The phenol resin (P) and the epoxy resin as the curing agent are adjusted so that the equivalent ratio (EP) / (OH) of the number of epoxy groups (EP) in the total thermosetting resin to the number of phenolic hydroxyl groups (OH) in the total phenol resin is preferably 0.8 to 1.6, more preferably 0.9 to 1.3, and even more preferably 1.0 to 1.2. When the equivalent ratio is within the above range, the curing characteristics of the resin composition of the present embodiment can be improved.

[0051] Other components contained in the resin composition of the second embodiment will be described later.

[0052] <Third embodiment> In the third embodiment, a resin composition containing an epoxy resin (A) having a -Si-O- structure is described. In this case, the curing agent may or may not have a -Si-O- structure, but in the third embodiment, a case where the curing agent does not have a Si-O- structure is described. The curing agent is not particularly limited, but a known curing agent may be used. Known curing agents will be described later.

[0053] Specific examples of the epoxy resin (A) having a -Si-O- structure include an epoxy resin (A1) having a -Si-O- structure obtained by epoxidizing the phenolic resin (P1) having a -Si-O- structure described in the first embodiment, a bifunctional or higher functional epoxy compound (A2) having a structure represented by the following formula (A2), and an organosiloxane type epoxy compound (A3) having a structure represented by the following formula (A3).

[0054] [Epoxy resin (A1)] The epoxy resin (A1) having a -Si-O- structure obtained by epoxidizing the phenol resin (P1) having a -Si-O- structure includes those represented by the following formula (A1).

[0055] [ka]

[0056] In formula (A1), x and y are both integers, and x+y is 2-200. In addition, in formula (A1), in order to obtain good dismantling properties and moldability, x:y=1:99 to 99:1 is preferable, x:y=2:98 to 75:25 is more preferable, and x:y=5:95 to 50:50 is even more preferable. In addition, in formula (A1), D has a structure represented by the following formula (A1-1).

[0057] [ka]

[0058] In formula (A1-1), R 9 R represents a divalent hydrocarbon group having 2 to 10 carbon atoms. 10 each independently represents a hydrogen atom, a monovalent hydrocarbon group or aromatic group having 1 to 30 carbon atoms, a hydroxyl group, or an alkoxyl group having 1 to 30 carbon atoms. z is an integer of 0 to 10. Among them, R 9 R is preferably a divalent hydrocarbon group having 2 to 5 carbon atoms, more preferably a divalent hydrocarbon group having 2 to 4 carbon atoms, and even more preferably a propenyl group. 10 are each independently preferably a monovalent hydrocarbon group having 1 to 20 carbon atoms, more preferably a monovalent hydrocarbon group having 1 to 10 carbon atoms, and are also preferably an alkyl group, more preferably an alkyl group having 1 to 5 carbon atoms, and even more preferably a methyl group.

[0059] The epoxy resin (A1) can be produced by epoxidizing the above-mentioned phenolic resin (P1) by a known method.

[0060] [Epoxy compound (A2)] The epoxy compound (A2) is a di- or higher functional epoxy compound having a structure represented by the following formula (A2).

[0061] [ka]

[0062] In formula (A2), m and n are integers, and m+n=4. R 3 is independently hydrogen, alkyl, alkenyl, alkynyl, cycloalkyl, cycloalkenyl, cycloalkynyl, aryl, heterocyclic, heterocycloalkyl, cycloalkenyl, heteroaryl, alkoxyaryl, alkoxyalkyl. B is independently arylene, arylene ether, alkylene-arylene, alkylene-arylene alkylene, alkenylene-arylene, alkenylene-arylenealkenylene, alkylene-arylene-alkenylene, alkynylenearylene, alkynylene-arylene-alkynylene, heteroarylene, alkylene-heteroarylene, alkylene-heteroarylene-alkylene, alkenylene-heteroarylene, alkenylene-heteroarylene-alkenylene, alkylene-heteroarylene-alkenylene, alkynylene; Heteroarylene, alkynylene-heteroarylene-alkynylene, alkylene, alkylene-hetero-alkylene, alkenylene, alkenylene-hetero-alkenylene, alkylene-hetero-alkenylene, alkynylene, cycloalkylene, alkylene-cycloalkylene, alkylene-cycloalkylene alkylene, alkenylene-cycloalkylene, alkenylenecycloalkylene-alkenylene, alkylene-cycloalkylene alkenylene, alkynylene-cycloalkylene, alkynylenecycloalkylene-alkynylene, hetero Cycloalkylene, alkyleneheterocycloalkylene, alkylene-heterocycloalkylenealkylene, alkenylene-heterocycloalkylene, alkenyleneheterocycloalkylene-alkenylene, alkyleneheterocycloalkylene-alkenylene, alkynyleneheterocycloalkylene, alkynylene-heterocycloalkylenealkynylene, cycloalkenylene, alkylene-cycloalkenylene, alkylene-cycloalkenylene-alkylene, alkenylene-cycloalkenylene, alkenylene-cycloalkenylene-alkenylene

[0043] In one embodiment, the aryl group is selected from the group consisting of aryl, alkylenecycloalkenylene-alkenylene, alkynylene-cycloalkenylene, alkynylene-cycloalkenylene-alkynylene, heterocycloalkenylene, alkylene-heterocycloalkenylene, alkylene-heterocycloalkenylene-alkylene, alkenylene-heterocycloalkenylene, alkenylene-heterocycloalkenylene-alkenylene, alkylene-heterocycloalkenylene-alkenylene, alkynyleneheterocycloalkenylene, alkynylene-heterocycloalkenylene, or alkynylene.

[0063] Specific examples of the di- or higher functional epoxy compound (A2) include those represented by the following formulas (A2-1) to (A2-19).

[0064] [ka]

[0065] [ka]

[0066] [ka]

[0067] [ka]

[0068] The epoxy compound (A2) can be obtained, for example, as follows. The method includes a step of partially epoxidizing a polyhydric alcohol having one or more hydroxyl groups with epihalohydrin in the presence of a base to obtain a partially epoxidized alcohol, and a step of reacting the partially epoxidized alcohol with a compound having a structure represented by each of the following formulae (4-1) to (4-3) in the presence of an acid catalyst, thereby obtaining a mixture containing an epoxy compound (A2) having a -Si-O- structure.

[0069] [ka]

[0070] [ka]

[0071] [ka]

[0072] (In the formula, R 5 ~R 8 are each independently hydrogen, alkyl, alkenyl, alkynyl, methylene, cycloalkyl, cycloalkenyl, cycloalkynyl, aryl, heterocyclic, heterocycloalkyl, cycloalkenyl, heteroaryl, alkoxy, alkoxyaryl, alkoxyalkyl, or aryloxy; R 11 is hydrogen, alkyl, aryl, aralkyl, alkenyl, or alkynyl)

[0073] [Epoxy compound (A3)] The epoxy compound (A3) has a structure represented by the following formula (A3).

[0074] [ka]

[0075] In formula (A3), R 1 , R 2 each independently represents a hydrogen atom, a hydrocarbon group or aromatic group having 1 to 30 carbon atoms, a hydroxyl group, or an alkoxyl group having 1 to 30 carbon atoms. R 12 each independently represents a hydrogen atom or a hydrocarbon group having 1 to 30 carbon atoms. and w is an integer from 1 to 50.

[0076] As the epoxy compound (A3), commercially available products can be used, and examples thereof include the double-end type epoxy-modified silicones "X-22-163", "X-22-163A", "X-22-163B", "X-22-163C", and "KF-105" (all manufactured by Shin-Etsu Silicones).

[0077] Specific examples of the epoxy compound (A3) include those represented by the following formula (A3-1).

[0078] [ka]

[0079] In formula (A3-1), R 1 , R 2 each independently represents a hydrogen atom, a hydrocarbon group or aromatic group having 1 to 30 carbon atoms, a hydroxyl group, or an alkoxyl group having 1 to 30 carbon atoms. Among them, R 1 , R 2 is preferably an alkyl group having 1 to 30 carbon atoms, more preferably an alkyl group having 1 to 3 carbon atoms, and further preferably a methyl group.

[0080] As the epoxy compound represented by the above formula (A3-1), commercially available products can be used, for example, alicyclic epoxy group-containing linear siloxane bifunctional oligomer "X-40-2669" (manufactured by Shin-Etsu Silicones).

[0081] Hereinafter, the physical properties of the epoxy resin (A) having a -Si-O- structure of this embodiment will be described.

[0082] The weight average molecular weight (Mw) of the epoxy resin (A) having a -Si-O- structure in this embodiment is not particularly limited, but is preferably 500 to 10,000, more preferably 1,000 to 7,000, and even more preferably 2,000 to 6,000. The number average molecular weight (Mn) of the epoxy resin (A) having a -Si-O- structure of the present embodiment is not particularly limited, but is preferably 100 to 5,000, more preferably 300 to 3,000, and even more preferably 600 to 1,000.

[0083] The viscosity of the epoxy resin (A) having a --Si--O-- structure of this embodiment is preferably in the range of 1 to 40,000 mPa·s.

[0084] In addition, the epoxy resin (A) having a -Si-O- structure in this embodiment preferably has an epoxy equivalent (EEW) in the range of 100 to 600 g / mEq. Here, the epoxy equivalent means the mass (grams) of a resin containing one epoxy equivalent.

[0085] In the third embodiment, the resin composition preferably uses a known phenol-based hardener.

[0086] The phenolic curing agent as the curing agent and the epoxy resin (A) having the -Si-O- structure are adjusted so that the equivalent ratio (EP) / (OH) of the number of epoxy groups (EP) in the total thermosetting resin to the number of phenolic hydroxyl groups (OH) in the total phenolic resin is preferably 0.8 to 1.6, more preferably 0.9 to 1.3, and even more preferably 1.0 to 1.2. When the equivalent ratio is within the above range, the curing characteristics of the resin composition of the present embodiment can be improved.

[0087] Other components contained in the resin composition of the third embodiment will be described later.

[0088] <Fourth embodiment> In the fourth embodiment, a resin composition containing, as a thermosetting resin, an organopolysiloxane (silicone resin) having two or more alkenyl groups bonded to silicon atoms in one molecule will be described.

[0089] [Organopolysiloxane] The organopolysiloxane having two or more alkenyl groups bonded to silicon atoms in one molecule preferably includes one or more selected from the group consisting of resinous organopolysiloxanes (S1), crosslinked organopolysiloxanes (S2), and block copolymers (S3) consisting of resinous organosiloxane blocks and linear organosiloxane blocks. The organopolysiloxane of this embodiment is preferably a mixture of different types of organopolysiloxanes.

[0090] (Resinous organopolysiloxane (S1)) The resinous organopolysiloxane (S1) is a resinous organopolysiloxane having a hydrosilylation reactive group and / or a radical reactive group.Specific examples include resins consisting of one or a combination of two or more units selected from the group consisting of triorganosiloxy units, diorganosiloxy units, monoorganosiloxy units, and siloxy units.

[0091] (Organopolysiloxane crosslinked product (S2)) The organopolysiloxane crosslinked product (S2) is either (i) a resinous organopolysiloxane structure and a linear organopolysiloxane structure linked in the molecule by an alkylene bond via a hydrosilylation reaction between an organopolysiloxane having at least two alkenyl groups in one molecule and an organopolysiloxane having at least two silicon-bonded hydrogen atoms in one molecule, (ii) a resinous organopolysiloxane structure and a linear organopolysiloxane structure linked in the molecule by a siloxane bond or an alkylene bond via a radical reaction with an organic peroxide of at least two organopolysiloxanes having at least two radical reactive groups in one molecule, or (iii) a resinous organopolysiloxane structure and a linear organopolysiloxane structure linked in the molecule by a siloxane (-Si-O-Si-) bond via a condensation reaction of at least two organopolysiloxanes.

[0092] In the above (i), the compound can be obtained by subjecting an organopolysiloxane having at least two alkenyl groups per molecule and an organopolysiloxane having at least two silicon-bonded hydrogen atoms per molecule to a hydrosilylation reaction in a reaction ratio such that [number of moles of alkenyl groups] / [number of moles of silicon-bonded hydrogen atoms]>1.

[0093] In the above (ii), at least two types of organopolysiloxanes each having at least two radical reactive groups in one molecule can be obtained by radical reaction with an organic peroxide in an amount that is insufficient to react with all of the radical reactive groups in the system.

[0094] In the above (i) and (ii), the organopolysiloxane crosslinked product (S2) is obtained by subjecting an organopolysiloxane having a resinous siloxane structure and an organopolysiloxane having a chain siloxane structure to a hydrosilylation reaction or a radical reaction.

[0095] The organopolysiloxane crosslinked product (S2) is Component (s1): an organopolysiloxane having at least two alkenyl groups having 2 to 20 carbon atoms in the molecule, the organopolysiloxane being composed of the following component (s1-1), and being subjected to a radical reaction with an organic peroxide; (s2) organohydrogenpolysiloxane; in the presence of a hydrosilylation catalyst such that the molar ratio of silicon-bonded hydrogen atoms in component (s2) is 0.2 to 0.7 mol per mol of alkenyl groups having 2 to 20 carbon atoms in component (s1).

[0096] The component (s1-1) is a polysiloxane having a relatively large amount of branching units, Average unit formula: (R 4 3 SiO 1 / 2 ) a (R 4 2 SiO 2 / 2 ) b (R 4 SiO 3 / 2 ) c (SiO 4 / 2 ) d (R 5 O 1 / 2 ) e It is an organopolysiloxane having at least two alkenyl groups in one molecule, represented by the following formula: In the formula, R 4are each independently an alkyl group having 1 to 20 carbon atoms, a halogen-substituted alkyl group having 1 to 20 carbon atoms, an alkenyl group having 2 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, a halogen-substituted aryl group having 6 to 20 carbon atoms, or an aralkyl group having 7 to 20 carbon atoms. 4 is preferably a methyl group, a vinyl group, or a phenyl group, provided that R 4 At least two of R are alkenyl groups. 4 Preferably, 10 mol % or more, or 20 mol % or more of R 5 is a hydrogen atom or an alkyl group having 1 to 6 carbon atoms.

[0097] In the formula, a is a number within the range of 0 to 0.7, b is a number within the range of 0 to 0.7, c is a number within the range of 0 to 0.9, d is a number within the range of 0 to 0.7, e is a number within the range of 0 to 0.1, and c+d is a number within the range of 0.3 to 0.9, and a+b+c+d is 1, and preferably a is a number within the range of 0 to 0.6, b is a number within the range of 0 to 0.6, c is a number within the range of 0 to 0.9, d is a number within the range of 0 to 0.5, e is a number within the range of 0 to 0.05, and c+d is a number within the range of 0.4 to 0.9, and a+b+c+d is 1. This is because when a, b, and c+d are each a number within the above range, the hardness and mechanical strength of the obtained cured product are excellent.

[0098] An example of such a component (s1-1) is the following organopolysiloxane: In the formula, Me, Ph, and Vi represent a methyl group, a phenyl group, and a vinyl group, respectively. (ViMe 2 SiO 1 / 2 ) 0.20 (PhSiO 3 / 2 ) 0.80

[0099] Component (s2) is a component that crosslinks component (s1-1) in the hydrosilylation reaction, and is an organopolysiloxane that contains at least two silicon-bonded hydrogen atoms in each molecule. Examples of groups other than hydrogen atoms bonded to silicon atoms in component (s2) include alkyl groups having 1 to 20 carbon atoms, halogen-substituted alkyl groups having 1 to 20 carbon atoms, aryl groups having 6 to 20 carbon atoms, halogen-substituted aryl groups having 6 to 20 carbon atoms, aralkyl groups having 7 to 20 carbon atoms, alkoxy groups, epoxy group-containing groups, and hydroxyl groups, and examples of such groups are the same as those mentioned above.

[0100] The component (s2) is not limited, but is preferably Average composition formula: R 6 k H m SiO (4-k-m) / 2 It is an organohydrogenpolysiloxane represented by the formula: In the formula, R 6 represents an alkyl group having 1 to 20 carbon atoms, a halogen-substituted alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, a halogen-substituted aryl group having 6 to 20 carbon atoms, or an aralkyl group having 7 to 20 carbon atoms, and examples of which include the same groups as those for R1 above, and are preferably a methyl group or a phenyl group.

[0101] In the formula, k is a number in the range of 1.0 to 2.5, and preferably a number in the range of 1.2 to 2.3, m is a number in the range of 0.01 to 0.9, and preferably a number in the range of 0.05 to 0.8, and k+m is a number in the range of 1.5 to 3.0, and preferably a number in the range of 2.0 to 2.7.

[0102] Examples of component (s2) include the following organopolysiloxanes. In the formula, Me and Ph represent a methyl group and a phenyl group, respectively. Ph 2 Si(OSiMe 2 H) 2 HMe 2 SiO(Me 2 SiO) 20 Sim 2 H HMe 2 SiO(Me 2 SiO) 55 Sim 2 H PhSi (OSiMe 2 H) 3 (HMe 2 SiO 1 / 2 ) 0.6 (PhSiO 3 / 2 ) 0.4

[0103] The amount of component (s2) added is an amount such that the molar ratio of silicon-bonded hydrogen atoms in component (s2) to the alkenyl groups in component (s1) is 0.2 to 0.7, and preferably 0.3 to 0.6, because when the amount of component (s2) added is within the above range, the initial hardness and mechanical strength of the resulting cured product are good.

[0104] There are no limitations on the hydrosilylation reaction catalyst used to cause the hydrosilylation reaction of the components (s1) and (s2), and the catalysts described below can be used. The amount of the hydrosilylation catalyst added is preferably an amount such that the platinum-based metal atoms in the hydrosilylation catalyst are in the range of 0.01 to 500 ppm, 0.01 to 100 ppm, or 0.01 to 50 ppm, by mass, relative to the combined amount of the components (s1) and (a2).

[0105] The organopolysiloxane is preferably granular. Although there are no limitations on the particle size, the average primary particle size is preferably within the range of 1 to 5000 μm, 1 to 500 μm, 1 to 100 μm, 1 to 20 μm, or 1 to 10 μm.

[0106] There are no limitations on the method for producing the organopolysiloxane, and any known method can be used.

[0107] (Block copolymer (S3)) The block copolymer (S3) consisting of a resinous organosiloxane block and a linear organosiloxane block may contain a siloxane unit or a silalkylene group-containing siloxane unit.

[0108] (Catalyst, curing accelerator) The organopolysiloxane of the fourth embodiment may contain a catalyst. By containing a catalyst, it is possible to promote the curing of the organopolysiloxane and the organohydrogenpolysiloxane. Examples of the catalyst include platinum-based catalysts, rhodium-based catalysts, and palladium-based catalysts, with platinum being preferred. Specific examples of platinum-based catalysts include platinum fine powder, chloroplatinic acid, an alcohol solution of chloroplatinic acid, a platinum-alkenylsiloxane complex, a platinum-olefin complex, and a platinum-carbonyl complex, as well as catalysts in which these platinum-based catalysts are dispersed or encapsulated in a thermoplastic resin. The amount of the catalyst added is preferably 0.01 to 5 mass %, more preferably 0.02 to 2 mass %, and even more preferably 0.05 to 1 mass %, based on the total amount of the resin composition.

[0109] (Inorganic filler) The organopolysiloxane of the fourth embodiment may contain an inorganic filler. The inorganic filler is contained in the particulate organopolysiloxane in order to obtain suitable strength, a low coefficient of linear expansion, and the like. Furthermore, the inorganic filler contained in the particulate organopolysiloxane may be one that has been subjected to a surface treatment in advance. The type of inorganic filler and the surface treatment agent may be the same as the inorganic filler and the surface treatment agent described above as one component of the resin composition.

[0110] The content of the inorganic filler is preferably from 100 to 4,000 parts by mass, more preferably from 250 to 4,000 parts by mass, and further preferably from 500 to 4,000 parts by mass, relative to 100 parts by mass of the organopolysiloxane.

[0111] Other components contained in the resin composition of the fourth embodiment will be described later.

[0112] Although one example of the embodiment of the resin composition of the present invention has been described above, the resin composition of the present invention is not limited thereto. In addition, the resin composition of each of the above embodiments may further contain a known thermosetting resin and a known curing agent in addition to the above-mentioned thermosetting component, and may contain other components depending on the application, etc. Hereinafter, other components that may be contained in the resin composition of the present invention will be described.

[0113] [Thermosetting resin] The thermosetting resin of the present embodiment may be, for example, one or more selected from phenol resin, epoxy resin, phenoxy resin, polyimide resin, benzoxazine resin, unsaturated polyester resin, melamine resin, silicone resin, cyanate resin, maleimide resin, cyanate resin, and acrylic resin. As these thermosetting resins, monomers, oligomers, and polymers having two or more reactive functional groups in one molecule may be used, and the molecular weight and molecular structure thereof are not particularly limited.

[0114] The epoxy resin may be any monomer, oligomer or polymer having two or more epoxy groups in one molecule, and the molecular weight and molecular structure thereof are not particularly limited. Specific examples of the epoxy resin include novolac type epoxy resins such as phenol novolac type epoxy resins and cresol novolac type epoxy resins; bisphenol type epoxy resins such as bisphenol A type epoxy resins and bisphenol F type epoxy resins; aromatic glycidylamine type epoxy resins such as N,N-diglycidylaniline, N,N-diglycidyltoluidine, diaminodiphenylmethane type glycidylamine, and aminophenol type glycidylamine; hydroquinone type epoxy resins; biphenyl type epoxy resins; stilbene type epoxy resins; triphenolmethane type epoxy resins; triphenolpropane type epoxy resins; alkyl-modified triphenol

[0043] One or more types selected from among nolmethane type epoxy resins; triazine nucleus-containing epoxy resins; dicyclopentadiene-modified phenol type epoxy resins; naphthol type epoxy resins; naphthalene type epoxy resins; naphthylene ether type epoxy resins; aralkyl type epoxy resins such as phenol aralkyl type epoxy resins having a phenylene and / or biphenylene skeleton, and naphthol aralkyl type epoxy resins having a phenylene and / or biphenylene skeleton, and aliphatic epoxy resins such as vinylcyclohexene dioxide, dicyclopentadiene oxide, and alicyclic diepoxy adipide can be used.

[0115] The content of the thermosetting resin is preferably from 1 mass % to 50 mass % of the total amount of the resin composition, more preferably from 2 mass % to 30 mass %, and even more preferably from 5 mass % to 20 mass %. By setting the content of the thermosetting resin to the above lower limit or more, the flowability and moldability of the resin composition can be more effectively improved. On the other hand, by setting the content of the thermosetting resin to the above upper limit or less, the curability can be improved and a good cured product can be obtained.

[0116] [Hardening agent] The curing agent of the present embodiment is selected according to the type of thermosetting resin, and is not particularly limited as long as it reacts with the thermosetting resin. Specific examples of the curing agent include polyaddition type curing agents, catalyst type curing agents, and condensation type curing agents.

[0117] Specific examples of the curing agent include phenol-based curing agents, amines, polyoxystyrenes such as polyparaoxystyrene, alicyclic acid anhydrides such as hexahydrophthalic anhydride (HHPA) and methyltetrahydrophthalic anhydride (MTHPA), aromatic acid anhydrides such as trimellitic anhydride (TMA), pyromellitic anhydride (PMDA), and benzophenonetetracarboxylic acid (BTDA), and other acid anhydrides, polymercaptan compounds such as polysulfides, thioesters, and thioethers, isocyanate compounds such as isocyanate prepolymers and blocked isocyanates, and organic acids such as carboxylic acid-containing polyester resins.

[0118] Specific examples of the phenol-based curing agent include novolac-type phenolic resins such as phenol novolac resin, cresol novolac resin, naphthol novolac resin, aminotriazine novolac resin, novolac resin, and trisphenylmethane-type phenol novolac resin; modified phenolic resins such as terpene-modified phenolic resin and dicyclopentadiene-modified phenolic resin; aralkyl-type resins such as phenol aralkyl resins having a phenylene skeleton and / or a biphenylene skeleton and naphthol aralkyl resins having a phenylene skeleton and / or a biphenylene skeleton; bisphenol compounds such as bisphenol A and bisphenol F; and resol-type phenolic resins. From the viewpoint of curability, the hydroxyl equivalent of the phenolic resin-based curing agent is preferably, for example, 90 g / eq or more and 250 g / eq or less.

[0119] Specific examples of the amines include one or more selected from aliphatic polyamines such as diethylenetriamine (DETA), triethylenetetramine (TETA), and metaxylenediamine (MXDA); aromatic polyamines such as diaminodiphenylmethane (DDM), m-phenylenediamine (MPDA), and diaminodiphenylsulfone (DDS); polyamine compounds including dicyandiamide (DICY) and organic acid dihydralazides; alicyclic acid anhydrides such as hexahydrophthalic anhydride (HHPA), methyltetrahydrophthalic anhydride (MTHPA), and aromatic acid anhydrides such as trimellitic anhydride (TMA), pyromellitic anhydride (PMDA), and benzophenonetetracarboxylic acid (BTDA).

[0120] The content of the curing agent is preferably 5 to 50 parts by mass, and more preferably 10 to 30 parts by mass, based on 100 parts by mass of the thermosetting resin.

[0121] The content of the thermosetting resin and the curing agent is appropriately set according to the thermosetting resin and the curing agent. For example, the phenolic curing agent as the curing agent and the epoxy resin as the thermosetting resin are adjusted so that the equivalent ratio (EP) / (OH) between the number of epoxy groups (EP) in the total thermosetting resin and the number of phenolic hydroxyl groups (OH) in the total phenolic resin is preferably 0.8 or more and 1.6 or less, more preferably 0.9 or more and 1.3 or less, and even more preferably 1.0 or more and 1.2 or less. When the equivalent ratio is within the above range, the curing characteristics of the resin composition of the present embodiment obtained can be improved.

[0122] The resin composition of the present embodiment may further contain the following components.

[0123] [Coupling agent] The resin composition of the present embodiment may contain a coupling agent, which can suppress aggregation of the inorganic filler and provide good flowability. As the coupling agent, for example, various silane-based compounds such as epoxysilane, mercaptosilane, aminosilane, alkylsilane, ureidosilane, vinylsilane, etc., titanium-based compounds, aluminum chelates, aluminum / zirconium-based compounds, and other known coupling agents can be used.

[0124] More specifically, vinyltrichlorosilane, vinyltrimethoxysilane, vinyltriethoxysilane, vinyltris(β-methoxyethoxy)silane, γ-methacryloxypropyltrimethoxysilane, β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropyltriethoxysilane, γ-glycidoxypropylmethyldimethoxysilane, γ-methacryloxypropylmethyldiethoxysilane, γ-methacryloxypropyltriethoxysilane, vinyltriacetoxysilane, γ-mercaptopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, γ-anilinopropyltrimethoxysilane, γ-anilinopropylmethyldimethoxysilane, γ-[bis(β-hydroxyethyl)]aminopropyltriethoxysilane, N-β-(aminoethyl)-γ-aminopropyltrimethoxysilane, N-β-(aminoethyl) - silane coupling agents such as gamma-aminopropyltriethoxysilane, N-beta-(aminoethyl)-gamma-aminopropylmethyldimethoxysilane, N-phenyl-gamma-aminopropyltrimethoxysilane, gamma-(beta-aminoethyl)aminopropyldimethoxymethylsilane, N-(trimethoxysilylpropyl)ethylenediamine, N-(dimethoxymethylsilylisopropyl)ethylenediamine, methyltrimethoxysilane, dimethyldimethoxysilane, methyltriethoxysilane, N-beta-(N-vinylbenzylaminoethyl)-gamma-aminopropyltrimethoxysilane, gamma-chloropropyltrimethoxysilane, hexamethyldisilane, vinyltrimethoxysilane, gamma-mercaptopropylmethyldimethoxysilane, 3-isocyanatopropyltriethoxysilane, 3-acryloxypropyltrimethoxysilane, and hydrolyzate of 3-triethoxysilyl-N-(1,3-dimethyl-butylidene)propylamine;Examples of titanate-based coupling agents include isopropyl triisostearoyl titanate, isopropyl tris(dioctyl pyrophosphate) titanate, isopropyl tri(N-aminoethyl-aminoethyl) titanate, tetraoctyl bis(ditridecyl phosphite) titanate, tetra(2,2-diallyloxymethyl-1-butyl)bis(ditridecyl)phosphite titanate, bis(dioctyl pyrophosphate)oxyacetate titanate, bis(dioctyl pyrophosphate)ethylene titanate, isopropyl trioctanoyl titanate, isopropyl dimethacryl isostearoyl titanate, isopropyl tridodecylbenzenesulfonyl titanate, isopropyl isostearoyl diacryl titanate, isopropyl tri(dioctyl phosphate) titanate, isopropyl tricumyl phenyl titanate, and tetraisopropyl bis(dioctyl phosphite) titanate. These may be used alone or in combination of two or more.

[0125] The content of the coupling agent is not particularly limited, but is preferably 0.05% by mass or more and 3% by mass or less, and more preferably 0.1% by mass or more and 2% by mass or less, based on the entire resin composition. By making the content of the coupling agent equal to or more than the lower limit, the dispersibility of the inorganic filler in the resin composition can be improved. In addition, by making the content of the coupling agent equal to or less than the upper limit, the flowability of the resin composition can be improved, and the moldability can be improved.

[0126] [Cure accelerator] The resin composition of the present embodiment may contain a curing accelerator. A cure accelerator typically accelerates the reaction between a thermosetting resin and a curing agent.

[0127] Specific examples of the curing accelerator include phosphorus atom-containing compounds such as organic phosphines, tetra-substituted phosphonium compounds, phosphobetaine compounds, adducts of phosphine compounds and quinone compounds, or adducts of phosphonium compounds and silane compounds; amidine compounds such as 1,8-diazabicyclo(5,4,0)undecene-7 and imidazole; nitrogen atom-containing compounds such as tertiary amines such as benzyldimethylamine, amidinium salts, or ammonium salts; and phenol compounds such as phenol, bisphenol A, nonylphenol, and 2,3-dihydroxynaphthalene. Examples of the organic phosphine include triphenylphosphine, tri-p-tolylphosphine, tetraphenylphosphonium tetraphenylborate, triphenylphosphine triphenylborane, 1,2-bis-(diphenylphosphino)ethane, etc. These may be used alone or in combination of two or more.

[0128] The content of the curing accelerator is appropriately set depending on the application, but is preferably 0.1 to 5 mass %, and more preferably 0.2 to 3 mass %, based on the total amount of the resin composition. By setting the content of the curing accelerator to be equal to or more than the lower limit, the resin composition can be appropriately cured. On the other hand, by setting the content of the curing accelerator to be equal to or less than the upper limit, the molten state can be prolonged, and the low viscosity state can be prolonged.

[0129] [Hydroxyl group-containing cyclic compound] When the resin composition of the present embodiment contains a curing accelerator, it may contain a compound in which a hydroxyl group is bonded to each of two or more adjacent carbon atoms constituting an aromatic ring (hereinafter also referred to as a "hydroxyl group-containing cyclic compound"). This makes it possible to suppress the reaction during melt kneading of the resin composition, even when a phosphorus atom-containing curing accelerator that does not have latency is used as the curing accelerator, and the resin composition can be stably obtained. In addition, the hydroxyl group-containing cyclic compound also has the effect of lowering the melt viscosity of the resin composition and improving the flowability.

[0130] The hydroxyl group-containing cyclic compound may be a monocyclic compound represented by the following general formula (5) or a polycyclic compound represented by the following general formula (6). These compounds may have a substituent other than a hydroxyl group.

[0131] [ka]

[0132] In the general formula (5), one of R15 and R19 is a hydroxyl group, and the other is a hydrogen atom, a hydroxyl group, or a substituent other than a hydroxyl group. R16, R17, and R18 are each a hydrogen atom, a hydroxyl group, or a substituent other than a hydroxyl group.

[0133] [ka]

[0134] In general formula (6), one of R20 and R26 is a hydroxyl group, and the other is a hydrogen atom, a hydroxyl group, or a substituent other than a hydroxyl group. R21, R22, R23, R24, and R25 are hydrogen atoms, a hydroxyl group, or a substituent other than a hydroxyl group.

[0135] Specific examples of the monocyclic compound represented by the general formula (5) include catechol, pyrogallol, gallic acid, gallic acid esters, and derivatives thereof. Specific examples of the polycyclic compound represented by the general formula (6) include, for example, 1,2-dihydroxynaphthalene, 2,3-dihydroxynaphthalene, and derivatives thereof. Among these, compounds in which hydroxyl groups are bonded to two adjacent carbon atoms constituting an aromatic ring are preferred because of the ease of controlling fluidity and curability. In addition, when considering volatilization during the kneading process, it is more preferable that the mother nucleus is a naphthalene ring, which has low volatility and high weighing stability. In this case, the hydroxyl group-containing cyclic compound can be specifically a compound having a naphthalene ring, such as, for example, 1,2-dihydroxynaphthalene, 2,3-dihydroxynaphthalene, and derivatives thereof. These hydroxyl group-containing cyclic compounds may be used alone or in combination of two or more kinds.

[0136] The content of the hydroxyl-containing cyclic compound is preferably 0.01% by mass or more, more preferably 0.03% by mass or more, and even more preferably 0.05% by mass or more, based on 100% by mass of the total resin composition. When the content of the hydroxyl-containing cyclic compound is within the above range, the resin composition can be sufficiently reduced in viscosity and improved in flowability. In addition, the content of the hydroxyl-containing cyclic compound is preferably 2% by mass or less, more preferably 0.8% by mass or less, and even more preferably 0.5% by mass or less, based on 100% by mass of the total resin composition. When the content of the hydroxyl-containing cyclic compound is within the above range, there is little risk of causing a decrease in the curability of the resin composition or a decrease in the physical properties of the cured product.

[0137] Furthermore, the resin composition of the present embodiment may further contain various additives, such as colorants such as carbon black; release agents such as natural waxes, synthetic waxes, higher fatty acids or metal salts thereof, paraffin, and polyethylene oxide; stress reducing agents such as silicone oil and silicone rubber; flame retardants such as aluminum hydroxide; ion scavengers such as hydrotalcites or hydrated oxides of elements selected from magnesium, aluminum, bismuth, titanium, and zirconium; adhesion promoters such as thiazoline, diazole, triazole, triazine, and pyrimidine, and antioxidants.

[0138] Next, a method for producing the resin composition of the present embodiment will be described. The method for producing the resin composition of the present embodiment is not particularly limited, but for example, the thermosetting component and other optional components are mixed using a mixer or the like, and then melt-heated and kneaded at about 90 to 120°C using a heated kneader, heated roll, extruder, or the like. The kneaded mixture is then cooled and pulverized to obtain a powdery or granular resin composition. If necessary, the resin composition may be molded into tablets after pulverization, or may be molded into a sheet shape by, for example, vacuum lamination molding or compression molding after pulverization.

[0139] Also, for example, the thermosetting component and other optional components may be dissolved, mixed, and stirred in a solvent using various mixers such as those used in an ultrasonic dispersion system, a high-pressure collision dispersion system, a high-speed rotation dispersion system, a bead mill system, a high-speed shear dispersion system, or a rotation-revolution dispersion system, to prepare a varnish-like resin composition. Specific examples of the solvent include acetone, methyl ethyl ketone, methyl isobutyl ketone, toluene, ethyl acetate, heptane, cyclohexane, cyclohexanone, tetrahydrofuran, dimethylformamide, dimethylacetamide, dimethylsulfoxide, ethylene glycol, cellosolve-based solvents, carbitol-based solvents, anisole, and N-methylpyrrolidone. The solvent may be used alone or in combination of two or more kinds.

[0140] 2. Structure The structure of the present embodiment includes a cured product of the easily dismantlable thermosetting resin composition described above. The cured product is obtained by thermally curing the resin composition of the present embodiment at 100 to 200° C. for 10 to 900 seconds. The structures can be widely applied to, for example, composite members for transport equipment such as automobiles, railways, ships, and aircraft, semiconductor chips, semiconductor elements, semiconductor devices equipped with printed wiring boards, composite members for factory equipment such as work robots, electronic devices such as electric circuit display devices, information and communication terminals, light-emitting diodes, physical batteries, chemical batteries, composite members for civil engineering and construction, composite members for sports and recreation, etc. Among them, in view of the importance of responding to environmental issues, composite members for transport equipment such as automobiles, semiconductor devices, etc. are preferable. Specifically, the semiconductor device includes a semiconductor element and an encapsulant that encapsulates the semiconductor element, the encapsulant being made of a cured product of the resin composition of the present embodiment. The encapsulation method is not particularly limited, and any known method can be used.

[0141] 3.Disassembly method The dismantling method of the present embodiment is carried out by immersing the cured product of the easily dismantlable thermosetting resin composition in a solvent, whereby the crosslinks in the cured product are cleaved and decomposed, the cured product is solubilized, or a part of the cured product is solubilized or gelled, allowing the product to be dismantled.

[0142] The immersion temperature of the cured product can be appropriately set depending on the application, but is preferably from -20 to 200°C, and more preferably from 0 to 150°C, for example. In addition, from the viewpoint of disassembly in a simple manner, the immersion of the cured product may be carried out at ambient temperature, i.e., at room temperature. This eliminates the need for special operations such as cooling or heating. For example, the liquid temperature of the solvent may be 5 to 30°C. On the other hand, in order to promote disintegration, heating or heat treatment may be added when the hardened material is immersed. The method of immersing the cured product is not particularly limited, and it is sufficient that the cured product is partially or entirely in contact with the solvent. The immersion time is appropriately adjusted depending on the size of the cured product, etc. Alternatively, the solvent may be poured into a container containing the cured product, or the cured product may be immersed and stirred in the solvent in the container.

[0143] The solvent may be any solvent that liberates the -Si-O- structure from the cured product, and is preferably a solvent containing fluoride ions. The solvent containing fluoride ions may be a solvent that generates fluoride ions.

[0144] The solvent of the present embodiment can be, for example, a solvent prepared as follows. (i) Tetra-n-butylammonium fluoride (n-Bu) in an organic solvent such as tetrahydrofuran 4 A solvent obtained by reacting fluorine compounds such as NF. The above-mentioned fluorine compound may be, for example, ammonium, an organic amine, or a fluoride salt of an organic ammonium, and specifically may be one or more selected from ammonium fluoride, hydrofluoric acid, acidic ammonium fluoride, methylamine hydrofluoride, ethylamine hydrofluoride, propylamine hydrofluoride, tetramethylammonium fluoride, tetraethylammonium fluoride, ethanolamine hydrofluoride, methylethanolamine hydrofluoride, dimethylethanolamine hydrofluoride, hydroxylamine hydrofluoride, dimethylhydroxylamine hydrofluoride, triethylenediamine hydrofluoride, etc. Among them, ammonium fluoride and tetra-n-butylammonium fluoride are preferred, and tetra-n-butylammonium fluoride is more preferred. (ii) Solvents obtained by reacting a mineral acid or a strong organic acid in an anhydrous organic solvent such as acetonitrile or a water-containing organic solvent. (iii) Solvent obtained by reacting N-bromosuccinimide (NBS) in dimethylsulfoxide (DMSO). (iv) A solvent obtained by reacting an alkali metal hydrogen sulfate in a solvent such as water or alcohol. As the hydrogen sulfate, alkali metal salts such as lithium hydrogen sulfate, potassium hydrogen sulfate, sodium hydrogen sulfate, etc. can be used, with the potassium salt and sodium salt being preferred. (v) A solvent obtained by treating with an aqueous solution of acetic acid. (vi) A solvent obtained by reacting an excess of potassium fluoride dihydrate with an excess of tetrabutylammonium chloride in acetonitrile.

[0145] Among these solvents, it is preferable to use the solvent (i) from the viewpoint of decomposition rate and waste liquid treatment.

[0146] 4. Recycling methods The recycling method of the present embodiment is a method for recycling materials constituting the above-mentioned structure, and includes a step of immersing the structure in a solvent and dismantling the cured product of the easily dismantlable thermosetting resin composition, and a step of recovering the materials from the structure. This allows the materials used in the structure to be reused. The process of dismantling the hardened product is the same as the method described above in the dismantling method.

[0147] The method for recovering the material from the structure is not particularly limited as long as it does not deteriorate the quality of the material. For example, there is a method in which the material is precipitated in a solvent in which the hardened material has been disassembled, and only the material is recovered by filtration or the like, or a method in which the structure is removed from the solvent, and then the structure is destroyed together with the hardened material that has become brittle due to disassembly, and the material is recovered.

[0148] The material is not particularly limited as long as it is not soluble in the above-mentioned solvent and does not cause a chemical reaction, and examples thereof include metals.

[0149] 2.Applications The resin composition of the present embodiment can be used in various applications. Specific examples of the applications include the following:

[0150] <Motor and stator> A stator including the resin composition of the present embodiment as a sealing material is applied to an electric motor (motor) as, for example, a rotating electric machine (electric motor, generator, or dual-purpose motor / generator). The resin composition of the present embodiment is used as a material for forming a sealing member in a stator having a stator core having a plurality of teeth and a plurality of slots alternately formed in the circumferential direction, a coil wound around the slot and housed in the slot, and a sealing member provided in the slot to cover the coil. A stator including the resin composition of the present embodiment as a sealing material is applied to an electric motor (motor) as, for example, a rotating electric machine (electric motor, generator, or dual-purpose motor / generator).

[0151] The stator of the present embodiment includes a cured product of the above-mentioned resin composition for a stator. The cured product is obtained by thermally curing the resin composition of the present embodiment at 100 to 200° C. for 10 to 900 seconds.

[0152] Fig. 1 is a schematic cross-sectional view perpendicular to the rotational axis direction of motor 100. Fig. 2 is a schematic cross-sectional view in the rotational axis direction of motor 100. Fig. 3 is an enlarged view of the periphery of the slot (area X in Fig. 1), and is a schematic cross-sectional view of the portion where coil 9 protrudes from the end of slot 8.

[0153] [Basic structure of Motor 100] The motor 100 includes a case 1, and a rotor 2, a stator 4, and a coil 9 housed inside the case 1.

[0154] [Case 1] The case 1 is configured to have a cylindrical portion 1a and side plate portions 1b, 1c that close both axial ends of the cylindrical portion 1a. The case 1 can be made of a material such as an aluminum alloy (cast metal casting), a resin material, or a combination thereof.

[0155] [Rotor 2] As shown in Fig. 1, the rotor 2 is housed inside the case 1. At the center of the rotor 2, a rotating shaft 3 is attached as an output shaft as shown in Fig. 2. Both ends of the rotating shaft 3 are supported by the side plate portions 1b, 1c via bearings 3a. This allows the rotor 2 to freely rotate around the rotating shaft 3.

[0156] Permanent magnets 5 are installed inside the rotor 2. Specifically, as shown in Fig. 1, a plurality of (eight here) permanent magnets 5 are arranged at equal intervals on the same circumference. At this time, the magnetic poles of adjacent permanent magnets 5 are set to be different from each other.

[0157] 2, a cylindrical stator 4 is disposed and fixed on the inner peripheral side of the cylindrical portion 1a so as to surround the outer periphery of the rotor 2. A minute gap (air gap) is provided between the inner peripheral surface of the stator 4 and the outer peripheral surface of the rotor 2.

[0158] [Stator core 41] Stator core 41 is provided by stacking a plurality of electromagnetic steel sheets in the axial direction and closely fixing them together, and when viewed from the axial end as shown in FIG. 1, it is provided with a yoke portion 6 provided in an annular shape and a plurality of teeth portions 7 extending from yoke portion 6 toward rotor 2 (inner circumference side). The plurality of teeth portions 7 are provided and arranged at equal intervals in the circumferential direction. Here, as shown in FIG. 1, 24 teeth portions 7 are provided. Slots 8 are provided between each of teeth portions 7. In addition, teeth portion 7 is provided with a resin layer 50 that is wrapped around and thinly covered with a resin composition.

[0159] [Coil 9] The coil 9 is a U-shaped rectangular wire wound so as to straddle the teeth portion 7 and be housed in two spaced apart slots 8. Here, the coil 9 is housed in a distributed winding manner in a liner member 20 arranged in the slot 8 (FIG. 1). The coil 9 has a first coil end and a second coil end. The first coil end protrudes to one axial side of the stator core 41. The second coil end protrudes to the other axial side of the stator core 41. That is, the coil 9 has a pair of coil ends that protrude from both axial sides of the stator core 41. The coil 9 is formed using a conductor such as copper, aluminum, or iron shaped into a wire.

[0160] [Teeth part 7] The teeth 7 are provided to correspond to the permanent magnets 5 of the rotor 2 described above, and by sequentially exciting each coil 9, the rotor 2 rotates due to attraction and repulsion between the corresponding permanent magnets 5.

[0161] The teeth 7 are tapered so that the circumferential width is large on the outer periphery and small on the inner periphery. Teeth tips 71 are formed at the inner periphery end of the teeth 7, facing each other in the circumferential direction so as to reduce the width of the slot 8.

[0162] [Slot 8] The slots 8 are spaces between adjacent teeth 7, and are provided so that wall surfaces 72 of teeth 7 facing each other in the radial direction are parallel to each other, as shown in Fig. 3. The space between the teeth tips 71 forms the inner peripheral opening of the slots 8. The slots 8 include a plurality of coils 9 arranged on the outer peripheral side (the yoke portion 6 side) and a resin sealing portion 65 provided on the inner peripheral side (the teeth tips 71 side).

[0163] [Resin sealing part 65] 3, the resin sealing portion 65 is provided on the inner periphery side of the slot 8 (the tooth tip 71 side). The resin sealing portion 65 may be provided by insert molding, or may be provided as a separate part. The resin material used for the resin sealing portion 65 is the sealing resin composition of the present embodiment described above.

[0164] In one embodiment, the resin encapsulation portion 65 is provided so as to cover the coil 9 only within the slot 8 . In another embodiment, the resin sealing portion 65 is provided so as to cover the coil 9 in the slot 8 and also to cover one of a pair of coil ends, in other words, to cover only one of the first and second coil ends. In still another embodiment, the resin sealing portion 65 is provided so as to cover the in-slot coil 9 and also to cover both of a pair of coil ends, in other words, to cover both the first and second coil ends.

[0165] [Manufacturing method of stator 4] A method for manufacturing the stator 4 of this embodiment will be described. First, a stator 4 is prepared by laminating a plurality of electromagnetic steel plates in the axial direction and closely fixing them together (stator preparation step). Next, the periphery of the teeth portion 7 (wall surface 73, upper surface 75a and lower surface 75b) is integrally covered with an insulating resin composition by insert molding to form the resin layer 50 (resin layer forming step). Next, the coil 9 is placed in the slot 8 in which the resin layer 50 is provided (coil placement process). After all the coils 9 are accommodated, the resin composition of this embodiment is filled into the inner peripheral region of the slots 8 and insert-molded to obtain the resin sealing portion 65 (resin filling step). Through the above steps, the stator 4 shown in FIG. 3 is obtained.

[0166] <Rotor> The rotor of the present embodiment includes a cured product of the above-mentioned easily dismantlable rotor fixing resin composition. The cured product is obtained by thermally curing the resin composition of the present embodiment at 100 to 200° C. for 10 to 900 seconds.

[0167] An example of the rotor of this embodiment will be described below. Fig. 4 is a plan view showing rotor 200 according to this embodiment. Fig. 5 is a cross-sectional view showing rotor 200 shown in Fig. 4. Note that Figs. 4 and 5 are schematic views showing rotor 200, and the configuration of rotor 200 according to this embodiment is not limited to that shown in Figs. 4 and 5.

[0168] The rotor 200 includes a rotor core 110, a magnet 120, and a fixing member 130. A hole 150 is provided in the rotor core 110. The magnet 120 is inserted into the hole 150. The fixing member 130 is provided in a spaced portion 140 between the hole 150 and the magnet 120. The fixing member 130 is formed using the above-mentioned easily dismantlable rotor fixing resin composition.

[0169] The rotor 200 according to this embodiment constitutes a motor mounted on, for example, an automobile, etc. The motor includes the rotor 200 and a stator (not shown) provided around the rotor 200. The stator is constituted by a stator core and a coil wound around the stator core. 5, the rotor 200 is attached to a rotating shaft 170. The rotation generated by the rotor 200 is transmitted to the outside via the rotating shaft 170.

[0170] The rotor core 110 is provided with a through hole for inserting the rotating shaft 170. The rotor core 110 is fixed to the rotating shaft 170 inserted into the through hole. The shape of the rotor core 110 is not particularly limited, but may be, for example, a circle or a polygon when viewed from above. 5, the rotor core 110 is formed by laminating a plurality of thin magnetic steel sheets 112. The magnetic steel sheets 112 are made of, for example, iron or an iron alloy. 5, end plates 118a and 118b are provided at both axial ends of rotor core 110. That is, end plate 118a is provided on stacked electromagnetic steel sheets 112. End plate 118b is provided below stacked electromagnetic steel sheets 112. End plate 118a and end plate 118b are fixed to rotating shaft 170 by, for example, welding.

[0171] Fig. 6 is an enlarged cross-sectional view showing rotor 200 shown in Fig. 4. As shown in Fig. 6, crimped portions 160 are formed on a plurality of electromagnetic steel sheets 112. Crimped portions 160 are configured by, for example, protrusions formed on electromagnetic steel sheets 112. Each electromagnetic steel sheet 112 is joined to another by crimped portions 160. Further, the end plate 118a is provided with, for example, a crimped portion 160 protruding from the electromagnetic steel sheet 112 and a groove portion 116 for avoiding interference with the fixing member 130 protruding onto the electromagnetic steel sheet 112. Note that the fixing member 130 protruding onto the electromagnetic steel sheet 112 is a portion formed by hardening the fixing resin composition remaining on the electromagnetic steel sheet 112 when the fixing resin composition is injected into the separation portion 140.

[0172] 4, rotor core 110 is provided with a plurality of holes 150. The plurality of holes 150 are arranged in rotor core 110 so as to be point symmetric with respect to the axis of rotating shaft 170. As shown in FIG. 4, in the rotor 200 of this embodiment, a plurality of hole groups, each of which is made up of, for example, two adjacent hole groups 150, are arranged along the periphery of the rotating shaft 170. The plurality of hole groups are arranged, for example, so as to be spaced apart from one another. The two holes 150 constituting one hole group are arranged, for example, in a V-shape in plan view. In this case, the two holes 150 constituting one hole group are arranged, for example, so that their respective opposing ends are located on the rotating shaft 170 side. In addition, the two holes 150 constituting one hole group are arranged, for example, so as to be spaced apart from one another.

[0173] <Automotive electronic control unit> The in-vehicle electronic control unit of the present embodiment includes a cured product of the above-mentioned resin composition for in-vehicle electronic control units. The cured product is obtained by thermally curing the resin composition of the present embodiment at 100 to 200° C. for 10 to 900 seconds.

[0174] FIG. 7 is a schematic cross-sectional view showing an example of the in-vehicle electronic control unit 10 according to the present embodiment. 7, the in-vehicle electronic control unit 10 includes, for example, a wiring board 12, a plurality of electronic components 16 mounted on at least one surface of the wiring board 12, and a sealing resin 14 that seals the electronic components 16. The wiring board 12 has a connection terminal 18 for connecting to an external device on at least one side. The in-vehicle electronic control unit 10 is electrically connected to the counterpart connector via the connection terminal 18 by fitting the connection terminal 18 into the counterpart connector. The vehicle electronic control unit 10 is used to control an engine, various vehicle devices, and the like.

[0175] Wiring board 12 is a wiring board having circuit wiring provided on one or both of one surface and the other surface opposite to the one surface. As shown in Fig. 7, wiring board 12 has, for example, a flat plate shape. Wiring board 12 may have, for example, through holes 120 that penetrate wiring board 12 and connect one surface to the other surface. In this case, the wiring provided on one surface of wiring board 12 and the wiring provided on the other surface are electrically connected via a conductor pattern provided in through hole 120.

[0176] Examples of materials that can be used to form the wiring board 12 include glass epoxy, polyimide, ceramic, and metal.

[0177] The wiring board 12 has a solder resist layer on one side on which the electronic components 16 are mounted, for example. The solder resist layer can be formed using a resin composition for forming a solder resist that is commonly used in the field of semiconductor devices. In this embodiment, for example, the solder resist layer can be provided on one side and the other side of the wiring board 12. The solder resist layer provided on one surface or on both surfaces of the wiring board 12 is formed from a resin composition containing a silicone compound, for example, which makes it possible to realize a solder resist layer with excellent surface smoothness.

[0178] 7, the plurality of electronic components 16 are mounted, for example, on one surface and the other surface of the wiring board 12. On the other hand, the electronic components 16 may be provided only on one surface of the wiring board 12, and may not be provided on the other surface of the wiring board 12. There is no particular limitation on the electronic components 16 as long as they can be mounted in an in-vehicle electronic control unit, and examples of the electronic components include microcomputers.

[0179] The sealing resin 14 is formed by molding and curing a sealing resin composition so as to seal the electronic component 16. For the sealing resin 14, the resin composition of the present embodiment described above is used.

[0180] In this embodiment, the sealing resin 14 is formed so as to seal the wiring board 12 together with, for example, the electronic components 16. In the example shown in Fig. 7, the sealing resin 14 is provided so as to seal one and the other surfaces of the wiring board 12 and the electronic components 16 mounted on the wiring board 12. The sealing resin 14 is also formed so as to seal, for example, a part or the whole of the wiring board 12. Fig. 7 illustrates a case in which the sealing resin 14 is provided so as to seal the entire other part of the wiring board 12 without sealing the connection terminals 18 so that the connection terminals 18 are exposed.

[0181] In the in-vehicle electronic control unit 10 according to this embodiment, the wiring board 12 may be mounted on, for example, a metal base. The metal base can function as a heat sink for dissipating heat generated from, for example, the electronic components 16. In this embodiment, for example, the metal base and the wiring board 12 mounted on the metal base are integrally encapsulated with an encapsulating resin composition to form the in-vehicle electronic control unit 10. The metal material constituting the metal base is not particularly limited, but may include, for example, iron, copper, aluminum, and alloys containing one or more of these. Note that the in-vehicle electronic control unit 10 does not need to have a metal base.

[0182] [Manufacturing method] Next, a method for manufacturing the in-vehicle electronic control unit 10 will be described. The manufacturing method of the in-vehicle electronic control unit 10 according to this embodiment is carried out by mounting a plurality of electronic components 16 on at least one surface of the wiring board 12, and then encapsulating the plurality of electronic components 16 using an encapsulating resin composition. The resin composition according to this embodiment described above is used as the encapsulating resin composition. The manufacturing method will be described in detail below.

[0183] First, a plurality of electronic components 16 are mounted on at least one surface of the wiring board 12. In this embodiment, for example, a plurality of electronic components 16 can be mounted on each of one surface of the wiring board 12 and the other surface opposite to the one surface. This makes it possible to form an in-vehicle electronic control unit 10 in which electronic components 16 are mounted on both surfaces of the wiring board 12 as shown in FIG. 7. On the other hand, electronic components 16 may be mounted only on one surface of the wiring board 12, and electronic components 16 may not be mounted on the other surface. Note that the above-mentioned examples of the wiring board 12 and electronic components 16 can be used as the wiring board 12 and electronic components 16.

[0184] Next, the electronic components 16 are encapsulated using an encapsulating resin composition, thereby forming an encapsulating resin 14 that encapsulates the electronic components 16. In this embodiment, the encapsulating resin composition is molded so as to encapsulate the wiring board 12 together with the electronic components 16. The in-vehicle electronic control unit 10 illustrated in FIG. 7 can be obtained by, for example, encapsulating one and the other surfaces of the wiring board 12 and the electronic components 16 mounted on the wiring board 12 with the encapsulating resin composition. In this embodiment, a part or the whole of the wiring board 12 together with the plurality of electronic components 16 is encapsulated using the encapsulating resin composition. The in-vehicle electronic control unit 10 illustrated in FIG. 7 can be obtained by, for example, molding the encapsulating resin composition so as to encapsulate the entire other parts of the wiring board 12 without encapsulating the connection terminals 18 so that the connection terminals 18 are exposed.

[0185] Although the embodiments of the present invention have been described above, these are merely examples of the present invention, and various configurations other than those described above can also be adopted. EXAMPLES

[0186] Next, the present invention will be described in detail with reference to examples, but the contents of the present invention are not limited to the examples.

[0187] 1. Synthesis of silicone rubber <Synthesis Example 1> Particulate silicone rubber 1 was synthesized according to the following steps (1) to (3). In the formula, Ph represents a phenyl group, Me represents a methyl group, and Vi represents a vinyl group. (1) 270.5 g of a 55 mass% toluene solution of an organopolysiloxane crosslinked material (S2) which is a white solid at 25°C and is represented by the following average unit formula (x1), and 0.034 g of a 1,3-divinyltetramethyldisiloxane solution of a platinum 1,3-divinyltetramethyldisiloxane complex (platinum metal content: approximately 4000 ppm) were placed in a 1 L flask and stirred uniformly at room temperature (25°C) to prepare a toluene solution of organopolysiloxane crosslinked material (S2) containing 10 ppm by mass as platinum metal. Average unit formula (x1): (PhSiO 3 / 2 ) 0.80 (Me 2 ViSiO 1 / 2 ) 0.20

[0188] (2) A toluene solution of the obtained organopolysiloxane crosslinked product (S2) was spray-dried at 40° C. to remove the toluene while atomizing the solution, thereby preparing spherical silicone microparticles.

[0189] (3) 1,900.0 g of fused silica ("S6050P" manufactured by Nippon Steel Materials Micron Corporation) having an average particle size of 17 μm and 9.5 g of dimethylpolysiloxane represented by the following formula (x2) and having a viscosity of 23 mPa s were charged into a small pulverizer all at once, and the mixture was stirred five times for one minute at 150°C to subject the fused silica to a surface treatment. The temperature of the small pulverizer was then returned to 25°C. Formula (x2):Me 2 ViSiO(Me 2 SiO) 29 Si(OMe) 3 Next, 78.7 g of the silicone microparticles obtained in (2) above, 9.1 g of diphenylsiloxane capped with dimethylhydrogensiloxy groups at both molecular chain terminals and having a viscosity of 5 mPa s, represented by formula (x3) below (silicon-bonded hydrogen atom content: 0.6% by mass), 12.2 g of branched-chain organopolysiloxane having two or more silicon-bonded hydrogen atoms per molecule and represented by average unit formula (x4) below (silicon-bonded hydrogen atom content: 0.65% by mass), and 1-ethynyl-1-cyclohexanol (an amount equivalent to 300 ppm by mass of the composition) were added to the small grinder and stirred for 1 minute at room temperature (25°C) to obtain a uniform white silicone rubber 1 (organopolysiloxane). Formula (x3): HMe 2 SiO(Ph 2 SiO)SiMe 2 H Formula (x4):(PhSiO 3 / 2 ) 0.4 (HMe 2 SiO 1 / 2 ) 0.6 The obtained silicone rubber 1 was then tableted using a tablet press to process it into cylindrical pellets measuring 14 mm in diameter and 22 mm in height.

[0190] 2. Preparation of resin composition <Example 1 and Comparative Example 1> The raw materials shown below were used and each component was mixed at the solid content ratio shown in Table 1 to obtain a mixture. Mixing was performed at room temperature using a Henschel mixer. The obtained mixture was then roll-kneaded at 90 to 120°C to obtain a kneaded product. The obtained kneaded product was cooled and then pulverized to obtain each of the resin compositions of Example 1 and Comparative Example 1.

[0191] [Raw materials] (thermosetting component) Epoxy resin 1: Orthocresol novolac type epoxy resin (DIC Corporation, EPICRON N-670) Silicone rubber 1: (organopolysiloxane) silicone rubber obtained in Synthesis Example 1 above (hardening agent) Hardener 1: Novolac-type phenol compound (Sumitomo Bakelite Co., Ltd., PR-51470) (Cure accelerator) Curing accelerator 1: Triphenylphosphine (Inorganic filler) Inorganic filler 1: Fused spherical silica (manufactured by Denka Co., Ltd., FB-60) Inorganic filler 2: Silica fine particles (particle size 7 nm, specific surface area 300 m 2 / g), manufactured by Nippon Aerosil Co., Ltd., "AEROSIL300" (others) Colorant 1: Carbon black (Mitsubishi Chemical Corporation, Carbon #5) Coupling agent 1: N-phenyl-3-aminopropyltrimethoxysilane (manufactured by Dow Corning Toray Co., Ltd., CF-4083) Release agent 1: Carnauba wax Additives: Stress reducing agents, ion scavengers and flame retardants

[0192] 3. Confirmation of the structure of the cured resin composition Each of the obtained resin compositions was molded under conditions of a mold temperature of 175° C. and a curing time of 2 minutes to obtain a cured product. The following resin composition analysis was performed on each of the cured products using pyrolysis GC-MS. For the GC-MS measurement, an FT-NMR device (JNM-ECA400, manufactured by JEOL Ltd.) was used. First, the cured material was heated at 600°C for 1 min in a helium atmosphere, and all the generated components were introduced into a GC separation column and trapped with liquid nitrogen. After heating, the trap was removed and GC-MS measurement was started immediately. The -Si-O- structure was identified based on the mass spectrum and retention time of each compound, and was judged according to the following criteria. The results are shown in Table 1. (standard) OK: -Si-O- structure was identified N / A: -Si-O- structure could not be identified

[0193] 4. Evaluation of ease of disassembly Dismantling properties were evaluated using the following solvents. Solvent: Tetrabutylammonium fluoride (0.5 mol / L, THF solution) First, each of the obtained resin compositions was molded under conditions of a mold temperature of 175° C. and a curing time of 2 minutes to obtain a cured product (width 10 mm, thickness 4 mm, length 20 mm). Next, the obtained cured product was immersed in 25 ml of solvent in a container and left to stand at 23°C for 24 hours. After that, the container was shaken for 1 minute using a shaker (approximately 200 reciprocations / min), and all the solution in the container was filtered through a 212 μm mesh filter (JIS standard sieve 212 μm diameter 100 mm). The possibility of filtration (whether the filter was clogged or not) and the residue on the filter were observed and evaluated according to the following criteria. The less the degree of clogging of the filter and the less the residue, the more the cured product can be dissolved in the solvent and the better the dismantling properties. The results are shown in Table 1. (standard) A: The filter is not clogged and there is no or only a small amount of cured product residue on the filter. B: The filter is not clogged, but there is noticeable residue of hardened material on the filter. C: The filter is clogged and cannot filter.

[0194] [Table 1] [Explanation of symbols]

[0195] 1 case 1a Cylindrical part 1b Side plate part 2 Rotors 3 Rotation Axis 3a Bearing 4 Stator 5. Permanent magnets 6. Yoke 7 Teeth 8 Slots 9 Coil 20 Liner material 41 Stator core 50 Resin layer 56 Allylphenol 65 Resin sealing part 71 Teeth tip 72 Wall 73 Wall 75a Top side 75b Bottom side 100 Motor 200 rotor 110 Rotor Core 112 Electrical steel sheet 112 Each electromagnetic steel plate 112 Electrical steel sheet 116 Groove 118a End plate 118b End plate 120 Magnet 130 Fixing member 140 Separation part 150 Hole 160 Crimping part 170 Rotating Shaft 10. Automotive Electronic Control Unit 12 Wiring board 14 Sealing resin 16 Electronic Components 18 Connection terminal 120 through hole

Claims

1. An easily dismantlable thermosetting resin composition comprising a thermosetting component and an inorganic filler, The content of the inorganic filler is 40% by mass or more based on the total amount of the easily dismantlable thermosetting resin composition, The easily dismantlable thermosetting resin composition has a structure represented by the following formula (1), wherein the cured product obtained by thermally curing the easily dismantlable thermosetting resin composition has a structure represented by the following formula (1): 【Chemistry 1】 (In formula (1), R １ , R ２ each independently represents a hydrogen atom, a hydrocarbon group or aromatic group having 1 to 30 carbon atoms, a hydroxyl group, or an alkoxyl group having 1 to 30 carbon atoms.

2. The easily dismantlable thermosetting resin composition according to claim 1, The easily dismantlable thermosetting resin composition, wherein the thermosetting component has a -Si-O- structure.

3. The easily dismantlable thermosetting resin composition according to claim 1 or 2, The easily dismantlable thermosetting resin composition, wherein the thermosetting component comprises a thermosetting resin and a curing agent, and both the thermosetting component and the curing agent have a -Si-O- structure.

4. The easily dismantlable thermosetting resin composition according to claim 1 or 2, The easily dismantlable thermosetting resin composition, wherein the thermosetting component comprises a thermosetting resin and a curing agent, and the curing agent has a -Si-O- structure.

5. The easily dismantlable thermosetting resin composition according to claim 3, The easily dismantlable thermosetting resin composition, wherein the curing agent comprises a phenol-based curing agent.

6. The easily dismantlable thermosetting resin composition according to claim 1 or 2, The easily dismantlable thermosetting resin composition, wherein the thermosetting component comprises a thermosetting resin and a curing agent, and the thermosetting resin has a -Si-O- structure.

7. The easily dismantlable thermosetting resin composition according to claim 6, The easily dismantlable thermosetting resin composition includes one or more thermosetting resins selected from the group consisting of epoxy resins, phenoxy resins, polyimide resins, benzoxazine resins, unsaturated polyester resins, phenolic resins, melamine resins, silicone resins, cyanate resins, bismaleimide resins, and acrylic resins.

8. The easily dismantlable thermosetting resin composition according to claim 7, The easily dismantlable thermosetting resin composition, wherein the thermosetting resin comprises an epoxy resin.

9. The easily dismantlable thermosetting resin composition according to claim 7, The easily dismantlable thermosetting resin composition, wherein the thermosetting resin comprises an organopolysiloxane having two or more alkenyl groups bonded to silicon atoms in each molecule.

10. The easily dismantlable thermosetting resin composition according to claim 9, The easily dismantlable thermosetting resin composition, wherein the organopolysiloxane is a mixture of different types of organopolysiloxane.

11. The easily dismantlable thermosetting resin composition according to claim 9, The easily dismantlable thermosetting resin composition, wherein the organopolysiloxane is in a granular form.

12. The easily dismantlable thermosetting resin composition according to claim 1 or 2, An easily dismantlable thermosetting resin composition in the form of a powder, granule, tablet or sheet.

13. The easily dismantlable thermosetting resin composition according to claim 1 or 2, The easily dismantlable thermosetting resin composition comprises: A stator having a stator core having a plurality of teeth and a plurality of slots formed alternately in a circumferential direction, a coil wound around and housed in the slot, the coil having a pair of coil ends protruding from the stator core on both sides in an axial direction, and a sealing member provided within the slot to cover the coil, An easily dismantlable thermosetting resin composition used for forming the sealing member.

14. The easily dismantlable thermosetting resin composition according to claim 1 or 2, The easily dismantlable thermosetting resin composition comprises: A rotor comprising: a rotor core fixed to a rotating shaft and having a plurality of holes arranged along a circumferential edge of the rotating shaft; magnets inserted into the holes; and a fixing member provided at a space between the holes and the magnets, An easily dismantlable thermosetting resin composition used for forming the fixing member.

15. The easily dismantlable thermosetting resin composition according to claim 1 or 2, The easily dismantlable thermosetting resin composition comprises: An in-vehicle electronic control unit including a wiring board, a plurality of electronic components mounted on the wiring board, and a sealing member that seals the electronic components, An easily dismantlable thermosetting resin composition used for forming the sealing member.

16. A structure comprising a cured product of the easily dismantlable thermosetting resin composition according to claim 1 or 2.

17. A semiconductor element; an encapsulant for encapsulating the semiconductor element; Equipped with A semiconductor device, wherein the sealing material is made of a cured product of the easily dismantlable thermosetting resin composition according to claim 1 or 2.

18. a stator core having a plurality of teeth and a plurality of slots alternately arranged in a circumferential direction; a coil wound in the slot and housed in the slot, the coil having a pair of coil ends protruding from the stator core in both axial directions; a sealing member provided in the slot to cover the coil, A stator, wherein the sealing member is made of a cured product of the dismantlable thermosetting resin composition according to claim 1 or 2.

19. An in-vehicle electronic control unit comprising: a wiring board; a plurality of electronic components mounted on the wiring board; and a sealing member that seals the electronic components, 3. An in-vehicle electronic control unit, wherein the sealing member is made of a cured product of the easily dismantlable thermosetting resin composition according to claim 1.

20. A rotor comprising: a rotor core fixed to a rotating shaft and having a plurality of holes arranged along a circumferential edge of the rotating shaft; magnets inserted into the holes; and a fixing member provided at a space between the holes and the magnets, A rotor, wherein the fixing member is made of a cured product of the dismantlable thermosetting resin composition according to claim 1 or 2.

21. A method for dismantling a cured product of the easily dismantlable thermosetting resin composition according to claim 1 or 2, comprising: A dismantling method comprising the step of immersing the cured product of the easily dismantlable thermosetting resin composition in a solvent to dismantle the cured product.

22. The disassembly method according to claim 21, The disassembly method, wherein the solvent is a solvent containing fluorine ions.

23. The disassembly method according to claim 21, The dismantling method, wherein the immersion is carried out at -20 to 200°C.

24. The disassembly method according to claim 21, The disassembly method, wherein the immersion is carried out at 5 to 30°C.

25. The disassembly method according to claim 21, The dismantling method, wherein the hardened material is powdered in the dismantling step.

26. A method for recycling materials constituting the structure according to claim 16, comprising the steps of: A step of immersing the structure in a solvent and dismantling the cured product of the easily dismantlable thermosetting resin composition; and recovering said material from said structure.

27. A method for recycling materials constituting the stator according to claim 18, comprising the steps of: Immersing the stator in a solvent and dismantling the cured product of the easily dismantlable thermosetting resin composition; and recovering said material from said stator.

28. A method for recycling materials constituting the in-vehicle electronic control unit according to claim 19, comprising the steps of: immersing the in-vehicle electronic control unit in a solvent and dismantling the cured product of the easily dismantlable thermosetting resin composition; and recovering said material from said vehicle electronic control unit.

29. A method for recycling materials constituting the rotor according to claim 20, comprising the steps of: Immersing the rotor in a solvent and dismantling the cured product of the easily dismantlable thermosetting resin composition; and recovering said material from said rotor.

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