Heating head and hot bar joint machine

Abstract

To provide a heating head and a hot bar joint machine that have a simple configuration and can prevent generation of a solder joint having a defect such as a solder bridge.SOLUTION: A hot bar joint machine 40 includes: a heating head 2 having a heating surface 10 of which part of heating temperature is set to be lower than the other part of the heating surface 10 and which performs solder joint with a single heating surface to a region having solder in one or more parts; and a heat release and low-heat generating part 11 serving as cooling means for cooling only the part of the heating surface 10.SELECTED DRAWING: Figure 17

Description

[Technical field]

[0001] The present invention relates to a heated head and hot bar bonder. [Background technology]

[0002] When soldering, adjacent molten solder pieces stick together, which is known as a joint defect called solder bridging. Various ideas have been devised to prevent solder bridging. For example, in the manufacturing process of printed circuit boards and TAB tapes, a coating made of polyimide resin is formed as a permanent resist between conductors, and then the coating is removed by chemical etching until the tops of the conductors are exposed, and solder plating is applied to the exposed conductors (Patent Document 1).

[0003] According to Patent Document 1, there is no need to print resist only in spaces excluding the conductors, and resist can be printed by so-called solid printing, which eliminates solder flow between the conductors and extremely increases productivity. It is said to be ideal for preventing solder bridges in various electronic circuits with fine patterns, especially in the soldering of TAB (Tape Automated Bonding) tape outer leads, which have a narrow pitch. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 07-263846 Summary of the Invention [Problem to be solved by the invention]

[0005] The technology of Patent Document 1 is undesirable in that it requires complicated steps to prevent solder bridges, such as forming a coating made of polyimide resin on the conductors and between the conductors, and then removing the coating by chemical etching until the tops of the conductors are exposed.

[0006] SUMMARY OF THE PRESENT EMBODIMENT An object of the present invention is to provide a heating head and a hot bar bonding machine equipped with the same that can prevent the occurrence of defective solder joints such as solder bridges with a simple configuration. [Means for solving the problem]

[0007] In order to achieve the above object, the hot bar joining machine has a heating head in which the heating temperature of a portion of the heating surface is set lower than that of the other portions of the heating surface, and which performs solder joining on an area having solder in two or more places on the heating surface alone, and has a cooling means for cooling only a portion of the heating surface.

[0008] Here, the part of the heating surface may be a central portion in the longitudinal direction of the heating surface.

[0009] Also, a heating head having heat dissipation and low heat generating portions may be provided on a portion of the heating surface.

[0010] Also, a cooling device that cools all or part of the heat dissipation and low heat generation portion may be provided, and a temperature sensor for the heat dissipation and low heat generation portion may be provided that measures the temperature of all or part of the heat dissipation and low heat generation portion.

[0011] Also, an edge heating temperature sensor may be provided to measure the temperature at the edge of the heating surface.

[0012] To achieve the above objective, the heating head has a heating surface with an uneven heating temperature, and the heating surface alone performs solder joining in an area having solder in one place, and the area of ​​the heating surface with a lower heating temperature is applied to the area where the heat received by the solder tends to build up.

[0013] Here, the heating surface with non-uniform heating temperature is formed due to the shape of the heating head.

[0014] To achieve the above objective, the hot bar joining machine has a heating surface with an uneven heating temperature, and is equipped with a heating head that performs solder joining on an area having solder in one place using only the heating surface, and applies an area of ​​the heating surface with a lower heating temperature to areas where the heat received by the solder is likely to become trapped.

[0015] Here, an edge heating temperature sensor may be provided to measure the temperature at the edge of the heating surface. Effect of the Invention

[0016] The present invention can provide a heating head and a hot bar joining machine equipped with the same, which can prevent the occurrence of defective solder joints such as solder bridges with a simple configuration. [Brief description of the drawings]

[0017] [Figure 1] FIG. 2 is a perspective view of the conductive plate side of a hot bar bonding machine equipped with a heating head according to the present embodiment. [Diagram 2] FIG. 2 is a perspective view of the heating surface side of a hot bar joining machine equipped with a heating head according to the present embodiment. [Diagram 3] The upper figure is a front view of a hot bar joining machine equipped with a heating head according to the present embodiment, and the lower figure is a graph showing the temperature distribution of the heating surface in the longitudinal direction of the heating surface. [Figure 4] FIG. 1 is a plan view of a hot bar joining machine equipped with a heating head according to an embodiment of the present invention. [Diagram 5] FIG. 2 is a bottom view of a hot bar joining machine equipped with a heating head according to the present embodiment. [Figure 6] 1 is a right side view of a hot bar joining machine equipped with a heating head according to the present embodiment. Note that a left side view of the hot bar joining machine equipped with a heating head according to the present embodiment is omitted because it is substantially symmetrical to the right side view. [Figure 7] FIG. 2 is an exploded perspective view of a hot bar joining machine equipped with the heating head of the present embodiment. [Figure 8] FIG. 13 is a perspective view of the conductive plate side of a hot bar bonding machine equipped with a heating head of a comparative example. [Figure 9] FIG. 13 is a perspective view of the heating surface side of a hot bar joining machine equipped with a heating head of a comparative example. [Figure 10] The upper figure is a front view of a hot bar joining machine equipped with a heating head of a comparative example, and the lower figure is a graph showing the temperature distribution of the heating surface in the longitudinal direction of the heating surface. [Figure 11] FIG. 1 is a plan view of a hot bar joining machine equipped with a heating head of a comparative example. [Figure 12] FIG. 13 is a bottom view of a hot bar joining machine equipped with a heating head of a comparative example. [Figure 13] 1 is a right side view of a hot bar joining machine equipped with a heating head of a comparative example. Note that a left side view of the hot bar joining machine equipped with a heating head of the comparative example is omitted because it is substantially symmetrical to the right side view. [Figure 14] FIG. 13 is a diagram showing how a heating surface, indicated by a dashed line, is applied to a mounting pattern such as a PCB (printed circuit board). [Figure 15] FIG. 11 is a plan view showing a state in which solder bonding is performed on a solder area 35 having solder at one location on a single heating surface according to the second embodiment. [Figure 16] FIG. 11 is a front view of a hot bar joining machine equipped with a heating head according to a third embodiment. [Figure 17] 17 is a cross-sectional view of FIG. 16 shown in ZZ. [Figure 18] 13A to 13C are diagrams illustrating a cooling device, a temperature sensor for heat dissipation and low heat generating parts, and a temperature sensor for heating an end part according to a fourth embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0018] (Configuration and Effects of the Hot Bar Bonding Machine and Heating Head of the Present Embodiment) The heating head of this embodiment will be described below with reference to Figures 1, 2, 3, 4, 5, 6 and 7. The hot bar joining machine 1 has a metallic heating head 2 mounted on metallic conductive plates 3 and 4.

[0019] The mounting method is to screw the heating head 2 and the conductive plates 3 and 4 together by inserting the screws 5a, 5b, 5c, and 5d into the screw holes 6a, 6b, 6c, and 6d of the conductive plates 3 and 4 and the screw holes 7a, 7b, 7c, and 7d of the heating head 2. Specifically, the screw 5a is inserted into the screw holes 7a and 6a, the screw 5b is inserted into the screw holes 7b and 6b, the screw 5c is inserted into the screw holes 7c and 6c, and the screw 5d is inserted into the screw holes 7d and 6d, and then they are screwed together (see FIG. 7).

[0020] A current flows between the conductive plates 3 and 4 (illustration of the current is omitted, same below). The current is also transmitted to and flows through the heating head 2. The current transmitted to the heating head 2 heats the heating surface 10 with Joule heat. The heating surface 10 is the flat portion of the bottom surface of the Y-shaped heating head 2 as seen in FIG. 2.

[0021] The heating temperature of the heating surface 10 is non-uniform along its longitudinal direction, as shown in the lower part of Fig. 3. The heating temperature decreases slightly toward the center of the longitudinal direction of the heating surface 10. This is due to the presence of a triangular heat dissipation and low heat generation portion 11 in the heating head 2. Since the heating head 2 is made of metal, the heat dissipation and low heat generation portion 11 is also made of metal. The metal portion has good heat dissipation properties.

[0022] When the heat dissipation and low heat generation section 11 generates heat by Joule heat by passing electricity between the conductive plates 3 and 4, the heat generation temperature is high in the area where the current flow path is narrow, and the heat generation temperature is low in the area where the current flow path is wide. The heat dissipation and low heat generation section 11 has a wider current flow path toward the center of the longitudinal direction of the heating surface 10, and the current flow path is narrower toward the end of the longitudinal direction of the heating surface 10. This is also the reason why the heating temperature of the heat dissipation and low heat generation section 11 decreases slightly toward the center of the longitudinal direction of the heating surface 10.

[0023] Then, as shown in Fig. 14, solder bonding is performed on the area having the solders 20, 21, and 22 in three places on the heating surface 10 alone. Then, an area of ​​the heating surface 10 with a low heating temperature is applied to the area where the heat received by the solders 20, 21, and 22 is likely to be trapped. Note that Fig. 14 also shows through holes 23, 24, and 25 and wiring patterns 26, 27, and 28.

[0024] 14, the areas where the heat received by the solders 20, 21, and 22 is likely to be trapped are the areas between the solders 20 and 21 and between the solders 21 and 21 and 22. This is because adjacent solders heat each other up due to the presence of other solder in adjacent locations. Therefore, conversely, the area of ​​the solder 20 that is not adjacent to the solder 21 and the area of ​​the solder 22 that is not adjacent to the solder 21 are not likely to trap the heat received by the solders 20, 21, and 22.

[0025] It is known that the heated and molten solder flows, that is, moves, from a low temperature region to a high temperature region. If the heating temperature of the heating surface 10 were uniform along its longitudinal direction, the solder would move from the region of the solder 20 that is not adjacent to the solder 21 and the region of the solder 22 that is not adjacent to the solder 21 to the region between the solders 20 and 21 and between the solders 21 and 21 and 22, which could cause a solder bridge.

[0026] Therefore, the heating temperature of the heating surface 10 is made non-uniform along its longitudinal direction, as shown in the lower part of FIG. 3. That is, as shown in the lower part of FIG. 3, the heating temperature is slightly lowered toward the central part of the longitudinal direction of the heating surface 10. Then, the heating temperature of the heating surface 10 in the region where the heat received by the solders 20, 21, and 22 is likely to be trapped is lowered, and the heat received by the solders 20, 21, and 22 can be made substantially uniform, and the occurrence of solder bridges can be prevented. This is because it is considered that the solder 20 moves to the left side of the longitudinal direction of the heating surface 10 in a region where the temperature is higher than the temperature of the region of the solder 20, and therefore it is difficult for the solder 20 to move in the direction of the solder 21. Also, it is considered that the solder 22 moves to the right side of the longitudinal direction of the heating surface 10 in a region where the temperature is higher than the temperature of the region of the solder 22, and therefore it is difficult for the solder 20 to move in the direction of the solder 21.

[0027] When soldering was actually performed using the heating head 2, the occurrence of solder bridges caused by the heating temperature of the heating surface 10 was 0%. However, the occurrence of solder bridges caused by the pressure of the heating head 2 being too high was 1%.

[0028] (Comparative Example: Hot Bar Bonding Machine and Heating Head Configuration and Effects) A hot bar joining machine 31 and a heating head 32 of a comparative example will be described with reference to Figures 8, 9, 10, 11, 12, and 13. Among the members shown in Figures 8, 9, 10, 11, 12, and 13, those having the same shape and function as the hot bar joining machine 1 and the heating head 2 of this embodiment are given the same reference numerals, and their description will be omitted.

[0029] The hot bar joining machine 31 and the heating head 32 of the comparative example are the same as those of the hot bar joining machine 1 and the heating head 2 of the present embodiment, except that the heat dissipation and low heat generating section 11 has been removed. Therefore, most of the symbols are the same as those of the hot bar joining machine 1 and the heating head 2 of the present embodiment.

[0030] As shown in Fig. 14, a hot bar joining machine 31 and a heating head 32 of the comparative example perform solder joining on an area having solder 20, 21, and 22 in three places on a single heating surface 10. Since there is no heat dissipation and low heat generating portion 11, the flow path of the current does not widen toward the center of the heating surface 10 in the longitudinal direction, and the heat generation temperature is constant along the longitudinal direction of the heating surface 10. As a result, there was a 2% probability of a solder bridge occurring due to the heating temperature of the heating surface 10. Also, the occurrence of solder bridges caused by the pressure applied by the heating head 2 being too high was 1%.

[0031] (Major Effects Obtained by the Present Embodiment) As described above, the hot bar joining machine 1 and the heating head 2 of this embodiment can prevent the occurrence of solder bridges. Moreover, what makes it possible to prevent the occurrence of solder bridges is the simple configuration of the heat dissipation and low heat generation section 11, which is a triangular part of the heating head 2.

[0032] (Other forms) The hot bar joining machine 1 and the heating head 2 according to the above-described embodiment are one example of a preferred form of the present invention, but the present invention is not limited to this and various modifications are possible within the scope that does not change the gist of the present invention.

[0033] For example, the conductive plates 3, 4 and the heating head 2 in this embodiment are both made of metal. However, the conductive plates 3, 4 and / or the heating head 2 may be made of any material that is conductive and allows current to flow through them. Materials that are conductive include conductive resins and cermets.

[0034] In addition, the heating surface 10 having a non-uniform heating temperature in this embodiment has a non-uniform heating temperature along its longitudinal direction as shown in Fig. 3. However, the heating surface 10 may have a non-uniform heating temperature along its lateral direction.

[0035] Also, as shown in FIGS. 1 and 4, the shape of the heating surface 10 is rectangular. However, the shape of the heating surface 10 may be other shapes such as a square, a trapezoid, a triangle, a circle, or a polygon other than a quadrilateral.

[0036] In this embodiment, soldering is performed on the regions having solder at three locations on the heating surface 10 alone. However, soldering may be performed on the regions having solder at two or more locations, such as two locations or four locations, on the heating surface 10 alone.

[0037] Also, FIG. 4 shows the through holes 23, 24, 25 and the wiring patterns 26, 27, 28, but some or all of these may be omitted.

[0038] Also, the heating head 2 and the conductive plates 3, 4 are inserted into the screw holes 6a, 6b, 6c, 6d of the conductive plates 3, 4 and the screw holes 7a, 7b, 7c, 7d of the heating head 2 with the screws 5a, 5b, 5c, 5d, and screw connection is performed. However, it is not necessary to connect the heating head 2 and the conductive plates 3, 4 by screw connection. Also, even when the heating head 2 and the conductive plates 3, 4 are screw-connected, the number of screws or the position of the screw connection does not have to be the same as in this embodiment.

[0039] Also, as shown in FIG. 3, the heat dissipation and low heat generation part 11 of the heating head 2 has a triangular shape with a height increasing toward the central part in the longitudinal direction of the heating surface 10. However, the heat dissipation and low heat generation part 11 may have various shapes such as a rectangular shape or a circular shape. Also, the number of the heat dissipation and low heat generation parts 11 may be two or more instead of one. That is, the heat dissipation and low heat generation part 11 may be provided at a location on the heating surface 10 where lower heat generation is desired than its periphery.

[0040] Moreover, the heating surface 10 with an uneven heating temperature has an unevenness formed due to the shape of the heating head 2. That is, as shown in Fig. 3, the heat dissipation and low heat generation portion 11 has a triangular shape that becomes taller toward the center of the heating surface 10 in the longitudinal direction, and due to this influence, the heating temperature is locally low, particularly in the center of the heating surface 10 in the longitudinal direction, due to heat dissipation from the heat dissipation and low heat generation portion 11. However, the heat dissipation and low heat generation portion 11 may be made of a different material in part or in whole, and the difference in material may affect the distribution of the heating temperature of the heating surface 10.

[0041] (Second embodiment) In the second embodiment, a heating head 2 is used that performs solder joining on an area having solder in two or more places on a single heating surface 10. However, as shown in Fig. 15, a hot bar joining machine 1 may be configured using a heating head 2 that performs solder joining on a solder area 35 having solder in one place on a single heating surface 10.

[0042] Such a hot bar joining machine 1 is used for manufacturing thin electronic devices such as smartphones. Since it is a thin electronic device, a hard and thick epoxy resin board or the like is not used, but a flexible board 36 (FPC: Flexible printed circuits) or the like is used. The flexible board 36 is formed by sandwiching both sides of a foil-like conductive pattern 37 such as copper foil between polyimide films or the like, removing a part of the polyimide film or the like to expose a part of the conductive pattern 37, and forming a solder area 35 in which solder is placed on the surface of the conductive pattern 37. Then, the solder area 35 and its surroundings are heated while being pressed with the heating surface 10 of the heating head 2, and the solder area 35 is solder-joined to a component or the like (not shown).

[0043] Here, during the soldering, as shown in the lower part of Fig. 3, the heating temperature is slightly lowered toward the center in the longitudinal direction of the heating surface 10. This makes it possible for the heating surface 10 to lower the heating temperature in the area where the heat received by the solder area 35 is likely to be trapped, and to make the heat received by the solder area 35 approximately uniform. If the heat received by the solder area 35 is not approximately uniform and is concentrated in a certain area, there is a concern that the flexible substrate 36 will melt and become a defective product. However, there is little concern that such defective soldering will occur.

[0044] The hot bar joining machine 1 according to the second embodiment can also be used for joining resins together without using solder, for example, for hermetically joining resin containers for packaging bread.

[0045] (Third embodiment) A hot bar joining machine 40 according to the third embodiment will be described below with reference to Fig. 15 and Fig. 16. Note that the reference numerals given to the components of the hot bar joining machine 40 according to the third embodiment are the same as those given to the components of the hot bar joining machine 40 having the same functions as those in the above-described present embodiment and comparative example, and the description of each component will be omitted.

[0046] A hot bar joining machine 40 according to the third embodiment has a heating head 2 in which the heating temperature of a portion of the heating surface 10 is set lower than that of other portions of the heating surface 10, and which performs solder joining on an area having solder in two or more places on the heating surface alone, and has a cooling means for cooling only a portion of the heating surface 10.

[0047] Thus, even if the heating head 2 has a heat dissipation and low heat generation portion 11 such that the heating temperature of a portion of the heating surface 10 is set lower than the other portions of the heating surface 10, the temperature of that portion of the heating surface 10 may become higher than the set temperature after long-term use. In such a case, the temperature of only the central portion of the heating surface 10 in the longitudinal direction can be lowered by the cooling means. This makes it possible to provide a hot bar joining machine 40 that is capable of preventing the occurrence of solder bridges with a simple configuration.

[0048] Even if the entire heating surface 10 is set to a substantially constant temperature as shown in FIG. 10, the temperature of a portion of the heating surface 10 can be lowered by a cooling means.

[0049] Also, a part of the heating surface 10 may be the central part in the longitudinal direction of the heating surface 10. It is considered that such a heating head 2 can be designed and manufactured more easily than setting a lower heating temperature for a part other than the central part in the longitudinal direction of the heating surface 10. Also, a part of the heating surface 10 may be provided other than the central part in the longitudinal direction of the heating surface 10.

[0050] Also, a part of the heating surface 10 has a heat dissipation and low heat generation part 11. Due to the presence of the heat dissipation and low heat generation part 11, the temperature of the central region in the length direction of the heating surface can be easily set lower than other regions. Also, a part of the heating surface 10 may not have the heat dissipation and low heat generation part 11. In that case, another measure is required to change the temperature of a part of the heating surface 10.

[0051] On the front side of the heating head 2, a cold air blower 41, which is a cooling means, is provided at a slight distance from the heating head 2. Also, on the rear side of the heating head 2, a temperature sensor 42 is provided at a slight distance from the heating head 2. This temperature sensor 42 mainly senses the area of ​​the heating surface 10 of the heating head 2 where the heat received by the solder is likely to be trapped. Then, when a thermostat or the like detects that the temperature sensor 42 has risen to a predetermined temperature at which there is a risk of a solder bridge occurring, cold air is blown from the cold air blower 41 to cool only the area of ​​the heating surface 10 of the heating head 2 where the heat received by the solder is likely to be trapped.

[0052] Here, "only" in the phrase "having a cooling means for cooling only a part of the heating surface 10" does not mean "only" in the strict sense, and may include, for example, an area outside the periphery of the part of the heating surface 10. Conversely, it may include a case where the area is several tens of percent of the part of the heating surface 10.

[0053] The cooling means may be other than the cold air blower 41, and may include, for example, a room temperature air blower. The means for setting the heating temperature of the central portion in the longitudinal direction of the heating surface 10 lower than that of other portions of the heating surface 10 is not limited to having the heat dissipation and low heat generating portion 11. The hot bar joining machine 40 shown in Fig. 15 and Fig. 16 is obtained by adding conductive plates 3, 4, a cold air blower 41, and a temperature sensor 42 to the heating head 2 shown in Fig. 3 etc.

[0054] Furthermore, in the third embodiment, as in the second embodiment, it goes without saying that the hot bar joining machine 1 may be configured using a heating head 2 that performs solder joining on a solder area 35 having solder in one location on a single heating surface 10.

[0055] (Fourth embodiment) A hot bar joining machine 50 according to the fourth embodiment will be described below with reference to Fig. 18. Note that the reference numerals given to the components of the hot bar joining machine 50 according to the fourth embodiment are the same as those given to the components of the hot bar joining machine 50 having the same functions as those in the above-described present embodiment and comparative example, and the description of each component will be omitted.

[0056] The hot bar joining machine 50 according to the fourth embodiment has a cooling device 51 for cooling a part or the whole of the heat dissipation and low heat generation part 11, and a temperature sensor 52 for measuring the temperature of a part or the whole of the heat dissipation and low heat generation part 11. In addition, it may have an end heating temperature sensor 53 for measuring the temperature of the end of the heating surface 10.

[0057] In addition, the end heating temperature sensor 53 may be applied to a hot bar joining machine 50 equipped with a heating head 2, which has a heating surface 10 with an uneven heating temperature, and which performs solder joining on an area having solder in one place using the heating surface 10 alone, and applies an area of ​​the heating surface 10 with a lower heating temperature to an area where the heat received by the solder is likely to become trapped.

[0058] When the end heating temperature sensor 53 detects the input of the set upper limit temperature, it weakens the heating of the heating head 2 or stops the heating of the heating head 2. When the end heating temperature sensor 53 detects the input of the set lower limit temperature, it strengthens the heating of the heating head 2 or starts the heating of the heating head 2. As shown in FIG. 3, the "end 54" of the heating surface 10 has the highest temperature. When controlling the temperature, the best controllability is achieved by controlling the temperature at the hottest part. For example, the sensitivity of an acceleration sensor is maximized when it is attached to a part that moves quickly. In addition, the "end 54" refers to an area of ​​approximately 1 / 3 of the total length of the heating surface 10 at each end of the length of the heating surface 10, and an area of ​​approximately 1 / 3 of the total length of the heating surface 10 side in the height direction at each end of the length of the heating surface 10.

[0059] The heat dissipation and low heat generation section temperature sensor 52 sets an upper limit and a lower limit temperature below the set temperature of the end heating temperature sensor 53, and when it detects this upper limit temperature, it increases the output of the cooling device 51 or activates the cooling device 51 to cool the heat dissipation and low heat generation section 11. When the heat dissipation and low heat generation section temperature sensor 52 detects the set lower limit temperature, it reduces the output of the cooling device 51 or stops the cooling device 51.

[0060] By automatically controlling this series of operations, the non-uniform temperature distribution on the heating surface 10 of the heating head 2 can be maintained within a set range. [Explanation of symbols]

[0061] 1 Hot bar joining machine 2 Heating Heads 10 Heating surface 11 Heat dissipation and low heat generation parts 20 Solder 21 Solder 22 Solder 40 Hot Bar Jointer 41 Cold air blower (cooling means) 51 Cooling device 52 Temperature sensors for heat dissipation and low heat generation parts 53 Temperature sensor for edge heating

Claims

1. A portion of the heating surface is set lower than other portions of the heating surface, The heating surface alone has a heating head for performing solder bonding on an area having solder at one or more locations, a cooling means for cooling only the portion of the heating surface; Hot bar joining machine.

2. The hot bar joining machine according to claim 1, The portion of the heating surface is a central portion of the heating surface in a longitudinal direction. Hot bar joining machine.

3. The hot bar joining machine according to claim 1, The part of the heating surface has a heat dissipation and low heat generation part. A hot bar joining machine having a heating head.

4. The hot bar joining machine according to claim 2, The part of the heating surface has a heat dissipation and low heat generation part. A hot bar joining machine with a heating head.

5. The hot bar joining machine according to claim 3 or 4, A cooling device is provided for cooling a part or the whole of the heat dissipating and low heat generating parts, a temperature sensor for the heat dissipation and low heat generation portion for measuring the temperature of a part or the whole of the heat dissipation and low heat generation portion; Hot bar joining machine.

6. A hot bar joining machine according to any one of claims 1 to 4, A temperature sensor for edge heating is provided to measure the temperature of the edge of the heating surface. Hot bar joining machine.

7. The hot bar joining machine according to claim 5, A temperature sensor for edge heating is provided to measure the temperature of the edge of the heating surface. Hot bar joining machine.

8. The heating surface has an uneven heating temperature. A solder joint is performed on the heating surface alone in an area having solder at one location; A region of the heating surface having a low heating temperature is applied to a region of the solder where heat is likely to be trapped. Heating head.

9. 9. The heating head according to claim 8, The heating surface having a non-uniform heating temperature is the non-uniformity is formed due to the shape of the heating head; Heating head.

10. The heating surface has an uneven heating temperature. A solder joint is performed on the heating surface alone in an area having solder at one location; A region of the heating surface having a low heating temperature is applied to a region of the solder where heat is likely to be trapped. Heating head, Equipped with a hot bar joining machine.

11. The hot bar joining machine according to claim 10, A temperature sensor for edge heating is provided to measure the temperature of the edge of the heating surface. Hot bar joining machine.

Images