Collector flow ring

Abstract

To provide systems, apparatuses and methods for a collector flow ring (CFR) housing configured to mitigate an accumulation of fuel debris in an extreme ultraviolet (EUV) radiation system.SOLUTION: A CFR housing 502 can include a plurality of showerhead flow channel outlets configured to output a plurality of first gaseous fluid flows to a plurality of portions of a plasma-facing surface of the CFR housing. The example CFR housing can further include a gutter purge flow channel outlet configured to output a second gaseous fluid flow to a fuel debris-receiving surface of the CFR housing. The example CFR housing can further include a shroud mounting structure configured to support a shroud assembly 520, a cooling flow channel configured to transport a fluid, and a plurality of optical metrology ports configured to receive a plurality of optical metrology tubes 528.SELECTED DRAWING: Figure 5

Description

Technical Field

[0001] Cross - Reference to Related Applications

[0001] This application claims the benefit of priority to U.S. Application No. 62 / 953,067, filed Dec. 23, 2019, entitled COLLECTOR FLOW RING, and also claims the benefit of priority to U.S. Application No. 62 / 970,497, filed Feb. 5, 2020, entitled COLLECTOR FLOW RING, the entire disclosures of both applications being incorporated herein by reference in their entirety.

[0002]

[0002] The present disclosure relates to collectors and collector flow rings for extreme ultraviolet (EUV) radiation systems.

Background Art

[0003]

[0003] A lithographic apparatus is a machine that applies a desired pattern onto a substrate, usually onto a target portion of the substrate. A lithographic apparatus can be used, for example, in the manufacture of integrated circuits (ICs). In such a case, a patterning device, also known as a mask or reticle interchangeably, can be used to generate the circuit pattern to be formed on an individual layer of the IC. This pattern can be transferred onto a target portion (e.g., including a part of one or several dies) on a substrate (e.g., a silicon wafer). The transfer of the pattern is usually effected by imaging onto a layer of radiation - sensitive material (e.g., resist) provided on the substrate. Generally, one substrate includes a network of adjacent target portions onto which patterns are sequentially imparted. Conventional lithographic apparatuses include so - called steppers, in which each target portion is irradiated by exposing the entire pattern onto the target portion in one go, and scanners, in which the substrate is scanned synchronously in a given direction (the “scan” direction) parallel or antiparallel, i.e., opposite, to a given direction (the “scan” direction) while scanning the pattern with a radiation beam in the given direction, whereby each target portion is irradiated. It is also possible to transfer the pattern from the patterning device to the substrate by imprinting the pattern onto the substrate.

[0004]

[0004] Extreme ultraviolet (EUV) light, for example, electromagnetic radiation having a wavelength of approximately 50 nanometers (nm) or less (sometimes referred to as soft x-rays) and including light having a wavelength of about 13 nm, may be used to create very small features in or on a substrate, such as a silicon wafer. Methods for generating EUV light include, but are not necessarily limited to, converting a material having an element such as xenon (Xe), lithium (Li), or tin (Sn) and having emission lines within the EUV range into a plasma state. For example, in one such method called laser-produced plasma (LPP), the plasma can be generated by irradiating a target material in the form of, for example, droplets, plates, tapes, streams, or clusters of a material, which may be referred to interchangeably as fuel in the context of an LPP source, with an amplified light beam that may be referred to as a drive laser. In this process, the plasma is typically generated within a sealed container, such as a vacuum chamber, and monitored using various types of measurement equipment.

[0005]

[0005] Inside a traditional tin-based radiation source container, many functions such as a protective hydrogen (H2) gas, thermal shielding, and accurate shroud attachment must take into account the measurement field of view (FOV) and droplet path clearance while preventing tin accumulation. Currently, there are many separate modules used to address each of these problems individually. For example, an active thermal shield absorbs unwanted heat flux, a peripheral flow ring collector module performs shroud attachment, provides a peripheral H2 flow, and notches within these modules account for the measurement FOV and refract stray light. However, this traditional radiation source container does not have hardware to provide a showerhead flow under the flow vanes. Furthermore, there is no way to add either (i) a single module or (ii) a modification of the current modules that would enable the addition of showerhead flow protection.

Summary of the Invention

[0006]

[0006] The present disclosure describes various aspects of systems, apparatuses, and methods for manufacturing and using a collector flow ring (CFR) housing configured to reduce fuel debris accumulation, remove heat, and provide optical measurement, and various other aspects in an extreme ultraviolet (EUV) radiation system.

[0007]

[0007] In some aspects, the present disclosure describes a CFR housing configured to reduce fuel debris accumulation in an EUV radiation system. The CFR housing may include a plurality of showerhead flow path outlets configured to output a plurality of first gas fluid flows to a plurality of portions of the plasma-facing surface of the CFR housing. The CFR housing may further include a groove purge flow path outlet configured to output a second gas fluid flow to the fuel debris receiving surface of the CFR housing. The CFR housing may further include a shroud mounting structure configured to support a shroud assembly. The CFR housing may further include a cooling flow path configured to transport a fluid configured to remove heat from at least a portion of the CFR housing during EUV radiation generation operation of the EUV radiation system. The CFR housing may further include a plurality of optical measurement ports configured to receive a plurality of optical measurement tubes.

[0008]

[0008] In some aspects, the plurality of showerhead flow path outlets, the groove purge flow path outlet, and the plurality of optical measurement ports are disposed, i.e., formed, in a body of the collector flow ring housing that can be a single material.

[0009]

[0009] In one aspect, the present disclosure describes an EUV radiation source. The EUV radiation source may comprise a laser source configured to generate an optical pulse configured to illuminate a fuel material at an irradiation location configured to generate a plasma configured to emit EUV radiation. The EUV radiation source may further comprise a fuel source configured to deliver the fuel material to the irradiation location. The EUV radiation source may further comprise a CFR housing comprising a plurality of showerhead flow path outlets configured to output a plurality of first gas fluid streams to a plurality of portions of a plasma facing surface of the CFR housing. The CFR housing may further comprise a groove purge flow path outlet configured to output a second gas fluid stream to a fuel debris receiving surface of the CFR housing. The CFR housing may further comprise a shroud mounting structure configured to support a shroud assembly. The CFR housing may further comprise a cooling flow path configured to transport a liquid fluid configured to remove heat from at least a portion of the CFR housing during EUV radiation generation operation of the EUV radiation system. The CFR housing may further comprise a plurality of optical measurement ports configured to receive a plurality of optical measurement tubes. The EUV radiation source may further comprise a controller configured to generate a first control signal configured to instruct the laser source to generate an optical pulse. The controller may be further configured to generate a second control signal configured to instruct the fuel source to deliver the fuel material. The controller may be further configured to generate a third control signal configured to instruct a gas fluid source to control the output of a plurality of first gas fluid streams from the plurality of showerhead flow path outlets. The third control signal may be further configured to instruct the gas fluid source to control the output of the second gas fluid stream from the groove purge flow path outlet. The controller may be further configured to generate a fourth control signal configured to instruct a liquid fluid source to control the transport of the liquid fluid in the cooling flow path.

[0010]

[0010] In one aspect, the present disclosure describes a method of manufacturing a CFR housing configured to reduce the accumulation of fuel debris in an extreme ultraviolet (EUV) radiation system. The method may include forming a plurality of showerhead flow path outlets configured to output a plurality of first gas fluid flows to a plurality of portions of a plasma-facing surface of the CFR housing. The method may further include forming a groove purge flow path outlet configured to output a second gas fluid flow to a fuel debris receiving surface of the CFR housing. The method may further include forming a shroud mounting structure configured to support a shroud assembly. The method may further include forming a cooling flow path configured to transport a fluid configured to remove heat from at least a portion of the CFR housing during an EUV radiation generation operation of the EUV radiation system. The method may further include forming a plurality of optical measurement ports configured to receive a plurality of optical measurement tubes.

[0011]

[0011] Further features and the structure and operation of various aspects are described in detail below with reference to the accompanying drawings. Note that the present disclosure is not limited to the specific aspects described herein. Such aspects are shown herein for illustrative purposes only. Further aspects will be apparent to those skilled in the art based on the teachings contained herein.

Brief Description of the Drawings

[0012]

[0012] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate the invention and, together with the description, serve to explain the principles of the aspects of the present disclosure and enable those skilled in the art to make and use the aspects of the present disclosure.

[0013]

Figure 1A

[0013] It is a schematic diagram of an exemplary reflective lithographic apparatus according to some aspects of the present disclosure.

Figure 1B

[0014] It is a schematic diagram of an exemplary transmissive lithographic apparatus according to some aspects of the present disclosure.

Figure 2

[0015] It is a more detailed schematic diagram of the reflective lithography apparatus shown in FIG. 1A according to some aspects of the present disclosure.

Figure 3

[0016] It is a schematic diagram of an exemplary lithography cell according to some aspects of the present disclosure.

Figure 4

[0017] It is a schematic diagram of an exemplary radiation source of an exemplary reflective lithography apparatus according to some aspects of the present disclosure.

Figure 5

[0018] It is a schematic diagram of an exemplary collector flow ring according to some aspects of the present disclosure.

Figure 6A

[0019] It is a schematic diagram of each part of an exemplary area of an exemplary collector flow ring according to some aspects of the present disclosure.

Figure 6B

[0019] It is a schematic diagram of each part of an exemplary area of an exemplary collector flow ring according to some aspects of the present disclosure.

Figure 6C

[0019] It is a schematic diagram of each part of an exemplary area of an exemplary collector flow ring according to some aspects of the present disclosure.

Figure 6D

[0019] It is a schematic diagram of each part of an exemplary area of an exemplary collector flow ring according to some aspects of the present disclosure.

Figure 7

[0020] It is a flowchart showing an example of a method for manufacturing an apparatus or one or more parts thereof according to some aspects of the present disclosure.

[0014]

[0021] The features and advantages of the present invention will become more apparent from the detailed description set forth below when interpreted in conjunction with the drawings. In the drawings, generally, unless otherwise indicated, like reference numerals indicate the same, functionally similar, and / or structurally similar elements. Further, generally, the leftmost digit of a reference numeral identifies the drawing in which the reference numeral is first shown. Unless otherwise indicated, the drawings provided throughout the present disclosure should not be construed as being to scale.

Mode for Carrying Out the Invention

[0015]

[0022] This specification discloses one or more embodiments incorporating the features of the present disclosure. The one or more disclosed embodiments merely illustrate the present disclosure. The scope of the present disclosure is not limited to the one or more disclosed embodiments. The breadth and scope of the present disclosure are defined by the claims appended hereto and their equivalents.

[0016]

[0023] When referring to one or more of the described embodiments and in this specification to "one embodiment", "an embodiment", "exemplary embodiment", "exemplary embodiments", etc., it indicates that the described embodiments can include specific features, structures, or characteristics, but each embodiment may not necessarily include the specific features, structures, or characteristics. Further, such phrases do not necessarily refer to the same embodiment. Further, when a specific feature, structure, or characteristic is described in relation to an embodiment, it is understood that such feature, structure, or characteristic can be practiced in relation to other embodiments, whether explicitly described or not, within the knowledge of those skilled in the art.

[0017]

[0024] Spatially relative terms such as "beneath", "below", "lower", "above", "on", "upper", etc. may be used herein to facilitate description of the relationship of one element or function to another element or one or more other functions as shown in the figures. Spatially relative terms are intended to encompass various orientations of the device in use or operation in addition to the orientation shown in the figures. The device may be otherwise oriented (rotated 90 degrees or other orientations), and the spatially relative descriptors used herein may be interpreted accordingly.

[0018]

[0025] As used herein, the term "about" refers to a value of a given quantity that can vary based on a particular technique. Based on a particular technique, the term "about" can refer to, for example, a value of a given quantity that varies within a range of 10-30% of that value (e.g., ±10%, ±20%, or ±30% of that value).

[0019] Overview

[0026] In contrast to conventional radiation source containers, the present disclosure provides a radiation source container having a collector flow ring (CFR) that integrates many individual modules into a single device, and in many cases, many features form part of a single machined part that modularizes the radiation source container. For example, the radiation source containers disclosed herein move the peripheral flow function from the radiation collector to the CFR, move the shroud attachment function from the radiation collector to the CFR, and add a purge flow function to the CFR. Further, the radiation source containers disclosed herein add a showerhead flow function for cleaning the plasma-facing surface and a purge flow function for preventing tin from overflowing from the heating grooves below the flow vanes to the CFR. In some aspects, by moving the peripheral flow ring from the radiation collector to the CFR and integrating these functions into a single device, the radiation source containers disclosed herein improve maintainability and upgradability and reduce hardware costs.

[0020]

[0027] In some embodiments, the CFR disclosed herein integrates all of the functions of thermal shielding, shroud attachment, stray light deflection, droplet passage, measurement FOV, plasma-facing surface gas protection, guiding flow into grooves to prevent overflow, and other functions disclosed herein into a single device. In some embodiments, the CFR disclosed herein provides an exhaust path for the measurement flow. In some embodiments, the CFR disclosed herein provides space for a removable insert (referred to herein as a tin writing insert) for cleaning the tin writing. In some embodiments, the CFR disclosed herein can handle higher power (e.g., 350 W) than conventional radiation source containers (e.g., 250 W). In some embodiments, the CFR disclosed herein may have a maintainability of less than about 2 hours for a 7-year lifespan. In some embodiments, the CFR disclosed herein guides the radiation collector to avoid interference and accurately position the radiation collector.

[0021]

[0028] In some embodiments, the CFR disclosed herein integrates the following functions into a single assembly. That is, a peripheral flow ring shape for divided peripheral flow, a showerhead flow applied to the plasma-facing surface to keep the surface tin-free, a groove purge flow applied to prevent tin from overflowing out of the grooves of the flow vanes, supplying the showerhead flow and the groove flow and providing less than about 3% non-uniformity, measurement FOV for a plurality of measurement ports (e.g., 13 measurement ports), active cooling to release heat, shroud attachment, stray light deflection, a placeholder for tin writing insert design (e.g., providing the ability to upgrade the tin writing insert), the flexible seal includes a measurement flow discharge means and can adapt to misalignment of the CFR position, and a precisely manufactured guide rail for providing a path for installation on the radiation collector and an alignment within about 1 mm, 100 microns, about 10 microns, or about 1 micron.

[0022]

[0029] In some embodiments, the CFR disclosed herein integrates the following features.

[0030] 1. A single device that integrates the functions of the above modules and has new functions of showerhead flow, enabling the integration of thermal cooling, gas flow, and precise alignment into a single device.

[0031] 2. Showerhead flow: H2 flow protection (pecre) of the plasma-facing surface to keep it tin-free.

[0032] 3. Groove purge flow: The flow used to prevent the overflow of tin flowing inside the flow vane grooves.

[0033] 4. Shared plenum for showerhead flow and groove flow: A shared plenum of H2 by passive means and a predictable and uniform flow outlet from a single inlet source.

[0034] 5. A single device design that integrates thermal shield, precise mounting, collector guidance, flow supply, droplet passage, and optical FOV passage.

[0035] 6. Collector guidance: A guide rail that guides a radiation collector to a mounted position accurately positioned along a safe path (e.g., within an allowable range of about 1 mm, 100 microns, about 10 microns, or about 1 micron).

[0036] 7. Measurement flow seal: A resistance seal that can narrow the gap between the inner wall of the radiation source container and the measurement tube of the CFR within the position allowable range of the CFR (e.g., within an allowable range of about 1 mm, 100 microns, about 10 microns, or about 1 micron).

[0037] 8. A cooling water channel in the H2 plenum having a combined structure of an O-ring and a gasket seal that enables the thermal path to be shorter than the conventional design.

[0038] 9. Self-centering precise shroud mounting. The shroud may be configured to protect the fuel target (e.g., droplets).

[0039] 10. Interference fit measurement tube sealing that uses an inserted measurement tube to seal the breakthrough that may occur during the piercing operation of fitting a tube (e.g., an interference fit tube for sealing the flow between plenums).

[0040] 11. A choke / restriction flow structure that provides low non-uniformity using one inlet and a shared plenum.

[0041] 12. Stray light scattered within a metrology tube having custom threading.

[0023]

[0042] The radiation source containers and CFRs disclosed herein have many advantages and benefits. For example, various aspects of the present disclosure provide modularity (e.g., improved maintainability, high upgradability), improved performance (e.g., more functions included in a single device), improved availability (e.g., reduced tin deposition and faster maintainability compared to conventional radiation source containers), and cost reduction (e.g., incorporating peripheral flow functions into the CFR may be less expensive than incorporating peripheral flow functions into a radiation collector as in conventional designs).

[0024]

[0043] Before detailing such aspects, it may be useful to present an exemplary environment in which embodiments of the present invention can be implemented.

[0025] Exemplary Lithography System

[0044] FIGS. 1A and 1B are schematic diagrams of a lithography apparatus 100 and a lithography apparatus 100', respectively, in which aspects of the present disclosure can be implemented. As shown in FIGS. 1A and 1B, the lithography apparatuses 100 and 100' are shown from a perspective perpendicular to the XZ plane (e.g., the X-axis points to the right and the Z-axis points up) (e.g., side view), while the patterning device MA and the substrate W are shown from a different perspective perpendicular to the XY plane (e.g., the X-axis points to the right and the Y-axis points up) (e.g., top view).

[0026]

[0045] The lithographic apparatuses 100 and 100’ each comprise the following. An illumination system IL (e.g., an illuminator) configured to condition a radiation beam B (e.g., a deep ultraviolet (DUV) radiation beam or an extreme ultraviolet (EUV) radiation beam), a support structure MT (e.g., a mask table) connected to a first positioner PM configured to support a patterning device MA (e.g., a mask, a reticle, or a dynamic patterning device) and configured to accurately position the patterning device MA, and a substrate holder such as a substrate table WT (e.g., a wafer table) connected to a second positioner PW configured to hold a substrate W (e.g., a resist-coated wafer) and configured to accurately position the substrate W. The lithographic apparatuses 100 and 100’ also have a projection system PS configured to project a pattern imparted to the radiation beam B by the patterning device MA onto a target portion C (e.g., a portion including one or more dies) of the substrate W. In the lithographic apparatus 100, the patterning device MA and the projection system PS are reflective. In the lithographic apparatus 100’, the patterning device MA and the projection system PS are transmissive.

[0027]

[0046] The illumination system IL can include various types of optical components such as refractive, reflective, catadioptric, magnetic, electromagnetic, electrostatic, or other types of optical components, or any combination thereof, for directing, shaping, or controlling the radiation beam B.

[0028]

[0047] The support structure MT holds the patterning device MA in a manner that depends on the orientation of the patterning device MA relative to the reference frame, conditions such as the design of at least one of the lithographic apparatuses 100 and 100', and whether the patterning device is held in a vacuum environment. The support structure MT can hold the patterning device MA using mechanical, vacuum, electrostatic, or other clamping techniques. The support structure MT may be, for example, a frame or a table, and may be stationary or movable as required. By using sensors, the support structure MT can ensure that the patterning device MA is in the desired position, for example, relative to the projection system PS.

[0029]

[0048] The term "patterning device" MA should be interpreted broadly to refer to any device that can be used to impart a pattern to a cross-section of the radiation beam B, for example, to generate a pattern in a target portion C of the substrate W. The pattern imparted to the radiation beam B may correspond to a particular functional layer in the device being generated in the target portion C to form an integrated circuit.

[0030]

[0049] The patterning device MA may be transmissive (as in the lithographic apparatus 100' of FIG. 1B) or reflective (as in the lithographic apparatus 100 of FIG. 1A). Examples of the patterning device MA include a reticle, a mask, a programmable mirror array, or a programmable LCD panel. Masks include mask types such as binary masks, Levenson-type phase-shift masks, or halftone-type phase-shift masks, and further various hybrid mask types. An example of a programmable mirror array employs a matrix array of small mirrors that can be individually tilted so as to reflect an incident radiation beam in different directions. The tilted mirrors impart a pattern to the radiation beam B reflected by the matrix of small mirrors.

[0031]

[0050] As used herein, the term "projection system" PS may include any type of projection system, including refractive, reflective, magnetic, electromagnetic, electrostatic, or any combination thereof, suitable for the exposure radiation used or for other elements such as the use of an immersion liquid or the use of a vacuum. Other gases may absorb too much radiation or electrons, so a vacuum environment may be used for EUV or electron beam radiation. Thus, a vacuum environment may be provided throughout the beam path using a vacuum wall and a vacuum pump.

[0032]

[0051] The lithographic apparatus 100 and / or the lithographic apparatus 100' may be of a type having two (dual stage) or more substrate tables WT (and / or two or more mask tables). In such a "multi-stage" machine, additional substrate tables WT may be used in parallel, or preparation steps may be carried out on one or more other tables while one or more substrate tables WT are being used for exposure. In certain situations, the additional table may not be a substrate table WT.

[0033]

[0052] The lithographic apparatus may be of a type that can cover at least a portion of the substrate with a liquid having a relatively high refractive index, such as water, so as to fill the space between the projection system and the substrate. The immersion liquid can also be applied to other spaces in the lithographic apparatus, such as, for example, between the mask and the projection system. Immersion techniques are provided to increase the numerical aperture of the projection system. As used herein, the term "immersion" does not mean that a structure such as a substrate must be submerged in a liquid, but rather means that a liquid is present between the projection system and the substrate during exposure.

[0034]

[0053] Referring to FIGS. 1A and 1B, the illumination system IL receives a radiation beam B from a radiation source SO. For example, when the radiation source SO is an excimer laser, the radiation source SO may be a separate physical entity from the lithographic apparatuses 100, 100'. In this case, the radiation source SO is not considered to form part of the lithographic apparatus 100 or 100', and the radiation beam B passes from the radiation source SO through a beam delivery system BD (shown in FIG. 1B), for example, comprising suitable guiding mirrors and / or a beam expander, to the illumination system IL. In other cases, for example, when the radiation source SO is a mercury lamp, the radiation source SO may be an integral part of the lithographic apparatuses 100, 100'. The radiation source SO and the illuminator IL, and also the beam delivery system BD if required, may together be referred to as a radiation system.

[0035]

[0054] The illumination system IL may comprise an adjuster AD (for example, as shown in FIG. 1B) for adjusting the angular intensity distribution of the radiation beam. In general, at least the outer and / or inner radial ranges of the intensity distribution in the pupil plane of the illuminator (commonly referred to as "σ-outer" and "σ-inner" respectively) can be adjusted. The illumination system IL may also comprise various other components (for example, as shown in FIG. 1B), such as an integrator IN and a radiation collector CO (for example, a condenser or collector system). The illumination system IL may be used to adjust the radiation beam B in order to obtain a desired uniformity and intensity distribution in the beam cross-section.

[0036]

[0055] Referring to Figure 1A, the radiation beam B is incident on a patterning device MA (e.g., a mask) held by a support structure MT (e.g., a mask table), and is patterned by the patterning device MA. In the lithographic apparatus 100, the radiation beam B is reflected from the patterning device MA. After being reflected from the patterning device MA, the radiation beam B passes through a projection system PS. The projection system PS focuses the radiation beam B onto a target portion C of a substrate W. With the help of a second positioner PW and a position sensor IFD2 (e.g., an interference device, a linear encoder, or a capacitance sensor), the substrate table WT can be accurately moved (e.g., to position different target portions C in the path of the radiation beam B). Similarly, using a first positioner PM and another position sensor IFD1 (e.g., an interference device, a linear encoder, or a capacitance sensor), the patterning device MA can be accurately positioned with respect to the path of the radiation beam B. Mask alignment marks M1 and M2 and substrate alignment marks P1 and P2 can be used to align the patterning device MA and the substrate W.

[0037]

[0056] Referring to Figure 1B, the radiation beam B is incident on a patterning device MA held by a support structure MT, and is patterned by the patterning device MA. After passing through the patterning device MA, the radiation beam B passes through a projection system PS. The projection system PS focuses the beam onto a target portion C of a substrate W. The projection system has a pupil PPU conjugate to an illumination system pupil IPU. A part of the radiation results from the intensity distribution at the illumination system pupil IPU, crosses the mask pattern without being affected by diffraction in the mask pattern, and creates an image of the intensity distribution at the illumination system pupil IPU.

[0038]

[0057] The projection system PS projects an image MP' of the mask pattern MP. The image MP' is formed on a resist layer coated on the substrate W by diffracted beams generated from the mask pattern MP by radiation from the intensity distribution. For example, the mask pattern MP may include an array of lines and spaces. From those that are not zero-order diffraction in the radiation diffraction in the array, induced diffracted beams whose directions change in a direction perpendicular to the lines are generated. The non-diffracted beam (e.g., the so-called zero-order diffracted beam) traverses the pattern without changing its propagation direction. The zero-order diffracted beam reaches the conjugate pupil PPU by traversing the upper lens or the upper lens group of the projection system PS upstream of the conjugate pupil PPU of the projection system PS. The portion of the intensity distribution on the plane of the conjugate pupil PPU related to the zero-order diffracted beam is an image of the intensity distribution of the illumination system pupil IPU of the illumination system IL. The aperture device PD is arranged, for example, in or substantially in a plane including the conjugate pupil PPU of the projection system PS.

[0039]

[0058] The projection system PS is arranged to capture not only the zero-order diffracted beam but also the first-order or higher-order diffracted beams (not shown) using the lens or lens group L. In some embodiments, in order to utilize the resolution improvement effect of dipole illumination, dipole illumination for imaging a line pattern extending in a direction perpendicular to the lines can be used. For example, the first-order diffracted beam interferes with the corresponding zero-order diffracted beam at the level of the substrate W to create an image of the mask pattern MP at the highest possible resolution and process window (e.g., the depth of focus that can be used in combination with the allowable exposure dose deviation). In some embodiments, the spherical aberration can be reduced by providing radiation poles (not shown) in the opposing quadrants of the illumination system pupil IPU. Further, in some embodiments, the spherical aberration can be reduced by blocking the zero-order beam at the conjugate pupil PPU of the projection system associated with the radiation poles in the opposing quadrants. This is described in more detail in U.S. Patent No. 7,511,799, issued March 31, 2009, which is hereby incorporated by reference in its entirety.

[0040]

[0059] With the aid of the second positioner PW and the position sensor IFD (e.g., an interference device, a linear encoder, or a capacitance sensor), the substrate table WT can be accurately moved (e.g., to position different target portions C along the path of the radiation beam B). Similarly, with the first positioner PM and another position sensor (not shown in FIG. 1B), the patterning device MA can be accurately positioned with respect to the path of the radiation beam B (e.g., after mechanical retrieval of the mask library or during scanning).

[0041]

[0060] Generally, the movement of the support structure MT can be realized with the help of a long-stroke positioner (coarse positioning) and a short-stroke positioner (fine positioning) that form part of the first positioner PM. Similarly, the movement of the substrate table WT can be realized using a long-stroke positioner and a short-stroke positioner that form part of the second positioner PW. In the case of a stepper (in contrast to a scanner), the support structure MT may be connected to or fixed to only the short-stroke actuator. The patterning device MA and the substrate W can be aligned using mask alignment marks M1, M2 and substrate alignment marks P1, P2. Substrate alignment marks as shown occupy dedicated target portions, but may also be located in the space between the target portions (e.g., scribe line alignment marks). Similarly, in a situation where a plurality of dies are provided on the patterning device MA, the mask alignment marks may be arranged between the dies.

[0042]

[0061] The support structure MT and the patterning device MA may be within the vacuum chamber V. Using an in-vacuum robot IVR, patterning devices such as masks can be moved into and out of the vacuum chamber. Alternatively, when the support structure MT and the patterning device MA are outside the vacuum chamber, an out-of-vacuum robot can be used for various transport operations, similar to the in-vacuum robot IVR. In some cases, both the in-vacuum and out-of-vacuum robots need to be calibrated for the smooth movement of any payload (e.g., a mask) to a fixed kinematic mount of a relay station.

[0043]

[0062] The illustrated lithographic apparatuses 100 and 100’ can be used in at least one of the following modes.

[0063] 1. In the step mode, while the support structure MT and the substrate table WT are basically maintained in a stationary state, the entire pattern imparted to the radiation beam B is projected onto the target portion C at once (i.e., single static exposure). Next, the substrate table WT is moved in the X direction and / or the Y direction so that another target portion C can be exposed.

[0064] 2. In the scan mode, while the support structure MT and the substrate table WT are scanned synchronously, the pattern imparted to the radiation beam B is projected onto the target portion C (i.e., single dynamic exposure). The speed and direction of the substrate table WT relative to the support structure MT (e.g., mask table) can be determined by the magnification (reduction) and image inversion characteristics of the projection system PS.

[0065] 3. In another mode, the support structure MT holds the programmable patterning device MA and is maintained substantially stationary while moving or scanning the substrate table WT and projecting the pattern imparted to the radiation beam B onto the target portion C. A pulsed radiation source SO can be used, and the programmable patterning device MA is updated as necessary each time the substrate table WT is moved or between successive radiation pulses during scanning. This mode of operation is readily applicable to maskless lithography using a programmable patterning device such as a programmable mirror array.

[0044]

[0066] Combinations and / or variations of the usage modes described above, or entirely different usage modes, can also be utilized.

[0045]

[0067] In a further aspect, the lithographic apparatus 100 comprises an EUV source. The EUV source is configured to generate an EUV radiation beam for EUV lithography. Generally, the EUV source is configured within a radiation system, and a corresponding illumination system is configured to condition the EUV radiation beam of the EUV source.

[0046]

[0068] FIG. 2 shows in more detail a lithographic apparatus 100 comprising a radiation source SO (e.g., a source collector apparatus), an illumination system IL, and a projection system PS. As shown in FIG. 2, the lithographic apparatus 100 is shown from a perspective perpendicular to the XZ plane (e.g., the X-axis points to the right and the Z-axis points upwards) (e.g., a side view).

[0047]

[0069] The radiation source SO is constructed and arranged to maintain a vacuum environment within the closed structure 220. The radiation source SO includes a source chamber 211 and a collector chamber 212 and is configured to generate and transmit EUV radiation. The EUV radiation may be generated by a gas or vapor, such as xenon (Xe) gas, lithium (Li) vapor, or tin (Sn) vapor, that is generated such that the EUV radiation emitting plasma 210 emits radiation within the EUV range of the electromagnetic spectrum. The at least partially ionized EUV radiation emitting plasma 210 may be generated, for example, by a discharge or a laser beam. For efficient radiation generation, for example, Xe gas, Li vapor, Sn vapor, or any other suitable gas or vapor with a partial pressure of about 10.0 pascals (Pa) may be used. In some aspects, an excited tin plasma is supplied to generate EUV radiation.

[0048]

[0070] The radiation emitted by the EUV radiation emitting plasma 210 is sent from the source chamber 211 into the collector chamber 212 through an optional gas barrier or contaminant trap 230 (e.g., sometimes also referred to as a contaminant barrier or foil trap) disposed within or behind the opening of the source chamber 211. The contaminant trap 230 may include a channel structure. The contaminant trap 230 may also include a gas barrier or a combination of a gas barrier and a channel structure. The contaminant trap 230 further shown herein includes at least a channel structure.

[0049]

[0071] The collector chamber 212 may comprise a radiation collector CO (e.g., a condenser or collector system) which may be a so-called grazing incidence collector. The radiation collector CO has an upstream radiation collector side 251 and a downstream radiation collector side 252. Radiation traversing the radiation collector CO may be reflected by the grating spectral filter 240 and focused onto a virtual light source point IF. The virtual light source point IF is generally referred to as an intermediate focus, and the source collector apparatus is arranged such that the virtual light source point IF is located at or near the aperture 219 of the closed structure 220. The virtual light source point IF is an image of the EUV radiation emitting plasma 210. The grating spectral filter 240 is used in particular to suppress infrared (IR) radiation.

[0050]

[0072] Subsequently, the radiation traverses the illumination system IL. The illumination system IL may comprise a facet field mirror device 222 and a facet pupil mirror device 224 arranged to provide a desired angular distribution of the radiation beam 221 in the patterning device MA and a desired radiation intensity uniformity in the patterning device MA. When the radiation beam 221 is reflected by the patterning device MA held by the support structure MT, a patterned beam 226 is formed, and this patterned beam 226 is imaged onto a substrate W held by a wafer stage or a substrate table WT via reflection elements 228, 229 by the projection system PS.

[0051]

[0073] In general, the illumination system IL and the projection system PS may have more elements than shown. The grating spectral filter 240 may optionally be present depending on the type of lithographic apparatus. Furthermore, there may be more mirrors than shown in FIG. 2. For example, the projection system PS may have 1 to 6 additional reflection elements compared to that shown in FIG. 2.

[0052]

[0074] As shown in FIG. 2, the radiation collector CO is shown as a nested collector having grazing incidence reflectors 253, 254, and 255 as merely an example of a collector (or collector mirror). The grazing incidence reflectors 253, 254, and 255 are arranged axially symmetrically about the optical axis O, and this type of radiation collector CO is preferably used in combination with a discharge-produced plasma (DPP) source.

[0053] Exemplary lithography cell

[0075] FIG. 3 shows a lithography cell 300, which may also be referred to as a litho cell or a cluster. The lithography apparatus 100 or 100' may form part of the lithography cell 300. Also, the lithography cell 300 may comprise one or more devices for performing pre-exposure processes and post-exposure processes on a substrate. For example, these devices may comprise a spin coater SC for depositing a resist layer, a developer DE for developing the exposed resist, a cooling plate CH, and a bake plate BK. A substrate handler RO (e.g., a robot) retrieves substrates from the input / output ports I / O1 and I / O2, moves them between the various process devices, and delivers them to the loading bay LB of the lithography apparatus 100 or 100'. These devices are often collectively referred to as a track and are under the control of a track control unit TCU. The TCU itself is controlled by a supervisory control system SCS, which also controls the lithography apparatus via a lithography control unit LACU. Thus, these various devices may be operated to maximize throughput and processing efficiency.

[0054] Exemplary radiation source

[0076] An example of a radiation source SO for an exemplary reflective lithography apparatus is shown in FIG. 4. As shown in FIG. 4, the radiation source SO is shown from a viewpoint perpendicular to the following XY plane (e.g., a top view).

[0055]

[0077] The radiation source SO shown in FIG. 4 is of a type that may be referred to as a laser-produced plasma (LPP) source. For example, carbon dioxide (CO2 )A laser system 401 that may include a laser is arranged to impart energy to a fuel target 403', such as one or more individual tin (Sn) droplets provided by a fuel target generator 403 (e.g., a fuel ejector, a droplet generator), via one or more laser beams 402. According to some aspects, the laser system 401 may be a pulsed continuous wave or quasi-continuous wave laser, or may operate like a pulsed continuous wave or quasi-continuous wave laser. The trajectory of the fuel target 403' (e.g., a droplet) ejected from the fuel target generator 403 may be parallel to the X-axis. According to some aspects, one or more laser beams 402 propagate in a direction parallel to the Y-axis perpendicular to the X-axis. The Z-axis is perpendicular to both the X-axis and the Y-axis and extends generally into (or out in front of) the plane of the paper, although in other aspects, other configurations may be used. In some embodiments, the laser beam 402 may propagate in a direction other than parallel to the Y-axis, i.e., in a direction other than perpendicular to the X-axis direction of the trajectory of the fuel target.

[0056]

[0078] Although tin is referred to in the following description, any suitable target material can be used. The target material can be, for example, in a liquid state and can be, for example, a metal or an alloy. The fuel target generator 403 may include a nozzle configured to direct tin in the form of a fuel target 403' (e.g., individual droplets) along a trajectory towards a plasma formation region 404. Throughout the remainder of the description, references to "fuel," "fuel target," or "fuel droplet" should be understood to refer to the target material (e.g., droplets) ejected by the fuel target generator 403. The fuel target generator 403 may include a fuel ejector. One or more laser beams 402 are incident on the target material (e.g., tin) in the plasma formation region 404. The accumulation of laser energy within the target material generates a plasma 407 in the plasma formation region 404. Radiation, including EUV radiation, is emitted from the plasma 407 during de-excitation and recombination of the ions and electrons of the plasma.

[0057]

[0079] EUV radiation is collected and focused by collector 405 (e.g., radiation collector CO). In some embodiments, collector 405 may include a near-normal incidence radiation collector (which may more generally be referred to as a normal incidence radiation collector). Collector 405 may be a multilayer mirror structure arranged to reflect EUV radiation (e.g., EUV radiation having a desired wavelength such as about 13.5 nm). According to some embodiments, collector 405 may have an elliptical configuration with two foci. As discussed herein, the first focus may be in plasma formation region 404 and the second focus may be in intermediate focus 406.

[0058]

[0080] In some embodiments, laser system 401 may be located relatively far from radiation source SO. In such a case, one or more laser beams 402 may be passed from laser system 401 to radiation source SO with the aid of, for example, a suitable steering mirror and / or beam expander, and / or a beam delivery system (not shown) comprising other optics. Laser system 401 and radiation source SO may be considered as a radiation system as a whole.

[0059]

[0081] The radiation reflected by collector 405 forms radiation beam B. Radiation beam B is focused at a point (e.g., intermediate focus 406) that serves as a virtual radiation source for illumination system IL (see FIG. 2) and forms an image of plasma formation region 404. The point at which radiation beam B is focused may be referred to as an intermediate focus (e.g., intermediate focus 406). Radiation source SO is arranged such that intermediate focus 406 is located at or near aperture 408 of the enclosure 409 of radiation source SO.

[0060]

[0082] The radiation beam B passes from the radiation source SO into the illumination system IL. The illumination system IL is configured to condition the radiation beam B. The radiation beam B travels from the illumination system IL and impinges on a patterning device MA held by a support structure MT. The patterning device MA reflects the radiation beam B and imparts a pattern thereto. After being reflected from the patterning device MA, the patterned radiation beam B enters a projection system PS. The projection system comprises a plurality of mirrors configured to project the radiation beam B onto a substrate W held on a substrate table WT. The projection system PS can apply a reduction factor to the radiation beam and form an image having features smaller than the corresponding features on the patterning device MA. For example, a reduction factor of 4 can be applied. In FIG. 2, the projection system PS is shown as having two mirrors, but the projection system can comprise any number of mirrors (e.g., six mirrors).

[0061]

[0083] The radiation source SO can also comprise components not shown in FIG. 4. For example, a spectral filter can be provided in the radiation source SO. The spectral filter can be substantially transmissive to EUV radiation but substantially block other radiation wavelengths such as infrared radiation.

[0062]

[0084] The radiation source SO (or radiation system) can further comprise a fuel target imaging system for obtaining an image of the fuel target (e.g., a droplet) in the plasma formation region 404, and more specifically, for obtaining an image of the shadow of the fuel target. The fuel target imaging system can detect light diffracted from the edge of the fuel target. References to the image of the fuel target in the following description should be understood to also refer to the image of the shadow of the fuel target, or the diffraction pattern produced by the fuel target.

[0063]

[0085] The fuel target imaging system may comprise a light detector such as a CCD array or a CMOS sensor, but it will be understood that any imaging device suitable for obtaining an image of the fuel target may be used. It will be understood that the fuel target imaging system may comprise optical components such as one or more lenses in addition to the light detector. For example, the fuel target imaging system may comprise a camera 410, such as a combination of a light sensor (i.e., a light detector) and one or more lenses. The optical components may be selected such that the light sensor or camera 410 obtains a near-field image and / or a far-field image. The camera 410 may be positioned at any suitable location within the radiation source SO such that the camera has a clear view of one or more markers (not shown in FIG. 4) provided on the plasma formation region 404 and the collector 405. However, in order to avoid damage to the camera 410, it may be necessary to position the camera 410 at a location away from the propagation path of the one or more laser beams 402 and the trajectory of the fuel target emitted from the fuel target generator 403. In some embodiments, the camera 410 is configured to provide an image of the fuel target to the controller 411 via the connection 412. Although the connection 412 is shown as a wired connection, it will be understood that the connection 412 (and other connections referred to herein) may be implemented as a wired connection, a wireless connection, or a combination thereof.

[0064]

[0086] As shown in FIG. 4, the radiation source SO may include a fuel target generator 403 configured to generate a fuel target 403' (e.g., individual tin droplets) and emit it toward the plasma formation region 404. The radiation source SO may further include a laser system 401 configured to collide one or more laser beams 402 with one or more of the fuel targets 403' to generate a plasma 407 in the plasma formation region 404. The radiation source SO may further include a collector 405 (e.g., radiation collector CO) configured to collect the radiation emitted by the plasma 407. In some embodiments, among several features, in particular, to reduce the accumulation of fuel debris (e.g., tin) in the radiation source SO, a collector flow ring CFR (not shown in FIG. 4) can be disposed adjacent to the collector 405. The collector flow ring CFR may be disposed along an axis parallel to the X-axis (e.g., near the trajectory of the fuel target 403' emitted from the fuel target generator 403).

[0065] Exemplary collector flow ring

[0087] FIG. 5 shows an exploded view of an exemplary collector flow ring (CFR) 500 that can be disposed adjacent to a radiation collector CO (e.g., the collector 405 shown in FIG. 4) of a radiation source SO of an exemplary reflective lithographic apparatus to reduce the accumulation of fuel debris (e.g., tin) in the radiation source SO. The CFR 500 may be arranged to direct a flow into the collector 405 and may reduce the accumulation of fuel debris (e.g., tin debris) in the radiation source SO. In some embodiments, the total weight of the exemplary CFR 500 may be less than about 200 kilograms (kg) or less than about 150 kg. In some embodiments, when there is no cooling fluid supply 506 and gas supply 524, the total size of the exemplary CFR 500 may be about 1.2 m × 1.0 m × 90 mm (e.g., the thickness of the CFR housing 502). In some embodiments, when including the cooling fluid supply 506 and gas supply 524, the total size of the exemplary CFR 500 may be about 1.2 m × 1.0 m × 800 mm, although other sizes may be used in other embodiments.

[0066]

[0088] In some embodiments, an exemplary CFR500 may include a CFR housing 502 configured to reduce the accumulation of fuel debris (such as tin) in an EUV radiation system (such as the radiation source SO shown in FIGS. 1A and 4). In some embodiments, the CFR housing 502 may be formed of aluminum (Al) or may include aluminum (Al). In some embodiments, the CFR housing 502 may include a coating of at least one material selected from the group consisting of titanium nitride (TiN), tin (Sn), and nickel (Ni).

[0067]

[0089] In some embodiments, the CFR housing 502 may include a plurality of showerhead flow path outlets configured to output a plurality of first gas fluid flows (such as H2 flows) to a plurality of portions of the plasma-facing surface of the CFR housing 502. In some embodiments, the CFR housing 502 may include a groove purge flow path outlet configured to output a second gas fluid flow (such as an H2 flow) to the fuel debris receiving surface of the CFR housing 502. In some embodiments, the plurality of showerhead flow path outlets and the groove purge flow path outlet may be configured to be fluidly coupled to a gas fluid chamber configured to provide a set non-uniformity of the gas fluid flow of less than about 5 percent, less than about 3 percent, or less than about 1 percent between the plurality of first gas fluid flows and the second gas fluid flow.

[0068]

[0090] In some embodiments, the CFR housing 502 may comprise a shroud mounting structure configured to support a shroud assembly 520 including, but not limited to, a ceramic shroud, for example, configured to protect a fuel target (e.g., fuel target 403'). In some embodiments, the CFR housing 502 may comprise a cooling channel configured to transport a fluid (e.g., water, deionized water, refrigerant, nanofluid including nanoparticles, or any other suitable fluid) configured to remove heat from at least a portion of the CFR housing 502 during EUV radiation generation operation of the EUV radiation system. In some embodiments, the CFR housing 502 may comprise a plurality of optical measurement ports configured to receive a plurality of optical measurement tubes. In some embodiments, the CFR housing 502 may comprise a plurality of thermometry channels configured to support a plurality of thermometry devices (e.g., thermocouple-based devices). In some embodiments, the CFR housing 502 may comprise a weight reduction cavity 522 configured to reduce the total mass of the CFR housing 502 and change the center of gravity of the CFR housing 502 (e.g., for balancing the CFR housing 502).

[0069]

[0091] In some embodiments, the CFR housing 502 may include a plurality of collector guide rail attachment structures 540 configured to couple to a plurality of collector guide rails 542. In some embodiments, the plurality of collector guide rails 542 may be configured to guide the radiation collector CO to an attachment position accurately positioned (e.g., within a tolerance of about 1 mm, 100 microns, about 10 microns, or about 1 micron) with respect to a collector such as collector 405 in FIG. 4 along a safe path. For example, the plurality of collector guide rails 542 may be a pair of precisely manufactured guide rails that provide a path for installation on the radiation collector CO and an alignment within about 1 mm, 100 microns, about 10 microns, or about 1 micron. In some embodiments, an exemplary CFR 500 may include a plurality of CFR mounts 544 configured to couple to the plurality of collector guide rails 542 and attach the exemplary CFR 500 to the radiation collector CO (see FIG. 2).

[0070]

[0092] In some embodiments, an exemplary CFR 500 may include a coolant channel assembly 504 (including, but not limited to, coolant channels and coolant connections, valves, or both), a coolant supply 506 (e.g., a water supply), and a coolant channel cover 508. In some embodiments, the coolant channel assembly 504 may include coolant channels within a gas plenum having an O-ring and gasket seal structure that allows the heat path to be shorter than in conventional designs. In some embodiments, the coolant channel assembly 504 provides active cooling to dissipate heat from an exemplary CFR 500, the CFR housing 502, or any component included in or mechanically connected to these. In some embodiments, the coolant channel assembly 504 may be bolted to a flat interface surface of the CFR housing 502. In some embodiments, the bottom surface of the water channel bottom may also be coated with tin to enhance the heat transfer effect.

[0071]

[0093] In some embodiments, an exemplary CFR500 may comprise a sheet 510 that has no affinity for tin. Optionally, the exemplary CFR500 may comprise a tin writing insert 512, or a placeholder for a tin writing insert design that provides the ability to upgrade the tin writing insert 512.

[0072]

[0094] In some embodiments, an exemplary CFR500 may comprise a shroud assembly 520 that can be a precision shroud attachment configured to self - center. In some embodiments, an exemplary CFR500 may comprise a gas fluid source such as a gas supply 524 (e.g., H2 supply). In some embodiments, an exemplary CFR500 may comprise a thermocouple access panel 526 that is removably attached to the CFR housing 502 and is configured to access a plurality of thermometry devices disposed in a plurality of thermometry channels of the CFR housing 502. For example, an exemplary CFR500 may comprise four thermocouple devices (e.g., two thermocouple devices on each side of the exemplary CFR500).

[0073]

[0095] In one aspect, an exemplary CFR500 may include a plurality of optical measurement tubes 528 configured to provide a measurement FOV for a plurality of optical measurement ports (e.g., 13 measurement ports) disposed via a CFR housing 502. In some aspects, an exemplary CFR500 may include a plurality of optical measurement surface seals 530 that may be resistive seals configured to reduce the gap between the inner surface of the CFR housing 502 and the optical measurement tubes 528 within the positional tolerance of the exemplary CFR500 (e.g., within a tolerance of about 1 mm, 100 microns, about 10 microns, or about 1 micron). In some aspects, the plurality of optical measurement surface seals 530 may be flexible seals that include a measurement flow discharge means and can accommodate misalignment of the position of the exemplary CFR500. In some aspects, an exemplary CFR500 may provide an interference fit optical measurement tube seal that uses the optical measurement tubes 528 inserted to seal through-holes that may occur during a piercing operation to fit the optical measurement tubes 528 (e.g., interference fit tubes for sealing the flow between plenums).

[0074]

[0096] FIGS. 6A, 6B, 6C, and 6D are schematic views of portions of an exemplary region of an exemplary CFR600 according to some aspects of the present disclosure.

[0075]

[0097] FIG. 6A shows a cutaway of a first exemplary region of an exemplary CFR600 including a CFR housing 602 according to some aspects of the present disclosure. In some aspects, the overall size of the CFR housing 602 may be about 1.2 m × 1.0 m × 90 mm, although in other embodiments, various other suitable sizes may be used.

[0076]

[0098] The CFR housing 602 may include a plurality of showerhead flow path outlets 604 configured to output a plurality of first gas fluid flows to a plurality of portions of the plasma-facing surface 602a of the CFR housing 602. The CFR housing 602 may include a groove purge flow path outlet 606 configured to output a second gas fluid flow to the fuel debris receiving surface 602b of the CFR housing 602.

[0077]

[0099] The CFR housing 602 may include a cooling channel 612 configured to transport a liquid fluid configured to remove heat from at least a portion of the CFR housing 602 during EUV radiation generation operation of the EUV radiation system. The CFR housing 602 may include a cooling fluid channel cover 614 configured to seal (e.g., at least partially) the cooling channel 612.

[0078]

[0100] The CFR housing 602 may include a plurality of optical measurement ports 616 configured to receive and support a plurality of optical measurement tubes 618. In some embodiments, the plurality of showerhead flow path outlets 604, the groove purge flow path outlets 606, and the plurality of optical measurement ports 616 may be disposed on the body of the CFR housing 602, which may be a single component or part.

[0079]

[0101] The CFR housing 602 may include a peripheral flow path outlet 620 configured to output a peripheral gas fluid flow to the surface of the peripheral flow ring 622 of the CFR housing 602. The peripheral flow ring 622 may include a hole sieve ring for regulating the peripheral gas fluid flow to promote uniformity. The peripheral skin plate 624 may be welded to the bottom of the CFR housing 602 by aerodynamic protrusions that provide rigidity and a constant gap thickness so that the peripheral gas fluid flow is fully developed and uniform.

[0080]

[0102] In some embodiments, the CFR housing 602 may include a plurality of collector guide rail attachment structures configured to couple to a plurality of collector guide rails such as collector guide rail 626.

[0081]

[0103] FIG. 6B shows a cutout of a second exemplary region of an exemplary CFR600 according to some embodiments of the present disclosure. As shown in FIG. 6B, the CFR housing 602 may include a gas supply 628 (e.g., a gas fluid source such as an H2 supply).

[0082]

[0104] Figure 6C shows a cutout of an exemplary third exemplary region of a CFR600 according to some aspects of the present disclosure. As shown in Figure 6C, the CFR housing 602 may include an optical measurement surface seal 630 configured to attach one of a plurality of optical measurement tubes 618 to the CFR housing 602.

[0083]

[0105] Figure 6D shows a portion of an exemplary fourth exemplary region of an exemplary CFR600 according to some aspects of the present disclosure. As shown in Figure 6D, the CFR housing 602 may include a showerhead flow distribution plenum 680 that may be a first chamber configured to receive one inlet fluidly connected to the gas supply 628 and configured to spread the flow as widely as possible around the CFR. The CFR housing 602 may include a showerhead flow expansion plenum 682 that may be configured to slow the flow, perform pressure accumulation for the outlet flow, and assist in distribution to the farthest flow locations. Although not shown in Figure 6D, the showerhead flow distribution plenum 680 may be fluidly coupled to the showerhead flow expansion plenum 682. The CFR housing 602 may include a peripheral flow distribution plenum 684 that may be configured to receive flow from one inlet and spread that flow as widely as possible. The peripheral flow distribution plenum 684 may be machined and sealed with an aluminum skin plate from the bottom. The CFR housing 602 may include a peripheral flow expansion plenum 686 that may have a function substantially similar to that of the showerhead flow expansion plenum 682 (e.g., to slow the gas, expand the gas to perform a certain pressure accumulation, and assist in distribution). The peripheral flow expansion plenum 686 may be machined and the bottom of the CFR housing 602 may be sealed with a peripheral skin plate 624 (e.g., an aluminum skin plate).

[0084]

[0106] As further shown in FIG. 6D, the plurality of showerhead flow path outlets 604 and the groove purge flow path outlets 606 can be manufactured by any of a variety of suitable methods, such as machining the counterbore holes at an accurate angle. Each hole angle determines a limited length that must be equal through all the holes so that the flow is uniform. The counterbore provides a development length such that the flow fully develops and exits.

[0085]

[0107] In some embodiments, the gas fluid flow (e.g., about 0.5 bar of H2 generated by a gas fluid source) passing through (a) the showerhead flow distribution plenum 680, the showerhead flow expansion plenum 682, the plurality of showerhead flow path outlets 604, and the groove purge flow path outlets 606, and (b) the peripheral flow distribution plenum 684, the peripheral flow expansion plenum 686, and the peripheral flow path outlet 620 may be configured to result in a gas flow collective non-uniformity of less than about 5 percent, less than about 3 percent, or less than about 1 percent among the plurality of first gas fluid flows (e.g., output from the plurality of showerhead flow path outlets 604 at about 15 to 50 standard liters per minute (slm)), the second gas fluid flow (e.g., output from the groove purge flow path outlets 606 at about 15 to 50 slm), and the third gas fluid flow (e.g., output from the peripheral flow path outlet 620 at about 50 to 130 slm). In some embodiments, the gas fluid flow may be configured to result in a collective pressure drop of less than about 15 kilopascals (kPa), 10 kPa, or 5 kPa among the plurality of first gas fluid flows, the second gas fluid flow, and the third gas fluid flow. In some embodiments, the gas fluid flow may be configured to result in a flow distribution of the plurality of first gas fluid flows and the second gas fluid flows of about 70 percent and about 30 percent, respectively. In some embodiments, the gas fluid flow may be configured to result in a flow distribution of the third gas fluid flow of about 50 percent upward flow (e.g., across the plasma facing surface 602a) and 50 percent flow toward the radiation collector CO. In other embodiments, various other flow rates and relative flow rates may be used.

[0086] Exemplary process for manufacturing a CFR housing

[0108] FIG. 7 is an exemplary method 700 of manufacturing a CFR housing (e.g., CFR housing 502 or 602) or a (one or more) portion thereof configured to reduce the accumulation of fuel debris in an EUV radiation system, according to some aspects of the present disclosure. The operations described with reference to exemplary method 700 may be performed by, or in accordance with, any of the systems, devices, components, techniques, or combinations thereof described herein, such as those described with reference to FIGS. 1 - 6.

[0087]

[0109] In operation 702, the method may include forming a plurality of showerhead flow path outlets (e.g., a plurality of showerhead flow path outlets 604) configured to output a plurality of first gas fluid flows to a plurality of portions of a plasma-facing surface (e.g., plasma-facing surface 602a) of the CFR housing. In some aspects, the formation of the plurality of showerhead flow path outlets may be achieved using suitable mechanical or other methods and may include forming the plurality of showerhead flow path outlets according to any of the aspects or combinations of aspects described with reference to FIGS. 1 - 6.

[0088]

[0110] In operation 704, the method may include forming a groove purge flow path outlet (e.g., groove purge flow path outlet 606) configured to output a second gas fluid flow to a fuel debris receiving surface (e.g., fuel debris receiving surface 602b) of the CFR housing. In some aspects, the formation of the groove purge flow path outlet may be achieved using suitable mechanical or other methods and may include forming the groove purge flow path outlet according to any of the aspects or combinations of aspects described with reference to FIGS. 1 - 6.

[0089]

[0111] In operation 706, the method may include forming a shroud mounting structure configured to support a shroud assembly (e.g., shroud assembly 520). In some aspects, the formation of the shroud mounting structure is achieved using suitable mechanical or other methods and may include forming the shroud mounting structure according to any of the aspects or combinations of aspects described with reference to FIGS. 1-6.

[0090]

[0112] In operation 708, the method may include forming a cooling channel (e.g., cooling channel 612) configured to transport a fluid configured to remove heat from at least a portion of the CFR housing during EUV radiation generation operation of the EUV radiation system. In some aspects, the formation of the cooling channel is achieved using suitable mechanical or other methods and may include forming the cooling channel according to any of the aspects or combinations of aspects described with reference to FIGS. 1-6.

[0091]

[0113] In operation 710, the method may include forming a plurality of optical measurement ports (e.g., a plurality of optical measurement ports 616) configured to receive a plurality of optical measurement tubes. In some aspects, the formation of the plurality of optical measurement ports may be achieved using suitable mechanical or other methods and may include forming the plurality of optical measurement ports according to any of the aspects or combinations of aspects described with reference to FIGS. 1-6.

[0092]

[0114] Optionally, the method may include forming a first gas fluid chamber (e.g., showerhead flow expansion plenum 682) configured to be fluidly coupled to a plurality of showerhead flow path outlets and groove purge flow path outlets. Optionally, the method may further include forming a second gas fluid chamber (e.g., showerhead flow distribution plenum 680) configured to be fluidly coupled to the first gas fluid chamber. In some embodiments, the gas fluid source is configured to output a gas fluid (e.g., H2) that flows through (i) the first gas fluid chamber, then (ii) the second gas fluid chamber, and finally (iii) the plurality of showerhead flow path outlets and groove purge flow path outlets, resulting in a gas flow collective non-uniformity of less than about 5 percent, less than about 3 percent, or less than about 1 percent between the plurality of first gas fluid flows and the second gas fluid flows.

[0093]

[0115] Optionally, the method may include forming a weight reduction cavity (e.g., weight reduction cavity 522 of FIG. 5) configured to reduce the total mass of the CFR housing, change the center of gravity of the CFR housing, or both. Optionally, the method may include forming a plurality of thermal measurement channels configured to support a plurality of thermal measurement devices (e.g., thermocouple-based devices). Optionally, the method may include forming a plurality of collector guide rail attachment structures (e.g., plurality of collector guide rail attachment structures 540) configured to couple to a plurality of collector guide rails (e.g., plurality of collector guide rails 542). Optionally, the method may include forming a CFR housing of Al. Optionally, the method may further include forming a coating of at least one material selected from the group consisting of TiN, Sn, or Ni.

[0094] Exemplary EUV radiation source having a CFR housing

[0116] In one aspect, the present disclosure provides an EUV radiation source (e.g., radiation source SO) that includes a laser source (e.g., laser system 401) configured to generate an optical pulse (e.g., one or more laser beams 402) configured to illuminate a fuel material (e.g., one or more of fuel targets 403') at an irradiation location (e.g., plasma formation region 404) configured to generate a plasma (e.g., plasma 407) configured to emit EUV radiation.

[0095]

[0117] The EUV radiation source may further include a fuel source (e.g., fuel target generator 403) configured to deliver the fuel material to the irradiation location.

[0096]

[0118] The EUV radiation source may further include a CFR housing (e.g., CFR housings 502, 602). The CFR housing may include a plurality of showerhead flow path outlets (e.g., the plurality of showerhead flow path outlets 604) configured to output a plurality of first gas fluid flows to a plurality of portions of the plasma facing surface of the CFR housing (e.g., the plasma facing surface 602a). The CFR housing may further include a groove purge flow path outlet (e.g., the groove purge flow path outlet 606) configured to output a second gas fluid flow to the fuel debris receiving surface of the CFR housing (e.g., the fuel debris receiving surface 602b). The CFR housing may further include a shroud mounting structure configured to support a shroud assembly (e.g., the shroud assembly 520). The CFR housing may further include a cooling flow path (e.g., the cooling flow path 612) configured to transport a liquid fluid configured to remove heat from at least a portion of the CFR housing during the EUV radiation generation operation of the EUV radiation system. The CFR housing may further include a plurality of optical measurement ports (e.g., the plurality of optical measurement ports 616) configured to receive a plurality of optical measurement tubes (e.g., the plurality of optical measurement tubes 618). In some aspects, the CFR housing may further include a weight reduction cavity (e.g., the weight reduction cavity 522) configured to reduce the total mass of the CFR housing and change the center of gravity of the CFR housing. In some aspects, the CFR housing may further include a plurality of collector guide rail mounting structures (e.g., the plurality of collector guide rail mounting structures 540) configured to couple to a plurality of collector guide rails (e.g., the plurality of collector guide rails 542).

[0097]

[0119] In some embodiments, the plurality of showerhead flow path outlets may be configured to be fluidly coupled to a gas fluid chamber (e.g., showerhead flow distribution plenum 680, showerhead flow expansion plenum 682) that is configured to be fluidly coupled to a gas fluid source. In some embodiments, the groove purge flow path is configured to be fluidly coupled to the gas fluid chamber. In some embodiments, the EUV radiation source may include a third control signal configured to direct control of a third gas fluid flow flowing through the gas fluid chamber. In some embodiments, the third gas fluid flow flowing through the gas fluid chamber may be configured to result in a collective non-uniformity of the gas fluid flow of less than about 5 percent between the plurality of first gas fluid flows and the second gas fluid flow.

[0098]

[0120] In some embodiments, the plurality of showerhead flow path outlets, the groove purge flow path outlet, and the plurality of optical measurement ports are disposed on the body of the collector flow ring housing (e.g., a single material). In some embodiments, the weight reduction cavity 522 of FIG. 5 is also formed in the body, e.g., a single material. In some embodiments, the collector flow ring housing may include aluminum (Al). In some embodiments, the collector flow ring housing may include a coating of at least one material selected from the group consisting of titanium nitride (TiN), tin (Sn), or nickel (Ni).

[0099]

[0121] The EUV radiation source may further include a controller (e.g., controller 411) configured to generate a first control signal configured to instruct the laser source to generate optical pulses. The controller may be further configured to generate a second control signal configured to instruct the fuel source to deliver fuel material. The controller may be further configured to generate a third control signal configured to instruct the gas fluid source (e.g., gas supplies 524, 628) to control the output of a plurality of first gas fluid flows from a plurality of showerhead flow path outlets. The third control signal may be further configured to instruct the gas fluid source to control the output of a second gas fluid flow from the groove purge flow path outlet. The controller may be further configured to generate a fourth control signal configured to instruct the liquid fluid source (e.g., coolant supply 506) to control the transport of liquid fluid in the cooling flow path.

[0100]

[0122] The EUV radiation source may further include a plurality of thermometry devices (e.g., thermocouple-based devices) configured to generate a plurality of thermometry signals related to the CFR housing and transmit the plurality of thermometry signals to the controller. The CFR housing may further include a plurality of thermometry channels configured to support the plurality of thermometry devices. The controller may be further configured to receive the plurality of thermometry signals from the plurality of thermometry devices and generate a plurality of thermometry values (e.g., temperature values, temperature gradients, heat fluxes, and other suitable values) related to the CFR housing based on the received plurality of thermometry signals.

[0101]

[0123] Although this document particularly refers to the use of a lithographic apparatus in the manufacture of ICs, it should be appreciated that the lithographic apparatus described herein may have other applications. For example, this can be in the manufacture of integrated optical systems, guidance and detection patterns for magnetic domain memories, flat panel displays, LCDs, thin film magnetic heads, etc. In light of such alternative applications, it will be recognized by those skilled in the art that when the terms "wafer" or "die" are used herein, they may be regarded as synonymous with the more general terms "substrate" or "target portion" respectively. The substrates described herein can be processed, before or after exposure, for example, by a track unit (a tool typically applying a layer of resist to the substrate and developing the exposed resist), a metrology unit and / or an inspection unit. Appropriately, the disclosure herein can be applied to the above and other substrate processing tools. Further, the substrate can be processed multiple times, for example, to create a multi-layer IC, and thus the term "substrate" as used herein can also refer to a substrate that already includes multiple processed layers.

[0102]

[0124] It should be understood that the terminology or jargon in this document is for the purpose of explanation and not for the purpose of limitation, and thus, the terminology or jargon in this document should be interpreted by those skilled in the art in light of the teachings herein.

[0103]

[0125] The term "substrate" as used herein describes a material onto which a material layer is added. In some embodiments, the substrate itself may be patterned, and the material added thereon may or may not be patterned.

[0104]

[0126] The examples disclosed herein illustrate, but do not limit, embodiments of this disclosure. Other suitable modifications and adaptations of various conditions and parameters that are commonly found in this technical field and are considered obvious to those skilled in the art are also within the spirit and scope of this disclosure.

[0105]

[0127] While specific aspects of the present disclosure have been described above, it will be understood that these aspects may be implemented in ways other than those described. This description is not intended to limit the embodiments of the present disclosure.

[0106]

[0128] It should be understood that the detailed description section, rather than the background, summary, and abstract sections, is intended to be used to interpret the claims. The summary and abstract sections may illustrate one or more, but not all, of the exemplary embodiments contemplated by the inventors, and thus are in no way intended to limit the embodiments of the invention and the appended claims.

[0107]

[0129] Some aspects of the present disclosure have been described above using functional building blocks that illustrate the implementation of specific functions and their relationships. In this specification, the boundaries of these functional building blocks are arbitrarily defined for convenience of explanation. Alternative boundaries can also be defined as long as the specific functions and their relationships are appropriately implemented.

[0108]

[0130] The foregoing description of specific aspects of the present disclosure has sufficiently clarified the overall nature of the aspects so that, by applying knowledge in the art, such specific aspects can be easily modified and / or adapted to various uses without undue experimentation and without departing from the overall concept of the present disclosure. Accordingly, such adaptations and modifications are intended to be within the meaning and scope of equivalents of the disclosed aspects based on the teachings and guidance presented herein.

[0109]

[0131] The embodiments of the present disclosure may be further described using the following clauses. 1. A collector flow ring housing for reducing the accumulation of fuel debris in an extreme ultraviolet (EUV) radiation system, a plurality of showerhead flow path outlets for outputting a plurality of first gas fluid flows to a plurality of portions of a plasma-facing surface of the collector flow ring housing, A groove purge flow path outlet that outputs a second gas fluid flow to the fuel debris receiving surface of the collector flow ring housing, A shroud mounting structure that supports a shroud assembly, A cooling flow path that transports a fluid for removing heat from at least a part of the collector flow ring housing during the EUV radiation generation operation of the EUV radiation system, and A collector flow ring housing including a plurality of optical measurement ports that receive a plurality of optical measurement tubes. 2. A plurality of showerhead flow path outlets are fluidly coupled to a gas fluid chamber, A groove purge flow path is fluidly coupled to the gas fluid chamber, The gas fluid chamber results in a gas fluid flow collective non-uniformity of less than about 5 percent between a plurality of first gas fluid flows and a second gas fluid flow, the collector flow ring housing of clause 1. 3. A plurality of showerhead flow path outlets, a groove purge flow path outlet, and a plurality of optical measurement ports are disposed in a single material forming a body of the collector flow ring housing, the collector flow ring housing of clause 1. 4. Formed in the body of the collector flow ring housing, Reducing the total mass of the collector flow ring housing, The collector flow ring housing of clause 3, further comprising a weight reduction cavity that changes the center of gravity of the collector flow ring housing. 5. The collector flow ring housing of clause 1, further comprising a plurality of thermal measurement channels that support a plurality of thermal measurement devices. 6. The collector flow ring housing of clause 1, further comprising a plurality of collector guide rail mounting structures that couple to a plurality of collector guide rails. 7. The collector flow ring housing of clause 1, wherein the collector flow ring housing includes aluminum (Al). 8. The collector flow ring housing of clause 1, further including a coating of at least one material selected from the group consisting of titanium nitride (TiN), tin (Sn), and nickel (Ni). 9. A laser source that generates an optical pulse for irradiating a fuel material at an irradiation location where a plasma that emits EUV radiation is generated, A fuel source that delivers the fuel material to the irradiation location, An extreme ultraviolet (EUV) radiation source comprising a collector flow ring housing, wherein the collector flow ring housing has a plurality of showerhead flow path outlets that output a plurality of first gas fluid flows to a plurality of portions of a plasma-facing surface of the collector flow ring housing, a groove purge flow path outlet that outputs a second gas fluid flow to a fuel debris receiving surface of the collector flow ring housing, a shroud mounting structure that supports a shroud assembly, and a cooling flow path that transports a liquid fluid for removing heat from at least a part of the collector flow ring housing during EUV radiation generation operation of the EUV radiation system. An extreme ultraviolet (EUV) radiation source comprising the same. 10. A plurality of optical measurement ports that receive a plurality of optical measurement tubes, and generate a first control signal for instructing the laser source to generate an optical pulse, generate a second control signal for instructing the fuel source to deliver the fuel material, generate a third control signal for instructing a gas fluid source to control the output of a plurality of first gas fluid flows from a plurality of showerhead flow path outlets, and further instructing the gas fluid source to control the output of a second gas fluid flow from the groove purge flow path outlet, A controller that generates a fourth control signal for instructing a liquid fluid source to control the transport of the liquid fluid in the cooling flow path. The EUV radiation source according to clause 9 comprising the same. 11. The plurality of showerhead flow path outlets are fluidly coupled to a gas fluid chamber that is fluidly coupled to a gas fluid source, the groove purge flow path is fluidly coupled to the gas fluid chamber, the third control signal instructs the gas fluid source to control a third gas fluid flow passing through the gas fluid chamber, An EUV radiation source according to clause 10, wherein a third gas fluid flow passing through the gas fluid chamber results in a collective non-uniformity of the gas fluid flow of less than about 5 percent between the plurality of first gas fluid flows and the second gas fluid flow. 12. An EUV radiation source according to clause 10, wherein a plurality of showerhead flow path outlets, groove purge flow path outlets, and a plurality of optical measurement ports are disposed in a single material forming the body of the collector flow ring housing. 13. The collector flow ring housing is formed in the body of the collector flow ring housing, reduces the total mass of the collector flow ring housing, and further comprises a weight reduction cavity that changes the center of gravity of the collector flow ring housing, for the EUV radiation source of clause 12. 14. Further comprising a plurality of thermal measurement devices that generate a plurality of thermal measurement signals related to the collector flow ring housing and transmit the plurality of thermal measurement signals to a controller, the collector flow ring housing further comprises a plurality of thermal measurement channels that support the plurality of thermal measurement devices, and the controller further receives the plurality of thermal measurement signals from the plurality of thermal measurement devices and generates a plurality of thermal measurement values related to the collector flow ring housing based on the received plurality of thermal measurement signals, for the EUV radiation source of clause 10. 15. An EUV radiation source according to clause 10, wherein the collector flow ring housing further comprises a plurality of collector guide rail mounting structures that couple to a plurality of collector guide rails. 16. A method of manufacturing a collector flow ring housing that reduces the accumulation of fuel debris in an extreme ultraviolet (EUV) radiation system, comprising: forming a plurality of showerhead flow path outlets in the body of the collector flow ring housing that output a plurality of first gas fluid flows to a plurality of portions of the plasma-facing surface of the collector flow ring housing; forming a groove purge flow path outlet in the body of the collector flow ring housing that outputs a second gas fluid flow to the fuel debris receiving surface of the collector flow ring housing; forming a shroud mounting structure that supports a shroud assembly; Forming a cooling flow path for transporting a fluid that removes heat from at least a portion of a collector flow ring housing during EUV radiation generation operation of an EUV radiation system, and Forming, in a body of the collector flow ring housing, a plurality of optical measurement ports that receive a plurality of optical measurement tubes, a method comprising. 17. Providing a first gas fluid chamber fluidly coupled to a plurality of showerhead flow path outlets and groove purge flow path outlets, Providing a second gas fluid chamber fluidly coupled to the first gas fluid chamber, comprising The method of clause 16, wherein the first gas fluid chamber and the second gas fluid chamber result in a collective non-uniformity of gas flow of less than about 5 percent between the plurality of first gas fluid flows and the second gas fluid flows. 18. Further comprising reducing the total mass of the collector flow ring housing, Forming, in a body of the collector flow ring housing, a weight reduction cavity that changes the center of gravity of the collector flow ring housing, the method of clause 16. 19. The method of clause 16, further comprising forming a plurality of thermal measurement channels that support a plurality of thermal measurement devices. 20. Further comprising forming a plurality of collector guide rail attachment structures that couple to a plurality of collector guide rails, the method of clause 16, wherein the collector flow ring housing is formed of aluminum (Al).

[0110]

[0132] The width and scope of the present disclosure should not be limited by any of the above exemplary aspects or embodiments, but should be defined only in accordance with the following claims and their equivalents.

Claims

1. 1. A collector flow ring housing for mitigating fuel debris accumulation in an extreme ultraviolet (EUV) radiation system, comprising: a plurality of showerhead channel outlets that output a plurality of first gas fluid streams to a plurality of portions of a plasma-facing surface of the collector flow ring housing; a groove purge channel outlet for outputting a second gaseous fluid flow to a fuel debris receiving surface of the collector flow ring housing; a shroud mounting structure supporting the shroud assembly; a cooling passage for transporting a fluid to remove heat from at least a portion of the collector flow ring housing during EUV radiation generating operation of the EUV radiation system; and A collector flow ring housing having a plurality of optical measurement ports for receiving a plurality of optical measurement tubes.

2. the plurality of showerhead channel outlets are fluidly coupled to a gas fluid chamber; the groove purge passage is fluidly coupled to the gas fluid chamber; The collector flow ring housing of claim 1 , wherein said gas fluid chamber provides a collective gas fluid flow non-uniformity of less than about 5 percent between said plurality of first gas fluid streams and said second gas fluid stream.

3. 2. The collector flow ring housing of claim 1, wherein the plurality of showerhead channel outlets, the groove purge channel outlets, and the plurality of optical metrology ports are disposed in a single piece of material forming a body of the collector flow ring housing.

4. formed in the body of the collector flow ring housing; Reducing the total mass of the collector flow ring housing; 4. The collector flow ring housing of claim 3, further comprising a weight reduction cavity that alters the center of gravity of said collector flow ring housing.

5. The collector flow ring housing of claim 1 further comprising a plurality of thermal measurement channels supporting a plurality of thermal measurement devices.

6. 2. The collector flow ring housing of claim 1, further comprising a plurality of collector guide rail mounting structures coupled to the plurality of collector guide rails.

7. The collector flow ring housing of claim 1 , wherein said collector flow ring housing comprises aluminum (Al).

8. 10. The collector flow ring housing of claim 1, further comprising a coating of at least one material selected from the group consisting of titanium nitride (TiN), tin (Sn), and nickel (Ni).

9. a laser source generating light pulses that irradiate the fuel material at an irradiation location generating a plasma that emits EUV radiation; a fuel source for delivering said fuel material to said irradiation location; a collector flow ring housing; The collector flow ring housing comprises: a plurality of showerhead channel outlets that output a plurality of first gas fluid streams to a plurality of portions of a plasma-facing surface of the collector flow ring housing; a groove purge channel outlet for outputting a second gaseous fluid flow to a fuel debris receiving surface of the collector flow ring housing; A shroud mounting structure that supports the shroud assembly; and 1. An extreme ultraviolet (EUV) radiation source comprising: a cooling passage for transporting a liquid fluid to remove heat from at least a portion of the collector flow ring housing during EUV radiation generating operation of the EUV radiation system.

10. a plurality of optical measurement ports for receiving a plurality of optical measurement tubes; and generating a first control signal directing the laser source to generate the light pulse; generating a second control signal directing the fuel source to deliver the fuel material; generating a third control signal directing a gas fluid source to control output of the plurality of first gas fluid flows from the plurality of showerhead channel outlets, the third control signal further directing the gas fluid source to control output of the second gas fluid flow from the groove purge channel outlet; 10. The EUV radiation source of claim 9, comprising a controller generating a fourth control signal directing a liquid fluid source to control transport of the liquid fluid in the cooling channel.

11. the plurality of showerhead channel outlets are fluidly coupled to a gas fluid chamber that is fluidly coupled to the gas fluid source; the groove purge passage is fluidly coupled to the gas fluid chamber; the third control signal directs the gas fluid source to control a third gas fluid flow through the gas fluid chamber; 11. The EUV radiation source of claim 10, wherein the third gas fluid flow passing through the gas fluid chamber results in a collective gas fluid flow non-uniformity between the plurality of first gas fluid flows and the second gas fluid flow of less than about 5 percent.

12. 11. The EUV radiation source of claim 10, wherein the showerhead channel outlets, the groove purge channel outlet, and the optical metrology ports are disposed in a single piece of material forming a body of the collector flow ring housing.

13. the collector flow ring housing is formed in the body of the collector flow ring housing; Reducing the total mass of the collector flow ring housing; The EUV radiation source of claim 12 , further comprising a weight reduction cavity that alters a center of gravity of the collector flow ring housing.

14. a plurality of thermal measurement devices generating a plurality of thermal measurement signals associated with the collector flow ring housing and transmitting the plurality of thermal measurement signals to the controller; the collector flow ring housing further comprising a plurality of thermal measurement channels supporting the plurality of thermal measurement devices; The EUV radiation source of claim 10 , wherein the controller is further configured to receive the plurality of thermal measurement signals from the plurality of thermal measurement devices and generate a plurality of thermal measurements associated with the collector flow ring housing based on the received plurality of thermal measurement signals.

15. The EUV radiation source of claim 10 , wherein the collector flow ring housing further comprises a plurality of collector guide rail mounting structures coupled to a plurality of collector guide rails.

16. 1. A method of manufacturing a collector flow ring housing for mitigating fuel debris accumulation in an extreme ultraviolet (EUV) radiation system, comprising: forming a plurality of showerhead channel outlets in a body of the collector flow ring housing for outputting a plurality of first gas fluid streams to a plurality of portions of a plasma-facing surface of the collector flow ring housing; forming a groove purge passage outlet in the body of the collector flow ring housing for outputting a second gaseous fluid flow to a fuel debris receiving surface of the collector flow ring housing; forming a shroud mounting structure supporting the shroud assembly; forming a cooling passage for transporting a fluid to remove heat from at least a portion of the collector flow ring housing during EUV radiation generating operation of the EUV radiation system; and forming a plurality of optical measurement ports in the body of the collector flow ring housing for receiving a plurality of optical measurement tubes.

17. providing a first gas fluid chamber fluidly coupled to the plurality of showerhead channel outlets and to the groove purge channel outlet; providing a second gas fluid chamber fluidly coupled to the first gas fluid chamber.

17. The method of claim 16, wherein the first gas fluid chamber and the second gas fluid chamber provide a collective gas flow non-uniformity of less than about 5 percent between the plurality of first gas fluid streams and the second gas fluid stream.

18. Reducing the total mass of the collector flow ring housing; The method of claim 16 , further comprising forming a weight reduction cavity in the body of the collector flow ring housing that alters the center of gravity of the collector flow ring housing.

19. The method of claim 16 , further comprising forming a plurality of thermal measurement channels supporting a plurality of thermal measurement devices.

20. 20. The method of claim 16, further comprising forming a plurality of collector guide rail mounting structures coupled to a plurality of collector guide rails, the collector flow ring housing being formed from aluminum (Al).

Images