Method and device for detaching stamp

Abstract

To provide a method for detaching a stamp from a substrate, in particular a master stamp and / or a product.SOLUTION: Provided is a method for detaching a stamp (17) from a substrate (12), in particular from a master stamp (12) and / or from a product. In this case, the stamp (17) is deformed in a direction of the substrate (12) in order to detach the stamp (17) from the substrate (12).SELECTED DRAWING: Figure 2e

Description

Technical Field

[0001] The present invention describes a method and an apparatus for peeling a stamp.

[0002] The prior art includes various apparatuses and methods for manufacturing and using stamps. Stamps are roughly classified into hard stamps and / or soft stamps. One special form of a soft stamp is a film stamp made of a relatively thin film, on which an embossing pattern is formed. In this case, the film and the embossing pattern form a soft stamp. In the prior art, the use of soft stamps is particularly preferred. Soft stamps do wear out earlier than hard stamps, but can be replicated extremely quickly. A very expensive hard stamp, which is precisely manufactured, is used as a master stamp, and a soft stamp is manufactured as a negative of this hard stamp. Therefore, this soft stamp is a so-called working stamp. Therefore, the product embossing material to be embossed with the actual product is processed only by the soft stamp, while the hard stamp is safely stored and protected. However, a problem that frequently occurs in the prior art remains regarding the release of the soft stamp from the master stamp or from the product embossing material.

[0003] Hard stamps have an extremely long service life, but have the drawback that it is relatively difficult to perform demolding without the risk of at least partial destruction of the pattern in the nanometer range and / or micrometer range. In contrast, soft stamps wear out extremely early. Easy demolding is possible, inter alia, as a result of elasticity and very low bending resistance. Due to both characteristics, the soft stamp can be pulled off, or at least bent to such an extent that the soft stamp can be continuously, i.e., stepwise, pulled off from the embossed material. Soft stamps of course have extremely low hardness values and are therefore relatively easy to wear. Therefore, soft stamps have to be newly formed from the master stamp continuously.

[0004] Therefore, the object of the present invention is to eliminate the drawbacks of the prior art and, in particular, to facilitate the peeling of a stamp (= soft stamp), hereinafter also referred to as a working stamp, from a master stamp (= hard stamp) and / or the embossed material. This object is solved by the subject matter of the parallel independent claims. All combinations consisting of at least two features described in the description, claims, and / or drawings are also within the scope of the present invention. In the numerical ranges described, values within the above ranges are also considered to be those disclosed as limit values and should be claimed in any combination.

[0005] The stamp (= soft stamp) according to the present invention particularly has the following characteristics or has the following materials.

[0006] · Polydimethylsiloxane (PDMS) · Perfluoropolyether (PFPE) · Polyhedral oligomeric silsesquioxane (POSS) · Polydimethylsiloxane (PDMS) · Tetraethyl orthosilicate (TEOS) · Poly(organo)siloxane (silicone) The stamp (= soft stamp) according to the invention can basically be derived from one of the following material classifications · Thermoplastic substances · Elastomers · Duroplasts The master stamp, the embossing material, and the product are hereinafter also referred to as the base material.

[0007] The invention relates to a method of peeling a stamp from a base material, in particular from a master stamp, from an embossing material, and / or from a product, wherein, in order to peel the stamp from the base material, the stamp is deformed in the direction of the base material.

[0008] The invention further relates, in particular as an exclusive object of the invention, to a method of manufacturing a stamp on a support, comprising the following steps, in particular the following sequence, namely - applying an embossing material onto the master stamp, - bringing the embossing material into contact with the support, - curing the embossing material, - peeling the master stamp from the cured embossing material, in particular by the method according to the embodiments described above, wherein the generated stamp remains on the support, and deforming the support in the direction of the master stamp in order to peel the master stamp from the stamp.

[0009] The invention further relates, in particular as an exclusive object of the invention, to a method of manufacturing a product from an embossing material, comprising the following steps, in particular the following sequence, namely - bringing the embossing material into contact with the stamp, - curing the embossing material, - peeling the stamp from the embossing material, in particular by the method according to the forms described in the above claims, and deforming the stamp in the direction of the product in order to peel the stamp from the product.

[0010] The present invention further relates, in particular as an object unique to the present invention, to an apparatus for peeling a stamp from a substrate, in particular from a master stamp, from an embossing material, and / or from a product, where, for peeling the stamp from the substrate, the stamp is deformable in the direction of the substrate.

[0011] The present invention further relates, in particular as an object unique to the present invention, to an apparatus for manufacturing a stamp on a support, in particular by the method according to the form described in the above-mentioned claims, - application means for applying an embossing material onto a master stamp, - contacting means for bringing the embossing material into contact with the support, - curing means for peeling the master stamp from the cured embossing material, where the generated stamp remains on the support, and for peeling the master stamp from the stamp, the support is deformable in the direction of the master stamp.

[0012] The present invention further relates, in particular as an object unique to the present invention, to an apparatus for manufacturing a product from an embossing material, - contacting means for bringing the embossing material into contact with a stamp, - curing means for curing the embossing material, - peeling means for peeling the stamp from the embossing material, and deformation means are provided for deforming the stamp in the direction of the product in order to peel the stamp from the product.

[0013] Preferably, it is assumed that the stamp and / or the support are deformed or deformable by positive pressure.

[0014] Furthermore, the largest deformation takes place at the center of the stamp and / or the support, and in particular this deformation is preferably carried out symmetrically with respect to the center of the stamp and / or the support.

[0015] Furthermore, the deformation of the stamp and / or the support is preferably carried out from the inside towards the outside, in particular from the center of the stamp and / or the support towards the edge of the stamp and / or the support.

[0016] Furthermore, for peeling, it is preferable to move the substrate and the stamp and / or the support away from each other, in particular simultaneously with the deformation of the stamp and / or the support.

[0017] Furthermore, it is preferable to peel the stamp from the outside towards the inside, in particular from the edge of the stamp towards the center of the stamp.

[0018] Furthermore, due to the deformation, it is preferable that the stamp and / or the support is formed into a convex shape and / or rounded.

[0019] Furthermore, for peeling, it is preferable to move the master stamp and the support away from each other, in particular simultaneously with the deformation of the support.

[0020] Furthermore, it is preferable that the support is a film and / or the stamp is a film stamp.

[0021] In another embodiment, it is assumed that the support is an extremely thin and flexible glass plate. The glass plate is particularly thinner than 20 mm, preferably thinner than 10 mm, more preferably thinner than 5 mm, even more preferably thinner than 2 mm, and most preferably thinner than 1 mm.

[0022] Furthermore, the apparatus has at least one support deformation element for deforming the support and / or at least one stretching element for stretching the support, and it is preferable that the support is particularly stretched by the support deformation element.

[0023] Furthermore, the support deformation element has at least one support deformation element protrusion, and the support deformation element protrusion preferably lifts the support from the support deformation element and / or stretches the support.

[0024] Furthermore, the support deformation element has at least one fixing element that functions especially for the dynamic fixing of the support, and preferably, at least one fixing element is switchable via this at least one fixing element so that gas and / or a gas mixture can be supplied to the intermediate chamber between the support deformation element and the support.

[0025] Furthermore, at least one extension element is a fluid element, and preferably, gas and / or a gas mixture can be supplied via the fluid element to generate a positive pressure between the support deformation element and the support.

[0026] In another exemplary embodiment, it is assumed that the support is held by a frame instead of the support deformation element, especially located behind the support. Even when using a frame, the extension element is located on the back of the support in the normal form.

[0027] The core of the present invention lies especially in the fixing of the stamp that enables the peeling of the stamp (= soft stamp) from the master stamp and / or the embossing material and / or from the product, especially from the edge towards the center.

[0028] In a specific embodiment, this fixing is configured such that an endless film capable of forming a plurality of stamps can be used. In this case, the endless film can be fixed so that, on the one hand, distortion that would cause problems with the embossing pattern does not occur, and on the other hand, the embossing pattern or the release of the stamp can be continuously performed from the outside towards the inside.

[0029] The release is carried out controllably, especially from the outside towards the inside. Embodiment including an endless film can provide an embossing device capable of automatically manufacturing a soft stamp by only one master stamp.

[0030] A special advantage of the embodiments and processes according to the invention is that the release of the stamp does not depend on the size of the substrate, especially the thickness of the substrate. During the deformation process, the substrate can remain completely flat and fixed, while the stamp is peeled off from the substrate by the deformation according to the invention, especially due to the convex curvature generated, especially continuously, from the outside towards the inside. Thereby, damage to the substrate is prevented.

[0031] A further advantage is that there is no exclusion zone. For separation, there is no need to introduce an object such as a blade that may damage the components and patterns at the edge of the substrate, so the pattern can be embossed up to the outermost edge of the substrate.

[0032] Embodiments according to the invention can basically emboss substrates of any size and shape, provided that the substrate is configured in the corresponding size.

[0033] A further advantage according to the invention lies especially in the reusability of the stamp support. If the pattern on the support is damaged or worn by multiple uses, the support can be replaced or further moved to produce a new, defect-free working stamp.

[0034] A further advantage according to the invention is in particular that the stamp can reach the entire surface of the wafer to be embossed and can also emboss up to the exclusion zone. This is due in particular to the fact that all the components to be shaped and deformed are located behind the stamp or the support of the stamp, and thus the stamp is not laterally restricted by any component.

[0035] A further advantage of the invention over the prior art is in particular that not only is the substrate that should not be embossed released from the stamp, but preferably the stamp is released from the substrate. The release of the stamp from the substrate is certainly assisted by the translational movement of the substrate away from the stamp, but the main release is based on the curvature of the support or the stamp according to the invention. Thereby, according to the invention, the substrate can be fixed completely, and it is not necessary to bend the substrate itself, so that it is possible to emboss a very thin substrate, and then the stamp can be released without damaging the substrate.

[0036] A further advantage of the invention is in particular that in the embossing process the stamp or the support is in a rigid state and in the release process the stamp or the support is in a flexible state. In the embossing process, the stamp is stabilized by the support and / or the components located behind the support, so that the stamp can withstand the pressure load, and in the release process the stamp and the support can be deformed.

[0037] The release behavior of the stamp is very easily affected by the thickness of the support and can be adjusted. The support is in particular thinner than 5 mm, preferably thinner than 1 mm, more preferably thinner than 0.1 mm, even more preferably thinner than 0.01 mm, and most preferably thinner than 0.001 mm.

[0038] Embodiments according to the present invention can be used, on the one hand, for the production of stamps and, on the other hand, for the use of stamps in an embossing process. Thus, unlike the prior art, two separate embodiments are no longer necessary.

[0039] In the prior art, a back plane is very frequently used and, in particular, the back plane must be coated before producing the stamp in order to ensure the adhesion to the working stamp embossing material. The back plane preferably used according to the present invention can already have the corresponding coating at the time of delivery, so that the coating process at the stamp manufacturer is omitted, thereby saving costs and time.

[0040] Embodiments according to the present invention relate in particular to an apparatus for producing a stamp on a back plane.

[0041] The apparatus according to the present invention particularly has at least one back plane deformation element by means of which the back plane can be tensioned. The back plane deformation element preferably has at least one back plane deformation element ridge which lifts the back plane stamp side of the tensioned back plane from the other part of the back plane deformation element.

[0042] The back plane deformation element particularly has at least one fixing element which functions in particular for the dynamic fixing of the back plane. The fixing element of the back plane deformation element is particularly switchable on and off. The fixing element functions in particular for the holding of the back plane with as little stress as possible.

[0043] One or more fixing elements are ● a vacuum fixing device, in particular · individually driveable vacuum tracks · interconnected vacuum tracks having a vacuum fixing element ● A mechanical fixing device, in particular · A clamp ● An electrical fixing device, in particular · An electrostatic fixing device · A magnetic fixing device ● An adhesive fixing part, in particular · The fixing part of a gel pack · A fixing part having an adhesive, in particular a surface that can be driven and controlled is.

[0044] At least one fixing element is, in particular, electronically drivable and controllable. The vacuum fixing device is a preferred form of the fixing element. The vacuum fixing device preferably consists of a plurality of vacuum tracks, and these vacuum tracks extend out from the surface of the support deformation element. The vacuum tracks are preferably individually drivable and controllable.

[0045] In a preferred application, several vacuum tracks are integrated to form a vacuum track segment, and these vacuum track segments are individually drivable and controllable, and thus can be evacuated individually or fluid can pass through them. Of course, each vacuum segment is independent of other vacuum segments. Thereby, a vacuum segment that can be individually driven and controlled can be configured. The vacuum segment is preferably configured in a ring shape. Thereby, depending on the purpose, it is possible to fix the substrate in a radially symmetric manner, in particular from the inside to the outside, and / or separate the substrate from the probe holder. Another preferred shape of the vacuum segment is rectangular.

[0046] The support deformation element particularly has at least one element for lifting the support from the support deformation element. The lifting of the support is also referred to as extension hereinafter; one or more elements that cause the extension are also called extension elements. Preferably, at least one extension element is a fluid element, and through this fluid element, gas and / or gas mixture can flow out to generate a positive pressure between the support deformation element and the support.

[0047] In a very special embodiment according to the present invention, at least one of the above-described vacuum segments that function as a fixing device can be switched via this vacuum segment so that a gas and / or gas mixture can be pumped into the intermediate chamber between the support deformation element and the support. Therefore, at least one fixing element can be used simultaneously as an extension element. If other fixing elements are to be used, the extension element is provided separately and independently of the fixing element.

[0048] At least one support deformation element deflects the support in the gentlest possible way, preferably having a rounded edge. The radius of the rounded edge is greater than 0.1 mm, preferably greater than 1 mm, more preferably greater than 5 mm, even more preferably greater than 10 mm, and most preferably greater than 30 mm.

[0049] The support is preferably fixed on at least two opposite sides, in particular by a mechanical fixing unit independent of the support deformation element that engages from the outside.

[0050] In order to measure and monitor the force with which the support is fixed to the support deformation element, a load cell is incorporated in particular in the fixing unit. In particular, the support should not be damaged by the fixing unit and must not be damaged.

[0051] The fixing unit is particularly useful for roughly fixing the support. The force that can be applied to the support by the fixing unit is preferably adjustable. The force used is 0.001 N to 1000 N, preferably 0.01 N to 500 N, more preferably 0.1 N to 100 N, even more preferably 1 N to 50 N, and most preferably 1 N to 25 N.

[0052] It is appropriate to specify the pressure that may be applied to the support so that no damage to the support occurs. The above-mentioned force value is expressed based on per square meter, and the corresponding pressure value can be obtained. The pressure is 0.001 MPa to 1000 MPa, preferably 0.01 MPa to 500 MPa, more preferably 0.1 MPa to 100 MPa, even more preferably 1 MPa to 50 MPa, and most preferably 1 MPa to 25 MPa.

[0053] The fine cracks generated in the support are preferably completely closed by the working stamp embossing material in the manufacturing process of the working stamp.

[0054] Embossing material In this specification, in particular, the working stamp embossing material and the product embossing material are distinguished. The working stamp embossing material is the embossing material for manufacturing a working stamp (= stamp, soft stamp). The product embossing material is the embossing material that is embossed by the working stamp to manufacture a desired product.

[0055] The stamp embossing material and the product embossing material may be different. Preferably, the difference between the working stamp embossing material and the product embossing material lies in the hydrophobicity or hydrophilicity of these materials. The criterion for hydrophobicity or hydrophilicity is the contact angle formed between a test liquid droplet, particularly water, and the surface to be measured. A hydrophilic surface flattens the liquid droplet because the adhesive force between the liquid and the surface dominates over the cohesive force of the liquid, thus forming a small contact angle. A hydrophobic surface makes the liquid droplet more spherical because the cohesive force of the liquid dominates over the adhesive force between the liquid and the surface.

[0056] A common method for specifying hydrophobicity or hydrophilicity is the contact angle method. To obtain information regarding the surface energy of a solid using a test liquid, the contact angle method is used in conjunction with Young's equation. By this method, the surface energy of the surface is evaluated by a given test liquid, mainly water. Those skilled in the art are aware of the corresponding measurement methods as well as evaluation methods. The contact angle obtained by the contact angle method can be converted into surface energy in units of N / m or J / m 2 . For relative comparison of various surfaces in the same test liquid, the contact angle information is already sufficient to obtain a relative estimate of the adhesion of the surface. Therefore, by using water as the test liquid, it can be said that a wet surface with a contact angle of about 30° in a water droplet has higher adhesiveness than a surface having a contact angle of about 120° in a water droplet.

[0057] In a preferred embodiment of the present invention, the adhesiveness of the working stamp material due to surface energy is specified to be less than 0.1 J / m 2 , particularly less than 0.01 J / m 2 , preferably less than 0.001 J / m 2 , more preferably less than 0.0001 J / m 2 , ideally less than 0.00001 J / m 2 .

[0058] Alternatively or additionally, according to an advantageous embodiment of the present invention, it is assumed that the adhesiveness of the contact surface is defined by a contact angle greater than 20°, particularly greater than 50°, preferably greater than 90°, more preferably greater than 150°. The adhesiveness of the surface to other materials can be specified using the contact angle method described above. In this case, one drop of a known liquid, preferably one drop of water (values according to the present invention regarding water), (alternatively glycerol or hexadecane) is dropped onto the surface to be measured. Using a microscope, the angle is measured precisely from the side, that is, the angle between the tangent of the liquid droplet and the surface.

[0059] The embossing material used according to the present invention preferably has a viscosity of 1 cp to 25,000 cp, preferably 10 cp to 25,000 cp, more preferably 100 cp to 25,000 cp, even more preferably 1,000 cp to 25,000 cp, and most preferably 10,000 cp to 25,000 cp.

[0060] Device In a first preferred embodiment of the present invention, the support is placed on a support deformation element. The support is preferably a film. The film is first pre-fixed by a dynamic support fixing device, preferably a vacuum element. Thereafter, lateral fixing is performed by a static support fixing device. This embodiment is designed to accommodate a cut film or a support with limited rigidity. In particular, the size of the support is designed such that the static support fixing device can fix the support. This embodiment has at least one stretching element capable of stretching the support. Preferably, the dynamic fixing device functions as a stretching element at the same time.

[0061] In another preferred embodiment according to the present invention, a stamp support device using an endless film capable of producing a plurality of stamps along the support is disclosed. The endless film is preferably delivered as a roll and attached to a first shaft. By a second shaft, the protective film can be wound off and removed from the endless film. The endless film may be guided through another element and is guided between a first static support fixing device and a support deformation element. The endless film passes through the static support fixing device and a second static support fixing device and is finally wound around a third shaft.

[0062] The static support fixing device consists of a movable fixing unit that can sandwich an endless film, especially between support deformation elements. This prevents the sliding of the endless film. In this state, a corresponding embossing pattern can be provided on the part of the endless film. This embodiment has at least one stretching element capable of stretching the support. Preferably, the dynamic fixing device functions as a stretching element at the same time.

[0063] The film of the present invention can be preloaded with a force of 1 N to 1000 N, preferably 2 N to 800 N, more preferably 5 N to 600 N, even more preferably 8 N to 400 N, and most preferably 10 N to 100 N.

[0064] The device according to the present invention can exist as a module part of one cluster. A cluster means an assembly of a plurality of modules connected to each other. These plurality of modules connected to each other are, in particular, all connected to each other in a vacuum-tight manner, so that the substrate can be transported between the modules without contacting the external atmosphere.

[0065] Each module can preferably be evacuated individually. The entire cluster can be evacuated. The pressure in each module and / or the entire cluster can be adjusted to less than 1 bar, preferably less than 10 -1 mbar, more preferably less than 10 -3 mbar, even more preferably less than 10 -5 mbar, and most preferably less than 10 -7 mbar.

[0066] The module and / or cluster can also be flushed, especially with a gas and / or gas mixture. The module and / or cluster can be placed, in particular, under a positive pressure. In this case, the pressure is adjusted to 1 bar to 5 bar, preferably 1 bar to 4.5 bar, more preferably 1 bar to 4 bar, even more preferably 1 bar to 3.5 bar, and most preferably 1 bar to 3 bar.

[0067] The modules within the cluster are interconnected with each other, particularly by a central module, and preferably, a robot capable of moving a substrate between storage containers (FOUPs) and / or between modules is located within this central module.

[0068] Method In a first preferred method of the present invention, the support is fixed to the device according to the present invention.

[0069] In a first process step, the working stamp embossing material is separated onto the master stamp by a separating device. Preferably, the working stamp embossing material is already distributed as uniformly and over the entire surface as possible.

[0070] In a second process step, the device according to the present invention is aligned relative to the master stamp. Movement of the device according to the present invention and / or the master stamp is possible. However, preferably, the master stamp is moved. The alignment can be performed mechanically and / or optically. It is conceivable that the master stamp is merely roughly positioned relative to the device according to the present invention. However, preferably, the alignment of both objects is performed based on alignment marks. The alignment marks can be located on the support deformation element and / or on the support. However, preferably, the alignment marks are located on the support.

[0071] In a third process step, contact is made between the support and the working stamp embossing material. By applying pressure, the working stamp material flattens along the support, and the master stamp pattern is formed as a negative mold in the working stamp material.

[0072] In a fourth process step, the working stamp embossing material is cured. The working stamp embossing material can be cured thermally and / or by electromagnetic radiation.

[0073] Thermosetting is carried out at 0 °C to 500 °C, preferably 50 °C to 450 °C, more preferably 100 °C to 400 °C, even more preferably 150 °C to 350 °C, and most preferably 200 °C to 300 °C.

[0074] The electromagnetic radiation preferably has a wavelength in the range of 10 nm to 2000 nm, preferably 50 nm to 1500 nm, more preferably 100 nm to 1000 nm, even more preferably 150 nm to 500 nm, and most preferably 200 nm to 370 nm.

[0075] In the fifth process step, the support having the cured working stamp embossing material is peeled from the master stamp by stretching the support by means of a stretching element. Preferably, a gas or gas mixture flows between the support deformation element and the support through a dynamic support fixing device consisting of a vacuum element, creating a support that is convexly curved when viewed from the outside. Thereby, the support is peeled from the outside towards the inside.

[0076] In the sixth process step, the support is fixed again through a dynamic support fixing device.

[0077] In a second preferred method of the present invention, an endless film is fixed to the device according to the present invention as the support.

[0078] The first six process steps of the second method are substantially the same as the first six process steps of the first method.

[0079] In the seventh process step, in order to release the endless film, the static support fixing device of the fixing unit is retracted, thereby releasing the fixing of the endless film. Thereafter, or simultaneously therewith, the endless film is wound onto a third roll. Thereby, the produced working stamp embossing material is separated from the support deformation element, and a new area of the endless film is provided for embossing.

[0080] Thus, a plurality of working stamps can be produced extremely easily on a single endless film.

[0081] In a third preferred method according to the present invention, a working stamp produced by one of the methods described above is used for embossing a product embossing material. From the product embossing material, the product to be actually produced is produced. Preferably, the product embossing material is applied on a base material, and the base material is aligned relative to the working stamp. Thereafter, an embossing step, a curing step, and a release step are performed.

[0082] Further advantages, features, and details of the present invention will be apparent from the following description of preferred embodiments and the drawings.

Brief Description of the Drawings

[0083]

Figure 1a

Figure 1b

Figure 2a

Figure 2b

Figure 2c

Figure 2d

Figure 2e

Figure 2f

Figure 3a

Figure 3b

Figure 3c

Figure 3d

Figure 3e

Figure 3f

[0084] In the figure, the same reference numerals are assigned to the same components or components that are functionally the same.

[0085] Figure 1a shows a side view of a manual first stamping device 1 according to the invention, which is provided with at least two fixing units 4 by means of which the support 3 can be fixed, in particular on two opposite sides. Both fixing units 4 are preferably connected to a support deformation element 2. The support deformation element 2 preferably has a support deformation element bulge 2e via which the support 3 can be tensioned. The fixing unit 4 consists, for example, of a static support fixing device 5, a spacer part 7 and an upper part 8. These components 5, 7 and 8 can be detachably fixed to each other by means of a fixing element 9, in particular a screw. The support deformation element 2 is preferably permeable to the wavelength range of electromagnetic radiation used to cure the working stamp embossing material. The support deformation element 2 has a switchable on / off dynamic fixing element 6 (hereinafter also referred to as a dynamic support fixing device). The fixing elements 6 may be arbitrarily distributed over the support deformation element surface 2o. The number of fixing elements 6 used is in particular more than 2, preferably more than 5, more preferably more than 10, very preferably more than 50 and most preferably more than 100. In a very particularly preferred embodiment according to the invention, the fixing elements 6 can be individually driven and controlled. The fixing elements 6 can preferably be controlled such that they can cause a convex deformation of the support 3 as seen from the outside. This is particularly easily possible by forming the fixing elements 6 as channels which not only function to evacuate the intermediate region between the support 3 and the support deformation element 2 but can also be used to generate a positive pressure. Thus, the fixing elements 6 are preferably channels which can generate a vacuum or a positive pressure. A further use according to the invention of the fixing elements 6 is that they can be used to fix the support 3 without distortion before performing a relatively distortion-prone fixing via the static support fixing device 5 of the fixing unit 4.As a result, the support 3 is distorted only minimally or not at all in the area to be stamped in the subsequent embossing process. The support 3 is clamped on the left and right sides between the outer part of the support deformation element 2 and the static support fixing device 5. Furthermore, alignment marks 14 are arranged on the surface of the support deformation element.

[0086] Figure 1b shows a bottom view of the first device 1 according to the invention, which is manual. Fixing elements 9, which function to removably screw-fix components 5, 7 and 8, can be seen, in particular the screws. The dynamic support fixing device 6 is shown as a single rectangular vacuum channel surrounding the entire circumference. The circular region 16 indicates the stamp region 16 that is to be embossed later by a stamp. The stamp region can of course take on any size and shape, but is shown as circular in connection with the circular standard wafer shape in the semiconductor industry.

[0087] Figure 2a shows the first process step according to the first method according to the invention, in which the working stamp embossing material 11 is applied via the separating device 10 onto the master stamp surface 12o of the master stamp 12 having a plurality of master stamp patterns 13.

[0088] Figure 2b shows the second process step according to the first method according to the invention, in which the first manual stamp device 1 according to the invention is aligned relative to the master stamp 12 using the alignment marks 14. In this case, the alignment marks 14 of the master stamp 12 and the alignment marks 14 of the stamp device 1 are preferably aligned with each other by means of an optical alignment element 15. It is also conceivable to align the stamp device 1 relative to the master stamp 12 purely mechanically and roughly without using the alignment element 15 and the alignment marks 14 in particular.

[0089] Figure 2c shows the third process step according to the first method according to the invention. In this step, contact between the support 3 and the working stamp embossing material 11 takes place over the support stamp side 3s. Due to such contact, the working stamp embossing material 11 is flattened.

[0090] Figure 2d shows the fourth process step according to the first method according to the invention. In this step, the working stamp embossing material 11 is cured. The curing can be carried out thermally, but preferably electromagnetically, in particular by UV light. The curing is preferably carried out by the support deformation element 2. When using electromagnetic radiation, the support deformation element 2 must be sufficiently transmissive in the corresponding wavelength range in order to cause the corresponding curing of the working stamp embossing material 11.

[0091] Figure 2e shows the fifth process step according to the first method according to the invention. In this step, detachment according to the invention of the stamp 17 (hereinafter also referred to as the working stamp) produced according to the invention takes place. In this case, the support 3 is separated from the support deformation element 2. This separation is effected in particular by the positive pressure of the fluid flowing out through the dynamic support fixing device 6 formed as a vacuum track. It is also conceivable that there is an element independent of the dynamic support fixing device 6 which can cause a corresponding curvature of the support 3 and thus of the stamp 17. For example, additionally integrated nozzles are conceivable. It is also conceivable to electrostatically charge the support 3 and push the support 3 away from the support deformation element 2 by a second potential of the same polarity passing through the element in the support deformation element 2. According to the invention, the cured working stamp embossing material 11 is peeled off from the master stamp 12 from the outside towards the inside, in particular continuously. By means of such a form of release, the cured stamp material 11 is peeled off particularly gently from the master stamp pattern 13 of the master stamp 12. Thereby, the stamp 17 thus produced can be produced without defects.

[0092] Figure 2f shows the sixth process step according to the invention. In this step, the support 3 on which the stamp 17 is formed together with the hardened embossing material 11 is fixed again completely onto the support deformation element 2. In this case, this fixing is again carried out via the dynamic support fixing device 6. The stamp 17 thus produced can now be used for the embossing process of the embossing material. The release of the stamp 17 from the embossing material in the subsequent embossing process can be carried out in exactly the same way as the release of the stamp 17 from the master stamp 12 according to Figure 2e.

[0093] Figure 3a shows the second process step according to the invention by means of the second stamping device 1' according to the invention. Since the first process step according to the invention is the same as the process step in Figure 2a, it is not shown again here. The second stamping device 1' according to the invention is a device with a roll system. On the roll 18a, there is a support 3', and this support can be coated with a protective film 19. The support 3' is an "endless film", different from the support 3 of the first embodiment according to the invention. The support 3' is stretched via the support deformation element 2 and wound up on the roll 18c. The protective film 19 can be peeled off and wound up on the roll 18b. The fixing unit 4' is configured to be able to clamp the support 3' especially from the side. The clamping of the support 3' is preferably carried out by an angled static support fixing device 5', and the clamping surface 5k' of this support fixing device is parallel to the opposing support deformation element clamping surface 2k. The angle α between the support deformation element clamping surface 2k and the support deformation element back surface 2r is in this case 0° to 90°, preferably 5° to 85°, more preferably 10° to 80°, even more preferably 15° to 75°, and most preferably 20° to 70°. In the embodiment according to the invention, preferably the master stamp 12 moves below the stamping device.

[0094] Figure 3b shows the third process step according to the invention by means of the second stamping device 1' according to the invention. Since the stamping device 1' is preferably designed to be stationary as a whole, the master stamp 12 moves towards the support 3' in order to bring the working stamp embossing material 11 into contact with the support 3'.

[0095] Figure 3c shows the fourth process step according to the invention by means of the second stamping device 1' according to the invention, which is similar to the process step of Figure 2d.

[0096] Figure 3d shows the fifth process step according to the invention by means of the second stamping device 1' according to the invention, which is similar to the process step of Figure 2e.

[0097] Figure 3e shows the sixth process step according to the invention by means of the second stamping device 1' according to the invention, which is similar to the process step of Figure 2f.

[0098] Figure 3f shows the seventh process step according to the invention by means of the second stamping device 1' according to the invention. In this step, the fixing unit 4' is opened, whereby the support 3 can be further moved by the rollers 18a, 18c. According to the invention, in this case, the removal of the working stamp 17 from the support deformation element 2 takes place. By winding the support 3' onto the roller 18c, a new unused section 3u of the support 3' arrives below the support deformation element 2, and the embossing material can be provided again by the process steps 3a to 3d.

Explanation of reference numerals

[0099] 1, 1' Stamping device 2 Support deformation element 2e Support deformation element bulge 2o Support deformation element surface 2r Support deformation element back 2k Support deformation element clamping surface 3, 3' Support 3u Unused support section 3s Support body stamp side 4,4’ Fixing unit 5,5’ Static support fixing device 5k’ Clamping surface 6 Dynamic support fixing device / fixing element 7 Spacer part 8 Upper part 9 Fixing element 10 Separation device 11 Working stamp embossing material 12 Master stamp 12o Master stamp surface 13 Master stamp pattern 14 Alignment mark 15 Alignment element 16 Stamp area 17 Stamp / working stamp 18a,18b,18c Roll 19 Protective film α Angle

Claims

1. A method for releasing a stamp (17) from a substrate (12), in particular from a master stamp (12), from an embossing material (11) and / or from a product, comprising the steps of: A method comprising deforming the stamp (17) towards the substrate (12) to peel the stamp (17) from the substrate (12).

2. The method of claim 1 , wherein the stamp (17) is deformed by positive pressure.

3. 3. The method according to claim 1 or 2, wherein the maximum deformation is performed in the center of the stamp (17), in particular the deformation is performed symmetrically with respect to the center of the stamp (17).

4. 4. The method according to claim 1, wherein the deformation of the stamp (17) is performed from the inside to the outside, in particular from the center of the stamp (17) towards the edge of the stamp (17).

5. 5. The method according to claim 1, further comprising the steps of: moving the substrate (12) and the stamp (17) away from each other for delamination, in particular simultaneously with the deformation of the stamp (17).

6. 6. The method according to claim 1, wherein the stamp (17) is peeled off from the outside to the inside, in particular from the edge of the stamp (17) towards the centre of the stamp (17).

7. A method for manufacturing a stamp (17) on a support (3, 3') comprising the following steps, in particular the following sequence: - applying an embossing material (11) onto a master stamp (12); - bringing said embossing material (11) into contact with said support (3, 3'), - hardening said embossing material (11), - peeling off the master stamp (12) from the hardened embossing material (11), in particular by a method according to any one of claims 1 to 6, wherein the generated stamp (17) remains on the support (3, 3'), 1. The method of claim 1, further comprising: A method, characterized in that the support (3, 3') is deformed towards the master stamp (12) in order to peel the master stamp (12) off the stamp (17).

8. A method for manufacturing a product from an embossing material (11), comprising the following steps, in particular the following sequence: - bringing said embossing material (11) into contact with a stamp (17), - hardening said embossing material (11), - peeling off the stamp (17) from the embossing material (11), in particular by a method according to any one of claims 1 to 6, 1. The method of claim 1, further comprising: A method, characterized in that the stamp (17) is deformed towards the product in order to peel the stamp (17) off the product.

9. An apparatus for peeling a stamp (17) from a substrate (12), in particular from a master stamp (12), from an embossing material (11) and / or from a product, comprising:

13. An apparatus, characterized in that the stamp (17) is deformable towards the substrate (12) in order to peel the stamp (17) from the substrate (12).

10. 10. An apparatus for producing a stamp (17) on a support (3, 3'), in particular by a method according to any one of claims 1 to 8, comprising: - application means (10) for applying an embossing material (11) onto the master stamp (12); - contacting means for contacting said embossing material (11) with said support (3, 3'); - hardening means for peeling off the master stamp (12) from the hardened embossing material (11), the resulting stamp (17) remaining on the support (3, 3'), Apparatus, characterized in that said support (3, 3') is deformable towards said master stamp (12) in order to peel said master stamp (12) from said stamp (17).

11. An apparatus for producing a product from an embossing material (11), comprising: - contact means for bringing said embossing material (11) into contact with said stamp (17); - hardening means for hardening said embossing material (11); - peeling means for peeling said stamp (17) from said embossing material (11), - a device, characterized in that deformation means are provided for deforming said stamp (17) towards said product in order to detach said stamp (17) from said product.

12. 12. The device according to claim 9, further comprising at least one support deformation element (2) for deforming the support (3, 3') and / or at least one tensioning element for tensioning the support (3, 3'), the support (3, 3') being tensioned in particular by the support deformation element (2).

13. 13. The device according to claim 9, wherein the support deformation element (2) has at least one support deformation element ridge (2e), which lifts the support (3, 3') from the support deformation element (2) and / or stretches the support (3, 3').

14. 14. The device according to claim 9, wherein the support deformation element (2) has at least one fixing element (6) which serves, in particular for dynamic fixing, of the support (3, 3'), and preferably the at least one fixing element (6) is switchable so that gas and / or gas mixtures can be supplied to an intermediate space between the support deformation element (2) and the support (3, 3') via the at least one fixing element (6).

15. 15. The device according to claim 9, wherein the at least one tensioning element is a fluid element, via which a gas and / or a gas mixture can be supplied in order to generate a positive pressure between the support deformation element (2) and the support (3, 3').

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