Substrate working device and method for manufacturing mounting board

Abstract

To achieve both an improvement in working efficiency and prevention of a reduction in work quality in work related to mounting of a component on a three-dimensional substrate.SOLUTION: A substrate working device performs work related to mounting of a component on a three-dimensional substrate, and the substrate working device comprises: a stage that supports the three-dimensional substrate and is capable of inclination operation; a working unit that performs work for a plurality of work points of the three-dimensional substrate supported by the stage; a data acquisition unit that acquires angular value data of the stage for every work point; a setting unit that divides the plurality of work points into one or more groups of work points whose angular value data is included in an allowable angular range, and sets the same work inclination angle to the work points belonging to the same group; and a control unit that controls the working unit and the stage to execute work for the work points at the work inclination angle for every group.SELECTED DRAWING: Figure 13

Description

Technical Field

[0001] The technology disclosed in this specification relates to a substrate working apparatus and a method for manufacturing a mounted substrate.

Background Art

[0002] In the technical field related to mounting apparatuses, a three-dimensional mounting apparatus that performs an operation of mounting components on a three-dimensional substrate, as disclosed in Patent Document 1, is known.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] When mounting components on a three-dimensional substrate, the stage that supports the three-dimensional substrate is controlled so that the mounting position (working point) of the component on the three-dimensional surface becomes horizontal. Similarly, in the operation of applying solder to the working point or the operation of soldering by irradiating the applied solder with a laser or the like, the tilt angle of the three-dimensional substrate is controlled by the stage. In order to achieve mounting of a large number of components, since working units such as component mounting heads and laser heads move at high speed, if the tilt angle of the stage is controlled for each working point of the three-dimensional substrate, there will be a waiting time for the stage to tilt, resulting in a decrease in working efficiency. On the other hand, if the tilt angle control of the stage is not performed, the surface including the working point will be inclined with respect to the working unit, so there is a concern about a decrease in working quality such as an increase in mounting defects.

[0005] The technology disclosed in this specification aims to achieve both an improvement in working efficiency and suppression of a decrease in working quality in the operation related to component mounting on a three-dimensional substrate.

Means for Solving the Problems

[0006] This specification discloses a substrate working apparatus. The substrate working apparatus is a substrate working apparatus that performs operations related to component mounting on a three-dimensional substrate, and includes a stage that supports the three-dimensional substrate and is tiltable, a working unit that performs operations on a plurality of working points of the three-dimensional substrate supported by the stage, a data acquisition unit that acquires angle value data of the stage for each of the working points, a setting unit that groups the plurality of working points into one or more groups among the working points whose angle value data is within an allowable angle range, and sets the same working tilt angle for the working points belonging to the same group, and a control unit that controls the working unit and the stage to perform operations on the working points at the working tilt angle for each group.

[0007] This specification discloses a method for manufacturing a mounting substrate. The method for manufacturing a mounting substrate is a method for manufacturing a mounting substrate in which electronic components are mounted on a three-dimensional substrate, and includes steps of acquiring angle value data for each of a plurality of working points of the three-dimensional substrate that is the object of operations by a substrate working apparatus, grouping the plurality of working points into one or more groups among the working points whose angle value data is within an allowable angle range, setting the same working tilt angle for the working points belonging to the same group for each group, and performing operations on the working points belonging to the same group at the same working tilt angle for each group by the substrate working apparatus.

Advantages of the Invention

[0008] According to the technology disclosed in this specification, it is possible to achieve both an improvement in working efficiency and a suppression of a decrease in working quality in operations related to component mounting on a three-dimensional substrate.

Brief Description of the Drawings

[0009]

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DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, embodiments will be described with reference to the drawings. In the embodiments, an XYZ orthogonal coordinate system is defined, and the positional relationship of each part will be described with reference to this XYZ orthogonal coordinate system. The direction parallel to the X-axis of a predetermined plane is defined as the X-axis direction. The direction parallel to the Y-axis of the predetermined plane orthogonal to the X-axis is defined as the Y-axis direction. The direction parallel to the Z-axis orthogonal to the predetermined plane is defined as the Z-axis direction. The rotation direction or inclination direction centered on the X-axis direction is defined as the θX direction. The rotation direction or inclination direction centered on the Y-axis direction is defined as the θY direction. The rotation direction or inclination direction centered on the Z-axis direction is defined as the θZ direction. In the embodiments, the predetermined plane is parallel to the horizontal plane. The Z-axis is parallel to the vertical axis, and the Z-axis direction is the up-down direction. The +Z side is the upper side, and the -Z side is the lower side. Note that the predetermined plane may be inclined with respect to the horizontal plane. Also, in the embodiments, the predetermined plane including the X-axis and the Y-axis is appropriately referred to as the XY plane.

[0011] [Substrate] FIG. 1 is a perspective view showing a substrate 1 and a component 2 according to an embodiment. In the embodiment, the substrate 1 is a three-dimensional substrate. A three-dimensional substrate refers to a substrate having a non-planar surface. The surface of the substrate 1 includes a curved surface. At least a part of the surface of the substrate 1 is curved. The surface of the substrate 1 may include corners. Protrusions may be provided on the surface of the substrate 1.

[0012] An electric circuit is provided on the surface of the substrate 1. In an embodiment, the substrate 1 is formed by an in-mold forming technique. The substrate 1 includes a base material 1A having a curved surface and a film 1B joined to the surface of the base material 1A. The film 1B is flexible. The film 1B is a flexible film. The film 1B includes an electric circuit. The electric circuit includes electrodes such as lands and pads. In the film 1B, the positions (plane coordinates) of the respective electrodes are assumed to be known. The surface of the substrate 1 includes the surface of the film 1B.

[0013] The component 2 includes an electronic component. The component 2 may be a lead type electronic component having leads protruding from the body. The component 2 may also be a chip type electronic component having no leads. By mounting the component 2 on the surface of the substrate 1, an electronic device is manufactured.

[0014] [Palette] FIG. 2 is a perspective view showing a palette 3 that supports the substrate 1 according to the embodiment. FIG. 3 is an exploded perspective view showing the substrate 1 and the palette 3 according to the embodiment. The palette 3 supports the substrate 1. In an embodiment, the substrate 1 is handled while being supported by the palette 3. The palette 3 has a support member 4 that supports the substrate 1 and a clamp mechanism 5 that fixes the substrate 1.

[0015] The support member 4 includes a base portion 4A that supports the substrate 1 from the -Z side, guard portions 4B provided on the +Y side and the -Y side of the base portion 4A respectively, and a plurality of pin portions 4C that support the substrate 1 from the +Y side and the -Y side respectively.

[0016] The base portion 4A is plate-shaped and has a plurality of openings. Two holes 4D are provided in the base portion 4A. The holes 4D penetrate the upper surface and the lower surface of the base portion 4A.

[0017] The guard part 4B is long in the X-axis direction. A pair of guard parts 4B is provided. The pair of guard parts 4B are separated from each other in the Y-axis direction. One guard part 4B protrudes from the +Y side end of the upper surface of the base part 4A to the +Z side. The other guard part 4B protrudes from the -Y side end of the upper surface of the base part 4A to the +Z side.

[0018] Each of the plurality of pin parts 4C protrudes from the upper surface of the base part 4A to the +Z side. Some of the pin parts 4C are arranged on the +Y side of the center of the base part 4A. Some of the pin parts 4C are arranged on the -Y side of the center of the base part 4A. The plurality of pin parts 4C arranged on the +Y side of the center of the base part 4A support the +Y side end of the substrate 1. The plurality of pin parts 4C arranged on the -Y side of the center of the base part 4A support the -Y side end of the substrate 1.

[0019] The clamping mechanism 5 is provided on the support member 4. The clamping mechanism 5 fixes the substrate 1 to the support member 4. The clamping mechanism 5 includes a pair of support parts 5A that support the -X side end of the substrate 1 and a movable part 5B that supports the +X side end of the substrate 1. The movable part 5B is movable in the X-axis direction on the upper surface of the base part 4A. With the substrate 1 disposed between the support part 5A and the movable part 5B, when the movable part 5B moves in the -X direction, the substrate 1 is sandwiched between the support part 5A and the movable part 5B. The substrate 1 is fixed to the pallet 3 by being sandwiched between the support part 5A and the movable part 5B.

[0020] In the embodiment, the pallet 3 may have an information medium 80. The information medium 80 holds substrate data related to the substrate 1. In the embodiment, the information medium 80 is a two-dimensional code. Note that the information medium 80 may be a one-dimensional bar code. The information medium 80 may be an RF tag. In the embodiment, the information medium 80 is attached to a part of the upper surface of the base part 4A. The information medium 80 is arranged so as not to overlap with the substrate 1. In the embodiment, the pallet 3 may not be provided with the information medium 80.

[0021] [Production System] FIG. 4 is a diagram schematically showing a production system of a mounting substrate including the substrate working device 10 according to the embodiment. The substrate working device 10 is a device that performs operations related to component mounting on the substrate 1. As shown in FIG. 4, the production system includes a mounting device 12, a preheating device 13, a laser irradiation device 14, an inspection device 15, and a management device 16. The mounting device 12, the preheating device 13, the laser irradiation device 14, and the inspection device 15 construct a production line 17 for electronic devices. In FIG. 4, as an example of the substrate working device 10 according to the embodiment, the mounting device 12 and the laser irradiation device 14 are shown.

[0022] The management device 16 manages the production line 17. The management device 16 is composed of a computer system having a processor, a main memory, a storage, and an interface. The processor is, for example, a CPU (Central Processing Unit). The main memory includes a non-volatile memory such as a ROM (Read Only Memory) and a volatile memory such as a RAM (Random Access Memory). Examples of the storage include a hard disk drive (HDD), a solid state drive (SSD), a magnetic disk, and a magneto-optical disk. The interface includes an input / output circuit. The management device 16 stores the substrate data 70 of the substrate 1. The substrate data 70 includes various information related to the production of the mounting substrate. The management device 16 can provide the substrate data 70 to each substrate working device 10 via a network.

[0023] FIG. 5 is a diagram schematically showing the internal structure of the mounting device 12 according to the embodiment. FIG. 6 is a plan view schematically showing the mounting device 12 according to the embodiment.

[0024] The mounting device 12 mounts the component 2 on the substrate 1. In the production line 17, at least one mounting device 12 is provided. Note that a plurality of mounting devices 12 may be provided. The substrate 1 is conveyed to the mounting device 12 in a state of being fixed to the pallet 3.

[0025] The mounting apparatus 12 includes a base member 22, a transfer device 23, a stage 24, a stage moving device 25, a component supply device 26, a mounting head 28 including a nozzle 27, a substrate camera 29, a height sensor 30, a head moving device 31, a nozzle moving device 32 (see FIG. 11), a chamber 33, an opening / closing cover 34 (see FIG. 4), a window 35 (see FIG. 4), a display device 36 (see FIG. 4), and an input device 37 (see FIG. 4). Further, the mounting apparatus 12 includes a control device 64A (see FIG. 4) that controls the operations of the respective parts of the mounting apparatus 12.

[0026] The base member 22 supports each of the transfer device 23, the stage 24, the stage moving device 25, the component supply device 26, the mounting head 28, the head moving device 31, and the nozzle moving device 32.

[0027] FIGS. 7 and 8 are a perspective view and an exploded perspective view showing the transfer device 23 and the stage 24 according to the embodiment.

[0028] The transfer device 23 transfers the pallet 3 supporting the substrate 1 in the X-axis direction. The transfer device 23 transfers the pallet 3 to the processing position of the mounting apparatus 12. The processing position is defined in the transfer path of the transfer device 23.

[0029] The transfer device 23 has a transfer belt 23A that transfers the pallet 3 in the X-axis direction and a guide member 23B that guides the pallet 3.

[0030] The guide member 23B is long in the X-axis direction. A pair of guide members 23B are provided. The pair of guide members 23B are separated from each other in the Y-axis direction. One guide member 23B is disposed on the +Y side of the pallet 3. The other guide member 23B is disposed on the -Y side of the pallet 3.

[0031] The conveying belt 23A is annular. A pair of conveying belts 23A are provided. The conveying belt 23A is supported by the guide member 23B via a driving pulley and a driven pulley. The conveying belt 23A is wound around the driving pulley and the driven pulley. One of the conveying belts 23A is supported by one of the guide members 23B. The other conveying belt 23A is supported by the other guide member 23B.

[0032] Of the pair of conveying belts 23A, the conveying belt 23A arranged on the +Y side supports the +Y side end of the lower surface of the pallet 3. The conveying belt 23A arranged on the -Y side supports the -Y side end of the lower surface of the pallet 3. When the driving pulley rotates by a drive motor (not shown), the pallet 3 is conveyed in the X-axis direction.

[0033] By an actuator (not shown), one of the guide members 23B is movable in the Y-axis direction with respect to the other guide member 23B. When one of the guide members 23B and the other guide member 23B move away from each other in the Y-axis direction, the support of the pallet 3 by the conveying belt 23A is released.

[0034] FIG. 9 is a perspective view showing the pallet 3 and the stage 24 according to the embodiment. FIG. 10 is an exploded perspective view showing the pallet 3 and the stage 24 according to the embodiment.

[0035] The stage 24 supports the substrate 1 via the pallet 3. The stage 24 supports the pallet 3 conveyed to the processing position from the -Z side. Two positioning members 24A are provided on the upper surface of the stage 24. The positioning member 24A is inserted into the hole 4D of the pallet 3. When the positioning member 24A is inserted into the hole 4D from the -Z side of the pallet 3, the stage 24 and the pallet 3 are positioned. A hook is provided at the upper end of the positioning member 24A. The hook is hung on the pallet 3. The hook includes a ball that moves by air pressure. After the positioning member 24A is inserted into the hole 4D from the -Z side of the pallet 3, the ball is hung on the pallet 3, whereby the stage 24 and the pallet 3 are fixed.

[0036] The stage moving device 25 moves the stage 24. In the embodiment, the stage moving device 25 moves the stage 24 in each of the Y-axis direction, Z-axis direction, θX direction, and θY direction. The stage moving device 25 includes a Y-axis motor that generates power for the stage 24 to move in the Y-axis direction, a Z-axis motor that generates power for the stage 24 to move in the Z-axis direction, a θX motor that generates power for the stage 24 to rotate in the θX direction, and a θY motor that generates power for the stage 24 to rotate in the θY direction.

[0037] When passing the pallet 3 from the transfer device 23 to the stage 24, after the pallet 3 is transferred to the processing position by the transfer device 23, the stage 24 moves in the +Z direction by the stage moving device 25, so that the stage 24 supports the pallet 3 from below, and the pallet 3 is passed from the transfer device 23 to the stage 24. Next, when the guide member 23B on the +Y side moves in the Y-axis direction so as to be separated from the other guide member 23B, the support of the pallet 3 by the conveyor belt 23A is released. Further, the stage 24 moves in the +Z direction to support the pallet 3, and the support of the pallet 3 by the conveyor belt 23A is released. The stage moving device 25 can move the stage 24 in each of the Z-axis direction, θX direction, and θY direction by moving the stage 24 in the +Y direction so as to come to the center of the two guide members 23B in a state where the pallet 3 is supported by the stage 24.

[0038] When passing the pallet 3 from the stage 24 to the transfer device 23, the stage 24 moves in the -Y direction until one side of the pallet 3 comes onto the conveyor belt 23A on the -Y side, and the guide member 23B on the +Y side moves to the -Y side until the opposite side of the pallet 3 comes onto the conveyor belt 23A on the +Y side. After the fixing of the hook provided at the upper end of the positioning member 24A is released, the stage 24 moves in the -Z direction by the stage moving device 25. Thereby, the support of the pallet 3 by the stage 24 is released, and the pallet 3 is supported by the conveyor belt 23A.

[0039] The component supply device 26 supplies the components 2. The component supply device 26 includes a plurality of tape feeders. The tape feeder holds a plurality of components 2. The component supply device 26 supplies at least one of the plurality of components 2 to the supply position. The component supply device 26 is arranged on the -Y side of the transfer device 23. Note that the component supply device 26 may be arranged on each of the +Y side and the -Y side of the transfer device 23.

[0040] The mounting head 28 mounts the components 2 on the substrate 1. The mounting head 28 supports a plurality of nozzles 27. The mounting head 28 holds the component 2 supplied from the component supply device 26 by the nozzle 27 and mounts it on the substrate 1. The mounting head 28 is movable between the supply position where the component 2 is supplied from the component supply device 26 and the processing position where the substrate 1 is arranged. The mounting head 28 holds the component 2 supplied to the supply position by the nozzle 27, moves to the processing position, and then mounts it on the surface of the substrate 1 arranged at the processing position.

[0041] The head moving device 31 moves the mounting head 28. In the embodiment, the head moving device 31 moves the mounting head 28 in each of the X-axis direction and the Y-axis direction. The head moving device 31 includes an X-axis moving device 31X that moves the mounting head 28 in the X-axis direction and a Y-axis moving device 31Y that moves the mounting head 28 in the Y-axis direction. Each of the X-axis moving device 31X and the Y-axis moving device 31Y includes an actuator. The X-axis moving device 31X is connected to the mounting head 28. By the operation of the X-axis moving device 31X, the mounting head 28 moves in the X-axis direction. The Y-axis moving device 31Y is connected to the mounting head 28 via the X-axis moving device 31X. By the operation of the Y-axis moving device 31Y, the X-axis moving device 31X moves in the Y-axis direction, so that the mounting head 28 moves in the Y-axis direction.

[0042] FIG. 11 is a diagram schematically showing the mounting head 28 according to the embodiment. As shown in FIG. 11, the mounting head 28 has a plurality of nozzles 27. The nozzle 27 detachably holds the component 2. The nozzle 27 is a suction nozzle that suction-holds the component 2. An opening is provided at the lower end of the nozzle 27. The opening of the nozzle 27 is connected to a vacuum system. When a suction operation is performed from the opening provided at the lower end of the nozzle 27 in a state where the lower end of the nozzle 27 is in contact with the component 2, the component 2 is suction-held at the lower end of the nozzle 27. When the suction operation from the opening is released, the component 2 is released from the nozzle 27. Note that the nozzle 27 may be a gripper nozzle that holds the component 2 while sandwiching it.

[0043] The nozzle moving device 32 moves the nozzle 27. In the embodiment, the nozzle moving device 32 moves the nozzle 27 in each of the Z-axis direction and the θZ direction. The nozzle moving device 32 is supported by the mounting head 28. The nozzle 27 is connected to the lower end of a shaft 27A. A plurality of shafts 27A are provided. The plurality of nozzles 27 are connected to respective ones of the plurality of shafts 27A. A plurality of nozzle moving devices 32 are provided. The plurality of nozzle moving devices 32 are connected to respective ones of the plurality of shafts 27A. The nozzle 27 is supported by the mounting head 28 via the shaft 27A and the nozzle moving device 32. The nozzle moving device 32 moves the nozzle 27 by moving the shaft 27A in the Z-axis direction and the θZ direction.

[0044] The nozzle 27 is movable in each of the X-axis direction, the Y-axis direction, the Z-axis direction, and the θZ direction by the head moving device 31 and the nozzle moving device 32. When the nozzle 27 moves, the component 2 held by the nozzle 27 is also movable in each of the X-axis direction, the Y-axis direction, the Z-axis direction, and the θZ direction.

[0045] The substrate camera 29 images the substrate 1. In the embodiment, the substrate camera 29 images the surface of the substrate 1 from the +Z side of the substrate 1. The substrate camera 29 is provided on the mounting head 28. The substrate camera 29 moves together with the mounting head 28 in the X-axis direction and the Y-axis direction. The substrate camera 29 can image, for example, the alignment marks provided on the surface of the substrate 1.

[0046] The height sensor 30 detects the height indicating the position in the Z-axis direction of the surface of the substrate 1. The height sensor 30 is provided on the mounting head 28. The height sensor 30 moves together with the mounting head 28 in the X-axis direction and the Y-axis direction. In the embodiment, the height sensor 30 is a laser displacement sensor. The height sensor 30 irradiates the surface of the substrate 1 with laser light from the +Z side of the substrate 1 and receives the laser light reflected by the surface of the substrate 1, thereby detecting the distance from the mounting head 28 to the substrate 1. By detecting the distance from the mounting head 28 to the substrate 1, the height of the surface of the substrate 1 is detected.

[0047] The chamber 33 has an internal space in which the base member 22, the transfer device 23, the stage 24, the stage moving device 25, the component supply device 26, the mounting head 28, the head moving device 31, and the nozzle moving device 32 are respectively accommodated.

[0048] The opening / closing cover 34 opens and closes the opening provided in the upper part of the chamber 33. The opening / closing cover 34 is rotatably supported on at least a part of the chamber 33 via a hinge.

[0049] The window 35 is provided on the opening / closing cover 34. The window 35 is substantially transparent. An operator can visually recognize the state of the internal space of the chamber 33 through the window 35.

[0050] The display device 36 is provided on the outer surface of the chamber 33. The display device 36 displays display data. As the display device 36, a flat panel display such as a liquid crystal display or an organic EL display is exemplified.

[0051] The input device 37 generates input data when operated by an operator. Examples of the input device 37 include a touch sensor, a computer keyboard, or a mouse. In the embodiment, the display device 36 is a touch screen including a touch sensor. The input device 37 includes the touch screen of the display device 36.

[0052] In the embodiment, the mounting device 12 has a dispenser 38 that applies cream solder to the substrate 1. The dispenser 38 moves in the X-axis direction, Y-axis direction, and Z-axis direction on the +Z side of the transfer device 23. The dispenser 38 and the mounting head 28 are movable separately. After the cream solder is applied to the surface of the substrate 1 by the dispenser 38, the component 2 is mounted on the substrate 1 by the mounting head 28. The substrate 1 on which the component 2 is mounted by the mounting device 12 is conveyed to the preheating device 13 while being fixed to the pallet 3.

[0053] FIG. 12 is a diagram schematically showing each of the preheating device 13 and the laser irradiation device 14 according to the embodiment.

[0054] The preheating device 13 reduces the liquid component of the cream solder applied to the substrate 1. The cream solder includes a flux and solder balls made of metal dispersed in the flux. The preheating device 13 reduces the liquid component of the cream solder by vaporizing at least a part of the liquid component along with the activation of the flux. The preheating device 13 includes a base member 39, a transfer device 40 that transfers the pallet 3, a heater 41 that heats the substrate 1, and a chamber 42.

[0055] The base member 39 supports the transfer device 40. The transfer device 40 transfers the pallet 3 supporting the substrate 1 in the X-axis direction. The transfer device 40 has a transfer belt 40A that transfers the pallet 3 and a guide member 40B that guides the pallet 3.

[0056] The heater 41 heats the substrate 1 so that at least a part of the liquid component of the flux of the cream solder is vaporized.

[0057] The chamber 42 has an internal space in which the base member 39, the transfer device 40, and the heater 41 are respectively accommodated.

[0058] The preheating device 13 heats the substrate 1 supported by the pallet 3 so that the liquid component of the cream solder decreases. The preheating device 13 heats the substrate 1 at a temperature lower than the melting point of the cream solder. The preheating device 13 heats the substrate 1 at a temperature of, for example, 80°C or higher and 100°C or lower for 10 minutes. The substrate 1 preheated by the preheating device 13 is transferred to the laser irradiation device 14 while being fixed to the pallet 3.

[0059] The laser irradiation device 14 irradiates the cream solder with laser light so that the cream solder melts. The laser irradiation device 14 performs the soldering operation of the component 2 by melting the solder and solidifying it as it cools. The laser irradiation device 14 includes a base member 43, a transfer device 44 that transfers the pallet 3, a stage 45 that supports the pallet 3, a stage moving device 46 that moves the stage 45 in the Y-axis direction, Z-axis direction, θX direction, and θY direction, a laser head 47 that emits laser light, a chamber 48, an opening / closing cover 49 (see FIG. 4), and a window 50 (see FIG. 4). The laser irradiation device 14 includes a control device 64B (see FIG. 4) that controls each part of the laser irradiation device 14.

[0060] The base member 43 supports the transfer device 44, the stage 45, the stage moving device 46, and the laser head 47 respectively. The transfer device 44 transfers the pallet 3 supporting the substrate 1 in the X-axis direction. The transfer device 44 has a transfer belt 44A that transfers the pallet 3 and a guide member 44B that guides the pallet 3. The structure and function of the transfer device 44 are substantially the same as the structure and function of the transfer device 23.

[0061] The stage 45 supports the pallet 3 from the -Z side. The stage moving device 46 moves the stage 45 in the Y-axis direction, Z-axis direction, θX direction, and θY direction respectively. The structure and function of the stage 45 are substantially the same as the structure and function of the stage 24.

[0062] The laser head 47 irradiates the cream solder with laser light to melt the cream solder. The laser head 47 moves in the X-axis direction, Y-axis direction, and Z-axis direction on the +Z side of the transfer device 44.

[0063] The chamber 48 has an internal space in which the base member 43, the transfer device 44, the stage 45, the stage moving device 46, and the laser head 47 are respectively accommodated.

[0064] The opening / closing cover 49 opens and closes an opening provided in the upper part of the chamber 48. The opening / closing cover 49 is rotatably supported on at least a part of the chamber 48 via a hinge.

[0065] The window 50 is provided on the opening / closing cover 49. The window 50 reduces the amount of light transmitted. An operator can visually recognize the state of the internal space of the chamber 48 through the window 50. Since the window 50 has a light reduction function and an anti-glare function, it prevents the operator's eyes from being damaged by the reflection of the laser light.

[0066] In the laser irradiation device 14, the laser light emitted from the laser head 47 is irradiated onto the cream solder. The cream solder is heated by the laser light, and the solder ball melts. The melted solder is cooled and solidified, whereby the component 2 is soldered to the substrate 1. In the embodiment, after the liquid component of the cream solder is reduced in the preheating device 13, the cream solder is irradiated with laser light. Since the cream solder is irradiated with laser light in a state where the liquid component of the cream solder is reduced, the sudden boiling of the cream solder is suppressed.

[0067] The inspection device 15 includes a substrate appearance inspection device (AOI: Automated Optical Inspection) that inspects the state of the substrate 1 after the component 2 is mounted.

[0068] The mounting device 12 is provided with a reading device 102. The preheating device 13 is provided with a reading device 103. The laser irradiation device 14 is provided with a reading device 104. The reading device 102 reads the substrate data held in the information medium 80. When the information medium 80 is a two-dimensional code, the reading device 102 is a two-dimensional code reader. When the information medium 80 is an RF tag, the reading device 102 is an RFID reader. Similar to the reading device 102, each of the reading device 103 and the reading device 104 reads the substrate data held in the information medium 80. Although not shown, the inspection device 15 is also provided with a reading device that reads the substrate data held in the information medium 80. In the embodiment, the reading devices 102, 103, and 104 may not be provided. The substrate data may be stored in the storage units provided in each of the mounting device 12, the preheating device 13, and the laser irradiation device 14. The mounting device 12, the preheating device 13, and the laser irradiation device 14 can acquire the substrate data from the management device 16 via a network. The substrate data may be stored in another storage device on the network accessible by the mounting device 12, the preheating device 13, the laser irradiation device 14, and the management device 16 so that each device can read the substrate data.

[0069] [Configuration related to control of substrate working device] FIG. 13 is a diagram schematically showing a configuration related to the control of the substrate working device 10 according to the embodiment. As described above, in the example of FIG. 4, the mounting device 12 and the laser irradiation device 14 are an example of the substrate working device 10 according to the embodiment. FIG. 13 generally shows the configuration of the substrate working device 10 commonly provided in the mounting device 12 and the laser irradiation device 14. That is, the substrate working device 10 includes a stage 61, a working unit 62, a transfer device 63, and a control device 64.

[0070] The stage 61 supports the substrate 1 and can perform a tilting operation. The stage 61 is a general term for the stage 24 of the mounting device 12 and the stage 45 of the laser irradiation device 14. As described above, the stage 24 tilts by the stage moving device 25. The stage 45 tilts by the stage moving device 46.

[0071] The working unit 62 performs operations on a plurality of working points Pp (see FIG. 15) of the substrate 1 supported by the stage 61. The working point Pp is a point (position) where an operation is performed by the substrate working apparatus 10, and is specified by the position coordinates set on the surface (mounting surface) of the substrate 1. The working unit 62 is composed of one or a plurality of apparatuses for performing operations on the working point Pp. The mounting apparatus 12 includes, as the working unit 62, a mounting head 28 for mounting the component 2 on the working point Pp. Further, the mounting apparatus 12 includes, as the working unit 62, a dispenser 38 for applying solder (cream solder) to the working point Pp. The laser irradiation apparatus 14 includes, as the working unit 62, a laser head 47 for performing laser irradiation on the solder applied to the working point Pp.

[0072] The transfer device 63 receives the substrate 1 from outside the substrate working apparatus 10 and transfers it to the stage 61. The transfer device 63 is a general term for the transfer device 23 of the mounting apparatus 12 and the transfer device 44 of the laser irradiation apparatus 14.

[0073] The control device 64 controls the operations of each part of the substrate working apparatus 10. The control device 64 is a general term for the control device 64A of the mounting apparatus 12 and the control device 64B of the laser irradiation apparatus 14. The control device 64 includes a data acquisition unit 65, a setting unit 66, a control unit 67, and a storage unit 68.

[0074] FIG. 14 is a diagram for explaining the hardware configuration of the control device 64 of the substrate working apparatus 10. The control device 64 is configured by a computer system. The control device 64 includes at least one processor 51, a main memory 52, a storage 53, and an interface 54. The processor 51 is a CPU. The main memory 52 includes a non-volatile memory such as a ROM and a volatile memory such as a RAM. Examples of the storage 53 include a hard disk drive and a solid state drive. The interface 54 includes an input / output circuit. The functions of the processor 51 are stored in the storage 53 as a program. The processor 51 reads the program from the storage 53 and expands it in the main memory 52, and executes processing according to the program. The program causes the processor 51 to function as a data acquisition unit 65, a setting unit 66, and a control unit 67. The storage unit 68 of the substrate working apparatus 10 is configured by the storage 53.

[0075] The data acquisition unit 65 acquires the angular value data 71 of the stage 61 for each working point Pp set on the substrate 1. Further, the data acquisition unit 65 acquires the component data 72 that defines the component 2 mounted on the working point Pp. The angular value data 71 is data that specifies the tilt angle of the stage 61 when the working unit 62 performs work on a certain working point Pp. For one working point Pp, one angular value is specified. The specified angular value is usually the tilt angle of the stage 61 when the plane including the working point Pp becomes horizontal (parallel to the XY plane). The component data 72 includes information such as the type, model number, dimensions, etc. of the component 2 mounted on the working point Pp. These angular value data 71 and component data 72 are included in the substrate data 70 of the substrate 1 and are managed by the management device 16. The substrate data 70 is, for example, the Gerber data of the film 1B or is created based on the Gerber data. In the embodiment, the data acquisition unit 65 acquires the substrate data 70 from the management device 16 through communication via the interface 54. By acquiring the substrate data 70, the data acquisition unit 65 acquires the angular value data 71 and the component data 72. The data acquisition unit 65 stores the acquired substrate data 70 (including the angular value data 71 and the component data 72) in the storage unit 68.

[0076] The setting unit 66 performs a process of grouping a plurality of working points Pp set on the substrate 1 according to a predetermined rule and setting a working tilt angle 74 (see FIG. 20) for each group 73 (see FIG. 18). The setting unit 66 generates grouping data 77 in which each group 73 is associated with the working tilt angle 74 of that group 73 and stores it in the storage unit 68. The grouping and the setting of the working tilt angle 74 will be described later.

[0077] The control unit 67 controls the operations of each part of the substrate working device 10. In the embodiment, the control unit 67 controls the working unit 62 and the stage 61 so as to perform operations on the working point Pp at the working inclination angle 74 for each group 73. That is, the control unit 67 executes operations on the working points Pp belonging to the same group 73 with the stage 61 arranged at the same working inclination angle 74 based on the grouped data 77. The control unit 67 controls the working unit 62 so as to execute operations on each working point Pp in units of groups. Therefore, in the embodiment, each working point Pp set on the substrate 1 is not necessarily worked at the inclination angle specified by the angle value data 71, and may be worked at an inclination angle (working inclination angle 74) different from the inclination angle specified by the angle value data 71. In other words, the substrate working device 10 may perform an operation by the working unit 62 with the surface including the working point Pp inclined with respect to the horizontal plane for a certain working point Pp.

[0078] [Working point] FIGS. 15 and 16 are diagrams for explaining the working point Pp according to the embodiment. In FIG. 15, for the sake of explanation, the declination angles θ and φ are exaggeratedly depicted. The substrate data 70 includes the working points Pp(xp, yp, zp) on the surface of the substrate 1 and the rotation angles (θxp, θyp) for making the surface of the substrate 1 horizontal at the working point Pp, and further design data such as the surface data of the surface of the substrate 1 and the texture data of the circuit pattern on the surface data. The data of the rotation angles (θxp, θyp) corresponds to the angle value data 71.

[0079] The design data of the substrate 1 includes a plurality of working points Pp0(xp0, yp0, zp0) respectively set for a plurality of electrodes 1C in the planar film 1B. By collating the design data with the measurement data obtained by measuring the substrate 1 by a three-dimensional measuring device (not shown) by the management device 16, the working point Pp corresponding to the working point Pp0 of the design data is obtained.

[0080] The substrate data 70 is represented in a substrate coordinate system (Xp, Yp, Zp) with the substrate coordinate reference point Pr fixed to the substrate 1 or the pallet 3 as the origin. In the embodiment, the substrate coordinate reference point Pr is set at the center of the back surface of the substrate 1. In addition to the above, the substrate data includes the component numbers to be mounted, the land positions where the cream solder is applied, the preheating temperature, the preheating time, the laser power, the laser irradiation time, etc., and is used in each device of the production line 17.

[0081] The stage 61 (stage 24, stage 45) can rotate in the θX and θY directions respectively around the rotation axis Rm. The stage 61 supports the substrate 1 via the pallet 3. When the stage 61 rotates in the θX and θY directions around the rotation axis Rm and the substrate 1 tilts, the working point Pp rotates around the rotation axis Rm. Although the rotation axis Rm is represented as a point in FIG. 15, the rotation axes may be set separately in the θX and θY directions respectively.

[0082] The machine coordinate system (Xm, Ym, Zm) is a coordinate system fixed to the mounting device 12 and serves as a reference when the working unit 62 (mounting head 28, dispenser 38, laser head 47) moves. The origin of the machine coordinate system can be anywhere on the mounting device 12. When the stage 24 rotates in the θX and θY directions around the rotation axis Rm and the substrate 1 tilts, the working point Pp rotates around the rotation axis Rm. In each substrate working device 10, the control unit 67 calculates the working point Pm (xm, ym, zm) (not shown) in the machine coordinate system of the rotated working point Pp. The control unit 67 moves the working unit 62 using this working point Pm (xm, ym, zm). The working point Pm (xm, ym, zm) in the machine coordinate system and the rotation angle of the stage 24 are stored in the storage unit 68 as NC data and used as the command position of the drive system motor during the operation of the substrate working device 10.

[0083] [Grouping] FIG. 17 is a graph showing an example of the distribution 75 of the number of work points with respect to the angle values of each work point Pp. FIG. 18 is a graph showing a first example of grouping of the work points Pp. FIG. 19 is a graph showing a second example of grouping of the work points Pp. The graphs shown in FIGS. 17 to 19 are frequency distributions with the vertical axis representing the number of work points and the horizontal axis representing the angle values of the inclination angles specified by the angle value data 71. That is, the graph classifies all the work points Pp on the substrate 1 for each section of the inclination angle of the stage 61 and shows the number of work points Pp belonging to each section. For convenience of explanation, the inclination angle of the stage 61 is divided into sections in units of 1 degree, but it may be further subdivided, for example, in units of 0.1 degree. The inclination angle of 0 degrees is the angle at which the upper surface of the stage 61 is horizontal (parallel to the XY plane). Here, only one of the θX and θY directions is considered.

[0084] In the embodiment, the setting unit 66 groups a plurality of work points Pp into one or more groups 73 among the work points Pp whose angle value data 71 is included within the allowable angle range 76, and sets the same work inclination angle 74 for the work points Pp belonging to the same group 73.

[0085] First, as shown in FIG. 17, the setting unit 66 obtains the distribution 75 of the number of work points with respect to the angle values from the angle value data 71 for each work point Pp. The setting unit 66 obtains the distribution 75 based on the angle value data 71 included in the substrate data 70 acquired by the data acquisition unit 65. In the curved surface-shaped substrate 1 as shown in FIG. 15, there are work points Pp with various angle values. It can be seen from the distribution 75 that there are angle values with a large number of work points and angle values with a small number of work points.

[0086] As shown in FIGS. 18 and 19, the setting unit 66 groups working points whose angle value data 71 is included within the allowable angle range 76. The allowable angle range 76 is the range of allowable angular deviation when performing work on the working point Pp. For example, for a working point Pp whose angle value is specified as +3 degrees, the stage 61 is tilted by +3 degrees to become horizontal, which is most preferable from the viewpoint of working accuracy. The allowable angle range 76 is information that defines up to how many degrees of tilt is allowed to perform work with respect to this horizontal angle value. The allowable angle range 76 is set as an initial value to a predetermined range determined by, for example, experiments or analysis. Further, the control device 64 can change the setting of the allowable angle range 76, for example, by receiving an operation input from the user.

[0087] The setting unit 66 includes working points included within the allowable angle range 76 in the same group 73. The setting unit 66 assigns a working point Pp outside the allowable angle range 76 to another group 73.

[0088] In the embodiment, the setting unit 66 groups the working points Pp with different allowable angle ranges 76 according to the work executed by the working unit 62. In the embodiment, a first allowable angle range 76A, a second allowable angle range 76B, and a third allowable angle range 76C are set for the respective works of the mounting head 28, the dispenser 38, and the laser head 47 as the working unit 62. In the embodiment, the first allowable angle range 76A used for grouping the work by the mounting head 28 is smaller than the second allowable angle range 76B used for grouping the work by the dispenser 38 and the third allowable angle range 76C used for grouping the work by the laser head 47.

[0089] FIG. 18 shows an example of grouping by the second allowable angle range 76B and the third allowable angle range 76C. Here, an example where the second allowable angle range 76B and the third allowable angle range 76C are equal is shown. The second allowable angle range 76B and the third allowable angle range 76C may be different. In the example of FIG. 18, the second allowable angle range 76B and the third allowable angle range 76C are set to 5 degrees (that is, divided into 5 sections in 1-degree units). FIG. 19 shows an example of grouping by the first allowable angle range 76A. In the example of FIG. 19, the first allowable angle range 76A is set to 4 degrees (divided into 4 sections in 1-degree units). Therefore, the allowable deviation of the angle value in the mounting operation of the component 2 by the mounting head 28 is set smaller than the allowable deviation in the operations of applying cream solder and soldering.

[0090] Next, a specific method of grouping will be described. The setting unit 66 preferentially includes in the same group 73 the group of work points Pp that form the peak K of the number of work points in the distribution 75. That is, as shown in FIG. 17, in the distribution 75, a peak K of the number of work points can be formed at a certain angle value. The setting unit 66 sets the first group 73A so as to include this peak K. In the example of FIG. 18, the setting unit 66 preferentially sets the group 73A from 0 degrees to +4 degrees including the peak K with an angle value of +3 degrees, the group 73A from +7 degrees to +11 degrees including the peak K with an angle value of +9 degrees, and the group 73A from -5 degrees to -9 degrees including the two peak Ks with angle values of -6 degrees and -8 degrees. The setting unit 66 performs grouping so as to include the peak K at the center of the allowable angle range 76. In other words, the setting unit 66 performs grouping so as to include the peak K other than both ends of the allowable angle range 76. In FIGS. 18 and 19, for convenience of explanation, the group 73A and the other groups 73B are shown shaded.

[0091] After setting the first group 73A including the peak K, the setting unit 66 sets a second group 73B that does not include the peak K for the working point Pp belonging to the division of the remaining angular values. The setting unit 66 sets the group 73B so as to equally divide the angular range within the allowable angular range 76. In the example of FIG. 18, the ranges of angular values from -1 degree to -4 degrees, from +5 degrees to +6 degrees, and from +12 degrees to +15 degrees (4 divisions) fall within the range of the second allowable angular range 76B (the third allowable angular range 76C), so the setting unit 66 sets each range as one group 73B. On the other hand, the range of angular values from -10 degrees to -15 degrees (6 divisions) does not fall within 5 degrees (5 divisions) of the second allowable angular range 76B (the third allowable angular range 76C), so the setting unit 66 divides the group into a 3-division group 73B from -10 degrees to -12 degrees and a 3-division group 73B from -13 degrees to -15 degrees so as to equally divide. For the example shown in FIG. 19, grouping is performed in the same manner except that the size of the allowable angular range 76 is different.

[0092] [Working Inclination Angle] For each group 73 (group 73A, group 73B) set as described above, the setting unit 66 sets the working inclination angle 74 one by one. For the group 73A including the peak K of the number of working points, the setting unit 66 sets the angular value that becomes the peak K of the number of working points as the working inclination angle 74. In the example of FIG. 18, for the group 73A including the peak K with an angular value of +3 degrees, the setting unit 66 sets the working inclination angle 74 to +3 degrees. For the group 73A including the peak K with an angular value of +9 degrees, the setting unit 66 sets the working inclination angle 74 to +9 degrees. When a plurality of peaks K are included in one group 73A, the angular value of any one of the peaks K may be set as the working inclination angle 74. In the embodiment, the setting unit 66 sets the angular value of the peak K with the maximum number of working points among the plurality of peaks K as the working inclination angle 74. Therefore, in the example of FIG. 18, for the group 73A including the peaks K with angular values of -6 degrees and -8 degrees, the setting unit 66 sets the working inclination angle 74 to -8 degrees.

[0093] In each group 73A, for each working point Pp belonging to the angular value of peak K, since the inclination angle specified by the angular value data 71 and the working inclination angle 74 are the same angle, the work by the working unit 62 is executed in a horizontal state (parallel to the XY plane). Since each group 73A includes peak K at the center of the angular range, for the working points Pp belonging to angular values deviated from the angular value of peak K, the deviation amount of the angular value is also reduced.

[0094] For the group 73B that does not include peak K of the number of working points, the setting unit 66 sets the intermediate value of the angular range of that group 73B as the working inclination angle 74. Although illustration is omitted, in the example of FIG. 18, for the group 73B from -1 degree to -4 degrees, the setting unit 66 sets the working inclination angle 74 to, for example, -3 degrees. For the group 73B from +12 degrees to +15 degrees, the setting unit 66 sets the working inclination angle 74 to, for example, +13 degrees. For the group 73B from -10 degrees to -12 degrees, the setting unit 66 sets the working inclination angle 74 to, for example, -11 degrees. For the group 73B from -13 degrees to -15 degrees, the setting unit 66 sets the working inclination angle 74 to, for example, -14 degrees.

[0095] [Specific working point] In the embodiment, an exception to the grouping can be set. As shown in FIG. 17, the setting unit 66 extracts a specific working point SP that is not a target for grouping from among the plurality of working points Pp. Then, for the specific working point SP, the setting unit 66 sets the inclination angle of the stage 61 based on the angular value data 71 preset for the specific working point SP. That is, the work for the specific working point SP is executed in a horizontal state (parallel to the XY plane) at the inclination angle specified by the angular value data 71 instead of the working inclination angle 74. For example, in FIG. 17, for the specific working point SP where the component 2 named "XXX" is mounted, the mounting is performed at -2 degrees specified by the angular value data 71. For the specific working point SP where the component 2 named "YYY" is mounted, the mounting is performed at +1 degree specified by the angular value data 71.

[0096] In an embodiment, the specific working point SP is a working point Pp on which a predetermined type of component 2 is mounted in advance. The setting unit 66 refers to the component data 72 included in the board data 70, extracts the working point Pp on which the predetermined type of component 2 is mounted, and sets the extracted working point Pp as the specific working point SP.

[0097] The predetermined type of component 2 is, for example, an electronic component with high importance on the mounting board, an electronic component that is likely to cause mounting defects, etc. The predetermined type of component 2 is, for example, an IC (Integrated Circuit) component. The predetermined type of component 2 is, for example, an IC component of a type in which the solder connection part (tip part) of the leads extends horizontally, such as a QFP (Quad Flat Package) or an SOP (Small Outline Package). Compared with discrete components, such IC components have a longer application area of cream solder and a larger area for one pad (working point Pp). When the board 1 is tilted during each operation of applying cream solder, mounting components, and soldering, the application state of cream solder within one pad may vary, gaps are likely to occur between the solder connection part of the leads and the solder on the pad, and the amount of energy applied by laser irradiation is likely to vary depending on the part of the application area. This possibility increases as the application area becomes larger. Therefore, by setting the working point Pp on which the predetermined type of component 2 with a large application area is mounted as the specific working point SP, for the specific working point SP, the work is performed in a state where the board 1 is not tilted, regardless of the grouping result or the angle value of the working tilt angle 74.

[0098] The setting unit 66 extracts IC components from the component data 72, excludes the working point Pp for mounting the IC components from the target of grouping, and sets it as the specific working point SP. In addition to automatically extracting the specific working point SP, the setting unit 66 may accept a designation of the specific working point SP from the user. In this case, the setting unit 66 sets a specific working point Pp included in the board data 70 as the specific working point SP based on an operation input from the user.

[0099] [Grouping data] FIG. 20 is a diagram for explaining grouped data 77 generated by grouping. The setting unit 66 generates grouped data 77 as shown in FIG. 20 by performing grouping, setting the working tilt angle 74, and setting the specific working point SP as described above. The grouped data 77 includes group information 78 that designates, for each individual group 73 (group 73A, group 73B), the working point Pp belonging to that group 73 and the working tilt angle 74 for that group 73. Further, the grouped data 77 includes information on the specific working point SP that does not belong to any group 73. The setting unit 66 stores the generated grouped data 77 in the storage unit 68.

[0100] The above grouping, setting of the working tilt angle 74, setting of the specific working point SP, and generation of the grouped data 77 are each performed as preparatory work before production start in the control device 64 of each substrate working device 10. The control device 64 of the mounting device 12 generates grouped data 77 for mounting work by the mounting head 28 grouped within the first allowable angle range 76A and grouped data 77 for solder application work by the dispenser 38 grouped within the second allowable angle range 76B, respectively. Further, the control device 64 of the laser irradiation device 14 generates grouped data 77 for soldering work by the laser head 47 grouped within the third allowable angle range 76C.

[0101] [Method for manufacturing a mounted substrate] FIG. 21 is a flowchart showing a method for manufacturing a mounted substrate according to an embodiment. The method for manufacturing a mounted substrate according to the embodiment is a method for manufacturing a mounted substrate in which electronic components are mounted on a substrate 1, and includes a step S1 of acquiring angle value data 71 (substrate data 70) for each working point Pp, a step S2 of grouping a plurality of working points Pp into one or more groups 73, a step S3 of setting a working tilt angle 74 for each group 73, and steps (S4, S5, S7) of performing work at the working tilt angle 74 for each group 73 by the substrate working device 10.

[0102] Steps S1 to S3 are carried out as a preparation stage before the start of the implementation work on the implementation substrate. First, in each substrate working device 10, the data acquisition unit 65 acquires substrate data 70 from the management device 16 (step S1). Thereby, the data acquisition unit 65 of each substrate working device 10 acquires angle value data 71 and component data 72 for each working point Pp of a plurality of working points Pp of the substrate 1 that is the object of the work by the substrate working device 10.

[0103] In each substrate working device 10, the setting unit 66 groups a plurality of working points Pp into one or a plurality of groups 73 with working points Pp whose angle value data 71 is included within the allowable angle range 76 (step S2). FIG. 22 is a flowchart showing the flow of the grouping process.

[0104] In the grouping process of step S2, as shown in FIG. 17, the setting unit 66 acquires the distribution 75 of the number of working points with respect to the angle value from the angle value data 71 for each working point Pp (step S10). The setting unit 66 extracts a specific working point SP that is not the object of grouping from among the plurality of working points Pp based on the component data 72 for each working point Pp (step S11). The setting unit 66 excludes the extracted specific working point SP from the subsequent grouping process. The setting unit 66 sets a first group 73A including the peak K within the allowable angle range 76 from the distribution 75 of the number of working points with respect to the angle value, as shown in FIGS. 18 and 19 (step S12). By the process of step S12, the setting unit 66 preferentially includes in the same group 73A the group of working points Pp that form the peak K of the number of working points in the distribution 75. Note that the setting unit 66 of each substrate working device 10 performs grouping using the allowable angle range 76 (the first allowable angle range 76A, the second allowable angle range 76B, or the third allowable angle range 76C) corresponding to the work executed by the working unit 62.

[0105] The setting unit 66 sets a second group 73B that does not include the peak K within the allowable angle range 76 for the work point groups not included in the group 73A among the distributions 75 (step S13). The setting unit 66 sets the second group 73B by equally dividing the angle range not set for the group 73A among the distributions 75 so as to fall within the allowable angle range 76. Thereby, the setting unit 66 groups all the work points Pp excluding the specific work point SP among the distributions 75 of the number of work points so as to be included in any of the groups 73. Thus, the grouping in step S2 is performed.

[0106] As shown in FIG. 21, for each group 73 set in step S2, the setting unit 66 sets a work tilt angle 74 respectively. Thereby, the setting unit 66 sets the same work tilt angle 74 for the work points Pp belonging to the same group 73. As a result of steps S1 to S3, the setting unit 66 of each substrate mounting device 10 generates the grouped data 77 shown in FIG. 20 and stores it in the storage unit 68.

[0107] After step S3, the mounting operation of the substrate 1 by the production line 17 is started. The substrate 1 is fixed to the pallet 3. The substrate data 70 is held in the information medium 80. When the information medium 80 is a two-dimensional code, the two-dimensional code indicating the substrate data is attached to the pallet 3. Only the identification number may be recorded on the information medium 80 held by the pallet 3, and the substrate data 70 stored in the management device 16 may be referred to.

[0108] The pallet 3 with the information medium 80 attached is transported to the mounting device 12 while supporting the substrate 1. The reading device 102 reads the information medium 80 attached to the pallet 3. The control unit 67 of the mounting device 12 (control device 64A) controls the dispenser 38 which is the working unit 62 and the stage 24 (stage moving device 25) so as to perform the solder application work for each group 73 based on the grouped data 77 for the solder application work stored in the storage unit 68 (step S4).

[0109] Specifically, the control unit 67 of the control device 64A selects one group 73 defined in the grouped data 77 and controls the posture of the stage 24 so as to be the working tilt angle 74 of the selected group 73. With the stage 24 set to the working tilt angle 74, the control unit 67 controls the dispenser 38 to apply cream solder to each working point Pp belonging to the selected group 73. The dispenser 38 applies cream solder to the pad position of the working point Pp. When the work for all the working points Pp belonging to the selected group 73 is completed, the control unit 67 selects the next group 73 included in the grouped data 77, controls the posture of the stage 24 so as to be the working tilt angle 74 of the selected group 73, and then performs the solder application work for that group 73. For a specific working point SP, the control unit 67 controls the posture of the stage 24 so as to be the tilt angle specified by the angle value data 71 of the substrate data 70, and controls the dispenser 38 to perform the solder application work for the specific working point SP. In this way, the control unit 67 controls the operations of the working unit 62 (dispenser 38) and the stage 24 so that for each group 73, work is performed at the same working tilt angle 74 for the working points Pp belonging to the same group 73.

[0110] After cream solder is applied to the substrate 1, the control unit 67 of the mounting device 12 (control device 64A) controls the mounting head 28, which is the working unit 62, and the stage 24 (stage moving device 25) to perform component mounting for each group 73 based on the grouped data 77 for component mounting work stored in the storage unit 68 (step S5).

[0111] Specifically, the control unit 67 of the control device 64A selects one group 73 defined in the grouped data 77 and controls the posture of the stage 24 so that the working tilt angle 74 of the selected group 73 is achieved. With the stage 24 set to the working tilt angle 74, the control unit 67 controls the mounting head 28 to perform component mounting operations on each working point Pp belonging to the selected group 73. The mounting head 28 mounts the component 2 on the working point Pp of the substrate 1. The mounting head 28 positions the terminal portion of the component 2 at the location where the cream solder is applied. When the operations for all the working points Pp belonging to the selected group 73 are completed, the control unit 67 selects the next group 73 included in the grouped data 77, controls the posture of the stage 24 so that the working tilt angle 74 of the selected group 73 is achieved, and then performs the component mounting operations for that group 73. For a specific working point SP, the control unit 67 controls the posture of the stage 24 so that the tilt angle specified by the angle value data 71 of the substrate data 70 is achieved, and controls the mounting head 28 to perform the component mounting operation for that specific working point SP. In this way, the control unit 67 controls the operations of the working unit 62 (mounting head 28) and the stage 24 so that for each group 73, operations are performed at the same working tilt angle 74 for the working points Pp belonging to the same group 73.

[0112] Note that for the application of cream solder and the mounting of components, the cream solder can be applied to all locations first and then the component mounting can be carried out collectively, or the application of cream solder and the mounting of components can be repeated for each component. That is, for a certain group 73, after performing the solder application operation and the component mounting operation, the solder application operation and the component mounting operation can be performed for the next group 73 in this procedure. The operation for the specific working point SP can be performed at any timing, either at the beginning, end, or during the operations for one group 73 and another group 73, of the series of operations.

[0113] After the component 2 is mounted on the substrate 1, the pallet 3 is conveyed to the preheating device 13 while supporting the substrate 1. The reading device 103 reads the information medium 80 attached to the pallet 3. The preheating device 13 preheats the cream solder applied to the substrate 1 based on the preheating temperature and preheating time of the substrate data read by the reading device 103 from the information medium 80 (step S6).

[0114] After the cream solder is preheated, the pallet 3 is conveyed to the laser irradiation device 14 while supporting the substrate 1. The reading device 104 reads the information medium 80 attached to the pallet 3. The control unit 67 of the laser irradiation device 14 (control device 64B) controls the laser head 47, which is the working unit 62, and the stage 45 (stage moving device 46) so as to perform soldering work for each group 73 based on the grouped data 77 for soldering work stored in the storage unit 68 (step S7).

[0115] Specifically, the control unit 67 of the control device 64B selects one group 73 defined in the grouped data 77 and controls the posture of the stage 45 to be the working tilt angle 74 of the selected group 73. With the stage 45 at the working tilt angle 74, the control unit 67 controls the laser head 47 to perform soldering operations on each working point Pp belonging to the selected group 73. The laser head 47 solders the component 2 to the substrate 1 by irradiating the laser light onto the application location of the cream solder at the working point Pp of the substrate 1. When the operations for all the working points Pp belonging to the selected group 73 are completed, the control unit 67 selects the next group 73 included in the grouped data 77, controls the posture of the stage 45 to be the working tilt angle 74 of the selected group 73, and then performs the soldering operation for that group 73. For a specific working point SP, the control unit 67 controls the posture of the stage 45 to be the tilt angle specified by the angle value data 71 of the substrate data 70 and controls the laser head 47 to perform the soldering operation for the specific working point SP. In this way, the control unit 67 controls the operations of the working unit 62 (laser head 47) and the stage 45 so that for each group 73, operations are performed at the same working tilt angle 74 for the working points Pp belonging to the same group 73.

[0116] After the component 2 is soldered to the substrate 1, the pallet 3 is conveyed to the inspection device 15 while supporting the substrate 1. The reading device provided in the inspection device 15 reads the information medium 80 attached to the pallet 3. The inspection device 15 inspects the substrate 1 based on the substrate data read by the reading device of the inspection device 15 from the information medium 80 (step S8).

[0117] [Effect] As described above, according to the present embodiment, a plurality of working points Pp are grouped into one or more groups 73 among the working points Pp whose angular value data 71 is included within the allowable angle range 76, and the same working tilt angle 74 is set for the working points Pp belonging to the same group 73. For each group 73, the work on the working point Pp can be carried out at the working tilt angle 74. Thereby, the frequency of changing the tilt angle of the stage 61 (stage 24, stage 45) during the work on the working point Pp can be reduced. For example, in the example of FIG. 18, when performing work on the working points Pp belonging to the group 73A including five sections from 0 degrees to +4 degrees, at least five angle adjustments are required to set each tilt angle from 0 degrees to +4 degrees. On the other hand, in the present embodiment, since the work can be carried out with only one angle adjustment to set the working tilt angle 74 set for the group 73A, the occurrence of the waiting time for the movement of the stage can be effectively suppressed. And in the present embodiment, since the grouping is performed within the allowable angle range 76, the deviation between the tilt angle specified by the angular value data 71 and the working tilt angle 74 can be suppressed. As a result, it is possible to suppress a decrease in work quality caused by performing work with the surface including the working point Pp inclined. By these, in the present embodiment, it is possible to achieve both an improvement in work efficiency and a suppression of a decrease in work quality in the work related to component mounting on a three-dimensional substrate.

[0118] In the present embodiment, a group of working points Pp that forms the peak K of the number of working points in the distribution 75 is preferentially included in the same group 73. Thereby, the work can be carried out by grouping the tilt angles with a large number of working points into one working tilt angle 74. And in the present embodiment, for the group 73 including the peak K of the number of working points, the angular value that becomes the peak K of the number of working points is set as the working tilt angle 74. Thereby, for the working point Pp having the highest ratio within the group 73, the work can be carried out at a normal tilt angle at which the surface including the working point Pp becomes horizontal (parallel to the XY plane), so that it is possible to effectively suppress a decrease in work quality.

[0119] In this embodiment, for a specific working point SP, the inclination angle of the stage 61 (stage 24, stage 45) is set based on the angle value data 71 preset for the specific working point SP. Thereby, by designating the specific working point SP, the working point Pp can be worked at the normal inclination angle designated by the angle value data 71. As a result, while improving the working efficiency, high working quality at the specific working point SP can be ensured. In this embodiment, the specific working point SP is a working point Pp on which a preset predetermined type of component is mounted. Thereby, by setting the working point Pp on which the component 2 that is likely to cause mounting defects is mounted or the working point Pp on which an important component for which a high-quality mounting state is desired is mounted as the specific working point SP, the occurrence of mounting defects can be effectively suppressed.

[0120] In this embodiment, the setting unit 66 groups the working points Pp within different allowable angle ranges 76 according to the work executed by the working unit 62. Thereby, an appropriate allowable angle range 76 that can effectively suppress a decrease in working quality can be set according to the work content. In this embodiment, the first allowable angle range 76A used for grouping the work by the mounting head 28 is smaller than the second allowable angle range 76B used for grouping the work by the dispenser 38 and the third allowable angle range 76C used for grouping the work by the laser head 47. Thereby, for the component mounting work by the mounting head 28 that requires higher precision compared to the solder application work and the soldering work, the deviation between the inclination angle designated by the angle value data 71 and the working inclination angle 74 can be effectively suppressed. As a result, while improving the working efficiency, a decrease in the working quality of component mounting can be effectively suppressed.

[0121] [Other Embodiments] The embodiments of the present application have been described above, but the present invention is not limited by the contents of these embodiments. The above-described embodiments and modifications can be appropriately combined as long as the processing contents do not conflict. In addition, the above-described components include those that can be easily assumed by those skilled in the art, those that are substantially the same, and those within the so-called equivalent range. Furthermore, the above-described components can be appropriately combined. Furthermore, various omissions, substitutions, or changes of the components can be made without departing from the gist of the above-described embodiments.

[0122] For example, in the above embodiment, an example is shown in which the setting unit 66 is provided in the control device 64 of each substrate working device 10 to perform the grouping process, but the setting unit 66 may be provided in the management device 16 to perform the grouping process.

[0123] Also, in the grouping, it is not necessary to set the specific work point SP. In the grouping, it is not necessary to preferentially group the group of work points Pp that form the peak K. Regardless of the angular value of the peak K, the grouping may be performed by a method of evenly dividing the distribution 75 of the number of work points with respect to the angular value within the allowable angular range 76.

[0124] Also, as an example of the working unit 62, the dispenser 38, the mounting head 28, and the laser head 47 are shown, but the working unit 62 is not limited to these. As long as the working unit 62 performs work related to the production of the mounting substrate for each work point Pp of the substrate 1, any work may be performed. Although an example is shown in which the mounting apparatus 12 includes the dispenser 38 and the mounting head 28, as the substrate working apparatus 10, a mounting apparatus 12 including the mounting head 28 and a solder application apparatus including the dispenser 38 may be provided separately. The number of working units 62 provided in the substrate working apparatus 10 may be one or more.

[0125] In the above embodiment, an example is shown in which the production line 17 of the mounting substrate including a plurality of substrate working apparatuses 10 is constructed, but the substrate working apparatus 10 may be installed and used as a single apparatus without being incorporated into the production line 17.

[0126] Moreover, each component of each illustrated device is functionally conceptual and does not necessarily have to be physically configured as shown in the figure. That is, the specific form of the distribution and integration of each device is not limited to that shown in the figure, and all or part of it can be functionally or physically distributed and integrated in any unit according to various loads, usage situations, etc. Further, the above-described management device 16 and control device 64 may be configured by a plurality of computers divided into several functions, and some functions of the computers may be possessed by a cloud server that executes various functions in the form of cloud computing.

Explanation of Signs

[0127] 1... Substrate, 1B... Film, 1A... Base material, 1C... Electrode, 2... Component, 3... Pallet, 4... Support member, 4A... Base part, 4B... Guard part, 4C... Pin part, 4D... Hole, 5... Clamping mechanism, 5B... Movable part, 5A... Support part, 10... Substrate working device, 12... Mounting device, 13... Preheating device, 14... Laser irradiation device, 15... Inspection device, 16... Management device, 17... Production line, 22... Base member, 23... Conveyor, 23A... Conveyor belt, 23B... Guide member, 24... Stage, 24A... Positioning member, 25... Stage moving device, 26... Component supply device, 27... Nozzle, 27A... Shaft, 28... Mounting head, 29... Substrate camera, 30... Height sensor, 31... Head moving device, 31X... X-axis moving device, 31Y... Y-axis moving device, 32... Nozzle moving device, 33... Chamber, 34... Opening / closing cover, 35... Window, 36... Display device, 37... Input device, 38... Dispenser, 39... Base member, 40... Conveyor, 40A... Conveyor belt, 40B... Guide member, 41... Heater, 42... Chamber, 43... Base member, 44... Conveyor, 44A... Conveyor belt, 44B... Guide member, 45... Stage, 46... Stage moving device, 47... Laser head, 48... Chamber, 49... Opening / closing cover, 50... Window, 51... Processor, 52... Main memory, 53... Storage, 54... Interface, 61... Stage, 62... Working part, 63... Conveyor, 64, 64A, 64B... Control device, 65... Data acquisition part, 66... Setting part, 67... Control part, 68... Memory part, 70... Substrate data, 71... Angle value data, 72... Component data, 73, 73A, 73B... Group, 74... Working tilt angle, 75... Distribution, 76... Allowable angle range, 76A... First allowable angle range, 76B... Second allowable angle range, 76C... Third allowable angle range, 77... Grouping data, 78... Group information, 80... Information medium, 102... Reading device, 103... Reading device, 104... Reading device, K... Peak, Pm, Pp, Pp0... Working point, Pr... Substrate coordinate reference point, Rm... Rotation axis, SP... Specific working point, θ, φ... Deflection angle.

Claims

1. A substrate working device for performing operations related to component mounting on a three-dimensional substrate, comprising: a stage that supports the three-dimensional substrate and is capable of tilting; a working unit that performs operations on a plurality of working points of the three-dimensional substrate supported by the stage; a data acquisition unit that acquires angle value data of the stage for each of the working points; a setting unit that groups the plurality of working points into one or more groups among the working points whose angle value data is within an allowable angle range, and sets the same working tilt angle for the working points belonging to the same group; a control unit that controls the working unit and the stage so as to perform operations on the working points at the working tilt angle for each group. A substrate working device.

2. The setting unit: acquires the distribution of the number of working points with respect to the angle value from the angle value data for each of the working points; preferably includes, in the same group, the group of working points that form a peak in the number of working points in the distribution. The substrate working device according to Claim 1.

3. For the group including the peak in the number of working points, the setting unit sets the angle value that is the peak in the number of working points as the working tilt angle. The substrate working device according to Claim 2.

4. The setting unit extracts specific working points that are not subject to the grouping from among the plurality of working points, and for the specific working points, sets the tilt angle of the stage based on the angle value data preset for the specific working points. The substrate working device according to any one of Claims 1 to 3.

5. The data acquisition unit acquires component data that defines the components mounted on the working points. The specific working points are the working points on which a predetermined type of component is mounted in advance. The substrate working device according to Claim 4.

6. The setting unit groups the working points within different allowable angle ranges according to the operations performed by the working unit. The substrate working device according to any one of Claims 1 to 3.

7. The working unit includes at least one of a dispenser that applies solder to the working points, a mounting head that mounts components on the working points, and a laser head that performs laser irradiation on the solder applied to the working points. The first allowable angle range used for grouping operations by the mounting head is smaller than the second allowable angle range used for grouping operations by the dispenser and the third allowable angle range used for grouping operations by the laser head. The substrate working apparatus according to claim 6.

8. A method for manufacturing a mounting substrate in which electronic components are mounted on a three-dimensional substrate, a step of acquiring angle value data for each of a plurality of working points of the three-dimensional substrate that are the targets of operations by the substrate working apparatus; a step of grouping the plurality of working points into one or more groups with respect to the working points whose angle value data is included within the allowable angle range; a step of setting the same working tilt angle for the working points belonging to the same group for each group; a step of performing operations at the same working tilt angle for the working points belonging to the same group for each group by the substrate working apparatus. A method for manufacturing a mounting substrate.

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