Multi-chamber assembly for handling removable epitaxial reaction unit

Abstract

To provide a multi-chamber assembly.SOLUTION: The present invention relates to a multi-chamber assembly for the handling and storage of removable reaction units for preventive maintenance operations, where said reaction units are used in reactors for the epitaxial deposition of semiconductor films on substrates. The present invention further relates to a reactor assembly integrating an epitaxial reactor for the deposition of semiconductor films on substrates, and the multi-chamber assembly hereinbefore described.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to the field of preventive maintenance operations for a removable reaction section for depositing a semiconductor film on a substrate in an epitaxial reactor.

[0002] The present invention further relates to the field of a multi-chamber assembly for handling and adjusting a removable reaction section when used in a reactor for epitaxial deposition of a semiconductor film on a substrate, particularly during preventive maintenance operations.

[0003] The present invention further relates to a multi-chamber assembly for handling and adjusting both a removable reaction section and a substrate holder used in an epitaxial reactor.

Background Art

[0004] Epitaxial growth apparatuses for the semiconductor industry may include a reactor that houses a reaction / deposition chamber in which a chemical vapor deposition process occurs. As a result of this process, some parts of the chamber are subject to the accumulation of unwanted products and need to be cleaned or replaced after several deposition cycles to avoid affecting the quality and performance of the epitaxial deposition.

[0005] Consequently, the consumable parts within the reaction chamber, as well as the walls and parts that make up the reaction chamber itself, require preventive maintenance (PM) operations that necessarily involve periodically entering the chamber for removal, cleaning, or replacement of the chamber and its relevant parts and components.

[0006] These operations significantly affect the downtime and throughput of the reactor. They are particularly problematic in hot-wall reactors for SiC deposition, and maintenance operations can occur more than once a week and cause interruptions lasting several hours.

[0007] Generally, the removal, cleaning, and replacement of the corresponding part of the reaction chamber are mainly carried out manually and are time-consuming processes.

[0008] Overall, the process requires complete cooling and purging of the reactor, undesirable exposure to air, and one or more operators present simultaneously.

[0009] The best scenario where the reaction chamber is of the removable type is that the entire reaction chamber can be withdrawn from the reactor via mechanical means. However, in this type of system, the reaction part, i.e., the narrow enclosed space (or working area) where the epitaxial deposition process takes place, cannot be easily separated from the bulky reaction chamber and is thus, for most purposes, not individually handleable and movable and is considered to be integrated with the reaction chamber.

[0010] For example, the reaction chambers described in European Patent Application Publication No. 1570107 and US Patent Application Publication No. 2022411961 are formed by an assembly of several elements creating an inner housing, and the working area that cannot be removed from the rest of the other sensitive elements is integrally provided on its own.

[0011] The above-described process of removing the entire reaction chamber has several drawbacks. That is, access to the chamber is not or cannot be automated, requires the implementation of special and time-consuming EHS (Environment Health Safety) procedures, the reactor is exposed to air, and the movement (and handling) of the reaction chamber is cumbersome and requires manual labor.

[0012] It should also be noted that in some of the latest generation of reactors, the handling of the substrate holder is automated, enabling the movement of the substrate holder between the reactor and a third chamber and appropriately adjusting the substrate before entering the chamber to minimize exposure to air.

[0013] Therefore, it is desirable to devise a chamber assembly for the insertion and replacement process of the reaction part of the reaction chamber into a suitable sealed space for purge / adjustment operations from the reactor without exposing the reaction part to air and without accelerating the PM work.

[0014] Furthermore, it is desirable to provide an automated mechanical system configured to move the reaction part of the reaction chamber within the multi-chamber assembly to perform specific handling, adjustment, and / or purge operations and shorten the PM time. Also, it is desirable to provide a multi-chamber assembly adapted to cooperate with the automated handling of the substrate holder without interference if present.

[0015] Finally, it is desirable to provide a reactor assembly integrated with the chamber assembly in a fully automated manner to further shorten the PM downtime, reduce EHS concerns, and present a compact integrated solution.

SUMMARY OF THE INVENTION

PROBLEMS TO BE SOLVED BY THE INVENTION

[0016] An object of the present invention is to overcome the drawbacks of the prior art. More specifically, an object of the present invention is to provide a multi-chamber assembly for handling one or more removable reaction parts of an epitaxial reactor for depositing a semiconductor film on a substrate, preferably avoiding exposure to air.

[0017] A further object of the present invention is to provide a multi-chamber assembly capable of performing automated handling of both the removable reaction part and the substrate holder.

[0018] A further object of the present invention is to provide a multi-chamber assembly adapted to be connected to a reactor suitable for the deposition of Si, SiC, and GaN films on a semiconductor substrate having a reaction chamber with a removable reaction part.

[0019] A further object of the present invention is to provide a multi-chamber assembly suitable for performing automatic handling of a reaction part for preventive maintenance work with reduced downtime.

[0020] Another object of the present invention is to provide a reactor assembly integrated with a multi-chamber assembly for handling a reaction part and a substrate holder in a fully automated manner, while providing a compact and integrated solution.

[0021] The above-described main object is achieved by the present invention described in the appended claims which form an essential part of this specification.

[0022] It should be noted that the use of reference signs in the claims does not limit their scope. The sole purpose of the reference signs is to make the claims easier to understand with reference to the drawings.

[0023] This summary is provided to introduce in a simplified form a selection of concepts. These concepts are further described in the detailed description of the exemplary embodiments of the following disclosure. This summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter.

Brief Description of the Drawings

[0024]

Figure 1

Figure 2

Figure 3

[0025] Of course, the elements in the figures are illustrated for simplicity and clarity and are not necessarily drawn to scale. For example, some of the dimensions of the elements in the figures may be omitted, or on the other hand, they may be exaggerated with respect to other elements to help deepen the understanding of the illustrated embodiments of the present disclosure.

Embodiments for Carrying Out the Invention

[0026] This application claims priority to Italian Patent Application No. 102024000009712, filed on April 30, 2024, the entire content of which is incorporated herein by reference. In particular, but not by way of limitation, the incorporation by reference is made with respect to claims 1 - 14, FIGS. 1 - 3, and the corresponding sections of the specification of Italian Patent Application No. 102024000009712.

[0027] This application also claims priority to Italian Patent Application No. 102023000024663, filed on November 21, 2023, the entire content of which is incorporated herein by reference. In particular, but not by way of limitation, the incorporation by reference is made with respect to claims 1 - 16, FIGS. 1 - 3, and the corresponding sections of the specification of Italian Patent Application No. 102023000024663.

[0028] Certain embodiments and examples are disclosed below, but it will be understood by those skilled in the art that the present invention extends beyond the specifically disclosed embodiments and / or uses of the present invention, as well as their obvious modifications and equivalents. Therefore, it is intended that the scope of the disclosed invention should not be limited by the specific disclosed embodiments described hereinafter.

[0029] Epitaxial reactors used in SiC deposition etc. are often formed by one or more structural elements assembled together to create a reaction chamber that defines at least one internal space or working area where actual deposition occurs. See, for example, European Patent Application Publication No. 1570107 and US Patent Application Publication No. 2022411961.

[0030] During PM work, in the reaction chambers such as those described in the above non - limiting examples provided for illustrative purposes only, it is usually not allowed to remove and handle a particular housing where deposition occurs. Bulky reaction chambers need to be removed integrally or entered internally to remove individual parts affected by unwanted deposits.

[0031] The applicant has devised an alternative reaction chamber design, in which the reaction and deposition processes take place within a removable type of reaction section that is surrounded by a working area, i.e., basically a hollow casing that can be integrally removed and is adapted to cooperate with an automated handler optionally provided with a specially designed end effector.

[0032] Therefore, such reaction sections are removable components of the reaction chamber of a reactor for the epitaxial deposition of semiconductor films on a substrate. The reaction sections are hereinafter identified as "removable reaction sections" or "reaction sections".

[0033] With this new design, it is not necessary to reach inside the reactor machine, or to move the entire bulky reaction chamber outside the reactor machine and enter into it and its components, which would cause exposure to unwanted air. Instead, the reaction section or its consumable parts can be easily removed and replaced.

[0034] The removable reaction part of the reaction chamber may be provided with engaging means such as indentations, protrusions, hooks, loops, or sliding parts that are mechanically coupled and adapted to cooperate with the end effector of an electromechanical system or an automatic handling machine so as to be automatically handled.

[0035] According to a first aspect, the present invention relates to a multi-chamber assembly for handling one or more removable reaction parts of an epitaxial reactor for depositing a semiconductor film on a substrate.

[0036] The multi-chamber assembly comprises at least two chambers, a first chamber and a second chamber, and at least one transfer device for communicating the first chamber and the second chamber with each other.

[0037] In particular, the first chamber, which may also be referred to as a "transfer chamber", comprises at least one opening adapted to transfer the reaction part from / to the reaction chamber of the reactor. The first chamber may advantageously be connected to the reactor directly or via a sealed space.

[0038] The opening may advantageously be closable, sealable, and / or lockable in order to be able to separate the first chamber from the reactor, in particular to prevent gas leakage and / or withstand the differential pressure between the two. For example, a gate valve may be provided at the opening. The first chamber may optionally be connected to a system for generating a vacuum and to a system for flowing and delivering gases.

[0039] The second chamber is designed to store and / or handle one or more removable reaction parts for PM and extraction. This can also be referred to as the "unit handling chamber". This chamber is provided with a resealable access part suitable for the removal and insertion of reaction parts by an operator or an automatic system. The removable reaction parts may be subject to routine PM work after removal or disposable at the end of their life.

[0040] Advantageously, the second chamber may be adapted to receive or send out removable reaction parts from / to the first chamber through a transfer device by an electromechanical system or a manually actuated mechanical device.

[0041] Due to its storage capacity, the second chamber enables the replacement of reaction parts for PM work in a more efficient way. The second chamber may optionally be adjusted, as discussed below, to further prepare the reaction parts for entry into the reactor for PM or for operation.

[0042] From the above, it can be inferred that the term "chamber" refers to a housing that encloses a cavity and is provided with an optionally sealable opening / aperture.

[0043] The multi-chamber assembly described above enables the handling of removable reaction parts of an epitaxial reactor without exposing them to air. This can significantly reduce the PM maintenance time.

[0044] Furthermore, the multi-chamber assembly described above positively impacts the process efficiency as it enables the automatic handling of reaction parts for preventive maintenance work.

[0045] It should be understood that the reaction section is the operating region of a reactor suitable for the epitaxial deposition of a semiconductor film on a substrate. The substrate may be positioned on a substrate holder and placed in the receiving region of the reaction section. The substrate holder is a device that supports the substrate.

[0046] According to a preferred embodiment, the multi-chamber assembly according to the present invention may include an electromechanical system comprising at least one inter-chamber actuator. The actuator can be configured to grip and move a removable reaction section from a first chamber through a transfer device to a second chamber and / or vice versa.

[0047] The term "actuator" means a device or part of a machine that enables the achievement of physical movement and can be used to convert electrical, mechanical, gas, or hydraulic inputs into linear or rotational movement or both into a continuous combination thereof.

[0048] The above electromechanical system enables the movement of the reaction section within the multi-chamber assembly without the need for the physical action or presence of an operator. This can optionally be remotely controlled using digital processing means via a cable or wirelessly, such as via a computer.

[0049] In a non-limiting example, the electromechanical system may comprise a linear actuator provided with an end effector. The end effector can be adapted to mechanically couple with a removable reaction section, grip it, and move it by moving it from an extended position to a retracted position and vice versa.

[0050] The end effector can be a gripper such as a rod, plunger, fork, shovel, or a combination thereof.

[0051] To withstand the weight of the reaction section, the end effector may be a metallic material or a ceramic material such as aluminum (in the form of oxide or nitride), silicon carbide, or titanium, stainless steel, and alloys thereof.

[0052] According to another embodiment, the transfer device comprises at least one transfer opening that puts the first chamber in communication with the second chamber. The transfer device may further comprise one transfer gate valve adapted to open and close the transfer opening. It should be understood that the transfer opening should be designed to allow passage of the reaction section alone and / or, if present, to be coupled to the electromechanical system.

[0053] The first chamber and the second chamber may be separated by a partition shared by both chambers, and the transfer opening may be a through hole of appropriate size formed in the partition.

[0054] Alternatively, the two chambers may not be integrated and may be installed adjacent to each other (e.g., overlapping or adjacent). In this case, the transfer opening can be a through hole that directly connects them to each other across two adjacent walls of the chambers.

[0055] Generally, regardless of the fact that the first chamber and the second chamber may be adjacent to each other and / or integrated, or separated by other elements as discussed below, one may be installed on top of the other, i.e., stacked vertically. This reduces the installation area of the transfer device and advantageously provides a compact solution.

[0056] According to different embodiments, the transfer device comprises (i) an interspace formed between the first chamber and the second chamber, (ii) at least one first transfer opening connecting the interspace to the first chamber, and (iii) at least one second transfer opening connecting the interspace to the second chamber.

[0057] As used herein, the term "space" refers to an enclosed space that separates a first chamber and a second chamber. In a non-limiting example, two walls of a housing may coincide with the walls of the opposing first and second chambers.

[0058] The first opening and the second opening are facing each other such that a removable reaction part can move between the first chamber and the second chamber through both the facing first and second openings and a portion of the space therebetween.

[0059] The adjectives "first" and "second" applied to the transfer openings simply mean to distinguish the opening formed on the side facing the first chamber from the opening on the side facing the second chamber, and do not imply any other limitation of their quantity, order, or position.

[0060] The transfer device further comprises at least one transfer gate valve adapted to seal the first transfer opening and / or the second transfer opening.

[0061] Advantageously, each of the first opening and the second opening may comprise a gate valve, and the gate valves are identified as the first transfer gate valve and the second transfer gate valve, respectively (and thus according to the side they face). The transfer device may further comprise at least one automatic double-sealing system adapted to operate the first transfer gate valve and the second transfer gate valve independently of each other.

[0062] This design, in particular for two chambers, prevents the second chamber and the first chamber from contaminating each other when they are at different pressures and / or when certain gas species are flowing. For this effect, it may be particularly advantageous to use a double-valve system comprising a first transfer gate valve and a second transfer gate valve that open and close the first opening and the second opening individually.

[0063] According to one embodiment of the present invention, the second chamber is provided with at least one shelf adapted to support one or more removable reaction parts. The second chamber may further comprise a single-chamber automatic system configured to move at least one removable reaction part within the second chamber through an optionally resealable access part. The resealable access part connects the second chamber to the external area around the reactor. The operator may receive the reaction part through the resealable access part to clean or discard parasitic deposits in the unit or its consumable parts.

[0064] By using one or more, preferably 1 to 10 shelves, the second chamber can store multiple reaction parts. For example, some shelves may be used to store reaction parts for PM, and other shelves may store adjusted units ready for use to immediately replace units removed for PM. For this effect, the shelves may be arranged at different heights according to their purposes. Each shelf may store two or more, preferably 1 to 10 shelves.

[0065] The single-chamber automatic system may comprise one or more actuators suitable for moving one or more reaction parts within the second chamber and installing them on or removing them from the shelf. Also, this system may enable the reaction part to be moved to / from each shelf and outside the multi-chamber assembly. Furthermore, these actuators may advantageously be adapted to collect the reaction part from the electromechanical system when entering the second chamber and positioning the reaction part on the shelf.

[0066] Thus, the reaction part may be transported from the shelf of the second chamber to the first chamber or vice versa. The first chamber may also comprise one or more shelves, and similar to the second chamber, its own single-chamber automatic system can be provided.

[0067] The actuators of the single-chamber automatic system may optionally be provided with end effectors suitable for mechanically coupling to the reaction section, regardless of the chamber in which they are used.

[0068] Of course, each shelf and actuator may be integrated with or incorporated into each other.

[0069] Note that the reaction section may typically have a weight of 2 to 15 kg, preferably 2 to 10 kg, and even more preferably 2.5 to 6 kg.

[0070] The reaction section may have a rectangular cross-section of 200 to 400 mm × 30 to 50 mm and extend 200 to 500 mm in the longitudinal direction, showing an overall box-like shape.

[0071] Therefore, the shelf should be configured to support the reaction section having the above sizes and weights.

[0072] Both the actuator of the single-chamber automatic system and the between-chamber actuator should be adapted to handle the reaction section having the above sizes and weights.

[0073] Both the actuator of the single-chamber automatic system and the between-chamber actuator may be designed to move their objects in a horizontal plane (parallel to the floor supporting the conveyor) or in a vertical direction perpendicular to the horizontal plane, depending on the mutual arrangement of the chamber and the shelf.

[0074] In one embodiment, the multi-chamber assembly according to the present invention comprises a heating system configured to heat the second chamber to a temperature of 150 to 500 °C. For example, the heating system may be an electric resistance heating system.

[0075] The multi-chamber assembly may further comprise at least one vacuum system configured to create a vacuum of less than 10 millibar in the second chamber. The vacuum system may also be configured to create a vacuum of less than 1 millibar, or more preferably less than 10 -3 millibar in the second chamber.

[0076] The second chamber may further be provided with at least one gas inlet and at least one gas outlet. The inlet and outlet allow a suitable gas, such as a purge gas, to flow through the second chamber and the reaction part stored therein. The gas inlet and gas outlet shall each be connected to a suitable gas circuit.

[0077] Any equipment of the second chamber discussed here, such as a heating system, a vacuum system, and / or a gas inlet and a gas outlet, can be advantageously used to adjust the reaction part.

[0078] When using the term "adjust", it means various operations or cycles suitable for preparing the reaction part or sub-part / device before insertion into the reactor. Further or alternatively, the adjustment operations or cycles can be adapted to be accessible by an operator or machine to the reaction part and removable from the assembly for safe removal or cleaning of the part.

[0079] For example, it is possible to create a vacuum of less than 10 millibar in the second chamber and perform a refill under an inert gas such as argon, nitrogen, helium, or xenon before removing the reaction part. In addition to or instead of the inert gas refill, an inert gas purge may be performed on the reaction part, and the preferred inert gas is argon.

[0080] An alternative conditioning cycle suitable for being carried out on a new / clean reaction section prior to insertion in the reactor may include the step of heating the second chamber to a temperature of 150 to 500 °C and performing vacuum degassing (in this case, the vacuum should preferably be less than 1 millibar, even more preferably less than 10 -3 millibar).

[0081] According to yet another embodiment, the multi-chamber assembly according to the present invention further comprises a third chamber installed to communicate with the first chamber through a substrate transfer opening.

[0082] The third chamber is adapted to receive or send out a substrate from the first chamber through the substrate transfer opening via electric means or manual means.

[0083] The first chamber may optionally be provided with a gate valve adapted to seal the substrate transfer opening. This may further include one or more substrate holder shelves.

[0084] The first chamber may further be provided with a substrate holder opening adapted to receive a substrate holder from or vice versa to the reaction section in the reactor. This chamber may be provided with one or more shelves and automatic means for properly handling and storing the substrate holder.

[0085] It should be understood that the substrate holder is a device adapted to hold one or more semiconductor substrates on which epitaxial film deposition occurs.

[0086] The first chamber, the second chamber, and the third chamber may each be connected to the same or different vacuum systems.

[0087] In particular, the third chamber may be a load lock chamber. This may be connected to a heating and / or cooling system and may be adapted to condition the substrate before use or removal. Of course, the third chamber may further be provided with an opening, a gate valve, and any automated system for handling the substrate holder or substrate and, optionally, for sealing the third chamber. Handling may include any displacement into or abutting the first or third chamber and / or reaching the inside of the reactor and / or the outer peripheral region of the multi-chamber assembly opened to the atmosphere.

[0088] The substrate handling automated system may comprise an end effector adapted to mechanically couple to the substrate holder. These may advantageously be made of silicon carbide, borosilicate glass, sapphire glass, or quartz in order to avoid contamination of the substrate.

[0089] The multi-chamber assembly with a third chamber enables handling both of the substrate holder and the removable reaction part of the reaction chamber, thereby providing a unique and compact solution with good space efficiency. When an automated system is used, the solution according to the invention does not require the presence and / or manual labor of an operator on site.

[0090] It should be understood that in the above embodiments, the handling of the substrate holder and the reaction part should be arranged so that they do not interfere with each other.

[0091] In a second aspect, the invention relates to a reactor assembly for moving and handling a reaction part for preventive maintenance operations of a reactor.

[0092] The reactor assembly includes, but is not limited to, (i) a reactor for epitaxial deposition of a semiconductor film on a substrate, comprising a reaction chamber having a reaction part integrally removable from a susceptor casing, (ii) a multi-chamber assembly according to any of the above-described embodiments, and (iii) an automatic handling machine for handling the removable reaction part.

[0093] The automatic handling machine is provided with a selective handling assembly including a first end effector and a second end effector that respectively engage with the removable reaction part and the substrate holder so as not to interfere with each other.

[0094] Specifically, the first end effector is configured to mechanically couple with the removable reaction part and move it along the longitudinal direction (x), while the second end effector is adapted to mechanically couple with the substrate holder and move it along the longitudinal direction.

[0095] For example, the first end effector and / or the second end effector can be grippers such as rods, plungers, forks, shovels, or combinations thereof.

[0096] To withstand the weight of the reaction part, the first end effector may be made of a metal material or a ceramic material such as aluminum or silicon carbide in oxide or nitride form, or titanium, stainless steel, and alloys thereof. The second end effector can be made from silicon carbide, borosilicate glass, sapphire glass, or quartz to avoid contamination of the substrate.

[0097] Furthermore, the selective handling assembly includes at least a first actuator adapted to move the first end effector and the second end effector longitudinally from an extended position to a retracted position and vice versa.

[0098] The first end effector is designed to withdraw or insert a removable reaction part from or into the reactor. Advantageously, the first actuator is movable between the reaction chamber in the reactor and the multi-chamber assembly, preferably corresponding to the first chamber, and even more preferably corresponding to the opening of the reaction part.

[0099] The second end effector is adapted to withdraw or insert the substrate holder from or into the removable reaction part, especially when the reaction part is positioned within the reactor chamber inside the reactor.

[0100] The presence of the reactor assembly integrating the multi-chamber assembly and the epitaxial reactor prevents the exposure of the reaction part to air during withdrawal / insertion into the reactor, and the presence of the automatic handling means provides a fully automated process that can reduce the reactor downtime by up to 70%.

[0101] The reactor may be suitable for the epitaxial deposition of semiconductor films on a substrate, preferably Si, SiC, or GaN. In a non-limiting example, the reactor may be a hot-wall cross-flow reactor.

[0102] The reactor preferably features one or more insulating components and may be equipped with an insulation system that forms a housing for the reaction chamber. The reactor may also include a liner suitable for directing the process gas at the reaction part and connected to it by releasable coupling means.

[0103] The reactor may be protected by an enclosure such as a double-wall quartz tube that allows the flow of a cooling fluid in the space between its two walls. Other elements typically used in a reactor as described above can be present and are assumed to be present as would be apparent to those skilled in the art.

[0104] One or more induction coils may be located outside the reactor to directly or indirectly heat the susceptor casing or reaction chamber and, in turn, the reaction part enclosed therein.

[0105] Description of the Drawings The examples presented herein are not meant to be the actual representation of any particular material, structure, or device, but are merely idealized representations used to describe embodiments of the present disclosure. Specifically, they are not intended to limit the scope of the aspects and implementations in any way. In fact, for the sake of brevity, conventional manufacturing, related, preparation, and other functional aspects of the system may not be described in detail. Further, the connecting lines shown in the various figures are intended to represent exemplary functional relationships and / or physical connections between the various elements. Many alternative or additional functional relationships, or physical connections, may exist in the actual system and / or may not exist in some embodiments.

[0106] FIG. 1 schematically shows an open view of one embodiment of a multi-chamber assembly (10) according to the present invention. The multi-chamber assembly is suitable for handling and storing a removable deposition part (1000). The removable deposition part is designed to be integrally withdrawn from an epitaxial reactor for the deposition of a semiconductor film on a substrate.

[0107] The multi-chamber assembly includes a first chamber (100), a second chamber (200), and a transfer device (400).

[0108] The first chamber is characterized by an opening (110) distinguishable as an "opening of the transfer part" connected or connectable to the reactor. The opening may be provided with a gate valve and is suitable for receiving the reaction part from / to the reaction chamber of the reactor.

[0109] A transport device (400) is connected to the first chamber. In this case, the transport device is integrated within the first chamber, specifically at one of its walls. In the present embodiment, the transport device is an opening that enables the first chamber to communicate with the second chamber. This opening, which enables displacement of the reaction part between the first chamber and the second chamber, is thus specified as the "transport opening". This opening may be opened and closed by a gate valve (not shown) specified as a "transport gate valve".

[0110] The second chamber (200) is designed to store and adjust the reaction part. This chamber includes a resealable access part (210) suitable for removal and insertion of the reaction part by an operator or an automatic system.

[0111] The multi-chamber assembly comprises an electromechanical system (500) including an inter-chamber actuator adapted to grip and move a removable reaction part from the first chamber to the second chamber and / or vice versa through the transport device.

[0112] Two shelves (252, 254) capable of supporting the reaction part are provided in the second chamber. The single-chamber automatic system (550) is configured to move the reaction part within the second chamber, specifically to grip the reaction part from the electromechanical system and place it on the shelf or vice versa. The single-chamber automatic system is also designed to move the reaction part in and out of the resealable access part (210). This access part is set to communicate the second chamber with the external environment. Thereby, the operator can then handle, clean or discard the reaction part.

[0113] The single-chamber automatic system (550) comprises two actuators each coupled to one shelf.

[0114] The second chamber comprises a resistance heating system (700) configured to heat the second chamber to a temperature of 150 to 500 °C. The second chamber also comprises an inlet (202) and an outlet (204) for flowing a selected gas. Thus, the second chamber is suitable for conditioning the reaction section.

[0115] The first chamber also comprises one shelf (152) and a single-chamber automated system (555) configured to move the reaction section within the first chamber.

[0116] FIG. 2 schematically shows another embodiment of a multi-chamber assembly (10) according to the invention, adopting an open view similar to FIG. 1 and using the same numbers for identical or equivalent functional features.

[0117] This embodiment differs from that described in FIG. 1 in that the transport device (400) is a housing that defines an interspace (405) installed between the first chamber and the second chamber.

[0118] One “first transport opening” (450), i.e., an opening that faces the first chamber and is suitable for transporting the reaction section, connects the first chamber to the space.

[0119] One “second transport opening” (455), i.e., an opening that faces the second chamber and is suitable for transporting the reaction section, connects the space to the second chamber and faces directly the first transport opening. Since the first opening and the second opening face each other, it is possible to move the reaction section linearly through both openings without difficulty.

[0120] The transport device further comprises at least one transport gate valve (600) adapted to seal the first transport opening and the second transport opening. However, it is preferred to use one gate valve per transport opening and operate them independently of each other.

[0121] Figure 3 schematically shows another embodiment of the multi-chamber assembly (10) according to the present invention, employing an open view similar to FIGS. 1 and 2 and using the same numbers for identical or equivalent functional features.

[0122] In this embodiment, the multi-chamber assembly further comprises a third chamber (300) installed in communication with the first chamber (100) through a substrate transfer opening (310), which is adapted to pass through a substrate holder (and any automatic means configured to move the holder if present).

[0123] The third chamber, only partially shown here, is suitable for storing the substrate, and optionally adjusting and / or cooling it, before the substrate enters the reactor or after the deposition process.

[0124] Furthermore, the first chamber comprises two transfer section openings (110, 130). Each of these openings may be provided with a gate valve (not shown) and is suitable for receiving / sending the reaction section from / to the reaction chamber of the reactor. These can be connected or connectable to an epitaxial reactor.

[0125] The first chamber includes a substrate holder opening (120) adapted to move the substrate holder between the multi-chamber assembly and the reactor, or an additional enclosed area connected or connectable thereto.

[0126] The first chamber also includes two shelves (152, 154) for supporting the reaction section. This chamber includes an additional shelf substrate holder shelf (156) that allows the substrate holder to be placed before transporting the substrate holder to the reactor or the third chamber.

[0127] In this embodiment, the electromechanical system (500) comprises an actuator between two linear chambers.

[0128] As a result, the transfer device (400) comprises a space (405) installed between the first chamber and the second chamber, and two "first transfer openings" (450, 460) connecting the space to the first chamber. The transfer device also includes two "second transfer openings" (455, 465) connecting the space to the second chamber. The "first transfer openings" (450, 460) face the "second transfer openings" (455, 465).

[0129] In this case, each of the first opening and the second opening may comprise one "first transfer gate valve" (610, 620) and one "second transfer gate valve" (615, 625) for sealing each transfer opening individually and independently of each other. For this effect, preferably, at least one automatic double-sealing system adapted to operate these first transfer gate valves and second transfer gate valves independently of each other is implemented.

[0130] The subject matter of the present disclosure includes not only all novel and non-obvious combinations and sub-combinations of the various processes, systems, and configurations, as well as other features, functions, operations, and / or characteristics disclosed herein, but also any and all equivalents thereof.

[0131] In the specification and claims of this application, the word "comprise", and its variants such as "comprising" and "comprises", do not exclude the presence of other additional elements, components, or steps.

[0132] The discussion of documents, acts, materials, devices, articles, etc. is included in the text only for the purpose of providing a background to the present invention, but this material or a part thereof should not be understood as constituting general knowledge in the field of the present invention prior to the priority date of each of the claims appended to this application.

Claims

1. A multi-chamber assembly (10) for handling at least one removable reaction part (1000) of an epitaxial reactor, comprising: a first chamber (100) including at least one opening (110, 130) adapted to receive or deliver said reactant from or to said epitaxial reactor; a second chamber (200) for storing at least one removable reaction unit, the second chamber (200) being provided with a resealable access (210) suitable for removal and insertion of the reaction unit by an operator or an automated system; a transfer device (400) connecting the first chamber with the second chamber; A multi-chamber assembly, wherein the reactor is suitable for epitaxial deposition of a semiconductor film on a substrate.

2. 2. The multi-chamber assembly of claim 1, further comprising an electric mechanical system (500) including at least one inter-chamber actuator adapted to grasp and move the removable reaction part from the first chamber to the second chamber and / or from the second chamber to the first chamber through the transport device.

3. The multi-chamber assembly according to claim 1 or 2, wherein the transport device comprises at least one transport opening and at least one transport gate valve adapted to open and close the at least one transport opening.

4. The conveying device is an enclosed space (405) between the first chamber and the second chamber; at least one first transfer opening (450, 460) connecting said enclosed space with said first chamber; at least one second transfer opening (455, 465) connecting the enclosed space with the second chamber and facing the at least one first transfer opening; 3. The multi-chamber assembly according to claim 1 or 2, comprising: at least one transfer gate valve (600) adapted to seal the first transfer opening and / or the second transfer opening.

5. each of the at least one first transfer opening (450, 460) and the at least one second transfer opening (455, 465) includes a transfer gate valve (610, 620, 615, 625); The multi-chamber assembly of claim 4 , wherein the transfer apparatus comprises at least one automatic double seal system adapted to operate each transfer gate valve independently of each other.

6. the second chamber is provided with at least one shelf (252, 254) adapted to support at least one removable reaction portion; 3. The multi-chamber assembly of claim 1 or 2, wherein the second chamber further comprises a single-chamber automation system (550) configured to move at least one of the removable reaction parts within the second chamber.

7. The multi-chamber assembly of claim 1 or 2, further comprising a heating system (700) configured to heat the second chamber to a temperature of 150 to 500°C.

8. The multi-chamber assembly of claim 7 , wherein the heating system is an electrical resistance heating system.

9. The multi-chamber assembly of claim 1 or 2, further comprising a vacuum system configured to create a vacuum of less than 10 mbar in the second chamber.

10. The multi-chamber assembly of claim 9 , wherein the vacuum system is configured to create a vacuum of less than 1 millibar.

11. The multi-chamber assembly of claim 1 or 2, wherein the second chamber is further provided with at least one gas inlet (202) and at least one gas outlet (204).

12. The multi-chamber assembly of claim 2 , wherein the electromechanical system comprises a linear actuator provided with an end effector.

13. the first chamber comprises a substrate transfer opening (310) adapted to transfer a substrate holder supporting a substrate; The multi-chamber assembly further comprises a third chamber (300) disposed in communication with the first chamber through the substrate transfer opening; 3. The multi-chamber assembly of claim 1 or 2, wherein the third chamber is adapted to receive or deliver the substrate holder from the first chamber through the substrate transport opening via motorized or manual means.

14. A reactor assembly for moving and handling a reactor section for preventive maintenance operations, comprising: A reactor for epitaxial deposition of a semiconductor film on a substrate, the reactor comprising a reaction chamber having a reaction part integrally removable from a sensitive casing; A multi-chamber assembly (10) according to claim 1 or 2, and an automatic handling machine for handling the reaction unit, The reactor extends along a longitudinal direction (x), The automatic handling machine includes: a first end effector mechanically coupled to the reaction portion and adapted to displace the reaction portion along the longitudinal direction (x); a second end effector mechanically coupled to the substrate holder and adapted to displace the substrate holder along the longitudinal direction (x); the selective handling assembly comprising at least a first actuator adapted to displace the first end effector and the second end effector in the longitudinal direction from an extended position to a retracted position and from a retracted position to an extended position; the second end effector is adapted to withdraw or insert the substrate holder from or into the removable reaction portion; The first end effector is adapted to extract or insert the reaction portion from or into the reactor.

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