Multilayer electronic component

Abstract

To suppress a phenomenon that moisture resistance reliability of a multilayer electronic component is reduced by occurrence of floating in an end of a plating layer and on a surface of a body.SOLUTION: A multilayer electronic component includes a body 110 including a dielectric layer 111 and internal electrodes 121 and 122 alternately disposed with the dielectric layer in a first direction, and including first and second surfaces 1 and 2 opposing each other in the first direction, third and fourth surfaces connected with the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected with the first to fourth surfaces and opposing each other in a third direction; and external electrodes 131 and 141 including connection portions disposed on the third and fourth surfaces, respectively, and band portions extending from the respective connection portions onto a portion of the first surface and a portion of the second surface. The external electrodes each include an electrode layer 131, 141 connected to one of the internal electrodes, and a first plating layer 132, 142 disposed on the electrode layer, and a metal layer 151, 152 including a conductive metal and glass is interposed between the electrode layer and the body in the band portions.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to a multilayer electronic component.

Background Art

[0002] A multilayer ceramic capacitor (MLCC), which is one of multilayer electronic components, is a chip-type capacitor that is mounted on printed circuit boards of various electronic products such as video devices like liquid crystal display (LCD) devices and plasma display panel (PDP) panels, computers, smartphones and mobile phones, and information entertainment systems, and serves to charge or discharge electricity.

[0003] In order to prevent the penetration of moisture into the external electrodes, attempts have been made to form a separate plating layer disposed in contact with the body on the base electrode layer. However, there is a possibility that a floating may occur at the interface between the end of the plating layer and the surface of the body due to a difference in components, and thus it is impossible to prevent damage to the base electrode layer and the penetration of moisture into the body, which may cause a problem of a decrease in the moisture resistance reliability of the multilayer electronic component.

[0004] Therefore, there is a need for a structural improvement that can simultaneously prevent the penetration of moisture into the external electrodes and the penetration of moisture into the body.

Summary of the Invention

Problems to be Solved by the Invention

[0005] One of several objects of the present invention is to prevent a phenomenon in which floating occurs at the end of the plating layer and the surface of the body, resulting in a decrease in the moisture resistance reliability of the multilayer electronic component.

[0006] However, the object of the present invention is not limited to the above description, and can be more easily understood in the process of explaining specific embodiments of the present invention.

Means for Solving the Problem

[0007] A multilayer electronic component according to an embodiment of the present invention includes a dielectric layer and internal electrodes alternately arranged with the dielectric layer in a first direction, a first surface and a second surface facing each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and facing each other in a second direction, a fifth surface and a sixth surface connected to the first surface to the fourth surface and facing each other in a third direction, a main body, a connection portion disposed on the third surface and the fourth surface, and an external electrode including a band portion extending from the connection portion to a part of the first surface and the second surface. The external electrode includes an electrode layer connected to the internal electrode and a first plating layer disposed on the electrode layer. In the band portion, a metal layer including a conductive metal and glass can be disposed between the electrode layer and the main body.

Advantages of the Invention

[0008] One of the various advantages of the present invention is to prevent the occurrence of floating on the end portion of the external electrode and the surface of the main body by disposing a glass containing a conductive metal and glass between the electrode layer and the main body, thereby improving the moisture resistance reliability of the multilayer electronic component.

[0009] However, the various and beneficial advantages and effects of the present invention are not limited to the above-described content, and can be more easily understood in the process of describing the specific embodiments of the present invention.

Brief Description of the Drawings

[0010]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Embodiments for Carrying Out the Invention

[0011] Hereinafter, embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Also, the embodiments of the present invention are provided to more fully explain the present invention to ordinary technicians. Therefore, the shape, size, etc. of the elements in the drawings can be exaggerated for clearer explanation, and the elements indicated by the same reference numerals in the drawings are the same elements.

[0012] And, in order to clearly explain the present invention in the drawings, parts not related to the explanation are omitted, and the sizes and thicknesses of each configuration shown in the drawings are arbitrarily shown for convenience of explanation, so the present invention is not necessarily limited to what is shown in the drawings. Note that components having the same function within the scope of the same idea are described using the same reference numerals. Furthermore, throughout the specification, when a certain part says that a certain component "includes", this means that other components can be further included, rather than excluding other components, unless otherwise stated to the contrary.

[0013] FIG. 1 is a perspective view schematically showing a stacked electronic component according to an embodiment of the present invention, FIG. 2 is a cross-sectional view taken along the line I-I' of FIG. 1, FIG. 3 is a cross-sectional view corresponding to FIG. 2 of the stacked electronic component according to an embodiment, and FIG. 4 is an enlarged view of the A region of FIG. 2. FIG. 5 is a cross-sectional view taken along the line II-II' of FIG. 1, and FIG. 6 is an exploded perspective view showing the main body according to an embodiment disassembled.

[0014] In the figure, the first direction can be defined as the direction in which the first internal electrode and the second internal electrode are alternately arranged with the dielectric layer interposed therebetween or the thickness T direction, and among the second direction and the third direction which are perpendicular to the first direction, the second direction is the length L direction and the third direction is the width W direction.

[0015] Hereinafter, with reference to FIGS. 1 to 6, a multilayer electronic component according to an embodiment of the present invention and various examples thereof will be described in detail.

[0016] A multilayer electronic component according to an embodiment of the present invention includes a dielectric layer 111 and internal electrodes 121 and 122 alternately arranged with the dielectric layer in a first direction, a first surface 1 and a second surface 2 facing each other in the first direction, a third surface 3 and a fourth surface 4 connected to the first surface and the second surface and facing each other in a second direction, a fifth surface 5 and a sixth surface 6 connected to the first surface, the second surface, the third surface and the fourth surface and facing each other in a third direction, a main body 110, connection portions arranged on the third surface and the fourth surface, and external electrodes 130 and 140 including band portions extending from the connection portions to a part of the first surface and the second surface. The external electrodes include electrode layers 131 and 141 connected to the internal electrodes and first plating layers 132 and 142 arranged on the electrode layers. In the band portions, metal layers 151 and 152 including a conductive metal and glass can be arranged between the electrode layers and the main body.

[0017] Referring to FIG. 2, the main body 110 includes a dielectric layer 111 and internal electrodes 121 and 122 alternately arranged with the dielectric layer 111 in a first direction.

[0018] There is no particular limitation on the specific shape of the main body 110, but as shown in the figure, the main body 110 can be formed in a hexahedron shape or a shape similar thereto. Due to the shrinkage of the ceramic powder contained in the main body 110 during the firing process, the main body 110 does not have a perfect hexahedron shape with straight lines, but can have a substantially hexahedron shape.

[0019] The main body 110 can include a first surface 1 and a second surface 2 facing each other in a first direction, a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 2 and facing each other in a second direction, a fifth surface 5 and a sixth surface 6 connected to the first surface 1 and the second surface 2, connected to the third surface 3 and the fourth surface 4, and facing each other in a third direction.

[0020] The plurality of dielectric layers 111 forming the body 110 are in a fired state, and the boundary between adjacent dielectric layers 111 can be integrated to the extent that it is difficult to confirm without using a scanning electron microscope (SEM).

[0021] The raw material for forming the dielectric layer 111 is not particularly limited as long as sufficient capacitance can be obtained. For example, a barium titanate-based material, a lead composite perovskite-based material, a strontium titanate-based material, or the like can be used. The barium titanate-based material can contain BaTiO 3 -based ceramic powder. As an example of the ceramic powder, BaTiO 3 , BaTiO 3 in which Ca (calcium), Zr (zirconium), etc. are partially solid-solved (Ba 1-x Ca x )TiO 3 (0 < x < 1), Ba(Ti 1-y Ca y )O 3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O 3 (0 < x < 1, 0 < y < 1) or Ba(Ti 1-y Zr y )O 3 (0 < y < 1), etc. can be mentioned.

[0022] Also, various ceramic additives, organic solvents, binders, dispersants, etc. can be added to the raw material for forming the dielectric layer 111, such as powder of barium titanate (BaTiO 3 ), according to the purpose of the present invention.

[0023] The average thickness td of the dielectric layer 111 is not particularly limited.

[0024] When aiming for miniaturization and high capacitance of the multilayer electronic component 100, the average thickness td of the dielectric layer 111 may be 0.35 μm or less, and in order to improve the reliability of the multilayer electronic component 100 under high temperature and high pressure, the average thickness td of the dielectric layer 111 may be 3 μm or more.

[0025] The average thickness td of the dielectric layer 111 can be measured by scanning an image of a cross-section (L-T cross-section) in the third direction and the first direction of the main body 110 with a scanning electron microscope (SEM).

[0026] For example, the average thickness td of the dielectric layer 111 is extracted from the dielectric layers in the image scanned by a scanning electron microscope (SEM) of the length and the cross-section in the thickness direction (L-T) cut at the central portion in the width direction of the main body 110. Among the dielectric layers, with respect to one dielectric layer at the point where the center line in the length direction of the main body and the center line in the thickness direction meet as a reference, for a total of five dielectric layers of two upper layers and two lower layers, with the point where the center line in the length direction of the main body and the center line in the thickness direction meet as a reference, after determining five points of two points on the left side and two points on the right side at equal intervals around one reference point, the thickness at each point can be measured and the average value can be measured.

[0027] The internal electrodes 121 and 122 can play a role of forming capacitance together with the dielectric layer 111 by being alternately arranged with the dielectric layer 111 interposed therebetween.

[0028] The internal electrodes 121 and 122 can include a first internal electrode 121 and a second internal electrode 122. The first internal electrode 121 and the second internal electrode 122 are alternately arranged so as to face each other with the dielectric layer 111 constituting the main body 110 interposed therebetween, and can be connected to the third surface 3 and the fourth surface 4 of the main body 110 respectively. Specifically, one end of the first internal electrode 121 can be connected to the third surface, and one end of the second internal electrode 122 can be connected to the fourth surface.

[0029] As shown in FIG. 2, the first internal electrode 121 is spaced apart from the fourth surface 4 and exposed through the third surface 3, and the second internal electrode 122 can be spaced apart from the third surface 3 and exposed through the fourth surface 4. A first external electrode 130 is disposed on the third surface 3 of the main body and connected to the first internal electrode 121, and a second external electrode 140 can be disposed on the fourth surface 4 of the main body and connected to the second internal electrode 122.

[0030] That is, the first internal electrode 121 is connected to the first external electrode 130 without being connected to the second external electrode 140, and the second internal electrode 122 is connected to the second external electrode 140 without being connected to the first external electrode 130. Therefore, the first internal electrode 121 can be formed at a certain distance apart on the fourth surface 4, and the second internal electrode 122 can be formed at a certain distance apart on the third surface 3. At this time, the first internal electrode 121 and the second internal electrode 122 can be electrically separated from each other by the dielectric layer 111 disposed in the middle.

[0031] The material for forming the internal electrodes 121 and 122 is not particularly limited, and a material having excellent electrical conductivity can be used. For example, the internal electrodes 121 and 122 can include at least one of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0032] In addition, the internal electrodes 121 and 122 can be formed by printing a conductive paste for internal electrodes containing at least one of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof on a ceramic green sheet. As the printing method of the conductive paste for internal electrodes, a screen printing method, a gravure printing method, or the like can be used, but the present invention is not limited thereto.

[0033] The average thickness te of the internal electrodes 121 and 122 is not particularly limited and may vary depending on the purpose. For miniaturization of the multilayer electronic component 100, the average thickness te of the internal electrodes 121 and 122 may be 0.35 μm or less, and for improving the reliability of the multilayer electronic component 100 under high temperature and high pressure, the average thickness te of the internal electrodes 121 and 122 may be 3 μm or more.

[0034] The average thickness te of the internal electrodes 121 and 122 is extracted from the internal electrode layers scanned by a scanning electron microscope (SEM) of the length cut at the central portion in the width direction of the main body 110 and the cross section in the thickness direction (L-T). Among the internal electrode layers, based on one internal electrode layer at the point where the central line in the length direction of the main body and the central line in the thickness direction meet, for a total of five internal electrode layers of two upper layers and two lower layers, with the point where the central line in the length direction of the main body and the central line in the thickness direction meet as a reference, after determining five points of two on the left side and two on the right side at equal intervals around one reference point, the thickness of each point can be measured and the average value can be measured.

[0035] Referring to FIGS. 2 and 5, the main body 110 can include a capacitance forming portion Ac which is an area where the first internal electrode 121 and the second internal electrode 122 overlap in the first direction and is disposed inside the main body 110.

[0036] The capacitance forming portion Ac is a portion that contributes to the formation of the capacitance of the capacitor, and as shown in FIG. 6, it can be formed by repeatedly laminating a plurality of first internal electrodes 121 and second internal electrodes 122 with a dielectric layer 111 interposed therebetween.

[0037] An upper cover portion 112 can be disposed on one surface of the capacitance forming portion Ac in the first direction, and a lower cover portion 113 can be disposed on the other surface of the capacitance forming portion Ac in the first direction.

[0038] The upper cover portion 112 and the lower cover portion 113 can be formed by laminating a single dielectric layer or two or more dielectric layers in the thickness direction on the upper and lower surfaces of the capacitance forming portion Ac, and can basically play a role in preventing damage to the internal electrodes due to physical or chemical stress.

[0039] The upper cover portion 112 and the lower cover portion 113 do not include internal electrodes and can contain the same material as the dielectric layer 111.

[0040] That is, the upper cover portion 112 and the lower cover portion 113 can contain a ceramic material, for example, a barium titanate (BaTiO 3 )-based ceramic material.

[0041] On the other hand, the average thickness tc of the cover portions 112, 113 does not need to be particularly limited. However, in order to more easily achieve miniaturization and high capacitance of the multilayer electronic component, the average thickness tc of the cover portions 112, 113 may be 15 μm or less. Here, the average thickness of the cover portions 112, 113 can mean the respective average thicknesses of the first cover portion 112 and the second cover portion 113.

[0042] The average thickness tc of the cover portions 112, 113 can mean the size in the first direction, and can be a value obtained by averaging the sizes in the first direction of the cover portions 112, 113 measured at five equally spaced points above or below the capacitance forming portion Ac.

[0043] Referring to FIG. 5, margin portions 114, 115 can be arranged on one surface and the other surface in the third direction of the capacitance forming portion Ac.

[0044] The margin portions 114, 115 can include a margin portion 114 arranged on the fifth surface 5 of the main body 110 and a margin portion 115 arranged on the sixth surface 6. That is, the margin portions 114, 115 can be arranged on both side surfaces in the width direction of the ceramic main body 110.

[0045] As shown in FIG. 4, the margin portions 114 and 115 can mean the regions between the boundaries of both ends of the first internal electrode 121 and the second internal electrode 122 and the main body 110 in a cross section obtained by cutting the main body 110 in the width-thickness (W-T) direction.

[0046] The margin portions 114 and 115 can basically play a role in preventing damage to the internal electrodes due to physical or chemical stress.

[0047] The margin portions 114 and 115 may be formed by applying a conductive paste to form internal electrodes except for the locations where the margin portions are formed on the ceramic green sheet.

[0048] Also, in order to suppress the step difference caused by the internal electrodes 121 and 122, after cutting so that the internal electrodes after lamination are exposed on the fifth surface 5 and the sixth surface 6 of the main body, a single dielectric layer or two or more dielectric layers are laminated in the width direction on both side surfaces of the capacitance forming portion Ac to form the margin portions 114 and 115.

[0049] On the other hand, the width of the margin portions 114 and 115 does not particularly need to be limited. However, in order to more easily achieve miniaturization and high capacitance of the multilayer electronic component, the average width of the margin portions 114 and 115 may be 15 μm or less.

[0050] The average width of the margin portions 114 and 115 can mean the average size of the margin portions 114 and 115 in the third direction, and can be a value obtained by averaging the sizes of the margin portions 114 and 115 in the third direction measured at five equally spaced points on the side surface of the capacitance forming portion Ac.

[0051] The external electrodes 130 and 140 are disposed on the main body 110.

[0052] The external electrodes 130 and 140 are disposed on the third surface 3 and the fourth surface 4, which are surfaces facing each other in a second direction perpendicular to the first direction of the main body 110, and can be connected to the internal electrodes 121 and 122. Specifically, the first external electrode 130 is disposed on the third surface 3, which is one surface facing each other in the second direction perpendicular to the first direction of the main body 110, and can be connected to the first internal electrode 121. The second external electrode 140 is disposed on the fourth surface 4, which is the other surface facing each other in the second direction perpendicular to the first direction of the main body 110, and can be connected to the second internal electrode 122.

[0053] In this embodiment, the structure in which the multilayer electronic component 100 has two external electrodes 130 and 140 is described. However, the number, shape, etc. of the external electrodes 130 and 140 can be changed according to the form of the internal electrodes 121 and 122 and other purposes.

[0054] The external electrodes 130 and 140 can include connection portions disposed on the third surface 3 and the fourth surface 4, and band portions extending from the connection portions to a part of the first surface 1 and the second surface 2.

[0055] On the other hand, referring to FIGS. 2 and 3, although it is shown that the band portion extends from the connection portion to a part of the first surface 1 and the second surface 2, it is not limited thereto. In one embodiment, the band portion can have a structure extending from the connection portion to a part of the first surface 1, the second surface 2, the fifth surface 5, and the sixth surface 6.

[0056] The external electrodes 130 and 140 can include electrode layers 131 and 141 connected to the internal electrodes. The electrode layers 131 and 141 are disposed on the third surface 3 and the fourth surface 4 of the main body 110, and can be in contact with one end of the internal electrodes 121 and 122 in the second direction.

[0057] The electrode layers 131 and 141 can include a first electrode layer 131 connected to the first internal electrode 121 and a second electrode layer 142 connected to the second internal electrode 122.

[0058] As shown in FIGS. 1 to 4, the electrode layers 131 and 141 can be disposed at the connection portions and the band portions of the external electrodes 130 and 140.

[0059] The electrode layers 131 and 141 can contain a conductive metal and glass. As the conductive metal, a material having excellent electrical conductivity can be used, and there is no particular limitation. For example, the conductive metal may be one or more of Cu, Ni, Sn, Pd, Au, and alloys thereof.

[0060] The method for forming the electrode layers 131 and 141 is not particularly limited. For example, a method of dipping a conductive paste containing a conductive metal and glass on the third surface 3 and the fourth surface 4 of the main body 110 can be used. When such a dipping method is used, the conductive paste can be formed not only on the third surface 3 and the fourth surface 4 of the main body 110 but also on a part of the first surface 1, the second surface 2, the fifth surface 5, and the sixth surface 6.

[0061] The external electrodes 130 and 140 can include first plating layers 132 and 142 disposed on the electrode layers 131 and 141. The first plating layers 132 and 142 can serve to protect the electrode layers 131 and 141 from the external environment such as heat and moisture to improve the sealing property or to improve the mechanical strength.

[0062] In one embodiment, the first plating layers 132 and 142 can be disposed so as to cover the electrode layers 131 and 141, whereby the effects of improving the sealing property and the mechanical strength can be further enhanced.

[0063] The components of the first plating layers 132 and 142 are not particularly limited. The first plating layers 132 and 142 can contain a metal that can form a smooth plating layer. For example, the first plating layers 132 and 142 can contain one or more of Cu, Ni, Sn, Pd, Au, and alloys thereof.

[0064] In one embodiment, the first plating layers 132 and 142 can contain Cu. More specifically, the first plating layers 132 and 142 can be Cu plating layers containing Cu, whereby the plating break phenomenon of the Ni plating layer described later can be suppressed.

[0065] In one embodiment, the first plating layers 132 and 142 can contain the same metal as the conductive metal contained in the electrode layers 131 and 141. Thereby, the electrical connectivity and bonding strength between the first plating layers 132 and 142 and the electrode layers 131 and 141 can be further improved.

[0066] On the other hand, since the first plating layers 132 and 142 have a lower content of ceramic components and a higher content of metal components than the surface of the main body 110, the bonding strength between the first plating layers 132 and 142 and the surface of the main body 110 may be weak. As a result, floating may occur at the interface between the first plating layers 132 and 142 and the surface of the main body 110, which may become a penetration path for moisture from the outside, and this can cause damage to the electrode layers 131 and 141. In particular, the ends of the electrode layers 131 and 141 in the band portion are formed thinner than other regions, so they may be more vulnerable to moisture penetration from the outside.

[0067] Therefore, in one embodiment of the present invention, by disposing metal layers 151 and 152 containing a conductive metal and glass between the electrode layers 131 and 141 and the main body, the moisture resistance reliability against moisture penetration from the outside of the laminated electronic component 100 can be improved. Specifically, since the metal layers 151 and 152 contain a conductive metal and glass, they have excellent bonding strength with the electrode layers 131 and 141 and the main body 110. In addition, since the metal layers 151 and 152 are disposed between the electrode layers 131 and 141 and the main body at the band portions of the external electrodes 130 and 140, they can play a role in smoothly forming the first plating layers 132 and 142 up to the ends of the band portions.

[0068] Referring to FIGS. 2, 3, and 4, the metal layers 151 and 152 according to an embodiment can be disposed between the ends of the electrode layers 131 and 141 and the surface of the main body 110 in the band portion. Specifically, one end of the metal layers 151 and 152 in the second direction can be disposed so as to exceed one end of the electrode layers 131 and 141 in the second direction, and the other end of the metal layers 151 and 152 in the second direction can be disposed in a part between the electrode layers 131 and 141 and the surface of the main body 110.

[0069] The conductive metal contained in the metal layers 151 and 152 may be one or more of Sn, Pd, Au, Ni, Cu, and alloys thereof, and is not particularly limited as long as it is a substance with excellent electrical conductivity.

[0070] In one embodiment, the metal layers 151 and 152 can be continuously disposed from one end to the other end of the main body 110 in the third direction on the first surface 1 and the second surface 2. Thereby, since the penetration of moisture from the outside can be effectively prevented in the entire band portion formed on the first surface 1 and the second surface 2 of the main body, the moisture resistance reliability of the laminated electronic component 100 can be further improved.

[0071] In one embodiment, the metal layers 151 and 152 can be disposed on the first surface 1, the second surface 2, the fifth surface 5, and the sixth surface 6. When the band portions of the external electrodes 130 and 140 are also formed on a part of the first surface 1, the second surface 2, the fifth surface 5, and the sixth surface 6, in order to prevent the penetration of moisture from the outside in the entire band portion, the metal layers 151 and 152 can also be disposed on the first surface 1, the second surface 2, the fifth surface 5, and the sixth surface 6. At this time, in order to further improve the moisture resistance reliability of the laminated electronic component 100, the metal layers 151 and 152 may be disposed so as to surround the first surface 1, the second surface 2, the fifth surface 5, and the sixth surface 6, and the metal layers 151 and 152 disposed so as to surround the first surface 1, the second surface 2, the fifth surface 5, and the sixth surface 6 may be in a continuous form along the first surface 1, the second surface 2, the fifth surface 5, and the sixth surface 6.

[0072] In one embodiment, the metal layers 151 and 152 can be disposed only on the first surface 1 and the second surface 2. When the band portions of the external electrodes 130 and 140 are formed on a part of the first surface 1 and the second surface 2, or when the band portions of the external electrodes 130 and 140 are also formed on a part of the first surface 1, the second surface 2, the fifth surface 5, and the sixth surface 6, the metal layers 151 and 152 can be disposed only on either one of the first surface 1 and the second surface 2. In this case, although there is a possibility that it is more difficult to improve the moisture resistance reliability than when the metal layers 151 and 152 are disposed on the first surface 1, the second surface 2, the fifth surface 5, and the sixth surface 6, there is no need to perform an additional process of separately forming the metal layers 151 and 152 on the fifth surface 5 and the sixth surface 6, and since the sizes of the external electrodes 130 and 140 in the third direction can be reduced, it can be advantageous for thinning the external electrodes 130 and 140.

[0073] Referring to FIG. 2, the metal layers 151 and 152 can be disposed only on either one of the first surface 1 and the second surface 2. When the first surface 1 is the mounting surface, the stacked electronic component 100 may be more vulnerable to penetration of external moisture toward the second surface 2, which is the surface opposite to the first surface 1. Therefore, in one embodiment, by disposing the metal layers 151 and 152 only on either one of the first surface 1 and the second surface 2, the external electrodes 130 and 140 can be thinned while ensuring moisture resistance reliability.

[0074] In one embodiment, a part of the metal layers 151 and 152 can be disposed so as to extend beyond one end of the electrode layers 131 and 141 in the second direction at the band portion. In this case, since a part of the metal layers 151 and 152 including the conductive metal and the glass exists at a part of the interface between the first plating layers 132 and 142 and the main body 110, the bonding force between the first plating layers 132 and 142 and the surface of the main body 110 can be improved.

[0075] At this time, the first plating layers 132 and 142 can cover a part of the metal layers 151 and 152 arranged so as to extend beyond one end of the electrode layers 131 and 141 in the second direction. Thereby, the bonding force between the electrode layers 131 and 141 and the main body 110 can be further improved, and the bonding force between the first plating layers 132 and 142 and the main body 110 can also be improved. As a result, the phenomenon of the generation of a gap between the first plating layers 132 and 142 and the main body 110 can be suppressed, and the penetration of moisture from the outside itself can be suppressed, so that the moisture resistance reliability of the laminated electronic component 100 can be further improved.

[0076] On the other hand, a part of the metal layers 151 and 152 can be arranged so as not to extend beyond the ends of the first plating layers 132 and 142 in the first direction in the band portion. In this case, one end of the metal layers 151 and 152 in the second direction can be arranged between one end of the electrode layers 131 and 141 in the second direction and one end of the first plating layers 132 and 142 in the second direction in the band portion.

[0077] At this time, when the total length of the metal layers 151 and 152 is a and the length of a part of the metal layers 151 and 152 arranged so as to extend beyond one end of the electrode layers 131 and 141 in the second direction is b, b / a can satisfy 0.5 or more and 1.0 or less.

[0078] When b / a is less than 0.5, it becomes difficult to form a sufficient bonding force with the first plating layers 132 and 142, and there is a possibility that the effect of improving the moisture resistance reliability is small.

[0079] When b / a exceeds 1.0, there is a possibility that the first plating layers 132 and 142 are formed too thickly, and it becomes difficult to thin the external electrodes 130 and 140.

[0080] Therefore, in one embodiment, by making b / a satisfy 0.5 or more and 1.0 or less, the moisture resistance reliability of the laminated electronic component can be improved, and an excessive increase in the volume of the external electrode can be suppressed.

[0081] The method for forming the metal layers 151 and 152 is not particularly limited. For example, when forming the metal layers 151 and 152 on the first surface 1 or the second surface 2, before forming the external electrodes, a conductive paste containing a conductive metal and glass can be printed on the surfaces of the cover portions 112 and 113 to form them. When forming the metal layers 151 and 152 on the fifth surface 5 or the sixth surface 6, before forming the external electrodes, a sheet containing a conductive metal and glass can be attached to the fifth surface 5 and the sixth surface 6 of the main body 110 to form them.

[0082] In the multilayer electronic component 100, the method for distinguishing the metal layers 151 and 152 is not particularly limited. However, when the metal layers 151 and 152 contain the same metal as the metal components of the electrode layers 131 and 141 and the first plating layers 132 and 142, it may be difficult to distinguish them even by observing the cross-sections in the first direction and the second direction with a scanning electron microscope (SEM). In such a case, it can be distinguished by observing the band portion region of the external electrode with high resolution using a field emission scanning electron microscope (FE-SEM) or a transmission electron microscope (TEM). Specifically, the metal layers 151 and 152 can be distinguished into regions containing a co-material in addition to the metal component.

[0083] On the other hand, when the metal layers 151 and 152 contain a metal different from that of the electrode layers 131 and 141 and the first plating layers 132 and 142, the metal layers 151 and 152 can be distinguished by methods such as SEM-EDS (Scanning Electron Microscope-Energy Dispersive Spectroscopy) or TEM-EDS (Transmission Electron Microscopy-Energy Dispersive Spectroscopy). For example, by observing the ends of the external electrodes in the cross-sections in the first direction and the second direction of the multilayer electronic component 100, they can be distinguished according to the presence or absence of other metal elements.

[0084] On the first plating layers 132 and 142, Ni plating layers 133 and 143 can be disposed, and on the Ni plating layers 133 and 143, Sn plating layers 134 and 144 can be disposed.

[0085] However, it is not limited to the Ni plating layers 133 and 143 and the Sn plating layers 134 and 144. On the first plating layers 132 and 142, one or a plurality of plating layers including one or more of Cu, Ni, Sn, Pd, Au, and alloys thereof may be disposed.

[0086] The size of the stacked electronic component 100 does not need to be particularly limited.

[0087] However, in order to simultaneously achieve miniaturization and high capacity, it is necessary to reduce the thickness of the dielectric layer and the internal electrodes and increase the number of layers. Therefore, in the stacked electronic component 100 having a size of 0201 (length × width, 0.2 mm × 0.1 mm) or less, it may be difficult to ensure moisture resistance reliability.

[0088] Therefore, considering manufacturing errors, the size of the external electrodes, etc., when the length of the stacked electronic component 100 is 0.22 mm or less and the width is 0.11 mm or less, the effect of improving the reliability according to the present invention can become more remarkable. Here, the length of the stacked electronic component 100 can mean the maximum size in the second direction of the stacked electronic component 100, and the width of the stacked electronic component 100 can mean the maximum size in the third direction of the stacked electronic component 100.

[0089] In addition, the expression "one embodiment" used in the present invention does not mean the same embodiment as each other, but is provided to emphasize and explain each different unique feature. However, the above-described one embodiment does not exclude being realized in combination with the features of other one embodiments. For example, even if a matter described in a specific one embodiment is not described in another one embodiment, as long as there is no description contrary to or conflicting with that matter in still another one embodiment, it can be understood as a description related to still another one embodiment.

[0090] The terms used in the present invention are merely used to describe an embodiment and are not intended to limit the present invention. At this time, singular expressions include plural expressions unless the context clearly indicates a different meaning.

Explanation of Reference Numerals

[0091] 100: Multilayer electronic component 110: Body 111: Dielectric layer 112, 113: Cover part 114, 115: Margin part 121, 122: Internal electrode 130, 140: External electrode 131, 141: Electrode layer 132, 142: First plating layer 133, 143: Ni plating layer 134, 144: Sn plating layer

Claims

1. a body including dielectric layers and internal electrodes alternately disposed with the dielectric layers in a first direction, the body including first and second surfaces facing the first direction, third and fourth surfaces connected to the first and second surfaces and facing the second direction, and fifth and sixth surfaces connected to the first, second, third and fourth surfaces and facing the third direction; an external electrode including a connection portion disposed on the third surface and the fourth surface, and a band portion extending from the connection portion to a portion of the first surface and the second surface, The external electrode includes an electrode layer connected to the internal electrode and a first plating layer disposed on the electrode layer, A multilayer electronic component, wherein a metal layer containing a conductive metal and glass is disposed between the electrode layer and the main body in the band portion.

2. The multilayer electronic component according to claim 1 , wherein the band portion is disposed so as to extend from the connection portion to a portion of the first surface, the second surface, the fifth surface, and the sixth surface.

3. The multilayer electronic component according to claim 2 , wherein the metal layer is disposed only on the first surface and the second surface.

4. The multilayer electronic component according to claim 1 , wherein the metal layer is disposed on only one of the first surface and the second surface.

5. The multilayer electronic component according to claim 2 , wherein the metal layer is also disposed on the first surface, the second surface, the fifth surface, and the sixth surface.

6. The multilayer electronic component according to claim 5 , wherein the metal layer is disposed so as to surround the first surface, the second surface, the fifth surface, and the sixth surface.

7. The multilayer electronic component according to claim 1 , wherein the metal layer is disposed continuously on the first surface and the second surface from one end to the other end of the main body in the third direction.

8. The multilayer electronic component according to claim 1 , wherein a portion of the metal layer is disposed so as to extend beyond one end of the electrode layer in the second direction in the band portion.

9. 9. The multilayer electronic component according to claim 8, wherein the first plating layer covers a portion of the metal layer disposed so as to extend beyond one end of the electrode layer in the second direction.

10. When the total length of the metal layer is a and the length of a portion of the metal layer disposed so as to extend beyond one end of the electrode layer in the second direction is b, 9. The multilayer electronic component according to claim 8, wherein b / a is 0.5 or more and 1.0 or less.

11. The multilayer electronic component according to claim 1 , wherein the first plating layer is disposed in the band portion so as not to extend beyond one end of the first plating layer in the second direction.

12. The multilayer electronic component according to claim 1 , wherein the first plating layer contains Cu.

13. the electrode layer comprises a conductive metal and a glass; the first plating layer contains the same conductive metal as that contained in the electrode layer; The multilayer electronic component according to claim 1 , wherein the external electrodes further include a Ni plating layer disposed on the first plating layer and a Sn plating layer disposed on the Ni plating layer.

14. 11. The multilayer electronic component according to claim 1, wherein the conductive metal contained in the metal layer includes one or more of Sn, Pd, Au, Ni, and Cu.

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