Thermosetting silicone composition, die bonding material, and optical semiconductor device

Abstract

To provide a thermosetting silicone composition that provides a cured product having excellent hardness and die shear strength; a die bonding material comprising the composition; and an optical semiconductor device in which an optical semiconductor element is die-bonded with a cured product of the die bonding material.SOLUTION: The present invention is a thermosetting silicone composition containing the following components (A)-(D): (A) an organopolysiloxane having an average constituent unit ratio represented by formula (1), (R13SiO1 / 2)a(R23-nR3nSiO1 / 2)b(R12SiO2 / 2)c(R1SiO3 / 2)d(SiO4 / 2)e (1), (B) an organic peroxide, (C) an organohydrogenpolysiloxane having two or more hydrogen atoms bonded to silicon atoms per molecule, and (D) a platinum group metal catalyst.SELECTED DRAWING: None

Description

[Technical field]

[0001] The present invention relates to a thermosetting silicone composition, a die bond material comprising said composition, and an optical semiconductor device using a cured product of said die bond material. [Background technology]

[0002] Optical semiconductor elements such as light-emitting diodes (LEDs) have the excellent characteristic of low power consumption, and therefore are applied to optical semiconductor devices for outdoor lighting and automobiles, and the optical semiconductor elements in the optical semiconductor devices are bonded and fixed to the housing using a die bond material. As the LED elements have become higher in brightness and output, silicone resins with excellent durability are used as die bond material compositions. The die bond material needs to hold the element in the wire bonding process after the die bond process. If the strength of the die bond material is insufficient, bonding is not possible, so a material with high hardness is generally used.

[0003] As LED chips become smaller in recent years, the die bond used for bonding is required to have high adhesive strength even in a small area. If the adhesive strength is insufficient, problems occur such as the chip peeling off during the wire bonding process, making bonding impossible.

[0004] The curing mechanism of silicone resin used as a die bond material is diverse, but the addition reaction by hydrosilylation reaction of SiH group and alkenyl group using platinum catalyst is widely used. On the LED package, there may be components (sulfur compounds, nitrogen compounds, phosphorus compounds, etc.) that act on platinum catalyst. In such cases, the curing reaction may be inhibited, and hardness and adhesion may decrease. Peroxide curing using (meth)acrylic groups and the like is also commonly used as a curing mechanism, but in curing by peroxide, radicals are consumed by oxygen, and the curing reaction on the surface is inhibited. In response to this, the use of a thermosetting silicone composition that gives a cured product that is resistant to reaction inhibition of hydrosilylation (addition) curing and oxygen inhibition of peroxide curing by combining radical curing of (meth)acrylic groups by peroxide and addition reaction of SiH groups and aliphatic unsaturated bonds has been proposed (Patent Document 1). However, the die shear strength is insufficient, and a material with higher die shear strength is desired. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2018-076415 A Summary of the Invention [Problem to be solved by the invention]

[0006] The present invention has been made in view of the above circumstances, and has an object to provide a thermosetting silicone composition that gives a cured product that has excellent hardness and die shear strength, a die bond material comprising said composition, and an optical semiconductor device in which an optical semiconductor element is die-bonded with the cured product of said die bond material. [Means for solving the problem]

[0007] In order to solve the above problems, the present invention provides a composition comprising the following components (A) to (D): (A) an organopolysiloxane having an average structural unit ratio represented by the following formula (1): (R 1 3 SiO 1 / 2 ) a (R 2 3-n R 3 n SiO 1 / 2 ) b (R 1 2 SiO 2 / 2 ) c (R 1 SiO 3 / 2 ) d (SiO 4 / 2 ) e (1) (In the formula, R 1 each independently represents a monovalent hydrocarbon group having 1 to 12 carbon atoms which does not have an aliphatic unsaturated bond and which may be substituted with a halogen atom; R 2 each independently represents an alkenyl group having 2 to 10 carbon atoms; R 3 each independently represents a group represented by the following formula (2), n is a number from 1.5 to 3, and a, b, c, d, and e are numbers that satisfy a≧0, b>0, c≧0, d≧0, and e≧0, with the proviso that d+e>0 and a+b+c+d+e=1. [ka] (In the formula, R 4 is a hydrogen atom or a methyl group, and R 5 each independently represents a monovalent hydrocarbon group having 1 to 12 carbon atoms which has no aliphatic unsaturated bond and which may be substituted with a halogen atom; Z 1 is an alkylene group or an oxyalkylene group having 1 to 10 carbon atoms, Z 2 is an alkylene group having 2 to 10 carbon atoms, and m is an integer of 0 to 20. The wavy line represents a bond. (B) organic peroxide, (C) an organohydrogenpolysiloxane having two or more hydrogen atoms bonded to silicon atoms in one molecule, and (D) Platinum group metal catalyst The present invention provides a heat-curable silicone composition comprising:

[0008] With the thermosetting silicone composition of the present invention, not only can the addition reaction take place, but the curing reaction can also be carried out using an organopolysiloxane with a specific structure having multiple (meth)acrylic groups at its terminals, resulting in high crosslink density, giving a cured product with excellent hardness and die shear strength.

[0009] The thermosetting silicone composition of the present invention is also characterized in that R 1 is a methyl group, and R 2 is a vinyl group, and R 3 is preferably a group represented by the following formula (3). [ka] (In the formula, the wavy line represents a bond.)

[0010] A thermosetting silicone composition of the present invention that contains such component (A) will have superior curability and the die shear strength of the cured product.

[0011] In the thermosetting silicone composition of the present invention, it is preferable that b in the above formula (1) is a number from 0.05 to 0.2, and n is a number from 2 to 3.

[0012] When the thermosetting silicone composition of the present invention contains this type of component (A), the crosslinking density increases, and the hardness and die shear strength of the cured product can be improved.

[0013] In the thermosetting silicone composition of the present invention, c and d in the above formula (1) are preferably 0.

[0014] A thermosetting silicone composition of the present invention that contains such component (A) can improve the hardness and die shear strength of the cured product.

[0015] Furthermore, the thermosetting silicone composition of the present invention preferably contains component (E), an organosiloxane having an average constitutional unit ratio represented by formula (4) below. (R 1 3 SiO 1 / 2 ) f (R 2 R 1 2 SiO 1 / 2 ) g (R 3 R 1 2 SiO 1 / 2 ) h (R 1 2 SiO 2 / 2 ) i (R 1 SiO 3 / 2 ) j (SiO 4 / 2 ) k (4) (In the formula, R 1 , R 2 and R 3 is the same as the above formula (1). f, g, h, i, j, and k are numbers that satisfy f≧0, g≧0, h>0, i≧0, j≧0, k≧0, and f+g+h+i+j+k=1.

[0016] By using such a component (E) in combination, the die shear strength of the cured product of the thermosetting silicone composition of the present invention can be further improved.

[0017] The present invention provides a die bond material that is characterized by comprising the thermosetting silicone composition of the present invention.

[0018] A die bond material that is characterized by being made of the thermosetting silicone composition of the present invention can be suitably used as a die bond material for mounting an LED chip to a wiring board.

[0019] The present invention also provides a silicone cured product, which is characterized by being a cured product of the thermosetting silicone composition of the present invention.

[0020] Such a silicone cured product has excellent hardness and die shear strength and has high adhesive strength to substrates, LED chips, etc., making it particularly useful for die bonding of LED elements, etc.

[0021] The present invention further provides an optical semiconductor device comprising the silicone cured product of the present invention.

[0022] Such optical semiconductor devices are highly reliable because they are die-bonded with the silicone cured product of the present invention, which has excellent hardness and die shear strength and strong adhesive strength to substrates, LED chips, etc. Effect of the Invention

[0023] As described above, the thermosetting silicone composition of the present invention gives a silicone cured product that has excellent hardness and die shear strength, and is particularly useful as a die bond material used in die bonding of LED elements, etc. Furthermore, in the wire bonding step carried out after the die bonding step, problems such as chip peeling and bonding being impossible are unlikely to occur, and optical semiconductor devices in which optical semiconductor elements are die-bonded with this silicone cured product are highly reliable and have improved productivity. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0024] As described above, there has been a need for the development of a thermosetting silicone composition that gives a cured silicone product with excellent hardness and die shear strength, which can be used as a die bonding material for die bonding of LED elements and the like.

[0025] As a result of extensive investigations into the above-mentioned problems, the present inventors discovered that the above-mentioned problems could be solved by a thermosetting silicone composition that contains component (A) having a specific structure, as described below, as well as components (B), (C), and (D), and thus completed the present invention.

[0026] That is, the present invention provides the following components (A) to (D): (A) an organopolysiloxane having an average structural unit ratio represented by the following formula (1): (R 1 3 SiO 1 / 2 ) a (R 2 3-n R 3 n SiO 1 / 2 ) b (R 1 2 SiO 2 / 2 ) c (R 1 SiO 3 / 2 ) d (SiO 4 / 2 ) e (1) (In the formula, R 1 each independently represents a monovalent hydrocarbon group having 1 to 12 carbon atoms which does not have an aliphatic unsaturated bond and which may be substituted with a halogen atom; R 2 each independently represents an alkenyl group having 2 to 10 carbon atoms; R 3 each independently represents a group represented by the following formula (2), n is a number from 1.5 to 3, and a, b, c, d, and e are numbers that satisfy a≧0, b>0, c≧0, d≧0, and e≧0, with the proviso that d+e>0 and a+b+c+d+e=1. [ka] (In the formula, R 4 is a hydrogen atom or a methyl group, and R 5 each independently represents a monovalent hydrocarbon group having 1 to 12 carbon atoms which has no aliphatic unsaturated bond and which may be substituted with a halogen atom; Z 1 is an alkylene group or an oxyalkylene group having 1 to 10 carbon atoms, Z 2 is an alkylene group having 2 to 10 carbon atoms, and m is an integer of 0 to 20. The wavy line represents a bond. (B) organic peroxide, (C) an organohydrogenpolysiloxane having two or more hydrogen atoms bonded to silicon atoms in one molecule, and (D) Platinum group metal catalyst The present invention relates to a heat-curable silicone composition comprising:

[0027] The present invention will be described in detail below, but the present invention is not limited thereto.

[0028] [Thermosetting silicone composition] The thermosetting silicone composition of the present invention contains the following components (A) to (D), each of which will be described in detail below.

[0029] <Component (A)> Component (A) is an organopolysiloxane having an average constitutional unit ratio represented by the following formula (1), and is a component that increases the strength of the cured product and improves the adhesive strength, that is, the die shear strength. (R 1 3 SiO 1 / 2 ) a (R 2 3-n R 3 n SiO 1 / 2 ) b (R 1 2 SiO 2 / 2 ) c (R 1 SiO 3 / 2 ) d (SiO 4 / 2 ) e (1) (In the formula, R 1 each independently represents a monovalent hydrocarbon group having 1 to 12 carbon atoms which does not have an aliphatic unsaturated bond and which may be substituted with a halogen atom; R 2 each independently represents an alkenyl group having 2 to 10 carbon atoms; R 3 are independently a group represented by the following formula (2), n is a number from 1.5 to 3, and a, b, c, d, and e are numbers that satisfy a≧0, b>0, c≧0, d≧0, and e≧0, provided that d+e>0 and a+b+c+d+e=1.) If n is less than 1.5, the crosslink density of the cured product will be low and the die shear strength will be poor, which is not preferable. Also, since b>0, R 3and has a methacrylic group at the end. Furthermore, since d+e>0, this organopolysiloxane has a branched or three-dimensional network structure. [ka] (In the formula, R 4 is a hydrogen atom or a methyl group, and R 5 each independently represents a monovalent hydrocarbon group having 1 to 12 carbon atoms which has no aliphatic unsaturated bond and which may be substituted with a halogen atom; Z 1 is an alkylene group or an oxyalkylene group having 1 to 10 carbon atoms, Z 2 is an alkylene group having 2 to 10 carbon atoms, and m is an integer of 0 to 20. The wavy line represents a bond.

[0030] In the above formula (1), R 1 The monovalent hydrocarbon group having 1 to 12 carbon atoms, which does not have an aliphatic unsaturated bond and may be substituted with a halogen atom, represented by the formula (1), is not particularly limited as long as it does not have an aliphatic unsaturated bond, and examples thereof include alkyl groups such as methyl, ethyl, propyl, and butyl groups, cycloalkyl groups such as cyclohexyl and cyclopentyl groups, aryl groups such as phenyl, tolyl, and xylyl groups, aralkyl groups such as benzyl and phenylethyl groups, and halogenated hydrocarbon groups such as chloromethyl, chloropropyl, and chlorocyclohexyl groups. An alkyl group having 1 to 8 carbon atoms is preferred, and a methyl group is more preferred.

[0031] In the above formula (1), R 2 Examples of the alkenyl group having 2 to 10 carbon atoms represented by the formula (I) include a vinyl group, an allyl group, a butenyl group, a hexenyl group, and an octenyl group, and preferably an alkenyl group having 2 to 6 carbon atoms, and more preferably a vinyl group.

[0032] R in the above formula (1) 3 In the group represented by the above formula (2), Z 1Examples of the alkylene group having 1 to 10 carbon atoms include a methylene group, an ethylene group, a trimethylene group, a propylene group, a tetramethylene group, an isobutylene group, a dimethylethylene group, a pentamethylene group, a 2,2-dimethyltrimethylene group, a hexamethylene group, a heptamethylene group, an octamethylene group, a nonamethylene group, a decylene (decamethylene) group, etc., and examples of the oxyalkylene group having 1 to 10 carbon atoms include an oxyethylene group, an oxypropylene group, etc. Among these, a trimethylene group is preferred.

[0033] In the above formula (2), Z 2 Examples of the alkylene group having 2 to 10 carbon atoms include an ethylene group, a trimethylene group, a propylene group, a tetramethylene group, an isobutylene group, a dimethylethylene group, a pentamethylene group, a 2,2-dimethyltrimethylene group, a hexamethylene group, a heptamethylene group, an octamethylene group, a nonamethylene group, and a decylene (decamethylene) group. An alkylene group having 2 to 6 carbon atoms is preferred, and an ethylene group is more preferred.

[0034] In the above formula (2), R 5 The monovalent hydrocarbon group having 1 to 12 carbon atoms, which does not have an aliphatic unsaturated bond and may be substituted with a halogen atom, is represented by the above R 1 Examples of the aryl group include the same groups as those exemplified as the aryl group, and a methyl group is preferred.

[0035] In the above formula (2), m is an integer of 0 to 20, preferably an integer of 0 to 10, and more preferably 0 or 1. If m is an integer exceeding 20, the hardness of the cured product may be undesirably low.

[0036] R 3 Specific examples of the group represented by the formula include those represented by the following formulas (3) and (5) to (7), and the group represented by the following formula (3) is particularly preferred. [ka] (In the formula, the wavy line represents a bond.)

[0037] In terms of curability and the hardness and die shear strength of the cured product, a, b, c, d, e, and n in formula (1) are preferably in the following ranges.

[0038] The character a is preferably a number from 0 to 0.65, and more preferably a number from 0.10 to 0.50.

[0039] b is preferably a number from 0.05 to 0.20, and more preferably a number from 0.07 to 0.14.

[0040] c is preferably a number from 0 to 0.30, and more preferably 0.

[0041] The value of d is preferably a number from 0 to 0.60, and more preferably 0.

[0042] e is preferably a number from 0.05 to 0.90, and more preferably a number from 0.40 to 0.70.

[0043] The value of d+e is preferably a number from 0.05 to 0.90, and more preferably a number from 0.40 to 0.70.

[0044] It is preferable that n is a number of 2 to 3.

[0045] Component (A) can be obtained, for example, as the product of a hydrosilylation reaction between component (a), an organopolysiloxane having an average structural unit ratio represented by the following formula (8), and component (b), a compound represented by the following general formula (9), using a platinum group metal as a catalyst. (R 1 3 SiO 1 / 2 ) a (R 2 3 SiO 1 / 2 ) b (R 1 2 SiO 2 / 2 ) c(R 1 SiO 3 / 2 ) d (SiO 4 / 2 ) e (8) (In the formula, R 1 , R 2 , a, b, c, d and e are the same as in formula (1) above. [ka] (In the formula, R 4 , R 5 , Z 1 and m are the same as in formula (2) above.

[0046] Component (b) is preferably a siloxane compound represented by formula (10) below, which can be obtained as the product of a hydrosilylation reaction between allyl methacrylate and 1,1,3,3-tetramethyldisiloxane using a platinum group metal as a catalyst. [ka]

[0047] Examples of platinum group metal catalysts used in the hydrosilylation reaction between component (a) and component (b) and in the hydrosilylation reaction when obtaining component (b) include platinum metal-supported carbon powder, platinum black, platinum (II) chloride, chloroplatinic acid, reaction products of chloroplatinic acid and monohydric alcohol, complexes of platinum and vinylsiloxanes such as divinyltetramethyldisiloxane, complexes of chloroplatinic acid and olefins, platinum-based catalysts such as platinum bisacetoacetate, palladium-based catalysts, and rhodium-based catalysts, among which platinum-containing catalysts are preferred from the viewpoint of reactivity. In addition, the addition reaction conditions, the use of solvents, etc. are not particularly limited and may be as usual.

[0048] Specific examples of the component (A) include, but are not limited to, those represented by the following formula: In addition, Me is a methyl group, Vi is a vinyl group, and MA is a group represented by the above formula (3). (Me 3 SiO1 / 2 ) 0.4 (Vi) 0.6 (MA) 2.4 SiO 1 / 2 ) 0.07 (SiO 4 / 2 ) 0.53 (Me 3 SiO 1 / 2 ) 0.33 (Vi) 0.6 (MA) 2.4 SiO 1 / 2 ) 0.14 (SiO 4 / 2 ) 0.53 (Me 3 SiO 1 / 2 ) 0.2 (MA 3 SiO 1 / 2 ) 0.2 (SiO 4 / 2 ) 0.6 (Me 3 SiO 1 / 2 ) 0.2 (Vi) 1.5 (MA) 1.5 SiO 1 / 2 ) 0.2 (SiO 4 / 2 ) 0.6 (Me 3 SiO 1 / 2 ) 0.2 ((Vi)(MA) 2 SiO 1 / 2 ) 0.2 (SiO 4 / 2 ) 0.6 ,

[0049] The organopolysiloxane of component (A) preferably has a weight average molecular weight in the range of 500 to 100,000. The weight average molecular weight is a value calculated using standard polystyrene in gel permeation chromatography (GPC).

[0050] The component (A) may use either a single type alone, or two or more types in combination.

[0051] <(B) component> Component (B) is an organic peroxide that generates radicals when heated. Component (B) is not particularly limited as long as it can polymerize the (meth)acrylic group of component (A) through a radical reaction, but examples of component (B) include diacyl peroxide, peroxy ester, dialkyl peroxide, peroxy dicarbonate, peroxy ketal, hydroperoxide, and silyl peroxide.

[0052] The present invention provides excellent hardness and die shear strength due to both curing by peroxide radical polymerization of component (B) and addition curing by component (D).

[0053] Examples of diacyl peroxides include isobutyl peroxide, 2,4-dichlorobenzoyl peroxide, 3,5,5-trimethylhexanoyl peroxide, octanoyl peroxide, lauroyl peroxide, stearoyl peroxide, succinic peroxide, benzoylperoxytoluene, and benzoyl peroxide.

[0054] Examples of peroxy esters include cumyl peroxy neodecanoate, 1,1,3,3-tetramethylbutyl peroxy neodecanoate, 1-cyclohexyl-1-methylethyl peroxy neodecanoate, t-hexyl peroxy neodecanoate, t-butyl peroxy pivalate, 1,1,3,3-tetramethylbutyl peroxy-2-ethylhexanoate, 1,6-bis(t-butylperoxycarbonyloxy)hexane, 2,5-dimethyl-2,5-bis(2-ethylhexanoylperoxy)hexane, 1-cyclohexyl-1-methylethyl peroxy-2-ethylhexanoate, and t-hexyl peroxy-2-ethylhexanone. t-butylperoxy-2-ethylhexanoate, t-butylperoxyisobutyrate, 1,1-bis(t-butylperoxy)cyclohexane, t-hexylperoxyisopropyl monocarbonate, t-butylperoxy-3,5,5-trimethylhexanoate, t-butylperoxylaurate, 2,5-dimethyl-2,5-bis(m-toluoylperoxy)hexane, t-butylperoxyisopropyl monocarbonate, t-butylperoxy-2-ethylhexyl monocarbonate, t-hexylperoxybenzoate, t-butylperoxyacetate and bis(t-butylperoxy)hexahydroterephthalate. These may be used alone or in combination of two or more.

[0055] Examples of dialkyl peroxides include α,α'-bis(t-butylperoxy)diisopropylbenzene, dicumyl peroxide, 2,5-dimethyl-2,5-bis(t-butylperoxy)hexane, and t-butylcumyl peroxide.

[0056] Examples of peroxydicarbonates include di-n-propyl peroxydicarbonate, diisopropyl peroxydicarbonate, bis(4-t-butylcyclohexyl)peroxydicarbonate, di-2-ethoxymethoxyperoxydicarbonate, bis(2-ethylhexylperoxy)dicarbonate, dimethoxybutyl peroxydicarbonate, and bis(3-methyl-3-methoxybutylperoxy)dicarbonate.

[0057] Examples of peroxyketals include 1,1-bis(t-hexylperoxy)-3,3,5-trimethylcyclohexane, 1,1-bis(t-hexylperoxy)cyclohexane, 1,1-bis(t-butylperoxy)-3,3,5-trimethylcyclohexane, 1,1-(t-butylperoxy)cyclododecane, and 2,2-bis(t-butylperoxy)decane.

[0058] Examples of hydroperoxides include diisopropylbenzene hydroperoxide and cumene hydroperoxide.

[0059] Examples of silyl peroxides include t-butyltrimethylsilyl peroxide, bis(t-butyl)dimethylsilyl peroxide, t-butyltrivinylsilyl peroxide, bis(t-butyl)divinylsilyl peroxide, tris(t-butyl)vinylsilyl peroxide, t-butyltriallylsilyl peroxide, bis(t-butyl)diallylsilyl peroxide, and tris(t-butyl)allylsilyl peroxide.

[0060] Taking into consideration the temperature at which the thermosetting silicone composition is thermally cured and storage stability, component (B) preferably has a 10-hour half-life temperature in benzene of at least 40° C., and more preferably at least 60° C. There is no particular upper limit, but it is usually no higher than 200° C.

[0061] The component (B) can use either a single type alone or a suitable combination of two or more types, and these may be used after being diluted with a solvent.

[0062] The amount of component (B) to be blended may be any amount sufficient to initiate the crosslinking reaction by heating, but from the viewpoints of curability and storage stability of the composition, the amount is preferably 0.1 to 30 parts by mass, and more preferably 0.5 to 5 parts by mass, per 100 parts by mass of component (A).

[0063] <(C) component> The organohydrogenpolysiloxane of component (C) functions as a crosslinking agent that reacts with the alkenyl groups and (meth)acrylic groups contained in component (A) via a hydrosilylation reaction.

[0064] Component (C) has at least two hydrogen atoms bonded to silicon atoms (i.e., Si-H groups) in one molecule, preferably 2 to 200, more preferably 3 to 100, and particularly preferably 4 to 50. If there are fewer than two, crosslinking cannot be formed, which is not preferred. The Si-H groups may be located at either the molecular chain terminals or non-terminals, or may be located at both the molecular chain terminals and non-terminals.

[0065] The molecular structure of the organohydrogenpolysiloxane of component (C) may be linear, cyclic, branched, or a three-dimensional network structure, but the number of silicon atoms in one molecule is preferably 2 to 300, and more preferably 3 to 200.

[0066] Examples of organohydrogenpolysiloxanes of component (C) include 1,1,3,3-tetramethyldisiloxane, 1,3,5,7-tetramethylcyclotetrasiloxane, tris(hydrogendimethylsiloxy)methylsilane, tris(hydrogendimethylsiloxy)phenylsilane, methylhydrogencyclopolysiloxane, methylhydrogensiloxane-dimethylsiloxane cyclic copolymer, methylhydrogenpolysiloxane blocked at both ends with trimethylsiloxy groups, dimethylsiloxane-methylhydrogensiloxane copolymer blocked at both ends with trimethylsiloxy groups, dimethylpolysiloxane blocked at both ends with dimethylhydrogensiloxy groups, methylhydrogenpolysiloxane blocked at both ends with dimethylhydrogensiloxy groups, Dimethylhydrogensiloxy-blocked dimethylsiloxane-methylhydrogensiloxane copolymer, both ends blocked by trimethylsiloxy-blocked methylhydrogensiloxane-diphenylsiloxane copolymer, both ends blocked by trimethylsiloxy-blocked methylhydrogensiloxane-diphenylsiloxane-dimethylsiloxane copolymer, both ends blocked by trimethylsiloxy-blocked methylhydrogensiloxane-methylphenylsiloxane-dimethylsiloxane copolymer, both ends blocked by dimethylhydrogensiloxy-blocked methylhydrogensiloxane-dimethylsiloxane-diphenylsiloxane copolymer, both ends blocked by dimethylhydrogensiloxy-blocked methylhydrogensiloxane-dimethylsiloxane-methylphenylsiloxane copolymer, (CH 3 ) 2 HSiO 1 / 2 Units and (CH 3 ) 3 SiO 1 / 2 Units and SiO 4 / 2 A copolymer consisting of (CH 3 ) 2 HSiO 1 / 2 Units and SiO 4 / 2 A copolymer consisting of (CH 3 ) 2 HSiO 1 / 2 Units and SiO 4 / 2 Units and (C 6 H 5 ) 3 SiO1 / 2 and copolymers consisting of a unit.

[0067] Specific examples of the component (C) include those represented by the following formula: [ka] (In the formula, the siloxane units may be arranged in any order.)

[0068] [ka] (In the formula, the siloxane units may be arranged in any order.)

[0069] [ka] (In the formula, the siloxane units may be arranged in any order.)

[0070] [ka] (In the formula, the siloxane units in the parentheses may be arranged in any order.)

[0071] The organohydrogenpolysiloxane of component (C) may use either a single compound, or a combination of two or more different compounds.

[0072] The amount of component (C) is such that the number of hydrogen atoms bonded to silicon atoms (Si-H groups) in component (C) is preferably 0.5 to 5.0 times, more preferably 0.7 to 3.0 times, the total number of alkenyl groups and (meth)acrylic groups in component (A). Within such a range, crosslinking proceeds sufficiently, and a cured product having excellent surface curability and hardness can be obtained.

[0073] <(D) component> The platinum group metal catalyst of component (D) is a component for promoting and accelerating the hydrosilylation reaction between components (A) and (C) above. Examples of platinum group metal catalysts include the same catalysts as those exemplified for use in the addition reaction between components (a) and (b) in component (A) above, and among these, those containing platinum are preferred.

[0074] Furthermore, the platinum group metal catalyst is used during the synthesis of component (A) and the one remaining in the composition may be used as is, or may be further added to the composition.

[0075] The component (D) may use either a single compound, or a combination of two or more different compounds.

[0076] The amount of component (D) to be blended may be any amount that is effective as a catalyst, but the amount is preferably an amount that results in a platinum group metal content of 0.01 to 500 ppm, and more preferably an amount that results in a platinum group metal content of 0.1 to 100 ppm, based on the total mass of the composition. Within such a range, the hydrosilylation reaction can be promoted more effectively.

[0077] <(E) component> The thermosetting silicone composition of the present invention preferably further contains component (E), an organosiloxane having an average structural unit ratio represented by the following formula (4): By using such component (E) in combination, the die shear strength of the cured product can be further improved. (R 1 3 SiO 1 / 2 ) f (R 2 R 1 2 SiO 1 / 2 ) g (R 3 R 1 2 SiO 1 / 2 ) h (R 1 2 SiO 2 / 2 ) i (R 1 SiO 3 / 2 ) j (SiO4 / 2 ) k (4) (In the formula, R 1 , R 2 and R 3 is the same as the above formula (1). f, g, h, i, j, and k are numbers that satisfy f≧0, g≧0, h>0, i≧0, j≧0, k≧0, and f+g+h+i+j+k=1.

[0078] f is preferably a number from 0 to 0.65, and more preferably a number from 0.10 to 0.50. More preferred.

[0079] The character g is preferably a number from 0 to 0.65, and more preferably a number from 0.01 to 0.50.

[0080] h is preferably a number from 0.01 to 0.65, and more preferably a number from 0.05 to 0.50.

[0081] The letter i is preferably a number from 0 to 0.30, and more preferably 0.

[0082] j is preferably a number from 0 to 0.60, and more preferably 0.

[0083] k is preferably a number from 0.05 to 0.90, and more preferably a number from 0.40 to 0.70.

[0084] Specific examples of the component (E) include organopolysiloxanes having an average structural unit ratio represented by the following formula, but are not limited to these.

[0085] (Me 3 SiO 1 / 2 ) 0.4 (Vi) (Me) 2 SiO 1 / 2 ) 0.014 ((MA)(Me) 2 SiO 1 / 2 ) 0.056 (SiO 4 / 2 ) 0.53 (Me 3 SiO 1 / 2 ) 0.2 (Vi) (Me) 2 SiO 1 / 2 ) 0.1 ((MA)(Me) 2 SiO 1 / 2 ) 0.1 (SiO 4 / 2 ) 0.6 (Me 3 SiO 1 / 2 ) 0.2 ((MA)(Me) 2 SiO 1 / 2 ) 0.2 (SiO 4 / 2 ) 0.6 (Vi) (Me) 2 SiO 1 / 2 ) 0.25 ((MA)(Me) 2 SiO 1 / 2 ) 0.25 (MeSiO 3 / 2 ) 0.5 ((MA)(Me) 2 SiO 1 / 2 ) 0.5 (SiO 4 / 2 ) 0.5

[0086] The component (E) may use either a single compound, or a combination of two or more different compounds.

[0087] When the component (E) is used, the blending amount is preferably from 10 to 80 mass %, and more preferably from 20 to 70 mass %, based on the total mass of the components (A) and (E).

[0088] <Other ingredients> In addition to the above components (A) to (E), components such as fillers, adhesion improvers, radical reaction inhibitors, and addition reaction inhibitors may also be added to the thermosetting silicone composition of the present invention, depending on the purpose.

[0089] Specific examples of fillers include inorganic fillers such as finely powdered silica, crystalline silica, hollow fillers, and silsesquioxanes, as well as fillers obtained by subjecting the above fillers to a surface hydrophobic treatment with an organosilicon compound such as an organoalkoxysilane compound, an organochlorosilane compound, an organosilazane compound, or a low-molecular-weight siloxane compound, silicone rubber powder, and silicone resin powder.

[0090] Among these, the preferred is a material with a specific surface area of ​​50 m2 by the BET method. 2 / g or more, more preferably 120 to 400m 2 / g, and examples of finely powdered silica include fumed silica (dry silica), precipitated silica (wet silica), and gel-process silica (wet silica) having a high specific surface area, with fumed silica being particularly preferred.

[0091] The finely powdered silica may be, for example, a finely powdered silica whose surface has been hydrophobized with a surface treatment agent such as a (usually hydrolyzable) organosilicon compound, such as chlorosilane, alkoxysilane, or organosilazane.

[0092] When a filler is used, the blending amount is preferably 1 to 50 parts by mass, and more preferably 5 to 20 parts by mass, per 100 parts by mass of the combined total of the components (A) and (E).

[0093] Examples of the radical reaction inhibitor include phenol-based radical reaction inhibitors such as dibutylhydroxytoluene, and amine-based radical reaction inhibitors such as diphenylamine derivatives.

[0094] Examples of the addition reaction inhibitor include phosphorus-containing compounds such as triphenylphosphine, nitrogen-containing compounds such as tributylamine, tetramethylethylenediamine, and benzotriazole, sulfur-containing compounds, acetylene compounds, hydroperoxy compounds, and maleic acid derivatives. Specific examples of such inhibitors include 3-methyl-1-dodecyn-3-ol, 1-ethynylcyclohexanol, and 3,5-dimethyl-1-hexyn-3-ol.

[0095] Since the degree of the curing inhibition effect of these reaction inhibitors varies depending on the chemical structure of the reaction inhibitor, it is desirable to adjust the blending amount of these reaction inhibitors to an optimal amount for each reaction inhibitor used. Usually, it is preferable to use 0.01 to 10 mass% based on the mass of the entire composition.

[0096] As the adhesion improver, from the viewpoint of imparting self-adhesiveness to the curable silicone composition of the present invention, an organosilicon compound such as a silane or siloxane that contains a functional group that imparts adhesiveness, or a non-silicon organic compound, etc., can be used.

[0097] Specific examples of functional groups that impart adhesiveness include vinyl groups bonded to silicon atoms, alkenyl groups such as allyl groups, or hydrogen atoms, epoxy groups bonded to silicon atoms via carbon atoms (e.g., γ-glycidoxypropyl group, β-(3,4-epoxycyclohexyl)ethyl group, etc.), acryloxy groups (e.g., γ-acryloxypropyl group, etc.), methacryloxy groups (e.g., γ-methacryloxypropyl group, etc.), and alkoxysilyl groups (e.g., trimethoxysilyl group, triethoxysilyl group, methyldimethoxysilyl group, and other alkoxysilyl groups bonded to silicon atoms via alkylene groups which may contain 1 to 2 ester structures, urethane structures, or ether structures).

[0098] Specific examples of such organosilicon compounds include compounds represented by the following structural formulas, but are not limited to these. [ka] [ka] (In the formula, the siloxane units may be arranged in any order.) [ka] (In the formula, the siloxane units may be arranged in any order.)

[0099] Examples of non-silicon organic compounds include unsaturated carboxylic acid allyl esters such as acrylic acid, methacrylic acid, and vinyl acetate; aromatic carboxylic acid allyl esters such as benzoic acid allyl ester, phthalic acid diallyl ester, and pyromellitic acid tetraallyl ester; saturated fatty acid allyl esters such as acetate allyl ester, propionate allyl ester, butyrate allyl ester, valerate allyl ester, and laurate allyl ester; and triallyl isocyanurate.

[0100] When an adhesion improver is used, its amount is preferably 1 to 30 parts by mass, and more preferably 1 to 10 parts by mass, per 100 parts by mass of the total of the above components (A) and (E). With such an amount, the thermosetting silicone composition of the present invention and its cured product effectively have improved adhesion to substrates and are less likely to become discolored.

[0101] The thermosetting silicone composition of the present invention can be produced by mixing the above-mentioned components by a known mixing method, for example, using a mixer, roll, etc. Furthermore, the thermosetting silicone composition of the present invention preferably has a viscosity measured at 25°C using a rotational viscometer, for example, an E-type viscometer, of 5 to 100 Pa·s, particularly 20 to 50 Pa·s. If the viscosity is in this range, the workability in die bonding (transfer method) is good.

[0102] [Silicone cured product] Furthermore, the present invention provides a silicone cured product, which is a cured product of the thermosetting silicone composition of the present invention. The thermosetting silicone composition of the present invention can be cured by a known curing method under known curing conditions. Specifically, the composition can be cured by heating at a temperature of usually 80 to 200°C, preferably 100 to 160°C. The heating time may be about 0.5 minutes to 5 hours, particularly about 1 minute to 3 hours. It can be appropriately selected from the balance of working conditions, productivity, and the heat resistance of the light-emitting element and the housing.

[0103] The heat-curable silicone composition of the present invention can provide a cured product that overcomes the problem of the surface being uncured due to oxygen inhibition by carrying out both curing of the (meth)acrylic group by peroxide and curing of the SiH group and the addition reaction of the unsaturated group. In addition, the heat-curable silicone composition of the present invention can provide a cured product that has excellent adhesive strength and high hardness.

[0104] [Die bond material] The present invention also provides a die bond material comprising the thermosetting silicone composition of the present invention, particularly a die bond material that can be used to connect a semiconductor element to a wiring board.

[0105] The thermosetting silicone composition of the present invention can be suitably used for fixing an LED chip to a package, and can also be suitably used for other optical semiconductor elements such as organic electroluminescent elements (organic EL), laser diodes, and LED arrays.

[0106] The thermosetting silicone composition of the present invention can provide a silicone cured product with excellent hardness and die shear strength. Therefore, a die bond material made of the thermosetting silicone composition of the present invention can be suitably used as a die bond material for mounting an LED chip to a wiring board.

[0107] The method of applying the die-bonding material is not particularly limited, and examples thereof include spin coating, printing, and compression molding. The thickness of the die-bonding material may be appropriately selected, and is usually 5 to 50 μm, and particularly 10 to 30 μm. For example, the thickness is 0.5 to 5 kgf / cm at a temperature of 23° C. using a dispenser. 2 It can be easily applied by discharging the die bond material at a pressure of 1000 MPa. It can also be easily applied by transferring a predetermined amount of the die bond material to the substrate using a stamping device.

[0108] The mounting method of the optical semiconductor element is not particularly limited, and for example, a die bonder can be used. Factors that determine the thickness of the die bond material include the above-mentioned viscosity of the die bond material, as well as the pressure load, pressure time, and pressure temperature of the optical semiconductor element. These conditions may be appropriately selected according to the outer shape of the optical semiconductor element and the desired thickness of the die bond material, and the pressure load is generally 1 gf or more and 1 kgf or less. Preferably, it is 10 gf or more and 100 gf or less. If the pressure load is 1 gf or more, the die bond material can be sufficiently pressure-bonded. Furthermore, if a pressure load of 1 kgf or less is used, the light-emitting layer on the surface of the optical semiconductor element will not be damaged. The pressure time may be appropriately selected in consideration of the productivity of the process, and is generally more than 0 msec and 1 sec or less. Preferably, it is 1 msec or more and 30 msec. If it is 1 sec or less, it is preferable in terms of productivity. There is no particular restriction on the pressure bonding temperature, and it may be in accordance with the temperature range of the die bond material, but generally, it is preferable that it is 15 ° C. or more and 100 ° C. or less. If the die bonder does not have a heating device on the compression stage, it is sufficient to use a temperature range close to room temperature. If the temperature is 15°C or higher, the viscosity of the die bond material does not become too high, allowing sufficient compression. If the temperature is 100°C or lower, the die bond material does not begin to harden, allowing the desired thickness of the die bond material to be achieved.

[0109] [Optical semiconductor device] The present invention further provides an optical semiconductor device comprising the above-mentioned silicone cured product of the present invention.

[0110] The optical semiconductor device of the present invention is obtained by curing a die bond material made of the thermosetting silicone composition of the present invention, and has a cured product with excellent hardness and die shear strength.

[0111] The optical semiconductor device of the present invention can be produced by applying a die bond material made from the thermosetting silicone composition of the present invention to a substrate, and then die bonding an optical semiconductor element thereto by a conventional method. EXAMPLES

[0112] The present invention will be specifically described below using examples and comparative examples, but the present invention is not limited to these. The molecular weight is the weight average molecular weight converted into standard polystyrene by gel permeation chromatography (GPC). The viscosity at 25°C is the value measured by a rotational viscometer.

[0113] The abbreviations for each siloxane unit are as follows: Me means a methyl group, Vi means a vinyl group, and MA means a group represented by the following formula (3). [ka] (In the formula, the wavy line represents a bond.) M: (CH 3 ) 3 SiO 1 / 2 M Vi :(CH 2 =CH)(CH 3 ) 2 SiO 1 / 2 M 3Vi :(CH 2 =CH) 3 SiO 1 / 2 D: (CH 3 ) 2 SiO 2 / 2 D H :H(CH 3 )SiO 2 / 2 D Vi :(CH=CH 2 )(CH 3 )SiO T: (CH 3 )SiO 3 / 2 T Vi :(CH 2 =CH)SiO 3 / 2 Q:SiO 4 / 2

[0114] [Synthesis Example 1] A 500 mL four-neck flask equipped with a stirrer, condenser, dropping funnel, and thermometer was charged with the average unit ratio M 0.4 M3Vi 0.07 Q 0.53 144.93 g of a 34.5 mass% xylene solution of an organopolysiloxane having a molecular weight of 3,300 and 29.80 g of the siloxane compound represented by the above formula (10) were added and heated to 70°C with stirring. A platinum group metal catalyst was added to the mixture so that the concentration was 3 ppm by mass, and the mixture was stirred at 95°C for 4 hours. The mixture was then cooled to room temperature, activated carbon was added, stirred for 30 minutes, and filtered. The mixture was concentrated under reduced pressure at 110°C and 1000 Pa or less for 2 hours, giving a viscosity of 1,316 mPa s and an average constitutional unit ratio (Me 3 SiO 1 / 2 ) 0.4 (Vi) 0.6 (MA) 2.4 SiO 1 / 2 ) 0.07 (SiO 4 / 2 ) 0.53 As a result, an organopolysiloxane (A-1) having a weight average molecular weight of 4,100 was obtained.

[0115] [Synthesis Example 2] A 500 mL four-neck flask equipped with a stirrer, condenser, dropping funnel, and thermometer was charged with the average unit ratio M 0.32 M 3Vi 0.14 Q 0.53 123.46 g of a 40.5% xylene solution of an organopolysiloxane having a molecular weight of 3,900 and 59.08 g of the siloxane compound represented by the above formula (10) were added and heated to 70°C with stirring. A platinum group metal catalyst was added to the mixture so that the concentration was 3 ppm by mass, and the mixture was stirred at 95°C for 4 hours. The mixture was then cooled to room temperature, activated carbon was added, stirred for 30 minutes, and filtered. The mixture was concentrated under reduced pressure at 110°C and 1000 Pa or less for 2 hours to obtain a viscosity of 505 mPa s and an average constitutional unit ratio (Me 3 SiO 1 / 2 ) 0.33 (Vi) 0.6 (MA) 2.4 SiO 1 / 2 ) 0.14 (SiO 4 / 2 ) 0.53 As a result, organopolysiloxane (A-2) having a weight average molecular weight of 4,700 was obtained.

[0116] [Synthesis Example 3] A 2000 mL four-neck flask equipped with a stirrer, condenser, dropping funnel, and thermometer was charged with the average unit ratio M 0.4 M Vi 0.07 Q 0.53 800 g of a 51.5% xylene solution of an organopolysiloxane having a molecular weight of 5,300 and 71.89 g of the siloxane compound represented by the above formula (10) were added and heated to 70° C. with stirring. A platinum group metal catalyst was added to the mixture so that the amount was 3 ppm by mass, and the mixture was stirred at 95° C. for 2 hours, after which it was cooled to room temperature, activated carbon was added, the mixture was stirred for 30 minutes, and the mixture was filtered to determine the average constitutional unit ratio (Me 3 SiO 1 / 2 ) 0.4 (Vi) (Me) 2 SiO 1 / 2 ) 0.014 ((MA)(Me) 2 SiO 1 / 2 ) 0.056 (SiO 4 / 2 ) 0.53 Thus, a 55.4% xylene solution of organopolysiloxane (E-1) was obtained.

[0117] [Synthesis Example 4] A 500 mL four-neck flask equipped with a stirrer, condenser, dropping funnel, and thermometer was charged with the average unit ratio M Vi 0.5 T 0.5 100 g of organopolysiloxane having a molecular weight of 3,700 was added, and the temperature was raised to 70°C while stirring. A platinum group metal catalyst was added so that the amount was 3 ppm by mass, and 68.8 g of the siloxane compound represented by the above formula (10) was added dropwise while stirring. After stirring at 95°C for 3 hours, the mixture was cooled to room temperature, activated carbon was added, stirred for 30 minutes, and then filtered to give a viscosity of 100 mPa s and an average constitutional unit ratio ((Vi)(Me) 2 SiO 1 / 2 ) 0.25 ((MA)(Me) 2 SiO 1 / 2 ) 0.25 (MeSiO 3 / 2 ) 0.5 As a result, organopolysiloxane (E-2) having a molecular weight of 2,100 was obtained.

[0118] [Examples 1 to 5, Comparative Examples 1 to 3] The components listed below were mixed in the amounts shown in Table 1 to prepare a thermosetting silicone composition. The numerical values ​​for each component in Table 1 represent parts by mass. The [Si-H] / [Vi] value represents the ratio (molar ratio) of the number of hydrogen atoms bonded to silicon atoms (Si-H groups) in components (C) and (H-3) to the total number of alkenyl groups and (meth)acrylic groups in components (A) and (E).

[0119] (A) Component: (A-1) Organopolysiloxane obtained in Synthesis Example 1 (A-2) Organopolysiloxane obtained in Synthesis Example 2

[0120] (B) Ingredients: (B-1) 70% by mass solution of 1,6-bis(t-butylperoxycarbonyloxy)hexane in tributyl acetate citrate (manufactured by Nouryon Chemical Industries, Ltd., trade name: Kayalene 6-70, 10-hour half-life temperature at 0.2 mol / L in benzene: 97° C.)

[0121] (C) Ingredients: (C-1)M 2 D H 8 Methylhydrogenpolysiloxane represented by the formula: (C-2)M 2 D 28 D H 70 Methylhydrogenpolysiloxane represented by the formula:

[0122] (D) Ingredients: (D-1) Toluene solution of reaction product of hexachloroplatinic acid and 1,3-divinyltetramethyldisiloxane (platinum content: 0.5% by mass)

[0123] (E) Ingredients: (E-1) 55.4% xylene solution of the organopolysiloxane obtained in Synthesis Example 3 (E-2) Organopolysiloxane obtained in Synthesis Example 4

[0124] (F) Filler: (F-1) Fumed silica (manufactured by Tokuyama Corporation, product name: Reolosil DM-30S)

[0125] (G) Component: Reaction control agent (G-1) 3-Methyl-1-dodecyne-3-ol

[0126] Component (H): Adhesion improver (H-1) Triallyl isocyanurate (H-2) 3-Methacryloxypropyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., product name: KBM-503) (H-3) A compound represented by the following structural formula: [ka]

[0127] The thermosetting silicone composition thus obtained was subjected to the following evaluations, and the results are shown in Table 2.

[0128] [hardness] The resulting thermosetting silicone composition was molded to a thickness of 2 mm and cured for 2 hours at 120°C, after which the hardness was measured using a Durometer Type D manufactured by Ueshima Seisakusho.

[0129] [Die shear strength] The obtained thermosetting silicone composition was quantitatively transferred by stamping onto the silver-plated electrode part of an SMD5050 package (I-CHIUN PRECSION INDUSTRY CO., resin part: polyphthalamide) using a die bonder (AD-830, manufactured by ASM), and an optical semiconductor element (0.25×0.25 mm) was mounted thereon. The produced package was heated in an oven at 120° C. for 4 hours to cure the thermosetting silicone composition, and then the die shear strength was measured using a bond tester (Series 4000, manufactured by Dage).

[0130] [Table 1]

[0131] [Table 2]

[0132] As shown in Table 2, the silicone cured products obtained from the thermosetting silicone compositions of Examples 1 to 5, which contained the component (A) with a specific structure, had excellent hardness and die shear strength at 25°C and 150°C.

[0133] On the other hand, the silicone cured products obtained from the thermosetting silicone compositions of Comparative Examples 1 to 3 that did not contain component (A) had low crosslink density and inferior die shear strength. Furthermore, in Comparative Example 2, in which component (C) in Comparative Example 1 was changed, and in Comparative Example 3, in which the amount of peroxide (component (B-1)) was increased, the die shear strength could not be increased.

[0134] As described above, it has been found that the thermosetting silicone composition of the present invention gives a cured silicone product that has excellent hardness and die shear strength, and is particularly useful as a die bonding material for use in die bonding of LED elements and the like.

[0135] The present specification includes the following aspects. [1]: The following components (A) to (D): (A) an organopolysiloxane having an average structural unit ratio represented by the following formula (1): (R 1 3 SiO 1 / 2 ) a (R 2 3-n R 3 n SiO 1 / 2 ) b (R 1 2 SiO 2 / 2 ) c (R 1 SiO 3 / 2 ) d (SiO 4 / 2 ) e(1) (In the formula, R 1 each independently represents a monovalent hydrocarbon group having 1 to 12 carbon atoms which does not have an aliphatic unsaturated bond and which may be substituted with a halogen atom; R 2 each independently represents an alkenyl group having 2 to 10 carbon atoms; R 3 each independently represents a group represented by the following formula (2), n is a number from 1.5 to 3, and a, b, c, d, and e are numbers that satisfy a≧0, b>0, c≧0, d≧0, and e≧0, with the proviso that d+e>0 and a+b+c+d+e=1. [ka] (In the formula, R 4 is a hydrogen atom or a methyl group, and R 5 each independently represents a monovalent hydrocarbon group having 1 to 12 carbon atoms which has no aliphatic unsaturated bond and which may be substituted with a halogen atom; Z 1 is an alkylene group or an oxyalkylene group having 1 to 10 carbon atoms, Z 2 is an alkylene group having 2 to 10 carbon atoms, and m is an integer of 0 to 20. The wavy line represents a bond. (B) organic peroxide, (C) an organohydrogenpolysiloxane having two or more hydrogen atoms bonded to silicon atoms in one molecule, and (D) Platinum group metal catalyst A thermosetting silicone composition comprising: [2]: R in the above formula (1) 1 is a methyl group, and R 2 is a vinyl group, and R 3 is a group represented by the following formula (3): [ka] (In the formula, the wavy line represents a bond.) [3]: The thermosetting silicone composition according to the above [1] or [2], wherein in the above formula (1), b is a number from 0.05 to 0.2, and n is a number from 2 to 3. [4]: The thermosetting silicone composition according to the above [1], [2] or [3], wherein c and d in the above formula (1) are 0. [5]: The thermosetting silicone composition according to the above [1], [2], [3] or [4], further comprising component (E), an organosiloxane having an average structural unit ratio represented by the following formula (4): (R 1 3 SiO 1 / 2 ) f (R 2 R 1 2 SiO 1 / 2 ) g (R 3 R 1 2 SiO 1 / 2 ) h (R 1 2 SiO 2 / 2 ) i (R 1 SiO 3 / 2 ) j (SiO 4 / 2 ) k (4) (In the formula, R 1 , R 2 and R 3 is the same as the above formula (1). f, g, h, i, j, and k are numbers that satisfy f≧0, g≧0, h>0, i≧0, j≧0, k≧0, and f+g+h+i+j+k=1. [6]: A die-bonding material comprising the thermosetting silicone composition according to any one of [1] to [5] above. [7]: A silicone cured product, which is a cured product of the thermosetting silicone composition described in any one of [1] to [5] above. [8]: An optical semiconductor device comprising the silicone cured product according to [7] above.

[0136] The present invention is not limited to the above-described embodiment. The above-described embodiment is merely an example, and anything that has substantially the same configuration as the technical idea described in the claims of the present invention and exhibits similar effects is included in the technical scope of the present invention.

Claims

1. The following components (A) to (D): (A) an organopolysiloxane having an average structural unit ratio represented by the following formula (1): (R １ ３ SiO １／２ ) ａ (R ２ ３－ｎ R ３ ｎ SiO １／２ ) ｂ (R １ ２ SiO ２／２ ) ｃ (R １ SiO ３／２ ) ｄ (SiO ４／２ ) ｅ ・・・(1) (In the formula, R １ each independently represents a monovalent hydrocarbon group having 1 to 12 carbon atoms which has no aliphatic unsaturated bond and which may be substituted with a halogen atom; R ２ each independently represents an alkenyl group having 2 to 10 carbon atoms; R ３ each independently represents a group represented by the following formula (2), n is a number from 1.5 to 3, and a, b, c, d, and e are numbers that satisfy a≧0, b>0, c≧0, d≧0, and e≧0, with the proviso that d+e>0 and a+b+c+d+e=1. 【Chemistry 1】 (In the formula, R ４ is a hydrogen atom or a methyl group, R ５ each independently represents a monovalent hydrocarbon group having 1 to 12 carbon atoms which has no aliphatic unsaturated bond and which may be substituted with a halogen atom; Z １ is an alkylene or oxyalkylene group having 1 to 10 carbon atoms; Z ２ is an alkylene group having 2 to 10 carbon atoms, and m is an integer from 0 to 20. The wavy line represents a bond. (B) organic peroxide, (C) an organohydrogenpolysiloxane having two or more hydrogen atoms bonded to silicon atoms in one molecule, and (D) Platinum group metal catalyst A thermosetting silicone composition comprising:

2. R in the formula (1) １ is a methyl group, R ２ is a vinyl group, R ３ is a group represented by the following formula (3): 【Chemistry 2】 (In the formula, the wavy line represents a bond.)

3. 2. The thermosetting silicone composition according to claim 1, wherein in the formula (1), b is a number from 0.05 to 0.2, and n is a number from 2 to 3.

4. 2. The thermosetting silicone composition according to claim 1, wherein c and d in formula (1) are 0.

5. 2. The heat-curable silicone composition according to claim 1, further comprising component (E), an organosiloxane having an average ratio of structural units represented by formula (4): (R １ ３ SiO １／２ ) ｆ (R ２ R １ ２ SiO １／２ ) ｇ (R ３ R １ ２ SiO １／２ ) ｈ (R １ ２ SiO ２／２ ) ｉ (R １ SiO ３／２ ) ｊ (SiO ４／２ ) ｋ ・・・(4) (In the formula, R １ , R ２ and R ３ is the same as the above formula (1). f, g, h, i, j, and k are numbers that satisfy f≧0, g≧0, h>0, i≧0, j≧0, k≧0, and f+g+h+i+j+k=1.

6. A die-bonding material comprising the thermosetting silicone composition according to any one of claims 1 to 5.

7. A silicone cured product, which is a cured product of the thermosetting silicone composition according to any one of claims 1 to 5.

8. An optical semiconductor device comprising the silicone cured product according to claim 7.

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