Reinforcing resin composition and mounted structure

Abstract

To provide a reinforcing resin composition that yields a cured product having adhesion to metals and resistance to moisture absorption.SOLUTION: A reinforcing resin composition includes: an epoxy compound (A); an aromatic amine compound (B1) having an active hydrogen equivalent of 50 g / eq. or more and 320 g / eq. or less; and an alicyclic amine compound (B2) having an active hydrogen equivalent of 30 g / eq. or more and 50 g / eq. or less.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present disclosure relates to a reinforcing resin composition and a mounting structure, and more particularly to a reinforcing resin composition containing an epoxy compound, and a mounting structure including a reinforcing part containing a cured product of this reinforcing resin composition. [Background technology]

[0002] Patent Document 1 discloses a flux composition containing 20 wt % or more and 50 wt % or less of an epoxy compound, 15 wt % or more and 45 wt % or less of diallyl bisphenol A, and 1 wt % or more and 30 wt % or less of an organic acid, a solder joint using this flux composition, and a solder joint method using this flux composition. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2020-025973 A Summary of the Invention [Problem to be solved by the invention]

[0004] When mounting an electronic component on a substrate or the like by soldering, the joint between the two is sometimes reinforced with a reinforcing part containing a cured product of a resin composition such as a flux composition (see Patent Document 1). In order to achieve reinforcement with the reinforcing part, the reinforcing part should adhere sufficiently to the metal electrodes and bumps, but if the reinforcing part absorbs moisture in the air, the adhesion between the reinforcing part and the metal may decrease.

[0005] An object of the present disclosure is to provide a reinforcing resin composition, the cured product of which has adhesion to metal and which can suppress a decrease in adhesion due to moisture absorption, and a mounting structure including a reinforcing part containing a cured product of this reinforcing resin composition. [Means for solving the problem]

[0006] A reinforcing resin composition according to one embodiment of the present disclosure contains an epoxy compound (A), an aromatic amine compound (B1) having an active hydrogen equivalent of 50 g / eq. or more and 320 g / eq. or less, and an alicyclic amine compound (B2) having an active hydrogen equivalent of 30 g / eq. or more and 50 g / eq. or less.

[0007] A mounting structure according to one embodiment of the present disclosure comprises a substrate having a first conductor, a mounting component having a second conductor, a solder bump interposed between the first conductor and the second conductor and electrically connecting the first conductor and the second conductor, and a reinforcing portion including a cured product of the reinforcing resin composition, the reinforcing portion covering at least one of a joint between the first conductor and the solder bump and a joint between the second conductor and the solder bump. Effect of the Invention

[0008] In the reinforcing resin composition according to one embodiment of the present disclosure, the cured product has adhesion to metal, and a decrease in adhesion due to moisture absorption can be suppressed. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a schematic cross-sectional view of a mounting structure according to an embodiment of the present disclosure. [Diagram 2] FIG. 2 is a schematic cross-sectional view of a mounting structure according to a first modified example of the present disclosure. [Diagram 3] FIG. 3 is a schematic cross-sectional view of a mounting structure according to a second modified example of the present disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] The embodiments and modifications will be described with reference to FIG. 1 to FIG. 3. The following embodiments and modifications are merely a part of various embodiments of the present disclosure. In addition, the following embodiments and modifications can be modified in various ways according to design, etc., as long as the object of the present disclosure can be achieved. The configuration of the embodiment and the configuration of the modifications can be appropriately combined, and the configurations of the modifications can be appropriately combined. The figures referred to below are schematic diagrams, and the dimensional ratios of the components in the figures do not necessarily reflect the actual dimensional ratios. Although the mechanisms related to the action and effect may be described below, all of the mechanisms are inferred, and the present disclosure is not bound by the description of the mechanisms.

[0011] 1. Overview The reinforcing resin composition according to the embodiment (hereinafter also referred to as composition (X)) contains an epoxy compound (A), an aromatic amine compound (B1) having an active hydrogen equivalent of 50 g / eq. or more and 320 g / eq. or less, and an alicyclic amine compound (B2) having an active hydrogen equivalent of 30 g / eq. or more and 50 g / eq. or less.

[0012] According to the embodiment, when the composition (X) is cured in contact with a metal, the cured product of the composition (X) can have good adhesion to the metal. In addition, the moisture absorption of the cured product is reduced, so that the adhesion of the cured product to the metal is less likely to decrease due to moisture absorption.

[0013] The composition (X) can be used to produce a reinforcing portion in a mounting structure.

[0014] The mounting structure according to the embodiment comprises a substrate, a mounting component, a solder bump, and a reinforcing portion. The substrate comprises a first conductor. The mounting component comprises a second conductor. The solder bump is interposed between the first conductor and the second conductor, and electrically connects the first conductor and the second conductor. The reinforcing portion includes a cured product of a composition (X), and covers at least one of the joint between the first conductor and the solder bump and the joint between the second conductor and the solder bump.

[0015] According to the embodiment, the reinforcing portion can have good adhesion to the solder bumps and the like, and the decrease in adhesion due to moisture absorption of the reinforcing portion can be suppressed. For example, when the reinforcing portion is heated in a reflow furnace or the like while absorbing moisture from the air, the adhesion between the surface of the solder bumps and the reinforcing portion decreases, and in some cases the reinforcing portion may peel off. In this case, the reinforcing effect of the reinforcing portion may not be sufficiently obtained. However, in the embodiment, since the reinforcing portion is not easily hygroscopic, the adhesion between the reinforcing portion and the solder bumps and the like can be maintained well.

[0016] 2. Composition The composition (X) will be explained in more detail.

[0017] The epoxy compound (A) is a compound having an epoxy group. The epoxy compound (A) may contain a monomer or an oligomer. The epoxy compound (A) can impart thermosetting properties to the composition (X). The epoxy compound (A) preferably contains a compound having two or more epoxy groups in one molecule.

[0018] The epoxy compound (A) is preferably liquid at room temperature. In that case, the epoxy compound (A) can be well mixed with other components in the composition (X). The term "liquid at room temperature" means that the epoxy compound (A) has fluidity under atmospheric pressure and at an ambient temperature of 5°C to 28°C (particularly around 20°C). The epoxy compound (A) may contain only a component that is liquid at room temperature, or may contain a component that is liquid at room temperature and a component that is not liquid at room temperature. The epoxy compound (A) may not be liquid at room temperature, and the epoxy compound (A) may be compatible with a reactive diluent, a solvent, etc. in the composition (X), so that the composition (X) is liquid.

[0019] The ratio of the epoxy compound (A) is preferably 48% by mass or more and 85% by mass or less based on the solid content of the composition (X). In this case, the composition (X) can have good fluidity, and the composition (X) can be easily applied to the joint between the conductor and the solder bump. This ratio is preferably 49% by mass or more. It is also preferable that this ratio is 80% by mass or less. The solid content refers to the components in the composition (X) excluding components (such as solvents) that volatilize during the process of producing a cured product, in other words, components that can constitute a cured product.

[0020] The epoxy compound (A) preferably contains at least one epoxy compound (A1) selected from the group consisting of naphthalene type epoxy resins, biphenyl aralkyl type epoxy resins, trisphenolmethane type epoxy resins, biphenyl type epoxy resins, and dicyclopentadiene type epoxy resins. In this case, the glass transition temperature of the cured product can be further increased. This is presumably because the epoxy compound (A1) has a highly rigid structure.

[0021] Specifically, each of naphthalene-type epoxy resins, biphenylaralkyl-type epoxy resins, trisphenolmethane-type epoxy resins, biphenyl-type epoxy resins, and dicyclopentadiene-type epoxy resins has two or more cyclic structures in one molecule, which is presumably restricting the movement of the molecular chain and thus increasing the glass transition point of the cured product.

[0022] The naphthalene-type epoxy resin is an epoxy compound containing one or more naphthalene skeletons in one molecule. The naphthalene skeleton in the naphthalene-type epoxy resin has rigidity and hydrophobicity, and the glass transition temperature of the cured product of the composition (X) can be increased.

[0023] The biphenylaralkyl type epoxy resin is an epoxy compound containing one or more aralkyl skeletons having a biphenyl group in one molecule. Since the aralkyl skeleton of the biphenylaralkyl type epoxy resin has a rigid biphenyl group, the glass transition temperature of the cured product of the composition (X) can be increased.

[0024] Trisphenolmethane type epoxy resin is an epoxy compound having three epoxy groups with phenylmethane skeletons in one molecule. The high density of functional groups (epoxy groups) in trisphenolmethane type epoxy resin can increase the glass transition temperature of the cured product of composition (X).

[0025] The dicyclopentadiene type epoxy resin is an epoxy compound having one or more dicyclopentadiene skeletons in one molecule. The rigid dicyclopentadiene skeleton in the dicyclopentadiene type epoxy resin can increase the glass transition temperature of the cured product of the composition (X).

[0026] The epoxy compound (A1) preferably has an epoxy group equivalent of 100 or more and 500 or less.

[0027] The naphthalene type epoxy resin contains at least one selected from the group consisting of, for example, a compound represented by the following formula (11), a compound represented by the following formula (12), a compound represented by the following formula (13), a compound represented by the following formula (14), a compound represented by the following formula (15), and a compound represented by the following formula (16). An example of the compound represented by formula (11) is HP-4032D (semi-solid) manufactured by DIC Corporation. An example of the compound represented by formula (12) is HP-4700 (softening point 85°C-95°C) and HP-4710 (softening point 85°C-105°C) manufactured by DIC Corporation. An example of the compound represented by formula (13) is EXA-4750 (softening point 80°C) manufactured by DIC Corporation. An example of the compound represented by formula (14) is HP-4770 (softening point 67°C-77°C) manufactured by DIC Corporation. Examples of the mixture of the compound represented by formula (15) and the compound represented by formula (16) include HP-6000 (softening point 65° C.-85° C.) and HP-6000L (softening point 59° C.) manufactured by DIC Corporation.

[0028] The trisphenolmethane type epoxy resin contains at least one selected from the group consisting of a compound represented by the following formula (17), a compound represented by the following formula (18), and a compound represented by the following formula (19). An example of the compound represented by formula (17) is HP-7241 (softening point 66°C) manufactured by DIC Corporation. An example of the compound represented by formula (18) is HP-7250 (semi-solid) manufactured by DIC Corporation. An example of the compound represented by formula (19) is EPPN-501H (softening point 51°C-57°C), EPPN-501HY (softening point 57°C-63°C), and EPPN-502H (softening point 60°C-72°C) manufactured by Nippon Kayaku Co., Ltd.

[0029] The biphenyl aralkyl type epoxy resin contains, for example, a compound represented by formula (20). Examples of the compound represented by formula (20) include NC-3000 (softening point 53°C-63°C), NC-3000L (softening point 45°C-60°C), NC-3000-H (softening point 65°C-75°C), and NC-3100 (softening point 90°C-103°C) manufactured by Nippon Kayaku Co., Ltd.

[0030] The biphenyl type epoxy resin contains, for example, a compound represented by formula (21). Examples of the compound represented by formula (21) include YH4000 (softening point 105° C.) and YX4000H (softening point 105° C.) manufactured by Mitsubishi Chemical Corporation.

[0031] The dicyclopentadiene type epoxy resin contains, for example, a compound represented by formula (22). Examples of the compound represented by formula (22) include HP-7200 (softening point 56°C-66°C), HP-7200L (softening point 50°C-60°C), HP-7200H (softening point 78°C-88°C), HP-7200HH (softening point 88°C-98°C), and HP-7200HHH (softening point 100°C-110°C) manufactured by DIC Corporation, and XD-1000 (softening point 68°C-78°C) manufactured by Nippon Kayaku Co., Ltd.

[0032] [ka]

[0033] [ka]

[0034] [ka]

[0035] [ka]

[0036] [ka]

[0037] [ka]

[0038] [ka]

[0039] In formula (17), n is an integer ranging from 1 to 10.

[0040] [ka]

[0041] In formula (18), n is an integer ranging from 1 to 10.

[0042] [ka]

[0043] In formula (19), n is an integer ranging from 1 to 10.

[0044] [ka]

[0045] In formula (20), n is an integer ranging from 1 to 10.

[0046] [ka]

[0047] In formula (21), R represents a methyl group.

[0048] [ka]

[0049] In formula (22), n is an integer ranging from 1 to 10.

[0050] The proportion of the epoxy compound (A1) is preferably 16% by mass or more and 35% by mass or less based on the solid content of the composition (X). If the proportion is 16% by mass or more, the glass transition temperature of the cured product can be increased. If the proportion is 18% by mass or more, it is more preferable. If the proportion is 35% by mass or less, it is advantageous in that the fluidity of the composition (X) is easily ensured. If the proportion is 32% by mass or less, it is more preferable.

[0051] The epoxy compound (A) may contain a compound (hereinafter referred to as epoxy compound (A2)) other than the above epoxy compound (A1).

[0052] When the epoxy compound (A) contains the epoxy compound (A1), the epoxy compound (A1) is often semi-solid or solid. Therefore, it is preferable that the epoxy compound (A) contains the epoxy compound (A2) in addition to the epoxy compound (A1), so that the epoxy compound (A) is liquid as a whole. In this case, the composition (X) can have better fluidity.

[0053] When the epoxy compound (A) contains the epoxy compound (A1) and the epoxy compound (A2), the ratio of the epoxy compound (A1) to the epoxy compound (A) is preferably 30% by mass or more and 40% by mass or less.

[0054] The epoxy compound (A2) contains, for example, a liquid compound having lower rigidity than the epoxy compound (A1). The epoxy compound (A2) may contain, for example, at least one selected from the group consisting of glycidyl ether type epoxy resins, glycidyl amine type epoxy resins, glycidyl ester type epoxy resins, olefin oxide type (alicyclic) epoxy compounds, bisphenol type epoxy resins such as bisphenol A type epoxy resins and bisphenol F type epoxy resins, hydrogenated bisphenol type epoxy resins such as hydrogenated bisphenol A type epoxy resins and hydrogenated bisphenol F type epoxy resins, alicyclic epoxy compounds, phenol novolac type epoxy resins, cresol novolac type epoxy resins, aliphatic epoxy compounds, and triglycidyl isocyanurate.

[0055] It is more preferable that the epoxy compound (A2) contains at least one selected from the group consisting of bisphenol A type epoxy resins, bisphenol F type epoxy resins, hydrogenated bisphenol A type epoxy resins, and hydrogenated bisphenol F type epoxy resins. In this case, the viscosity of the composition (X) can be reduced, and the physical properties of the cured product of the composition (X) can be improved.

[0056] In an embodiment, the composition (X) contains a curing agent (B), and the curing agent (B) contains an aromatic amine compound (B1) having an active hydrogen equivalent of 50 g / eq. or more and 320 g / eq. or less, and an alicyclic amine compound (B2) having an active hydrogen equivalent of 30 g / eq. or more and 50 g / eq. or less. Therefore, in the embodiment, as described above, the cured product of the composition (X) can have good adhesion to metal, and the cured product is less likely to absorb moisture, so that the deterioration of adhesion over time due to moisture absorption can be suppressed. The reason for this has not been fully elucidated, but it is presumed to be as follows.

[0057] The aromatic amine compound (B1) can contribute to the adhesion between the cured product and metal. In addition, the aromatic amine compound (B1) tends to increase the moisture absorption of the cured product, but when the alicyclic amine compound (B2) is used in combination, the moisture absorption of the cured product is not excessively increased.

[0058] In addition, when the active hydrogen group equivalent of the aromatic amine compound (B1) is 50 g / eq., moisture absorption of the cured product caused by active hydrogen in the cured product can be suppressed. When the active hydrogen group equivalent of the aromatic amine compound (B1) is 320 g / eq. or less, good reactivity between the epoxy compound (A) and the aromatic amine compound (B1) is realized, so that unreacted amino groups are less likely to remain in the cured product, and moisture absorption of the cured product by the amino group can be suppressed. When the active hydrogen group of the alicyclic amine compound (B2) is 30 g / eq. or more, moisture absorption of the cured product caused by active hydrogen in the cured product can be suppressed. When the active hydrogen group of the alicyclic amine compound (B2) is 50 g / eq. or less, there is an advantage that a crosslinked structure due to the reaction between the alicyclic amine compound (B2) and the epoxy compound (A) can be smoothly formed.

[0059] It is presumed that this leads to good adhesion between the cured product and the metal, and also prevents a decrease in adhesion due to moisture absorption by the cured product.

[0060] The aromatic amine compound (B1) is an amine compound having an aromatic ring in the molecule and an active hydrogen equivalent of 50 g / eq. to 320 g / eq. When the aromatic amine compound (B1) contains a plurality of compounds, each of the plurality of compounds has an active hydrogen equivalent of 50 g / eq. to 320 g / eq. The active hydrogen equivalent of the aromatic amine compound (B1) is preferably 52 g / eq. or more, and more preferably 53 g / eq. or more. The active hydrogen equivalent is more preferably 318 g / eq. or less, and even more preferably 316 g / eq. or less.

[0061] The aromatic amine compound (B1) has, for example, at least one selected from the group consisting of benzene rings as aromatic rings in the molecule. The aromatic amine compound (B1) contains, for example, a compound having two aromatic rings to which amino groups are bonded in the molecule. The aromatic amine compound (B1) contains, for example, at least one selected from the group consisting of 4,4'-diamino-3,3'-dimethyldiphenylmethane shown in the following formula (1), 4,4'-diaminodiphenylsulfone shown in the following formula (2), trimethylene bis(4-aminobenzoate) shown in the following formula (3), and poly(1,4-butanediol)bis(4-aminobenzoic acid) shown in the following formula (4).

[0062] [ka]

[0063] [ka]

[0064] [ka]

[0065] [ka]

[0066] In formula (4), n is the number of repeating units and is defined so that the active hydrogen equivalent of poly(1,4-butanediol)bis(4-aminobenzoic acid) shown in formula (4) is 50 g / eq. or more and 320 g / eq. or less.

[0067] The proportion of the aromatic amine compound (B1) is preferably 3% by mass or more and 20% by mass or less based on the solid content of the composition (X). When this proportion is 3% by mass or more, the adhesion of the cured product to metals can be further improved, and the moisture absorption of the cured product can be further reduced. This proportion is more preferably 3.2% by mass or more, and even more preferably 3.5% by mass or more. When this proportion is 20% by mass or less, the moisture absorption of the cured product can be further reduced. This proportion is more preferably 19.8% by mass or less, and even more preferably 19.5% by mass or less.

[0068] The alicyclic amine compound (B2) is an amine compound having an aliphatic ring in the molecule and an active hydrogen equivalent of 30 g / eq. to 50 g / eq. When the alicyclic amine compound (B2) contains a plurality of compounds, each of the plurality of compounds has an active hydrogen equivalent of 30 g / eq. to 50 g / eq. The active hydrogen equivalent of the alicyclic amine compound (B2) is preferably 31 g / eq. or more, and more preferably 33 g / eq. or more. The active hydrogen equivalent is more preferably 49 g / eq. or less, and even more preferably 47 g / eq. or less.

[0069] The alicyclic amine compound (B2) has, for example, at least one selected from the group consisting of a cyclohexane ring and norbornene as an aliphatic ring in the molecule. The aromatic amine compound (B1) contains, for example, a compound having two aromatic rings and two amino groups in the molecule. The aromatic amine compound (B1) contains, for example, at least one of norbornane diamine shown in the following formula (5) and isophorone diamine shown in the following formula (6).

[0070] [ka]

[0071] [ka]

[0072] The proportion of the alicyclic amine compound (B2) is preferably 3% by mass or more and 13% by mass or less based on the solid content of the composition (X). When this proportion is 3% by mass or more, the moisture absorption of the cured product can be further reduced. This proportion is more preferably 3.1% by mass or more, and even more preferably 3.3% by mass or more. When this proportion is 13% by mass or less, there is an advantage that the cured product does not become brittle. This proportion is more preferably 12.8% by mass or less, and even more preferably 12.5% ​​by mass or less.

[0073] The curing agent (B) may further contain an amine compound (hereinafter also referred to as amine compound (B3)) which is neither an aromatic amine compound (B1) nor an alicyclic amine compound (B2) within a range that does not excessively impair the object of the present disclosure. When the curing agent (B) contains the amine compound (B3), the proportion of the amine compound (B3) is preferably 5 mass% or less based on the total of the aromatic amine compound (B1), the alicyclic amine compound (B2) and the amine compound (B3).

[0074] The composition (X) may contain an activator (C). The activator (C) is a substance that exhibits a flux action during soldering. The flux action means a reducing action of removing an oxide film formed on the solder and the conductor, and an action of lowering the surface tension of the molten solder to increase the wettability of the solder to the metal surface. When the composition (X) contains the activator (C), the electrical connection reliability between the solder and the conductor can be improved.

[0075] The activator (C) preferably contains at least one of an organic acid (C1) having a carboxyl group equivalent of 40 g / eq to 400 g / eq and a melting point of 220°C or less, and an amine (C2) having a nitrogen atom equivalent of 10 g / eq to 300 g / eq and a melting point of 220°C or less. By having the melting point of the activator (C) be 220°C or less, even when using a solder having a melting point around 200°C or more, the oxide film of the solder can be removed before melting the solder. Note that the "carboxyl group equivalent" is the value obtained by dividing the mass (g) of one mole of a substance by the number of carboxyl groups per molecule of the substance, and the "nitrogen atom equivalent" is the value obtained by dividing the mass (g) of one mole of a substance by the number of nitrogen atoms per molecule of the substance.

[0076] The organic acid (C1) may include at least one selected from the group consisting of, for example, rosin component material, adipic acid, glutaric acid, succinic acid, malonic acid, citric acid, suberic acid, sebacic acid, and pimelic acid. The organic acid (C1) may include at least one selected from the group consisting of succinic acid (carboxyl group equivalent: 59 g / eq), glutaric acid (carboxyl group equivalent: 66 g / eq), adipic acid (carboxyl group equivalent: 73 g / eq), suberic acid (carboxyl group equivalent: 87 g / eq), sebacic acid (carboxyl group equivalent: 101 g / eq), and Tsunodyme 395 (carboxyl group equivalent: 288 g / eq).

[0077] The amine (C2) is not particularly limited as long as it is an amine used as a flux, and may include, for example, at least one selected from the group consisting of various amine salts, alkanolamines, and guanidines. It is particularly preferable that the amine (C2) includes at least one selected from the group consisting of diethanolamine (nitrogen atom equivalent: 105 g / eq), triethanolamine (TEA) (nitrogen atom equivalent: 149 g / eq), triisopropanolamine (nitrogen atom equivalent: 191 g / eq), 1,3-diphenylguanidine (nitrogen atom equivalent: 70 g / eq), and 1,3-di-o-tolylguanidine (nitrogen atom equivalent: 80 g / eq).

[0078] The activator (C) may contain components other than the organic acid (C1) and the amine (C2). For example, the activator (C) may contain an organic acid or amine having a melting point of more than 220°C.

[0079] The proportion of the activator (C) is preferably 1.5% by mass or more and 25% by mass or less based on the solid content of the composition (X). If this proportion is 4% by mass or more, the flux action is well exhibited, and the reliability of the conduction between the conductor and the solder can be further improved. If this proportion is 25% by mass or less, the deterioration of the storage stability of the composition (X) can be suppressed, the deterioration of the glass transition temperature of the cured product can be suppressed, and the deterioration of the bonding strength between the conductor and the solder can be suppressed. Furthermore, although the activator (C) is a polar compound, if the proportion of the activator (C) is 25% by mass or less, the moisture absorption of the cured product by the activator (C) can be suppressed. If this proportion is 2.5% by mass or more, it is more preferable. If this proportion is 23% by mass or less, it is more preferable.

[0080] The composition (X) may contain a thixotropic agent (D). The thixotropic agent (D) is a compound that imparts thixotropy to the composition (X). Thixotropy is the property of a substance decreasing in viscosity when subjected to shear stress. Thixotropy is quantified by the thixotropic ratio (thixotropy index). The thixotropic agent (D) can also be said to be a compound that can increase the thixotropic ratio. For example, the viscosity is measured under two conditions with different rotational speeds of a rotational viscometer at a constant temperature, and the ratio of the two viscosities obtained as a result can be defined as the thixotropic ratio.

[0081] The thixotropic agent (D) contains at least one selected from the group consisting of 1,3:2,4-bis-O-benzylidene-D-glucitol (dibenzylidene sorbitol) (e.g., product name Gelall D, manufactured by New Japan Chemical Co., Ltd.), 1,3:2,4-bis-O-(4-methylbenzylidene)-D-sorbitol (e.g., product name Gelall MD, manufactured by New Japan Chemical Co., Ltd.), and N,N'-methylenebis(stearamide) (e.g., product name Bisamide LA, manufactured by Mitsubishi Chemical Corporation).

[0082] The ratio of the thixotropic agent (D) is preferably 1% by mass or more and 7% by mass or less based on the solid content of the composition (X), in which case the composition (X) can have an appropriate thixotropic ratio.

[0083] The composition (X) may contain a solvent (E) if necessary. The solvent (E) is preferably an ether-based solvent. The solvent (E) preferably contains a glycol ether. For example, the solvent (E) contains at least one selected from the group consisting of diethylene glycol diethyl ether, ethylene glycol mono-2-ethylhexyl ether, hexyl diglycol, and the like.

[0084] The amount of the solvent (E) can be appropriately set so that the composition (X) has an appropriate viscosity. The ratio of the solvent is, for example, 2% by mass or more and 25% by mass or less relative to the composition (X).

[0085] The composition (X) may contain an additive (F) other than the epoxy compound (A), the curing agent (B), the alicyclic amine compound (B2), the activator (C), the thixotropic agent (D) and the solvent (E). The additive (F) contains at least one selected from the group consisting of, for example, a phenol compound, an imidazole compound, a benzoxazine compound, a component modifier, and a filler. The proportion of the additive (F) relative to the solid content of the composition (X) is preferably 5 mass% or less.

[0086] The viscosity of composition (X) is preferably 10 Pa·s or more and 250 Pa·s or less. In this case, composition (X) can be easily applied to the joint between the conductor and the solder bump. That is, the applicability of composition (X) can be improved. The viscosity is more preferably 25 Pa·s or more, and even more preferably 30 Pa·s or more. The viscosity is more preferably 120 Pa·s or less, and even more preferably 110 Pa·s or less. The viscosity of composition (X) is a value measured using an E-type viscometer at 25°C and a rotation speed of 2.5 rpm.

[0087] The thixotropic ratio of the composition (X) is preferably 1.5 or more and 8 or less. In this case, the applicability of the composition (X) can be improved. The thixotropic ratio is a viscosity η measured by an E-type viscometer under the conditions of 25° C. and a rotation speed of 0.25 rpm. 0.25 and viscosity η measured with an E-type viscometer at 25°C and 2.5 rpm 2.5 The ratio value η 0.25 / η 2.5 The thixotropic ratio is more preferably 1.5 or more, and even more preferably 2.0 or more. The thixotropic ratio is more preferably 5.0 or less, and even more preferably 4.5 or less.

[0088] The glass transition temperature of the cured product of the composition (X) is preferably 100° C. or higher. In this case, the heat resistance of the cured product is more likely to be improved, and therefore the heat cycle resistance of the cured product and the mounting structure can be further improved. A glass transition temperature of 125° C. or higher is more preferable.

[0089] 2. Mounting structure The reinforcing portion 4 in the mounting structure 1 can be made from the composition (X).

[0090] The mounting structure 1 of the embodiment includes a base material 2, a mounting component 3, a solder bump 32, and a reinforcing portion 4. The base material 2 includes a first conductor 21. The mounting component 3 includes a second conductor 31. The solder bump 32 is interposed between the first conductor 21 and the second conductor 31, and electrically connects the first conductor 21 and the second conductor 31. The reinforcing portion 4 includes a cured product of the composition (X), and covers at least one of the joint 20 between the first conductor 21 and the solder bump 32 and the joint 20 between the second conductor 31 and the solder bump 32.

[0091] FIG. 1 shows a mounting structure 1 according to an embodiment.

[0092] The substrate 2 is, for example, a mother substrate, a package substrate, or an interposer substrate. The substrate 2 includes an insulating substrate, such as a glass epoxy substrate, a polyimide substrate, a polyester substrate, or a ceramic substrate, and a first conductor 21 formed on the insulating substrate. The first conductor 21 is, for example, a conductor wiring made of a metal.

[0093] The mounting component 3 is, for example, a semiconductor chip. More specifically, the mounting component 3 is, for example, a flip-chip type chip such as a BGA (ball grid array), an LGA (land grid array), or a CSP (chip size package). The mounting component 3 may also be a WLP (wafer level package). The mounting component 3 may also be a PoP (package on package) type chip.

[0094] The mounting component 3 includes a second conductor 31. The second conductor 31 is, for example, a pad (terminal electrode) on a semiconductor chip. For example, when the mounting component 3 is a BGA, the mounting component 3 is a package configured by sealing a die mounted on a substrate with a sealing resin, and the second conductor 31 is a terminal electrode electrically connected to the die. For example, when the mounting component 3 is a WLP, the mounting component 3 includes a silicon substrate provided with a rewiring layer, and the second conductor 31 is a pillar electrically connected to the rewiring layer. Note that the structure of the mounting component 3 is not limited to the above, and may be any appropriate structure according to the type of the mounting component 3.

[0095] The solder bumps 32 are interposed between the first conductors 21 of the substrate 2 and the second conductors 31 of the mounting component 3. The solder bumps 32 electrically connect the first conductors 21 and the second conductors 31. The solder bumps 32 may be, for example, a Sn-Ag-Cu (SAC) based solder or a Sn-Bi (tin-copper) based solder.

[0096] When the solder bumps 32 are made of SAC solder, the melting point of the solder bumps 32 is, for example, 217° C. or higher and 230° C. or lower.

[0097] In addition to Sn and Bi, the Sn-Bi solder may contain at least one material selected from the group consisting of Ag, Ni, Fe, Ge, Cu, In, etc. In order to improve the mechanical performance of the Sn-Bi solder, it is preferable that the Sn-Bi solder contains at least one material selected from the group consisting of Ag, Ni, Fe, Ge, etc.

[0098] As described above, the reinforcing part 4 includes a cured product of the composition (X). In the mounting structure 1 shown in FIG. 1, the reinforcing part 4 covers the joint 20 between the solder bump 32 and the first conductor 21. Therefore, the reinforcing part 4 can reinforce the joint 20 between the solder bump 32 and the first conductor 21. Therefore, poor conduction between the first conductor 21 and the solder bump 32 is suppressed, and the mounting structure 1 can have good connection reliability. Furthermore, in the embodiment, the reinforcing part 4 can have high heat resistance and heat cycle resistance, and as a result, the mounting structure 1 can have high heat resistance and heat cycle resistance.

[0099] In this embodiment, the reinforcing portion 4 covers the joint 20 between the second conductor 31 and the solder bump 32 .

[0100] A method for manufacturing this mounting structure 1 will now be described.

[0101] A composition (X) is interposed at least between the first conductor 21 and the solder bump 32 and / or between the second conductor 31 and the solder bump 32, and in this state, a mounting component 3 is flip-mounted onto the base material 2 by soldering, thereby producing a mounting structure 1 having a reinforcing portion 4.

[0102] Specifically, first, a composition (X), a base material 2 having a first conductor 21, a mounting component 3 having a second conductor 31, and solder bumps 32 are prepared.

[0103] The composition (X) is disposed on the first conductors 21 of the substrate 2 by, for example, applying the composition (X) onto the first conductors 21. The method for applying the composition (X) is, but is not limited to, a printing method or a transfer method. Examples of the printing method include an inkjet method.

[0104] Solder bumps 32 are provided on the mounting component 3 so as to be in contact with the second conductors 31. The solder bumps 32 are, for example, solder balls.

[0105] The substrate 2 and the mounting component 3 are arranged so that the first conductors 21 of the substrate 2 and the second conductors 31 of the mounting component 3 face each other and the solder bumps 32 are in contact with the composition (X). This causes the composition (X) to be interposed between the solder bumps 32 and the first conductors 21.

[0106] In this state, the solder bumps 32 and the composition (X) are heated in a heating furnace such as a reflow furnace.

[0107] When heating the solder bump 32 and the composition (X), for example, the solder bump 32 and the composition (X) are first heated to near the melting point of the composition (X). For example, the composition (X) and the solder bump 32 are heated to a temperature of 140° C. or higher and 160° C. or lower. This reduces the viscosity of the composition (X), causing the composition (X) to flow, and the solder bump 32 comes into contact with the first conductor 21.

[0108] Next, the solder bump 32 and the composition (X) are heated to a temperature higher than the melting point of the solder. For example, the composition (X) and the solder bump 32 are heated to a temperature of 232°C or higher and 255°C or lower. This causes the solder bump 32 to melt and spread between the first conductor 21 and the second conductor 31. This electrically connects the first conductor 21 and the second conductor 31 via the solder bump 32.

[0109] Subsequently, the composition (X) is further heated to cause the curing of the composition (X) to proceed, and a reinforcing part 4 containing a cured product of the composition (X) is produced.

[0110] In this manner, the mounting structure 1 having the reinforcing portion 4 is manufactured.

[0111] 3. Variations A first modified example and a second modified example of the mounting structure 1 will be described with reference to Fig. 2 and Fig. 3, respectively. Note that in these modified examples, components similar to those of the mounting structure 1 of the embodiment are denoted by the same reference numerals in the drawings as in the embodiment, and detailed descriptions thereof will be omitted as appropriate.

[0112] 2, the joints 20 between the first conductors 21 of the mounting component 3 and the solder bumps 32 are not covered with the reinforcing portion 4, but the joints 20 between the second conductors 31 of the mounting component 3 and the solder bumps 32 are covered with the reinforcing portion 4. Even in this case, the heat cycle resistance of the mounting structure 1 can be improved.

[0113] When manufacturing the mounting structure 1 of the first modified example, for example, with the solder bumps 32 provided on the substrate 2 so as to be in contact with the first conductors 21, the substrate 2 and the mounting component 3 are arranged so that the first conductors 21 of the substrate 2 face the second conductors 31 of the mounting component 3 and the solder bumps 32 are in contact with the composition (X). This causes the composition (X) to be interposed between the solder bumps 32 and the second conductors 31.

[0114] In this state, the solder bumps 32 and the composition (X) are heated in a heating furnace such as a reflow furnace. As a result, the first conductors 21 and the second conductors 31 are electrically connected via the solder bumps 32, and the joints 20 between the second conductors 31 of the mounting component 3 and the solder bumps 32 are covered with the reinforcing parts 4 including the hardened composition (X). In this way, the mounting structure 1 is manufactured.

[0115] 3, the joint 20 between the first conductor 21 and the solder bump 32 of the mounting component 3 and the joint 20 between the second conductor 31 and the solder bump 32 of the mounting component 3 are each covered with a reinforcing portion 4. That is, the mounting structure 1 includes a reinforcing portion 4 that covers the joint 20 between the first conductor 21 and the solder bump 32 of the mounting component 3, and a reinforcing portion 4 that covers the joint 20 between the second conductor 31 and the solder bump 32 of the mounting component 3. Even in this case, the heat cycle resistance of the mounting structure 1 can be improved.

[0116] When manufacturing the mounting structure 1 of the second modification, for example, the composition (X) is placed on each of the first conductor 21 and the second conductor 31. In this state, the base material 2 and the mounting component 3 are placed so that the first conductor 21 of the base material 2 and the second conductor 31 of the mounting component 3 face each other, and the solder bump 32 is interposed between the first conductor 21 and the second conductor 31 so as to contact both the composition (X) on the first conductor 21 and the composition (X) on the second conductor 31.

[0117] In this state, the solder bumps 32 and the composition (X) are heated in a heating furnace such as a reflow furnace. As a result, the first conductors 21 and the second conductors 31 are electrically connected via the solder bumps 32. In addition, the joints 20 between the first conductors 21 and the solder bumps 32 of the substrate 2 and the joints 20 between the second conductors 31 and the solder bumps 32 of the mounting component 3 are each covered with the reinforcing portion 4 including the hardened composition (X). In this way, the mounting structure 1 is manufactured.

[0118] Alternatively, the first conductor 21 and the solder bump 32 may be joined first, and the joint 20 between the first conductor 21 and the solder bump 32 may be covered with the reinforcing portion 4, and then the second conductor 31 and the solder bump 32 may be joined, and the joint 20 between the second conductor 31 and the solder bump 32 may be covered with the reinforcing portion 4. Alternatively, the second conductor 31 and the solder bump 32 may be joined first, and the joint 20 between the second conductor 31 and the solder bump 32 may be covered with the reinforcing portion 4, and then the first conductor 21 and the solder bump 32 may be joined, and the joint 20 between the first conductor 21 and the solder bump 32 may be covered with the reinforcing portion 4.

[0119] In addition, the reinforcing portion 4 covering the joint 20 between the second conductor 31 and the solder bump 32 and the reinforcing portion 4 covering the joint 20 between the first conductor 21 and the solder bump 32 may be separate, or may be integrated without being separated.

[0120] 4. Aspects The reinforcing resin composition according to the first embodiment contains an epoxy compound (A), an aromatic amine compound (B1) having an active hydrogen equivalent of 50 g / eq. or more and 320 g / eq. or less, and an alicyclic amine compound (B2) having an active hydrogen equivalent of 30 g / eq. or more and 50 g / eq. or less.

[0121] According to this embodiment, the cured product of the reinforcing resin composition has adhesion to metal and is not easily hygroscopic, so that deterioration of adhesion over time due to moisture absorption can be suppressed.

[0122] In the second aspect, in the first aspect, the proportion of the epoxy compound (A) is 48 mass% or more and 85 mass% or less based on the solid content of the reinforcing resin composition, the proportion of the aromatic amine compound (B1) is 3 mass% or more and 20 mass% or less based on the solid content of the reinforcing resin composition, and the proportion of the alicyclic amine compound (B2) is 3 mass% or more and 13 mass% or less based on the solid content of the reinforcing resin composition.

[0123] In a third aspect, in the first or second aspect, the epoxy compound (A) contains at least one epoxy compound (A1) selected from the group consisting of naphthalene type epoxy resins, biphenyl aralkyl type epoxy resins, trisphenolmethane type epoxy resins, biphenyl type epoxy resins, and dicyclopentadiene type epoxy resins.

[0124] In the fourth embodiment, in the third embodiment, the proportion of the epoxy compound (A1) is 16% by mass or more and 35% by mass or less based on the solid content of the reinforcing resin composition.

[0125] In a fifth embodiment, in any one of the first to fourth embodiments, the reinforcing resin composition further contains an activator (C).

[0126] In a sixth embodiment, in the fifth embodiment, the proportion of the activator (C) is 1.5 mass % or more and 25 mass % or less based on the solid content of the reinforcing resin composition.

[0127] In a seventh embodiment, in any one of the first to sixth embodiments, the reinforcing resin composition further contains a thixotropic agent (D).

[0128] In an eighth embodiment, in the seventh embodiment, the proportion of the thixotropic agent (D) is 1 mass % or more and 7 mass % or less with respect to the solid content of the reinforcing resin composition.

[0129] A mounting structure (1) according to a ninth aspect includes a substrate (2) having a first conductor (21), a mounting component (3) having a second conductor (31), a solder bump (32) interposed between the first conductor (21) and the second conductor (31) and electrically connecting the first conductor (21) and the second conductor (31), and a reinforcing portion (4) including a cured product of the reinforcing resin composition according to any one of the first to eighth aspects and covering at least one of the joint (20) between the first conductor (21) and the solder bump (32) and the joint (20) between the second conductor (31) and the solder bump (32).

[0130] According to this embodiment, the reinforcing portion (4) has adhesion to the solder bumps (32) and is not easily hygroscopic, so that deterioration of adhesion over time due to moisture absorption can be suppressed. EXAMPLES

[0131] Specific examples of the present disclosure will be presented below. Note that the present disclosure is not limited to the following examples.

[0132] 1. Preparation of resin composition Resin compositions were obtained by mixing the components shown in Tables 1 and 2 in the ratios shown in Tables 1 and 2. Details of the components shown in Tables 1 and 2 are as follows. - Epoxy compound #1: Trisphenolmethane type epoxy resin represented by formula (18). Epoxy group equivalent: 162. Manufactured by DIC Corporation. Product name: HP-7250. - Epoxy compound #2: A mixture of a naphthalene type epoxy resin represented by formula (15) and a naphthalene type epoxy resin represented by formula (16). Epoxy group equivalent: 215. Manufactured by DIC Corporation. Product name: HP-6000L. - Epoxy compound #3: Naphthalene type epoxy resin represented by formula (11). Epoxy group equivalent: 136 to 148. Manufactured by DIC Corporation. Product name: HP-4032D. - Epoxy compound #4: Biphenyl aralkyl type epoxy resin represented by formula (20). Epoxy group equivalent: 280 to 300. Manufactured by Nippon Kayaku Co., Ltd. Product name: NC-3000-H. - Epoxy compound #5: Biphenyl type epoxy resin represented by formula (21). Epoxy group equivalent: 187-197. Manufactured by Mitsubishi Chemical Corporation. Product name: YX4000H. - Epoxy compound #6: Dicyclopentadiene type epoxy resin represented by formula (22). Epoxy group equivalent: 280-292. Manufactured by DIC Corporation. Product name: HP-7200HHH. - Epoxy compound #7: Bisphenol type epoxy resin that is liquid at 25℃. Manufactured by Nippon Steel Chemical & Material Co., Ltd. Product name: YD8125. - Epoxy compound #8: Bisphenol type epoxy resin that is liquid at 25℃. Manufactured by Nippon Steel Chemical & Material Co., Ltd. Product name: YDF8170. - Aromatic amine compound #1: 4,4'-diamino-3,3'-dimethyldiphenylmethane represented by formula (1). Active hydrogen equivalent: 56.6 g / eq., manufactured by Tokyo Chemical Industry Co., Ltd. - Aromatic amine compound #2: 4,4-diaminodiphenyl sulfone represented by formula (2). Active hydrogen equivalent: 62.1 g / eq., manufactured by Tokyo Chemical Industry Co., Ltd. - Aromatic amine compound #3: Trimethylene bis(4-aminobenzoate) represented by formula (3). Active hydrogen equivalent: 78.6 g / eq. Manufactured by Kumiai Chemical Industry Co., Ltd. - Aromatic amine compound #4: Poly(1,4-butanediol)bis(4-aminobenzoic acid) represented by formula (4), where n in formula (4) is an average of 2.5. Active hydrogen equivalent: 127.0 g / eq. Manufactured by Kumiai Chemical Industry Co., Ltd. - Aromatic amine compound #5: Poly(1,4-butanediol)bis(4-aminobenzoic acid) represented by formula (4), where n in formula (4) is an average of 8.8. Active hydrogen equivalent: 232.7 g / eq. Manufactured by Kumiai Chemical Industry Co., Ltd. - Aromatic amine compound #6: Poly(1,4-butanediol)bis(4-aminobenzoic acid) represented by formula (4), where n in formula (4) is an average of 14.2. Active hydrogen equivalent: 311.03 g / eq. Manufactured by Kumiai Chemical Industry Co., Ltd. - Aromatic amine compound #7: Poly(1,4-butanediol)bis(4-aminobenzoic acid) represented by formula (4), where n in formula (4) is an average of 15.6. Active hydrogen equivalent: 334.8 g / eq. Manufactured by Kumiai Chemical Industry Co., Ltd. - Aromatic amine compound #8: Diethyltoluenediamine shown in the formula below. Active hydrogen equivalent: 44.5 g / eq. Manufactured by Mitsui Fine Chemicals Co., Ltd.

[0133] [ka]

[0134] - Alicyclic amine compound #1: norbornane diamine represented by formula (5). Active hydrogen equivalent: 38.5 g / eq. Manufactured by Mitsui Fine Chemicals Co., Ltd. - Alicyclic amine compound #2: isophoronediamine represented by formula (6). Active hydrogen equivalent: 42.6 g / eq. Manufactured by Tokyo Chemical Industry Co., Ltd. - Aliphatic amine compound: Poly(propylene glycol) diamine shown in the formula below. Active hydrogen equivalent: 100.0 g / eq. Manufactured by Mitsui Fine Chemicals Co., Ltd.

[0135] [ka]

[0136] - Activator #1: Adipic Acid. Produced by Tokyo Chemical Industry Co., Ltd. - Activator #2: Glutaric Acid. Produced by Tokyo Chemical Industry Co., Ltd. - Activator #3: Triethanolamine, manufactured by Tokyo Chemical Industry Co., Ltd. - Activator #4: 1,3-diphenylguanidine. Manufactured by Tokyo Chemical Industry Co., Ltd. - Activator #5: Manufactured by Tsuno Foods Co., Ltd. Product name: Tsunodime 395. Contains 94% dimer acid. - Thixotropic agent #1:1,3:2,4-Bis-O-benzylidene-D-glucitol (dibenzylidene sorbitol). Manufactured by New Japan Chemical Co., Ltd. Product name: Gelall D. - Thixotropic agent #2: 1,3:2,4-Bis-O-(4-methylbenzylidene)-D-sorbitol. Manufactured by New Japan Chemical Co., Ltd. Product name: Gelall MD. - Thixotropic agent #3: N,N'-methylenebis(stearamide). Manufactured by Mitsubishi Chemical Corporation. Product name: Bisamide LA. - Solvent #1: Diethylene glycol diethyl ether. Manufactured by Nippon Nyukazai Co., Ltd. - Solvent #2: Diethylene glycol monohexyl ether. Manufactured by Nippon Nyukazai Co., Ltd.

[0137] 2. Evaluation The resin compositions were subjected to the following evaluation tests, the results of which are shown in Tables 1 and 2.

[0138] (1) Viscosity The viscosity of the resin composition was measured at 25° C. and a rotation speed of 2.5 rpm using an E-type viscometer (manufactured by Toki Sangyo Co., Ltd., product number: RE-215U).

[0139] (2) Thixotropy Using an E-type viscometer (manufactured by Toki Sangyo Co., Ltd., product number: RE-215U), the viscosity η of the resin composition at 25°C and a rotation speed of 0.25 rpm was measured. 0.25 and viscosity η at 25°C and 2.5 rpm 2.5 Based on the measurement results, the ratio value η 0.25 / η 2.5 was calculated as the thixotropic ratio.

[0140] (3) Spreadability A resin composition was applied onto each pad of a substrate having a plurality of Ni-Pd-Au alloy pads with a diameter of 300 μm arranged at 0.5 mm intervals, using a printer (SP-80V, manufactured by Panasonic Smart Factory Solutions Co., Ltd.) to form a coating film of the resin composition covering each pad. The state of the coating film was observed under a microscope and evaluated according to the following criteria. A: There is no problem with the shape of the coating. B: There are bridges between the coating films and chips in the coating film, but this does not cause any problems in practical use. C: There are many bridges between the coatings and chips in the coating.

[0141] (4) Wetting and spreading properties In accordance with JIS Z 3198-3, the resin composition was placed on a copper plate, and the solder sample was placed on the resin composition and the solder sample. The spread rate of the solder sample was calculated based on the results. The solder sample was a solder ball with a diameter of 300 μm made of lead-free solder SAC305 (composition Sn96.5%Ag3.0%Cu0.5%, melting point 219°C). The heating conditions were as follows: first, the temperature of the resin composition and the solder sample was raised to a range of 220 to 225°C, and the temperature was maintained in this range for 60 seconds. The temperature was then lowered to room temperature.

[0142] If the spreading rate is 50% or more, the wet-spreading property can be evaluated as excellent, and if it is 60% or more, the wet-spreading property can be evaluated as particularly excellent.

[0143] (5) Hygroscopicity The composition was molded, heated at 150°C for 1 hour, and then heated at 200°C for 3 hours to cure, and a sample with dimensions of 100 mm length x 5 mm width x 2 mm thickness was prepared. The weight of this sample (initial weight) was measured. The sample was then exposed to an atmosphere of 85°C and 85% RH for 24 hours, and the weight of the sample (moisture absorption weight) was measured immediately thereafter.

[0144] From these results, the moisture absorption rate (%) of the sample was calculated by the formula: [{(weight after moisture absorption)-(initial weight)} / (initial weight)]×100.

[0145] If the moisture absorption rate is less than 1.0%, the moisture absorption of the sample can be evaluated as being fairly low, and if the moisture absorption rate is less than 0.7%, the moisture absorption of the sample can be evaluated as being very low.

[0146] (6) Initial adhesion strength and rate of decrease in adhesion after moisture absorption The composition was heated at 150°C for 1 hour and then at 200°C for 3 hours to prepare 10 samples with a diameter of mm and a height of 2 mm on a copper plate.

[0147] The shear strength of the five samples against the copper plate was measured in accordance with JEITA ED-4703 using a bond tester (manufactured by Nordson Advanced Technology Co., Ltd.) The average value of the five measurements obtained in this way was taken as the initial adhesion strength.

[0148] The five samples that were not subjected to the measurement of the initial adhesion strength were exposed to an atmosphere of 85°C and 85% RH for 24 hours, and then passed through a reflow furnace with a peak top temperature of 250°C three times. Next, the shear strength against the copper plate of these five samples was measured using the bond tester described above. The average value of the five measured values ​​obtained in this way was taken as the adhesion strength after moisture absorption.

[0149] From these results, the decrease rate (%) of the adhesion strength of the sample after moisture absorption was calculated by the formula: [{(initial adhesion strength)-(adhesion strength after moisture absorption)} / (initial adhesion strength)]×100.

[0150] If the initial adhesion strength is 140 gf (about 1.37 N) or more, the initial adhesion can be evaluated as excellent, and if it is 150 gf (about 1.47 N) or more, the initial adhesion can be evaluated as very excellent.

[0151] If the rate of decrease in adhesion strength after moisture absorption is less than 20%, the moisture absorption resistance can be evaluated as excellent, and if it is less than 10%, the moisture absorption resistance can be evaluated as very excellent.

[0152] [Table 1]

[0153] [Table 2] [Explanation of symbols]

[0154] 1 Implementation structure 2 Base material 21 First Conductor 3. Mounting parts 31 Second Conductor 32 Solder Bumps 4 Reinforcement 20 Joint

Claims

1. An epoxy compound (A), an aromatic amine compound (B1) having an active hydrogen equivalent of 50 g / eq. or more and 320 g / eq. or less; and an alicyclic amine compound (B2) having an active hydrogen equivalent of 30 g / eq. or more and 50 g / eq. or less. Reinforcing resin composition.

2. The ratio of the epoxy compound (A) is 48% by mass or more and 85% by mass or less based on the solid content of the reinforcing resin composition, the proportion of the aromatic amine compound (B1) is 3% by mass or more and 20% by mass or less based on the solid content of the reinforcing resin composition, The ratio of the alicyclic amine compound (B2) is 3% by mass or more and 13% by mass or less based on the solid content of the reinforcing resin composition. The reinforcing resin composition according to claim 1 .

3. The epoxy compound (A) contains at least one epoxy compound (A1) selected from the group consisting of naphthalene type epoxy resins, biphenyl aralkyl type epoxy resins, trisphenolmethane type epoxy resins, biphenyl type epoxy resins, and dicyclopentadiene type epoxy resins. The reinforcing resin composition according to claim 1 .

4. The ratio of the epoxy compound (A1) is 16% by mass or more and 35% by mass or less based on the solid content of the reinforcing resin composition. The reinforcing resin composition according to claim 3.

5. Further containing an activator (C), The reinforcing resin composition according to claim 1 .

6. The proportion of the activator (C) is 1.5% by mass or more and 25% by mass or less based on the solid content of the reinforcing resin composition. The reinforcing resin composition according to claim 5 .

7. Further containing a thixotropic agent (D), The reinforcing resin composition according to claim 1 .

8. The ratio of the thixotropic agent (D) is 1 mass% or more and 7 mass% or less based on the solid content of the reinforcing resin composition. The reinforcing resin composition according to claim 7.

9. a substrate including a first conductor; A mounting component including a second conductor; a solder bump interposed between the first conductor and the second conductor and electrically connecting the first conductor and the second conductor; 9. A reinforcing member comprising a cured product of the reinforcing resin composition according to claim 1, the reinforcing member comprising: a reinforcing portion that covers at least one of a joint between the first conductor and the solder bump and a joint between the second conductor and the solder bump. The implementation structure.

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