Device handling apparatus and device testing apparatus

Abstract

To provide a device handling apparatus capable of transporting a device having an optical fiber.SOLUTION: A handler 40 includes a holding head 41 for holding a DUT 100 and a contact arm 42 for moving the holding head 41. The holding head 41 includes a first holding part 50 for holding a main body part 110 of the DUT 100 and a second holding part 60 for holding an optical connector 140 of the DUT 100. The holding head 41 holds the DUT 100 in which an optical fiber 130 of the DUT 100 is separated from the holding head 41.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to a device handling apparatus for handling a device under test (DUT) having an optical fiber, and a device test apparatus for testing the above DUT.

Background Art

[0002] There is known an electronic component handling apparatus that conveys an electronic component while holding it with an arm having a suction mechanism and presses it against a socket of a test head (see, for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] Some devices to be tested include a main body including a die and a substrate, an optical fiber having one end connected to the main body, and a connector connected to the other end of the optical fiber. When attempting to convey such a device with the above-described electronic component handling apparatus, only the main body is held, and the optical fiber and connector of the device are not held. For this reason, the above-described electronic component handling apparatus has a problem that it cannot hold and convey a device having an optical fiber.

[0005] The problem to be solved by the present invention is to provide a device handling apparatus capable of conveying a device having an optical fiber.

Means for Solving the Problems

[0006] [1]Aspect 1 of the present invention is a device handling apparatus for handling a DUT including a main body portion including a die, an optical fiber having one end connected to the main body portion, and a first connector connected to the other end of the optical fiber. The device handling apparatus includes a holding head for holding the DUT and a first moving device for moving the holding head. The holding head includes a first holding portion for holding the main body portion and a second holding portion for holding the connector. The holding head is a device handling apparatus that holds the DUT in a state where the optical fiber is separated from the holding head.

[0007] [2]Aspect 2 of the present invention is the device handling apparatus of Aspect 1, wherein the first holding portion may include a first suction pad for suction-holding the main body portion, and the second holding portion may include a second suction pad for suction-holding the connector.

[0008] [3]Aspect 3 of the present invention is the device handling apparatus of Aspect 1, wherein the first holding portion may include a first gripping portion for gripping the main body portion, and the second holding portion may include a second gripping portion for gripping the connector.

[0009] [4]Aspect 4 of the present invention is the device handling apparatus according to any one of Aspects 1 to 3, wherein the first moving device electrically connects the terminals of the main body portion to the contacts of the socket by opposing the holding head to the DUT and pressing the DUT against the socket. The holding head may be a device handling apparatus including a first contact portion that contacts the main body portion when the DUT is pressed against the socket.

[0010] [5]Aspect 5 of the present invention is the device handling apparatus of Aspect 4, wherein the main body portion of the DUT includes a wiring board to which the optical fiber is connected and the die mounted on the wiring board. The first contact portion may be a device handling apparatus that contacts the wiring board when the DUT is pressed against the socket.

[0011] [6]Aspect 6 of the present invention is the device handling apparatus of Aspect 5, wherein the wiring board has a connection portion to which the optical fiber is connected on the main surface of the wiring board, and the first contact portion may be a device handling apparatus that contacts an area other than the connection portion on the main surface when pressing the DUT against the socket.

[0012] [7]Aspect 7 of the present invention is the device handling apparatus of Aspect 5 or 6, wherein the wiring board has a connection portion to which the optical fiber is connected, and the first contact portion may be a device handling apparatus having a recess facing the connection portion when pressing the DUT against the socket.

[0013] [8]Aspect 8 of the present invention is a device test apparatus for testing a DUT including a main body portion including a die, an optical fiber having one end connected to the main body portion, and a connector connected to the other end of the optical fiber, the device test apparatus including a device handling apparatus according to any one of Aspects 1 to 7, a socket electrically connected to the main body portion of the DUT, a second connector optically connected to the first connector, and a tester for testing the DUT via the socket and the second connector.

[0014] [9]Aspect 9 of the present invention is the device test apparatus of Aspect 8, wherein the device test apparatus includes a second moving device for moving the second connector in a first direction substantially parallel to the main surface of the main body portion, and the socket may be a device test apparatus having a second contact portion that contacts the first connector in the first direction. [Advantages of the Invention]

[0015] In the present invention, the holding head of the device handling apparatus includes a first holding portion that holds the main body portion of the DUT, and a second holding portion that holds a connector connected to an optical fiber, and can hold both the main body portion and the connector. Therefore, a device provided with an optical fiber can be transported. Moreover, in the present invention, since the holding head holds the device with the optical fiber separated from the holding head, it is possible to suppress damage to the optical fiber during transportation.

Brief Description of the Drawings

[0016]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Embodiments for Carrying Out the Invention

[0017] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0018] FIG. 1(a) and FIG. 1(b) are a plan view and a side view showing the configuration of the DUT 100 in the present embodiment, FIG. 2 is a cross-sectional view showing the configuration of the device test apparatus 1 in the present embodiment, FIG. 3(a) is a bottom view of the holding head 41 viewed along the IIIA direction in FIG. 2, and FIG. 3(b) is a cross-sectional view taken along the line IIIB-IIIB in FIG. 2. Note that FIG. 2 is a cross-sectional view taken along the line II-II in FIG. 3(a) and also a view taken along the line II-II in FIG. 3(b).

[0019] The DUT 100, which is the test object of the device test apparatus 1 in the present embodiment, is a device (semiconductor device) capable of handling electrical signals and optical signals. Specifically, as shown in FIGS. 1(a) and 1(b), the DUT 100 is a so-called pigtail-equipped device including a main body portion 110, an optical module 120, an optical fiber 130, an optical connector 140, and input / output terminals 150. The main body portion 110 includes a substrate 111 and a die 112. As a specific example of the substrate 111, a wiring board such as an interposer can be exemplified.

[0020] The die 112 is a bare die (bare chip) formed by dicing a semiconductor wafer and is mounted on the upper surface 113 of the substrate 111. The die 112 is connected to the optical module 120 mounted on the upper surface 113 of the substrate 111 via a conductive path 114 for transmitting an electrical signal. Although not particularly limited, the conductive path 114 may be formed on the surface of the substrate 111 or inside the substrate 111.

[0021] The optical module 120 includes a photoelectric conversion element and is capable of converting an optical signal into an electrical signal or converting an electrical signal into an optical signal. One end of the optical fiber 130 is connected to the optical module 120. The optical fiber 130 has flexibility. Therefore, in this optical fiber 130, portions other than the connection portion with the optical module 120 can be freely deformed and can move relative to the substrate 111.

[0022] The optical connector 140 is connected to the other end of the optical fiber 130. This optical connector 140 is provided away from the substrate 111 via the optical fiber 130. Therefore, the optical connector 140 can move relative to the substrate 111 following the optical fiber 130. As will be described later, during the test of the DUT 100, this optical connector 140 is connected to the optical connector 30 provided on the tester 10. Although not particularly limited, examples of the optical connector 140 include MPO connectors. The input / output terminals 150 are mounted on the surface of the substrate 111 opposite to the surface on which the die 112 is mounted, although not particularly limited.

[0023] The device test apparatus 1 in the present embodiment is an apparatus for testing the DUT 100. As shown in FIG. 2, the device test apparatus 1 includes a tester (test apparatus main body) 10, a socket 20, an optical connector 30, and a handler 40. 40 corresponds to an example of the "device handling apparatus" in the aspect of the present invention.

[0024] The tester 10 is a test apparatus that tests the DUT 100 using electrical signals and optical signals. As will be described later, the tester 10 inputs and outputs optical signals to and from the DUT 100 via the optical connector 30, and inputs and outputs electrical signals from the DUT 100 via the socket 20 to perform a test on the DUT 100 and evaluate the DUT 100 according to the test results. Although not particularly shown, this tester 10 includes a generation function (for example, a light source) for generating test signals (optical signals and electrical signals) and an evaluation function for evaluating output signals (optical signals and electrical signals) from the DUT 100.

[0025] The socket 20 is provided on the tester 10. The socket 20 includes a socket body 21, a contact 22, a connector receiving portion 23, and a connector abutting portion 24.

[0026] The contact 22 is disposed on the socket body 21 so as to correspond to the input / output terminals 150 of the DUT 100. Although not particularly limited, specific examples of the contact 22 include a pogo pin, a vertical probe pin, a cantilever probe pin, an anisotropic conductive rubber sheet, bumps provided on a membrane, or a contactor fabricated using MEMS technology, etc. As will be described later, the DUT 100 is pressed against the socket 20 by the handler 40, and when the input / output terminals 150 of the DUT 100 come into contact with the contacts 22, the DUT 100 and the socket 20 are electrically connected. Input / output is performed between the DUT 100 and the tester 10 via the socket 20.

[0027] The connector receiving portion 23 is an area on the socket body 21 where the optical connector 140 of the DUT 100 is disposed when the DUT 100 is pressed against the socket 20 by the handler 40. The configuration of the connector receiving portion 23 is not particularly limited, but the connector receiving portion 23 has at least a planar shape so that the optical connector 140 can be disposed. In the present embodiment, the height position of the planar shape of the connector receiving portion 23 is adjusted so that the input / output terminals 150 of the DUT 100 can come into contact with the contacts 22 in a state where the optical connector 140 is disposed in the connector receiving portion 23.

[0028] The connector abutting portion 24 is a portion where the optical connector 140 disposed in the connector receiving portion 23 abuts in the direction along the X direction in the figure. The connector abutting portion 24 is provided so as to protrude upward (Z direction in the figure) from the connector receiving portion 23. As will be described later, the optical connector 140 disposed in the connector receiving portion 23 contacts the connector abutting portion 24 in the X direction by contacting the optical connector 30 that has moved in the X direction on the horizontal rail 32. Since the socket 20 has the connector abutting portion 24, when the optical connector 30 contacts the optical connector 140, the movement of the optical connector 140 in the X direction is restricted by the connector abutting portion 24, so that the optical connector 30 and the optical connector 140 can be more easily fitted together.

[0029] The optical connector 30 is provided on the tester 10. The optical connector 30 is optically connected to the tester 10 by an optical fiber 31. The optical connector 30 is fitted to the optical connector 140 of the DUT 100 disposed in the socket 20, as will be described later. When the optical connector 30 provided on the tester 10 and the optical connector 140 of the DUT 100 are fitted together, the DUT 100 and the tester 10 are optically connected. The optical connector 30 can be moved on the horizontal rail 32 by an actuator such as an air cylinder that drives along the X direction (a direction substantially parallel to the upper surface 113 of the substrate 111) in the figure. Thereby, the optical connector 30 can be fitted to the optical connector 140 of the DUT 100 disposed in the socket 20 in the X direction in the figure.

[0030] As shown in FIG. 2, the handler 40 includes a holding head 41 that holds the DUT 100 and a contact arm 42 that moves the holding head 41.

[0031] The holding head 41 is a block-shaped member attached to the tip of the contact arm 42. The holding head 41 includes a first holding portion 50 that holds the main body portion 110 of the DUT 100 and a second holding portion 60 that holds the optical connector 140 of the DUT 100. An adsorption pad 51 is formed on the first holding portion 50, and the adsorption pad 51 communicates with a suction pipe 52. By sucking air through the suction pipe 52 by a vacuum pump (not shown), the adsorption pad 51 can hold the main body portion 110 of the DUT 100. An adsorption pad 61 is formed on the second holding portion 60, and the adsorption pad 61 communicates with a suction pipe 62. By sucking air through the suction pipe 62 by a vacuum pump (not shown), the adsorption pad 61 can hold the optical connector 140 of the DUT 100.

[0032] As shown in FIGS. 3(a) and 3(b), the lower surface 411 of the holding head 41 contacts the upper surface 113 of the substrate 111 of the DUT 100 when holding the DUT 100. Recesses 412 are formed in the lower surface 411 of the holding head 41 opposite to the optical connector 140, the optical module 120, and the die 112 of the DUT 100. Due to the formation of the recesses 412, the lower surface 411 of the holding head 41 contacts the area on the upper surface 113 of the substrate 111 of the DUT 100 where the optical connector 140, the optical module 120, the optical fiber 130, and the die 112 are not mounted. Thereby, the entire surface of the DUT 100 can be pressed as evenly as possible by the holding head 41. As long as the lower surface 411 can contact the area on the upper surface 113 of the substrate 111 of the DUT 100 where the optical connector 140, the optical module 120, the optical fiber 130, and the die 112 are not mounted, the shape of the recesses 412 is not particularly limited. In the present embodiment, the lower surface 411 of the holding head 41 refers to the combined area of the lower surface of the first holding portion 50 and the lower surface of the second holding portion 60.

[0033] Also, in the present embodiment, since the first holding portion 50 holds the main body portion 110 of the DUT 100 and the second holding portion 60 holds the optical connector 140 of the DUT 100, the holding head 41 holds the DUT 100 with the optical fiber 130 separated from the holding head 41. That is, a space 80 is formed between the lower surface 411 and the recesses 412 of the holding head 41 and the optical fiber 130. Thereby, since the optical fiber 130 is not fixed during conveyance, damage to the optical fiber 130 can be suppressed.

[0034] Although not particularly limited, the holding head 41 may be provided with a temperature adjustment mechanism for adjusting the temperature of the DUT 100. This temperature adjustment mechanism includes, for example, a heating device, a cooling device, and a temperature sensor. Examples of the heating device include ceramic heaters such as aluminum nitride heaters, silicon nitride heaters, and PTC heaters, polyimide heaters, and cartridge heaters. Examples of the cooling device include a cooling flow path formed in the holding head 41 and supplied with a refrigerant from the outside. As the refrigerant, a liquid or a gas may be used. Specific examples of the liquid refrigerant include, for example, water and fluorine-based inert liquids. Specific examples of the gaseous refrigerant include, for example, air and nitrogen. Further, a Peltier element may be used as the heating device and the cooling device. Although not particularly limited, since the temperature change around the die 112 of the DUT 100 is large during the test of the DUT 100, the temperature adjustment mechanism of the DUT 100 is preferably formed in the first holding portion 50 corresponding to the die 112 in the holding head 41.

[0035] In this embodiment, the first holding portion 50 of the holding head 41 includes a suction pad 51, and the second holding portion 60 includes a suction pad 61, and holds the DUT 100 by sucking it. However, as long as the DUT 100 can be held, the configuration of the holding head 41 is not particularly limited to this. For example, the first holding portion 50 may include a first gripping portion that grips (clamps and holds) the substrate 111 of the DUT 100, and the second holding portion 60 may include a second gripping portion that grips the optical connector 140 of the DUT 100. Examples of the first and second gripping portions include, for example, a robot hand. FIG. 4 shows an example of the first gripping portion 50B that holds the main body portion 110 of the DUT 100 and the second gripping portion 60B that grips the optical connector 140. FIG. 4 is a side view of a handler 40 showing a modified example of the holding head 41 in this embodiment.

[0036] The contact arm 42 is supported by a rail (not shown) provided on the handler 40. The contact arm 42 is provided with an actuator (not shown) for horizontal movement and can move back and forth, left and right along the rail. Further, the contact arm 42 is provided with an actuator (not shown) for vertical drive and can move in the vertical direction. Further, suction pipes 52 and 62 are formed inside the contact arm 42. By moving the contact arm 42 to move the holding head 41, the DUT 100 held by the holding head 41 is transported.

[0037] Hereinafter, a method of pressing the DUT 100 against the socket 20 by the handler 40 in the present embodiment will be described with reference to FIGS. 2, 5, and 6. FIGS. 5 and 6 are cross-sectional views showing a method of pressing the DUT 100 against the socket 20 by the handler 40 in the present embodiment.

[0038] First, the contact arm 42 moves above the pre-test DUT 100 placed on a tray or plate and then descends, so that the lower surface 411 of the holding head 41 contacts the upper surface 113 of the substrate 111 of the DUT 100. At this time, the suction pad 51 of the first holding portion 50 of the holding head 41 contacts the main body portion 110 of the DUT 100, and the suction pad 61 of the second holding portion 60 contacts the optical connector 140 of the DUT 100.

[0039] Next, the main body portion 110 of the DUT 100 is sucked by the suction pad 51, and the optical connector 140 of the DUT 100 is sucked by the suction pad 61, so that the DUT 100 is held by the holding head 41 as shown in FIG. 2. By moving the contact arm 42 in this state, the DUT 100 held by the holding head 41 can be transported. In the present embodiment, the first holding portion 50 of the holding head holds the main body portion 110 of the DUT 100, and the second holding portion 60 holds the optical connector 140 of the DUT 100, and the DUT 100 is held and transported with the optical fiber 130 separated from the holding head 41. Therefore, it is possible to suppress damage to the optical fiber 130 during transportation of the DUT 100.

[0040] Next, the contact arm 42 moves above the socket 20 and then descends, thereby pressing the DUT 100 against the socket 20 as shown in FIG. 5. As a result, the input / output terminals 150 of the DUT 100 come into contact with the contacts 22 of the socket 20, and the DUT 100 and the tester 10 are electrically connected via the socket 20. At this time, since the concave portion 412 is formed in the holding head 41, the lower surface 411 contacts the region on the upper surface 113 of the substrate 111 where the optical connector 140, the optical fiber 130, the optical module 120, and the die 112 are not mounted. Further, the optical connector 140 of the DUT 100 is disposed in the connector receiving portion 23 of the socket 20.

[0041] Next, as shown in FIG. 6, the optical connector 30 is moved on the horizontal rail 32 by the actuator and is fitted to the optical connector 140 of the DUT 100. At this time, in the present embodiment, since the movement of the optical connector 140 in the X direction is restricted by the contact between the optical connector 140 and the connector contact portion 24 of the socket 20, the optical connector 30 and the optical connector 140 can be more easily fitted. By fitting the optical connector 30 and the optical connector 140, the DUT 100 and the tester 10 are optically connected. In this state, an optical signal is input and output between the tester 10 and the DUT 100 via the optical connectors 30 and 140, and an electrical signal is input and output between the tester 10 and the DUT 100 via the socket 20 and the input / output terminals 150, thereby testing the DUT 100. At this time, the optical signal is converted into an electrical signal in the optical module 120 and input and output to the die 112.

[0042] As described above, the handler 40 in the present embodiment includes a first holding portion 50 that holds the main body portion 110 of the DUT 100 including the optical fiber 130, and a second holding portion 60 that holds the optical connector 140 of the DUT 100. Thereby, not only the main body portion 110 of the DUT 100 but also the optical connector 140 can be held, so that the DUT 100 including the optical fiber 130 can be held and transported.

[0043] Moreover, according to the handler 40 in the present embodiment, by holding the main body 110 with the first holding part 50 and holding the optical connector 140 with the second holding part 60, the movable range of the optical fiber 130 is restricted, and the DUT 100 can be transported with the optical fiber 130 separated from the holding head 41. Thereby, breakage of the optical fiber 130 can be suppressed.

[0044] Also, since the handler 40 in the present embodiment holds the optical connector 140 with the second holding part 60, when the DUT 100 is pressed against the socket 20, the optical connector 140 can be disposed at a predetermined position (connector receiving part 23) of the socket 20. Thereby, connection between the optical connector 140 and the optical connector 30 provided in the tester 10 becomes easy.

[0045] Further, the handler 40 in the present embodiment includes a recess 412 formed on the lower surface 411 of the holding head 41. Thereby, the holding head 41 contacts an area of the substrate 111 of the DUT 100 where the optical connector 140, the optical module 120, the optical fiber 130, and the die 112 are not mounted, and the entire surface of the DUT 100 can be pressed as evenly as possible by the holding head 41. Therefore, the DUT 100 can be appropriately pressed against the socket 20, and the input / output terminals 150 of the DUT 100 and the contacts 22 of the socket 20 can be brought into contact more accurately.

[0046] Note that the embodiments described above are described to facilitate understanding of the present invention and are not described to limit the present invention. Therefore, each element disclosed in the above embodiments is intended to include all design changes and equivalents belonging to the technical scope of the present invention.

Explanation of Reference Numerals

[0047] 1... Device test apparatus 10... Tester 20... Socket 21... Socket body 22... Contact 23... Connector receptacle 24... Connector abutting portion 30... Optical connector 31... Optical fiber 32... Horizontal rail 40... Handler 41... Holding head 411... Bottom surface 50... First holding portion 51... Suction pad 52... Suction pipe 60... Second holding portion 61... Suction pad 62... Suction pipe 42... Contact arm 100... DUT 110... Body part 111... Substrate 112... Die 113... Top surface 114... Conductive part 120... Optical module 130... Optical fiber 140... Optical connector 150... Input / output terminal

Claims

1. A device handling apparatus for handling a DUT (Device Under Test) including a main body portion including a die, an optical fiber having one end connected to the main body portion, and a first connector connected to the other end of the optical fiber, wherein the device handling apparatus includes a holding head for holding the DUT, and a first moving device for moving the holding head, wherein the holding head includes a first holding portion for holding the main body portion, and a second holding portion for holding the connector, and the holding head holds the DUT with the optical fiber being separated from the holding head.

2. The device handling apparatus according to Claim 1, wherein the first holding portion includes a first suction pad for sucking and holding the main body portion, and the second holding portion includes a second suction pad for sucking and holding the connector.

3. The device handling apparatus according to Claim 1, wherein the first holding portion includes a first gripping portion for gripping the main body portion, and the second holding portion includes a second gripping portion for gripping the connector.

4. The device handling apparatus according to Claim 1, wherein the first moving device electrically connects terminals of the main body portion to contacts of the socket by opposing the holding head to the DUT and pressing the DUT against the socket, and the holding head includes a first contact portion that contacts the main body portion when pressing the DUT against the socket.

5. The device handling apparatus according to Claim 4, wherein the main body portion of the DUT includes a wiring board to which the optical fiber is connected, and the die mounted on the wiring board, and the first contact portion contacts the wiring board when pressing the DUT against the socket.

6. The device handling apparatus according to Claim 5, wherein the wiring board has a connection portion to which the optical fiber is connected on a main surface of the wiring board, and the first contact portion contacts a region other than the connection portion on the main surface when pressing the DUT against the socket.

7. The device handling apparatus according to Claim 5, wherein the wiring board includes a connection portion to which the optical fiber is connected. The first contact portion is a device handling apparatus having a concave portion facing the connection portion when pressing the DUT against the socket. **Claim 8** A device test apparatus for testing a DUT including a main body portion including a die, an optical fiber having one end connected to the main body portion, and a connector connected to the other end of the optical fiber, The device handling apparatus according to any one of claims 1 to 7, A socket electrically connected to the main body portion of the DUT, A second connector optically connected to the first connector, A device test apparatus comprising a tester for testing the DUT via the socket and the second connector. **Claim 9** The device test apparatus according to claim 8, The device test apparatus includes a second moving device that moves the second connector in a first direction substantially parallel to the main surface of the main body portion, The socket is a device test apparatus having a second contact portion that contacts the first connector in the first direction.

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