Substrate conveyance device and substrate processing device including the same

Abstract

To provide a substrate conveyance device which can surely deliver a substrate between a deliver destination of the substrate and the substrate conveyance device.SOLUTION: A control part operates a sandwiching control part on the basis of a capture range CRR1 set to a mounting part when a substrate W is delivered to the mounting part, and moves each guide 67 so that a delivering position RP is inside the capture range CRR1. Accordingly, even though the substrate W is drawn when the guides 67 are moved to the delivering position RP, the substrate W is within the capture range CRR1. As the result, the substrate W can be surely delivered to the mounting part.SELECTED DRAWING: Figure 6

Description

Technical Field

[0001] The present invention relates to a substrate transfer device for transferring substrates such as semiconductor substrates, substrates for flat panel displays (FPDs) such as liquid crystal display and organic EL (Electroluminescence) display devices, glass substrates for photomasks, and substrates for optical discs, and a substrate processing device including the same.

Background Art

[0002] Conventionally, as this type of device, there is one including a support plate, a plurality of pads, at least one fixed stopper, at least one movable stopper, and a stopper actuator (see, for example, Patent Document 1).

[0003] The support plate is defined with a reference capture range that serves as a reference for the range within which the substrate can be transferred. The plurality of pads are arranged on the support plate within the reference capture range. The fixed stopper is arranged along the outer peripheral circle of the reference capture range and restricts the movement of the substrate supported by the plurality of pads to the outer peripheral side of the reference capture range. The movable stopper has the same height portion as the fixed stopper. The stopper actuator moves the movable stopper from a retracted position outside the outer peripheral circle of the reference capture range to an advanced position close to the fixed stopper. The stopper actuator is constituted by an air cylinder.

[0004] When the movable stopper is advanced in this substrate transfer device, a reduced capture range that is larger than the diameter of the substrate and smaller than the reference capture range can be set. In this state, the substrate is positioned on the support plate, and the substrate is placed on the placement portion, which is the delivery destination, with the movable stopper in the retracted position. Thereby, since the substrate is placed in the reduced capture range on the support plate, the substrate can be transferred to the placement portion with good positional accuracy.

Prior Art Documents

Patent Documents

[0005] [Patent Document 1] Japanese Unexamined Patent Application Publication No. 2021-136397 [Summary of the Invention] [Problems to be Solved by the Invention]

[0006] However, in the case of a conventional example having such a configuration, there are the following problems. That is, in the conventional apparatus, after holding the substrate in a reduced capture range, when the movable stopper is moved to the retracted position during the transfer to the placement unit, the position of the substrate may shift. Therefore, the substrate may protrude from the receiving-side capture range, which is the capture range on the placement unit side. For this reason, there is a risk that the substrate cannot be transferred to the placement unit and a transfer failure may occur. In particular, recently, the substrate may contain an adhesive substance. In such a substrate, when the movable stopper moves to the retracted position, the substrate is dragged by the movable stopper, so a transfer failure is likely to occur.

[0007] The present invention has been made in view of such circumstances, and an object thereof is to provide a substrate transfer apparatus capable of reliably transferring a substrate to a delivery destination of the substrate and a substrate processing apparatus including the same. [Means for Solving the Problems]

[0008] In order to achieve such an object, the present invention has the following configuration. That is, the invention according to claim 1 is a substrate transfer device for transferring a substrate, comprising: a hand for holding the substrate in a horizontal posture; a placement unit within a range where the substrate can be transferred, and a first capture range is defined; a horizontal drive mechanism for driving the hand to advance and retreat in a horizontal plane to transfer the substrate between the hand and the placement unit; a first guide provided on the hand for abutting and supporting the outer peripheral edge of the substrate; a second guide provided on the hand for sandwiching the substrate together with the first guide to hold the substrate separated from the hand; a retracted position outside a second capture range which is a range where the substrate can be transferred by the hand; a clamping position inside the second capture range for clamping the substrate; a motor drive unit for moving the second guide to at least three positions, which is a position for transferring the substrate between the placement unit and is a position between the clamping position and the retracted position; and a control unit for operating the motor drive unit to move the second guide so that the transfer position is inside the first capture range based on the first capture range set for each placement unit when transferring the substrate to the placement unit.

[0009] [Operation and Effect] According to the invention described in claim 1, when transferring the substrate to the placement unit, the control unit operates the motor drive unit based on the first capture range set for each placement unit to move the second guide so that the transfer position is inside the first capture range. Therefore, even if the substrate is dragged when the second guide moves to the transfer position, the substrate will fit within the first capture range. As a result, the substrate can be reliably transferred to the placement unit.

[0010] Further, in the present invention, it is further preferable to include a capture range storage unit for storing the first capture range in association with the placement unit, and the control unit preferably refers to the capture range storage unit when transferring the substrate to the placement unit (claim 2).

[0011] Even if the first capture range varies for each placement unit, the transfer position can be appropriately set. Even when there are a plurality of placement units, the substrate can be appropriately transferred.

[0012] Also, in the present invention, when the control unit receives the substrate from the placement unit, it is preferable to operate the motor drive unit according to the shape of the substrate so that the second guide is positioned outside the substrate (Claim 3).

[0013] When the control unit receives the substrate from the placement unit, it moves the second guide so that it is positioned outside the substrate according to the shape of the substrate. Therefore, the substrate can be reliably received.

[0014] Also, in the present invention, it is preferable that the guide has a cylindrical shape (Claim 4).

[0015] When the substrate has a circular shape, the cylindrical guide and the outer peripheral surface of the substrate are in point contact. Therefore, the contact area can be minimized, and mutual contamination through the guide can be suppressed.

[0016] Also, in the present invention, the motor drive unit includes a motor that drives the guide to move forward and backward, a drive circuit that applies a drive current for driving the motor, and an encoder that detects the rotational position of the motor, and further includes at least one of a drive current detection unit that detects the contact based on the drive current information of the drive circuit and a position information detection unit that detects the contact based on the position information output from the encoder. The control unit preferably adjusts the biasing force on the substrate at the clamping position based on at least one of the drive current information and the position information (Claim 5).

[0017] The control unit adjusts the biasing force applied to the substrate at the clamping position based on at least one of the drive current information from the drive current detection unit and the position information from the encoder. Therefore, it is not necessary to provide a sensor for detecting that the second guide and the outer peripheral surface of the substrate are in contact. As a result, the structure can be simplified and the cost can be reduced.

[0018] In the present invention, it is preferable to include the substrate transfer device described above and a processing unit including the placement unit that performs a predetermined process on the substrate (Claim 6).

[0019] When transferring the substrate to and from the processing unit, the substrate can be reliably transferred. As a result, in the substrate processing apparatus, it is possible to prevent a processing stop due to the transfer of the substrate and improve the throughput.

Effects of the Invention

[0020] According to the substrate transfer device of the present invention, when the control unit transfers the substrate to the placement unit, it operates the motor drive unit based on the first capture range set for each placement unit, and moves the second guide so that the transfer position is inside the first capture range. Therefore, even if the substrate is dragged when the second guide moves to the transfer position, the substrate fits within the first capture range. As a result, the substrate can be reliably transferred to the placement unit.

Brief Description of the Drawings

[0021]

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Best Mode for Carrying Out the Invention

[0022] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0023] FIG. 1 is a plan view showing the overall configuration of a substrate processing apparatus according to an embodiment. FIG. 2 is a view of the substrate processing apparatus of FIG. 1 as seen from the rear X.

[0024] <1. Overall Configuration>

[0025] The substrate processing apparatus 1 includes a loading / unloading block 3, an index block 5, and a processing block 7.

[0026] The substrate processing apparatus 1 processes a substrate W. The substrate processing apparatus 1 performs, for example, a cleaning process on the substrate W. The substrate processing apparatus 1 processes the substrate W in a single-wafer type in the processing block 7. The single-wafer type processes one substrate W at a time in a horizontal posture. The substrate W is, for example, circular in plan view.

[0027] In this specification, for convenience, the direction in which the loading / unloading block 3, the index block 5, and the processing block 7 are arranged is referred to as the "front-rear direction X". The front-rear direction X is horizontal. Among the front-rear direction X, the direction from the processing block 7 toward the loading / unloading block 3 is referred to as "front". The direction opposite to the front is referred to as "rear". The horizontal direction orthogonal to the front-rear direction X is referred to as the "width direction Y". One direction of the "width direction Y" is appropriately referred to as "right". The direction opposite to the right is referred to as "left". The direction perpendicular to the horizontal direction is referred to as the "vertical direction Z". In each figure, for reference, front, rear, right, left, up, and down are appropriately shown.

[0028] <2. Loading / Unloading Block>

[0029] The loading / unloading block 3 includes a loading section 9 and a discharging section 11. The loading section 9 and the discharging section 11 are arranged in the width direction Y. A plurality of substrates W (for example, 25 substrates) are stacked and stored horizontally at regular intervals within a single carrier C. The carrier C containing the untreated substrates W is placed on the loading section 9. The loading section 9 includes, for example, two mounting tables 13 on which the carrier C is placed. The carrier C has a plurality of grooves (not shown) formed therein for accommodating the substrates W one by one with the surfaces of the substrates W spaced apart from each other. The carrier C accommodates the substrates W, for example, with the surface of the substrate W facing upward. Examples of the carrier C include a FOUP (Front Opening Unify Pod). The FOUP is a sealed container. The carrier C may be an open container, regardless of its type.

[0030] The discharging section 11 is disposed on the opposite side of the loading section 9 across the central portion of the substrate processing apparatus 1 in the width direction Y. The discharging section 11 is arranged to the left Y of the loading section 9. The discharging section 11 stores the processed substrates W in the carrier C and discharges the entire carrier C. The discharging section 11 that functions in this way includes, like the loading section 9, for example, two mounting tables 13 for placing the carrier C. The loading section 9 and the discharging section 11 are also called load ports.

[0031] <3. Indexer Block>

[0032] The indexer block 5 is arranged adjacent to the rear X of the loading / unloading block 3 in the substrate processing apparatus 1. The indexer block 5 includes an indexer robot IR and a transfer section 15.

[0033] The indexer robot IR is configured to be rotatable about the vertical direction Z. The indexer robot IR is configured to be movable in the width direction Y. The indexer robot IR includes a first hand 19 and a second hand 21. In FIG. 1, only one hand is shown due to the illustration relationship. The first hand 19 and the second hand 21 hold the substrate W in a horizontal posture. The first hand 19 and the second hand 21 sandwich the outer peripheral surface of the substrate W and hold the substrate W while separating it from the upper surfaces of the first hand 19 and the second hand 21.

[0034] The first hand 19 and the second hand 21 each hold one substrate W. The first hand 19 and the second hand 21 are each configured to be independently movable forward and backward in the front-rear direction X. The indexer robot IR moves in the width direction Y and rotates about the vertical direction Z, and advances and retreats the first hand 19 and the second hand 21 to transfer the substrate W to and from each carrier C. Similarly, the indexer robot IR transfers the substrate W to and from the transfer unit 15.

[0035] The transfer unit 15 is disposed at the boundary with the processing block 7 among the index blocks 5. The transfer unit 15 is disposed, for example, at the central portion in the width direction Y. As shown in FIG. 2, the transfer unit 15 is formed long in the vertical direction Z.

[0036] The transfer unit 15 includes a first inversion unit 23, a path unit 25, a path unit 27, and a second inversion unit 29 from the lower side to the upper side in the vertical direction Z.

[0037] The first inversion unit 23 inverts the top and bottom of the substrate W received from the index block 5. The first inversion unit 23 inverts the horizontal posture of the substrate W. Specifically, the first inversion unit 23 converts the substrate W with the surface facing upward into a posture with the surface facing downward. In other words, the posture of the substrate W is converted so that the back surface faces upward.

[0038] The second inversion unit 29 performs the reverse operation. That is, the second inversion unit 29 inverts the top and bottom of the substrate W received from the processing block 7. The second inversion unit 29 converts the substrate W with its surface facing downward into a posture with its surface facing upward. In other words, the posture of the substrate W is converted so that its back surface faces downward.

[0039] The inversion directions of the first inversion unit 23 and the second inversion unit 29 described above may be opposite to each other. That is, the first inversion unit 23 converts the posture of the substrate W so that its surface faces upward. The second inversion unit 29 converts the posture of the substrate W so that its back surface faces upward.

[0040] The path portions 25 and 27 are used to transfer the substrate W between the indexer block 5 and the processing block 7. The path portion 25 is used, for example, to convey the substrate W from the processing block 7 to the indexer block 5. The path portion 27 is used, for example, to convey the substrate W from the indexer block 5 to the processing block 7. Note that the conveyance directions of the substrate W in the path portions 25 and 27 may be opposite to each other.

[0041] <4. Processing Block>

[0042] The processing block 7 performs various processes on the substrate W, for example. Examples of the process include a cleaning process. The cleaning process is, for example, a process liquid cleaning process in which only a cleaning liquid is supplied, or a brush cleaning process using a brush in addition to the process liquid.

[0043] As shown in FIG. 1, the processing block 7 is divided into, for example, a first row R1, a second row R2, and a third row R3 in the width direction Y. Specifically, the first row R1 is arranged on the left side Y. The second row R2 is arranged in the central portion of the width direction Y. In other words, the second row R2 is arranged on the right side Y of the first row R1. The third row R3 is arranged on the right side Y of the second row R2.

[0044] <4-1. First Row>

[0045] The first row R1 of the processing block 7 includes a plurality of processing units 31. The first row R1 includes, for example, four processing units 31. The first row R1 has the four processing units 31 stacked and arranged in the vertical direction Z. Each processing unit 31 is, for example, a cleaning unit. The cleaning unit performs a cleaning process on the substrate W. As the cleaning unit, there are a surface cleaning unit that cleans the surface of the substrate W and a back surface cleaning unit that cleans the back surface of the substrate W. In the present embodiment, the back surface cleaning unit SSR is taken as an example to explain the processing unit 31.

[0046] <4-2. Second row>

[0047] The second row R2 of the processing block 7 includes a center robot CR. The center robot CR is configured to be rotatable around the vertical direction Z. The center robot CR is configured to be movable up and down in the vertical direction Z. The center robot CR includes, for example, a first hand 33 and a second hand 35. The first hand 33 and the second hand 35 each hold one substrate W. The first hand 33 and the second hand 35 are each configured to be independently movable back and forth in the front-rear direction X and the width direction Y.

[0048] The first hand 33 and the second hand 35 hold the substrate W in a horizontal posture. The first hand 33 and the second hand 35 sandwich the outer peripheral surface of the substrate W and hold the substrate W while separating it from the upper surfaces of the first hand 33 and the second hand 35.

[0049] <4-3. Third row>

[0050] The third column R3 of the processing block 7 has the same configuration as the first column R1. That is, the third column R3 includes a plurality of processing units 31. The third column R3 includes, for example, four processing units 31. The four processing units 31 of the third column R3 are stacked and arranged in the vertical direction Z. Each processing unit 31 of the first column R1 and each processing unit 31 of the third column R3 are arranged to face each other in the width direction Y. Thereby, the center robot CR can access each of the opposing processing units 31 of the first column R1 and the third column R3 at the same height in the vertical direction Z.

[0051] The processing block 7 is configured as described above. Here, an operation example of the center robot CR will be briefly described. The center robot CR receives the substrate W from, for example, the first inversion unit 23. The center robot CR transports the substrate W to the back surface cleaning unit SSR of either the first column R1 or the third column R3 to cause the back surface of the substrate W to be cleaned. The center robot CR receives the substrate W that has been cleaned by the back surface cleaning unit SSR of either the first column R1 or the third column R. The center robot CR transports the substrate W to the second inversion unit 29. The index robot IR receives the substrate W from the second inversion unit 29 and stores it in the carrier C.

[0052] <5. Mounting Table>

[0053] Here, with reference to FIGS. 1 and 3, the above-described three loading / unloading blocks will be described in detail. FIGS. 3(a) to (e) are side views showing the configuration and operation of the loading / unloading blocks.

[0054] The loading / unloading block 3 includes a mounting table 13, an opening 39, and a lid opening / closing mechanism 41. The mounting table 13 is where the carrier C is placed. The mounting table 13 is provided with a mechanism (not shown) for moving the carrier C in the front-rear direction X. The mounting table 13 can move the carrier C forward and backward with respect to the opening 39. The carrier C has a loading / unloading port CT. The loading / unloading port CT is formed on one side surface of the carrier C. A plurality of substrates W stacked and accommodated in the carrier C are loaded / unloaded through the loading / unloading port CT. The carrier C includes a lid CL. The lid CL is detachably configured at the loading / unloading port CT of the carrier C. The lid CL seals the inside of the carrier C. When the lid CL is attached to the carrier C, the atmosphere inside the carrier C is blocked from the outside.

[0055] The lid opening / closing mechanism 41 includes a detaching / attaching unit 43 in the forward X direction. The detaching / attaching unit 43 removes the lid CL from the carrier C or attaches the lid CL to the carrier C. The detaching / attaching unit 43 is movable in the vertical direction Z and the front-rear direction X while holding the lid CL. The lid opening / closing mechanism 41 is movable in the front-rear direction X at the opening 39 while holding the lid CL. The lid opening / closing mechanism 41 is movable up and down in the vertical direction Z while holding the lid CL. The lid opening / closing mechanism 41 can move downward in the vertical direction Z from the opening 39 while holding the lid CL. By descending while holding the lid CL, the lid opening / closing mechanism 41 can fully open the opening 39.

[0056] First, as shown in Fig. 3(a), the carrier C is placed on the mounting table 13. The carrier C has a plurality of substrates W stacked and accommodated therein and is closed by the lid CL. At this time, the lid opening / closing mechanism 41 positions the detaching / attaching unit 43 at the opening 39. Thereby, the inside of the index block 5 is separated from the external atmosphere.

[0057] As shown in FIG. 3(b), the mounting table 13 moves the carrier C rearward in the X direction. The carrier C is positioned such that the loading / unloading opening CT and the lid CL are located at the opening 39. At this time, the attaching / detaching unit 43 releases the lock of the lid CL and holds the lid CL. The holding is performed, for example, by the attaching / detaching unit 43 sucking the lid CL.

[0058] As shown in FIG. 3(c), the lid opening / closing mechanism 41 moves rearward in the X direction. As a result, the lid CL is moved rearward in the X direction from the opening 39. The lid CL is moved inside the index block 5.

[0059] As shown in FIG. 3(d), the lid opening / closing mechanism 41 moves downward in the vertical direction Z. The lid opening / closing mechanism 41 lowers the attaching / detaching unit 43 to the lower part of the loading / unloading opening CT. The lid opening / closing mechanism 41 lowers the attaching / detaching unit 43 until the upper part of the attaching / detaching unit 43 is positioned below the lower part of the opening 39.

[0060] As shown in FIG. 3(d), the lid opening / closing mechanism 41 moves downward in the vertical direction Z. The lid opening / closing mechanism 41 lowers the attaching / detaching unit 43 to the lower part of the loading / unloading opening CT. The lid opening / closing mechanism 41 lowers the attaching / detaching unit 43 until the upper part of the attaching / detaching unit 43 is positioned below the lower part of the opening 39.

[0061] As shown in FIG. 3(e), the lid opening / closing mechanism 41 moves downward in the vertical direction Z and moves to the lowermost position where the lid opening / closing mechanism 41 can move. The lid opening / closing mechanism 41 lowers the attaching / detaching unit 43 to a position where the attaching / detaching unit 43 does not overlap with the opening 39 in the front-rear direction X. As a result, the opening 39 is fully opened. A plurality of substrates W in the carrier C can face the index block 5 through the opening 39.

[0062] The above-described lid opening / closing mechanism 41 includes, for example, a substrate sensor 45 in the attaching / detaching unit 43. The substrate sensor 45 is used to detect the position of the substrate W stacked and stored in the carrier C or to collect shape information based on the outer edge of the substrate W. The shape information includes information regarding the thickness based on the outer edge of the substrate W.

[0063] <6. Mounting Part>

[0064] Here, with reference to FIGS. 4 and 5, a part of the above-described processing unit 31 will be described. FIG. 4 is a side view showing a first example of the mounting part provided in the processing unit. FIG. 5 is a side view showing a second example of the mounting part provided in the processing unit.

[0065] The above-described processing unit 31 is assumed to be the back surface cleaning unit SSR. Such a back surface cleaning unit SSR is provided with, for example, one of two types of mounting parts 47 (mounting parts 47A and 47B) as described below. The mounting part 47 is a place where the substrate W is mounted in the back surface cleaning unit SSR. The mounting part 47 supports the lower surface of the substrate W. In addition to such two types of mounting parts 47 (mounting parts 47A and 47B), there is also a mounting part that holds the substrate W by suction.

[0066] As shown in FIG. 4, the mounting part 47A includes a turntable 49 and support pins 51. The turntable 49 has a circular shape in plan view. The turntable 49 has a diameter slightly larger than that of the substrate W. There are a plurality of support pins 51. The support pins 51 are erected on the upper surface of the turntable 49. The support pins 51 are arranged on the upper surface slightly inside the outer peripheral surface of the turntable 49. Some of the support pins 51 rotate eccentrically around the axis in the vertical direction Z. The substrate W is pressed horizontally from the outer peripheral surface by the support pins 51 that rotate in this way, and the position is fixed by the plurality of support pins 51. The support pins 51 contact the outer peripheral surface and the lower surface of the substrate W, and support the lower surface of the substrate W so as to be separated from the upper surface of the turntable 49.

[0067] Here, the distance between the upper surface of the turntable 49 and the lower surface of the substrate W supported by the support pins 51 is referred to as clearance CL1. The mounting part 47A in this first example has a relatively large clearance CL1. The clearance CL1 is larger than the thickness DP of the first hand 33 and the second hand 35. The thickness DP corresponds to the maximum height in the vertical direction Z when the part that enters the position where the substrate W is transferred among the first hand 33 and the second hand 35 is viewed from the side.

[0068] In the cleaning unit SSR provided with such a placement part 47A, it is preferable to access with the take-down hand described later. In addition, in the placement part 47A, it is also possible to access with the take-up hand described later.

[0069] The above-described placement part 47A has a defined range within which the substrate W can be transferred. The transferable range is called the capture range. The capture range varies depending on the dimensions and support structure of the transfer destination. Here, the capture range of the placement part 47A is represented by the symbol CRR1.

[0070] The capture range CRR1 is the range within which the placement part 47A can place the substrate W. In other words, the capture range CRR1 is the range within which transfer can be performed even if the center of the substrate W is displaced from the center of the placement part 47 and the outer peripheral surface of the substrate W is displaced in the front-rear direction X and the width direction Y. The capture range CRR1 is a circular shape with a diameter slightly larger than the diameter of the substrate W. Therefore, when the substrate W is placed on the placement part 47A, if the outer peripheral surface is located inside the capture range CRR1, the substrate W can be normally supported by the support pins 51. On the other hand, when the substrate W is placed on the placement part 47A, if the outer peripheral surface is located outside the capture range CRR1, the substrate W cannot be normally supported by the support pins 51.

[0071] As shown in FIG. 5, the placement portion 47B includes a turntable 53 and support protrusions 55. The turntable 53 has a circular shape in plan view. The turntable 53 is provided with an injection port (not shown) for supplying gas to the lower surface of the substrate W. The support protrusions 55 are formed on the upper surface of the turntable 53. There are a plurality of support protrusions 55. The support protrusions 55 are formed slightly inside the outer peripheral surface of the turntable 53. The support protrusions 55 abut against the lower surface of the substrate W and support the lower surface of the substrate W so as to be separated from the upper surface of the turntable 53. The substrate W is supported so as to be attracted to the support protrusions 55 and the turntable 53 by the negative pressure generated by the supply of gas. Thereby, the position of the substrate W is fixed. The clearance CL2 of this placement portion 47B is relatively small. The clearance CL2 is smaller than the clearance CL1. The clearance CL2 is smaller than the thickness DP of the first hand 33 and the second hand 35.

[0072] In the cleaning unit SSR provided with such a placement portion 47B, it is preferable to access with the lifting hand described later.

[0073] Similar to the placement portion 47A described above, the capture range is defined for the placement portion 47B described above. However, since the holding mechanism of the substrate W is different for the placement portion 47B, the capture range is also different. Here, the capture range of the placement portion 47B is represented by the symbol CRR2. For example, the capture range CRR1 is defined in a narrower range than the capture range CRR2. This is due to the fact that the placement portion 47A is a mechanism pressed by the support pin 51 that rotates.

[0074] <7. Details of the Hand>

[0075] Here, with reference to FIGS. 6 to 9, the first hand 33 in the center robot CR will be described as an example. FIG. 6 is a plan view of the take-over hand according to the embodiment. FIG. 7 is a side view of the hand according to the embodiment. FIG. 8 is a longitudinal sectional view showing the configuration of the movable guide on the tip side. FIG. 9 is a longitudinal sectional view showing the configuration of the movable guide (pusher) on the base end side. Note that the configuration of the first hand 33 is the same as that of the second hand 35 and the first hand 19 and the second hand 21 in the index robot IR.

[0076] The center robot CR is provided with a horizontal drive mechanism 57. The horizontal movement mechanism 57 drives the first hand 19 in the front-rear direction X. The horizontal movement mechanism 57 drives the first hand 33 to advance and retreat in a horizontal plane including the width direction Y together with the front-rear direction X. The horizontal movement mechanism 57 drives the first hand 33 to advance and retreat with respect to the handover destination. Specifically, the handover destinations in the center robot CR are the handover unit 15 and the processing unit 31. Note that the horizontal movement mechanism 57 in the index robot IR drives the first hand 19 and the second hand 21 to advance and retreat with respect to the front-rear direction X.

[0077] The first hand 33 includes one palm part 59 and two finger parts 61. The palm part 59 is on the base end side of the first hand 19. The finger part 61 is on the tip end side of the first hand 33. With respect to the handover destination, it enters from the tip end side of the first hand 33 and exits from the base end side of the first hand 33. The palm part 59 includes a mounting base end part 63 and a finger part mounting part 65. The mounting base end part 63 is attached to the horizontal drive mechanism 57. The finger part 61 is attached to the finger part mounting part 65. The finger part mounting parts 65 are provided at two positions spaced apart in the width direction Y. The portions where the two finger parts 61 of the finger part mounting part 65 are attached are located outside the outer peripheral surface of the substrate W in a plan view when the first hand 33 advances to the position for handing over the substrate W. In other words, the finger part 61 has a length in the front-rear direction X longer than the diameter of the substrate W.

[0078] The first hand 33 has two finger portions 61. The two finger portions 61 extend in the front-rear direction X. The two finger portions 61 are spaced apart from each other in the width direction Y. The distance by which the two finger portions 61 are spaced apart from each other does not exceed the diameter of the substrate W. In other words, the width direction Y of the two finger portions 61 falls within the diameter of the substrate W. The base end side of the finger portions 61 is attached to the finger portion attachment portion 65. The tip side of the finger portions 61, which is opposite to the base end side, is in an open state. The first hand 33 has a U-shape in a plan view with the palm portion 59 and the two finger portions 61.

[0079] The first hand 33 is equipped with three guides 67. The first hand 33 has three guides 67 attached to its upper surface. The finger portion 61 is equipped with one guide 67 on the tip side. A structure in which the guide 67 is attached to the upper surface of the finger portion 61, like this first hand 33, is called a "trade-in hand." The first hand 33, which has a trade-in hand structure, holds the substrate W by scooping it up from below.

[0080] 8, the guide 67 of the finger portion 61 is attached to a guide hole 69. The guide hole 69 is long in the front-rear direction X. A moving piece 71 is disposed at the bottom of the guide hole 69. The moving piece 71 is movable at the bottom of the guide hole 69 only in the front-rear direction X.

[0081] The finger part 61 has a lateral hole 77 formed in the front-rear direction X from the guide hole 69. The lateral hole 77 penetrates through to the palm part 59. A servo motor 79 is provided at a position in the palm part 59 corresponding to the end of the lateral hole 77. The servo motor 79 is equipped with an encoder 81. The encoder 81 detects the rotational position (rotation angle) of the rotation shaft of the servo motor 79 and outputs it as position information in an electrical signal. A ball screw 83 is inserted into the lateral hole 77. One end side of the ball screw 83 is connected to the rotation shaft of the servo motor 79. A moving piece 71 is screwed onto the other end side of the ball screw 83. When the servo motor 79 is rotationally driven, the ball screw 83 rotates and the moving piece 71 moves in the front-rear direction X along the guide hole 69. As a result, the guide 67 moves in the front-rear direction X.

[0082] As shown in FIG. 9, the palm part 59 is provided with a pusher 87. The pusher 87 is provided with one guide 67. The pusher 87 has the same configuration as that for driving the guide 67 of the finger part 61, except for the pusher arm 89 and the guide hole 91.

[0083] That is, the pusher 87 includes the lateral hole 77, the ball screw 83, the servo motor 79, the encoder 81, and the pusher arm 89. One end side of the lateral hole 77 penetrates through the side surface on the finger part 61 side. A guide hole 91 is formed on the finger part 61 side of the lateral hole 77. The guide hole 91 has a larger dimension in the vertical direction Z than the lateral hole 77. A part of the pusher arm 89 is inserted into the guide hole 91 so as to be movable in the front-rear direction X. The other end side of the lateral hole 77 is closed inside the palm part 59. The servo motor 79 is arranged at the other end side of the lateral hole 77. The servo motor 79 is equipped with the encoder 81. One end side of the ball screw 83 is connected to the rotation shaft of the servo motor 79. The pusher arm 89 is screwed onto the other end side of the ball screw 83. The guide 67 is attached to the opposite side of the servo motor 79 in the front-rear direction X on the pusher arm 89.

[0084] Each of the above-described guides 67 is configured to be movable by a predetermined distance in the front-rear direction X. Each of the above-described guides 67 is movable, for example, by a distance of about 5 mm in the front-rear direction X.

[0085] The first hand 33 has three guides 67 on its upper surface. The first hand 33 holds the substrate W in a state where the lower surface of the substrate W is spaced upward from the upper surface of the finger portion 61. Specifically, the outer peripheral surface of the substrate W is sandwiched by the three guides 67, and the substrate W is held in a state where the lower surface of the substrate W floats from the upper surface of the finger portion 61. The first hand 33 holds the substrate W in a state of contacting only the outer peripheral surface of the substrate W. The first hand 33 moves the three guides 67 toward the outer peripheral surface of the substrate W, sandwiches the outer peripheral surface of the substrate W with the three guides 67, and holds the substrate W in a state of being spaced from the upper surface of the finger portion 61.

[0086] Here, return to FIGS. 6 and 7.

[0087] The first hand 33 has a defined capture range on the hand side. Here, the capture range of the first hand 33 is represented by the symbol CRH. The capture range CRH is the range within which the first hand 33 can transfer the substrate W. The capture range CRH is the range within which the first hand 33 can place the substrate W. In other words, the capture range CRH is the range within which the substrate W can be transferred even if the center of the substrate W is displaced from the center of the first hand 33 and the outer peripheral surface of the substrate W is displaced in the front-rear direction X or the width direction Y. The capture range CRH is the range within which the first hand 33 can normally hold the substrate W by sandwiching the outer peripheral surface of the substrate W. The capture range CRH varies depending on the dimensions and structure of the hand.

[0088] The capture range CRH is circular and slightly larger in diameter than the diameter of the substrate W. Therefore, when the substrate W is positioned above the first hand 33, if the outer peripheral surface of the substrate W is located inside the capture range CRH, the substrate W can be normally held by the three guides 67. On the other hand, when the substrate W is positioned above the first hand 33, if the outer peripheral surface of the substrate W is located outside the capture range CRH, the substrate W cannot be normally held by the three guides 67. As shown in FIG. 6, the capture range CRH is, for example, larger than the capture range CRR1 of the placement portion 47A. However, depending on the configuration, the capture range CRH may be smaller than the capture range CRR1 of the placement portion 47A.

[0089] The first hand 33 moves each guide 67 in the front-rear direction X by the servo motor 79 described above. Each guide 67 is moved to at least three positions: a retracted position EP, a clamping position PP, and a transfer position RP.

[0090] The retracted position EP is the position where the three guides 67 are farthest from the center of the substrate W. The retracted position EP is the same as or outside the capture range CRH. The retracted position EP is the position where the three guides 67 are moved when receiving the substrate W. The retracted position EP is preferably set according to the diameter of the substrate W.

[0091] The clamping position PP is the position where the three guides 67 are closer to the center of the substrate W than the retracted position EP. The clamping position PP is closer to the center of the substrate W than the capture range CRH. The clamping position PP varies depending on the shape and size of the substrate W.

[0092] The handover position RP is a position where the three guides 67 are closer to the center of the substrate W than the retracted position EP. The handover position RP is a position between the clamping position PP and the retracted position EP of the three guides 67. The handover position RP is a position closer to the center of the substrate W than the capture range CRR1 of the placement portion 47A. Although not shown, the handover position RP is a position closer to the center of the substrate W than the capture range CRR2 of the placement portion 47B. The handover position RP is inside the capture ranges CRR1 and CRR2.

[0093] The above-described retracted position EP, the clamping position PP, and the handover position RP are defined by the positions of the side surfaces of the guides 67 facing the center side of the substrate W among the configurations of the respective guides 67.

[0094] The first hand 33 has three guides 67 on the upper surface, but it may be configured as shown in FIG. 10. FIG. 10 is a side view of the pick-up hand according to the embodiment.

[0095] Unlike the first hand 33, the first hand 33D has three guides 67 attached to the lower surface. Specifically, each of the two finger portions 61 has one guide 67 on the lower surface at the tip side. The palm portion 59 has one guide 67 on the lower surface at the tip side. This first hand 33D is referred to as a "pick-up hand". The first hand 33D having the structure of the pick-up hand holds the substrate W by entering from above and further lifting it upward.

[0096] The first hand 33D drives the three guides 67 with the same configuration, differing only in the attachment surface of the guides 67 from the above-described first hand 33. Therefore, detailed description of the drive mechanism is omitted.

[0097] This first hand 33D has a defined capture range CRH. Each guide 67 is moved to at least three positions: the retracted position EP, the clamping position PP, and the handover position RP, in the same manner as the above-described first hand 33.

[0098] Each of the above-described guides 67 is preferably made of, for example, PBI (polybenzimidazole). This is because PBI has high heat resistance, excellent chemical resistance, and toughness. However, each guide 67 may be made of other materials. Examples of other materials include fluororesins such as PTFE (polytetrafluoroethylene) and PFA (perfluoroalkoxyalkane).

[0099] <8. Control System>

[0100] Referring to FIG. 11, the control system of the above-described substrate processing apparatus 1 will be described. FIG. 11 is a block diagram showing the control system.

[0101] The substrate processing apparatus 1 is comprehensively controlled by a control unit CU. The control unit CU includes a CPU and a memory. The control unit CU transports the substrate W to the processing unit 31 based on a recipe that defines the processing procedure and conditions of the substrate W and performs processing.

[0102] The processing unit 31 is composed of a back surface cleaning unit SSR and the like. The processing unit 31 includes the above-described mounting portions 47A and 47B. The processing of the processing unit 31 is controlled by the control unit CU. The control unit CU stores in advance which processing unit 31 includes the mounting portion 47A and which processing unit 31 includes the mounting portion 47B.

[0103] The center robot CR is controlled by the control unit CU. The movement of the center robot CR in the front-rear direction X, the width direction Y, and the vertical direction Z is operated by the control unit CU. The movement of the first hand 33 and the second hand 35 in the front-rear direction X is operated by the control unit CU via the horizontal movement mechanism 57.

[0104] The capture range storage unit 94 stores in advance the capture ranges for each of the delivery unit 15 and the processing unit 31. For example, the capture range storage unit 94 stores that the placement unit 47A has a capture range CRR1 and the placement unit 47B has a capture range CRR2. The capture range storage unit 94 stores in advance the association between the delivery destination and its capture range.

[0105] The capture range storage unit 94 stores in advance the capture range CRH in the first hand 33 and the second hand 35 of the center robot CR, and the capture range CRH in the first hand 19 and the second hand 21 of the indexer robot IR.

[0106] The shape information storage unit 96 stores the shape information for each substrate W obtained by the substrate sensor 45 in association with the substrate W. The shape information includes the thickness of the substrate W. The shape information includes the warp of the substrate W. The shape information includes the diameter of the substrate W. The shape information storage unit 93 is referenced by the control unit CU for the shape information.

[0107] The clamping control unit 97 operates the movement of each of the three guides 67 independently. The clamping control unit 97 is operated by the control unit CU. The clamping control unit 97 operates each servo motor 79 based on an instruction from the control unit CU to move the three guides 67 independently. At that time, the clamping control unit 97 operates the servo motor 79 according to the position information from the encoder 81. The clamping control unit 97 operates the drive current to the servo motor 79. The clamping control unit 97 can detect the drive current supplied to the servo motor 79.

[0108] The clamping control unit 97 is connected to the servo motor 79 and the encoder 81. The clamping control unit 97 operates the servo motor 79 based on an instruction from the control unit CU to move the three guides 67. At this time, the clamping control unit 97 operates the servo motor 79 according to the position information from the encoder 81. The clamping control unit 97 can detect the drive current supplied to the servo motor 79 as drive current information. The clamping control unit 97 determines that the guide 67 has contacted the outer peripheral surface of the substrate W based on either one or both of the position information and the drive current information.

[0109] That is, when the guide 67 contacts the outer peripheral surface of the substrate W, the movement of the guide 67 is temporarily obstructed. Therefore, the displacement of the position information from the encoder 81 temporarily stops. Also, even when the guide 67 contacts the outer peripheral edge of the substrate, to further move the guide 67 toward the outer peripheral surface of the substrate W, it is necessary to increase the torque of the servo motor 79. Therefore, the drive current to the servo motor 79 increases and the drive current information is displaced. Accordingly, by monitoring either one or both of the position information and the drive current information, it is possible to accurately determine that the guide 67 has contacted the outer peripheral surface of the substrate W. After the guide 67 contacts the outer peripheral surface of the substrate W, the clamping control unit 97 adjusts the biasing force of the guide 67 on the outer peripheral surface of the substrate W to clamp the substrate W. Each guide 67 at this time moves from the retracted position EP to the clamping position PP. Note that the control unit CU preferably refers to the shape information storage unit 96 to refer to the shape information of the substrate W to be conveyed. Thereby, the biasing force of each guide 67 on the substrate W can be adjusted according to the shape of the substrate W. As a result, breakage of the substrate W and each guide 67 can be suppressed.

[0110] Also, before holding the substrate W, the control unit CU preferably refers to the shape information storage unit 96 and moves each guide 67 to the retracted position EP. That is, the control unit CU moves each guide 67 to the retracted position EP according to the diameter of the substrate W. Thereby, it is possible to move the guide 67 so as to be located outside the substrate W. Therefore, the substrate W can be surely received by the first hand 33.

[0111] After the control unit CU holds the substrate W with the first hand 33, it moves the first hand 33 to the delivery destination. The control unit CU enters the first hand 33 into the delivery destination and refers to the information of the delivery destination before delivering the substrate W. Specifically, the control unit CU accesses the capture range storage unit 96 and refers to the capture range of the delivery destination. Thereby, when placing the substrate W, each guide 67 moves from the clamping position PP to the delivery position RP, and the delivery position RP can be accommodated within the capture range of the delivery destination.

[0112] The control system of the above-described center robot CR also includes an indexer robot IR. That is, the control system of the indexer robot IR includes a clamping control unit 97. The indexer robot IR refers to the capture range storage unit 94 and the shape information storage unit 96, and operates the indexer robot IR to transfer the substrate W between the carrier C and the delivery unit 15.

[0113] <9. Operation Flow>

[0114] With reference to FIGS. 12 to 23, the transfer operation of the substrate W by the center robot CR in the substrate processing apparatus 1 will be described. FIG. 12 is a flowchart for explaining the operation related to transfer. FIGS. 13, 15, 17, 19, 21 to 23 are schematic views for explaining the operation, and are views seen from the side. FIGS. 14, 16, 18, 20 are schematic views for explaining the operation, and are views seen from the plane.

[0115] In the following description, the operation of receiving the substrate W placed on the path unit 27 with the first hand 33 and delivering the substrate W to the processing unit 31 will be described as an example.

[0116] Step S1 The control unit CU refers to the capture range storage unit 94 and the shape information storage unit 96. The control unit CU acquires the capture range and the shape information of the substrate W. Since the control unit CU knows the substrate W to be conveyed, the conveyance source, and the conveyance destination, it acquires the shape information regarding the substrate W and the capture range of the conveyance destination. Here, it is assumed that the conveyance destination is the processing unit 31 including the placement unit 47A.

[0117] Step S2 The control unit CU operates the clamping control unit 97 to move each guide 67 in the first hand 33. Specifically, it is preferable to move the three guides 67 of the first hand 33 to the retracted position EP corresponding to a position outside the outer peripheral surface according to the shape information of the substrate W. Thereby, the substrate W can be reliably received by the first hand 19.

[0118] Step S3 As shown in FIGS. 13 and 14, the control unit CU operates the horizontal movement mechanism 57 of the center robot CR to cause the first hand 33 to enter the delivery position within the path portion 27. Since the first hand 33 is a pick-up hand that picks up the substrate W from below, the first hand 33 is caused to enter below the position where the substrate W is placed in the path portion 27.

[0119] Step S4 As shown in FIGS. 15 and 16, the control unit CU moves the first hand 33 to a height at which the substrate W can be clamped. Specifically, the control unit CU operates the center robot CR to raise the first hand 33 in the vertical direction Z so that the substrate W is positioned below the upper end of the guide 67 and above the upper surface of the finger portion 61.

[0120] Next, as shown in FIGS. 17 to 20, the control unit CU operates the clamping control unit 97 to move the three guides 67 of the first hand 33 toward the outer peripheral surface of the substrate W. Specifically, the clamping control unit 97 moves to the clamping position PP so that each guide 67 abuts against the outer peripheral surface of the substrate W and an urging force (indicated by a white arrow in the figure) can be applied according to the shape information of the substrate W. All of the guides 67 are movable, and the urging force is adjusted for all of the three guides 67. Therefore, when clamping the substrate W, the distance by which the lower surface of the substrate W slides horizontally at the place where the substrate W is placed can be shortened. As a result, the movement of the center position of the substrate W when clamping the substrate W is minimized. Thus, particles generated when clamping the substrate W can be suppressed.

[0121] Step S5 As shown in FIG. 21, the control unit CU causes the first hand 33 to enter the processing unit 31. Specifically, the control unit CU moves the first hand 33 above the placement portion 47A of the processing unit 31. At this time, it is preferable that the control unit CU causes the first hand 33 to enter so that the center position of the first hand 33 substantially coincides with the center position of the placement portion 47A. Thereby, the entire substrate W fits within the capture range CRR1 of the placement portion 47A. Therefore, the placement portion 47A can reliably receive the substrate W from the first hand 33.

[0122] Step S6 As shown in FIG. 22, the control unit CU moves the first hand 33 to the delivery position of the placement portion 47A. Specifically, the first hand 33 is lowered toward the placement portion 47A. Thereby, the lower surface of the substrate W held by the first hand 33 abuts against the support pin 51 of the placement portion 47A.

[0123] Step S7 As shown in FIG. 23, the control unit CU delivers the substrate W held by the first hand 33 to the placement unit 47A. Specifically, the control unit CU operates the gripping control unit 97 to move each guide 67 from the clamping position PP to the delivery position RP. The delivery position RP is a position that does not exceed the capture range CRR1 of the placement unit 47A. Thereby, the substrate W abuts against the support pins 51 within the capture range CRR1. Even if the substrate W contains an adhesive substance and is dragged horizontally by the guide 67, the substrate W fits within the capture range CRR1. The placement unit 47A rotates some of the support pins 51 to sandwich the outer peripheral surface of the substrate W and hold the substrate W.

[0124] Thereafter, the control unit CU operates the horizontal drive mechanism 57 to withdraw the first hand 33 from the processing unit 31. By the above-described series of operations, the transfer operation for one substrate W is completed.

[0125] According to this embodiment, when the control unit CU delivers the substrate W to the placement unit 47A, based on the capture range CRR1 set in the placement unit 47A, the control unit CU operates the clamping control unit 97 to move each guide 67 so that the delivery position RP is inside the capture range CRR1. Therefore, even if the substrate W is dragged when the guide 67 moves to the delivery position RP, the substrate W fits within the capture range CRR1. As a result, the substrate W can be reliably delivered to the placement unit 47A.

[0126] The correspondence between the above-described embodiment and the configuration of the present invention is as follows.

[0127] The indexer robot IR and the center robot CR correspond to the "substrate transfer device" in the present invention. The moving piece 71, the servo motor 79, and the ball screw 83 correspond to the "motor drive unit" in the present invention. The control unit CU and the clamping control unit 97 correspond to the "control unit" in the present invention. The processing unit 31 and the back surface cleaning unit SSR correspond to the "processing unit" in the present invention. The capture ranges CRR1 and CRR2 correspond to the "first capture range" in the present invention. The capture range CRH corresponds to the "second capture range" in the present invention. The two guides 67 in the finger part 61 correspond to the "first guide" in the present invention. The one guide 67 of the pusher 87 corresponds to the "second guide" in the present invention. The servo motor 79 corresponds to the "motor" in the present invention. The clamping control unit 97 corresponds to the "drive circuit" and the "drive current detection unit" in the present invention. The encoder 81 corresponds to the "position information detection unit" in the present invention.

[0128] The present invention is not limited to the above-described embodiments and can be modified as follows.

[0129] (1) In the above-described embodiment, the first hand 33 of the center robot RR was taken as an example for explanation. However, the present invention can also be applied to the second hand 35 of the center robot IR and the first hand 19 and the second hand 21 of the indexer robot IR.

[0130] (2) In the above-described embodiment, a configuration including three guides 67 is adopted. However, the present invention is not limited to such a configuration. That is, the present invention may have a configuration including at least two or four or more guides 67. For example, the first hand 33 including two guides 67 may be configured with one finger part having an I-shaped shape in plan view, one arc-shaped guide 67 corresponding to the outer edge shape of the substrate W at the tip side, and a pusher 87 at the base end side.

[0131] (3) In the above-described Example 1, the advancing / retreating drive mechanism is configured to move the guide 67 by the moving piece 71, the servo motor 79, and the ball screw 83. However, the present invention is not limited to such a configuration. For example, a configuration may be adopted that includes a wire having one end connected to a spring, a guide fixedly attached to a part of the wire, and a drive unit that winds up the other end of the wire to move the wire in the front-rear direction X.

[0132] (4) In the above-described Example 1, the guide 67 is driven to advance and retreat in the front-rear direction X with respect to the finger part 61. However, the present invention is not limited to such a configuration. For example, the guide 67 may be fixedly attached to the finger part 61, and the finger part 61 may be attached to the finger part attachment part 65 so as to be able to advance and retreat in the front-rear direction X at the finger part attachment part 65. Thereby, since the movable part can be arranged outside the outer peripheral surface of the substrate W, it is advantageous in terms of cleanliness.

[0133] (5) In the above-described examples, a configuration in which three guides 67 move is adopted. However, the present invention is not limited to such a configuration. For example, a configuration may be adopted that includes two fixed guides on the tip side and the base end side of the finger part 61, respectively, and a guide 67 that advances and retreats from the base end side to the tip side of the finger part 61.

[0134] Here, refer to FIGS. 24 and 25. FIG. 24 is a plan view of the hand in the substrate processing apparatus according to the modification. FIG. 25 is a view taken along the line 100-100 in FIG. 24.

[0135] The first hand 33B differs from the above-described example in the configuration of the finger part 61. That is, the finger part 61 is provided with guides 67A at both end sides in the front X and the rear X. Each guide 67A is a fixed type that does not move. Each guide 67A does not move in the front-rear direction X in the finger part 61.

[0136] The guide 67A includes an inclined surface 101 and a restricting portion 103. The inclined surface 101 is formed to be lower toward the center side of the substrate W. In other words, the inclined surface 101 is formed to be higher toward the outside than the outer peripheral surface of the substrate W. The restricting portion 103 is erected along the outer peripheral surface of the substrate W. It is preferable that the portion of the restricting portion 103 facing the outer peripheral surface of the substrate W in plan view has the same shape as the shape of the corresponding outer peripheral surface of the substrate W. This is because although the contact area increases, the substrate W can be stably held. The four guides 67A are arranged slightly outside the outer shape of the substrate W in plan view. Note that the capture range CRH in the first hand 33B is circular and contacts the inside of the four restricting portions 103 in plan view.

[0137] In the above-described first hand 33B, after the substrate W is placed on the inclined surface 101 of the guide 67A within the capture range CRH, the guide 67 of the pusher 87 is moved to the clamping position PP (not shown), whereby the outer peripheral surface of the substrate W is biased forward in the X direction. As a result, the outer peripheral surface of the substrate W located forward in the X direction slides up the inclined surface 101 and is pressed against the restricting portion 103, and is clamped between the guide 67 of the pusher 87 and the two guides 67A. Thereby, the substrate W is held by the first hand 33B.

[0138] According to this modification, since only the guide 67 of the pusher 87 needs to be driven, the drive mechanism can be simplified. Even with this configuration, by setting the transfer position RP (not shown) of the guide 67 of the pusher 87 within the capture range CRR1 of the mounting portion 47A, the same effect as in the embodiment can be achieved.

[0139] (6) In the above-described embodiment, the shape information storage unit 96 is provided, but the present invention does not necessarily require this configuration.

[0140] (7) In the above-described embodiment, the configuration of the substrate processing apparatus 1 has been described as an example, but the present invention is not limited to a substrate processing apparatus having such a configuration.

[0141] (8) In the above-described embodiments, the case of processing the circular substrate W has been described as an example. However, the substrate W is not limited to a circular shape.

[0142] (9) In the above-described embodiments, a configuration in which only one of the upper hand or the lower hand is adopted has been exemplified. However, for example, the center robot CR of the substrate processing apparatus 1 includes the first hand 33 and the second hand 35, and hands with different picking methods may be adopted respectively.

[0143] For example, in the center robot CR, the first hand 33 is an upper hand, and the second hand 35 is configured as a lower hand. Further, the first hand 33 and the second hand 35 may be selectively used according to the clearance CL1 of the mounting portion 47A provided in the processing unit 31 and the clearance CL2 of the mounting portion 47B.

[0144] Therefore, an appropriate hand (the first hand 33 or the second hand 35) can be selected according to the clearances CL1 and CL2 related to the transfer of the substrate W in the processing unit 31, and the substrate W can be reliably transferred.

Explanation of Reference Numerals

[0145] 1... Substrate processing apparatus W... Substrate 3... Loading / Unloading Block 5... Indexer Block 7... Processing Block C... Carrier IR... Indexer Robot 19... First Hand 21... Second Hand 31... Processing Unit SSR... Back Surface Cleaning Unit CR... Center Robot 33... First Hand 35... Second Hand 45... Substrate Sensor 47A, 47B... Mounting Portions CL1, CL2... Clearances 57 … Horizontal movement mechanism 59 … Palm part 61 … Finger part 63 … Mounting base end part 65 … Finger part mounting part 67 … Guide 69 … Guide hole 71 … Moving piece 73 … Tactile sensor 75 … Detection surface 79 … Servo motor 81 … Encoder 83 … Ball screw 87 … Pusher CU … Control unit 94 … Capture range memory unit 96 … Shape information memory unit 97 … Gripping control unit CRH … Capture range CRR1,CRR2 … Capture range EP … Retracted position PP … Clamping position RP … Handover position

Claims

1. In a substrate transfer device for transferring a substrate, a hand for holding the substrate in a horizontal posture, a horizontal drive mechanism for driving the hand to move forward and backward in a horizontal plane in order to transfer the substrate between the hand and a placement portion within a first capture range which is a range where the substrate can be transferred, a first guide provided on the hand for abutting and supporting the outer peripheral edge of the substrate, a second guide provided on the hand for holding the substrate separated from the hand by sandwiching the substrate together with the first guide, a motor drive unit for moving the second guide to at least three positions including a retracted position outside a second capture range which is a range where the substrate can be transferred by the hand, a clamping position inside the second capture range for clamping the substrate, and a transfer position which is a position for transferring the substrate between the placement portion and is a position between the clamping position and the retracted position, a control unit for operating the motor drive unit to move the second guide so that the transfer position is inside the first capture range based on the first capture range set for each placement portion when transferring the substrate to the placement portion, A substrate transfer device, characterized by comprising the above.

2. In the substrate transfer device according to Claim 1, further comprising a capture range storage unit for storing the first capture range in association with the placement portion, The control unit refers to the capture range storage unit when transferring the substrate to the placement portion. A substrate transfer device characterized by this.

3. In the substrate transfer device according to Claim 1, When receiving the substrate from the placement portion, the control unit operates the motor drive unit to move the second guide so that the second guide is positioned outside the substrate according to the shape of the substrate. A substrate transfer device characterized by this.

4. In the substrate transfer device according to Claim 1, The guide has a cylindrical shape. A substrate transfer device characterized by this.

5. In the substrate transfer device according to Claim 1, The motor drive unit includes a motor for driving the guide to move forward and backward, a drive circuit for applying a drive current for driving the motor, and an encoder for detecting the rotational position of the motor. The apparatus further includes at least one of a drive current detection unit that detects the contact based on drive current information of the drive circuit and a position information detection unit that detects the contact based on position information output from the encoder. The control unit adjusts a biasing force applied to the substrate at the clamping position based on at least one of the drive current information and the position information. A substrate transfer apparatus characterized by this. [

6. ] A substrate transfer apparatus according to any one of claims 1 to 5, A processing unit that includes the placement unit and performs a predetermined process on the substrate, A substrate processing apparatus characterized by including the above.

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