Substrate processing apparatus and substrate transport method

Abstract

To provide a substrate processing apparatus and a substrate transport method that can prevent substrate transport trouble even if a substrate is misaligned in the horizontal plane.SOLUTION: A control unit moves two distance sensors 31, 32 in the vertical direction using a shutter lifting unit, and while the two distance sensors 31, 32 are moving, measures two distances DA, DB between the two distance sensors 31, 32 and two different points EA, EB on a peripheral portion of each substrate W stored in a carrier placed on a carrier placement unit using the two distance sensors 31, 32, and calculates the central position CP of each substrate W in the horizontal plane based on the two distances DA, DB corresponding to each substrate W and the diameter DM or radius of each substrate W, and transports multiple substrates W from the carrier by a substrate transport robot based on the central position CP of each substrate W in the horizontal plane.SELECTED DRAWING: Figure 8

Description

Technical Field

[0001] The present invention relates to a substrate processing apparatus for processing a substrate and a substrate transfer method. Examples of the substrate include a semiconductor substrate, a substrate for an FPD (Flat Panel Display), a glass substrate for a photomask, a substrate for an optical disk, a substrate for a magnetic disk, a ceramic substrate, a substrate for a solar cell, and the like. Examples of the FPD include a liquid crystal display device, an organic EL (electroluminescence) display device, and the like.

Background Art

[0002] A conventional substrate processing apparatus includes two sets of mapping sensors (transmission-type sensors) arranged at two positions in different directions for loading and unloading a substrate with respect to a carrier. After the two sets of mapping sensors enter the carrier, the two sets of mapping sensors are moved downward. Thereby, two heights of the substrate at two different positions are detected. Based on the two heights of the substrate, the differential height of the tilted substrate and the amount of displacement of the substrate position toward the back side of the carrier are detected (see, for example, Patent Document 1).

[0003] Patent Document 2 discloses a substrate transfer apparatus including a detection unit which is a mechanism for detecting the position, shape, etc. of each substrate stored in a storage unit (carrier). The detection unit includes three distance sensors using infrared rays, ultrasonic waves, etc.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, conventional substrate processing apparatuses have the following problems. The substrate transfer robot takes out a substrate from a carrier placed on the carrier placement section. At this time, for example, if there are errors such as the shape of the carrier, the hand of the substrate transfer robot only moves to a pre-registered position, so transfer troubles such as failure to pick up the substrate may occur.

[0006] In Patent Document 1, the amount of substrate displacement in the depth direction of the carrier is detected. However, the amount of substrate displacement in the horizontal direction orthogonal to the direction in which the substrate is inserted into and removed from the carrier cannot be detected.

[0007] The present invention has been made in view of such circumstances, and an object thereof is to provide a substrate processing apparatus and a substrate transfer method capable of preventing substrate transfer troubles even if the substrate is displaced in a horizontal plane.

Means for Solving the Problems

[0008] In order to achieve such an object, the present invention has the following configuration. That is, a substrate processing apparatus according to the present invention includes a plurality of slots for accommodating a plurality of horizontally oriented substrates arranged in the vertical direction, and a carrier placement unit for placing a processing carrier having a carrier opening for inserting and removing the plurality of substrates, a substrate transfer robot having a hand for supporting one substrate and capable of moving the hand, two distance sensors arranged horizontally so as to face the plurality of substrates in the processing carrier through the carrier opening, a sensor lifting unit for moving the two distance sensors in the vertical direction, and a control unit. The control unit moves the two distance sensors in the vertical direction by the sensor lifting unit, and during the movement of the two distance sensors, the two distance sensors measure two distances between the two distance sensors and two different points on the peripheral edge of each substrate accommodated in the processing carrier placed on the carrier placement unit, respectively. Based on the two distances corresponding to each substrate and the diameter of each substrate, the control unit calculates the center position of each substrate in the horizontal plane, and based on the center position of each substrate in the horizontal plane, the substrate transfer robot transfers the plurality of substrates from the processing carrier, which is characterized in that.

[0009] According to the substrate processing apparatus of the present invention, it includes two distance sensors arranged horizontally so as to face a plurality of substrates in a processing carrier through a carrier opening. During the movement of the two distance sensors, the control unit measures two distances from the two distance sensors to two different points on the peripheral edge of each substrate in the processing carrier placed on the carrier placement unit by the two distance sensors. Further, the control unit calculates the center position of the horizontal plane of each substrate from the two distances of each substrate and the diameter of each substrate. The calculated center position in the horizontal plane indicates the accurate position of the substrate. Therefore, even if the substrate is misaligned in the horizontal plane, it is possible to prevent the substrate transfer trouble caused by the substrate transfer robot.

[0010] Also, in the above-described substrate processing apparatus, the control unit executes (1) a teaching process and (2) a teaching correction process. As the teaching process, (1-1) the substrate transfer robot causes the hand to enter the standard carrier placed on the carrier placement unit, and sets, as a teaching position, a position for taking, with the hand, a standard substrate stored in a predetermined standard slot among a plurality of standard slots of the standard carrier. (1-2) The sensor lifting unit moves the two distance sensors in the vertical direction to a height position corresponding to the standard substrate stored in the standard slot. (1-3) The two distance sensors respectively measure two standard distances between the two distance sensors and two different points on the peripheral edge of the standard substrate stored in the standard slot. (1-4) Based on the two standard distances and the diameter of the standard substrate, a standard center position of the standard substrate in the horizontal plane is calculated. (1-5) The standard center position is associated with the teaching position. Next, when transferring a substrate from the processing carrier, as the teaching correction process, (2-1) the sensor lifting unit moves the two distance sensors in the vertical direction. (2-2) During the movement of the two distance sensors, the two distance sensors respectively measure two distances between the two distance sensors and two different points on the peripheral edge of each substrate stored in the processing carrier placed on the carrier placement unit. (2-3) Based on the two distances corresponding to each substrate and the diameter of each substrate, a center position of each substrate in the horizontal plane is calculated. (2-4) Among the plurality of slots of the processing carrier, a deviation amount of the center position of the substrate stored in the slot corresponding to the standard slot is calculated based on the standard center position. (2-5) Using the deviation amount, the teaching position associated with the standard center position is corrected. It is preferable to transfer the substrate from among the plurality of substrates from the processing carrier by the substrate transfer robot based on the corrected teaching position.

[0011] A position for manually picking up a standard substrate stored in a predetermined standard slot of a standard carrier is set as a teaching position. Also, two standard distances to the standard substrate are respectively measured by two distance sensors. Then, a standard center position is calculated based on the two standard distances and the diameter of the standard substrate. The standard center position is associated with the teaching position. A displacement amount of the center position of a substrate stored in a slot of a processing carrier corresponding to the standard slot is calculated with reference to the standard center position. The teaching position is corrected using the calculated displacement amount. Therefore, the teaching position on the horizontal plane can be corrected well.

[0012] Also, in the above-described substrate processing apparatus, it is preferable that the control unit performs the teaching process for all of the plurality of standard slots of the standard carrier and performs the teaching correction process for all of the plurality of slots of the processing carrier. Thereby, for all of the plurality of substrates of the processing carrier, the teaching position on the horizontal plane can be corrected well.

[0013] Also, in the above-described substrate processing apparatus, the control unit executes the teaching process for a first standard slot at the lowermost stage and a second standard slot at the uppermost stage among the plurality of standard slots of the standard carrier, and as the teaching process for a third standard slot between the first standard slot and the second standard slot among the plurality of standard slots, a third teaching position related to the third standard slot is calculated from a geometric relationship between a first teaching position related to the first standard slot and a second teaching position related to the second standard slot, a third standard center position related to the third standard slot is calculated from a geometric relationship between a first standard center position related to the first standard slot and a second standard center position related to the second standard slot, the third standard center position is associated with the third teaching position, and it is preferable that the teaching correction process is performed for all of the plurality of slots of the processing carrier.

[0014] Teaching processing is executed for the first standard slot at the bottommost stage and the second standard slot at the uppermost stage of the standard carrier, and the third standard slot between them is calculated from geometric relationships. Therefore, the teaching processing can be easily performed.

[0015] Also, in the above-described substrate processing apparatus, the substrate transfer robot has two or more hands including the hand, and has the two or more hands that each support one substrate, and can move the two or more hands integrally. When the two or more hands support two or more substrates among the plurality of substrates, the control unit calculates an average value of two or more center positions in the horizontal plane corresponding to the two or more substrates, and based on the average value, it is preferable to transfer the two or more substrates from the processing carrier by the substrate transfer robot.

[0016] When two or more hands are moved integrally, an average value of two or more center positions corresponding to two or more substrates supported by the two or more hands is calculated, and two or more substrates are transferred based on the average value. Therefore, even if the substrates are misaligned in the horizontal plane, it is possible to prevent troubles in transferring the substrates by the substrate transfer robot.

[0017] Also, in the above-described substrate processing apparatus, it further includes a notification unit that emits at least one of sound and light, and when the misalignment amount exceeds a preset range, the control unit preferably emits at least one of sound and light by the notification unit. Thereby, the operator can recognize that the misalignment amount has exceeded the preset range.

[0018] In addition, the substrate transfer method according to the present invention includes a plurality of slots for storing a plurality of substrates in a horizontal posture arranged in the vertical direction, and a carrier mounting portion for mounting a processing carrier having a carrier opening for inserting and removing the plurality of substrates, a substrate transfer robot having a hand for supporting one substrate and capable of moving the hand, two distance sensors arranged horizontally so as to face the plurality of substrates in the processing carrier through the carrier opening, and a sensor lifting portion for moving the two distance sensors in the vertical direction. A substrate transfer method of a substrate processing apparatus, comprising: a sensor moving step of moving the two distance sensors in the vertical direction by the sensor lifting portion; during the movement of the two distance sensors, the two distance sensors and the two distance sensors measure two distances between two different points on the peripheral edge of each substrate stored in the processing carrier mounted on the carrier mounting portion respectively; a center position calculating step of calculating the center position of each substrate in the horizontal plane based on the two distances corresponding to each substrate and the diameter of each substrate; and a transfer step of transferring the plurality of substrates from the processing carrier by the substrate transfer robot based on the center position of each substrate in the horizontal plane.

Effect of the Invention

[0019] According to the substrate processing apparatus and the substrate transfer method of the present invention, even if the substrate is displaced in the horizontal plane, it is possible to prevent substrate transfer troubles.

Brief Description of the Drawings

[0020]

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Example 1

[0021] Hereinafter, Example 1 of the present invention will be described with reference to the drawings. FIG. 1 is a plan view showing a schematic configuration of the substrate processing apparatus according to Example 1. FIG. 2 is a cross-sectional view of the carrier. FIG. 3 is a front view of the carrier.

[0022] In this specification, when the teaching positions TP1 to TP25 are not particularly distinguished, they are referred to as the teaching position TP. When the points EA1 to EA25 are not particularly distinguished, they are referred to as the point EA. When the points EB1 to EB25 are not particularly distinguished, they are referred to as the point EB. When the distances DA1 to DA25 are not particularly distinguished, they are referred to as the distance DA. When the distances DB1 to DB25 are not particularly distinguished, they are referred to as the distance DB. When the standard center positions DP1 to DP25 are not particularly distinguished, they are referred to as the standard center position DP. When the center positions CP1 to CP25 are not particularly distinguished, they are referred to as the center position CP. When the position deviation amounts DF1 to DF25 are not particularly distinguished, they are referred to as the position deviation amount DF. When the corrected teaching positions RTP1 to RTP25 are not particularly distinguished, they are referred to as the corrected teaching position RTP.

[0023] <1. Configuration of Substrate Processing Apparatus> Refer to FIG. 1. The substrate processing apparatus 1 processes a substrate W. The substrate processing apparatus 1 includes an index block 3 and a processing block 5. The index block 3 includes a plurality (e.g., two) of carrier placement units 7, a substrate transfer robot IR, a wall portion 9, and a plurality (e.g., two) of lid attaching / detaching units 11. Note that the horizontal direction in which the index block 3 and the processing block 5 are arranged is the X direction (front-rear direction). The horizontal direction in which the two carrier placement units 7 are arranged is the Y direction (width direction). The Y direction is orthogonal to the X direction.

[0024] Each of the two carrier placement units 7 places a carrier C. The carrier C houses a plurality (e.g., 25) of substrates W in a horizontal posture arranged in the vertical direction (Z direction). Also, the carrier C houses a plurality of substrates W at a predetermined interval (e.g., 10 mm). The substrate W is formed in a disk shape. The substrate W may or may not have warpage, and may be a laminate of a plurality of substrates. As the carrier C, for example, a FOUP (Front Opening Unify Pod) is used, but it is not limited thereto. For example, the carrier may be a cassette (open cassette) that does not have a lid portion 17 (described later) that closes a carrier opening 9A (described later).

[0025] Refer to FIGS. 2 and 3. The carrier C includes a container 13, an outlet 14, a plurality (e.g., 25) of shelf portions 15, and a lid portion 17. The container 13 houses a plurality of substrates W. The outlet 14 is provided on the front surface of the container 13. The outlet 14 is an opening for taking in and out a plurality of substrates W. The substrate W in the container 13 of the carrier C is taken out through the outlet 14. Also, the substrate W is stored through the outlet 14. When the carrier C is being transferred, the lid portion 17 that closes the outlet 14 is attached to the container 13. Note that the outlet 14 corresponds to the carrier opening of the present invention. Also, the carrier C corresponds to the processing carrier of the present invention.

[0026] A plurality of shelf portions 15 are provided in the vertical direction (Z direction) within the carrier C (container 13). In the vertical direction, the plurality of shelf portions 15 are arranged at equal intervals (for example, at intervals of 10 mm). Each of the plurality of shelf portions 15 can place a single substrate W in a horizontal posture.

[0027] The shelf portion 15 includes a plurality of (for example, 25) shelves 15A and a plurality of (for example, 25) shelves 15B. The 25 shelves 15A are provided on the left inner wall 13B of the container 13, and the 25 shelves 15B are provided on the right inner wall 13C of the container 13. The 25 shelves 15A face the 25 shelves 15B respectively. A single substrate W is placed on each pair of shelves 15A and 15B.

[0028] In this embodiment, it is assumed that the carrier C can accommodate a maximum of 25 (n sheets, where n is a natural number of 2 or more) substrates W. Refer to FIG. 3. Within the carrier C, for example, the space for accommodating a single substrate W between two adjacent shelf portions 15 in the vertical direction (Z direction) is called a slot. The carrier C includes 25 slots SL1, SL2, ~ SL23, SL24, SL25. The 25 slots SL1 to SL25 are arranged in order from the bottom. Slot SL1 is the slot at the lowest position, and slot SL25 is the slot at the highest position.

[0029] Refer to FIGS. 1 and 4. The two carrier placement portions 7 are arranged at the front part of the index block 3. The two carrier placement portions 7 are arranged outside the front wall portion 9A. The front wall portion 9A has a through hole 9C at a position corresponding to the take-out port 14 of the carrier C placed on the carrier placement portion 7. That is, the front wall portion 9A includes two through holes 9C (refer to FIG. 1). The through hole 9C is formed to be approximately the same size as the take-out port 14 of the carrier C. The substrate transfer robot IR takes out the substrate W from the carrier C placed on the carrier placement portion 7 through the through hole 9C.

[0030] Each passage 9C is blocked by the shutter portion 19 of the lid attachment / detachment portion 11 in order to block the atmosphere outside and inside the wall portion 9. The two lid attachment / detachment portions 11 are respectively provided on the two carrier placement portions 7. As shown in FIG. 5, the two lid attachment / detachment portions 11 each include a shutter portion 19, a shutter advancing / retreating portion 21, a shutter elevating portion 23, and a height sensor 25.

[0031] As described above, the shutter portion 19 blocks the passage 9C. Further, the shutter portion 19 removes the lid portion 17 from the carrier C or attaches the lid portion 17 to the carrier C. Further, the shutter portion 19 holds the removed lid portion 17. The shutter advancing / retreating portion 21 moves the shutter portion 19 forward and backward in the X direction. The shutter elevating portion 23 moves the shutter portion 19 in the vertical direction (Z direction). The shutter advancing / retreating portion 21 and the shutter elevating portion 23 each include an electric motor. The height sensor 25 is composed of, for example, a linear encoder or a rotary encoder.

[0032] Note that the shutter advancing / retreating portion 21 moves the two distance sensors 31, 32 and the sensor moving portion 33, which will be described later, forward and backward in the X direction. Further, the shutter elevating portion 23 moves the two distance sensors 31, 32 and the sensor moving portion 33, which will be described later, up and down in the vertical direction (Z direction). Note that the shutter elevating portion 23 corresponds to the sensor elevating portion of the present invention.

[0033] The index block 3 further includes two distance sensors 31, 32 and a sensor moving portion 33. The two distance sensors 31, 32 are provided on the upper surface of the shutter portion 19 via the sensor moving portion 33. As shown in FIGS. 6 and 7, the two distance sensors 31, 32 are arranged to face a plurality of substrates W in the carrier C via the take-out port 14. The two distance sensors 31, 32 are arranged horizontally. That is, the distance sensor 31 is arranged at the same height position as the distance sensor 32.

[0034] The two distance sensors 31 and 32 each measure a distance. The two distance sensors 31 and 32 measure two distances DA and DB between the two distance sensors 31 and 32 and two different points (points EA and EB) on the peripheral edge of the substrate W in the carrier C placed on the carrier placement portion 7. Specifically, the first distance sensor 31 measures the distance DA between the tip TA of the first distance sensor 31 and the point EA on the peripheral edge of the substrate W (see FIG. 8). The second distance sensor 32 measures the distance DB between the tip TB of the second distance sensor 32 and the point EB on the peripheral edge of the substrate W (see FIG. 8). The point EA is a point different from the point EB. Note that the point EA and the point EB are each positions that vary depending on, for example, the position where the laser light is irradiated. Also, the tips TA and TB are each assumed to be in positions that serve as references when measuring the distance.

[0035] The two distance sensors 31 and 32 are each an optical distance sensor. The two distance sensors 31 and 32 each include a light emitter and a light receiver. The light emitter irradiates laser light toward the measurement object (for example, the peripheral edge of the substrate W). The light receiver detects the laser light reflected by the measurement object. The first distance sensor 31 is configured in the same manner as the second distance sensor 32. Note that the two distance sensors 31 and 32 may each irradiate light such as infrared light that is not laser light. Also, the two distance sensors 31 and 32 may each be a sensor that uses ultrasonic waves.

[0036] The sensor moving unit 33 is provided on the upper surface of the shutter unit 19. As shown in FIGS. 6 and 7, the sensor moving unit 33 moves the two distance sensors 31 and 32 in the X direction between the measurement position MEP and the standby position. FIG. 6 shows a state where the two distance sensors 31 and 32 are located at the standby position. FIG. 7 shows a state where the two distance sensors 31 and 32 are located at the measurement position MEP. Note that the measurement position MEP and the standby position are preset positions.

[0037] The sensor moving unit 33 includes a sensor support member 33A, two guide rails 33B, a screw shaft 33C, an electric motor 33D, and a position sensor (such as a rotary encoder) (not shown). The sensor support member 33A is formed in a C shape in plan view. Two distance sensors 31 and 32 are attached to both ends of the C-shaped sensor support member 33A. The two guide rails 33B and the screw shaft 33C are arranged so as to extend in the X direction. The two guide rails 33B support the sensor support member 33A so as to be movable in the X direction. That is, the sensor support member 33A is guided in the X direction by the two guide rails 33B. The screw shaft 33C penetrates the sensor support member 33A and meshes with the internal thread 33F of the sensor support member 33A. The output shaft of the electric motor 33D is connected to the proximal end of the screw shaft 33C.

[0038] When the electric motor 33D rotates the screw shaft 33C in the positive direction about the axis, the two distance sensors 31 and 32 and the sensor support member 33A are advanced (see Fig. 7). Also, when the electric motor 33D rotates the screw shaft 33C in the reverse direction about the axis, the two distance sensors 31 and 32 and the sensor support member 33A are retracted (see Fig. 6).

[0039] Refer to Fig. 8. For example, assume that it passes through the center position of the substrate W or its vicinity, and there is a center line AX1 extending in the X direction. In this case, the two distance sensors 31 and 32 are arranged symmetrically in the Y direction with respect to the center line AX1. The distance SF1 from the center line AX1 to the first distance sensor 31 is approximately the same as the distance SF2 from the center line AX1 to the second distance sensor 32.

[0040] Also, from the position of the tip TA of the first distance sensor 31, the distance DA, and the distance SF1, the position (coordinates) of the point EA in the horizontal plane (XY direction) can be obtained. Also, from the position of the tip TB of the second distance sensor 32, the distance DB, and the distance SF2, the position (coordinates) of the point EB in the horizontal plane can be obtained. The center position of the substrate W (standard substrate WT) is calculated from the point EA, the point EB, and the diameter DM or radius of the substrate W (standard substrate WT).

[0041] FIG. 9 is a side view of the substrate transfer robot IR. FIG. 10 is a plan view of the hand 35. The substrate transfer robot IR has a hand 35 that supports a single substrate W and can move the hand 35. In addition to the hand 35, the substrate transfer robot IR includes an articulated arm 37 and a lifting table 39.

[0042] The hand 35 includes a hand body 41 and three or more (for example, four) guides 43. The hand body 41 is formed in a Y shape in plan view. The four guides 43 are formed on the upper surface of the hand body 41. The four guides 43 receive the peripheral portion of the substrate W. Each of the four guides 43 includes a receiving portion 43A and a guide wall 43B. The peripheral portion of the substrate W is placed on the four receiving portions 43A. The four guide walls 43B surround the substrate W placed on the four receiving portions 43A and restrict the movement of the substrate W in the horizontal direction (XY direction).

[0043] Note that, for example, if the substrate W is displaced on the horizontal plane and the substrate W is not surrounded by the four guide walls 43B but is placed on the guide walls 43B, conveyance troubles such as the substrate W falling from the hand 35 may occur.

[0044] The articulated arm 37 is composed of, for example, a scalar type robot arm. The base end portion (base end part) of the articulated arm 37 is attached to the lifting table 39. Also, the tip end portion (tip end part) of the articulated arm 37 is connected to the hand 35. The articulated arm 37 moves the hand 35 in the horizontal direction to perform substrate transfer. The articulated arm 37 is driven by a plurality of electric motors including the electric motor of a rotation drive unit 37D described later.

[0045] The multi-joint arm 37 includes, for example, a first arm 37A, a second arm 37B, a third arm 37C, and a rotary drive unit 37D. The base end portion of the first arm 37A is attached to the rotary drive unit 37D so as to be rotatable about the vertical axis AX2. The base end portion of the second arm 37B is attached to the tip end portion of the first arm 37A so as to be rotatable about the vertical axis AX3. The base end portion of the third arm 37C is attached to the tip end portion of the second arm 37B so as to be rotatable about the vertical axis AX4. Further, the tip end portion of the third arm 37C is connected to the base end portion of the hand 35. The rotary drive unit 37D includes an electric motor. The rotary drive unit 37D rotates the first arm 37A about the vertical axis AX2.

[0046] The rotary drive unit 37D includes a rotary encoder 45A that measures the amount of rotation of the first arm 37A about the vertical axis AX2. The first arm 37A includes a rotary encoder 45B that measures the amount of rotation of the second arm 37B about the vertical axis AX3. The second arm 37B includes a rotary encoder 45C that measures the amount of rotation of the third arm 37C about the vertical axis AX4. The XY-direction position of the hand 35 can be obtained by the three rotary encoders 45A to 45C. That is, the position of the hand 35 in the horizontal plane can be obtained.

[0047] The lifting table 39 raises and lowers the hand 35 and the multi-joint arm 37. The lifting table 39 includes a slider 39A, a guide rail 39B, a screw shaft 39C, an electric motor 39D, and a rotary encoder 39E. The slider 39A is fixed to, for example, the rotary drive unit 37D of the multi-joint arm 37. The guide rail 39B and the screw shaft 39C are each arranged so as to extend in the vertical direction (Z direction). The guide rail 39B and the screw shaft 39C each penetrate the slider 39A. The screw shaft 39C meshes with the internal thread 39F of the slider 39A. The output shaft of the electric motor 39D is connected to the lower end of the screw shaft 39C.

[0048] When the electric motor 39D rotates the screw shaft 39C in the forward direction about its axis, the slider 39A, the rotary drive unit 37D, and the hand 35 are raised. Also, when the electric motor 39D rotates the screw shaft 39C in the reverse direction about its axis, the slider 39A, the rotary drive unit 37D, and the hand 35 are lowered. The rotary encoder 39E measures the rotational movement amount of the output shaft of the electric motor 39D and the screw shaft, thereby measuring the height position of the hand 35. Although the rotary encoder 39E is used as the height position sensor, a linear encoder may be used instead of the rotary encoder 39E.

[0049] Refer to FIG. 1. The processing block 5 includes a plurality of processing units 49, a center robot CR, and a substrate mounting section PS. The substrate mounting section PS is provided between the substrate transfer robot IR and the center robot CR. The substrate mounting section PS can mount one or more substrates W.

[0050] The processing unit 49 performs a preset process on the substrate W. For example, each processing unit 49 includes, for example, a holding and rotating unit 51 and a nozzle 53. The holding and rotating unit 51 includes a spin chuck that holds one substrate W in a horizontal posture, and an electric motor that rotates the spin chuck about a vertical axis passing through the center of the substrate W. The nozzle 53 discharges a processing liquid onto the upper surface of the substrate W held by the holding and rotating unit 51.

[0051] The center robot CR includes a hand 55 that supports one substrate W in a horizontal posture. The center robot CR can move the hand 55. The center robot CR can transfer the substrate W between the plurality of processing units 49 and the substrate mounting section PS.

[0052] The center robot CR includes a forward and backward movement unit 57 and a lifting and rotating unit 59 in addition to the hand 55. The forward and backward movement unit 57 moves the hand 55 forward and backward. The lifting and rotating unit 59 rotates the hand 55 and the forward and backward movement unit 57 around the vertical axis AX5 to change the orientation of the hand 55. Further, the lifting and rotating unit 59 moves the hand 55 and the forward and backward movement unit 57 up and down in the vertical direction (Z direction). Each of the forward and backward movement unit 57 and the lifting and rotating unit 59 includes one or more electric motors.

[0053] In addition, the forward and backward movement unit 57 includes a position sensor (for example, a rotary encoder or a linear encoder) that measures the position when the hand 55 is moved forward and backward. The lifting and rotating unit 59 includes a direction sensor (for example, a rotary encoder) that detects the orientation of the hand 55 around the vertical axis AX5 and a height sensor (for example, a rotary encoder or a linear encoder) that detects the height position of the hand 55. The XY-direction position of the hand 55 can be obtained by the position sensor and the direction sensor.

[0054] FIG. 11 is a block diagram showing the control system of the substrate processing apparatus 1. The substrate processing apparatus 1 includes a control unit 61 and a storage unit 63. The control unit 61 controls each component of the substrate processing apparatus 1 (for example, the substrate transfer robot IR, the two distance sensors 31 and 32, and the lid attaching / detaching unit 11). The control unit 61 includes one or more processors such as a central processing unit (CPU). The storage unit 63 includes at least one of, for example, a ROM (Read-Only Memory), a RAM (Random-Access Memory), and an auxiliary storage device (for example, a hard disk). The storage unit 63 stores a computer program necessary for controlling each component of the substrate processing apparatus 1. Further, the diameter DM or the radius of each of the substrate W and the standard substrate WT is stored in the storage unit 63.

[0055] The substrate processing apparatus 1 includes a notification unit 65 and an input unit 67. The notification unit 65 notifies an operator of information by emitting at least one of sound and light. The notification unit 65 includes at least one of an electronic buzzer, a speaker, and an electric lamp. The input unit 67 includes at least one of a keyboard, a mouse, a joystick, a cross key, a button switch, and a touch panel.

[0056] <2. Operation of the Substrate Processing Apparatus> Next, the operation of the substrate processing apparatus 1 will be described with reference to the flowchart of FIG. 12. Steps S01 to S07 are steps for teaching processing (teaching work). Steps S11 to S14 are steps for transporting the substrate W (product substrate) and processing the substrate W. First, the teaching process of the substrate transfer robot IR will be described with reference to steps S01 to S07.

[0057] The teaching process in this description is an operation of teaching the substrate transfer robot IR the positions when taking out the substrate W from within the carrier C placed on the carrier placement unit 7 or storing the substrate W within the carrier C.

[0058] First, the standard carrier CT is placed on one of the carrier placement units 7. The standard carrier CT is, for example, a carrier C that is not deformed and is formed substantially according to the design values. That is, the standard carrier CT is a good-quality carrier C. Also, the standard carrier CT and the standard substrate WT (described later) may be formed of a metal (for example, aluminum).

[0059] The standard carrier CT is configured to be able to accommodate 25 standard substrates WT, similar to the carrier C shown in FIGS. 2 and 3. The standard carrier CT placed on the carrier placement unit 7 accommodates two standard substrates WT in the lowermost slot SL1 and the uppermost slot SL25. The standard substrate WT is also, for example, a substrate W that is not distorted and is formed substantially according to the design values. The two standard substrates WT are stored at preset positions within two slots SL1, SL25 of the standard carrier CT. Note that the standard carrier CT is assumed to have no lid portion 17 attached thereto.

[0060] After being transported to the standard carrier CT on one carrier placement unit 7, the lid attachment / detachment unit 11 retracts the shutter unit 19 and then lowers the shutter unit 19 to the position shown by the solid line in FIG. 4. Thereby, the passage port 9C provided in the front wall portion 9A is released, and the substrate transfer robot IR can access the inside of the standard carrier CT.

[0061] 〔Step S01〕Acquisition of the teaching position related to the substrate in slot SL1 The operator causes the control unit 61 to control the substrate transfer robot IR via the input unit 67. As shown in FIG. 13, the substrate transfer robot IR enters the hand 35 into the standard carrier CT so as to be positioned below the standard substrate WT stored in the slot SL1. Thereafter, as shown in FIG. 14, the substrate transfer robot IR raises the hand 35 so that the upper surface of the hand 35 (the four receiving portions 43A of the four guides 43) firmly contacts the lower surface of the standard substrate WT in the slot SL1. This operation is visually confirmed by the operator, for example.

[0062] Once the operator confirms contact with the standard substrate WT, the position (coordinates in the XYZ directions) of the hand 35 is registered. That is, the operator causes the control unit 61 to acquire position data from the four rotary encoders 39E, 45A to 45C through the input unit 67 and set it as the teaching position TP1. For example, when the hand 35 is at the teaching position TP1, it is assumed that the position of the symbol FP shown in FIGS. 9 and 10 is at the teaching position TP1. The control unit 61 stores the teaching position TP1 in the storage unit 63.

[0063] [Step S02] Acquisition of the teaching position related to the substrate in the slot SL25 After that, the operator causes the control unit 61 to control the substrate transfer robot IR via the input unit 67. The substrate transfer robot IR causes the hand 35 to enter the standard carrier CT so as to be positioned below the standard substrate WT stored in the slot SL25. After that, the substrate transfer robot IR raises the hand 35 in order to pick up the standard substrate WT, thereby firmly contacting the upper surface of the hand 35 with the lower surface of the standard substrate WT in the slot SL25.

[0064] Once the operator confirms contact with the standard substrate WT, the position (coordinates in the XYZ directions) of the hand 35 is registered. That is, the operator causes the control unit 61 to acquire from the four rotary encoders 39E, 45A to 45C through the input unit 67 and set it as the teaching position TP25. For example, when the hand 35 is at the teaching position TP25, it is assumed that the position of the symbol FP shown in FIGS. 9 and 10 is at the teaching position TP25. The control unit 61 stores the teaching position TP25 in the storage unit 63.

[0065] [Step S03] Calculation of the teaching positions related to the slots SL2 to SL24 The teaching positions TP2 to TP24 related to the slots SL2 to SL24 are calculated by the control unit 61. First, the reason for the calculation will be explained. The carrier placement unit 7 has individual differences. Therefore, when either the carrier C or the standard carrier CT is placed on the carrier placement unit 7, it tilts in one of the XY directions. Due to this unique tilt, a certain relationship in the XYZ directions can be understood and thus calculated.

[0066] Therefore, the control unit 61 calculates 23 teaching positions TP2 to TP24 between the two teaching positions TP1 and TP25 from the geometric relationship between the two teaching positions TP1 and TP25.

[0067] Specifically, as shown in FIGS. 15 and 16, the control unit 61 calculates 23 teaching positions TP2 to TP24 (coordinates in the XYZ directions) such that the 25 teaching positions TP1 to TP25 are arranged at equal intervals on the straight line LN1 connecting the two teaching positions TP1 and TP25. When calculating this, the two teaching positions TP1 and TP25 do not change. The 25 teaching positions TP1 to TP25 are stored in the storage unit 63.

[0068] More specifically, as shown in FIG. 15, the control unit 61 calculates the Z components of the 23 teaching positions TP2 to TP24 such that the Z components of the 25 teaching positions TP1 to TP25 are arranged at equal intervals on the Z component of the straight line LN1 connecting the two teaching positions TP1 and TP25.

[0069] Also, as shown in FIG. 16, the control unit 61 calculates the X components of the 23 teaching positions TP2 to TP24 such that the X components of the 25 teaching positions TP1 to TP25 are arranged at equal intervals on the X component of the straight line LN1 connecting the two teaching positions TP1 and TP25. Further, the control unit 61 calculates the Y components of the 23 teaching positions TP2 to TP24 such that the Y components of the 25 teaching positions TP1 to TP25 are arranged at equal intervals on the Y component of the straight line LN1 connecting the two teaching positions TP1 and TP25.

[0070] [Step S04] Calculation of the standard center position of the substrate of the slot SL1 The operator retracts the hand 35 to a position where it does not interfere with the operations of the lid attaching / detaching unit 11 and the sensor moving unit 33 via the input unit 67. The standard carrier CT remains placed on one of the carrier placement units 7.

[0071] Thereafter, the operator causes the control unit 61 to control the lid attaching / detaching unit 11, the sensor moving unit 33, and the two distance sensors 31, 32 via the input unit 67. The shutter elevating unit 23 of the lid attaching / detaching unit 11 raises the two distance sensors 31, 32 to a height position facing the standard substrate WT of the slot SL1 in the standard carrier CT. Thereafter, the sensor moving unit 33 advances the two distance sensors 31, 32 from the standby position to the measurement position MEP shown in FIG. 7. As a result, the two distance sensors 31, 32 are in a state where they can measure.

[0072] Thereafter, as shown by the broken line in FIG. 17, the two distance sensors 31, 32 each irradiate the peripheral portion of the standard substrate WT of the slot SL1 with laser light. As a result, the first distance sensor 31 measures the distance DA1 to the point EA1 on the peripheral portion of the standard substrate WT as shown in FIG. 8. Also, the second distance sensor 32 measures the distance DB1 to the point EB1 on the peripheral portion of the standard substrate WT. The two measured distances DA1, DB1 are stored in the storage unit 63.

[0073] Also, the control unit 61 calculates the center position (coordinates in the X direction and coordinates in the Y direction) of the horizontal plane (XY direction) of the standard substrate WT of the slot SL1 based on the two distances DA1, DB1 and the diameter DM or radius of the standard substrate WT. The calculated center position is stored in the storage unit 63 as the coordinates in the XY direction of the standard center position DP1.

[0074] Further, the height sensor 25 of the lid attachment / detachment unit 11 measures the height positions of the two distance sensors 31 and 32 at which the distances DA1 and DB1 are measured, that is, the height positions of points EA1 and EB1. The height positions of points EA1 and EB1, or their average height position, are stored in the storage unit 63 as the Z-direction coordinates of the standard center position DP1.

[0075] [Step S05] Calculation of the standard center position related to the substrate of slot SL25 The shutter lifting unit 23 raises the two distance sensors 31 and 32 to the height position facing the standard substrate WT of the slot SL25 in the standard carrier CT. The two distance sensors 31 and 32 remain in the state of being moved to the measurement position MEP.

[0076] Thereafter, as shown by the solid line in FIG. 17, the two distance sensors 31 and 32 each irradiate the peripheral edge of the standard substrate WT of the slot SL25 with laser light. As a result, the first distance sensor 31 measures the distance DA25 to the point EA25 on the peripheral edge of the standard substrate WT. Also, the second distance sensor 32 measures the distance DB25 to the point EB25 on the peripheral edge of the standard substrate WT. The two measured distances DA25 and DB25 are stored in the storage unit 63.

[0077] Further, the control unit 61 calculates the center position (coordinates in the X direction and coordinates in the Y direction) of the horizontal plane (XY direction) of the standard substrate WT of the slot SL25 based on the two distances DA25 and DB25 and the diameter DM or radius of the standard substrate WT. The calculated center position is stored in the storage unit 63 as the XY-direction coordinates of the standard center position DP25.

[0078] Further, the height sensor 25 of the lid attachment / detachment unit 11 measures the height positions of the two distance sensors 31 and 32 at which the distances DA25 and DB25 are measured, that is, the height positions of points EA25 and EB25. The height positions of points EA25 and EB25, or their average height position, are stored in the storage unit 63 as the Z-direction coordinates of the standard center position DP25.

[0079] [Step S06] Calculation of the standard center positions related to slots SL2 to SL24 The control unit 61 calculates 23 standard center positions DP2 to DP24 related to slots SL2 to SL24 in the same way as in step S03.

[0080] The control unit 61 calculates 23 standard center positions DP2 to DP24 between the two standard center positions DP1 and DP25 from the geometric relationship between the two standard center positions DP1 and DP25.

[0081] Specifically, as shown in FIGS. 18 and 19, the control unit 61 calculates 23 standard center positions DP2 to DP24 on the straight line LN2 connecting the standard center positions DP1 and DP25 so that the 25 standard center positions DP1 to DP25 are arranged at equal intervals. At the time of this calculation, the two standard center positions DP1 and DP25 do not change. The standard center positions DP1 to DP25 (coordinates in the XYZ directions) are stored in the storage unit 63.

[0082] Although the standard center positions DP1 and DP25 are calculated in the order of step S04 and step S05, they may be calculated in the order of step S05 and step S04. The same applies to steps S01 and S02.

[0083] 〔Step S07〕Association between teaching position and standard center position Thereafter, the control unit 61 associates the 25 standard center positions DP1 to DP25 with the 25 teaching positions TP1 to TP25, respectively.

[0084] For example, the standard center position DP1 is associated with the teaching position TP1. The standard center position DP2 is associated with the teaching position TP2. The standard center position DP3 is associated with the teaching position TP3. The standard center position DP25 is associated with the teaching position TP25. Note that the timing of the association is not limited to the timing after step S06.

[0085] As a result, the teaching process of the substrate transfer robot IR related to one carrier placement unit 7 is completed. For example, after measuring the distances DA25 and DB25 in step S05, the sensor moving unit 33 of the lid attaching / detaching unit 11 retracts the two distance sensors 31 and 32 to the standby position. Thereafter, the shutter advancing / retreating unit 21 and the shutter elevating unit 23 close the passage port 9C with the shutter unit 19.

[0086] Thereafter, a standard carrier CT containing two standard substrates WT is moved from one carrier placement unit 7 to the other carrier placement unit 7. Similar to steps S01 to S07, the teaching process of the substrate transfer robot IR related to the other carrier placement unit 7 is performed. That is, the teaching process of the substrate transfer robot IR is performed for each carrier placement unit 7.

[0087] Next, with reference to steps S11 to S14, the transfer of the substrate W (product substrate) and the processing of the substrate W will be described.

[0088] A carrier C that houses 25 substrates W is placed on one side of the carrier placement unit 7. The lid attaching / detaching unit 11 removes the lid 17 of the carrier C placed on the carrier placement unit 7 and holds the removed lid 17. The shutter advancing / retreating unit 21 of the lid attaching / detaching unit 11 retracts the lid 17 to the side of the substrate transfer robot IR. As a result, the passage port 9C is opened. The shutter elevating unit 23 of the lid attaching / detaching unit 11 slightly lowers the shutter unit 19 in order to move (advance) the two distance sensors 31 and 32 into the carrier C.

[0089] 〔Step S11〕Calculation of the central positions of the substrates (product substrates) in slots SL1 to SL25 Thereafter, the sensor moving unit 33 moves (advances) the two distance sensors 31 and 32 from the standby position to the measurement position MEP. Thereafter, the shutter elevating unit 23 lowers the two distance sensors 31 and 32 in order to detect the presence or absence of the substrate W and to measure the two distances DA and DB (see FIG. 20). Note that the direction in which the two distance sensors 31 and 32 are moved may be upward.

[0090] During the descent of the two distance sensors 31 and 32, the two distance sensors 31 and 32 measure two distances DA (DA1 to DA25) and DB (DB1 to DB25) between the two distance sensors 31 and 32 and two different points EA (EA1 to EA25) and EB (EB1 to EB25) on the peripheral edges of each substrate W stored in the carrier C placed on the carrier placement section 7, respectively.

[0091] For example, the two distance sensors 31 and 32 measure two distances DA25 and DB25 to two different points EA25 and EB25 on the peripheral edge of the substrate W stored in the slot SL25, respectively. Also, the two distance sensors 31 and 32 measure two distances DA24 and DB24 to two different points EA24 and EB24 on the peripheral edge of the substrate W stored in the slot SL24, respectively. Further, the two distance sensors 31 and 32 measure two distances DA1 and DB1 to two different points EA1 and EB1 on the peripheral edge of the substrate W stored in the slot SL1, respectively.

[0092] Also, the control unit 61 calculates the central position CP (CP1 to CP25) of each substrate in the horizontal plane (XY direction) based on the two distances DA and DB corresponding to each substrate W and the diameter DM or radius of each substrate W.

[0093] For example, based on the two distances DA25 and DB25 corresponding to the substrate W stored in the slot SL25 and the diameter DM (e.g., 300 mm) or radius (e.g., 150 mm) of the substrate W, the central position CP25 of the substrate W stored in the slot SL25 in the horizontal plane is calculated.

[0094] Also, based on the two distances DA24 and DB24 corresponding to the substrate W stored in the slot SL24 and the diameter DM or radius of the substrate W, the central position CP24 of the substrate W stored in the slot SL24 in the horizontal plane is calculated. Further, based on the two distances DA1 and DB1 corresponding to the substrate W stored in the slot SL1 and the diameter DM or radius of the substrate W, the central position CP1 of the substrate W stored in the slot SL1 in the horizontal plane is calculated.

[0095] In addition, the height sensor 25 of the lid removal unit 11 measures the height positions of the two distance sensors 31 and 32 at which 25 sets of distances DA and DB (DA1 to DA25, DB1 to DB25) are respectively measured, that is, the height positions of points EA and EB. The height positions of points EA and EB, or their average height position (for example, the average height position of two points EA1 and EB1), are stored in the storage unit 63 as the Z-direction coordinates of the center position CP. That is, 25 height positions (Z-direction coordinates) corresponding to the 25 substrates W are stored in the storage unit 63.

[0096] In addition, the two distance sensors 31 and 32 also detect the presence or absence of the substrate W in the carrier C. For example, when the two distance sensors 31 and 32 output two distances DA25 and DB25 with respect to the slot SL25, the control unit 61 determines that there is a substrate W in the slot SL25. On the contrary, when the two distance sensors 31 and 32 do not output two distances DA25 and DB25 with respect to the slot SL25, the control unit 61 determines that there is no substrate W in the slot SL25. Further, even when the distances DA25 and DB25 are output, if they are not within a preset range, the control unit 61 determines that there is no substrate W in the slot SL25.

[0097] Twenty-five center positions CP1 to CP25 (XYZ-direction coordinates) including twenty-five height positions are stored in the storage unit 63. Also, twenty-five distances DA1 to DA25 and twenty-five distances DB1 to DB25 are stored in the storage unit 63. Information on the presence or absence of the twenty-five slots SL1 to SL25 is also stored in the storage unit 63.

[0098] 〔Step S12〕Correction of the teaching position Referring to FIG. 21, the control unit 61 calculates twenty-five position deviation amounts DF1 to DF25 (XYZ-direction position deviation amounts) of the twenty-five center positions CP1 to CP25 with reference to the twenty-five standard center positions DP1 to DP25.

[0099] The 25 slots SL1 to SL25 of the standard carrier CT (25 standard slots) respectively correspond to the 25 slots SL1 to SL25 of the carrier C. Therefore, for example, the slot SL25 of the standard carrier CT corresponds to the slot SL25 of the carrier C.

[0100] In this case, based on the standard center position DP25 related to the slot SL25 of the standard carrier CT, the displacement amount DF25 of the center position CP25 corresponding to the substrate W stored in the slot SL25 of the carrier C is calculated. That is, the displacement amount DF25 is calculated as the difference between the center position CP25 and the standard center position DP25 (displacement amount DF25 = center position CP25 - standard center position DP25).

[0101] Similarly, the slot SL24 of the standard carrier CT corresponds to the slot SL24 of the carrier C. In this case, based on the standard center position DP24 related to the slot SL24 of the standard carrier CT, the displacement amount DF24 of the center position CP24 corresponding to the substrate W stored in the slot SL24 of the carrier C is calculated (displacement amount DF24 = center position CP24 - standard center position DP24).

[0102] Similarly, the slot SL1 of the standard carrier CT corresponds to the slot SL1 of the carrier C. In this case, based on the standard center position DP1, the displacement amount DF1 of the center position CP1 is calculated (displacement amount DF1 = center position CP1 - standard center position DP1).

[0103] In addition, the control unit 61 corrects the 25 teaching positions TP1 to TP25 associated with the 25 standard center positions DP1 to DP25 by using the 25 displacement amounts DF1 to DF25 (displacement amounts in the XYZ directions). The corrected 25 teaching positions TP1 to TP25 are called the 25 corrected teaching positions RTP1 to RTP25. The 25 displacement amounts DF1 to DF25 and the 25 corrected teaching positions RTP1 to RTP25 (coordinates in the XYZ directions) are stored in the storage unit 63.

[0104] In addition, when any one of the 25 position shift amounts DF1 to DF25 exceeds a preset range, the control unit 61 notifies the operator through the notification unit 65 that the range has been exceeded. When the position shift amount DF exceeds the preset range, there is a possibility that the substrate W cannot be placed inside the four guide walls 43B of the four guides 43 shown in FIG. 10. In this case, during the conveyance of the substrate W, conveyance troubles such as the substrate W falling from the hand 35 may occur. By the notification of the notification unit 65, it is possible to avoid in advance the conveyance troubles that may occur even if the teaching position TP is corrected.

[0105] 〔Step S13〕Substrate conveyance Thereafter, based on the 25 corrected teaching positions RTP1 to RTP25, the substrate transfer robot IR uses the hand 35 to take out the 25 substrates W one by one from the carrier C placed on the carrier placement unit 7. The substrate transfer robot IR conveys the taken-out substrate W to the substrate placement unit PS.

[0106] The center robot CR takes the substrate W from the substrate placement unit PS and conveys the substrate W to any one of the plurality of processing units 49. Each processing unit 49 performs a preset process (for example, a cleaning process with pure water) on the substrate W conveyed by the center robot CR.

[0107] The center robot CR takes out the processed substrate W on which the preset process has been performed from any one of the plurality of processing units 61 and conveys the substrate W to the substrate placement unit PS. The substrate transfer robot IR takes out the processed substrate W from the substrate placement unit PS and returns the substrate W to the carrier C on the carrier placement unit 7. When returning the substrate W, the substrate transfer robot IR uses the hand 35 to return the 25 substrates W one by one to the carrier C based on the 25 corrected teaching positions RTP1 to RTP25.

[0108] 〔Step S14〕Repeat? When processing the substrate W (product substrate) stored in another carrier C using the processing unit 49, the process returns to step S11. When performing the teaching process again, the flowchart shown in FIG. 12 is terminated and the process returns to step S01.

[0109] According to this embodiment, two distance sensors 31 and 32 are provided, which are horizontally arranged so as to face a plurality of substrates W in the carrier C through the outlet 14. During the movement of the two distance sensors 31 and 32, the control unit 61 measures two distances DA and DB from the two distance sensors 31 and 32 to two different points EA and EB on the peripheral edge of each substrate W in the carrier C placed on the carrier placement unit 7. Further, the control unit 61 calculates the center position CT of the horizontal plane of each substrate W from the two distances DA and DB of each substrate W and the diameter DM or radius of each substrate W. The calculated center position CT in the horizontal plane indicates the exact position of the substrate W. Therefore, even if the substrate W is misaligned in the horizontal plane, it is possible to prevent the transfer trouble of the substrate W by the substrate transfer robot IR.

[0110] For example, the position for taking the standard substrate WT stored in the slot SL1 of the standard carrier CT with the hand 35 is set as the teaching position TP1. Also, two distances DA1 and DB1 to the standard substrate WT are measured by the two distance sensors 31 and 32, respectively. Then, the standard center position DP1 is calculated based on the two distances DA1 and DB1 and the diameter DM or radius of the standard substrate WT. The standard center position DP1 is associated with the teaching position TP1. The displacement amount DF1 of the center position CT1 related to the substrate W stored in the slot SL1 of the carrier C corresponding to the slot SL1 of the standard carrier CT is calculated based on the standard center position DP1. The teaching position TP1 is corrected using the calculated displacement amount DF1. Therefore, the teaching position TP1 in the horizontal plane can be corrected well.

[0111] Teaching processing is executed for the lowermost slot SL1 and the uppermost slot SL25 of the standard carrier CT, and for at least one of the slots SL2 to SL24 therebetween, it is calculated from geometric relationships. Therefore, teaching processing can be easily performed.

[0112] For example, the slot SL1 of the standard carrier CT corresponds to the first standard slot of the present invention. The slot SL25 of the standard carrier CT corresponds to the second standard slot of the present invention. At least one of the 23 slots SL2 to SL24 of the standard carrier CT corresponds to the third standard slot of the present invention.

[0113] Also, for example, the teaching position TP1 corresponds to the first teaching position of the present invention. The teaching position TP25 corresponds to the second teaching position of the present invention. At least one of the 23 teaching positions TP2 to TP24 corresponds to the third teaching position of the present invention.

[0114] Also, for example, the standard center position DP1 corresponds to the first standard center position of the present invention. The standard center position DP25 corresponds to the second standard center position of the present invention. At least one of the 23 standard center positions DP2 to DP24 corresponds to the third standard center position of the present invention. Also, the diameter DM or the radius corresponds to the diameter of the present invention.

Example 2

[0115] Next, Example 2 of the present invention will be described with reference to the drawings. Note that descriptions overlapping with Example 1 are omitted.

[0116] In Example 1, the two distance sensors 31, 32 were provided on the upper surface of the shutter unit 19 via the sensor moving unit 33. In this regard, as shown in FIG. 22, it may be provided separately from the lid attaching / detaching unit 11 and the substrate transfer robot IR.

[0117] Refer to FIGS. 22 and 23. The index block 3 includes a sensor unit 71. The sensor unit 71 includes two distance sensors 31, 32, a sensor support member 73, a forward / backward movement unit 75, a lifting unit 76, and a height sensor 78. The sensor support member 73 supports the two distance sensors 31, 32 arranged in the Y direction.

[0118] The forward / backward movement unit 75 moves the two distance sensors 31, 32 and the sensor support member 73 forward and backward in the X direction. The lifting unit 76 moves the two distance sensors 31, 32, the sensor support member 73, and the forward / backward movement unit 75 in the vertical direction (Z direction). The forward / backward movement unit 75 and the lifting unit 76 each include an electric motor. The height sensor 78 is composed of, for example, a linear encoder or a rotary encoder.

[0119] The sensor unit 71 moves the two distance sensors 31, 32, etc. so as not to interfere with the lid attaching / detaching unit 11. As shown by the dashed line in FIG. 22, the sensor unit 71 waits for the two distance sensors 31, 32 at a position where they do not interfere with the substrate transfer by the substrate transfer robot IR. Also, as shown by the solid line in FIG. 22, when measuring the distance, the sensor unit 71 moves the two distance sensors 31, 32 to the measurement position MEP (see FIG. 8) in the carrier C placed on the carrier placement unit 7.

[0120] When the index block 3 includes the sensor unit 71 and the lid attaching / detaching unit 11 is unnecessary, the index block 3 may not include the lid attaching / detaching unit 11.

Example 3

[0121] Next, Example 3 of the present invention will be described with reference to the drawings. Note that descriptions overlapping with those of Examples 1 and 2 are omitted.

[0122] In Example 1, the substrate transfer robot IR included one hand 35. In this regard, in Example 3, the substrate transfer robot IR may include two or more hands 35.

[0123] Refer to FIG. 24. The substrate transfer robot IR includes, for example, five hands 35 and a hand connecting member 81. Each of the five hands 35 supports one substrate W. The five hands 35 are arranged vertically at an interval of, for example, 10 mm, like the interval of the shelf portions 15 of the carrier C. The hand connecting member 81 is connected to the five hands 35. Therefore, the substrate transfer robot IR can move the hands 35 integrally.

[0124] In the flowchart of FIG. 12, the teaching position TP may be obtained and the teaching position TP may be corrected as follows. For example, it is assumed that a standard substrate WT is stored in the slot SL3 (the third row from the bottom) of the standard carrier CT placed on the carrier placement portion 7. Also, the third hand 35 from the bottom of the five hands 35 is indicated by reference numeral 35A.

[0125] In step S01, first, the substrate transfer robot IR causes the five hands 35 to enter the standard carrier CT so that the hand 35A is disposed below the standard substrate WT. Then, the substrate transfer robot IR raises the five hands 35 to bring the upper surface of the hand 35A into contact with the lower surface of the standard substrate WT in the slot SL3. The control unit 61 obtains position data from the four rotary encoders 39E, 45A to 45C regarding the position where the hand 35A contacts, and sets it as the teaching position TP3. For example, it is assumed that when the five hands 35 are at the teaching position TP3, the position indicated by reference numeral FP shown in FIG. 24 is at the teaching position TP3.

[0126] In step S04, the shutter elevating unit 23 moves the two distance sensors 31, 32 to the height position corresponding to the standard substrate WT stored in the slot SL3 of the standard carrier CT. Then, the control unit 61 obtains two distances DA3, DB3 related to the standard substrate WT by the two distance sensors 31, 32. Then, the control unit 61 calculates the standard center position DP3 of the standard substrate WT on the horizontal plane based on the two distances DA3, DB3, etc. Also, in step S07, the standard center position DP3 is associated with the teaching position TP1.

[0127] In step S11, the control unit 61 calculates the center positions CP1 to CP25 for the 25 substrates W in the carrier C. Further, when the five hands 35 support five substrates W, the control unit 61 calculates the average value of the five center positions CP1 to CP5 in the horizontal plane corresponding to the five substrates.

[0128] In step S12, the control unit 61 calculates the amount of deviation DF3 of the position of the average value of the center positions CP1 to CP5 corresponding to the five substrates W with respect to the standard center position DP3. The control unit 61 corrects the teaching position TP3 associated with the standard center position DP3 using the amount of deviation DF3 of the average value.

[0129] Based on the corrected teaching position TP3 (i.e., the corrected teaching position RTP3), the control unit 61 conveys the five substrates W from the carrier C to the slots SL1 to SL5 by the substrate transfer robot IR. That is, the control unit 61 conveys the five substrates W from the carrier C by the substrate transfer robot IR based on the average value of the five center positions CP1 to CP5.

[0130] According to this embodiment, for example, when the five hands 35 are moved integrally, the average value of the five center positions CT corresponding to the five substrates W supported by the five hands 35 is calculated, and the five substrates W are conveyed based on the average value. Therefore, even if the substrate W is displaced in the horizontal plane, it is possible to prevent troubles in conveying the substrate by the substrate transfer robot.

[0131] The present invention is not limited to the above-described embodiment and can be modified as follows.

[0132] (1) In the above-described Example 1, for example, the two distance sensors 31 and 32 are provided on the upper surface of the shutter unit 19 via the sensor moving unit 33. In this regard, as shown in FIG. 25, they may be provided at the tip of the hand 35 of the substrate transfer robot IR. Further, the substrate transfer robot IR may include another articulated arm 37, and two distance sensors 31 and 32 may be provided at the tip of the articulated arm 37.

[0133] (2) In the above-described Example 1, the two distance sensors 31 and 32 are provided on the upper surface of the shutter unit 19 via the sensor moving unit 33. In this regard, the two distance sensors 31 and 32 may be provided on the upper surface of the shutter unit 19 without passing through the sensor moving unit 33. In this case, the two distance sensors 31 and 32 measure the two distances DA and DB while being fixed to the upper surface of the shutter unit 19 without being moved in the X direction.

[0134] (3) In the above-described Example 1, the sensor moving unit 33 moves the two distance sensors 31 and 32 forward and backward in the X direction. In this regard, as shown in FIG. 26, the sensor moving unit 83 may swing the two distance sensors 31 and 32 respectively. The sensor moving unit 83 includes a swinging member 85 to which the distance sensor 31 is attached, a swinging member 87 to which the distance sensor 32 is attached, and at least one electric motor (not shown). The sensor moving unit 83 swings the distance sensor 31 around the vertical axis AX7 and swings the distance sensor 32 around the vertical axis AX8.

[0135] (4) In each of the above-described examples and modified examples, the 23 teaching positions TP2 to TP24 are obtained based on the two teaching positions TP1 and TP25. In this regard, the 23 teaching positions TP2 to TP24 may be obtained using the standard substrate WT stored in the standard carrier CT as in steps S01 and S02 shown in FIG. 12.

[0136] In addition, the 23 standard center positions DP2 to DP24 are obtained based on the two standard center positions DP1 and DP25. In this regard, the 23 standard center positions DP2 to DP24 may be obtained using the standard substrate WT stored in the standard carrier CT as in steps S04 and S05 shown in FIG. 12. Thereby, for all of the 25 substrates W of the carrier C, the teaching positions in the horizontal plane can be corrected well.

[0137] (5) In each of the above-described embodiments and each modification, the index block 3 includes two distance sensors 31 and 32. In this regard, the index block 3 may include three or more distance sensors. In other words, the index block 3 may include at least two distance sensors. The center position CP can be calculated with higher accuracy based on the three distances and the diameter DM or the radius.

[0138] (6) In each of the above-described embodiments and each modification, the substrate transfer robot IR includes an articulated arm 37 and a lifting table 39. In this regard, the substrate transfer robot IR may include a reciprocating unit 57 and a lifting and rotating unit 59 like the center robot CR.

Explanation of Reference Numerals

[0139] 1 … Substrate processing apparatus 7 … Carrier placement unit IR … Substrate transfer robot 11 … Cover attachment / detachment unit 14 … Outlet SL1~SL25 … Slots 23 … Shutter lifting unit 25 … Height sensor 31,32 … Distance sensors 35 … Hand 39E,45A~45C … Rotary encoders 61 … Control unit 63 … Storage unit 65 … Notification unit TP(TP1~TP25) … Teaching positions EA(EA1~EA25) … Points EB (EB1~EB25) … point DA (DA1~DA25) … distance DB (DB1~DB25) … distance DP (DP1~DP25) … standard center position CP (CP1~CP25) … center position DF (DF1~DF25) … amount of displacement RTP (RTP1~RTP25) … corrected teaching position DM … diameter 76 … lifting part 78 … height sensor C … carrier CT … standard carrier WT … standard substrate W … substrate

Claims

1. A carrier placement section for placing a processing carrier having a plurality of slots for storing a plurality of substrates in a horizontal posture arranged in the vertical direction and a carrier opening for taking in and out the plurality of substrates; A substrate transfer robot having a hand for supporting one substrate and capable of moving the hand; Two distance sensors arranged horizontally so as to face the plurality of substrates in the processing carrier through the carrier opening; A sensor lifting section for moving the two distance sensors in the vertical direction; A control section, and The control section Moves the two distance sensors in the vertical direction by the sensor lifting section, During the movement of the two distance sensors, the two distance sensors measure two distances between the two distance sensors and two different points on the peripheral edge of each substrate stored in the processing carrier placed on the carrier placement section, respectively, Based on the two distances corresponding to each substrate and the diameter of each substrate, calculates the central position of each substrate in the horizontal plane, Based on the central position of each substrate in the horizontal plane, the substrate transfer robot transfers the plurality of substrates from the processing carrier A substrate processing apparatus characterized by the above.

2. In the substrate processing apparatus according to Claim 1, The control section executes (1) a teaching process and (2) a teaching correction process, As the teaching process, (1-1) The substrate transfer robot causes the hand to enter a standard carrier placed on the carrier placement section, and sets, as a teaching position, a position for taking a standard substrate stored in a predetermined standard slot among a plurality of standard slots of the standard carrier with the hand, (1-2) The sensor lifting section moves the two distance sensors in the vertical direction to a height position corresponding to the standard substrate stored in the standard slot, (1-3) The two distance sensors measure two standard distances between the two distance sensors and two different points on the peripheral edge of the standard substrate stored in the standard slot, respectively, (1-4) Based on the two standard distances and the diameter of the standard substrate, calculates the standard central position of the standard substrate in the horizontal plane, (1-5) Associates the standard central position with the teaching position, And then, when transferring a substrate from the processing carrier, as the teaching correction process, ​ (2-1) Moving the two distance sensors vertically by the sensor lifting unit, (2-2) During the movement of the two distance sensors, measuring, by the two distance sensors, two distances between the two distance sensors and two different points on the peripheral edges of each substrate stored in the processing carrier placed on the carrier placement unit, respectively, (2-3) Calculating the central position of each substrate in the horizontal plane based on the two distances corresponding to each substrate and the diameter of each substrate, (2-4) Calculating the amount of displacement of the central position related to the substrate stored in the slot corresponding to the standard slot among the plurality of slots of the processing carrier, based on the standard central position, (2-5) Correcting the teaching position associated with the standard central position using the amount of displacement, and A substrate processing apparatus, characterized in that, based on the corrected teaching position, the substrate is conveyed from the processing carrier by the substrate transfer robot among the plurality of substrates.

3. In the substrate processing apparatus according to claim 2, the control unit performs the teaching process for all of the plurality of standard slots of the standard carrier, and performs the teaching correction process for all of the plurality of slots of the processing carrier. A substrate processing apparatus characterized by this.

4. In the substrate processing apparatus according to claim 2, the control unit executes the teaching process for the lowermost first standard slot and the uppermost second standard slot among the plurality of standard slots of the standard carrier, As the teaching process related to the third standard slot between the first standard slot and the second standard slot among the plurality of standard slots, calculating the third teaching position related to the third standard slot from the geometric relationship between the first teaching position related to the first standard slot and the second teaching position related to the second standard slot, calculating the third standard central position related to the third standard slot from the geometric relationship between the first standard central position related to the first standard slot and the second standard central position related to the second standard slot, associating the third standard central position with the third teaching position, and performing the teaching correction process for all of the plurality of slots of the processing carrier. A substrate processing apparatus characterized by this.

5. In the substrate processing apparatus according to claim 1, The substrate transfer robot has two or more hands including the hand, has the two or more hands each supporting one substrate, and can move the two or more hands integrally. When the two or more hands support two or more substrates among the plurality of substrates, the control unit calculates an average value of two or more of the central positions in the horizontal plane corresponding to the two or more substrates. Based on the average value, the substrate processing apparatus is characterized in that the two or more substrates are transferred from the processing carrier by the substrate transfer robot.

6. In the substrate processing apparatus according to claim 2, further comprising a notification unit that emits at least one of sound and light, when the amount of misalignment exceeds a preset range, the control unit emits at least one of sound and light by the notification unit. The substrate processing apparatus is characterized by this.

7. A carrier placement unit for placing a processing carrier having a plurality of slots for storing a plurality of substrates in a horizontal posture arranged in the vertical direction and a carrier opening for taking in and out the plurality of substrates, A substrate transfer robot having a hand for supporting one substrate and capable of moving the hand, Two distance sensors arranged horizontally so as to face the plurality of substrates in the processing carrier through the carrier opening, A sensor lifting unit for moving the two distance sensors in the vertical direction, A substrate transfer method of a substrate processing apparatus including: A sensor moving step of moving the two distance sensors in the vertical direction by the sensor lifting unit, During the movement of the two distance sensors, two distances between the two distance sensors and two different points on the peripheral edge of each substrate stored in the processing carrier placed on the carrier placement unit are measured by the two distance sensors respectively. A distance measuring step, A central position calculating step of calculating a central position of each substrate in the horizontal plane based on the two distances corresponding to each substrate and the diameter of each substrate, A transfer step of transferring the plurality of substrates from the processing carrier by the substrate transfer robot based on the central position of each substrate in the horizontal plane, A substrate transfer method characterized by comprising:

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