Enclosure for wireless implantable device with embedded power source

Abstract

To provide an improved sensor and a method for improving specimen measurement capability regarding an implantable device including specimen monitoring and power supply.SOLUTION: An implantable device includes a housing, circuitry within the housing, and a power source attached to the housing and electrically connected to the circuitry. The device may include electrically conductive connectors configured to electrically connect positive and negative terminals of the power source to the circuitry. The device may include a power source terminal enclosure attached to the power source and configured to enclose the positive and negative terminals of the power source. The power source terminal enclosure may include holes through which the electrically conductive connectors pass. The device may include a housing cap enclosure attached to the power source terminal enclosure and to an open end of the housing. The housing cap enclosure may enclose the circuitry within the housing and includes passages through which the electrically conductive connectors pass.SELECTED DRAWING: None

Description

Technical Field

[0001] Cross - Reference to Related Applications

[0001] This application claims the benefit of priority of U.S. Provisional Application No. 62 / 994,809, filed on March 25, 2020, which is hereby incorporated by reference in its entirety.

[0002]

[0002] Field of the Invention

[0003] The present invention generally relates to specimen monitoring and also to implantable devices including a power source.

Background Art

[0003]

[0004] Consideration of the Background

[0005] Implantable sensors without charge - storage devices may rely exclusively on an external device for the operating power (e.g., to perform measurements and operate their circuits to transmit data to the external device). The sensor and the external device may each include an inductive element (e.g., a coil). The sensor can receive power from the external device when the external device uses its inductive element to generate an electrodynamic field and the inductive element of the sensor and the external device are magnetically coupled within the electrodynamic field. However, without an internal power source, when the sensor is not located in the vicinity of the external device (i.e., when the inductive element of the sensor and the external device are not coupled within the electrodynamic field generated by the external device), the sensor is in a quiescent state.

[0004]

[0006] For example, a sensor without a charge storage device may be implanted in the arm of a human patient, and when the human patient wears an armband having an external device therein, the sensor may be disposed in the vicinity of the external device. The sensor can perform a sample measurement and transmit data to the external device while the patient is wearing the armband, but the sensor cannot perform a sample measurement while the patient is not wearing the armband (e.g., because the human patient is swimming or taking a shower), and as a result, there will be a gap in the sample measurement information. SUMMARY OF THE INVENTION PROBLEM TO BE SOLVED BY THE INVENTION

[0005]

[0007] Accordingly, there is a need for an improved sensor and a method of using the same to improve the ability of the sensor to perform sample measurements. MEANS FOR SOLVING THE PROBLEM

[0006]

[0008] One aspect of the present invention can provide an implantable device including a housing, a circuit, a power source, a conductive connector, a power terminal enclosure, and a housing cap enclosure. The power source may be attached to the housing. The power source may include a positive terminal and a negative terminal electrically connected to the circuit. The conductive connector may be configured to electrically connect the positive and negative terminals of the power source to the circuit. The power terminal enclosure may be attached to the power source and configured to seal the positive and negative terminals of the power source. The housing cap enclosure may be attached to the power terminal enclosure and also attached to the open end of the housing, and the housing cap enclosure seals the circuit within the housing.

[0007]

[0009] In some embodiments, the power terminal enclosure may include a hole through which the conductive connector passes. In some embodiments, the housing cap enclosure, It may include a passage through which the conductive connector passes. In some embodiments, the housing cap enclosure may include a passage through which one or more supports attached to and extending from the power source pass.

[0008]

[0010] In some embodiments, the device may further include a spring configured to establish an electrical connection between a certain connector among the conductive connectors and the positive terminal of the power source. In some embodiments, the power source terminal enclosure may seal the spring.

[0009]

[0011] In some embodiments, the device may further include one or more supports attached to and extending from the power source, and the one or more supports may be configured to support the attachment of the power source to the housing. In some embodiments, the one or more supports may have a diameter larger than the diameter of the conductive connector. In some embodiments, the support may be made of a non-conductive material. In some embodiments, the power source terminal enclosure may include a hole through which the support passes. In some embodiments, the housing cap enclosure may include a passage through which the support passes.

[0010]

[0012] In some embodiments, the device may further include one or more substrates within the housing, and the circuit may include one or more circuit components mounted on or created within the one or more substrates. In some embodiments, the one or more circuit components may include one or more light sources and one or more light receivers.

[0011]

[0013] In some embodiments, the circuit may include an inductive element. In some embodiments, the inductive element may include a conductor and a magnetic core. In some embodiments, the device may further include one or more analyte indicators on or in a portion of the outer surface of the housing. In some embodiments, the power source may be a battery. In some embodiments, the device may be hermetically sealed. In some embodiments, the implantable device may further include a drug-eluting polymer matrix that coats at least a portion of the power terminal enclosure and / or the housing cap enclosure.

[0012]

[0014] Another aspect of the present invention may provide a method of manufacturing an implantable device. The method may include placing a circuit within a housing. The method may include filling the housing with epoxy up to an initial epoxy fill line after placing the circuit within the housing. The method may include curing the epoxy after filling the housing with epoxy up to the initial epoxy fill line. The method may include connecting a conductive connector to a contact pad of the circuit. The method may include placing the conductive connector within a passage of a housing cap enclosure. The method may include filling the remaining space within the housing between the initial epoxy fill line and the end of the housing with epoxy after placing the conductive connector within the passage of the housing cap enclosure. The method may include curing the epoxy in the remaining space within the housing between the initial epoxy fill line and the end of the housing.

[0013]

[0013]

[0015] In some embodiments, the method may further include placing one or more supports attached to the power source and extending from the power source within a passage of the housing cap enclosure. In some embodiments, the method may further include connecting the conductive connector to the positive and negative terminals of the power source.

[0014]

[0016] In some embodiments, connecting the conductive connectors to the positive and negative terminals of the power source may include pressing a spring at the end of one of the conductive connectors against the positive terminal of the power source and compressing the spring. In some embodiments, after arranging the conductive connectors within the passage of the housing cap enclosure, the surface of the housing cap enclosure abuts against the power terminal enclosure attached to the power source, sealing the positive and negative terminals of the power source. After arranging the conductive connectors within the passage of the housing cap enclosure, the surface of the housing cap enclosure abuts against the power terminal enclosure attached to the power source, sealing the positive and negative terminals of the power source.

[0015]

[0017] Yet another aspect of the present invention may provide an embedded device including a housing, a circuit at least partially within the housing, a power source, first and second conductive connectors, and a coupler. The power source may include a positive terminal and a negative terminal electrically connected to the circuit. The first conductive connector may be configured to electrically connect the positive terminal of the power source to the circuit. The second conductive connector may be configured to electrically connect the negative terminal of the power source to the circuit. The coupler may be between the housing and the power source. The coupler may be attached to the power source and may include one or more supports extending from the coupler into the housing.

[0016]

[0018] In some embodiments, the coupler may include the second conductive connector. In some embodiments, the one or more supports may be made of a non-conductive material. In some embodiments, the coupler may have a cylindrical portion and one or more supports may extend from the cylindrical portion.

[0017]

[0019] In some embodiments, the device may include one or more substrates within the housing, and the circuit may include one or more circuit components mounted on or formed within the one or more substrates. In some embodiments, the one or more circuit components may include one or more light sources and one or more light receivers.

[0018]

[0020] In some embodiments, the circuit may include an inductive element. In some embodiments, the inductive element may include a conductor and a magnetic core. In some embodiments, the inductive element may extend into the coupler.

[0019]

[0021] In some embodiments, the circuit may include contact pads, and the device may further include bonding wires that electrically connect the first and second conductive connectors to the contact pads. In some embodiments, the device may include one or more analyte indicators on or in a portion of the outer surface of the housing. In some embodiments, the power source may be a battery. In some embodiments, the device may be hermetically sealed. In some embodiments, the device may include a spring configured to establish an electrical connection between the first conductive connector and the positive terminal of the power source. In some embodiments, the implantable device may further include a drug-eluting polymer matrix that coats at least a portion of the coupler.

[0020]

[0022] Yet another aspect of the present invention may provide a method of manufacturing an implantable device. The method may include placing a circuit within a housing. The method may include filling the housing with epoxy up to an initial epoxy fill line after placing the circuit within the housing. The method may include curing the epoxy after filling the housing with epoxy up to the initial epoxy fill line. The method may include inserting one or more supports of the coupler into the housing. The method may include connecting the first and second conductive connectors to the contact pads of the circuit with the one or more supports of the coupler inserted into the housing. The method may include attaching the coupler to a power source. The method may include filling at least the remaining space within the housing between the initial epoxy fill line and the end of the housing with epoxy. The method may include curing the epoxy in at least the remaining space within the housing between the initial epoxy fill line and the end of the housing.

[0021]

[0023] In some embodiments, attaching the coupler to the power source may include connecting a first conductive connector to the positive terminal of the power source. In some embodiments, connecting the first conductive connector to the positive terminal of the power source may include pressing a spring at the end of the first conductive connector against the positive terminal of the power source and compressing the spring.

[0022]

[0024] In some embodiments, attaching the coupler to the power source may include connecting a second conductive connector to the negative terminal of the power source. In some embodiments, after inserting one or more supports of the coupler into the housing, the surface of the coupler abuts against the surface of the housing.

[0023]

[0025] Further variations included in the system and method are described in the following detailed description of the invention.

[0024]

[0026] The accompanying drawings, which are incorporated herein and form a part of this specification, illustrate various non-limiting embodiments of the invention. In the drawings, like reference numerals indicate identical or functionally similar elements.

Brief Description of the Drawings

[0025]

Figure 1

[0027] It is a schematic diagram showing a system embodying an aspect of the present invention.

Figure 2A

[0028] It is a perspective view showing an embedded device embodying an aspect of the present invention.

Figure 2B

Figure 3A

[0029] It is a side view showing an embedded device embodying an aspect of the present invention.

Figure 3B

Figure 3E

Figure 3CD

[0030] FIG. 3C is a perspective view showing a housing of an implantable device and a coupler configured to attach a power supply, embodying an aspect of the present invention. FIG. 3D is a cross-sectional view showing a housing of an implantable device and a coupler configured to attach a power supply, embodying an aspect of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

[0026]

[0031] FIG. 1 is a schematic diagram of an exemplary system 50 embodying an aspect of the present invention. In some embodiments, system 50 may be a specimen monitoring system. In some embodiments, system 50 may be a continuous specimen monitoring system (e.g., a continuous glucose monitoring system). In some embodiments, system 50 may include one or more of implantable device 100, external device 101, and display device 107. In some embodiments, implantable device 100 may be a specimen sensor. In some embodiments, implantable device 100 may be a small, fully subcutaneous sensor that measures the amount or concentration of a specimen (e.g., glucose) in a medium (e.g., interstitial fluid) of a living animal (e.g., a living human). However, this is not essential, and in some alternative embodiments, implantable device 100 may be a partially implanted (e.g., transcutaneous) device. Additionally, while embodiments of the present invention are described with respect to a specimen monitoring system in which implantable device 100 is a specimen sensor, this is not essential. In some alternative embodiments, implantable device 100 is not a sensor, and instead, is a different type of implantable device, such as, for example, but not limited to, an insulin pump, a pacemaker, or an electrical / thermal therapy device.

[0027]

[0032] In some embodiments, the external device 101 may be an external wearable device (e.g., attached via an armband, wristband, waistband, or adhesive patch). In some embodiments, the external device 101 may communicate remotely with the implanted device 100 (e.g., via near-field communication (NFC)). In some embodiments, the external device 101 may communicate with the implanted device 100 to initiate a measurement and receive a measurement value from the implanted device 100. In some embodiments, the external device 101 may be a transceiver. In some embodiments, the external device 101 may be a smartphone (e.g., an NFC-enabled smartphone). In some embodiments, the external device 101 may wirelessly communicate information (e.g., one or more analyte measurement values) to a handheld application running on a display device 107 (e.g., a smartphone) (e.g., but not limited to, via a Bluetooth (trademark) communication standard such as Bluetooth Low Energy).

[0028]

[0033] FIG. 2A is a perspective view of an implanted device 100 of a system 50 according to some embodiments. FIG. 2B is a perspective view of portion A of the implanted device 100 as shown in FIG. 2A. FIG. 3A is a side view of an implanted device 100 of a system 50 according to some alternative embodiments. FIG. 3B is a side view of portion B of the implanted device 100 as shown in FIG. 3A. In some embodiments, the implanted device 100 may be a wireless analyte sensor. In some embodiments, the implanted device 100 may be an analyte sensor. In some embodiments, the analyte sensor may detect the presence, amount, and / or concentration of an analyte (e.g., glucose, oxygen, cardiac markers, low density lipoprotein (LDL), high density lipoprotein (HDL), or triglycerides). In some embodiments, the implanted device 100 may be an optical sensor (e.g., a fluorometer). In some embodiments, the implanted device 100 may be a chemical or biochemical sensor.

[0029]

[0034] In some embodiments, as shown in FIGS. 2A, 2B, 3A, and 3B, the implantable device 100 may include a power source 202, inductive elements 204, one or more substrates 206, and / or a housing 208. In some embodiments, the housing 208 may be a body, shell, capsule, or container. In some embodiments, the housing 208 may be rigid and / or biocompatible. In some embodiments, the housing 208 may include a polymer (e.g., PMMA) sleeve or a silicone tube. However, this is not essential, and in other embodiments, different materials and / or shapes may be used for the housing 208.

[0030]

[0035] In some embodiments, the implantable device 100 may include one or more analyte indicators (e.g., analyte indicator 334 in FIG. 3E), such as a polymer graft or hydrogel, that are coated, diffused, adhered, embedded, or grown on or in at least a portion of the outer surface of the housing 208. In some embodiments, as shown in FIGS. 2A and 3A, the housing 208 may include one or more cutouts or depressions 209, and one or more analyte indicators may be (partially or entirely) disposed in the cutouts or depressions 209. In some embodiments, one or more analyte indicators may be porous and may allow an analyte (e.g., glucose) in a medium (e.g., interstitial fluid) to diffuse into the one or more analyte indicators.

[0031]

[0036] In some embodiments, one or more analyte indicators may exhibit one or more detectable properties (e.g., optical properties) that vary according to the amount or concentration of an analyte in the vicinity of the one or more indicators. In some embodiments, one Alternatively, the one or more analyte indicators may emit a certain amount of radiant light that varies according to the amount or concentration of the analyte in the vicinity of the one or more indicators. In some embodiments, the one or more analyte indicators may include one or more analyte indicator molecules (e.g., fluorescent analyte indicator molecules) that may be distributed throughout the one or more analyte indicators. In some embodiments, the one or more analyte indicators may be phenylboron-based analyte indicators. However, phenylboron-based analyte indicators are not essential, and in some alternative embodiments, the implantable device 100 may include different analyte indicators, such as, but not limited to, glucose oxidase-based indicators, glucose dehydrogenase-based indicators, or glucose-binding protein-based indicators.

[0032]

[0037] In some embodiments, as shown in FIGS. 2A and 3A, the implantable device 100 may include one or more light sources 210 that emit excitation light over an excitation wavelength range. In some embodiments, the excitation wavelength range may be a range of wavelengths that interact with the analyte indicator (e.g., one or more of the analyte indicators 334 in FIG. 3E). In some embodiments, the excitation light may be ultraviolet (UV) light.

[0033]

[0038] In some embodiments, as shown in FIGS. 2A and 3A, the implantable device 100 may include one or more light receivers 212 (e.g., photodiodes, phototransistors, photoreceptors, or other photosensitive elements). In some embodiments, the one or more light receivers 212 may be configured to detect a detectable property of the analyte indicator and output an analyte signal indicative of the amount or concentration of the analyte in the medium within the living animal's body. In some embodiments, the one or more light receivers 212 may be configured to output an analyte signal indicative of the amount of radiant light (e.g., fluorescent light) received by the one or more light receivers 212.

[0034]

[0039] In some embodiments, as shown in FIGS. 2A, 2B, 3A, and 3B, the embedded device 100 may include one or more substrates 206 on one side of the inductive element 204. In some embodiments, although not shown in FIGS. 2A, 2B, 3A, and 3B, the embedded device 100 may additionally include one or more substrates 206 on the opposite side of the inductive element 204. In some embodiments, the one or more substrates 206 may be a circuit board (e.g., a printed circuit board (PCB) or a flexible PCB) on which one or more of the circuit components (e.g., analog and / or digital circuit components) may be mounted or otherwise attached. However, in some alternative embodiments, the one or more substrates 206 may be a semiconductor substrate.

[0035]

[0040] In embodiments where the substrate 206 is a semiconductor substrate, one or more of the circuit components may be fabricated on the substrate 206. For example, the fabricated circuit components may include analog and / or digital circuits. Also, in some embodiments where the substrate 206 is a semiconductor substrate, in addition to the circuit components fabricated on the semiconductor substrate, circuit components may be mounted on or otherwise attached to the semiconductor substrate. In other words, in some semiconductor substrate embodiments, some or all of the circuit components, which may include discrete circuit elements, integrated circuits (e.g., application specific integrated circuits (ASICs)), and / or other electronic components (e.g., non-volatile memory), may be fabricated on the semiconductor substrate, and the remainder of the circuit components may be fixed to the semiconductor substrate, thereby providing communication paths between the various fixed components.

[0036]

[0041] In some embodiments, as shown in FIGS. 2A and 3A, one or more of the light sources 210 are mounted on one or more of the substrates 206 or one or It may be fabricated within a plurality of substrates. In some embodiments, one or more of the light receivers 212 may be mounted on one or more of the substrates 206 or may be fabricated within one or more of the substrates. In some embodiments, one or more light sources 210 may be mounted on one or more of the substrates 206, one or more light receivers 212 may be fabricated within one or more of the substrates 206, and all or a portion of the circuit components may be fabricated within one or more of the substrates 206. In some embodiments, as shown in FIGS. 2B, 3A, and 3B, the implantable device 100 may additionally or alternatively have one or more circuit components 214 (e.g., capacitors) mounted on the inductive element 204.

[0037]

[0042] In some embodiments, the implantable device 100 may communicate with an external device 101. In some embodiments, the external device 101 may be an electronic device that communicates with the implantable device 100 to provide commands (e.g., measurement commands) to the implantable device 100 and / or receive measurement data (e.g., light receiver and / or temperature sensor readings) from the implantable device 100. The measurement data may include one or more readings from one or more of the light receivers 212 of the implantable device 100 and / or one or more readings from one or more of the temperature sensors of the implantable device 100. In some embodiments, the external device 101 may calculate the analyte concentration from the measurement data received from the implantable device 100. However, it is not essential for the external device 101 to perform the analyte concentration calculation itself. In some alternative embodiments, the external device 101 may instead transmit / relay the measurement data received from the implantable device 100 to another device that calculates the analyte concentration. In other alternative embodiments, the implantable device 100 may perform the analyte concentration calculation.

[0038]

[0043] In some embodiments, the inductive element 204 of the implantable device 100 may act as an antenna. In some embodiments, the external device 101 may implement passive telemetry for data transfer by communicating with the implantable device 100 via an inductive magnetic link. In some embodiments, the inductive element 204 may be, for example, a ferrite-based microantenna. In some embodiments, as shown in FIG. 2A, the inductive element 204 may include a conductor 216 in the form of a coil and a magnetic core 218. In some embodiments, the core 218 may be, for example, but not limited to, a ferrite core. In some embodiments, the inductive element 204 may be connected to a circuit (e.g., an application-specific integrated circuit (ASIC)) of the implantable device 100. In some embodiments, the implantable device 100 may provide a data link and transmit data from the implantable device 100 to the external device 101 depending on the external device 101.

[0039]

[0044] In some embodiments, the circuit of the implantable device 100 may include the inductive element 204, circuit components (e.g., one or more light sources 210 and / or one or more light receivers 212) mounted on one or more substrates 206 or created within one or more substrates, and / or one or more circuit components 214 mounted on the inductive element 204. In some embodiments, the circuit of the implantable device 100 may be powered by a power supply 202.

[0040]

[0045] In some embodiments, the power supply 202 may be a charge storage device. In some embodiments, the power supply 202 may be a battery (e.g., a rechargeable battery such as a lithium-ion battery), a capacitor, or a supercapacitor. In some embodiments, at least the exterior of the power supply 202 may be made of a biocompatible material such as, for example, but not limited to, stainless steel or a titanium alloy. In some embodiments, the power supply 202 may include a positive terminal (cathode) 220 and a negative terminal (anode) 222.

[0041]

[0046] In some embodiments, as shown in FIGS. 2A, 2B, 3A, and 3B, one or more couplers may attach the power supply 202 to the housing 208. In some embodiments, as shown in FIGS. 2A and 2B, the one or more couplers that attach the power supply 202 to the housing 208 may include a power supply terminal enclosure 224 and a housing cap enclosure 226. In some embodiments, the conductive connectors 228 and 230 may electrically connect the positive terminal 220 and the negative terminal 222 of the power supply 202 to the circuit of the embedded device 100, respectively. In some embodiments, the attachment of the power supply 202 to the housing 208 may be supported by one or more supports 232. In some embodiments, as shown in FIG. 2A, the circuit of the embedded device 100 may extend away from the power supply 202 along the longitudinal axis of the power supply.

[0042]

[0047] In some embodiments, the conductive connectors 228 and 230 may be rods or beams that include or are made of a conductive material. In some embodiments, the bonding wire 234 may electrically connect the conductive connectors 228 and 230 to the contact pads 236 on the inductive element 204. In some embodiments, a spring 238 (e.g., a V-shaped spring) may be attached (e.g., welded) to one end of the conductive connector 228. In some embodiments, the spring 238 may be made of a conductive material and may establish an electrical connection between the connector 228 and the positive terminal 220 of the power supply 202. In some embodiments, when the housing 208 and the power supply 202 are attached to each other, the spring 238 may be pressed against and compressed by the positive terminal 220 of the power supply 202.

[0043]

[0048] In some embodiments, one or more supports 232 may be reinforcing rods, bars, or beams. In some embodiments, one or more supports 232 may be attached to and extend from the power source 202. In some embodiments, one or more supports 232 may have a diameter larger than that of the conductive connectors 228 and 230. In some embodiments, one or more supports 232 may be made of a non-conductive material.

[0044]

[0049] In some embodiments, as shown in FIG. 2B, the power terminal enclosure 224 may be cup-shaped (e.g., a hollow cylinder with a flat bottom 224b and an open top). However, other shapes (e.g., a hollow right prism with a flat bottom and an open top) may be used in alternative embodiments. In some embodiments, the power terminal enclosure 224 may enclose the positive terminal 220 and the negative terminal 222 of the power source 202. In some embodiments, the power terminal enclosure 224 may enclose the spring 238. In some embodiments, the bottom 224b of the power terminal enclosure 224 may have holes 224c through which the conductive connectors 228 and 230 and one or more supports 232 pass. In some embodiments, the power terminal enclosure 224 may be made of a biocompatible material. In some embodiments, the power terminal enclosure 224 may be made of a biocompatible metal such as, for example, but not limited to, stainless steel or titanium. In some embodiments, the power terminal enclosure 224 may be attached (e.g., welded) to the power source 202. In some embodiments, the power terminal enclosure 224 may be attached to the power source 202 by laser welding.

[0045]

[0050] In some embodiments, the housing cap enclosure 226 may have a solid cylindrical shape. However, other shapes (e.g., a solid right prism shape) may be used in alternative embodiments. In some embodiments, the housing cap enclosure 226 may be made of a biocompatible material such as, for example and without limitation, glass or ceramic. In some embodiments, the housing cap enclosure 226 has a passage or feedthrough 240 through which the conductive connectors 228 and 230 and one or more supports 232 pass. In some embodiments, the housing cap enclosure 226 may include a first flat surface that abuts and is attached to the bottom 224b of the power terminal enclosure 224. In some embodiments, the housing cap enclosure 226 may be attached to the bottom 224b of the power terminal enclosure 224 by soldering. In some embodiments, the housing cap enclosure 226 may include a first flat surface that abuts and is attached to the open end 208a of the housing 208. In some embodiments, the housing cap enclosure 226 may enclose the circuit of the implantable device 100 within the housing 208.

[0046]

[0051] In some embodiments, after the circuit of the implantable device 100 is disposed within the housing 208, the housing 208 may be filled with epoxy up to an initial epoxy fill line 242. In some embodiments, the epoxy may create a permeable optical cavity within the housing 208. In some embodiments, the permeable optical cavity may be formed from a suitable optically transparent polymer material such as, for example, an acrylic polymer (e.g., polymethyl methacrylate (PMMA)). However, this is not essential and in other embodiments, different materials may be used for the permeable optical cavity.

[0047]

[0052] In some embodiments, after the housing 208 is filled with epoxy up to the initial epoxy fill line 242, the epoxy may be cured. In some embodiments, the conductive connectors 228 and 230 may be connected to the contact pads 236 of the circuit of the embedded device 100 (e.g., by soldering the bonding wire 234 to the contact pad 236). In some embodiments, after the conductive connectors 228 and 230 and the one or more supports 232 are disposed in place within the passage or feedthrough 240 of the housing cap enclosure 226, the remaining space within the housing 208 between the initial epoxy fill line 242 and the open end 208a of the housing 208 is filled with epoxy, and then the epoxy is cured.

[0048]

[0053] In some embodiments, the embedded device 100 including the power supply 202, the power terminal enclosure 224, the housing cap enclosure 226, and the housing 208 may be hermetically sealed.

[0049]

[0054] In some alternative embodiments, as shown in FIGS. 3A and 3B, the coupler 324 may attach the housing 208 and the power supply 202. In some embodiments, the coupler 324 may be between the housing 208 and the power supply 202. In some embodiments, the embedded device 100 including the power supply 202, the coupler 324, and the housing 208 may be hermetically sealed. In some embodiments, as shown in FIG. 3B, the embedded device 100 may include first and second conductive connectors 228 and 230. In some embodiments, the first conductive connector 228 may be configured to electrically connect the positive terminal 220 of the power supply 202 to the circuit. In some embodiments, the second conductive connector 230 may be configured to electrically connect the negative terminal 222 of the power supply 202 to the circuit. In some embodiments, as shown in FIG. 3B, the coupler 324 may include a flat surface 326 that abuts the power supply 202. In some embodiments, the coupler 324 may be attached to the power supply 202 (e.g., by laser welding). In some embodiments, as shown in FIG. 3A, the circuit of the embedded device 100 may extend away from the power supply 202 along the longitudinal axis of the power supply 202.

[0050]

[0055] In some embodiments, the first conductive connector 228 may be a rod or beam that includes or is made from a conductive material. In some embodiments, the second conductive connector 230 may include a conductive material (e.g., gold plating). In some In an embodiment, the bonding wire 234 may electrically connect the first and second conductive connectors 228 and 230 to a circuit contact pad 236 (e.g., the contact pad 236 on the inductive element 204). In some embodiments, as shown in FIG. 3B, one or both of the first and second conductive connectors 228 and 230 may not extend from the coupler 324 and instead may be housed with the coupler 324. However, this is not essential, and in some alternative embodiments, one or both of the first and second conductive connectors 228 and 230 may extend from the coupler 324 into the housing 208. In some embodiments, as shown in FIG. 3B, the inductive element 204 may extend into the coupler 324.

[0051]

[0056] In some embodiments, a spring (e.g., a V-shaped spring such as the spring 238 shown in FIG. 2B) may be attached (e.g., welded) to one end of the conductive connector 228. In some embodiments, the spring 238 may be made of a conductive material and may establish an electrical connection between the connector 228 and the positive terminal 220 of the power supply 202. In some embodiments, when the housing 208 and the power supply 202 are attached to each other, the spring 238 may be pressed against and compressed by the positive terminal 220 of the power supply 202.

[0052]

[0057] Figures 3C and 3D are a perspective view and a cross-sectional view, respectively, of coupler 324 according to some embodiments. In some embodiments, as shown in FIGS. 3B - 3D, coupler 324 may include one or more supports 232. In some embodiments, the one or more supports 232 may be reinforcing rods, bars, or beams. In some embodiments, the one or more supports 232 may be attached to and / or integral with coupler 324. In some embodiments, the one or more supports 232 may be made of a non-conductive material. The coupler 324 of the illustrated embodiment includes three supports 232, but this is not essential, and in some alternative embodiments, coupler 324 may include more or fewer supports 232 (e.g., 1, 2, 4, 5, 6, or 10 supports 232). In some embodiments, as shown in FIGS. 3A and 3B, the one or more supports 232 may extend from coupler 324 into housing 208.

[0053]

[0058] In some embodiments, as shown in FIGS. 3B - 3D, coupler 324 may include a second conductive connector 230. In some embodiments, as shown in FIG. 3C, the coupler has a cylindrical portion, and one or more supports 232 may extend from the cylindrical portion. In some embodiments, as shown in FIG. 3B, coupler 324 may include a flat surface 328 that abuts housing 328. In some embodiments, coupler 324 and housing 208 may be held together (e.g., by cured epoxy within housing 208 and / or coupler 324).

[0054]

[0059] In some embodiments, the process of manufacturing the embedded device 100 may include placing a circuit (e.g., an inductive element 204, circuit elements mounted on the inductive element 204, and / or circuit elements mounted on or formed within one or more substrates 206) at least partially within the housing 208. The process may include filling the housing 208 with epoxy up to an initial epoxy fill line after placing the circuit at least partially within the housing 208. In some embodiments, the initial epoxy fill line may be such that the contact pads 236 are not exposed and are not covered by epoxy. In some embodiments, the initial epoxy fill line may additionally or alternatively be such that there is still space within the housing 208 for inserting one or more supports 232 into the housing 208 after the epoxy has cured.

[0055]

[0060] In some embodiments, the process may include curing the epoxy after filling the housing with epoxy up to the initial epoxy fill line. In some embodiments, the cured epoxy may create a transmissive optical cavity within the housing 208. In some embodiments, the transmissive optical cavity may be formed from a suitable optically transmissive polymer material, such as an acrylic polymer (e.g., polymethyl methacrylate (PMMA)). However, this is not essential, and in other embodiments, different materials may be used for the transmissive optical cavity.

[0056]

[0061] In some embodiments, the process may include inserting one or more supports 232 of the coupler 324 into the housing 208 (e.g., into the remaining empty space of the housing 208 not filled with cured epoxy). In some embodiments, after inserting one or more supports 232 of the coupler 324 into the housing 208, the surface of the coupler 328 may abut the surface of the housing 208.

[0057]

[0062] In some embodiments, the process may include connecting the first and second conductive connectors 228 and 230 to the circuit contact pads 236 (e.g., the contact pads 236 on the inductive element 204) with one or more supports 232 of the coupler 324 inserted into the housing 208. In some embodiments, the first and second conductive connectors 228 and 230 may be connected to the circuit contact pads 236 by soldering bonding wires 234 to the contact pads 236.

[0058]

[0063] In some embodiments, the process may include attaching the coupler 324 to the power supply 202 (e.g., by laser welding the flat surface 326 of the coupler 324). In some embodiments, attaching the coupler 324 to the power supply 202 may include connecting the first conductive connector 228 to the positive terminal 220 of the power supply 202. In some embodiments, connecting the first conductive connector 228 to the positive terminal 220 of the power supply 202 may include pressing a spring (e.g., spring 238) at the end of the first conductive connector 238 against the positive terminal 220 of the power supply 202 and compressing the spring 238. In some embodiments, attaching the coupler 324 to the power supply 202 may include connecting the second conductive connector 230 to the negative terminal 222 of the power supply 202.

[0059]

[0064] In some embodiments, the process may include filling at least the remaining space within the housing 208 between the initial epoxy fill line and the end of the housing 208 with epoxy. In some embodiments, the epoxy may additionally be filled in all or part of the coupler 324. In some embodiments, the remaining space within the housing 208, all or part of it, and / or all or part of the coupler 324 may be filled with epoxy using small holes in the coupler 324.

[0060]

[0065] In some embodiments, the process may include curing epoxy in at least the remaining space within housing 208 between the initial epoxy filling line and the end of housing 208. In some embodiments, since one or more supports 232 of coupler 324 are inserted into housing 208, the cured epoxy within the remaining space and / or within coupler 324 may hold coupler 324 and housing 208 together.

[0061]

[0066] In some embodiments, implant device 100 may include one or more drug eluting polymer matrices. In some embodiments, implant device 100 may include one or more drug eluting polymer matrices (e.g., drug eluting polymer matrix 330 shown in FIG. 3E) on all or a portion of the outer surface of housing 208. In some embodiments, one or more drug eluting polymer matrices on housing 208 may be disposed in one or more depressions of housing 208. In some embodiments, implant device 100 may additionally or alternatively include one or more drug eluting polymer matrices (e.g., drug eluting polymer matrix 332 shown in FIG. 3E) on all or a portion of the outer surface of one or more couplers that attach power source 202 and housing 208. In some embodiments, one or more drug eluting polymer matrices may be disposed on all or a portion of one or both of power terminal enclosure 224 and housing cap enclosure 226. In some embodiments, as shown in FIG. 3E, one or more drug eluting polymer matrices 332 may be disposed on all or a portion of coupler 324.

[0062]

[0067] In some embodiments, one or more drug-eluting polymer matrices may be applied to the sensor housing 208 and / or one or more couplers (e.g., coupler 324 or power terminal enclosure 224 and housing cap enclosure 226) via an immersion or spray coating. In some alternative embodiments, one or more drug-eluting polymer matrices may have a preformed shape, such as a ring or a sleeve. In some alternative embodiments, one or more drug-eluting polymer matrices may have different shapes. In some embodiments, as shown in FIG. 3E, one or more drug-eluting polymer matrices 330 and 332 may be wound around a portion of the sensor housing 208 and / or a portion of the coupler 324. In some alternative embodiments, one or more drug-eluting polymer matrices 330 and 332 may be wider or narrower than the drug-eluting polymer matrices 330 and 332 shown in FIG. 3E.

[0063]

[0068] One or more therapeutic agents may be dispersed within one or more drug-eluting polymer matrices (e.g., one or more inert polymer matrices). In some embodiments, one or more therapeutic agents may reduce or prevent neutrophils from migrating into the wound space, and thus may reduce or prevent the production of hydrogen peroxide and fibrotic encapsulation bodies. Thus, in some embodiments, one or more therapeutic agents may reduce the degradation of one or more analyte indicators (e.g., analyte indicator 334). In some embodiments, one or more therapeutic agents that may be dispersed within the drug-eluting polymer matrix may include one or more anti-inflammatory drugs, such as, for example, non-steroidal anti-inflammatory drugs (e.g., acetylsalicylic acid (aspirin) and / or isobutylphenylpropanoic acid (ibuprofen)). In some non-limiting embodiments, one or more therapeutic agents dispersed within the drug-eluting polymer matrix may include one or more glucocorticoids. In some non-limiting embodiments, one or more therapeutic agents may include one or more of dexamethasone, triamcinolone, betamethasone, methylprednisolone, beclomethasone, fludrocortisone, their derivatives, and their analogs. In some embodiments, one or more therapeutic agents may reduce the production of hydrogen peroxide by neutrophils and macrophages.

[0064]

[0069] Embodiments of the present invention have been described above in sufficient detail with reference to the drawings. Although the present invention has been described based on these preferred embodiments, it will be apparent to those skilled in the art that specific changes, modifications, and alternative configurations to the described embodiments may be made within the spirit and scope of the present invention. For example, in some embodiments, the implantable device 100 may include a cross-linked material having insulation.

Claims

1. Housing and a circuit at least partially within said housing; a power source including a positive terminal and a negative terminal electrically connected to the circuit; a first conductive connector configured to electrically connect the positive terminal of the power source to the circuit; a second conductive connector configured to electrically connect the negative terminal of the power source to the circuit; a coupler between the housing and the power source, the coupler including one or more supports attached to the power source and extending from the coupler into the housing; An implantable device comprising:

2. The device of claim 1 , wherein the coupler comprises the second conductive connector.

3. The device according to claim 1 or 2, wherein the one or more supports are made from a material that is not electrically conductive.

4. The device of claim 1 , wherein the coupler has a cylindrical portion and the one or more supports extend from the cylindrical portion.

5. 5. The device of claim 1 , further comprising one or more substrates within the housing, the circuit including one or more circuit components mounted on or fabricated within the one or more substrates.

6. The device of claim 5 , wherein the one or more circuit components include one or more light sources and one or more light receivers.

7. The device of claim 1 , wherein the circuit comprises an inductive element.

8. The device of claim 7 , wherein the inductive element comprises a conductor and a magnetic core.

9. 9. The device of claim 7 or 8, wherein the inductive element extends into the coupler.

10. 10. The device of claim 1, wherein the circuitry includes contact pads, the device further comprising bonding wires electrically connecting the first and second conductive connectors to the contact pads.

11. 11. The device of claim 1, further comprising one or more analyte indicators on or in a portion of an exterior surface of the housing.

12. 12. The device of claim 1, wherein the power source is a battery.

13. The device of claim 1 , wherein the device is hermetically sealed.

14. 14. The device of claim 1, further comprising a spring configured to establish an electrical connection between the first conductive connector and the positive terminal of the power source.

15. 15. The device of claim 1, further comprising a drug eluting polymer matrix covering at least a portion of the coupler.

16. 1. A method of manufacturing an implantable device, comprising: disposing the circuitry at least partially within the housing; after disposing said circuitry at least partially within said housing, filling said housing with epoxy up to an initial epoxy fill line; filling the housing with the epoxy up to the initial epoxy fill line and then curing the epoxy; inserting one or more supports of a coupler into said housing; With the one or more supports of the coupler inserted into the housing, connecting first and second conductive connectors to contact pads of the circuit; attaching the coupler to a power source; filling at least a remaining space within the housing between the initial epoxy fill line and an end of the housing with epoxy; curing the epoxy in at least the remaining space within the housing between the initial epoxy fill line and an end of the housing; A method comprising:

17. 17. The method of claim 16, wherein attaching the coupler to the power source comprises connecting the first conductive connector to a positive terminal of the power source.

18. 20. The method of claim 17, wherein connecting the first conductive connector to the positive terminal of the power source comprises: pressing a spring at an end of the first conductive connector against the positive terminal of the power source; and compressing the spring.

19. 19. The method of claim 16, wherein attaching the coupler to the power supply comprises connecting the second conductive connector to a negative terminal of the power supply.

20. 20. The method of claim 16, wherein after insertion of the one or more supports of the coupler into the housing, a surface of the coupler abuts a surface of the housing.

21. Housing and a circuit within the housing; a power supply mounted to the housing, the power supply including a positive terminal and a negative terminal electrically connected to the circuit; a conductive connector configured to electrically connect the positive and negative terminals of the power source to the circuit; a power supply terminal enclosure configured to be attached to the power supply and to enclose the positive and negative terminals of the power supply; a housing cap enclosure attached to the power terminal enclosure and to an open end of the housing to seal the circuit within the housing; and An implantable device comprising:

22. 22. The device of claim 21, wherein the power terminal enclosure includes a hole through which the conductive connector passes.

23. 23. The device of claim 21 or 22, wherein the housing cap enclosure includes a passageway through which the conductive connector passes.

24. The housing cap enclosure is attached to the power source and extends from the power source.

24. The device of any one of claims 21 to 23, wherein one or more supports for supporting the substrate include a passageway therethrough.

25. 25. The device of claim 21, further comprising one or more supports attached to and extending from the power source, the one or more supports configured to support mounting of the power source to the housing.

26. 26. The device of claim 25, wherein the one or more supports have a diameter greater than a diameter of the conductive connector.

27. 27. The device of claim 25 or 26, wherein the one or more supports are made from a material that is not electrically conductive.

28. 28. The device of claim 25, wherein the power terminal enclosure includes a hole through which the support passes.

29. 29. The device of any one of claims 25 to 28, wherein the housing cap enclosure includes a passageway through which the support extends.

30. 30. The device of any one of claims 25 to 29, further comprising a drug eluting polymer matrix covering at least a portion of the power terminal enclosure and / or the housing cap enclosure.

31. 1. A method of manufacturing an implantable device, comprising: disposing the circuitry within the housing; after placing the circuitry within the housing, filling the housing with epoxy up to an initial epoxy fill line; filling the housing with the epoxy up to the initial epoxy fill line and then curing the epoxy; connecting a conductive connector to a contact pad of said circuit; placing the conductive connector within a passage of a housing cap enclosure; filling a remaining space within the housing between the initial epoxy fill line and an end of the housing with epoxy after placing the conductive connector within the passage of the housing cap enclosure; curing the epoxy in the remaining space within the housing between the initial epoxy fill line and an end of the housing; A method comprising:

32. 32. The method of claim 31, further comprising disposing one or more supports attached to and extending from a power source within the passageway of the housing cap enclosure.

33. 33. The method of claim 31 or 32, further comprising the step of connecting the conductive connectors to a positive and negative terminal of a power source.

34. 34. The method of claim 33, wherein connecting the conductive connectors to the positive and negative terminals of the power source includes pressing a spring at an end of one of the conductive connectors against the positive terminal of the power source and compressing the spring.

35. 35. The method of claim 31, wherein after the conductive connector is positioned within the passage of the housing cap enclosure, a surface of the housing cap enclosure abuts a power supply terminal enclosure attached to a power supply and seals positive and negative terminals of the power supply.

36. 1. A coupler for attachment to a housing and a power source of an implantable device, comprising: a cylindrical portion including a first planar surface configured to abut the power source and a second planar surface configured to abut the housing; one or more supports extending from the cylindrical portion; a conductive connector configured to electrically connect terminals of the power source to a circuit at least partially contained within the housing; and A coupler comprising:

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