Taping device and taping method

Abstract

To provide a taping device and a taping method that are advantageous for inspecting taped packaging according to sealing processing.SOLUTION: A taping device includes: a sealing unit 14 for thermally bonding a top tape Tt to a carrier tape Tc in which a workpiece W is housed; a first inspection unit 15 for inspecting at least one of the workpiece W, the carrier tape Tc, and the top tape Tt packaged by the carrier tape Tc and the top tape Tt after thermocompression bonding; and a control unit for controlling the sealing unit 14 and the first inspection unit 15, in which the control unit controls the first inspection unit 15 so that the inspection by the first inspection unit 15 is performed based on driving of the sealing unit 14.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present disclosure relates to a taping device and a taping method.

Background Art

[0002] Taping and packaging of small electronic components is convenient for shipping a large quantity of small electronic components after manufacturing and is widely used.

[0003] Patent Documents 1 and 2 disclose a taping device that performs such taping and packaging.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0005] In order to prevent defective products from being shipped, inspection is performed prior to final shipment. Such inspection to prevent shipment of defective products may be performed before the sealing process for taping and packaging or after the sealing process. For example, it is possible to perform inspection before the sealing process to determine whether the electronic components and / or carrier tape used for the sealing process are in an appropriate state. On the other hand, it is possible to perform inspection after the sealing process to determine whether the sealing process has been properly performed (i.e., whether the electronic components are properly packaged by the tape).

[0006] However, in conventional taping devices, since the packing process (especially the sealing process) and the inspection process are performed independently without interlocking with each other, the inspection process cannot always be carried out under optimal conditions. For example, the inspection process is carried out without being related to the timing at which the sealing process for taping packing is performed, that is, without being carried out in cooperation with the actual sealing process.

[0007] The present disclosure has been made in view of the above circumstances, and an object thereof is to provide a technique advantageous for performing inspection of taping packing according to a sealing process.

Means for Solving the Problems

[0008] One aspect of the present disclosure relates to a taping device including a sealing unit that performs thermocompression bonding of a top tape to a carrier tape in which a work is accommodated, a first inspection unit that inspects at least any one of the work, the carrier tape, and the top tape packed by the carrier tape and the top tape after thermocompression bonding, and a control unit that controls the sealing unit and the first inspection unit, wherein the control unit controls the first inspection unit so that the inspection by the first inspection unit is performed based on the drive of the sealing unit.

[0009] The taping device may include a feeding unit that feeds the carrier tape under the control of the control unit, and the control unit may control the feeding unit so that the feeding of the carrier tape by the feeding unit is performed based on the drive of the sealing unit.

[0010] The taping device may include a second inspection unit that inspects the work accommodated in the carrier tape before thermocompression bonding under the control of the control unit.

[0011] The control unit controls the feeding unit so that the feeding unit repeatedly performs intermittent feeding and intermittent stopping of the carrier tape, and the carrier tape is intermittently fed by a set moving amount, and the inspection may be performed during the intermittent stopping of the carrier tape.

[0012] Other aspects of the present disclosure include a step of thermocompression bonding a top tape to a carrier tape in which a workpiece is accommodated by a seal unit, and a step of inspecting at least any one of the workpiece, the carrier tape, and the top tape packaged by the carrier tape and the top tape after thermocompression bonding, and the inspection is performed based on the drive of the seal unit, and relates to a taping method.

Effects of the Invention

[0013] According to the present disclosure, it is advantageous to perform the inspection of the taping package according to the sealing process.

Brief Description of the Drawings

[0014]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Embodiments for Carrying Out the Invention

[0015] Hereinafter, an embodiment of the present disclosure will be described with reference to the drawings.

[0016] In the following description, unless otherwise specified, the terms "upstream" and "downstream" are based on the moving direction of the tape (carrier tape, top tape, and packaging tape).

[0017] FIG. 1 is a diagram schematically showing the device configuration of an example of the taping device 10. FIG. 2 is a perspective view schematically showing the device configuration of an example of the seal unit 14. FIG. 3 is a block diagram showing an example of the control configuration of the taping device 10.

[0018] The taping device 10 shown in FIG. 1 includes a feed unit 11, a work supply unit 12, a pre-seal inspection unit 13, a seal unit 14, a post-seal inspection unit 15, a buffer unit 16, and a tape recovery unit 17.

[0019] The feed unit 11 feeds the carrier tape Tc, the top tape Tt, and the packaging tape Tp from upstream to downstream under the control of the control unit 20. In the present embodiment, the carrier tape Tc, the top tape Tt, and the packaging tape Tp are intermittently fed by the feed unit 11. The specific intermittent transfer method of the tapes Tc, Tt, and Tp by the feed unit 11 is not limited. For example, while measuring the transfer amount of the tapes Tc, Tt, and Tp by a sensor or the like, when the transfer amount reaches a predetermined value, the transfer of the tapes Tc, Tt, and Tp may be stopped, and the tapes Tc, Tt, and Tp may be intermittently stopped. Alternatively, the tapes Tc, Tt, and Tp may be transferred using a driving device such as a stepping motor, and the driving device may be intermittently moved based on a predetermined intermittent driving amount, thereby repeatedly performing the intermittent transfer and intermittent stop of the tapes Tc, Tt, and Tp.

[0020] Functionally, the feed unit 11 includes a carrier tape feed section 45, a top tape feed section 46, and a packaging tape feed section 47 as shown in FIG. 3, but one or more devices are shared among these feed sections 45, 46, and 47.

[0021] In the example shown in FIG. 1, at least each of the carrier tape feeding section 21, the feed delivery section 23, the packing tape delivery section 24, and the packing tape recovery section 25 is actively rotated under the control of the control unit 20, whereby the carrier tape Tc is sent from upstream to downstream. Also, at least each of the top tape feeding section 22, the packing tape delivery section 24, and the packing tape recovery section 25 is actively rotated under the control of the control unit 20, whereby the top tape Tt is intermittently sent from upstream to downstream. Therefore, the packing tape Tp formed by thermocompression bonding of the carrier tape Tc and the top tape Tt is intermittently sent from upstream to downstream by actively rotating at least each of the carrier tape feeding section 21, the top tape feeding section 22, the feed delivery section 23, the packing tape delivery section 24, and the packing tape recovery section 25 under the control of the control unit 20.

[0022] The carrier tape Tc has a number of accommodation recesses (not shown) for accommodating workpieces (e.g., small electronic components) and a number of through holes for delivery (not shown) used for sending the carrier tape Tc downstream. The accommodation recesses are provided at equal intervals along the longitudinal direction of the carrier tape Tc. The through holes for delivery are also provided at equal intervals along the longitudinal direction of the carrier tape Tc, but the interval between adjacent through holes for delivery is set to a length corresponding to the intermittent feed distance of the tapes Tc, Tt, Tp (e.g., the tape movement amount by one intermittent feed).

[0023] The carrier tape Tc is held in a roll form by the carrier tape feeding section 21 and is fed out from the carrier tape feeding section 21. The carrier tape Tc fed out from the carrier tape feeding section 21 passes through a plurality of guide rollers Rg, the feed delivery section 23, the buffer roller Rb, and the packing tape delivery section 24, and then is wound up and recovered in a roll form by the packing tape recovery section 25 in the form of the packing tape Tp together with the top tape Tt.

[0024] The feed delivery unit 23 includes a rotatable body that can be actively rotated, and a plurality of delivery protrusions provided at equal intervals on the outer periphery of the rotatable body. The plurality of delivery protrusions have a shape and size that match the feed through-holes of the carrier tape Tc and can be inserted into the feed through-holes. When the plurality of delivery protrusions move along a circular orbit in response to the rotation of the rotatable body, one or more (for example, about 2 to 4) delivery protrusions move while fitting into the feed through-holes, so that the carrier tape Tc receives a force from the delivery protrusions and is sent downstream. In particular, when the delivery protrusions fit into the feed through-holes, the relative position of the carrier tape Tc with respect to the feed delivery unit 23 is corrected, and the carrier tape Tc is accurately arranged at a desired position. In this way, the feed delivery unit 23 (particularly the delivery protrusions) functions to send out the carrier tape Tc downstream while positioning (position correction) the carrier tape Tc.

[0025] The workpiece W is placed by the workpiece supply unit 12 into the accommodation recess provided in the portion of the carrier tape Tc that is positioned by the feed delivery unit 23.

[0026] The workpiece supply unit 12 shown in FIG. 1 includes a hopper 31, a feeder 32, an index table 33, and an insertion unit 34. A plurality of workpieces W input into the hopper 31 by other machines or manually are sent from the hopper 31 to the feeder 32, aligned by the feeder 32, and then sent to the index table 33. Then, the workpiece W intermittently moves along a circular orbit together with the index table 33, is inspected by the workpiece inspection unit 51, and is then sent from the index table 33 to the insertion unit 34. The insertion unit 34 is arranged to face the feed delivery unit 23 via the carrier tape Tc, and sequentially places the workpieces W sent from the index table 33 into the accommodation recesses of the carrier tape Tc.

[0027] Note that the workpiece supply unit 12 can be appropriately realized by a known device, and a detailed description of the workpiece supply unit 12 here is omitted.

[0028] The carrier tape Tc is sent from the feed-out unit 23 to the sealing unit 14 together with the work W accommodated in the accommodation recess. The sealing unit 14 performs thermocompression bonding of the top tape Tt to the carrier tape Tc in which the work W is accommodated in the accommodation recess, and hermetically seals the work W with the carrier tape Tc and the top tape Tt.

[0029] The top tape Tt is held in a roll form by the top tape pay-out unit 22 and is payed out from the top tape pay-out unit 22. The top tape Tt payed out from the top tape pay-out unit 22 passes through a plurality of guide rollers Rg, buffer rollers Rb, and the packing tape feed-out unit 24, and then is wound up and recovered by the packing tape recovery unit 25 in the form of the packing tape Tp together with the carrier tape Tc.

[0030] The sealing unit 14 shown in Fig. 2 has a support frame 65, a sealing body 41 supported by the support frame 65, and a sealing drive unit 42. The support frame 65 has a horizontal support portion extending in the horizontal direction and vertical support portions extending downward from both ends of the horizontal support portion. Each vertical support portion has a guide hole 66 extending in the height direction, and a guide bar 67 of the sealing body 41 is inserted into each guide hole 66 so as to be movable in the height direction (vertical direction).

[0031] The sealing body 41 generates heat by energization under the control of the control unit 20 and is controlled to a temperature suitable for thermocompression bonding of the carrier tape Tc and the top tape Tt.

[0032] The sealing drive unit 42 moves the sealing body 41 in the height direction (vertical direction) under the control of the control unit 20. The sealing drive unit 42 shown in Fig. 2 has a piston mechanism (for example, an air cylinder) 42a and a solenoid mechanism 42b. The sealing body 41 is moved between a retracted position and a standby position under the drive of the piston mechanism 42a, and is moved between the standby position and a sealing position under the drive of the solenoid mechanism 42b.

[0033] The sealing position mentioned here is the position where the sealing body 41 contacts the top tape Tt from above, which is overlapped on the carrier tape Tc that houses the workpiece W, and thermocompression-bonds the top tape Tt to the carrier tape Tc. The standby position and the retracted position are positions where the sealing body 41 is spaced apart upward from the top tape Tt (and thus the carrier tape Tc that houses the workpiece W), and the sealing body 41 arranged at the standby position is located closer to the top tape Tt (and thus the carrier tape Tc that houses the workpiece W) than the sealing body 41 arranged at the retracted position.

[0034] The carrier tape Tc and the top tape Tt travel below the sealing body 41 in a state of being overlapped with each other, and while being located below the sealing body 41, they are subjected to a thermocompression-bonding process one or more times by the sealing body 41 positioned at the sealing position. As a result, the carrier tape Tc and the top tape Tt are sent downstream as a packaging tape Tp enclosing the workpiece W.

[0035] The packaging tape Tp thus produced is sent to the packaging tape recovery unit 25 via the buffer unit 16 (buffer roller Rb) and the packaging tape delivery unit 24 from the sealing unit 14 as shown in FIG. 1. Note that by providing the buffer unit 16, it is possible to apply a desired tension to the "carrier tape Tc located between the feed delivery unit 23 and the packaging tape delivery unit 24" and the "packaging tape Tp located between the sealing unit 14 and the packaging tape delivery unit 24". Thereby, the "carrier tape Tc located between the feed delivery unit 23 and the packaging tape delivery unit 24" and the "packaging tape Tp located between the sealing unit 14 and the packaging tape delivery unit 24" can be kept in a taut state, preventing the slack of these tapes. As a result, it is possible to stably and accurately perform the supply of the workpiece W to the accommodation recess of the carrier tape Tc by the insertion unit 34 (workpiece supply unit 12) and the thermocompression-bonding process of the carrier tape Tc and the top tape Tt by the sealing unit 14.

[0036] The packing tape Tp thus produced is wound up in a roll shape at the packing tape collection unit 25. Note that the packing tape Tp may be tensioned and taut or may be slack between the packing tape delivery unit 24 and the packing tape collection unit 25.

[0037] The taping device 10 of the present embodiment having the above-described configuration includes a pre-sealing inspection unit (second inspection unit) 13 that inspects the carrier tape Tc and the top tape Tt before thermocompression bonding, and a post-sealing inspection unit (first inspection unit) 15 that inspects the carrier tape Tc and the top tape Tt after thermocompression bonding. The pre-sealing inspection unit 13 and the post-sealing inspection unit 15 perform inspections under the control of the control unit 20.

[0038] In the example shown in FIG. 1, a work inspection unit 51 and a feed inspection unit 56 are provided as the pre-sealing inspection unit 13.

[0039] The work inspection unit 51 inspects the work W being conveyed by the index table 33, and has a work power supply unit 52 and a work imaging unit 53 as an example as shown in FIG. 3. The work power supply unit 52 supplies electricity to the work W to be inspected to inspect for electrical defects in the work W. The work imaging unit 53 images the work W to be inspected, and the presence or absence of external defects (for example, shape abnormalities such as scratches) in the work W is inspected by analyzing the captured image. The analysis of such a captured image may be performed by the work inspection unit 51 and the analysis result may be notified to the control unit 20, or may be performed by the control unit 20.

[0040] The feed inspection unit 56 has a pre-sealing inspection controller 57 and a pre-sealing imaging unit 58 as shown in FIG. 3. The pre-sealing imaging unit 58 captures an image of the work W and the carrier tape Tc that houses the work W under the control of the pre-sealing inspection controller 57 (and thus under the control of the control unit 20) to obtain an image. The imaging by the pre-sealing imaging unit 58 is performed on the work W and the carrier tape Tc before being covered by the top tape Tt. The pre-sealing inspection controller 57 analyzes the captured image obtained by the pre-sealing imaging unit 58 under the control of the control unit 20 to inspect for the presence or absence of abnormalities in the work W and / or the carrier tape Tc. Note that such analysis and inspection of the captured image may be performed by the control unit 20.

[0041] The post-sealing inspection unit 15 has a post-sealing inspection controller 61 and a post-sealing imaging unit 62 as shown in FIG. 3. The post-sealing imaging unit 62 captures an image of the packing tape Tp (i.e., the carrier tape Tc, the top tape Tt, and the work W after the thermocompression bonding process) under the control of the post-sealing inspection controller 61 (and thus under the control of the control unit 20) to obtain an image. By configuring the top tape Tt with a transparent member, it is possible to include the work W in the accommodation recess of the carrier tape Tc in the captured image. The post-sealing inspection controller 61 analyzes the captured image obtained by the post-sealing imaging unit 62 under the control of the control unit 20 to inspect for the presence or absence of abnormalities in at least any one of the work W, the carrier tape Tc, and the top tape Tt that are packed by the carrier tape Tc and the top tape Tt after the thermocompression bonding. Note that such analysis and inspection of the captured image may be performed by the control unit 20.

[0042] Note that the specific methods for analyzing and inspecting the captured images described above are not limited. Typically, imaging images of a carrier tape Tc, a top tape Tt, a work W, and / or a packing tape Tp in an appropriate state without defects are prepared in advance as reference images, and the presence or absence of abnormalities can be detected by comparing the imaging images for analysis and inspection with the reference images. More specifically, the presence or absence of abnormalities may be detected by comparing the dimensions, areas, and / or relative positions of the carrier tape Tc, the top tape Tt, and / or the work W between the reference image and the imaging image, or the presence or absence of abnormalities such as scratches may be detected based on a comparison of the presence or absence of shadows.

[0043] In this example, the inspections by the pre-sealing inspection unit 13 (the work inspection unit 51 and the feed inspection unit 56) and the post-sealing inspection unit 15 are performed during the intermittent stop of the work W and the carrier tape Tc. However, the contents and methods of the inspections by the pre-sealing inspection unit 13 (the work inspection unit 51 and the feed inspection unit 56) and the post-sealing inspection unit 15 are not limited to the above examples.

[0044] The control unit 20 controls each part (the feed unit 11, the work supply unit 12, the pre-sealing inspection unit 13, the sealing unit 14, the post-sealing inspection unit 15, the buffer unit 16, and the tape recovery unit 17) constituting the above-described taping device 10. Although the control unit 20 shown in FIG. 3 is shown as a single block, the control unit 20 may be constituted by a single control unit or may be constituted based on a combination of a plurality of control units. Therefore, a specific control unit may be assigned to each unit, or one control unit may be assigned to a plurality of units.

[0045] The control unit 20 of the present embodiment controls the post-sealing inspection unit 15 so that the inspection by the post-sealing inspection unit 15 (first inspection unit) is performed based on the drive of the sealing unit 14. The control unit 20 may transmit a drive signal for performing an inspection to the post-sealing inspection unit 15 based on the transmission of a drive signal from the control unit 20 to the sealing unit 14. Alternatively, the control unit 20 may receive a signal from the sealing unit 14 and transmit a drive signal for performing an inspection to the post-sealing inspection unit 15 based on the received signal. In this way, the inspection by the post-sealing inspection unit 15 is performed according to the sealing process by the sealing unit 14, and it is possible to check the state of the packaging tape Tp (carrier tape Tc, top tape Tt, and workpiece W) at an optimal timing.

[0046] Further, the control unit 20 controls the carrier tape feeding unit 45 of the feeding unit 11 so that the feeding of the carrier tape Tc by the carrier tape feeding unit 45 of the feeding unit 11 is performed based on the drive of the sealing unit 14. The control unit 20 may transmit a drive signal for intermittently transferring the tapes Tc, Tt, and Tp to the feeding unit 11 based on the transmission of a drive signal from the control unit 20 to the sealing unit 14. Alternatively, the control unit 20 may receive a signal from the sealing unit 14, for example, receive a signal regarding the drive of the sealing unit 14 from the sealing unit 14, and transmit a drive signal for intermittently transferring the tapes Tc, Tt, and Tp to the feeding unit 11 based on the received signal.

[0047] In particular, the control unit 20 of this example controls the carrier tape feeding unit 45 so that the carrier tape feeding unit 45 of the feeding unit 11 repeatedly performs intermittent feeding and intermittent stopping of the carrier tape Tc, and the carrier tape Tc is intermittently fed by a set moving amount each time. Thereby, the intermittent transfer of the tapes (carrier tape Tc, top tape Tt, and packaging tape Tp) can be performed according to the sealing process by the sealing unit 14, and the tapes can be reliably transferred at a timing that does not inhibit the sealing process.

[0048] Next, an example of the taping method (particularly the thermocompression bonding process and the inspection process) performed by the above-described taping device 10 will be described.

[0049] FIG. 4 is a flowchart showing an example of the taping method (particularly the thermocompression bonding process and the inspection process).

[0050] A sealing process is performed by the sealing unit 14 to thermocompression bond the top tape Tt to the carrier tape Tc in which the work W is accommodated (S1 in FIG. 4). More specifically, with the sealing body 41 positioned at the standby position by the piston mechanism 42a and the solenoid mechanism 42b, the portion to be sealed among the carrier tape Tc, the top tape Tt, and the work W is positioned below the sealing body 41. Then, by moving the sealing body 41 from the standby position to the sealing position by the solenoid mechanism 42b, the sealing process for the target portion is performed, and the work W is enclosed by the carrier tape Tc and the top tape Tt to form the packaging tape Tp.

[0051] Thereafter, by moving the sealing body 41 from the sealing position to the standby position by the solenoid mechanism 42b, the sealing body 41 is separated from the target portions of the carrier tape Tc and the top tape Tt. Thereafter, the control unit 20 determines whether or not the sealing body 41 is disposed at the standby position (S2). The specific determination method for whether or not the sealing body 41 is disposed at the standby position is not limited, and for example, the determination may be made based on the detection result of a sensor (not shown).

[0052] When it is determined that the sealing body 41 is not disposed at the standby position (N in S2), the control unit 20 performs error processing for notifying the administrator of the taping device 10 that a defect has occurred in the sealing body 41 (and thus there is a high possibility that a sealing defect has occurred in the carrier tape Tc and the top tape Tt) (S3).

[0053] On the other hand, when it is determined that the sealing body 41 is disposed at the standby position (Y in S2), the control unit 20 controls the feeding unit 11 to intermittently transfer the tapes (carrier tape Tc, top tape Tt, and packing tape Tp) downstream (S4). Then, after the control unit 20 intermittently stops the tapes (S5), it determines whether the intermittent transfer amount of the tapes is appropriate (S6). The specific determination method for whether the intermittent transfer amount of the tapes is appropriate is not limited, and for example, the determination may be made based on the detection result of a sensor (not shown).

[0054] When it is determined that the intermittent transfer amount of the tapes is not appropriate (N in S6), the control unit 20 performs error processing to notify the administrator that an error has occurred in the intermittent transfer of the tapes (S7).

[0055] On the other hand, when it is determined that the intermittent transfer amount of the tapes is appropriate (Y in S6), the control unit 20 controls the pre-sealing inspection unit 13 (particularly the feed inspection unit 56) and the post-sealing inspection unit 15 to perform imaging by the pre-sealing imaging unit 58 and the post-sealing imaging unit 62 (S8).

[0056] Then, the control unit 20 controls the pre-sealing inspection controller 57 and the post-sealing inspection controller 61 to analyze the imaging images acquired by the pre-sealing imaging unit 58 and the post-sealing imaging unit 62 (S9). Note that the object of imaging by the post-sealing imaging unit 62 is not necessarily subject to the sealing process by the sealing unit 14 immediately before the imaging. Therefore, the target parts of the imaging process and the image analysis process by the post-sealing inspection unit 15 in steps S8 and S9 described above do not necessarily coincide with the target parts of the sealing process in step S1 described above.

[0057] Then, the control unit 20 determines whether the carrier tape Tc, the top tape Tt, and / or the workpiece W are appropriate based on the analysis result of the imaging images (S10).

[0058] When it is determined that the carrier tape Tc, the top tape Tt, and / or the work W is not appropriate (N in S10), the control unit 20 performs error processing to notify the administrator that an error has occurred in the carrier tape Tc, the top tape Tt, and / or the work W (S11).

[0059] For example, by analyzing the captured image acquired by the pre-sealing imaging unit 58, it is determined whether the carrier tape Tc and / or the work W before the sealing process is in an appropriate state. In the case of an inappropriate determination, the administrator is notified accordingly. Also, by analyzing the captured image acquired by the post-sealing imaging unit 62, it is determined whether the carrier tape Tc, the top tape Tt, and / or the work W (i.e., the packaging tape Tp) after the sealing process is in an appropriate state. In the case of an inappropriate determination, the administrator is notified accordingly.

[0060] On the other hand, when it is determined that the carrier tape Tc, the top tape Tt, and the work W (i.e., the packaging tape Tp) are appropriate (Y in S10), the thermal compression bonding process and the inspection process are completed for the current target part among the carrier tape Tc, the top tape Tt, and the work W.

[0061] In this way, at least one of the work W, the carrier tape Tc, and the top tape Tt packaged by the carrier tape Tc and the top tape Tt after thermal compression bonding is inspected by the post-sealing inspection unit 15. In particular, in this embodiment, the inspection is performed based on the drive of the sealing unit 14 as described above. Also, at least one of the carrier tape Tc before thermal compression bonding and the work W accommodated in the carrier tape Tc is inspected by the pre-sealing inspection unit 13 (particularly the feed inspection unit 56).

[0062] Then, the control unit 20 determines whether the sealing process of the carrier tape Tc, the top tape Tt, and the workpiece W has been completed (i.e., whether there is no target portion that needs to undergo a further thermocompression bonding process) (S12). If it is determined that the sealing process has not been completed (N in S12), the above-described series of processing steps (see S1 to S11) are repeated, and the thermocompression bonding process and the inspection process for the target portions (carrier tape Tc, top tape Tt, and workpiece W) that need to undergo a further thermocompression bonding process are performed.

[0063] On the other hand, if it is determined that the sealing process for the carrier tape Tc, the top tape Tt, and the workpiece W has been completed (Y in S12), the control unit 20 determines whether the inspection process for the carrier tape Tc, the top tape Tt, and the workpiece W has been completed (i.e., whether there is no further target portion that needs to undergo an inspection process) (S13). If it is determined that the inspection process has not been completed (N in S13), the above-described series of processing steps (see S4 to S12) are repeated, and the inspection process for the further target portions (carrier tape Tc, top tape Tt, and workpiece W) that need to undergo an inspection process is performed.

[0064] On the other hand, if it is determined that the inspection process has been completed (Y in S13), the series of taping methods (particularly the thermocompression bonding process and the inspection process) are terminated.

[0065] Note that the above error processes S3, S7, and S11 can be executed by any method. For example, a direct notification indicating an error (e.g., a visual notification on a display and / or an audio notification from a speaker) may be issued to the administrator, or the operation of the taping device 10 may be stopped to indirectly inform the administrator of the occurrence of the error.

[0066] As described above, according to the above-described taping device 10 and taping method, since the inspection by the post-sealing inspection unit 15 is performed based on the drive of the sealing unit 14, it is possible to inspect the taping and packaging of the workpiece W according to the sealing process, leading to an improvement in the quality of the packaging tape Tp.

[0067] Also, before and after the sealing process, inspections are carried out by the pre-sealing inspection unit 13 and the post-sealing inspection unit 15. If a defect is found during the inspection, the taping device 10 can be immediately stopped, and immediate countermeasures such as removing the defective part can be taken. On the other hand, in conventional devices and methods, the inspection of taping parts is performed independently of the sealing operation of the taping device, and inspections may not be carried out before and after the sealing process. In such cases, even if the carrier tape Tc, the top tape Tt, and / or the work W have defects, countermeasures such as stopping the taping device 10 cannot be taken, and the taping device 10 continues to operate without correcting the defects. As a result, for example, steps such as unrolling the roll (completed roll) of the packing tape Tp collected by the packing tape recovery unit 25 to check the defective part and then re-rolling the packing tape Tp into a roll are additionally required after the confirmation is completed.

[0068] Also, according to the above-described taping device 10 and taping method, the feeding of the carrier tape Tc by the feeding unit 11 is performed based on the drive of the sealing unit 14. Therefore, it is possible to perform the intermittent feeding and intermittent stopping of the carrier tape Tc (and thus the intermittent feeding and intermittent stopping of the top tape Tt and the packing tape Tp) at an optimal timing with respect to the operation of the sealing unit 14. On the other hand, in conventional devices and methods in which the feeding of the tape is performed independently of the sealing process, it is not always possible to perform the tape feeding at an optimal timing with respect to the sealing process.

[0069] [First Modified Example] FIG. 5 is a diagram showing a schematic configuration of an example of the post-sealing inspection unit 15. In FIG. 5, for the chip product Q (work W (chip-type electronic component (chip device)), carrier tape Tc, and top tape Tt), the work W in each accommodation recess (cavity) C of the carrier tape Tc is shown transparently.

[0070] The post-sealing inspection unit 15 shown in FIG. 5 includes a first lighting device 111, a second lighting device 112, a post-sealing imaging unit 62, and an image processing device 114 (post-sealing inspection controller 61).

[0071] The first illumination device 111 emits first inspection light (high-angle inspection light) in a direction forming a first angle θ1 with respect to the vertical line Lv. In the example shown in FIG. 5, a plurality (two) of first illumination devices 111 each constituted by an LED device are provided. The first inspection light is red diffused light, and the first angle θ1 can be set to any angle within the angular range of 0° to 45°. The first angle θ1 is represented by the direction of the principal ray of the first inspection light emitted by the first illumination device 111 (i.e., the first inspection light emission direction DL1). In the example shown in FIG. 5, the first inspection light emission direction DL1 of each first illumination device 111 is directed such that the principal ray of the first inspection light passes through a chip product Q (particularly a workpiece W within the accommodation recess C of the carrier tape Tc) that is conveyed in the conveyance direction Dt and positioned at the inspection position P0.

[0072] The workpiece W shown in FIG. 5 includes a workpiece main body W0 and two workpiece electrodes W1, and the two workpiece electrodes W1 are attached to the workpiece main body W0 so as to sandwich the workpiece main body W0. In each accommodation recess C of the carrier tape Tc, the workpiece W is accommodated in each accommodation recess C such that the workpiece main body W0 and the workpiece electrodes W1 are arranged in the horizontal direction.

[0073] The second illumination device 112 emits second inspection light (low-angle inspection light) having a wavelength (wavelength band) different from that of the first inspection light in a direction forming a second angle θ2 larger than the first angle θ1 with respect to the vertical line Lv. The wavelengths of the first inspection light and the second inspection light are not limited, and the wavelength of the first inspection light may be longer than the wavelength of the second inspection light. In the example shown in FIG. 5, a plurality (two) of second illumination devices 112 each constituted by an LED device are provided. The second inspection light is green diffused light, and the second angle θ2 can be set to any angle within the angular range of 75° to 90°. The second angle θ2 is represented by the direction of the principal ray of the second inspection light emitted by the second illumination device 112 (i.e., the second inspection light emission direction DL2). In the example shown in FIG. 5, the second inspection light emission direction DL2 of each second illumination device 112 is directed such that the principal ray of the second inspection light travels horizontally.

[0074] The emission modes of the inspection light from each first lighting device 111 and each second lighting device 112 are not limited. For example, while the post-sealing inspection unit 15 is operating, the inspection light may be continuously emitted from each first lighting device 111 and each second lighting device 112 at all times. Alternatively, each first lighting device 111 and each second lighting device 112 may turn on / off the emission of the inspection light according to the imaging by the post-sealing imaging unit 62 under the control of the post-sealing inspection controller 61 (and thus under the control of the control unit 20), and may not emit the inspection light while the imaging by the post-sealing imaging unit 62 is not performed.

[0075] In the example shown in FIG. 5, the minimum horizontal distance L1 between the first lighting devices 111 is set to, for example, 65 mm, and the minimum height (vertical direction) distance L2 between each first lighting device 111 and the chip product Q (especially the upper surface (exposed surface) of the top tape Tt) is set to, for example, 95 mm to 160 mm. Also, the height direction distance L3 of each second lighting device 112 (especially the range where the second inspection light is emitted) is set to, for example, 15 mm to 20 mm.

[0076] In other product inspection apparatuses, when white inspection light is emitted from two LED lighting devices, the minimum horizontal distance L1 between the two LED lighting devices is set to, for example, 3 mm to 15 mm, the emission angle θ of the inspection light (main optical axis) of each LED lighting device is set to, for example, 0° to 60° with respect to the vertical line Lv, and the minimum height (vertical direction) distance L2 between each LED lighting device and the chip product (especially the upper surface of the top tape Tt) is set to, for example, 10 mm to 30 mm.

[0077] The post-sealing imaging unit 62 acquires a captured image of the chip product Q irradiated with the first inspection light and the second inspection light. The imaging direction Dc (optical axis direction) of the post-sealing imaging unit 62 in the present embodiment coincides with the vertical direction, and the optical axis of the post-sealing imaging unit 62 passes through the accommodation recess C and the workpiece W located at the inspection position P0. While the chip product Q to be inspected including the workpiece W located at the inspection position P0 is irradiated with the first inspection light from each first lighting device 111 and the second inspection light from each second lighting device 112, an image of the chip product Q to be inspected is captured and acquired by the post-sealing imaging unit 62.

[0078] The image processing device 114 analyzes (image processes) the captured image of the chip product Q sent from the post-sealing imaging unit 62 to perform a quality inspection of the chip product Q. The image processing device 114 of the present embodiment detects the state of the workpiece W based on the image component of the first inspection light (red light) in the captured image of the chip product Q, detects the state of the carrier tape Tc based on the image component of the second inspection light (green light) in the captured image, and performs image processing to detect the state of at least a part of the top tape Tt based on both the image component of the first inspection light and the image component of the second inspection light in the captured image.

[0079] Particularly regarding the top tape Tt, the image processing device 114 detects the state of the portion (sealing portion Ttb) of the top tape Tt that is thermocompression bonded to the carrier tape Tc based on the image component of the second inspection light in the captured image of the chip product Q, and detects the state of the portion (non-sealing portion Tta) of the top tape Tt that is not thermocompression bonded to the carrier tape Tc based on both the image component of the first inspection light and the image component of the second inspection light in the captured image.

[0080] The specific manner of the image processing performed in the image processing device 114 is not limited, and the image processing device 114 executes the image processing required for each inspection according to an arbitrary algorithm. As an example, the image processing device 114 can detect at least one or more of the state of the workpiece W, the state of the carrier tape Tc, and the state of the top tape Tt by comparing the captured image of the chip product Q to be inspected with a reference image prepared in advance. That is, in the image processing performed by the image processing device 114, the state of the workpiece W may be detected based on the reference image of the image component of the first inspection light, the state of the carrier tape Tc may be detected based on the reference image of the image component of the second inspection light, and the state of at least a part (non-sealing portion Tta) of the top tape Tt may be detected based on the reference images of both the image component of the first inspection light and the image component of the second inspection light.

[0081] In the example shown in FIG. 5, the image processing apparatus 114 and the post-sealing inspection controller 61 that controls each part of the post-sealing inspection unit 15 (each first lighting device 111, each second lighting device 112, and the post-sealing imaging unit 62) are configured by a common device.

[0082] Connected to the post-sealing inspection controller 61 and the image processing apparatus 114 is a control unit 20 that also functions as an interface device 115 and an alarm device 116, and data (including commands (instructions)) is transmitted and received between the post-sealing inspection controller 61 and the image processing apparatus 114, and the control unit 20.

[0083] The interface device 115 includes an input device (e.g., a keyboard, a touch panel, and / or a mouse for the user), and the user can operate the input device to input various information into the interface device 115. The interface device 115 also includes an output device (e.g., a display and / or a speaker), and the user can recognize various information through the output device. Based on the data input by the user via the interface device 115, the image processing apparatus 114 performs image processing, and the control unit 20 and the post-sealing inspection controller 61 control various devices. Also, information regarding the image processing by the image processing apparatus 114 and information regarding the device control by the control unit 20 and the post-sealing inspection controller 61 are provided to the user via the interface device 115.

[0084] The result of the image processing by the image processing apparatus 114 is transmitted to the control unit 20. The alarm device 116 issues an alarm when at least one or more of the states of the workpiece W, the carrier tape Tc, and the top tape Tt detected by the image processing in the image processing apparatus 114 indicate an abnormality. The alarm mentioned here is issued in any form recognizable through the five senses of the user, and typically is issued as a visual display and / or a sound via the output device.

[0085] The post-sealing inspection unit 15 may be provided with a light-shielding cover (not shown) for suppressing the influence of external light on the captured image of the chip product Q.

[0086] Next, an example of a product inspection method that can be implemented by the post-sealing inspection unit 15 (see FIG. 5) of this modification will be described.

[0087] FIG. 6 is a flowchart showing an example of a product inspection method by the post-sealing inspection unit 15.

[0088] In the product inspection method of this example, first, while simultaneously irradiating the chip product Q to be inspected with the first inspection light and the second inspection light from each first lighting device 111 and each second lighting device 112, a captured image of the chip product Q to be inspected is acquired by the post-sealing imaging unit 62 (S21 in FIG. 6). The post-sealing imaging unit 62 may perform imaging in a state where the chip product Q to be inspected intermittently stops at the inspection position P0, or may perform imaging while the chip product Q to be inspected is moving.

[0089] The captured image of the chip product Q to be inspected is sent from the post-sealing imaging unit 62 to the image processing device 114 (post-sealing inspection controller 61). Then, by subjecting the captured image to image processing by the image processing device 114, a first inspection light image, a second inspection light image, and a composite inspection light image of the chip product Q to be inspected are acquired (extracted) from the captured image (S22).

[0090] Here, the first inspection light image is an image based on the image component of the first inspection light in the captured image, and in this example, it is a red component image. The second inspection light image is an image based on the image component of the second inspection light in the captured image, and in this example, it is a green component image. The composite inspection light image is an image based on both the image component of the first inspection light and the image component of the second inspection light in the captured image, and in this example, it is a mixed image of the red component and the green component.

[0091] The methods for obtaining the first inspection light image, the second inspection light image, and the composite inspection light image are not limited. As an example, the first inspection light image (red component image) is extracted by adjusting the hue and saturation of the captured image to match those of the red component, and the second inspection light image (green component image) is extracted by adjusting the hue and saturation of the captured image to match those of the green component. Also, by adjusting the hue and saturation of the captured image to match those of both the red component and the green component, a composite inspection light image (mixed image of the red component and the green component) is extracted.

[0092] Then, the image processing apparatus 114 performs first image processing based on the first inspection light image, second image processing based on the second inspection light image, and third image processing based on the composite inspection light image to inspect the chip product Q to be inspected (S23). In the present embodiment, the state of the workpiece W is detected by the first image processing based on the first inspection light image (red component image). Also, by the second image processing based on the second inspection light image (green component image), the state of the carrier tape Tc and the state of the portion (seal portion Ttb) of the top tape Tt thermocompression-bonded to the carrier tape Tc are detected. Further, by the third image processing based on the composite inspection light image (mixed image of the red component and the green component), the state of the portion (non-seal portion Tta) of the top tape Tt that is not thermocompression-bonded to the carrier tape Tc is detected.

[0093] For example, by performing image processing on the first inspection light image, it is possible to detect the edge of the workpiece electrode W1 of the workpiece W or to detect the density of the captured image of the workpiece electrode W1. Also, by performing image processing on the second inspection light image, it is possible to detect the position of the carrier tape Tc, detect the edge of the carrier tape Tc, detect the edge of the seal portion Ttb of the top tape Tt, or detect the density of the captured image of the seal portion Ttb. Further, by performing image processing on the composite inspection light image, it is possible to detect the position of the top tape Tt or to detect the edge of the top tape Tt.

[0094] Then, based on the above-described detection results regarding each element of the chip product Q, the image processing apparatus 114 determines whether the chip product Q is a non-defective product (or a defective product).

[0095] For example, based on the result of edge detection of the carrier tape Tc, the result of edge detection of the top tape Tt, the result of edge detection of the seal portion Ttb of the top tape Tt, and the result of edge detection of the work electrode W1 of the work W, dimensional inspection of the individual elements (work W, carrier tape Tc, and top tape Tt) of the chip product Q is performed. As a result of the dimensional inspection, if it is determined that the dimensions of the individual elements of the chip product Q are within a predetermined allowable range, the chip product Q is determined to be a non-defective product. If it is determined that the dimensions of any one or more elements are not within the allowable range, the chip product Q is determined to be a defective product.

[0096] Also, based on the detection result of the density of the captured image of the seal portion Ttb of the top tape Tt and the detection result of the density of the captured image of the work electrode W1 of the work W, a pass / fail inspection of the chip product Q is performed. That is, if it is determined that the density of the captured image of the seal portion Ttb and the density of the captured image of the work electrode W1 are within the allowable range, the chip product Q is determined to be a non-defective product. If it is determined that any of the captured image densities are not within the allowable range, the chip product Q is determined to be a defective product.

[0097] As a result of the above-described inspection, if an error is found in the chip product Q to be inspected and the chip product Q is determined to be a defective product (Y in S24), an error signal is sent from the image processing apparatus 114 to the alarm device 116 (control unit 20). As a result, an alarm is issued from the alarm device 116 (S25), and the error of the chip product Q is notified to the user. For example, when an error is detected in the seal portion Ttb of the top tape Tt, the alarm device 116 may issue a warning prompting the user to inspect and adjust the taping device 10 (for example, the sealing unit 14).

[0098] On the other hand, as a result of the above inspection, when it is determined that there is no error in the chip product Q to be inspected and the chip product Q is a non-defective product (N in S24), no alarm is issued from the alarm device 116 regarding the chip product Q.

[0099] The above series of processes (S21 to S25) are repeated for each chip product Q, and inspections are performed for each chip product Q. The results of the inspections for each chip product Q may be recorded. For example, the control unit 20 may store and save the ID (such as the serial number) of each chip product Q and the inspection result in a storage unit (storage medium) in association with each other. The data thus stored and saved in the storage unit can be read out as needed and used for various processes.

[0100] [Second Modified Example] The sealing unit 14 that performs thermocompression bonding of the carrier tape Tc and the top tape Tt is not limited to the above example (see FIG. 2) and may have an arbitrary configuration.

[0101] FIG. 7 is a perspective view showing another configuration example of the sealing unit 14.

[0102] The sealing unit 14 shown in FIG. 7 includes the swing arm body 71 that functions as the above-described sealing body, and also includes the rod 72, the piston mechanism 73, the electromagnetic mechanism 74, and the spring lever member 75 that function as the above-described seal drive unit.

[0103] One end of the swing arm body 71 is rotatably supported by a support portion installed on a base, and a heat seal action portion 711 is provided at the other end of the swing arm body 71. By the rotation of one end of the swing arm body 71, the swing arm body 71 swings about one end of the swing arm body 71, and the heat seal action portion 711 moves in the height direction along an arc orbit. The heat seal action portion 711 generates heat by being energized under the control of the control unit 20 and is controlled to a temperature suitable for thermocompression bonding of the carrier tape Tc and the top tape Tt.

[0104] One end of the rod 72 is connected to one end of the swing arm body 71 via a connecting member and is rotatably supported by a support portion. The swing arm body 71 and the rod 72 are fixed to each other via a connecting member and swing integrally about the connecting member that is rotatably supported by the support portion. The other end of the rod 72 acts as a driving end 721, and a spring acts directly or indirectly on the rod 72 to urge the driving end 721 of the rod 72 downward and apply a downward force to the driving end 721.

[0105] The electromagnetic mechanism 74 is positioned below the driving end 721 and can apply an upward force to the driving end 721. The spring lever member 75 is swingably attached to the base at its central portion, one end of which can apply an upward force to the driving end 721, and the other end of which can apply an upward force to the piston mechanism 73. Therefore, the piston mechanism 73 can raise the driving end 721 of the rod 72 via the spring lever member 75. In this way, the sealing body (i.e., the heat-sealing action portion 711 of the swing arm body 71) rises according to the operation of the piston mechanism 73 and is arranged at the standby position. When the piston mechanism 73 applies a force to the spring lever member 75 to operate the spring lever member 75, the taping body (i.e., the heat-sealing action portion 711 of the swing arm body 71) is positioned at the standby position. On the other hand, when the piston mechanism 73 does not apply a force to the spring lever member 75, the taping body (i.e., the heat-sealing action portion 711 of the swing arm body 71) is lowered by the spring against the electromagnetic mechanism 74. And the taping body (i.e., the heat-sealing action portion 711 of the swing arm body 71) is arranged at the taping position by such lowering of the taping body, and heat-pressure bonding of the carrier tape Tc and the top tape Tt can be performed. The sensor 76 is provided for the rod 72 or the taping body, and directly or indirectly detects that the taping body (i.e., the heat-sealing action portion 711 of the swing arm body 71) is at the standby position and / or the taping position, and transmits a detection signal to the control unit 20.

[0106] [Other Modification Examples] The pre-sealing inspection unit 13 and the post-sealing inspection unit 15 in the above-described embodiment perform inspections based on the analysis of captured images, but any other inspections can be performed. The pre-sealing inspection unit 13 and the post-sealing inspection unit 15 may, for example, acquire an X-ray captured image instead of a visible light captured image, and the inspection may be performed by analyzing the X-ray captured image. Further, the pre-sealing inspection unit 13 and the post-sealing inspection unit 15 may perform inspections based on the measurement results of sensors that measure any state quantity of the carrier tape Tc, the top tape Tt, and / or the workpiece W.

[0107] It should be noted that the embodiments and modification examples disclosed in this specification are merely illustrative in all respects and should not be construed in a limiting sense. The above-described embodiments and modification examples can be omitted, substituted, and changed in various forms without departing from the scope and spirit of the appended claims. For example, the above-described embodiments and modification examples may be combined wholly or partially, or embodiments other than the above may be combined with the above-described embodiments or modification examples. Also, the effects of the present disclosure described in this specification are merely illustrative, and other effects may be brought about.

[0108] The technical category for embodying the above-described technical idea is not limited. For example, the above-described technical idea may be embodied by a computer program for causing a computer to execute one or more procedures (steps) included in a method for manufacturing or using the above-described device. Also, the above-described technical idea may be embodied by a non-transitory computer-readable recording medium on which such a computer program is recorded.

Explanation of Reference Numerals

[0109] 10 Taping device, 11 Feeding unit, 12 Work supply unit, 13 Pre-sealing inspection unit, 14 Sealing unit, 15 Post-sealing inspection unit, 16 Buffer unit, 17 Tape recovery unit, 20 Control unit, 21 Carrier tape feeding section, 22 Top tape feeding section, 23 Feed delivery section, 24 Packing tape delivery section, 25 Packing tape recovery section, 31 Hopper, 32 Feeder, 33 Index table, 34 Insertion unit, 41 Sealing body, 42 Sealing drive section, 42a Piston mechanism, 42b Solenoid mechanism, 45 Carrier tape feeding section, 46 Top tape feeding section, 47 Packing tape feeding section, 51 Work inspection unit, 52 Work energization section, 53 Work imaging section, 56 Feed inspection unit, 57 Pre-sealing inspection controller, 58 Pre-sealing imaging section, 61 Post-sealing inspection controller, 62 Post-sealing imaging section, 65 Support frame, 66 Guide hole, 67 Guide bar, 71 Swing arm body, 72 Rod, 73 Piston mechanism, 74 Electromagnetic mechanism, 75 Spring lever member, 76 Sensor, 111 First lighting device, 112 Second lighting device, 114 Image processing device, 115 Interface device, 116 Alarm device, 711 Heat sealing action section, 721 Drive end, C Accommodation recess, Dc Imaging direction, Dt Conveying direction, DL1 First inspection light emission direction, DL2 Second inspection light emission direction, Lv Vertical line, P0 Inspection position, Q Chip product, Rb Buffer roller, Rg Guide roller, Tc Carrier tape, Tt Top tape, Tta Non-sealed portion, Ttb Sealed portion, Tp Packing tape, W Work, W0 Work body, W1 Work electrode

Claims

1. a sealing unit that performs thermal compression bonding of a top tape to a carrier tape on which a work is housed; a first inspection unit that inspects at least one of the work, the carrier tape, and the top tape that are packaged by the carrier tape and the top tape after the thermocompression bonding; a control unit for controlling the sealing unit and the first inspection unit, The control unit controls the first inspection unit so that the inspection by the first inspection unit is performed based on the driving of the sealing unit. Taping device.

2. a feed unit for feeding the carrier tape under the control of the control unit; The taping device according to claim 1 , wherein the control unit controls the feed unit so that the feed of the carrier tape by the feed unit is performed based on the driving of the sealing unit.

3. 2. The taping apparatus according to claim 1, further comprising a second inspection unit that inspects the workpieces contained in the carrier tape before the thermocompression bonding under the control of the control unit.

4. the control unit controls the feed unit so that the feed unit repeatedly performs intermittent feeding and intermittent stopping of the carrier tape, so that the carrier tape is intermittently fed by a set movement amount; 3. The taping device according to claim 2, wherein the inspection is performed during an intermittent stop of the carrier tape.

5. A step of thermocompressing a top tape to a carrier tape containing a workpiece by a sealing unit; and inspecting at least one of the work, the carrier tape, and the top tape that are packaged by the carrier tape and the top tape after the thermocompression bonding, The inspection is performed based on the actuation of the sealing unit. Taping method.

Images