Sample holder

Abstract

To provide a technology that can provide a sample holder capable of heating a sample uniformly.SOLUTION: A sample holder has a ceramic substrate, a heat generating resistive element, a first heat shield plate, and a second heat shield plate. The ceramic substrate has a first surface on which the sample is located and a second surface opposite the first surface. The heat-generating resistive element is located inside or on the second face of the ceramic substrate. The first heat shield plate has a third surface spaced apart from and facing the second surface and a fourth surface opposite the third surface. The second heat shield plate has a fifth surface spaced apart from and facing the fourth surface and a sixth surface opposite the fifth surface.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present disclosure relates to a sample holder.

Background Art

[0002] Conventionally, in the manufacturing process of electronic components and the like, a sample holder for holding flat samples such as semiconductor wafers, liquid crystal substrates, and circuit boards has been used. Patent Document 1 discloses a semiconductor manufacturing and inspection apparatus that uses a resistance heating element provided on the surface of a ceramic substrate to heat a sample such as a silicon wafer placed on the ceramic substrate.

[0003] The semiconductor manufacturing and inspection apparatus described in Patent Document 1 includes a plate-like body that is positioned to face one main surface of the ceramic substrate and functions as a bottom plate or a heat shield.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] The present disclosure provides a technique capable of providing a sample holder that can uniformly heat a sample.

Means for Solving the Problems

[0006] A sample holder according to an aspect of the present disclosure includes a ceramic substrate, a heating resistor, a first heat shield, and a second heat shield. The ceramic substrate has a first surface on which a sample is placed and a second surface located opposite to the first surface. The heating resistor is located inside the ceramic substrate or on the second surface. The first heat shield has a third surface facing the second surface at a distance and a fourth surface located opposite to the third surface. The second heat shield has a fifth surface facing the fourth surface at a distance and a sixth surface located opposite to the fifth surface.

Advantages of the Invention

[0007] According to the present disclosure, it is possible to provide a sample holder capable of uniformly heating a sample.

Brief Description of the Drawings

[0008]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Modes for Carrying Out the Invention

[0009] Next, embodiments for implementing a sample holder according to the present disclosure (hereinafter referred to as "embodiments") will be described in detail with reference to the drawings. Note that the present disclosure is not limited by these embodiments. Also, the respective embodiments can be appropriately combined within a range where the processing contents do not conflict. In addition, in the following embodiments, the same parts are denoted by the same reference numerals, and redundant explanations are omitted.

[0010] In addition, in the embodiments shown below, expressions such as "constant", "orthogonal", "perpendicular", or "parallel" may be used, but these expressions do not necessarily require strict "constant", "orthogonal", "perpendicular", or "parallel". That is, each of the above expressions is assumed to allow deviations such as manufacturing accuracy and installation accuracy.

[0011] In addition, in each of the drawings referred to below, for the sake of easy understanding of the description, an orthogonal coordinate system may be shown that defines an X-axis direction, a Y-axis direction, and a Z-axis direction that are orthogonal to each other, with the positive Z-axis direction being the vertically upward direction. Also, the rotation direction about the vertical axis may be referred to as the θ direction.

[0012] Patent Document 1 discloses a semiconductor manufacturing and inspection apparatus that uses a resistance heating element provided on the surface of a ceramic substrate to heat a silicon wafer placed on the ceramic substrate. The semiconductor manufacturing and inspection apparatus described in Patent Document 1 includes a plate-like body that functions as a bottom plate or a heat shield plate.

[0013] However, when the sample is heated using the resistance heating element in the above-described semiconductor manufacturing and inspection apparatus, the heat shield plate may warp due to the temperature difference between one main surface and the other main surface of the heat shield plate. If the heat shield plate warps, it cannot uniformly reflect the radiant heat from the ceramic substrate, and the heat uniformity of the ceramic substrate deteriorates.

[0014] Therefore, a sample holder that can uniformly heat a sample is expected.

[0015] (First Embodiment) <Configuration of Sample Holder First, the configuration of the sample holder 1 according to this embodiment will be described with reference to FIG. 1. FIG. 1 is a schematic cross-sectional view showing a configuration example of the sample holder 1 according to the first embodiment.

[0016] As shown in FIG. 1, the sample holder 1 includes a ceramic substrate 11, a plurality of heating resistors 12, a plurality of heat insulating plates 20, a base plate 13, a plurality of support members 14, and a plurality of fixing members 15.

[0017] The ceramic substrate 11 has, for example, a disc shape. The first surface 111 (here, the upper surface), which is one main surface of the ceramic substrate 11, is a surface on which a flat sample such as a semiconductor wafer, a liquid crystal substrate, or a circuit board is placed.

[0018] The ceramic substrate 11 may contain, for example, aluminum oxide (Al2O3), aluminum nitride (AlN), yttria (Y2O3), cordierite, silicon carbide (SiC), or silicon nitride (Si3N4) as a main component. The ceramic substrate 11 can be obtained, for example, by laminating and firing a plurality of green sheets.

[0019] Note that a conductive member may be located inside the ceramic substrate 11. For example, an electrode for electrostatic adsorption or a high-frequency electrode to which high-frequency power for plasma generation is applied may be located inside the ceramic substrate 11. Examples of the metal material constituting the electrode for electrostatic adsorption and the high-frequency electrode include tungsten, molybdenum, rhenium, their alloys, or platinum.

[0020] On the second surface 112 (here, the lower surface), which is the other main surface of the ceramic substrate 11, a plurality of heating resistors 12 are located. The plurality of heating resistors 12 have, for example, a concentric circular shape in plan view. The heating resistor 12 is a member that generates heat when an electric current flows through it. The heating resistor 12 is provided to heat a sample placed on the first surface 111. The heating resistor 12 may have a linear pattern (meander pattern) having a plurality of bent portions.

[0021] The heating resistor 12 is composed of, for example, a metal material. Examples of the metal material constituting the heating resistor 12 include tungsten, molybdenum, rhenium, their alloys, or platinum. The heating resistor 12 may contain a glass component such as an oxide such as silicon dioxide.

[0022] Note that the position of the heating resistor 12 is not limited to the second surface 112 of the ceramic substrate 11. For example, the heating resistor 12 may be located inside the ceramic substrate 11.

[0023] The ceramic substrate 11 is formed with a plurality of notches 113 that penetrate the first surface 111 and the second surface 112 (see FIG. 1). The notches 113 are arranged at the outer edge of the ceramic substrate 11. Specifically, the notches 113 extend radially inward from the outer edge of the ceramic substrate 11. A fixing member 15 described later is inserted into such notches 113.

[0024] The plurality of heat insulating plates 20 have, for example, a disc shape with a smaller diameter than the ceramic substrate 11. The plurality of heat insulating plates 20 are located between the ceramic substrate 11 and the base plate 13. The plurality of heat insulating plates 20 are arranged at equal intervals along the vertical direction. The heat insulating plate 20 is composed of, for example, metal. The detailed configuration of the plurality of heat insulating plates 20 will be described later.

[0025] The base plate 13 has, for example, a disk shape with a larger diameter than the ceramic substrate 11. The base plate 13 has a ninth surface 131 (here, the upper surface), which is the surface facing the eighth surface 232 of the third heat insulating plate 23, which is the farthest from the ceramic substrate 11 among the plurality of heat insulating plates 20, and a tenth surface 132 (here, the lower surface) located opposite to the ninth surface 131.

[0026] The base plate 13 has a plurality of through holes 133 penetrating the ninth surface 131 and the tenth surface 132. The plurality of through holes 133 are located at the outer peripheral portion of the base plate 13. A fixing member 15 described later is inserted into the plurality of through holes 133.

[0027] The base plate 13 may be made of, for example, metal. As the metal material for forming the base plate 13, for example, aluminum, stainless steel, titanium, aluminum-based composite materials such as AlSiC can be used.

[0028] The plurality of support members 14 are located between the ceramic substrate 11 and the base plate 13 and support the ceramic substrate 11 in a state of being separated from the base plate 13. The plurality of support members 14 support the ceramic substrate 11 so that the ceramic substrate 11 and the base plate 13 are parallel. The support member 14 is made of a metal such as stainless steel.

[0029] The plurality of fixing members 15 fix the ceramic substrate 11 to the base plate 13. The fixing member 15 includes a head portion that abuts against the first surface 111 and a shaft portion that extends from such a head portion toward the base plate 13. Specifically, the head portion abuts against the first surface 111 so as to cover the notch 113. The shaft portion is connected to the contact surface of the head portion with the first surface 111, and is inserted through the notch 113 and the through hole 133. The tip of the shaft portion protrudes from the through hole 133. The tip of the shaft portion has a thread groove on the outer peripheral surface. The fixing member 15 is made of a metal such as stainless steel.

[0030] The sample holder 1 also includes a nut 16, a spring member 17, and a spring stopper 18. The nut 16, the spring member 17, and the spring stopper 18 are located on the side of the 10th surface 132 of the base plate 13 and are inserted through the shaft portion of the fixing member 15. The nut 16, the spring member 17, and the spring stopper 18 are positioned in the order of the spring member 17, the spring stopper 18, and the nut 16, in this order, closer to the 10th surface 132 of the base plate 13. The nut 16 is screwed into a screw groove provided at the tip of the shaft portion. The spring member 17 biases the spring stopper 18 and the nut 16 in a direction away from the 10th surface 132 of the base plate 13. In other words, the spring member 17 biases the base plate 13 in a direction approaching the ceramic substrate 11. Also, due to the biasing force of the spring member 17, the head of the fixing member 15 is pressed against the 1st surface 111 of the ceramic substrate 11, so that the ceramic substrate 11 is biased in a direction approaching the base plate 13. As a result, the ceramic substrate 11 and the base plate 13 are integrally fixed via a plurality of support members 14.

[0031] When heating a sample using the heating resistor 12, the sample holder 1 configured as described above can reflect the radiant heat from the ceramic substrate 11 by the heat shield 20 and reduce the amount of heat transferred to the base plate 13.

[0032] However, if there is only one heat shield 20, when the temperature rises, a temperature difference occurs between the main surface facing the ceramic substrate 11 and the main surface located on the opposite side among the two main surfaces of the heat shield 20, and there is a possibility that the heat shield 20 may warp due to such a temperature difference. If the heat shield 20 warps, the radiant heat from the ceramic substrate 11 cannot be reflected uniformly, and the heat uniformity of the ceramic substrate 11 deteriorates. On the other hand, if the heat shield 20 is made thicker to make it less likely to warp, the heating efficiency and cooling efficiency of the sample may decrease.

[0033] Therefore, the sample holder 1 according to the first embodiment is configured to include a plurality of heat insulating plates 20 that are located at a distance from each other. As a result, the space between two adjacent heat insulating plates 20 functions as a heat insulating layer, so that a thicker heat insulating layer can be formed compared to the case where only one heat insulating plate 20 is provided. When the heat insulating layer is thick, warping of the heat insulating plate 20 is less likely to occur. Therefore, radiant heat from the ceramic substrate 11 can be uniformly reflected, and the heat uniformity of the ceramic substrate 11 can be improved. Accordingly, the sample can be heated uniformly. Also, the heating efficiency and cooling efficiency of the sample can be increased compared to the case where the heat insulating plate 20 is simply made thick.

[0034] Next, the relationship between the ceramic substrate 11 and the plurality of heat insulating plates 20 according to the first embodiment will be further described with reference to FIG. 2. FIG. 2 is a schematic side view showing the relationship between the ceramic substrate 11 and the plurality of heat insulating plates 20 according to the first embodiment.

[0035] As shown in FIG. 2, the plurality of heat insulating plates 20 include a first heat insulating plate 21, a second heat insulating plate 22, and a third heat insulating plate 23. Here, the number of the heat insulating plates 20 is three. However, the number of the heat insulating plates 20 is not limited to three. For example, the number of the heat insulating plates 20 may be two, or may be four or more.

[0036] The first heat shield 21 is positioned to face the second surface 112 of the ceramic substrate 11. Specifically, the first heat shield 21 has a third surface 211 (here, the upper surface) that faces the second surface 112 at a distance, and a fourth surface 212 (here, the lower surface) that is located opposite the third surface 211. As shown in FIG. 1, the first heat shield 21 includes a plurality of through holes 21a that penetrate the third surface 211 and the fourth surface 212. The second heat shield 22 includes a plurality of through holes 22a that penetrate a fifth surface 221 and a sixth surface 222 at positions corresponding to the plurality of through holes 21a. The third heat shield 23 includes a plurality of through holes 23a that penetrate the fifth surface 221 and the sixth surface 222 at positions corresponding to the plurality of through holes 21a. Threaded holes 131a are formed in the ninth surface 131 of the base plate 13 at positions corresponding to the plurality of through holes 21a. A first fixing member 61 is inserted through the through holes 21a of the first heat shield 21, the through holes 22a of the second heat shield 22, and the through holes 23a of the third heat shield 23, and the threaded holes 131a of the base plate 13 are screwed with such first fixing member 61. Thereby, the base plate 13 and the first heat shield 21 are fixed.

[0037] The second heat shield 22 is positioned to face the fourth surface 212 of the first heat shield 21. Specifically, the second heat shield 22 has a fifth surface 221 (here, the upper surface) that faces the fourth surface 212 at a distance, and a sixth surface 222 (here, the lower surface) that is located opposite the fifth surface 221.

[0038] The third heat shield 23 is positioned to face the sixth surface 222 of the second heat shield 22. Specifically, the third heat shield 23 has a seventh surface 231 (here, the upper surface) that faces the sixth surface 222 at a distance, and an eighth surface 232 (here, the lower surface) that is located opposite the seventh surface 231.

[0039] A plurality of screw holes 21b are formed in the fourth surface 212 of the first heat shield plate 21. The second heat shield plate 22 is provided with a plurality of through holes 22b penetrating through the fifth surface 221 and the sixth surface 222 at positions corresponding to the plurality of screw holes 21b. The third heat shield plate 23 is provided with a plurality of through holes 23b penetrating through the fifth surface 221 and the sixth surface 222 at positions corresponding to the plurality of screw holes 21b. The second fixing member 62 is inserted into the through holes 22b of the second heat shield plate 22 and the through holes 23b of the third heat shield plate 23, and the first heat shield plate 21, the second heat shield plate 22, and the third heat shield plate 23 are fixed by screwing the screw holes 21b of the first heat shield plate 21 and the second fixing member 62.

[0040] In addition, in a plan view of the sample holder 1, the centers of gravity of the plurality of heat shield plates 20 may coincide. Also, the plurality of heat shield plates 20 may be concentric. Further, in a plan view of the sample holder 1, the outer peripheries of the plurality of heat shield plates 20 may coincide.

[0041] As described above, the sample holder 1 according to the first embodiment includes a plurality of heat shield plates 20 that are spaced apart from each other. Thereby, since the space between two adjacent heat shield plates 20 functions as a heat insulation layer, a thicker heat insulation layer can be formed compared to the case where only one heat shield plate 20 is provided. When the heat insulation layer is thick, warping of the heat shield plate 20 is less likely to occur. Therefore, radiant heat from the ceramic substrate 11 can be uniformly reflected, and the heat uniformity of the ceramic substrate 11 can be improved. Accordingly, the sample can be heated uniformly.

[0042] (Second Embodiment) FIG. 3 is a schematic side view showing the relationship between the ceramic substrate 11 and the plurality of heat shield plates 20 according to the second embodiment. As shown in FIG. 3, the interval between two adjacent heat shield plates 20 may be narrower than the interval between the ceramic substrate 11 and the first heat shield plate 21, which is the closest to the ceramic substrate 11 among the plurality of heat shield plates 20. That is, the interval S2 between the first heat shield plate 21 and the second heat shield plate 22 may be narrower than the interval S1 between the ceramic substrate 11 and the first heat shield plate 21. Similarly, the interval S3 between the second heat shield plate 22 and the third heat shield plate 23 may be narrower than the interval S1 between the ceramic substrate 11 and the first heat shield plate 21.

[0043] Since the space between the first heat shield 21 and the second heat shield 22 functions as a heat insulating layer, if such a space is large, the temperature of the fourth surface 212 of the first heat shield 21 may drop too much, and due to the temperature difference between the third surface 211 and the fourth surface 212, the first heat shield 21 may warp. Therefore, by narrowing the distance between the first heat shield 21 and the second heat shield 22, such a space can be made smaller, and the temperature difference between the third surface 211 and the fourth surface 212 becomes smaller, so the first heat shield 21 is less likely to warp.

[0044] (Third Embodiment) Figs. 4 and 5 are schematic side views showing the relationship between the ceramic substrate 11 and the plurality of heat shields 20 according to the third embodiment. The distance S4 between the first heat shield 21 and the second heat shield 22 may be different from the distance S5 between the second heat shield 22 and the third heat shield 23. Specifically, as shown in Fig. 4, the distance S4 between the first heat shield 21 and the second heat shield 22 may be wider than the distance S5 between the second heat shield 22 and the third heat shield 23. Even if the distance S5 between the second heat shield 22 and the third heat shield 23, which is far from the ceramic substrate 11, is made narrower than the distance S4 between the first heat shield 21 and the second heat shield 22, it is less likely to be affected by the heat of the ceramic substrate 11. Also, compared with the case where the distance S4 and the distance S5 are equal, the entire sample holder 1 can be made more compact.

[0045] Also, as shown in Fig. 5, the distance S6 between the first heat shield 21 and the second heat shield 22 may be narrower than the distance S7 between the second heat shield 22 and the third heat shield 23. If the space between the first heat shield 21 and the second heat shield 22 is small, it is possible to make it less susceptible to the influence of convection occurring in such a space, and the heat shield 20 is less likely to warp.

[0046] (Fourth Embodiment) FIG. 6 is a schematic side view showing the relationship between the ceramic substrate 11 and the plurality of heat insulating plates 20 according to the fourth embodiment. As shown in FIG. 6, the thickness T2 of the second heat insulating plate 22 or the thickness T3 of the third heat insulating plate 23 may be thinner than the thickness T1 of the first heat insulating plate 21. According to such a configuration, since the heat capacity of the second heat insulating plate 22 or the third heat insulating plate 23 becomes small, the heating efficiency and the cooling efficiency of the sample can be improved.

[0047] (Fifth Embodiment) FIG. 7 is a schematic side view showing the relationship between the ceramic substrate 11 and the plurality of heat insulating plates 20 according to the fifth embodiment. As shown in FIG. 7, a heat insulating material 30 may be provided between two adjacent heat insulating plates 20. That is, a heat insulating material 30 may be provided between the first heat insulating plate 21 and the second heat insulating plate 22. Similarly, a heat insulating material 30 may be provided between the second heat insulating plate 22 and the third heat insulating plate 23.

[0048] By disposing the heat insulating material 30 in the space between two adjacent heat insulating plates 20, convection can be made difficult to occur in such a space. Therefore, compared with the case where the heat insulating material 30 is not provided, the heat insulating effect is stable, and warping of the heat insulating plate 20 is less likely to occur even when heating and cooling are repeated.

[0049] The heat insulating material 30 may be made of, for example, a material having a lower thermal conductivity than metal. Specifically, the heat insulating material 30 may include ceramics such as porous ceramics and ceramic fibers, or glass wool. In particular, it is preferable that the heat insulating material 30 includes ceramics. Since the porosity is generally constant compared with glass wool, the heat insulating effect is stable, and warping of the heat insulating plate 20 is less likely to occur even when heating and cooling are repeated.

[0050] (Sixth Embodiment) FIG. 8 is a schematic side view showing the relationship between the ceramic substrate 11 and the plurality of heat insulating plates 20 according to the sixth embodiment. As shown in FIG. 8, the third surface 211 of the first heat insulating plate 21 may have a coating film 40. According to such a configuration, compared with the case where the coating film 40 is not provided on the third surface 211, the first heat insulating plate 21 is less likely to deteriorate, so that the durability of the first heat insulating plate 21 can be improved.

[0051] The coating film 40 may be composed of, for example, nickel, chromium, alumite, or gold.

[0052] (Seventh Embodiment) FIGS. 9 and 10 are schematic side views showing the relationship between the ceramic substrate 11 and the plurality of heat insulating plates 20 according to the seventh embodiment. The surface area of the first heat insulating plate 21 may be different from the surface area of the second heat insulating plate 22. Specifically, as shown in FIG. 9, the second heat insulating plate 22 may have a smaller surface area than the first heat insulating plate 21. According to such a configuration, since the heat capacity of the second heat insulating plate 22 becomes small, the heating efficiency and the cooling efficiency of the sample can be increased.

[0053] Also, as shown in FIG. 10, the second heat insulating plate 22 may have a larger surface area than the first heat insulating plate 21. The first heat insulating plate 21 is closer to the ceramic substrate 11 than the second heat insulating plate 22 and is more likely to be affected by the heat generated from the heating resistor 12. When the surface area of the second heat insulating plate 22 is larger than the surface area of the first heat insulating plate 21, when the first heat insulating plate 21 thermally expands during temperature rise, the surface area becomes close to that of the second heat insulating plate 22, and the structure can be stabilized.

[0054] (Eighth Embodiment) FIG. 11 is a schematic perspective view showing the configuration of a plurality of heat insulating plates 20 according to the eighth embodiment. As shown in FIG. 11, the heat insulating plate 20 may have a plurality of through holes 50. Specifically, the first heat insulating plate 21 may have a plurality of first through holes 51 penetrating the third surface 211 and the fourth surface 212. The second heat insulating plate 22 may have a plurality of second through holes 52 penetrating the fifth surface 221 and the sixth surface 222. The third heat insulating plate 23 may have a plurality of third through holes 53 penetrating the seventh surface 231 and the eighth surface 232. According to such a configuration, the heat capacity of the heat insulating plate 20 is smaller than that in the case where the through holes 50 are not provided, so that the heating efficiency and the cooling efficiency of the sample can be improved.

[0055] The first through hole 51, the second through hole 52, and the third through hole 53 may be located at different positions from each other in the in-plane direction of the first heat insulating plate 21, the second heat insulating plate 22, and the third heat insulating plate 23. According to such a configuration, the heat insulation effect can be enhanced as compared with the case where the first through hole 51, the second through hole 52, and the third through hole 53 are located at the same position in the in-plane direction of the first heat insulating plate 21, the second heat insulating plate 22, and the third heat insulating plate 23.

[0056] Note that the present technology can also adopt the following configuration. (1) The sample holder (for example, the sample holder 1) includes a ceramic substrate (for example, the ceramic substrate 11), a heating resistor (for example, the heating resistor 12), a first heat insulating plate (for example, the first heat insulating plate 21), and a second heat insulating plate (for example, the second heat insulating plate 22). The ceramic substrate has a first surface (for example, the first surface 111) on which the sample is placed and a second surface (for example, the second surface 112) located opposite to the first surface. The heating resistor is located inside the ceramic substrate or on the second surface. The first heat insulating plate has a third surface (for example, the third surface 211) facing the second surface at a distance and a fourth surface (for example, the fourth surface 212) located opposite to the third surface. The second heat insulating plate has a fifth surface (for example, the fifth surface 221) facing the fourth surface at a distance and a sixth surface (for example, the sixth surface 222) located opposite to the fifth surface. (2) In a side view of the sample holder described in the above (1), the distance between the first heat shield and the second heat shield may be narrower than the distance between the ceramic substrate and the first heat shield. (3) The sample holder described in the above (1) includes a third heat shield (e.g., the third heat shield 23) having a seventh surface (e.g., the seventh surface 231) that is spaced apart and opposed to the sixth surface, and an eighth surface (e.g., the eighth surface 232) that is located opposite to the seventh surface. The distance between the first heat shield and the second heat shield may be different from the distance between the second heat shield and the third heat shield. (4) In the sample holder described in the above (1), the thickness of the second heat shield may be thinner than the thickness of the first heat shield. (5) The sample holder described in the above (1) may include a heat insulating material (e.g., the heat insulating material 30) located between the first heat shield and the second heat shield. (6) In the sample holder described in the above (1), the heat insulating material may contain ceramics. (7) The sample holder described in the above (1) may have a coating film (e.g., the coating film 40) on the third surface of the first heat shield. (8) In the sample holder described in the above (1), the second heat shield may have a smaller surface area than the first heat shield. (9) In the sample holder described in the above (1), the first heat shield has a plurality of first through holes (e.g., the first through holes 51) that penetrate the third surface and the fourth surface, and the second heat shield has a plurality of second through holes (e.g., the second through holes 52) that penetrate the fifth surface and the sixth surface. The first through holes and the second through holes may be located at different positions from each other in the in-plane direction of the first heat shield and the second heat shield. (10) The sample holder described in the above (1) may include a base plate (for example, base plate 13) positioned to face the sixth surface of the second heat insulating plate, a support member (for example, support member 14) positioned between the ceramic substrate and the base plate and supporting the ceramic substrate in a state separated from the base plate, a first fixing member (for example, first fixing member 61) for fixing the first heat insulating plate in a state separated from the base plate, and a second fixing member (for example, second fixing member 62) for fixing the second heat insulating plate in a state separated from the first heat insulating plate.

[0057] The embodiments disclosed this time should be considered illustrative in all respects and not restrictive. Indeed, the above-described embodiments can be embodied in various forms. Also, the above embodiments may be omitted, substituted, or changed in various forms without departing from the scope and spirit of the appended claims.

Explanation of Reference Numerals

[0058] 1 Sample holder 11 Ceramic substrate 12 Heating resistor 13 Base plate 14 Support member 15 Fixing member 20 Heat insulating plate 21 First heat insulating plate 22 Second heat insulating plate 111 First surface 112 Second surface 211 Third surface 212 Fourth surface 221 Fifth surface 222 Sixth surface

Claims

1. A ceramic substrate, A heating resistor, A first heat shield, A second heat shield and comprising The ceramic substrate has a first surface on which a sample is placed and a second surface located opposite to the first surface, The heating resistor is located inside the ceramic substrate or on the second surface, The first heat shield has a third surface facing the second surface at a distance and a fourth surface located opposite to the third surface, The second heat shield has a fifth surface facing the fourth surface at a distance and a sixth surface located opposite to the fifth surface, a sample holder.

2. In a side view of the sample holder, the distance between the first heat shield and the second heat shield is narrower than the distance between the ceramic substrate and the first heat shield, the sample holder according to claim 1.

3. Comprising a third heat shield having a seventh surface facing the sixth surface at a distance and an eighth surface located opposite to the seventh surface, The distance between the first heat shield and the second heat shield is different from the distance between the second heat shield and the third heat shield, the sample holder according to claim 1 or 2.

4. The thickness of the second heat shield is thinner than the thickness of the first heat shield, the sample holder according to claim 1 or 2.

5. Comprising a heat insulating material located between the first heat shield and the second heat shield, the sample holder according to claim 1 or 2.

6. The heat insulating material contains ceramic, the sample holder according to claim 5.

7. The third surface of the first heat shield has a coating film, the sample holder according to claim 1 or 2.

8. The sample holder according to claim 1 or 2, wherein the second heat shield has a smaller surface area than the first heat shield.

9. The first heat shield has a plurality of first through-holes penetrating the third surface and the fourth surface. The second heat shield has a plurality of second through-holes penetrating the fifth surface and the sixth surface. The sample holder according to claim 1 or 2, wherein the first through-holes and the second through-holes are located at different positions from each other in the in-plane direction of the first heat shield and the second heat shield.

10. A base plate located opposite to the sixth surface of the second heat shield. A support member located between the ceramic substrate and the base plate and supporting the ceramic substrate in a state of being separated from the base plate. A first fixing member for fixing the first heat shield to the base plate in a separated state. A second fixing member for fixing the second heat shield to the first heat shield in a separated state. The sample holder according to claim 1 or 2, comprising:

Images