Processing device and processing method

Abstract

To enable a suppression of a consumption of a power.SOLUTION: A processing device 1 comprises: a processing unit that executes a processing to an object; and a control unit 100 that controls the processing unit. The processing device 1 comprises: a main switch 63 that is distributed to a main circuit 61 that supplies a power from a power supply 130 to the control unit 100, and switches a supply and a switch of the power to the control unit 100; and a sub-switch 64 that is distributed to a sub-circuit 62 that supplies the power from the power supply 130 to a construction component 70 of the processing unit, and switches the supply and the stop of the power to the construction component 70 of the processing unit.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present invention relates to a processing apparatus and a processing method for performing processing on an object.

Background Art

[0002] In processing apparatuses such as cutting apparatuses, laser processing apparatuses, grinding apparatuses, turning cutting apparatuses, cleaning apparatuses, tape mounters, tape expanding apparatuses, inspection apparatuses, and flexural strength testing apparatuses, processing conditions such as processing conditions, cleaning conditions, sticking conditions, expanding conditions, inspection conditions, and test conditions for performing processing such as processing, cleaning, and measurement on an object are input in advance. Further, each processing apparatus stores the operation history and the details of the errors that have occurred as a log over time. Furthermore, each processing apparatus stores a captured image of the object on which the processing has been performed. (For example, refer to Patent Document 1, Patent Document 2, and Patent Document 3).

[0003] By the way, in various processing apparatuses, when the processing apparatus is operated, power from the power supply connected to the processing apparatus is supplied to the processing apparatus, enabling the processing apparatus to perform processing on the object. Then, when the use of the processing apparatus is completed, the power supply from the power supply is stopped by shutting down the processing apparatus.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Patent Document 2

Patent Document 3

Summary of the Invention

Problems to be Solved by the Invention

[0005] Conventionally, there has been a case where processing conditions are input or edited in a processing device, or the processing device is operated only for checking the processing conditions. Similarly, the processing device is operated only for checking the logs and captured images stored in the processing device, or for extracting information such as these processing conditions, logs, and captured images from the processing device using an external storage device such as a USB memory (USB flash drive).

[0006] However, a processing device that is operating in a state where it can process an object consumes corresponding power, and improvement has been eagerly desired.

[0007] An object of the present invention is to provide a processing device and a processing method capable of suppressing power consumption.

Means for Solving the Problems

[0008] In order to solve the above-described problems and achieve the object, a processing device of the present invention is a processing device including a processing unit that performs processing on an object and a control unit that controls the processing unit, and is disposed in a main circuit that supplies power from a power source to the control unit, and includes a main switch that switches the supply and stop of power to the control unit, and is disposed in a sub-circuit that supplies power from the power source to the processing unit, and includes a sub-switch that switches the supply and stop of power to the processing unit.

[0009] In the processing device, the sub-switch may be switched by the control unit to which power is supplied.

[0010] The processing device may be connected to an external control device, and the external control device may switch the main switch to switch the supply and stop of power to the processing device.

[0011] The processing method of the present invention is a processing method for subjecting an object to processing by the processing device, and includes a startup step of starting the processing device by the main switch and supplying power from the power source to the control unit, a processing preparation step of supplying power from the power source to the processing unit by the sub-switch after the startup step is implemented, and a processing step of subjecting the object to processing by the processing unit after the processing preparation step is implemented.

Effect of the Invention

[0012] The present invention has the effect of suppressing power consumption.

Brief Description of the Drawings

[0013]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Modes for Carrying Out the Invention

[0014] Embodiments for carrying out the present invention (embodiments) will be described in detail with reference to the drawings. The present invention is not limited by the contents described in the following embodiments. In addition, the constituent elements described below include those that can be easily assumed by those skilled in the art and substantially the same ones. Furthermore, the configurations described below can be combined as appropriate. Also, various omissions, substitutions, or changes in the configuration can be made without departing from the gist of the present invention.

[0015] 〔Embodiment 1〕 A processing apparatus according to Embodiment 1 of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing a configuration example of the processing apparatus according to Embodiment 1. FIG. 2 is a perspective view schematically showing a configuration example of an object to be processed by the processing apparatus shown in FIG. 1. FIG. 3 is a diagram showing a power supply system of the processing apparatus shown in FIG. 1.

[0016] (Object) The processing apparatus 1 shown in FIG. 1 according to Embodiment 1 is a cutting apparatus (also referred to as a processing apparatus) that performs cutting processing (equivalent to processing) on the object 200 shown in FIG. 2. In Embodiment 1, the object 200 to be processed by the processing apparatus 1 is a wafer such as a disk-shaped semiconductor wafer or an optical device wafer having a substrate such as silicon, sapphire, gallium arsenide, or SiC (silicon carbide).

[0017] As shown in FIG. 2, devices 203 are formed in each region of the object 200 partitioned by a plurality of division planned lines 202 formed in a lattice pattern on the surface 201.

[0018] The device 203 is, for example, an integrated circuit such as an IC (Integrated Circuit) or an LSI (Large Scale Integration), an image sensor such as a CCD (Charge Coupled Device) or a CMOS (Complementary Metal Oxide Semiconductor), various memories (semiconductor storage devices) such as MEMS (Micro Electro Mechanical Systems), an LED (light emitting element: Light Emitting Diode), or a power device.

[0019] A disk-shaped adhesive tape having a diameter larger than that of the object 200 is attached to the back surface 210 on the back side of the surface 201 of the object 200, and an annular frame is attached to the outer edge portion of the adhesive tape and is supported within the opening of the annular frame. The object 200 is supported within the opening of the annular frame and is divided into individual devices 203 along the division planned lines 202.

[0020] (Processing apparatus) The processing device 1 shown in FIG. 1 is a cutting device that holds the object 200 on the holding table 10 and performs cutting (equivalent to processing) with the cutting blade 21 along the planned division line 202 to divide the object 200 into individual devices 203. As shown in FIG. 1, the processing device 1 includes a holding table 10 that sucks and holds the object 200 on the holding surface 11, a cutting unit 20 that performs cutting (equivalent to processing) on the object 200 held on the holding table 10 with the cutting blade 21, an imaging unit (not shown) that images the object 200 held on the holding table 10, and a control unit 100.

[0021] In addition, the processing device 1 includes a moving unit (not shown) that relatively moves the holding table 10 and the cutting unit 20. The moving unit includes an X-axis moving unit that is a machining feed unit that feeds the holding table 10 in the X-axis direction parallel to the horizontal direction, a Y-axis moving unit that is an indexing feed unit that indexes and feeds the cutting unit 20 in the Y-axis direction parallel to the horizontal direction and orthogonal to the X-axis direction, a Z-axis moving unit that is a cutting feed unit that feeds the cutting unit 20 in the Z-axis direction parallel to the vertical direction orthogonal to both the X-axis direction and the Y-axis direction, and at least a rotational moving unit that rotates the holding table 10 around an axis parallel to the Z-axis direction.

[0022] As shown in FIG. 1, the processing device 1 includes two cutting units 20, that is, a two-spindle dicing saw, a so-called facing dual-type cutting device. The moving unit of the processing device 1 includes two Y-axis moving units and two Z-axis moving units respectively, and these two Y-axis moving units and Z-axis moving units correspond to each of the cutting units 20.

[0023] The X-axis moving unit is installed on the apparatus main body 2, and moves the holding table 10 together with the rotational movement unit in the X-axis direction, which is the machining feed direction, so as to relatively machine-feed the holding table 10 and the cutting unit 20 along the X-axis direction. The Y-axis moving unit is installed on a gantry-shaped support frame (not shown) erected from the apparatus main body 2, and moves the corresponding cutting unit 20 in the Y-axis direction, which is the indexing feed direction, so as to relatively index-feed the holding table 10 and the cutting unit 20 along the Y-axis direction. The Z-axis moving unit is installed on a moving frame (not shown) moved in the Y-axis direction by the Y-axis moving unit, and moves the corresponding cutting unit 20 in the Z-axis direction, which is the plunge feed direction, so as to relatively plunge-feed the holding table 10 and the cutting unit 20 along the Z-axis direction.

[0024] The X-axis moving unit, the Y-axis moving unit, and the Z-axis moving unit include a well-known ball screw rotatably provided around an axis, a well-known motor for rotating the ball screw around the axis, and a well-known guide rail for movably supporting the holding table 10 or the cutting unit 20 in the X-axis direction, the Y-axis direction, or the Z-axis direction. The rotational movement unit includes a well-known motor or the like for rotating the holding table 10 around an axis.

[0025] The holding table 10 has a disk shape, and a holding surface 11 for holding the object 200 is formed of porous ceramic or the like. Further, the holding table 10 is movably provided in the X-axis direction across a machining area below the cutting unit 20 and a loading / unloading area where the object 200 is loaded / unloaded while being separated from below the cutting unit 20 by the X-axis moving unit, and is rotatably provided around an axis parallel to the Z-axis direction by the rotational movement unit.

[0026] The holding table 10 has a holding surface 11 connected to a vacuum suction source (not shown), and by being suctioned by the vacuum suction source, the object 200 placed on the holding surface 11 is suction-held. In Embodiment 1, the holding table 10 suction-holds the back surface 210 side of the object 200 via an adhesive tape. Further, a plurality of clamp portions 12 for clamping an annular frame are provided around the holding table 10.

[0027] The cutting unit 20 is a processing unit detachably equipped with a cutting blade 21 for cutting the object 200 held by the holding table 10. Each cutting unit 20 is attached to a second moving frame (not shown) movable in the Z-axis direction by a corresponding Z-axis moving unit, and is provided so as to be movable in the Y-axis direction by a Y-axis moving unit and movable in the Z-axis direction by a Z-axis moving unit with respect to the object 200 held by the holding table 10. The cutting unit 20 can position the cutting blade 21 at any position on the holding surface 11 of the holding table 10 by the Y-axis moving unit and the Z-axis moving unit.

[0028] The cutting unit 20 includes a cutting blade 21, a spindle housing 22 attached to the lower end of the second moving frame and provided so as to be movable in the Y-axis direction and the Z-axis direction by a Y-axis moving unit and a Z-axis moving unit, a spindle (not shown) that is rotatably provided around the axis of rotation in the spindle housing 22, a spindle motor 23 (shown in FIG. 3) that rotates the spindle around the axis of rotation, and a supply nozzle (not shown) that supplies cutting water to the cutting blade 21 during cutting.

[0029] The cutting blade 21 is an extremely thin grinding wheel having a substantially ring shape for cutting an object 200. In Embodiment 1, the cutting blade 21 includes an annular cutting edge for cutting the object 200 and an annular base supported at the outer edge of the cutting edge and detachably attached to the spindle. The cutting edge is formed of abrasive grains such as diamond or CBN (Cubic Boron Nitride) and a bonding material (binder) such as metal or resin and has a predetermined thickness. In the present invention, the cutting blade 21 may be a so-called washer blade composed only of the cutting edge.

[0030] The spindle housing 22 is attached to the lower end of the second moving frame and is supported so as to be movable in the Z-axis direction by a Z-axis moving unit and is supported so as to be movable in the Y-axis direction by a Y-axis moving unit via the Z-axis moving unit and the moving frame. The spindle housing 22 houses a portion excluding the tip of the spindle and the spindle motor 23 and supports the spindle so as to be rotatable about the axis.

[0031] The spindle is one to which the cutting blade 21 is detachably fixed at the tip. The spindle is rotated by the spindle motor 23, and the tip portion thereof protrudes from the tip surface of the spindle housing 22. The tip portion of the spindle is gradually formed thinner toward the tip, and the cutting blade 21 is attached thereto. The axes of the spindle of the cutting unit 20 and the cutting blade 21 are parallel to the Y-axis direction.

[0032] The cutting unit 20 rotates the cutting blade 21 about the axis by the spindle while supplying cutting water from the supply nozzle to the cutting blade 21. The cutting unit 20 cuts the cutting edge of the cutting blade 21 rotating about the axis into the planned division line 202 until it reaches the adhesive tape, cuts the planned division line 202 with the cutting blade 21, and divides the object 200 into individual devices 203.

[0033] The imaging unit images the object 200 held by the holding table 10 and acquires an imaging image. The imaging unit includes an imaging element that images the area to be machined of the object 200 before machining held by the holding table 10. The imaging element is, for example, a CCD (Charge-Coupled Device) imaging element or a CMOS (Complementary MOS) imaging element. The imaging unit images the object 200 held by the holding table 10, acquires an image for performing alignment such as aligning the object 200 with the cutting blade 21, and outputs the acquired image to the control unit 100.

[0034] Further, the processing device 1 includes an X-axis direction position detection unit (not shown) for detecting the position of the holding table 10 in the X-axis direction, a Y-axis direction position detection unit (not shown) for detecting the position of the cutting unit 20 in the Y-axis direction, and a Z-axis direction position detection unit for detecting the position of the cutting unit 20 in the Z-axis direction. The X-axis direction position detection unit and the Y-axis direction position detection unit can be composed of a linear scale parallel to the X-axis direction or the Y-axis direction and a reading head. The Z-axis direction position detection unit detects the position of the cutting unit 20 in the Z-axis direction by the pulses of the motor.

[0035] The X-axis direction position detection unit, the Y-axis direction position detection unit, and the Z-axis direction position detection unit output the positions of the holding table 10 in the X-axis direction, the cutting unit 20 in the Y-axis direction, or the Z-axis direction to the control unit 100. The angle detection unit outputs the angle from the reference position around the axis of the holding table 10 to the control unit 100. In the first embodiment, the positions of the components of the processing device 1 in the X-axis direction, the Y-axis direction, and the Z-axis direction are determined based on a predetermined reference position (not shown).

[0036] The processing device 1 also includes a cassette elevator 50 that places a cassette (not shown) containing the object 200 before and after cutting and moves the cassette in the Z-axis direction, a cleaning unit (not shown) that cleans the object 200 after cutting, and a transfer unit (not shown) that transfers the object 200 between the cassette, the holding table 10, and the cleaning unit.

[0037] In Embodiment 1, the holding table 10, the cutting unit 20, the imaging unit, the moving unit, the cassette elevator 50, the cleaning unit, and the transfer unit of the processing device 1 correspond to processing units that perform a processing operation of performing processing (cutting in Embodiment 1) on the object 200. Further, these processing units are configured to include various components that operate by being supplied with power such as the spindle motor 23, the motor 24, and the solenoid valve 25 shown in FIG. 3.

[0038] The control unit 100 controls each component of the processing device 1, that is, the processing unit, to cause the processing device 1 to perform a processing operation on the object 200. The control unit 100 is a computer having an arithmetic processing device 101 (shown in FIG. 3) having a microprocessor such as a CPU (central processing unit), a storage device 102 (shown in FIG. 3) having a memory such as a ROM (read only memory) or a RAM (random access memory), and an input / output interface device. The arithmetic processing device 101 of the control unit 100 performs arithmetic processing according to a computer program stored in the storage device 102, and outputs a control signal for controlling the processing device 1 to each component of the processing device 1 via the input / output interface device.

[0039] The storage device 102 of the control unit 100 stores various information such as processing conditions that are conditions when processing the object 200, various logs generated during the processing operation, and imaging images acquired by the imaging unit.

[0040] The processing device 1 also includes a display unit 110 composed of a liquid crystal display device or the like that displays the state of the processing operation, captured images, etc., an input unit 120 used when an operator registers processing conditions, etc., and a notification unit (not shown). These display unit 110, input unit 120, and notification unit are connected to the control unit 100.

[0041] The input unit 120 is configured to include a touch panel provided on the display unit 110. The notification unit emits at least one of sound and light to notify the operator. In the embodiment, the function of the notification unit is realized by a display lamp that emits at least one of sound and light and by displaying characters or the like for notifying the display unit 110.

[0042] The processing device 1 with the above-described configuration is supplied with power from a power source 130 shown in FIG. 3 and performs processing operations and the like. As shown in FIG. 3, a power supply system 60 supplied with power from the power source 130 of the processing device 1 includes a main circuit 61 supplied with power from the power source 130 and a sub-circuit 62 branched from the main circuit 61 and supplying power from the power source 130 to components such as a spindle motor 23, a motor 24, and a solenoid valve 25 via the main circuit 61. Hereinafter, components are indicated by reference numeral 70, and the processing unit is indicated by reference numeral 40.

[0043] The main circuit 61 supplies the power from the power source 130 to the control unit 100, the display unit 110, and the input unit 120, and also supplies the power from the power source 130 to components 70 such as the spindle motor 23, the motor 24, and the solenoid valve 25 via the sub-circuit 62. The main circuit 61 is provided with a main switch 63 that opens and closes the circuit of the power supplied from the power source 130. That is, the processing device 1 includes the main switch 63 provided in the main circuit 61 that supplies the power from the power source 130 to the control unit 100.

[0044] The main switch 63 switches the supply and stop of power to the control unit 100, the display unit 110, and the input unit 120 by opening and closing. In Embodiment 1, the main switch 63 is installed in the housing 3 of the processing device 1 and is exposed to the outside. The main switch 63 is opened and closed by an operator or the like of the processing device 1, that is, the opening and closing are switched.

[0045] The sub-circuit 62 branches from the main circuit 61 and supplies the power from the power supply 130 to the components 70 of the processing unit 40 such as the spindle motor 23, the motor 24, and the solenoid valve 25. In Embodiment 1, the sub-circuit 62 corresponds one-to-one with the components 70 of the processing unit 40. The sub-circuit 62 is provided with a sub-switch 64 that opens and closes the electric circuit of the power supplied from the power supply 130. That is, the processing device 1 includes a sub-switch 64 disposed in the sub-circuit 62 that supplies the power from the power supply 130 to the components 70 of the processing unit 40.

[0046] The sub-switch 64 switches the supply and stop of power to the control unit 100 by opening and closing. In Embodiment 1, the sub-switch 64 is opened and closed, that is, the opening and closing are switched, by the control unit 100 supplied with power according to an instruction from an operator input via the input unit 120 or the like. Note that the sub-switch 64 is configured to open when the power supply from the power supply 130 stops.

[0047] In addition, the processing device 1 includes a connection portion (not shown) provided at a position exposed to the outside and connectable to an external storage device such as a USB memory (USB flash drive).

[0048] The above-described processing device 1, without performing cutting on the object 200, when inputting, editing, or confirming processing conditions stored in the storage device 102 of the control unit 100, or extracting and editing various logs generated during the processing operation, imaging images acquired by the imaging unit, etc., with the sub-switch 64 open, the main switch 63 is closed by an operator or the like. Then, the power from the power supply 130 is supplied to the control unit 100, the display unit 110, and the input unit 120 without being supplied to the components 70 of the processing unit 40.

[0049] Thereafter, in the processing device 1, when an operator operates the input unit 120 or the like, the processing conditions are input, edited, or confirmed, and various logs generated during the processing operation, imaging images acquired by the imaging unit, etc., are extracted and edited. Also, in the processing device 1, various information is recorded, that is, retrieved, in the external storage device connected to the connection unit and stored in the storage device.

[0050] (Processing method) Next, the processing method according to Embodiment 1 will be described with reference to the drawings. FIG. 4 is a flowchart showing the processing method according to Embodiment 1. The processing method according to Embodiment 1 is a method of performing cutting, which is a processing, on the object 200 with the processing device 1 having the above-described configuration. As shown in FIG. 4, the processing method according to Embodiment 1 includes a startup step 1001, a processing preparation step 1002, and a processing step 1003.

[0051] (Startup step) The startup step 1001 is a step of starting the processing device 1 by the main switch 63 and supplying the power from the power supply 130 to the control unit 100. In Embodiment 1, in the startup step 1001, the processing device 1 having the above-described configuration has a cassette in which a plurality of objects 200 are accommodated placed on the cassette elevator 50. In Embodiment 1, in the startup step 1001, the main switch 63 is operated and closed by an operator for the processing device 1 having the above-described configuration.

[0052] Then, the power from the power supply 130 is supplied to the control unit 100, the display unit 110, and the input unit 120. In Embodiment 1, in the startup step 1001, the control unit 100 receives and registers the processing conditions input by the operator from the input unit 120 or the like. Note that in the startup step 1001, all the sub-switches 64 are open.

[0053] (Processing Preparation Step) The processing preparation step 1002 is a step of supplying the power from the power supply 130 to the processing unit 40 by the sub-switch 64 after the startup step 1001 is performed. In Embodiment 1, in the processing preparation step 1002, when the processing device 1 receives the processing start instruction input by the operator from the input unit or the like by the control unit 100, the processing operation is started. In the processing preparation step 1002, when the processing device 1 starts the processing operation, the control unit 100 closes all the sub-switches 64 and supplies the power from the power supply 130 to each component 70 of the processing unit 40. Then, each component 70 of the processing unit 40 performs a home return operation.

[0054] (Processing Step) The processing step 1003 is a step of processing the object 200 with the processing unit 40 after the processing preparation step 1002 is performed. In Embodiment 1, in the processing step, after the completion of the home return operation of each component 70 in the processing preparation step 1002, the control unit 100 starts the rotation of the spindle of the cutting unit 20, that is, the cutting blade 21, and starts the supply of cutting water to the cutting blade 21 by the processing device 1.

[0055] In Embodiment 1, in processing step 1003, the processing apparatus 1 controls the control unit 100 to control the cassette elevator 50 and the transfer unit or the like to take out one object 200 before cutting from the cassette and position it on the holding surface 11 of the holding table 10 positioned in the loading / unloading area. In Embodiment 1, in processing step 1003, the processing apparatus 1 controls the control unit 100 to suck and hold the object 200 on the holding surface 11 of the holding table 10 positioned in the loading / unloading area via an adhesive tape, and the clamp unit 12 clamps the annular frame.

[0056] In Embodiment 1, in processing step 1003, the processing apparatus 1 controls the control unit 100 to control the moving unit to position the holding table 10 holding the object 200 in the processing area, and causes the imaging unit to image the object 200 to perform alignment. In Embodiment 1, in processing step 1003, the processing apparatus 1 controls the control unit 100 to control the moving unit and the cutting unit 20, and while supplying cutting water to the cutting blade 21, relatively moves the cutting unit 20 and the object 200 along the division planned line 202 and cuts the cutting blade 21 into the division planned line 202 until it reaches the adhesive tape.

[0057] In Embodiment 1, in processing step 1003, the processing apparatus 1 performs cutting on the object 200 along the division planned line 202. In Embodiment 1, in processing step 1003, the processing apparatus 1 performs cutting on all the division planned lines 202 of the object 200. In Embodiment 1, in processing step 1003, when the processing apparatus 1 performs cutting on all the division planned lines 202, the control unit 100 controls the moving unit to position the holding table 10 in the loading / unloading area, and causes the transfer unit to transfer the object 200 after cutting from the holding table 10 to the cleaning unit. After cleaning with the cleaning unit, the transfer unit accommodates the object 200 in the cassette. In processing step 1003, cutting is performed on all the objects 200 to be processed in the cassette determined by the processing conditions, and the processing method according to Embodiment 1 is terminated.

[0058] Conventionally used processing devices have needed to perform a homing operation of a motor or a robot after being powered on and operated from a power source. For this reason, conventionally used processing devices have required time until they can be used even when only the control unit is to be used, such as when it is desired to view or edit information stored inside the control unit within the processing device.

[0059] For such a conventional processing device, the processing device 1 according to Embodiment 1 includes a main switch 63 that switches the supply and stop of power to the control unit 100, and a sub-switch 64 that switches the supply and stop of power to each component 70 of the processing unit 40. The sub-switch 64 is closed by the control unit 100 to which power is supplied.

[0060] For this reason, the processing device 1 according to Embodiment 1 can supply power only to the control unit 100 without supplying power to each component 70 of the processing unit 40 at startup, and can suppress the power consumption when inputting, editing, and confirming processing conditions, extracting and editing captured images and various types of information.

[0061] In addition, the processing device 1 according to Embodiment 1 can use the control unit 100 even when power is supplied only to the control unit 100 and power is not supplied to each component 70 of the processing unit 40. Therefore, the waiting time of the operator when inputting, editing, and confirming processing conditions, extracting and editing various types of information, etc. can be reduced.

[0062] As a result, the processing device 1 according to Embodiment 1 has the effect of being able to suppress power consumption.

[0063] 〔Embodiment 2〕 The processing device according to Embodiment 2 will be described with reference to the drawings. FIG. 5 is a perspective view showing a configuration example of the processing device according to Embodiment 2. In addition, in FIG. 5, the same parts as those in Embodiment 1 are denoted by the same reference numerals and the description thereof is omitted.

[0064] As shown in FIG. 3, in the processing device 1 according to Embodiment 2, the control unit 100 is connected to an external control device 150 via a wired or wireless network 140. In Embodiment 2, a plurality of processing devices 1 are connected to one external control device 150 via the network 140, and the control unit 100 of each processing device 1 is configured to be supplied with power from a power source 130 via a main circuit 61.

[0065] The external control device 150 is a computer having an arithmetic processing unit with a microprocessor such as a CPU (central processing unit), a storage device having a memory such as a ROM (read only memory) or a RAM (random access memory), and an input / output interface device. The external control device 150 is also connected to a display unit configured by a liquid crystal display device or the like that displays various information, and an input unit operable by an operator. The network 140 is configured to connect the control units 00 of the plurality of processing devices 1 and the external control device 150 so as to enable bidirectional communication.

[0066] In Embodiment 2, the processing device 1 switches the main switch 63 of each processing device 1 according to an instruction from an operator input to the external control device 150 via an input unit or the like, thereby switching the supply and stop of power to the control unit 100 of each processing device 1.

[0067] Similar to Embodiment 1, the processing device 1 according to Embodiment 2 can use the control unit 100 even when power is supplied only to the control unit 100 and not to each component 70 of the processing unit 40, thus achieving the effect of suppressing power consumption.

[0068] Note that the present invention is not limited to the above-described embodiments. That is, various modifications can be made without departing from the gist of the present invention. In Embodiment 1, the processing device 1 is a cutting device that performs cutting on the planned cutting line 202 of the object 200. However, in the present invention, it is not limited to a cutting device. For example, it may be a processing device that performs various processes such as laser processing, grinding, and polishing on the object 200, an inspection device that inspects the object 200, a cleaning device that cleans the object 200, a mounter that attaches a tape to the object 200, a tape expander device that expands the attached tape of the object 200, or a flexural strength test device that measures the flexural strength of the object 200.

Explanation of Reference Numerals

[0069] 1 Processing device 10 Holding table (processing unit) 20 Cutting unit (processing unit) 40 Processing unit 50 Cassette elevator (processing unit) 61 Main circuit 62 Sub-circuit 63 Main switch 64 Sub-switch 100 Control unit 130 Power supply 150 External control device 200 Object 1001 Startup step 1002 Processing preparation step 1003 Processing step

Claims

1. A processing apparatus comprising a processing unit that performs processing on an object and a control unit that controls the processing unit, A main switch disposed in a main circuit that supplies power from a power source to the control unit and switches between supplying and stopping power to the control unit, A sub-switch disposed in a sub-circuit that supplies power from the power source to the processing unit and switches between supplying and stopping power to the processing unit.

2. The processing apparatus according to claim 1, wherein the sub-switch is switched by the control unit to which power is supplied.

3. The processing apparatus is connected to an external control device, The processing apparatus according to claim 1 or claim 2, wherein the external control device switches the main switch to switch between supplying and stopping power to the processing apparatus.

4. A processing method for performing processing on an object using the processing apparatus according to any one of claims 1 to 3, A startup step of starting the processing apparatus by the main switch to supply power from the power source to the control unit, After performing the startup step, a processing preparation step of supplying power from the power source to the processing unit by the sub-switch, After performing the processing preparation step, a processing step of performing processing on the object by the processing unit.

Images