Mounting table

Abstract

To provide a mounting table that improves working efficiency in testing or processing a workpiece.SOLUTION: A mounting table comprises a mounting surface 811 on which a workpiece W is mounted, and a liquid channel 812 that allows liquid to circulate therein. The mounting surface 811 is provided with a liquid discharge hole 812 communicating with a first end side of the liquid channel 812, and a surface different from the mounting surface is provided with a liquid supply hole 814 communicating with a second end side of the liquid channel.SELECTED DRAWING: Figure 11

Description

Technical Field

[0001] The present invention relates to a mounting table for mounting a workpiece.

Background Art

[0002] Conventionally, a thermal conductivity measurement device for measuring the thermal conductivity performance of workpieces such as metal members has been known. In such a thermal conductivity measurement device, the thermal conductivity performance such as the thermal conductivity and the thermal resistance value is measured based on the amount of heat input to the workpiece and the amount of heat radiated from the workpiece.

[0003] For example, in Patent Document 1, a workpiece is sandwiched between a heating-side clamping member connected to a heating unit and a cooling-side clamping member connected to a cooling unit, and the temperature is measured at a plurality of locations on the heating-side clamping member and the cooling-side clamping member, and the thermal conductivity performance of the workpiece is calculated from the measured temperature gradient. A configuration is disclosed.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] For example, when evaluating or processing a workpiece W, a liquid (agent) according to the purpose may be applied to the workpiece W. Such an application operation is troublesome when performed manually, and there are problems such as an error in the application amount. Further, when replacing the workpiece W after the test evaluation or the processing, there is a problem that the previous workpiece W adheres to the mounting table due to the liquid applied thereto and is difficult to remove.

[0006] An object of the present invention is to provide a mounting table that improves the working efficiency when testing or processing a workpiece.

Means for Solving the Problems

[0007] The temperature control device according to the present invention includes a placement surface on which a workpiece is placed, a measurement unit that measures the temperature of the workpiece or the placement surface, a heating mechanism that heats the placement surface, a cooling mechanism that cools the placement surface, and a control unit that controls the operations of the heating mechanism and the cooling mechanism. The heating mechanism and the cooling mechanism are both disposed below the placement surface. The control unit heats the placement surface by the heating mechanism until the measured temperature of the measurement unit reaches a first temperature, and cools the workpiece by the cooling mechanism when the measured temperature of the measurement unit becomes equal to or higher than a second temperature that is higher than the first temperature. In the above temperature control device, the cooling mechanism may adopt a configuration including a cooling block provided with a circulation flow path for a coolant and a circulation device that circulates the coolant. In the above temperature control device, the control unit may adopt a configuration that controls the operation of the cooling mechanism so that the measurement unit is within a predetermined temperature range. In the above temperature control device, the heating mechanism may adopt a configuration including a Peltier element. In the above temperature control device, a configuration may be adopted in which the heating mechanism is disposed below the placement surface and the cooling mechanism is disposed below the heating mechanism. In the above temperature control device, the heating mechanism is a Peltier element, and the control unit may adopt a configuration that causes the Peltier element to function as a temperature control mechanism for cooling the workpiece when cooling the placement surface. The heat treatment device according to the present invention includes the above temperature control device, a heating device that is provided opposite to the temperature control device and heats the workpiece, and a driving device that adjusts the distance between the heating device and the temperature control device. The temperature control device adjusts the temperature of the workpiece before the heating device heats the workpiece. In the above temperature control device, it may have a control device that controls the operations of the temperature control device and the heating device. The control device may adopt a configuration that repeats a process of simultaneously heating the workpiece with the temperature control device and the heating device and a process of cooling the workpiece with the temperature control device while heating the workpiece with the heating device. The heat conduction performance measuring device according to the present invention includes the above heat treatment device, a heat dissipation surface temperature measuring device that measures the temperature of the heat dissipation surface where the heating device contacts the workpiece, and an arithmetic device that calculates the heat conduction performance of the workpiece based on the measured temperature of the placement surface or the workpiece measured by the temperature control device and the measured temperature of the heat dissipation surface or the workpiece measured by the heat dissipation surface temperature measuring device. A heat treatment method according to a first aspect of the present invention is a heat treatment method for heating a workpiece having a first surface and a second surface, using a heating device that heats the first surface of the workpiece and a temperature control device that heats or cools the second surface of the workpiece, the method including a preheating step of heating the second surface of the workpiece with the temperature control device, and a main heating step of heating or cooling the second surface of the workpiece with the temperature control device while heating the first surface of the workpiece with the heating device. In the main heating step, the second surface is heated until the temperature of the second surface reaches a first set temperature while heating the second surface, and when the temperature of the second surface becomes equal to or higher than a second temperature higher than the first set temperature, the second surface is cooled by the temperature control device. A heat treatment method according to a second aspect of the present invention is a heat treatment method for heating a workpiece having a first surface and a second surface, using a heating device that heats the first surface of the workpiece and a temperature control device that heats or cools the second surface of the workpiece, the method being characterized by repeating a step of heating the second surface of the workpiece with the temperature control device while heating the first surface of the workpiece with the heating device and a step of cooling the second surface of the workpiece with the temperature control device while heating the first surface of the workpiece with the heating device. In the above heat treatment method, when heating the first surface and the second surface, it can be configured such that, on the second surface, heat having a higher amount of heat than the first surface is applied.

[0008] Moreover, the present invention is not limited to a thermal conductivity measuring device for measuring the thermal conductivity performance of a workpiece, and can be applied to a heat treatment device that transfers heat to the workpiece in order to process and manufacture any workpiece. For example, the present invention can be configured as a heat treatment device having the following characteristics and a mounting table used for processing a workpiece with a heat treatment device or the like. The mounting table according to the present invention is a mounting table on which a workpiece is placed and which provides a fluid for use in processing the workpiece when processing the workpiece, and includes a mounting surface on which the workpiece is placed and a liquid flow path through which a liquid circulates inside, and a liquid discharge communicating with the first end side of the liquid flow path is provided on the mounting surface, and a liquid supply communicating with the second end side of the liquid flow path is provided on a surface opposite to the mounting surface. In the above mounting table, the mounting surface may further include a gas flow path through which a gas circulates inside, a gas blowout communicating with the first end side of the gas flow path is provided on the mounting surface, and a gas supply communicating with the second end side of the gas flow path is provided on a surface opposite to the mounting surface. At least one of the liquid discharge and the gas blowout is provided at the center of the mounting. In the above mounting table, the liquid supply can be connected to a liquid supply device via a first pipe to send out the liquid from the liquid discharge on the mounting surface, and the gas supply can be connected to a gas supply device via a second pipe to send out the gas from the gas blowout on the mounting surface. In the above mounting table, the liquid discharge can be configured to also serve as a liquid suction for sucking the liquid discharged onto the mounting surface, or to have a liquid suction for sucking the liquid discharged onto the mounting surface separately from the liquid discharge on the mounting surface. In the above mounting table, an operation unit for a user to input an instruction and a control unit are provided, and the control unit can be configured to control the liquid supply device and / or the gas supply device based on the user's instruction input to the operation unit, so as to perform the sending of the liquid and / or the sending of the gas on the mounting table. In the above mounting table, a temperature sensor can be installed on the mounting surface. The heat treatment apparatus according to the present invention includes a heat source, a heat conductor that conducts the heat generated by the heat source, and a temperature control device that has the mounting table and adjusts the temperature of the mounting surface of the mounting table. When heat-treating a workpiece, the heat conductor contacts the workpiece to apply the heat conducted from the heat source to the workpiece, and the mounting table adjusts the temperature of the workpiece to the temperature adjusted by the temperature control device.

Effect of the Invention

[0009] According to the present invention, the working efficiency when testing or processing a workpiece can be improved.

Brief Description of the Drawings

[0010]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Figure 12

Embodiments for Carrying Out the Invention

[0011] Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following, as an example of the heat treatment apparatus of the present invention, a thermal conductivity measurement apparatus that applies heat to a workpiece (including work-in-progress, parts, and products to be worked on) to measure the thermal conductivity of the workpiece will be exemplified and described. FIG. 1 is a perspective view of the thermal conductivity measurement apparatus 1 according to the present embodiment, and FIG. 2 is a configuration diagram showing the thermal conductivity measurement apparatus 1 according to the present embodiment, showing a cross-section along line II-II of FIG. 1. As shown in FIGS. 1 and 2, the thermal conductivity measurement apparatus 1 according to the present embodiment includes a heater 10, a heat conductor 20, a heat insulation part 30, a connecting device 40, a driving part (driving device) 50, a temperature control part (temperature control device) 60, and a control part 70. In the present embodiment, it is assumed that the heater 10, the heat conductor 20, and the heat insulation part 30 constitute a heating part (heating device) 2. Also, in the present embodiment, the lower side of each figure (for example, the direction in which the temperature control part 60 is located with respect to the heating part 2) is described as downward, and the upper side of the figure (for example, the direction in which the heating part 2 is located with respect to the temperature control part 60) is described as upward. Further, in FIG. 2, the input and output of electrical signals to the control part 70 are shown by broken lines, and the tubes 651, 661, 671 to which the pumps 65, 66 and the refrigerant circulation device 67 to be described later are connected are shown by one-dot chain lines.

[0012] The heater 10 is a heat source, and for example, a ceramic heater of 900 to 1500 W is exemplified. In the present embodiment, the heater 10 is disposed on the upper surface of the heat conductor 20, and the heat generated by the heater 10 is input to the heat conductor 20. Note that the heater 10 can be configured to be in direct contact with the heat conductor 20, or can be configured to be indirectly in contact with the heat conductor 20 via thermal grease, grease, elastomer, metal, or other highly thermally conductive members in addition to thermal grease.

[0013] The heat conductor 20 is a member for conducting the heat received from the heater 10 and applying it to the work W. FIG. 3 is a configuration diagram showing the heat conductor 20 according to the present embodiment. The heat conductor 20 has a heat receiving member 21 that holds the heater 10 and a columnar heat radiating portion 22 that extends from the heat receiving member 21.

[0014] The heat receiving member 21 is also referred to as a heater block. As shown in FIG. 3, it has a heat receiving portion 23 that holds the heater 10, which is a heat source, and a tapered heat converging portion 24. The heat receiving portion 23 is the portion of the heat receiving member 21 that has the widest diameter in plan view, and the heater 10 is placed on its upper surface (heat receiving surface 23a). Note that the heat receiving surface 23a of the heat receiving portion 23 on which the heater 10 is placed may be a flat surface, or may have a shape in which the portion where the heater 10 is placed is recessed, and the heater 10 can be embedded in the recess. Note that the area of the heat receiving surface 23a of the heat receiving portion 23 is wider than the area of the heater 10, and the heat of the heater 10 can be efficiently applied to the heat receiving portion 23. Above the heat receiving portion 23, a flat fixing portion 26 is provided for biasing and fixing the heater 10 to the heat receiving surface 23a of the heat receiving portion 23. The fixing portion 26 can be switched between an open position and a fixed position by a locking member (not shown).

[0015] Also, the heat converging portion 24 is formed on the lower end side of the heat receiving portion 23, and the diameter in plan view becomes thinner in the direction away from the heat receiving portion 23 (from the heat receiving portion 23 side toward the heat radiating portion 22 side). As a result, the heat generated by the heater 10 is input into the heat receiving member 21, conducted from the heat receiving portion 23 to the heat converging portion 24, then heat-converged in the heat converging portion 24, and conducted to the heat radiating portion 22 with a high heat flux. Note that the heater 10 can be arranged in the heat converging portion 24, but in order to transfer heat evenly, it is preferable not to arrange the heater 10 in the heat converging portion 24. In the present embodiment, the heat converging portion 24 is configured not to have the heater 10.

[0016] As shown in FIG. 3, the heat radiating portion 22 is a columnar member extending from the lower end of the heat convergence portion 24 of the heat receiving member 21, and the cross-sectional area in the horizontal direction is substantially the same from the root portion to the tip portion. Further, the diameter (cross-sectional area) of the heat radiating portion 22 is formed smaller than the diameter (cross-sectional area) of the heat receiving portion 23. For example, the diameter of the heat radiating portion 22 can be 1 / 2 or less of the diameter of the heat receiving portion 23, and more preferably 1 / 3 or less. Further, as shown in FIG. 2, the lower end portion of the heat radiating portion 22 is exposed from the heat insulating portion 30 described later, and has a heat radiating surface 25 that directly or indirectly contacts the work W. Thereby, the heat converged by the heat convergence portion 24 is conducted from the heat radiating portion 22 upward (toward the heater 10 side) to downward (toward the work W side), and is applied to the work W from the heat radiating surface 25. In particular, in the present embodiment, since the cross-sectional area of the heat radiating portion 22 in the horizontal direction is smaller than that of the heat receiving member 21, it is possible to directly apply the heat of the high heat flux converged by the heat convergence portion 24 from the heat radiating surface 25 to the work W. Further, the diameter of the flat heat radiating surface 25 is smaller than the area of the plane of the work W (for example, several mm to several tens of mm or 5 mm to 20 mm), but since no temperature measuring device is provided on the heat radiating surface 25, a sufficient contact area can be ensured, and heat can be efficiently applied to the work W. For example, in the present embodiment, even when a ceramic heater of 900 to 1500 W is used as the heater 10, the heat of the heat flux of 1000 W / cm 2 or more can be applied to the work W. A plurality of holes for arranging the thermocouple 71 described later are provided in the heat radiating portion 22 in the longitudinal direction.

[0017] Note that the material of the heat conductor 20 is not particularly limited as long as it has high thermal conductivity. For example, it can be made of silver, copper, gold, aluminum, iron, nickel, platinum, etc. In this embodiment, the heat conductor 20 is made of copper. Further, in this embodiment, the heat conductor 20 is integrally formed to enhance its thermal conductivity. On the other hand, in the heat conductor 20, the heat receiving member 21 and the heat radiating portion 22 can be separately formed, and the end face of the heat radiating portion 22 can be joined to the joining surface provided at the lower end of the heat receiving member 21 to manufacture the heat conductor 20. In this way, by joining the heat receiving member 21 and the heat radiating portion 22 separately, the thermal resistance at the joining surface increases, and by utilizing this thermal resistance, it is also possible to promote the uniformization of heat in the horizontal direction. Further, in this embodiment, as shown in FIG. 1, the heat receiving member 21 is surrounded by the heat insulating portion 30, and is configured to suppress the heat generated by the heater 10 from diffusing to the outside. Note that the material of the heat insulating portion 30 is not particularly limited. For example, the inside can be made of a heat insulating material such as an inorganic porous material or a fiber material (e.g., glass fiber), and this heat insulating material can be covered with a heat resistant resin cover.

[0018] Also, in this embodiment, in the heat conductor 20, the heat receiving member 21 (the heat receiving portion 23 and the heat convergence portion 24) is formed in a circular shape in plan view. By forming the heat receiving member 21 (the heat receiving portion 23 and the heat convergence portion 24) in a circular shape in plan view, when the heat generated by the heater 10 is conducted to the heat radiating surface 25 of the heat radiating portion 22, the heat can be evenly converged in the horizontal direction, and it is possible to reduce the temperature unevenness on the heat radiating surface 25. In this embodiment, a configuration in which the heat receiving member 21 (the heat receiving portion 23 and the heat convergence portion 24) and the heat radiating portion 22 are formed in a circular shape in plan view is illustrated, but the configuration is not limited to this. The heat receiving member 21 (the heat receiving portion 23 and the heat convergence portion 24) and the heat radiating portion 22 can also be formed in a regular polygon shape in plan view. Also in this case, when the heat is conducted through the heat receiving member 21, it is possible to converge the heat almost evenly. Further, in this embodiment, since the heat radiating surface of the heat radiating portion 22 can have an arbitrary area and / or shape, heat input according to the situation in which each workpiece is used becomes possible.

[0019] Further, in the present embodiment, as shown in FIG. 3, a plurality of thermocouples 71, which are temperature measuring devices, are installed at equal intervals (for example, a 2 mm pitch) along the extending direction of the heat radiating portion 22. The plurality of thermocouples 71 are respectively connected to the control unit 70, and the temperature data measured by each thermocouple 71 is periodically output to the control unit 70. The control unit 70 measures the heat conduction performance of the work W based on the temperature data of the plurality of thermocouples 71. In particular, in the present embodiment, since the plurality of thermocouples 71 are installed at equal intervals along the extending direction of the heat radiating portion 22, based on the temperature data of these thermocouples 71, the temperature gradient of the heat radiating portion 22 is obtained, and based on the temperature gradient of the heat radiating portion 22, the temperature of the heat radiating surface 25 can be calculated with high accuracy. Since the temperature of the heat radiating surface 25 is used for calculating the heat conduction performance of the work W, by calculating the temperature of the heat radiating surface 25 with high accuracy, the control unit 70 can calculate the heat conduction performance such as the thermal conductivity and thermal resistance of the work W with high accuracy. In the present embodiment, a configuration using the thermocouple 71 as the temperature measuring device is illustrated, but the temperature measuring device is not limited to the thermocouple 71, and a configuration using a contact type temperature sensor such as a platinum resistance thermometer or a thermistor, or a non-contact type temperature sensor such as a thermography can also be adopted. Further, in the present embodiment, a configuration in which the thermocouples 71 are installed at equal intervals along the extending direction of the heat radiating portion 22 is illustrated, but the thermocouples 71 do not necessarily need to be installed at equal intervals as long as they are installed along the extending direction of the heat radiating portion 22, and the temperature gradient of the heat radiating portion 22 can be calculated in consideration of the interval between the thermocouples 71 and the position of each thermocouple 71.

[0020] Next, the connecting device 40 will be described. The connecting device 40 has a plurality of shafts 41 that are connecting members, and the lower end portions of the respective shafts 41 are connected to the upper surface of the heat conductor 20. The shaft 41 is a straight columnar member, and is a cylindrical shape in the present embodiment. Further, the connecting device 40 is connected to the driving unit 50 directly or indirectly at the upper part, and by the driving unit 50, together with the heat conductor 20, it can move up and down in the vertical direction.

[0021] Here, referring to FIG. 4, the arrangement method of the shaft 41 in the connecting device 40 will be described. FIG. 4 is a diagram for explaining the arrangement method of the shaft 41, (A1)-(A3) are top view configurations of the connecting device 40, and (B1)-(B3) are perspective views of the connecting device 40. Note that in FIG. 4, the illustration of the fixing portion 26 is omitted. In the present embodiment, as shown in (A1) and (B1), in the connecting device 40, a plurality of shafts 41 are arranged so as to surround the heater 10. Specifically, the connecting device 40 has three shafts 41, and these plurality of shafts 41 are arranged at an equal distance from the center point O of the heater 10 (or on a concentric circle of the center point O), and the angle θ formed by two adjacent shafts 41 and the center point of the heater 10 is substantially the same (in the examples shown in (A1) and (B1), each angle θ is 120°). In other words, the three shafts 41 that connect the heat conductor 20 and the drive unit 50 are connected to the heat receiving surface 23a of the heat receiving portion 23 at positions that are rotationally symmetric about the center point O in a plan view. Thereby, in the present embodiment, heat is evenly conducted from the heater 10 to each shaft 41, and even when the shaft 41 thermally expands, the expansion amount of each shaft 41 can be made the same, and it is possible to prevent the heat radiating surface 25 of the heat conductor 20 from tilting in the horizontal direction. That is, if the distance from each shaft 41 to the heater 10 is different for each shaft 41, the elongation accompanying the thermal expansion of the shaft 41 becomes non-uniform, and there is a possibility that the heat radiating surface 25 may tilt in the horizontal direction. Also, if the shaft 41 is disposed unevenly on the heat receiving surface 23a of the heat receiving portion 23, there is a bias in the pressure applied to the heat conductor 20 due to the thermal expansion of the shaft 41, and there is a possibility that the heat radiating surface 25 may tilt in the horizontal direction. And when the heat radiating surface 25 tilts in the horizontal direction, there is a problem that it cannot contact the work W in a surface-to-surface manner, and the measurement accuracy of the heat conduction performance of the work W decreases.In contrast, in the connecting device 40 according to the present embodiment, a plurality of shafts 41 are arranged at an equal distance (or on a concentric circle) from the center point O of the heater 10, and the angle θ formed by two adjacent shafts 41 and the center point of the heater 10 is arranged to be substantially the same. Therefore, it is possible to suppress the heat dissipation surface 25 of the heat conductor 20 from tilting.

[0022] Note that, as the connecting device 40 according to the present embodiment, the configurations shown in FIGS. 4(A1) and (B1) are illustrated, but the present invention is not limited to this configuration, and the configurations shown in FIGS. 4(A2) and (B2), or (A3) and (B3) can also be adopted. That is, in the configuration shown in FIGS. 4(A2) and (B2), four shafts 41 are arranged at an equal distance (or on a concentric circle) from the center point O of the heater 10, and are arranged to be line-symmetric with respect to two or more lines passing through the center point O. Specifically, in the example shown in FIGS. 4(A2) and (B2), four shafts 41 are arranged to be line-symmetric with respect to four lines L1 to L4 passing through the center point O. Also in this case, the thermal expansion amounts of the shafts 41 can be made uniform, and the heat dissipation surface 25 of the heat conductor 20 can be prevented from tilting. Further, in the example shown in FIGS. 4(A3) or (B3), a plurality of shafts 41 are arranged line-symmetrically with respect to the line L1 passing through the center point O of the heater 10, and each shaft 41 is arranged such that the angle θ formed by two adjacent shafts 41 and the center point O of the heater 10 is substantially the same. Thus, also in the example shown in FIGS. 4(A3) or (B3), since a plurality of shafts 41 are arranged symmetrically and at regular intervals, the inclination of the heat dissipation surface 25 of the heat conductor 20 due to the shafts 41 can be suppressed.

[0023] As described above, the drive unit 50 is connected to the heat conductor 20 via the connecting device 40, and drives the connecting device 40 and the heat conductor 20 in the vertical direction. In particular, in the present embodiment, the drive unit 50 operates based on the control of the control unit 70. When measuring the work W, the heat conductor 20 is moved downward to a position where it contacts the work W. After measuring the work W, the heat conductor 20 is moved upward to a predetermined height position where it does not contact the work W. In the present embodiment, the drive unit 50 is connected to a proximity sensor or a contact sensor (not shown). Based on the signals from these sensors, when the heat conductor 20 is moved downward, it can be determined whether the heat dissipation surface 25 of the heat dissipation unit 22 has contacted the work W. Further, the drive unit 50 can be configured to determine whether the heat dissipation surface 25 of the heat dissipation unit 22 has contacted the work W based on the signal from the load sensor installed on the temperature control unit 60 side. By these sensors, it is possible to prevent damage to the work W due to overload while ensuring that the heat dissipation surface 25 contacts the work W. The type of the drive unit 50 is not particularly limited. For example, an air cylinder can be used. By using an air cylinder, the heat conductor 20 can be brought into contact with the work W with a constant thrust while performing drive control in the vertical direction, and the measurement accuracy of the heat conduction performance of the work W can be improved.

[0024] Next, the temperature control unit 60 will be described. The temperature control unit 60 has a temperature control function for maintaining the work W placed on the upper surface at a predetermined set temperature. In the present embodiment, as shown in FIGS. 2 and 5, the temperature control unit 60 includes a temperature control block 61 on which the work W is placed, a heat spreader 62 for horizontally diffusing the heat conducted from the lower surface of the temperature control block 61, a heating and cooling device 63 that contacts the central portion of the lower surface of the heat spreader 62, and a cooling device 64 that contacts the lower surface of the heating and cooling device 63. In the present embodiment, the work W is held by the temperature control block 61 due to its own weight, but a holding mechanism for holding the work W by clamping or suction, for example, may be provided.

[0025] The heat spreader 62 is a metal member with good horizontal thermal conductivity and can be constituted by, for example, a heat pipe or a vapor chamber for transferring heat horizontally using a working fluid. The heating and cooling device 63 is a Peltier element that can heat and cool the temperature control block 61 via the heat spreader 62 under the energization control by the control unit 70. The cooling device 64 includes a water-cooled block in which a flow path through which the refrigerant supplied from the refrigerant circulation device 67 circulates is formed inside.

[0026] In this embodiment, by executing the preheating process by the heating and cooling device 63, it is possible to significantly shorten the time of the measurement test of the heat conduction performance. For example, when heating a workpiece W with a predetermined amount of heat and measuring the heat conduction performance at that amount of heat, since the temperature of the workpiece W changes until the workpiece W reaches the temperature corresponding to the heat of that amount, the heat conduction performance of the workpiece W may fluctuate. Also, when the preheating process is not executed, even when the workpiece W reaches the temperature corresponding to the heat of that amount, the calculated thermal resistance value may not be stable until a certain period of time has elapsed (until the temperature of the workpiece W stabilizes). Thus, conventionally, it has been necessary to wait for the measurement of the heat conduction performance of the workpiece W until the workpiece W reaches the temperature corresponding to the heat input thereto and until the temperature of the workpiece W stabilizes after reaching the temperature corresponding to the heat input thereto. However, in this embodiment, by preheating the temperature control block 61, the workpiece W can be stabilized at the temperature corresponding to the heat input in a short time, and the heat conduction performance of the workpiece W can be measured.

[0027] Further, the control unit 70 can also measure the thermal conductivity performance of the workpiece W at a predetermined temperature. For example, when measuring the thermal conductivity performance of the workpiece W at 60°C, the control unit 70 adjusts the temperature of the workpiece W before and after the measurement to 60°C. When the temperature of the temperature control block 61 is less than 60°C, the control unit 70 performs energization control to cause the heating / cooling device 63 to generate heat, thereby heating the temperature control block 61 by the heating / cooling device 63 and quickly heating the temperature of the workpiece W in contact with the temperature control block 61 to the target 60°C. On the other hand, when the temperature of the temperature control block 61 is 60°C or higher, the control unit 70 operates the refrigerant circulation device 67 communicating with the cooling device 64, and circulates the refrigerant from the refrigerant circulation device 67 to the cooling device 64, thereby reducing the temperature of the temperature control block 61 and adjusting the temperature of the workpiece to the target 60°C. Further, when cooling the workpiece W, the control unit 70 can also be configured to cool the workpiece W by the Peltier element which is the heating / cooling device 63. That is, the heating / cooling device 63 can function as a heating device when heating the workpiece W and can function as a cooling device when cooling the workpiece W. Note that the set temperature of the temperature control block 61 (60°C in the above example) can be set as appropriate, but it is preferably set to a temperature lower than the temperature of the heat applied to the workpiece W by the heating unit 2. In the present embodiment, a configuration in which the Peltier element is used as the heating / cooling device 63 to heat the workpiece W is illustrated, but the present invention is not limited to this configuration. As a heating mechanism, instead of or in addition to the Peltier element, a heater can be provided in the temperature control unit 60 to heat the workpiece W with the heater.

[0028] Also, as shown in FIGS. 5 and 6(A) and (B), in the present embodiment, the temperature control block 61 has a TIM flow path 612 and a TIM discharge 613 for discharging a thermal interface material (TIM: Thermal Interface Material) onto the upper surface 611 of the temperature control block 61, and an air flow path 615 and an air outlet 616 for ejecting air onto the upper surface 611 of the temperature control block 61. Note that FIG. 6(A) is a plan view of the temperature control block 61 according to the present embodiment, and FIG. 6(B) is a cross-sectional view of the temperature control block 61 according to the present embodiment.

[0029] Specifically, the TIM flow path 612 is a flow path formed inside the temperature control block 61. One end communicates with the TIM discharge port 613 formed on the upper surface 611 of the temperature control block 61, and the other end communicates with the TIM supply hole 614 formed on the side surface of the temperature control block 61. Further, the TIM flow path 612 is connected to the tube 651 at the TIM supply hole 614, and the tube 651 is connected to the TIM pump 65. Thus, the TIM pumped by the TIM pump 65 passes through the TIM flow path 612 and is discharged from the TIM discharge port 613 to the upper surface 611 of the temperature control block 61. In particular, in this embodiment, with the work W placed on the upper surface 611 of the temperature control block 61, by discharging the TIM onto the upper surface 611 of the temperature control block 61 (between the temperature control block 61 and the work W), the work W can be brought into contact with the upper surface 611 of the temperature control block 61 via the TIM. Therefore, the adhesion between the work W and the temperature control block 61 is enhanced, heat conduction between the work W and the temperature control block 61 becomes easier, and heat can be input to the work W more efficiently.

[0030] Also, the air flow path 615 is a flow path formed inside the temperature control block 61. One end communicates with the air outlet 616 formed on the upper surface of the temperature control block 61, and the other end communicates with the air supply hole 617 opened on the side surface of the temperature control block 61. Further, the air flow path 615 is connected to the tube 661 at the air supply hole 617, and the tube 661 is connected to the air pump 66. Thus, the air blown from the air pump 66 passes through the air flow path 615 and is ejected from the air outlet 616. Therefore, even when the work W is adsorbed to the upper surface 611 of the temperature control block 61 by the TIM, the work W can be easily removed from the temperature control block 61.

[0031] Further, the temperature control block 61 can be configured to provide a TIM suction for sucking the TIM discharged onto the upper surface 611. The TIM suction can be configured to be shared with the TIM discharge 613, or can be configured to provide a TIM suction separately from the TIM discharge 613. Further, the control unit 70 can be configured to control, for each workpiece W, the TIM discharge operation from the TIM discharge 613 and the suction operation of the TIM discharged from the TIM suction.

[0032] Further, in the thermal conductivity measurement device 1 according to the present embodiment, it can be configured to detect an abnormality in the discharge or suction of the TIM. For example, in the present embodiment, the drive unit 50 can be configured to include a sensor that detects a drive amount (the amount of movement in the upward or downward direction of the heating unit 2), and by this sensor, when measuring the workpiece W, the drive amount from a predetermined fixed position until the heat dissipation surface 25 abuts against the workpiece W is detected and transmitted to the control unit 70. In this case, the control unit 70 calculates the thickness of the TIM based on the drive amount acquired from the drive unit 50 (for example, calculated as drive amount - thickness of the workpiece W = thickness of the TIM), and determines the thickness of the TIM applied to the workpiece W. Then, when the thickness of the TIM applied to the workpiece W is outside a predetermined range, the control unit 70 can be configured to issue an alarm by an alarm unit (not shown) for reasons such as insufficient TIM or excessive TIM.

[0033] A plurality of thermocouples 72 are installed in the temperature control block 61. Specifically, as shown in FIG. 5, a plurality of thermocouples 72 are arranged in parallel on the upper surface 611 of the temperature control block 61. Thereby, the temperature on the lower surface side (heat dissipation side) of the workpiece W placed on the upper surface 611 of the temperature control block 61 can be measured in the plane direction of the upper surface 611 of the temperature control block 61. Note that the temperature data measured by the plurality of thermocouples 72 is output to the control unit 70 and used for calculating the thermal conductivity performance of the workpiece W. Further, the temperature data measured by the plurality of thermocouples 72 is output to the control unit 70 and used for controlling the heating and cooling device 63 and the refrigerant circulation device 67 in order to adjust the temperature of the temperature control block 61.

[0034] The control unit 70 controls the operations of the heater 10, the drive unit 50, the heating and cooling device 63, the TIM pump 65, the air pump 66, and the refrigerant circulation device 67 in order to measure the thermal conductivity performance of the workpiece W. Specifically, the control unit 70 causes the heater 10 to generate heat, drives the heat conductor 20 by the drive unit 50, and brings the heat dissipation surface 25 of the heat dissipation unit 22 into contact with the workpiece W, so that the heat converged by the heat conductor 20 can be applied to the workpiece W. Further, the control unit 70 controls the operations of the heating and cooling device 63 and the refrigerant circulation device 67 based on the temperature of the temperature control block 61, and maintains the temperature of the workpiece W at a predetermined set temperature. Furthermore, the control unit 70 controls the operation of the TIM pump 65 to supply and recover TIM between the temperature control block 61 and the workpiece W, and controls the operation of the air pump 66, so that the operations of the operator applying TIM to the workpiece W and wiping off TIM from the workpiece W can be omitted or facilitated, and the operation of the operator removing the workpiece W from the temperature control block 61 can be facilitated.

[0035] In addition, the control unit 70 measures the thermal conductivity performance of the workpiece W. In particular, in the present embodiment, the control unit 70 acquires temperature data from a plurality of thermocouples 71 installed in the heat dissipation unit 22 and calculates the temperature gradient of the heat dissipation unit 22 in order to perform the thermal conductivity performance of the workpiece W with high precision, thereby calculating the temperature of the heat dissipation surface 25 with high precision. Further, the control unit 70 acquires temperature data from a plurality of thermocouples 72 to 73 installed in the temperature control unit 60 and calculates the temperature gradient of the temperature control unit 60 in order to perform the thermal conductivity performance of the workpiece W with high precision, thereby calculating the temperature of the upper surface 611 of the temperature control block 61 with high precision. The control unit 70 can calculate the thermal conductivity performance of the workpiece W with high precision based on the temperature of the heat dissipation surface 25 and the temperature of the upper surface 611 of the temperature control block 61 calculated in this way. Furthermore, the control unit 70 can also determine whether the workpiece W is a good product or a defective product based on the measurement result of the thermal conductivity performance of the workpiece W. Although details will be described later, the control unit 70 can also be configured to determine whether the workpiece W is a good product or a defective product by determining whether the thermal conductivity performance of the workpiece W satisfies a predetermined reference value.

[0036] Next, the operation of the thermal conductivity measurement device 1 according to the present embodiment will be described. In the present embodiment, a temperature control process for controlling the temperature of the temperature control block 61 on which the work W is placed to a constant temperature and a measurement process for measuring the thermal conductivity of the work W are performed in parallel. First, based on FIG. 7, the temperature control process according to the present embodiment will be described. FIG. 7 is a flowchart showing the temperature control process according to the present embodiment.

[0037] In step S101, the control unit 70 acquires the temperature data of the temperature control block 61. Specifically, the control unit 70 acquires the temperature data detected by the thermocouple 72 installed on the upper surface 611 of the temperature control block 61 as the temperature data of the temperature control block 61. In the present embodiment, as shown in FIG. 5, the upper surface 611 of the temperature control block 61 has a plurality of thermocouples 72, and the average temperature of the temperatures detected by these plurality of thermocouples 72 is acquired as the temperature data of the temperature control block 61. Further, the control unit 70 may be configured to obtain the temperature gradient of the temperature control unit 60 from the average temperature of the plurality of thermocouples 72 and each temperature of the thermocouple 73, and calculate the upper surface temperature of the temperature control block 61.

[0038] Then, in step S102, the control unit 70 determines whether or not the temperature of the temperature control block 61 acquired in step S101 is equal to or higher than a predetermined set temperature. The set temperature is a temperature determined in advance for measuring the thermal conductivity of the work W, and the operator can appropriately set the set temperature via an input unit (not shown). When the temperature control block 61 is equal to or higher than the predetermined set temperature, the process proceeds to step S103, while when the temperature control block 61 is lower than the predetermined set temperature, the process proceeds to step S104.

[0039] In step S103, since the temperature control block 61 is at or above the set temperature, the control unit 70 performs a process to lower the temperature of the temperature control block 61. Specifically, the control unit 70 operates the refrigerant circulation device 67 to circulate a refrigerant such as water through the cooling device 64. Thereby, heat exchange is performed between the cooling device 64 and the temperature control block 61 via the heating and cooling device 63 and the heat spreader 62, and the temperature control block 61 can be cooled. Further, the control unit 70 can also be configured to cool the temperature control block 61 by energizing the Peltier element which is the heating and cooling device 63 in addition to the cooling device 64. Then, the process returns to step S101.

[0040] Also, in step S104, since the temperature control block 61 is below the set temperature, the control unit 70 performs a process to raise the temperature of the temperature control block 61. Specifically, the control unit 70 energizes the heating and cooling device 63 to generate heat in the heating and cooling device 63, thereby heating the temperature control block 61 via the heat spreader 62 and raising the temperature of the temperature control block 61. Then, the process returns to step S101.

[0041] In this way, the temperature control process according to the present embodiment cools the temperature control block 61 with the cooling device 64 or heats it with the heating and cooling device 63 so as to maintain the temperature of the temperature control block 61 at a constant set temperature. Thereby, in the thermal conductivity measurement device 1 according to the present embodiment, the temperature control block 61 is not excessively cooled, and the thermal conductivity of the workpiece W can be measured. Therefore, it is possible to shorten the waiting time for waiting for the workpiece W to reach a predetermined temperature, and the measurement efficiency of the workpiece W can be improved (see the examples described later).

[0042] In the example shown in FIG. 7, when the temperature control block 61 is at or above a predetermined set temperature, the cooling device 64 (and the heating and cooling device 63) cools the temperature control block 61, and when the temperature control block 61 is below the predetermined set temperature, the heating and cooling device 63 heats the temperature control block 61. However, the present invention is not limited to this configuration. When the temperature control block 61 is at or above the first target temperature, the control unit 70 may cool the temperature control block 61 by the cooling device 64 (and the heating and cooling device 63), and when the temperature control block 61 is below the second target temperature lower than the first target temperature, the heating and cooling device 63 may heat the temperature control block 61. That is, when the temperature control block 61 deviates from the range between the first target temperature and the second target temperature, the temperature control block 61 can be cooled or heated to control the temperature.

[0043] Next, based on FIG. 8, the measurement process of the heat conduction characteristics of the workpiece W according to the present embodiment will be described. FIG. 8 is a flowchart showing the measurement process of the heat conduction characteristics of the workpiece W according to the present embodiment. As shown in FIG. 8, in step S201, the control unit 70 determines whether or not the workpiece W is set on the temperature control block 61. For example, in the present embodiment, an operator places the workpiece W on the upper surface of the temperature control block 61 and presses a measurement start button (not shown), so that the control unit 70 can determine that the workpiece W is set. The control unit 70 waits in step S201 until the workpiece W is set, and proceeds to step S202 when the workpiece W is set.

[0044] In step S202, the control unit 70 supplies TIM to the workpiece W. Specifically, the control unit 70 operates the TIM pump 65 to discharge TIM from a TIM tank (not shown) through the tube 651 and the TIM flow path 612 in the temperature control block 61 from the TIM discharge port 613. Thereby, TIM is supplied between the upper surface 611 of the temperature control block 61 and the workpiece W, and the adhesion between the workpiece W and the temperature control block 61 can be enhanced.

[0045] In step S203, heat is input to the workpiece W by the control unit 70. Specifically, the control unit 70 operates the heater 10 to generate heat. Further, the control unit 70 operates the drive unit 50 to move the heating unit 2 downward until the heat dissipation surface 25 of the heat conductor 20 comes into contact with the workpiece W. As a result, the heat generated by the heater 10 is conducted to the heat receiving portion 23 of the heat conductor 20, converges at the heat convergence portion 24, then conducts through the heat dissipation portion 22, and heat is input from the heat dissipation surface 25 of the heat dissipation portion 22 to the workpiece W. In step S203, the control unit 70 determines whether there is an abnormality in the thickness of the TIM based on the moving amount of the heating unit 2 by the drive unit 50. If the driving amount of the heating unit 2 is outside the predetermined range, it is determined that there is an abnormality such as too much or too little TIM, and an alarm can be output to an alarm unit (not shown).

[0046] In step S204, the control unit 70 measures the heat conduction performance of the workpiece W. For example, the control unit 70 obtains the temperature gradient of the heat dissipation portion 22 based on the temperature data of a plurality of thermocouples 71 provided in the heat dissipation portion 22, and obtains the temperature gradient of the temperature control unit 60 based on the temperature data of a plurality of thermocouples 72 and 73 provided in the temperature control unit 60. The control unit 70 can be configured to obtain the average temperature of the plurality of thermocouples 72 as the temperature at the height position of the thermocouple 72, and obtain the temperature gradient of the temperature control unit 60 from the average temperature of the thermocouple 72 and each temperature of the thermocouple 73. Then, the control unit 70 calculates the temperature T1 of the heat dissipation surface 25 of the heat dissipation portion 22 from the temperature gradient of the heat dissipation portion 22, and calculates the temperature T2 of the upper surface of the temperature control block 61 from the temperature gradient of the temperature control unit 60. Further, as shown in the following formula, the control unit 70 uses the temperature T1 of the heat dissipation surface 25, the temperature T2 of the upper surface of the temperature control block 61, and the heat input amount Q In (e.g., 1000 W / cm 2 ) to calculate the thermal resistance R W of the workpiece W, which is one of the heat conduction performances of the workpiece W.

Equation

[0047] In step S205, the control unit 70 performs a process for removing the workpiece W. Specifically, the control unit 70 causes the drive unit 50 to move the heating unit 2 upward and move the heat conductor 20 to a predetermined height position. As a result, the upper surface 611 of the temperature control block 61 is exposed, and the operator can take out the workpiece W for which the measurement has been completed from the upper surface 611 of the temperature control block 61. Further, in the present embodiment, the control unit 70 can also operate the TIM pump 65 to recover the TIM supplied to the upper surface 611 of the temperature control block 61. Furthermore, the control unit 70 operates the air pump 66 to eject air from the air ejection 616 through the tube 661 and the air flow path 615. Thereby, even when the workpiece W is in close contact with the upper surface 611 of the temperature control block 61 by the TIM, the workpiece W can be easily removed from the temperature control block 61. In this way, by taking out the workpiece W for which the measurement has been completed, the measurement process of the thermal conductivity performance of the workpiece W shown in FIG. 8 is completed. Note that the operator can directly place a new workpiece W on the upper surface 611 of the temperature control block 61 and measure the thermal conductivity performance of the workpiece W. In this case, the process returns to step S201.

[0048] Note that, in the present embodiment, as described above, since the measurement process of the heat conduction performance of the work W and the temperature control process are carried out in parallel, even if the temperature control block 61 is heated in steps S202 and S203, the temperature control block 61 can be cooled to prevent excessive heating of the temperature control block 61. Further, in the present embodiment, when the cooling of the temperature control block 61 is carried out excessively and the temperature of the temperature control block 61 is lower than the set temperature, heating by the heating and cooling device 63 is carried out. Therefore, when continuously measuring the heat conduction performance of the work W, even if the temperature of the work W is lower than the temperature suitable for measurement, the temperature of the work W can be quickly raised to the temperature suitable for measurement.

Example

[0049] Next, an example of the heat conduction performance measuring device 1 according to the present embodiment will be described. In this example, using the heat conduction performance measuring device 1 according to the present embodiment, the thermal resistance value, which is one of the heat conduction performances, was measured for (1) a copper plate, (2) a normal product of a flat heat pipe, and (3) a defective product of a flat heat pipe as the work W. Note that, for (2) and (3) the normal product and the defective product of the flat heat pipe, those that have been previously determined to be normal products and defective products were used. FIG. 9 is a graph showing the measurement results of the heat conduction performance in this example. In the example shown in FIG. 9, the control unit 70 repeatedly calculates the thermal resistance value of the work W, and when the thermal resistance value after a certain time from when the heat dissipation surface 25 of the heat dissipation unit 22 is brought into contact with the work W to input heat is lower than a predetermined reference value, it is determined as a non-defective product with no abnormality in the heat conduction performance. When the thermal resistance value after a certain time is higher than the predetermined reference value, it is determined as a defective product with an abnormality in the heat conduction performance. The reference value was set based on the thermal resistance value of the copper plate.

[0050] Also, in the example shown in FIG. 9, (1) for the copper plate, the thermal resistance value was measured only once, and for (2) the normal flat heat pipes and (3) the defective flat heat pipes, the thermal resistance value was measured three times to improve the measurement accuracy. If the thermal resistance value exceeded the reference value even once, it was determined that there was an abnormality. Also, in the example shown in FIG. 9, the thermal resistance values were measured in the order of the copper plate, the normal flat heat pipes, and the defective flat heat pipes. The thermal resistance values were measured for 3 copper plates, 3 normal flat heat pipes, and 3 defective flat heat pipes, respectively. In FIG. 9, the measurement results of the thermal resistance values of the copper plates are shown as C1 to C3, the measurement results of the thermal resistance values of the normal flat heat pipes are shown as WG1 to WG3, and the measurement results of the thermal resistance values of the defective flat heat pipes are shown as WR1 to WR3.

[0051] As shown in FIG. 9, for (2) the normal flat heat pipes, all 3 (WG1 to WG3) had thermal resistance values below the reference value in all 3 measurements and were determined to be non-defective. Also, for (3) the defective flat heat pipes, all 3 (WR1 to WR3) had thermal resistance values exceeding the reference value at least once in the 3 measurements (for example, in the second WR2, the thermal resistance value exceeded the reference value in the second measurement), and all were determined to be defective. Thus, with the thermal conductivity performance measuring device 1 according to this embodiment, the thermal conductivity performance of the work W can be appropriately measured, and based on the measurement result of the thermal conductivity performance, it was possible to appropriately determine whether the work W is non-defective or not.

[0052] Also, in the embodiment shown in FIG. 10, the relationship between the temperature control process of the temperature control block 61 and the measurement time of the heat conduction performance was verified. That is, using a copper plate (denoted as C4 in FIG. 10) and a normal product of a flat heat pipe (denoted as WG4 in FIG. 10) respectively, the measurement time Tt required for measuring the heat conduction performance (thermal resistance value) was verified in the case without temperature control processing and in the case with temperature control processing. In this embodiment, when the heater 10 generates heat at 170 W and starts heating the workpiece W, the time from the start time Ts until the heat input amount and the temperature (Tave) of the upper surface 611 of the temperature control block 61 become stable at the time Te is detected as the measurement time Tt. In this embodiment, the time Te when the heat amount and the temperature (Tave) of the upper surface 611 of the temperature control block 61 become stable is defined as the time when the temperature (Tave) of the upper surface 611 of the temperature control block 61 is within ±0.2% / 10 seconds of the set value and the heat input amount is within ±1.0% / 10 seconds of the set value, but it is not limited thereto.

[0053] Among the examples shown in FIG. 10, when the copper plate C4 was used, the temperature of the temperature control block 61 was 20°C without temperature control processing, but was 36°C due to preheating with temperature control processing. When 170 W of heat was input to the copper plate C4, regardless of the presence or absence of temperature control processing, the temperature of the heat dissipation surface 25 of the heat conductor 20 in contact with the copper plate C4 rose to 83°C and stabilized at 83°C, and the temperature of the temperature control block 61 stabilized at 45°C. However, without temperature control processing, it took 542 seconds for the temperature of the heat dissipation surface 25 of the heat conductor 20 in contact with the copper plate C4 and the temperature of the temperature control block 61 to stabilize. On the other hand, with temperature control processing, it took 60 seconds for the temperature of the heat dissipation surface 25 of the heat conductor 20 in contact with the copper plate C4 and the temperature of the temperature control block 61 to stabilize.

[0054] Furthermore, among the examples shown in Fig. 10, when a normal product WG4 of a flat heat pipe is used as the work W, without temperature control treatment, the temperature of the temperature control block 61 is 30°C, and with temperature control treatment, the temperature of the temperature control block 61 is 40°C due to preheating. When 170 W of heat is input to the normal product WG4 of the flat heat pipe, the stable temperatures vary depending on the presence or absence of temperature control treatment. Without temperature control treatment, the temperature of the heat dissipation surface 25 of the heat conductor 20 in contact with the normal product WG4 of the flat heat pipe stabilized at 83°C, and the temperature of the temperature control block 61 stabilized at 45°C. On the other hand, with temperature control treatment, the temperature of the heat dissipation surface 25 of the heat conductor 20 in contact with the normal product WG4 of the flat heat pipe stabilized at 80°C, and the temperature of the temperature control block 61 stabilized at 45°C. However, without temperature control treatment, it took 302 seconds for the temperature of the heat dissipation surface 25 of the heat conductor 20 in contact with the normal product WG4 of the flat heat pipe and the temperature of the temperature control block 61 to stabilize. On the other hand, with temperature control treatment, it took 55 seconds for the temperature of the heat dissipation surface 25 of the heat conductor 20 in contact with the normal product WG4 of the flat heat pipe and the temperature of the temperature control block 61 to stabilize.

[0055] Thus, by performing the temperature control treatment to pre-adjust the temperature of the temperature control block 61, the temperature of the work W can be stabilized, the waiting time until the measurement of the heat conduction performance of the work W becomes possible can be shortened, and it was found that the measurement time Tt in the case of repeatedly measuring the heat conduction performance of a plurality of works W can be significantly shortened. Also, in this embodiment, in the normal product WG4 of the flat heat pipe, without temperature control treatment, the thermal resistance value R at the measurement time of 302 seconds was 0.228°C / W, but the thermal resistance value R at the measurement time of 2400 seconds was 0.220°C / W, and the measured thermal resistance value R did not stabilize even after a long time passed. However, when temperature control treatment was performed, after the measurement time of 55 seconds, the thermal resistance value R only fluctuated within the range of ±0.001°C / W, and it was also found that the measurement result of the thermal resistance value R stabilized.

[0056] As described above, the thermal conductivity performance measuring apparatus 1 according to the present embodiment includes an upper surface 611 of a temperature control block 61 on which a work W is placed, a thermocouple 72 that measures the temperature of the work W or the upper surface 611, a heating / cooling mechanism 63 that heats the upper surface 611, a cooling mechanism 64 that cools the upper surface 611, and a control unit 70 that controls the operations of the heating / cooling mechanism 63 and the cooling mechanism 64. The heating / cooling mechanism 63 and the cooling mechanism 64 are both disposed below the upper surface 611. The control unit 70 has a temperature control unit 60 that heats the upper surface 611 by the heating / cooling mechanism 63 until the measured temperature of the thermocouple 72 reaches a first temperature, and cools the work W by the cooling mechanism 64 when the measured temperature of the thermocouple 72 becomes equal to or higher than a second temperature that is higher than the first temperature. Thus, in the thermal conductivity performance measuring apparatus 1 according to the present embodiment, since the work W can be temperature-controlled by the temperature control unit 60 before the heat treatment of the work W, when measuring the thermal conductivity performance of the work W at a target temperature or when measuring the thermal conductivity performance of the work W with a predetermined heat input amount, the time required to raise the work W to the target temperature can be shortened, and the heat treatment of the work W can be efficiently performed. Further, in the thermal conductivity performance measuring apparatus 1 according to the present embodiment, by preheating the work W in advance, the temperature of the work W can be quickly stabilized, and thereby, the thermal conductivity performance of the work W can be stably measured in a shorter time.

[0057] 《Second Embodiment》 Next, a second embodiment of the present invention will be described. In the above-described embodiment, the present invention has been described by exemplifying the thermal conductivity measurement device 1 for measuring the thermal conductivity performance of the work W. However, the present invention is not limited to the thermal conductivity measurement device 1 for measuring the thermal conductivity performance of the work W, and can be applied to a test device for evaluating other performances of the work W, or a processing device such as a heat treatment device for heat-treating the work W. For example, when evaluating the work W or processing the work W, a liquid (agent) according to the purpose may be applied to the work W. Such an application operation is troublesome when performed manually, and there are problems such as an error in the application amount. Further, when the work W is picked up from the workbench after the evaluation test or the processing, there is also a problem that the work W coated with the liquid adheres to the workbench and is difficult to pick up. In response to such problems, in the first embodiment described above, in the temperature control block 61, the TIM can be applied to the work W by discharging the TIM from the TIM discharge 613, and the TIM adhered to the temperature control block 61 can be easily removed by ejecting the air from the air blowout 616. Also in the second embodiment of the present invention, similar to the first embodiment, the above problems can be solved by discharging the agent and ejecting the air on the mounting table on which the work W is mounted. In the following, a heat treatment device 1a for processing and manufacturing the work W by introducing the heat of the heater 10 into the work W such as metal will be exemplified to describe the second embodiment of the present invention. Note that, in the heat treatment device 1a according to the second embodiment, the description of the same configuration as that of the thermal conductivity measurement device 1 according to the first embodiment will be omitted, and the different parts will be described in detail.

[0058] The heat treatment apparatus 1a according to the second embodiment has a mounting table 81 instead of the temperature control block 61 according to the first embodiment. FIG. 11 is a configuration diagram showing the mounting table 81 according to the second embodiment. The mounting table 81 is a table on which the workpiece W is mounted, and can have the same configuration as the temperature control block 61 according to the first embodiment. However, in the second embodiment, the mounting table 81 may be configured to control the temperature of the workpiece W, or may not be configured to control the temperature. That is, the mounting table 81 can be used alone without being combined with the heating and cooling device 63 or the cooling device 64 in the first embodiment.

[0059] As shown in FIG. 11, the mounting table 81 has a mounting surface 811 for mounting the workpiece W on the upper surface, and inside, a liquid flow path 812 and a gas flow path 815. Further, a liquid discharge port 813 communicating with the first end side of the liquid flow path 812 is provided on the mounting surface 811. Furthermore, a liquid supply hole 814 communicating with the second end side of the liquid flow path 812 is provided on the side surface (main body surface) of the mounting table 81. In the example shown in FIG. 11, a configuration having a single liquid discharge port 813 and a single liquid supply hole 814 is illustrated, but the configuration is not limited thereto, and for example, a configuration having a plurality of liquid discharge ports 813 and / or a plurality of liquid supply holes 814 can be adopted.

[0060] Also, a gas blowout port 816 communicating with the first end side of the internal gas flow path 815 is provided on the mounting surface 811. Further, a gas supply hole 817 communicating with the second end side of the gas flow path 815 is provided on the side surface (main body surface) of the mounting table 81. In the example shown in FIG. 11, a configuration having a single gas blowout port 816 and a single gas supply hole 817 is illustrated, but the configuration is not limited thereto, and for example, a configuration having a plurality of gas blowout ports 816 and / or a plurality of gas supply holes 817 can be adopted.

[0061] Also, since the workpiece W is often placed near the center of the placement surface 811, from the perspective of working efficiency, it is preferable that the liquid discharge holes 813 and the gas blowing holes 816 are provided at positions closer to the center of the placement surface 811 than to the outer edge of the placement surface 811. However, they may be provided on the outer edge side of the placement surface 811 so as not to interfere during testing or processing. Alternatively, one of the liquid discharge holes 813 and the gas blowing holes 816 may be provided on the center side of the placement surface 811, and the other may be provided on the outer edge side of the placement surface 811.

[0062] Also, in the second embodiment as well, the placement surface 811 of the placement table 81 may be configured to have a liquid supply device for supplying liquid and a gas supply device for supplying gas, and also have an operation unit for the user to instruct the operations of the liquid supply device and the gas supply device, and a control unit for controlling the operations. The liquid supply device (also referred to as a liquid pump) may be a positive displacement pump (for example, a reciprocating pump such as a plunger pump or a piston pump, a tube pump, a gear pump, a vane pump, a screw pump, etc.), a non-positive displacement pump (a centrifugal pump such as a volute pump or a turbine pump, a propeller pump such as an axial flow pump or a mixed flow pump, a viscous pump such as a cascade pump, etc.). As long as it can supply liquid, it is not limited to these. Further, a flow meter sensor may be attached to the liquid supply device to stably supply a predetermined amount of liquid. The gas supply device (also referred to as an air pump) may include a compression pump and a vacuum pump. As long as it can supply gas, it is not limited to these.

[0063] Also, in the second embodiment, a liquid suction port communicating with the first end side of the liquid suction flow path inside the placement table 81 may be provided on the placement surface 811, and a liquid suction inlet / outlet communicating with the second end side of the liquid suction flow path may be provided on the side surface (the surface of the main body). Also, the liquid suction may be configured to be shared with the liquid discharge 813, or a liquid suction may be provided separately from the liquid discharge 813.

[0064] In the second embodiment, the heat treatment apparatus 1a can be configured to perform a process of coating the surface of the workpiece W. In this case, the mounting table 81 can supply a coating agent for coating the workpiece W placed on the mounting table 81 from a liquid pump to the mounting table 81 via the tube 851, and discharge it from the liquid discharge 813 via the liquid flow path 812. The coating agent is not particularly limited, and examples thereof include a coating agent containing a water repellent, an antibacterial agent, a photocatalyst, silicon, or a fluororesin. Further, the heat treatment apparatus 1a can be configured to perform a process of polishing the workpiece W. In this case, the mounting table 81 can supply an abrasive for polishing the workpiece W placed on the mounting table 81 from a liquid pump to the mounting table 81 via the tube 851, and discharge it from the liquid discharge 813 via the liquid flow path 812. The abrasive is also not particularly limited, and examples thereof include an abrasive containing silica, diamond, boron nitride, silicon carbide, aluminum(III) oxide, chromium oxide, iron(II) oxide, alumina, etc. as an abrasive stone.

[0065] In the first embodiment, the temperature near the upper surface 611 of the temperature control block 61 is detected by the thermocouple 72. In the second embodiment, a temperature sensor such as a contact type temperature sensor such as a platinum resistance thermometer or a thermistor, or a non-contact type temperature sensor such as a thermograph can be used to measure the temperature near the mounting surface 811 of the mounting table 81.

[0066] Note that the mounting table 81 is preferably made of a material with good thermal conductivity in order to warm the liquid agent, and the mounting table 81 can be configured to be heated using a heater or a Peltier element. Further, the mounting table 81 can also be configured to have a thermocouple or a temperature sensor for managing the temperature of the liquid agent.

[0067] As described above, in the heat treatment apparatus 1a according to the second embodiment, similar to the heat conduction performance measuring apparatus 1 according to the first embodiment, the heat generated by the heater 10 is converged at the heat convergence portion 24 of the heat conductor 20, and heat can be efficiently input to the work W. Therefore, the work W can be heated to a predetermined temperature in a short time. Further, in the heat treatment apparatus 1a according to the second embodiment, since the liquid agent used for processing and manufacturing the work W can be provided around the work W at an appropriate temperature, the processing and manufacturing of the work W can be performed more efficiently.

[0068] Note that the mounting table 81 according to the second embodiment can be applied not only to the heat treatment apparatus 1a having the heating unit 2 but also to a processing apparatus having no heating unit 2. For example, as described above, it can be applied to a processing apparatus that mounts the work W on the mounting table 81 and performs a coating process or a polishing process by supplying a coating agent or a polishing agent to the work W. Further, it is also possible to dry the work W by blowing hot air from the gas blowing portion 816 of the mounting table 81.

[0069] As described above, the preferred embodiments of the present invention have been described. However, the technical scope of the present invention is not limited to the description of the above embodiments. Various changes and improvements can be made to the above embodiments, and forms with such changes or improvements are also included in the technical scope of the present invention.

[0070] For example, in the above-described embodiment, a connecting device having a plurality of shafts around the heater 10 is exemplified. However, the present invention is not limited to this configuration, and the configuration may be such that a single shaft is provided at the center of the upper surface of the heat conductor 20, or a configuration having a donut-shaped or annular connecting member instead of the shaft may be adopted.

[0071] Further, in the above-described embodiment, a configuration in which the temperature control unit 60 is disposed below the heating unit 2 is exemplified. However, a configuration in which the temperature control unit 60 is disposed above the heating unit 2 may be adopted, or a configuration in which the temperature control unit 60 is disposed on the side of the heating unit 2 may be adopted.

[0072] Furthermore, in the above-described embodiment, the heat convergence portion 24 of the heat conductor 20 is exemplified as having a tapered structure. However, the heat convergence portion 24 is not limited to a tapered shape as long as it becomes narrower in the direction away from the heat receiving portion 23. For example, as shown in Fig. 12(A), a configuration in which a part of the heat convergence portion 24a has a cylindrical shape (a configuration in which a part extends vertically) can also be adopted. Alternatively, as shown in Fig. 12(B), a configuration in which the heat convergence portion 24b has a step can also be adopted. Note that Figs. 12(A) and 12(B) are schematic side views showing other embodiments of the heat conductor 20.

Explanation of Reference Numerals

[0073] 1…Heat conduction performance measurement device 2…Heating portion (heating device) 10…Heater 20…Heat conductor 21…Heat receiving member 22…Heat dissipation portion 23…Heat receiving portion 23a…Heat receiving surface 24…Heat convergence portion 25…Heat dissipation surface 26…Fixing portion 30…Heat insulation portion 40…Connecting device 41…Shaft 50…Driving portion (driving device) 60…Temperature control portion (temperature control device) 61…Temperature control block 611…Upper surface 612…TIM flow path 613…TIM discharge 614…TIM supply hole 615…Air flow path 616…Air discharge 617…Air supply hole 62…Heat spreader 63…Heating and cooling device 64…Cooling device 65…TIM pump 651…Tube 66…Air pump 661…Tube 67…Refrigerant circulation device (chiller) 70…Control portion 71 to 73... thermocouple 1a... heat treatment apparatus 81... mounting table 811... mounting surface 812... liquid flow path 813... liquid ejection 814... liquid supply hole 815... gas flow path 816... gas blowing 817... gas supply hole

Claims

1. A mounting surface on which a workpiece is placed; A liquid flow path through which a liquid can flow, a liquid discharge hole communicating with a first end side of the liquid flow path is provided on the mounting surface; The mounting table has a liquid supply hole in communication with a second end side of the liquid flow path on a surface different from the mounting surface.

2. The placement surface further includes a gas flow path through which gas can flow, a gas blowing hole communicating with a first end side of the gas flow path is provided on the mounting surface, The mounting table according to claim 1 , further comprising a gas supply hole provided in a surface other than the mounting surface, the gas supply hole communicating with a second end side of the gas flow path.

3. The mounting table according to claim 2 , wherein at least one of the liquid discharge holes and the gas blowing holes is provided at a position closer to a center of the mounting surface than to an outer edge of the mounting surface.

4. the liquid supply hole is connected to a liquid supply device via a first pipe; The mounting table according to claim 2 , wherein the gas supply hole is connected to a gas supply device via a second pipe.

5. 5. The mounting table of claim 4, further comprising an operation unit through which a user inputs instructions, and a control unit, wherein the control unit controls the liquid supply device and / or the gas supply device based on the user's instructions input to the operation unit.

6. The mounting table according to claim 1 , wherein the mounting surface is provided with a temperature sensor for measuring a surface temperature of the workpiece placed thereon.

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