Processing device

Abstract

To intuitively grasp an operation state of a processing device by enabling the selection of necessary information and the analysis of history information to be easily performed.SOLUTION: In a processing device configured by including a chuck table, a processing unit (rough grinding unit and finishing grinding unit) for processing a wafer (workpiece), a display for displaying various information, and a control unit for controlling each component, the control unit includes a processing history storage part for storing a processing history that executes processing to the wafer, a maintenance history storage part for storing a maintenance history that executes maintenance, an error history storage part for storing an error history of occurrences of errors, and a display command part for commanding the display to display history information stored by each of the processing history storage part, the maintenance history storage part and the error history storage part in a calendar format.SELECTED DRAWING: Figure 5

Description

Technical Field

[0001] The present invention relates to a processing apparatus for processing a workpiece such as a wafer held on a chuck table.

Background Art

[0002] For example, in the manufacturing process of semiconductor chips used in electronic devices such as mobile phones (smartphones) and personal computers (personal computers), the surface of a thin disk-shaped semiconductor wafer (hereinafter simply referred to as "wafer") is divided into a large number of rectangular regions by dividing lines called streets arranged in a grid pattern, and devices such as ICs and LSIs are respectively mounted in each rectangular region. Then, in order to miniaturize and lighten the semiconductor chip, after the back surface of the wafer (the surface opposite to the surface on which the device is mounted) is ground by a grinding apparatus and the wafer is thinned to a predetermined thickness, the wafer is cut along the dividing line with a cutting blade of a cutting apparatus called a dicing saw, whereby a plurality of semiconductor chips can be obtained.

[0003] By the way, in a processing apparatus such as a grinding apparatus or a cutting apparatus, in order to set processing conditions according to the type of wafer and perform processing of the wafer, a plurality of processing conditions are registered in the processing apparatus (see, for example, Patent Document 1). In addition, a processing history (log) when the wafer is processed is recorded, and this processing history is used for confirming the quality stability and investigating the situation when a defect occurs. Note that the processing history (log) registered in the processing apparatus includes, in addition to the above-described processing history, a maintenance history such as replacement of consumables such as a cutting blade and a grinding wheel, and an error history of an error that occurred during processing.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, conventionally, processing history, maintenance history, error history, etc. registered in a processing apparatus are generally listed and displayed by character information, so there has been a problem that it takes time and effort to select necessary information and analyze history information.

[0006] The present invention has been made in view of the above problems, and an object thereof is to provide a processing apparatus capable of easily selecting necessary information and analyzing history information in a short time and intuitively grasping the operating status.

Means for Solving the Problems

[0007] The invention according to claim 1 for achieving the above object is a processing apparatus including a chuck table for holding a workpiece, a processing unit for processing the workpiece held by the chuck table, a display for displaying various information, and a control unit for controlling each component, wherein the control unit includes a processing history storage unit for storing a processing history of performing processing on the workpiece, a maintenance history storage unit for storing a maintenance history of performing maintenance, an error history storage unit for storing an error history in which an error has occurred, and a display command unit for commanding the display to display the history information stored in the processing history storage unit, the maintenance history storage unit, and the error history storage unit in a calendar format, respectively.

[0008] The invention according to claim 2 is characterized in that, in the invention according to claim 1, the display command unit commands the display to display the processing history, the maintenance history, and the error history in a calendar format with different marks for each item.

[0009] The invention according to claim 3 is the invention according to claim 1, wherein the control unit further comprises a maintenance management unit, and the maintenance management unit comprises a maintenance item storage unit that stores maintenance items that require maintenance, a maintenance cycle storage unit that stores the maintenance cycle of the maintenance items, and a maintenance date calculation unit that calculates the maintenance date when the next maintenance is required based on the maintenance items and the maintenance cycle. The display command unit is characterized in that it commands the display to display the processing history, the maintenance history, the error history, and each item of the maintenance date in a calendar format.

[0010] The invention according to claim 4 is the invention according to claim 1, wherein the display command unit is characterized in that it commands the display to display the processing history, the maintenance history, the error history, and each item of the maintenance date in a calendar format with different marks for each item.

Advantages of the Invention

[0011] According to the invention described in claim 1, since the processing history stored in the processing history storage unit of the control unit, the maintenance history stored in the maintenance history storage unit, and the error history stored in the error history storage unit are displayed on the display in a calendar format, it is possible to easily select necessary information and analyze the history information in a short time, and intuitively and accurately grasp the operating status of the processing device.

[0012] According to the invention described in claim 2, since each item of the processing history, the maintenance history, and the error history is displayed in a calendar format with different marks for each item, it is possible to easily select necessary information and analyze the history information in a short time, and more intuitively and accurately grasp the operating status of the processing device.

[0013] According to the invention described in claim 3, in addition to the processing history, maintenance history, and error history, the maintenance date, which is the next maintenance scheduled date, is displayed in a calendar format on the display. Therefore, the selection of necessary information and the analysis of history information can be easily performed in a short time, and the operating status of the processing apparatus can be intuitively and accurately grasped.

[0014] According to the invention described in claim 4, the history information (processing history, maintenance history, and error history) and the maintenance date are each displayed in a calendar format with different marks. Therefore, the selection of necessary information and the analysis of history information can be easily performed in a short time, and the operating status of the processing apparatus can be grasped more intuitively and accurately.

Brief Description of the Drawings

[0015]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Embodiments for Carrying Out the Invention

[0016] Hereinafter, embodiments of the present invention will be described based on the accompanying drawings. In the following, a grinding apparatus as one form of the processing apparatus according to the present invention will be described.

[0017] [Configuration of Grinding Apparatus] First, the configuration of the grinding device will be described based on FIGS. 1 and 2. In the following description, the directions of the arrows shown in FIG. 1 are the X-axis direction (front-rear direction), Y-axis direction (left-right direction), and Z-axis direction (up-down direction), respectively.

[0018] The grinding device 1 shown in FIG. 1 is a device for grinding a disk-shaped wafer W (see FIG. 3), which is an object to be ground. Basically, it includes a chuck table 10, a rough grinding unit 20 and a finish grinding unit 30, which are grinding units, thickness gauges 40 and 50, a display 60 for displaying various information, and a control unit 70 for controlling each component as main components.

[0019] In addition, as shown in FIG. 1, the grinding device 1 includes a cassette 101 for accommodating the wafer W before grinding, a cassette 102 for accommodating the wafer W after grinding, a loading / unloading robot 103 for taking out the wafer W accommodated in the cassette 101 and storing the wafer W after grinding in the cassette 102, an alignment table 104 for temporarily placing and aligning the wafer W taken out from the cassette 101 by the loading / unloading robot 103, a first transfer unit 105 for transferring the wafer W aligned by the alignment table 104 and delivering it to the chuck table 10, a cleaning unit 110 for cleaning the wafer W after grinding, a second transfer unit 106 for receiving the wafer W from the chuck table 10 and transferring it to the cleaning unit 110, and the like.

[0020] Here, the configurations of the chuck table 10, the rough grinding unit 20 and the finish grinding unit 30, the thickness gauges 40 and 50, the display 60, and the control unit 70, which are the main components of the grinding device 1, will be described respectively.

[0021] (Chuck Table) As shown in FIG. 1, three chuck tables 10 are arranged on a disk-shaped turntable 2 that is horizontally rotatably arranged on a base 100 of a grinding device 1. Here, each chuck table 10 is a disk-shaped member, and is arranged on the turntable 2 that intermittently rotates around a central axis perpendicular to the Z-axis direction at an equal angular pitch (120° pitch) in the circumferential direction. And these chuck tables 10 intermittently rotate (revolve) by 120° each around the axis center perpendicular to the Z-axis direction of the turntable 2 due to the intermittent rotation of the turntable 2, and sequentially move between the wafer loading / unloading area R1, the rough grinding area R2, and the finish grinding area R3, and rotate (rotate on its own axis) at a predetermined speed around the axis center perpendicular to the Z-axis direction by a rotation drive mechanism (not shown).

[0022] Also, a disk-shaped porous member 10A made of porous ceramic or the like is incorporated in the center of each chuck table 10, and the upper surface of each porous member 10A constitutes a holding surface for sucking and holding a disk-shaped wafer W. Each porous member 10A is selectively connected to a suction source (not shown), and when this porous member 10A is connected to the suction source, a negative pressure is generated in the porous member 10A, so that the wafer W (see FIG. 3) is sucked and held on the holding surface of the upper surface of the porous member 10A by this negative pressure.

[0023] Here, the wafer W to be processed is a thin disk-shaped member made of a single-crystal silicon base material. In the state shown in FIG. 3, the surface facing downward is partitioned into a plurality of rectangular regions by a plurality of lattice-shaped division planned lines L1, L2 called streets, and devices D such as ICs and LSIs are mounted in each rectangular region. These devices D are protected by a protective tape T attached to the surface of the wafer W. Then, the wafer W is sucked and held on the holding surface of the chuck table 10 via the protective tape T on its surface, and its back surface (the upper surface in FIG. 3) is ground by the grinding device 1.

[0024] (Rough grinding unit and finish grinding unit) The rough grinding unit 20 and the finish grinding unit 30 that make up the grinding unit are arranged side by side along the front-rear direction (X-axis direction) at the left-right direction (Y-axis direction) end (right end) on the base 100. Here, the rough grinding unit 20 is a unit that rough grinds the upper surface (surface to be ground) of the wafer W held on the holding surface of the chuck table 10 located in the rough grinding region R2, and the finish grinding unit 30 is a unit that finish grinds the upper surface (surface to be ground) of the wafer W held on the holding surface of the chuck table 10 located in the finish grinding region R3, and the basic configurations of both are the same.

[0025] That is, the rough grinding unit 20 includes a spindle motor 22 fixed to a holder 21, a vertical spindle (not shown) rotationally driven by the spindle motor 22, a disk-shaped mount 24 attached to the lower end of the spindle, and a grinding wheel 25 detachably attached to the lower surface of the mount 24. Here, the grinding wheel 25 is composed of a disk-shaped base 25a and a plurality of grinding grains, which are cutting tools, annularly attached to the lower surface of the base 25a.

[0026] Similarly, the finish grinding unit 30 also includes a spindle motor 32 fixed to a holder 31, a vertical spindle (not shown) rotationally driven by the spindle motor 32, a disk-shaped mount 34 attached to the lower end of the spindle, and a grinding wheel 35 detachably attached to the lower surface of the mount 34. Here, the grinding wheel 35 is composed of a disk-shaped base 35a and a plurality of grinding grains, which are cutting tools, annularly attached to the lower surface of the base 35a, but these grinding grains 35b are composed of finer abrasive grains than the grinding grains 25b of the rough grinding unit 20.

[0027] Incidentally, the rough grinding unit 20 and the finish grinding unit 30 are each supported by a lifting mechanism 3 provided on a pair of block-shaped columns 200 vertically erected along the X-axis direction (front-rear direction) at the +Y-axis direction end (right end) of the base 100 so as to be movable up and down. Here, since the configurations of both lifting mechanisms 3 are the same, hereinafter, corresponding components will be described with the same reference numerals.

[0028] Each lifting mechanism 3 moves the rough grinding unit 20 and the finish grinding unit 30 up and down along the Z-axis direction (vertical direction), and is provided with a lifting plate 4 in the shape of a rectangular plate and a guide rail 5 for guiding the lifting movement of the lifting plate 4, respectively. Here, the rough grinding unit 20 and the finish grinding unit 30 are respectively attached to each lifting plate 4. Further, the guide rails 5 are disposed perpendicular to and parallel to each other on the column 200.

[0029] And near each guide rail 5, a rotatable ball screw 6 is vertically erected along the Z-axis direction (vertical direction) parallel to the guide rail 5, and the upper end of the ball screw 6 is connected to a servomotor 7 capable of forward and reverse rotation, which is a drive source. Further, the lower end of each ball screw 6 is rotatably supported by the column 200 by bearings (not shown), and nut members (not shown) horizontally protruding from the back surface of each lifting plate 4 are respectively screwed onto these ball screws 6.

[0030] Therefore, when the servomotor 7 of each lifting mechanism 3 configured as described above is activated to rotate each ball screw 6 forward and backward, each lifting plate 4 with a nut member (not shown) screwed onto each ball screw 6 moves up and down along the guide rail 5, so that the rough grinding unit 20 and the finish grinding unit 30 respectively attached to each lifting plate 4 also move up and down independently of each other along the Z-axis direction (vertical direction).

[0031] (Thickness measuring instrument) In this embodiment, a thickness measuring device 40 for measuring the thickness of the wafer W being roughly ground by the rough grinding unit 20 and a thickness measuring device 50 for measuring the thickness of the wafer W being finish ground by the finish grinding unit 30 are provided. Here, each of the thickness measuring devices 40 and 50 is a contact type height gauge, and as shown in FIG. 1, it includes a first probe 41, 51 that contacts the upper surface of the wafer W during grinding and a second probe 42, 52 that contacts the upper surface of the chuck table 10.

[0032] Then, one thickness measuring device 40 measures the thickness of the wafer W during rough grinding by subtracting the upper surface height of the chuck table 10 measured by the other second probe 42 from the upper surface height of the wafer W during rough grinding measured by one first probe 41. Similarly, the other thickness measuring device 50 measures the thickness of the wafer W during finish grinding by subtracting the upper surface height of the chuck table 10 measured by the other second probe 52 from the upper surface height of the wafer W during finish grinding measured by one first probe 51.

[0033] (Display) Various components including the chuck table 10, the rough grinding unit 20, the finish grinding unit 30, etc. described above are housed in a processing chamber S formed in a rectangular box-shaped processing chamber cover 80 as shown in FIG. 1. However, a rectangular plate-shaped display 60 is installed at the upper part of the -Y-axis direction end face (left end face) of the processing chamber cover 80. Also, in the vicinity of the display 60 on the upper surface of the processing chamber cover 80, an indicator lamp 90 for displaying the operating status of the grinding device 1 is erected. This indicator lamp 90 lights up green, for example, when the grinding device 1 is operating normally, and blinks red when any error such as a failure occurs in the grinding device 1, notifying the operator of the operating status of the grinding device 1.

[0034] Here, for the display 60, an operator can input processing conditions and the like. Also, various history information such as processing history, maintenance history, error history, etc. and maintenance schedule information are displayed in a calendar format on the display 60. Details regarding this will be described later.

[0035] (Control Unit) The control unit 70 includes a CPU (Central Processing Unit) that performs arithmetic processing according to a control program, and memories such as a ROM (Read Only Memory) and a RAM (Random Access Memory). This control unit 70 controls each component such as the chuck table 10, the rough grinding unit 20, and the finish grinding unit 30, and also functions to display various history information and maintenance schedule information in a calendar format on the display 60.

[0036] Specifically, as shown in FIG. 2, this control unit 70 is provided with a processing history storage unit 71 that stores the processing history of performing grinding processing on the wafer W, a maintenance history storage unit 72 that stores the maintenance history of performing maintenance on the grinding apparatus 1, an error history storage unit 73 that stores the error history in which an error has occurred in the grinding apparatus 1, and a display command unit 74 that outputs a command to display various history information stored respectively by the processing history storage unit 71, the maintenance history storage unit 72, and the error history storage unit 73 in a calendar format to the display 60, and a maintenance management unit 75 that manages the maintenance scheduled date (maintenance date) and the like. Here, the processing history includes the processing conditions of the wafer W, the supply current values to various drive sources, the consumption amounts of the grinding wheels 25b, 35b, etc., the transfer history of the wafer W, and the like. Also, the maintenance history includes the replacement of consumables such as the grinding wheels 25b, 35b, etc., and the error history includes current value over, wafer W transfer error, wafer W suction error (vacuum error), flow rate error of grinding water, etc.

[0037] Then, the maintenance management unit 75 includes a maintenance item storage unit 751 that stores maintenance items that require maintenance, a maintenance cycle storage unit 752 that stores the cycle for performing the maintenance items, and a maintenance date calculation unit 753 that calculates the date (maintenance date) when the next maintenance is required based on the maintenance items and the maintenance cycle.

[0038] [Operation of the grinding device] Next, the grinding process of the wafer W by the grinding device 1 configured as described above will be described.

[0039] When grinding the wafer W, one wafer W before processing is taken out from the cassette 101 by the loading / unloading robot 103 shown in FIG. 1, and the taken-out wafer W is transferred to the alignment table 104. On the alignment table 104, the wafer W is aligned, and the aligned wafer W is transferred by the first transfer unit 105 to the chuck table 10 located in the wafer loading / unloading region R1 and is sucked and held on the holding surface of the chuck table 10.

[0040] Then, the turntable 2 rotates by 120° in the direction of the arrow in FIG. 1 (counterclockwise) around its vertical axis center and moves to the rough grinding region R2 together with the wafer W. In this rough grinding region R2, the back surface (upper surface) of the wafer W held on the holding surface of the chuck table 10 is rough ground by the rough grinding unit 20.

[0041] That is, the chuck table 10 is rotationally driven at a predetermined rotational speed (for example, 300 rpm) by a rotational drive mechanism (not shown), and the spindle motor 22 of the rough grinding unit 20 is activated to rotationally drive the grinding wheel 25b at a predetermined speed (for example, 4000 rpm).

[0042] As described above, with the chuck table 10, the wafer W held thereon, and the grinding wheel 25b each rotating, the elevating mechanism 3 is driven to lower the grinding wheel 25b in the -Z axis direction. That is, when the servo motor 7 is driven and the ball screw 6 rotates, the elevating plate 4 provided with a nut member (not shown) screwed to the ball screw 6 descends in the -Z axis direction together with the rough grinding unit 20. Then, the lower surface (grinding surface) of the grinding wheel 25b contacts the upper surface (back surface) of the wafer W. At this time, grinding water is supplied from a grinding water supply source (not shown) to the contact surface between the grinding wheel 25b and the wafer W. Then, while receiving the supply of this grinding water, the upper surface (back surface) of the wafer W is ground by the grinding wheel 25b, and its thickness is measured by the thickness measuring device 40.

[0043] Then, when the wafer W is roughly ground to a predetermined thickness by the rough grinding unit 20 as described above, the rough grinding unit 20 is raised in the +Z axis direction by the elevating mechanism 3, and the grinding wheel 25b is separated from the upper surface of the wafer W. Then, the turntable 2 rotates 120° in the direction of the arrow in FIG. 1 around its vertical axis center, and the wafer W roughly ground in the rough grinding area R2 and the chuck table 10 holding the same move to the finish grinding area R3, and the upper surface (back surface) of the wafer W is finish ground by the finish grinding unit 30 in this finish grinding area R3. During the finish grinding of the wafer W, grinding water is also supplied from a grinding water supply source (not shown) to the contact surface between the grinding wheel 35b and the wafer W, and the thickness of the wafer W during finish grinding is measured by the thickness measuring device 50. Here, since the finish grinding of the wafer W by the finish grinding unit 30 is the same as the rough grinding of the wafer W by the rough grinding unit 20, the description of this finish grinding is omitted.

[0044] Then, when the wafer W is finish-ground to a predetermined thickness by the finish-grinding unit 30, the elevating mechanism 3 raises the finish-grinding unit 30 in the +Z-axis direction so that the grinding wheel 35b is separated from the upper surface of the wafer W. Then, the turntable 2 rotates by 120° in the direction of the arrow in FIG. 1 around its vertical axis center, and the wafer W finish-ground in the finish-grinding area R3 and the chuck table 10 holding the same move to the wafer loading / unloading area R1, and in this wafer loading / unloading area R1, the wafer W is removed from the chuck table 10 by the second transfer unit 106 and transferred to the cleaning unit 110. In the cleaning unit 110, the wafer W is cleaned with a cleaning liquid (pure water), and the cleaned wafer W is transferred from the cleaning unit 110 to the cassette 102 by the second transfer unit 106 and is housed in the cassette 102, whereby a series of grinding processes for the wafer W is completed.

[0045] Thus, when the grinding process of the wafer W is performed by the grinding apparatus 1 as described above, the processing history is stored by the processing history storage unit 71 of the control unit 70 together with the date on which the processing was performed. Also, in the grinding apparatus 1, when maintenance such as replacement of the worn grinding wheels 25b and 35b is performed, the maintenance history is stored by the maintenance history storage unit 72 of the control unit 70 together with the date on which the maintenance was performed. Further, in the grinding apparatus 1, when any error occurs during the grinding process of the wafer W, the error history is stored by the error history storage unit 73 of the control unit 70 together with the date on which the error occurred.

[0046] On the other hand, in the maintenance management unit 75 of the control unit 70, the maintenance items that require maintenance are stored by the maintenance item storage unit 751, and the maintenance cycle of the maintenance items is stored by the maintenance cycle storage unit 752. Then, in the maintenance date calculation unit 753, the maintenance date when the next maintenance is required is calculated based on the maintenance items stored in the maintenance item storage unit 751 and the maintenance cycle stored in the maintenance cycle storage unit 752.

[0047] Then, the display command unit 74 of the control unit 70 commands the display 60 to display in calendar format the items of processing history, maintenance history, error history, and maintenance date. Here, an example of the display screen of the display 60 is shown in FIG. 4. On this display screen, a calendar display unit 60A is provided. In this calendar display unit 60A, for example, as shown in FIG. 5, the history information of the processing history, maintenance history, or error history on each date in November 2023, and the maintenance date on which the next maintenance is scheduled are displayed in characters in calendar format. In FIG. 5, "Processing" means the processing history, "Maint." means the maintenance history, "Error" means the error history, and "Maint. Sched." means the maintenance date (scheduled maintenance date).

[0048] Specifically explaining the display content in November 2023 shown in FIG. 5, on November 2, 16, and 27, grinding of the wafer W is performed and maintenance is also performed. Therefore, the processing history and the maintenance history are displayed on these dates. Also, from November 3 to 6, from 9 to 12, on the 14th, and from 19 to 26, only grinding of the wafer W is performed. Therefore, only the processing history is displayed on these dates.

[0049] Furthermore, on November 7, 13, 17, and 28, some error occurred when grinding the wafer W was being performed. Therefore, the error history is displayed together with the processing history. Here, for example, when clicking on the 25th, the details of the processing history (XXX…, YYY…, ZZZ…) are displayed. Similarly, when clicking on other dates, the details of the items displayed there are shown.

[0050] And according to the display content shown in FIG. 5, it can be seen that maintenance is scheduled on November 29 and 30.

[0051] Note that Fig. 5 shows various history information (processing history, maintenance history, and error history) for November 2023 and maintenance schedule information (maintenance scheduled date). When the send key 61 is clicked, the content for December of the following month is displayed, and when the return key 62 is clicked, the content for October of the previous month is displayed.

[0052] As described above, in this embodiment, the processing history stored in the processing history storage unit 71 of the control unit 70, the maintenance history stored in the maintenance history storage unit 72, the error history stored in the error history storage unit 73, and the maintenance date calculated by the maintenance date calculation unit 753 of the maintenance management unit 75 are displayed in character form in a calendar format on the display 60. Therefore, the selection of necessary information and the analysis of history information can be easily performed in a short time, and the effect of being able to intuitively and accurately grasp the operating status of the grinding device 1 can be obtained.

[0053] Note that in Fig. 5, various history information (processing history, maintenance history, and error history) and the maintenance date are displayed in character form in a calendar format. However, as shown in Fig. 6, the various history information and the maintenance history may be displayed in a calendar format using different marks.

[0054] That is, the display contents of the various history information (processing history, maintenance history, and error history) and the maintenance date shown in Figs. 5 and 6 are the same. However, in the display example shown in Fig. 6, instead of the characters shown in Fig. 5, four different marks ○, ◎, ●, and ※ are used for display. Specifically, ○ represents the processing history, ◎ represents the maintenance history, ● represents the error history, and ※ represents the maintenance date.

[0055] Furthermore, by displaying various history information (processing history, maintenance history, and error history) indicated by characters in FIG. 5 and the maintenance date using four different marks 〇, ◎, ●, and ※ as shown in FIG. 6, it is possible to easily select necessary information and analyze the history information in a short time, and an effect that the operating status of the grinding device 1 can be intuitively and accurately grasped can be obtained. In addition, the same effect can be obtained by making the colors of the marks 〇, ◎, ●, and ※ different from each other, or by making the colors of the same mark different from each other.

[0056] Note that the above has been described by taking the grinding device for wafers as an example, but the present invention is similarly applicable to grinding devices for any other workpiece other than wafers, or processing devices such as cutting devices and polishing devices other than grinding devices.

[0057] In addition, the present invention is not limited to being applied to the embodiments described above, and it goes without saying that various modifications are possible within the scope of the technical idea described in the claims, the specification, and the drawings.

Explanation of Reference Numerals

[0058] 1: Grinding device (processing device), 2: Turntable, 3: Lifting mechanism, 4: Lifting plate, 5: Guide rail, 6: Ball screw, 7: Servo motor, 10: Chuck table, 10A: Porous member, 20: Rough grinding unit (grinding unit), 21: Holder, 22: Spindle motor, 24: Mount, 25: Grinding wheel, 25a: Base, 25b: Grinding stone, 30: Finish grinding unit (grinding unit), 31: Holder, 32: Spindle motor, 33: Spindle, 34: Mount, 35: Grinding wheel, 35a: Base, 35b: Grinding stone, 40, 50: Thickness measuring instrument, 41, 42: First probe, 51, 52: Second probe, 60: Display, 60A: Calendar display section, 61: Feed key, 62: Return key, 70: Control unit, 71: Processing history storage section, 72: Maintenance history memory unit, 73: Error history memory unit, 74: Display command unit, 75: Maintenance management unit, 751: Maintenance item memory unit, 752: Maintenance cycle memory unit, 753: Maintenance date calculation unit, 80: Processing chamber cover, 90: Display lamp, 100: Base, 101, 102: Cassette, 103: Loading / unloading robot, 104: Alignment table, 105: First transfer unit, 106: Second transfer unit, 110: Cleaning unit, 200: Column, D: Device, L1, L2: Scheduled division lines, R1: Wafer loading / unloading area, R2: Rough grinding area, R3: Finish grinding area, S: Processing chamber, T: Protection tape, W: Wafer (workpiece)

Claims

1. A chuck table for holding a workpiece, A processing unit for processing the workpiece held by the chuck table, A display for displaying various information, A control unit for controlling each component, A processing apparatus comprising: The control unit includes: A processing history storage unit for storing a processing history of the workpiece, A maintenance history storage unit for storing a maintenance history of maintenance performed, An error history storage unit for storing an error history in which an error has occurred, A display command unit for instructing the display to display the history information stored in the processing history storage unit, the maintenance history storage unit, and the error history storage unit in a calendar format, The processing apparatus is characterized by comprising the above.

2. The display command unit instructs the display to display the processing history, the maintenance history, and the error history in a calendar format with different marks for each item, according to the processing apparatus according to Claim 1.

3. The control unit further includes a maintenance management unit, The maintenance management unit includes: A maintenance item storage unit for storing maintenance items that require maintenance, A maintenance cycle storage unit for storing the maintenance cycle of the maintenance items, A maintenance date calculation unit for calculating the next maintenance date based on the maintenance items and the maintenance cycle, The maintenance management unit is characterized by comprising the above, The display command unit instructs the display to display the processing history, the maintenance history, the error history, and the maintenance date in a calendar format, according to the processing apparatus according to Claim 1.

4. The display instruction unit instructs the display to display, in a calendar format with different marks for each item of the processing history, the maintenance history, the error history, and the maintenance date, in accordance with the processing apparatus according to claim 3.

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