Stage device, exposure device, and method for producing article

Abstract

To provide a stage device provided with a static elimination device due to soft X-ray irradiation capable of reducing an influence of the ion gas to a non-static elimination target.SOLUTION: A stage device comprises a chuck with a mounting surface for placing a substrate, a substrate elevation member that lifts the substrate placed on the mounting surface of the chuck from the mounting surface, an irradiation section that is arranged outside the chuck in a first plane parallel to the mounting surface and irradiates, with X-rays, a part between the substrate lifted from the mounting surface by the substrate elevation member and the mounting surface, a blowing section that is arranged outside the chuck in the first plane and blows air toward between the substrate lifted from the mounting surface by the substrate elevation member and the mounting surface, and a shielding mechanism that is arranged along at least part of the outer shape of the mounting surface in the first plane and regulates the direction of the airflow of the gas blown from the blowing section.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to a stage device, an exposure device, and a method for manufacturing an article.

Background Art

[0002] Conventionally, in a photolithography process for manufacturing a liquid crystal display element, a semiconductor element, or the like, an exposure device is used that illuminates a photomask or a reticle with exposure light and projects a pattern image of the mask onto a substrate coated with a photosensitive agent such as photoresist through a projection optical system. When the exposed photosensitive substrate is carried out of the exposure device, peeling charge may occur between the substrate and the substrate support portion. Since there is a risk that foreign matter such as fine particles may adhere to the charged substrate or the element may be damaged by dielectric breakdown, it is necessary to remove the static electricity charged on the substrate. Patent Document 1 discloses an exposure device that irradiates soft X-rays along the mounting surface of a substrate to ionize the atmosphere near the substrate, thereby removing the static electricity charged on the substrate.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The exposure device of Patent Document 1 includes a blower unit that moves the ion gas generated by irradiating soft X-rays. However, there is a risk that the ion gas may also come into contact with peripheral members that are not the objects to be discharged, causing problems such as plating peeling. The peeled plating film may contaminate the environment where the exposure device is arranged and affect the exposure accuracy, or the plating film may peel off, causing the member to rust, which may also have an adverse effect on the device itself. Therefore, an object of the present invention is to provide a stage device including an electrostatic charge removal mechanism by soft X-ray irradiation that can reduce the influence of ion gas on a non-charge removal target portion.

Means for Solving the Problems

[0005] To achieve the object, a stage mechanism according to an aspect of the present invention includes a chuck having a mounting surface for mounting a substrate, a substrate lifting member for lifting the substrate mounted on the mounting surface of the chuck from the mounting surface, an irradiation unit disposed outside the chuck in a first plane parallel to the mounting surface, and irradiating X-rays between the substrate lifted from the mounting surface by the substrate lifting member and the mounting surface, and a blowing unit disposed outside the chuck in the first plane, and blowing air between the substrate lifted from the mounting surface by the substrate lifting member and the mounting surface, and a shielding mechanism disposed along at least a part of the outer shape of the mounting surface in the first plane, and regulating the direction of the flow of the gas blown from the blowing unit.

Effects of the Invention

[0006] According to the present invention, it is possible to provide a stage device including an electrostatic charge removal mechanism by soft X-ray irradiation that can reduce the influence of ion gas on a non-charge removal target portion.

Brief Description of the Drawings

[0007]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Best Mode for Carrying Out the Invention

[0008] Hereinafter, the exposure apparatus according to this embodiment will be described in detail with reference to the accompanying drawings. Note that the drawings shown below are drawn at scales different from the actual ones for easy understanding of this embodiment. Hereinafter, the stage apparatus according to this embodiment will be described with reference to the accompanying drawings. FIG. 1 is a schematic diagram showing the configuration of an exposure apparatus 1 including a stage apparatus as one aspect of the present invention. In the exposure apparatus 1 of this embodiment, a mask stage 20 is disposed above the projection optical system 10 in the vertical direction, and a substrate stage (substrate to be exposed stage) 30 is disposed below it. In this specification, the optical axis direction of the projection optical system 10 is defined as the Z direction, and the directions perpendicular to the Z direction and perpendicular to each other are defined as the X direction and the Y direction. Also, the respective rotation directions around the X axis, Y axis, and Z axis are defined as the θX direction, θY direction, and θZ direction. The mask stage 20 and the substrate stage 30 are each independently movable, and their moving positions can both be controlled by measuring with a laser interferometer 50.

[0009] The substrate stage 30 has a Y stage 32 disposed on a main body base 31 and an X stage 33 disposed on the Y stage 32. A θZ stage 34 is mounted on this X stage 33, and a substrate chuck 35 is disposed thereon. The substrate chuck 35 supports a substrate 36 to be exposed. Thereby, the substrate 36 can be moved in the X direction, Y direction, and Z direction by the substrate stage 30 and is supported so as to be rotatable within the XY plane. The θZ stage 34 can move the substrate 36 in the Z direction so that the surface of the substrate 36 coincides with the substrate-side focal plane of the projection optical system 10 during exposure.

[0010] The mask stage 20 includes a mask stage plate 21 and an XYθ stage 22 disposed thereon, and a mask (original plate) 23 on which a pattern to be projected onto the XYθ stage 22 is formed is disposed. Accordingly, the mask 23 is movable in the X and Y directions and is supported so as to be rotatable within the XY plane. Above the mask stage 20, an observation optical system 40 for observing an image of the pattern of the mask 23 formed on the substrate 36 through the projection optical system 10 is disposed. Above the observation optical system 40, an illumination optical system 41 is disposed.

[0011] Both the mask stage 20 and the substrate stage 30 are position-measured and controlled by a laser interferometer 50. The laser interferometer 50 includes a laser head 51, a beam splitter 52, an interference mirror 53, a first reflection mirror 54 attached to the θZ stage 34, and a second reflection mirror 55 attached to the mask stage plate 21.

[0012] Here, the laser beam position of the laser interferometer 50 is set to be approximately at the mask-side focal plane of the projection optical system 10 in the vertical direction (the optical axis direction of the projection optical system 10) and approximately at the optical axis position of the projection optical system 10 within the horizontal plane for the mask stage 20. For the substrate stage 30, it is set to be approximately at the optical axis position of the projection optical system 10 within the horizontal plane, and is set to pass below the plate-side focal plane of the projection optical system 10 in the vertical direction.

[0013] When performing an exposure process (lithography process) on the surface of the substrate 36 using the exposure apparatus 1, the substrate 36 is transported to the position of the substrate chuck 35 by a substrate transport apparatus such as a transport robot (not shown). At this time, the substrate lifting member 37 of the substrate chuck 35 is in a state of being raised above the mounting surface of the substrate chuck 35. The substrate transport apparatus such as a transport robot has a hand portion, and within the XY plane, the substrate lifting member 37 and the hand portion are configured to be alternately arranged.

[0014] The hand that has carried the substrate 36 stops and descends above the substrate lifting member 37. After delivering the substrate 36 to the substrate lifting member 37, it stops descending and retracts from the position of the substrate chuck 35. The substrate lifting member 37 that has received the substrate 36 from the hand descends until the upper surface of the substrate lifting member 37 is lower than the upper surface of the substrate chuck 35, and the substrate 36 is placed on the substrate chuck 35.

[0015] In this state, a negative pressure is provided to a blow hole (second blow hole) 39 provided in the substrate chuck 35 by an exhaust device (not shown), and the substrate 36 is fixed to the upper surface of the substrate chuck 35. Note that the fixing of the substrate 36 to the substrate chuck 35 may be performed by other methods such as electrostatic adsorption instead of by suction with a negative pressure. By the above drive mechanism, the exposure apparatus moves the mask stage 20 and the substrate stage 30 to perform alignment of the substrate 36, the mask 23, and the projection optical system 10. Thereafter, an exposure process for transferring the pattern of the mask 23 onto the surface of the substrate 36 is performed.

[0016] After the exposure, after the substrate stage has moved to the transfer position, the substrate lifting member 37 ascends. The supply of the negative pressure by the exhaust device is stopped to restore the pressure, and the substrate chuck 35 releases the substrate adsorption. At this time, in order to easily peel the substrate 36 from the substrate chuck 35, air may be blown from the blow hole 39. The substrate lifting member 37 ascends above the upper surface of the substrate chuck 35 to lift the substrate 36. The hand enters in a state where a sufficient gap is secured between the substrate chuck 35 and the substrate 36. The hand ascends to the transfer position, receives the substrate 36, and carries it out.

[0017] When the adsorption of the substrate 36 by the substrate chuck 35 is released and the substrate 36 is lifted from the substrate chuck 35 by the hand, peeling electrification occurs between the substrate chuck 35 and the substrate 36. The present invention discloses a stage mechanism that reduces the influence of ionized gas on members around the non-discharging target when discharging by soft X-ray irradiation in order to prevent adhesion of dust or the like to the peeled and electrified substrate 36 and to prevent dielectric breakdown of the element.

[0018] A mechanism that is configured in the stage mechanism according to this embodiment and eliminates static electricity generated during substrate transfer or the like will be described.

Embodiment

[0019] FIG. 2 shows a top view of the stage mechanism of Embodiment 1 of the present invention. The stage mechanism of this embodiment includes a substrate chuck 35, a soft X-ray ionizer (soft X-ray irradiation unit) 60, a blower unit 70, a substrate lifting member 37, and a control unit (not shown). The substrate chuck 35 has a substrate placement surface on which a substrate 36 is placed, and has shielding blow holes (first blow holes) 38 provided on the substrate placement surface along the outer shape of the substrate chuck 35 in a first plane parallel to the substrate placement surface. The soft X-ray ionizer 60 is disposed around the substrate chuck 35. In this specification, the soft X-ray ionizer 60 is exemplified as the ionizer, but the present invention is not limited thereto, and an X-ray ionizer can also achieve the same effect.

[0020] The substrate lifting member 37 is disposed in the gap between the substrate placement surface of the substrate chuck 35 and the substrate placement surface that holds the substrate placed on the substrate placement surface of the substrate chuck 35, and raises and lowers the substrate 36 with respect to the substrate placement surface. The blower unit 70 is disposed outside the substrate chuck 35 in a first plane parallel to the substrate placement surface, and blows a gas such as air between the substrate 36 lifted from the placement surface by the substrate lifting member 37 and the substrate placement surface.

[0021] The shielding blow holes 38 may be holes having a circular or elliptical cross-sectional shape arranged at equal intervals, or holes having a rectangular (slit-like) cross-sectional shape with the direction along the outer shape of the substrate chuck 35 as the longitudinal direction. When blow holes 39 used during conveyance of the substrate 36 are provided on the substrate chuck 35 as shown in FIG. 2, the control unit controls the blow flow rate (flow velocity) from the shielding blow holes 38 to be greater than the blow flow rate (flow velocity) from the blow holes 39. In that case, the shielding blow holes 38 are arranged on the outer peripheral side of the substrate chuck 35 with respect to the blow holes 39 in a first plane parallel to the substrate placement surface.

[0022] Further, the substrate lifting member 37 is configured to have a longitudinal direction continuously along one side direction of the substrate 36 (Y direction in FIG. 2), and the air blowing unit 70 blows air along the longitudinal direction of the substrate lifting member 37. In this way, when the substrate 36 is lifted by the substrate lifting member 37, the gas containing the gas ionized by the soft X-ray 61 irradiated from the soft X-ray ionizer 60 (hereinafter also referred to as ion gas) moves in the Y direction by the air blowing from the air blowing unit 70.

[0023] At this time, the air blow blown from the shielding blow hole 38 in the Z direction functions as a shielding portion (shielding mechanism) that restricts the outflow of the ion gas to a place other than the object to be neutralized. That is, it is possible to suppress (restrict) the outflow to the outside of the space (first space) surrounded by the air blow from the shielding blow hole 38 between the substrate 36 lifted by the substrate lifting member 37 serving as the object to be neutralized and the substrate chuck 35. The shielding portion is disposed along at least a part of the outer shape of the substrate placement surface in the first plane. The ion gas that has passed through the first space between the substrate 36 and the substrate chuck 35 is recovered by the recovery unit (exhaust unit, exhaust opening) 90. The recovery unit 90 is disposed outside the air blowing unit 70 of the substrate chuck 35 in the first plane. The gas supplied from the air blowing unit 70 is not limited to air, and nitrogen, argon, inert gas, etc. may be used.

[0024] With this configuration, the substrate 36 irradiated with the soft X-ray 61 from the soft X-ray ionizer 60 is neutralized, or the substrate 36 is neutralized by contact with the ion gas in the first space generated by irradiation with the soft X-ray 61 from the soft X-ray ionizer 60. The ion gas in the first space is recovered by the recovery unit 90, and it is possible to prevent contact with non-neutralization target members outside the first space surrounded by the substrate 36, the substrate chuck 35, and the shielding portion. Thereby, it is possible to avoid the influence such as plating peeling due to contact of the ion gas with non-neutralization target members.

Example

[0025] FIG. 3 is a top view of the stage mechanism of Example 2 as viewed from above. The description of the same configuration as that of the stage mechanism of Example 1 will be omitted, and the different configurations will be described.

[0026] The stage mechanism of this embodiment includes a shielding blow member 80 instead of the shielding blow holes 38 provided along the outer shape of the substrate chuck 35 with respect to Example 1. The shielding blow member 80 is provided so as to surround the outer shape of the substrate chuck 35 in a first plane parallel to the substrate mounting surface, and blows air upward (in the Z direction). Note that the shielding blow holes (first blow holes) 81 of the shielding blow member 80 may be round holes arranged at equal intervals, or continuous linear (slit-shaped) with the direction along the outer shape of the substrate chuck 35 as the longitudinal direction.

[0027] The upper surface (the surface on the mask 23 side) of the shielding blow member 80 is preferably not higher than the upper surface of the substrate chuck 35 (the mounting surface of the substrate 36) in order to avoid interference of equipment when the substrate 36 is loaded into and unloaded from the substrate chuck 35. In this embodiment, since the shielding blow member 80 is provided as a separate member from the substrate chuck 35, the ease of component replacement and the degree of freedom in arranging the shielding blow holes 81 with respect to the substrate chuck 35 can be increased.

[0028] Also in the stage mechanism of this embodiment, the substrate 36 irradiated with the soft X-rays 61 from the soft X-ray ionizer 60 is discharged, or the substrate 36 is discharged by contact with the ion gas in the first space generated by irradiation with the soft X-rays 61 from the soft X-ray ionizer 60. The ion gas in the first space is recovered by the recovery unit 90, and it is possible to prevent contact with members that are not to be discharged and are outside the first space surrounded by the substrate 36, the substrate chuck 35, and the shielding portion. Thereby, it is possible to avoid the influence such as plating peeling due to contact of the ion gas with members that are not to be discharged.

Example

[0029] The stage mechanism of Example 3 of the present invention will be described with reference to FIG. 4.

[0030] FIG. 4 is a top view of the stage mechanism according to Embodiment 3 of the present invention as viewed from above (in the Z direction). The stage mechanism of this embodiment includes a shielding member 82 instead of the shielding blow member 80 of Embodiment 2. The shielding member (shielding mechanism) 82 is composed of a member having a thickness and a low density such that soft X-rays can pass through, and is preferably composed of a material such as stainless steel or lead.

[0031] Since the shielding member 82 of this embodiment is configured as a wall composed of a plate-like member, in order not to cause interference when loading and unloading the substrate 36 to and from the substrate chuck 35 of the substrate 36, it may be provided with a drive mechanism that can move upward (in the Z direction) from the placement surface. For example, from after the completion of the exposure process until before unloading the substrate 36, or while irradiating the soft X-ray 61 from the soft X-ray ionizer 60, or while the blower unit 70 is blowing air and the recovery unit 90 is exhausting, the shielding member 82 may be arranged so as to surround the space between the substrate 36 and the substrate chuck 35. As the drive mechanism, for example, it is a lifting mechanism that enables movement in the Z direction.

[0032] Also in the stage mechanism of this embodiment, the substrate 36 irradiated with the soft X-ray 61 from the soft X-ray ionizer 60 is discharged of static electricity, or the substrate 36 is discharged of static electricity by contact with the ion gas in the first space generated by irradiating the soft X-ray 61 from the soft X-ray ionizer 60. The ion gas in the first space is recovered by the recovery unit 90, and it is possible to prevent contact with non-electrostatic-discharge target members outside the first space surrounded by the substrate 36, the substrate chuck 35, and the shielding unit. Thereby, it is possible to avoid the influence such as plating peeling due to contact of the ion gas with non-electrostatic-discharge target members.

[0033] Here, a flowchart of the static electricity removal method in the stage mechanism according to the above-described Embodiments 1 to 3 will be described with reference to FIG. 5. The control of the static electricity removal method in the stage mechanism described in FIG. 5 is executed by, for example, a control unit (not shown).

[0034] The substrate 36 coated with the photosensitive agent is transported to the substrate stage 30 by the transport device. After driving the substrate stage 30 to align the substrate 36, the pattern of the mask 23 is transferred. When the desired pattern is formed on the substrate 36, the exposure process ends. The substrate 36 after the exposure process is moved to the substrate transfer position by the substrate stage 30 (step S1). When the substrate 36 has moved to the transfer position, in order to unload the substrate 36, the substrate 36 is lifted by the substrate elevating member 37 and the blow from the blow holes 39 for substrate transfer (step S2).

[0035] When the substrate 36 is separated from the substrate mounting surface of the substrate chuck 35 (at the time of separation), charge separation occurs on the substrate 36. Therefore, simultaneously with the lifting of the substrate 36 by the substrate elevating member 37 and the blow from the blow holes 39, an air wall is generated by blowing air from the shielding blow holes 38 provided on the substrate chuck 35 as in Example 1 or from the shielding blow holes 81 provided so as to surround the outer shape of the substrate chuck 35 as in Example 2. Note that the shielding member 82 in Example 3 serves as a wall that performs the same role as the wall formed by blowing air (step S3).

[0036] Simultaneously with the air blow from the shielding blow holes 81 in step S5, soft X-rays 61 are emitted from the soft X-ray ionizer 60. The soft X-rays 61 emitted from the soft X-ray ionizer 60 are irradiated along the mounting surface of the substrate 36 to the space formed between the substrate 36 and the substrate chuck 35. Also, air is blown from the air blowing unit 70 (step S4).

[0037] When the soft X-ray 61 is irradiated, the air in the space formed between the substrate 36 and the substrate chuck 35 is ionized, and the static electricity charged on the substrate 36 is discharged and disappears. Further, due to the blowing of air from the blower unit 70, the ion gas generated along with the irradiation of the soft X-ray ionizer 60 moves, and the ion gas spreads in the space formed between the substrate 36 and the substrate chuck 35. In addition, the air blown from the shielding blow hole 38 or the shielding blow hole 81, or the shielding member 82 serves as a wall, and the outflow of the ion gas to the outside of the space between the substrate 36 and the substrate chuck 35 can be suppressed. Thereby, the ion gas is supplied to the static elimination target portion in the space between the substrate 36 and the substrate chuck 35, and it is possible to suppress the ion gas from coming into contact with the non-static elimination target portion outside the space between the substrate 36 and the substrate chuck 35.

[0038] When the static electricity charged on the substrate 36 is discharged, the substrate 36 is unloaded from the substrate stage 30. Further, the irradiation of the soft X-ray 61 from the soft X-ray ionizer 60, the blowing of air from the blower unit 70, and the air blowing from the shielding blow hole 38 or the shielding blow hole 81 are stopped. Here, the determination of the completion of the static elimination of the charged substrate 36 may be managed by time based on the relationship between various conditions acquired in advance and the time required for static elimination. The various conditions acquired in advance may include at least any one of the humidity, temperature in the exposure space, the shielding blow hole 38, the shielding blow hole 81, the flow rate from the blower unit 70, the gas type, the irradiation X-ray intensity, the exposure processing conditions, and the like.

[0039] [Embodiment related to an article manufacturing method] A method for manufacturing a device as an article (such as a semiconductor integrated circuit element, a liquid crystal display element, a sensor, an optical element, etc.) includes a step of exposing a photosensitive material applied on a substrate (wafer, glass plate, film-like substrate) by the above-described exposure apparatus to form a latent image pattern (exposure step). Further, the manufacturing method includes a step of developing the substrate on which the latent image pattern is formed (development step). Further, the manufacturing method may include other well-known steps (oxidation, film formation, vapor deposition, doping, planarization, etching, resist stripping, dicing, bonding, packaging, etc.). The manufacturing method of the article of the present embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article as compared with the conventional method.

[0040] As described above, the preferred embodiments of the present invention have been described. However, the present invention is not limited to these embodiments, and various modifications and changes are possible within the scope of the gist thereof.

[0041] The disclosure of the present embodiment includes the following configurations. (Configuration 1) A chuck having a mounting surface for mounting a substrate, A substrate lifting member for lifting the substrate mounted on the mounting surface of the chuck from the mounting surface, An irradiation unit disposed outside the chuck in a first plane parallel to the mounting surface, and irradiating X-rays toward the space between the substrate lifted from the mounting surface by the substrate lifting member and the mounting surface, A blowing unit disposed outside the chuck in the first plane, and blowing air toward the space between the substrate lifted from the mounting surface by the substrate lifting member and the mounting surface, A stage device including a shielding mechanism disposed along at least a part of the outer shape of the mounting surface in the first plane, and regulating the direction of the flow of the gas blown from the blowing unit. (Configuration 2) The shielding mechanism is provided along the outer shape of the chuck in the first plane, and is composed of a first blow hole that opens in a direction perpendicular to the first plane, and a control unit that controls blowing of gas from the first blow hole. The stage device according to Configuration 1 is characterized by this. (Configuration 3) The first blow hole is provided on the mounting surface of the chuck. The stage device according to Configuration 2 is characterized by this. (Configuration 4) The shielding mechanism has a shielding blow member provided so as to surround the outer shape of the chuck in the first plane. The first blow hole is provided in the shielding blow member. The stage device according to Configuration 2 is characterized by this. (Configuration 5) The chuck is provided with a second blow hole for air blowing that flows when the substrate is separated from the mounting surface on the mounting surface. The first blow hole is arranged on the outer peripheral side of the chuck rather than the second blow hole in the first plane. The stage device according to Configuration 3 is characterized by this. (Configuration 6) The chuck is provided with a second blow hole for air blowing that flows when the substrate is separated from the mounting surface on the mounting surface. The flow velocity flowing from the first blow hole is greater than the flow velocity flowing from the second blow hole. The stage device according to Configuration 2 is characterized by this. (Configuration 7) The shielding mechanism is composed of a plate-like member provided so as to surround the outer shape of the chuck in the first plane. The stage device according to Configuration 1 is characterized by this. (Configuration 8) The plate-like member is composed of a material containing stainless steel or lead. The stage device according to Configuration 7 is characterized by this. (Configuration 9) The cross-sectional shape of the first blow hole is circular, elliptical, or slit-shaped. The stage device according to any one of Configurations 2 to 6 is characterized by this. (Configuration 10) In the first plane, the air blowing unit is disposed outside the placement surface, The substrate lifting member is configured such that the longitudinal direction is the direction in which the air blowing unit and the placement surface are aligned. The stage device according to Configuration 1. (Configuration 11) In the first plane, the air blowing unit is disposed outside the chuck, In the first plane, an exhaust unit is disposed outside the chuck on the side opposite to the air blowing unit, and the stage device according to Configuration 1, which exhausts the gas between the chuck and the substrate. (Configuration 12) An exposure apparatus for transferring a pattern of a master plate onto a substrate, An exposure apparatus comprising the stage device according to any one of Configurations 1 to 11. (Configuration 13) An exposure step of exposing a substrate by the exposure apparatus according to Configuration 12, A developing step of developing the exposed substrate, A method for manufacturing an article, characterized by including the above steps.

Explanation of Reference Numerals

[0042] 35 Substrate chuck 36 Substrate 37 Substrate lifting member 60 Soft X-ray ionizer 70 Air blowing unit

Claims

1. A chuck having a mounting surface for mounting a substrate, A substrate lifting member for lifting the substrate mounted on the mounting surface of the chuck from the mounting surface, An irradiation unit disposed outside the chuck in a first plane parallel to the mounting surface, and irradiating X-rays toward the space between the substrate lifted from the mounting surface by the substrate lifting member and the mounting surface, A blowing unit disposed outside the chuck in the first plane, and blowing air toward the space between the substrate lifted from the mounting surface by the substrate lifting member and the mounting surface, A stage device including a shielding mechanism disposed along at least a part of the outer shape of the mounting surface in the first plane, and regulating the direction of the flow of the gas blown from the blowing unit.

2. The stage device according to claim 1, wherein the shielding mechanism includes a first blow hole provided along the outer shape of the chuck in the first plane and opening in a direction perpendicular to the first plane, and a control unit for controlling to blow gas from the first blow hole.

3. The stage device according to claim 2, wherein the first blow hole is provided on the mounting surface of the chuck.

4. The shielding mechanism has a shielding blow member provided so as to surround the outer shape of the chuck in the first plane, The stage device according to claim 2, wherein the first blow hole is provided in the shielding blow member.

5. The chuck is provided with a second blow hole on the mounting surface for air blowing when the substrate is separated from the mounting surface, The stage device according to claim 3, wherein the first blow hole is disposed on the outer peripheral side of the chuck with respect to the second blow hole in the first plane.

6. The chuck has a second blow hole for air blow when separated from the placement surface of the substrate on the placement surface. The stage device according to claim 2, wherein the flow velocity flowing from the first blow hole is greater than the flow velocity flowing from the second blow hole.

7. The stage device according to claim 1, wherein the shielding mechanism is constituted by a plate-like member provided so as to surround the outer shape of the chuck in the first plane.

8. The stage device according to claim 7, wherein the plate-like member is made of a material containing stainless steel or lead.

9. The stage device according to claim 2, wherein the cross-sectional shape of the first blow hole is circular, elliptical, or slit-shaped.

10. The air blowing unit is disposed outside the placement surface in the first plane. The stage device according to claim 1, wherein the substrate lifting member is configured such that the direction in which the air blowing unit and the placement surface are aligned is the longitudinal direction.

11. The air blowing unit is disposed outside the chuck in the first plane. The stage device according to claim 1, which has an exhaust unit disposed outside the chuck on the side opposite to the air blowing unit in the first plane and exhausting the gas between the chuck and the substrate.

12. An exposure device for transferring an original pattern onto a substrate. An exposure device comprising the stage device according to any one of claims 1 to 11.

13. An exposure step of exposing a substrate with the exposure device according to claim 12, A developing step of developing the exposed substrate, A method for manufacturing an article, characterized by including the above.

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