Inertia sensor and manufacturing method thereof

Abstract

To suppress a decrease in a Q value of a vibrator by suppressing dissipation of vibration energy from a junction between the vibrator and packaging structure in an inertia sensor.SOLUTION: In an inertia sensor, a vibrator 2 having a rim 211 vibrating in a resonance mode by electrostatic force from one portion of electrodes is joined to a mounting board having the multiple electrodes 51 that are disposed separately mutually. The inertia sensor further has a connection section 6 disposed between a mount section 22 joined to the mounting board in the vibrator 2, and the mounting board 3. The connection section 6 has multiple straight sections 61. A connection center between the vibrator 2 and the mounting board is set as a mounting center C, and a radial direction with a virtual straight line along a thickness direction of the mounting board passing through the mounting center C as an axis is set as a board radial direction D1. A direction that is along a board radial direction D1 and passes through a position of a node of vibration in the rim 211 vibrating in a resonance mode of n=k (k: an integer of 2 or larger) is set as a node direction D3. In this case, the multiple straight sections 61 are linear along the node direction D3.SELECTED DRAWING: Figure 7

Description

Technical Field

[0001] The present disclosure relates to an inertial sensor and a method for manufacturing the same.

Background Art

[0002] In recent years, the development of vehicle automatic driving systems has been underway, and in this type of system, a highly accurate self-position estimation technology is required. For example, for so-called Level 3 automatic driving, the development of a self-position estimation system equipped with GNSS and IMU is in progress. GNSS is an abbreviation for Global Navigation Satellite System. IMU is an abbreviation for Inertial Measurement Unit, and is, for example, a six-axis inertial force sensor composed of a three-axis gyro sensor and a three-axis acceleration sensor. In the future, in order to realize so-called Level 4 or higher automatic driving, an IMU with even higher accuracy than the current level is required.

[0003] As a gyro sensor for realizing such a highly accurate IMU, BRG is regarded as promising, and a minute vibrator having a substantially hemispherical three-dimensional curved surface vibrating in a wine glass mode is mounted on a mounting substrate. BRG is an abbreviation for Bird-bath Resonator Gyroscope. Since the Q value representing the vibration state of this vibrator reaches 10 6 or more, higher accuracy than before is expected. Examples of the inertial sensor in which this type of vibrator is mounted on a mounting substrate include those described in Patent Document 1.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] The inertial sensor described in Patent Document 1 has a bottomed cylindrical mounting portion extending from the apex of a substantially hemispherical curved surface portion of the vibrator toward the center of the substantially hemispherical shape, which is joined to the mounting substrate. The curved surface portion is in a hollow state and vibrates in a wine glass mode. As a result of intensive studies by the present inventors, it has been newly found that in an inertial sensor having a structure in which the entire bottom surface of the bottomed cylindrical mounting portion of the vibrator is joined to the mounting substrate, when the vibrator is vibrated in a resonance mode, a part of the vibration energy dissipates from this joint portion to the mounting substrate. When such dissipation of vibration energy occurs, the Q value of the vibrator decreases.

[0006] In view of the above points, an object of the present disclosure is to provide an inertial sensor and a method for manufacturing the same that suppress the dissipation of vibration energy from the joint portion between the vibrator and the mounting structure and suppress a decrease in the Q value of the vibrator.

Means for Solving the Problems

[0007] According to one aspect of the present disclosure, there is provided an inertial sensor including a mounting substrate (3) having a plurality of electrodes (51) arranged apart from each other, a hollow rim (211) that vibrates in a resonance mode by an electrostatic force from a part of the plurality of electrodes, a vibrator (2) having a mounting portion (22) connected to the mounting substrate, and a connection portion (6) disposed between the mounting surface (22b), which is the surface of the mounting portion facing the mounting substrate, and the mounting substrate. The plurality of electrodes are arranged so as to surround the rim in a ring shape at a distance from the rim. The center of the connection portion between the mounting surface and the mounting substrate is defined as the mounting center (C), the radial direction along a virtual straight line passing through the mounting center in the thickness direction of the mounting substrate is defined as the substrate radial direction (D1), and the direction along the substrate radial direction and passing through the position of the node of vibration among the rims vibrating in a resonance mode of n = k (k: an integer of 2 or more) is defined as the node direction (D3). The connection portion has a plurality of linear portions (61) linearly extending along the node direction.

[0008] As a result, there is provided an inertial sensor in which a vibrator is joined to a mounting substrate and a connecting portion is disposed between the mounting portion of the vibrator and the mounting substrate, the connecting portion having a plurality of straight portions along a nodal direction passing through a position of a node of vibration among rims vibrating in a resonance mode of n = k (k: an integer of 2 or more). In this inertial sensor, since the mounting portion of the vibrator is fixed to the mounting substrate via the straight portions of the connecting portion, dissipation of the vibration energy of the rim from a position of an antinode of vibration among the rims vibrating in the resonance mode to the mounting substrate is suppressed.

[0009] According to another aspect of the present disclosure, there is provided a method of manufacturing an inertial sensor, including: preparing a mounting substrate (3) having a plurality of electrodes (51) disposed apart from each other, and a vibrator (2) having a hollow rim (211) vibrating in a resonance mode by an electrostatic force from a part of the plurality of electrodes and a mounting portion (22) connected to the mounting substrate; disposing the vibrator on the mounting substrate with a mounting surface (22b) of the mounting portion facing the mounting substrate, and joining the vibrator and the mounting substrate by irradiating light onto the mounting surface from the side of the mounting substrate; and setting a center of a connection portion between the mounting surface and the mounting substrate as a mounting center (C), setting a radial direction with respect to a virtual straight line along a thickness direction of the mounting substrate passing through the mounting center as a substrate radial direction (D1), and joining the vibrator and the mounting substrate in a direction along the substrate radial direction and in a nodal direction (D3) passing through a position of a node of vibration among rims vibrating in a resonance mode of n = k (k: an integer of 2 or more), wherein by the irradiation of light, a connecting portion (6) having a plurality of straight portions (61) linearly extending along the nodal direction is formed.

[0010] As a result, there is provided a method of manufacturing an inertial sensor in which a vibrator is mounted on a mounting substrate and these are joined, including forming a connecting portion having a plurality of straight portions along a nodal direction passing through a position of a node of vibration among rims vibrating in a resonance mode of n = k (k: an integer of 2 or more).

[0011] Note that the reference numerals in parentheses attached to each component etc. indicate an example of a correspondence relationship between the component etc. and specific components etc. described in the embodiments described later.

Brief Description of the Drawings

[0012]

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Modes for Carrying Out the Invention

[0013] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. In each of the following embodiments, parts that are identical or equivalent to each other will be described with the same reference numerals.

[0014] (First Embodiment) The inertial sensor 1 of the first embodiment will be described with reference to the drawings.

[0015] Hereinafter, for convenience of explanation, as shown in FIG. 1, one direction in the plane formed by the mounting substrate 3 to be described later is referred to as the "x direction", the direction orthogonal to the x direction on the same plane is referred to as the "y direction", and the normal direction to the xy plane is referred to as the "z direction", respectively. The x, y, and z directions in the figures after FIG. 2 respectively correspond to the x, y, and z directions in FIG. 1. Also, in this specification, "up" means the direction along the z direction in the figure, meaning the arrow side, and "down" means the opposite side of up. Further, in this specification, the state of viewing the inertial sensor 1, the vibrator 2 to be described later, or the mounting substrate 3 from the upper side in the z direction may be referred to as "top view".

[0016] Also, in FIGS. 4, 6, 8, and 9, in a top view, the outline of the rim 211 of the vibrator 2 in a state where it is not vibrating is shown by a solid line, and the outline of the rim 211 in a vibration mode state is shown by a two-dot chain line. In FIG. 7, a part of the outline of the vibrator 2 is shown by a two-dot chain line, and the outline of a connection part 6 described later located directly below the mounting part 22 of the vibrator 2 in a top view is shown by a solid line.

[0017] 〔Basic Configuration〕 The inertial sensor 1 of this embodiment includes, for example, as shown in FIG. 1, a vibrator 2 and a mounting substrate 3. The inertial sensor 1 can detect the angular velocity and the rotated angle applied to the inertial sensor 1 based on the change in capacitance between the rim 211 of the thin-walled vibrator 2 that can vibrate in the first driving mode and the second driving mode described later and a plurality of first electrode portions 51 on the mounting substrate 3. In this specification, a case where the inertial sensor 1 is configured as a gyro sensor that outputs a signal corresponding to the applied angular velocity will be described as a representative example.

[0018] The vibrator 2 is, for example, as shown in FIG. 2, a three-dimensional micro-vibrator having a substantially symmetric structure including a curved surface portion 21 including an outer shape of a substantially hemispherical three-dimensional curved surface, and a mounting portion 22 extending from the vertex side of the virtual hemisphere formed by the curved surface portion 21 toward the center side of the hemisphere. The vibrator 2, for example, has a bowl-shaped three-dimensional curved surface for the curved surface portion 21, and the Q value of its vibration is 10 5 or more.

[0019] The vibrator 2 is composed of a base having, for example, a curved surface portion 21 and a mounting portion 22, which is made of a reflow material such as glass containing additives such as quartz glass and borosilicate glass, metallic glass, silicon, or the like. Note that the base of the vibrator 2 may be made of a reflow material that can form the curved surface portion 21 and the mounting portion 22 having a three-dimensional curved surface shape and can vibrate in the resonance mode of n = k (k: an integer of 2 or more) described later, and is not limited to the above material examples. The vibrator 2 is, for example, a thin member on the order of micrometers such that the thicknesses of the curved surface portion 21 and the mounting portion 22 are 10 μm to 100 μm. The vibrator 2 has, for example, a milli-sized bird bath shape in which the dimension in the height direction is 2.5 mm with the direction along the thickness direction of the mounting substrate 3 as the height direction, and the outer diameter on the surface 2a side of the rim 211 described later is 5 mm.

[0020] The vibrator 2 is manufactured, for example, by the following manufacturing process. First, a quartz plate with a thickness of 100 μm or less is set in a mold (not shown) having recesses and support portions that support a part of the quartz plate at the centers of the recesses when the quartz plate is softened by heating, and while softening a part of the quartz plate by a heating means such as a flame, the inside of the recess is evacuated. For example, by this process, the portion deformed toward the recess becomes the curved surface portion 21, and the portion of the quartz plate supported by the support portions of the mold (not shown) becomes the mounting portion 22 having a bottomed cylindrical recessed shape. Note that the portion protruding outward from the recess remains unprocessed, but the base of the vibrator 2 is formed by removing it by an arbitrary method such as laser processing or polishing. Then, for example, the vibrator 2 can be manufactured by forming a surface electrode 23 on the base formed in the above process by an arbitrary film forming method. The vibrator 2 is manufactured, for example, by the above manufacturing process, but is not limited to this manufacturing method example, and other known methods may be adopted.

[0021] Taking the end of the curved surface portion 21 opposite to the mounting portion 22 as the rim 211, the rim 211 is, for example, substantially cylindrical. Note that the substantially cylindrical shape includes not only a cylindrical shape with the same diameter from the upper end to the lower end of the outer surface and the inner surface of the rim 211, but also a cylindrical shape with a varying diameter from the upper end to the lower end. In other words, the curved surface portion 21 has a configuration having a rim 211 that is an annular curved surface shape. The vibrator 2 has the surface 2a as the surface with the larger outer diameter and the opposite surface as the back surface 2b. When mounted on the mounting substrate 3, the rim 211 faces the plurality of first electrode portions 51 on the surface 2a side with a distance therebetween. The vibrator 2 is mounted such that the intervals between the rim 211 and the plurality of first electrode portions 51 are equal. The vibrator 2 is a portion in a hollow state where the curved surface portion 21 including the rim 211 does not contact other members when mounted on the mounting substrate 3. The vibrator 2 has a structure in which the hollow rim 211 can vibrate in the resonance mode of n = k when mounted on the mounting substrate 3 and can also be referred to as a resonator.

[0022] For example, as shown in FIG. 3, the rim 211 generates a first driving mode in the vibration direction indicated by the solid arrow and a second driving mode in the vibration direction indicated by the dashed arrow in a top view when n = 2 due to the electrostatic force from the driving electrode among the plurality of first electrode portions 51. In the case of the resonance mode of n = 2, two second driving modes equal in number to the first driving mode are generated, and they are generated in a direction inclined 45° with respect to the direction of the first driving mode. The first driving mode and the second driving mode have different mode frequencies. In a gyro sensor, for the purpose of improving accuracy, mode matching control is performed to make the difference in mode frequencies zero by adjusting the electrostatic force of the driving electrode. At this time, for example, as shown in FIG. 4, in a top view, a standing wave vibration pattern in which the outer contour of the rim 211 is displaced in a substantially sinusoidal wave shape is generated, and four antinode and node portions are generated in the vibration amplitude thereof.

[0023] Also, in the case of the resonance mode with n = 3, as shown in FIG. 5 for example, the second driving mode in the vibration direction indicated by the dashed arrow occurs in a direction inclined by 30° with respect to the direction of the first driving mode in the vibration direction indicated by the solid arrow. Further, in the resonance mode with n = 3, three first driving modes and three second driving modes occur respectively. And in the state of mode matching in the resonance mode with n = 3, as shown in FIG. 6 for example, in a top view, a standing wave vibration pattern in which the outer contour of the rim 211 is displaced in a substantially sinusoidal shape occurs. In the case of the resonance mode with n = 3, six antinode and node portions occur in the vibration amplitude of the standing wave vibration pattern of the rim 211. The rim 211 may be in a higher-order resonance mode with n = 4 or more. In the case of the resonance mode with n = k (k: an integer of 2 or more), the second driving mode occurs in a direction inclined by (180 / k)° with respect to the direction of the first driving mode, and the number of antinodes and nodes in the standing wave vibration pattern of the rim 211 becomes 2k respectively.

[0024] Hereinafter, for convenience of explanation, as shown in FIGS. 4 and 6, the node portion of the standing wave vibration pattern generated when the rim 211 is vibrated in the resonance mode with n = k is referred to as "node 211S". The connection portion 6 described later is configured to correspond to the number and direction of the nodes 211S in the resonance mode of the rim 211 described above.

[0025] The mounting portion 22 is a mounting site mounted on the mounting substrate 3 via the connection portion 6 described later. For example, it is a bottomed cylindrical recess, but is not limited thereto and may be substantially columnar. When the mounting portion 22 is a bottomed cylindrical recess, the recess bottom surface 22a on the surface 2a side can be used as an adsorption surface used for adsorption and transfer when mounting the vibrator 2 on the mounting substrate 3. The surface on the side opposite to the recess bottom surface 22a of the mounting portion 22, that is, the surface on the back surface 2b side, is the mounting surface 22b facing the mounting substrate 3.

[0026] The surface electrode 23 is composed of, for example, but not limited to, a laminated film of an adhesion layer formed of chromium or titanium from the base side and a conductive layer formed of an arbitrary conductive material such as gold or platinum. The surface electrode 23 is formed on the front surface 2a and the back surface 2b of the oscillator 2 by an arbitrary film formation method such as sputtering, vapor deposition, CVD, or ALD. CVD is an abbreviation for Chemical Vapor Deposition. ALD is an abbreviation for Atomic Layer Deposition. The surface electrode 23 is formed, for example, on at least the mounting surface 22b and the surface 2a of the rim 211, and these parts are electrically connected. The surface electrode 23 may be a solid shape covering the entire front and back surfaces of the oscillator 2, or may be patterned by a photolithography etching method or the like and be a pattern shape covering a part of the front and back surfaces. The oscillator 2 is, for example, electrically connected to the mounting substrate 3 at the part covering the mounting surface 22b of the mounting portion 22 of the surface electrode 23.

[0027] The mounting substrate 3 includes, for example, as shown in FIG. 1, a lower substrate 4 and an upper substrate 5, and these are joined together. For example, the mounting substrate 3 is obtained by performing etching and wiring film formation on a lower substrate 4 made of an insulating material of borosilicate glass, and then anodically bonding an upper substrate 5 made of a semiconductor material of silicon to the lower substrate 4 and performing patterning. The mounting substrate 3 has, for example, a plurality of first electrode portions 51 and second electrode portions 52 formed by performing dry etching such as DRIE on the upper substrate 5 anodically bonded to the lower substrate 4. DRIE is an abbreviation for Deep Reactive Ion Etching. Also, the mounting substrate 3 has, for example, an annular groove 41 formed on the lower substrate 4 side that surrounds the region to which the mounting portion 22 of the oscillator 2 is connected. The lower substrate 4 is made of at least a light-transmissive material that transmits ultraviolet light or light in other wavelength regions in order to enable the formation of a connection portion 6 described later.

[0028] The groove 41 is, for example, an annular groove formed in the inner region of the plurality of first electrode portions 51 as shown in FIG. 2, and is formed by wet etching. The groove 41 has dimensions corresponding to the outer diameter of the rim 211 of the vibrator 2, and is provided so that the rim 211 does not contact the mounting substrate 3 when the vibrator 2 is mounted on the mounting substrate 3.

[0029] The plurality of first electrode portions 51 are, for example, arranged at equal intervals and separated from each other so as to draw one ring on the xy plane while surrounding the rim 211 of the vibrator 2 as shown in FIG. 1, and electrode films (not shown) are formed on their respective upper surfaces. The plurality of first electrode portions 51 are, for example, connected to a wire (not shown) to an electrode film (not shown), and can be electrically connected to an external circuit board or the like, so that their potentials can be controlled. When the vibrator 2 is mounted, all of the plurality of first electrode portions 51 are in a state of being separated from the rim 211 of the vibrator 2 by a predetermined distance, and each forms a capacitor with the vibrator 2, and it is possible to detect the capacitance between the vibrator 2 and the first electrode portions 51. A part of the plurality of first electrode portions 51 serves as a detection electrode for detecting capacitance, and another part serves as a drive electrode for applying an electrostatic force to the rim 211 of the vibrator 2.

[0030] The second electrode portion 52 is, for example, in a frame shape surrounding the plurality of first electrode portions 51 in a top view, and an electrode film (not shown) is formed on the upper surface, and a wire (not shown) is connected to the electrode film (not shown). The second electrode portion 52 may be connected to the surface electrode 23 of the vibrator 2 by wiring or the like (not shown), and may have a configuration capable of applying a voltage, and may have a shape other than the frame shape, or a plurality of them may be arranged, and its shape, arrangement, etc. can be appropriately changed.

[0031] Note that the mounting substrate 3 is connected to the surface electrode 23 of the vibrator 2, for example, and includes wiring (not shown) on the lower substrate 4 that is electrically independent of the plurality of first electrode portions 51. A plurality of wirings (not shown) are provided, for example, and while straddling the groove 41 in the lower substrate 4, the other ends are connected to the second electrode portions 52 respectively directly below the connection portion 6, and these are electrically connected. Thereby, the mounting substrate 3 can apply a voltage to the surface electrode 23 of the vibrator 2 via the second electrode portion 52 and the wiring (not shown).

[0032] The connection portion 6 is disposed between the mounting portion 22 of the vibrator 2 and the mounting substrate 3, and is a member that connects a part of the mounting portion 22 and the mounting substrate 3. The connection portion 6 has, for example, a plurality of linear portions 61 extending linearly along a predetermined direction in a top view as shown in FIG. 7, and has an integrated configuration. The connection portion 6 is, for example, a joint portion where the vibrator 2 and the mounting substrate 3 are directly joined, or a portion made of another material independent of the vibrator 2 and the mounting substrate 3. In the latter case, the connection portion 6 is composed of, for example, a main portion made of an arbitrary joining material such as an ultraviolet curable resin material, a thermosetting resin material, or a die attach film. The connection portion 6 has, for example, a conductive path (not shown) made of a conductive material formed on the surface or inside or both, and is configured such that the mounting substrate 3 and the surface electrode 23 of the vibrator 2 are electrically connected by the conductive path.

[0033] Hereinafter, for convenience of explanation, as shown in FIG. 7, in a top view, a point located at the center of the joint portion of the mounting substrate 3 with the mounting surface 22b of the vibrator 2 is referred to as the "mounting center C". Also, on the xy plane, the radial direction with respect to the virtual straight line passing through the mounting center C and along the thickness direction of the mounting substrate 3 as the axis is referred to as the "substrate radial direction D1", and the circumferential direction with respect to the virtual straight line as the axis is referred to as the "substrate circumferential direction D2". Note that in FIG. 7, only one representative example of the substrate radial direction D1 is shown for easy viewing, but each direction from 0° to 360° radially spreading around the mounting center C in the xy plane is the substrate radial direction D1.

[0034] The plurality of straight portions 61 are each linearly extended along a different substrate diameter direction D1 starting from the mounting center C, and are evenly arranged such that the angle formed by two adjacent straight portions 61 is substantially the same. Specifically, the plurality of straight portions 61 are arranged along the nodal direction D3 corresponding to the position of the vibration node 211S when the rim 211 of the vibrator 2 vibrates in the resonance mode of n = k.

[0035] The nodal direction D3 is, for example, as shown in FIGS. 8 and 9, when the rim 211 of the vibrator 2 vibrates in the resonance mode of n = k, the direction of the substrate diameter direction D1 passing through the vibration node 211S as the node 211S. The nodal direction D3 changes in its direction and number according to the resonance mode of the rim 211. In the example of n = 2 shown in FIG. 8, it is four directions evenly arranged at 90° intervals along the substrate circumferential direction D2 in the substrate diameter direction D1. For example, assuming that the right direction on the plane of the paper in FIGS. 8 and 9 is 0°, the upward direction is 90°, the left direction is 180°, and the downward direction is 270° counterclockwise, and drive electrodes or detection electrodes are arranged in these azimuths. At this time, in the case of the resonance mode of n = 2, the nodal direction D3 is the directions of 45°, 135°, 225°, and 315° as shown in FIG. 8. Further, the nodal direction D3 is, for example, in the case of the resonance mode of n = 3 shown in FIG. 9, six directions evenly arranged at 60° intervals along the substrate circumferential direction D2 in the substrate diameter direction D1, that is, the directions of 30°, 90°, 150°, 210°, 270°, and 330°. That is, the nodal direction D3 is the same number as the number 2k of the nodes 211S of the rim 211 generated in the resonance mode of n = k, and is 2k directions evenly arranged at (180 / k)° intervals along the substrate circumferential direction D2. Note that the nodal direction D3 changes in its number and direction depending on the resonance mode of the vibrator 2, the arrangement of the first electrode portion 51, the number, and the assignment of the drive electrodes and detection electrodes. Therefore, the connecting portion 6 determines the number and orientation of the plurality of straight portions 61 according to the number and direction of the nodal direction D3 generated according to the operation mode of the pre-designed inertial sensor 1, that is, the resonance mode of the vibrator 2 and the arrangement of the first electrode portion 51, etc.

[0036] The above is the basic configuration of the inertial sensor 1 of this embodiment. In FIG. 1 and the like, the case where the mounting substrate 3 has 16 first electrode portions 51 is shown as a representative example, but the present invention is not limited thereto, and the number and arrangement of the first electrode portions 51 can be appropriately changed.

[0037] 〔Effect of the connection part〕 Next, the effect of the connection part 6 will be described in comparison with an inertial sensor 100 of a comparative example in which the entire mounting surface 22b of the vibrator 2 shown in FIG. 10 is bonded and fixed to the mounting substrate 3.

[0038] In the inertial sensor 100 of the comparative example, as shown in FIG. 10, the entire mounting surface 22b of the vibrator 2 is bonded and fixed to the mounting substrate 3 by an arbitrary bonding material 110 made of, for example, gold-tin. In the inertial sensors 1 and 100, when vibrating in a resonance mode such as n = 2, for example, in order to achieve higher precision, it is preferable that the Q value of the vibrator 2 in this resonance mode is high.

[0039] Here, the Q value is obtained as the sum of Q determined by the thermal physical properties of the material and Q anchor determined by the dissipation of vibration from the fixed portion of the vibrator 2 to the mounting substrate 3. Q TED The TED in Q is an abbreviation of thermoelastic dissipation, and Q TED is the Q value caused by thermoelastic loss, that is, energy loss. Q anchor increases as the dissipation of vibration energy due to the transmission of vibration from the fixed portion of the vibrator 2 to the mounting substrate 3, that is, the anchor loss decreases. That is, the Q value is determined by Q depending on the constituent material of the vibrator 2 TED and Q anchor depending on the state of bonding and fixing between the vibrator 2 and the mounting substrate 3. TED The above is the basic configuration of the inertial sensor 1 of this embodiment. In FIG. 1 and the like, the case where the mounting substrate 3 has 16 first electrode portions 51 is shown as a representative example, but the present invention is not limited thereto, and the number and arrangement of the first electrode portions 51 can be appropriately changed.

[0040] When the inventors performed modal analysis on the inertial sensor 100 of the comparative example, as shown in FIGS. 11 and 12, it was found that the dissipation of vibration energy from the direction located at the antinode in the vibration amplitude of the rim 211 of the resonance mode was large among the fixed portions of the mounting surface 22b. On the other hand, with respect to the direction located at the node in the vibration amplitude of the rim 211 of the resonance mode among the fixed portions of the mounting surface 22b, the dissipation of vibration energy was smaller compared to the portion located at the antinode. Further, in the inertial sensor 100 of the comparative example, the dissipation of vibration energy was relatively small near the center of the joint among the fixed portions of the mounting surface 22b, and the dissipation of vibration energy was relatively large in the direction located at the antinode during the resonance mode of the rim 211 and at a position away from the center of the joint.

[0041] Note that the results shown in FIGS. 11 and 12 were obtained by vibrating the vibrator 2 of the inertial sensor 100 of the comparative example in the resonance mode of n = 2 and analyzing the resonance frequency obtained in this vibration state and the shape of the vibrator 2 at that time by a known vibration analysis technique. Further, in FIGS. 11 and 12, in order to make the dissipation of vibration energy easy to understand, the region where the degree of transmission of the vibration of the vibrator 2 is large is shown with hatching closer to black.

[0042] On the other hand, in the inertial sensor 1 of the present embodiment, a connecting portion 6 having a plurality of straight portions 61 is formed between the mounting surface 22b of the vibrator 2 and the mounting substrate 3, and the mounting surface 22b of the vibrator 2 is partially joined and fixed to the mounting substrate 3 via the connecting portion 6. In other words, the inertial sensor 1 has a structure in which the vibrator 2 and the mounting substrate 3 are joined by a plurality of straight portions 61 along the node direction D3 during the resonance mode of the vibrator 2, and the other portions of the mounting surface 22b are not fixed to the mounting substrate 3. For this reason, in the inertial sensor 1, the transmission of vibration to the mounting substrate 3 is suppressed from the direction located at the antinode of the vibration of the rim 211 in the resonance mode of the vibrator 2, and the dissipation of vibration energy due to anchor loss is reduced. Therefore, the inertial sensor 1 has a larger Q anchor value, and thus a larger Q value, and it is possible to detect the angular velocity with higher accuracy compared to the comparative example.

[0043] 〔Manufacturing method〕 Next, an example of the manufacturing process of the inertial sensor 1 of the present embodiment will be described. Since the forming processes of the vibrator 2 and the mounting substrate 3 have been described above, in this specification, the bonding process between the vibrator 2 and the mounting substrate 3 will be mainly described.

[0044] Prepare the vibrator 2 and the mounting substrate 3, convey the vibrator 2 using a conveying device (not shown), and place the mounting surface 22b on the mounting substrate 3. Then, as shown in FIG. 13 for example, irradiate the interface between the mounting surface 22b and the mounting substrate 3 with laser light from the mounting substrate 3 side, partially melt at least one of the lower substrate 4 and the mounting surface 22b, and re-solidify to bond the mounting surface 22b and the mounting substrate 3. The connection portion 6 is formed, for example, by the above-described process.

[0045] Regarding the plurality of straight portions 61 in the connection portion 6, for example, in a state where the vibrator 2 and the mounting substrate 3 are temporarily fixed, they can be actually resonated to confirm the nodal direction D3, and formed by a first method of irradiating laser light along the confirmed nodal direction D3. Also, a plurality of straight portions 61 corresponding to the resonance mode of n = k may be formed in advance, and a second method of aligning the nodal direction D3 with the extending direction of the straight portion 61 by controlling the voltage application from the drive electrode may be adopted. That is, when the vibrator 2 is driven in the resonance mode, it is only necessary that the extending direction of the straight portion 61 and the nodal direction D3 coincide with each other. A plurality of straight portions 61 may be formed in accordance with the nodal direction D3, or drive control may be performed to align the nodal direction D3 with the plurality of straight portions 61.

[0046] Also, as shown in FIG. 14 for example, the connection portion 6 may be formed by disposing a bonding material 60 made of an ultraviolet curable resin material on the mounting substrate 3 using a dispenser or the like, placing the vibrator 2 thereon, and then irradiating and curing the bonding material 60 from the mounting substrate 3 side. Further, a thermosetting resin material may be used as the bonding material 60, and the connection portion 6 may be formed by irradiating laser light from the mounting substrate 3 side to heat and cure the bonding material 60.

[0047] Further, the connection part 6 may use a die attach film as the bonding material 60, heat it to fix the vibrator 2 to the mounting substrate 3 over the entire area of the bonding material 60, and then irradiate the bonding material 60 with laser light from the mounting substrate 3 side to peel off unnecessary bonding portions from the vibrator 2 to form it. In this case, the laser light is irradiated onto portions other than the nodal direction D3 in the cured bonding material 60.

[0048] Through the above bonding process, the vibrator 2 is bonded to the mounting substrate 3, and the inertial sensor 1 of the present embodiment can be manufactured by forming the connection part 6 having a plurality of straight portions 61 and these being integrated in the vicinity of the mounting center C.

[0049] In FIG. 7, four straight portions 61 along the substrate radial direction D1 are arranged at 90° intervals, and a cross-shaped connection part 6 in which these are integrated is shown as a representative example. However, this connection part 6 corresponds to the case of n = 2 and is not limited to this representative example. For example, when the resonance mode of the vibrator 2 is n = 3, the connection part 6 has a configuration in which six straight portions 61 extending along the substrate radial direction D1 at 60° intervals around the mounting center C in a top view are integrated in the vicinity of the mounting center C. Thus, the shape of the connection part 6 is appropriately changed according to the resonance mode of the vibrator 2.

[0050] According to the present embodiment, the inertial sensor 1 has a structure in which a part of the mounting surface 22b of the vibrator 2 is bonded to the mounting substrate 3 via the connection part 6, and the connection part 6 has a plurality of straight portions 61 along the nodal direction D3. Therefore, when the vibrator 2 is driven in the resonance mode, vibration is not transmitted from the portion of the mounting surface 22b located in the antinode direction in the standing wave vibration pattern of the rim 211 to the mounting substrate 3, and anchor loss is suppressed. Thus, the inertial sensor 1 can improve the Q value of the vibrator 2 and further enhance the sensor accuracy as compared with the case where the entire area of the mounting surface 22b of the vibrator 2 is bonded and fixed to the mounting substrate 3.

[0051] (Second Embodiment) The inertial sensor 1 of the second embodiment will be described with reference to FIG. 15.

[0052] In FIG. 15, similar to FIG. 7, in order to make the connection portion 6 easier to see, the outer contour of the vibrator 2 is shown by a two-dot chain line, and the outer contour of the connection portion 6 is shown by a solid line.

[0053] The inertial sensor 1 of the present embodiment is different from the first embodiment in that, for example, as shown in FIG. 15, the connection portion 6 includes a connection central portion 62 that is wider than the plurality of straight portions 61. In the present embodiment, this difference will be mainly described.

[0054] In the present embodiment, the connection portion 6 has a plurality of straight portions 61 and a connection central portion 62 that connects the plurality of straight portions 61, and these are integrally formed. The plurality of straight portions 61 are formed only in the vicinity of the outer contour of the mounting surface 22b in the region directly below the mounting surface 22b. The connection central portion 62 is formed, for example, in a predetermined region including the mounting center C in a top view, and the entire region is wider than the plurality of straight portions 61. The width referred to here is the width in the substrate circumferential direction D2. The connection central portion 62 has, for example, a curved shape in which the portion connecting the adjacent straight portions 61 is recessed toward the mounting center C.

[0055] Also in the present embodiment, the inertial sensor 1 can obtain the same effects as those of the first embodiment. Further, since the connection portion 6 has the connection central portion 62 that is wider than the plurality of straight portions 61, the bonding area between the vibrator 2 and the mounting substrate 3 is increased, and the bonding reliability is improved.

[0056] (Third Embodiment) The inertial sensor 1 of the third embodiment will be described with reference to FIGS. 16 and 17.

[0057] In FIG. 16, similar to FIG. 15, the outer contour of the vibrator 2 is shown by a two-dot chain line, and the outer contours of the connection portion 6 and a shim 7 described later are shown by solid lines.

[0058] The inertial sensor 1 of the present embodiment is different from the first embodiment in that, for example, as shown in FIG. 16, it further has a shim 7 disposed between the connection portion 6 and the vibrator 2. In the present embodiment, this difference will be mainly described.

[0059] As shown in FIG. 17, for example, the shim 7 is a reinforcing member disposed between the vibrator 2 and the connection portion 6, and improves the bonding strength between the vibrator 2 and the mounting substrate 3. The shim 7 has, for example, a disk shape with a planar size substantially the same as that of the mounting surface 22b. The shim 7 is made of a material that can be joined to the lower substrate 4, such as borosilicate glass. The shim 7 is joined to the mounting surface 22b of the vibrator 2 and electrically connected to the surface electrode 23 by a bonding material (not shown) made of, for example, a thermosetting resin material or an ultraviolet curable resin material containing a filler of a conductive material. The shim 7 has a conductive film (not shown) formed on its surface, and is configured to be able to electrically connect the surface electrode 23 of the vibrator 2 and the mounting substrate 3.

[0060] The inertial sensor 1 of the present embodiment is manufactured by joining one of the mounting surface 22b of the vibrator 2 or the connection portion 6 and the shim 7 in advance, and then joining the other and the shim 7. The connection portion 6 is made of a resin material that melts and re-solidifies a part of the lower substrate 4 or cures by ultraviolet rays or heat, as in the first embodiment.

[0061] Also according to the present embodiment, the inertial sensor 1 can obtain the same effects as those of the first embodiment. Further, by having the shim 7 between the vibrator 2 and the connection portion 6, even when it is difficult for the vibrator 2 to ensure the bonding strength with the connection portion 6, the bonding strength with the connection portion 6 can be ensured by the shim 7 via the shim 7, and the effect of improving the bonding reliability can also be obtained.

[0062] In FIG. 16, as in the first embodiment, the case where the connection portion 6 has only a plurality of straight portions 61 is shown as a representative example. However, the inertial sensor 1 is not limited to this example, and the connection portion 6 may have the same configuration as that of the second embodiment.

[0063] (Fourth Embodiment) The inertial sensor 1 of the fourth embodiment will be described with reference to FIGS. 18 to 20.

[0064] In FIG. 18, similar to FIG. 15, the outline of the vibrator 2 is shown by a two-dot chain line, and the outline of the connection portion 6 is shown by a solid line.

[0065] The inertial sensor 1 of the present embodiment is different from the first embodiment in that, for example, as shown in FIGS. 18 and 19, a recess 42 is formed in the mounting substrate 3. In the present embodiment, this difference will be mainly described.

[0066] The mounting substrate 3 has, for example, in a top view, a region surrounded by a plurality of first electrode portions 51 as an inner region, and a recess 42 is formed in a portion located in a direction different from the nodal direction D3 in the inner region. In other words, the mounting substrate 3 has a recess 42 formed in a portion different from the portion where the connection portion 6 is formed in the inner region of the lower substrate 4.

[0067] A plurality of recesses 42 are formed, for example, in a portion located in a direction different from the nodal direction D3, and serve to suppress the dissipation of the vibration energy of the vibrator 2 in the resonance mode to the mounting substrate 3. That is, in the present embodiment, the inertial sensor 1 has the recess 42 formed in a portion located at the antinode of the standing wave vibration pattern of the rim 211, so that the portion that hinders the vibration of the vibrator 2 is reduced, and the dissipation of the vibration energy of the vibrator 2 is reduced. The recess 42 has, for example, an arbitrary shape such as a circular shape, an elliptical shape, or a polygonal shape in a top view, and its depth can be appropriately changed. Further, the outer shape, size, etc. of the recess 42 can be appropriately changed according to the shape of the connection portion 6.

[0068] Note that, for example, as shown in FIG. 20, a through hole 43 may be formed in the inertial sensor 1 instead of the recess 42. Even with such a configuration, the inertial sensor 1 can obtain the same effect as in the case of having the recess 42.

[0069] Also according to this embodiment, the inertial sensor 1 can achieve the same effects as those in the first embodiment. Further, since the inertial sensor 1 has the recess 42 or the through hole 43 in the inner region, there is no portion that inhibits the vibration of the vibrator 2 in the driving mode, and the vibration energy thereof can be dissipated to the mounting substrate 3, and thus the effect of further suppressing the decrease in the Q value can be obtained.

[0070] (Fifth Embodiment) The inertial sensor 1 according to the fifth embodiment will be described with reference to FIGS. 21 and 22.

[0071] In FIG. 22, the outer outlines of a part of a support column portion 8 and a connection portion 6, which are hidden and not visible in the mounting portion 22 of the vibrator 2 on the mounting substrate 3, are shown by broken lines, and a part of the outer outline of the mounting portion 22 that is not visible at the angle of FIG. 22 is shown by a one-dot chain line.

[0072] The inertial sensor 1 according to this embodiment is different from the first embodiment in that, as shown in FIG. 21 for example, it further has a support column portion 8 that partially covers the side surface 22c of the mounting portion 22 of the vibrator 2. In this embodiment, this difference will be mainly described.

[0073] The support column portion 8 is formed on the mounting substrate 3, for example, as shown in FIG. 21, and covers a part of the side surface 22c of the vibrator 2, and is a reinforcing member that improves the bonding strength between the vibrator 2 and the mounting substrate 3. The support column portion 8 is formed, for example, as a part of the upper substrate 5, and a plurality of support column portions 8 are formed together with the first electrode portion 51 and the second electrode portion 52 by etching such as DRIE, and are shaped along the side surface 22c of the mounting portion 22. When the vibrator 2 is driven in the resonance mode of n = 2, for example, the support column portion 8 is formed so as to cover the portions corresponding to the four node directions D3 in the side surface 22c, as shown in FIG. 22. Thereby, the support column portion 8 improves the bonding strength between the vibrator 2 and the mounting substrate 3 while suppressing the dissipation of the vibration energy of the vibrator 2.

[0074] Note that the number, arrangement, shape, etc. of the support columns 8 can be appropriately changed according to the resonance mode of the vibrator 2 and the shape of the side surface 22c. For example, a conductive film (not shown) may be formed on the surface of the support column 8 facing the vibrator 2, so that the vibrator 2 is supported more stably and an electrical connection is established between the surface electrode 23 of the vibrator 2 and the mounting substrate 3. Further, the support column 8 may have no conductive film and may only serve to support the vibrator 2 more stably. Further, for the vibrator 2, the portion of the side surface 22c corresponding to the position of the antinode during the resonance mode is exposed so that the vibration during driving is not unnecessarily transmitted to the mounting substrate 3.

[0075] Also according to the present embodiment, the inertial sensor 1 can achieve the same effects as those of the first embodiment. Further, since the inertial sensor 1 has the support columns 8 that cover the portions of the side surface 22c of the vibrator 2 located in the nodal direction D3, the joining strength between the vibrator 2 and the mounting substrate 3 can be further improved.

[0076] (Other Embodiments) Although the present disclosure has been described based on the embodiments, it should be understood that the present disclosure is not limited to these embodiments and structures. The present disclosure includes various modifications and modifications within the equivalent scope. In addition, various combinations and forms, and further other combinations and forms including only one element thereof, more, or less, fall within the scope and spirit of the present disclosure.

[0077] (1) In the above-described third embodiment, the inertial sensor 1 may have a configuration in which, for example, as shown in FIG. 23, the shim 7 has a plurality of support portions 71 that cover a portion of the side surface 22c located in the node direction D3. Note that the number, arrangement, shape, etc. of the support portions 71 can be appropriately changed according to the number and direction of the node directions D3 and the shape of the side surface 22c of the vibrator 2. In this case, the inertial sensor 1 has a structure in which the effects of the above-described third embodiment are further improved by the support portions 71. Thus, unless clearly incompatible, the inertial sensor 1 can have a structure in which some or all of the components of the above-described embodiments are freely combined. For example, the inertial sensor 1 may have a shape in which the connection portion 6 has a connection center portion 62 and may have a configuration including the concave portion 42, the through hole 43, the shim 7, and the support portion 8.

[0078] (2) In the above-described embodiments, as shown in FIG. 11, the case where a region with little dissipation of vibration energy along the node direction D3 occurs in the vibrator 2 has been described. However, when a region with relatively little dissipation of vibration energy occurs in a curved shape, the configuration of the connection portion 6 may be changed. For example, assuming that a region of the mounting surface 22b where the dissipation of vibration energy is relatively small is defined as a low-dissipation region, and the low-dissipation region occurs so as to connect the mounting center C and the node 211S in a curved shape in a top view. In such a case, the connection portion 6 may have a configuration including a plurality of curved portions along this curved low-dissipation region.

[0079] (3) It goes without saying that in the above-described embodiments, the components constituting the embodiments are not necessarily essential except in cases where it is clearly specified as essential or cases where it is considered clearly essential in principle. Also, in the above-described embodiments, when numerical values such as the number, numerical value, quantity, range, etc. of the components of the embodiments are mentioned, they are not limited to that specific number except in cases where it is clearly specified as essential or cases where it is clearly limited to a specific number in principle. Further, in the above-described embodiments, when referring to the shape, positional relationship, etc. of the components, etc., they are not limited to that shape, positional relationship, etc. except in cases where it is clearly specified or cases where it is clearly limited to a specific shape, positional relationship, etc. in principle.

[0080] (Aspects of the present disclosure) The above-described present disclosure can be understood, for example, from the following aspects.

[0081] [First aspect] An inertial sensor, a mounting substrate (3) having a plurality of electrodes (51) arranged apart from each other, a hollow rim (211) that vibrates in a resonance mode by an electrostatic force from a part of the plurality of electrodes, and a vibrator (2) having a mounting portion (22) connected to the mounting substrate, a connection portion (6) disposed between the mounting surface and the mounting substrate, with the surface of the mounting portion facing the mounting substrate being defined as a mounting surface (22b), the plurality of electrodes are arranged in a ring shape so as to surround the rim at a distance from the rim, with the center of the connection portion between the mounting surface and the mounting substrate being defined as a mounting center (C), the radial direction along a virtual straight line passing through the mounting center and along the thickness direction of the mounting substrate being defined as a substrate radial direction (D1), and the direction along the substrate radial direction and passing through the position of a node of vibration of the rim vibrating in a resonance mode of n = k (k: an integer of 2 or more) being defined as a node direction (D3), the connection portion has a plurality of linear portions (61) linearly extending along the node direction, the inertial sensor. [Second aspect] the connection portion has a connection central portion (62) connecting the plurality of linear portions in the vicinity of the mounting center, the inertial sensor according to the first aspect, wherein the connection central portion is curved such that the portion connecting two adjacent linear portions is recessed toward the mounting center. [Third aspect] the inertial sensor according to the first or second aspect, further comprising a shim (7) disposed between the mounting surface and the connection portion and joining the mounting surface and the connection portion. [Fourth aspect] The mounting substrate is within a region surrounded by the plurality of electrodes, and at least one recess (42) or through-hole (43) is formed at a position different from the connection portion, in the inertial sensor according to any one of the first to third aspects. [Fifth aspect] Regarding a side surface (22c) of the mounting portion that is adjacent to the mounting surface, the mounting substrate further has support portions (71, 8) that cover portions of the side surfaces that are located in the node direction, in the inertial sensor according to any one of the first to fourth aspects. [Sixth aspect] The plurality of straight portions are 2k in number, which is the same as the number of the node directions. Regarding the angle formed by two adjacent ones of the node directions among the node directions, it is 180° / k, in the inertial sensor according to any one of the eleventh to fifth aspects. [Seventh aspect] A method for manufacturing an inertial sensor, preparing a mounting substrate (3) having a plurality of electrodes (51) arranged apart from each other, and a vibrator (2) having a hollow rim (211) that vibrates in a resonance mode by an electrostatic force from a part of the plurality of electrodes and a mounting portion (22) connected to the mounting substrate; placing the vibrator on the mounting substrate with the mounting surface (22b) of the mounting portion facing the mounting substrate, and irradiating light from the side of the mounting substrate to the mounting surface to bond the vibrator and the mounting substrate, taking the center of the connection portion between the mounting surface and the mounting substrate as the mounting center (C), taking the radial direction with respect to an imaginary straight line along the thickness direction of the mounting substrate passing through the mounting center as the substrate radial direction (D1), and taking, as the node direction (D3), the direction along the substrate radial direction and passing through the position of the node of the rim that vibrates in a resonance mode of n = k (k: an integer of 2 or more), in bonding the vibrator and the mounting substrate, a connection portion (6) having a plurality of straight portions (61) linearly extending along the node direction is formed by the irradiation of the light, in the method for manufacturing an inertial sensor. [Eighth aspect] In joining the vibrator and the mounting substrate, the method for manufacturing an inertial sensor according to the seventh aspect, wherein laser light is used as the light, and a part of the mounting surface is melted and re-solidified to form the connection portion. [Ninth Aspect] In joining the vibrator and the mounting substrate, the method for manufacturing an inertial sensor according to the seventh aspect, wherein an ultraviolet curable resin material is disposed between the mounting surface and the mounting substrate, and light including ultraviolet light is used as the light to cure the ultraviolet curable resin material to form the connection portion. [Tenth Aspect] In joining the vibrator and the mounting substrate, the method for manufacturing an inertial sensor according to the seventh aspect, wherein a thermosetting resin material is disposed between the mounting surface and the mounting substrate, and the thermosetting resin material is heated and cured by irradiation with the light to form the connection portion. [Eleventh Aspect] In joining the vibrator and the mounting substrate, the method for manufacturing an inertial sensor according to the seventh aspect, wherein a thermosetting resin material is disposed between the mounting surface and the mounting substrate, the thermosetting resin material is heated and cured to join the mounting surface and the mounting substrate, and then laser light is used as the light to irradiate a part of the cured thermosetting resin material with the laser light, and the connection portion is formed by partially peeling the joining site.

Description of Reference Numerals

[0082] 2... Vibrator, 211... Rim, 22... Mounting portion, 22b... Mounting surface, 22c... Side surface, 3... Mounting substrate, 42... Recess, 43... Through hole, 51... Electrode, 6... Connection portion, 61... Straight portion, 62... Connection center portion, 7... Shim, 8... Support portion, C... Mounting center, D1... Substrate radial direction, D2... Node direction

Claims

1. An inertial sensor, comprising: A mounting substrate (3) having a plurality of electrodes (51) arranged apart from each other; A vibrator (2) having a hollow rim (211) that vibrates in a resonance mode by an electrostatic force from a part of the plurality of electrodes, and a mounting portion (22) connected to the mounting substrate; A connecting portion (6) disposed between the mounting surface and the mounting substrate, with the surface of the mounting portion facing the mounting substrate being defined as a mounting surface (22b); The plurality of electrodes are arranged to surround the rim at a distance from the rim so as to form a ring; Taking the center of the connection portion between the mounting surface and the mounting substrate as a mounting center (C), a radial direction along a virtual straight line passing through the mounting center and along the thickness direction of the mounting substrate is defined as a substrate radial direction (D1), and a direction along the substrate radial direction and passing through the position of a vibration node among the rims vibrating in a resonance mode with n = k (k: an integer of 2 or more) is defined as a node direction (D3); The connecting portion has a plurality of linear portions (61) linearly extending along the node direction, the inertial sensor.

2. The connecting portion has a connecting central portion (62) connecting the plurality of linear portions in the vicinity of the mounting center; The connecting central portion is in a curved shape in which a portion connecting two adjacent linear portions is recessed toward the mounting center, the inertial sensor according to claim 1.

3. Further comprising a shim (7) disposed between the mounting surface and the connecting portion and joined to the connecting portion, the inertial sensor according to claim 1 or 2.

4. The mounting substrate has at least one recess (42) or through hole (43) formed at a position different from the connecting portion within a region surrounded by the plurality of electrodes, the inertial sensor according to claim 1 or 2.

5. Taking the surface adjacent to the mounting surface among the mounting parts as a side surface (22c), the mounting substrate further has a support part (8) that covers a portion of the side surface located in the node direction. The inertial sensor according to claim 1 or 2.

6. The plurality of straight portions are 2k in number, which is the same as the number of the node directions, The angle formed by two adjacent ones of the node directions in the node direction is 180° / k. The inertial sensor according to claim 1 or 2.

7. A method for manufacturing an inertial sensor, Prepare a mounting substrate (3) having a plurality of electrodes (51) arranged apart from each other, and a vibrator (2) having a hollow rim (211) vibrating in a resonance mode by an electrostatic force from a part of the plurality of electrodes and a mounting part (22) connected to the mounting substrate. Place the vibrator on the mounting substrate with the mounting surface (22b) of the mounting part facing the mounting substrate, and irradiate the mounting surface with light from the side of the mounting substrate to join the vibrator and the mounting substrate. Taking the center of the connection part between the mounting surface and the mounting substrate as the mounting center (C), taking the radial direction with respect to the virtual straight line along the thickness direction of the mounting substrate passing through the mounting center as the substrate radial direction (D1), and taking the direction along the substrate radial direction and passing through the position of the node of the rim vibrating in the resonance mode where n = k (k: an integer of 2 or more) as the node direction (D3). In joining the vibrator and the mounting substrate, a connection part (6) having a plurality of straight portions (61) linearly extending along the node direction is formed by irradiating the light. A method for manufacturing an inertial sensor.

8. In joining the vibrator and the mounting substrate, laser light is used as the light, and the connection part is formed by melting and then re-solidifying at least a part of one of the mounting surface and the mounting substrate. The method for manufacturing an inertial sensor according to claim 7.

9. In joining the vibrator and the mounting substrate, an ultraviolet curable resin material is disposed between the mounting surface and the mounting substrate, and light including ultraviolet light is used as the light to cure the ultraviolet curable resin material, thereby forming the connection portion. The method for manufacturing an inertial sensor according to claim 7.

10. In joining the vibrator and the mounting substrate, a thermosetting resin material is disposed between the mounting surface and the mounting substrate, and the thermosetting resin material is heated and cured by irradiation with the light, thereby forming the connection portion. The method for manufacturing an inertial sensor according to claim 7.

11. In joining the vibrator and the mounting substrate, a thermosetting resin material is disposed between the mounting surface and the mounting substrate, and after the thermosetting resin material is heated and cured to join the mounting surface and the mounting substrate, laser light is used as the light, and the laser light is irradiated onto a part of the thermosetting resin material after curing to partially peel the joining portion, thereby forming the connection portion. The method for manufacturing an inertial sensor according to claim 7.

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