Semiconductor device

Abstract

To provide a semiconductor device that establishes compatibility between positioning of a semiconductor module and prevention of improper mounting of the semiconductor module.SOLUTION: A semiconductor device according to the present disclosure comprises a semiconductor module 2, and a base plate 4 for being loaded with the semiconductor module 2. The semiconductor module 2 has a linear protrusion 8 that is provided not to be point-symmetric with respect to the center of the semiconductor module 2, on at least one side. The base plate 4 has a recess 9 that is provided to correspond to the protrusion 8.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] The present disclosure relates to a semiconductor device, and more particularly to a semiconductor device for power.

Background Art

[0002] Generally, power semiconductor modules typified by IGBT (Insulated Gate Bipolar Transistor) modules, IPM (Intelligent Power Module), and T-PM (Transfer molded Power Module) are connected to a cooler via a base plate in order to dissipate heat generated by power loss. The connection between the power semiconductor module and the cooler is realized by fitting a convex portion (protrusion) provided on the power semiconductor module into a concave portion (a concave portion corresponding to the convex portion of the semiconductor module) provided on the cooler. By adopting such a configuration, the semiconductor module is positioned with respect to the cooler, so that horizontal displacement of the semiconductor module during assembly of the semiconductor module or during solder reflow can be prevented.

[0003] On the other hand, for semiconductor modules having the same outer shape but different types (functions), if the convex portions provided on the respective semiconductor modules are provided at the same position, it is possible to fit the convex portions into the concave portions (concave portions corresponding to the convex portions of the semiconductor modules) provided on the cooler, so it has been difficult to prevent mismounting of the semiconductor modules. Here, semiconductor modules having the same outer shape but different types (functions) refer to, for example, semiconductor modules having different rated currents, rated voltages, or circuit configurations.

[0004] Conventionally, a technique has been disclosed for preventing mismounting in a region other than the region where the semiconductor module is to be mounted by varying the distance between a pair of convex portions provided on the semiconductor module according to the size of the semiconductor module (see, for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0005] [Patent Document 1] International Publication No. 2018 / 131310 [Summary of the Invention] [Problems to be Solved by the Invention]

[0006] In Patent Document 1, the distance between the convex portions is varied according to the size of the semiconductor module. However, for semiconductor modules having the same outer shape but different types, the types cannot be identified, so there is a problem that semiconductor modules of a different type from the original may be mis-mounted. Further, in Patent Document 1, since a pair of convex portions are provided on the semiconductor module, there is a problem that the semiconductor module may be mis-mounted in the opposite direction (a direction 180 degrees different from the original direction).

[0007] The present disclosure has been made to solve such problems, and an object thereof is to provide a semiconductor device that achieves both positioning of a semiconductor module and prevention of mis-mounting of the semiconductor module. [Means for Solving the Problems]

[0008] In order to solve the above problems, a semiconductor device according to the present disclosure includes a semiconductor module and a base plate on which the semiconductor module is mounted. The semiconductor module has a linear convex portion provided on at least one side so as not to be point-symmetrical with respect to the center of the semiconductor module, and the base plate has a concave portion provided corresponding to the convex portion. [Effects of the Invention]

[0009] According to the present disclosure, it is possible to achieve both positioning of the semiconductor module and prevention of mis-mounting of the semiconductor module. [Brief Description of the Drawings]

[0010]

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Embodiments for Carrying Out the Invention

[0011] <Overall Configuration> FIG. 1 is a figure showing an example of the overall configuration of the semiconductor device according to Embodiments 1 to 8.

[0012] The semiconductor device includes at least the semiconductor module 2. Note that the semiconductor device may be configured to further include at least one of the bus bar 1, the water-cooling jacket 3, and the base plate 4 in addition to the semiconductor module 2.

[0013] In FIG. 1, six semiconductor modules 2 are mounted on the base plate 4, but the number of semiconductor modules 2 is not limited to this. The base plate 4 is provided on the water-cooling jacket 3. That is, the semiconductor module 2 is attached to the water-cooling jacket 3 via the base plate 4.

[0014] The semiconductor module 2 is provided with electrode terminals 5, and the electrode terminals 5 are connected to the bus bar 1.

[0015] FIG. 2 shows the back surface (the surface connected to the base plate 4) of the semiconductor module 2.

[0016] The electrode terminal 5 protrudes outward from the semiconductor module 2. A convex portion 6 is provided on at least one side of the semiconductor module 2. Note that the convex portion 6 shown in FIG. 2 is an example, and the shape, number, and position of the convex portion 6 are different in each of Embodiments 1 to 8.

[0017] FIG. 3 is a diagram showing an example of the configuration of the water-cooling jacket 3.

[0018] A base plate 4 is attached to the water-cooling jacket 3. A concave portion 7 is provided on the base plate 4. The convex portion 6 of the semiconductor module 2 fits into the concave portion 7 of the base plate 4. Note that the concave portion 7 shown in FIG. 3 is an example, and the shape, number, and position of the concave portion 7 are different in each of Embodiments 1 to 8.

[0019] <Embodiment 1> <Configuration> FIG. 4 is a diagram showing an example of the configuration of the semiconductor module 2 according to Embodiment 1, and shows the back surface of the semiconductor module 2. FIG. 5 is a diagram of the semiconductor module 2 shown in FIG. 4 viewed from the side of the electrode terminal 5.

[0020] The semiconductor module 2 has a linear convex portion 8 on one side. In FIGS. 4 and 5, the case where a linear convex portion 8 is provided on one side of the semiconductor module 2 is shown. However, as shown in FIG. 6, a linear convex portion 8 may be provided on another side, or linear convex portions 8 may be provided on a plurality of sides of the semiconductor module 2. That is, the semiconductor module 2 has a linear convex portion 8 on at least one side.

[0021] The linear convex portion 8 is provided so as not to be point-symmetrical with respect to the center of the semiconductor module 2 (the center of the semiconductor module 2 in the plan view shown in FIG. 4). The convex portion 8 of the semiconductor module 2 shown in FIGS. 4 and 5 is provided on one side of the semiconductor module 2 and is provided so as not to be point-symmetrical with respect to the center of the semiconductor module 2. Further, when convex portions 8 are provided on a plurality of sides of the semiconductor module 2, these convex portions 8 need to be provided so as not to be point-symmetrical with respect to the center of the semiconductor module 2.

[0022] FIG. 7 is a diagram showing the configuration of the base plate 4. The base plate 4 has a linear recess 9 provided so as to correspond to the convex portion 8 of the semiconductor module 2.

[0023] As shown in FIG. 8, when the semiconductor module 2 is mounted on the base plate 4, the convex portion 8 of the semiconductor module 2 and the concave portion 9 of the base plate 4 are fitted together. Thereby, the semiconductor module 2 is positioned.

[0024] <Effect> By fitting the convex portion 8 of the semiconductor module 2 and the concave portion 9 of the base plate 4 together, the semiconductor module 2 and the base plate 4 can be fixed so as not to shift (the semiconductor module 2 can be positioned).

[0025] Further, by providing the convex portion 8 of the semiconductor module 2 so as not to be point-symmetrical with respect to the center of the semiconductor module 2, the orientation is limited to one direction when the semiconductor module 2 is mounted on the base plate 4 (the possible fitting orientation between the semiconductor module 2 and the base plate 4 is limited to one direction). Therefore, it is possible to prevent a mis-mounting such that the mounting orientation of the semiconductor module 2 is different from the original one.

[0026] Thus, according to the first embodiment, it is possible to achieve both the positioning of the semiconductor module 2 and the prevention of mis-mounting of the semiconductor module 2.

[0027] <Second Embodiment> <Configuration> FIG. 9 is a diagram showing an example of the configuration of the semiconductor module 2 according to the second embodiment, and shows the back surface of the semiconductor module 2.

[0028] The semiconductor module 2 has convex portions 10 at both ends of one side. Both ends of one side correspond to the corners of the semiconductor module 2.

[0029] FIG. 9 shows a case where the convex portions 10 are provided at both ends of one side of the semiconductor module 2, but the convex portions 10 may also be provided at both ends of a plurality of sides of the semiconductor module 2. That is, the semiconductor module 2 has the convex portions 10 at both ends of at least one side.

[0030] The convex portions 10 are provided so as not to be point-symmetrical with respect to the center of the semiconductor module 2 (the center of the semiconductor module 2 in the plan view shown in FIG. 9). The convex portions 10 of the semiconductor module 2 shown in FIG. 9 are provided at both ends of one side of the semiconductor module 2 and are provided so as not to be point-symmetrical with respect to the center of the semiconductor module 2. Further, when the convex portions 10 are provided at both ends of a plurality of sides of the semiconductor module 2, it is necessary to provide these convex portions 10 so as not to be point-symmetrical with respect to the center of the semiconductor module 2.

[0031] FIG. 10 is a diagram showing the configuration of the base plate 4. The base plate 4 has a circular concave portion 11 and an elliptical concave portion 12 provided so as to correspond to the convex portions 10 of the semiconductor module 2. When the semiconductor module 2 is mounted on the base plate 4, the convex portion 10 provided at one end of one side of the semiconductor module 2 is fitted with the circular concave portion 11 of the base plate 4, and the convex portion 10 provided at the other end of one side of the semiconductor module 2 is fitted with the elliptical concave portion 12 of the base plate 4. Thereby, the semiconductor module 2 is positioned.

[0032] <Effect> In the first embodiment, when the linear convex portion 8 of the semiconductor module 2 is longer than the linear concave portion 9 of the base plate 4 due to the dimensional tolerance of the semiconductor module 2 or the base plate 4, the convex portion 8 of the semiconductor module 2 and the concave portion 9 of the base plate 4 may not be fitted. Further, when the linear concave portion 9 of the base plate 4 is longer than the linear convex portion 8 of the semiconductor module 2, misalignment may occur when the semiconductor module 2 is mounted on the base plate 4.

[0033] On the other hand, in Embodiment 2, among the convex portions 10 provided at both ends of one side of the semiconductor module 2, the concave portion 11 of the base plate 4 corresponding to the convex portion 10 provided at one end is formed in a circular shape that fits with the convex portion 10, and the concave portion 12 of the base plate 4 corresponding to the convex portion 10 provided at the other end is formed in an elliptical shape. As a result, fitting considering the dimensional tolerances of the semiconductor module 2 or the base plate 4 becomes possible, and the semiconductor module 2 and the base plate 4 can be fixed so as not to shift (the semiconductor module 2 can be positioned).

[0034] Further, by providing the convex portion 10 of the semiconductor module 2 so as not to be point-symmetrical with respect to the center of the semiconductor module 2, the orientation is limited to one direction when the semiconductor module 2 is mounted on the base plate 4 (the possible fitting orientation between the semiconductor module 2 and the base plate 4 is limited to one direction). Therefore, it is possible to prevent mis-mounting such that the mounting orientation of the semiconductor module 2 is different from the original.

[0035] As described above, according to Embodiment 2, it is possible to achieve both positioning of the semiconductor module 2 and prevention of mis-mounting of the semiconductor module 2.

[0036] <Embodiment 3> <Configuration> FIG. 11 is a diagram showing an example of the configuration of the semiconductor module 2 according to Embodiment 3, and shows the back surface of the semiconductor module 2.

[0037] The semiconductor module 2 has an L-shaped convex portion 13 at one corner. FIG. 11 shows the case where the convex portion 13 is provided at one corner of the semiconductor module 2, but the convex portion 13 may be provided at a plurality of corners of the semiconductor module 2. That is, the semiconductor module 2 has the convex portion 13 at at least one corner.

[0038] The convex portion 13 is provided so as not to be point-symmetrical with respect to the center of the semiconductor module 2 (the center of the semiconductor module 2 in the plan view shown in FIG. 11). The convex portion 13 of the semiconductor module 2 shown in FIG. 11 is provided at one corner of the semiconductor module 2 and is provided so as not to be point-symmetrical with respect to the center of the semiconductor module 2. Further, when a plurality of convex portions 13 are provided at the corners of the semiconductor module 2, it is necessary to provide these convex portions 13 so as not to be point-symmetrical with respect to the center of the semiconductor module 2.

[0039] FIG. 12 is a diagram showing the configuration of the base plate 4. The base plate 4 has an L-shaped recess 14 provided so as to correspond to the convex portion 13 of the semiconductor module 2. When the semiconductor module 2 is mounted on the base plate 4, the convex portion 13 provided at the corner of the semiconductor module 2 and the recess 14 of the base plate 4 are fitted together. Thereby, the semiconductor module 2 is positioned.

[0040] <Effect> In Embodiment 1, as shown in FIG. 13, when a missing portion 15 in which a part of the linear convex portion 8 is missing is formed, a misalignment occurs when the semiconductor module 2 is mounted on the base plate 4, so that the semiconductor module 2 and the base plate 4 cannot be fixed so as not to be displaced.

[0041] On the other hand, in Embodiment 3, by making the convex portion 13 of the semiconductor module 2 L-shaped, even if a part of the convex portion 13 is missing, the remaining portion can be fitted into the recess 14 of the base plate 4 (the semiconductor module 2 can be positioned).

[0042] Further, by providing the convex portion 13 of the semiconductor module 2 so as not to be point-symmetrical with respect to the center of the semiconductor module 2, the orientation is limited to one direction when the semiconductor module 2 is mounted on the base plate 4 (the possible fitting orientation between the semiconductor module 2 and the base plate 4 is limited to one direction). Therefore, it is possible to prevent a mis-mounting such that the mounting orientation of the semiconductor module 2 is different from the original one.

[0043] Thus, according to Embodiment 3, it becomes possible to achieve both the positioning of the semiconductor module 2 and the prevention of the mis-mounting of the semiconductor module 2.

[0044] <Embodiment 4> <Configuration> FIG. 14 is a diagram showing an example of the configuration of the semiconductor module 2 according to Embodiment 4, and shows the back surface of the semiconductor module 2.

[0045] The semiconductor module 2 has linear convex portions 16 on two opposing sides. In FIG. 14, the case where the linear convex portions 16 are provided on two opposing sides of the semiconductor module 2 is shown, but the linear convex portions 16 may be provided on one side. That is, the semiconductor module 2 has linear convex portions 16 on at least one side.

[0046] The linear convex portions 16 are provided between the electrode terminals 5 and the connection portions 17. The connection portions 17 are portions that connect the semiconductor module 2 and the base plate 4, and are portions where heat transfer grease, solder, or sinter is applied.

[0047] Further, the linear convex portions 16 are provided so as not to be point-symmetrical with respect to the center of the semiconductor module 2 (the center of the semiconductor module 2 in the plan view shown in FIG. 14). In the semiconductor module 2 shown in FIG. 14, the convex portions 16 provided on two opposing sides are provided so as not to be point-symmetrical with respect to the center of the semiconductor module 2. Also, when the convex portion 16 is provided on one side of the semiconductor module 2, the convex portion 16 is provided so as not to be point-symmetrical with respect to the center of the semiconductor module 2.

[0048] FIG. 15 is a diagram showing the configuration of the base plate 4. The base plate 4 has concave portions 18 provided so as to correspond to the convex portions 16 of the semiconductor module 2. When the semiconductor module 2 is mounted on the base plate 4, the convex portions 16 of the semiconductor module 2 and the concave portions 18 of the base plate 4 are fitted together. Thereby, the semiconductor module 2 is positioned.

[0049] <Effect> When using a conductive heat transfer grease, solder, or sinter to connect the semiconductor module 2 and the base plate 4, if these flow out near the electrode terminal 5 of the semiconductor module 2, the insulation distance may be insufficient and it may not be possible to attach the semiconductor module 2 to the base plate 4. As a countermeasure to this problem, by fitting the convex portion 16 of the semiconductor module 2 and the concave portion 18 of the base plate 4 (positioning the semiconductor module 2), the connection portion 17 where the heat transfer grease, solder, or sinter is applied is separated from the electrode terminal 5. Thereby, it is possible to prevent the heat transfer grease, solder, or sinter from flowing out near the electrode terminal 5.

[0050] Also, by providing the convex portion 16 of the semiconductor module 2 so as not to be point-symmetrical with respect to the center of the semiconductor module 2, when mounting the semiconductor module 2 on the base plate 4, the orientation is limited to one direction (the possible fitting orientation between the semiconductor module 2 and the base plate 4 is limited to one direction). Therefore, it is possible to prevent incorrect mounting such that the mounting orientation of the semiconductor module 2 is different from the original.

[0051] Thus, according to the fourth embodiment, in addition to achieving both the positioning of the semiconductor module 2 and the prevention of incorrect mounting of the semiconductor module 2, it is possible to prevent the heat transfer grease, solder, or sinter from flowing out near the electrode terminal 5.

[0052] <Embodiment 5> <Configuration> FIG. 16 is a diagram showing an example of the configuration of the semiconductor module 2 according to the fifth embodiment, and shows the back surface of the semiconductor module 2.

[0053] The semiconductor module 2 has three or more circular convex portions 19 on one side. In FIG. 16, the case where three or more circular convex portions 19 are provided on one side of the semiconductor module 2 is shown. However, three or more circular convex portions 19 may be provided on other sides, or three or more circular convex portions 19 may be provided on a plurality of sides of the semiconductor module 2. That is, the semiconductor module 2 has three or more circular convex portions 19 on at least one side.

[0054] The three or more circular convex portions 19 are provided so as not to be point-symmetrical with respect to the center of the semiconductor module 2 (the center of the semiconductor module 2 in the plan view shown in FIG. 16). The convex portion 19 of the semiconductor module 2 shown in FIG. 16 is provided on one side of the semiconductor module 2 and is provided so as not to be point-symmetrical with respect to the center of the semiconductor module 2. Further, when the convex portions 19 are provided on a plurality of sides of the semiconductor module 2, it is necessary to provide these convex portions 19 so as not to be point-symmetrical with respect to the center of the semiconductor module 2.

[0055] FIG. 17 is a diagram showing the configuration of the base plate 4. The base plate 4 has a concave portion 20 provided so as to correspond to the convex portion 19 of the semiconductor module 2. When the semiconductor module 2 is mounted on the base plate 4, the convex portion 19 of the semiconductor module 2 and the concave portion 20 of the base plate 4 are fitted together. Thereby, the semiconductor module 2 is positioned.

[0056] <Effect> In Embodiment 1, as shown in FIG. 13, when a part of the linear convex portion 8 is missing, misalignment occurs when the semiconductor module 2 is mounted on the base plate 4, so that the semiconductor module 2 and the base plate 4 cannot be fixed so as not to be displaced.

[0057] On the other hand, in Embodiment 5, by providing three or more convex portions 19 of the semiconductor module 2, even if one of the convex portions 19 is missing, the remaining convex portions 19 can be fitted into the concave portions 20 of the base plate 4 (the semiconductor module 2 can be positioned).

[0058] Further, by providing the convex portion 19 of the semiconductor module 2 so as not to be point-symmetrical with respect to the center of the semiconductor module 2, when the semiconductor module 2 is mounted on the base plate 4, the orientation is limited to one direction (the mountable orientation of the semiconductor module 2 and the base plate 4 is limited to one direction), so that it is possible to prevent incorrect mounting in which the mounting orientation of the semiconductor module 2 is different from the original one.

[0059] Thus, according to the fifth embodiment, it is possible to achieve both the positioning of the semiconductor module 2 and the prevention of incorrect mounting of the semiconductor module 2.

[0060] <Embodiment 6> <Configuration> FIG. 18 is a diagram showing an example of the configuration of the semiconductor module 2 according to the sixth embodiment, and shows the back surface of the semiconductor module 2.

[0061] The semiconductor module 2 has three or more circular convex portions 21 on one side. In FIG. 18, the case where three or more circular convex portions 21 are provided on one side of the semiconductor module 2 is shown, but three or more circular convex portions 21 may be provided on other sides, or three or more circular convex portions 21 may be provided on a plurality of sides of the semiconductor module 2. That is, the semiconductor module 2 has three or more circular convex portions 21 on at least one side.

[0062] The three or more circular convex portions 21 are provided so as not to be point-symmetrical with respect to the center of the semiconductor module 2 (the center of the semiconductor module 2 in the plan view shown in FIG. 18). The convex portion 21 of the semiconductor module 2 shown in FIG. 18 is provided on one side of the semiconductor module 2 and is provided so as not to be point-symmetrical with respect to the center of the semiconductor module 2. When convex portions 21 are provided on a plurality of sides of the semiconductor module 2, it is necessary to provide these convex portions 21 so as not to be point-symmetrical with respect to the center of the semiconductor module 2.

[0063] FIG. 19 is a diagram showing the configuration of the base plate 4. The base plate 4 has recesses 22 provided so as to correspond to the convex portions 21 of the semiconductor module 2. Among the recesses 22, only one recess 22 is circular, and the other recesses 22 are elliptical. When the semiconductor module 2 is mounted on the base plate 4, the convex portions 21 of the semiconductor module 2 and the recesses 22 of the base plate 4 are fitted together. Thereby, the semiconductor module 2 is positioned.

[0064] <Effect> The semiconductor module 2 and the base plate 4 each have a different coefficient of thermal expansion, and a difference in expansion and contraction occurs due to their respective thermal histories. In Embodiment 6, since only one of the recesses 22 of the base plate 4 is circular and the other recesses 22 are elliptical, it is possible to absorb the difference in expansion and contraction due to the respective thermal histories of the semiconductor module 2 and the base plate 4, and it is possible to prevent damage to the convex portion 21 of the semiconductor module 2 due to the thermal history.

[0065] Further, by providing the convex portion 21 of the semiconductor module 2 so as not to be point-symmetrical with respect to the center of the semiconductor module 2, the direction is limited to one direction when the semiconductor module 2 is mounted on the base plate 4 (the fitting direction of the semiconductor module 2 and the base plate 4 is limited to one direction). Therefore, it is possible to prevent a mis-mounting in which the mounting direction of the semiconductor module 2 is different from the original one.

[0066] Thus, according to Embodiment 6, it is possible to achieve both the positioning of the semiconductor module 2 and the prevention of mis-mounting of the semiconductor module 2.

[0067] <Embodiment 7> <Configuration> FIG. 20 is a diagram showing an example of the configuration of the semiconductor module 2 according to Embodiment 7, and shows the back surface of the semiconductor module 2.

[0068] The semiconductor module 2 has two or more circular convex portions 23 provided so as not to face each other on each of two opposing sides.

[0069] In the example of FIG. 20, the circular convex portions 23 are provided in the first, fourth, and fifth rows in Example A and in the second and third rows in Column B. Thus, the circular convex portions 23 are not provided in the same rows in each of Column A and Column B. Note that the dashed circles shown in Columns A and B of FIG. 20 indicate that no unevenness is provided.

[0070] FIG. 21 is a diagram showing the configuration of the base plate 4. The base plate 4 has recesses 24 provided so as to correspond to the convex portions 23 of the semiconductor module 2. When the semiconductor module 2 is mounted on the base plate 4, the convex portions 23 of the semiconductor module 2 and the recesses 24 of the base plate 4 are fitted together. Thereby, the semiconductor module 2 is positioned.

[0071] <Effect> According to Embodiment 7, when the semiconductor module 2 is mounted on the base plate 4, since the convex portions 23 of the semiconductor module 2 and the recesses 24 of the base plate 4 are fitted together, the semiconductor module 2 can be positioned.

[0072] Also, by providing the convex portions 23 of the semiconductor module 2 such that they do not face each other on each of the two opposing sides, the orientation is limited to one direction when the semiconductor module 2 is mounted on the base plate 4 (the possible fitting orientation between the semiconductor module 2 and the base plate 4 is limited to one direction), so that it is possible to prevent a mis-mounting such that the mounting orientation of the semiconductor module 2 is different from the original one.

[0073] Furthermore, according to Embodiment 7, it is possible to identify the type of the semiconductor module 2. For example, when two or more convex portions 23 are provided on the semiconductor module 2 and the number of rows is five, 5C2 + 5C3 = 20 types of identification are possible. Thereby, it is possible to identify the rated current, rated voltage, circuit configuration, etc. of the semiconductor module 2.

[0074] As an example, assume a case where the convex portions 23 provided on the semiconductor module 2 with a rated current of 100 A and a rated voltage of 650 V (two convex portions 23 in column A and three convex portions 23 in column B) are fitted into the concave portions 24 of the base plate 4. In this case, the convex portions 23 provided on the semiconductor module 2 with a rated current of 50 A and a rated voltage of 1200 V (three convex portions 23 in column A and two convex portions 23 in column B) do not fit into the concave portions 24 of the base plate 4.

[0075] If convex portions 23 are provided in each of the same rows of column A and column B in the semiconductor module 2, it is necessary to provide concave portions 24 in each of the same rows of column A and column B on the base plate 4 as well. In this case, for the semiconductor module 2 having convex portions 23 provided only in column A in the same row and the semiconductor module 2 having convex portions 23 provided only in column B in the same row, since the respective convex portions 23 can be fitted into the concave portions 24 of the base plate 4, the types of the semiconductor modules 2 cannot be identified. Therefore, the semiconductor module 2 does not provide convex portions 23 in each of the same rows of column A and column B.

[0076] Thus, according to the seventh embodiment, in addition to achieving both the positioning of the semiconductor module 2 and the prevention of mis-mounting of the semiconductor module 2, it becomes possible to identify the type of the semiconductor module 2.

[0077] <Embodiment 8> <Configuration> FIG. 22 is a diagram showing an example of the configuration of the semiconductor module 2 according to the eighth embodiment, and shows the back surface of the semiconductor module 2.

[0078] The semiconductor module 2 has two or more circular convex portions 25 and concave portions 26 on one side. In the example of FIG. 22, the semiconductor module 2 has three convex portions 25 and two concave portions 26.

[0079] FIG. 22 shows a case where two or more circular protrusions 25 and recesses 26 are provided on one side of the semiconductor module 2. However, two or more circular protrusions 25 and recesses 26 may be provided on the other side, or two or more circular protrusions 25 and recesses 26 may be provided on a plurality of sides of the semiconductor module 2. That is, the semiconductor module 2 has two or more circular protrusions 25 and recesses 26 on at least one side.

[0080] The two or more circular protrusions 25 and recesses 26 are provided so as not to be point-symmetrical with respect to the center of the semiconductor module 2 (the center of the semiconductor module 2 in the plan view shown in FIG. 22). The protrusions 25 and recesses 26 of the semiconductor module 2 shown in FIG. 22 are provided on one side of the semiconductor module 2 and are provided so as not to be point-symmetrical with respect to the center of the semiconductor module 2. Further, when the protrusions 25 and recesses 26 are provided on a plurality of sides of the semiconductor module 2, it is necessary to provide these protrusions 25 and recesses 26 so as not to be point-symmetrical with respect to the center of the semiconductor module 2.

[0081] FIG. 23 is a diagram showing the configuration of the base plate 4. The base plate 4 has a recess 27 provided so as to correspond to the protrusion 25 of the semiconductor module 2 and a protrusion 28 provided so as to correspond to the recess 26. When the semiconductor module 2 is mounted on the base plate 4, the protrusion 25 of the semiconductor module 2 and the recess 27 of the base plate 4 are fitted, and the recess 26 of the semiconductor module 2 and the protrusion 28 of the base plate 4 are fitted. Thereby, the semiconductor module 2 is positioned.

[0082] <Effect> According to the eighth embodiment, when the semiconductor module 2 is mounted on the base plate 4, the protrusion 25 of the semiconductor module 2 and the recess 27 of the base plate 4 are fitted, and the recess 26 of the semiconductor module 2 and the protrusion 28 of the base plate 4 are fitted, so that the semiconductor module 2 can be positioned.

[0083] Also, by providing the convex portions 25 and concave portions 26 of the semiconductor module 2 so as not to be point-symmetrical with respect to the center of the semiconductor module 2, when mounting the semiconductor module 2 on the base plate 4, the orientation is limited to one direction (the mountable orientation of the semiconductor module 2 and the base plate 4 is limited to one direction), so it is possible to prevent mis-mounting such that the mounting orientation of the semiconductor module 2 is different from the original.

[0084] Furthermore, according to the eighth embodiment, it is possible to identify the type of the semiconductor module 2. For example, when a total of five convex portions 25 and concave portions 26 are provided on one side of the semiconductor module 2, 5C5 + 5C4 + 5C3 + 5C2 + 5C1 + 5C0 = 32 types of identification are possible. Thereby, it is possible to identify the rated current, rated voltage, circuit configuration, etc. of the semiconductor module 2.

[0085] As an example, assume a case where two convex portions 25 and three concave portions 26 provided on the semiconductor module 2 with a rated current of 100 A and a rated voltage of 650 V are respectively fitted into the concave portion 27 and convex portion 28 of the base plate 4. In this case, the three convex portions 25 and two concave portions 26 provided on the semiconductor module 2 with a rated current of 50 A and a rated voltage of 1200 V do not fit into the concave portion 27 and convex portion 28 of the base plate 4 respectively.

[0086] Thus, according to the eighth embodiment, in addition to achieving both the positioning of the semiconductor module 2 and the prevention of mis-mounting of the semiconductor module 2, it is possible to identify the type of the semiconductor module 2.

[0087] Note that in the semiconductor module 2 (see FIG. 18) according to the sixth embodiment, two or more convex portions 21 may be replaced with concave portions 26. In this case, it is necessary to provide a convex portion 28 corresponding to the concave portion 26 of the semiconductor module 2 on the base plate 4.

[0088] Also, in the semiconductor module 2 (see FIG. 20) according to Embodiment 7, a recess 26 may be provided at the position of the dashed round mark shown in Column A and Column B. In this case, the base plate 4 needs to be provided with a convex portion 28 corresponding to the recess 26 of the semiconductor module 2.

[0089] Within the scope of the present disclosure, it is possible to freely combine the respective embodiments or appropriately deform or omit the respective embodiments.

[0090] <Appendix> Hereinafter, various aspects of the present disclosure will be collectively described as appendices.

[0091] (Appendix 1) A semiconductor module, a base plate on which the semiconductor module is mounted, and the semiconductor module has a linear convex portion provided so as not to be point-symmetrical with respect to the center of the semiconductor module on at least one side, the base plate has a recess provided so as to correspond to the convex portion, a semiconductor device. (Appendix 2) A semiconductor module, a base plate on which the semiconductor module is mounted, and the semiconductor module has convex portions provided so as not to be point-symmetrical with respect to the center of the semiconductor module at both ends of at least one side, the base plate has a circular recess provided so as to correspond to one of the convex portions at both ends and an elliptical recess provided so as to correspond to the other convex portion at both ends, a semiconductor device. (Appendix 3) A semiconductor module, a base plate on which the semiconductor module is mounted, and the semiconductor module has an L-shaped convex portion provided so as not to be point-symmetrical with respect to the center of the semiconductor module at at least one corner A semiconductor device, wherein the base plate has an L-shaped recess provided corresponding to the convex portion. (Appendix 4) A semiconductor module, a base plate on which the semiconductor module is mounted, and comprising: the semiconductor module has a linear convex portion provided such that it is not point-symmetrical with respect to the center of the semiconductor module between a terminal that is at least one side and protrudes outward from the semiconductor module and a connection portion that connects the semiconductor module and the base plate; A semiconductor device, wherein the base plate has a recess provided corresponding to the convex portion. (Appendix 5) A semiconductor module, a base plate on which the semiconductor module is mounted, and comprising: the semiconductor module has three or more circular convex portions provided such that they are not point-symmetrical with respect to the center of the semiconductor module on at least one side; A semiconductor device, wherein the base plate has three or more recesses provided corresponding to the convex portions. (Appendix 6) The semiconductor device according to Appendix 5, wherein only one of the recesses is circular and the other recesses are elliptical. (Appendix 7) The semiconductor module further has two or more circular recesses on the at least one side, The semiconductor device according to Appendix 5 or 6, wherein the base plate further has two or more circular convex portions provided corresponding to the recesses. (Appendix 8) A semiconductor module, a base plate on which the semiconductor module is mounted, and comprising: the semiconductor module has two or more circular convex portions provided such that they do not face each other on each of two opposing sides. The base plate has two or more concave portions provided to correspond to the convex portions, and the semiconductor device. (Appendix 9) The semiconductor module further has two or more circular concave portions on at least one of the two opposite sides. The base plate further has two or more circular convex portions provided to correspond to the concave portions, and the semiconductor device according to Appendix 8.

Explanation of symbols

[0092] 1 Bus bar, 2 Semiconductor module, 3 Water-cooling jacket, 4 Base plate, 5 Electrode terminal, 6 Convex portion, 7 Concave portion, 8 Convex portion, 9 Concave portion, 10 Convex portion, 11 Concave portion, 12 Concave portion, 13 Convex portion, 14 Concave portion, 15 Defective portion, 16 Convex portion, 17 Connection portion, 18 Concave portion, 19 Convex portion, 20 Concave portion, 21 Convex portion, 22 Concave portion, 23 Convex portion, 24 Concave portion, 25 Convex portion, 26 Concave portion, 27 Concave portion, 28 Convex portion.

Claims

1. A semiconductor module, a base plate on which the semiconductor module is mounted, and the semiconductor module has a linear convex portion provided so as not to be point-symmetric with respect to the center of the semiconductor module on at least one side, the base plate has a concave portion provided corresponding to the convex portion, a semiconductor device.

2. A semiconductor module, a base plate on which the semiconductor module is mounted, and the semiconductor module has convex portions provided so as not to be point-symmetric with respect to the center of the semiconductor module at both ends of at least one side, the base plate has a circular concave portion provided corresponding to one of the convex portions at one of the both ends and an elliptical concave portion provided corresponding to the convex portion at the other end of the both ends, a semiconductor device.

3. A semiconductor module, a base plate on which the semiconductor module is mounted, and the semiconductor module has an L-shaped convex portion provided so as not to be point-symmetric with respect to the center of the semiconductor module at at least one corner, the base plate has an L-shaped concave portion provided corresponding to the convex portion, a semiconductor device.

4. A semiconductor module, a base plate on which the semiconductor module is mounted, and the semiconductor module has a linear convex portion provided so as not to be point-symmetric with respect to the center of the semiconductor module between a terminal protruding outward from the semiconductor module and a connection portion connecting the semiconductor module and the base plate on at least one side, A semiconductor device, wherein the base plate has a concave portion provided corresponding to the convex portion. **Claim 5** A semiconductor module, A base plate on which the semiconductor module is mounted, and comprising: The semiconductor module has three or more circular convex portions provided such that they are not point-symmetrical with respect to the center of the semiconductor module on at least one side. A semiconductor device, wherein the base plate has three or more concave portions provided corresponding to the convex portions. **Claim 6** The semiconductor device according to claim 5, wherein only one of the concave portions is circular, and the other concave portions are elliptical. **Claim 7** The semiconductor module further has two or more circular concave portions on at least one side. The semiconductor device according to claim 5 or 6, wherein the base plate further has two or more circular convex portions provided corresponding to the concave portions. **Claim 8** A semiconductor module, A base plate on which the semiconductor module is mounted, and comprising: The semiconductor module has two or more circular convex portions provided such that they do not face each other on each of two opposite sides. A semiconductor device, wherein the base plate has two or more concave portions provided corresponding to the convex portions. **Claim 9** The semiconductor module further has two or more circular concave portions on at least one side of the two opposite sides. The semiconductor device according to claim 8, wherein the base plate further has two or more circular convex portions provided corresponding to the concave portions.

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